WO2019015128A1

WO2019015128A1 - Heat insulation box for both cooling and heating

Info

Publication number: WO2019015128A1
Application number: PCT/CN2017/105229
Authority: WO
Inventors: 袁泽昊
Original assignee: 袁泽昊
Priority date: 2017-07-18
Filing date: 2017-10-01
Publication date: 2019-01-24
Also published as: CN207329276U

Abstract

Disclosed is a heat insulation box for both cooling and heating. The heat insulation box comprises a box body (10) composed of a heat insulation structure and having an accommodation cavity (11). A temperature control device (20) is provided below the accommodation cavity (11) in the box body (10). The temperature control device (20) comprises a heat conduction block (21) placed at the bottom of the accommodation cavity (11), a semi-conductor refrigeration sheet (22) detachably arranged below the heat conduction block (21), and a heat dissipation structure (23) located below the semi-conductor refrigeration sheet (22). The technical solution solves the technical problems that the existing heat insulation box cannot maintain a constant temperature and the temperature in the heat insulation box cannot be regulated.

Description

A heating and cooling incubator

Technical field

The utility model relates to the technical field of thermal insulation boxes, in particular to an insulation box for heating and cooling.

Background technique

The incubator is a bag with insulation properties. At present, the incubator only has the function of keeping warm or keeping cold. No matter how strong the heat preservation capacity is, there will still be loss of heat or cold, and the temperature in the incubator cannot be kept constant, and the temperature in the incubator cannot be adjusted.

Utility model content

The object of the present invention is to provide an insulated box for heating and cooling, which solves the technical problem that the existing incubator cannot maintain a constant temperature and cannot adjust the temperature inside the incubator by using the technical solution provided by the utility model.

In order to achieve the above object, the technical solution adopted by the utility model is: a heat and cold insulation box, comprising a box body composed of a heat insulating structure and having a receiving cavity, wherein the box body is located in the box body. A temperature control device is formed under the chamber; the temperature control device includes a heat conducting block disposed at the bottom of the accommodating chamber, a semiconductor refrigeration sheet detachably disposed under the heat conducting block, and a semiconductor cooling sheet located under the semiconductor cooling sheet Heat dissipation structure.

Preferably, a cavity for placing the semiconductor refrigerating sheet is disposed under the accommodating cavity on the casing; one end surface of the semiconductor refrigerating sheet is in contact with a bottom surface of the heat conducting block, and the other end surface is In contact with the heat dissipation structure.

Preferably, a handle for extracting the semiconductor refrigerating sheet is provided on one side of the semiconductor refrigerating sheet, and a set of metal contacts is formed on the other side; the metal contact is located on one side of the side surface; a power contact electrically connected to an external power source is formed on a sidewall of the cavity; the power contact includes a first power contact and a second power contact; the first power contact and the metal The contacts are matched, and the second power contact is obtained by rotating the first power contact by 180° centering on the geometric center of the side of the semiconductor refrigerating sheet.

Preferably, the method further includes a temperature-controlled digital display motherboard connected in series between the external power source and the power contact.

Preferably, a temperature sensor electrically connected to the temperature control digital display board is formed in the accommodating cavity.

Preferably, the heat dissipation structure comprises a heat sink and a heat dissipation fan located under the heat sink; the heat sink is in contact with the semiconductor refrigeration sheet.

Preferably, the heat conducting block is a thermal conductive layer of silica gel.

It can be seen from the above that the technical solution provided by the embodiment of the present invention has the following beneficial effects. The utility model has a detachable semiconductor refrigeration chip at the bottom of the incubator, and the semiconductor refrigerating sheet is passed through The heating or cooling in the incubator can solve the problem that the existing incubator can only be insulated and cannot change the temperature of the contents, and the volume of the original incubator is basically unchanged, high-efficiency and practical, and the hot and cold switching is realized through special contact design.

DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings to be used in the embodiments of the present invention or the description of the prior art will be briefly described below. Obviously, the drawings in the following description are only a part of the embodiments of the present invention, and those skilled in the art can obtain other drawings according to the drawings without any inventive labor.

Figure 1 is a schematic structural view of an embodiment;

2 is a schematic view showing the structure of a metal contact and a power contact of an embodiment.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. It is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

The current incubator only has the function of heat preservation or cold preservation, no matter how strong the insulation capacity is, there will still be heat. The loss of the amount or the amount of cold does not keep the temperature inside the incubator constant, and the temperature inside the incubator cannot be adjusted.

In order to solve the above technical problem, referring to FIG. 1 , the embodiment provides a thermal insulation box for heating and cooling, the thermal insulation box includes a casing 10 having a receiving cavity 11 , and the casing 10 can be insulated or separated. The thermal structure is composed, and the cover body can be connected with the box body by using a thread or a buckle.

A temperature control device 20 is formed below the accommodating cavity 11 in the casing 10. The temperature control device 20 includes a heat conducting block 21 disposed at the bottom of the accommodating cavity 11 and a semiconductor cooling sheet 22 detachably disposed under the heat conducting block 21.

Specifically, a cavity 12 for placing the semiconductor refrigerating sheet 22 is disposed below the accommodating cavity 11 on the casing 10. After the semiconductor refrigerating sheet 22 is placed in the cavity 12, an end surface of the semiconductor refrigerating sheet 22 is in contact with the bottom surface of the heat conducting block 21, and the end surface may be a cold end surface or a hot end surface of the semiconductor refrigerating sheet 22, and when it is necessary to heat the housing 10 When the end face is the hot end face of the semiconductor refrigerating sheet 22, when the case 10 needs to be cooled, the end face is the cold end face of the semiconductor refrigerating sheet 22; the other end face is in contact with the heat dissipating structure 23. The heat conducting block 21 can be a thermal conductive layer of silica gel.

The incubator provided in this embodiment is provided with a detachable semiconductor refrigerating sheet 22 at the bottom of the box body 10. The heating or cooling of the incubator is realized by the semiconductor refrigerating sheet 22, and the loss of heat and cold can be offset not only by heating or cooling. Ensure that the tank 10 is at a constant temperature and that the temperature of the contents is also Cause changes, such as putting a normal temperature beverage into a cold drink or even ice cubes; heating the cold water to a high temperature, etc. In the heating mode, the heat generated is the heat transferred to the hot end plus the heat generated by the self-resistance heat, so It can heat up efficiently. Solve the problem that the existing incubator can only keep warm, can not change the temperature of the contents, and the volume of the original incubator is basically unchanged, and it is efficient and practical.

In order to switch between the cooling and heating functions of the semiconductor refrigerating sheet 22, a handle 221 for extracting the semiconductor refrigerating sheet 22 from the cavity 12 is provided on one side of the semiconductor refrigerating sheet 22, and a set of metal contacts is formed on the other side. 222, the metal contact 222 is located on one side of the side. A power contact electrically connected to the external power source is formed on the sidewall of the cavity 12, and the power contact includes a first power contact 121 and a second power contact 122. The first power contact 121 is matched with the metal contact 222, and the second power contact 122 is obtained by rotating the first power contact 121 by 180° from the geometric center of the side surface of the semiconductor refrigerating sheet 22. The external power supply electrically connected to the power contact can input electric energy through the universal 12VDC socket 13, and can supply electric energy through the battery, the solar battery, the power adapter and the car cigarette lighter interface. At the same time, the power contact can be electrically shocked by the spring, so that the metal contact 222 continues to be energized after being turned over.

Referring to FIG. 2, when the case 10 needs to be heated, the semiconductor refrigerating sheet 22 is inserted into the cavity 12, and the metal contact 222 is in contact with the first power contact 121 on the inner side wall of the cavity 12, and the semiconductor refrigerating sheet 22 is Conductively and generating heat at the end face in contact with the heat conducting block 21, thereby achieving heating of the casing 10; when the casing 10 needs to be cooled, the semiconductor refrigeration sheet 22 is withdrawn and turned 180° to make the metal contact 222 After the semiconductor refrigerating sheet 22 is inserted into the cavity 12, the metal contact 222 is in contact with the second power contact 122, so that the current direction of the semiconductor refrigerating sheet 22 is reversed, and the semiconductor refrigerating sheet 22 is in contact with the thermal block 21. The end face generates a low temperature absorbing heat, thereby achieving the refrigeration of the casing 10. It should be noted that, since the heat conducting block 21 is a flexible silicone heat conducting layer, although the semiconductor refrigerating sheet 22 needs to be repeatedly extracted and inserted into the cavity 12 during use, the semiconductor refrigerating sheet 22 is still close to the heat conducting block 21. The contact ensures the exchange of heat between the semiconductor refrigerating sheet 22 and the accommodating chamber 11.

During the cooling process of the casing 10, the end surface of the semiconductor refrigerating sheet 22 that is in contact with the heat conducting block 21 is a cold end surface, and the other end is a hot end surface, which generates a large amount of heat. In order to avoid the high temperature affecting the normal operation of the semiconductor refrigerating sheet 22, in the semiconductor A heat dissipation structure 23 is disposed below the cooling fins 22. The heat dissipation structure 23 includes a heat sink 231 and a heat dissipation fan 232 located below the heat sink 231, and the heat sink 231 is in contact with the semiconductor refrigeration sheet 22.

In order to improve the practicability of the incubator, the temperature control digital display board 30 is connected in series between the external power source and the power contact, and the temperature sensor 40 electrically connected to the temperature control digital display main board 30 is formed in the accommodating cavity 11. . After the incubator is connected to the power supply, the temperature in the current incubator will be displayed. The temperature is set by the digital display plus or minus button. After the setting is completed, the main board 30 automatically controls the semiconductor refrigerating piece 22 to be energized until the set temperature is reached, and the heat is dissipated. The fan 232 is turned on.

The embodiments described above do not constitute a limitation on the scope of protection of the technical solutions. Anything at Modifications, equivalent substitutions and improvements made within the spirit and principles of the above-described embodiments are intended to be included within the scope of the technical solutions.

Claims

The invention relates to a heat-insulating box for heating and cooling, comprising a box body composed of a heat insulating structure and having a receiving cavity, wherein: a temperature control device is formed below the receiving cavity in the box body; The temperature control device includes a heat conducting block disposed at the bottom of the accommodating cavity, a semiconductor cooling sheet detachably disposed under the heat conducting block, and a heat dissipation structure located under the semiconductor cooling sheet.
A heat-insulating incubator according to claim 1, wherein a cavity for placing the semiconductor refrigerating sheet is disposed below the accommodating cavity on the casing; the semiconductor One end surface of the cooling sheet is in contact with the bottom surface of the heat conducting block, and the other end surface is in contact with the heat dissipating structure.
A heat-insulating incubator according to claim 2, wherein a handle for extracting said semiconductor refrigerating sheet is provided on one side of said semiconductor refrigerating sheet, and a set of metal is formed on the other side a contact; the metal contact is located at one side of the side; a power contact electrically connected to an external power source is formed on a sidewall of the cavity; the power contact includes a first power contact and a second power contact; the first power contact is matched to the metal contact, and the second power contact is a rotation of the first power contact centered on a side geometric center of the semiconductor refrigerating sheet Obtained at 180°.
A heat-insulating incubator according to claim 3, further comprising a temperature-controlled digital display motherboard connected in series between said external power source and said power contact.
The incubator for heating and cooling according to claim 4, wherein a temperature sensor electrically connected to the temperature-controlled digital display main board is formed in the accommodating cavity.
A heat-insulating incubator according to claim 5, wherein the heat dissipating structure comprises a heat sink and a heat dissipating fan located below the heat sink; the heat sink is in contact with the semiconductor refrigerating sheet.
The heat-insulating incubator according to claim 6, wherein the heat-conducting block is a heat-conducting layer of a silica gel.