WO2019004608A1 - Boîtier de dispositif électroluminescent - Google Patents

Boîtier de dispositif électroluminescent Download PDF

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Publication number
WO2019004608A1
WO2019004608A1 PCT/KR2018/006059 KR2018006059W WO2019004608A1 WO 2019004608 A1 WO2019004608 A1 WO 2019004608A1 KR 2018006059 W KR2018006059 W KR 2018006059W WO 2019004608 A1 WO2019004608 A1 WO 2019004608A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
emitting device
adhesive
disposed
bonding
Prior art date
Application number
PCT/KR2018/006059
Other languages
English (en)
Korean (ko)
Inventor
이태성
임창만
김기석
김영신
김원중
송준오
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020170081295A external-priority patent/KR102249649B1/ko
Priority claimed from KR1020170093032A external-priority patent/KR102369245B1/ko
Priority claimed from KR1020170107936A external-priority patent/KR102380582B1/ko
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Publication of WO2019004608A1 publication Critical patent/WO2019004608A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present invention relates to a semiconductor device, a semiconductor device manufacturing method, a semiconductor device package, a semiconductor device package manufacturing method, and a light source device.
  • Semiconductor devices including compounds such as GaN and AlGaN have many merits such as wide and easy bandgap energy, and can be used variously as light emitting devices, light receiving devices, and various diodes.
  • a light emitting device such as a light emitting diode or a laser diode using a Group III-V or Group II-VI compound semiconductor material can be used for a variety of applications such as red, Blue and ultraviolet rays can be realized.
  • a light emitting device such as a light emitting diode or a laser diode using a Group III-V or Group-VI-VI compound semiconductor material can realize a white light source having high efficiency by using a fluorescent material or combining colors.
  • Such a light emitting device has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environment friendliness compared with conventional light sources such as fluorescent lamps and incandescent lamps.
  • a light-receiving element such as a photodetector or a solar cell
  • a Group III-V or Group-VI-VI compound semiconducting material development of a device material absorbs light of various wavelength regions to generate a photocurrent , It is possible to use light in various wavelength ranges from the gamma ray to the radio wave region. Further, such a light receiving element has advantages of fast response speed, safety, environmental friendliness and easy control of element materials, and can be easily used for power control or microwave circuit or communication module.
  • the semiconductor device can be replaced with a transmission module of an optical communication means, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, White light emitting diode (LED) lighting devices, automotive headlights, traffic lights, and gas and fire sensors.
  • CCFL cold cathode fluorescent lamp
  • LED White light emitting diode
  • semiconductor devices can be applied to high frequency application circuits, other power control devices, and communication modules.
  • the light emitting device can be provided as a pn junction diode having a characteristic in which electric energy is converted into light energy by using a group III-V element or a group II-VI element in the periodic table, Various wavelengths can be realized by adjusting the composition ratio.
  • nitride semiconductors have received great interest in the development of optical devices and high power electronic devices due to their high thermal stability and wide bandgap energy.
  • a blue light emitting element, a green light emitting element, an ultraviolet (UV) light emitting element, and a red (RED) light emitting element using a nitride semiconductor are commercially available and widely used.
  • an ultraviolet light emitting device it is a light emitting diode that generates light distributed in a wavelength range of 200 nm to 400 nm. It is used for sterilizing and purifying in the wavelength band, short wavelength, Can be used.
  • UV-A 315nm ⁇ 400nm
  • UV-B 280nm ⁇ 315nm
  • UV-C 200nm ⁇ 280nm
  • UV-A 315nm ⁇ 400nm
  • UV-B 280nm ⁇ 315nm
  • UV-C 200nm ⁇ 280nm
  • studies are being made on a method for improving the light extraction efficiency of a semiconductor device and improving the light intensity at a package end in a semiconductor device package.
  • studies have been made on a method for improving the bonding strength between a package electrode and a semiconductor device in a semiconductor device package.
  • Embodiments can provide a semiconductor device, a semiconductor device manufacturing method, a semiconductor device package, a method of manufacturing a semiconductor device package, and a light source device capable of improving light extraction efficiency and electrical characteristics.
  • Embodiments can provide a semiconductor device package, a method of manufacturing a semiconductor device package, and a light source device, which can improve the process efficiency and provide a new package structure to reduce the manufacturing cost and improve the manufacturing yield.
  • Embodiments can provide a semiconductor device package and a method of manufacturing a semiconductor device package that can prevent a re-melting phenomenon from occurring in a bonding region of a semiconductor device package in a process of re-bonding the semiconductor device package to a substrate or the like have.
  • Embodiments can provide a semiconductor device, a semiconductor device manufacturing method, a semiconductor device package, and a method of manufacturing a semiconductor device package, wherein stable bonding can be performed at a low temperature.
  • a light emitting device package includes first and second frames spaced apart from each other; A body disposed between the first and second frames and including a recess; A first adhesive disposed on the recess; A light emitting element disposed on the first adhesive; A second adhesive disposed between the first and second frames and the light emitting element; And a resin part arranged to surround a part of the second adhesive and the light emitting element; A light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer; A first bonding portion disposed on the light emitting structure and electrically connected to the first conductive semiconductor layer; And a second bonding portion disposed on the light emitting structure and spaced apart from the first bonding portion, the second bonding portion being electrically connected to the second conductive type semiconductor layer; Wherein the first frame includes a first region in which the second adhesive and the first bonding portion are disposed and a first upper recess disposed to
  • a light emitting device package includes first and second frames spaced apart from each other; A body disposed between the first and second frames and including a recess; A first adhesive disposed on the recess; A light emitting device disposed on the first adhesive, the light emitting device including first and second bonding portions; A second adhesive disposed between the first and second frames and the light emitting element; Wherein the first and second bonding portions are electrically connected to the first and second frames, respectively, and each of the first and second frames includes first and second upper recesses provided in a peripheral portion of the light emitting element, Wherein the second adhesive is disposed in the first and second upper recesses and has a first distance from the side of the light emitting element to a side of the first upper recess disposed below the lower surface of the light emitting element, Can be provided to be larger than a second distance from the side surface of the light emitting element to the side surface of the first bonding portion.
  • a light emitting device package includes first and second frames spaced apart from each other; A body disposed between the first and second frames; A light emitting device including a first bonding portion electrically connected to the first frame and a second bonding portion electrically connected to the second frame; A first adhesive disposed between the body and the light emitting device; And a second adhesive disposed between the first and second frames and the light emitting element; Wherein each of the first and second frames includes first and second upper recesses recessed in a first direction from an upper surface to a lower surface and the second adhesive is disposed within the first and second upper recesses And the first adhesive is disposed on a recess formed on an upper surface of the body, and when viewed from the upper direction of the light emitting device, the first adhesive is disposed on the lower surface of the light emitting device from the side surface of the light emitting device, The first distance to the side of the seth may be provided larger than the second distance from the side of the light emitting element to the side of the first bonding portion.
  • the second distance from the side surface of the light emitting element to the side surface of the first bonding portion may be several tens of micrometers.
  • the second distance from the side surface of the light emitting device to the side surface of the first bonding portion may be 40 to 50 micrometers.
  • a portion of the first upper recess may be overlapped with the lower surface of the first bonding portion in the first direction.
  • the first adhesive may be an insulating adhesive
  • the second adhesive may be provided as a conductive adhesive
  • the first adhesive directly contacts the upper surface of the body and directly contacts the lower surface of the light emitting device
  • the second adhesive contacts the upper surface of the first frame, Can be directly contacted.
  • the light emitting device package may include a first resin part disposed in the first and second upper recesses and in contact with the second adhesive.
  • the first resin part is in direct contact with the lower surface of the light emitting element and can be in direct contact with the side surface of the second adhesive.
  • the first adhesive is disposed to overlap the light emitting device with respect to the first direction
  • the second adhesive may be disposed to overlap the first bonding unit with respect to the first direction
  • the first adhesive may be disposed between the first bonding portion and the second bonding portion.
  • a light emitting device package includes first and second frames spaced apart from each other; A body disposed between the first and second frames and including a recess; A first adhesive disposed on the recess; A light emitting device disposed on the first adhesive, the light emitting device including first and second bonding portions; A second adhesive disposed between the first and second frames and the light emitting element; Wherein the first and second bonding portions are electrically connected to the first and second frames, respectively, and each of the first and second frames includes first and second upper recesses provided in a peripheral portion of the light emitting element, And a second upper recess, wherein the second adhesive is disposed in the first and second upper recesses, and a side surface of the first upper recess located below the lower surface of the light emitting element from the side surface of the light emitting element Is smaller than a second distance from the side of the light emitting device to the side of the first bonding portion and the second distance from the side of the light emitting device to the side of the first bonding portion is less
  • a light emitting device package includes first and second frames spaced apart from each other; A body disposed between the first and second frames; A light emitting device including a first bonding portion electrically connected to the first frame and a second bonding portion electrically connected to the second frame; A first adhesive disposed between the body and the light emitting device; And a second adhesive disposed between the first and second frames and the light emitting element; Wherein each of the first and second frames includes first and second upper recesses recessed in a first direction from an upper surface to a lower surface and the second adhesive is disposed within the first and second upper recesses And the first adhesive is disposed on a recess formed on an upper surface of the body, and when viewed from the upper direction of the light emitting device, the first adhesive is disposed on the lower surface of the light emitting device from the side surface of the light emitting device, The first distance to the side surface of the sieve is provided to be smaller than a second distance from the side surface of the light emitting element to the side surface of the first bonding
  • the second distance from the side of the light emitting device to the side of the first bonding portion may be provided from 50 micrometers to 90 micrometers.
  • a portion of the first upper recess may be overlapped with the lower surface of the first bonding portion in the first direction.
  • the first adhesive may be an insulating adhesive
  • the second adhesive may be provided as a conductive adhesive
  • a light emitting device package includes first and second frames spaced apart from each other; A body disposed between the first and second frames; A light emitting element electrically connected to the first and second frames; A first adhesive disposed between the body and the light emitting device; And a second adhesive disposed between the first and second frames and the light emitting element; Wherein the first adhesive is disposed in a recess formed in the upper surface of the body, and the first and second adhesive may include different materials.
  • the first adhesive may be an insulating adhesive and the second adhesive may be provided by a conductive adhesive.
  • the second adhesive may be disposed on the recess formed on the upper surface of the first and second frames, respectively.
  • the first adhesive directly contacts the upper surface of the body and directly contacts the lower surface of the light emitting device, the second adhesive contacts directly to the upper surface of the first frame, Can be contacted.
  • a light emitting device package includes first and second frames spaced apart from each other; A body disposed between the first and second frames; A light emitting element including a first electrode electrically connected to the first frame and a second electrode electrically connected to the second frame; A first adhesive disposed between the body and the light emitting device; And a second adhesive disposed between the first and second frames and the light emitting element;
  • each of the first and second frames includes first and second recesses recessed from an upper surface thereof, and the first recess has a first direction from a lower surface of the first frame toward an upper surface, The second recess overlaps with the second electrode with respect to the first direction, and the second adhesive is disposed within the first and second recesses, and the first The adhesive may be disposed in the recess formed on the upper surface of the body.
  • the first adhesive may be an insulating adhesive and the second adhesive may be provided by a conductive adhesive.
  • the first adhesive directly contacts the upper surface of the body and directly contacts the lower surface of the light emitting device
  • the second adhesive contacts the upper surface of the first frame, Can be directly contacted.
  • the light emitting device package according to the embodiment may include a first resin part disposed in the first and second recesses and in contact with the second adhesive.
  • the first resin part is in direct contact with the lower surface of the light emitting element and can be in direct contact with the side surface of the second adhesive.
  • the first adhesive may be disposed to overlap the light emitting device with respect to the first direction
  • the second adhesive may be disposed to overlap with the first electrode with respect to the first direction
  • the first adhesive may be disposed between the first electrode and the second electrode.
  • the first frame and the second frame may be provided as a conductive frame.
  • the body may include a plurality of recesses recessed in the first direction.
  • a light emitting device package includes a first frame including a first recess on an upper surface thereof; A second frame spaced apart from the first frame and including a second recess on an upper surface thereof; A body disposed between the first and second frames; A light emitting element electrically connected to the first and second frames; A first adhesive disposed between the body and the light emitting device; A second adhesive disposed between the first and second frames and the light emitting element; A first resin part disposed in the first recess and the second recess; And a second resin part disposed on the first resin part; And the first resin part may be provided in contact with the lower surface of the light emitting device.
  • the second resin part can be disposed on the light emitting element.
  • the first adhesive may be an insulating adhesive and the second adhesive may be provided by a conductive adhesive.
  • the first resin part may include white silicon.
  • a light source device includes: a substrate; First and second frames disposed on the substrate; A body disposed between the first and second frames; A light emitting element electrically connected to the first and second frames; A first adhesive disposed between the body and the light emitting device; A second adhesive disposed between the first and second frames and the light emitting element; A third adhesive disposed between the substrate and the first and second frames; Wherein the second adhesive and the third adhesive are conductive and may include different materials.
  • the first adhesive is an insulating adhesive and may be provided in direct contact with the upper surface of the body and in direct contact with the lower surface of the light emitting device.
  • the second adhesive may be disposed on the recess formed on the upper surface of the first and second frames, respectively.
  • the light emitting device may include a first resin portion disposed in the recess, and the first resin portion may be provided directly in contact with the lower surface of the light emitting element and in direct contact with the side surface of the second adhesive.
  • a light emitting device package includes first and second frames spaced apart from each other; A body between the first frame and the second frame; A light emitting element disposed on the first and second frames, the light emitting element including a first electrode and a second electrode; A first bonding pad disposed between the first electrode and the first frame and electrically connected to the first electrode and the first frame; A second bonding pad disposed between the second electrode and the second frame and electrically connected to the second electrode and the second frame; And a joining portion disposed between the first and second bonding pads and the first and second frames, respectively, wherein the joining portion includes a first metal containing at least one of Ag, Au, and Cu, 2 metal, wherein the mass percentages of the first metal and the second metal may range from 4.5: 2 to 5.5: 2.
  • the bonding portion comprises an intermetallic compound
  • the intermetallic compound may be any one of Ag-Sn compound, Ag-Au-Sn compound, Au-Sn compound, and Cu- have.
  • the first and second bonding pads include a Cu layer in the lowest layer, and the bonding portion may be formed of a compound with a part of the Cu material of the first and second bonding pads.
  • the lower surface of the engaging portion is disposed lower than the upper surface of the body and may have a width smaller than an interval between the first and second frames.
  • a package comprising: a package body disposed on the first and second frames; Wherein the first and second bonding regions of the first and second frames are exposed on the bottom of the cavity, and the first and second bonding regions of the first and second frames are exposed on the bottom of the cavity,
  • the first and second bonding regions of the light emitting device correspond to the first and second electrodes of the light emitting device, and the coupling unit may be connected to the first and second bonding regions.
  • the lower surface of the coupling portion may have an area larger than that of the first and second bonding regions and may be in contact with the upper surface of the body.
  • the light emitting device may include at least one of a resin adhesive between the light emitting device and the body, and a recessed recess in the body disposed below the light emitting device.
  • the light emitting device may have a substrate on an upper portion thereof and a light emitting structure below the substrate, and may be arranged on the first and second frames as a flip chip.
  • the first and second frames include a base layer and an adhesive layer on the base layer, and the engaging portion may be in contact with or not in contact with the base layer.
  • the light extraction efficiency, electrical characteristics and reliability can be improved.
  • the process efficiency is improved and a new package structure is presented, which is advantageous in that the manufacturing cost can be reduced and the manufacturing yield can be improved.
  • the semiconductor device package according to the embodiment has an advantage that the reflector can be prevented from being discolored by providing the body with high reflectance, thereby improving the reliability of the semiconductor device package.
  • the semiconductor device package and the method for manufacturing a semiconductor device it is possible to prevent the re-melting phenomenon from occurring in the bonding area of the semiconductor device package in the process of re-bonding the semiconductor device package to the substrate .
  • stable bonding can be performed by providing a small pressure at a low temperature.
  • the solder is not used in the process of mounting the semiconductor device in the semiconductor device package, There is an advantage that it can be reduced.
  • FIG. 1 is a plan view of a light emitting device package according to an embodiment of the present invention.
  • FIG. 2 is a bottom view of the light emitting device package shown in FIG.
  • FIG. 3 is a cross-sectional view taken along line D-D of the light emitting device package shown in FIG.
  • FIG. 4 is a view for explaining the arrangement relationship of the first frame, the second frame, and the body applied to the light emitting device package according to the embodiment of the present invention.
  • FIG. 5 is a view for explaining the arrangement relationship of the light emitting device, the first frame, and the second adhesive applied to the light emitting device package according to the embodiment of the present invention.
  • 6 to 9 are views illustrating a method of manufacturing a light emitting device package according to an embodiment of the present invention.
  • FIG. 10 is a view illustrating another example of a light emitting device package according to an embodiment of the present invention.
  • FIG. 11 is a view illustrating another example of a light emitting device package according to an embodiment of the present invention.
  • FIG. 12 is a view showing another example of the light emitting device package according to the embodiment of the present invention.
  • FIG. 13 is a view showing another example of the light emitting device package according to the embodiment of the present invention.
  • FIG. 14 is a view for explaining the arrangement relationship of the first frame, the second frame, and the body applied to the light emitting device package shown in FIG.
  • 15 is a view showing still another example of a light emitting device package according to an embodiment of the present invention.
  • FIG. 16 is a view for explaining the arrangement relationship of the first frame, the second frame, and the body applied to the light emitting device package shown in FIG.
  • 17 is a view showing another example of the light emitting device package according to the embodiment of the present invention.
  • FIG. 18 is a view for explaining an arrangement example of the first and second frames in the light emitting device package shown in Fig.
  • FIG. 19 is a view for explaining an arrangement example of the first and second bonding pads in the light emitting device package shown in Fig.
  • FIG. 20 is a cross-sectional view taken along line A-A of the light emitting device package shown in Fig.
  • 21 is a view for explaining the bonding process between the light emitting device and the frame in the light emitting device package shown in FIG.
  • FIG. 22 is a cross-sectional view taken along the line B-B of the light emitting device package shown in Fig.
  • FIG. 23 is a view for explaining an example of the arrangement of molding parts in the light emitting device package shown in Fig.
  • FIG. 24 is a cross-sectional view taken along the line B-B of the light emitting device package shown in Fig.
  • FIG. 25 is a view for explaining the structure before bonding between the first and second bonding pads and the first and second electrodes of the light emitting device in the light emitting device package shown in FIG. 17; FIG.
  • 26 is a view for explaining an intermetallic compound layer after bonding is completed in the light emitting device package shown in Fig.
  • FIG. 27 is a view illustrating a light emitting device applied to a light emitting device package according to an embodiment of the present invention.
  • FIG. 30 is a second modification of the light emitting device package shown in Fig.
  • Fig. 34 shows an example of a light emitting module or light source device including the light emitting device package shown in Fig.
  • each layer (film), area, pattern or structure may be referred to as being “on” or “under” the substrate, each layer Quot; on “ and “ under “ are intended to include both “directly” or “indirectly” do.
  • the criteria for the top, bottom, or bottom of each layer will be described with reference to drawings, but the embodiment is not limited thereto.
  • FIGS. 1 to 5 a light emitting device package according to an embodiment of the present invention will be described.
  • the light emitting device package 100 may include a package body 110 and a light emitting device 120 as shown in FIGS. 1 to 5.
  • the package body 110 may include a first frame 111 and a second frame 112.
  • the first frame 111 and the second frame 112 may be spaced apart from each other.
  • the package body 110 may include a body 113.
  • the body 113 may be disposed between the first frame 111 and the second frame 112.
  • the body 113 may function as an electrode separation line.
  • the body 113 may be referred to as an insulating member.
  • the body 113 may be disposed on the first frame 111. In addition, the body 113 may be disposed on the second frame 112.
  • the body 113 may provide an inclined surface disposed on the first frame 111 and the second frame 112.
  • a cavity C may be provided on the first frame 111 and the second frame 112 by an inclined surface of the body 113.
  • the package body 110 may be provided with a cavity C, or may be provided with a flat upper surface without a cavity C.
  • the body 113 may be formed of a material selected from the group consisting of polyphthalamide (PPA), polychloro tri phenyl (PCT), liquid crystal polymer (LCP), polyamide 9T, silicone, epoxy molding compound, And may be formed of at least one selected from the group including silicon molding compound (SMC), ceramic, photo sensitive glass (PSG), sapphire (Al 2 O 3 ), and the like.
  • the body 113 may include a high refractive index filler such as TiO 2 and SiO 2 .
  • the first frame 111 and the second frame 112 may be provided as a conductive frame.
  • the first frame 111 and the second frame 112 can stably provide the structural strength of the package body 110 and can be electrically connected to the light emitting device 120.
  • the light emitting device 120 may include a first bonding portion 121, a second bonding portion 122, a light emitting structure 123, and a substrate 124.
  • the light emitting device 120 may include the light emitting structure 123 disposed under the substrate 124, as shown in FIG.
  • the first bonding part 121 and the second bonding part 122 may be disposed between the light emitting structure 123 and the body 113.
  • the light emitting structure 123 may include a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer.
  • the first bonding portion 121 may be electrically connected to the first conductive semiconductor layer.
  • the second bonding portion 122 may be electrically connected to the second conductivity type semiconductor layer.
  • the light emitting device 120 may be disposed on the package body 110.
  • the light emitting device 120 may be disposed on the first frame 111 and the second frame 112.
  • the light emitting device 120 may be disposed in the cavity C provided by the package body 110.
  • the light emitting device 120 may be disposed on the body 113.
  • the first bonding part 121 may be disposed on a lower surface of the light emitting device 120.
  • the second bonding portion 122 may be disposed on a lower surface of the light emitting device 120.
  • the first bonding part 121 and the second bonding part 122 may be spaced apart from each other on a lower surface of the light emitting device 120.
  • the first bonding part 121 may be disposed on the first frame 111.
  • the second bonding portion 122 may be disposed on the second frame 112.
  • the first bonding portion 121 may be disposed between the light emitting structure 123 and the first frame 111.
  • the second bonding portion 122 may be disposed between the light emitting structure 123 and the second frame 112.
  • the first bonding portion 121 and the second bonding portion 122 may be formed of one selected from the group consisting of Ti, Al, In, Ir, Ta, Pd, Co, Cr, Mg, Zn, Ni, Si, Layer or an alloy using at least one material or alloy selected from the group consisting of Hf, Pt, Ru, Rh, ZnO, IrOx, RuOx, NiO, RuOx / ITO, Ni / IrOx / Au, Ni / IrOx / And may be formed in multiple layers.
  • the light emitting device package 100 may include a first adhesive 130, as shown in FIG.
  • the first adhesive 130 may be disposed between the body 113 and the light emitting device 120.
  • the first adhesive 130 may be disposed between the upper surface of the body 113 and the lower surface of the light emitting device 120.
  • the first adhesive 130 may be disposed to overlap the light emitting device 120 in the vertical direction.
  • the first adhesive 130 may be disposed to overlap the light emitting device 120 with reference to a direction from the lower surface of the body 113 toward the upper surface.
  • the light emitting device package 100 may include a recess R as shown in FIGS. 1 to 5.
  • the recesses R may be provided in the body 113.
  • the recess R may be recessed in a first direction from the upper surface to the lower surface of the body 113.
  • the recess R may be disposed below the light emitting device 120.
  • the recess R may be provided to overlap with the light emitting device 120 in the first direction.
  • the recess R may be disposed between the first bonding portion 121 and the second bonding portion 122.
  • the recess R may be provided so as not to overlap with the first bonding portion 121 in the first direction.
  • the recess R may be provided so as not to overlap with the second bonding portion 122 in the first direction.
  • the first adhesive 130 may be disposed in the recess R.
  • the first adhesive 130 may be disposed between the light emitting device 120 and the body 113.
  • the first adhesive 130 may be disposed between the first bonding part 121 and the second bonding part 122.
  • the first adhesive 130 may be disposed in contact with a side surface of the first bonding portion 121 and a side surface of the second bonding portion 122.
  • the first adhesive 130 may provide a stable fixing force between the light emitting device 120 and the package body 110.
  • the first adhesive 130 may provide a stable fixing force between the light emitting device 120 and the body 113.
  • the first adhesive 130 may be disposed in direct contact with the upper surface of the body 113, for example.
  • the first adhesive 130 may be disposed in direct contact with the lower surface of the light emitting device 120.
  • the first adhesive 130 may be provided as an insulating adhesive.
  • the first adhesive 130 may include at least one of an epoxy-based material, a silicone-based material, a hybrid material including an epoxy-based material and a silicon-based material .
  • the adhesive may comprise a white silicone.
  • the first adhesive 130 may provide a stable fixing force between the body 113 and the light emitting device 120 and may prevent the light emitting device 120 from being damaged when light is emitted to the lower surface of the light emitting device 120.
  • a light diffusing function may be provided between the body 113 and the body 113.
  • the first adhesive 130 provides a light diffusion function to improve the light extraction efficiency of the light emitting device package 100 have.
  • the first adhesive 130 may reflect light emitted from the light emitting device 120.
  • the first adhesive 130 includes a reflection function
  • the first adhesive 130 may be formed of a material including TiO 2 , Silicone, and the like.
  • the depth T1 of the recess R may be smaller than the thickness T2 of the first frame 111 or the thickness T2 of the second frame 112.
  • the depth T1 of the recess R may be determined in consideration of the adhesive force of the first adhesive 130.
  • the depth T1 of the recess R may be determined by taking into consideration the stable strength of the body 113 and / or by applying heat to the light emitting device package 100 by heat emitted from the light emitting device 120. [ Can be determined not to occur.
  • the recess R may provide a suitable space under which an under-fill process may be performed under the light emitting device 120.
  • the underfilling process may be a process of mounting the light emitting device 120 on the package body 110 and disposing the first adhesive 130 under the light emitting device 120,
  • the first adhesive 130 may be disposed on the recess R to be mounted through the first adhesive 130 in the process of mounting the device 120 on the package body 110, As shown in FIG.
  • the recess R may be provided at a depth greater than the first depth so that the first adhesive 130 may be sufficiently provided between the lower surface of the light emitting device 120 and the upper surface of the body 113.
  • the recesses R may be provided at a second depth or less to provide stable strength of the body 113.
  • the depth (T1) and the width (W4) of the recess (R) may affect the forming position and fixing force of the first adhesive (130).
  • the depth T1 and the width W4 of the recess R are determined so that a sufficient fixing force can be provided by the first adhesive 130 disposed between the body 113 and the light emitting device 120 .
  • the depth (T1) of the recess (R) may be provided by several tens of micrometers.
  • the depth (T1) of the recess (R) may be provided from 40 micrometers to 60 micrometers.
  • the width W4 of the recess R may be several tens of micrometers to several hundreds of micrometers.
  • the width W4 of the recess R may be provided in the major axis direction of the light emitting device 120 to secure a fixing force between the light emitting device 120 and the package body 110.
  • the width W4 of the recess R may be narrower than the gap between the first bonding portion 121 and the second bonding portion 122.
  • the width W4 of the recess R with respect to the major axis length of the light emitting device 120 may be provided in a range of 5% or more to 80% or less.
  • the adhesive 130 is disposed on each of the first and second frames 111 and 112 between the recess R and the first and second openings TH1 and TH2 .
  • the fixation force between the first and second frames 111 and 112 between the recess R and the first and second openings TH1 and TH2 and the light emitting device 120 can be secured.
  • the thickness T2 of the first frame 111 and the thickness T2 of the second frame 112 may be provided corresponding to the thickness of the body 113. [ The thickness T2 of the first frame 111 and the thickness T2 of the second frame 112 may be provided to a thickness sufficient to maintain a stable strength of the body 113. [
  • the thickness T2 of the first frame 111 may be several hundred micrometers.
  • the thickness T2 of the first frame 111 may be 180 to 500 micrometers.
  • the thickness T2 of the first frame 111 may be 500 micrometers.
  • the thickness of (T2-T1) may be selected to be at least 100 micrometers or more. This is in consideration of the thickness of the injection process capable of providing crack free of the body 113.
  • the ratio of the T1 thickness to the T2 thickness may be 2 to 10.
  • the thickness of T2 may be provided at 200 micrometers, the thickness of T1 may be provided from 20 micrometers to 100 micrometers.
  • the ratio of the T1 thickness to the T2 thickness (T2 / T1) is equal to or greater than 2, mechanical strength can be secured so that cracks do not occur in the body 113 or that the body 113 is not broken.
  • the amount of the adhesive 130 disposed in the recess R can be sufficiently arranged until the ratio of the T1 thickness to the T2 thickness (T2 / T1) is 10 or less, The fixing force between the light emitting device packages 110 can be improved.
  • the light emitting device package 100 may include a second adhesive 133, as shown in FIGS. 3 and 4.
  • the second adhesive 133 may be disposed between the first frame 111 and the light emitting device 120.
  • the second adhesive 133 may be disposed between the second frame 112 and the light emitting device 120.
  • the second adhesive 133 may be disposed between the upper surface of the package body 110 and the lower surface of the light emitting device 120.
  • the second adhesive 133 may be disposed in direct contact with the upper surface of the package body 110.
  • the second adhesive 133 may be disposed in direct contact with the lower surface of the light emitting device 120.
  • the second adhesive 133 may be disposed in direct contact with the lower surface of the first bonding portion 121. In addition, the second adhesive 133 may be disposed in direct contact with the lower surface of the second bonding portion 122.
  • the second adhesive 133 may be provided as an example of a conductive adhesive.
  • the first frame 111 and the first bonding part 121 may be electrically connected through the second adhesive 133.
  • the second frame 112 and the second bonding part 122 may be electrically connected through the second adhesive 133.
  • the second adhesive 133 may include one material or an alloy thereof selected from the group including Ag, Au, Pt, and the like.
  • the second adhesive 133 may be made of a material capable of securing a conductive function.
  • the second adhesive 133 may be formed using a conductive paste.
  • the conductive paste may be selected from the group consisting of solder paste, silver paste and the like.
  • the first adhesive 130 and the second adhesive 133 may include different materials.
  • the first adhesive 130 may be provided as an insulating adhesive
  • the second adhesive 133 may be provided as a conductive adhesive.
  • the light emitting device package according to the embodiment may include a first upper recess R10 and a second upper recess R20, as shown in FIGS. 1 to 5.
  • the first upper recess R10 may be provided on the upper surface of the first frame 111. [ The first upper recess R10 may be recessed from the upper surface of the first frame 111 in a downward direction. The first upper recess R10 may be spaced apart from the recess R. [
  • the first upper recess R10 may be overlapped with a portion of the first bonding portion 121 in the first direction with reference to a first direction from the lower surface of the first frame 111 toward the upper surface .
  • the first upper recess R10 may be overlapped with a portion of the light emitting structure 123 with respect to the first direction.
  • the first upper recess R10 has an outer surface of the package body 110, an inner surface of the package body, and an inner surface of the package body 110, as viewed from above the light emitting device 120. [ And an extended side connecting the outer side and the inner side and arranged in parallel with a direction in which the recess R extends.
  • the inner surface may be provided extending inwardly from three sides of the first bonding portion 121.
  • the outer surface of the first upper recess R10 may be provided in two short sides facing each other in the minor axis direction of the package body 110 and an outer peripheral region in the major axis direction.
  • the first upper recess R10 may have three outer side surfaces, three inner side surfaces, two extended side surfaces, and may be provided around the first bonding portion 121 in a " have.
  • the inner surface of the package body 110 is connected to the second adhesive 133 (see FIG. 4) ) Adjacent to the three sides of the frame.
  • the outer surface of the first upper recess R10 may be provided in two short sides facing each other in the minor axis direction of the package body 110 and an outer peripheral region in the major axis direction.
  • the first upper recess R10 may have three outer side surfaces and three inner side surfaces, two extended side surfaces, and may be provided in the shape of " [" have.
  • the first frame 111 may include a first region extending in a direction in which the first upper recess R10 is provided along the major axis direction of the light emitting device 120 from a region where the body 113 is disposed .
  • the second adhesive 133 may be disposed in the first area of the first frame 111.
  • the second adhesive 133 may be disposed so as to overlap the first bonding portion 121 with respect to the first direction.
  • the first region may be provided as a flat surface. Also, the first region may correspond to an area defined by the three inner sides.
  • a portion of the first upper recess R10 may be formed in a portion of the light emitting structure 123 and a portion of the light emitting structure 123 in the upper direction of the light emitting device 120, And may be provided to overlap in the vertical direction.
  • three inner side regions of the first upper recess R10 adjacent to the first bonding portion 121 may be provided extending below the light emitting structure 123.
  • the first upper recess R10 may be disposed to overlap with the first bonding portion 121 in the vertical direction.
  • the second upper recess R20 may be provided on the upper surface of the second frame 112.
  • the second upper recess R20 may be recessed in a downward direction from the upper surface of the second frame 112.
  • the second upper recess R20 may be spaced apart from the recess R. [
  • the second upper recess R20 may be spaced apart from the first upper recess R10.
  • the second upper recess R20 may be overlapped with a portion of the second bonding portion 122 in the first direction with reference to a first direction from the lower surface of the second frame 112 toward the upper surface .
  • the second upper recess R20 may be overlapped with a portion of the light emitting structure 123 with respect to the first direction.
  • the second upper recess R20 includes an outer surface of the package body 110 and an inner surface of the package body, And an extended side connecting the outer side and the inner side and arranged in parallel with a direction in which the recess R extends.
  • the inner side surface may be provided extending inwardly from three sides of the second bonding portion 122.
  • the second upper recess R20 may have three outer sides, three inner sides, two extended sides, and may be provided "] " around the second bonding portion 122 have.
  • the inner surface of the package body 110 when viewed from the upper direction of the light emitting device 120, is connected to the second adhesive 133 (133) ) Adjacent to the three sides of the frame.
  • the outer surface of the second upper recess R20 may be provided on two sides facing each other in the minor axis direction of the package body 110 and an outer peripheral region in the major axis direction.
  • the second upper recess R20 may have three outer sides, three inner sides, two extended sides, and may be provided in the shape of "] " around the second adhesive 133 have.
  • the second frame 112 may include a first region extending in a direction in which the second upper recess R20 is provided along the major axis direction of the light emitting device 120 from a region where the body 113 is disposed .
  • the second adhesive 133 may be disposed in the first area of the second frame 112.
  • the second adhesive 133 may be disposed to overlap the second bonding portion 122 with respect to the first direction.
  • the first region may be provided as a flat surface. Also, the first region may correspond to an area defined by the three inner sides.
  • the light emitting structure 123 In the vertical direction.
  • three inner side regions of the second upper recess R20 adjacent to the second bonding portion 122 may be provided extending below the light emitting structure 123.
  • the second upper recess R20 may be disposed to overlap the second bonding portion 122 in the vertical direction.
  • first upper recess R10 and the second upper recess R20 may be provided in a width of several tens of micrometers to several hundreds of micrometers.
  • the side surfaces of the first and second upper recesses R10 and R20 may have an inclined surface and may have a curvature.
  • the first and second upper recesses R10 and R20 may have a spherical shape, and a side surface thereof may have a circular shape.
  • the second adhesive 133 is disposed on the first frame 111 and the second frame 112, as shown in FIGS. 1 to 5, .
  • the second adhesive 133 may be provided on the first area of the first frame 111 and be disposed between the first bonding part 121 and the first frame 111.
  • the second adhesive 133 may be disposed in direct contact with the lower surface of the first bonding portion 121.
  • the second adhesive 133 may be provided on the second frame 112 and disposed under the second bonding part 122.
  • the second adhesive 133 may be disposed in direct contact with the lower surface of the second bonding portion 122.
  • the second adhesive 133 is provided on the first frame 111, and the first bonding portion 121 of the light emitting device 120 is mounted on the second adhesive 133 .
  • a part of the second adhesive 133 may be partially embedded in the first upper recess R10 while the first bonding part 121 of the light emitting device 120 is mounted on the second adhesive 133. [ And may be diffused to the side of the light emitting structure 123 to be electrically connected to the active layer, thereby causing a short circuit problem of the light emitting device 120.
  • a second distance D2 from a side surface of the light emitting device 120 to a side surface of the first bonding portion 121 is greater than a second distance D2 between the light emitting device 120 and the first bonding portion 121.
  • 120 to the side of the first upper recess R10 disposed below the lower surface of the light emitting device 120 is greater than a second distance D2 between the light emitting device 120 and the first bonding portion 121.
  • a second distance D2 from the side surface of the light emitting device 120 to the side surface of the first bonding portion 121 is a distance from the side surface of the light emitting structure 123 to the side surface of the first bonding portion 121 As shown in FIG. A first distance D1 from a side surface of the light emitting device 120 to a side surface of the first upper recess R10 disposed below the lower surface of the light emitting device 120 is greater than a distance D1 from a side surface of the light emitting structure 123 May correspond to the distance to the inner surface of the first upper recess R10 disposed below the lower surface of the light emitting structure 123. [
  • the second distance D2 from the side of the light emitting device 120 to the side of the first bonding portion 121 may be several tens of micrometers.
  • the second distance D2 from the side surface of the light emitting device 120 to the side surface of the first bonding portion 121 may be 40 to 50 micrometers.
  • the light emitting device 120 may further include a light emitting device 120 disposed on a side surface of the first upper recess R10,
  • the distance D1 may be several micrometers or several tens of micrometers larger than the second distance D2.
  • a part of the first upper recess R10 may overlap with a part of the first bonding part 121 in the first direction. Accordingly, even when the second adhesive 133 is excessively supplied and diffused to the periphery, the second adhesive 133 is not moved upward in the side direction of the first bonding part 121, And can be diffused into the upper recess R10 region.
  • the second adhesive 133 can be prevented from spreading toward the light emitting structure 123 on the side surface of the first bonding portion 121, the second adhesive 133, which is a conductive material, It is possible to prevent the light emitting device 120 from being electrically short-circuited by the diffusion of the light emitting device 133.
  • the second adhesive 112 is provided with the second adhesive 133 and the second bonding portion 122 of the light emitting device 120 is bonded to the second adhesive 112 133).
  • a part of the second adhesive 133 may be bonded to the second upper recess R20 while the second bonding portion 122 of the light emitting device 120 is mounted on the second adhesive 133. [ Or may be diffused on the side surface of the second bonding part 122. [
  • the light emitting device 120 when viewed from the upper direction of the light emitting device 120, the light emitting device 120 may be formed so as to extend from the side of the light emitting device 120 to the side of the second bonding part 122 The distance to the side may be smaller than the distance from the side of the light emitting device 120 to the side of the second upper recess R20 disposed below the lower surface of the light emitting device 120.
  • a portion of the second upper recess R20 may be disposed in a direction perpendicular to the lower surface of the second bonding portion 122.
  • the second adhesive 133 can be prevented from spreading toward the light emitting structure 123 on the side surface of the second bonding portion 122, the second adhesive 133 It is possible to prevent the light emitting device 120 from being electrically short-circuited.
  • the second adhesive 133 can be prevented from rising on the side surface of the light emitting device 120, the first conductive semiconductor layer and the second conductive semiconductor layer, which form the light emitting device 120, It is possible to prevent electrical short-circuiting. Also, since the second adhesive 133 can be prevented from being disposed on the side of the active layer of the light emitting device 120, the light extraction efficiency of the light emitting device 120 can be improved.
  • the light emitting device package 100 may include the first resin part 135 as shown in FIGS. 1 to 5.
  • the first resin part 135 may be disposed between the first frame 111 and the light emitting device 120.
  • the first resin part 135 may be disposed between the second frame 112 and the light emitting device 120.
  • the first resin part 135 may be disposed on a side surface of the first bonding part 121.
  • the first resin part 135 may be disposed on a side surface of the second bonding part 122.
  • the first resin part 135 may be disposed under the light emitting structure 123.
  • the first resin part 135 may be disposed on the side of the second adhesive 133.
  • the first resin part 135 may be in contact with the lower surface of the light emitting device 120 directly.
  • the first resin part 135 may be disposed in direct contact with the side surface of the second adhesive 133.
  • the first resin part 135 may be disposed in the first upper recess R10.
  • the first resin part 135 may be disposed in the second upper recess R20.
  • the second adhesive 133 may flow over the first upper recess R10. Accordingly, the first resin part 135 may be disposed on the second adhesive 133 in the first upper recess R10.
  • the second adhesive 133 is diffused into the first upper recess R10 region or diffused to the side of the first bonding portion 121 by the first resin portion 135, The second adhesive 133 can be prevented from moving in the lateral direction of the light emitting structure 123.
  • the first resin part 135 may be disposed in the first upper recess R10 and contacted with the second adhesive 133. [ The first resin part 135 may be disposed in the first upper recess R10 and may be provided around the second adhesive 133. The first resin part 135 may be disposed in the first upper recess R10 and provided around the first bonding part 121. [
  • the second adhesive 133 may be disposed so as to be surrounded by the first adhesive 130 and the first resin part 135. Accordingly, since the first and second adhesive and resin portions, which are made of different materials, are disposed between the light emitting device 120 and the package body 110, the reliability of the light emitting device package 100 can be improved .
  • the second adhesive 133 may flow over the second upper recess R20. Accordingly, the first resin part 135 may be disposed on the second adhesive 133 in the second upper recess R20.
  • the second adhesive 133 is diffused into the second upper recess R20 region or diffused to the side of the second bonding portion 122 by the first resin portion 135, The second adhesive 133 can be prevented from moving in the lateral direction of the light emitting structure 123.
  • the first resin part 135 may be disposed in the second upper recess R20 and may be in contact with the second adhesive 133.
  • the first resin part 135 may be disposed in the second upper recess R20 and may be provided around the second adhesive 133.
  • the first resin part 135 may be disposed in the second upper recess R20 and may be provided around the second bonding part 122.
  • the first resin part 135 filled in the first upper recess R10 and the second upper recess R20 is connected to the first bonding part 121 and the second bonding part 122, The periphery can be effectively sealed.
  • the first resin part 135 may include at least one of an epoxy-based material, a silicone-based material, a hybrid material including an epoxy-based material and a silicon-based material can do.
  • the first resin part 135 may be a reflective part that reflects light emitted from the light emitting device 120 and may be a resin including a reflective material such as TiO 2 or a white silicone ).
  • the first resin part 135 may be disposed below the light emitting device 120 to perform a sealing function. In addition, the first resin part 135 can improve adhesion between the light emitting device 120 and the first frame 111. The first resin part 135 can improve the adhesion between the light emitting device 120 and the second frame 112.
  • the first resin part 135 may seal the first bonding part 121 and the second bonding part 122.
  • the first resin part 135 may prevent the second adhesive 133 from diffusing and moving in the lateral direction of the light emitting device 120.
  • the second adhesive 133 diffuses and moves in the lateral direction of the light emitting device 120, the second adhesive 133 may contact the active layer of the light emitting device 120, resulting in a failure due to a short circuit . Therefore, when the first resin part 135 is disposed, the second adhesive 133 and the active layer can be prevented from being short-circuited, thereby improving the reliability of the light emitting device package according to the embodiment.
  • the first resin part 135 may transmit light from the light emitting element 120 to the package body 110 The light extraction efficiency of the light emitting device package 100 can be improved.
  • the light emitting device package 100 may include a second resin part 140, as shown in FIG.
  • the second resin part 140 may be formed in the shape of a rectangle such that the arrangement of the first frame 111, the second frame 112, I did not.
  • the second resin part 140 may be provided on the light emitting device 120.
  • the second resin part 140 may be disposed on the first frame 111 and the second frame 112.
  • the second resin part 140 may be disposed in the cavity C provided by the package body 110.
  • the second resin part 140 may be disposed on the first resin part 135.
  • the second resin part 140 may include an insulating material.
  • the second resin part 140 may include wavelength conversion means for receiving light emitted from the light emitting device 120 and providing wavelength-converted light.
  • the second resin part 140 may include at least one selected from the group including phosphors, quantum dots, and the like.
  • the first resin part 135 is not provided separately, and the second resin part 140 is provided between the first frame 111 and the second frame part Or may be arranged to be in direct contact with the second frame 112.
  • the second resin part 140 may be disposed in the first upper recess R10 and the second upper recess R20.
  • the light emitting structure 123 may be provided as a compound semiconductor.
  • the light emitting structure 123 may be formed of, for example, a Group 2-VI-VI or Group III-V compound semiconductor.
  • the light emitting structure 123 may include at least two elements selected from aluminum (Al), gallium (Ga), indium (In), phosphorus (P), arsenic (As) .
  • the light emitting structure 123 may include a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer.
  • the first and second conductivity type semiconductor layers may be formed of at least one of Group III-V-Vs or Group V-VIs compound semiconductors.
  • the first and second conductivity type semiconductor layers are formed of a semiconductor material having a composition formula of In x Al y Ga 1-xy N (0? X? 1, 0? Y? 1, 0? X + y? .
  • the first and second conductive semiconductor layers may include at least one selected from the group consisting of GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, .
  • the first conductive semiconductor layer may be an n-type semiconductor layer doped with an n-type dopant such as Si, Ge, Sn, Se or Te.
  • the second conductive semiconductor layer may be a p-type semiconductor layer doped with a p-type dopant such as Mg, Zn, Ca, Sr or Ba.
  • the active layer may be formed of a compound semiconductor.
  • the active layer may be implemented, for example, in at least one of Group 3-Group-5 or Group-6-Group compound semiconductors.
  • the active layer may include a plurality of alternately arranged well layers and a plurality of barrier layers, and may be In x Al y Ga 1 -x- y N , 0? Y? 1, 0? X + y? 1).
  • the active layer may be selected from the group consisting of InGaN / GaN, GaN / AlGaN, AlGaN / AlGaN, InGaN / InGaN, InGaN / InGaN, AlGaAs / GaAs, InGaAs / GaAs, InGaP / GaP, AlInGaP / InGaP, And may include at least one.
  • the light emitting device package 100 is connected to the first bonding portion 121 through the second adhesive 133 provided on the first frame 111, And power may be connected to the second bonding portion 122 through the second adhesive 133 provided on the second bonding portion 122.
  • the light emitting device 120 can be driven by the driving power supplied through the first bonding part 121 and the second bonding part 122.
  • the light emitted from the light emitting device 120 may be provided in an upward direction of the package body 110.
  • the light emitting device package 100 may be mounted on a submount, a circuit board, or the like.
  • a high temperature process such as a reflow process can be applied.
  • a re-melting phenomenon occurs in the bonding region between the lead frame and the light emitting device provided in the light emitting device package, so that the stability of electrical connection and physical coupling can be weakened.
  • the first bonding portion 121 and the second bonding portion 122 of the light emitting device 120 according to the embodiment are formed in the second And the driving power can be supplied through the adhesive 133.
  • the melting point of the second adhesive 133 may be selected to have a higher value than the melting point of the common bonding material.
  • the light emitting device package 100 and the method of manufacturing the light emitting device package according to the embodiment since the light emitting device 120 is mounted on the package body 110 using the conductive paste, The package body 110 does not need to be exposed to high temperatures. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discolored.
  • the selection range for the material constituting the body 113 can be widened.
  • the body 113 may be provided using not only expensive materials such as ceramics but also relatively inexpensive resin materials.
  • the body 113 may include at least one material selected from the group consisting of PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin and SMC can do.
  • PPA PolyPhtalAmide
  • PCT PolyCyclohexylenedimethylene Terephthalate
  • EMC Epoxy Molding Compound
  • FIG. 6 a method of manufacturing a light emitting device package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 5.
  • FIG. 6 a method of manufacturing a light emitting device package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 5.
  • a method of manufacturing a light emitting device package may include providing a package body 110.
  • the package body 110 may include a first frame 111 and a second frame 112.
  • the first frame 111 and the second frame 112 may be spaced apart from each other.
  • the package body 110 may include a body 113.
  • the body 113 may be disposed between the first frame 111 and the second frame 112.
  • the body 113 may function as an electrode separation line.
  • the body 113 may be referred to as an insulating member.
  • the package body 110 may include a recess R provided in the body 113.
  • the recesses R may be provided in the body 113.
  • the recess (R) may be recessed in a downward direction from an upper surface of the body (113).
  • first frame 111 may include a first upper recess R10.
  • second frame 112 may include a second upper recess R20.
  • the first upper recess R10 may be provided on the upper surface of the first frame 111. [ The first upper recess R10 may be recessed from the upper surface of the first frame 111 in a downward direction. The first upper recess R10 may be spaced apart from the recess R. [
  • the second upper recess R20 may be provided on the upper surface of the second frame 112.
  • the second upper recess R20 may be recessed in a downward direction from the upper surface of the second frame 112.
  • the second upper recess R20 may be spaced apart from the recess R.
  • a second adhesive 133 may be provided on the first frame 111 and the second frame 112, as shown in FIG. 6, .
  • the second adhesive 133 may be provided on a part of the area adjacent to the first upper recess R10 and a part of the area adjacent to the second upper recess R20 through a doting method or the like have.
  • the second adhesive 133 may be provided as a conductive adhesive.
  • the second adhesive 133 may include one material or an alloy thereof selected from the group including Ag, Au, Pt, and the like.
  • the second adhesive 133 may be made of a material capable of securing a conductive function.
  • the second adhesive 133 may be formed using a conductive paste.
  • the conductive paste may be selected from the group consisting of solder paste, silver paste and the like.
  • the light emitting device 120 may be provided on the package body 110.
  • the light emitting device 120 may be provided on the package body 110.
  • the recess R may be used as an align key in the process of disposing the light emitting device 120 on the package body 110.
  • the light emitting device 120 may be fixed to the body 113 by the second adhesive 133.
  • the second adhesive 133 provided on the first frame 111 may be adhered to the first bonding portion 121 of the light emitting device 120.
  • the second adhesive 133 provided on the second frame 112 may be adhered to the second bonding portion 122 of the light emitting device 120.
  • the first adhesive 130 may be provided to the recess R.
  • the first adhesive 130 may be injected into the recess R.
  • the first adhesive 130 may be provided in a region where the recess R is formed, and may be provided to overflow the recess R. Referring to FIG.
  • the length L2 of the recess R may be greater than the length L1 of the light emitting device 120 in the minor axis direction. Accordingly, according to the embodiment, the first adhesive 130 can be injected into the lower region of the light emitting device 120 through the recesses R.
  • the first adhesive 130 provided in the recess R The portion overflowing while being bonded to the lower portion of the light emitting device 120 can be moved in the direction of the length L2 of the recess R.
  • the first adhesive 130 may be moved in the direction of the first bonding part 121 and the second bonding part 122 provided in the light emitting device 120. Thus, even when the amount of the first adhesive 130 is greater than that of the design, the light emitting device 120 can be stably fixed without lifting from the body 113.
  • the first adhesive 130 may be provided on a wide area between the lower surface of the light emitting device 120 and the upper surface of the body 113.
  • the light emitting device 120 and the body 113 Can be improved.
  • the light emitting device 120 can be fixed to the upper surface of the package body 110 by the first adhesive 130 and the second adhesive 133.
  • the first adhesive 130 may be provided as an insulating adhesive
  • the second adhesive 133 may be provided as a conductive adhesive.
  • a first resin part 135 may be formed.
  • the first resin part 135 may be disposed between the first frame 111 and the light emitting device 120, as described with reference to FIGS.
  • the first resin part 135 may be disposed between the second frame 112 and the light emitting device 120.
  • the first resin part 135 may be disposed on a side surface of the first bonding part 121.
  • the first resin part 135 may be disposed on a side surface of the second bonding part 122.
  • the first resin part 135 may be disposed under the light emitting structure 123.
  • the first resin part 135 may be in contact with the lower surface of the light emitting device 120 directly.
  • the first resin part 135 may be in direct contact with the side surface of the second adhesive 133.
  • the first resin part 135 may be disposed in the first upper recess R10.
  • the first resin part 135 may be disposed in the first upper recess R10 and contacted with the second adhesive 133.
  • the first resin part 135 may be disposed in the first upper recess R10 and may be provided around the second adhesive 133.
  • the first resin part 135 may be disposed in the first upper recess R10 and provided around the first bonding part 121.
  • the first resin part 135 may be disposed in the second upper recess R20.
  • the first resin part 135 may be disposed in the second upper recess R20 and may be in contact with the second adhesive 133.
  • the first resin part 135 may be disposed in the second upper recess R20 and may be provided around the second adhesive 133.
  • the first resin part 135 may be disposed in the second upper recess R20 and may be provided around the second bonding part 122.
  • the first resin part 135 may include at least one of an epoxy-based material, a silicone-based material, a hybrid material including an epoxy-based material and a silicon-based material can do.
  • the first resin part 135 may be a reflective part that reflects light emitted from the light emitting device 120 and may be a resin including a reflective material such as TiO 2 or a white silicone ).
  • the first resin part 135 may be disposed below the light emitting device 120 to perform a sealing function. In addition, the first resin part 135 can improve adhesion between the light emitting device 120 and the first frame 111. The first resin part 135 can improve the adhesion between the light emitting device 120 and the second frame 112.
  • the first resin part 135 may seal the first bonding part 121 and the second bonding part 122.
  • the first resin part 135 may prevent the second adhesive 133 from diffusing and moving in the lateral direction of the light emitting device 120.
  • the second adhesive 133 diffuses and moves in the lateral direction of the light emitting device 120, the second adhesive 133 may contact the active layer of the light emitting device 120, resulting in a failure due to a short circuit . Therefore, when the first resin part 135 is disposed, the second adhesive 133 and the active layer can be prevented from being short-circuited, thereby improving the reliability of the light emitting device package according to the embodiment.
  • the first resin part 135 may transmit light from the light emitting element 120 to the package body 110 The light extraction efficiency of the light emitting device package 100 can be improved.
  • a second resin part 140 may be provided on the light emitting device 120 as shown in FIG.
  • the second resin part 140 may be provided on the light emitting device 120.
  • the second resin part 140 may be disposed on the first frame 111 and the second frame 112.
  • the second resin part 140 may be disposed in the cavity C provided by the package body 110.
  • the second resin part 140 may be disposed on the first resin part 135.
  • the second resin part 140 may include an insulating material.
  • the second resin part 140 may include wavelength conversion means for receiving light emitted from the light emitting device 120 and providing wavelength-converted light.
  • the second resin part 140 may include at least one selected from the group including phosphors, quantum dots, and the like.
  • the first adhesive (not shown) is formed under the light emitting device 120 130 are formed on the substrate.
  • the second adhesive 133 is provided on the first and second frames 111 and 112, and the second adhesive 133 is provided on the first and second frames 111 and 112.
  • the light emitting device 120 may be provided and fixed on the first adhesive 130 and the second adhesive 133.
  • the first resin part 135 is not formed and only the second resin part 140 is formed in the cavity of the package body 110 .
  • the light emitting device package 100 is connected to the first bonding portion 121 through the second adhesive 133 provided on the first frame 111,
  • the second bonding agent 122 may be connected to the second bonding agent 122 through the second adhesive 133 provided on the second bonding part 122.
  • the light emitting device 120 can be driven by the driving power supplied through the first bonding part 121 and the second bonding part 122.
  • the light emitted from the light emitting device 120 may be provided in an upward direction of the package body 110.
  • the light emitting device package 100 may be mounted on a submount, a circuit board, or the like.
  • a high temperature process such as a reflow process can be applied.
  • re-melting phenomenon occurs in the bonding region between the frame and the light emitting device provided in the light emitting device package, so that the stability of electrical connection and physical coupling can be weakened, And the optical and electrical characteristics and reliability of the light emitting device package may be deteriorated.
  • the first bonding portion 121 and the second bonding portion 122 of the light emitting device 120 according to the embodiment are formed in the second And the driving power can be supplied through the adhesive 133.
  • the melting point of the second adhesive 133 may be selected to have a higher value than the melting point of the common bonding material.
  • the light emitting device package 100 and the method of manufacturing the light emitting device package according to the embodiment since the light emitting device 120 is mounted on the package body 110 using the conductive paste, The package body 110 is not exposed to high temperatures. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discolored.
  • the selection range for the material constituting the body 113 can be widened.
  • the body 113 may be provided using not only expensive materials such as ceramics but also relatively inexpensive resin materials.
  • the body 113 may include at least one material selected from the group consisting of PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin and SMC can do.
  • PPA PolyPhtalAmide
  • PCT PolyCyclohexylenedimethylene Terephthalate
  • EMC Epoxy Molding Compound
  • FIG. 10 is a view illustrating another example of a light emitting device package according to an embodiment of the present invention.
  • FIG. 10 a light emitting device package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 9.
  • FIG. 10 a light emitting device package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 9.
  • the light emitting device package may include a package body 110 and a light emitting device 120, as shown in FIG.
  • the package body 110 may include a first frame 111 and a second frame 112.
  • the first frame 111 and the second frame 112 may be spaced apart from each other.
  • the package body 110 may include a body 113.
  • the body 113 may be disposed between the first frame 111 and the second frame 112.
  • the body 113 may function as an electrode separation line.
  • the body 113 may be referred to as an insulating member.
  • the light emitting device 120 may include a first bonding portion 121, a second bonding portion 122, a light emitting structure 123, and a substrate 124.
  • the light emitting device 120 may be disposed on the package body 110.
  • the light emitting device 120 may be disposed on the first frame 111 and the second frame 112.
  • the light emitting device 120 may be disposed in the cavity C provided by the package body 110.
  • the light emitting device 120 may be disposed on the body 113.
  • the first bonding part 121 may be disposed on a lower surface of the light emitting device 120.
  • the second bonding portion 122 may be disposed on a lower surface of the light emitting device 120.
  • the first bonding part 121 and the second bonding part 122 may be spaced apart from each other on a lower surface of the light emitting device 120.
  • the first bonding part 121 may be disposed on the first frame 111.
  • the second bonding portion 122 may be disposed on the second frame 112.
  • the first bonding portion 121 may be disposed between the light emitting structure 123 and the first frame 111.
  • the second bonding portion 122 may be disposed between the light emitting structure 123 and the second frame 112.
  • the light emitting device package according to the embodiment may include a first adhesive 130.
  • the first adhesive 130 may be disposed between the body 113 and the light emitting device 120.
  • the first adhesive 130 may be disposed between the upper surface of the body 113 and the lower surface of the light emitting device 120.
  • the first adhesive 130 may be disposed to overlap the light emitting device 120 in the vertical direction.
  • the first adhesive 130 may be disposed to overlap the light emitting device 120 with reference to a direction from the lower surface of the body 113 toward the upper surface.
  • the light emitting device package according to the embodiment may include a recess R as shown in FIG.
  • the recesses R may be provided in the body 113.
  • the recess R may be recessed in a first direction from the upper surface to the lower surface of the body 113.
  • the recess R may be disposed below the light emitting device 120.
  • the recess R may be provided to overlap with the light emitting device 120 in the first direction.
  • the recess R may be disposed between the first bonding portion 121 and the second bonding portion 122.
  • the recess R may be provided so as not to overlap with the first bonding portion 121 in the first direction.
  • the recess R may be provided so as not to overlap with the second bonding portion 122 in the first direction.
  • the first adhesive 130 may be disposed in the recess R.
  • the first adhesive 130 may be disposed between the light emitting device 120 and the body 113.
  • the first adhesive 130 may be disposed between the first bonding part 121 and the second bonding part 122.
  • the first adhesive 130 may be disposed in contact with a side surface of the first bonding portion 121 and a side surface of the second bonding portion 122.
  • the recess R may provide a suitable space under which an under-fill process may be performed under the light emitting device 120.
  • the underfilling process may be a process of mounting the light emitting device 120 on the package body 110 and disposing the first adhesive 130 under the light emitting device 120,
  • the first adhesive 130 may be disposed on the recess R to be mounted through the first adhesive 130 in the process of mounting the device 120 on the package body 110, As shown in FIG.
  • the light emitting device package 100 may include a second adhesive 133, as shown in FIG.
  • the second adhesive 133 may be disposed between the first frame 111 and the light emitting device 120.
  • the second adhesive 133 may be disposed between the second frame 112 and the light emitting device 120.
  • the second adhesive 133 may be disposed between the upper surface of the body 113 and the lower surface of the light emitting device 120.
  • the second adhesive 133 may be disposed in direct contact with the upper surface of the body 113.
  • the second adhesive 133 may be disposed in direct contact with the lower surface of the light emitting device 120.
  • the second adhesive 133 may be disposed in direct contact with the lower surface of the first bonding portion 121. In addition, the second adhesive 133 may be disposed in direct contact with the lower surface of the second bonding portion 122.
  • the second adhesive 133 may be provided as an example of a conductive adhesive.
  • the first frame 111 and the first bonding part 121 may be electrically connected through the second adhesive 133.
  • the second frame 112 and the second bonding part 122 may be electrically connected through the second adhesive 133.
  • the second adhesive 133 may include one material or an alloy thereof selected from the group including Ag, Au, Pt, and the like.
  • the second adhesive 133 may be made of a material capable of securing a conductive function.
  • the second adhesive 133 may be formed using a conductive paste.
  • the conductive paste may be selected from the group consisting of solder paste, silver paste and the like.
  • the first adhesive 130 and the second adhesive 133 may include different materials.
  • the first adhesive 130 may be provided as an insulating adhesive
  • the second adhesive 133 may be provided as a conductive adhesive.
  • the light emitting device package according to the embodiment may include a first upper recess R10 and a second upper recess R20, as shown in FIG.
  • the first upper recess R10 may be provided on the upper surface of the first frame 111. [ The first upper recess R10 may be recessed from the upper surface of the first frame 111 in a downward direction. The first upper recess R10 may be spaced apart from the recess R. [
  • the first upper recess R10 may overlap the first bonding portion 121 with reference to a first direction from the lower surface of the first frame 111 toward the upper surface.
  • the first upper recess R10 may be overlapped with the light emitting structure 123 with respect to the first direction.
  • the first upper recess R10 extends inward from three sides of the first bonding portion 121 as viewed from above the light emitting device 120 as described with reference to FIG. .
  • the first upper recess R10 may be provided around the first bonding portion 121 in a " [" shape.
  • the first upper recess R10 may be provided adjacent to three sides of the second adhesive 133 as viewed from above the light emitting device 120, .
  • the first upper recess R10 may be provided in the shape of " [" in the periphery of the second adhesive 133.
  • the first frame 111 may include a first region extending in a direction in which the first upper recess R10 is provided.
  • the second adhesive 133 may be disposed in the first area of the first frame 111.
  • the second adhesive 133 may be disposed so as to overlap the first bonding portion 121 with respect to the first direction.
  • the light emitting structure 123 In the vertical direction.
  • a side region of the first upper recess R10 adjacent to the first bonding portion 121 may be provided extending below the light emitting structure 123.
  • the first upper recess R10 may be disposed to overlap with the first bonding portion 121 in the vertical direction.
  • the second upper recess R20 may be provided on the upper surface of the second frame 112.
  • the second upper recess R20 may be recessed in a downward direction from the upper surface of the second frame 112.
  • the second upper recess R20 may be spaced apart from the recess R. [
  • the second upper recess R20 may be spaced apart from the first upper recess R10.
  • the second upper recess R20 may be overlapped with the second bonding portion 122 with reference to a first direction from the lower surface of the second frame 112 toward the upper surface.
  • the second upper recess R20 may be overlapped with the light emitting structure 123 with respect to the first direction.
  • the second upper recess R20 extends inward from three sides of the second bonding portion 122 as viewed from the upper direction of the light emitting element 120, .
  • the second upper recess R20 may be provided in the shape of "] " around the second bonding portion 122.
  • the second upper recess R20 may be provided adjacent to three sides of the second adhesive 133 as viewed from above the light emitting device 120, .
  • the second upper recess R20 may be provided in the shape of "] " around the second adhesive 133.
  • the second frame 112 may include a first region extending in a direction in which the second upper recess R20 is provided.
  • the second adhesive 133 may be disposed in the first area of the second frame 112.
  • the second adhesive 133 may be disposed to overlap the second bonding portion 122 with respect to the first direction.
  • the second upper recess R20 when a portion of the second upper recess R20 is viewed from the upper direction of the light emitting device 120, In the vertical direction with respect to the base plate 123.
  • a side region of the second upper recess R20 adjacent to the second bonding portion 122 may be provided extending below the light emitting structure 123.
  • the second upper recess R20 may be disposed to overlap the second bonding portion 122 in the vertical direction.
  • first upper recess R10 and the second upper recess R20 may be provided in a width of several tens of micrometers to several hundreds of micrometers.
  • the second adhesive 133 may be disposed on the first frame 111 and the second frame 112. Referring to FIG. 10
  • the second adhesive 133 may be provided on the first frame 111 and disposed below the first bonding part 121. [ The second adhesive 133 may be disposed in direct contact with the lower surface of the first bonding portion 121.
  • the second adhesive 133 may be provided on the second frame 112 and disposed under the second bonding part 122.
  • the second adhesive 133 may be disposed in direct contact with the lower surface of the second bonding portion 122.
  • the second adhesive 133 is provided on the first frame 111, and the first bonding portion 121 of the light emitting device 120 is mounted on the second adhesive 133 .
  • a part of the second adhesive 133 may be partially embedded in the first upper recess R10 while the first bonding part 121 of the light emitting device 120 is mounted on the second adhesive 133. [ Or may be diffused on the side surface of the first bonding portion 121. [
  • the distance from the side of the light emitting device 120 to the side of the first bonding part 121 It is possible to prevent a part of the second adhesive 133 from diffusing to the side of the first bonding part 121 and moving in the lateral direction of the light emitting device 120 .
  • the second distance D2 from the side of the light emitting device 120 to the side of the first bonding portion 121 may be several tens of micrometers.
  • the second distance D2 from the side surface of the light emitting device 120 to the side surface of the first bonding portion 121 may be 40 micrometers or more.
  • the second distance D2 from the side surface of the light emitting device 120 to the side surface of the first bonding portion 121 may be 50 to 90 micrometers.
  • the first distance D1 to the side of the first upper recess R10 disposed below the lower surface of the first upper recess R10 may be smaller than the second distance D2.
  • the light emitting device 120 may include a light emitting device 120 and a light emitting device 120.
  • the light emitting device 120 may include a light emitting device 120, 1 distance D1 may be provided by a few micrometers or a few tens of micrometers smaller than the second distance D2.
  • a part of the first upper recess R10 may be arranged in a direction perpendicular to the lower surface of the first bonding portion 121.
  • the second adhesive 133 can be prevented from spreading toward the light emitting structure 123 on the side surface of the first bonding portion 121, the second adhesive 133 It is possible to prevent the light emitting device 120 from being electrically short-circuited.
  • the first distance D1 to the side of the first upper recess R10 disposed below the lower surface of the first upper recess R10 may be minus. That is, the first upper recess R10 and the light emitting device 120 may be arranged so as not to overlap each other in the vertical direction.
  • the second adhesive 112 is provided with the second adhesive 133 and the second bonding portion 122 of the light emitting device 120 is bonded to the second adhesive 112 133).
  • a part of the second adhesive 133 may be bonded to the second upper recess R20 while the second bonding portion 122 of the light emitting device 120 is mounted on the second adhesive 133. [ Or may be diffused on the side surface of the second bonding part 122. [
  • the second distance from the side of the light emitting device 120 to the side of the second bonding portion 122 may be several tens of micrometers.
  • the second distance from the side surface of the light emitting device 120 to the side surface of the second bonding portion 122 may be 40 micrometers or more.
  • the second distance from the side of the light emitting device 120 to the side of the second bonding portion 122 may be provided from 50 micrometers to 90 micrometers.
  • the first distance to the inner surface of the first upper recess R20 disposed below may be provided smaller than the second distance.
  • the light emitting device 120 includes a light emitting device 120 and a light emitting device 120.
  • the light emitting device 120 includes a light emitting device 120 and a light emitting device 120.
  • the light emitting device 120 includes a light emitting device 120, One distance may be provided by a few micrometers or a few tens of micrometers smaller than the second distance.
  • a part of the second upper recess R20 may be overlapped with the lower surface of the second bonding portion 122 in the vertical direction. Accordingly, even when the second adhesive 133 is excessively provided and diffused to the periphery, the second adhesive 133 is not moved upward in the side direction of the second bonding portion 122, To the upper recess R20 region.
  • the second adhesive 133 can be prevented from spreading toward the light emitting structure 123 on the side surface of the second bonding portion 122, the second adhesive 133 It is possible to prevent the light emitting device 120 from being electrically short-circuited.
  • the first distance to the inner surface of the second upper recess R20 disposed in the second upper recess R20 may be minus. That is, the second upper recess R20 and the light emitting device 120 may be arranged so as not to overlap each other in the vertical direction.
  • the second adhesive 133 can be prevented from rising on the side surface of the light emitting device 120, the first conductive semiconductor layer constituting the light emitting device 120 and the second conductive semiconductor layer So that the conductivity type semiconductor layer can be prevented from being electrically short-circuited. Also, since the second adhesive 133 can be prevented from being disposed on the side of the active layer of the light emitting device 120, the light extraction efficiency of the light emitting device 120 can be improved.
  • the light emitting device package according to the embodiment may include a first resin part 135 as shown in FIG.
  • the first resin part 135 may be disposed between the first frame 111 and the light emitting device 120.
  • the first resin part 135 may be disposed between the second frame 112 and the light emitting device 120.
  • the second adhesive 133 may flow over the first upper recess R10. Accordingly, the first resin part 135 may be disposed on the second adhesive 133 in the first upper recess R10.
  • the second adhesive 133 is diffused into the first upper recess R10 region or diffused to the side of the first bonding portion 121 by the first resin portion 135, The second adhesive 133 can be prevented from moving in the lateral direction of the light emitting structure 123.
  • the first resin part 135 may be disposed in the first upper recess R10 and contacted with the second adhesive 133. [ The first resin part 135 may be disposed in the first upper recess R10 and may be provided around the second adhesive 133. The first resin part 135 may be disposed in the first upper recess R10 and provided around the first bonding part 121. [
  • the second adhesive 133 may flow over the second upper recess R20. Accordingly, the first resin part 135 may be disposed on the second adhesive 133 in the second upper recess R20.
  • the second adhesive 133 is diffused into the second upper recess R20 region or diffused to the side of the second bonding portion 122 by the first resin portion 135, The second adhesive 133 can be prevented from moving in the lateral direction of the light emitting structure 123.
  • the first resin part 135 may be disposed in the second upper recess R20 and may be in contact with the second adhesive 133.
  • the first resin part 135 may be disposed in the second upper recess R20 and may be provided around the second adhesive 133.
  • the first resin part 135 may be disposed in the second upper recess R20 and may be provided around the second bonding part 122.
  • the first resin part 135 filled in the first upper recess R10 and the second upper recess R20 is connected to the first bonding part 121 and the second bonding part 122, The periphery can be effectively sealed.
  • the first resin part 135 may be disposed below the light emitting device 120 to perform a sealing function. In addition, the first resin part 135 can improve adhesion between the light emitting device 120 and the first frame 111. The first resin part 135 can improve the adhesion between the light emitting device 120 and the second frame 112.
  • the first resin part 135 may seal the first bonding part 121 and the second bonding part 122.
  • the first resin part 135 can prevent the second adhesive 133 from diffusing and moving in the lateral direction of the light emitting device 120.
  • the second adhesive 133 diffuses and moves in the lateral direction of the light emitting device 120, the second adhesive 133 may contact the active layer of the light emitting device 120, resulting in a failure due to a short circuit . Therefore, when the first resin part 135 is disposed, the second adhesive 133 and the active layer can be prevented from being short-circuited, thereby improving the reliability of the light emitting device package according to the embodiment.
  • the first resin part 135 may transmit light from the light emitting element 120 to the package body 110 The light extraction efficiency of the light emitting device package 100 can be improved.
  • the light emitting device package according to the embodiment may include the second resin part 140.
  • the second resin part 140 may be provided on the light emitting device 120.
  • the second resin part 140 may be disposed on the first frame 111 and the second frame 112.
  • the second resin part 140 may be disposed in the cavity C provided by the package body 110.
  • the second resin part 140 may be disposed on the first resin part 135.
  • the light emitting device package 100 is connected to the first bonding portion 121 through the second adhesive 133 provided on the first frame 111,
  • the second bonding agent 122 may be connected to the second bonding agent 122 through the second adhesive 133 provided on the second bonding part 122.
  • the light emitting device 120 can be driven by the driving power supplied through the first bonding part 121 and the second bonding part 122.
  • the light emitted from the light emitting device 120 may be provided in an upward direction of the package body 110.
  • the light emitting device package 100 may be mounted on a submount, a circuit board, or the like.
  • a high temperature process such as a reflow process can be applied.
  • a re-melting phenomenon occurs in the bonding region between the lead frame and the light emitting device provided in the light emitting device package, so that the stability of electrical connection and physical coupling can be weakened.
  • the first bonding portion 121 and the second bonding portion 122 of the light emitting device 120 according to the embodiment are formed in the second And the driving power can be supplied through the adhesive 133.
  • the melting point of the second adhesive 133 may be selected to have a higher value than the melting point of the common bonding material.
  • the light emitting device package 100 and the method of manufacturing the light emitting device package according to the embodiment since the light emitting device 120 is mounted on the package body 110 using the conductive paste, The package body 110 does not need to be exposed to high temperatures. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discolored. Accordingly, the selection range for the material constituting the body 113 can be widened. According to the embodiment, the body 113 may be provided using not only expensive materials such as ceramics but also relatively inexpensive resin materials.
  • the body 113 may include at least one material selected from the group consisting of PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin and SMC can do.
  • PPA PolyPhtalAmide
  • PCT PolyCyclohexylenedimethylene Terephthalate
  • EMC Epoxy Molding Compound
  • the light emitting device package 100 may be mounted on a submount, a circuit board, or the like.
  • the light emitting device package 300 according to the embodiment of the present invention shown in FIG. 11 is an example in which the light emitting device package 100 described with reference to FIGS. 1 to 10 is mounted on the circuit board 310 and supplied .
  • FIG. 11 a light emitting device package 300 according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 to 10.
  • FIG. 11 a light emitting device package 300 according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 to 10.
  • the light emitting device package 300 may include a circuit board 310, a package body 110, and a light emitting device 120, as shown in FIG.
  • the circuit board 310 may include a first pad 311, a second pad 312, and a support substrate 313.
  • a power supply circuit for controlling driving of the light emitting device 120 may be provided on the support substrate 313.
  • the package body 110 may be disposed on the circuit board 310.
  • the first pad 311 and the first bonding portion 121 may be electrically connected to each other.
  • the second pad 312 and the second bonding portion 122 may be electrically connected to each other.
  • the first pad 311 and the second pad 312 may include a conductive material.
  • the first pad 311 and the second pad 312 may be formed of a material selected from the group consisting of Ti, Cu, Ni, Au, Cr, Ta, Pt, Sn, Ag, P, Fe, At least one selected material or alloy thereof.
  • the first pad 311 and the second pad 312 may be provided as a single layer or a multilayer.
  • the package body 110 may include a first frame 111 and a second frame 112.
  • the first frame 111 and the second frame 112 may be spaced apart from each other.
  • the package body 110 may include a body 113.
  • the body 113 may be disposed between the first frame 111 and the second frame 112.
  • the body 113 may function as an electrode separation line.
  • the light emitting device 120 may include a first bonding portion 121, a second bonding portion 122, a light emitting structure 123, and a substrate 124.
  • the light emitting device 120 may be disposed on the package body 110.
  • the light emitting device 120 may be disposed on the first frame 111 and the second frame 112.
  • the light emitting device 120 may be disposed in the cavity C provided by the package body 110.
  • the light emitting device 120 may be disposed on the body 113.
  • the first bonding part 121 may be disposed on the first frame 111.
  • the second bonding portion 122 may be disposed on the second frame 112.
  • the first bonding portion 121 may be disposed between the light emitting structure 123 and the first frame 111.
  • the second bonding portion 122 may be disposed between the light emitting structure 123 and the second frame 112.
  • the light emitting device package 300 may include a first adhesive 130, as shown in FIG.
  • the first adhesive 130 may be disposed between the package body 110 and the light emitting device 120.
  • the first adhesive 130 may be disposed between the upper surface of the package body 110 and the lower surface of the light emitting device 120.
  • the first adhesive 130 may be disposed to overlap the light emitting device 120 in the vertical direction.
  • the first adhesive 130 may be disposed to overlap the light emitting device 120 with reference to a direction from the lower surface of the body 113 toward the upper surface.
  • the light emitting device package 300 may include a recess R as shown in FIG.
  • the recesses R may be provided in the body 113.
  • the recess R may be recessed in a first direction from the upper surface to the lower surface of the body 113.
  • the recess R may be disposed below the light emitting device 120.
  • the recess R may be provided to overlap with the light emitting device 120 in the first direction.
  • the recess R may be disposed between the first bonding portion 121 and the second bonding portion 122.
  • the recess R may be provided so as not to overlap with the first bonding portion 121 in the first direction.
  • the recess R may be provided so as not to overlap with the second bonding portion 122 in the first direction.
  • the first adhesive 130 may be disposed in the recess R.
  • the first adhesive 130 may be disposed between the light emitting device 120 and the body 113.
  • the first adhesive 130 may be disposed between the first bonding part 121 and the second bonding part 122.
  • the first adhesive 130 may be disposed in contact with a side surface of the first bonding portion 121 and a side surface of the second bonding portion 122.
  • the light emitting device package 300 may include a second adhesive 133 as shown in FIG.
  • the second adhesive 133 may be disposed between the first frame 111 and the light emitting device 120.
  • the second adhesive 133 may be disposed between the second frame 112 and the light emitting device 120.
  • the second adhesive 133 may be disposed between the upper surface of the package body 110 and the lower surface of the light emitting device 120.
  • the second adhesive 133 may be disposed in direct contact with the upper surface of the package body 110.
  • the second adhesive 133 may be disposed in direct contact with the lower surface of the light emitting device 120.
  • the second adhesive 133 may be disposed in direct contact with the lower surface of the first bonding portion 121. In addition, the second adhesive 133 may be disposed in direct contact with the lower surface of the second bonding portion 122.
  • the second adhesive 133 may be provided as an example of a conductive adhesive.
  • the first frame 111 and the first bonding part 121 may be electrically connected through the second adhesive 133.
  • the second frame 112 and the second bonding part 122 may be electrically connected through the second adhesive 133.
  • the second adhesive 133 may include one material or an alloy thereof selected from the group including Ag, Au, Pt, and the like.
  • the second adhesive 133 may be made of a material capable of securing a conductive function.
  • the second adhesive 133 may be formed using a conductive paste.
  • the conductive paste may be selected from the group consisting of solder paste, silver paste and the like.
  • the first adhesive 130 and the second adhesive 133 may include different materials.
  • the first adhesive 130 may be provided as an insulating adhesive
  • the second adhesive 133 may be provided as a conductive adhesive.
  • the light emitting device package 300 may include a first upper recess R10 and a second upper recess R20, as shown in FIG.
  • the first upper recess R10 may be provided on the upper surface of the first frame 111. [ The first upper recess R10 may be recessed from the upper surface of the first frame 111 in a downward direction. The first upper recess R10 may be spaced apart from the recess R. [
  • the second upper recess R20 may be provided on the upper surface of the second frame 112.
  • the second upper recess R20 may be recessed in a downward direction from the upper surface of the second frame 112.
  • the second upper recess R20 may be spaced apart from the recess R. [
  • the second upper recess R20 may be spaced apart from the first upper recess R10.
  • the second adhesive 133 may be disposed on the first frame 111 and the second frame 112. Referring to FIG.
  • the second adhesive 133 may be provided on the first frame 111 and disposed below the first bonding part 121. [ The second adhesive 133 may be disposed in direct contact with the lower surface of the first bonding portion 121.
  • the second adhesive 133 may be provided on the second frame 112 and disposed under the second bonding part 122.
  • the second adhesive 133 may be disposed in direct contact with the lower surface of the second bonding portion 122.
  • the second adhesive 133 is provided on the first frame 111, and the first bonding portion 121 of the light emitting device 120 is mounted on the second adhesive 133 .
  • a part of the second adhesive 133 may be partially embedded in the first upper recess R10 while the first bonding part 121 of the light emitting device 120 is mounted on the second adhesive 133. [ Or may be diffused on the side surface of the first bonding portion 121. [
  • the first bonding part 121 is formed on the side of the light emitting device 120 when viewed from the upper direction of the light emitting device 120.
  • a first distance D2 from the side of the light emitting device 120 to the side of the first upper recess R10 disposed below the lower surface of the light emitting device 120 ) can be provided.
  • the second distance D2 from the side of the light emitting device 120 to the side of the first bonding portion 121 may be several tens of micrometers.
  • the second distance D2 from the side surface of the light emitting device 120 to the side surface of the first bonding portion 121 may be 40 to 50 micrometers.
  • the light emitting device 120 may further include a light emitting device 120 disposed on a side surface of the first upper recess R10,
  • the distance D1 may be several micrometers or several tens of micrometers larger than the second distance D2.
  • a part of the region of the first upper recess R10 may be overlapped with the lower surface of the first bonding portion 121 in the vertical direction. Accordingly, even when the second adhesive 133 is excessively supplied and diffused to the periphery, the second adhesive 133 is not moved upward in the side direction of the first bonding part 121, And can be diffused into the upper recess R10 region.
  • the second adhesive 133 can be prevented from spreading toward the light emitting structure 123 on the side surface of the first bonding portion 121, the second adhesive 133 It is possible to prevent the light emitting device 120 from being electrically short-circuited.
  • the second adhesive 112 is provided with the second adhesive 133 and the second bonding portion 122 of the light emitting device 120 is bonded to the second adhesive 112 133).
  • a part of the second adhesive 133 may be bonded to the second upper recess R20 while the second bonding portion 122 of the light emitting device 120 is mounted on the second adhesive 133. [ Or may be diffused on the side surface of the second bonding part 122. [
  • the second bonding part 122 is formed on the side of the light emitting device 120 when viewed from the upper direction of the light emitting device 120.
  • the distance to the side of the light emitting device 120 may be smaller than the distance from the side of the light emitting device 120 to the side of the second upper recess R20 disposed below the lower surface of the light emitting device 120.
  • a portion of the second upper recess R20 may be disposed in a direction perpendicular to the lower surface of the second bonding portion 122.
  • the second adhesive 133 can be prevented from spreading toward the light emitting structure 123 on the side surface of the second bonding portion 122, the second adhesive 133 It is possible to prevent the light emitting device 120 from being electrically short-circuited.
  • the second adhesive 133 can be prevented from rising on the side surface of the light emitting device 120, the first conductive semiconductor layer and the second conductive semiconductor layer, which form the light emitting device 120, It is possible to prevent electrical short-circuiting. Also, since the second adhesive 133 can be prevented from being disposed on the side of the active layer of the light emitting device 120, the light extraction efficiency of the light emitting device 120 can be improved.
  • the light emitting device package 300 may include the first resin part 135 as shown in FIG.
  • the first resin part 135 may be disposed between the first frame 111 and the light emitting device 120.
  • the first resin part 135 may be disposed between the second frame 112 and the light emitting device 120.
  • the second adhesive 133 is diffused into the first upper recess R10 region or diffused to the side of the first bonding portion 121 by the first resin portion 135, The second adhesive 133 can be prevented from moving in the lateral direction of the light emitting structure 123.
  • the first resin part 135 may be disposed in the first upper recess R10 and contacted with the second adhesive 133. [ The first resin part 135 may be disposed in the first upper recess R10 and may be provided around the second adhesive 133. The first resin part 135 may be disposed in the first upper recess R10 and provided around the first bonding part 121. [
  • the second adhesive 133 may flow over the second upper recess R20. Accordingly, the first resin part 135 may be disposed on the second adhesive 133 in the second upper recess R20.
  • the second adhesive 133 is diffused into the second upper recess R20 region or diffused to the side of the second bonding portion 122 by the first resin portion 135, The second adhesive 133 can be prevented from moving in the lateral direction of the light emitting structure 123.
  • the first resin part 135 may be disposed in the second upper recess R20 and may be in contact with the second adhesive 133.
  • the first resin part 135 may be disposed in the second upper recess R20 and may be provided around the second adhesive 133.
  • the first resin part 135 may be disposed in the second upper recess R20 and may be provided around the second bonding part 122.
  • the first resin part 135 filled in the first upper recess R10 and the second upper recess R20 is connected to the first bonding part 121 and the second bonding part 122, The periphery can be effectively sealed.
  • the first resin part 135 may be disposed below the light emitting device 120 to perform a sealing function. In addition, the first resin part 135 can improve adhesion between the light emitting device 120 and the first frame 111. The first resin part 135 can improve the adhesion between the light emitting device 120 and the second frame 112.
  • the first resin part 135 may seal the first bonding part 121 and the second bonding part 122.
  • the first resin part 135 may prevent the second adhesive 133 from diffusing and moving in the lateral direction of the light emitting device 120.
  • the second adhesive 133 diffuses and moves in the lateral direction of the light emitting device 120, the second adhesive 133 may contact the active layer of the light emitting device 120, resulting in a failure due to a short circuit . Therefore, when the first resin part 135 is disposed, the second adhesive 133 and the active layer can be prevented from being short-circuited, thereby improving the reliability of the light emitting device package according to the embodiment.
  • the first resin part 135 may transmit light from the light emitting element 120 to the package body 110 The light extraction efficiency of the light emitting device package 100 can be improved.
  • the light emitting device package 300 may include a second resin part 140, as shown in FIG.
  • the second resin part 140 may be provided on the light emitting device 120.
  • the second resin part 140 may be disposed on the first frame 111 and the second frame 112.
  • the second resin part 140 may be disposed in the cavity C provided by the package body 110.
  • the second resin part 140 may be disposed on the first resin part 135.
  • the second resin part 140 may include an insulating material.
  • the second resin part 140 may include wavelength conversion means for receiving light emitted from the light emitting device 120 and providing wavelength-converted light.
  • the second resin part 140 may include at least one selected from the group including phosphors, quantum dots, and the like.
  • the first pad 311 of the circuit board 310 and the first frame 111 may be electrically connected.
  • the second pad 312 of the circuit board 310 and the second frame 112 may be electrically connected.
  • the first pad 311 and the second pad 312 may be referred to as a third adhesive.
  • the first pad 311 and the second pad 312 may be formed of a conductive adhesive.
  • the first adhesive 130 may be provided as an insulating adhesive, and the second adhesive 133 and the third adhesive may be provided as a conductive adhesive.
  • the second adhesive 133 and the third adhesive may include different materials.
  • the melting point of the second adhesive 133 may be selected to be higher than the melting point of the third adhesive. Accordingly, it is possible to prevent the re-melting phenomenon of the second adhesive 133 from occurring in the process of mounting the package body 110 on the circuit board 310 by the third adhesive .
  • a separate bonding layer may be additionally provided between the first pad 311 and the first frame 111. Further, a separate bonding layer may be additionally provided between the second pad 312 and the second frame 112.
  • the first bonding portion 121 and the second bonding portion 122 of the light emitting device 120 according to the embodiment May be supplied with driving power through the second adhesive 133.
  • the melting point of the second adhesive 133 may be selected to have a higher value than the melting point of the common bonding material.
  • the light emitting device package according to the embodiment has advantages such that the electrical connection and the physical bonding force are not deteriorated because the re-melting phenomenon does not occur even when the light emitting device package according to the embodiment is bonded to the main substrate through a reflow process have.
  • the light emitting device package 100 and the method of manufacturing the light emitting device package according to the embodiment since the light emitting device 120 is mounted on the package body 110 using the conductive paste, The package body 110 does not need to be exposed to high temperatures. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discolored.
  • the selection range for the material constituting the body 113 can be widened.
  • the body 113 may be provided using not only expensive materials such as ceramics but also relatively inexpensive resin materials.
  • the body 113 may include at least one material selected from the group consisting of PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin and SMC can do.
  • PPA PolyPhtalAmide
  • PCT PolyCyclohexylenedimethylene Terephthalate
  • EMC Epoxy Molding Compound
  • the package body 110 includes only the support member 113 having a flat top surface, and may not be provided with inclined reflection parts.
  • the package body 110 may be provided with a structure for providing the cavity C.
  • the package body 110 may be provided with a flat upper surface without providing the cavity C.
  • FIG. 12 a light emitting device package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 11.
  • FIG. 12 a light emitting device package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 11.
  • the light emitting device package may include a package body 110, a light emitting device 120, a first conductor 221, and a second conductor 222, as shown in FIG.
  • the package body 110 may include a first frame 111 and a second frame 112.
  • the first frame 111 and the second frame 112 may be spaced apart from each other.
  • the package body 110 may include a body 113.
  • the body 113 may be disposed between the first frame 111 and the second frame 112.
  • the body 113 may function as an electrode separation line.
  • the first frame 111 and the second frame 112 may be provided as a conductive frame.
  • the first frame 111 and the second frame 112 can stably provide the structural strength of the package body 110 and can be electrically connected to the light emitting device 120.
  • the light emitting device 120 may include a first bonding portion 121, a second bonding portion 122, a light emitting structure 123, and a substrate 124.
  • the light emitting device 120 may be disposed on the package body 110.
  • the light emitting device 120 may be disposed on the first frame 111 and the second frame 112.
  • the light emitting device 120 may be disposed in the cavity C provided by the package body 110.
  • the light emitting device 120 may be disposed on the body 113.
  • the first bonding part 121 may be disposed on a lower surface of the light emitting device 120.
  • the second bonding portion 122 may be disposed on a lower surface of the light emitting device 120.
  • the first bonding part 121 and the second bonding part 122 may be spaced apart from each other on a lower surface of the light emitting device 120.
  • the first conductor 221 may be disposed under the first bonding portion 121.
  • the first conductor 221 may be electrically connected to the first bonding portion 121.
  • the first conductor 221 may be overlapped with the first bonding portion 121 in the first direction.
  • the second conductor 222 may be disposed under the second bonding portion 122.
  • the second conductor 222 may be electrically connected to the second bonding portion 122.
  • the second conductor 222 may be disposed to overlap with the second bonding portion 122 in the first direction.
  • the light emitting device package according to the embodiment may include a first adhesive 130, as shown in FIG.
  • the first adhesive 130 may be disposed between the package body 110 and the light emitting device 120.
  • the first adhesive 130 may be disposed between the upper surface of the package body 113 and the lower surface of the light emitting device 120.
  • the first adhesive 130 may be disposed to overlap the light emitting device 120 in the vertical direction.
  • the first adhesive 130 may be disposed to overlap the light emitting device 120 with reference to a direction from the lower surface of the body 113 toward the upper surface.
  • the light emitting device package according to the embodiment may include a recess (R) as shown in FIG.
  • the recesses R may be provided in the body 113.
  • the recess R may be recessed in a first direction from the upper surface to the lower surface of the body 113.
  • the recess R may be disposed below the light emitting device 120.
  • the recess R may be provided to overlap with the light emitting device 120 in the first direction.
  • the recess R may be disposed between the first bonding portion 121 and the second bonding portion 122.
  • the recess R may be provided so as not to overlap with the first bonding portion 121 in the first direction.
  • the recess R may be provided so as not to overlap with the second bonding portion 122 in the first direction.
  • the first adhesive 130 may be disposed in the recess R.
  • the first adhesive 130 may be disposed between the light emitting device 120 and the body 113.
  • the first adhesive 130 may be disposed between the first bonding part 121 and the second bonding part 122.
  • the first adhesive 130 may be disposed in contact with a side surface of the first bonding portion 121 and a side surface of the second bonding portion 122.
  • the light emitting device package according to the embodiment may include a second adhesive 133, as shown in FIG.
  • the second adhesive 133 may be disposed between the first frame 111 and the light emitting device 120.
  • the second adhesive 133 may be disposed between the second frame 112 and the light emitting device 120.
  • the first conductor 221 may be electrically connected to the first bonding portion 121.
  • the second conductor 222 may be electrically connected to the second bonding portion 1220.
  • the first and second conductors 221 and 222 may be electrically connected to the first and second bonding portions 121 and 122, And the second adhesive 133, respectively.
  • the second adhesive 133 may be disposed on the lower surface and the side surface of the first conductor 221.
  • the second adhesive 133 may be disposed in direct contact with the lower surface and the side surface of the first conductor 221.
  • the electrical connection between the second adhesive 133 and the first bonding part 121 can be more stably provided by the first conductor 221.
  • the second adhesive 133 may be disposed on the lower surface and the side surface of the second conductor 222.
  • the second adhesive 133 may be disposed in direct contact with the lower surface and the side surface of the second conductor 222.
  • the electrical connection between the second adhesive 133 and the second bonding part 122 can be more stably provided by the second conductor 222.
  • first and second conductors 221 and 222 may be stably bonded to the first and second bonding portions 121 and 122 through separate bonding materials, respectively.
  • the side surfaces and the bottom surface of the first and second conductors 221 and 222 may be in contact with the second adhesive 133, respectively.
  • the second adhesive 133 can be applied to the first and second bonding parts 121 and 122, respectively, as compared with the case where the second adhesive 133 directly contacts the lower surface of the first and second bonding parts 121 and 122, The area of contact with each of the contact portions 221 and 222 becomes larger. Accordingly, power can be stably supplied from the second adhesive 133 to the first and second bonding portions 121 and 122 via the first and second conductors 221 and 222, respectively .
  • the second adhesive 133 may be provided as an example of a conductive adhesive.
  • the second adhesive 133 may include one material or an alloy thereof selected from the group including Ag, Au, Pt, and the like.
  • the second adhesive 133 may be made of a material capable of securing a conductive function.
  • the second adhesive 133 may be formed using a conductive paste.
  • the conductive paste may be selected from the group consisting of solder paste, silver paste and the like.
  • the first adhesive 130 and the second adhesive 133 may include different materials.
  • the first adhesive 130 may be provided as an insulating adhesive
  • the second adhesive 133 may be provided as a conductive adhesive.
  • the first and second conductors 221 and 222 may include one material selected from the group consisting of Ag, Au, Pt, Al, and the like, or an alloy thereof. However, the present invention is not limited thereto, and the first and second conductors 221 and 222 may be formed of a material capable of securing a conductive function.
  • the light emitting device package 300 may include a first upper recess R10 and a second upper recess R20, as shown in FIG.
  • the first upper recess R10 may be provided on the upper surface of the first frame 111. [ The first upper recess R10 may be recessed from the upper surface of the first frame 111 in a downward direction. The first upper recess R10 may be spaced apart from the recess R. [
  • the first upper recess R10 may overlap the first bonding portion 121 with reference to a first direction from the lower surface of the first frame 111 toward the upper surface.
  • the first upper recess R10 may be overlapped with the light emitting structure 123 with respect to the first direction.
  • the second upper recess R20 may be provided on the upper surface of the second frame 112.
  • the second upper recess R20 may be recessed in a downward direction from the upper surface of the second frame 112.
  • the second upper recess R20 may be spaced apart from the recess R. [
  • the second upper recess R20 may be spaced apart from the first upper recess R10.
  • the second upper recess R20 may be overlapped with the second bonding portion 122 with reference to a first direction from the lower surface of the second frame 112 toward the upper surface.
  • the second upper recess R20 may be overlapped with the light emitting structure 123 with respect to the first direction.
  • first upper recess R10 and the second upper recess R20 may be provided in a width of several tens of micrometers to several hundreds of micrometers.
  • the second adhesive 133 may be disposed on the first frame 111 and the second frame 112. Referring to FIG. 12
  • the second adhesive 133 may be provided on the first frame 111 and disposed below the first bonding part 121. [ The second adhesive 133 may be disposed in direct contact with the lower surface of the first conductor 221.
  • the second adhesive 133 may be provided on the second frame 112 and disposed under the second bonding part 122.
  • the second adhesive 133 may be disposed in direct contact with the lower surface of the second conductor 222.
  • the second bonding agent 133 may be provided on the first frame 111 and the first bonding portion 121 and the first conductor 221 of the light emitting device 120 may be bonded to the first frame 111, And may be mounted on the second adhesive 133.
  • a part of the second adhesive 133 May be diffused into the first upper recess R10 region and diffused by the side surface of the first conductor 221.
  • the first bonding part 121 is formed on the side of the light emitting device 120 when viewed from the upper direction of the light emitting device 120.
  • a first distance D2 from the side of the light emitting device 120 to the side of the first upper recess R10 disposed below the lower surface of the light emitting device 120 ) can be provided.
  • the second distance D2 from the side of the light emitting device 120 to the side of the first bonding portion 121 may be several tens of micrometers.
  • the second distance D2 from the side surface of the light emitting device 120 to the side surface of the first bonding portion 121 may be 40 to 50 micrometers.
  • the light emitting device 120 may further include a light emitting device 120 disposed on a side surface of the first upper recess R10,
  • the distance D1 may be several micrometers or several tens of micrometers larger than the second distance D2.
  • a part of the region of the first upper recess R10 may be overlapped with the lower surface of the first bonding portion 121 in the vertical direction. Accordingly, even when the second adhesive 133 is excessively supplied and diffused to the periphery, the second adhesive 133 is not moved upward in the side direction of the first conductor 221, And can be diffused into the upper recess R10 region.
  • the second adhesive 133 is bonded to the first bonding part 133, It can be prevented from moving in the upward direction on the side surface of the base 121.
  • the second adhesive 133 can be prevented from spreading toward the light emitting structure 123 on the side surface of the first bonding portion 121, the second adhesive 133 It is possible to prevent the light emitting device 120 from being electrically short-circuited.
  • the second adhesive 112 is provided with the second adhesive 133 and the second bonding portion 122 of the light emitting device 120 is bonded to the second adhesive 112 133).
  • a part of the second adhesive 133 May be diffused into the second upper recess (R20) region and may be diffused across the side of the second conductor (222).
  • the second bonding part 122 is formed on the side of the light emitting device 120 when viewed from the upper direction of the light emitting device 120.
  • the second distance from the side of the light emitting device 120 to the side of the light emitting device 120 is smaller than the first distance from the side of the light emitting device 120 to the side of the second upper recess R20 disposed below the lower surface of the light emitting device 120 .
  • a portion of the second upper recess R20 may be disposed in a direction perpendicular to the lower surface of the second bonding portion 122.
  • the second adhesive 133 is bonded to the second bonding portion 133, And can be prevented from moving upward in a side direction of the side wall 122.
  • the second adhesive 133 can be prevented from spreading toward the light emitting structure 123 on the side surface of the second bonding portion 122, the second adhesive 133 It is possible to prevent the light emitting device 120 from being electrically short-circuited.
  • the second adhesive 133 can be prevented from rising on the side surface of the light emitting device 120, the first conductive semiconductor layer and the second conductive semiconductor layer, which form the light emitting device 120, It is possible to prevent electrical short-circuiting. Also, since the second adhesive 133 can be prevented from being disposed on the side of the active layer of the light emitting device 120, the light extraction efficiency of the light emitting device 120 can be improved.
  • the light emitting device package according to the embodiment may include the first resin part 135 as shown in FIG.
  • the first resin part 135 may be disposed between the first frame 111 and the light emitting device 120.
  • the first resin part 135 may be disposed between the second frame 112 and the light emitting device 120.
  • the first resin part 135 may be disposed on a side surface of the first bonding part 121.
  • the first resin part 135 may be disposed on a side surface of the second bonding part 122.
  • the first resin part 135 may be disposed under the light emitting structure 123.
  • the first resin part 135 may be disposed on the side of the second adhesive 133.
  • the first resin part 135 may be disposed on a side surface of the first conductor 221.
  • the first resin part 135 may be disposed on a side surface of the second conductor 222.
  • the first resin part 135 may be in contact with the lower surface of the light emitting device 120 directly.
  • the first resin part 135 may be in direct contact with the side surface of the second adhesive 133.
  • the first resin part 135 may be disposed in the first upper recess R10.
  • the first resin part 135 may be disposed in the second upper recess R20.
  • the second adhesive 133 may flow over the first upper recess R10. Accordingly, the first resin part 135 may be disposed on the second adhesive 133 in the first upper recess R10.
  • the second adhesive 133 is diffused into the first upper recess R10 region or diffused to the side of the first bonding portion 121 by the first resin portion 135, The second adhesive 133 can be prevented from moving in the lateral direction of the light emitting structure 123.
  • the first resin part 135 may be disposed in the first upper recess R10 and contacted with the second adhesive 133. [ The first resin part 135 may be disposed in the first upper recess R10 and may be provided around the second adhesive 133. The first resin part 135 may be disposed in the first upper recess R10 and provided around the first bonding part 121. [ The first resin part 135 may be disposed in the first upper recess R10 and may be provided around the first conductor 221.
  • the second adhesive 133 may flow over the second upper recess R20. Accordingly, the first resin part 135 may be disposed on the second adhesive 133 in the second upper recess R20.
  • the second adhesive 133 is diffused into the second upper recess R20 region or diffused to the side of the second bonding portion 122 by the first resin portion 135, The second adhesive 133 can be prevented from moving in the lateral direction of the light emitting structure 123.
  • the first resin part 135 may be disposed in the second upper recess R20 and may be in contact with the second adhesive 133.
  • the first resin part 135 may be disposed in the second upper recess R20 and may be provided around the second adhesive 133.
  • the first resin part 135 may be disposed in the second upper recess R20 and may be provided around the second bonding part 122.
  • the first resin part 135 may be disposed in the second upper recess R20 and may be provided around the second conductor 222.
  • the first resin part 135 filled in the first upper recess R10 and the second upper recess R20 is connected to the first bonding part 121 and the second bonding part 122, The periphery can be effectively sealed.
  • the first resin part 135 may be disposed below the light emitting device 120 to perform a sealing function. In addition, the first resin part 135 can improve adhesion between the light emitting device 120 and the first frame 111. The first resin part 135 can improve the adhesion between the light emitting device 120 and the second frame 112.
  • the first resin part 135 may seal the first bonding part 121 and the second bonding part 122.
  • the first resin part 135 may prevent the second adhesive 133 from diffusing and moving in the lateral direction of the light emitting device 120.
  • the second adhesive 133 diffuses and moves in the lateral direction of the light emitting device 120, the second adhesive 133 may contact the active layer of the light emitting device 120, resulting in a failure due to a short circuit . Therefore, when the first resin part 135 is disposed, the second adhesive 133 and the active layer can be prevented from being short-circuited, thereby improving the reliability of the light emitting device package according to the embodiment.
  • the first resin part 135 may transmit light from the light emitting element 120 to the package body 110 The light extraction efficiency of the light emitting device package 100 can be improved.
  • the light emitting device package according to the embodiment may include a second resin part 140, as shown in FIG.
  • the second resin part 140 may be provided on the light emitting device 120.
  • the second resin part 140 may be disposed on the first frame 111 and the second frame 112.
  • the second resin part 140 may be disposed in the cavity C provided by the package body 110.
  • the second resin part 140 may be disposed on the first resin part 135.
  • the second resin part 140 may include an insulating material.
  • the second resin part 140 may include wavelength conversion means for receiving light emitted from the light emitting device 120 and providing wavelength-converted light.
  • the second resin part 140 may include at least one selected from the group including phosphors, quantum dots, and the like.
  • the light emitting device package 100 is connected to the first bonding portion 121 through the second adhesive 133 provided on the first frame 111, And power may be connected to the second bonding portion 122 through the second adhesive 133 provided on the second bonding portion 122.
  • the light emitting device 120 can be driven by the driving power supplied through the first bonding part 121 and the second bonding part 122.
  • the light emitted from the light emitting device 120 may be provided in an upward direction of the package body 110.
  • the light emitting device package 100 may be mounted on a submount, a circuit board, or the like.
  • a high temperature process such as a reflow process can be applied.
  • a re-melting phenomenon occurs in the bonding region between the lead frame and the light emitting device provided in the light emitting device package, so that the stability of electrical connection and physical coupling can be weakened.
  • the first bonding portion 121 and the second bonding portion 122 of the light emitting device 120 according to the embodiment are formed in the second And the driving power can be supplied through the adhesive 133.
  • the melting point of the second adhesive 133 may be selected to have a higher value than the melting point of the common bonding material.
  • the light emitting device package 100 and the method of manufacturing the light emitting device package according to the embodiment since the light emitting device 120 is mounted on the package body 110 using the conductive paste, The package body 110 does not need to be exposed to high temperatures. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discolored.
  • the selection range for the material constituting the body 113 can be widened.
  • the body 113 may be provided using not only expensive materials such as ceramics but also relatively inexpensive resin materials.
  • the body 113 may include at least one material selected from the group consisting of PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin and SMC can do.
  • PPA PolyPhtalAmide
  • PCT PolyCyclohexylenedimethylene Terephthalate
  • EMC Epoxy Molding Compound
  • the package body 110 includes only the support member 113 having a flat top surface, and may not be provided with inclined reflection parts.
  • the package body 110 may be provided with a structure for providing the cavity C.
  • the package body 110 may be provided with a flat upper surface without providing the cavity C.
  • FIGS. 13 and 14 a description of elements overlapping with those described with reference to FIGS. 1 to 12 may be omitted in describing the light emitting device package according to the embodiment.
  • FIG. 13 is a cross-sectional view illustrating another example of a light emitting device package according to an embodiment of the present invention
  • FIG. 14 is a view explaining the arrangement relationship of a first frame, a second frame, and a body applied to the light emitting device package shown in FIG. to be.
  • the light emitting device package 500 may include the package body 110 and the light emitting device 120, as shown in FIGS. 13 and 14.
  • the package body 110 may include a first frame 111 and a second frame 112.
  • the first frame 111 and the second frame 112 may be spaced apart from each other.
  • the package body 110 may include a body 113.
  • the body 113 may be disposed between the first frame 111 and the second frame 112.
  • the body 113 may function as an electrode separation line.
  • the body 113 may be referred to as an insulating member.
  • the light emitting device 120 may include a first bonding portion 121, a second bonding portion 122, and a light emitting structure 123.
  • the first bonding portion 121 may be disposed on the lower surface of the light emitting device 120 at 122.
  • the second bonding portion 122 may be disposed on a lower surface of the light emitting device 120.
  • the first bonding part 121 and the second bonding part 122 may be spaced apart from each other on a lower surface of the light emitting device 120.
  • the light emitting device package 500 may include a first adhesive 130, as shown in FIG.
  • the first adhesive 130 may be disposed to overlap the light emitting device 120 in the vertical direction.
  • the first adhesive 130 may be disposed to overlap the light emitting device 120 with reference to a direction from the lower surface of the body 113 toward the upper surface.
  • the light emitting device package 500 may include a recess (R).
  • the recesses R may be provided in the body 113.
  • the recess R may be recessed in a first direction from the upper surface to the lower surface of the body 113.
  • the recess R may be disposed below the light emitting device 120.
  • the recess R may be provided to overlap with the light emitting device 120 in the first direction.
  • the first adhesive 130 may be disposed in the recesses R, 121, 121, and 122, respectively.
  • the first adhesive 130 may be disposed between the light emitting device 120 and the body 113.
  • the first adhesive 130 may be disposed between the first bonding part 121 and the second bonding part 122.
  • the first adhesive 130 may be disposed in contact with a side surface of the first bonding portion 121 and a side surface of the second bonding portion 122.
  • the recess R may provide a suitable space under which an under-fill process may be performed under the light emitting device 120.
  • the underfilling process may be a process of mounting the light emitting device 120 on the package body 110 and disposing the first adhesive 130 under the light emitting device 120,
  • the first adhesive 130 may be disposed on the recess R to be mounted through the first adhesive 130 in the process of mounting the device 120 on the package body 110, As shown in FIG.
  • the light emitting device package 500 may include a second adhesive 133.
  • the second adhesive 133 may be disposed between the first frame 111 and the light emitting device 120.
  • the second adhesive 133 may be disposed between the second frame 112 and the light emitting device 120.
  • the second adhesive 133 may be disposed between the upper surface of the body 113 and the lower surface of the light emitting device 120.
  • the second adhesive 133 may be disposed in direct contact with the upper surface of the body 113.
  • the second adhesive 133 may be disposed in direct contact with the lower surface of the light emitting device 120.
  • the second adhesive 133 may be provided as an example of a conductive adhesive.
  • the first frame 111 and the first bonding part 121 may be electrically connected through the second adhesive 133.
  • the second frame 112 and the second bonding part 122 may be electrically connected through the second adhesive 133.
  • the second adhesive 133 may include one material or an alloy thereof selected from the group including Ag, Au, Pt, and the like.
  • the second adhesive 133 may be made of a material capable of securing a conductive function.
  • the second adhesive 133 may be formed using a conductive paste.
  • the conductive paste may be selected from the group consisting of solder paste, silver paste and the like.
  • the first adhesive 130 and the second adhesive 133 may include different materials.
  • the first adhesive 130 may be provided as an insulating adhesive
  • the second adhesive 133 may be provided as a conductive adhesive.
  • the light emitting device package according to the embodiment may include a first recess R110 and a second recess R120.
  • the first recess (R110) may be provided on the upper surface of the first frame (111).
  • the first recess R110 may be recessed in a downward direction from an upper surface of the first frame 111.
  • the first recess (R110) may be disposed apart from the recess (R).
  • the first recess R110 may overlap the first bonding portion 121 with reference to a first direction from the lower surface of the first frame 111 toward the upper surface.
  • the second adhesive 133 may be provided on the first recess R110.
  • the second adhesive 133 may be disposed so as to overlap the first bonding portion 121 with respect to the first direction.
  • the second recess R120 may be provided on the upper surface of the second frame 112. [ The second recess R120 may be recessed in a downward direction from the upper surface of the second frame 112. [ The second recess R120 may be spaced apart from the recess R. [
  • the second recess R120 may overlap the second bonding portion 122 with reference to a first direction from the lower surface of the second frame 112 toward the upper surface.
  • the second adhesive 133 may be provided on the second recess R120.
  • the second adhesive 133 may be disposed to overlap the second bonding portion 122 with respect to the first direction.
  • first recess R110 and the second recess R120 may be provided in a width of several tens of micrometers to several hundreds of micrometers.
  • the second adhesive 133 may be disposed in the first recess R110 and the second recess R120.
  • the second adhesive 133 may be provided under the first bonding part 121 by being provided in the first recess R110.
  • the second adhesive 133 may be disposed in direct contact with the upper surface of the first recess R110.
  • the second adhesive 133 may be disposed in direct contact with the lower surface of the first bonding portion 121.
  • the second adhesive 133 may be provided in the second recess R120 and disposed below the second bonding portion 122. [ The second adhesive 133 may be disposed in direct contact with the upper surface of the second recess R120. The second adhesive 133 may be disposed in direct contact with the lower surface of the second bonding portion 122.
  • the area of the first recess R110 is larger than the area of the first bonding portion 121.
  • the area of the first recess R110 is larger than the area of the second adhesive 133.
  • the second adhesive 133 is provided on the first recess R110 and the first bonding portion 121 of the light emitting device 120 is mounted on the second adhesive 133, .
  • the adhesive 133 can be moved to the free space in the first recess R110 without riding on the side surface of the light emitting device 120.
  • the second adhesive 133 may be mounted on the side surface of the light emitting device 120 while the first bonding portion 121 of the light emitting device 120 is mounted on the second adhesive 133 So that the light emitting device 120 can be moved to an outer area of the first recess R110 where the light emitting device 120 is not disposed.
  • the second recess 133 may be provided in the second recess R120 and the second bonding portion 122 of the light emitting device 120 may be mounted on the second adhesive 133 .
  • the adhesive 133 can be moved to the free space in the second recess R120 without riding on the side surface of the light emitting device 120.
  • the second adhesive 133 may be mounted on the side surface of the light emitting device 120 while the second bonding portion 122 of the light emitting device 120 is mounted on the second adhesive 133
  • the light emitting device 120 can be moved to an outer area of the second recess R120 where the light emitting device 120 is not disposed.
  • the second adhesive 133 can be prevented from rising on the side surface of the light emitting device 120, the first conductive semiconductor layer and the second conductive semiconductor layer, which form the light emitting device 120, It is possible to prevent electrical short-circuiting. Also, since the second adhesive 133 can be prevented from being disposed on the side of the active layer of the light emitting device 120, the light extraction efficiency of the light emitting device 120 can be improved.
  • the light emitting device package 500 may include the first resin part 135.
  • the first resin part 135 may be disposed between the first frame 111 and the light emitting device 120.
  • the first resin part 135 may be disposed between the second frame 112 and the light emitting device 120.
  • the first resin part 135 may be disposed on a side surface of the first bonding part 121.
  • the first resin part 135 may be disposed on a side surface of the second bonding part 122.
  • the first resin part 135 may be disposed under the light emitting structure 123.
  • the first resin part 135 may be disposed between the light emitting device 120 and the second adhesive 133.
  • the first resin part 135 may be disposed in the first recess R110.
  • the first resin part 135 may be disposed in the first recess R110 and contacted with the second adhesive 133.
  • the first resin part 135 may be disposed in the first recess Rl 10 and provided around the second adhesive 133.
  • the first resin part 135 may be disposed in the first recess R110 and provided around the first bonding part 121.
  • the first resin part 135 may be disposed in the second recess R120.
  • the first resin part 135 may be disposed in the second recess R120 and contacted with the second adhesive 133.
  • the first resin part 135 may be disposed in the second recess R120 and provided around the second adhesive 133.
  • the first resin part 135 may be disposed in the second recess R120 and may be provided around the second bonding part 122.
  • the first resin part 135 may be disposed below the light emitting device 120 to perform a sealing function. In addition, the first resin part 135 can improve adhesion between the light emitting device 120 and the first frame 111. The first resin part 135 can improve the adhesion between the light emitting device 120 and the second frame 112.
  • the first resin part 135 may seal the first bonding part 121 and the second bonding part 122.
  • the first resin part 135 may prevent the second adhesive 133 from diffusing and moving in the lateral direction of the light emitting device 120.
  • the second adhesive 133 diffuses and moves in the lateral direction of the light emitting device 120, the second adhesive 133 may contact the active layer of the light emitting device 120, resulting in a failure due to a short circuit . Therefore, when the first resin part 135 is disposed, the second adhesive 133 and the active layer can be prevented from being short-circuited, thereby improving the reliability of the light emitting device package according to the embodiment.
  • the light emitting device package 500 may include the second resin part 140.
  • the second resin part 140 may include an insulating material.
  • the second resin part 140 may include wavelength conversion means for receiving light emitted from the light emitting device 120 and providing wavelength-converted light.
  • the second resin part 140 may include at least one selected from the group including phosphors, quantum dots, and the like.
  • the first resin part 135 is not provided separately, and the second resin part 140 is provided between the first frame 111 and the second frame part Or may be arranged to be in direct contact with the second frame 112.
  • the second resin part 140 may be disposed in the first recess R110 and the second recess R120.
  • the light emitting device package 500 is connected to the first bonding portion 121 through the second adhesive 133 provided in the first recess R110,
  • the second bonding portion 122 may be connected to the second bonding portion 122 via the second adhesive 133 provided on the second bonding portion 122.
  • the light emitting device 120 can be driven by the driving power supplied through the first bonding part 121 and the second bonding part 122.
  • the light emitted from the light emitting device 120 may be provided in an upward direction of the package body 110.
  • the light emitting device package 500 may be mounted on a submount, a circuit board, or the like.
  • a high temperature process such as a reflow process can be applied.
  • a re-melting phenomenon occurs in the bonding region between the lead frame and the light emitting device provided in the light emitting device package, so that the stability of electrical connection and physical coupling can be weakened.
  • the first bonding portion 121 and the second bonding portion 122 of the light emitting device 120 according to the embodiment are formed in the second And the driving power can be supplied through the adhesive 133.
  • the melting point of the second adhesive 133 may be selected to have a higher value than the melting point of the common bonding material.
  • the light emitting device package 500 and the method of manufacturing the light emitting device package according to the embodiment since the light emitting device 120 is mounted on the package body 110 using the conductive paste, The package body 110 does not need to be exposed to high temperatures. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discolored.
  • the selection range for the material constituting the body 113 can be widened.
  • the body 113 may be provided using not only expensive materials such as ceramics but also relatively inexpensive resin materials.
  • the body 113 may include at least one material selected from the group consisting of PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin and SMC can do.
  • PPA PolyPhtalAmide
  • PCT PolyCyclohexylenedimethylene Terephthalate
  • EMC Epoxy Molding Compound
  • FIG. 15 Another example of the light emitting device package according to the embodiment of the present invention will be described with reference to FIGS. 15 and 16.
  • FIG. 15 Another example of the light emitting device package according to the embodiment of the present invention will be described with reference to FIGS. 15 and 16.
  • FIG. 15 is a view illustrating still another example of the light emitting device package according to the embodiment of the present invention.
  • FIG. 16 is a view for explaining the arrangement relationship of the first frame, the second frame and the body applied to the light emitting device package shown in FIG. FIG.
  • FIGS. 15 and 16 a light emitting device package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 14.
  • FIG. 15 and 16 a light emitting device package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 14.
  • FIG. 15 and 16 a light emitting device package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 14.
  • the light emitting device package 600 may include a package body 110 and a light emitting device 120, as shown in FIGS.
  • the package body 110 may include a first frame 111 and a second frame 112.
  • the first frame 111 and the second frame 112 may be spaced apart from each other.
  • the package body 110 may include a body 113.
  • the body 113 may be disposed between the first frame 111 and the second frame 112.
  • the body 113 may function as an electrode separation line.
  • the body 113 may be referred to as an insulating member.
  • the first bonding part 121 may be disposed on a lower surface of the light emitting device 120.
  • the second bonding portion 122 may be disposed on a lower surface of the light emitting device 120.
  • the first bonding part 121 and the second bonding part 122 may be spaced apart from each other on a lower surface of the light emitting device 120.
  • the first bonding part 121 may be disposed on the first frame 111.
  • the second bonding portion 122 may be disposed on the second frame 112.
  • the first bonding portion 121 may be disposed between the light emitting structure 123 and the first frame 111.
  • the second bonding portion 122 may be disposed between the light emitting structure 123 and the second frame 112.
  • the light emitting device package 600 may include a first adhesive 130.
  • the first adhesive 130 may be disposed to overlap the light emitting device 120 in the vertical direction.
  • the first adhesive 130 may be disposed to overlap the light emitting device 120 with reference to a direction from the lower surface of the body 113 toward the upper surface.
  • the light emitting device package 600 may include a recess (R).
  • the recesses R may be provided in the body 113.
  • the recess R may be recessed in a first direction from the upper surface to the lower surface of the body 113.
  • the recess R may be disposed below the light emitting device 120.
  • the recess R may be provided to overlap with the light emitting device 120 in the first direction.
  • the recess R may be disposed between the first bonding portion 121 and the second bonding portion 122.
  • the recess R may be provided so as not to overlap with the first bonding portion 121 in the first direction.
  • the recess R may be provided so as not to overlap with the second bonding portion 122 in the first direction.
  • the first adhesive 130 may be disposed in the recess R.
  • the first adhesive 130 may be disposed between the light emitting device 120 and the body 113.
  • the first adhesive 130 may be disposed between the first bonding part 121 and the second bonding part 122.
  • the first adhesive 130 may be disposed in contact with a side surface of the first bonding portion 121 and a side surface of the second bonding portion 122.
  • the recess R may provide a suitable space under which an under-fill process may be performed under the light emitting device 120.
  • the underfilling process may be a process of mounting the light emitting device 120 on the package body 110 and disposing the first adhesive 130 under the light emitting device 120,
  • the first adhesive 130 may be disposed on the recess R to be mounted through the first adhesive 130 in the process of mounting the device 120 on the package body 110, As shown in FIG.
  • the light emitting device package 600 may include a second adhesive 133.
  • the second adhesive 133 may be disposed between the first frame 111 and the light emitting device 120.
  • the second adhesive 133 may be disposed between the second frame 112 and the light emitting device 120.
  • the second adhesive 133 may be disposed between the upper surface of the body 113 and the lower surface of the light emitting device 120.
  • the second adhesive 133 may be disposed in direct contact with the upper surface of the body 113.
  • the second adhesive 133 may be disposed in direct contact with the lower surface of the light emitting device 120.
  • the second adhesive 133 may be provided as an example of a conductive adhesive.
  • the first frame 111 and the first bonding part 121 may be electrically connected through the second adhesive 133.
  • the second frame 112 and the second bonding part 122 may be electrically connected through the second adhesive 133.
  • the second adhesive 133 may include one material or an alloy thereof selected from the group including Ag, Au, Pt, and the like.
  • the second adhesive 133 may be made of a material capable of securing a conductive function.
  • the second adhesive 133 may be formed using a conductive paste.
  • the conductive paste may be selected from the group consisting of solder paste, silver paste and the like.
  • the first adhesive 130 and the second adhesive 133 may include different materials.
  • the first adhesive 130 may be provided as an insulating adhesive
  • the second adhesive 133 may be provided as a conductive adhesive.
  • the light emitting device package 600 may include a first recess R110 and a second recess R120.
  • the first recess (R110) may be provided on the upper surface of the first frame (111).
  • the first recess R110 may be recessed in a downward direction from an upper surface of the first frame 111.
  • the first recess (R110) may be disposed apart from the recess (R).
  • the first recess R110 may overlap the first bonding portion 121 with reference to a first direction from the lower surface of the first frame 111 toward the upper surface.
  • the second adhesive 133 may be provided on the first recess R110.
  • the second adhesive 133 may be disposed so as to overlap the first bonding portion 121 with respect to the first direction.
  • the second recess R120 may be provided on the upper surface of the second frame 112. [ The second recess R120 may be recessed in a downward direction from the upper surface of the second frame 112. [ The second recess R120 may be spaced apart from the recess R. [
  • the second recess R120 may overlap the second bonding portion 122 with reference to a first direction from the lower surface of the second frame 112 toward the upper surface.
  • the second adhesive 133 may be provided on the second recess R120.
  • the second adhesive 133 may be disposed to overlap the second bonding portion 122 with respect to the first direction.
  • the second adhesive 133 may be disposed in the first recess R110 and the second recess R120.
  • the second adhesive 133 may be provided under the first bonding part 121 by being provided in the first recess R110.
  • the second adhesive 133 may be disposed in direct contact with the upper surface of the first recess R110.
  • the second adhesive 133 may be disposed in direct contact with the lower surface of the first bonding portion 121.
  • the second adhesive 133 may be provided in the second recess R120 and disposed below the second bonding portion 122. [ The second adhesive 133 may be disposed in direct contact with the upper surface of the second recess R120. The second adhesive 133 may be disposed in direct contact with the lower surface of the second bonding portion 122.
  • the second adhesive 133 is provided on the first recess R110 and the first bonding portion 121 of the light emitting device 120 is mounted on the second adhesive 133, .
  • the second recess 133 may be provided in the second recess R120 and the second bonding portion 122 of the light emitting device 120 may be mounted on the second adhesive 133 .
  • the light emitting device package 600 may include a third recess R130 and a fourth recess R140.
  • the third recess R130 may be provided adjacent to three sides of the first bonding portion 121 when viewed from the upper direction.
  • the third recess R130 may be provided in the shape of " [" in the periphery of the first bonding portion 121.
  • the third recess R130 may be provided adjacent to three sides of the first recess R110 when viewed from the upper direction.
  • the third recess R130 may be provided in the shape of " [" in the periphery of the first recess R110.
  • the fourth recess R140 may be provided adjacent to three sides of the second bonding portion 122 when seen from the upper direction.
  • the second recess R120 may be provided in the shape of "] " around the second bonding portion 122.
  • the fourth recess R140 may be provided adjacent to three sides of the second recess R120 when viewed from the upper direction.
  • the fourth recess R140 may be provided in the shape of "] " around the second recess R120.
  • the light emitting device package 600 may include the first resin part 135.
  • the first resin part 135 may be disposed on a side surface of the first bonding part 121.
  • the first resin part 135 may be disposed on a side surface of the second bonding part 122.
  • the first resin part 135 may be disposed under the light emitting structure 123.
  • the first resin part 135 may be disposed between the light emitting device 120 and the second adhesive 133.
  • the first resin part 135 may be provided to the third recess R130 and the fourth recess R140.
  • the first resin part 135 may be disposed on a side surface of the first bonding part 121.
  • the first resin part 135 may be provided to the third recess R130 and extended to a region where the first bonding part 121 is disposed.
  • the first resin part 135 may be disposed under the light emitting structure 123.
  • the first resin part 135 may be disposed on a side surface of the second bonding part 122.
  • the first resin part 135 may be provided to the fourth recess R140 and extended to a region where the second bonding part 122 is disposed.
  • the first resin part 135 may be disposed under the light emitting structure 123.
  • the first resin part 135 may be provided on a side surface of the light emitting structure 123.
  • the first resin part 135 is disposed on the side surface of the light emitting structure 123 to effectively prevent the second adhesive 133 from moving to the side surface of the light emitting structure 123.
  • the first resin part 135 may be disposed under the active layer of the light emitting structure 123, The extraction efficiency can be improved.
  • the light emitting device package according to the embodiment may be provided such that a part of the third recess R 130 overlaps with the light emitting structure 123 in the vertical direction when viewed from the upper direction.
  • a lateral region of the third recess R 130 adjacent to the first bonding portion 121 may be provided extending below the light emitting structure 123.
  • a part of the fourth recess R140 may be provided to overlap with the light emitting structure 123 in the vertical direction when viewed from the upper direction.
  • a lateral region of the fourth recess R 140 adjacent to the second bonding portion 122 may be provided extending below the light emitting structure 123.
  • the first resin part 135 filled in the third recesses R 130 and the fourth recesses R 140 may be formed around the first bonding part 121 and the second bonding part 122 So that it can be effectively sealed.
  • the third recess R130 and the fourth recess R140 may provide sufficient space under which the first resin part 135 can be provided under the light emitting device 120. [ The third recess R130 and the fourth recess R140 may provide an appropriate space under which a kind of underfill process may be performed under the light emitting device 120. [
  • the first resin part 135 may be disposed below the light emitting device 120 to perform a sealing function. In addition, the first resin part 135 can improve adhesion between the light emitting device 120 and the first frame 111. The first resin part 135 can improve the adhesion between the light emitting device 120 and the second frame 112.
  • the first resin part 135 may seal the first bonding part 121 and the second bonding part 122.
  • the first resin part 135 can prevent the second adhesive 133 from diffusing and moving in the lateral direction of the light emitting device 120.
  • the second adhesive 133 diffuses and moves in the lateral direction of the light emitting device 120, the second adhesive 133 may contact the active layer of the light emitting device 120, resulting in a failure due to a short circuit . Therefore, when the first resin part 135 is disposed, the second adhesive 133 and the active layer can be prevented from being short-circuited, thereby improving the reliability of the light emitting device package according to the embodiment.
  • the light emitting device package according to the embodiment may include the second resin part 140.
  • the second resin part 140 may be provided on the light emitting device 120.
  • the second resin part 140 may be disposed on the first frame 111 and the second frame 112.
  • the second resin part 140 may be disposed in the cavity C provided by the package body 110.
  • the second resin part 140 may be disposed on the first resin part 135.
  • the light emitting device package 500 is connected to the first bonding portion 121 through the second adhesive 133 provided in the first recess R110,
  • the second bonding portion 122 may be connected to the second bonding portion 122 via the second adhesive 133 provided on the second bonding portion 122.
  • the light emitting device 120 can be driven by the driving power supplied through the first bonding part 121 and the second bonding part 122.
  • the light emitted from the light emitting device 120 may be provided in an upward direction of the package body 110.
  • the light emitting device package 600 may be mounted on a submount, a circuit board, or the like.
  • a high temperature process such as a reflow process can be applied.
  • a re-melting phenomenon occurs in the bonding region between the lead frame and the light emitting device provided in the light emitting device package, so that the stability of electrical connection and physical coupling can be weakened.
  • the first bonding portion 121 and the second bonding portion 122 of the light emitting device 120 according to the embodiment are formed in the second And the driving power can be supplied through the adhesive 133.
  • the melting point of the second adhesive 133 may be selected to have a higher value than the melting point of the common bonding material.
  • the light emitting device package 600 and the method of manufacturing the light emitting device package according to the embodiment since the light emitting device 120 is mounted on the package body 110 using the conductive paste, The package body 110 does not need to be exposed to high temperatures.
  • the embodiment it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discolored. Accordingly, the selection range for the material constituting the body 113 can be widened. According to the embodiment, the body 113 may be provided using not only expensive materials such as ceramics but also relatively inexpensive resin materials.
  • the body 113 may include at least one material selected from the group consisting of PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin and SMC can do.
  • PPA PolyPhtalAmide
  • PCT PolyCyclohexylenedimethylene Terephthalate
  • EMC Epoxy Molding Compound
  • the light emitting device package according to the embodiment described above may be mounted on a submount, a circuit board, or the like.
  • the light emitting device package described above may be provided with a flip chip light emitting device as an example.
  • the flip chip light emitting device may be provided as a transmissive flip chip light emitting device that emits light in six plane directions, or may be provided as a reflective flip chip light emitting device that emits light in five plane directions.
  • the reflection type flip chip light emitting device in which light is emitted in the five-sided direction may have a structure in which a reflection layer is disposed in a direction close to the package package body 110.
  • the reflective flip chip light emitting device may include an insulating reflective layer (e.g., a Distributed Bragg Reflector, an Omni Directional Reflector, etc.) and / or a conductive reflective layer (e.g., Ag, Al, Ni, Au, etc.).
  • the flip chip light emitting device may include a first bonding portion electrically connected to the first conductive type semiconductor layer and a second bonding portion electrically connected to the second conductive type semiconductor layer, And may be provided as a general horizontal light emitting device in which light is emitted between the first bonding portion and the second bonding portion.
  • the flip-chip light emitting device in which the light is emitted in the six-sided direction includes a reflective region in which a reflective layer is disposed between the first and second electrode pads, and a transmissive flip chip light emitting device Can be provided.
  • the transmissive flip chip light emitting device refers to a device that emits light to the top surface, four side surfaces, and six surfaces of the bottom surface.
  • the reflection type flip chip light emitting device means an element that emits light to the upper surface and the four side surfaces.
  • FIG. 17 Another example of the light emitting device package according to the embodiment will be described with reference to FIGS. 17 to 19.
  • FIG. 17 is a diagrammatic representation of the light emitting device package according to the embodiment.
  • FIGS. 17 to 19 a light emitting device package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 16.
  • FIG. 17 a light emitting device package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 16.
  • FIG. 17 is a cross-sectional view of a light emitting device package according to an embodiment of the present invention
  • FIG. 18 is a view for explaining an arrangement example of first and second frames in the light emitting device package shown in FIG. 17, And the first and second bonding pads are disposed on the first and second frames in the illustrated light emitting device package.
  • the light emitting device package 1100 may include a body 1115 and a light emitting device 1151 on the body 1115.
  • the body 1115 may be coupled to a plurality of frames 1121 and 1131. At least one or both of the plurality of frames 1121 and 1131 may include coupling parts 1120 and 1130 connected to the light emitting device 1151.
  • One or more of the frames 1121 and 1131 may be a conductive material.
  • the plurality of frames 1121 and 1131 may include first and second frames 1121 and 1131 spaced from each other. At least one or two of the plurality of frames 1121 and 1131 may be electrically connected to the light emitting device 1151. (1121, 1131)
  • the package body 1110 may be disposed on the frames 1121 and 1131 and the body 1115.
  • the package body 1110 may include the body 1115 or may be formed of a separate material.
  • the body 1115 may be disposed between the first and second frames 1121 and 1131 and the first and second frames 1121 and 1131 may be insulated from each other through the body 1115, As shown in FIG.
  • the body 1115 may be made of a resin material or an insulating material.
  • the body 1115 may be formed of a material such as polyphthalamide (PPA), polychlorophenyl (PCT), liquid crystal polymer (LCP), polyamide 9T, silicone, epoxy molding compound (SMC), ceramics, photo sensitive glass (PSG), sapphire (Al 2 O 3 ), and the like.
  • the body 1115 may include a high refractive index filler such as TiO 2 and SiO 2 as an epoxy material.
  • the body 1115 may be made of a reflective resin material.
  • the body 1115 may be a transparent or non-transparent material.
  • the body 1115 may be a ceramic material.
  • the body 1115 may be made of the same material as the package body 1110 or may be made of another material.
  • the package body 1110 may be a reflective material or a transparent or non-transparent material.
  • the first frame 1121 and the second frame 1131 may be separated from each other by a body 1115.
  • the body 1115 may be formed of an insulating material as an electrode separating member when the first frame 1121 and the second frame 1131 are conductive materials or electrodes.
  • the body 1115 may include a cavity 1112. A part of the first frame 1121 and the second frame 1131 may be exposed to the bottom of the cavity 1112. For example, the bonding regions B1 and B2 of the first and second frames 1121 and 1131 are exposed as shown in FIG. 18 and may correspond to the light emitting device 1151.
  • One or more light emitting devices 1151 may be disposed in the cavity 1112. When the light emitting devices 1151 are disposed in a plurality of the cavities 1112, a plurality of the bonding regions B1 and B2 may be arranged. The positions of the bonding areas B1 and B2 may be on the same plane or on different planes.
  • the body 1115 may be exposed to the bottom 1113 of the cavity 1112.
  • the side surface 1116 of the cavity 1112 may be a sloped surface or a vertical surface with respect to the bottom surface of the package 1100 or may have a surface perpendicular to the sloped surface.
  • the top view shape of the cavity 1112 may include a circular shape, an elliptical shape, or a polygonal shape.
  • the cavity 1112 may be narrower or smaller in floor area or width than the top area or width.
  • the first frame 1121 and the second frame 1131 may be made of a conductive material, for example, a metal material.
  • the first frame 1121 and the second frame 1131 may be formed of a metal such as Pt, Ti, Ni, Cu, Au, (Al), and silver (Ag), and may be a single layer or a multi-layer having different metal layers.
  • the first and second frames 1121 and 1131 are a base layer in which a copper layer is disposed and an aluminum layer is formed on the surface of the copper layer or a nickel layer / aluminum layer is laminated.
  • the first frame 1121 may include a first extending portion 1123 extending to a first side of the package body 1110.
  • the first extending portion 1123 may protrude into a single or a plurality of .
  • the opposite side of the first side of the package body 1110 may be the second side.
  • the first frame 1121 may include at least one hole and / or groove in a region vertically overlapping the package body 1110 to be coupled with the package body 1110.
  • the second frame 1131 may include a second extension 1133 extending to a second side of the package body 1110 and the second extension 1133 may be formed as a single or a plurality of projections .
  • the second frame 1131 may be coupled to the package body 1110 with at least one hole and / or groove in a region overlapping the package body 1110 in the vertical direction.
  • the first and second frames 1121 and 1131 may include concave regions 1122 and 1132 at the top.
  • a portion of the package body 1110 or the body 1115 may be disposed in the concave regions 1122 and 1132.
  • a portion of the concave regions 1122 and 1132 may overlap with the cavity 1112 in the vertical direction.
  • the depths of the concave regions 1122 and 1132 may be in a range of 50% to 70% of the thickness of the first and second frames 1121 and 1131, and if they are out of this range, the supporting force or bonding force may be lowered.
  • the thickness of the first frame 1121 and the second frame 1131 may be 220 ⁇ or less, for example, 180 ⁇ to 220 ⁇ . This thickness range takes into account the thickness of the injection process that can provide crack free of the package body 1115. [ The bottoms of the first and second frames 1121 and 1131 may be exposed on the lower surface of the package body 1115.
  • the first and second frames 1121 and 1131 may have at least two layers and may include a base layer 13 and an adhesive layer 14 on the base layer 13 as shown in FIG.
  • the base layer 13 may be a Cu layer
  • the adhesive layer 14 may be a Ni layer or a Ti layer.
  • the first and second frames 1121 and 1131 may further include an Ag layer disposed on the surface of the adhesive layer 14. [ The Ag layer can function as a junction with a circuit substrate or as a surface protective layer.
  • the base layer 13 may be in non-contact with or in contact with the bonding portions 1120 and 1130 forming an intermetallic compound.
  • the light emitting device 1151 may selectively emit light of blue, green, red, visible, and infrared wavelengths.
  • the light emitting device 1151 includes a substrate 1305, a light emitting structure 1310 under the substrate 1305, a first electrode P5 electrically connected to the light emitting structure 1310, (P6).
  • the first electrode P5 may include a first bonding pad 1373 or a separate layer below the first electrode P5.
  • the second electrode P6 may include a second bonding pad 1371 at the bottom or may have a separate layer.
  • the light emitting device 1151 may be disposed in the cavity 1112 and disposed on the first and second frames 1121 and 1131.
  • the light emitting device 1151 may be disposed on the first bonding area B1 of the first frame 1121 and the second bonding area B2 of the second frame 1131 as shown in FIG.
  • the first bonding pads 1373 of the light emitting device 1151 may correspond to or face the first bonding areas B1 of the first frame 1121.
  • the second bonding pads 1371 of the light emitting element 1151 may correspond to or face the second bonding areas B2 of the second frame 1131.
  • the first and second bonding pads 1373 and 1371 may be formed as a lower layer of the first and second electrodes P5 and P6, respectively, as a single layer or a multilayer.
  • the first and second bonding pads 1373 and 1371 may include an adhesive layer 41, a barrier layer 42, and a bonding layer 43 as shown in FIG.
  • the adhesive layer 41 may be Ni
  • the barrier layer 42 may be a single layer or multiple layers including Ti
  • the bonding layer 43 may include Cu.
  • the thickness of the adhesive layer 41 and the barrier layer 42 may be in a range of 500 nm or less, for example, 100 nm to 500 nm, and may function as an adhesion and a barrier in such a thickness range.
  • the coupling portions 1120 and 1130 may be disposed between the electrodes P5 and P6 of the light emitting device 1151 and the bonding regions B1 and B2 of the frames 1121 and 1131 .
  • the coupling portions 1120 and 1130 may be intermetallic compounds.
  • the coupling parts 1120 and 1130 may include a first coupling part 1120 on the first bonding area B1 and a second coupling part 1130 on the second bonding area B2.
  • the first bonding portion 1120 is disposed between the first bonding region B1 and the first electrode P5 and the second bonding portion 1130 is disposed between the second bonding region B2 and the second electrode P6.
  • the first coupler 1120 may be connected to the first bonding pad 1373 of the first electrode P5 and the first frame 1121.
  • the second coupling portion 1130 may be connected to the second bonding pad 1371 of the second electrode P6 and the second frame 1131.
  • the intermetallic compound of the first and second coupling parts 1120 and 1130 may be formed of the same material, for example, a metal, a compound, or an alloy.
  • the first and second coupling portions 1120 and 1130 may be made of a material having no lead (Pb).
  • the first and second coupling portions 1120 and 1130 are formed in the first and second bonding regions B1 and B2 of the first and second frames 1121 and 1131 with a base layer Formed or contacted or non-contacted.
  • the lower surfaces of the first and second coupling portions 1120 and 1130 may be disposed lower than the bottom 1113 of the cavity 1112 or may be in contact with the body 1115.
  • the first and second coupling portions 1120 and 1130 may have at least two kinds of metals and the first metal is at least one of gold (Au), copper (Cu), and silver (Ag) May include tin (Sn).
  • the first and second coupling portions 1120 and 1130 may be formed of any one of Ag-Sn based compound, Ag-Au-Sn based compound, Au-Sn based compound, Cu-Sn based compound and Au- .
  • the second metal may form an intermetallic compound (IMC) with the bonding pads 1371 and 1373 and the metal layer provided on the frame.
  • IMC intermetallic compound
  • the second metal must be capable of forming an intermetallic compound (IMC) with the frame as well as with the first metal, so that a stable bonding force can be provided between the light emitting device according to the embodiment and the bonding layer provided in the frame .
  • IMC intermetallic compound
  • the amount of the first metal in the first and second coupling portions 1120 and 1130 may be greater than twice the amount of the second metal in terms of the mass percent (Wt%). This is because when the layer of the material constituting the coupling portion (21, 23 in FIG. 20) on the frame 1121, 1131 is plated, the substance formed by plating has a porous property compared with the substance formed through the sputter , And may be formed at the above magnification.
  • the amount of the second metal e.g., Sn
  • the amount of the second metal may be less than 1/2 times the amount of the first metal (e.g., Ag) based on the mass percentage (Wt%).
  • the amount of Ag and the amount of Sn are set to 4.5 : 2 to 5.5: 2. Further, since the atomic weight of Ag is 107.8682 and the atomic weight of Sn is 118.710, the binding can proceed at a ratio of Ag and Sn of, for example, 5: 2 on the basis of At%.
  • the semiconductor device and the first and second frames Peeling may occur and the melting point of the intermetallic compound (IMC) may become too low, so that re-melting may occur when the light emitting device package is mounted on a circuit board.
  • the ratio of the first metal (e.g., Ag) of the intermetallic compound forming the bonding portion to the second metal (e.g., Sn) is out of 4.5: 2 to 5.5: 2
  • the semiconductor device and the first and second frames Peeling may occur and the melting point of the intermetallic compound (IMC) may become too low, so that re-melting may occur when the light emitting device package is mounted on a circuit board.
  • the upper and lower surfaces of the intermetallic compound (IMC) of the bonding portion may not be flat. Therefore, since the length of the surface of the coupling portion can be long, the coupling between the light emitting device and the first and second frames can be firmly established.
  • IMC intermetallic compound
  • the Sn must be capable of forming an intermetallic compound (IMC) not only with the Ag but also with the metal layer provided on the frame to which the light emitting device is bonded. Accordingly, when the intermetallic compound (IMC) between the Sn and the Ag is formed, the amount of each layer should be selected so that the Sn can remain. This is because the Sn can form an intermetallic compound (IMC) with the frame as well as the Ag, so that a stable bonding force can be provided between the light emitting device and the metal layer on the frame.
  • IMC intermetallic compound
  • the thicknesses of the first and second layers 21 and 23 may be provided in the range of 0.8 ⁇ ⁇ or more, for example, 0.8 ⁇ ⁇ to 1.5 ⁇ ⁇ . If the thickness is less than the above range, the bonding ability is deteriorated. If the thickness is larger than the above range, the improvement of the bonding ability may be insignificant. As shown in FIG. 31, remelting may occur when the light emitting device package 1100 is bonded to the circuit board .
  • the bonding layers 1125 and 1135 may include a first layer 21 formed on each bonding region B1 and B2 and a second layer 23 on the first layer 21 as shown in FIG. .
  • the laminated structure of the first layer 21 and the second layer 23 formed on the first bonding region B1 may be defined as a first bonding layer 1125 and the second bonding layer 1125 may be formed on the second bonding region B2.
  • the first layer 21 / the second layer 23 may be defined as a second bonding layer 1135.
  • the first layer 21 is disposed between the adhesive layer 14 and the second layer 23 of the first and second frames 1121 and 1131 and includes a second metal (e.g., Sn) can do.
  • the second layer 23 is disposed between the first and second bonding pads 1373 and 1371 and the first layer 21 and may include a first metal such as Ag.
  • the mass percentages of the first and second layers 21 and 23 in the first and second bonding layers 1125 and 1135 of the first and second bonding layers 1125 and 1135 indicate that the first metal may be 90 wt% or more, for example, 90 to 98 wt% And the second metal may have a range of 10 wt% or less, for example, 2 wt% to 10 wt%.
  • the first metal (e.g., Ag) and the second metal (e.g., Sn) may be formed in a ratio of 9: 1 to 49: 1 based on the mass percentage (wt%) in the bonding layers 1125 and 1135 .
  • the strength may be lowered and the moisture absorption preventing function may be deteriorated. If the first metal A re-melting may occur between the light emitting device and the light emitting device package. If the second metal (for example, Sn) is less than the above range, the intermetallic compound is not normally formed and the adhesive strength may be lowered. If the second metal is larger than the above range, the intermetallic compound may be remelted when bonded to the circuit board.
  • the first metal for example, Ag
  • the second metal for example, Sn
  • the first layer 21 and the second layer 23 are melted to form an intermetallic compound having a first metal and a second metal IMC (intermetallic compound) layers (1120 and 1130 in FIG. 17) may be formed as shown in FIGS. 17 and 25.
  • FIG. The bonding portions 1120 and 1130 connect the first electrode P5 and the first bonding region B1 and connect the second electrode P6 and the second bonding region B2 to each other. have.
  • the first coupling part 1120 connects the first electrode P5 of the light emitting device with the first frame 1121 and the second coupling part 1130 connects the second electrode P6 And the second frame 1131 can be connected to each other. Since the first and second bonding portions 1120 and 1130 are melted by the air reflow process, the bottom surface area may be wider than the top surface area, and the bottom surface area may be larger than the first and second bonding areas B1 and B2 It can be wider. The first and second coupling portions 1120 and 1130 may be in contact with the bottom 1113 of the cavity 1112 made of the body material.
  • the prebonding process and the air reflow process may be performed at a temperature of 230 ° C or lower, for example, at a low temperature bonding.
  • the prebonding process and the air reflow process may be performed at a temperature of 230 ° C or less.
  • the pre-bonding step and the air reflow step may be performed at a temperature of 200 ° C or lower.
  • the metal scheme of the first and second bonding layers (1125 and 1135 in FIG. 22) 2 metal, and a low temperature bonded intermetallic compound layer may be provided.
  • the copper bonding layer 43 which is the lowermost layer of the first and second bonding pads 1371 and 1373, is formed in the air- in combination with the bonding layer (1125, 1135), it may be formed of a Cu-Sn based intermetallic compound layer 4. Part or all of the copper bonding layer 43 may be formed of an intermetallic compound by bonding between the metals of the first and second bonding layers 1125 and 1135. The metal of the bonding layer 43 of the first and second bonding pads 1371 and 1373 is combined with the first and second metals of the first and second bonding layers 1125 and 1135 to form a Au- Sn compound.
  • the ratio of the thickness T1 of the bonding layer 43 of the first and second bonding pads 1371 and 1373 to the thickness T2 of the first and second bonding layers 1125 and 1135 May range from 0.8: 1 to 1.2: 1. Since the thickness T2 of the first and second bonding layers 1125 and 1135 is in the range of 0.8 ⁇ m or more, for example, 0.8 ⁇ m to 1.5 ⁇ m, the thickness T1 of the bonding layer differs depending on the thickness T2 . If the thickness T2 of the first and second bonding layers 1125 and 1135 is less than the above range, the bonding strength may be lowered. If the thickness T2 is larger than the above range, remelting may occur.
  • the thickness T3 of the coupling portions 1120 and 1130 is a thickness formed by an intermetallic compound and may be 1.5 ⁇ ⁇ or less, for example, in a range of 0.5 ⁇ ⁇ to 1.5 ⁇ ⁇ .
  • the bonding force between the light emitting element and the frame can be improved by the range of the thickness T3.
  • each of the coupling parts 1120 and 1130 may be larger than the top surface area of the first and second bonding areas B1 and B2 of the first and second frames 1121 and 1131, Bonding strength with the second bonding areas B1 and B2 can be improved.
  • FIG. 23 is a view for explaining an example in which a molding part is formed in a cavity after bonding the light emitting device according to the embodiment
  • FIG. 24 is a sectional view taken along the line B-B in FIG.
  • a molding part 1181 may be disposed in the cavity 1112.
  • the molding part 1181 may include a transparent resin material.
  • the molding part 1181 may include a material such as transparent silicone or epoxy.
  • the molding part 1181 may cover the light emitting device 1151.
  • the molding part 1181 may transmit the light emitted from the light emitting device 1151.
  • the molding part 1181 may be disposed as a single layer or a multi-layer structure. In case of a multi-layered structure, a resin material having a lower refractive index may be disposed from the lower surface of the molding part 1181 toward the upper surface.
  • the molding part 1181 may include a fluorescent material therein.
  • the phosphor may include at least one of red, green, blue, and yellow phosphors.
  • the upper surface of the molding part 1181 may include a horizontal plane, a concave curved surface, or a convex curved surface.
  • An optical lens (not shown) may be disposed on the molding part 1181, and the optical lens may control the directivity of the light emitted through the molding part 1181.
  • the material of the coupling portions 1120 and 1130 is formed in advance in the frames 1121 and 1131 as a plating layer and is then bonded to the light emitting device 1151 so that the problem of defects due to use of the solder can be reduced. Also, the area occupied by the coupling portions 1120 and 1130 can be minimized.
  • the coupling portions 1120 and 1130 may be disposed within a range of about 150% or less, for example, 80% to 150% of the bonding regions B1 and B2 based on the bonding regions B1 and B2. have.
  • FIG. 27 is a plan view of a light emitting device applied to a light emitting device package according to an embodiment
  • FIG. 28 is a cross-sectional view taken along line C-C of the light emitting device shown in FIG.
  • the first bonding pad 1173 of the first electrode P5 and the second bonding pad 1171 of the second electrode P6 may be spaced apart from each other on one side of the light emitting device 1151 have.
  • One or a plurality of the first electrode units 1342 connected to the first electrode P5 may extend in the first direction and overlap the second electrode P6 in the vertical direction.
  • One or a plurality of the second electrode units 1341 connected to the second electrode P6 may extend in the first direction and may overlap with the first electrode P5 in the vertical direction.
  • the first direction may be a longitudinal direction of the light emitting device, and may be a direction orthogonal to the second direction.
  • the first and second electrodes P5 and P6 may have a long length in the second direction.
  • the P region and the N region may be regions showing a via structure connected to different semiconductor layers.
  • the electrode portions 1341 and 1342 can diffuse the current to the entire region.
  • the light emitting element 1151 may include a substrate 1305 and a light emitting structure 1310 disposed thereon.
  • the substrate 1305 may be selected from the group consisting of a sapphire substrate (Al 2 O 3 ), SiC, GaAs, GaN, ZnO, Si, GaP, InP and Ge.
  • the substrate 1305 may have a concavo-convex pattern formed on its upper surface.
  • the light emitting structure 1310 may include a first conductive semiconductor layer 1311, an active layer 1312, and a second conductive semiconductor layer 1313.
  • the first conductive semiconductor layer 1311 may be provided as an n-type semiconductor layer
  • the second conductive semiconductor layer 1313 may be provided as a p-type semiconductor layer.
  • the first conductivity type semiconductor layer 1311 may be provided as a p-type semiconductor layer
  • the second conductivity type semiconductor layer 1313 may be provided as an n-type semiconductor layer.
  • description will be made on the case where the first conductivity type semiconductor layer 1311 is provided as an n-type semiconductor layer and the second conductivity type semiconductor layer 1313 is provided as a p-type semiconductor layer .
  • a current diffusion layer 1320 and a transparent electrode layer 1330 or a transparent contact layer may be disposed on the light emitting structure 1310. [ The current diffusion layer 1320 and the transparent electrode layer 1330 or the transparent contact layer may increase current diffusion to increase light output.
  • the current diffusion layer 1320 may be provided, for example, with an oxide or a nitride.
  • the horizontal width of the current diffusion layer 1320 may be greater than the horizontal width of the second electrode P6 disposed above. Accordingly, the current diffusion layer 1320 can improve the luminous flux by preventing the current concentration at the lower side of the second electrode P6 and improving the electrical reliability.
  • the transparent electrode layer 1330 or the transparent contact layer may include at least one selected from the group consisting of a metal, a metal oxide, and a metal nitride.
  • the transparent electrode layer 1330 or the transparent contact layer may include a light-transmitting material.
  • the transparent electrode layer 1330 or the transparent contact layer may be formed of one selected from the group consisting of ITO (indium tin oxide), IZO (indium zinc oxide), IZON nitride, IZTO (indium zinc oxide) (indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO (gallium zinc oxide), IrOx, RuOx, RuOx / ITO, Ni / IrOx / Au, Ni / IrOx / Au / ITO, Pt, Ni, Au, Rh, and Pd, and may be formed as a single layer or a multilayer.
  • ITO indium tin oxide
  • IZO indium zinc oxide
  • IZON nitride IZTO (indium zinc oxide) (indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), A
  • the second electrode P6 may have a second electrode portion 1341 electrically connected to the first conductivity type semiconductor layer 1311 and the second electrode portion 1341 may have a second electrode portion 1341, May be disposed on the exposed surface of the first conductive type semiconductor layer 1311 after a part of the active layer 1313 and a part of the active layer 1312 are removed.
  • the first electrode P5 may have a first electrode portion 1342 electrically connected to the second conductivity type semiconductor layer 1313.
  • the first electrode portion 1342 may have a first electrode portion 1342, (1313).
  • the current diffusion layer 1320 may be disposed between the first electrode portion 1342 and the second conductivity type semiconductor layer 1313.
  • the first and second electrode portions 1342 and 1341 may have a single-layer structure or a multi-layer structure.
  • the first and second electrode units 1342 and 1341 may be ohmic electrodes.
  • the first and second electrode units 1342 and 1341 may be formed of a material selected from the group consisting of ZnO, IrOx, RuOx, NiO, RuOx / ITO, Ni / IrOx / Au, , At least one of Ti, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au and Hf or an alloy of two or more of them.
  • the protective layer 1350 may be disposed on the first and second electrode portions 1342 and 1341.
  • the protective layer 1350 may have openings h1 and h2 to expose the first and second electrode portions 1342 and 1341.
  • the protective layer 1350 may be provided as an insulating material .
  • the protective layer 1350 may be formed of SiO 2 , SiO x , SiO x N y , Si 3 N 4 , Al 2 O 3 And at least one material selected from the group consisting of:
  • the insulating reflective layers 1361 and 1362 may be disposed on the protective layer 1350.
  • the insulating reflective layers 1361 and 1362 may have openings h3 and h4 and may expose the first electrode portion 1342 and the second electrode portion 1341.
  • a DBR (Distributed Bragg Reflector) layer or an ODR (Omni Directional Reflector) layer may be provided with TiO 2 and SiO 2 or Ta 2 O 5 and SiO 2 , for example.
  • the insulating semiconductor layers 361 and 362 are formed around the electrodes to reflect light emitted from the active layer 1312 of the light emitting structure 1310 to minimize light absorption and improve brightness.
  • the first connection electrode 1362 is connected to the first electrode unit 1342 through the opening h3 and the second connection electrode 1361 is connected to the second electrode unit 1341 through the opening h4.
  • the first and second connection electrodes 1361 and 1362 may be formed of a metal such as Ti, Al, In, Ir, Ta, Pd, Co, Cr, Mg, Zn, Ni, Si, Ge, Ag, Layer or multi-layer using at least one material or alloy selected from Ru, Rh, ZnO, IrOx, RuOx, NiO, RuOx / ITO, Ni / IrOx / Au and Ni / IrOx / Au / ITO.
  • a first bonding pad 1373 may be disposed on the first connection electrode 1362 and a second bonding pad 1371 may be disposed on the second connection electrode 1361.
  • the light emitting device according to the embodiment may be connected to the external power source through the first and second bonding pads 1373 and 1371 in a flip chip bonding manner.
  • the first bonding pad 1373 and the second bonding pad 1371 are formed of Ni / Ti / Cu or the like, so that the bonding process can be performed stably.
  • the light emitting device according to the embodiment When the light emitting device according to the embodiment is mounted by a flip chip bonding method and is implemented as a package, the light provided from the light emitting structure 1310 may be emitted through the substrate 1305.
  • the first bonding pad 1373 and the second bonding pad 1371 having a large area can be directly bonded to a circuit board providing power, so that the flip chip bonding process It can be done easily and stably.
  • FIG. 29 shows a first modification of the light emitting device package of FIG. 17, wherein the light emitting device package may include a recess 1115A provided in a body 1115 disposed below the light emitting element 1151.
  • FIG. The recess 1115A may be disposed in a region overlapping the light emitting device 1151.
  • the recess 1115A may be formed at a predetermined depth from the upper surface of the body 1115 to a depth smaller than the thickness of the body 1115, for example. The depth of the recess 1115A may be determined in consideration of the adhesive force of the resin material disposed between the body 1115 and the light emitting device 1151.
  • the resin material may be a material of the molding part 1181 or a resin material having reflection and / or heat radiation characteristics.
  • the length of the recess 1115A may be the direction between the first and second frames 1121 and 1131 and may be smaller or larger than the length of the light emitting device 1151.
  • the depth of the recess 1115A is set so that a stable strength of the body 1115 is taken into consideration and / or cracks are not generated in the semiconductor device package 1100 by heat emitted from the light emitting device 1151 Can be determined.
  • the recess 1115A may provide a proper space in which an under-fill process can be performed under the light emitting device 1151.
  • Fig. 30 is a second modification of the light emitting device package of Fig. 16, and the light emitting device package may include a through hole 1115B provided in a body 1115 disposed below the light emitting element 1151.
  • the through hole 1115B may be a hole penetrating from the upper surface to the lower surface of the body 1115.
  • the width of the through hole 1115B in the first direction may be smaller than the width of the body 1115 and the length of the second direction may be smaller or larger than the length of the light emitting element 1151 in the second direction.
  • a part of the molding part 1181 may be disposed in the through-hole 1115B, or a part of the adhesive shown in FIGS. 31 and 32 may be disposed.
  • the through hole 1115B may be formed by attaching a sheet adhered to the lower portion of the through hole 1115B and then molding the same into the molding portion 1181 or molding an adhesive.
  • the adhesive may be disposed in an area between the light emitting device 1151 and the body 1115, and may be disposed through the through hole 1115B.
  • the adhesive may be a reflective or / and heat-releasing resin.
  • FIG. 31 shows a third modification of the light emitting device package of FIG. 17, wherein the light emitting device package may include an adhesive 1118 disposed under the light emitting device 1151.
  • the adhesive 1118 may be in contact with the light emitting device 1151.
  • the adhesive 1118 may include at least one of a resin material, a hybrid material including an epoxy-based material, a silicone-based material, an epoxy-based material, and a silicon-based material .
  • the adhesive 1118 may be a reflective material or / and a heat-dissipating resin that reflects light emitted from the light emitting device 1151.
  • a high-refractive index filler such as Al 2 O 3 , SiO 2 , or TiO 2 may be used Or may comprise a white silicone.
  • the adhesive 1118 may be disposed between the light emitting device 1151 and the body 1115.
  • the adhesive 1118 may be disposed between the light emitting device 1151 and the first and second frames 1121 and 1131.
  • the adhesive 1118 contacts at least one of the light emitting device 1151 and the first and second couplers 1120 and 1130 to reflect light incident from the light emitting device 1151,
  • the heat generated from the heat source 1151 can be conducted.
  • the heat conductive property of the adhesive 1118 is higher than the thermal conductivity of the molding part 1181 and the heat generated from the light emitting device 1151 is conducted through the first and second frames 1121 and 1131, Thermal stability can be provided.
  • the adhesive 1118 may be in contact with the molding part 1181.
  • the light emitting device package includes an adhesive 1118 disposed below the light emitting device 1151 and a recess 1115A of the body 1115 .
  • the recess 1115A may be formed at a predetermined depth from the upper surface of the body 1115 to a depth smaller than the thickness of the body 1115, for example.
  • the depth of the recess 1115A may be determined in consideration of the adhesive strength of the adhesive 1118 disposed between the body 1115 and the light emitting device 1151. [ The depth of the recess 1115A is set so that a stable strength of the body 1115 is taken into consideration and / or cracks are not generated in the semiconductor device package 1100 by heat emitted from the light emitting device 1151 Can be determined.
  • the adhesive 1118 may be a reflective or heat dissipative resin.
  • the length of the recess 1115A in the second direction may be smaller or larger than the length of the light emitting device 1151.
  • the width of the recess 1115A in the first direction may be smaller than the width of the body 1115 in the first direction.
  • the recess 1115A may provide a proper space under which the underfill process can be performed with the adhesive 1118 under the light emitting device 1151.
  • the adhesive 1118 is applied to the recess 1115A to mount the light emitting device 1151 after supporting the light emitting device 1151 through the adhesive 1118 in the process of mounting the light emitting device 1151 on the package body 1110
  • the light emitting device 1151 can be disposed after the arrangement.
  • FIG. 33 is a fifth modification of the light emitting device package of FIG. 17, in which the light emitting device package may include a reflective portion 1119 disposed around the lower portion of the light emitting device 1151.
  • the reflective portion 1119 may be in contact with the light emitting device 1151.
  • the reflective portion 1119 may be provided with the same material as the adhesive of FIG.
  • the reflective portion 1119 is formed on a region between the light emitting device 1151 and the body 1115 and a region on the bottom 1113 of the cavity 1112 and a region on the side 1116 of the cavity 1112 And may be disposed in at least one or both of the arranged regions.
  • the reflective portion 1119 may extend along the side 1116 of the cavity 1112 and may be spaced from the upper end of the cavity 1112.
  • the reflective portion 1119 may be disposed under the molding portion 1181 without being exposed through the molding portion 1181. [ Since the reflecting portion 1119 is disposed on the side surface 1116 and the bottom 1113 of the cavity 1112, the incident light can be effectively reflected.
  • FIG. 34 is a diagram for explaining an example of a light emitting module or a light source device having a circuit board on which the light emitting device package of FIG. 17 is disposed.
  • a light emitting device package 1100 is disposed on a circuit board 1201.
  • the circuit board 1201 may be arranged in a light unit such as a display device, a terminal, a vehicle lamp, and a lighting device.
  • the circuit board 1201 may include a circuit layer electrically connected to the light emitting device package 1100.
  • the circuit board 1201 may include at least one of a resin-made PCB, a metal core PCB (MCPCB) having a metal core, a non-flexible PCB, and a flexible PCB (FPCB) Do not.
  • MCPCB metal core PCB
  • FPCB flexible PCB
  • the third and fourth electrode pads 1211 and 1213 are disposed on the circuit board 1201 and the third electrode pad 1211 is electrically connected to the first frame 1121 of the light emitting device package 1100 And the fourth electrode pad 1213 may be adhered to the second frame 1131 of the light emitting device package 1100 by a conductive adhesive agent 1223.
  • the conductive adhesives 1221 and 1223 may include, for example, a solder paste.
  • the light emitting device package 1100 may be bonded to the circuit board 1201 by low temperature bonding the light emitting device 1151 of the light emitting device package 1100 with the first and second bonding layers provided in the frames 1121 and 1131, It is possible to prevent the problem of remelting that may occur when bonding the light emitting device package to the light emitting device package, thereby improving the reliability of the light emitting device package.
  • the light emitting device 1151 in the light emitting device package 1100 may emit light to five or six sides.
  • the light emitting device package or the light emitting unit according to the embodiment can be applied to the light source device.
  • the light source device may be applied to a lamp such as a display device, a lighting device, a vehicle lamp such as a fog lamp, a car light, a turn signal, a brake, a tail light, a reverse light, an upward light, a down light, and a fog light.
  • the above light source device may include at least one of an optical sheet having an optical lens or a light guide plate in a light output area.
  • An example of the light source device includes a bottom cover, a reflector disposed on the bottom cover, a light emitting module that emits light and includes a light emitting element, a light emitting module disposed in front of the reflector,
  • An optical sheet including a light guide plate, prism sheets disposed in front of the light guide plate, a display panel disposed in front of the optical sheet, an image signal output circuit connected to the display panel and supplying an image signal to the display panel, And may include a color filter disposed in front thereof.
  • the bottom cover, the reflection plate, the light emitting module, the light guide plate, and the optical sheet may form a backlight unit.
  • the display device may have a structure in which light emitting elements emitting red, green, and blue light are disposed, respectively, without including a color filter.
  • the head lamp includes a light emitting module including a light emitting device package disposed on a substrate, a reflector that reflects light emitted from the light emitting module in a predetermined direction, for example, forward, A lens that refracts light forward, and a shade that reflects off a portion of the light that is reflected by the reflector and that is directed to the lens to provide the designer with a desired light distribution pattern.
  • a light emitting module including a light emitting device package disposed on a substrate, a reflector that reflects light emitted from the light emitting module in a predetermined direction, for example, forward, A lens that refracts light forward, and a shade that reflects off a portion of the light that is reflected by the reflector and that is directed to the lens to provide the designer with a desired light distribution pattern.
  • the lighting device which is another example of the light source device, may include a cover, a light source module, a heat sink, a power supply, an inner case, and a socket. Further, the light source device according to the embodiment may further include at least one of a member and a holder.
  • the light source module may include the light emitting device package according to the embodiment.
  • the light extraction efficiency, electrical characteristics and reliability can be improved.
  • the process efficiency is improved and a new package structure is presented, which is advantageous in that the manufacturing cost can be reduced and the manufacturing yield can be improved.
  • the semiconductor device package according to the embodiment has an advantage that the reflector can be prevented from being discolored by providing the body with high reflectance, thereby improving the reliability of the semiconductor device package.
  • the semiconductor device package and the method for manufacturing a semiconductor device it is possible to prevent the re-melting phenomenon from occurring in the bonding area of the semiconductor device package in the process of re-bonding the semiconductor device package to the substrate .
  • stable bonding can be performed by providing a small pressure at a low temperature.
  • the solder is not used in the process of mounting the semiconductor device in the semiconductor device package, There is an advantage that it can be reduced.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

Un boîtier de dispositif électroluminescent selon un mode de réalisation peut comprendre : un premier et un second cadre ; un corps disposé entre le premier et le second cadre et comprenant un évidement ; un premier agent adhésif disposé sur l'évidement ; un dispositif électroluminescent disposé sur le premier agent adhésif ; un second agent adhésif disposé entre le premier cadre et le dispositif électroluminescent et entre le second cadre et le dispositif électroluminescent ; et une partie résine disposée de façon à entourer une zone partielle du second agent adhésif et du dispositif électroluminescent.
PCT/KR2018/006059 2017-06-27 2018-05-29 Boîtier de dispositif électroluminescent WO2019004608A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR10-2017-0081295 2017-06-27
KR1020170081295A KR102249649B1 (ko) 2017-06-27 2017-06-27 발광소자 패키지 및 광원 장치
KR10-2017-0093032 2017-07-21
KR1020170093032A KR102369245B1 (ko) 2017-07-21 2017-07-21 발광소자 패키지
KR1020170107936A KR102380582B1 (ko) 2017-08-25 2017-08-25 발광 소자 패키지, 발광 소자 패키지 제조 방법 및 광원 장치
KR10-2017-0107936 2017-08-25

Publications (1)

Publication Number Publication Date
WO2019004608A1 true WO2019004608A1 (fr) 2019-01-03

Family

ID=64743011

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2018/006059 WO2019004608A1 (fr) 2017-06-27 2018-05-29 Boîtier de dispositif électroluminescent

Country Status (1)

Country Link
WO (1) WO2019004608A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140061797A (ko) * 2012-11-14 2014-05-22 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 장치
KR20140092038A (ko) * 2013-01-15 2014-07-23 엘지이노텍 주식회사 발광 소자 패키지
KR20140095722A (ko) * 2013-01-25 2014-08-04 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 장치
KR101443870B1 (ko) * 2014-03-05 2014-09-23 주식회사 루멘스 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법
KR20160057146A (ko) * 2014-11-13 2016-05-23 엘지이노텍 주식회사 발광 소자 패키지

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140061797A (ko) * 2012-11-14 2014-05-22 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 장치
KR20140092038A (ko) * 2013-01-15 2014-07-23 엘지이노텍 주식회사 발광 소자 패키지
KR20140095722A (ko) * 2013-01-25 2014-08-04 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 장치
KR101443870B1 (ko) * 2014-03-05 2014-09-23 주식회사 루멘스 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법
KR20160057146A (ko) * 2014-11-13 2016-05-23 엘지이노텍 주식회사 발광 소자 패키지

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