WO2019091900A1 - Compositions époxy respectueuses de l'environnement - Google Patents

Compositions époxy respectueuses de l'environnement Download PDF

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Publication number
WO2019091900A1
WO2019091900A1 PCT/EP2018/080126 EP2018080126W WO2019091900A1 WO 2019091900 A1 WO2019091900 A1 WO 2019091900A1 EP 2018080126 W EP2018080126 W EP 2018080126W WO 2019091900 A1 WO2019091900 A1 WO 2019091900A1
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WO
WIPO (PCT)
Prior art keywords
composition
optionally
jeffamine
formation
region
Prior art date
Application number
PCT/EP2018/080126
Other languages
English (en)
Inventor
Finlay Gordon MacKenzie BERTRAM
Anders Kyrme TUXEN
Original Assignee
Total E&P Danmark A/S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB1718601.6A external-priority patent/GB2561638B8/en
Priority claimed from GBGB1719397.0A external-priority patent/GB201719397D0/en
Priority claimed from GBGB1812280.4A external-priority patent/GB201812280D0/en
Application filed by Total E&P Danmark A/S filed Critical Total E&P Danmark A/S
Publication of WO2019091900A1 publication Critical patent/WO2019091900A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K8/00—Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
    • C09K8/02—Well-drilling compositions
    • C09K8/03—Specific additives for general use in well-drilling compositions
    • C09K8/035—Organic additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K8/00—Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
    • C09K8/42—Compositions for cementing, e.g. for cementing casings into boreholes; Compositions for plugging, e.g. for killing wells
    • C09K8/426—Compositions for cementing, e.g. for cementing casings into boreholes; Compositions for plugging, e.g. for killing wells for plugging
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K8/00—Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
    • C09K8/42—Compositions for cementing, e.g. for cementing casings into boreholes; Compositions for plugging, e.g. for killing wells
    • C09K8/428—Compositions for cementing, e.g. for cementing casings into boreholes; Compositions for plugging, e.g. for killing wells for squeeze cementing, e.g. for repairing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K8/00—Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
    • C09K8/42—Compositions for cementing, e.g. for cementing casings into boreholes; Compositions for plugging, e.g. for killing wells
    • C09K8/44—Compositions for cementing, e.g. for cementing casings into boreholes; Compositions for plugging, e.g. for killing wells containing organic binders only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K8/00—Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
    • C09K8/56—Compositions for consolidating loose sand or the like around wells without excessively decreasing the permeability thereof

Definitions

  • the present invention relates to compositions and methods for treating a region of a subterranean formation.
  • the present invention relates to epoxy compositions which are environmentally friendly and which exhibit suitable curing properties for treating a region of a subterranean formation.
  • compositions are used extensively in a number of applications relating to the treatment of subterranean formations.
  • Hydraulic fracturing also known as fracking
  • fracking is a known process which allows creation of fractures from a wellbore into a formation or reservoir. This technique consists of pumping hydraulic fluid into a wellbore at a pressure and injection rate such that fractures are created within the formation. These fractures act as channels which facilitate and increase production of hydrocarbons, e.g. oil, from the formation into the wellbore.
  • hydrocarbons e.g. oil
  • proppants solid particles known as proppants into the created fractures, either during, or after, fracturing.
  • chemical compositions may be injected into the formation fractures in order to consolidate the proppant particles in the fractures. This process is known as proppant consolidation.
  • Gel treatments can also be used to repair small casing leaks more effectively. Gel compositions can flow easily through the small casing holes and may travel some distance into the formation near the leak. Thus, gel treatments are generally directed at stopping flow in the porous rock around the vicinity of the casing leak, rather than solely attempting to permanently plug the casing leak itself. If the resulting gel is able to withstand the near wellbore pressure conditions, a small amount of gel material may be sufficient to repair the leak. However, greater volumes may be required if flow behind pipe or fractures exist in the vicinity of the casing leak.
  • a common family of chemicals used for injections in a subterranean formation is epoxy resins.
  • Most commercially available epoxy systems are based on resin sealants containing the chemical compound Biphenol A.
  • Biphenol A and Biphenol A diglycyl ether are, however, environmentally unfriendly and therefore undesirable.
  • many of the crosslinkers and/or crosslinking systems used to cure or harden conventional epoxy resins are also environmentally unfriendly.
  • a curable composition for treating a region of a formation comprising:
  • composition is environmentally friendly, is capable of curing in the region of the formation in situ, and does not flash set.
  • hardener and crosslinker will be herein understood as referring to compounds that induce curing of the epoxy resin. Hardeners/crosslinkers are sometimes also referred to as curatives, and may typically react with the epoxy to achieve curing thereof. Thus, the terms “hardener” and “crosslinker”, and “hardening” and “crosslinking” will be herein understood as being synonymous and may be used interchangeably.
  • composition may be capable of curing in about 1 -15 hours, e.g., in about 1 -
  • the composition may be capable of curing in about 1 -15 hours, e.g., in about 1 -10 hours, e.g., in about 3-8 hours, at about 30°C-50°C and/or at about 50°C-70°C and/or at about 70°C-90°C.
  • the composition may be capable of curing in about 1-15 hours, e.g., in about 1 -10 hours, e.g., in about 3-8 hours at about 30°C.
  • the curing times of the composition of the present invention may be well suited for injection in a region of a formation.
  • a composition exhibits an excessively short curing time under the conditions in the formation, e.g. at about 30°C-90°C, premature hardening may occur, leading to hardening of the epoxy composition before it reaches its intended location, thus failing to achieve its intended use and/or potentially causing damage and/or blockage to downhole equipment such as coil tubing.
  • a composition exhibits an excessively long curing time under the conditions in the formation, e.g. at about 30°C-90°C, delayed hardening may occur, which may also be undesirable for several reasons.
  • the epoxy material may flow into areas of the well or formation that were not intended to be treated.
  • the integrity of the cured material e.g. epoxy plug, may be compromised, for example if formation fluid trickles into or passes through of by the material, potentially causing flow channels through the material.
  • the composition may have a viscosity which permits injection of the composition at/to the region of the formation.
  • the viscosity may be sufficiently low to permit the composition to flow to the region of the formation.
  • the viscosity may be sufficiently high to maintain integrity of the composition during curing at the region of the formation.
  • the viscosity of the composition (for example a curable composition according to this invention), e.g., at the time of injection, e.g. at surface, may be at least about 1 cP, e.g. at least about 100 cP, e.g. at least about 500 cP.
  • the viscosity of the composition e.g., at the time of injection, e.g. at surface, may be in the range of about 1 cP to about 2,000 cP, e.g. about 500 cP to about 1 ,500 cP, e.g. about 750 cP to about 1 ,250 cP.
  • the viscosity of the composition e.g., at the time of injection, e.g.
  • the viscosity at the time of injection, e.g. at surface may relate to the viscosity of the composition upon or shortly after mixing, e.g. prior to hardening or shortly after hardening has started.
  • the viscosity of the composition e.g., at the location where the composition is intended to be injected, e.g., at the region of the formation, may be at least about 1 ,000 cP, e.g. at least about 2,000 cP, e.g. at least about 3,000 cP.
  • the viscosity of the composition e.g., at the location where the composition is intended to be injected, e.g., at the region of the formation, may be in the range of about 1 ,000 cP to about 100,000 cP, e.g. about 3,000 cP to about 10,000 cP.
  • the viscosity of the composition may not remain constant over time, e.g. from the time of mixing and/or injection, to the moment when the composition reaches a desired location, e.g. the region of the formation.
  • the composition may advantageously have a sufficiently low viscosity to allow injection, e.g. pumping, of the composition, e.g. to the region of the formation.
  • the composition may also advantageously have a sufficiently high viscosity to provide a hardening and/or hardened material having adequate structural integrity in situ, e.g. at the region of the formation.
  • the composition of the present invention possesses a viscosity which permits injection, e.g. pumping, of the composition downhole, e.g., to the region of the formation, and/or effective hardening of the composition in situ, e.g. at the region of the formation. Additionally (and as described above), the composition is environmentally friendly, is capable of curing in the region of the formation in situ, (and under the particular conditions of the formation (temperature, pressure, movement and the like)) and does not flash set.
  • the viscosity of the composition may be adjusted with one or more additives, e.g., a solvent, a diluent, a viscosifier, a thickener, or the like.
  • the composition may comprise one or more additives capable of altering, modifying and/or adjusting the viscosity of the composition, e.g., a solvent, a diluent, a viscosifier, a thickener, or the like.
  • the composition may not flash set at about 30°C-90°C, e.g. at about 30°C-50°C and/or at about 50°C-70°C and/or at about 70°C-90°C.
  • the composition may not flash set at about 50°C.
  • the composition may not cause excessive exothermic reactions upon curing.
  • the epoxy resin may be selected from the group consisting of: 1 ,6-Hexanediol diglycidyl ether (HDDGE), 1 ,4-Butanediol diglycidyl ether (BDDGE), Neopentyl glycol diglycidyl ether (NPGDGE), or 1 ,4-Cyclohexanedimethanol diglycidyl ether (CHDMDGE).
  • HDDGE 1 ,6-Hexanediol diglycidyl ether
  • BDDGE 1 ,4-Butanediol diglycidyl ether
  • NPGDGE Neopentyl glycol diglycidyl ether
  • CHDMDGE 1 ,4-Cyclohexanedimethanol diglycidyl ether
  • the epoxy resin may comprise, may consist essentially of or may consist of 1 ,6-
  • HDDGE Hexanediol diglycidyl ether
  • the crosslinking/hardening system may comprise a first crosslinker/hardener.
  • the first crosslinker may comprise, may consist essentially of or may consist of a diamine or a polyamine compound.
  • the first crosslinker may comprise, may consist essentially of or may consist of a polyetheramine compound.
  • the first crosslinker may comprise, may consist essentially of or may consist of a polyetherdiamine compound.
  • the first crosslinker may comprise, may consist essentially of or may consist of a polyoxypropylenediamine compound.
  • the first crosslinker may comprise, may consist essentially of or may consist of a polyetherdiamine compound of formula (I).
  • the first crosslinker may comprise, may consist essentially of or may consist of a Jeffamine® crosslinker.
  • the first crosslinker may comprise, may consist essentially of or may consist of a Jeffamine® D-400 crosslinker.
  • the use of a Jeffamine® crosslinker, e.g., Jeffamine® D-400, as the first crosslinker provides sufficiently long curing time to allow injection and/or delivery of the composition to a desired region of a subterranean formation, as well as being categorized as yellow under the OSPAR classification.
  • This crosslinker also has the advantage of providing swellability in seawater.
  • Jeffamine® D400 may be named Polypropylene glycol bis(2-aminopropyl ether).
  • the crosslinking/hardening system may comprise a second crosslinker/hardener.
  • the second crosslinker may comprise or may be a crosslinker having faster curing characteristics or properties than the first crosslinker.
  • the second crosslinker may comprise an alkyldiamine, e.g. hexamethylene diamine (HMDA) and/or 2-Methyl 1 ,5-pentanediamine (also referred to as 2- methylpentamethylenediamine, marketed under the name Dytek® Amine A).
  • HMDA hexamethylene diamine
  • Dytek® Amine A 2-Methyl 1 ,5-pentanediamine
  • the composition may comprise at least one crosslinking/hardening accelerator.
  • the at least one crosslinking accelerator may comprise trietanolamine (TEA), pyridine, 3-aminopropyldimethylamine, N,N- Dimethylaniline (DMA) and/or ⁇ , ⁇ -dimethylbutylamine.
  • the at least one crosslinking accelerator may comprise or may be trietanolamine (TEA).
  • the first crosslinker, second crosslinker and/or crosslinking accelerator may provide for an environmentally friendly crosslinking system, e.g. may allow the crosslinking system to satisfy OSPAR requirements.
  • the crosslinking system may contain about 60%-100%, e.g. about 75-100%, typically about 90-100%, of the first crosslinker.
  • the crosslinking system may contain about 0-40%, e.g. about 0-25%, typically about 0-10%, of the second crosslinker and/or of the crosslinking accelerator.
  • the composition may comprise about 25-75 wt %, e.g., about 30-70 wt%, e.g. about 40-60 wt%, e.g. about 45-50 wt % of the epoxy resin.
  • the composition may comprise about 25-75 wt %, e.g., about 30-70 wt%, e.g. about 40-60 wt%, e.g. about 50-55 wt % of the crosslinking system.
  • the composition may comprise about 25-75 wt %, e.g., about 30-70 wt%, e.g. about 40-60 wt%, e.g. about 45-55 wt % of the first crosslinker.
  • the composition may comprise about 0-5 wt %, e.g., about 0-2 wt%, e.g. about 0-1 wt% of the second crosslinker or crosslinking accelerator.
  • the composition may comprise about 0.001 -0.5 wt %, e.g., about 0.01 -0.1 wt% of the crosslinking accelerator.
  • the crosslinking system may be selected from the group consisting of:
  • a polyetherdiamine compound e.g. Jeffamine® D400;
  • a polyetherdiamine compound e.g. Jeffamine® D400 with up to 10% 2- methylpentamethylenediamine;
  • a polyetherdiamine compound e.g. Jeffamine® D400 with up to 10% hexamethylene diamine (HMDA); and/or
  • a polyetherdiamine compound e.g. Jeffamine® D400 with up to 10% triethanolamine (TEA).
  • TEA triethanolamine
  • the crosslinking system may be selected from the group consisting of:
  • a polyetherdiamine compound e.g. Jeffamine® D400;
  • a polyetherdiamine compound e.g. Jeffamine® D400 with 0.5-10% 2- methylpentamethylenediamine
  • a polyetherdiamine compound e.g. Jeffamine® D400 with 0.5-10% hexamethylene diamine (HMDA)
  • HMDA hexamethylene diamine
  • a polyetherdiamine compound e.g. Jeffamine® D400 with 0.5-10% triethanolamine (TEA).
  • a curable composition for treating a region of a formation comprising:
  • an epoxy resin comprising, consisting essentially of or consisting of 1 ,6- Hexanediol diglycidyl ether (HDDGE); and
  • crosslinking system comprising, consisting essentially of or consisting of
  • the crosslinking system may be selected from the group consisting of:
  • a polyetherdiamine compound e.g. Jeffamine® D400;
  • a polyetherdiamine compound e.g. Jeffamine® D400 with 0.5-10% 2- methylpentamethylenediamine
  • a polyetherdiamine compound e.g. Jeffamine® D400 with 0.5-10% hexamethylene diamine (HMDA) and/or
  • a polyetherdiamine compound e.g. Jeffamine® D400 with 0.5-10% triethanolamine (TEA).
  • a slow-curing first crosslinker e.g. a polyetherdiamine compound such as Jeffamine® D400
  • a fast-curing second crosslinker e.g. 2- methylpentamethylenediamine or HMDA
  • a crosslinking accelerator e.g.
  • a tunable composition may be formed, in which the rate of curing and reactivity may be adjusted based on the expected temperature of the region of the subterranean formation where the composition is to be injected, by adjusting the relative amounts of the first crosslinker and second crosslinker in the crosslinking system and/or in the overall composition.
  • TAA triethanolamine
  • the term "major amount” may be defined as or may be an amount of about 51 -100%, e.g., 60-100%, e.g., 75-100% e.g., 90- 100%, of the curable composition.
  • the amounts may be expressed by weight.
  • the term "minor amount” may be defined as or may be an amount of about 0-49%, e.g., 0-40%, e.g., 0-25% e.g., 0-10%, of the curable composition. The amounts may be expressed by weight.
  • the term "major amount” may be defined as or may be an amount of about 51 -99.5% e.g., 60-99.5%, e.g., 75-99.5% e.g., 90-99.5%, of the curable composition.
  • the amounts may be expressed by weight.
  • the term "minor amount” may be defined as or may be an amount of about 0.5-49%, e.g., 0.5-40%, e.g., 0.5-25% e.g., 0.5-10%, of the curable composition. The amounts may be expressed by weight.
  • the composition may be suitable for curing at a temperature in the range of 30- 50°C.
  • the composition may comprise an epoxy resin comprising, consisting essentially of or consisting of 1 ,6-Hexanediol diglycidyl ether (HDDGE); and a crosslinking system comprising, consisting essentially of or consisting of a polyetherdiamine compound, e.g. Jeffamine® D400, with up to 10% 2- methylpentamethylenediamine, a polyetherdiamine compound, e.g. Jeffamine® D400, with up to 10% hexamethylene diamine (HMDA), and/or a polyetherdiamine compound, e.g. Jeffamine® D400, with up to 10% triethanolamine (TEA).
  • an epoxy resin comprising, consisting essentially of or consisting of 1 ,6-Hexanediol diglycidyl ether (HDDGE); and a crosslinking system comprising, consisting essentially of or consisting of a poly
  • a composition suitable for curing at a temperature in the range of 30-50°C may comprise an epoxy resin comprising, consisting essentially of or consisting of 1 ,6-Hexanediol diglycidyl ether (HDDGE); and a crosslinking system comprising, consisting essentially of or consisting of about 100 parts by weight of a polyetherdiamine compound, e.g. Jeffamine® D400 and about 3-10 parts by weight triethanolamine (TEA).
  • an epoxy resin comprising, consisting essentially of or consisting of 1 ,6-Hexanediol diglycidyl ether (HDDGE); and a crosslinking system comprising, consisting essentially of or consisting of about 100 parts by weight of a polyetherdiamine compound, e.g. Jeffamine® D400 and about 3-10 parts by weight triethanolamine (TEA).
  • HDDGE 1 ,6-Hexanediol diglycidyl ether
  • TSA triethanolamine
  • the composition may be suitable for curing at a temperature in the range of 50- 70°C.
  • the composition may comprise an epoxy resin comprising, consisting essentially of or consisting of 1 ,6-Hexanediol diglycidyl ether (HDDGE); and a crosslinking system comprising, consisting essentially of or consisting of a polyetherdiamine compound, e.g. Jeffamine® D400 with up to 10% 2- methylpentamethylenediamine, a polyetherdiamine compound, e.g. Jeffamine® D400 with up to 10% hexamethylene diamine (HMDA), and/or a polyetherdiamine compound, e.g. Jeffamine® D400 with up to 10% triethanolamine (TEA).
  • an epoxy resin comprising, consisting essentially of or consisting of 1 ,6-Hexanediol diglycidyl ether (HDDGE); and a crosslinking system comprising, consisting essentially of or consisting of a polyetherd
  • a composition suitable for curing at a temperature in the range of 50-70°C may comprise an epoxy resin comprising, consisting essentially of or consisting of 1 ,6-Hexanediol diglycidyl ether (HDDGE); and a crosslinking system comprising, consisting essentially of or consisting of about 100 parts by weight of a polyetherdiamine compound, e.g. Jeffamine® D400 and about 0-3 parts by weight triethanolamine (TEA), e,g, about 0.1 - 3 parts by weight triethanolamine (TEA).
  • an epoxy resin comprising, consisting essentially of or consisting of 1 ,6-Hexanediol diglycidyl ether (HDDGE); and a crosslinking system comprising, consisting essentially of or consisting of about 100 parts by weight of a polyetherdiamine compound, e.g. Jeffamine® D400 and about 0-3 parts by weight triethanolamine (TEA), e,g, about 0.1 - 3
  • the composition may be suitable for curing at a temperature in the range of 70- 90°C.
  • the composition may comprise an epoxy resin comprising, consisting essentially of or consisting of 1 ,6-Hexanediol diglycidyl ether (HDDGE); and a crosslinking system comprising, consisting essentially of or consisting of a polyetherdiamine compound, e.g. Jeffamine® D400.
  • HDDGE 1 ,6-Hexanediol diglycidyl ether
  • a crosslinking system comprising, consisting essentially of or consisting of a polyetherdiamine compound, e.g. Jeffamine® D400.
  • a second crosslinker and/or crosslinking accelerator may not be required in addition to the first crosslinker, when the composition is cured at a higher temperature such as at about 70-90°C.
  • a composition suitable for curing at a temperature in the range of 70-90°C may comprise an epoxy resin comprising, consisting essentially of or consisting of 1 ,6-Hexanediol diglycidyl ether (HDDGE); and a crosslinking system consisting essentially of or consisting of a polyetherdiamine compound, e.g. Jeffamine® D400.
  • an epoxy resin comprising, consisting essentially of or consisting of 1 ,6-Hexanediol diglycidyl ether (HDDGE); and a crosslinking system consisting essentially of or consisting of a polyetherdiamine compound, e.g. Jeffamine® D400.
  • a curable composition for treating a region of a formation comprising:
  • an epoxy resin comprising, consisting essentially of or consisting of 1 ,6- Hexanediol diglycidyl ether (HDDGE); and
  • a crosslinking system comprising, consisting essentially of or consisting of a polyetherdiamine compound, optionally Jeffamine® D400; a polyetherdiamine compound, optionally Jeffamine® D400, with a minor amount of 2- methylpentamethylenediamine; a polyetherdiamine compound, optionally Jeffamine® D400, with a minor amount of hexamethylene diamine (HMDA); and/or a polyetherdiamine compound, optionally Jeffamine® D400, with a minor amount of triethanolamine (TEA),
  • composition is capable of curing in approximately 1 -10 hours at about 30-90°C, and the amount or relative amounts of the component(s) of the crosslinking system is/are selected dependent on the temperature of the region of the formation.
  • the composition may be capable of curing in the formation in situ.
  • the composition may be capable of curing within approximately 15 hours from injection, e.g. within about 10 hours from injection, e.g. within about 8 hours from injection.
  • the composition may be capable of curing within about 1 -15 hours, e.g. within about 1 -10 hours, e.g. within about 2-8 hours, e.g. 3-8 hours, from injection.
  • the crosslinking system may consist essentially of or may consist of Jeffamine® D400 or Jeffamine® D400 with a minor amount of 10% triethanolamine (TEA), e.g. Jeffamine® D400 with about 0-10 wt% TEA.
  • TEA triethanolamine
  • the crosslinking system may consist essentially of or may consist of Jeffamine® D400 or Jeffamine® D400 with a minor amount of 10% triethanolamine (TEA), e.g. Jeffamine® D400 with about 0-10 wt% TEA.
  • the ratio of epoxy resin, e.g. HDDGE, and first crosslinker, e.g. Jeffamine® D400 may be the same or substantially the same in all compositions (e.g., for use at 30-50°C, 50-70°C, and 70-90°C).
  • the amount or concentration of the second crosslinker or crosslinking accelerator, e.g. TEA may vary dependent on the target temperature.
  • the composition may comprise about 0.05-0.2 wt %, e.g. about 0.07-0.1 wt%, of crosslinking accelerator, e.g. triethanolamine (TEA), for use in a composition suitable for curing at a temperature in the range of 30-50°C.
  • crosslinking accelerator e.g. triethanolamine (TEA)
  • the composition may comprise about 0.01 -0.05 wt%, e.g. about 0.02-0.03 wt%, of crosslinking accelerator, e.g. triethanolamine (TEA), for use in a composition suitable for curing at a temperature in the range of 50-70°C.
  • crosslinking accelerator e.g. triethanolamine (TEA)
  • TAA triethanolamine
  • the composition may be substantially free of crosslinking accelerator, e.g. triethanolamine (TEA), for use in a composition suitable for curing at a temperature in the range of 70-90°C. This may allow the formulation of a composition suitable for use in a variety of temperatures, using only two or three components.
  • a method for treating a region of a formation comprising:
  • composition comprises or is a composition as described in relation to the first aspect, second aspect or third aspect of the invention.
  • the method may comprise curing the composition.
  • the method may comprise curing the composition in situ.
  • the method may comprise curing the composition within approximately 15 hours from injection, e.g. within about 10 hours from injection, e.g. within about 8 hours from injection.
  • the method may comprise curing the composition within about 1 -15 hours, e.g., within about 1 -10 hours, e.g. within about 2- 8 hours, e.g. 3-8 hours, from injection.
  • the method may comprise plugging or at least partially plugging a high- permeability region of a subterranean formation, e.g. the region of the formation.
  • the method may comprise plugging or at least partially plugging the region of the formation with the composition. This may be useful for subsequent enhanced oil recovery by water, gas, or chemical flooding.
  • the method may comprise performing conformance control.
  • the method may comprise consolidating the formation, e.g. consolidating the region of the formation.
  • the method may comprise consolidating the region of the formation with the composition. This may help reduce production of sand from the formation during production.
  • the method may comprise performing sand control.
  • the method may comprise consolidating proppants, e.g. proppant particles, in the formation, e.g. in the region of the formation.
  • the method may comprise consolidating proppants, e.g. proppant particles, in the region of the formation with the composition. This may help prevent the proppant particles being produced back into the wellbore during subsequent production of the formation.
  • the method may comprise performing proppant consolidation.
  • the method may comprise treating, e.g. cementing and/or repairing, downhole equipment, e.g., casings or liners, with the composition.
  • the method may comprise abandoning a well.
  • a curable composition according the first aspect, second aspect or third aspect of the invention for treating a region of a formation.
  • the composition may be used for plugging or at least partially plugging a high- permeability region of a subterranean formation, e.g. the region of the formation. This may be useful for subsequent enhanced oil recovery by water, gas, or chemical flooding.
  • the composition may be used for performing conformance control.
  • the composition may be used for consolidating the formation, e.g. consolidating the region of the formation. This may help reduce production of sand from the formation during production.
  • the composition may be used for performing sand control.
  • the composition may be used for consolidating proppants, e.g. proppant particles, in the formation, e.g. in the region of the formation. This may help prevent the proppant particles being produced back into the wellbore during subsequent production of the formation.
  • the composition may be used for performing proppant consolidation.
  • the composition may be used for treating, e.g. cementing and/or repairing, downhole equipment, e.g., casings or liners, with the composition.
  • the composition may be used for abandoning a well.
  • a method for treating a region of a formation comprising:
  • composition suitable for treatment of the region of a formation comprising:
  • an epoxy resin comprising, consisting essentially of or consisting of 1 ,6- Hexanediol diglycidyl ether (HDDGE); and
  • a crosslinking system comprising, consisting essentially of or consisting of a polyetherdiamine compound, optionally Jeffamine® D400; a polyetherdiamine compound, optionally Jeffamine® D400, with a minor amount of 2-methylpentamethylenediamine; a polyetherdiamine compound, optionally Jeffamine® D400, with a minor amount of hexamethylene diamine (HMDA); and/or a polyetherdiamine compound, optionally Jeffamine® D400, with a minor amount of triethanolamine (TEA),
  • the amount or relative amounts of the component(s) of the composition e.g. of the crosslinking system, is/are selected dependent on the parameter of the region of the formation.
  • the method may comprise determining a/the temperature of the region of a formation.
  • the amount or relative amounts of the component(s) of the composition e.g. of the crosslinking system, may be selected dependent on the temperature of the region of the formation.
  • the method may comprise selecting a composition comprising: an epoxy resin comprising, consisting essentially of or consisting of 1 ,6-Hexanediol diglycidyl ether (HDDGE); and a crosslinking system comprising, consisting essentially of or consisting of about 100 parts by weight of a polyetherdiamine compound, e.g. Jeffamine® D400 and about 3-10 parts by weight triethanolamine (TEA).
  • a composition comprising: an epoxy resin comprising, consisting essentially of or consisting of 1 ,6-Hexanediol diglycidyl ether (HDDGE); and a crosslinking system comprising, consisting essentially of or consisting of about 100 parts by weight of a polyetherdiamine compound, e.g. Jeffamine® D400 and about 3-10 parts by weight triethanolamine (TEA).
  • HDDGE 1 ,6-Hexanediol diglycidyl ether
  • TSA triethanolamine
  • the method may comprise selecting a composition comprising: an epoxy resin comprising, consisting essentially of or consisting of 1 ,6-Hexanediol diglycidyl ether (HDDGE); and a crosslinking system comprising, consisting essentially of or consisting of about 100 parts by weight of a polyetherdiamine compound, e.g. Jeffamine® D400 and about 0-3 parts by weight triethanolamine (TEA), e,g, about 0.1 -3 parts by weight triethanolamine (TEA).
  • a polyetherdiamine compound e.g. Jeffamine® D400
  • TAA triethanolamine
  • TAA triethanolamine
  • the method may comprise selecting a composition comprising: an epoxy resin comprising, consisting essentially of or consisting of 1 ,6-Hexanediol diglycidyl ether (HDDGE); and a crosslinking system consisting essentially of or consisting of a polyetherdiamine compound, e.g. Jeffamine® D400.
  • the method may comprise (or further comprise) selecting a composition having a viscosity which permits injection of the composition at/to the region of the formation.
  • the viscosity may be sufficiently low to permit the composition to flow to the region of the formation.
  • the viscosity may be sufficiently high to maintain integrity of the composition during curing at the region of the formation.
  • the selected viscosity may be dependent on one or more paramaters of the formation (for example, one or more physical paramaters, including porosity, temperature, pressure, movement and the like).
  • the viscosity of the composition may be at least about 1 cP, e.g. at least about 100 cP, e.g. at least about 500 cP.
  • the viscosity of the composition e.g., at the time of injection, e.g. at surface may be in the range of about 1 cP to about 2,000 cP, e.g. about 500 cP to about 1 ,500 cP.
  • the viscosity of the composition e.g., at the time of injection, e.g. at surface, may be about 1 ,000 cP.
  • the viscosity at the time of injection, e.g. at surface, at surface may relate to the viscosity of the composition upon or shortly after mixing, e.g. prior to hardening or shortly after hardening has started.
  • the viscosity of the composition e.g., at the location where the composition is intended to be injected, e.g., at the region of the formation, may be at least about 1 ,000 cP, e.g. at least about 2,000 cP, e.g. at least about 3,000 cP.
  • the viscosity of the composition e.g., at the location where the composition is intended to be injected, e.g., at the region of the formation, may be in the range of about 1 ,000 cP to about 100,000 cP, e.g. about 3,000 cP to about 10,000 cP.
  • the method may comprise preparing the composition.
  • the method may comprise mixing one or more components of the composition, e.g., prior to injection.
  • the method may comprise adding one or more additives to the composition, one or more additives capable of altering, modifying and/or adjusting the viscosity of the composition, such as a solvent, a diluent, a viscosifier, a thickener, or the like.
  • the method may comprise injecting the composition in the region of the formation.
  • Figure 1 shows photographs of epoxy resin plugs cured with (a) Jeffamine® D400 at 80°C, (b) HMDA at 80°C, and (c) 2-methylpentamethylenediamine (Dytek® A) at 30°C;
  • Figure 2 shows a photograph of an epoxy resin formulation based on 300g HDDGE and a crosslinking system containing 100% HMDA, cured at 50°C;
  • Figure 3 is a graph showing curing characteristics for a composition containing a HDDGE epoxy resin and HMDA or Dytek® as sole crosslinker;
  • Figure 4 is a graph showing curing characteristics for a composition containing a HDDGE epoxy resin and a combination of Jeffamine® D-400 as primary crosslinker with either Dytek® A or TEA as additional crosslinker/accelerator;
  • Figure 5 is a graph showing curing characteristics for a composition containing a HDDGE epoxy resin and a combination of HHPA maleic anhydride as primary crosslinker with various amounts of pyridine as accelerator;
  • Figure 6 is a graph showing curing characteristics for a composition containing a HDDGE epoxy resin and a combination of 130 pbw Jeffamine® D-400 as primary crosslinker with 10 pbw TEA as accelerator, cured at 30°C
  • Figure 7 is a graph showing curing characteristics for a composition containing a HDDGE epoxy resin and a combination of 100 pbw Jeffamine® D-400 as primary crosslinker with 3 pbw TEA as accelerator, cured at 50°C;
  • Figure 8 is a graph showing curing characteristics for a composition containing a HDDGE epoxy resin and Jeffamine® D-400 as sole crosslinker, cured at 80°C;
  • Figure 9 is a graph showing curing characteristics for a composition containing a HDDGE epoxy resin and a combination of 100 pbw Jeffamine® D-400 as primary crosslinker with 3 pbw TEA as accelerator, cured at 50°C;
  • Figure 10 shows a schematic view of an embodiment of an assembly for mixing and injecting a composition of the present invention
  • Figure 1 1 shows a schematic view of another embodiment of an assembly for mixing and injecting a composition of the present invention
  • Figure 12 shows DSC data for 30-50°C, 50-70°C and 70-90°C formulations according to embodiments of the present invention
  • Figures 13(a) to 13(c) are schematic representations illustrating the effect of curing times on the intended treatment
  • Figures 14 (a) and 14(b) are schematic representations illustrating the effect of the viscosity of the composition on the intended treatment. DETAILED DESCRIPTION OF THE DRAWINGS
  • Trietanolamina 85% Trietanolamina 99%
  • the resulting cured plugs are shown on Figure 1. It can be seen that the appearance of the cured plugged can vary greatly depending on the curing agent, from (a) opaque (Jeffamine® D-400), to (b) translucent (HMDA), to (c) transparent/clear (Dytek® A).
  • Dytek® A and HMDA constituted potentially suitable crosslinkers, and were investigated individually.
  • Table 1 provides an overview of curing tests using HDDGE as epoxy resin, Jeffamine® D-400 as crosslinker, and a number of compounds used an additional crosslinkers or crosslinking accelerators.
  • HHPA/mal 70-90C form 1.0% pyridine 45 min 72 C
  • HHPA/mal 70-90C form 0.25 % pyridine 180 min 5 C
  • HHPA/mal 70-90C form 0.1 % pyridine 300 min 2 C
  • HHPA/maleic anhydride tests are shown in Figure 5 with different accelerator concentrations of 1.5%, 1 .0%, 0.25% and 0.1 % pyridine accelerator. It can be seen that HHPA/malic produce extensive heat when the concentration of pyridine accelerator is 1 % or above. At concentrations of 0.25 % or below the heat release was considered to be acceptable.
  • the first 70-90°C formulation to be tested was based on HHPA maleic anhydride with 0.2% pyridine. This formulation did, however, not cure even after 12 hours. The sample was seen to be discoloured and it is suspected that the hardener had been contaminated by water.
  • HHPA maleic anhydride As an alternative to HHPA maleic anhydride, Jeffamine® D400 without accelerator was tested for high temperature curing (see Figure 8). A formulation with no added accelerator was measured and found to cure in 1 hour and 45 minutes. This demonstrates that Jeffamine® D-400 is a suitable crosslinker for high temperature applications.
  • DSC Differential scanning calorimetry
  • the DSC data is presented in Figure 12 and shows how much heat is consumed or released while the epoxy formulations are heated from room temperature to ⁇ 120°C.
  • a peak pointing upward represents a heat release (exothermic reaction) while a downward pointing peak (valley) represents a consumption of heat (endothermic reaction). All the formulations show the same general trend in the heat release in this temperature range.
  • a broad and relatively weak exothermic peak appears from room temperature to ⁇ 70-80°C. This peak represents the curing process of the epoxy formulation. At higher temperatures another, more intense, exothermic peak appears. Without wishing to be bound by theory, it is thought that this peak may represent the flash-set process where so much heat is released that the temperature of the epoxy mixture increases uncontrollably if the heat is not removed efficiently.
  • the results of the DSC measurements are summarized in Table 8.
  • the onset temperature for the curing process is very close to room temperature for all the formulations indicating that the curing process starts already at room temperature even though the formulations are designed to cure at higher temperatures.
  • the exothermic peak temperature is also very similar for all formulations, ⁇ 40-45°C. This means the maximum rate of heat release happens at this temperature for all formulations.
  • the accelerator works as a catalyst during the curing and therefore only affects the reaction kinetics and not the thermodynamics.
  • the unchanged thermodynamics are also nicely illustrated in the total heat release during curing.
  • Peak area (heat release) 3.0 J/g 7.0 J/g 8.5 J/g
  • the present environmental epoxy resins can be discarded, for example at sea.
  • the hardener and the resin may be cooled prior to mixing to reduce the risk of flash setting. This could be done by cooling the chemicals with cold sea water through a coil immersed in the epoxy tanks (see Figures 10 and 1 1 ).
  • the temperature of the epoxy should be monitored at critical locations such at the inlet to the pump and inside the batch mixer to ensure that it stays low throughout the pumping job.
  • Figure 10 shows a schematic view of an embodiment of an assembly for mixing and injecting a composition of the present invention.
  • the resin is stored in a resin container 10a and the crosslinking composition is stored in a crosslinker container 20a.
  • Resin and crosslinker are mixed as a batch in a batch container 30a, which is kept cooled by a cooling device 40a.
  • the mixed composition 35a is pumped via pump 50a into tubing 60a for injection in a well.
  • Figure 1 1 shows a schematic view of another embodiment of an assembly for mixing and injecting a composition of the present invention.
  • the resin is stored in a resin container 10b and the crosslinking composition is stored in a crosslinker container 20b.
  • Resin and crosslinker are each kept cooled by cooling devices 41 b and 42b.
  • each of the resin and crosslinker can be pumped via respective pumps 51 b and 52b into and mixed in container 30b.
  • the mixed composition 35b can then be pumped via pump 53b into tubing 60b for injection in a well.
  • Figure 13 is a schematic representation illustrating the effect of curing times on the intended treatment.
  • the composition 135 hardens before it can reach the location intended to be treated (here a region 180 of a channel).
  • the composition in the event of delayed hardening, i.e. when the curing time of the composition is too long, the composition does not form an effective plug within the channel 180, and a fluid, e.g. formation fluid, may still be able to trickle or pass through or around the plug 135.
  • a fluid e.g. formation fluid
  • the composition was selected to exhibit an adequate curing time under the conditions in the formation, e.g. at about 30°C-90°C.
  • FIG 14 is a schematic representation illustrating the effect of the viscosity of the composition on the intended treatment.
  • a composition 235 is injected into a liner 270 having perforations 272, for creating an annular plug around the liner 270.
  • a 7" liner 270 was sealed off with two inflatable packers 274, 275, inside the liner 270.
  • the liner 270 is placed inside a 8.5" open hole and the aim is to create a solid plug that closes the void spacing between the liner 270 and the formation.
  • An epoxy composition was injected from an upper packer (not shown) via an attached coil tubing 278. The injected epoxy 235 flows towards the perforation holes 272 of the liner 270.
  • Figure 14(b) illustrates the shape and the integrity of the formed plug using a computational model, based on different viscosities of the epoxy composition.
  • the indicated values relate to the viscosities of the composition in situ at the point of delivery, that is, when the composition reaches the perforations 272 and/or enters the surrounding annulus.
  • a person of skill in the art will appreciate the corresponding viscosities at the time of injection, e.g. at surface, will be significantly lower, as the composition starts hardening upon or shortly after mixing. With an in situ viscosity of about 100 cP (bottom), the resulting plug slumps into the lower part of the annulus before it can fully harden.
  • the resulting composition With a viscosity of about 3,000 cP (middle), the resulting composition forms an annular plug around the liner 270, with more material near a lower region of the annulus than near an upper region of the annulus. With a viscosity of about 10,000 cP (top), the resulting composition forms a relatively uniform annular plug 235 around the liner 270.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)

Abstract

La présente invention concerne une composition durcissable (35a, 35b) pour le traitement d'une région d'une formation comprenant une résine époxy et un système de réticulation ou de durcissement. Le système de réticulation ou de durcissement comprend un premier agent de réticulation ou agent de durcissement, le premier agent de réticulation ou agent de durcissement comprenant, étant essentiellement constitué de ou étant constitué d'un composé polyétherdiamine. La composition est respectueuse de l'environnement, est susceptible de durcir dans la région de la formation in situ, et ne durcit pas instantanément.
PCT/EP2018/080126 2017-11-10 2018-11-05 Compositions époxy respectueuses de l'environnement WO2019091900A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
GB1718601.6A GB2561638B8 (en) 2017-11-10 2017-11-10 Epoxy compositions for treating a region of a subterranean formation
GB1718601.6 2017-11-10
GBGB1719397.0A GB201719397D0 (en) 2017-11-22 2017-11-22 Environmentally friendly epoxy compositions
GB1719397.0 2017-11-22
GB1812280.4 2018-07-27
GBGB1812280.4A GB201812280D0 (en) 2018-07-27 2018-07-27 Environmentally friendly epoxy compositions

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WO2021173430A1 (fr) * 2020-02-25 2021-09-02 Saudi Arabian Oil Company Composition d'étanchéité et procédés d'obturation et d'abandon d'un puits de forage
US11168243B2 (en) 2018-08-30 2021-11-09 Saudi Arabian Oil Company Cement compositions including epoxy resin systems for preventing fluid migration
US11236263B2 (en) 2020-02-26 2022-02-01 Saudi Arabian Oil Company Method of sand consolidation in petroleum reservoirs
US11326087B2 (en) 2018-08-30 2022-05-10 Saudi Arabian Oil Company Compositions for sealing an annulus of a wellbore
US11332656B2 (en) 2019-12-18 2022-05-17 Saudi Arabian Oil Company LCM composition with controlled viscosity and cure time and methods of treating a lost circulation zone of a wellbore
US11370956B2 (en) 2019-12-18 2022-06-28 Saudi Arabian Oil Company Epoxy-based LCM compositions with controlled viscosity and methods of treating a lost circulation zone of a wellbore
US11827841B2 (en) 2021-12-23 2023-11-28 Saudi Arabian Oil Company Methods of treating lost circulation zones
US11939825B2 (en) 2021-12-16 2024-03-26 Saudi Arabian Oil Company Device, system, and method for applying a rapidly solidifying sealant across highly fractured formations during drilling of oil and gas wells

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WO2013102006A1 (fr) * 2011-12-29 2013-07-04 Dow Global Technologies Llc Systèmes de revêtement époxy utilisant des polyamines polycycliques en tant que durcisseurs époxy
WO2016048332A1 (fr) * 2014-09-25 2016-03-31 Halliburton Energy Services, Inc. Composition comprenant une résine durcissable et une argile modifiée de manière organophilique destinée à des applications de puits de pétrole souterrain

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WO2008147658A1 (fr) * 2007-05-23 2008-12-04 M-I Llc Utilisation d'émulsions époxydiques directes pour stabilisation de puits
WO2013102006A1 (fr) * 2011-12-29 2013-07-04 Dow Global Technologies Llc Systèmes de revêtement époxy utilisant des polyamines polycycliques en tant que durcisseurs époxy
WO2016048332A1 (fr) * 2014-09-25 2016-03-31 Halliburton Energy Services, Inc. Composition comprenant une résine durcissable et une argile modifiée de manière organophilique destinée à des applications de puits de pétrole souterrain

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11168243B2 (en) 2018-08-30 2021-11-09 Saudi Arabian Oil Company Cement compositions including epoxy resin systems for preventing fluid migration
US11326087B2 (en) 2018-08-30 2022-05-10 Saudi Arabian Oil Company Compositions for sealing an annulus of a wellbore
US11352541B2 (en) 2018-08-30 2022-06-07 Saudi Arabian Oil Company Sealing compositions and methods of sealing an annulus of a wellbore
US11472998B2 (en) 2018-08-30 2022-10-18 Saudi Arabian Oil Company Cement compositions including epoxy resin systems for preventing fluid migration
US11332656B2 (en) 2019-12-18 2022-05-17 Saudi Arabian Oil Company LCM composition with controlled viscosity and cure time and methods of treating a lost circulation zone of a wellbore
US11370956B2 (en) 2019-12-18 2022-06-28 Saudi Arabian Oil Company Epoxy-based LCM compositions with controlled viscosity and methods of treating a lost circulation zone of a wellbore
WO2021173430A1 (fr) * 2020-02-25 2021-09-02 Saudi Arabian Oil Company Composition d'étanchéité et procédés d'obturation et d'abandon d'un puits de forage
US11193052B2 (en) 2020-02-25 2021-12-07 Saudi Arabian Oil Company Sealing compositions and methods of plugging and abandoning of a wellbore
US11236263B2 (en) 2020-02-26 2022-02-01 Saudi Arabian Oil Company Method of sand consolidation in petroleum reservoirs
US11939825B2 (en) 2021-12-16 2024-03-26 Saudi Arabian Oil Company Device, system, and method for applying a rapidly solidifying sealant across highly fractured formations during drilling of oil and gas wells
US11827841B2 (en) 2021-12-23 2023-11-28 Saudi Arabian Oil Company Methods of treating lost circulation zones

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