WO2019081802A1 - Carte à circuit imprimé, son procédé de production et dispositif d'éclairage la comprenant - Google Patents

Carte à circuit imprimé, son procédé de production et dispositif d'éclairage la comprenant

Info

Publication number
WO2019081802A1
WO2019081802A1 PCT/FI2018/050642 FI2018050642W WO2019081802A1 WO 2019081802 A1 WO2019081802 A1 WO 2019081802A1 FI 2018050642 W FI2018050642 W FI 2018050642W WO 2019081802 A1 WO2019081802 A1 WO 2019081802A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
light source
illumination device
distance
Prior art date
Application number
PCT/FI2018/050642
Other languages
English (en)
Inventor
Juha RÖYHKIÖ
Original Assignee
Ledil Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ledil Oy filed Critical Ledil Oy
Publication of WO2019081802A1 publication Critical patent/WO2019081802A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
    • G02B19/0066—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • a printed circuit board a method for producing the same and an illumination device comprising the same
  • the disclosure relates generally to illumination engineering. More particularly, the disclosure relates to a printed circuit board and a method for producing the printed circuit board. The disclosure relates also to an illumination device comprising a printed circuit board, a light source, and an optical device such as a lens.
  • Figure 1 shows a section view of a representative part of an exemplifying illumination device 101 according to prior art. The section shown in figure 1 is taken along a plane that is parallel with the is parallel with the xy-plane of a coordinate system 199.
  • the illumination device comprises a printed circuit board "PCB" 102, a light source 103 assembled therein and an optical device 104 substantially surrounding the light source.
  • the optical device 104 can be for example rotationally symmetric with respect to a geometric line parallel with the y-axis of the coordinate system 199.
  • the light source shown in the figure 1 is a traditional LED comprising a dome section 105.
  • the optical device is designed so that when assembled as part of the illumination device, its rear focal point is located on light emitting surface of the light source 103.
  • the position of rear focal point of the optical device 104 is shown with an arrow 106 in figure 1 .
  • Figure 2 illustrates a representative part of an illumination device 201 comprising a printed circuit board 202, a light source 203 attached therein and an optical device 204 substantially surrounding the light source.
  • the printed circuit board and the optical device is as in figure 1 , but the light source different.
  • the size of the light source 203 is substantially smaller than the size of the light source 103.
  • the light emitting surface of the light source 203 is not at rear focal point of the optical device 204 when assembled as shown in the figure.
  • the rear focal point of the optical device 204 is shown with an arrow 206 in figure 2.
  • the rear focal point of the optical device is off by a distance (d 0 ff) from the optimal position.
  • a new illumination device for modifying distribution of light produced by a light source.
  • An illumination device comprises:
  • the center section of the printed circuit board is stamped so as light emitting surface of the light source is substantially at rear focal point of the optical device in proviso that distance (d) between the first surface of the central section and first surface of the peripheral section is > 0.0 mm.
  • the light source may comprise, for example, one or more light emitting diodes "LED".
  • a preferable optical device is a lens.
  • a new method for processing a printed circuit board comprising, providing a substantially planar printed circuit board comprising a peripheral section and a center section, - determining a distance (d) between rear focal point of an optical device and light emitting surface of a light source in an illumination device when the light source is assembled on a first surface of the center section of the substantially planar printed circuit board, and the optical device is substantially surrounding the light source, and - stamping the center section of the printed circuit board by the distance (d), from a first surface of the peripheral section, in proviso that the distance is > 0.0 mm.
  • a stamped printed circuit board obtainable by the method of the present invention.
  • a system comprising a stamped printed circuit board obtainable by the method of the present invention and a light source.
  • figure 1 and 2 illustrate illuminating devices according to the prior art for modifying light distribution
  • figures 3 and 4 illustrate illuminating devices according to exemplifying and non- limiting embodiments of the invention
  • figure 5 illustrates a method for the manufacture of a printed circuit board according to an exemplifying and non-limiting embodiment of the invention
  • figure 6 illustrates an exemplary stamped printed circuit board obtainable by the method shown in figure 5
  • figure 7 illustrates a top view of an exemplary printed circuit board according to an exemplifying and non-limiting embodiment of the invention.
  • Figure 3 shows a section view of a representative part of an illumination device 301 according to an exemplifying and non-limiting embodiment of the invention for modifying the distribution of light emitted by a light source 303.
  • the section shown in figure 3 is taken along a plane that is parallel with the is parallel with the xy-plane of a coordinate system 399.
  • the illumination device comprises a printed circuit board 302, a light source 303, and an optical device 304.
  • the printed circuit board of the illumination device shown in the figure comprises a peripheral section 307 and a center section 308.
  • the light source 303 is assembled on first surface 31 1 of the center section.
  • the illumination device comprises also an optical device 304 substantially surrounding the light source.
  • the light source and the optical device are assembled in respect each other in the illumination device preferably so that the section line A-A divides the light source and the optical device in equal portion as seen in the section view of figure 3.
  • the center section of the PCB is stamped so as the light emitting surface 309 of the light source is substantially at the rear focal point 306 of the optical device.
  • the stamping depth i.e. the distance (d) between first surface of the peripheral section 310 and the first surface of the center section 31 1 is 0.5 mm.
  • the printed circuit board is a metal core printed circuit board (MPCB), and the core metal is preferably aluminum.
  • Top surface of the MPCB comprises preferably a layer comprising glass fiber, epoxy resin and copper.
  • the light source is preferably light emitting diode "LED".
  • a particular LED is chip scale package (CSP) LED which is typically substantially smaller than traditional LEDs.
  • An exemplary difference is 0.5 mm in height.
  • the illuminating device may include two or more light sources such as LEDs, in particular CSP LEDs, and one or more optical devices such as lenses.
  • An optical device may surround plurality of light sources, in particular LEDs and CSP LEDs.
  • FIG. 4 A section view of an exemplary illumination device 401 comprising a stamped PCB 402 is shown in figure 4.
  • the section shown in the figure is taken along a plane that is parallel with the is parallel with the xy-plane of a coordinate system 499.
  • a part of the illumination device is enlarged for clarity.
  • One of the center sections is marked with reference number 408. Accordingly, the center section of the PCB is stamped in such a way that the light emitting surface 409 of the light source 403 is substantially at the rear focal point of the lens 404.
  • the rear focal point of the lens is marked with an arrow 406 in the enlarged part of the figure 4.
  • the center sections shown herein are identical, it should be understood that a PCB and thus also an illuminating device of the present invention may include plurality of center sections wherein one of more of them has different size and/or different stamping depth.
  • the present invention concerns a method for producing a stamped PCB.
  • the method shown in figure 5 comprises the following actions: action 501 : provide a substantially planar printed circuit board comprising a peripheral section and a center section, action 502: determine a distance (d) between rear focal point of an optical device and light emitting surface of a light source in an illumination device when the light source is assembled on a first surface of the center section of the substantially planar printed circuit board, and the optical device is substantially surrounding the light source, action 503: stamp the center section of the printed circuit board by a distance (d).
  • the term "substantially planar PCB" should be understood that there is no distance (d) in ( ⁇ ) y-direction of the coordinate system 699 between the center section 608 and peripheral section 607 of the PCB prior to stamping process.
  • the printed circuit board used in the method is preferably a metal core printed circuit board (MPCB).
  • the core metal is preferably aluminum.
  • Top surface of MPCB the printed circuit board comprises a layer comprising glass fiber, epoxy resin and copper.
  • the PCB When the distance (d) has been determined, the PCB is placed into a stamping press.
  • the stamping is performed so that the distance of the first surface of the center section from the first surface of the peripheral section in the stamped PCB equals to the distance (d) towards to the predetermined rear focal point of the optical device. Accordingly, the stamping of the center section is in ( ⁇ ) y-direction of the coordinate system 699. According to an exemplary embodiment the stamping is in (+)-y-direction of the coordinate system 699.
  • the stamping depth, i.e. the distance (d) may be as required by the optical device used. According to one embodiment distance is 0.1 mm - 1 mm. An exemplary distance is 0.25 mm. Another exemplary distance is 0.5 mm. Still another exemplary distance is 0.75 mm. Still another exemplary distance is 1 .0 mm.
  • the present invention concerns a PCB obtainable by the method disclosed above.
  • a section view of an exemplary PCB 602 obtainable by the method is shown in figure 5.
  • the section plane is parallel with the xy-plane of a coordinate system 699.
  • the PCB comprises a peripheral section 607 and a center section 608.
  • a light source is adapted to be assembled on first surface 61 1 of the center section.
  • the distance between the first surface of the peripheral section 610 and first surface of the center section 61 1 in y-direction of the coordinate system is marked with d that is thus also the stamping depth.
  • the arrow in the figure demonstrated the stamping direction.
  • An exemplary distance is 0.5 mm.
  • Another exemplary distance is 0.75 mm. Stamping into opposite direction is also possible. This may be useful in a situation when rear focal point of an optical device would be too close to a light source in an illumination device if a substantially planar PCB were used.
  • Figure 7 illustrates a top view of an exemplary printed circuit board 702 according to the present invention.
  • One of the stamped center portions is marked with reference number 708, and the peripheral section is marked with reference number 707
  • the stamped part of the PCB is square, and the PCB is designed for light sources. It is obvious for a skilled person that different design options are available.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Planar Illumination Modules (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

L'invention concerne un dispositif d'éclairage (401) comprenant une carte à circuit imprimé (PCB ; 402), une source de lumière (403) montée sur la section centrale (408) de la PCB et un dispositif optique (404). La section centrale de la carte à circuit imprimé est matricée de telle sorte que la surface d'émission de lumière (409) de la source de lumière se trouve sensiblement au niveau du point focal arrière (406) du dispositif optique.
PCT/FI2018/050642 2017-10-23 2018-09-11 Carte à circuit imprimé, son procédé de production et dispositif d'éclairage la comprenant WO2019081802A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20175936 2017-10-23
FI20175936 2017-10-23

Publications (1)

Publication Number Publication Date
WO2019081802A1 true WO2019081802A1 (fr) 2019-05-02

Family

ID=63840873

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI2018/050642 WO2019081802A1 (fr) 2017-10-23 2018-09-11 Carte à circuit imprimé, son procédé de production et dispositif d'éclairage la comprenant

Country Status (1)

Country Link
WO (1) WO2019081802A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1376708A2 (fr) * 2002-06-24 2004-01-02 Lumileds Lighting US, LLC Diode électroluminescente à émission latérale et lentille
KR20110068362A (ko) * 2009-12-16 2011-06-22 (주) 굿피앤씨 엘이디 조명 장치
EP2700868A2 (fr) * 2012-08-21 2014-02-26 Truck-Lite Europe GmbH Corps d'optique pour une lampe de véhicule
US20140055991A1 (en) * 2012-08-23 2014-02-27 Forrest Starnes McCanless Printed Circuit Boards with Deformations
EP2924333A1 (fr) * 2014-03-27 2015-09-30 Belux IP AG Luminaire modulaire

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1376708A2 (fr) * 2002-06-24 2004-01-02 Lumileds Lighting US, LLC Diode électroluminescente à émission latérale et lentille
KR20110068362A (ko) * 2009-12-16 2011-06-22 (주) 굿피앤씨 엘이디 조명 장치
EP2700868A2 (fr) * 2012-08-21 2014-02-26 Truck-Lite Europe GmbH Corps d'optique pour une lampe de véhicule
US20140055991A1 (en) * 2012-08-23 2014-02-27 Forrest Starnes McCanless Printed Circuit Boards with Deformations
EP2924333A1 (fr) * 2014-03-27 2015-09-30 Belux IP AG Luminaire modulaire

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