WO2019041929A1 - 触控基板及其制作方法、触控装置 - Google Patents

触控基板及其制作方法、触控装置 Download PDF

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Publication number
WO2019041929A1
WO2019041929A1 PCT/CN2018/089214 CN2018089214W WO2019041929A1 WO 2019041929 A1 WO2019041929 A1 WO 2019041929A1 CN 2018089214 W CN2018089214 W CN 2018089214W WO 2019041929 A1 WO2019041929 A1 WO 2019041929A1
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WIPO (PCT)
Prior art keywords
layer
touch
organic layer
inorganic
covering
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PCT/CN2018/089214
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English (en)
French (fr)
Inventor
曾亭
张明
胡海峰
邹富伟
费诗超
唐星
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to EP18849413.2A priority Critical patent/EP3495137B1/en
Priority to US16/331,801 priority patent/US10891009B2/en
Publication of WO2019041929A1 publication Critical patent/WO2019041929A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present disclosure relates to the field of touch technologies, and in particular to a touch substrate, a method for fabricating the same, and a touch device.
  • the present disclosure provides a touch substrate including a touch area and a trace area adjacent to the touch area, wherein the trace area is covered with a protection structure, and the protection structure includes a stacked structure. At least two organic layers and at least two inorganic layers, the organic layer and the inorganic layer being alternately disposed.
  • the protection structure comprises a first organic layer, a first inorganic layer, a second organic layer and a second inorganic layer which are sequentially stacked.
  • the routing area of the touch substrate specifically includes:
  • the routing area of the touch substrate specifically includes:
  • the first inorganic layer and the second inorganic layer are made of the same material, and the first organic layer and the second organic layer are made of the same material.
  • the inorganic layer is made of SiNxOy.
  • each inorganic layer is the thickness of each inorganic layer.
  • the organic layer is made of a transparent photoresist material.
  • the thickness of each organic layer is not
  • the inorganic layer has a refractive index of 1.60 to 1.75.
  • the present disclosure further provides a method for fabricating a touch substrate, including:
  • the protective structure comprising at least two organic layers and at least two inorganic layers stacked in a stack, the organic layer and the inorganic layer being alternately disposed.
  • the forming the protection structure specifically includes:
  • a first organic layer, a first inorganic layer, a second organic layer, and a second inorganic layer are sequentially formed on the wiring region.
  • the manufacturing method specifically includes:
  • the second organic layer covering the second inorganic layer is formed.
  • the manufacturing method specifically includes:
  • the second inorganic layer covering the second organic layer is formed.
  • the present disclosure further provides a touch device including the touch substrate as described above.
  • the touch device is an in-vehicle touch device.
  • FIG. 1 is a schematic structural view of a touch panel wiring area in the related art
  • FIG. 2 is a schematic structural diagram of a touch panel routing area of some embodiments of the present disclosure.
  • FIG. 3 is a schematic structural diagram of a touch panel routing area according to still another embodiment of the present disclosure.
  • FIG. 4 is a schematic flow chart of a method for fabricating a touch substrate according to some embodiments of the present disclosure
  • FIG. 7 is a schematic diagram of a touch substrate according to some embodiments of the present disclosure.
  • Car touch requires touch products to work in high temperature and high humidity for a long time.
  • the current standard is that touch products need to work in high temperature and high humidity for at least 1000 hours.
  • Some high-end models also require touch products at high temperature and high humidity.
  • the metal trace After the touch product is operated in high temperature and high humidity for 1200 hours, the metal trace will be corroded. The situation affects the performance of touch products and cannot meet the requirements of high temperature and high humidity resistance of touch products.
  • the routing area of the touch substrate includes a substrate substrate 1, a black matrix 2, a flat layer 3, and a metal layer. 4.
  • the inorganic layer 5 and the organic layer 6, the base substrate 7, and the base substrate 7 function as a package cover.
  • the metal layer 4 includes metal traces. As can be seen from FIG. 1, only one inorganic layer 5 and one organic layer 6 are covered on the metal traces, resulting in poor ability of the touch substrate to isolate water and oxygen, and the metal walks.
  • the line is in a high temperature and high humidity environment for a long time, it will be corroded, affecting the performance of the touch product, and cannot meet the requirements of high temperature and high humidity resistance of the touch product.
  • embodiments of the present disclosure provide a touch substrate, a method for fabricating the same, and a touch device, which enable the touch product to work for a long time in a high temperature and high humidity environment.
  • An embodiment of the present disclosure provides a touch substrate including a touch area 10 and a trace area 20 adjacent to the touch area, as shown in FIG.
  • the wiring area is covered with a protective structure, and the protection structure includes at least two organic layers and at least two inorganic layers stacked in a stack, and the organic layer and the inorganic layer are alternately disposed.
  • the protection area is covered on the wiring area, and the protection structure adopts an alternate laminated design of a plurality of organic layers and inorganic layers.
  • the laminated design has good performance of insulating water and oxygen, and can be well.
  • the metal traces are protected to improve the corrosion of the metal traces in a high temperature and high humidity environment, and the touch products can be operated for a long time in a high temperature and high humidity environment.
  • the protection structure includes two organic layers and two inorganic layers, and the protection structure includes a first organic layer, a first inorganic layer, a second organic layer, and a second inorganic layer disposed in a stack.
  • the protective structure may further include more organic layers and inorganic layers, such as three organic layers and three inorganic layers. The more the number of layers of the organic layer and the inorganic layer included in the protection structure, the higher the performance of insulating the water and oxygen, and the higher the cost of the touch substrate, and the greater the thickness of the touch substrate. In practical applications, different layers of organic and inorganic layers can be designed according to actual needs.
  • the inorganic layer has a refractive index of 1.60 to 1.75.
  • the refractive index of the inorganic layer is close to that of the touch electrode, and can serve as a shadow mask.
  • the inorganic layer may be SiNxOy, SiNx, or SiOy. If the inorganic layer is composed of SiNxOy, a first inorganic layer and a second inorganic layer may be separately formed by two SiNxOy film forming processes on the wiring region.
  • the thickness of the SiNxOy covering the wiring area in the touch substrate in the related art is On the left and right sides, the thickness of SiNxOy is large, and the film density of SiNxOy film formation is poor.
  • the thickness of the inorganic layer is thinned, and the thickness of the single inorganic layer is The film density of the SiNxOy film can be made better, and the performance of protecting the structure from water and oxygen can be further improved.
  • the organic layer and the inorganic layer are both insulating materials, and the organic layer is made of a transparent photoresist material or a resin material; the thickness of each organic layer is
  • the metal traces may be disposed on the planar layer 3, and the metal traces are covered with two organic layers and two inorganic layers arranged alternately.
  • the routing area of the touch substrate specifically includes:
  • the second organic layer 62 of the second inorganic layer 52 is covered.
  • the metal traces may be disposed directly on the black matrix 2, and the metal traces are covered with two organic layers and two inorganic layers arranged alternately.
  • the routing area of the touch substrate specifically includes:
  • the second inorganic layer 52 of the second organic layer 62 is covered.
  • the protective structure Starting from the base substrate 1 in a direction in which the respective film layers are stacked, the protective structure includes a first organic layer, a first inorganic layer, a second organic layer, and a second inorganic layer which are sequentially stacked, or include a stacking layer in sequence a first inorganic layer, a first organic layer, a second inorganic layer, and a second organic layer.
  • the order of arrangement of the protective structures on the base substrate is not limited to the structures shown in FIGS. 2 and 3 as long as the plurality of organic layers and the plurality of inorganic layers are alternately disposed.
  • the organic layer of the protective structure may also directly cover the metal traces on the flat layer 3, and the inorganic layer of the protective structure may also directly cover the metal traces on the black matrix 2.
  • Some embodiments of the present disclosure further provide a method for fabricating a touch substrate. As shown in FIG. 4, the manufacturing method includes:
  • Step 401 Form a protection structure covering a wiring area of the touch substrate, the protection structure comprising at least two organic layers and at least two inorganic layers disposed in a stack, the organic layer and the inorganic layer being alternately disposed.
  • the protection area is covered on the wiring area, and the protection structure adopts an alternate laminated design of a plurality of organic layers and inorganic layers.
  • the laminated design has good performance of insulating water and oxygen, and can be well.
  • the metal traces are protected to improve the corrosion of the metal traces in a high temperature and high humidity environment, and the touch products can be operated for a long time in a high temperature and high humidity environment.
  • the manufacturing method specifically includes:
  • Step 501 providing a substrate 1;
  • Step 502 forming a black matrix 2 in the routing area of the base substrate 1;
  • Step 503 forming a flat layer 3 covering the black matrix 2;
  • Step 504 forming a metal trace on the flat layer 3 (formed by the metal layer 4);
  • Step 505 forming the first inorganic layer 51 covering the metal trace
  • Step 506 forming the first organic layer 61 covering the first inorganic layer 51;
  • Step 507 forming the second inorganic layer 52 covering the first organic layer 61;
  • Step 508 forming the second organic layer 62 covering the second inorganic layer 52.
  • the manufacturing method of the touch substrate includes the following steps A1-A9:
  • A1 providing a substrate substrate 1, which may be a glass substrate or a quartz substrate;
  • the first transparent conductive layer may be patterned by using ITO or IZO, wherein the patterning process is included in the first transparent
  • the photoresist is coated on the conductive layer, and the photoresist is exposed by the mask. After the development, the photoresist remaining region and the photoresist unretained region are formed, and the first transparent conductive region of the photoresist unretained region is etched away. a layer, and removing the photoresist in the photoresist retention region to form a bridge for connecting the touch electrodes, wherein the touch electrode bridge is located in the touch area of the touch substrate;
  • the insulating material may be resin, silicon nitride or silicon oxide;
  • a second transparent conductive layer is deposited on the substrate 1 through the step A3, specifically, the second transparent conductive layer may be ITO or IZO;
  • Patterning the second transparent conductive layer wherein the patterning process comprises coating a photoresist on the second transparent conductive layer, exposing the photoresist by using the mask, and forming a photoresist retention region and a photoresist after development
  • the touch area is located on the touch area of the touch substrate.
  • the second transparent conductive layer in the unreserved area of the photoresist is etched away, and the photoresist in the photoresist remaining area is removed to form a pattern of the touch electrode.
  • a metal layer 4 is deposited on the substrate 1 through the step A4, and the metal layer 4 is patterned.
  • the patterning process includes coating a photoresist on the metal layer 4, and exposing the photoresist by using a mask. After the development, a photoresist remaining region and a photoresist unretained region are formed, the metal layer 4 of the photoresist unretained region is etched away, and the photoresist of the photoresist remaining region is removed to form a metal on the flat layer 3. Traces;
  • the first inorganic layer 51 is made of SiNxOy, has a refractive index of 1.60 to 1.75, and has a thickness of The first inorganic layer 51 covers the touch area and the trace area.
  • the first inorganic layer 51 located in the trace area can protect the metal traces, and the first inorganic layer 51 located in the touch area can function as a shadow.
  • the thickness of the first inorganic layer 51 of the present disclosure is thinned, so that the film density of the SiNxOy film is better, and the performance of protecting the structure from water and oxygen can be further improved;
  • the first organic layer 61 is formed on the base substrate 1 of the step A6, the first organic layer 61 is located in the routing area of the touch substrate, and the first organic layer 61 may be a transparent photoresist material or a resin material;
  • the second inorganic layer 52 is made of SiNxOy, having a refractive index of 1.60 to 1.75, and having a thickness of The second inorganic layer 52 covers the touch area and the trace area.
  • the second inorganic layer 52 located in the trace area can protect the metal traces, and the second inorganic layer 52 located in the touch area can function as a shadow.
  • the thickness of the second inorganic layer 52 of the present disclosure is thinned, so that the film density of the SiNxOy film is better, and the performance of protecting the structure from water and oxygen can be further improved;
  • a second organic layer 62 is formed on the substrate 1 through the step A8, the second organic layer 62 is located in the wiring area of the touch substrate, and the second organic layer 62 may be made of a transparent photoresist material or a resin material.
  • the touch substrate of the embodiment can be fabricated through the above steps A1-A9.
  • the base substrate 7 may be further covered on the base substrate 1 subjected to the step A9 to function as a package cover.
  • a stacked design of the first inorganic layer 51, the first organic layer 61, the second inorganic layer 52, and the second organic layer 62 is sequentially covered on the wiring region, and the laminated design has a good design. Isolation of water oxygen performance can protect the metal traces well, improve the corrosion of metal traces in high temperature and high humidity environment, and enable touch products to work in high temperature and high humidity environment for a long time.
  • the manufacturing method specifically includes:
  • Step 601 providing a substrate 1;
  • Step 602 forming a black matrix 2 in the routing area of the base substrate 1;
  • Step 603 forming a metal trace on the black matrix 2 (formed by the metal layer 4);
  • Step 604 forming the first organic layer 61 covering the metal trace
  • Step 605 forming the first inorganic layer 51 covering the first organic layer 61;
  • Step 606 forming the second organic layer 62 covering the first inorganic layer 51;
  • Step 607 forming the second inorganic layer 52 covering the second organic layer 62.
  • the manufacturing method of the touch substrate includes the following steps B1-B8:
  • substrate substrate 1 which may be a glass substrate or a quartz substrate
  • the metal layer 4 can also be used to form a registration mark of a subsequent process;
  • the first transparent conductive layer may adopt ITO or IZO to pattern the first transparent conductive layer, wherein the patterning process is included in the first transparent
  • the photoresist is coated on the conductive layer, and the photoresist is exposed by the mask. After the development, the photoresist remaining region and the photoresist unretained region are formed, and the first transparent conductive region of the photoresist unretained region is etched away. a layer, and removing the photoresist in the photoresist retention region to form a bridge for connecting the touch electrodes, wherein the touch electrode bridge is located in the touch area of the touch substrate;
  • a first organic layer 61 is formed on the base substrate 1 through the step B3, and the first organic layer 61 includes a portion located in the routing area of the touch substrate and a portion of the touch area of the touch substrate, the first organic The layer 61 is located on the portion of the touch area of the touch substrate and covers the metal trace. The portion of the first organic layer 61 located on the touch area of the touch substrate is located on the touch electrode bridge, and the touch electrode bridge and the touch can be isolated.
  • the electrode, the first organic layer 61 may be a resin;
  • a second transparent conductive layer is deposited on the substrate 1 through the step B4, specifically, the second transparent conductive layer may be ITO or IZO;
  • Patterning the second transparent conductive layer wherein the patterning process comprises coating a photoresist on the second transparent conductive layer, exposing the photoresist by using the mask, and forming a photoresist retention region and a photoresist after development
  • the touch area is located on the touch area of the touch substrate.
  • the second transparent conductive layer in the unreserved area of the photoresist is etched away, and the photoresist in the photoresist remaining area is removed to form a pattern of the touch electrode.
  • the first inorganic layer 51 is made of SiNxOy, has a refractive index of 1.60 to 1.75, and has a thickness of The first inorganic layer 51 covers the touch area and the trace area.
  • the first inorganic layer 51 located in the trace area can protect the metal traces, and the first inorganic layer 51 located in the touch area can function as a shadow.
  • the thickness of the first inorganic layer 51 of the present disclosure is thinned, so that the film density of the SiNxOy film is better, and the performance of protecting the structure from water and oxygen can be further improved;
  • a second organic layer 62 is formed on the base substrate 1 through the step B6, the second organic layer 62 is located in the routing area of the touch substrate, and the second organic layer 62 may be made of a resin;
  • the second inorganic layer 52 is made of SiNxOy, has a refractive index of 1.60 to 1.75, and has a thickness of The second inorganic layer 52 covers the touch area and the trace area.
  • the second inorganic layer 52 located in the trace area can protect the metal traces, and the second inorganic layer 52 located in the touch area can function as a shadow.
  • the thickness of the second inorganic layer 52 of the present disclosure is thinned, so that the film density of the SiNxOy film is better, and the performance of protecting the structure from water and oxygen can be further improved.
  • the touch substrate of the embodiment can be fabricated through the above steps B1-B8.
  • the base substrate 7 may be further covered on the substrate 1 through the step B8 to function as a package cover.
  • a stacked design of the first organic layer 61, the first inorganic layer 51, the second organic layer 62, and the second inorganic layer 52 is sequentially covered on the wiring region, and the laminated design has a good design. Isolation of water oxygen performance can protect the metal traces well, improve the corrosion of metal traces in high temperature and high humidity environment, and enable touch products to work in high temperature and high humidity environment for a long time.
  • Some embodiments of the present disclosure also provide a touch device including the touch substrate as described above.
  • the touch device has good performance of isolating water and oxygen, can well protect metal traces, improve corrosion of metal traces in high temperature and high humidity environment, and can be used for a long time under high temperature and high humidity environment. jobs. Therefore, it can be applied to a vehicle touch, that is, the touch device is a vehicle touch device.

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Abstract

一种触控基板及其制作方法、触控装置。触控基板，包括触控区（10）和与其相邻的走线区（20），走线区（20）覆盖有保护结构，保护结构包括层叠设置的至少两层有机层和至少两层无机层，有机层和无机层交替设置。

Description

触控基板及其制作方法、触控装置
相关申请的交叉引用
本申请主张在2017年8月29日在中国提交的中国专利申请No.201710754988.4的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及触控技术领域，特别是指一种触控基板及其制作方法、触控装置。
背景技术
随着触控技术的发展，车载触控已逐渐深入人们的生活，在车载的主控台及后座中控台已普遍采用触控产品来提高驾驶者及乘坐者的用户体验。早期的车载触控主要以电阻触摸屏为主，随着电容式触控技术的发展，因GG(玻璃式外挂触控屏)/OGS(一体化触控)产品的触控灵敏性及体验感优异，车载触控技术以GG/OGS技术为后续的发展方向。
发明内容
第一方面，本公开提供一种触控基板，包括触控区和与所述触控区相邻的走线区，所述走线区上覆盖有保护结构，所述保护结构包括层叠设置的至少两层有机层和至少两层无机层，所述有机层和所述无机层交替设置。
可选地，所述保护结构包括依次层叠设置的第一有机层、第一无机层、第二有机层和第二无机层。
可选地，所述触控基板的走线区具体包括：
平坦层；
位于所述平坦层上的金属走线；
覆盖所述金属走线的所述第一无机层；
覆盖所述第一无机层的所述第一有机层；
覆盖所述第一有机层的所述第二无机层；
覆盖所述第二无机层的所述第二有机层。
可选地，所述触控基板的走线区具体包括：
金属走线；
覆盖所述金属走线的所述第一有机层；
覆盖所述第一有机层的所述第一无机层；
覆盖所述第一无机层的所述第二有机层；
覆盖所述第二有机层的所述第二无机层。
可选地，所述第一无机层和所述第二无机层由同一种材料制成，所述第一有机层和所述第二有机层由同一种材料制成。
可选地，所述无机层采用SiNxOy。
可选地，每层无机层的厚度为
Figure PCTCN2018089214-appb-000001
可选地，所述有机层采用透明光阻材料。
可选地，每层有机层的厚度为
Figure PCTCN2018089214-appb-000002
可选地，所述无机层的折射率为1.60～1.75。
第二方面，本公开还提供了一种触控基板的制作方法，包括：
形成覆盖触控基板的走线区的保护结构，所述保护结构包括层叠设置的至少两层有机层和至少两层无机层，所述有机层和所述无机层交替设置。
可选地，形成所述保护结构具体包括：
在所述走线区上依次形成第一有机层、第一无机层、第二有机层和第二无机层。
可选地，所述制作方法具体包括：
形成平坦层；
在所述平坦层上形成金属走线；
形成覆盖所述金属走线的所述第一无机层；
形成覆盖所述第一无机层的所述第一有机层；
形成覆盖所述第一有机层的所述第二无机层；
形成覆盖所述第二无机层的所述第二有机层。
可选地，所述制作方法具体包括：
形成金属走线；
形成覆盖所述金属走线的所述第一有机层；
形成覆盖所述第一有机层的所述第一无机层；
形成覆盖所述第一无机层的所述第二有机层；
形成覆盖所述第二有机层的所述第二无机层。
第三方面，本公开还提供了一种触控装置，包括如上所述的触控基板。
可选地，所述触控装置为车载触控装置。
附图说明
为了更清楚地说明本公开实施例或现有技术中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为相关技术中的触控基板走线区的结构示意图；
图2为本公开的一些实施例触控基板走线区的结构示意图；
图3为本公开的另一些实施例触控基板走线区的结构示意图；
图4-图6为本公开的一些实施例触控基板的制作方法的流程示意图；
图7为本公开的一些实施例触控基板的示意图。
具体实施方式
为使本公开的实施例要解决的技术问题、技术方案和优点更加清楚，下面将结合附图及具体实施例进行详细描述。
车载触控需要触控产品能够在高温高湿环境下长时间工作，目前通用的标准是触控产品需要在高温高湿环境下工作至少1000小时，一些高端车型还要求触控产品在高温高湿环境下工作至少1500小时，但是现有触控产品的走线区耐高温高湿的性能较差，触控产品在高温高湿环境下工作1200小时后走线区将出现金属走线被腐蚀的情况，影响触控产品的性能，不能满足触控产 品耐高温高湿的要求。
图1为相关技术中的触控基板走线区的结构示意图，如图1所示，所述触控基板的走线区依次包括有衬底基板1、黑矩阵2、平坦层3、金属层4、无机层5和有机层6、衬底基板7，衬底基板7起到封装盖板的作用。金属层4包括有金属走线，从图1中可以看出，在金属走线上仅覆盖有一层无机层5和一层有机层6，导致触控基板隔绝水氧的能力较差，金属走线长时间处于高温高湿环境下时将出现被腐蚀的情况，影响触控产品的性能，不能满足触控产品耐高温高湿的要求。
为了解决上述问题，本公开的实施例提供一种触控基板及其制作方法、触控装置，能够使触控产品在高温高湿环境下长时间工作。
本公开的实施例提供了一种触控基板，包括触控区10和与所述触控区相邻的走线区20，如图7所示。所述走线区上覆盖有保护结构，所述保护结构包括层叠设置的至少两层有机层和至少两层无机层，所述有机层和所述无机层交替设置。
本实施例中，在走线区上覆盖有保护结构，保护结构采用多层有机层和无机层的交替叠层设计，该种叠层设计具有很好的隔绝水氧的性能，能够很好地对金属走线进行保护，改善金属走线在高温高湿的环境下出现腐蚀的情况，能够使触控产品在高温高湿环境下长时间工作。
在一些可选的实施例中，保护结构包括有两层有机层和两层无机层，所述保护结构包括层叠设置的第一有机层、第一无机层、第二有机层和第二无机层。当然保护结构还可以包括更多层有机层和无机层，比如包括三层有机层和三层无机层。保护结构包括的有机层和无机层的层数越多，隔绝水氧的性能越高，而触控基板的成本越高，同时触控基板的厚度也越大。在实际应用中，可根据实际需求设计不同层数的有机层和无机层。
在一些可选的实施例中，所述无机层的折射率为1.60～1.75。这样在无机层覆盖触控区时，无机层的折射率与触控电极的折射率相近，可以充当消影层。
在一些可选的实施例中，所述无机层可采用SiNxOy、SiNx、或SiOy。 如果所述无机层由SiNxOy组成，在所述走线区上通过两次SiNxOy成膜工艺可分别形成第一无机层和第二无机层。
相关技术中的触控基板中覆盖走线区的SiNxOy的厚度在
Figure PCTCN2018089214-appb-000003
左右，SiNxOy的厚度较大，SiNxOy成膜的质密性较差。在本公开实施例中，将无机层的厚度减薄，单层无机层的厚度为
Figure PCTCN2018089214-appb-000004
可以使得SiNxOy成膜的质密性更好，可以进一步提高保护结构隔绝水氧的性能。
在一些可选的实施例中，有机层和无机层都是绝缘材料，所述有机层采用透明光阻材料，也可以采用树脂材料；每层有机层的厚度为
Figure PCTCN2018089214-appb-000005
Figure PCTCN2018089214-appb-000006
在一些可选的实施例中，可以将金属走线设置在平坦层3上，在金属走线上覆盖有交替层叠设置的两层有机层和两层无机层。如图2所示，所述触控基板的走线区具体包括：
衬底基板1；
位于所述衬底基板1上的黑矩阵2；
位于所述黑矩阵2上的平坦层3；
位于所述平坦层3上的金属走线(由金属层4形成)；
覆盖所述金属走线的所述第一无机层51；
覆盖所述第一无机层51的所述第一有机层61；
覆盖所述第一有机层61的所述第二无机层52；
覆盖所述第二无机层52的所述第二有机层62。
在另一些可选的实施例中，可以将金属走线直接设置在黑矩阵2上，在金属走线上覆盖有交替层叠设置的两层有机层和两层无机层。如图3所示，所述触控基板的走线区具体包括：
衬底基板1；
位于所述衬底基板1上的黑矩阵2；
位于所述黑矩阵2上的金属走线(由金属层4形成)；
覆盖所述金属走线的所述第一有机层61；
覆盖所述第一有机层61的所述第一无机层51；
覆盖所述第一无机层51的所述第二有机层62；
覆盖所述第二有机层62的所述第二无机层52。
从所述衬底基板1开始指向各膜层层叠的方向，所述保护结构包括依次层叠设置的第一有机层、第一无机层、第二有机层和第二无机层、或包括依次层叠设置的第一无机层、第一有机层、第二无机层和第二有机层。保护结构在衬底基板上的排列顺序不限于图2和图3所示的结构，只要多层有机层和多层无机层交替设置即可。例如，保护结构的有机层也可直接覆盖于所述平坦层3上的金属走线，保护结构的无机层也可直接覆盖于黑矩阵2上的金属走线。本公开的一些实施例还提供了一种触控基板的制作方法，如图4所示，所述制作方法包括：
步骤401：形成覆盖触控基板的走线区的保护结构，所述保护结构包括层叠设置的至少两层有机层和至少两层无机层，所述有机层和所述无机层交替设置。
本实施例中，在走线区上覆盖有保护结构，保护结构采用多层有机层和无机层的交替叠层设计，该种叠层设计具有很好的隔绝水氧的性能，能够很好地对金属走线进行保护，改善金属走线在高温高湿的环境下出现腐蚀的情况，能够使触控产品在高温高湿环境下长时间工作。
在一些可选的实施例中，在制作如图2所示的触控基板时，如图5所示，所述制作方法具体包括：
步骤501：提供一衬底基板1；
步骤502：在所述衬底基板1的走线区形成黑矩阵2；
步骤503：形成覆盖所述黑矩阵2的平坦层3；
步骤504：在所述平坦层3上形成金属走线(由金属层4形成)；
步骤505：形成覆盖所述金属走线的所述第一无机层51；
步骤506：形成覆盖所述第一无机层51的所述第一有机层61；
步骤507：形成覆盖所述第一有机层61的所述第二无机层52；
步骤508：形成覆盖所述第二无机层52的所述第二有机层62。
具体地，所述触控基板的制作方法包括以下步骤A1-A9：
A1、提供一衬底基板1，该衬底基板1可以为玻璃基板或石英基板；
在衬底基板1上形成黑色不透光材料层，对黑色不透光材料层进行构图，形成黑矩阵2，黑矩阵2位于触控基板的走线区；
A2、在经过步骤A1的衬底基板1上沉积第一透明导电层，具体地，第一透明导电层可以采用ITO或IZO，对第一透明导电层进行构图，其中构图工艺包括在第一透明导电层上涂覆光刻胶，利用掩膜板对光刻胶进行曝光，显影后形成光刻胶保留区域和光刻胶未保留区域，刻蚀掉光刻胶未保留区域的第一透明导电层，并去除光刻胶保留区域的光刻胶，形成用于连接触控电极的架桥，触控电极架桥位于触控基板的触控区；
A3、在经过步骤A2的衬底基板1上沉积绝缘材料，具体地，绝缘材料可以采用树脂、氮化硅或氧化硅；
对绝缘材料层进行构图，形成位于走线区的平坦层3，和覆盖架桥的绝缘图形，通过绝缘图形能够实现架桥与触控电极的绝缘；
A4、在经过步骤A3的衬底基板1上沉积第二透明导电层，具体地，第二透明导电层可以采用ITO或IZO；
对第二透明导电层进行构图，其中构图工艺包括在第二透明导电层上涂覆光刻胶，利用掩膜板对光刻胶进行曝光，显影后形成光刻胶保留区域和光刻胶未保留区域，刻蚀掉光刻胶未保留区域的第二透明导电层，并去除光刻胶保留区域的光刻胶，形成触控电极的图形，触控电极位于触控基板的触控区。
A5、在经过步骤A4的衬底基板1上沉积金属层4，对金属层4进行构图，其中构图工艺包括在金属层4上涂覆光刻胶，利用掩膜板对光刻胶进行曝光，显影后形成光刻胶保留区域和光刻胶未保留区域，刻蚀掉光刻胶未保留区域的金属层4，并去除光刻胶保留区域的光刻胶，形成位于平坦层3上的金属走线；
A6、在经过步骤A5的衬底基板1上沉积第一无机层51，第一无机层51采用SiNxOy，折射率为1.60～1.75，厚度为
Figure PCTCN2018089214-appb-000007
第一无机层51覆盖触控区和走线区，位于走线区的第一无机层51可以保护金属走线，位于触控 区的第一无机层51可以起到消影的作用。相比于现有触控基板的SiNxOy层，本公开的第一无机层51的厚度减薄，使得SiNxOy成膜的质密性更好，可以进一步提高保护结构隔绝水氧的性能；
A7、在经过步骤A6的衬底基板1上形成第一有机层61，第一有机层61位于触控基板的走线区，第一有机层61可以采用透明光阻材料也可以采用树脂材料；
A8、在经过步骤A7的衬底基板1上沉积第二无机层52，第二无机层52采用SiNxOy，折射率为1.60～1.75，厚度为
Figure PCTCN2018089214-appb-000008
第二无机层52覆盖触控区和走线区，位于走线区的第二无机层52可以保护金属走线，位于触控区的第二无机层52可以起到消影的作用。相比于现有触控基板的SiNxOy层，本公开的第二无机层52的厚度减薄，使得SiNxOy成膜的质密性更好，可以进一步提高保护结构隔绝水氧的性能；
A9、在经过步骤A8的衬底基板1上形成第二有机层62，第二有机层62位于触控基板的走线区，第二有机层62可以采用透明光阻材料也可以采用树脂材料。
经过上述步骤A1-A9即可制作得到本实施例的触控基板。可选地，还可以在经过步骤A9的衬底基板1上再盖上衬底基板7，起到封装盖板的作用。本实施例中，在走线区上依次覆盖有第一无机层51、第一有机层61、第二无机层52、第二有机层62的叠层设计，该种叠层设计具有很好的隔绝水氧的性能，能够很好地对金属走线进行保护，改善金属走线在高温高湿的环境下出现腐蚀的情况，能够使触控产品在高温高湿环境下长时间工作。
在一些可选的实施例中，在制作如图3所示的触控基板时，如图6所示，所述制作方法具体包括：
步骤601：提供一衬底基板1；
步骤602：在所述衬底基板1的走线区形成黑矩阵2；
步骤603：在所述黑矩阵2上形成金属走线(由金属层4形成)；
步骤604：形成覆盖所述金属走线的所述第一有机层61；
步骤605：形成覆盖所述第一有机层61的所述第一无机层51；
步骤606：形成覆盖所述第一无机层51的所述第二有机层62；
步骤607：形成覆盖所述第二有机层62的所述第二无机层52。
具体地，所述触控基板的制作方法包括以下步骤B1-B8：
B1、提供一衬底基板1，该衬底基板1可以为玻璃基板或石英基板；
在衬底基板1上形成黑色不透光材料层，对黑色不透光材料层进行构图，形成黑矩阵2，黑矩阵2位于触控基板的走线区；
B2、在经过步骤B1的衬底基板1上沉积金属层4，对金属层4进行构图，其中构图工艺包括在金属层4上涂覆光刻胶，利用掩膜板对光刻胶进行曝光，显影后形成光刻胶保留区域和光刻胶未保留区域，刻蚀掉光刻胶未保留区域的金属层4，并去除光刻胶保留区域的光刻胶，形成位于黑矩阵2上的金属走线。进一步地，还可以利用金属层4形成后续工艺的对位标记；
B3、在经过步骤B2的衬底基板1上沉积第一透明导电层，具体地，第一透明导电层可以采用ITO或IZO，对第一透明导电层进行构图，其中构图工艺包括在第一透明导电层上涂覆光刻胶，利用掩膜板对光刻胶进行曝光，显影后形成光刻胶保留区域和光刻胶未保留区域，刻蚀掉光刻胶未保留区域的第一透明导电层，并去除光刻胶保留区域的光刻胶，形成用于连接触控电极的架桥，触控电极架桥位于触控基板的触控区；
B4、在经过步骤B3的衬底基板1上形成第一有机层61，第一有机层61包括位于触控基板的走线区的部分和位于触控基板的触控区的部分，第一有机层61位于触控基板的走线区的部分覆盖金属走线，第一有机层61位于触控基板的触控区的部分位于触控电极架桥上，可以隔绝触控电极架桥与触控电极，第一有机层61可以采用树脂；
B5、在经过步骤B4的衬底基板1上沉积第二透明导电层，具体地，第二透明导电层可以采用ITO或IZO；
对第二透明导电层进行构图，其中构图工艺包括在第二透明导电层上涂覆光刻胶，利用掩膜板对光刻胶进行曝光，显影后形成光刻胶保留区域和光刻胶未保留区域，刻蚀掉光刻胶未保留区域的第二透明导电层，并去除光刻胶保留区域的光刻胶，形成触控电极的图形，触控电极位于触控基板的触控 区。
B6、在经过步骤B5的衬底基板1上沉积第一无机层51，第一无机层51采用SiNxOy，折射率为1.60～1.75，厚度为
Figure PCTCN2018089214-appb-000009
第一无机层51覆盖触控区和走线区，位于走线区的第一无机层51可以保护金属走线，位于触控区的第一无机层51可以起到消影的作用。相比于现有触控基板的SiNxOy层，本公开的第一无机层51的厚度减薄，使得SiNxOy成膜的质密性更好，可以进一步提高保护结构隔绝水氧的性能；
B7、在经过步骤B6的衬底基板1上形成第二有机层62，第二有机层62位于触控基板的走线区，第二有机层62可以采用树脂；
B8、在经过步骤B7的衬底基板1上沉积第二无机层52，第二无机层52采用SiNxOy，折射率为1.60～1.75，厚度为
Figure PCTCN2018089214-appb-000010
第二无机层52覆盖触控区和走线区，位于走线区的第二无机层52可以保护金属走线，位于触控区的第二无机层52可以起到消影的作用。相比于现有触控基板的SiNxOy层，本公开的第二无机层52的厚度减薄，使得SiNxOy成膜的质密性更好，可以进一步提高保护结构隔绝水氧的性能。
经过上述步骤B1-B8即可制作得到本实施例的触控基板。在一些可选的实施例中，还可以在经过步骤B8的衬底基板1上再盖上衬底基板7，起到封装盖板的作用。本实施例中，在走线区上依次覆盖有第一有机层61、第一无机层51、第二有机层62和第二无机层52的叠层设计，该种叠层设计具有很好的隔绝水氧的性能，能够很好地对金属走线进行保护，改善金属走线在高温高湿的环境下出现腐蚀的情况，能够使触控产品在高温高湿环境下长时间工作。
本公开的一些实施例还提供了一种触控装置，包括如上所述的触控基板。该触控装置具有很好的隔绝水氧的性能，能够很好地对金属走线进行保护，改善金属走线在高温高湿的环境下出现腐蚀的情况，能够在高温高湿环境下长时间工作。因此，可以应用在车载触控中，即上述触控装置为车载触控装置。
在本公开各方法实施例中，所述各步骤的序号并不能用于限定各步骤的 先后顺序，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，对各步骤的先后变化也在本公开的保护范围之内。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
可以理解，当诸如层、膜、区域或基板之类的元件被称作位于另一元件“上”或“下”时，该元件可以“直接”位于另一元件“上”或“下”，或者可以存在中间元件。
以上所述是本公开的可选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本公开所述原理的前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本公开的保护范围。

Claims (16)

  1. 一种触控基板，包括触控区和与所述触控区相邻的走线区，其中，所述走线区覆盖有保护结构，所述保护结构包括层叠设置的至少两层有机层和至少两层无机层，所述有机层和所述无机层交替设置。
  2. 根据权利要求1所述的触控基板，其中，所述保护结构包括依次层叠设置的第一有机层、第一无机层、第二有机层和第二无机层。
  3. 根据权利要求2所述的触控基板，其中，所述触控基板的走线区包括：
    平坦层；
    位于所述平坦层上的金属走线；
    覆盖所述金属走线的所述第一无机层；
    覆盖所述第一无机层的所述第一有机层；
    覆盖所述第一有机层的所述第二无机层；
    覆盖所述第二无机层的所述第二有机层。
  4. 根据权利要求2所述的触控基板，其中，所述触控基板的走线区具体包括：
    金属走线；
    覆盖所述金属走线的所述第一有机层；
    覆盖所述第一有机层的所述第一无机层；
    覆盖所述第一无机层的所述第二有机层；
    覆盖所述第二有机层的所述第二无机层。
  5. 根据权利要求2中所述的触控基板，其中，所述第一无机层和所述第二无机层由同一种材料制成，所述第一有机层和所述第二有机层由同一种材料制成。
  6. 根据权利要求1-5中任一项所述的触控基板，其中，所述无机层采用SiNxOy。
  7. 根据权利要求6所述的触控基板，其中，每层无机层的厚度为
    Figure PCTCN2018089214-appb-100001
  8. 根据权利要求1-4中任一项所述的触控基板，其中，所述有机层采用 透明材料。
  9. 根据权利要求8所述的触控基板，其中，每层有机层的厚度为
    Figure PCTCN2018089214-appb-100002
  10. 根据权利要求1-4中任一项所述的触控基板，其中，所述无机层的折射率为1.60～1.75。
  11. 一种触控基板的制作方法，包括：
    形成覆盖触控基板的走线区的保护结构，所述保护结构包括层叠设置的至少两层有机层和至少两层无机层，所述有机层和所述无机层交替设置。
  12. 根据权利要求11所述的触控基板的制作方法，其中，形成所述保护结构包括：
    在所述走线区上依次形成第一有机层、第一无机层、第二有机层和第二无机层。
  13. 根据权利要求12所述的触控基板的制作方法，进一步包括：
    形成平坦层；
    在所述平坦层上形成金属走线；
    形成覆盖所述金属走线的所述第一无机层；
    形成覆盖所述第一无机层的所述第一有机层；
    形成覆盖所述第一有机层的所述第二无机层；
    形成覆盖所述第二无机层的所述第二有机层。
  14. 根据权利要求12所述的触控基板的制作方法，进一步包括：
    形成金属走线；
    形成覆盖所述金属走线的所述第一有机层；
    形成覆盖所述第一有机层的所述第一无机层；
    形成覆盖所述第一无机层的所述第二有机层；
    形成覆盖所述第二有机层的所述第二无机层。
  15. 一种触控装置，包括如权利要求1-10中任一项所述的触控基板。
  16. 根据权利要求15所述的触控装置，其中，所述触控装置为车载触控装置。
PCT/CN2018/089214 2017-08-29 2018-05-31 触控基板及其制作方法、触控装置 WO2019041929A1 (zh)

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