WO2019068916A3 - Heating apparatus - Google Patents

Heating apparatus Download PDF

Info

Publication number
WO2019068916A3
WO2019068916A3 PCT/EP2018/077229 EP2018077229W WO2019068916A3 WO 2019068916 A3 WO2019068916 A3 WO 2019068916A3 EP 2018077229 W EP2018077229 W EP 2018077229W WO 2019068916 A3 WO2019068916 A3 WO 2019068916A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermal energy
computer system
processor
fluid circuit
distribution assembly
Prior art date
Application number
PCT/EP2018/077229
Other languages
French (fr)
Other versions
WO2019068916A2 (en
Inventor
Adam Iain Laurie Pulley
Original Assignee
Green Processing Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Green Processing Ltd filed Critical Green Processing Ltd
Publication of WO2019068916A2 publication Critical patent/WO2019068916A2/en
Publication of WO2019068916A3 publication Critical patent/WO2019068916A3/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24DDOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D12/00Other central heating systems
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/20772Liquid cooling without phase change within server blades for removing heat from heat source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24DDOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D2200/00Heat sources or energy sources
    • F24D2200/16Waste heat
    • F24D2200/29Electrical devices, e.g. computers, servers

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Steam Or Hot-Water Central Heating Systems (AREA)
  • Heat-Pump Type And Storage Water Heaters (AREA)
  • Central Heating Systems (AREA)

Abstract

Disclosed is a heating apparatus for a domestic or commercial building. The apparatus comprises a computer system for installation in the building, the computer system including a data store, a program store storing processor implementable instructions, and at least one processor coupled to the data and program stores for implementing the stored instructions to thereby produce thermal energy. The apparatus further comprises a thermal energy distribution assembly arranged for transferring the thermal energy away from the computer system for heating purposes, the thermal energy distribution assembly comprising a piped fluid circuit and at least one first heat exchanger connected to the piped fluid circuit for transferring the thermal energy from the processor to a fluid of the piped fluid circuit. The piped fluid circuit may be arranged such that, before passing through the first heat exchanger, thermal energy is transferred to the fluid from thermal energy-generating ancillary components of the computer system. The apparatus may be operated such that,in response to the determination of a need for an increased heating temperature, at least one of a rate at which the computer system produces the thermal energy and a rate at which the thermal energy distribution assembly transfers thermal energy away from the processor is controlled, such that the temperature of the processor increases.
PCT/EP2018/077229 2017-10-06 2018-10-05 Heating apparatus WO2019068916A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1716368.4A GB2567209B (en) 2017-10-06 2017-10-06 Heating apparatus
GB1716368.4 2017-10-06

Publications (2)

Publication Number Publication Date
WO2019068916A2 WO2019068916A2 (en) 2019-04-11
WO2019068916A3 true WO2019068916A3 (en) 2019-06-06

Family

ID=60326934

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2018/077229 WO2019068916A2 (en) 2017-10-06 2018-10-05 Heating apparatus

Country Status (2)

Country Link
GB (1) GB2567209B (en)
WO (1) WO2019068916A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201619987D0 (en) 2016-11-25 2017-01-11 Iceotope Ltd Fluid cooling system
FR3099814B1 (en) * 2019-08-07 2022-05-13 Tresorio Installation and process for heat recovery
EP4208892A1 (en) 2020-09-04 2023-07-12 JDI Design Inc. System and method for transferring thermal energy from integrated circuits
EP3985320B1 (en) * 2020-10-14 2023-04-05 Siemens Schweiz AG Control of room comfort
US11729950B2 (en) 2021-04-01 2023-08-15 Ovh Immersion cooling system with dual dielectric cooling liquid circulation
EP4068925A1 (en) * 2021-04-01 2022-10-05 Ovh Scissor structure for cable/tube management of rack-mounted liquid-cooled electronic assemblies
EP4316220A1 (en) * 2021-04-01 2024-02-07 Ovh Hybrid liquid cooling system with leak detection
CA3153037A1 (en) * 2021-04-01 2022-10-01 Ovh Hybrid immersion cooling system for rack-mounted electronic assemblies
WO2024039589A1 (en) * 2022-08-15 2024-02-22 Hunt Energy, L.L.C. System and method for using waste heat generated by digital processing components
GB202217333D0 (en) * 2022-11-18 2023-01-04 Bbg Holdings Gmbh Energy demand regulator

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040008483A1 (en) * 2002-07-13 2004-01-15 Kioan Cheon Water cooling type cooling system for electronic device
US20050243517A1 (en) * 2004-04-29 2005-11-03 Hewlett-Packard Development Company, L.P. High serviceability liquid cooling loop using tubing hinge
EP2058724A2 (en) * 2007-11-06 2009-05-13 Fujitsu Siemens Computers GmbH Method and system for using the waste heat of a computer system
US20090218078A1 (en) * 2008-02-28 2009-09-03 International Business Machines Corporation Variable flow computer cooling system for a data center and method of operation
WO2010019517A1 (en) * 2008-08-11 2010-02-18 Green Revolution Cooling, Inc. Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack
DE102016204175A1 (en) * 2016-03-14 2017-09-14 Thomas-Krenn.AG System, preferably for temperature regulation of a volume

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2474248B (en) * 2009-10-07 2015-05-13 Ibex Uk Ltd Heating apparatus
US8416572B2 (en) * 2010-01-20 2013-04-09 Dell Products L.P. System and method for cooling information handling resources

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040008483A1 (en) * 2002-07-13 2004-01-15 Kioan Cheon Water cooling type cooling system for electronic device
US20050243517A1 (en) * 2004-04-29 2005-11-03 Hewlett-Packard Development Company, L.P. High serviceability liquid cooling loop using tubing hinge
EP2058724A2 (en) * 2007-11-06 2009-05-13 Fujitsu Siemens Computers GmbH Method and system for using the waste heat of a computer system
US20090218078A1 (en) * 2008-02-28 2009-09-03 International Business Machines Corporation Variable flow computer cooling system for a data center and method of operation
WO2010019517A1 (en) * 2008-08-11 2010-02-18 Green Revolution Cooling, Inc. Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack
DE102016204175A1 (en) * 2016-03-14 2017-09-14 Thomas-Krenn.AG System, preferably for temperature regulation of a volume

Also Published As

Publication number Publication date
GB2567209A (en) 2019-04-10
GB201716368D0 (en) 2017-11-22
GB2567209B (en) 2021-11-24
WO2019068916A2 (en) 2019-04-11

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