WO2019071375A1

WO2019071375A1 - Surface polishing jig for electronic product housing, and polishing process

Info

Publication number: WO2019071375A1
Application number: PCT/CN2017/105339
Authority: WO
Inventors: 彭后绵
Original assignee: 深圳传音制造有限公司
Priority date: 2017-10-09
Filing date: 2017-10-09
Publication date: 2019-04-18

Abstract

A surface polishing jig for an electronic product housing, and a polishing process. The surface polishing jig for an electronic product housing comprises: a profiling polishing head (10) and a rotating shaft (20). A vertical cross section of the profiling polishing head (10) has an outer contour matching the shape of an outer contour of a vertical cross section of an outer surface of a workpiece (100) to be polished. The rotating shaft (20) is connected to an output shaft of a rotation drive device, so as to drive the profiling polishing head (10) to rotate. An abrasive layer (30) adheres to and covers an outer surface of the profiling polishing head (10). The present invention achieves superior polishing of a mold parting line of an electronic product housing, and does not leave any noticeable grinding traces after grinding, such that the appearance of the housing is unaffected.

Description

Polishing fixture and polishing process for electronic product shell surface

Technical field

The embodiment of the invention relates to the technical field of product post-processing, in particular to a surface grinding tool and a grinding process for an electronic product casing.

Background technique

After the electronic product shell is molded by the mold, the mold parting line will be left on the appearance surface. The so-called mold parting line is formed by splicing most of the molds used for pouring, and the position of the joint is impossible. To absolute smoothness, there will be small gaps, and when the perfused fitting is produced, there will be a small edge protrusion, that is, a parting line. In the molding process of the electronic product casing, it is necessary to use a post-processing process, such as a grinding process to remove the mold parting line, to ensure that the appearance requirements are met.

1 is a partial structural view of a polished member; FIG. 2 is a schematic structural view of a prior art grinding jig; and FIG. 2 shows a cylindrical shape of a sanding head 10a of a grinding jig used in the prior art finishing process. The housing of the electronic product (for example, FIG. 1) has various shapes, and the positions of the mold parting lines L1 and L2 are also various. Therefore, it is impossible to ensure that the parts of the polishing jig are applied to the polished design surface by the uniform grinding jig. The strength is the same, so after the existing process is polished, it will leave obvious traces of grinding. After spraying, electroplating, etc., the traces are more obvious.

Summary of the invention

In view of the deficiencies of the prior art, the present invention provides a surface grinding tool and a grinding process for an electronic product casing, which can better polish the mold parting line of the electronic product casing, and the polishing marks after grinding are not obvious. Does not affect the appearance of the electronics housing.

An aspect of the present invention provides an electronic product housing surface grinding jig, comprising: a contouring sanding head, and a rotating shaft, the longitudinal cross-sectional outer contour of the contouring sanding head and the outer surface of the workpiece to be polished The cross-sectional outer contours are matched for coupling to an output shaft of the rotary drive to drive the contoured sanding head to rotate, the outer surface of the contouring sanding head being covered with an abrasive layer.

In some embodiments, further, the abrasive layer is adhered to an outer surface of the contouring sanding head.

In some embodiments, further, the abrasive layer is sandpaper.

In certain embodiments, preferably, the sandpaper is 1000# sandpaper.

In certain embodiments, further comprising a polishing layer for securing to an outer surface of the abrasive layer.

In some embodiments, further, the polishing layer is a scouring pad.

Another aspect of the present invention also provides a surface grinding process for an electronic product housing, comprising the steps of:

In the first step, according to the shape of the outer surface of the polished member, a profiled grinding head having a longitudinal section outer contour matching the outer contour longitudinal profile shape of the outer surface to be polished on the sanded member is prepared;

In a second step, the abrasive layer is adhered to the outer surface of the contouring sanding head, and the rotary driving device is driven to drive the polishing head to rotate the sanding member to be polished once until the mold clamping line of the sanding portion of the sanding member disappears. ;

In the third step, the rotary drive is stopped.

In some embodiments, further, after the third step, further comprising:

a fourth step of coating the outer surface of the polishing layer with a scouring pad;

a fifth step of restarting the rotary driving device to drive the contouring polishing head to rotate;

In the sixth step, the rotating profile grinding head is close to the polished part, so that the scouring pad on the profile grinding head is in contact with the sanding part of the polished part, and the sanding part of the polished part is polished to be polished and removed. A polishing mark of the abrasive layer remaining on the polished part.

In some embodiments, a fourth step of coating the scouring pad on the outer surface of the polishing layer comprises:

The scouring pad is fixedly bound to the outer surface of the polishing layer by a strap; or the scouring pad is adhered to the outer surface of the polishing layer by an adhesive.

In some embodiments, further, the abrasive layer is sandpaper.

In certain embodiments, preferably, the sandpaper is 1000# sandpaper.

The surface of the electronic product casing of the present invention is polished and the grinding process is performed by matching the longitudinally contoured outer surface of the sanding head with the longitudinally contoured outer surface of the electronic product being polished, and covering the outer surface of the sanding head The abrasive layer is used to polish the polished parts, and the polishing fixture is used to hit the polished parts. When grinding, the polished parts can be better fitted, so that the mold parting line of the workpiece can be well polished, and the polishing marks after polishing are not obvious, and the appearance of the electronic product is not affected.

DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are some embodiments of the present invention. Other drawings may also be obtained from those of ordinary skill in the art in view of the drawings.

Figure 1 is a partial structural view of a polished member;

2 is a schematic structural view of a grinding fixture in the prior art;

3 is a partial structural schematic view of a polished member according to an embodiment of the present invention;

Figure 4 is a schematic view showing the structure of the sharpening jig for polishing the polished member shown in Figure 3;

Figure 5 is a partial structural view of a polished member according to another embodiment of the present invention;

Figure 6 is a schematic view showing the structure of the sharpening jig for polishing the polished member shown in Figure 5;

7 is a schematic structural view of a sharpening jig having a polishing layer according to an embodiment of the present invention;

8 is a flow chart showing a surface grinding process of an electronic product casing according to an embodiment of the present invention;

9 is a flow chart showing a surface grinding process of an electronic product casing according to another embodiment of the present invention.

Reference mark:

10-profiling grinding head;

20-rotating shaft;

30-grinding layer;

40-polished layer;

100-polished piece;

11- Polish the surface.

The additional aspects and advantages of the invention will be set forth in part in the description which follows.

Detailed ways

The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the accompanying drawings, in which the same or similar reference numerals are used to refer to the same or similar elements or have the same or similar functions. element. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.

In the description of the present invention, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like means the specific features described in connection with the embodiment or example. A structure, material or feature is included in at least one embodiment or example of the invention.

In the present specification, the schematic representation of the above terms is not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

In addition, various embodiments or examples described in the specification and features of various embodiments or examples may be combined and combined without departing from the scope of the invention.

Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The features of the embodiments and examples described below can be combined with each other without conflict.

3 is a partial structural view of a sharpened member according to an embodiment of the present invention; FIG. 4 is a schematic structural view of a sharpening jig for polishing the polished member shown in FIG. 3; and FIG. 5 is another embodiment of the present invention; FIG. 6 is a schematic structural view of a polishing fixture for polishing the polished member shown in FIG. 5; FIG. 7 is a polishing diagram with a polishing layer according to an embodiment of the present invention; Schematic diagram of the fixture.

Referring to FIG. 3 to FIG. 7 , the embodiment provides a surface grinding tool for an electronic product housing, comprising: a contouring sanding head 10 , and a rotating shaft 20 , the longitudinal section of the contouring sanding head 10 ( eg The cross-section formed in the axial direction of the rotating shaft 20 in FIGS. 4 and 6 is matched with the outer contour longitudinal cross-sectional shape of the sharpened member 100 to be polished, and the rotating shaft 20 is used for rotation. An output shaft (not shown) of the drive unit is coupled to drive the contoured sanding head 10 to rotate, the outer surface of the contouring sanding head 10 being covered with an abrasive layer 30.

It should be noted that the electronic product casing targeted by the embodiment may be a casing of an electronic product such as a mobile phone, a computer, or an electronic book.

Specifically, the rotating shaft 20 of the grinding fixture in the embodiment can be connected to the output shaft of the driving device such as a motor, and the rotating shaft 20 of the grinding fixture is rotated by the rotation of the output shaft of the driving device, thereby driving the contour polishing. The head 10 is rotated and the rotating contoured sanding head 10 is parted with the mold of the workpiece 100 to be polished.

Wherein, the longitudinal section outer contour of the contouring sanding head 10 matches the outer contour longitudinal section outer contour shape of the sanding member 100 to be polished, it should be understood that if the upper side surface of the sanding member 100 has a mold division The mold clamping line, and the upper side surface is the outer surface to be polished by the sanding member 100. Correspondingly, the longitudinal cross-sectional outer contour of the sanding surface 11 of the sanding head 10 is at least perpendicular to the upper side surface of the sanded member 100. The profile of the section matches. If the middle side surface of the sanding member 100 has a mold parting line, and the middle side surface is the outer surface to be polished by the sanding member 100, correspondingly, the sharpening surface 11 of the sanding head 10 has at least a longitudinal section outer contour. Matching the longitudinal section profile of the middle side surface of the workpiece 100.

Specifically, as shown in FIG. 3, the upper side surface of the workpiece 100 has a mold parting line L, and the upper side surface of the workpiece 100 is a convex curved surface, correspondingly, as shown in FIG. It is to be noted that the sanding surface 11 of the contouring sanding head 10 should also include at least a concave curved surface matching the convex upper side surface, and the position of the mold parting line L of the sanded workpiece 100 is located at the polished part. The upper side position of the side surface of 100, so that the longitudinal section outer contour of the contouring sanding head 10 matches at least the upper surface of the side surface of the workpiece 100, and the longitudinal section outer contour of the contouring sanding head 10 can be attached to the workpiece 100. The surface portion that does not need to be polished is formed with a certain gap, or is completely matched and matched, and is not limited in this embodiment. Of course, the longitudinal profile of the entire profiled sanding head 10 can also be matched to the longitudinal profile of the entire side surface of the workpiece 100.

For example, as shown in FIG. 5, the middle side surface of the workpiece 100 has a mold parting line L, and the middle side surface of the workpiece 100 is a convex curved surface, correspondingly, as shown in FIG. It should be noted that the sanding surface 11 of the contouring sanding head 10 should also include at least a concave curved surface matching the convex central side surface, and the position of the mold parting line of the sanded workpiece 100 is located at the polished member 100. The lower side position of the side surface, so that the longitudinal section outer contour of the contouring sanding head 10 matches at least the middle of the side surface of the sanded member 100, and the longitudinal section outer contour of the contouring sanding head 10 may not be on the polished workpiece 100. The surface portion to be polished is formed with a certain gap, or is completely matched and matched, and is not limited in this embodiment. Of course, the longitudinal profile of the entire profiled sanding head 10 can also be matched to the longitudinal profile of the entire side surface of the workpiece 100.

It should be noted that, in the grinding process, specifically, the polishing layer 30 is in contact with the polished member 100, and the polishing layer 30 is attached to cover the outer surface of the contouring polishing head 10, and the polished member 100 is polished by the polishing layer 30. .

The surface of the electronic product casing provided by the embodiment of the invention is polished by the longitudinal section of the sanding head The surface of the outer contour is matched with the outer surface of the longitudinal section of the polished workpiece of the electronic product, and the outer surface of the sanding head is covered with the abrasive layer to polish the polished member, and the polishing fixture can be polished when the workpiece is polished. The polished parts are well fitted, so that the mold parting line of the workpiece can be well polished, and the polishing marks are not obvious after grinding, and the appearance of the electronic product is not affected.

In the above embodiment, preferably, in order to better attach the polishing layer 30 to the outer surface of the contouring sanding head 10, the polishing layer 30 may be attached to the outer surface of the contouring sanding head 10 in a selective manner.

Further, the polishing layer 30 may be sandpaper. Sandpaper, commonly known as sand, is a material for grinding. It is used to grind metal, wood and other surfaces to make it smooth and smooth. It is usually made of various kinds of abrasive grains on the base paper. More preferably, the sandpaper in this embodiment may be 1000# sandpaper. 1000# sandpaper is a fine sanding paper that can grind the surface of workpieces with high precision requirements. In this embodiment, the surface of the electronic product casing is polished, and the electronic product is used as a high-precision product, and the appearance of the electronic product is also required to be high. Therefore, in the embodiment, the 1000# sandpaper for the electronic product housing is selected with high grinding precision. Grinding can meet the grinding accuracy requirements.

The electronic product housing surface grinding jig provided by the above embodiment further includes a polishing layer 40 for fixing on the outer surface of the polishing layer 30. The polishing layer 40 may be bonded to the outer surface of the polishing layer 30 by a strap; or may be attached to the outer surface of the polishing layer 30 by an adhesive.

Specifically, the polishing layer 40 may be a scouring pad. The scouring pad can perform high-quality decorative line processing: it can provide decorative decorative lines on a variety of material surfaces, such as stainless steel surface decorative grain treatment, antique copper modification treatment, etc., the polishing fixture provided in this embodiment is required The surface of the electronic product casing is polished and polished, so that polishing with a scouring pad can achieve a better polishing effect.

Embodiment 2

The embodiment provides a surface grinding process of the electronic product casing, and FIG. 8 is a flow chart of the surface grinding process of the electronic product casing according to an embodiment of the present invention; as shown in FIG. 8, the following steps are specifically included:

In a first step S101, according to the shape of the outer surface of the object to be polished, a profiled sanding head having a longitudinal cross-sectional outer contour matching the outer contour shape of the outer surface of the sanded member to be polished is prepared.

Specifically, referring to FIG. 3 to FIG. 6, the longitudinal profile of the profiled sanding head 10 matches the shape of the longitudinal profile of the outer surface of the workpiece 100 to be polished, which should be understood as if it is polished. The upper side surface of the piece 100 has a mold parting line, and the upper side surface is an outer surface to be polished by the sanding member 100, correspondingly, the longitudinal section outer wheel of the sanding surface 11 of the sanding head 10. The profile matches at least the longitudinal profile of the upper side surface of the sanded member 100. If the middle side surface of the sanding member 100 has a mold parting line, and the middle side surface is the outer surface to be polished by the sanding member 100, correspondingly, the sharpening surface 11 of the sanding head 10 has at least a longitudinal section outer contour. Matching the longitudinal section profile of the middle side surface of the workpiece 100.

Specifically, as shown in FIG. 3, the upper side surface of the workpiece 100 has a mold parting line, and the upper side surface of the workpiece 100 is a convex curved surface, correspondingly, as shown in FIG. The sanding surface 11 of the contouring sanding head 10 should also include at least a concave curved surface that matches the convex upper side surface, and the position of the mold parting line L of the sanded workpiece 100 is located at the polished member 100. The upper side position of the side surface, so that the longitudinal section outer contour of the contouring sanding head 10 matches at least the upper surface of the side surface of the workpiece 100, and the longitudinal section outer contour of the contouring sanding head 10 can be different from the workpiece 100. The surface portion to be polished is formed with a certain gap, or is completely matched and matched, and is not limited in this embodiment. Of course, the longitudinal profile of the entire profiled sanding head 10 can also be matched to the longitudinal profile of the entire side surface of the workpiece 100.

For example, as shown in FIG. 5, the middle side surface of the workpiece 100 has a mold parting line L, and the middle side surface of the workpiece 100 is a convex curved surface, correspondingly, as shown in FIG. It should be noted that the sanding surface 11 of the contouring sanding head 10 should also include at least a concave curved surface matching the convex central side surface, and the position of the mold parting line L of the sanded workpiece 100 is located at the polished part. The more intermediate position of the side surface of 100, so that the longitudinal profile of the profiled sanding head 10 matches at least the middle of the side surface of the workpiece 100, and the longitudinal profile of the profiled sanding head 10 can be associated with the workpiece 100. The surface portion that does not need to be polished is formed with a certain gap, or is completely matched and matched, and is not limited in this embodiment. Of course, the longitudinal profile of the entire profiled sanding head 10 can also be matched to the longitudinal profile of the entire side surface of the workpiece 100.

When making a profiled sanding head, you can first measure the size of the surface to be polished of the sanded piece, and draw a sketching head drawing according to the measured size, and grind the head drawing according to the drawn profile, and imitate Shaped head blanks are machined by CNC machine tools to obtain the desired profiled sanding head.

In a second step S102, the polishing layer is pasted on the outer surface of the contouring sanding head, and the rotary driving device is driven to drive the polishing head to rotate the sanding member to be polished once until the sanding of the sanding member is performed. disappear.

Pasting the polishing layer on the outer surface of the contouring polishing head, in particular, the liquid adhesive agent may be uniformly applied to the outer surface of the contouring polishing head, and then the polishing layer is covered on the liquid adhesive agent, thereby The abrasive layer is now applied to cover the outer surface of the contouring sanding head.

In the rotary driving device of the embodiment, a driving device such as a motor can be used, and the driving device drives the contour polishing head to rotate, which can avoid the technical problem of low manual grinding efficiency and has high grinding efficiency.

In this embodiment, the abrasive layer may be sandpaper. Sandpaper, commonly known as sand, is a material for grinding. It is used to grind metal, wood and other surfaces to make it smooth and smooth. It is usually made of various kinds of abrasive grains on the base paper. More preferably, the sandpaper in this embodiment may be 1000# sandpaper. 1000# sandpaper is a fine sanding paper that can grind the surface of workpieces with high precision requirements. In this embodiment, the surface of the electronic product casing is polished, and the electronic product is used as a high-precision product, and the appearance of the electronic product is also required to be high. Therefore, in the embodiment, the 1000# sandpaper for the electronic product housing is selected with high grinding precision. Grinding can meet the grinding accuracy requirements.

In a third step S103, the rotation driving device is stopped.

Embodiment 3

The surface grinding process of the electronic product housing provided by this embodiment is further improved on the basis of the third embodiment, and specifically includes the following steps:

In a third step S103, the rotation driving device is stopped.

The detailed description of the foregoing steps S101 to S103 is the same as that of the second embodiment. For details, refer to the second embodiment, and details are not described herein again.

Further, it also includes:

In a fourth step S104, the scouring pad is coated on the outer surface of the polishing layer.

In a fifth step S105, the rotary driving device is activated again to drive the profile grinding head to rotate.

In a sixth step S106, the rotating profile grinding head is brought close to the polished part, so that the scouring pad on the contour polishing head is in contact with the polishing part of the polished part, and the polished part of the polished part is polished to polish and The abrasive imprint of the abrasive layer remaining on the polished member is removed.

Specifically, scouring pad can perform high-quality decorative line processing: it can be used on a variety of materials. For the appearance of decorative lines, such as stainless steel surface decorative pattern treatment, antique copper modification treatment, etc., the polishing fixture provided in this embodiment needs to polish and polish the surface of the electronic product housing, therefore, polishing with scouring pad can Get a better polishing effect.

Further, regarding the fourth step S104, the scouring pad is coated on the outer surface of the polishing layer, and specifically includes:

The surface grinding process of the electronic product casing provided by the embodiment can be matched with the surface to be polished on the polished part by the contour grinding head, and can be polished for specific shapes of the polished parts, and is ground by grinding. After the layer is processed and polished to remove the mold parting line, it is further processed by the scouring pad to polish the polishing marks after the grinding process, which can further eliminate the polishing marks and further improve the outer surface of the electronic product casing. Degree, can effectively improve the appearance of the electronic product housing.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " After, "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inside", "Outside", "Clockwise", "Counterclockwise", "Axial", The orientation or positional relationship of the "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of describing the present invention and the simplified description, and does not indicate or imply the indicated device or component. It must be constructed and operated in a particular orientation, and is not to be construed as limiting the invention.

Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" and "second" may include at least one of the features, either explicitly or implicitly. In the related description of the present invention, the meaning of "a plurality" is at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present invention, the terms "installation", "connected", "connected", "fixed" and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless explicitly stated and defined otherwise. Or integrated; can be directly connected, or indirectly connected through an intermediate medium, which can be the internal communication of two elements or the interaction of two elements. For those skilled in the art, the specific content of the above terms in the present invention can be understood according to the specific circumstances. Righteousness.

Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, and are not intended to be limiting; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that The technical solutions described in the foregoing embodiments may be modified, or some or all of the technical features may be equivalently replaced; and the modifications or substitutions do not deviate from the technical solutions of the embodiments of the present invention. range.

Claims

An electronic product housing surface grinding fixture, comprising: a contouring sanding head, and a rotating shaft, a longitudinal section outer contour of the contouring sanding head and an outer surface longitudinal section of the workpiece to be polished The outer contours are matched for engagement with an output shaft of the rotary drive to drive the contoured sanding head to rotate, the outer surface of the contouring sanding head being covered with an abrasive layer.
The electronic product housing surface grinding jig according to claim 1, wherein the polishing layer is adhered to an outer surface of the contouring sanding head; and/or further comprises a polishing layer for the polishing layer And fixed on the outer surface of the polishing layer.
The electronic product housing surface grinding jig according to claim 2, wherein the polishing layer is sandpaper.
The electronic product housing surface grinding jig according to claim 3, wherein the sandpaper is 1000# sandpaper.
The electronic product housing surface grinding jig according to claim 2, wherein the polishing layer is a scouring pad.
A surface grinding process for an electronic product casing, characterized in that the method comprises the following steps:

In the first step, according to the shape of the outer surface of the polished member, a profiled grinding head having a longitudinal section outer contour matching the outer contour longitudinal profile shape of the outer surface to be polished on the sanded member is prepared;

In a second step, the abrasive layer is adhered to the outer surface of the contouring sanding head, and the rotary driving device is driven to drive the polishing head to rotate the sanding member to be polished once until the mold clamping line of the sanding portion of the sanding member disappears. ;

In the third step, the rotary drive is stopped.
The surface grinding process of the electronic product casing according to claim 6, further comprising: after the third step:

a fourth step of coating the outer surface of the polishing layer with a scouring pad;

a fifth step of restarting the rotary driving device to drive the contouring polishing head to rotate;

In the sixth step, the rotating profile grinding head is close to the polished part, so that the scouring pad on the profile grinding head is in contact with the sanding part of the polished part, and the sanding part of the polished part is polished to be polished and removed. A polishing mark of the abrasive layer remaining on the polished part.
The surface grinding process of an electronic product casing according to claim 7, wherein In the fourth step, the scouring pad is coated on the outer surface of the polishing layer, and specifically includes:

The scouring pad is fixedly bound to the outer surface of the polishing layer by a strap; or the scouring pad is adhered to the outer surface of the polishing layer by an adhesive.
The surface polishing process of an electronic product casing according to claim 6, wherein the abrasive layer is sandpaper.
The surface polishing process of an electronic product casing according to claim 9, wherein the sandpaper is 1000# sandpaper.