WO2019016995A1 - Electronic device - Google Patents

Electronic device Download PDF

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Publication number
WO2019016995A1
WO2019016995A1 PCT/JP2018/006919 JP2018006919W WO2019016995A1 WO 2019016995 A1 WO2019016995 A1 WO 2019016995A1 JP 2018006919 W JP2018006919 W JP 2018006919W WO 2019016995 A1 WO2019016995 A1 WO 2019016995A1
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WO
WIPO (PCT)
Prior art keywords
antenna
radar
wireless communication
circuit
electronic device
Prior art date
Application number
PCT/JP2018/006919
Other languages
French (fr)
Japanese (ja)
Inventor
克利 小原
明秀 安達
Original Assignee
アルプス電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アルプス電気株式会社 filed Critical アルプス電気株式会社
Publication of WO2019016995A1 publication Critical patent/WO2019016995A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them

Definitions

  • the present invention relates to electronic devices.
  • an antenna substrate provided with a first antenna for transmitting and receiving radar waves, a second antenna for communicating with a portable terminal, and an electronic component for processing a signal transmitted and received by the first antenna
  • a vehicle antenna unit has been proposed.
  • the first antenna, the second antenna, and the electronic component are provided on the same antenna substrate, which causes a problem of an increase in size.
  • the present invention has been made in view of the above problems, and has an object to miniaturize an electronic device having a wireless communication function and a radar function.
  • the electronic device includes a circuit board, a radar circuit provided on the surface of the circuit board for performing transmission / reception processing of a signal for radar, and a surface of the circuit board provided with a signal for wireless communication.
  • the electronic device provided with the wireless communication function and the radar function can be miniaturized.
  • FIG. 2 is a diagram illustrating an example of an electronic device. The figure which shows the modification of an electronic device. The figure which shows the modification of an electronic device. The figure which shows the modification of an electronic device. The figure which shows the modification of an electronic device. The figure which shows the modification of an electronic device.
  • the electronic device 100 is an electronic device provided with a radar function and a wireless communication function.
  • the electronic device 100 may be a radar device with a wireless communication function whose main function is a radar function, or may be a wireless communication device with a radar function whose main function is a wireless communication function. Further, the electronic device 100 may be an electronic device whose main function is a function other than the radar function and the wireless communication function.
  • FIG. 1 is a view showing an example of the electronic device 100.
  • the left view of FIG. 1 is a side view of the electronic device 100
  • the right view of FIG. 1 is a plan view of the electronic device 100.
  • the electronic device 100 of FIG. 1 includes a circuit board 1, a radar circuit 2, a wireless communication circuit 3, a resin layer 4, an antenna substrate 5, a radar antenna 6, a wireless communication antenna 7, connection portions 8 and 9. And.
  • the upper surface in the side view is referred to as the front surface
  • the lower surface is referred to as the back surface.
  • the circuit board 1 is a printed circuit board made of resin or ceramic.
  • the circuit board 1 is provided with a radar circuit 2, a wireless communication circuit 3, and a resin layer 4 on the surface.
  • the radar circuit 2 is a circuit (a radar module) that performs transmission / reception processing of a signal for radar, and is provided on the surface of the circuit board 1.
  • the radar circuit 2 is sealed with a resin layer 4 on the circuit board 1.
  • the radar circuit 2 includes a transmission circuit, a reception circuit, and a signal processing circuit.
  • the transmission circuit performs transmission processing on the transmission signal input from the signal processing circuit, generates a radar signal (electric signal) according to the transmission signal, and generates a radar wave (radio wave) according to the radar signal as a radar antenna.
  • Radiate 6 The reception circuit performs reception processing on the radar signal input from the radar antenna 6 and generates a reception signal according to the radar signal.
  • the signal processing circuit performs generation of a transmission signal, protocol processing on a reception signal input from the reception circuit, control of transmission / reception timing of a radar wave, and the like.
  • a centimeter wave SHF: Super High Frequency
  • a millimeter wave EHF: Extremely High Frequency
  • a terahertz wave THz
  • the wireless communication circuit 3 is a circuit that performs transmission / reception processing of a signal for wireless communication, and is provided on the surface of the circuit board 1.
  • the wireless communication circuit 3 is sealed with a resin layer 4 on the circuit board 1.
  • the wireless communication circuit 3 includes a transmission circuit, a reception circuit, and a signal processing circuit.
  • the transmission circuit performs transmission processing on the transmission signal input from the signal processing circuit, generates a wireless communication signal (electric signal) corresponding to the transmission signal, and generates a wireless signal (radio wave) corresponding to the wireless communication signal.
  • the radio communication antenna 7 is caused to emit radiation.
  • the reception circuit performs reception processing on the wireless communication signal input from the wireless communication antenna 7 and generates a reception signal according to the wireless communication signal.
  • the signal processing circuit generates a transmission signal, performs protocol processing on a reception signal input from the reception circuit, and controls transmission / reception timing of a radio signal.
  • the standard of wireless communication executed by the wireless communication circuit 3 is, for example, Bluetooth (registered trademark), BLE (Bluetooth Low Energy), Wi-Fi (registered trademark), or Zigbee (registered trademark), but is not limited thereto. Absent.
  • the radar circuit 2 and the wireless communication circuit 3 may be ICs (Integrated Circuits) independent of one another as in the example of FIG. 1 or may be one integrated IC.
  • the radar circuit 2 and the wireless communication circuit 3 may also include discrete elements mounted on the surface of the circuit board 1 and a wiring pattern formed on the surface of the circuit board 1.
  • the resin layer 4 is provided on the surface of the circuit board 1 and seals the radar circuit 2 and the wireless communication circuit 3 on the circuit board 1.
  • the resin layer 4 is formed of an insulating resin such as a glass epoxy resin.
  • the resin layer 4 may be mounted on the surface of the circuit board 1 in a state in which the radar circuit 2 and the wireless communication circuit 3 are sealed in advance, or the radar circuit 2 and wireless communication previously mounted on the surface of the circuit board 1 It may be formed to cover the circuit 3.
  • the resin layer 4 is provided with the antenna substrate 5 on the surface. For this reason, the surface of the resin layer 4 is preferably flat. Thus, the antenna substrate 5 can be easily fixed to the surface of the resin layer 4.
  • the antenna substrate 5 (first antenna substrate) is a printed circuit board made of resin or ceramic, and is provided on the surface of the resin layer 4.
  • the antenna substrate 5 is adhered to the surface of the resin layer 4 by an adhesive, for example.
  • the antenna substrate 5 is provided with the radar antenna 6 and the wireless communication antenna 7 on the surface. Therefore, the antenna substrate 5 is preferably a ceramic substrate having a low dielectric constant. As a result, the pattern accuracy of the radar antenna 6 and the wireless communication antenna 7 formed on the surface can be improved, and the loss of the signal by the antenna substrate 5 can be suppressed.
  • the radar antenna 6 is an antenna provided on the surface of the antenna substrate 5 for transmitting and receiving radar waves, and is electrically connected to the radar circuit 2 through the connection portion 8. Specifically, the radar antenna 6 radiates a radar wave (radio wave) according to the radar signal input from the radar circuit 2 (transmission circuit), and the radar circuit 2 (receives the radar signal according to the received radar wave) Input to the circuit).
  • a radar wave radio wave
  • the radar antenna 6 is formed of a conductive material such as silver, copper, aluminum, and carbon. Although the radar antenna 6 is a rectangular planar antenna in the example of FIG. 1, it may be a circular planar antenna. The shape and size of the radar antenna 6 are determined according to the wavelength (frequency) of the radar wave transmitted and received by the radar antenna 6.
  • a plurality of radar antennas 6 are provided on the surface of the antenna substrate 5 as in the example of FIG. Desired directivity can be given to the radar antenna 6 by adjusting the arrangement of the plurality of radar antennas 6.
  • the number of radar antennas 6 provided on the surface of the antenna substrate 5 can be arbitrarily designed.
  • the radar antenna 6 can be disposed at an arbitrary position of the antenna substrate 5, but as shown in the example of FIG. 1, the radar antenna 6 is preferably provided at the center of the antenna substrate 5. Thereby, as described later, the area required for the antenna substrate 5 can be reduced. Further, the distance between the radar antenna 6 and the radar circuit 2 can be easily shortened, and when using a millimeter wave or a terahertz wave, it is easy to suppress a decrease in accuracy due to a phase shift.
  • the wireless communication antenna 7 is an antenna provided on the surface of the antenna substrate 5 to transmit and receive a wireless signal, and is electrically connected to the wireless communication circuit 3 through the connection unit 9. Specifically, the wireless communication antenna 7 radiates a wireless signal (radio wave) according to the wireless communication signal input from the wireless communication circuit 3 (transmission circuit), and wirelessly transmits a wireless communication signal according to the received wireless signal. Input to the communication circuit 2 (reception circuit).
  • the wireless communication antenna 7 is formed of a conductive material such as silver, copper, aluminum, and carbon.
  • the wireless communication antenna 7 is a spiral planar antenna, but may be a meander planar antenna.
  • the shape and size of the wireless communication antenna 7 are determined according to the wavelength (frequency) of a wireless signal transmitted and received by the wireless communication antenna 7.
  • a signal used for wireless communication a signal having a frequency lower than that of a signal used for a radar wave is used, so the length dimension required for the wireless communication antenna 7 tends to be long.
  • the number of wireless communication antennas 7 provided on the surface of the antenna substrate 5 can be designed arbitrarily. Further, the wireless communication antenna 7 can be disposed at an arbitrary position of the antenna substrate 5, but as shown in the example of FIG. 1, the wireless communication antenna 7 is preferably provided at the outer peripheral portion of the antenna substrate 5. As a result, as shown in the example of FIG. 1, the radar antenna 6 can be provided inside the wireless communication antenna 7 (the central portion of the antenna substrate 5). Therefore, the radar antenna 6 and the wireless communication antenna 7 can be disposed on the surface of the antenna substrate 5 efficiently, that is, the surplus space on the surface of the antenna substrate 5 is reduced. As a result, the area required for the antenna substrate 5 can be reduced, and the electronic device 100 can be miniaturized.
  • the connection unit 8 electrically connects the radar circuit 2 and the radar antenna 6.
  • the radar antenna 6 receives a radar signal from the radar circuit 2 (transmission circuit) via the connection unit 8.
  • the radar antenna 6 also inputs a radar signal to the radar circuit 2 (reception circuit) via the connection unit 8.
  • the connection portion 8 is formed of a conductive material such as silver, copper, aluminum, and carbon.
  • connection portion 8 is electrically connected by solder or a conductive adhesive to the through via provided in the resin layer 4 and the through via provided in the antenna substrate 5.
  • the through via referred to here is one obtained by applying or embedding a conductive material on the inner surface of the through hole provided in the substrate.
  • the connection portion 8 may be formed using a columnar metal member embedded in the resin layer 4 instead of the through via provided in the resin layer 4 or provided on the side surface of the resin layer 4 and the antenna substrate 5 It may be formed by electrically connecting the side electrodes. Further, the connection portion 8 may be formed by electrically connecting the through via of the resin layer 4 and the side electrode of the antenna substrate 5, or the side electrode of the resin layer 4 and the through via of the antenna substrate 5 may be electrically It may form by connecting.
  • connection unit 9 electrically connects the wireless communication circuit 3 and the wireless communication antenna 7.
  • the wireless communication antenna 7 receives a wireless communication signal from the wireless communication circuit 3 (transmission circuit) via the connection unit 9. Further, the wireless communication antenna 7 inputs a wireless communication signal to the wireless communication circuit 3 (reception circuit) via the connection unit 9.
  • the connection portion 9 is formed of a conductive material such as silver, copper, aluminum, and carbon.
  • connection portion 9 is electrically connected by solder or a conductive adhesive to the through via provided in the resin layer 4 and the through via provided in the antenna substrate 5.
  • the connection portion 9 may be formed using a columnar metal member embedded in the resin layer 4 instead of the through via provided in the resin layer 4 or provided on the side surface of the resin layer 4 and the antenna substrate 5 It may be formed by electrically connecting the side electrodes. Further, the connection portion 9 may be formed by electrically connecting the through via of the resin layer 4 and the side electrode of the antenna substrate 5, or the side electrode of the resin layer 4 and the through via of the antenna substrate 5 are electrically It may form by connecting.
  • the circuit board 1 and the antenna board 5 are provided.
  • the area required for can be reduced.
  • the antenna substrate 5 is provided on the surface of the resin layer 4, a complex structure for arranging the radar circuit 2 and the wireless communication circuit 3 and the radar antenna 6 and the wireless communication antenna 7 in layers one above the other. That is, the multistage structure of the substrate via the spacer and the like is not necessary. That is, the structure of the electronic device 100 can be simplified. As a result, the electronic device 100 provided with the wireless communication function and the radar function can be miniaturized.
  • the radar circuit 2 and the wireless communication circuit 3 are sealed by the resin layer 4, protection of the radar circuit 2 and the wireless communication circuit 3 is facilitated. Further, as described above, the structure of the electronic device 100 can be simplified. This makes the electronic device 100 easy to handle.
  • FIGS. 2 to 5 are diagrams showing a modification of the electronic device 100.
  • FIG. The left views of FIGS. 2 to 5 are side views of the electronic device 100, and the right views of FIGS. 2 to 5 are plan views of the electronic device 100.
  • the wireless communication antenna 7 is provided on the back surface of the antenna substrate 5.
  • the other configuration of the electronic device 100 of FIG. 2 is similar to that of FIG. 1 and the electronic device 100.
  • the electronic device 100 can be miniaturized and easy to handle.
  • the radar antenna 6 may be provided on the back surface of the antenna substrate 5, and the wireless communication antenna 7 may be provided on the surface of the antenna substrate 5. Alternatively, both the radar antenna 6 and the wireless communication antenna 7 may be provided on the back surface of the antenna substrate 5. In any case, the same effect as the electronic device 100 of FIG. 2 can be obtained.
  • the wireless communication antenna 7 is provided on the back surface of the circuit board 1.
  • the other configuration of the electronic device 100 of FIG. 3 is similar to that of FIG. 1 and the electronic device 100.
  • the electronic device 100 can be miniaturized and easy to handle. Further, the distance between the radar antenna 6 and the wireless communication antenna 7 is increased, and the radar antenna 6 and the wireless communication antenna 7 are separated by the circuit board 1, the resin layer 4, and the antenna substrate 5. Thereby, the radio wave interference between the radar antenna 6 and the wireless communication antenna 7 is reduced, so that the radar antenna 6 and the wireless communication antenna 7 are opposed to each other while suppressing the deterioration of the radar performance and the wireless communication quality by the radio wave interference. It can be arranged. That is, the radar antenna 6 can be disposed at the central portion of the antenna substrate 5, and the wireless communication antenna 7 can be disposed at the central portion of the circuit substrate 1. As a result, the area required for the antenna substrate 5 and the circuit substrate 1 can be further reduced, and the electronic device 100 can be further miniaturized.
  • the radar antenna 6 may be provided on the back surface of the circuit board 1, and the wireless communication antenna 7 may be provided on the front surface of the antenna substrate 5.
  • one of the radar antenna 6 and the wireless communication antenna 7 may be provided on the back surface of the circuit board 1, and the other may be provided on the back surface of the antenna substrate 5. In any case, the same effect as the electronic device 100 of FIG. 3 can be obtained.
  • the antenna substrate 10 (second antenna substrate) is provided on the surface of the resin layer 4, the radar antenna 6 is provided on the surface of the antenna substrate 5, and the wireless communication antenna 7 of meander shape is the antenna substrate It is provided on the surface of ten.
  • the antenna substrate 10 is disposed apart from the antenna substrate 5.
  • the other configuration of the electronic device 100 of FIG. 4 is the same as that of FIG. 1 and the electronic device 100.
  • the electronic device 100 can be miniaturized and easy to handle.
  • the distance between the radar antenna 6 and the wireless communication antenna 7 is increased, and the antenna substrate 5 provided with the radar antenna 6 and the antenna substrate 10 provided with the wireless communication antenna 7 are separated by a gap. It is placed apart. As a result, radio wave interference between the radar antenna 6 and the wireless communication antenna 7 is reduced, so that it is possible to suppress the deterioration of the radar performance and the radio communication quality due to the radio wave interference.
  • the radar antenna 6 may be provided on the back surface of the antenna substrate 5, and the wireless communication antenna 7 may be provided on the back surface of the antenna substrate 10. In any case, the same effect as the electronic device 100 of FIG. 4 can be obtained.
  • the electronic device 100 of FIG. 5 does not include the antenna substrate 5, and the radar antenna 6 and the wireless communication antenna 7 are provided on the surface of the resin layer 4.
  • the other configuration of the electronic device 100 of FIG. 5 is similar to that of FIG. 1 and the electronic device 100.
  • the electronic device 100 can be miniaturized and easy to handle. Further, since the antenna substrate 5 is not necessary, the electronic device 100 can be further miniaturized, and the manufacturing cost can be reduced.
  • the radar antenna 6 and the wireless communication antenna 7 can be disposed at opposing positions while suppressing the deterioration of the radar performance and the wireless communication quality due to radio wave interference. That is, one of the radar antenna 6 and the wireless communication antenna 7 can be disposed at the central portion of the resin layer 4, and the other can be disposed at the central portion of the circuit board 1. As a result, the area required for the resin layer 4 and the circuit board 1 can be further reduced, and the electronic device 100 can be further miniaturized.
  • Circuit board 2 Radar circuit 3: Wireless communication circuit 4: Resin layer 5: Antenna board 6: Radar antenna 7: Wireless communication antenna 8, 9: Connection part 10: Antenna board 100: Electronic device

Abstract

An electronic device according to one embodiment comprises: a circuit board; a radar circuit that is provided on a surface of the circuit board and performs transmission and reception processing of signals for a radar; a wireless communication circuit that is provided on the surface of the circuit board and performs transmission and reception processing of wireless communication signals; a resin layer for sealing the radar circuit and the wireless communication circuit; a first antenna board provided on the surface of the resin layer; a radar antenna connected to the radar circuit; and a wireless communication antenna connected to the wireless communication circuit. At least one of the radar antenna and the wireless communication antenna is provided to the first antenna board.

Description

電子装置Electronic device
　本発明は、電子装置に関する。 The present invention relates to electronic devices.
　従来、レーダ機能及び無線通信機能を備えた電子装置が知られている。このような電子装置として、レーダ波を送受信する第１アンテナと、携帯端末と通信するための第２アンテナと、第１アンテナが送受信する信号を処理する電子部品と、が設けられたアンテナ基板を備える車両用アンテナユニットが提案されている。 Conventionally, electronic devices provided with a radar function and a wireless communication function are known. As such an electronic device, an antenna substrate provided with a first antenna for transmitting and receiving radar waves, a second antenna for communicating with a portable terminal, and an electronic component for processing a signal transmitted and received by the first antenna A vehicle antenna unit has been proposed.
特開２０１６－１９７０６１号公報Unexamined-Japanese-Patent No. 2016-197061
　しかしながら、上記従来の車両アンテナユニットでは、第１アンテナ、第２アンテナ、及び電子部品が、同一のアンテナ基板に設けられるため、サイズが大きくなるという問題があった。 However, in the above-described conventional vehicle antenna unit, the first antenna, the second antenna, and the electronic component are provided on the same antenna substrate, which causes a problem of an increase in size.
　本発明は、上記の課題に鑑みてなされたものであり、無線通信機能及びレーダ機能を備えた電子装置を小型化することを目的とする。 The present invention has been made in view of the above problems, and has an object to miniaturize an electronic device having a wireless communication function and a radar function.
　一実施形態に係る電子装置は、回路基板と、前記回路基板の表面に設けられ、レーダ用の信号の送受信処理を行うレーダ回路と、前記回路基板の表面に設けられ、無線通信用の信号の送受信処理を行う無線通信回路と前記レーダ回路及び前記無線通信回路を封止する樹脂層と、前記樹脂層の表面に設けられた第１アンテナ基板と、前記レーダ回路に接続されたレーダアンテナと、前記無線通信回路に接続された無線通信アンテナと、を備え、前記レーダアンテナ及び前記無線通信アンテナの少なくとも一方は、前記第１アンテナ基板に設けられる。 The electronic device according to one embodiment includes a circuit board, a radar circuit provided on the surface of the circuit board for performing transmission / reception processing of a signal for radar, and a surface of the circuit board provided with a signal for wireless communication. A wireless communication circuit for performing transmission / reception processing, a resin layer sealing the radar circuit and the wireless communication circuit, a first antenna substrate provided on the surface of the resin layer, a radar antenna connected to the radar circuit, A wireless communication antenna connected to the wireless communication circuit, and at least one of the radar antenna and the wireless communication antenna is provided on the first antenna substrate.
　本発明の各実施形態によれば、無線通信機能及びレーダ機能を備えた電子装置を小型化することができる。 According to each embodiment of the present invention, the electronic device provided with the wireless communication function and the radar function can be miniaturized.
電子装置の一例を示す図。FIG. 2 is a diagram illustrating an example of an electronic device. 電子装置の変形例を示す図。The figure which shows the modification of an electronic device. 電子装置の変形例を示す図。The figure which shows the modification of an electronic device. 電子装置の変形例を示す図。The figure which shows the modification of an electronic device. 電子装置の変形例を示す図。The figure which shows the modification of an electronic device.
　以下、本発明の各実施形態について、添付の図面を参照しながら説明する。なお、各実施形態に係る明細書及び図面の記載に関して、実質的に同一の機能構成を有する構成要素については、同一の符号を付することにより重畳した説明を省略する。 Hereinafter, embodiments of the present invention will be described with reference to the attached drawings. In addition, regarding the description of the specification and drawings according to each embodiment, the same reference numerals are given to components having substantially the same functional configuration, and the overlapping description will be omitted.
　一実施形態に係る電子装置１００について、図１～図５を参照して説明する。本実施形態に係る電子装置１００は、レーダ機能及び無線通信機能を備えた電子装置である。電子装置１００は、レーダ機能を主たる機能とした無線通信機能付きレーダ装置であってもよいし、無線通信機能を主たる機能としたレーダ機能付き無線通信装置であってもよい。また、電子装置１００は、レーダ機能及び無線通信機能以外の機能を主たる機能とした電子装置であってもよい。 An electronic device 100 according to an embodiment will be described with reference to FIGS. The electronic device 100 according to the present embodiment is an electronic device provided with a radar function and a wireless communication function. The electronic device 100 may be a radar device with a wireless communication function whose main function is a radar function, or may be a wireless communication device with a radar function whose main function is a wireless communication function. Further, the electronic device 100 may be an electronic device whose main function is a function other than the radar function and the wireless communication function.
　図１は、電子装置１００の一例を示す図である。図１の左図は電子装置１００の側面図であり、図１の右図は電子装置１００の平面図である。図１の電子装置１００は、回路基板１と、レーダ回路２と、無線通信回路３と、樹脂層４と、アンテナ基板５と、レーダアンテナ６と、無線通信アンテナ７と、接続部８，９と、を備える。以下では、説明の便宜のため、側面図における上側の面を表面、下側の面を裏面と称する。 FIG. 1 is a view showing an example of the electronic device 100. As shown in FIG. The left view of FIG. 1 is a side view of the electronic device 100, and the right view of FIG. 1 is a plan view of the electronic device 100. The electronic device 100 of FIG. 1 includes a circuit board 1, a radar circuit 2, a wireless communication circuit 3, a resin layer 4, an antenna substrate 5, a radar antenna 6, a wireless communication antenna 7, connection portions 8 and 9. And. Hereinafter, for convenience of description, the upper surface in the side view is referred to as the front surface, and the lower surface is referred to as the back surface.
　回路基板１は、樹脂製又はセラミックス製のプリント基板である。回路基板１は、表面にレーダ回路２、無線通信回路３、及び樹脂層４を設けられる。 The circuit board 1 is a printed circuit board made of resin or ceramic. The circuit board 1 is provided with a radar circuit 2, a wireless communication circuit 3, and a resin layer 4 on the surface.
　レーダ回路２は、レーダ用の信号の送受信処理を行う回路（レーダモジュール）であり、回路基板１の表面に設けられる。レーダ回路２は、回路基板１上で、樹脂層４により封止される。 The radar circuit 2 is a circuit (a radar module) that performs transmission / reception processing of a signal for radar, and is provided on the surface of the circuit board 1. The radar circuit 2 is sealed with a resin layer 4 on the circuit board 1.
　レーダ回路２は、送信回路と、受信回路と、信号処理回路と、を備える。送信回路は、信号処理回路から入力された送信信号に送信処理を施し、当該送信信号に応じたレーダ信号（電気信号）を生成すると共に、当該レーダ信号に応じたレーダ波（電波）をレーダアンテナ６に放射させる。受信回路は、レーダアンテナ６から入力されたレーダ信号に受信処理を施し、当該レーダ信号に応じた受信信号を生成する。信号処理回路は、送信信号の生成、受信回路から入力された受信信号に対するプロトコル処理、及びレーダ波の送受信タイミングの制御などを行う。レーダ回路２が送受信処理を行うレーダ用の信号には、例えば、センチメートル波（ＳＨＦ：Super High Frequency）、ミリ波（ＥＨＦ：Extremely High Frequency）、又はテラヘルツ波（ＴＨｚ）が用いられるが、これに限られない。 The radar circuit 2 includes a transmission circuit, a reception circuit, and a signal processing circuit. The transmission circuit performs transmission processing on the transmission signal input from the signal processing circuit, generates a radar signal (electric signal) according to the transmission signal, and generates a radar wave (radio wave) according to the radar signal as a radar antenna. Radiate 6 The reception circuit performs reception processing on the radar signal input from the radar antenna 6 and generates a reception signal according to the radar signal. The signal processing circuit performs generation of a transmission signal, protocol processing on a reception signal input from the reception circuit, control of transmission / reception timing of a radar wave, and the like. As a signal for radar that the radar circuit 2 performs transmission / reception processing, for example, a centimeter wave (SHF: Super High Frequency), a millimeter wave (EHF: Extremely High Frequency), or a terahertz wave (THz) is used. It is not limited to.
　無線通信回路３は、無線通信用の信号の送受信処理を行う回路であり、回路基板１の表面に設けられる。無線通信回路３は、回路基板１上で、樹脂層４により封止される。 The wireless communication circuit 3 is a circuit that performs transmission / reception processing of a signal for wireless communication, and is provided on the surface of the circuit board 1. The wireless communication circuit 3 is sealed with a resin layer 4 on the circuit board 1.
　無線通信回路３は、送信回路と、受信回路と、信号処理回路と、を備える。送信回路は、信号処理回路から入力された送信信号に送信処理を施し、当該送信信号に応じた無線通信信号（電気信号）を生成すると共に、当該無線通信信号に応じた無線信号（電波）を無線通信アンテナ７に放射させる。受信回路は、無線通信アンテナ７から入力された無線通信信号に受信処理を施し、当該無線通信信号に応じた受信信号を生成する。信号処理回路は、送信信号の生成、受信回路から入力された受信信号に対するプロトコル処理、及び無線信号の送受信タイミングの制御などを行う。無線通信回路３が実行する無線通信の規格は、例えば、Ｂｌｕｅｔｏｏｔｈ（登録商標）、ＢＬＥ（Bluetooth Low Energy）、Ｗｉ－Ｆｉ（登録商標）、又はＺｉｇｂｅｅ（登録商標）であるが、これに限られない。 The wireless communication circuit 3 includes a transmission circuit, a reception circuit, and a signal processing circuit. The transmission circuit performs transmission processing on the transmission signal input from the signal processing circuit, generates a wireless communication signal (electric signal) corresponding to the transmission signal, and generates a wireless signal (radio wave) corresponding to the wireless communication signal. The radio communication antenna 7 is caused to emit radiation. The reception circuit performs reception processing on the wireless communication signal input from the wireless communication antenna 7 and generates a reception signal according to the wireless communication signal. The signal processing circuit generates a transmission signal, performs protocol processing on a reception signal input from the reception circuit, and controls transmission / reception timing of a radio signal. The standard of wireless communication executed by the wireless communication circuit 3 is, for example, Bluetooth (registered trademark), BLE (Bluetooth Low Energy), Wi-Fi (registered trademark), or Zigbee (registered trademark), but is not limited thereto. Absent.
　なお、レーダ回路２及び無線通信回路３は、図１の例のように、それぞれ独立したＩＣ（Integrated Circuit）であってもよいし、一体化された１つのＩＣであってもよい。また、レーダ回路２及び無線通信回路３は、回路基板１の表面に実装されたディスクリート素子及び回路基板１の表面に形成された配線パターンを含んでもよい。 The radar circuit 2 and the wireless communication circuit 3 may be ICs (Integrated Circuits) independent of one another as in the example of FIG. 1 or may be one integrated IC. The radar circuit 2 and the wireless communication circuit 3 may also include discrete elements mounted on the surface of the circuit board 1 and a wiring pattern formed on the surface of the circuit board 1.
　樹脂層４は、回路基板１の表面に設けられ、回路基板１上でレーダ回路２及び無線通信回路３を封止する。樹脂層４は、ガラスエポキシ樹脂などの絶縁性の樹脂により形成される。樹脂層４は、レーダ回路２及び無線通信回路３を予め封止した状態で、回路基板１の表面に実装されてもよいし、回路基板１の表面に予め実装されたレーダ回路２及び無線通信回路３を覆うように形成されてもよい。また、樹脂層４は、表面にアンテナ基板５を設けられる。このため、樹脂層４の表面は、平坦であるのが好ましい。これにより、アンテナ基板５を樹脂層４の表面に容易に固定することができる。 The resin layer 4 is provided on the surface of the circuit board 1 and seals the radar circuit 2 and the wireless communication circuit 3 on the circuit board 1. The resin layer 4 is formed of an insulating resin such as a glass epoxy resin. The resin layer 4 may be mounted on the surface of the circuit board 1 in a state in which the radar circuit 2 and the wireless communication circuit 3 are sealed in advance, or the radar circuit 2 and wireless communication previously mounted on the surface of the circuit board 1 It may be formed to cover the circuit 3. In addition, the resin layer 4 is provided with the antenna substrate 5 on the surface. For this reason, the surface of the resin layer 4 is preferably flat. Thus, the antenna substrate 5 can be easily fixed to the surface of the resin layer 4.
　アンテナ基板５（第１アンテナ基板）は、樹脂製又はセラミックス製のプリント基板であり、樹脂層４の表面に設けられる。アンテナ基板５は、例えば、樹脂層４の表面に、接着剤により接着される。また、アンテナ基板５は、表面にレーダアンテナ６及び無線通信アンテナ７を設けられる。このため、アンテナ基板５は、誘電率が低いセラミック基板であるのが好ましい。これにより、表面に形成されるレーダアンテナ６及び無線通信アンテナ７のパターン精度を向上させると共に、アンテナ基板５による信号の損失を抑制できる。 The antenna substrate 5 (first antenna substrate) is a printed circuit board made of resin or ceramic, and is provided on the surface of the resin layer 4. The antenna substrate 5 is adhered to the surface of the resin layer 4 by an adhesive, for example. Further, the antenna substrate 5 is provided with the radar antenna 6 and the wireless communication antenna 7 on the surface. Therefore, the antenna substrate 5 is preferably a ceramic substrate having a low dielectric constant. As a result, the pattern accuracy of the radar antenna 6 and the wireless communication antenna 7 formed on the surface can be improved, and the loss of the signal by the antenna substrate 5 can be suppressed.
　レーダアンテナ６は、アンテナ基板５の表面に設けられた、レーダ波を送受信するアンテナであり、接続部８を介してレーダ回路２に電気的に接続される。具体的には、レーダアンテナ６は、レーダ回路２（送信回路）から入力されたレーダ信号に応じたレーダ波（電波）を放射し、受信したレーダ波に応じたレーダ信号をレーダ回路２（受信回路）に入力する。 The radar antenna 6 is an antenna provided on the surface of the antenna substrate 5 for transmitting and receiving radar waves, and is electrically connected to the radar circuit 2 through the connection portion 8. Specifically, the radar antenna 6 radiates a radar wave (radio wave) according to the radar signal input from the radar circuit 2 (transmission circuit), and the radar circuit 2 (receives the radar signal according to the received radar wave) Input to the circuit).
　レーダアンテナ６は、銀、銅、アルミニウム、及びカーボンなどの導電性材料により形成される。図１の例では、レーダアンテナ６は、矩形の平面アンテナであるが、円形の平面アンテナであってもよい。レーダアンテナ６の形状及び寸法は、レーダアンテナ６により送受信するレーダ波の波長（周波数）に応じて決定される。 The radar antenna 6 is formed of a conductive material such as silver, copper, aluminum, and carbon. Although the radar antenna 6 is a rectangular planar antenna in the example of FIG. 1, it may be a circular planar antenna. The shape and size of the radar antenna 6 are determined according to the wavelength (frequency) of the radar wave transmitted and received by the radar antenna 6.
　なお、レーダアンテナ６は、図１の例のように、アンテナ基板５の表面に複数設けられるのが好ましい。複数のレーダアンテナ６の配置を調整することにより、レーダアンテナ６に所望の指向性を付与することができる。アンテナ基板５の表面に設けるレーダアンテナ６の数は、任意に設計可能である。 Preferably, a plurality of radar antennas 6 are provided on the surface of the antenna substrate 5 as in the example of FIG. Desired directivity can be given to the radar antenna 6 by adjusting the arrangement of the plurality of radar antennas 6. The number of radar antennas 6 provided on the surface of the antenna substrate 5 can be arbitrarily designed.
　また、レーダアンテナ６は、アンテナ基板５の任意の位置に配置可能であるが、図１の例のように、アンテナ基板５の中央部に設けられるのが好ましい。これにより、後述する通り、アンテナ基板５に要求される面積を縮小できる。また、レーダアンテナ６とレーダ回路２との距離を短くし易く、ミリ波又はテラヘルツ波を使用する際に位相ずれによる精度低下を抑制し易い。 The radar antenna 6 can be disposed at an arbitrary position of the antenna substrate 5, but as shown in the example of FIG. 1, the radar antenna 6 is preferably provided at the center of the antenna substrate 5. Thereby, as described later, the area required for the antenna substrate 5 can be reduced. Further, the distance between the radar antenna 6 and the radar circuit 2 can be easily shortened, and when using a millimeter wave or a terahertz wave, it is easy to suppress a decrease in accuracy due to a phase shift.
　無線通信アンテナ７は、アンテナ基板５の表面に設けられた、無線信号を送受信するアンテナであり、接続部９を介して無線通信回路３に電気的に接続される。具体的には、無線通信アンテナ７は、無線通信回路３（送信回路）から入力された無線通信信号に応じた無線信号（電波）を放射し、受信した無線信号に応じた無線通信信号を無線通信回路２（受信回路）に入力する。 The wireless communication antenna 7 is an antenna provided on the surface of the antenna substrate 5 to transmit and receive a wireless signal, and is electrically connected to the wireless communication circuit 3 through the connection unit 9. Specifically, the wireless communication antenna 7 radiates a wireless signal (radio wave) according to the wireless communication signal input from the wireless communication circuit 3 (transmission circuit), and wirelessly transmits a wireless communication signal according to the received wireless signal. Input to the communication circuit 2 (reception circuit).
　無線通信アンテナ７は、銀、銅、アルミニウム、及びカーボンなどの導電性材料により形成される。図１の例では、無線通信アンテナ７は、スパイラル形状の平面アンテナであるが、メアンダ形状の平面アンテナであってもよい。無線通信アンテナ７の形状及び寸法は、無線通信アンテナ７により送受信する無線信号の波長（周波数）に応じて決定される。通常、無線通信に使用される信号としては、レーダ波に使用される信号と比較して周波数の低い信号が使用されるので、無線通信アンテナ７に必要な長さ寸法が長くなり易いが、無線通信アンテナ７の形状をスパイラル形状又はメアンダ形状とすることにより、無線通信アンテナ７を省スペース化し、アンテナ基板５に要求される面積を縮小できる。 The wireless communication antenna 7 is formed of a conductive material such as silver, copper, aluminum, and carbon. In the example of FIG. 1, the wireless communication antenna 7 is a spiral planar antenna, but may be a meander planar antenna. The shape and size of the wireless communication antenna 7 are determined according to the wavelength (frequency) of a wireless signal transmitted and received by the wireless communication antenna 7. Usually, as a signal used for wireless communication, a signal having a frequency lower than that of a signal used for a radar wave is used, so the length dimension required for the wireless communication antenna 7 tends to be long. By making the shape of the communication antenna 7 into a spiral shape or a meander shape, the space of the wireless communication antenna 7 can be saved, and the area required for the antenna substrate 5 can be reduced.
　なお、アンテナ基板５の表面に設ける無線通信アンテナ７の数は、任意に設計可能である。また、無線通信アンテナ７は、アンテナ基板５の任意の位置に配置可能であるが、図１の例のように、アンテナ基板５の外周部に設けられるのが好ましい。これにより、図１の例のように、無線通信アンテナ７の内側（アンテナ基板５の中央部）に、レーダアンテナ６を設けることができる。したがって、アンテナ基板５の表面に、レーダアンテナ６及び無線通信アンテナ７を効率的に、すなわち、アンテナ基板５の表面の余剰スペースが小さくなるように、配置することができる。この結果、アンテナ基板５に要求される面積を縮小し、電子装置１００を小型化できる。 The number of wireless communication antennas 7 provided on the surface of the antenna substrate 5 can be designed arbitrarily. Further, the wireless communication antenna 7 can be disposed at an arbitrary position of the antenna substrate 5, but as shown in the example of FIG. 1, the wireless communication antenna 7 is preferably provided at the outer peripheral portion of the antenna substrate 5. As a result, as shown in the example of FIG. 1, the radar antenna 6 can be provided inside the wireless communication antenna 7 (the central portion of the antenna substrate 5). Therefore, the radar antenna 6 and the wireless communication antenna 7 can be disposed on the surface of the antenna substrate 5 efficiently, that is, the surplus space on the surface of the antenna substrate 5 is reduced. As a result, the area required for the antenna substrate 5 can be reduced, and the electronic device 100 can be miniaturized.
　接続部８は、レーダ回路２とレーダアンテナ６とを電気的に接続する。レーダアンテナ６は、レーダ回路２（送信回路）から、接続部８を介して、レーダ信号を入力される。また、レーダアンテナ６は、レーダ信号を、接続部８を介して、レーダ回路２（受信回路）に入力する。接続部８は、銀、銅、アルミニウム、及びカーボンなどの導電性材料により形成される。 The connection unit 8 electrically connects the radar circuit 2 and the radar antenna 6. The radar antenna 6 receives a radar signal from the radar circuit 2 (transmission circuit) via the connection unit 8. The radar antenna 6 also inputs a radar signal to the radar circuit 2 (reception circuit) via the connection unit 8. The connection portion 8 is formed of a conductive material such as silver, copper, aluminum, and carbon.
　なお、図１の例では、接続部８は、樹脂層４に設けられた貫通ビアと、アンテナ基板５に設けられた貫通ビアと、を半田や導電性接着剤により電気的に接続することにより形成されているが、これに限られない。ここでいう貫通ビアは、基板に設けられた貫通孔の内面に導電性材料を塗布又は埋設したものである。接続部８は、樹脂層４に設けられた貫通ビアに代わりに、樹脂層４に埋設された柱状の金属部材を用いて形成されてもよいし、樹脂層４及びアンテナ基板５の側面に設けられた側面電極を電気的に接続することにより形成されてもよい。また、接続部８は、樹脂層４の貫通ビア及びアンテナ基板５の側面電極を電気的に接続することにより形成されてもよいし、樹脂層４の側面電極及びアンテナ基板５の貫通ビアを電気的に接続することにより形成されてもよい。 In the example of FIG. 1, the connection portion 8 is electrically connected by solder or a conductive adhesive to the through via provided in the resin layer 4 and the through via provided in the antenna substrate 5. Although formed, it is not restricted to this. The through via referred to here is one obtained by applying or embedding a conductive material on the inner surface of the through hole provided in the substrate. The connection portion 8 may be formed using a columnar metal member embedded in the resin layer 4 instead of the through via provided in the resin layer 4 or provided on the side surface of the resin layer 4 and the antenna substrate 5 It may be formed by electrically connecting the side electrodes. Further, the connection portion 8 may be formed by electrically connecting the through via of the resin layer 4 and the side electrode of the antenna substrate 5, or the side electrode of the resin layer 4 and the through via of the antenna substrate 5 may be electrically It may form by connecting.
　接続部９は、無線通信回路３と無線通信アンテナ７とを電気的に接続する。無線通信アンテナ７は、無線通信回路３（送信回路）から、接続部９を介して、無線通信信号を入力される。また、無線通信アンテナ７は、無線通信信号を、接続部９を介して、無線通信回路３（受信回路）に入力する。接続部９は、銀、銅、アルミニウム、及びカーボンなどの導電性材料により形成される。 The connection unit 9 electrically connects the wireless communication circuit 3 and the wireless communication antenna 7. The wireless communication antenna 7 receives a wireless communication signal from the wireless communication circuit 3 (transmission circuit) via the connection unit 9. Further, the wireless communication antenna 7 inputs a wireless communication signal to the wireless communication circuit 3 (reception circuit) via the connection unit 9. The connection portion 9 is formed of a conductive material such as silver, copper, aluminum, and carbon.
　なお、図１の例では、接続部９は、樹脂層４に設けられた貫通ビアと、アンテナ基板５に設けられた貫通ビアと、を半田や導電性接着剤により電気的に接続することにより形成されているが、これに限られない。接続部９は、樹脂層４に設けられた貫通ビアに代わりに、樹脂層４に埋設された柱状の金属部材を用いて形成されてもよいし、樹脂層４及びアンテナ基板５の側面に設けられた側面電極を電気的に接続することにより形成されてもよい。また、接続部９は、樹脂層４の貫通ビア及びアンテナ基板５の側面電極を電気的に接続することにより形成されてもよいし、樹脂層４の側面電極及びアンテナ基板５の貫通ビアを電気的に接続することにより形成されてもよい。 In the example of FIG. 1, the connection portion 9 is electrically connected by solder or a conductive adhesive to the through via provided in the resin layer 4 and the through via provided in the antenna substrate 5. Although formed, it is not restricted to this. The connection portion 9 may be formed using a columnar metal member embedded in the resin layer 4 instead of the through via provided in the resin layer 4 or provided on the side surface of the resin layer 4 and the antenna substrate 5 It may be formed by electrically connecting the side electrodes. Further, the connection portion 9 may be formed by electrically connecting the through via of the resin layer 4 and the side electrode of the antenna substrate 5, or the side electrode of the resin layer 4 and the through via of the antenna substrate 5 are electrically It may form by connecting.
　以上説明した通り、本実施形態によれば、レーダ回路２及び無線通信回路３と、レーダアンテナ６及び無線通信アンテナ７と、が上下に積層して配置されるため、回路基板１及びアンテナ基板５に要求される面積を縮小できる。また、アンテナ基板５が樹脂層４の表面に設けられるため、レーダ回路２及び無線通信回路３と、レーダアンテナ６及び無線通信アンテナ７と、を上下に積層して配置するための複雑な構造（例えば、スペーサを介した基板の多段構造など）が不要となる。すなわち、電子装置１００の構造を簡素化できる。結果として、無線通信機能及びレーダ機能を備えた電子装置１００を小型化できる。 As described above, according to the present embodiment, since the radar circuit 2 and the wireless communication circuit 3 and the radar antenna 6 and the wireless communication antenna 7 are vertically stacked, the circuit board 1 and the antenna board 5 are provided. The area required for can be reduced. Further, since the antenna substrate 5 is provided on the surface of the resin layer 4, a complex structure for arranging the radar circuit 2 and the wireless communication circuit 3 and the radar antenna 6 and the wireless communication antenna 7 in layers one above the other For example, the multistage structure of the substrate via the spacer and the like is not necessary. That is, the structure of the electronic device 100 can be simplified. As a result, the electronic device 100 provided with the wireless communication function and the radar function can be miniaturized.
　また、本実施形態によれば、レーダ回路２及び無線通信回路３が樹脂層４により封止されるため、レーダ回路２及び無線通信回路３の保護が容易となる。また、上述の通り、電子装置１００の構造を簡素化できる。これにより、電子装置１００を扱いやすくすることができる。 Further, according to the present embodiment, since the radar circuit 2 and the wireless communication circuit 3 are sealed by the resin layer 4, protection of the radar circuit 2 and the wireless communication circuit 3 is facilitated. Further, as described above, the structure of the electronic device 100 can be simplified. This makes the electronic device 100 easy to handle.
　ここで、図２～図５は、電子装置１００の変形例を示す図である。図２～図５の左図は電子装置１００の側面図であり、図２～図５の右図は電子装置１００の平面図である。 Here, FIGS. 2 to 5 are diagrams showing a modification of the electronic device 100. FIG. The left views of FIGS. 2 to 5 are side views of the electronic device 100, and the right views of FIGS. 2 to 5 are plan views of the electronic device 100.
　図２の電子装置１００は、無線通信アンテナ７が、アンテナ基板５の裏面に設けられている。図２の電子装置１００の他の構成は、図１と電子装置１００と同様である。 In the electronic device 100 of FIG. 2, the wireless communication antenna 7 is provided on the back surface of the antenna substrate 5. The other configuration of the electronic device 100 of FIG. 2 is similar to that of FIG. 1 and the electronic device 100.
　このような構成により、図１の電子装置１００と同様に、電子装置１００を小型化し、かつ、扱いやすくすることができる。 With such a configuration, as in the electronic device 100 of FIG. 1, the electronic device 100 can be miniaturized and easy to handle.
　なお、レーダアンテナ６をアンテナ基板５の裏面に設け、無線通信アンテナ７をアンテナ基板５の表面に設けてもよい。また、レーダアンテナ６及び無線通信アンテナ７の両方をアンテナ基板５の裏面に設けてもよい。いずれの場合も、図２の電子装置１００と同様の効果が得られる。 The radar antenna 6 may be provided on the back surface of the antenna substrate 5, and the wireless communication antenna 7 may be provided on the surface of the antenna substrate 5. Alternatively, both the radar antenna 6 and the wireless communication antenna 7 may be provided on the back surface of the antenna substrate 5. In any case, the same effect as the electronic device 100 of FIG. 2 can be obtained.
　図３の電子装置１００は、無線通信アンテナ７が、回路基板１の裏面に設けられている。図３の電子装置１００の他の構成は、図１と電子装置１００と同様である。 In the electronic device 100 of FIG. 3, the wireless communication antenna 7 is provided on the back surface of the circuit board 1. The other configuration of the electronic device 100 of FIG. 3 is similar to that of FIG. 1 and the electronic device 100.
　このような構成により、図１の電子装置１００と同様に、電子装置１００を小型化し、かつ、扱いやすくすることができる。また、レーダアンテナ６及び無線通信アンテナ７の間の距離が大きくなり、かつ、レーダアンテナ６及び無線通信アンテナ７が、回路基板１、樹脂層４、及びアンテナ基板５により隔てられる。これにより、レーダアンテナ６及び無線通信アンテナ７の間の電波干渉が小さくなるため、電波干渉によるレーダ性能や無線通信品質の低下を抑制しつつ、レーダアンテナ６及び無線通信アンテナ７を対向する位置に配置することができる。すなわち、レーダアンテナ６をアンテナ基板５の中央部に配置し、無線通信アンテナ７を回路基板１の中央部に配置することができる。この結果、アンテナ基板５及び回路基板１に要求される面積をさらに縮小し、電子装置１００をより小型化することができる。 With such a configuration, as in the electronic device 100 of FIG. 1, the electronic device 100 can be miniaturized and easy to handle. Further, the distance between the radar antenna 6 and the wireless communication antenna 7 is increased, and the radar antenna 6 and the wireless communication antenna 7 are separated by the circuit board 1, the resin layer 4, and the antenna substrate 5. Thereby, the radio wave interference between the radar antenna 6 and the wireless communication antenna 7 is reduced, so that the radar antenna 6 and the wireless communication antenna 7 are opposed to each other while suppressing the deterioration of the radar performance and the wireless communication quality by the radio wave interference. It can be arranged. That is, the radar antenna 6 can be disposed at the central portion of the antenna substrate 5, and the wireless communication antenna 7 can be disposed at the central portion of the circuit substrate 1. As a result, the area required for the antenna substrate 5 and the circuit substrate 1 can be further reduced, and the electronic device 100 can be further miniaturized.
　なお、レーダアンテナ６を回路基板１の裏面に設け、無線通信アンテナ７をアンテナ基板５の表面に設けてもよい。また、レーダアンテナ６及び無線通信アンテナ７の一方を回路基板１の裏面に設け、他方をアンテナ基板５の裏面に設けてもよい。いずれの場合も、図３の電子装置１００と同様の効果が得られる。 The radar antenna 6 may be provided on the back surface of the circuit board 1, and the wireless communication antenna 7 may be provided on the front surface of the antenna substrate 5. Alternatively, one of the radar antenna 6 and the wireless communication antenna 7 may be provided on the back surface of the circuit board 1, and the other may be provided on the back surface of the antenna substrate 5. In any case, the same effect as the electronic device 100 of FIG. 3 can be obtained.
　図４の電子装置１００は、樹脂層４の表面にアンテナ基板１０（第２アンテナ基板）が設けられ、レーダアンテナ６がアンテナ基板５の表面に設けられ、メアンダ形状の無線通信アンテナ７がアンテナ基板１０の表面に設けられている。アンテナ基板１０は、アンテナ基板５と離間して配置される。図４の電子装置１００の他の構成は、図１と電子装置１００と同様である。 In the electronic device 100 of FIG. 4, the antenna substrate 10 (second antenna substrate) is provided on the surface of the resin layer 4, the radar antenna 6 is provided on the surface of the antenna substrate 5, and the wireless communication antenna 7 of meander shape is the antenna substrate It is provided on the surface of ten. The antenna substrate 10 is disposed apart from the antenna substrate 5. The other configuration of the electronic device 100 of FIG. 4 is the same as that of FIG. 1 and the electronic device 100.
　このような構成により、図１の電子装置１００と同様に、電子装置１００を小型化し、かつ、扱いやすくすることができる。また、レーダアンテナ６及び無線通信アンテナ７の間の距離が大きくなり、かつ、レーダアンテナ６が設けられたアンテナ基板５と、無線通信アンテナ７が設けられたアンテナ基板１０とが、間隙を介して隔てて配置される。これにより、レーダアンテナ６及び無線通信アンテナ７の間の電波干渉が小さくなるため、電波干渉によるレーダ性能や無線通信品質の低下を抑制できる。 With such a configuration, as in the electronic device 100 of FIG. 1, the electronic device 100 can be miniaturized and easy to handle. In addition, the distance between the radar antenna 6 and the wireless communication antenna 7 is increased, and the antenna substrate 5 provided with the radar antenna 6 and the antenna substrate 10 provided with the wireless communication antenna 7 are separated by a gap. It is placed apart. As a result, radio wave interference between the radar antenna 6 and the wireless communication antenna 7 is reduced, so that it is possible to suppress the deterioration of the radar performance and the radio communication quality due to the radio wave interference.
　なお、レーダアンテナ６をアンテナ基板５の裏面に設けてもよいし、無線通信アンテナ７をアンテナ基板１０の裏面に設けてもよい。いずれの場合も、図４の電子装置１００と同様の効果が得られる。 The radar antenna 6 may be provided on the back surface of the antenna substrate 5, and the wireless communication antenna 7 may be provided on the back surface of the antenna substrate 10. In any case, the same effect as the electronic device 100 of FIG. 4 can be obtained.
　図５の電子装置１００は、アンテナ基板５を備えず、レーダアンテナ６及び無線通信アンテナ７が、樹脂層４の表面に設けられる。図５の電子装置１００の他の構成は、図１と電子装置１００と同様である。 The electronic device 100 of FIG. 5 does not include the antenna substrate 5, and the radar antenna 6 and the wireless communication antenna 7 are provided on the surface of the resin layer 4. The other configuration of the electronic device 100 of FIG. 5 is similar to that of FIG. 1 and the electronic device 100.
　このような構成により、図１の電子装置１００と同様に、電子装置１００を小型化し、かつ、扱いやすくすることができる。また、アンテナ基板５が不要となるため、電子装置１００をより小型化し、製造コストを低減できる。 With such a configuration, as in the electronic device 100 of FIG. 1, the electronic device 100 can be miniaturized and easy to handle. Further, since the antenna substrate 5 is not necessary, the electronic device 100 can be further miniaturized, and the manufacturing cost can be reduced.
　なお、レーダアンテナ６及び無線通信アンテナ７の一方を樹脂層４の表面に設け、他方を回路基板１の裏面に設けることも可能である。これにより、図３の電子装置１００と同様に、電波干渉によるレーダ性能や無線通信品質の低下を抑制しつつ、レーダアンテナ６及び無線通信アンテナ７を対向する位置に配置することができる。すなわち、レーダアンテナ６及び無線通信アンテナ７の一方を樹脂層４の中央部に配置し、他方を回路基板１の中央部に配置することができる。この結果、樹脂層４及び回路基板１に要求される面積をさらに縮小し、電子装置１００をより小型化することができる。 It is also possible to provide one of the radar antenna 6 and the wireless communication antenna 7 on the surface of the resin layer 4 and the other on the back surface of the circuit board 1. Thus, as with the electronic device 100 of FIG. 3, the radar antenna 6 and the wireless communication antenna 7 can be disposed at opposing positions while suppressing the deterioration of the radar performance and the wireless communication quality due to radio wave interference. That is, one of the radar antenna 6 and the wireless communication antenna 7 can be disposed at the central portion of the resin layer 4, and the other can be disposed at the central portion of the circuit board 1. As a result, the area required for the resin layer 4 and the circuit board 1 can be further reduced, and the electronic device 100 can be further miniaturized.
　なお、上記実施形態に挙げた構成等に、その他の要素との組み合わせなど、ここで示した構成に本発明が限定されるものではない。これらの点に関しては、本発明の趣旨を逸脱しない範囲で変更可能であり、その応用形態に応じて適切に定めることができる。 Note that the present invention is not limited to the configurations shown here, such as combinations with other elements in the configurations and the like described in the above embodiments. These points can be changed without departing from the spirit of the present invention, and can be appropriately determined according to the application form.
　また、本国際出願は、２０１７年７月１８日に出願した日本国特許出願第２０１７－１３８８４８号に基づく優先権を主張するものであり、当該出願の全内容を本国際出願に援用する。 In addition, this international application claims priority based on Japanese Patent Application No. 2017-138848 filed on July 18, 2017, and the entire content of the application is incorporated into this international application.
１：回路基板
２：レーダ回路
３：無線通信回路
４：樹脂層
５：アンテナ基板
６：レーダアンテナ
７：無線通信アンテナ
８，９：接続部
１０：アンテナ基板
１００：電子装置 1: Circuit board 2: Radar circuit 3: Wireless communication circuit 4: Resin layer 5: Antenna board 6: Radar antenna 7: Wireless communication antenna 8, 9: Connection part 10: Antenna board 100: Electronic device

Claims (9)

  1. 　回路基板と、
    　前記回路基板の表面に設けられ、レーダ用の信号の送受信処理を行うレーダ回路と、
    　前記回路基板の表面に設けられ、無線通信用の信号の送受信処理を行う無線通信回路と、
    　前記レーダ回路及び前記無線通信回路を封止する樹脂層と、
    　前記樹脂層の表面に設けられた第１アンテナ基板と、
    　前記レーダ回路に接続されたレーダアンテナと、
    　前記無線通信回路に接続された無線通信アンテナと、
    を備え、
    　前記レーダアンテナ及び前記無線通信アンテナの少なくとも一方は、前記第１アンテナ基板に設けられる
    電子装置。     Circuit board,
    A radar circuit provided on the surface of the circuit board and performing transmission / reception processing of a signal for radar;
    A wireless communication circuit provided on the surface of the circuit board and performing transmission / reception processing of a signal for wireless communication;
    A resin layer sealing the radar circuit and the wireless communication circuit;
    A first antenna substrate provided on the surface of the resin layer;
    A radar antenna connected to the radar circuit;
    A wireless communication antenna connected to the wireless communication circuit;
    Equipped with
    An electronic apparatus, wherein at least one of the radar antenna and the wireless communication antenna is provided on the first antenna substrate.
  2. 　前記レーダアンテナ及び前記無線通信アンテナは、前記第１アンテナ基板の一方の面に設けられる
    請求項１に記載の電子装置。     The electronic device according to claim 1, wherein the radar antenna and the wireless communication antenna are provided on one surface of the first antenna substrate.
  3. 　前記レーダアンテナは、前記第１アンテナ基板の一方の面に設けられ、
    　前記無線通信アンテナは、前記第１アンテナ基板の他方の面に設けられる
    請求項１に記載の電子装置。     The radar antenna is provided on one surface of the first antenna substrate,
    The electronic device according to claim 1, wherein the wireless communication antenna is provided on the other surface of the first antenna substrate.
  4. 　前記レーダアンテナ及び前記無線通信アンテナは、一方が前記第１アンテナ基板の一方の面に設けられ、他方が前記回路基板の裏面に設けられる
    請求項１に記載の電子装置。     The electronic device according to claim 1, wherein one of the radar antenna and the wireless communication antenna is provided on one surface of the first antenna substrate, and the other is provided on the back surface of the circuit board.
  5. 　前記樹脂層の表面に、前記第１アンテナ基板と離間して設けられた第２アンテナ基板を更に備え、
    　前記レーダアンテナは、前記第１アンテナ基板に設けられ、
    　前記無線通信アンテナは、前記第２アンテナ基板に設けられる
    請求項１に記載の電子装置。     And a second antenna substrate provided on the surface of the resin layer so as to be spaced apart from the first antenna substrate.
    The radar antenna is provided on the first antenna substrate,
    The electronic device according to claim 1, wherein the wireless communication antenna is provided on the second antenna substrate.
  6. 　前記レーダアンテナは、前記第１アンテナ基板の中央部に設けられ、
    　前記無線通信アンテナは、前記第１アンテナ基板の外周部に設けられる
    請求項１から請求項３までのいずれか１項に記載の電子装置。     The radar antenna is provided at a central portion of the first antenna substrate.
    The electronic device according to any one of claims 1 to 3, wherein the wireless communication antenna is provided on an outer peripheral portion of the first antenna substrate.
  7. 　前記レーダアンテナは、矩形又は円形の平面アンテナである
    請求項１から請求項６までのいずれか１項に記載の電子装置。     The electronic apparatus according to any one of claims 1 to 6, wherein the radar antenna is a rectangular or circular planar antenna.
  8. 　前記無線通信アンテナは、スパイラル形状又はメアンダ形状の平面アンテナである
    請求項１から請求項７までのいずれか１項に記載の電子装置。     The electronic device according to any one of claims 1 to 7, wherein the wireless communication antenna is a flat antenna having a spiral shape or a meander shape.
  9. 　回路基板と、
    　前記回路基板の表面に設けられ、レーダ用の信号の送受信処理を行うレーダ回路と、
    　前記回路基板の表面に設けられ、無線通信用の信号の送受信処理を行う無線通信回路と、
    　前記レーダ回路及び前記無線通信回路を封止する樹脂層と、
    　前記レーダ回路に接続されたレーダアンテナと、
    　前記無線通信回路に接続された無線通信アンテナと、
    を備え、
    　前記レーダアンテナ及び前記無線通信アンテナの少なくとも一方は、前記樹脂層の表面に設けられる
    電子装置。     Circuit board,
    A radar circuit provided on the surface of the circuit board and performing transmission / reception processing of a signal for radar;
    A wireless communication circuit provided on the surface of the circuit board and performing transmission / reception processing of a signal for wireless communication;
    A resin layer sealing the radar circuit and the wireless communication circuit;
    A radar antenna connected to the radar circuit;
    A wireless communication antenna connected to the wireless communication circuit;
    Equipped with
    An electronic device, wherein at least one of the radar antenna and the wireless communication antenna is provided on a surface of the resin layer.
PCT/JP2018/006919 2017-07-18 2018-02-26 Electronic device WO2019016995A1 (en)

Applications Claiming Priority (2)

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JP2017138848A JP2020161853A (en) 2017-07-18 2017-07-18 Electronic apparatus
JP2017-138848 2017-07-18

Publications (1)

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WO2019016995A1 true WO2019016995A1 (en) 2019-01-24

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252515A (en) * 2001-02-22 2002-09-06 Murata Mfg Co Ltd Antenna device
JP2007129304A (en) * 2005-11-01 2007-05-24 Taiyo Yuden Co Ltd High frequency wireless module
JP2016197061A (en) * 2015-04-03 2016-11-24 株式会社日本自動車部品総合研究所 Vehicle antenna unit and direction estimation system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252515A (en) * 2001-02-22 2002-09-06 Murata Mfg Co Ltd Antenna device
JP2007129304A (en) * 2005-11-01 2007-05-24 Taiyo Yuden Co Ltd High frequency wireless module
JP2016197061A (en) * 2015-04-03 2016-11-24 株式会社日本自動車部品総合研究所 Vehicle antenna unit and direction estimation system

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