WO2019045658A3 - Waterproof lighting module which chip-on-board (cob), die-on-board (dob) or similar led clusters integrated with optical structure - Google Patents

Waterproof lighting module which chip-on-board (cob), die-on-board (dob) or similar led clusters integrated with optical structure Download PDF

Info

Publication number
WO2019045658A3
WO2019045658A3 PCT/TR2017/050488 TR2017050488W WO2019045658A3 WO 2019045658 A3 WO2019045658 A3 WO 2019045658A3 TR 2017050488 W TR2017050488 W TR 2017050488W WO 2019045658 A3 WO2019045658 A3 WO 2019045658A3
Authority
WO
WIPO (PCT)
Prior art keywords
board
lighting module
dob
cob
optical structure
Prior art date
Application number
PCT/TR2017/050488
Other languages
French (fr)
Other versions
WO2019045658A2 (en
Inventor
Engin GUR
Original Assignee
Ttaf Elektronik Sanayi Ve Ticaret Limited Sirketi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ttaf Elektronik Sanayi Ve Ticaret Limited Sirketi filed Critical Ttaf Elektronik Sanayi Ve Ticaret Limited Sirketi
Publication of WO2019045658A2 publication Critical patent/WO2019045658A2/en
Publication of WO2019045658A3 publication Critical patent/WO2019045658A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09027—Non-rectangular flat PCB, e.g. circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

The invention relates to an integrated lighting module (1) that is watertight, has enhanced heat conduction and is easily removable; the lighting module (1) is manufactured by assembly of a cover (10), which carries an optical structure (lens 40) and a connector (20), via screws or bolts (100) to a chassis and/or a printed circuit board (PCB) (90), and wherein COB, DOB and / or similar LED clusters (70) are also installed.
PCT/TR2017/050488 2016-10-13 2017-10-10 Waterproof lighting module which chip-on-board (cob), die-on-board (dob) or similar led clusters integrated with optical structure WO2019045658A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TR2016/14398 2016-10-13
TR2016/14398A TR201614398A2 (en) 2016-10-13 2016-10-13 WATERPROOF LIGHTING MODULE WITH CHIP-ON-BOARD (COB), DIE-ON-BOARD (DOB) OR SIMILAR LED CLUSTERS INTEGRATED WITH OPTICAL STRUCTURE

Publications (2)

Publication Number Publication Date
WO2019045658A2 WO2019045658A2 (en) 2019-03-07
WO2019045658A3 true WO2019045658A3 (en) 2019-04-11

Family

ID=63833579

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/TR2017/050488 WO2019045658A2 (en) 2016-10-13 2017-10-10 Waterproof lighting module which chip-on-board (cob), die-on-board (dob) or similar led clusters integrated with optical structure

Country Status (2)

Country Link
TR (1) TR201614398A2 (en)
WO (1) WO2019045658A2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100099276A1 (en) * 2008-10-16 2010-04-22 Osram Gesellschaft Mit Beschraenkter Haftung Method of connecting printed circuit boards and corresponding arrangment
US20130176732A1 (en) * 2012-01-05 2013-07-11 Molex Incorporated Holder and led module using same
US20140063814A1 (en) * 2011-04-25 2014-03-06 Molex Incorporated Illumination system
US20150129910A1 (en) * 2013-11-08 2015-05-14 Abl Ip Holding Llc System and Method for Connecting LED Devices
DE102013114209A1 (en) * 2013-12-17 2015-06-18 Osram Opto Semiconductors Gmbh Method for mounting a chip carrier LED on a carrier body and optoelectronic component with a chip carrier LED and a carrier body
WO2015101420A1 (en) * 2014-01-02 2015-07-09 Tyco Electronics Nederland B.V. Led socket assembly

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100099276A1 (en) * 2008-10-16 2010-04-22 Osram Gesellschaft Mit Beschraenkter Haftung Method of connecting printed circuit boards and corresponding arrangment
US20140063814A1 (en) * 2011-04-25 2014-03-06 Molex Incorporated Illumination system
US20130176732A1 (en) * 2012-01-05 2013-07-11 Molex Incorporated Holder and led module using same
US20150129910A1 (en) * 2013-11-08 2015-05-14 Abl Ip Holding Llc System and Method for Connecting LED Devices
DE102013114209A1 (en) * 2013-12-17 2015-06-18 Osram Opto Semiconductors Gmbh Method for mounting a chip carrier LED on a carrier body and optoelectronic component with a chip carrier LED and a carrier body
WO2015101420A1 (en) * 2014-01-02 2015-07-09 Tyco Electronics Nederland B.V. Led socket assembly

Also Published As

Publication number Publication date
TR201614398A2 (en) 2017-01-23
WO2019045658A2 (en) 2019-03-07

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