WO2019080657A1 - 一种压力温度处理电路，尤其是具有它的压力温度计 - Google Patents

一种压力温度处理电路，尤其是具有它的压力温度计

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Publication number
WO2019080657A1
WO2019080657A1 PCT/CN2018/104965 CN2018104965W WO2019080657A1 WO 2019080657 A1 WO2019080657 A1 WO 2019080657A1 CN 2018104965 W CN2018104965 W CN 2018104965W WO 2019080657 A1 WO2019080657 A1 WO 2019080657A1
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WO
WIPO (PCT)
Prior art keywords
pressure
temperature
unit
output
probe
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Application number
PCT/CN2018/104965
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English (en)
French (fr)
Inventor
陈怡因
Original Assignee
伊玛精密电子（苏州）有限公司
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Publication date
Application filed by 伊玛精密电子（苏州）有限公司 filed Critical 伊玛精密电子（苏州）有限公司
Publication of WO2019080657A1 publication Critical patent/WO2019080657A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/08—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of piezoelectric devices, i.e. electric circuits therefor
    • G01L9/085—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of piezoelectric devices, i.e. electric circuits therefor with temperature compensating means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02—Means for indicating or recording specially adapted for thermometers
    • G01K1/04—Scales
    • G01K1/045—Scales temperature indication combined with the indication of another variable
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G01K7/24—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G01K7/24—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit
    • G01K7/25—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit for modifying the output characteristic, e.g. linearising
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/08—Means for indicating or recording, e.g. for remote indication
    • G01L19/083—Means for indicating or recording, e.g. for remote indication electrical
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L27/00—Testing or calibrating of apparatus for measuring fluid pressure
    • G01L27/002—Calibrating, i.e. establishing true relation between transducer output value and value to be measured, zeroing, linearising or span error determination
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • G05B19/0423—Input/output
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K2219/00—Thermometers with dedicated analog to digital converters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L2019/0053—Pressure sensors associated with other sensors, e.g. for measuring acceleration, temperature
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/21—Pc I-O input output
    • G05B2219/21137—Analog to digital conversion, ADC, DAC
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/26—Pc applications
    • G05B2219/2622—Press

Definitions

  • the present invention relates to the field of air treatment, and in particular to a pressure temperature processing circuit, and more particularly to a pressure thermometer having the same.
  • Cipheral Patent Application No. 200810196365.0 discloses a pressure temperature sensor whose circuit part comprises a signal acquisition unit, an MCU, a display unit and a detection signal output unit.
  • the signal acquisition unit includes a thermistor for collecting a temperature signal, a pressure sensor for collecting a pressure signal, a conditioning circuit for a temperature signal and a pressure signal, and an A/D conversion circuit;
  • the detection signal output unit includes a temperature detection signal output circuit and a pressure detection signal.
  • An output circuit; the temperature and pressure signals output by the thermistor and the pressure sensor are respectively passed through a conditioning circuit of the temperature signal and the pressure signal, and then transmitted to the MCU through A/D conversion; the MCU processes the temperature and pressure signals and outputs the signal to the MCU.
  • the display unit simultaneously controls the outputs of the temperature detection signal output circuit and the pressure detection signal output circuit.
  • the sensor combines the traditional temperature sensor and pressure sensor into one, and has all the functions of the pressure sensor and the temperature sensor.
  • the temperature detection is also used as the basis for suppressing the temperature drift of the pressure.
  • the circuit part is installed with the thermistor in the main body, one end of the probe is connected with the main body, the thermistor and the pressure sensor are disposed in the other end of the probe; the thermistor is filled with the heat conductor, and the thermal The resistor is mounted close to the pressure sensor.
  • the temperature and pressure processing circuit design is not reliable enough, especially the temperature value A/D conversion part circuit design is not reasonable enough, so that the measurement has a delay; at the same time, the probe structure setting is unreasonable, resulting in a narrow effective measurement range, and due to the probe structure
  • the temperature and pressure measurement are lagging, the temperature and pressure display is not accurate enough in real time; at the same time, there are deficiencies in seismic and stability of use, and it is urgent to improve.
  • the present invention provides a pressure temperature processing circuit, particularly a pressure thermometer having the same.
  • the invention integrates the pressure and temperature sensor into an integral pressure thermometer, and realizes the simultaneous detection of the pressure temperature through the circuit design, so that it is more convenient in industrial application; at the same time, the pressure temperature processing circuit of the invention has reasonable design and realizes NPN, PNP switching output, voltage, current analog output, and equipped with self-reset button, through programming to control NPN, PNP switching output and voltage, current analog output parameters, making it more beneficial for industrial applications, easy to promote.
  • a pressure temperature processing circuit comprising:
  • a pressure and temperature measuring unit for measuring pressure and temperature signals
  • a pressure temperature processing unit connected to the pressure temperature measuring unit for processing the pressure and temperature signals measured by the pressure temperature measuring unit;
  • the main control unit is connected to the pressure temperature processing unit for reading and calculating the pressure and temperature signals processed by the pressure temperature processing unit.
  • the pressure temperature measuring unit comprises:
  • Pressure measuring unit using pressure ceramics for measuring pressure signals
  • the temperature measuring unit uses a thermistor for measuring the temperature signal.
  • the pressure temperature processing unit includes:
  • the pressure signal processing unit adopts a bridge sensor signal processing chip of the model ZMD31050 for A/D conversion of the pressure signal measured by the pressure ceramic into a pressure signal value, and the pressure ceramic is connected to the ZMD bridge sensor signal processing chip;
  • the temperature signal processing unit adopts a three-stage operational amplifier circuit for amplifying the temperature signal measured by the thermistor, and the thermistor is connected to the three-stage operational amplifier circuit.
  • the ZMD bridge sensor signal processing chip is provided with a built-in temperature sensor chip of the model LM73, and the LM73 built-in temperature sensor chip is connected to the ZMD bridge sensor signal processing chip, and the single chip uses the built-in temperature of the LM73.
  • the temperature detected by the sensor chip is temperature compensated for the pressure value processed by the ZMD bridge sensor.
  • the main control unit adopts a single chip microcomputer of the type PIC16F1518;
  • the ZMD bridge sensor signal processing chip connects the A/D conversion result of the pressure signal to the single chip microcomputer through the I 2 C bus, and is used for reading the pressure value after the A/D conversion by the single chip microcomputer;
  • the three-stage operational amplifier circuit connects the amplification result of the temperature signal to the single-chip microcomputer through the serial port, and is used for A/D conversion of the temperature signal into a temperature value through the internal A/D conversion channel of the single-chip microcomputer.
  • an output unit is disposed outside the main control unit, and the output unit includes a switch quantity output unit and an analog quantity output unit; the analog quantity output unit is configured to convert the pressure value and the temperature value after the A/D conversion into an analog quantity.
  • the switch output unit includes:
  • the PNP output unit is connected to the single chip microcomputer through the Q9 triode, and is used for controlling the output unit to output the pressure value and the temperature value switch output form as PNP;
  • the NPN output unit is connected to the single chip microcomputer through the Q15 transistor, and is used for controlling the output unit to output the pressure value and the temperature value switch output form to the NPN.
  • a first output protection unit is disposed outside the PNP output unit, and the first output protection unit is composed of three triodes Q10, Q11, and Q12, and functions as an overload protection;
  • a second output protection unit is disposed outside the NPN output unit, and the second output protection unit is composed of three triodes Q16, Q17, and Q18, and functions as an overload protection.
  • analog output unit includes:
  • D/A conversion unit using D/A conversion chip of model DAC101, D/A conversion chip is connected to single chip microcomputer;
  • 0 ⁇ 10V voltage analog output unit connected to D/A converter chip, used for analog output of D/A converted pressure signal or temperature signal with 0 ⁇ 10V voltage signal, and 0 ⁇ 10V voltage analog output unit Connected to the single-chip microcomputer, the single-chip microcomputer controls the 0 ⁇ 10V voltage analog output unit to work;
  • 4 ⁇ 20mA current analog output unit connected to D/A converter chip, used for analog output of D/A converted pressure signal or temperature signal with 4 ⁇ 20mA current signal, and 4 ⁇ 20mA current analog output unit Connected to the MCU, the MCU controls the 4 ⁇ 20mA current analog output unit to work.
  • the main control unit is provided with a display unit and an external control unit;
  • the display unit includes at least three seven-segment digital display tubes for displaying pressure values and temperature values in the single chip microcomputer;
  • the external control unit includes at least two self-reset buttons for adjusting the switching quantity output unit to be one of an NPN output mode or a PNP output mode for adjusting a voltage analog quantity or a current analog quantity output range of the analog output unit.
  • a pressure thermometer comprising the above pressure temperature processing circuit and a probe and a probe;
  • the probe is soldered to the probe, and the temperature processing PCB board is clamped in the probe, and the one end of the thermistor is filled with the conduction heat conductor and placed in the probe, and the other end of the thermistor is connected to the temperature processing PCB board;
  • a blind hole is defined in the probe, and a damping screw is disposed in the blind hole to contact the pressure ceramic.
  • the pressure ceramic is disposed on the top and bottom of the pressure to the pressure processing PCB, and the pressure ceramic is electrically connected to the pressure processing PCB.
  • a temperature signal processing unit is disposed on the temperature processing PCB board 305;
  • the probe is connected to the casing, and the main control PCB board is clamped by the plastic component in the casing, and the temperature processing PCB board and the pressure processing PCB board are electrically connected to the main control PCB board respectively;
  • the main control unit is provided on the main control PCB board And an external control unit, a digital output unit, an output protection unit, a D/A conversion unit, and an analog output unit.
  • the length of the probe is not less than 20 mm
  • the diameter of the probe is 3 ⁇ 10 mm
  • the thickness of the probe is 0.3 ⁇ 1.0 mm.
  • the invention integrates the pressure and temperature sensor into an integral pressure thermometer, and realizes the simultaneous detection of the pressure temperature through the circuit design, so that it is more convenient in industrial application; at the same time, the pressure temperature processing circuit of the invention has reasonable design and realizes NPN, PNP switch output, voltage and current analog output, and equipped with self-reset button, programmatically control NPN, PNP switch output and voltage, current analog output parameter; the probe and probe structure of the present invention are set properly, Structurally compensated for temperature and pressure measurements showing hysteresis and error problems, while making it have a wider measurement range, which is more beneficial for industrial applications and easy to promote.
  • FIG. 1 is a schematic diagram of a circuit module of a pressure temperature processing circuit of the present invention
  • FIG. 2 is a circuit schematic diagram of a pressure signal processing unit of the present invention
  • FIG. 3 is a circuit schematic diagram of a temperature signal processing unit of the present invention.
  • Figure 4 is a circuit schematic diagram of the main air unit of the present invention.
  • FIG. 5 is a circuit schematic diagram of a PNP output unit and a first output protection unit of the present invention
  • FIG. 6 is a circuit schematic diagram of an NPN output unit and a second output protection unit of the present invention.
  • FIG. 7 is a circuit schematic diagram of a 0 to 10V voltage analog output unit of the present invention.
  • FIG. 8 is a circuit schematic diagram of a 4-20 mA current analog output unit of the present invention.
  • Figure 9 is a circuit schematic diagram of a display driving unit of the present invention.
  • Figure 10 is a circuit schematic diagram of a display unit of the present invention.
  • Figure 11 is a schematic view showing the overall structure of the pressure thermometer of the present invention.
  • Figure 12 is a cross-sectional view of Figure 11 of the present invention.
  • Figure 13 is an exploded view of the overall structure of the present invention.
  • a pressure temperature processing circuit includes:
  • a pressure and temperature measuring unit for measuring pressure and temperature signals
  • a pressure temperature processing unit connected to the pressure temperature measuring unit for processing the pressure and temperature signals measured by the pressure temperature measuring unit;
  • the main control unit is connected to the pressure temperature processing unit for reading and calculating the pressure and temperature signals processed by the pressure temperature processing unit.
  • the pressure temperature measuring unit comprises:
  • the pressure measuring unit uses pressure ceramic J3 for measuring the pressure signal
  • the temperature measuring unit uses a thermistor for measuring the temperature signal.
  • the pressure temperature processing unit includes:
  • the pressure signal processing unit adopts the model ZMD31050 bridge sensor signal processing chip for A/D conversion of the pressure signal measured by the pressure ceramic to a pressure signal value, and the pressure ceramic J3 is connected to the ZMD bridge.
  • Sensor signal processing chip at the four pins of VINN, VSS, VINP, VBR;
  • the temperature signal processing unit adopts a three-stage operational amplifier circuit composed of U1A, U1B, and U1D for signal amplification of the temperature signal measured by the thermistor, and the thermistor is connected to the three-stage operational amplifier. Vpt- in the circuit.
  • the ZMD bridge sensor signal processing chip is provided with a built-in temperature sensing chip of the model LM73, and the LM73 built-in temperature sensing chip is connected to the SDA of the ZMD bridge sensor signal processing chip.
  • the two pins of SCL are used for temperature compensation of the ZMD bridge sensor signal processing chip.
  • the ZMD bridge sensor signal processing chip is provided with a built-in temperature sensing chip of the model LM73, and the LM73 built-in temperature sensing chip is connected to the SDA and SCL pins of the single chip microcomputer.
  • the single chip uses the temperature detected by the LM73 built-in temperature sensing chip to temperature compensate the processed value of the ZMD bridge sensor.
  • the main control unit adopts a single chip microcomputer of the type PIC16F1518;
  • the ZMD bridge sensor signal processing chip connects the A/D conversion result of the pressure signal, SDA and SCL, to the RC3 and RC4 pins of the single chip through the I 2 C bus, and is used for Reading the pressure value after A/D conversion by the single chip microcomputer;
  • the three-stage operational amplifier circuit connects the TC end of the temperature signal to the pin 23 of the single-chip microcomputer through the serial port, and is used to perform the temperature signal through the internal A/D conversion channel of the single-chip microcomputer. D is converted to a temperature value.
  • an output unit is disposed outside the main control unit, and the output unit includes a switch quantity output unit and an analog quantity output unit; the analog quantity output unit is configured to convert the pressure value and the temperature value after the A/D conversion into an analog quantity.
  • the switch output unit includes:
  • PNP output unit as shown in Figure 5, through the Q9, Q11 two transistors connected to the RC7 and RB4 pins of the microcontroller, for the pressure value and temperature value switch output form with PNP output as OUT1;
  • the NPN output unit is connected to the RC6 and RB5 pins of the microcontroller through two transistors Q15 and Q16 for outputting the pressure and temperature values in the form of a switch.
  • a first output protection unit is disposed outside the PNP output unit, and the first output protection unit is composed of three triodes Q10, Q11, and Q12, and functions as an overload protection; when an output short circuit occurs, the triode Q12 is turned on, further Q10 is turned on, so that the entire PNP output unit is grounded through the transistor Q11.
  • a first output protection unit is disposed outside the PNP output unit, and the first output protection unit is composed of three triodes Q10, Q11, and Q12, and functions as an overload protection; when an output short circuit occurs, the triode Q10 is turned on, further Q11 turns on, which causes RB4 to go low, so that the microcontroller stops output and achieves protection.
  • a second output protection unit is disposed outside the NPN output unit, and the second output protection unit is composed of three triodes Q16, Q17, and Q18, and functions as an overload protection.
  • analog output unit includes:
  • the D/A conversion unit adopts a D/A conversion chip of the type DAC101, and the D/A conversion chip is connected to the RA1, RA2, and RA3 pins of the single chip microcomputer;
  • the 0 ⁇ 10V voltage analog output unit is connected to the DA pin of the D/A converter chip for analog output of the D/A converted pressure signal or temperature signal with a 0 ⁇ 10V voltage signal. It is OUT3, and the 0 ⁇ 10V voltage analog output unit is connected to the CONV pin of the single-chip microcomputer, and the 0 ⁇ 10V voltage analog output unit is controlled by the single-chip microcomputer;
  • the 4 ⁇ 20mA current analog output unit is connected to the DA pin of the D/A converter chip for analog output of the D/A converted pressure signal or temperature signal with 4 ⁇ 20mA current signal.
  • 4 ⁇ 20mA current analog output unit is connected to the CONI pin of the single-chip microcomputer, the 4 ⁇ 20mA current analog output unit is controlled by the single-chip microcomputer, that is, the CONV and CONI pins can be controlled by the single-chip microcomputer programming, and further select 0 ⁇ 10V voltage analog output mode or 4 ⁇ 20mA current analog output mode.
  • the main control unit is provided with a display unit and an external control unit;
  • the display unit includes at least three seven-segment digital display tubes dig1, dig2, dig3 for displaying pressure values and temperature values in the single-chip microcomputer; the three seven-segment digital display tubes dig1
  • the dig2 and dig3 are connected to the RC1, RC2, and RC3 pins of the MCU through the display driver unit to drive the display.
  • the invention also sets an LED output indicating unit, including an OUT1 indicator and an OUT2 indicator, wherein the OUT1 indicator indicates a switching output state, when the switching output mode is a switching output, OUT1 is lit; and the OUT2 indicator indicates an analog output state. When the switching output mode is the analog output, OUT2 lights up).
  • the external control unit includes at least two self-reset buttons 6 for adjusting the switch output unit to be an NPN output mode or a PNP output mode for adjusting a voltage analog quantity or a current analog output range of the analog output unit.
  • the digital output unit also has a hysteresis function, a window function, and an offset calibration function.
  • a pressure thermometer including the above pressure temperature processing circuit and probe 3, probe 316;
  • the probe 316 is soldered to the probe 3, and the temperature processing PCB board 305 is placed in the probe 3.
  • the one end of the thermistor 310 is filled with a conducting heat conductor and placed in the probe 316, and the other end of the thermistor is connected to the temperature. Processing the PCB board 305;
  • a blind hole 312 is defined in the probe, and a damping screw 315 is disposed in the blind hole 312 to contact the pressure ceramic 309.
  • the pressure ceramic 309 is disposed above and below the gasket to the pressure processing PCB board 318, and the pressure ceramic 309 is electrically connected to the pressure.
  • the PCB board 318 is processed.
  • a temperature signal processing unit is disposed on the temperature processing PCB board 305;
  • a pressure signal processing unit is disposed on the pressure processing PCB board 318;
  • the probe 3 is connected to the housing 2, and the main control PCB board 201 is disposed in the housing 2 through the plastic member 202.
  • the temperature processing PCB board 305 and the pressure processing PCB board 318 are electrically connected to the main control PCB board 201, respectively;
  • the control PCB board 201 is provided with a main control unit and an external control unit, a switch quantity output unit, an output protection unit, a D/A conversion unit, and an analog output unit.
  • the length of the probe 316 is not less than 20 mm, the diameter of the probe 316 is 3 ⁇ 10 mm, and the thickness of the probe 316 is 0.3 ⁇ 1.0 mm.
  • the probe in this range can solve the display hysteresis problem, synchronize the display data, can be stabilized without waiting for a long time, and the probe structure of the invention makes the effective temperature range extend to -40 ° C ⁇ 150 ° C, which The measuring range of the probe has a wider measuring range than the conventional industrial temperature sensor, making it more suitable for industrial applications.
  • the probe 3 thread adopts G1 thread, and the diameter of the probe is allowed to be 3-5 mm.
  • the probe with a diameter of 5 mm is finally used; the thickness of the probe is 0.3-1.0 mm, and the compressive strength should be Need to reach more than 300bar, the final use of 0.5mm thickness probe, in the choice of probe length, by setting the standard temperature of -40 ° C (as shown in Table 1), 0 ° C (as shown in Table 2), 150 ° C ( As shown in Table 3, test the test temperature results for multiple probe lengths and set the probe length to at least 27 mm.
  • the housing 2 is further provided with a connector 205 for externally switching the output of the digital output unit or the analog output of the analog output unit;
  • the display driving unit and the display unit are disposed on the display circuit PCB board 106, and the display circuit PCB board 106 is fixed on the main control PCB board 201 by screws 102; the upper cover 1 is provided with the upper cover 1 and the upper cover 1 and the shell The body 2 is fixed by the sealing ring 203 and the sealing gasket 204 to facilitate subsequent maintenance and maintenance.
  • the upper cover 1 has a sloped surface, a "convex" type window on the upper part, and two buttons 101 on the lower part; at the same time, the upper cover 1 is further provided with a pressing piece 105, a display cover 104, and a silicone gasket 103.
  • the pressing piece 105 has a card slot on the front side and a stud on the back side.
  • the display cover 104 is inserted into the card slot through the pressing piece 105.
  • the silicone gasket 103 is placed on the surface of the display cover 103, and mainly functions as a waterproofing device.
  • the splicing 104, the display cover 103, and the silicone gasket 103 are fixed in the upper cover 1 by welding.
  • the connecting member 303 is disposed.
  • the upper end of the connecting member 303 is interference-fitted by the sealing ring 301 and the sealing gasket 302 and the lower end of the housing 2.
  • the lower end of the connecting member 303 is interference-fitted by the sealing ring 304 and the probe 3.
  • Two symmetric wrenching slots are arranged on the outside of the probe 3 for subsequent installation and maintenance.
  • the lower end of the probe 3 is externally threaded, and the top of the external thread is provided with a flat washer three 317; at the center of one of the wrenches
  • a venting hole is provided with a gas permeable membrane 313 attached thereto, and a gas permeable pressure cap 314 is installed from the upper portion of the gas permeable membrane 313 to be fixedly fitted with the venting hole.
  • the venting hole design makes the pressure ceramic and the thermistor work environment stable and convenient for heat exchange.
  • Each of the top and bottom of the blind hole 312 is provided with a step, the top step is provided with an insulating spacer 306, the bottom step is placed with a flat washer 311, the pressure ceramic 309 is placed on the flat washer 311, and a flat washer 308 is disposed.
  • the pressure washer 309 is placed on the pressure ceramic 309, and the flat washer 311, the pressure ceramic 309, and the flat washer 308 are screwed and fixed by screws.
  • the damper screw is forced by the pressure washer 309 through the flat washer 311, so that the pressure is buffered, and the structure of the plurality of washer sleeves solves the effects of thermal expansion and contraction and uneven force of the pressure detecting unit, and the pressure
  • the detection unit can perform multiple ranges of -1bar ⁇ 0.1/0.25/0.5/1/2/5/10/20/50/100/200/250/400/600bar, which can be tested according to the pressure ceramic model and software.
  • the range selection in particular, the measurement of micro-pressure of 0.1/0.25/0.5ba can also be included.
  • the probe of the present invention is mounted to the gas measurement site or liquid measurement field pipe to be measured by the external thread on the probe 3, so that the probe 316 and the blind hole 312 are located in the gas measurement site or the liquid measurement site, and the pipe passes through the flat
  • the gasket 317 and the probe are pressed together to ensure airtightness.
  • the current temperature value and the pressure value can be read by the display circuit 106, and the output of the temperature value and the pressure value can be extracted through the connector 206.
  • buttons 6 can be selectively pressed to implement the following functions:
  • Table 4 shows the function menus of the two self-reset buttons 6 of the present invention:

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Abstract

一种压力温度处理电路和压力温度计，压力温度处理电路包括：用于测量压力和温度信号的压力温度测量单元；连接于压力温度测量单元，用于对压力温度测量单元测量的压力和温度信号进行处理的压力温度处理单元；连接压力温度处理单元，用于读取和计算压力温度处理单元处理后的压力和温度信号的主控单元。压力温度计包括：压力温度处理电路和探棒(316)、探头(3)。将压力温度处理电路集成为一个整体压力温度计，并通过电路设计，实现了对压力温度的同时检测和NPN、PNP开关量输出，电压、电流模拟量输出，且搭载自复位按钮，通过编程控制NPN、PNP开关量输出和电压、电流模拟量输出量参数，使其更有益于工业应用，易于推广。

Description

一种压力温度处理电路，尤其是具有它的压力温度计 技术领域
本发明涉及空气处理领域，具体涉及一种压力温度处理电路，尤其是具有它的压力温度计。
背景技术
在现有技术中，将温度和压力检测传感器结合于一个设备上，以便工业应用，给用户带来了接线简单、可靠性高的优点。申请号为200810196365.0的中国专利，公开了一种压力温度传感器，其电路部分为包括信号采集单元、MCU、显示单元和检测信号输出单元。所述信号采集单元包括采集温度信号的热敏电阻、采集压力信号的压力传感器、温度信号和压力信号的调理电路以及A/D转换电路；检测信号输出单元包括温度检测信号输出电路、压力检测信号输出电路；所述热敏电阻和压力传感器输出的温度和压力信号分别经过温度信号和压力信号的调理电路后，再经A/D转换传到MCU中；MCU把温度和压力信号处理后输出到显示单元，同时控制温度检测信号输出电路和压力检测信号输出电路的输出。其传感器将传统的温度传感器、压力传感器合二为一，同时具备压力传感器和温度传感器的所有功能，温度的检测同时作为压力的温漂抑制依据。其在传感器结构上：电路部分安装热敏电阻在主体内，探棒的一端和主体连接，热敏电阻和压力传感器设在探棒的另一端内；热敏电阻的周围填充热导体，热敏电阻的安装位置贴近压力传感器。其温度和压力处理电路设计不够可靠，尤其是温度值A/D转换部分电路设计不够合理，使得测量存在延时；同时探棒结构设置不合理，导致有效温度测量范围窄，且由于探棒结构使得温度和压力测量有滞后，温度压力显示不够实时精准；同时在抗震和使用稳定性上存在不足，迫切需要加以改进。
发明内容
为解决上述问题，本发明提供了一种压力温度处理电路，尤其是 具有它的压力温度计。本发明将压力和温度传感器集成为一个整体压力温度计，并通过电路设计，实现了对压力温度的同时检测，使其在工业应用时更加方便；同时本发明的压力温度处理电路设计合理，实现了NPN、PNP开关量输出，电压、电流模拟量输出，且搭载自复位按钮，通过编程控制NPN、PNP开关量输出和电压、电流模拟量输出量参数，使其更有益于工业应用，易于推广。
为实现所述技术目的，本发明的技术方案是：一种压力温度处理电路，包括：
压力温度测量单元，用于测量压力和温度信号；
压力温度处理单元，连接于压力温度测量单元，用于对压力温度测量单元测量的压力和温度信号进行处理；
主控单元，连接压力温度处理单元，用于读取和计算压力温度处理单元处理后的压力和温度信号。
进一步，所述压力温度测量单元包括：
压力测量单元，采用压力陶瓷，用于对压力信号的测量；
温度测量单元，采用热敏电阻，用于对温度信号的测量。
进一步，所述压力温度处理单元包括：
压力信号处理单元，采用型号为ZMD31050的桥式传感器信号处理芯片，用于对压力陶瓷测量的压力信号进行A/D转换为压力信号值，所述压力陶瓷连接至ZMD桥式传感器信号处理芯片；
温度信号处理单元，采用三级运放电路，用于对热敏电阻测量的温度信号进行信号放大，所述热敏电阻接入三级运放电路中。
作为本发明的优选，所述ZMD桥式传感器信号处理芯片外设置型号为LM73的内置温度传感芯片，LM73内置温度传感芯片连接至ZMD桥式传感器信号处理芯片，所述单片机使用LM73内置温度传感芯片检测到的温度对所述ZMD桥式传感器处理后的压力值进行温度补偿。
进一步，所述主控单元采用型号为PIC16F1518的单片机；
所述ZMD桥式传感器信号处理芯片将压力信号的A/D转换结果通过I 2C总线连接至单片机，用于通过单片机读取A/D转换后的压力值；
所述三级运放电路将温度信号的放大结果通过串口连接至单片机，用于通过单片机内部A/D转换通道，将温度信号进行A/D转换为温度值。
进一步，所述主控单元外设置输出单元，所述输出单元包括开关量输出单元和模拟量输出单元；模拟量输出单元用于将A/D转换后的压力值和温度值以模拟量的形式输出；
开关量输出单元，包括：
PNP输出单元，通过Q9三极管连接至单片机，用于控制输出单元将所述压力值和温度值开关量输出形式以PNP输出；
NPN输出单元，通过Q15三极管连接至单片机，用于控制输出单元将所述压力值和温度值开关量输出形式以NPN输出。
进一步，所述PNP输出单元外设置第一输出保护单元，第一输出保护单元由Q10、Q11、Q12三个三极管组成，起到过载保护的作用；
所述NPN输出单元外设置第二输出保护单元，第二输出保护单元由Q16、Q17、Q18三个三极管组成，起到过载保护的作用。
进一步，所述模拟量输出单元包括：
D/A转换单元，采用型号为DAC101的D/A转换芯片，D/A转换芯片连接至单片机；
0～10V电压模拟量输出单元，连接至D/A转换芯片，用于将D/A转换后的压力信号或温度信号以0～10V电压信号进行模拟输出，且0～10V电压模拟量输出单元连接至单片机，由单片机控制0～10V电压模拟量输出单元是否工作；
4～20mA电流模拟量输出单元，连接至D/A转换芯片，用于将D/A转换后的压力信号或温度信号以4～20mA电流信号进行模拟输出，且4～20mA电流模拟量输出单元连接至单片机，由单片机控制4～20mA电流模拟量输出单元是否工作。
作为本发明的优选，所述主控单元外设置显示单元和外部控制单元；
所述显示单元包括至少三个七段数码显示管，用于显示单片机内 的压力值和温度值；
所述外部控制单元包括至少两个自复位按键，用于调整开关量输出单元为NPN输出模式或PNP输出模式的一种，用于调整模拟量输出单元的电压模拟量或电流模拟量输出范围。
一种压力温度计，包括上述压力温度处理电路和探头、探棒；
所述探棒焊接于探头上，探头内卡置温度处理PCB板，所述热敏电阻一端外填充导通导热体置于探棒内，热敏电阻另一端连接至温度处理PCB板；
所述探头上开设盲孔，盲孔内设置阻尼螺丝顶触压力陶瓷，所述压力陶瓷上下设置垫圈顶触至压力处理PCB板，且所述压力陶瓷电连接至压力处理PCB板。
进一步，所述温度处理PCB板305上设置温度信号处理单元；
所述压力处理PCB板上设置压力信号处理单元；
所述探头连接壳体，壳体内通过塑胶件卡置主控PCB板，所述温度处理PCB板和压力处理PCB板分别电连接至主控PCB板；所述主控PCB板上设置主控单元和外部控制单元、开关量输出单元、输出保护单元、D/A转换单元、模拟量输出单元。
进一步，所述探棒长度不小于20mm，探棒直径为3∽10mm，探棒厚度为0.3∽1.0mm。
本发明的有益效果在于：
本发明将压力和温度传感器集成为一个整体压力温度计，并通过电路设计，实现了对压力温度的同时检测，使其在工业应用时更加方便；同时本发明的压力温度处理电路设计合理，实现了NPN、PNP开关量输出，电压、电流模拟量输出，且搭载自复位按钮，通过编程控制NPN、PNP开关量输出和电压、电流模拟量输出量参数；本发明的探棒和探头结构设置合理，在结构上弥补了温度和压力的测量显示滞后和误差问题，同时使其具有更宽的测量范围，更有益于工业应用，易于推广。
附图说明
图1是本发明压力温度处理电路的电路模块原理图；
图2是本发明压力信号处理单元的电路原理图；
图3是本发明温度信号处理单元的电路原理图；
图4是本发明主空单元的电路原理图；
图5是本发明PNP输出单元和第一输出保护单元的电路原理图；
图6是本发明NPN输出单元和第二输出保护单元的电路原理图；
图7是本发明0～10V电压模拟量输出单元的电路原理图；
图8是本发明4～20mA电流模拟量输出单元的电路原理图；
图9是本发明显示驱动单元的电路原理图；
图10是本发明显示单元的电路原理图；
图11是本发明压力温度计的整体结构示意图；
图12是本发明图11的剖面图；
图13是本发明的整体结构爆炸图。
具体实施方式
下面将对本发明的技术方案进行清楚、完整地描述。
如图1所示，一种压力温度处理电路，包括：
压力温度测量单元，用于测量压力和温度信号；
压力温度处理单元，连接于压力温度测量单元，用于对压力温度测量单元测量的压力和温度信号进行处理；
主控单元，连接压力温度处理单元，用于读取和计算压力温度处理单元处理后的压力和温度信号。
进一步，所述压力温度测量单元包括：
压力测量单元，采用压力陶瓷J3，用于对压力信号的测量；
温度测量单元，采用热敏电阻，用于对温度信号的测量。
进一步，所述压力温度处理单元包括：
如图2所示，压力信号处理单元，采用型号为ZMD31050桥式传感器信号处理芯片，用于对压力陶瓷测量的压力信号进行A/D转换为压力信号值，所述压力陶瓷J3连接至ZMD桥式传感器信号处理芯片的VINN、VSS、VINP、VBR四个引脚处；
如图3所示，温度信号处理单元，采用U1A、U1B、U1D组成的三级运放电路，用于对热敏电阻测量的温度信号进行信号放大，所述热敏电阻接入三级运放电路中的Vpt-处。
作为本发明的优选，如图2所示，所述ZMD桥式传感器信号处理芯片外设置型号为LM73的内置温度传感芯片，LM73内置温度传感芯片连接至ZMD桥式传感器信号处理芯片的SDA、SCL两个引脚处，用于对ZMD桥式传感器信号处理芯片进行温度补偿。
作为本发明的优选，如图2所示，所述ZMD桥式传感器信号处理芯片外设置型号为LM73的内置温度传感芯片，LM73内置温度传感芯片连接至单片机的SDA、SCL两个引脚处，所述单片机使用LM73内置温度传感芯片检测到的温度对所述ZMD桥式传感器处理后的压力值进行温度补偿。
进一步，所述主控单元采用型号为PIC16F1518的单片机；
如图4所示，所述ZMD桥式传感器信号处理芯片将压力信号的A/D转换结果SDA、SCL两个引脚通过I 2C总线连接至单片机的RC3和RC4两个引脚，用于通过单片机读取A/D转换后的压力值；
如图4所示，所述三级运放电路将温度信号的放大结果TC端通过串口连接至单片机的23号引脚处，用于通过单片机内部A/D转换通道，将温度信号进行A/D转换为温度值。
进一步，所述主控单元外设置输出单元，所述输出单元包括开关量输出单元和模拟量输出单元；模拟量输出单元用于将A/D转换后的压力值和温度值以模拟量的形式输出；
开关量输出单元，包括：
PNP输出单元，如图5所示，通过Q9、Q11两个三极管连接至单片机的RC7和RB4引脚，用于将所述压力值和温度值开关量输出形式以PNP输出为OUT1；
NPN输出单元，如图6所示，通过Q15、Q16两个三极管连接至单片机的RC6和RB5引脚，用于将所述压力值和温度值以开关量的形式输出OUT2。
进一步，所述PNP输出单元外设置第一输出保护单元，第一输出保护单元由Q10、Q11、Q12三个三极管组成，起到过载保护的作用；在出现输出短路时，三极管Q12导通，进一步Q10导通，从而整个PNP输出单元通过三极管Q11导通接地。
进一步，所述PNP输出单元外设置第一输出保护单元，第一输出保护单元由Q10、Q11、Q12三个三极管组成，起到过载保护的作用；在出现输出短路时，三极管Q10导通，进一步Q11导通，从而使得RB4变为低电平，使得单片机停止输出，达到保护作用。
所述NPN输出单元外设置第二输出保护单元，第二输出保护单元由Q16、Q17、Q18三个三极管组成，起到过载保护的作用。
进一步，所述模拟量输出单元包括：
D/A转换单元，采用型号为DAC101的D/A转换芯片，D/A转换芯片连接至单片机的RA1、RA2、RA3引脚；
0～10V电压模拟量输出单元，如图7所示，连接至D/A转换芯片的DA引脚，用于将D/A转换后的压力信号或温度信号以0～10V电压信号进行模拟输出为OUT3，且0～10V电压模拟量输出单元连接至单片机的CONV引脚，由单片机控制0～10V电压模拟量输出单元是否工作；
4～20mA电流模拟量输出单元，如图8所示，连接至D/A转换芯片的DA引脚，用于将D/A转换后的压力信号或温度信号以4～20mA电流信号进行模拟输出为OUT4，且4～20mA电流模拟量输出单元连接至单片机CONI引脚，由单片机控制4～20mA电流模拟量输出单元是否工作，也即可以通过单片机编程控制CONV和CONI引脚，进一步选择0～10V电压模拟量输出模式或4～20mA电流模拟量输出模式。
作为本发明的优选，所述主控单元外设置显示单元和外部控制单元；
如图9和10所示，所述显示单元包括至少三个七段数码显示管dig1、dig2、dig3，用于显示单片机内的压力值和温度值；所述三个七段数码显示管dig1、dig2、dig3通过显示驱动单元连接至单片机 的RC1、RC2、RC3引脚，用以驱动显示。本发明还设置LED输出指示单元，包括OUT1指示灯和OUT2指示灯，其中OUT1指示灯表示开关量输出状态，当切换输出模式为开关量输出时，OUT1点亮；OUT2指示灯表示模拟量输出状态，当切换输出模式为模拟量输出时，OUT2点亮)。
所述外部控制单元包括至少两个自复位按键6，用于调整开关量输出单元为NPN输出模式或PNP输出模式的一种，用于调整模拟量输出单元的电压模拟量或电流模拟量输出范围，所述开关量输出单元还具有滞后功能、窗口功能和偏移校准功能。
如图11所示，一种压力温度计，包括上述压力温度处理电路和探头3、探棒316；
所述探棒316焊接于探头3上，探头3内卡置温度处理PCB板305，所述热敏电阻310一端外填充导通导热体置于探棒316内，热敏电阻另一端连接至温度处理PCB板305；
所述探头上开设盲孔312，盲孔312内设置阻尼螺丝315顶触压力陶瓷309，所述压力陶瓷309上下设置垫圈顶触至压力处理PCB板318，且所述压力陶瓷309电连接至压力处理PCB板318。
进一步，所述温度处理PCB板305上设置温度信号处理单元；
所述压力处理PCB板318上设置压力信号处理单元；
所述探头3连接壳体2，壳体2内通过塑胶件202设置主控PCB板201，所述温度处理PCB板305和压力处理PCB板318分别电连接至主控PCB板201；所述主控PCB板201上设置主控单元和外部控制单元、开关量输出单元、输出保护单元、D/A转换单元、模拟量输出单元。
进一步，所述探棒316长度不小于20mm，探棒316直径为3∽10mm，探棒316厚度为0.3∽1.0mm。在这个范围内的探棒，可以解决显示滞后问题，使显示数据同步，不用长时间等待才可以稳定，且本发明的探棒结构，使得有效的温度范围扩展至-40℃～150℃，这种测量范围的探头较传统应用于工业上的温度传感器具有更宽的测量范围，使其 更加应适应于工业应用。作为本发明的一种实施例，探头3螺纹采用G1螺纹，探棒直径允许范围为3-5mm，考虑生产组装，最终采用直径为5mm探棒；探棒厚度0.3-1.0mm，应抗压强度需要达到300bar以上，最终采用0.5mm厚度探棒，在探棒长度选择上，通过设定标准温度为-40℃(如表1所示)、0℃(如表2所示)、150℃(如表3所示)下，测试多个探棒长度下的测试温度结果，将探棒长度设置为至少27mm。
Figure PCTCN2018104965-appb-000001
表1
Figure PCTCN2018104965-appb-000002
Figure PCTCN2018104965-appb-000003
表2
Figure PCTCN2018104965-appb-000004
表3
所述壳体2还设置插接件205，用于外接开关量输出单元的开关量输出或模拟量输出单元的模拟量输出；
所述显示驱动单元和显示单元设置于显示电路PCB板106上，且显示电路PCB板106通过螺钉102固定于主控PCB板201上；壳体2上端设置上盖1，且上盖1和壳体2通过密封圈203和密封垫片204过盈配合固定，便于后续维修和维护。上盖1表面呈斜面状，上部设有一个“凸”型的视窗，下部设有2个按键101；同时，上盖1内部 还设有压合片105、显示罩104、硅胶垫片103，压合片105正面设有卡槽，反面设有螺柱，显示罩104穿过压合片105卡在卡槽内，硅胶垫片103放在显示罩103表面，主要起到防水的作用，压合片104、显示罩103、硅胶垫片103通过焊接固定在上盖1内。
设置连接件303，连接件303上端通过密封圈一301和密封垫片一302和壳体2下端过盈配合，连接件303下端通过密封圈二304和探头3过盈配合。
所述探头3外部设置2个对称的拧扳手卡槽，便于后续安装维护，探头3下端是外螺纹的，外螺纹顶部设置平垫圈三317；在其中一个拧扳手卡槽的中心位置处设有一个透气孔，透气孔上面黏贴一个透气膜313，透气压盖314从透气膜313上部安装，与透气孔过盈配合固定。透气孔的设计使得压力陶瓷和热敏电阻工作环境稳定，方便热交换
所述盲孔312的顶部和底部各设有一个台阶，顶部的台阶放置有绝缘垫片306，底部的台阶放置平垫圈二311，压力陶瓷309放置在平垫圈二311上，设置平垫圈一308放置于压力陶瓷309上，设置压圈307通过螺纹将平垫圈二311、压力陶瓷309、平垫圈一308螺纹拧紧、固定。阻尼螺丝穿过平垫圈二311受力于压力陶瓷309，使得压力得到缓冲，同时这种多个垫圈套接的结构解决了热胀冷缩以及压力检测单元受力不均等因素的影响，且压力检测单元可以进行-1bar∽0.1/0.25/0.5/1/2/5/10/20/50/100/200/250/400/600bar多个范围的检测，可根据压力陶瓷的型号和软件来进行范围选择，尤其是还可以将0.1/0.25/0.5ba这种微压的测量也包含在内。
本发明的实施步骤如下：
通过探头3上的外螺纹，将本发明的探头安装至所需测量的气体测量现场或液体测量现场管道，使得探棒316和盲孔312位于气体测量现场或液体测量现场内，且管道通过平垫圈三317和探头压合，保证了气密性。通过显示电路106即可读取当前温度值和压力值，通过插接件206即可引出温度值和压力值的输出。
具体的，可选择的按下两个自复位按键6，实现如下功能：
1)开关量输出的模式、上下限、步距、滞后功能和串口功能的选择。
2)模拟量输出的模式、起始点、阻尼的选择。
3)压力输出的单位换算、偏移量校准、清零偏移量校准、压力最大值记录。
4)温度输出的单位换算、偏移量校准、最大最小直记录。
5)显示刷新频率、数码管显示方向(数码管正反向显示当前温度和压力数据，方便现场观察和监控)、温度/压力显示切换。
表4为本发明的两个自复位按键6的功能菜单：
Figure PCTCN2018104965-appb-000005
Figure PCTCN2018104965-appb-000006
Figure PCTCN2018104965-appb-000007
表4
上述实施例仅例示性说明本发明的原理及其功效，而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下，对上述实施例进行修饰或改变。因此，举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变，仍应由本发明的权利要求所涵盖。

Claims (12)

  1. 一种压力温度处理电路，其特征在于，包括：
    压力温度测量单元，用于测量压力和温度信号；
    压力温度处理单元，连接于压力温度测量单元，用于对压力温度测量单元测量的压力和温度信号进行处理；
    主控单元，连接压力温度处理单元，用于读取和计算压力温度处理单元处理后的压力和温度信号。
  2. 根据权利要求1所述的一种压力温度处理电路，其特征在于，所述压力温度测量单元包括：
    压力测量单元，采用压力陶瓷，用于对压力信号的测量；
    温度测量单元，采用热敏电阻，用于对温度信号的测量。
  3. 根据权利要求2所述的一种压力温度处理电路，其特征在于，所述压力温度处理单元包括：
    压力信号处理单元，采用ZMD桥式传感器信号处理芯片，用于对压力陶瓷测量的压力信号进行A/D转换为压力信号值，所述压力陶瓷连接至ZMD桥式传感器信号处理芯片；
    温度信号处理单元，采用三级运放电路，用于对热敏电阻测量的温度信号进行信号放大，所述热敏电阻接入三级运放电路中。
  4. 根据根据权利要求3所述的一种压力温度处理电路，其特征在于，所述主控单元采用PIC单片机。
  5. 根据权利要求4所述的一种压力温度处理电路，其特征在于，所述ZMD桥式传感器信号处理芯片外设置型号为LM73的内置温度传感芯片，所述单片机使用内置温度传感芯片检测到的温度对所述ZMD桥式传感器处理后的压力值进行温度补偿。
    所述ZMD桥式传感器信号处理芯片将压力信号的A/D转换结果通过I 2C总线连接至单片机，用于通过单片机读取A/D转换后的压力值；
    所述三级运放电路将温度信号的放大结果连接至单片机，用于通过单片机内部A/D转换通道，将温度信号进行A/D转换为温度值。
  6. 根据权利要求5所述的一种压力温度处理电路，其特征在于， 所述主控单元外设置输出单元，所述输出单元包括开关量输出单元和模拟量输出单元；模拟量输出单元用于将A/D转换后的压力值和温度值以模拟量的形式输出；
    开关量输出单元，包括：
    PNP输出单元，通过Q9三极管连接至单片机，用于控制输出单元将所述压力值和温度值开关量输出形式以PNP输出；
    NPN输出单元，通过Q15三极管连接至单片机，用于控制输出单元将所述压力值和温度值开关量输出形式以NPN输出。
  7. 根据权利要求6所述的一种压力温度处理电路，其特征在于，
    所述PNP输出单元外设置第一输出保护单元，第一输出保护单元由Q10、Q11、Q12三个三极管组成，起到过载保护的作用；
    所述NPN输出单元外设置第二输出保护单元，第二输出保护单元由Q16、Q17、Q18三个三极管组成，起到过载保护的作用。
  8. 根据权利要求6所述的一种压力温度处理电路，其特征在于，所述模拟量输出单元包括：
    D/A转换单元，采用型号为DAC101的D/A转换芯片，且D/A转换芯片连接至单片机；
    0～10V电压模拟量输出单元，连接至D/A转换芯片，用于将D/A转换后的压力信号或温度信号以0～10V电压信号进行模拟输出，且0～10V电压模拟量输出单元连接至单片机，由单片机控制0～10V电压模拟量输出单元是否工作；
    4～20mA电流模拟量输出单元，连接至D/A转换芯片，用于将D/A转换后的压力信号或温度信号以4～20mA电流信号进行模拟输出，且4～20mA电流模拟量输出单元连接至单片机，由单片机控制4～20mA电流模拟量输出单元是否工作。
  9. 根据权利要求8所述的一种压力温度处理电路，其特征在于，所述主控单元外设置显示单元和外部控制单元；
    所述显示单元包括至少三个数码显示管，用于显示单片机内的压力值和温度值；
    所述外部控制单元包括至少两个自复位按键，用于调整开关量输出单元为NPN输出模式或PNP输出模式的一种，用于调整模拟量输出单元的电压模拟量或电流模拟量输出范围。
  10. 一种压力温度计，其特征在于，包括权利要求1～9任一项所述的压力温度处理电路和探头、探棒；
    所述探棒焊接于探头上，探头内卡置温度处理PCB板，所述热敏电阻一端外填充导通导热体置于探棒内，热敏电阻另一端连接至温度处理PCB板；
    所述探头上开设盲孔，盲孔内设置阻尼螺丝顶触压力陶瓷，所述压力陶瓷上下设置垫圈顶触至压力处理PCB板，且所述压力陶瓷电连接至压力处理PCB板。
  11. 根据权利要求10所述的一种压力温度计，其特征在于，
    所述温度处理PCB板上设置温度信号处理单元；
    所述压力处理PCB板上设置压力信号处理单元；
    所述探头连接壳体，壳体内设置主控PCB板，所述温度处理PCB板和压力处理PCB板分别电连接至主控PCB板。
  12. 根据权利要求11所述的一种压力温度计，其特征在于，所述根据权利要求1所述的一种压力温度传感器，其特征在于，所述探棒长度不小于20mm，探棒直径为3∽10mm，探棒厚度为0.3∽1.0mm。
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