WO2018234262A1 - Support de circuit pour un circuit électronique et procédé de fabrication dudit support de circuit - Google Patents

Support de circuit pour un circuit électronique et procédé de fabrication dudit support de circuit Download PDF

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Publication number
WO2018234262A1
WO2018234262A1 PCT/EP2018/066164 EP2018066164W WO2018234262A1 WO 2018234262 A1 WO2018234262 A1 WO 2018234262A1 EP 2018066164 W EP2018066164 W EP 2018066164W WO 2018234262 A1 WO2018234262 A1 WO 2018234262A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit carrier
circuit
channel
tempering
fluid
Prior art date
Application number
PCT/EP2018/066164
Other languages
German (de)
English (en)
Inventor
Rüdiger Knofe
Bernd Müller
Jörg Strogies
Klaus Wilke
Rene Blank
Martin Franke
Peter Frühauf
Stefan Nerreter
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2018234262A1 publication Critical patent/WO2018234262A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask

Definitions

  • Circuit carrier for an electronic circuit and method for its production
  • the invention relates to a temperature-controllable circuit carrier for an electronic circuit with contact surfaces for at least one electronic component.
  • the invention relates to a method for producing such a circuit carrier for an electronic circuit with Kunststoffflä ⁇ chen for at least one electronic component, wherein the circuit carrier may preferably be composed of several layers and these layers form a circuit board.
  • a temperature-controllable circuit carrier of the type specified is known for example from EP 2 790 474 AI.
  • This temperature-controlled circuit carrier can be embodied for example in the form of a printed circuit board.
  • a Peltier element is integrated, which can heat or cool depending on the operating state of the realized on the circuit board electronic assembly. However, it must be accepted in this tempering that the heating or cooling by Peltier elements has a low efficiency.
  • the object of the invention is to provide a temperature-controllable circuit carrier for an electronic circuit, wherein the efficiency is improved in the temperature control.
  • This object is achieved with the circuit ⁇ specified carrier according to the invention in that in the scarf ⁇ tion carrier below the contact surfaces a temperature control channel is provided which connects an inlet for a fluid and an outlet for the fluid with each other.
  • Temperierkanal has a closed cross-section, so that the fluid transported from the inlet to the outlet who ⁇ can and thereby the circuit carrier and after installation of the components located on the contact surfaces can temper.
  • tempering can be understood to mean heating or cooling. Cooling is usually required during the operation of the electronic circuit located on the circuit carrier, since in the operation of power electronic components in particular, power loss occurs in the form of heat. Heating may be required, for example, before the electronic circuit is put into operation. It may, for example, serve to de-dew the electronic circuit, that is to say that the electronic circuit is heated so that condensed water evaporates from the electronic circuit.
  • a gas or a liquid can be used as the fluid, which is passed through the tempering.
  • t liquids are to be used such as water, as fluids have a higher heat capacity than Ga ⁇ se.
  • air can preferably be used as a gas.
  • the fluid can be brought to a certain temperature, for example by means of an external temperature control unit, before it is introduced into the temperature control channel.
  • This temperature is for example at room temperature, it is possible with the fluid so ⁇ well, if necessary, a heating of the electronic circuit and the circuit support before operation successes gene and cooling, when the circuit substrate is heated with the electronic circuit during operation , Alternatively, it is also possible that fluids be used with different ⁇ union temperatures for heating or cooling to a higher temperature turgebine in the operating conditions and thus to achieve a higher heating or cooling capacity.
  • a direct cooling of the circuit substrate by a fluid is advantageously a temperature, that is, heating or cooling, possible with high efficiency.
  • a temperature that is, heating or cooling
  • the contact surfaces between the component and the circuit carrier serve to transfer heat.
  • These may be electrical contact surfaces which are provided for the electrical contacting of the relevant component. These are preferably metallic and therefore well suited for heat conduction.
  • contact surfaces for the transmission of heat can be provided as a thermal interface. These can also be metallic (for example made of copper) and additionally serve to conduct an electric current.
  • materials can be used, which are also referred to as Thermal Interface Materials (TIM).
  • This may be a paste or film (for example based on silicone) in which a filler which is thermally highly conductive in comparison to the paste (eg metal particles, carbon nanotubes, graphene or non-metallic particles such as ceramic particles) is dispersed.
  • a filler which is thermally highly conductive in comparison to the paste (eg metal particles, carbon nanotubes, graphene or non-metallic particles such as ceramic particles) is dispersed.
  • a wall of a metal or a metal alloy is formed.
  • the wall forms the Ka ⁇ nalober constitutional and can be made available, for example, by Metallisie ⁇ tion of the channel cross-section.
  • Al ⁇ ternativ it is also possible that the channel is formed by a self-supporting metal structure in the interior of the circuit carrier.
  • the advantage of a metallic wall in the tempering channel is that metals have a good thermal conductivity. have capability and thereby the heat transfer is improved on the wall of the tempering.
  • the metallic wall is electrically conductively connected to an electrical circuit ⁇ device.
  • This connection device can be used to advantage that the wall is acted upon by applying an electrical voltage with a current. Due to the electric wall Wi (more specifically, the wall-forming metalli ⁇ rule structure) DERS tandes it is possible to heat by applying a current to the thermal treatment. Thus, a heating power for temperature control of the circuit carrier can be generated electrically, so that cooling by the fluid can be made. If, for example, the circuit carrier with the electronic circuit is to be heated prior to startup, this is done by electrical preheating by means of the electrical connection device. A circulation of the fluid in the temperature control does not occur during the heating phase. The fluid in the temperature control can therefore serve as a heat buffer, since this is also heated. Only when the electronic
  • Circuit cooling is required, a circulation of the fluid is activated, so that the inflowing fluid can cool the circuit carrier and the electronic circuit.
  • connection device is formed by contact pads on the circuit carrier. This makes it possible to produce the connection for operating the channel wall as a heating device during the assembly of the circuit carrier. This advantageously simplifies the production of an electronic rule ⁇ circuit including temperature management on the scarf ⁇ tung carrier.
  • the circuit carrier is formed by a printed circuit board.
  • Ladder- plates are advantageously used in many cases for mounting electronic circuits. These may be formed of ceramic materials or fiber reinforced plastic materials. Further have circuit carrier Metallisierun- gene, which can be structured to implement the electronic circuit, so that conductor paths and contact surfaces ⁇ for the electronic circuit on the circuit carrier are formed.
  • the temperature control channels are also to be produced (more on this in the following).
  • the circuit carrier may for example also be formed by a housing, which in addition to its housing function as a substrate for the electronic
  • tempering channels are integrated in this Vari ⁇ ante of the invention in the wall structure of the housing.
  • this printed circuit board can be made up of several layers, wherein the tempering channel is formed by a structured layer in the interior of the printed circuit board.
  • the structured layer must lie inside the printed circuit board so that a closed cross-section of the tempering channel is ensured.
  • the wall of the tempering channel is thereby forms ⁇ out both by the structured layer as well as by one or two adjacent layers.
  • Temperature control channel is gebil ⁇ det by a self-supporting wall structure, which is embedded in the material of the circuit substrate ⁇ Tet.
  • This wall structure may include metallic, be ⁇ vorzugt made of copper and is a the
  • Temperierkanal forming pipe cross-section available. This has the advantage that the wall structure ensures high reliable ⁇ ness in terms of tightness.
  • the temperature control channel can be embedded in the circuit also be checked for leaks.
  • the embedding ⁇ tion of a self-supporting wall structure of the tempering channel is suitable for any type of circuit carriers, such as, for example, for housing, which are used as a circuit carrier used.
  • the tempering channel is formed by parallel and interconnected channel sections.
  • the tempering channel can meander through the channel sections thus formed.
  • Each adjacent channel sections are connected to each other at their ends, so that in each case adjacent channel sections are flowed through in the opposite direction.
  • Temperierkanals can advantageously a high cooling capacity per unit area of the circuit substrate can be achieved.
  • the parallel channel sections un ⁇ terrenz of the contact surfaces for the components may be arranged so that a high cooling performance can be realized there during the operation of the electronic circuit. Between the contact surfaces, said channel sections may each be connected to a connection channel section for communicating with the inlet and the outlet.
  • the inlet and / or the outlet is formed by at least one connection structure which is fastened on the circuit carrier.
  • the attachment can be carried out by soldering, which has the advantage that the connection structure for the inlet and / or the connection structure for the outlet during assembly of the circuit substrate can be mounted.
  • the inlet and the outlet may be for example in forms in the form of nozzles or other types of lead terminals, so that advantageously a supply line and a laxative ⁇ line for the fluid on them can be mounted. These lines are then in communication with a fluid reservoir.
  • the circuit carrier has a pumping device, for example a circulating pump, which is connected to the temperature control channel.
  • the tempering channel forms a closed circuit.
  • the circuit carrier is thus advantageously not dependent on external components.
  • the inlet and the outlet of the tempering channel can be used as a connection for the pump. It is also possible to structurally integrate the pumping device into the temperature control channel and to use the inlet and the outlet only for filling the temperature control channel and then to bridge it. The bridging connects the inlet and the outlet and forms a closed circuit together with the tempering channel.
  • the circuit carrier may advantageously have a heat exchanger which forms a fluidic circuit with the temperature control channel and the circulation pump.
  • a nickeltau ⁇ shear advantageously improves the effectiveness of Temperie ⁇ tion. If the fluid is used to cool the components, the heat in the fluid is released again via the heat exchanger.
  • the heat exchanger may for example be generated by a passive radiator which is thermally conductively connected to the circuit substrate, wherein the thermal treatment proceeds under ⁇ half of the thermally conductive connection to the radiator.
  • the circuit carrier can thus be advantageously operated at the same time comparatively high temperature control, in particular cooling ⁇ power, without the circuit carrier is dependent on external cooling devices.
  • the circuit carrier has a temperature sensor.
  • the temperature of the circuit substrate can be determined and there ⁇ out a Temperier pad be derived. This one can out a necessary heating of the circuit substrate example ⁇ example, for the purpose of Enttauens or from a necessary cooling during operation of the electronic circuit.
  • the signal of the temperature sensor can be evaluated externally by a control device for the cooling or heating.
  • the scarf ⁇ tion carrier itself have a control device for controlling the temperature of the circuit substrate. This can then be connected to the ge ⁇ called temperature sensor, so that the tempering of the circuit carrier can be controlled by components that are realized on the circuit substrate.
  • the heating or cooling power can be controlled, for example, by varying the flow rate of the fluid through the temperature control channel, by influencing the temperature of the fluid or by electrically heating metal channel walls.
  • the above object is further achieved by a method for
  • Producing the temperature-controlled circuit carrier according to the invention achieved in that a self-supporting tempering is made with a closed cross-section and the
  • Temperature control channel is embedded in the circuit substrate below the contact surfaces.
  • the embedded tempering channel connects an inlet and an outlet for the fluid having ⁇ today. This is a method which can be advantageously used for circuit-formed circuit board produced by design.
  • the self-supporting tempering channel can be injected into a plastic housing. Another possibility is the
  • Embed tempering channel in a sintered ceramic is stable enough to endure the thermal and mechanical stresses during the manufacture of the circuit substrate.
  • Circuit board also be done so that a
  • Temperature control channel is made by structuring a layer of a printed circuit board and a cover layer is applied to the structured layer as a further layer of the circuit board.
  • tempering channel then extends below the contact surfaces and connects an inlet and an outlet for the fluid with one another.
  • the production of the fluid channel in la ⁇ geneously constructed printed circuit boards is advantageously particularly economically possible if an inner layer of the circuit board is used for structuring to produce the fluid channel.
  • an inner layer of the circuit board is used for structuring to produce the fluid channel.
  • a photolithographic process or a milling process can be used.
  • the layer to be structured can be removed down to an underlying layer, wherein the underlying layer in this case forms part of the channel cross-section.
  • Embodiments of the invention Shen circuit substrate, each marnit th,
  • FIG. 4 shows a further exemplary embodiment of the circuit carrier according to the invention as plan view
  • Figures 5 and 6 selected steps of an embodiment ⁇ example of the method according to the invention, shown in section, and
  • FIG. 1 shows a circuit carrier 11 in the form of a housing, which can only be seen as a cutout.
  • the ⁇ ses housing has a bottom 12, the contact surfaces 13 for an electronic component 14 has.
  • the component 14 is part of an electronic circuit, not shown.
  • the two smaller contact surfaces 13 serve to receive electrical connections 15 of the component 14 for the purpose of electrical contacting thereof.
  • the middle larger contact surface 13 serves for a thermal connection of the component 14 to the bottom 12 of the circuit carrier 11.
  • a self-supporting tubular wall structure 16 is cast to form a tempering channel 17 (the circuit substrate 11 is made of plastic).
  • the wall structure also forms an inlet 18 in the form of a pipe socket, onto which a hose 19 can be plugged. This serves to supply a fluid, such as water, in the tempering 17.
  • An outlet 20 is formed in the same way and provided in another part of the scarf ⁇ tion carrier 11.
  • the wall structure 16 is formed of copper. This has two connection devices 21, which allow electrical contacting of the wall structure 16 from the bottom of the housing. In Figure 1, only one of these connection devices 21 is shown, the second is located in a manner not shown, preferably in the vicinity of the outlet 20.
  • the connection structures 21 form in the interior of the housing contact pads 22, which are connected to an electrical connection line, not shown can be. In this way, the channel structure 16 can be operated as a resistance heater.
  • the circuit carrier 11 according to FIG. 2 is constructed as a multilayer printed circuit board. This has a carrier layer 23 made of a FR-4 material that gives the printed circuit board its mechanical Sta ⁇ stability. On the support sheet 23 a textured gray ⁇ th layer 24 is provided in the by patterning
  • Temperature control channel 17 is formed.
  • a cover layer 25 is provided on the structured layer 24 .
  • Other layers are not shown in Figure 2 for reasons of clarity, for example, the cover layer 25 is metallized to provide nä ⁇ forth illustrated contact surfaces for the terminals 15 of the device 14 is available. These contact surfaces are also produced by structuring.
  • the component 14 according to FIG. 2 is a ball grid array.
  • the component 14 is connected by an underfill material 26 to the circuit substrate 11, so that the heat transfer, the indicated contact surface 13 is formed, which is partially formed by the non-illustrated electrical contact surfaces of the terminals 15 with.
  • the tempering channel 17 runs in parallel aligned channel sections (comparable to 27 in FIG. 4), which lie parallel to one another.
  • the channel sections are aligned perpendicular to the drawing plane.
  • Respectively adjacent Kanalabschnit ⁇ te are interconnected, so that a meandering course of the tempering 17 is realized.
  • Temperierkanal 17 according to Figure 2 passes through a substantial portion of the printed circuit board formed as a circuit substrate 11, so that a great freedom of design of the arrangement of the contact surfaces 13 is formed.
  • the circuit carrier 11 according to FIG. 2 can therefore be equipped with different electrical circuits.
  • the tempering channel 17 is also equipped with a metallic layer 28, which can be applied for example by means of a PVD process. This layer 28 ver ⁇ improved sealing of the closed cross-section of the tempering channel 17 and further improves the heat ⁇ line into the circuit carrier.
  • a bare power semiconductor chip is used as the component 14 (also called the die). This is connected via the flat terminals 15 with its one side to the circuit substrate 11 in the form of a ceramic circuit board and with its opposite side to another circuit board 29. In this way, a sandwich is formed.
  • the circuit carrier 11 has a metallization, not shown, from the contact surfaces 13 are formed for the terminals 15.
  • the self-supporting wall structure 16 of copperlichbet ⁇ tet in the interior of the tempering 17 extends.
  • the tempering channel is arranged locally below the contact surfaces 13 in the circuit carrier 11 according to FIG. 3 and can have a meandering profile, as indicated in FIG. 4 below the components used there.
  • the meandering course of a dash- dotted ⁇ indicated tempering 17 can be seen in the circuit board, the meandering course is formed by the respective parallel channel sections 27.
  • This tempering channel connects the inlet 18 with the outlet 20, wherein the inlet 18 and the outlet 20 by a respective
  • connection structures 30 are soldered onto the contact pads 22 of the printed circuit board, wherein this soldering process can be carried out together with the soldering of the components 14 and further components.
  • the contact pads 22 not only provide a surface suitable for soldering the connection structures, but can also be used in time for the electrical contacting of the temperature control channel via the not shown electrical connection devices, which has metallic walls in a manner not shown.
  • This control device 31 also controls a pump device 32 which is connected in the fluid circuit formed by the temperature control channel.
  • the pump device 32 can be fitted to the circuit carrier 11 as well as the control device 31.
  • a temperature sensor 33 is provided on the circuit board 11, which serves to monitor the temperature by the controller 31.
  • the tempering channel 17 can be closed or open
  • a closed circuit is produced by the two connection structures 30
  • a heat ⁇ exchanger 34 is realized on the one outer side of the circuit substrate 11.
  • This consists of a passive cooling structure 35, which is equipped with ribs 36.
  • the cooling structure 35 may be made of aluminum or copper, for example.
  • the tempering channel 17 runs, wherein it has a meandering course. has, which is similar to below the components 14 formed of parallel ⁇ running channel sections 27a.
  • the fluid in the thermal treatment 17 is to be used for cooling the Bauele ⁇ elements fourteenth
  • the heat exchanger 34 dissipates the heat into the environment that has been absorbed by the components 14.
  • Tempering channel 17 the ver ⁇ runs underneath the cooling structure 35, however, is not to be heated. Therefore, a bridging line 37 is provided, which shorts the part of the tempering channel extending below the cooling structure 36.
  • a circuit carrier is produced from a ceramic.
  • a layer 38 of ceramic particles is introduced into a mold 39.
  • the self-supporting wall structure is then ⁇ 16 set with the temperature control channel 17 to the layer 38 on ⁇ and another ceramic material filled into the mold 39 until the wall structure 16 is completely covered.
  • the mold 39 is now completely filled.
  • the ceramic material is now pressed, whereby a green body 41 of the circuit substrate 11 is formed. This can be removed in a manner not shown the mold 39 and then subjected to a sintering treatment.
  • an alternative method of manufacturing a layer-built circuit board is Darge ⁇ is intended to form the circuit carrier. 11 FIG.
  • FIG. 7 shows how the layer located on the carrier layer 23 has been patterned in order to obtain the structured layer 24.
  • a mask 25 was applied to the structured layer 24, the temperature control channel 17 being formed photolithographically in the openings of the mask. This is still open in the state shown in Figure 7.
  • FIG. 8 shows that the structured layer 24 has been covered with the cover layer 25.
  • This cover layer 25 has a structured metallization 42, wherein it has been structured in such a way that the metallization 42 supplements the layer 28.
  • the tempering channel 17 thus has a closed ⁇ nen cross-section, which is completely formed by a metallic wall.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un support de circuit (11) thermorégulable, se présentant par exemple sous la forme d'une carte de circuits imprimés. Ledit support de circuit est prévu pour réaliser un circuit électronique comportant des composants (14), ce à quoi servent des surfaces de contact (13). L'invention prévoit qu'un canal de thermorégulation (14) servant en particulier à refroidir des composants (14) est réalisé dans le support de circuit (11) sous la surface de contact (13). Le canal de thermorégulation (17) fait partie intégrante du support de circuit (11) et peut par exemple être réalisé dans une couche intermédiaire (24) structurée. Le canal de thermorégulation (17) peut être également pourvu en supplément d'une métallisation (28) qui peut être soumise à l'action d'une tension électrique par l'intermédiaire d'un système de mise en contact (21) et qui peut ainsi être utilisée en tant que chauffage par résistance. L'invention concerne également des procédés de fabrication pour le support de circuit (11). Le canal de thermorégulation (17) peut être produit de préférence par structuration d'une couche intermédiaire (24) d'une carte de circuits imprimés ou par intégration du canal de thermorégulation (17) dans le matériau du support de circuit.
PCT/EP2018/066164 2017-06-20 2018-06-19 Support de circuit pour un circuit électronique et procédé de fabrication dudit support de circuit WO2018234262A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017210237.3 2017-06-20
DE102017210237.3A DE102017210237A1 (de) 2017-06-20 2017-06-20 Schaltungsträger für eine elektronische Schaltung und Verfahren zu dessen Herstellung

Publications (1)

Publication Number Publication Date
WO2018234262A1 true WO2018234262A1 (fr) 2018-12-27

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PCT/EP2018/066164 WO2018234262A1 (fr) 2017-06-20 2018-06-19 Support de circuit pour un circuit électronique et procédé de fabrication dudit support de circuit

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WO (1) WO2018234262A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110113867A (zh) * 2019-05-31 2019-08-09 维沃移动通信有限公司 散热结构及移动终端

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112243311B (zh) * 2019-07-19 2023-06-13 欣兴电子股份有限公司 电路板结构
EP4040480A1 (fr) 2021-02-09 2022-08-10 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Dispositif électronique comprenant un porte-composant à connexion métallique et un élément de refroidissement de fluide
EP4199075A1 (fr) * 2021-12-16 2023-06-21 Siemens Aktiengesellschaft Module électronique comprenant un caloduc pulsant doté d'une structure de canal
EP4199074A1 (fr) * 2021-12-16 2023-06-21 Siemens Aktiengesellschaft Module électronique comprenant un caloduc pulsant doté d'une structure de canal

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4012100A1 (de) * 1990-04-14 1991-10-17 Standard Elektrik Lorenz Ag Leiterplatte mit einer kuehlvorrichtung und verfahren zur herstellung derselben
WO2007096313A1 (fr) * 2006-02-22 2007-08-30 Thales Nederland B.V. Caloduc plat destiné au refroidissement
EP2330873A1 (fr) * 2009-12-03 2011-06-08 Continental Automotive GmbH Module électronique
US20110225818A1 (en) * 2010-03-19 2011-09-22 Shih-Bin Chiu Method of manufacturing an led illuminator device
EP2790474A1 (fr) 2013-04-09 2014-10-15 Harman Becker Automotive Systems GmbH Dispositif de refroidissement/chauffage thermoélectrique intégré dans une carte à circuit imprimé

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4012100A1 (de) * 1990-04-14 1991-10-17 Standard Elektrik Lorenz Ag Leiterplatte mit einer kuehlvorrichtung und verfahren zur herstellung derselben
WO2007096313A1 (fr) * 2006-02-22 2007-08-30 Thales Nederland B.V. Caloduc plat destiné au refroidissement
EP2330873A1 (fr) * 2009-12-03 2011-06-08 Continental Automotive GmbH Module électronique
US20110225818A1 (en) * 2010-03-19 2011-09-22 Shih-Bin Chiu Method of manufacturing an led illuminator device
EP2790474A1 (fr) 2013-04-09 2014-10-15 Harman Becker Automotive Systems GmbH Dispositif de refroidissement/chauffage thermoélectrique intégré dans une carte à circuit imprimé

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110113867A (zh) * 2019-05-31 2019-08-09 维沃移动通信有限公司 散热结构及移动终端

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