WO2019079453A2

WO2019079453A2 - Shrinkable packaging materials with integrated transponder, and methods of making and using the same

Info

Publication number: WO2019079453A2
Application number: PCT/US2018/056291
Authority: WO
Inventors: Alex CHANDER
Original assignee: Thin Film Electronics Asa
Priority date: 2017-10-17
Filing date: 2018-10-17
Publication date: 2019-04-25
Also published as: WO2019079453A3

Abstract

A device including a heat shrink material, a transponder substrate thereon, and a transponder on the transponder substrate is disclosed. The transponder is configured to wirelessly communicate with a reader. Methods of manufacturing the device, placing a heat shrink material with an integrated transponder onto a container, and communicating information about the container, a product in the container, and/or a purchaser or user of the container are also disclosed.

Description

SHRINKABLE PACKAGING MATERIALS WITH INTEGRATED TRANSPONDER, AND METHODS OF MAKING AND USING THE SAME

RELATED APPLICATION S)

[0001] This application claims priority to U.S. Provisional Pat. Appl. No. 62/573,623, filed October 17, 2017, incorporated herein by reference.

FIELD OF THE INVENTION

[0002] The present invention generally relates to the field(s) of product security and authentication. More specifically, embodiments of the present invention pertain to shrinkable packaging materials with an integrated transponder (e.g., a wireless electronic tag and/or device) and an optional continuity sensor, and methods of manufacturing and using the same.

DISCUSSION OF THE BACKGROUND

[0003] Shrink-wrap packaging is used for bottles, beverages, or chemical bottles, for example. Shrink wrap packaging is a common and growing packaging field which offers complete product coverage, increasing the amount a product sticks out on the shelf, as well as offering more space for product, compliance, and marketing material.

[0004] Shrink bands typically cover the opening of a bottle/jar/cosmetic cylinder in order to provide tamper evidence. These are machine-applied at high speed and formed to the container by applying steam in an enclosed space.

[0005] Shrink sleeves cover the majority of the product (e.g., a bottle or jar), but usually not the opening. They can be applied automatically to most standing package types. The sleeve conforms to complex geometries to which labels are otherwise difficult to apply to.

[0006] International Pat. Appl. No. PCT/US 17/28135 (Atty. Docket No.

IDR4710WO, the relevant portions of which are incorporated herein by reference) and US Provisional Pat. Appl. No. 62/324,196 (Atty. Docket No. IDR4710-PR, the relevant portions of which are incorporated herein by reference) disclose shrink-wrap and an RFID/NFC tag/label on a bottle. In IDR4710, a label is applied to a bottle and shrink-wrap comes over it and secures it in place, optionally with an adhesive. Opening the bottle breaks a sense line on the label. Putting shrink-wrap onto a bottle as described in International Pat. Appl. No. PCT/US 17/28135 may require some modification to the application equipment. The application of shrink sleeves is the same or substantially the same, but in International Pat. Appl. No. PCT/US17/28135, the label is not integrated with the shrink sleeve. [0007] This "Discussion of the Background" section is provided for background information only. The statements in this "Discussion of the Background" are not an admission that the subject matter disclosed in this "Discussion of the Background" section constitutes prior art to the present disclosure, and no part of this "Discussion of the Background" section may be used as an admission that any part of this application, including this "Discussion of the Background" section, constitutes prior art to the present disclosure.

SUMMARY OF THE INVENTION

[0008] The present invention generally relates to the field(s) of product security and authentication. More specifically, embodiments of the present invention pertain to a label inserted into shrink-wrap during shrink-wrap packaging. The label may include a transponder (e.g., an RF, RFID, high frequency [HF] or ultrahigh frequency [UHF] transponder) incorporated into heat-shrink packaging material or shrink sleeve packaging.

[0009] Thus, in one aspect, the present invention relates to a device, comprising a heat shrink material, a transponder substrate on the heat shrink material, and a transponder on the transponder substrate. The transponder is configured to wirelessly communicate with a reader. In some embodiments, the device further comprises perforations in the heat shrink material. The perforations do not overlap with the transponder substrate in some cases, but in others, the perforations overlap with at least one notch in the transponder substrate.

[0010] In some embodiments, the device further comprises a tab in the heat shrink material. The tab may facilitate tearing of the heat shrink material.

[0011] In other or further embodiments, the transponder comprises (i) an antenna configured to receive a first wireless signal from a reader and/or transmit a second wireless signal to the reader and (ii) a receiver configured to demodulate the first wireless signal and/or a transmitter configured to modulate the second wireless signal. In addition, the transponder may further comprise an integrated circuit configured to process the first wireless signal and/or generate the second wireless signal. In such embodiments, the transponder may further comprise a sense line electrically connected to the integrated circuit. The sense line is generally configured to determine a continuity state of a container on which the device is placed. In embodiments including perforations in the heat shrink material, the perforations may intersect the sense line.

[0012] In some embodiments, the heat shrink material comprises first and second fold lines and first and second seams, configured to seal the heat shrink material to itself after folding the heat shrink material along the first and second fold lines. Alternatively or additionally, the heat shrink material may further comprise a plurality of registration lines, each of which is configured to define a location at which the heat shrink material is to be cut or severed prior to application onto a container. The registration lines may also define one or more print regions in which the transponder substrate is adhered or in which the heat shrink material may be printed.

[0013] Another aspect of the present invention relates to a method of manufacturing a device, comprising placing a transponder substrate on a heat shrink material, the transponder substrate having a transponder thereon; perforating the heat shrink material; folding the heat shrink material over the transponder and the transponder substrate; and sealing the heat shrink material to itself to secure the transponder and the transponder substrate on an inner surface of the heat shrink material. Typically, the transponder substrate is secured (e.g., adhered using a glue) to the heat shrink material during or after placing it on the heat shrink material.

[0014] In some embodiments, the heat shrink material is perforated before the transponder substrate is placed on the heat shrink material. In other embodiments, the transponder substrate is placed on the heat shrink material before the heat shrink material is perforated. In still other or further embodiments, the heat shrink material is perforated before the heat shrink material is folded over the transponder and the transponder substrate. Additionally or alternatively, the heat shrink material is folded over the transponder and the transponder substrate before the heat shrink material is perforated.

[0015] As with the present device, in some embodiments, the perforations do not overlap with the transponder substrate. In addition, the transponder substrate may comprise one or more notches therein, and the perforations may overlap with at least one of the notch(es). The method may further comprise forming a tab in the heat shrink material. As with the present device, the tab may facilitate tearing of the heat shrink material. Typically, the tab is formed at a same time as the perforations.

[0016] As with the present device, the transponder may comprise (i) an antenna configured to receive a first wireless signal from a reader and/or transmit a second wireless signal to the reader and (ii) a receiver configured to demodulate the first wireless signal and/or a transmitter configured to modulate the second wireless signal. In some examples, the transponder further comprises an integrated circuit configured to process the first wireless signal and/or generate the second wireless signal.

[0017] The method may further comprise forming a sense line on the transponder substrate. The sense line may be (i) electrically connected to the integrated circuit and/or (ii) configured to determine a continuity state of a container on which the device is placed. In some embodiments, the perforations may intersect the sense line.

[0018] In some embodiments, the heat shrink material may comprise first and second fold lines and/or first and second seams. In such embodiments, the heat shrink material may be folded along the first and second fold lines, and/or the first and second seams may be sealed to each other (e.g., after folding the heat shrink material).

[0019] The method may further comprise cutting or severing the heat shrink material along one of a plurality of registration lines, then applying the cut or severed heat shrink material onto a container. As with the present device, the registration lines may define one or more print regions in which the transponder substrate is placed. In such embodiments, the method may further comprise printing one or more graphics on the heat shrink material in the print region(s). In other or further embodiments, the method may further comprise heating the cut or severed heat shrink material on the container.

[0020] Yet another aspect of the present invention relates to a method of communicating information about a container and/or a product in the container, the container having a heat shrink material with an integrated transponder thereon or therein, comprising wirelessly broadcasting or transmitting a first signal from a reader to the transponder; and wirelessly receiving a second signal from the transponder. The transponder may be between the heat shrink material and the container. As with the present device, the transponder may comprise an antenna configured to receive the first signal from the reader and transmit the second signal to the reader. In such embodiments, the method of communicating information may further comprise demodulating the first signal with a receiver in the transponder, and modulating the second signal with a transmitter in the transponder. In various embodiments, the method of communicating information may further comprise (i) processing the first signal and generating the second signal using an integrated circuit in the transponder, and/or (ii) determining a continuity state of the container using a sense line electrically connected to the integrated circuit.

[0021] In some embodiments, the second signal may comprise information about the product in the container. The information about the product in the container may comprise an identification code (e.g., identifying the product), and optionally, an address (e.g., a network address or website) at which further product information can be found or from which further product information can be retrieved.

[0022] The present invention allows transponder applications with difficult package surfaces. The invention can work with standard inlays (e.g., the SpeedTap™ wireless transponders and mobile marketing tags manufactured by Thin Film Electronics ASA, Oslo, Norway) and other RF and RFID transponders (e.g., a SMARTTRAC™ UHF or HF tag) and other electronic labels. The present packaging materials with integrated transponders can include a desiccant, which is often included in packaging materials and equipment similar to labels and label applicators. The present invention also encompasses and can integrate any and/or all pressure-sensitive inserts. For example, a label applicator or feeding mechanism can be used to lay down any insert in the shrinkable packaging material (e.g., a shrink-sleeve) to create an aggregate shrink-sleeve or other shrink wrap that can be applied to a bottle. Pressure-sensitive labels use a pressure-sensitive adhesive, instead of a cut and stack application, where in some cases a dry powder is applied, followed by applying a liquid. In the present invention, a coating can be formed on the label or other insert, so that when the shrink-wrap forms around the bottle (e.g., when it is heated), the insert sticks to the bottle and to the shrink-wrap.

[0023] The present invention can also be used with one or more sense lines. With sense lines, typical applications use perforations (e.g., in the label or packaging) to assist in sense line breaking. In general, the perforations avoid the sense line (e.g., do not cut or expose the sense line). In the present invention, the sense lines can be increased (e.g., in number and/or in length), and the shrinkable materials can also be perforated. The present invention also relates to methods of manufacturing and using such shrinkable packaging materials with an integrated transponder.

[0024] The present invention advantageously allows (1) application of RF and/or

RFID transponders to package surfaces to any form of packaging which is not a box, including those for which transponder application may be difficult or challenging, and/or (2) integration of RF and/or RFID transponders into shrink sleeve packaging. The present invention also has the advantage that the label or other insert and the shrink wrap can be combined remotely (e.g., away from the bottling line), and then the same shrink-wrap equipment (e.g., on the bottling line) can be used to apply the compound shrink-wrap with a label/insert and integrated transponder. Consequently, the present invention does not require modification of bottling equipment to apply the label/insert and transponder. These and other advantages of the present invention will become readily apparent from the detailed description of various embodiments below.

BRIEF DESCRIPTION OF THE DRAWINGS

[0025] FIG. 1A shows an exemplary layout for a shrinkable material, and FIG. IB shows the shrinkable material applied to a capped bottle, with a label having an integrated transponder and one or more integrated sense lines thereon, and a tax label thereover).

[0026] FIG. 2A shows an exemplary layout for a shrink band, and FIG. 2B shows a broken shrink band on a bottle and a removed cap, with a label having an integrated transponder and one or more broken sense lines on the bottle.

[0027] FIG. 3A shows an exemplary application that includes an integrated shrink material (e.g., including a transponder, a square coiled antenna, and an optional IC on printed shrink material) in accordance with one or more embodiments of the present invention.

[0028] FIG. 3B shows the inner surface of an integrated shrink material similar to that of FIG. 3 A prior to application to a container (e.g., a bottle).

[0029] FIG. 3C shows a variation of a substrate, continuity sensing structure and circular antenna on a perforated shrinkable material, in accordance with one or more embodiments of the present invention.

[0030] FIGS. 4A-C show an exemplary layout in an exemplary process for an integrated shrink packaging solution, in accordance with embodiments of the present invention.

[0031] FIGS. 5A-C show another exemplary integrated shrink packaging solution similar to those in FIGS. 3A-4C, in accordance with one or more alternative embodiments of the present invention.

[0032] FIGS. 6A-C show yet another exemplary integrated shrink packaging solution, in accordance with further embodiments of the present invention.

[0033] FIG. 7 shows an exemplary integrated circuit for use in the present transponder.

[0034] FIG. 8 is a diagram of an exemplary shrink packaging process and/or flow.

DETAILED DESCRIPTION

[0035] Reference will now be made in detail to various embodiments of the invention, examples of which are illustrated in the accompanying drawings. While the invention will be described in conjunction with the following embodiments, it will be understood that the descriptions are not intended to limit the invention to these embodiments. On the contrary, the invention is intended to cover alternatives, modifications and equivalents that may be included within the spirit and scope of the invention. Furthermore, in the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be readily apparent to one skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures and components have not been described in detail so as not to unnecessarily obscure aspects of the present invention. Furthermore, it should be understood that the possible permutations and combinations described herein are not meant to limit the invention. Specifically, variations that are not inconsistent may be mixed and matched as desired.

[0036] Thus, the technical proposal(s) of embodiments of the present invention will be fully and clearly described in conjunction with the drawings in the following embodiments. It will be understood that the descriptions are not intended to limit the invention to these embodiments. Based on the described embodiments of the present invention, other embodiments can be obtained by one skilled in the art without creative contribution and are in the scope of legal protection given to the present invention.

[0037] Furthermore, all characteristics, measures or processes disclosed in this document, except characteristics and/or processes that are mutually exclusive, can be combined in any manner and in any combination possible. Any characteristic disclosed in the present specification, claims, Abstract and Figures can be replaced by other equivalent characteristics or characteristics with similar objectives, purposes and/or functions, unless specified otherwise. Each characteristic is generally only an embodiment of the invention disclosed herein.

[0038] The term "length" generally refers to the largest dimension of a given 3- dimensional structure or feature. The term "width" generally refers to the second largest dimension of a given 3-dimensional structure or feature. The term "thickness" generally refers to a smallest dimension of a given 3-dimensional structure or feature. The length and the width, or the width and the thickness, may be the same in some cases. A "major surface" refers to a surface defined by the two largest dimensions of a given structure or feature, which in the case of a structure or feature having a circular surface, may be defined by the radius of the circle.

[0039] In addition, for convenience and simplicity, the terms "part," "portion," and

"region" may be used interchangeably, but these terms are also generally given their art- recognized meanings. Also, unless indicated otherwise from the context of its use herein, the terms "known," "fixed," "given," "certain" and "predetermined" generally refer to a value, quantity, parameter, constraint, condition, state, process, procedure, method, practice, or combination thereof that is, in theory, variable, but is typically set in advance and not varied thereafter when in use.

Exemplary Shrinkable Packaging Materials with Integrated Transponders and Continuity Sensors and Methods of Making and Using the Same

[0040] The present invention relates at least in part to inserting a label or similar object (i.e., an insert) into shrink-wrap during shrink-wrap packaging. It has the advantage that the label, the transponder and the shrink wrap are combined away from the bottling line, but the same shrink-wrap equipment used in conventional bottling lines is used to apply the compound shrink-wrap (i.e., including the label and transponder). The invention does not require modification of bottling equipment to apply the label and transponder. Some standard

/ conventional and some modified manufacturing methods can be used in the present invention with standard shrink packaging materials to make shrink-packaged products. The application of the transponder-embedded shrink material uses standard application equipment or can be done by hand.

[0041] Transponders are applied to the flat and/or printed shrink substrate, before or after perforation. Alternatively, transponders are first applied to the flat and/or printed shrink substrate, before a tear tab or strip is applied or formed. When included, a sense line (e.g., as in OpenSense wireless communication tags commercially available from Thin Film Electronics ASA, Oslo, Norway) is broken by standard package opening actions. The transponder (e.g., an RF or RFID transponder) maintains normal functions before and after the package is opened.

[0042] The invention can work with a standard inlay, such as Thin Film's

SPEEDTAP™ tags and labels. Other RFID, HF and UHF transponders (e.g., a SMARTTRAC™ UHF or HF tag) and other label and inserts can be used. The invention does not require a particular transponder.

[0043] Multiple manufacturing solutions and methods can achieve the intended result. The feasibility, operability and practice of the invention has been demonstrated experimentally.

[0044] Other materials can be included in the compound shrink-wrap packaging as well. For example, a desiccant, which is often set in shrinkable packaging using equipment similar to a label applicator, can be included. A pressure-sensitive insert (any kind) is another example of a material that can be included in the compound shrink-wrap packaging. Pressure-sensitive inserts and labels may use a pressure-sensitive adhesive (instead of more typical cut-and-stack applications, where dry powder is applied and then a liquid added to the dry powder, but such cut-and-stack inserts can also be included in the present invention). Alternatively, a label applicator or feeding mechanism can be inserted or laid down in a shrink-sleeve or other shrinkable packaging material to create an aggregate shrink-sleeve or shrink wrap, which can be applied in the same way to a bottle as a regular shrink-sleeve or shrink wrap.

[0045] A sense line (electrically connected or electromagnetically coupled to a continuity sensor, in turn operably coupled or connected to the transponder and/or transponder IC) can also be included in the compound shrink-wrap packaging. The sense line(s) (e.g., as found in OpenSense™ wireless communication tags, commercially available from Thin Film Electronics ASA, Oslo, Norway) are broken using standard package-opening actions.

[0046] A coating can be formed on the label so that the label sticks or adheres to the shrink-wrap. This is in addition to any bond or other adhesion formed when the shrink-wrap is formed or placed around the bottle and is heated and/or placed under pressure. The coating may hold the label in place (e.g., during application of the shrinkable packaging material).

[0047] No solution such as the present invention exists in the market. Formation of compound shrink-wrap packaging uses some standard shrink packaging equipment and manufacturing methods (e.g., for standard products) and/or some modified shrink packaging equipment and methods. The transponder-embedded shrink material is applied (e.g., to a bottle or other packaging) using standard application equipment or by hand.

[0048] In one embodiment, transponders are applied to a flat, printed or unprinted shrink substrate before perforation (e.g., in the shrinkable material). In another embodiment, transponders are applied to the flat, printed or unprinted shrink substrate after perforation. In yet another embodiment, transponders are applied to the flat, printed or unprinted shrink substrate before or after a tear tab or strip is applied or formed (e.g., to or in the shrinkable material).

[0049] FIGS. 1A-B show an embodiment that uses a label 20 and, for example, a clear or colored flexible thermoplastic polymer shrink material 10 (e.g., a band or sleeve of polyvinyl chloride [PVC], which may also be tamper-evident) with a perforation 15 at the position of the cap 32 of a bottle 30 (e.g., so-called "T-Perf ' shrink wrap). Alternatively, the cap may be on ajar or tube. FIG. 1A shows an exemplary layout for the T-Perf shrink wrap 10, and FIG. IB shows the shrink wrap 10 applied to a capped bottle 30 (with a label 20 having an integrated transponder and one or more integrated sense lines thereon, and a tax label 40 thereover).

[0050] The method comprises two stages: first, the graphic label 20 is applied (e.g., to the shrink material 10), then the shrink material 10 is applied (e.g., to the package; in this case, the capped bottle 30). This solution can be applied to shrink bands or sleeves. The perforation 15 separates the removable portion of the label/shrink material 10 from the main body of the product or package (e.g., bottle 30). For example, a portion of the shrink band 10 is removed to gain access to the bottle cap 32. The cap 32 is removed, which breaks any sense line present under the extension portion 22 of the label across the cap-bottle interface 34. A portion of the shrink band remains (e.g., on the bottle) to support the breaking action. This embodiment is good for early engagement and manual processes, and can be applied to bands or sleeves. T-Perf shrink bands are standard, commercially available products.

[0051] FIGS. 2A-B show another embodiment the uses a label 60 and a shrink band

50 with heat-sensitive adhesive (HSA). FIG. 2A shows an exemplary layout for the shrink band 50, and FIG. 2B shows the broken shrink band 50' on a bottle 70 and a removed cap 72, with a label 60 having an integrated transponder and one or more (now broken) sense lines 65 on the bottle 70.

[0052] The method comprises two stages: first, the graphic label 60 is applied (e.g., to the shrink material 50), then the shrink material 50 is applied (e.g., to the package; in this case, the capped bottle 70). This solution can use shrink bands or sleeves. This embodiment is similar to the one described previously, except that: (i) the HSA may cause the shrink material to adhere to the package and label, (ii) the opening operation breaks the sense-line 65 and shrink material 50 together, and (iii) the sense-line 65 and upper shrink material (i.e., on the cap 72) is removed with the cap 72. The shrink material 50 may include two perforation lines 55a-b in parallel as shown in FIG. 2A. This embodiment is best for aggressive opening operations, or for partial twist operations without cap removal. This embodiment helps prevent movement of the label 60 during package opening. Shrink materials with HSA are standard, commercially available products.

[0053] There are different application options for these (and other) embodiments. For example, FIGS. 3A-C show an exemplary application option that includes an integrated shrink material 100, in which the process applies the wireless inlay 110 (e.g., including a transponder comprising a square coiled antenna 120 and an IC 130 on a flexible plastic [e.g., polyethylene terephthalate, or PET] substrate 140; see FIG. 3 A) to the shrink material 105 after printing (e.g., printing graphics on the shrink material 105). The graphics are visible as a mirror image through the shrink material 105. The shrink material 105 covers the entire inlay 110.

[0054] FIG. 3B shows a variation 150 of the integrated shrink material of FIG. 3A, including a part of an antenna 170 and an IC 180 on a clear PET substrate 190. The substrate 190 includes notches 195 to facilitate tearing the substrate 190 across a sense line 160 when the shrink material 155 is torn (e.g., when opening the container [not shown] on which the shrink material 155 is placed). The sense line, when broken or electrically disconnected, informs the IC 180 that the shrink material 155 is torn or tampered with, and the container is no longer is a factory-sealed state or condition.

[0055] FIG. 3C shows a layout of the integrated shrink material 150 of FIG. 3B. The sense line 160 and circular antenna 170 are formed (e.g., by printing and/or thin film techniques) on a substrate 190, placed on the shrinkable material 155 such that perforations 152 in the material 155 overlap with indentations 192 in the substrate. When the shrinkable material 155 is clear or transparent, the substrate 190 may comprise a label. The IC 180 (FIG. 3B) is mounted on the substrate 190 or attached to pads electrically connected to the sense line 160 and antenna 170 in a bonding area 182. The shrink material 155 is applied to the package using standard application methods. A perforation or pull tab may be used to break the sense line 160 within the integrated shrink material 150 before the package is opened. This application option is best for difficult package shapes and/or difficult label locations.

[0056] There are 4 conversion processes available for manufacturing integrated shrink labels for NFC and other wireless communications applications. One process, termed the "ST Solution," involves the least risk because it is a standard conversion process. Another process, the "Pre-Perforation Solution," involves making a conventional transponder, antenna and optional IC on a flexible substrate, then applying the substrate to a perforated shrinkable material. Alternatively, the transponder, antenna and optional IC may be formed directly on the shrinkable material. This process may have the least risk for integrated solutions with one or more sense lines and a continuity sensor, even though it is a non-standard conversion process.

[0057] Yet another process, termed the "Post-Perforation Solution," includes applying the transponder, antenna and optional IC to the shrinkable material first, then perforating the shrinkable material. This process may be most advantageous for perforating the shrinkable material, as it introduces potential weakness(es) into the shrinkable material at a relatively late stage. Care should be taken when choosing the location of the perforations when the integrated shrinkable material includes one or more sense lines and a continuity sensor, as the sense line(s) should not be cut while forming the perforations. Otherwise, this process is a standard conversion process.

[0058] A still further process, termed the "Tear Tab Solution," includes forming a tear tab in the shrinkable material before or after applying the transponder, antenna and optional IC to the shrinkable material. Examples of such tear tabs may be found in International Pat. Appl. No. PCT/US2017/28128, filed April 18, 2017 and entitled "Smart Label or Tag Having a Continuity Sensor on a Substrate Having a Preferential Tearing Direction and System Including the Same," the relevant portions of which are incorporated herein by reference. This process may be most advantageous overall, even though it is a non-standard conversion process.

[0059] The two processes, placing a "smart" label (with an integrated transponder, antenna, IC and optional sense line) on a bottle or other package and forming a shrink band or sleeve over the label, should define the interaction parameters of the two products (e.g., the smart label and the shrinkable packaging material) within known or slightly modified processes, rather than defining a new manufacturing process. For example, the process for placing a shrink capsule on a bottle (e.g., for wine) is very similar to the shrink packaging process. Extensions of this process include formation of an integrated shrink capsule (e.g., with transponder, antenna, IC and optional sense line[s] integrated into/onto the shrinkable material prior to application on the package), and spin-down capsule products. [0060] FIGS. 4A-C shows an example of the integrated ST solution, which is relatively easy to implement. For example, there is no process step that negatively interacts with the wireless inlay 200 (i.e., the transponder, including an antenna 210 and an IC [not shown] on a flexible substrate 220). A bonding location 230 for the IC is shown in FIGS. 4A-C. The inlay 200 also includes a pad 212 electrically connected to an outer end of the antenna 210, and a trace 240 that crosses under the antenna 210 and that electrically connects the pad 212 to another pad 232 that is electrically connected to a bonding structure in the bonding location 230. The trace 240 is separated and/or electrically isolated from the antenna 210 by a dielectric material (not shown).

[0061] FIG. 4 A shows repeating sections or units of continuous shrink band material

250 with the wireless inlay 200 thereon. Each inlay 200 is within a print region 252a-c. Fold lines 260-262, a lower seam 270, an upper seam 272, and a registration bar 280 are also shown. The print regions include an area between adjacent registration bars 280, from the lower fold line 260 to the upper seam 272.

[0062] FIG. 4B shows the continuous shrink band material 250' trimmed along its outer edges and folded over the inlay 200 along the fold lines 260 and 262, such that the upper seam 272 overlaps the lower seam 270 (or vice versa). FIG. 4C shows the continuous shrink band material 250' after perforation cutting or patterning, with 3 different perforation patterns (i.e., from top to bottom, double parallel perforations 254a-b across the shrink band material 250', a single perforation line 256 across the shrink band material 250', and a single perforation line 256 across the shrink band material 250' with a perforated tab or strip 258).

[0063] This solution can be used with shrink bands or shrink sleeves. The shrink material can be applied using conventional shrink-packaging equipment.

[0064] One concern with the ST solution may be process-generated ESD; another may be snags or jams during application of the integrated shrink material. ESD measurements can be taken during and/or after the conversion, and application lines and counter-measures can be applied.

[0065] FIGS. 5A-C show examples of the integrated pre-perforation method, which perforates the shrinkable material 300 before the inlay 310 is applied (compare the FIG. 5 A with FIG. 5B). Perforation cutting (including formation of a tab region 334) is usually done after seaming (see FIG. 9), so this capability may not be possible on all conversion lines. Perforation profiles may be optimized for registration tolerance of inlay placement to perforation location(s). The perforation profiles may also be optimized for overlap with and breaking of sense lines 320.

[0066] FIG. 5B shows perforation lines 330a-b and 332 crossing the sensing structure

(e.g., sense lines 320) at the location of the indentations 342a-b in the inlay substrate 340 after application of the inlay 310. FIG. 5C shows the continuous shrink band material 300' folded over the inlay 310 along the fold lines 350 and 352, such that the upper seam 362 overlaps the lower seam 360 (or vice versa). This solution can be applied to shrink bands or sleeves. ESD and other processing concerns should be the same as or similar to the ST solution.

[0067] FIGS. 6A-C shows examples of the integrated post-perforation solution, which generally follows a standard shrink packaging manufacturing process. Embodiments with one or more sense lines 420 may consider parameters such as width of the sense line 420, count and length of the perforations 430a-b, tolerances in placement of the inlay 410 and the perforations 430a-b and 432 (e.g., with indentations or notches 442), and ESD limits.

[0068] In FIG. 6A, the inlays 410 are placed and/or adhered to the continuous shrink material sheet 400. In FIG. 6B, perforations 430a-b are made in predetermined locations in the continuous shrink material sheet 400. Perforation profiles should take into consideration the registration tolerance of inlay placement to perforation location. In the example of FIGS. 6A-C, tabs are not formed in the shrink material sheet 400. FIG. 6C shows the shrink material sheet 400' folded over the inlays 410 along the fold lines 450 and 452, such that the upper seam 462 overlaps the lower seam 460 (or vice versa).

[0069] This solution can be applied to shrink bands or sleeves. ESD and other processing concerns should be the same as or similar to the ST solution and/or the integrated pre-perforation method. However, there may be decreased ESD protection through the sense structure, as the overlay will be cut (see FIG. 6C).

[0070] There are at least two applications that can use the present integrated shrink material plus label and wireless communication electronics. In one example, a standard T- Perf shrink material is used. Tear profile parameters of the label, shrink material, and the substrate for the electronics (e.g., the transponder, IC and/or sense line) are defined. Perforations in both the shrink material and the label (including any additional substrate for the sense line, if present) must be designed and laid out to work together (e.g., placed so as not to expose or cut any sense lines that may be present, aligned [e.g., in parallel or superposition] to facilitate clean tearing of the integrated / composite shrink wrap, etc.) on different package openings. Examples have been reduced to practice.

[0071] Making an integrated T-Perf shrink material with transponder includes two steps. First, the graphic label (after printing, with a transponder, antenna, and optional IC and/or continuity sensor thereon) is applied to the shrink material, then the shrink material is applied to the package (e.g., a bottle, jar, tube, etc.). In various embodiments, the shrink material and the label can be individually sourced and produced using standard conversion operations. This solution can be applied to shrink bands or shrink sleeves.

[0072] Another application includes use of HSA shrink material. The tear profile parameters of the label, shrink material, and any substrate for the electronics is defined as for the standard T-Perf shrink material. This has been demonstrated experimentally. Making an integrated HSA shrink material with transponder also includes two steps. First, the graphic label is applied to the shrink material, then the shrink material is applied to the package. As for the T-Perf shrink material, the shrink material and the label can be individually sourced and produced using standard conversion operations. This solution can be applied to shrink bands or shrink sleeves.

An Exemplary Integrated Circuit for the Wireless Communication Device

[0073] FIG. 7 shows an exemplary integrated circuit 500 for use in the present wireless communication device. The exemplary integrated circuit (IC) 500 for use with the present "smart label" includes one or more sensors 510, a threshold comparator 520 receiving information (e.g., a signal) from the sensor(s) 510, a pulse driver 540 receiving an output of the threshold comparator 520, a memory 560 storing sensor data from the pulse driver 540, one or more bit lines (BL) 572 for reading data from the memory 560, one or more sense amplifiers (SA) 574 for converting the signal(s) on the bit line(s) to digital signals, one or more latches 576 for temporarily storing data from the sense amplifier(s), and a transmitter (e.g., modulator) 590 configured to output data (including an identification code) from the device. The exemplary IC 500 in FIG. 7 also contains a clock 550 configured to provide a timing signal (e.g., CLK) that controls the timing of certain operations in the IC 500 and a memory timing control block or circuit 570 that controls the timing of memory read operations. The modulator 590 also receives the timing signal (CLK) from the clock circuit or a slowed-down or sped-up variation thereof. The exemplary IC 500 also includes a power supply block or circuit 580 that provides a direct current (e.g., VCC) to various circuits and/or circuit blocks in the IC. The memory 560 may also contain identification code. The portion of the memory 560 containing identification code may be printed. The IC 500 may further contain a receiver (e.g., a demodulator), one or more rectifiers (e.g., a rectifying diode, one or more half-bridge or full-bridge rectifiers, etc.), one or more tuning or storage capacitors, etc. Terminals in the modulator and the power supply are connected to ends of the antenna (e.g., at Coill and Coil2).

[0074] The memory in an NFC or RF identification device may contain a fixed number of bits. In some implementations, NFC tags may contain 128 or 256 bits. Some bits are allocated to overhead (non-payload) data for format identification and data integrity (CRC) checking. The payload of the device (e.g., the NFC or RF tag) consumes the remainder of the bits. For example, the payload can be up to 96 bits in the case of the 128-bit NFC tag and up to 224 bits in the case of the 256-bit NFC tag.

[0075] The payload of the NFC tag can be allocated to variable amounts of fixed

ROM bits (which are generally - but not always - used as a unique identification number). When print methods are used in manufacturing the NFC tag, the ROM bits are permanently encoded and cannot be electrically modified. Any payload bits that are not allocated as fixed ROM bits can be allocated as dynamic sensor bits (e.g., for the continuity sensor to which the sense lines are connected). These sensor bits can change values, based on a sensed input. Different splits or allocations between ROM and sensor bits are indicated by data format bits that are part of the non-payload or Overhead' bits, generally in the first 16 bits of the NFC tag memory.

[0076] One example of how continuity sensing may be implemented in the present invention involves a sensor 510 that detects when a sense line (e.g., sense line 160 in FIGS. 3B-C, sense line 320 in FIGS. 5B-C, or sense line 420 in FIGS. 6A-C) is broken. Upon such an event, one or more sensor bits in the memory 560 change state to reflect the broken or cut sense line. This indicates to the reader (e.g., an NFC smartphone, etc.) that the protected container has been opened. The ROM ID bits do not change, but any data integrity bits (e.g., for CRC) may be updated to reflect the state of the sensor bits.

[0077] Continuity sensing generally refers to a capability and/or function that senses or determines whether a container has been tampered with or opened on the one hand, or remains in a closed state (e.g., its factory-sealed condition) on the other hand. In one embodiment, continuity sensing is implemented using at least one sense line. The present communication device may be thought of as having two parts: a first part that includes the IC and the antenna (or display), and a second part that includes the sense line(s). The part of the wireless communication device that includes the IC and antenna or display is on a first part of the protected container. The part of the communication device that includes the sense line(s) may be on the same part of the container as the integrated circuit and the antenna or display, or may be at least partially on a second part of the protected container and/or a sealing device or mechanism such as a cap or lid that may move relative to the container (e.g., a bottle, jap or tray) upon opening. The tab or other mechanism configured to enable tearing of the substrates across the sense line may be over an interface between the two parts of the container. Pulling the tab or other mechanism along or across the interface should break the sense line(s).

[0078] In addition to a primary sense line, the present wireless communication device may include one or more redundant sense lines. The redundant sense line(s) can be used in an "AND"-type function with the primary sense line(s) (e.g., the IC and sensor sense that the bottle is opened only when all of the primary and redundant sense lines are broken), or in an "OR"-type function with the sense line(s) (e.g., the IC and sensor sense that the container is opened or has been tampered with when any of the primary and redundant sense lines are broken). Alternatively, the sense line and redundant sense lines can provide one or more "partially-opened" continuity states when one or more of the primary and redundant sense lines are broken and one or more of the primary and redundant sense lines are not broken. One skilled in the art can easily derive logic and applications for such functionality and/or capability.

[0079] Of course, the IC 500 in the present device may include one or more other sensors in addition to the continuity sensor(s). For example, the IC 500 can further include one or more temperature sensors, humidity sensors, electromagnetic field sensors, current / voltage / power sensors, light sensors, and/or chemical sensors (e.g., for oxygen, carbon monoxide, carbon dioxide, nitrogen oxides, sulfur dioxide and/or tri oxide, ozone, one or more toxins, etc.). The present IC may also include one or more time sensors (e.g., configured to count or determine elapsed time), which may include the clock circuit (which can be a basis for a real-time clock) and one or more counters, dividers, etc., as is known in the art. The leads from any external sensing mechanism should be connected to the IC at terminals separate from those for the antenna and the continuity sensor. Such sensors should be on the same part of the substrate as the antenna and the IC.

An Exemplary Shrink Packaging Integration Method

[0080] FIG. 8 is an overview / diagram of an exemplary shrink packaging process and/or flow 600. The flow 600 shown in FIG. 8 is modified as described herein to make and use the present shrink packaging with an integrated transponder, antenna, IC, sense line, etc. The activities and manufacturing process in the modified flow 600 will be the same or substantially the same for shrink sleeves and shrink bands.

[0081] For example, the method 600 starts by preparing the shrink material and inlays at 610. For example, the shrink material and inlay substrates may be conventionally primed (e.g., coated with a primer), and an adhesive may be conventionally applied to a side or major surface of the inlays (i.e., the transponder and substrate). In one embodiment, the shrink material may be perforated at this time (e.g., prior to placement of the inlay on the shrink material). At 620, the inlays may be placed in predetermined locations on the primed shrink material (e.g., using pick-and-place or smart modular technology [SMT] equipment), and the primed shrink material and placed inlays are prepressed (e.g., to adhere the inlays to the shrink material), for example using a pressing station positioned between an unwinding roll (e.g., containing the primed shrink material) and a winding roll (e.g., configured to take up the pressed shrink material and inlays).

[0082] At 622, if the shrink material has been perforated, the method may continue at

630. However, if the shrink material has not been perforated at 622, and if perforations are not desired at this step (i.e., at 622-624), then the method may continue at 630. If the shrink material has not been perforated at 622, but perforations are desired at this step (i.e., at 624), then the shrink material is perforated at 626, as described herein.

[0083] At 630, graphics are printed on the shrink material and/or inlay. When the inlay functions as a label, the graphics are printed on at least the inlay. The graphics may be printed on the shrink material and/or inlay by roll-to-roll printing (e.g., gravure or flexographic printing). Thereafter, a conventional varnish may be conventionally applied to the shrink material. The varnish may be applied to the shrink material by roll-to-roll processing.

[0084] At 640, the shrink material is slit (e.g., using a conventional shrink material slitter). The slitter trims the edges of the shrink material, usually to within a certain or predetermined level of uniformity (e.g., such that the width of the shrink material does not vary by more than, e.g., 1-5%).

[0085] At 650, the shrink material may be folded along the fold lines as described herein and sealed along the seams as described herein, thereby sealing the inlay on the interior surface of the shrink material. The shrink material is folded conventionally and sealed, e.g., by roll-to-roll processing.

[0086] At 652, if the shrink material has been perforated, the method may continue at

660. However, if the shrink material has not been perforated at 652, then the shrink material is perforated at 654, as described herein.

[0087] At 660, the shrink material with the inlay along the interior surface is cut to length. For example, the shrink material may be cut from a roll along the registration lines shown in FIGS. 4A-6C using a knife, another blade, or an automated cutting instrument.

[0088] At 670, the shrink material is conventionally applied to the container (e.g., a bottle), and at 680, heat is conventionally applied to the shrink material to cause it to contract and form a tight seal around the container. For example, when the container is a bottle having a body, shoulder and neck and a sealing mechanism such as a cap or a cork, the shrink material is slid over the sealing mechanism and the neck of the bottle, and heat-shrunk to fit the bottle, such that the inlay is on or over a predetermined part of the bottle (but not over the interface between the neck of the bottle and the sealing mechanism), and any sense line(s) on the inlay substrate are over the interface between the neck of the bottle and the sealing mechanism. Alternatively, when the container is a jar having a body and a sealing mechanism such as a cap, the shrink material is slid over the sealing mechanism and the adjacent part of the jar and heat-shrunk to fit the jar and the sealing mechanism, such that the inlay is on or over a predetermined part of the jar and any sense line(s) on the inlay substrate are over the interface between the body of the jar and the sealing mechanism.

[0089] At 690, the container with the heat-shrunk shrink material and inlay therein is conventionally packaged into a shipping container and shipped to a destination. When unpacked, the transponder on the inlay can be conventionally read (e.g., using an RF or NFC reader such as a smart phone or tablet computer).

[0090] There are additional shrink label options available, but shrink sleeves and shrink bands appear to be advantageous products for commercial development. After standardizing the modified process 600, it can be extended to other shrink packaging product types.

[0091] The foregoing descriptions of specific embodiments of the present invention have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the invention to the precise forms disclosed, and obviously many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, to thereby enable others skilled in the art to best utilize the invention and various embodiments with various modifications as are suited to the particular use contemplated.

Claims

1. A device, comprising:

a) heat shrink material;

b) a transponder substrate on the heat shrink material; and

c) a transponder on the transponder substrate, wherein the transponder is configured to wirelessly communicate with a reader.

2. The device of claim 1, further comprising perforations in the heat shrink material.

3. The device of claim 2, wherein the perforations do not overlap with the transponder substrate.

4. The device of claim 2, wherein the transponder substrate comprises one or more notches therein, and the perforations overlap with at least one of the one or more notches.

5. The device of claim 1 or 2, further comprising a tab in the heat shrink material.

6. The device of claim 5, wherein the tab facilitates tearing of the heat shrink material.

7. The device of claim 1, wherein the transponder comprises (i) an antenna configured to receive a first wireless signal from a reader and/or transmit a second wireless signal to the reader and (ii) a receiver configured to demodulate the first wireless signal and/or a transmitter configured to modulate the second wireless signal.

8. The device of claim 7, wherein the transponder further comprises an integrated circuit configured to process the first wireless signal and/or generate the second wireless signal.

9. The device of claim 8, wherein the transponder further comprises a sense line electrically connected to the integrated circuit, and the sense line is configured to determine a continuity state of a container on which the device is placed.

10. The device of claim 9, further comprising perforations in the heat shrink material that intersect the sense line.

11. The device of claim 1, 2, 5 or 7, wherein the heat shrink material comprises first and second fold lines and first and second seams, configured to seal the heat shrink material to itself after folding the heat shrink material along the first and second fold lines.

12. The device of claim 11, wherein the heat shrink material further comprises a plurality of registration lines, each of which is configured to define a location at which the heat shrink material is to be cut or severed prior to application onto a container.

13. The device of claim 11, wherein the plurality of registration lines define one or more print regions in which the transponder substrate is adhered or the heat shrink material may be printed.

14. A method of manufacturing a device, comprising:

a) placing a transponder substrate on a heat shrink material, the transponder substrate having a transponder thereon;

b) perforating the heat shrink material;

c) folding the heat shrink material over the transponder and the transponder substrate; and

d) sealing the heat shrink material to itself to secure the transponder and the transponder substrate on an inner surface of the heat shrink material.

15. The method of claim 14, wherein the heat shrink material is perforated before the transponder substrate is placed on the heat shrink material.

16. The method of claim 14, wherein the transponder substrate is placed on the heat shrink material before the heat shrink material is perforated.

17. The method of claim 14, 15 or 16, wherein the heat shrink material is perforated before the heat shrink material is folded over the transponder and the transponder substrate.

18. The method of claim 14 or 16, wherein the heat shrink material is folded over the transponder and the transponder substrate before the heat shrink material is perforated.

19. The method of claim 14, 15 or 16, wherein the perforations do not overlap with the transponder substrate.

20. The method of claim 14, 15 or 16, wherein the transponder substrate comprises one or more notches therein, and the perforations overlap with at least one of the one or more notches.

21. The method of claim 14, 15 or 16, further comprising forming a tab in the heat shrink material.

22. The method of claim 21, wherein the tab facilitates tearing of the heat shrink material.

23. The method of claim 21, wherein the tab is formed at a same time as the perforations.

24. The method of claim 14, 15 or 16, wherein the transponder comprises (i) an antenna configured to receive a first wireless signal from a reader and/or transmit a second wireless signal to the reader and (ii) a receiver configured to demodulate the first wireless signal and/or a transmitter configured to modulate the second wireless signal.

25. The method of claim 24, wherein the transponder further comprises an integrated circuit configured to process the first wireless signal and/or generate the second wireless signal.

26. The method of claim 25, further comprising forming a sense line on the transponder substrate, wherein the sense line is electrically connected to the integrated circuit and configured to determine a continuity state of a container on which the device is placed.

27. The method of claim 26, wherein the perforations intersect the sense line.

28. The method of claim 14, 15, or 16, wherein the heat shrink material comprises first and second fold lines and first and second seams, the heat shrink material is folded along the first and second fold lines, and the first and second seams are sealed to each other after folding the heat shrink material.

29. The method of claim 14, 15, or 16, wherein the heat shrink material further comprises a plurality of registration lines, and the method further comprises cutting or severing the heat shrink material along one of the plurality of registration lines, then applying the cut or severed heat shrink material onto a container.

30. The method of claim 29, wherein the plurality of registration lines define one or more print regions in which the transponder substrate is placed.

31. The method of claim 30, further comprising printing one or more graphics on the heat shrink material in the one or more print regions.

32. The method of claim 29, further comprising heating the cut or severed heat shrink material on the container.

33. A method of communicating information about a container and/or a product in the container, the container having a heat shrink material with an integrated transponder thereon or therein, comprising:

a) wirelessly broadcasting or transmitting a first signal from a reader to the transponder; and b) wirelessly receiving a second signal from the transponder.

34. The method of claim 33, wherein the transponder is between the heat shrink material and the container.

35. The method of claim 33, wherein the transponder comprises an antenna configured to receive the first signal from the reader and transmit the second signal to the reader, and the method further comprises demodulating the first signal with a receiver in the transponder, and modulating the second signal with a transmitter in the transponder.

36. The method of claim 35, further comprising processing the first signal and generating the second signal using an integrated circuit in the transponder.

37. The method of claim 36, further comprising determining a continuity state of the container using a sense line electrically connected to the integrated circuit.

38. The method of claim 37, wherein the heat shrink material further comprises perforations that intersect the sense line.

39. The method of claim 33, wherein the second signal comprises the information about the product in the container.

40. The method of claim 39, wherein the information about the product in the container comprises an identification code.