WO2019010974A1 - Backlight module and liquid crystal display device - Google Patents

Backlight module and liquid crystal display device Download PDF

Info

Publication number
WO2019010974A1
WO2019010974A1 PCT/CN2018/076288 CN2018076288W WO2019010974A1 WO 2019010974 A1 WO2019010974 A1 WO 2019010974A1 CN 2018076288 W CN2018076288 W CN 2018076288W WO 2019010974 A1 WO2019010974 A1 WO 2019010974A1
Authority
WO
WIPO (PCT)
Prior art keywords
pcb
backlight module
back plate
led lamp
liquid crystal
Prior art date
Application number
PCT/CN2018/076288
Other languages
French (fr)
Chinese (zh)
Inventor
唐志强
Original Assignee
青岛海信电器股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 青岛海信电器股份有限公司 filed Critical 青岛海信电器股份有限公司
Publication of WO2019010974A1 publication Critical patent/WO2019010974A1/en

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133615Edge-illuminating devices, i.e. illuminating from the side
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133608Direct backlight including particular frames or supporting means
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133628Illuminating devices with cooling means

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a backlight module and a liquid crystal display device.
  • the display device 100 includes a front frame 110 , a liquid crystal panel 111 , a light guide plate 112 , a back plate 113 , and a heat sink 114 on a lower surface of the back plate 113 , a driving plate 115 and a flexible connection between the liquid crystal panel and the driving board.
  • the circuit board 116 wherein the light guide plate 112 includes a light incident side on a side surface thereof, the heat sink 114 includes a bottom plate fixed to a lower surface of the back plate 113 and a vertical plate disposed opposite to the light incident side, and the display device further includes a light guide plate 112 a printed circuit board (PCB) 118 disposed opposite to the light incident side and disposed on the vertical plate of the heat sink 114, and a light emitting diode (LED) lamp 117 disposed on a side of the printed circuit board opposite to the light incident surface, the front frame 110
  • the first bottom edge extending along the display surface of the liquid crystal panel and the second vertical edge perpendicular to the first bottom edge are formed, and an accommodation gap is formed between the vertical plate of the heat sink 114 and the second vertical edge for driving the liquid crystal panel.
  • the driving board 115 is disposed under the bottom plate of the heat sink 114, and realizes connection with the liquid crystal panel 111 through the flexible circuit board 116 disposed in the accommodating gap, wherein the heat sink 114 helps to transmit and emit the LED lamp 117 and the PCB 118 when working. Heat, guaranteed Normal operation of the apparatus 100.
  • an embodiment of the present disclosure provides a backlight module, including: a light guide plate, a back plate, a front frame, an LED lamp, and a PCB, wherein the light guide plate includes a light incident side on a side thereof;
  • the back plate is disposed under the light guide plate, and the length of the back plate is greater than the length of the light guide plate in a direction of the light entrance side toward the LED lamp;
  • the front frame includes a parallel with the back plate And connecting a first bottom edge extending in a direction of the light incident side toward the LED lamp, and connecting the back board and the first side on a side of the first bottom side away from the light incident side a first vertical side of the bottom edge and perpendicular to the back plate and the first bottom edge;
  • the LED lamp is disposed opposite to a light incident side of the light guide plate;
  • the PCB is away from the light incident side Laying over the back panel and electrically connecting with the LED lamp;
  • the first bottom edge, the first vertical edge and the back panel form an accommodating
  • the present application provides a liquid crystal display device, including a liquid crystal panel and any of the above backlight modules, wherein the backlight module is disposed opposite to the liquid crystal panel, and the liquid crystal panel is located in the backlight module The upper surface of the group.
  • FIG. 1 is a schematic structural view of a related art backlight module and a liquid crystal display device thereof;
  • FIG. 2 is a schematic structural diagram of a backlight module and a liquid crystal display device thereof according to some embodiments of the present disclosure
  • FIG. 3 is a schematic structural view of an LED lamp and a PCB in some embodiments of the present disclosure
  • FIG. 4 is a schematic structural view of a PCB and a back plate fixed by screws according to some embodiments of the present disclosure
  • FIG. 5 is a schematic structural diagram of a backlight module and a liquid crystal display device thereof according to other embodiments of the present disclosure.
  • the liquid crystal display device is more and more popular among consumers because of its small footprint and thin appearance.
  • the heat sink and the driving board are disposed under the backing plate and superposed to form a convex step structure.
  • the backlight of the backlight module 200 is a side-lit backlight.
  • the backlight module 200 includes a light guide plate 210, a back plate 211, a front frame 212, an LED lamp 213, and a PCB 214, wherein the light guide plate 210 includes a light incident side on a side thereof; the back plate 211 is disposed at Below the light guide plate 210, and in the direction of the light incident side toward the LED lamp 213, the length of the back plate 211 is greater than the length of the light guide plate 210; the front frame 212 includes a side parallel to the back plate 211 and toward the LED lamp 213 on the light incident side.
  • the LED 213 is disposed opposite to the light incident side of the light guide plate 210; the PCB 214 is disposed above the back plate 211 in a direction away from the light incident side and electrically connected to the LED lamp 213.
  • the PCB 214 is a PCB board of a plastic substrate in some embodiments, and a PCB board of a metal substrate in other embodiments.
  • the first bottom edge 2121, the first vertical side 2122 and the back plate 211 form an accommodating space for arranging the LED lamp 213 and the PCB 214.
  • the back plate is only slightly larger than the light guide plate, and only the limit of the light guide plate is required.
  • the back plate 211 since the back plate 211 needs to conduct and dissipate the heat generated when the LED lamp 117 and the PCB 118 operate to perform heat dissipation, the back plate 211 needs to have better thermal conductivity, and the embodiment preferably has better thermal conductivity.
  • the aluminum material is used to make the back plate 211, and the heat conduction function of the back plate 211 is realized while realizing the supporting and fixing action of the back plate 211.
  • the use of the back plate 211 having better thermal conductivity integrates the heat dissipation effect of the heat sink and the support function of the back plate 211 itself, reduces the space occupied by the heat sink in the thickness direction, and achieves thinning of the overall thickness of the display device.
  • the PCB 214 in order to make full use of the accommodating space formed between the first bottom plate 2121, the first vertical side 2122, and the back plate 211, and effectively utilize the heat conduction effect of the back plate 211, the PCB 214 can be used.
  • the shape is designed to be L-shaped, and the L-shaped PCB 214 includes a standing side 2141 connected to the LED lamp 213 and a bottom side 2142 disposed opposite to the backing plate 211.
  • the vertical side 2141 is disposed opposite to the light incident side of the light guide plate 210, and the LED lamp is disposed on a side of the vertical side 2141 facing the light incident side.
  • the vertical side 2141 and the bottom side 2142 of the L-shaped PCB 214 are not strictly right angles and may have errors.
  • the upside 2141 and the bottom side 2142 may be flat plates or may be formed with some relief structures.
  • an accommodating space extending along the surface of the display device is formed, and a PCB that generates more heat and takes up a larger space is disposed in the accommodating space, and is away from The direction of the light entrance side is laid on the surface of the back plate, which ensures the effective contact area between the PCB and the back plate having the heat dissipation effect, thereby further reducing the overall thickness of the display device on the basis of realizing the heat dissipation of the PCB.
  • the heat generation of the trace layer of the PCB 214 and the heat generation of the LED lamp 213 are the two main sources of heat.
  • the wiring layer of the PCB 214 is disposed on the vertical side 2141 of the PCB 214 opposite to the light incident side of the light guide plate 210, and The bottom side 2142 of the PCB 214 opposite the backing plate 211.
  • the backlight module 200 includes a plurality of LED lights 213, and the plurality of LED lights are uniform.
  • the layout is installed on the vertical side 2141 of the PCB 214.
  • the PCB 214 provides power for the LED lamp 213 and controls the brightness of the LED lamp 213, so that the LED lamp 213 provides a uniform backlight for the display device.
  • the PCB 214 is laid on the backplane 211, in order to balance the fixing of the PCB 214 and ensure the heat generated by the PCB 214 and the LED lamp 213 through the backing plate 211 for heat conduction and heat dissipation.
  • the PCB 214 can be fixed on the back plate 211 by using the thermal conductive adhesive 215, that is, the thermal conductive adhesive 215 is disposed between the PCB 214 and the back plate 211 to achieve fixation and heat conduction, and the use of the thermal conductive adhesive 215 can be effective.
  • the conduction efficiency of the heat generated by the PCB 214 and the LED lamp 213 is improved to ensure the normal operation of the display device.
  • one side of the wiring layer of the PCB 214 is attached to the back plate 211 by a thermal adhesive 215.
  • the side of the bottom side 2142 of the PCB 214 on which the wiring layer is disposed may be attached to the backing plate 211 by a thermal adhesive.
  • the PCB 214 is laid on the back plate 211 in a fixed manner by means of screws 218.
  • the PCB 214 is fixed on the back plate 211 by screws 218.
  • the effect of transferring the heat generated by the PCB 214 to the back plate 211 is inferior to that of fixing through the thermal conductive adhesive, the fixing effect is better, and the PCB 214 is not fixed to the back plate 211.
  • the PDB 214 can be simultaneously secured to the backing plate 211 by thermally conductive glue and screws, thereby achieving better heat dissipation and fixation at the same time.
  • the driving board 216 included in the backlight module 200 for driving the liquid crystal panel is also disposed in the accommodating space.
  • the driving board 216 may be disposed at Above the PCB 214, not only can the accommodating space be effectively utilized, but also the overall reduction of the display device can be further achieved by transferring the thickness of the driving board 216 superimposed on the thickness of the display device to the accommodating space in the horizontal direction. It is thin and realizes the planar design of the back of the display device.
  • FIG. 5 is a schematic structural view of a backlight module and a liquid crystal display device thereof in other embodiments of the present disclosure.
  • the embodiment shown in FIG. 5 is substantially the same as the embodiment shown in FIG. 4, except that in the embodiment shown in FIG. 5, the driving board 216 is disposed above the back board 211 in parallel with the PCB 214.
  • the PCB 214 is disposed above the backplane 211, which in turn is disposed over the PCB 214.
  • the PCB 214 and the back plate 211 are fixed by screws 218, but the disclosure is not limited thereto.
  • the PCB 214 may be attached to the back plate by a thermal adhesive. 211.
  • Some embodiments of the present disclosure provide a backlight module and a liquid crystal display device, wherein the backlight module includes a light guide plate, a back plate, a front frame, an LED lamp, and a PCB, and the light guide plate includes a light incident side on a side thereof.
  • the back plate is disposed under the light guide plate, and the length of the back plate is greater than the length of the light guide plate in the direction of the light incident side toward the LED lamp
  • the front frame includes a parallel to the back plate and is oriented on the light incident side a first bottom edge extending in a direction of the LED lamp, and a side of the first bottom edge away from the light incident side connecting the back plate and the first bottom edge and the back plate and the first bottom
  • the first vertical side of the vertical side, the LED light is opposite to the light incident side of the light guide plate, and the PCB is laid above the back plate in a direction away from the light incident side and electrically connected with the LED light, the first bottom edge, the first The vertical side and the back plate form an accommodating space for arranging the LED lamp and the PCB.
  • heat conduction and dissipation are implemented by using a back plate having better thermal conductivity, and the back plate integrates a dual function of a heat dissipation function and a support positioning function, so that the overall thickness of the display device is reduced;
  • the back plate and the front frame By extending the back plate and the front frame, forming an accommodating space extending along the surface of the display device, and placing a PCB with a large amount of heat and occupying a large space in the accommodating space, and moving away from the light entering side Laying on the surface of the backplane ensures an effective contact area between the PCB and the backplane having a heat dissipation effect, thereby further reducing the overall thickness of the display device on the basis of achieving heat dissipation of the PCB.
  • Some embodiments of the present disclosure also provide a liquid crystal display device including a liquid crystal panel 217 and the backlight module 200 described in the above embodiments.
  • the backlight module 200 is disposed opposite to the liquid crystal panel 217, and the liquid crystal panel 217 is located on the upper surface of the backlight module 200.
  • the structure, functions, and functions of the backlight module 200 have been described in detail in the foregoing embodiments, and are not described herein again.

Abstract

A backlight module (200) and a liquid crystal display device. The backlight module (200) comprises a light guide plate (210), a back plate (211), a front frame (212), an LED lamp (213), and a PCB (214), wherein the light guide plate (210) comprises a light incident side on a side surface thereof; the LED lamp (213) is disposed opposite the light incident side of the light guide plate (210); the back plate (211) is disposed below the light guide plate (210), and the length of the back plate (211) is greater than the length of the light guide plate (210) in the direction of the light incident side facing the LED lamp (213); the front frame (212) comprises a first bottom edge (2121) that is parallel to the back plate (211) and extends in the direction of the light incident side facing the LED lamp (213), and a first vertical edge (2122) that is connected to the back plate (211) and the first bottom edge (2121) on one side, away from the light incident side, of the first bottom edge (2121) and is perpendicular to the back plate (211) and the first bottom edge (2121); the PCB (214) is laid above the back plate (211) in a direction away from the light incident side and is electrically connected to the LED lamp (213); and the first bottom edge (2121), the first vertical edge (2122) and the back plate (211) form an accommodating space for placing the LED lamp (213) and the PCB (214). The liquid crystal display device comprises a liquid crystal panel (217) and a backlight module (200).

Description

一种背光模组及液晶显示装置Backlight module and liquid crystal display device
本申请要求于2017年7月12日提交中国专利局、申请号为201710567099.7、发明名称为“一种背光模组及液晶显示装置”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。The present application claims priority to Chinese Patent Application No. 200910567099.7, entitled "Backlight Module and Liquid Crystal Display Device", filed on July 12, 2017, the entire contents of which are incorporated herein by reference. In the application.
技术领域Technical field
本公开涉及显示技术领域,尤其涉及一种背光模组及液晶显示装置。The present disclosure relates to the field of display technologies, and in particular, to a backlight module and a liquid crystal display device.
背景技术Background technique
在超薄显示装置领域,贴墙悬挂式液晶显示装置越来越受欢迎,而且,液晶显示装置的薄型化越来越成为发展的趋势,而且,显示装置的薄型化,不仅减轻显示装置的重量,有利于悬挂后的稳固定,同时也迎合了消费者的审美需求。In the field of ultra-thin display devices, wall-mounted liquid crystal display devices are becoming more and more popular, and the thinning of liquid crystal display devices is becoming more and more popular, and the thinness of display devices not only reduces the weight of display devices. It is conducive to the stability of the suspension, but also caters to the aesthetic needs of consumers.
图1是相关技术中一种液晶显示装置结构示意图。如图1所示,显示装置100,包括前框110、液晶面板111、导光板112、背板113以及位于背板113下表面的散热器114,驱动板115和连接液晶面板和驱动板的柔性电路板116,其中导光板112包含位于其侧面的一入光侧,散热器114包括固定在背板113下表面的底板和与入光侧相对设置的立板,显示装置还包含与导光板112入光侧相对设置的并设置在散热器114立板上的印刷电路板(PCB)118和设置在印制电路板上相对于入光面一侧的发光二极管(LED)灯117,前框110包括沿液晶面板显示面延伸的第一底边和与第一底边垂直的第二立边,并且散热器114立板与第二立边之间形成有容置间隙,用于驱动液晶面板的驱动板115设置在散热器114底板下方,通过设置在容置间隙内的柔性电路板116,实现与液晶面板111的连接,其中散热器114有助于传导和散发LED灯117和PCB118工作时产生的热量,保证显示装置100的正常工作。1 is a schematic structural view of a liquid crystal display device in the related art. As shown in FIG. 1 , the display device 100 includes a front frame 110 , a liquid crystal panel 111 , a light guide plate 112 , a back plate 113 , and a heat sink 114 on a lower surface of the back plate 113 , a driving plate 115 and a flexible connection between the liquid crystal panel and the driving board. The circuit board 116, wherein the light guide plate 112 includes a light incident side on a side surface thereof, the heat sink 114 includes a bottom plate fixed to a lower surface of the back plate 113 and a vertical plate disposed opposite to the light incident side, and the display device further includes a light guide plate 112 a printed circuit board (PCB) 118 disposed opposite to the light incident side and disposed on the vertical plate of the heat sink 114, and a light emitting diode (LED) lamp 117 disposed on a side of the printed circuit board opposite to the light incident surface, the front frame 110 The first bottom edge extending along the display surface of the liquid crystal panel and the second vertical edge perpendicular to the first bottom edge are formed, and an accommodation gap is formed between the vertical plate of the heat sink 114 and the second vertical edge for driving the liquid crystal panel. The driving board 115 is disposed under the bottom plate of the heat sink 114, and realizes connection with the liquid crystal panel 111 through the flexible circuit board 116 disposed in the accommodating gap, wherein the heat sink 114 helps to transmit and emit the LED lamp 117 and the PCB 118 when working. Heat, guaranteed Normal operation of the apparatus 100.
本部分披露的信息仅为和本公开相关的技术信息,并不能构成本公开的相关技术。The information disclosed in this section is only technical information related to the present disclosure, and does not constitute a related art of the present disclosure.
发明内容Summary of the invention
第一方面,本公开的实施例提供了一种背光模组,包括:导光板、背板、前框、LED灯和PCB,其中,所述导光板包括位于其侧面的一入光侧;所述背板设置在所述导光板下方,并且在所述入光侧朝向LED灯的方向上,所述背板的长度大于所述导光板的长度;所述前框包括与所述背板平行且在所述入光侧朝向所述LED灯的方向上延伸的第一底边,以及在所述第一底边的远离所述入光侧的一侧连接所述背板和所述第一底边且与所述背板和所述第一底边垂直的第一立边;所述LED灯与所述导光板的入光侧相对设置;所述PCB沿远离所述入光侧的方向铺设在所述背板的上方并与所述LED灯电性连接;所述第一底边、所述第一立边和所述背板形成容置空间,所述容置空间用于放置所述LED灯和所述PCB。In a first aspect, an embodiment of the present disclosure provides a backlight module, including: a light guide plate, a back plate, a front frame, an LED lamp, and a PCB, wherein the light guide plate includes a light incident side on a side thereof; The back plate is disposed under the light guide plate, and the length of the back plate is greater than the length of the light guide plate in a direction of the light entrance side toward the LED lamp; the front frame includes a parallel with the back plate And connecting a first bottom edge extending in a direction of the light incident side toward the LED lamp, and connecting the back board and the first side on a side of the first bottom side away from the light incident side a first vertical side of the bottom edge and perpendicular to the back plate and the first bottom edge; the LED lamp is disposed opposite to a light incident side of the light guide plate; the PCB is away from the light incident side Laying over the back panel and electrically connecting with the LED lamp; the first bottom edge, the first vertical edge and the back panel form an accommodating space, and the accommodating space is used for the placement The LED lamp and the PCB.
第二方面,本申请提供了一种液晶显示装置,包括液晶面板及上述任一背光模组, 其中,所述背光模组与所述液晶面板相对设置,并且所述液晶面板位于所述背光模组的上表面。In a second aspect, the present application provides a liquid crystal display device, including a liquid crystal panel and any of the above backlight modules, wherein the backlight module is disposed opposite to the liquid crystal panel, and the liquid crystal panel is located in the backlight module The upper surface of the group.
附图说明DRAWINGS
为了更清楚地说明本公开的一些实施例或相关技术中的技术方案,下面将对实施例或相关技术,描述中所需要使用的附图作简单的介绍,显而易见地,下面描述中的附图仅仅是本公开的一些实施例而非全部的可实施方式,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate some embodiments of the present disclosure or the technical solutions in the related art, the embodiments or the related art, the drawings to be used in the description will be briefly described below. Obviously, the drawings in the following description It is merely some embodiments of the present disclosure, and not all of the embodiments, and other drawings may be obtained from those skilled in the art without departing from the drawings.
图1为相关技术背光模组及其液晶显示装置的结构示意图;1 is a schematic structural view of a related art backlight module and a liquid crystal display device thereof;
图2为本公开的一些实施例中背光模组及其液晶显示装置的结构示意图;2 is a schematic structural diagram of a backlight module and a liquid crystal display device thereof according to some embodiments of the present disclosure;
图3为本公开的一些实施例中LED灯和PCB的结构示意图;3 is a schematic structural view of an LED lamp and a PCB in some embodiments of the present disclosure;
图4为本公开的一些实施例中PCB与背板采用螺钉固定的结构示意图;4 is a schematic structural view of a PCB and a back plate fixed by screws according to some embodiments of the present disclosure;
图5为本公开的另一些实施例中背光模组及其液晶显示装置的结构示意图。FIG. 5 is a schematic structural diagram of a backlight module and a liquid crystal display device thereof according to other embodiments of the present disclosure.
具体实施方式Detailed ways
下面将结合本公开的一些实施例中的附图,对本公开的一些实施例中的技术方案进行清除、完整地描述,显然,所描述的实施例仅仅是公开的一部分实施例,而不是全部的实施例。基于本公开的一些实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本公开保护范围。The technical solutions in some embodiments of the present disclosure will be described below in detail in conjunction with the accompanying drawings in the embodiments of the present disclosure, and the described embodiments are only a part of the disclosed embodiments, rather than all Example. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present disclosure without departing from the inventive scope are the scope of the disclosure.
下面,通过具体实施例对本申请所示的技术方案进行详细说明。需要说明的是,下面这几个具体的实施例可以相互结合,对于相同或相似的概念或过程可能在某些实施例中不再赘述。The technical solutions shown in the present application are described in detail below through specific embodiments. It should be noted that the following specific embodiments may be combined with each other, and the same or similar concepts or processes may not be described in some embodiments.
液晶显示装置由于占用空间小,外观轻薄等优点,越来越受到消费者的欢迎。但是,为了设计和组装的方便,一些模组组件中散热器和驱动板多设置在背板下方并叠加设置,形成凸起台阶结构。The liquid crystal display device is more and more popular among consumers because of its small footprint and thin appearance. However, for the convenience of design and assembly, in some module assemblies, the heat sink and the driving board are disposed under the backing plate and superposed to form a convex step structure.
本公开的一些实施例提供了背光模组200,该背光模组200的背光源为侧入式背光源。如图2所示,背光模组200,包括导光板210、背板211、前框212、LED灯213和PCB214,其中,导光板210包括位于其侧面的一入光侧;背板211设置在导光板210的下方,并且在入光侧朝向LED灯213的方向上,背板211的长度大于导光板210的长度;前框212包括与背板211平行且在入光侧朝向LED灯213的方向上延伸的第一底边2121,以及在第一底边2121的远离入光侧的一侧连接背板211和第一底边2111且与背板211和第一底边2121垂直的第一立边2122;LED灯213与导光板210的入光侧相对设置;PCB214沿远离入光侧的方向铺设在背板211的上方并与LED灯213电性连接。该PCB214在一些实施例中是塑料基材的PCB板,在另一些实施例中是金属基材的PCB板。上述的第一底边2121、第一立边2122和背板211形成一容置空间,该容置空间用于放置LED灯213和PCB214。Some embodiments of the present disclosure provide a backlight module 200. The backlight of the backlight module 200 is a side-lit backlight. As shown in FIG. 2, the backlight module 200 includes a light guide plate 210, a back plate 211, a front frame 212, an LED lamp 213, and a PCB 214, wherein the light guide plate 210 includes a light incident side on a side thereof; the back plate 211 is disposed at Below the light guide plate 210, and in the direction of the light incident side toward the LED lamp 213, the length of the back plate 211 is greater than the length of the light guide plate 210; the front frame 212 includes a side parallel to the back plate 211 and toward the LED lamp 213 on the light incident side. a first bottom edge 2121 extending in a direction, and a first side connecting the back plate 211 and the first bottom edge 2111 on a side of the first bottom edge 2121 away from the light incident side and perpendicular to the back plate 211 and the first bottom edge 2121. The LED 213 is disposed opposite to the light incident side of the light guide plate 210; the PCB 214 is disposed above the back plate 211 in a direction away from the light incident side and electrically connected to the LED lamp 213. The PCB 214 is a PCB board of a plastic substrate in some embodiments, and a PCB board of a metal substrate in other embodiments. The first bottom edge 2121, the first vertical side 2122 and the back plate 211 form an accommodating space for arranging the LED lamp 213 and the PCB 214.
在导光板的其他三个窄侧面位置处,背板仅略大于导光板,只需实现导光板的限位即可。At the other three narrow side positions of the light guide plate, the back plate is only slightly larger than the light guide plate, and only the limit of the light guide plate is required.
在一些实施例中,由于背板211需要传导和散发LED灯117和PCB118工作时产生的热量以起到散热作用,因此背板211需要具有较好的热传导性,本实施例优选导热性较好的铝材质制作背板211,在实现背板211支撑和固定作用的同时,实现背板211的热传导作用。导热性较好的背板211的使用并且集成了散热器的散热效果与背板211本身的支撑作用,减少了散热器在厚度方向上占据的空间,实现显示装置整体厚度上的减薄。In some embodiments, since the back plate 211 needs to conduct and dissipate the heat generated when the LED lamp 117 and the PCB 118 operate to perform heat dissipation, the back plate 211 needs to have better thermal conductivity, and the embodiment preferably has better thermal conductivity. The aluminum material is used to make the back plate 211, and the heat conduction function of the back plate 211 is realized while realizing the supporting and fixing action of the back plate 211. The use of the back plate 211 having better thermal conductivity integrates the heat dissipation effect of the heat sink and the support function of the back plate 211 itself, reduces the space occupied by the heat sink in the thickness direction, and achieves thinning of the overall thickness of the display device.
在一些实施例中,如图3所示,为了充分利用第一底板2121、第一立边2122和背板211之间形成的容置空间,并且有效利用背板211的热传导作用,可以将PCB214的形状设计成L型,该L型PCB214包括与LED灯213相连的立侧2141和与背板211相对设置的底侧2142。该立侧2141与导光板210的入光侧相对设置,LED灯设置于立侧2141朝向该入光侧的一面。应当注意的是,L型PCB214的立侧2141和底侧2142并非是严格的直角,可以有误差。在一些实施例中,立侧2141和底侧2142可以是平板,也可形成有一些凹凸的结构。在这些实施例中,通过延长背板及前框,形成一个沿显示装置表面延伸的容置空间,并将产生热量较多且占用空间较大的PCB设置在该容置空间中,并沿远离入光侧的方向铺设在背板的表面,保证了PCB与具有散热效果的背板的有效接触面积,从而,在实现PCB散热的基础上,进一步地减小了显示装置的整体厚度。In some embodiments, as shown in FIG. 3, in order to make full use of the accommodating space formed between the first bottom plate 2121, the first vertical side 2122, and the back plate 211, and effectively utilize the heat conduction effect of the back plate 211, the PCB 214 can be used. The shape is designed to be L-shaped, and the L-shaped PCB 214 includes a standing side 2141 connected to the LED lamp 213 and a bottom side 2142 disposed opposite to the backing plate 211. The vertical side 2141 is disposed opposite to the light incident side of the light guide plate 210, and the LED lamp is disposed on a side of the vertical side 2141 facing the light incident side. It should be noted that the vertical side 2141 and the bottom side 2142 of the L-shaped PCB 214 are not strictly right angles and may have errors. In some embodiments, the upside 2141 and the bottom side 2142 may be flat plates or may be formed with some relief structures. In these embodiments, by extending the back plate and the front frame, an accommodating space extending along the surface of the display device is formed, and a PCB that generates more heat and takes up a larger space is disposed in the accommodating space, and is away from The direction of the light entrance side is laid on the surface of the back plate, which ensures the effective contact area between the PCB and the back plate having the heat dissipation effect, thereby further reducing the overall thickness of the display device on the basis of realizing the heat dissipation of the PCB.
在显示装置工作时,PCB214的走线层的发热和LED灯213的发热为两个主要热量来源。为了更有效地散热,并且为了方便LED灯213在PCB214上的安装固定,在一些实施例中,PCB214的走线层设置在PCB214的与导光板210的入光侧相对的立侧2141上,以及PCB214的与背板211相对的底侧2142上。When the display device is in operation, the heat generation of the trace layer of the PCB 214 and the heat generation of the LED lamp 213 are the two main sources of heat. In order to dissipate heat more efficiently, and to facilitate mounting and fixing of the LED lamp 213 on the PCB 214, in some embodiments, the wiring layer of the PCB 214 is disposed on the vertical side 2141 of the PCB 214 opposite to the light incident side of the light guide plate 210, and The bottom side 2142 of the PCB 214 opposite the backing plate 211.
具体的,如图3所示,为了保证显示装置有足够的背光亮度值,并且背光亮度值保持均匀,在一些实施例中,背光模组200包括多个LED灯213,该多个LED灯均匀布设安装在PCB214的立侧2141上,PCB214为LED灯213提供电源和实现对LED灯213亮度的控制,达到LED灯213为显示装置提供均匀背光源的目的。Specifically, as shown in FIG. 3, in order to ensure that the display device has sufficient backlight brightness value and the backlight brightness value remains uniform, in some embodiments, the backlight module 200 includes a plurality of LED lights 213, and the plurality of LED lights are uniform. The layout is installed on the vertical side 2141 of the PCB 214. The PCB 214 provides power for the LED lamp 213 and controls the brightness of the LED lamp 213, so that the LED lamp 213 provides a uniform backlight for the display device.
如图2所示,PCB214铺设在背板211上,为了兼顾PCB214的固定和保证PCB214与LED灯213产生的热量通过背板211进行热量的传导和散热。在一些实施例中,可采用导热胶215的方式将PCB214固定在背板211上,即PCB214与背板211之间设置导热胶215,实现固定和热传导作用,并且导热胶215的使用可有效的提高PCB214和LED灯213产生的热量的传导效率,从而保证显示装置的正常工作。As shown in FIG. 2, the PCB 214 is laid on the backplane 211, in order to balance the fixing of the PCB 214 and ensure the heat generated by the PCB 214 and the LED lamp 213 through the backing plate 211 for heat conduction and heat dissipation. In some embodiments, the PCB 214 can be fixed on the back plate 211 by using the thermal conductive adhesive 215, that is, the thermal conductive adhesive 215 is disposed between the PCB 214 and the back plate 211 to achieve fixation and heat conduction, and the use of the thermal conductive adhesive 215 can be effective. The conduction efficiency of the heat generated by the PCB 214 and the LED lamp 213 is improved to ensure the normal operation of the display device.
在一些实施例中,PCB214的走线层一侧通过导热胶215贴附固定在背板211上。可将PCB214的底侧2142的设置有走线层的一侧通过导热胶贴附固定在背板211上。In some embodiments, one side of the wiring layer of the PCB 214 is attached to the back plate 211 by a thermal adhesive 215. The side of the bottom side 2142 of the PCB 214 on which the wiring layer is disposed may be attached to the backing plate 211 by a thermal adhesive.
在一些实施例中,如图4所示,PCB214铺设在背板211上的固定方式为采用螺钉218固定方式。PCB214采用螺钉218固定在背板211上,虽然将PCB214产生的热量传导到背板211的效果相对于通过导热胶固定的方式较差,但其固定作用较好,PCB214固定到背板211上不容易因搬动或因发热造成PCB214脱离背板211的情况,保证了PCB214的正常工作。在一些实施例中,可同时通过导热胶和螺钉将PDB214固定到背板211上,从而可同时实现较好的散热和固定效果。In some embodiments, as shown in FIG. 4, the PCB 214 is laid on the back plate 211 in a fixed manner by means of screws 218. The PCB 214 is fixed on the back plate 211 by screws 218. Although the effect of transferring the heat generated by the PCB 214 to the back plate 211 is inferior to that of fixing through the thermal conductive adhesive, the fixing effect is better, and the PCB 214 is not fixed to the back plate 211. It is easy to move the PCB 214 out of the backplane 211 due to movement or heat, and the normal operation of the PCB 214 is ensured. In some embodiments, the PDB 214 can be simultaneously secured to the backing plate 211 by thermally conductive glue and screws, thereby achieving better heat dissipation and fixation at the same time.
进一步地,如图2和图4所示,在一些实施例中,背光模组200包括的用于驱动 液晶面板的驱动板216也设置在容置空间中,具体地,驱动板216可设置在PCB214上方,这样不仅可以有效利用该容置空间,而且,通过将在显示装置厚度上叠加的驱动板216的厚度转移到位于水平方向上的容置空间中,进一步实现了显示装置整体上的减薄,并且实现了显示装置背部的平面设计。Further, as shown in FIG. 2 and FIG. 4, in some embodiments, the driving board 216 included in the backlight module 200 for driving the liquid crystal panel is also disposed in the accommodating space. Specifically, the driving board 216 may be disposed at Above the PCB 214, not only can the accommodating space be effectively utilized, but also the overall reduction of the display device can be further achieved by transferring the thickness of the driving board 216 superimposed on the thickness of the display device to the accommodating space in the horizontal direction. It is thin and realizes the planar design of the back of the display device.
图5示出了本公开的另一些实施例中的背光模组及其液晶显示装置的结构示意图。图5所示的实施例与图4所示的实施例基本相同,不同之处主要在于,在图5所示的实施例中,驱动板216与PCB214并行设置在背板211上方,而在图4所示的实施例中,PCB214设置在背板211上方,驱动板216继而设置在PCB214上方。在如图5所示实施例中,采用螺钉218将PCB 214与背板211固定,但本公开并不限于此,在其他一些实施例,还可通过导热胶将PCB 214贴附固定在背板211上。FIG. 5 is a schematic structural view of a backlight module and a liquid crystal display device thereof in other embodiments of the present disclosure. The embodiment shown in FIG. 5 is substantially the same as the embodiment shown in FIG. 4, except that in the embodiment shown in FIG. 5, the driving board 216 is disposed above the back board 211 in parallel with the PCB 214. In the embodiment shown in FIG. 4, the PCB 214 is disposed above the backplane 211, which in turn is disposed over the PCB 214. In the embodiment shown in FIG. 5, the PCB 214 and the back plate 211 are fixed by screws 218, but the disclosure is not limited thereto. In other embodiments, the PCB 214 may be attached to the back plate by a thermal adhesive. 211.
本公开的一些实施例提供了一种背光模组及液晶显示装置,其中,背光模组包括导光板、背板、前框、LED灯和PCB,导光板包括位于其侧面的一入光侧,背板设置在导光板的下方,并且在所述入光侧朝向LED灯的方向上,背板的长度大于导光板的长度,前框包括与所述背板平行且在所述入光侧朝向所述LED灯的方向上延伸的第一底边,以及在第一底边的远离入光侧的一侧连接所述背板和所述第一底边且与所述背板和第一底边垂直的第一立边,LED灯与导光板的入光侧相对设置,PCB沿远离入光侧的方向铺设在背板的上方并与LED灯电性连接,上述第一底边、第一立边和背板形成容置空间,容置空间用于放置LED灯和PCB。本公开的一些实施例提供的背光模组中,使用热传导性较好的背板实现热量的传导和消散,背板集成了散热功能和支撑定位功能双重功能,使得显示装置整体厚度减小;而且,通过延长背板及前框,形成一个沿显示装置表面延伸的容置空间,并将产生热量较多且占用空间较大的PCB设置在该容置空间中,并沿远离入光侧的方向铺设在背板的表面,保证了PCB与具有散热效果的背板的有效接触面积,从而,在实现PCB散热的基础上,进一步地减小了显示装置的整体厚度。Some embodiments of the present disclosure provide a backlight module and a liquid crystal display device, wherein the backlight module includes a light guide plate, a back plate, a front frame, an LED lamp, and a PCB, and the light guide plate includes a light incident side on a side thereof. The back plate is disposed under the light guide plate, and the length of the back plate is greater than the length of the light guide plate in the direction of the light incident side toward the LED lamp, and the front frame includes a parallel to the back plate and is oriented on the light incident side a first bottom edge extending in a direction of the LED lamp, and a side of the first bottom edge away from the light incident side connecting the back plate and the first bottom edge and the back plate and the first bottom The first vertical side of the vertical side, the LED light is opposite to the light incident side of the light guide plate, and the PCB is laid above the back plate in a direction away from the light incident side and electrically connected with the LED light, the first bottom edge, the first The vertical side and the back plate form an accommodating space for arranging the LED lamp and the PCB. In a backlight module provided by some embodiments of the present disclosure, heat conduction and dissipation are implemented by using a back plate having better thermal conductivity, and the back plate integrates a dual function of a heat dissipation function and a support positioning function, so that the overall thickness of the display device is reduced; By extending the back plate and the front frame, forming an accommodating space extending along the surface of the display device, and placing a PCB with a large amount of heat and occupying a large space in the accommodating space, and moving away from the light entering side Laying on the surface of the backplane ensures an effective contact area between the PCB and the backplane having a heat dissipation effect, thereby further reducing the overall thickness of the display device on the basis of achieving heat dissipation of the PCB.
本公开的一些实施例还提供了一种液晶显示装置,包含液晶面板217和上述实施例中所述的背光模组200。其中,背光模组200与液晶面板217相对设置,液晶面板217位于背光模组200上表面;背光模组200的结构、功能与作用已在前述实施例中详细说明,此处不再赘述。Some embodiments of the present disclosure also provide a liquid crystal display device including a liquid crystal panel 217 and the backlight module 200 described in the above embodiments. The backlight module 200 is disposed opposite to the liquid crystal panel 217, and the liquid crystal panel 217 is located on the upper surface of the backlight module 200. The structure, functions, and functions of the backlight module 200 have been described in detail in the foregoing embodiments, and are not described herein again.
以上具体实施方式,对本公开的实施例的目的、技术方案和有益效果进行了进一步详细说明,所应理解的是,以上仅为本公开的具体实施方式而已,并不用于限定本公开的保护范围,凡在本公开的实施例的精神和原则之内,所做的任何修改、等同替换、改进等,均应包含在本公开的保护范围之内。The above detailed description of the embodiments of the present invention has been described in detail, the embodiments of the present invention Any modifications, equivalent substitutions, improvements, etc., made within the spirit and scope of the embodiments of the present disclosure are intended to be included within the scope of the present disclosure.

Claims (13)

  1. 一种背光模组,包括:A backlight module comprising:
    导光板,包括位于其侧面的入光侧;a light guide plate comprising a light incident side on a side thereof;
    发光二极管LED灯,所述LED灯与所述导光板的所述入光侧相对设置;a light-emitting diode LED lamp, the LED light being disposed opposite to the light-incident side of the light guide plate;
    背板,设置在所述导光板下方,并且在所述入光侧朝向所述LED灯的方向上,所述背板的长度大于所述导光板的长度;a back plate disposed under the light guide plate, and a length of the back plate is greater than a length of the light guide plate in a direction of the light incident side toward the LED lamp;
    前框,所述前框包括与所述背板平行且在所述入光侧朝向所述LED灯的方向上延伸的第一底边,以及在所述第一底边的远离所述入光侧的一侧连接所述背板和所述第一底边的第一立边;a front frame, the front frame including a first bottom edge extending parallel to the back plate and extending in a direction of the light incident side toward the LED lamp, and a distance from the light entering the first bottom edge a side of the side connecting the back panel and the first vertical side of the first bottom edge;
    印刷电路板PCB,所述PCB沿远离所述入光侧的方向铺设在所述背板的上方并与所述LED灯电性连接;a printed circuit board PCB, the PCB is laid above the backplane in a direction away from the light incident side and electrically connected to the LED lamp;
    所述第一底边、所述第一立边和所述背板形成容置空间,所述容置空间用于放置所述LED灯和所述PCB。The first bottom edge, the first vertical side and the back plate form an accommodating space for placing the LED lamp and the PCB.
  2. 如权利要求1所述的背光模组,其中,所述背板的材料为铝材质。The backlight module of claim 1 , wherein the back plate is made of aluminum.
  3. 如权利要求1所述的背光模组,其中,所述PCB的形状为L型,包括与所述LED灯电性连接的立侧和与铺设在所述背板上方的底侧。The backlight module of claim 1, wherein the PCB has an L-shape, and includes a vertical side electrically connected to the LED lamp and a bottom side disposed above the back plate.
  4. 如权利要求1所述的背光模组,其中,所述PCB的走线层设置在所述PCB的与所述背板相对的侧面上。根据权利要求3所述的激光投影机,其特征在于,所述至少一个透过区域包括中心对称的两个透过区域,至少一个所述荧光区域包括中心对称的两个荧光区域。The backlight module of claim 1, wherein the wiring layer of the PCB is disposed on a side of the PCB opposite to the backplane. The laser projector according to claim 3, wherein said at least one transmission region comprises two centrally symmetric transmission regions, and at least one of said fluorescent regions comprises two centrally symmetric fluorescent regions.
  5. 如权利要求3所述的背光模组,其中,所述LED灯为多个,并均匀布设安装在所述PCB的所述立侧上。The backlight module of claim 3, wherein the plurality of LED lamps are plural and evenly mounted on the vertical side of the PCB.
  6. 如权利要求3所述的背光模组,其中,所述PCB的底侧的设置有走线层的一侧通过导热胶贴附固定在所述背板上。The backlight module of claim 3, wherein a side of the bottom side of the PCB on which the wiring layer is disposed is attached to the backing plate by a thermal adhesive.
  7. 如权利要求1所述的背光模组,其中,所述PCB与所述背板之间设有导热胶。The backlight module as claimed in claim 1 , wherein a thermal conductive adhesive is disposed between the PCB and the back plate.
  8. 如权利要求1所述的背光模组,其中,所述PCB的设置有走线层的一侧通过导热胶贴附固定在所述背板上。The backlight module of claim 1, wherein one side of the PCB on which the wiring layer is disposed is attached to the back plate by a thermal adhesive.
  9. 如权利要求1所述的背光模组,其中,所述PCB采用螺固定在所述背板上。The backlight module of claim 1, wherein the PCB is screwed to the backplane.
  10. 如权利要求1所述的背光模组,其中,还包括驱动板,所述驱动板用于驱动液晶面板,且设置在所述容置空间中。The backlight module of claim 1, further comprising a driving board for driving the liquid crystal panel and disposed in the accommodating space.
  11. 如权利要求10所述的背光模组,其中,所述驱动板设置在所述PCB上方。The backlight module of claim 10, wherein the driving board is disposed above the PCB.
  12. 如权利要求10所述的背光模组,其中,所述驱动板与所述PCB并行设置在所述背板上方。The backlight module of claim 10, wherein the driving board is disposed above the backing plate in parallel with the PCB.
  13. 一种液晶显示装置,包括液晶面板和如权利要求1所述的背光模组,其中,所述背光模组与所述液晶面板相对设置,并且所述液晶面板位于所述背光模组的上表面。A liquid crystal display device comprising a liquid crystal panel and the backlight module of claim 1 , wherein the backlight module is disposed opposite to the liquid crystal panel, and the liquid crystal panel is located on an upper surface of the backlight module .
PCT/CN2018/076288 2017-07-12 2018-02-11 Backlight module and liquid crystal display device WO2019010974A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710567099.7 2017-07-12
CN201710567099.7A CN107203069A (en) 2017-07-12 2017-07-12 A kind of backlight module and liquid crystal display device

Publications (1)

Publication Number Publication Date
WO2019010974A1 true WO2019010974A1 (en) 2019-01-17

Family

ID=59911103

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/076288 WO2019010974A1 (en) 2017-07-12 2018-02-11 Backlight module and liquid crystal display device

Country Status (2)

Country Link
CN (1) CN107203069A (en)
WO (1) WO2019010974A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107203069A (en) * 2017-07-12 2017-09-26 青岛海信电器股份有限公司 A kind of backlight module and liquid crystal display device
TWI666491B (en) * 2018-05-08 2019-07-21 友達光電股份有限公司 Display device
CN108922407B (en) * 2018-09-11 2023-11-24 合肥京东方光电科技有限公司 Display screen and display device
CN109031793B (en) * 2018-10-15 2024-02-06 四川长虹电器股份有限公司 Liquid crystal display device having a light shielding layer
CN109188744B (en) * 2018-10-25 2020-09-18 福耀玻璃工业集团股份有限公司 Transparent liquid crystal display hollow glass
CN109166465A (en) * 2018-11-06 2019-01-08 苏州与来视讯科技有限公司 A kind of integrated double-sided display all-in-one machine
CN110441939A (en) * 2019-07-24 2019-11-12 青岛海信电器股份有限公司 A kind of display device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102121641A (en) * 2010-12-20 2011-07-13 友达光电股份有限公司 Backlight module
CN102865528A (en) * 2012-10-18 2013-01-09 深圳市华星光电技术有限公司 Backlight module and liquid crystal display device
KR20130038062A (en) * 2011-10-07 2013-04-17 엘지이노텍 주식회사 The backlight unit and the display device having the same
CN204459973U (en) * 2015-03-31 2015-07-08 京东方光科技有限公司 A kind of backlight and display unit
CN105938272A (en) * 2016-05-27 2016-09-14 安比斯特殊玻璃(苏州)有限公司 Ultrathin backlight module and touch all-in-one machine based on ultrathin backlight module
CN106707592A (en) * 2017-02-28 2017-05-24 奥英光电(苏州)有限公司 Ultra-narrow frame ultra-thin LCD display module
CN107203069A (en) * 2017-07-12 2017-09-26 青岛海信电器股份有限公司 A kind of backlight module and liquid crystal display device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102121641A (en) * 2010-12-20 2011-07-13 友达光电股份有限公司 Backlight module
KR20130038062A (en) * 2011-10-07 2013-04-17 엘지이노텍 주식회사 The backlight unit and the display device having the same
CN102865528A (en) * 2012-10-18 2013-01-09 深圳市华星光电技术有限公司 Backlight module and liquid crystal display device
CN204459973U (en) * 2015-03-31 2015-07-08 京东方光科技有限公司 A kind of backlight and display unit
CN105938272A (en) * 2016-05-27 2016-09-14 安比斯特殊玻璃(苏州)有限公司 Ultrathin backlight module and touch all-in-one machine based on ultrathin backlight module
CN106707592A (en) * 2017-02-28 2017-05-24 奥英光电(苏州)有限公司 Ultra-narrow frame ultra-thin LCD display module
CN107203069A (en) * 2017-07-12 2017-09-26 青岛海信电器股份有限公司 A kind of backlight module and liquid crystal display device

Also Published As

Publication number Publication date
CN107203069A (en) 2017-09-26

Similar Documents

Publication Publication Date Title
WO2019010974A1 (en) Backlight module and liquid crystal display device
KR101807442B1 (en) Backlight module and liquid crystal display device using backlight module
KR101777527B1 (en) Backlight module and liquid crystal display module using same
TWI402577B (en) Backlight module and display device with two-sided light emitting structure
EP2607949A1 (en) Display module and display apparatus having the same
US20150268410A1 (en) Liquid crystal display device
KR20150025231A (en) Light source module and manufacturing method thereof, backlight unit
JP5506483B2 (en) Liquid crystal display device and lighting device
WO2014029120A1 (en) Backlight unit and liquid crystal display device
WO2016165252A1 (en) Backlight module and display device
US9229155B2 (en) Side-edge backlight module
US20150301404A1 (en) Direct backlight module
WO2020135459A1 (en) Direct-type backlight module and display
WO2013152521A1 (en) Direct type backlight module
TW201604625A (en) Backlight device
JP2008112607A (en) Light-source module, and liquid-crystal display device and lighting device respectively using the same
TW201400940A (en) Backlight module and display apparatus using the same
TWI382249B (en) Liquid crystal display and backlight module and assembly method for the same
KR20130073816A (en) Display module and displyay apparatus having the same
KR20120023324A (en) The radiant heat circuit board unified blanket and the chassis structure having the same
US9389354B2 (en) Backlight module
KR101283068B1 (en) The radiant heat circuit board unified blanket and the backlight unit having the same
KR101785647B1 (en) A back light unit and display device including the same
US9022634B2 (en) Backlight and display device
KR101898211B1 (en) Backlight unit and liquid crystal display device including the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18831831

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18831831

Country of ref document: EP

Kind code of ref document: A1