WO2018231153A1 - Synthesis of atomically-thin metal dichalcogenides - Google Patents

Synthesis of atomically-thin metal dichalcogenides Download PDF

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WO2018231153A1
WO2018231153A1 PCT/SG2018/050296 SG2018050296W WO2018231153A1 WO 2018231153 A1 WO2018231153 A1 WO 2018231153A1 SG 2018050296 W SG2018050296 W SG 2018050296W WO 2018231153 A1 WO2018231153 A1 WO 2018231153A1
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process according
alkali metal
formula
temperature
transition metal
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Zheng Liu
Jiadong Zhou
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Nanyang Technological University
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Definitions

  • This invention relates to a method to synthesise a wide range of two-dimensional transition metal dichalcogenides.
  • TMDs transition-metal dichalcogenides
  • TMDs Group VI MX 2 (M: Mo, W; X: S, Se) compounds and more than forty TMDs are left to be explored. Many of them were predicted in theory to possess diverse and novel properties. For example, Group IV TMDs (Ti, Zr and Hf) are predicted to have properties of high mobility and phase transition, while Group V TMDs are predicted to possess ferromagnetic, superconducting and charge density wave effects. In addition, Group VI tellurides are predicted to behave like type-ll Weyl semimetals and topological insulators.
  • the Mo- and W-based TMDs have been synthesised, typically via sulfurisation 15"19 , selenisation 20"21 and tellurisation 22 of metals and metal compounds. Many other TMDs remain inaccessible due to the high melting points and low vapour pressure of the metal precursors (such as oxides of Ti, Zr, Hf, Nb, Ta, W, P and Pd).
  • TMDs Given the potentially useful properties and applications of TMDs, there remains a need to develop an effective and general synthetic method to produce a wide range of 2D TMDs. This will open up opportunities for studying the properties and potential application of a wide variety of 2D TMDs. Other than gaining access to the desired TMDs, there are inherent requirements on what an ideal synthesis method needs to demonstrate. In the first instance, it is important that the method is applicable to a wide range of TMDs and should allow the user to have the flexibility to control the properties of the materials accordingly. The method should also allow the production of high quality (with little or no defects), large size TMDs crystals which are highly desired for practical use.
  • M is selected from one or more of the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Cd, Hf, Ta, W, and Re: and
  • X is selected from one or more of the group consisting of S, Se, and Te, the process comprising the step of depositing the transition metal dichalcogenide of formula I on a substrate by chemical vapour deposition, wherein the vapour deposition is accomplished by: passing a carrier gas through a fluid pathway in a furnace, where the fluid pathway comprises a first temperature zone housing one or more of elemental sulfur, selenium or tellurium and a second temperature zone that houses a substrate above a mixture of one or more metallic precursors and an alkali metal halide, where the wt:wt ratio of the one or more metallic precursors to the alkali metal halide is from 1 :2 to 15:1 , where:
  • the temperature of the first temperature zone is from 150 to 500°C;
  • the temperature of the second temperature zone is from 350 to 950°C;
  • the substrate is from 0.01 to 2.0 cm above the mixture of one or more metallic precursors and the alkali metal halide;
  • the one or more metallic precursors are selected from an elemental metal, a metal oxide or a metal halide, where each respective metal is selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Cd, Hf, Ta, W, and Re, wherein the growth rate of the two-dimensional transition metal dichalcogenide of formula I on the substrate is from 0.01 pm/s to 10 pm/s.
  • Embodiments of the first aspect of the invention that may be generally applicable include those in which:
  • the carrier gas may comprise an inert gas having a flow rate of from 30 to 200 seem and may optionally further comprise hydrogen, the hydrogen having a flow rate of from 1 to 20 seem, optionally the inert gas may be argon and/or nitrogen;
  • the alkali metal halide may be selected from one or more of the group consisting of NaCI, KCI, LiCI, NaBr, KBr, LiBr, Nal, Kl, and Lil;
  • the thickness of the deposited transition metal dichalcogenide may be from 1 nm to less than 1 ⁇ (e.g. from 1 nm to 500 nm);
  • the process may further comprise laying one or more further layers of a two- dimensional transition metal dichalcogenide of formula I onto a substrate that has already undergone the deposition process described above, optionally wherein the two-dimensional transition metal dichalcogenide of formula I deposited in each further layer is different to the layer on the surface of the substrate;
  • the wt:wt ratio of the one or more metallic precursors to the alkali metal halide may be from 1.5:1 to 15:1 , such as from 1.5:1 to 5:1 ;
  • the flow rate of the carrier gas is varied during the process to provide an in- plane heterostructure.
  • the temperature of the second temperature zone is from 600 to 670°C, or when the transition metal dichalcogenide of formula I is WSe 2 the temperature of the second temperature zone is from 650 to 670°C.
  • the transition metal dichalcogenide of formula I that is formed may be MoS 2 or MoSe 2 .
  • the temperature of the second temperature zone may be from 350 to 800°C (e.g.
  • the temperature of the second temperature zone may be from 550 to 900°C (e.g. from 550 to 650°C, such as from 550 to 600°C) and the wt:wt ratio of the one or more metallic precursors to the alkali metal halide may be from 5:1 to 10:1.
  • transition metal dichalcogenide of formula I that is formed is MoS 2 or MoSe 2 :
  • the wt:wt ratio of the one or more metallic precursors to the alkali metal halide may be 6:1 ; and/or (b) the metallic precursor may be Mo0 3 ; and/or
  • the alkali metal halide may be NaCI.
  • the transition metal dichalcogenide of formula I that is formed may be one selected from the group consisting of PdTe 2> PdSe 2 , PdS 2 , PtTe 2 , PtSe 2 , and PtS 2) where the temperature of the second temperature zone in the process may be from 750 to 860°C and the w wt ratio of the one or more metallic precursors to the alkali metal halide may be from 8:1 to 12:1 (e.g. 10:1).
  • the alkali metal halide may be NaCI.
  • the transition metal dichalcogenide of formula I contains Pd
  • the metallic precursor may be PdCI 2 .
  • the transition metal dichalcogenide of formula I contains Pt
  • the metallic precursor may be PtCI 2 .
  • the transition metal dichalcogenide of formula I that is formed may be one selected from the group consisting of HfTe 2 , HfSe 2 , HfS 2 , VTe 2 , VSe 2 , VS 2) TiTe 2 , TiSe 2 , TiS 2 , NbTe 2 , NbSe 2l NbS 2 , ZrTe 2 , ZrSe 2 , ZrS 2 , TaTe 2 , TaSe 2 , TaS 2 , MoTe 2 , and WTe 2 , where the temperature of the second temperature zone in the process may be from 600 to 860°C and the wt:wt ratio of the one or more metallic precursors to the alkali metal halide may be from 1.6:1 to 4:1.
  • the alkali metal halide may be NaCI.
  • the metallic precursor may be Hf.
  • the transition metal dichalcogenide of formula I is selected from V, Ti, Nb, Zr, Ta, Mo, W, the metallic precursor may be a metal oxide of the respective metal.
  • the transition metal dichalcogenide of formula I that is formed may be one selected from the group consisting of FeS 2 , FeSe 2 or FeTe 2
  • the temperature of the second temperature zone in the process may be from 500 to 850°C (e.g. from 500 to 600°C)
  • the wtwt ratio of the one or more metallic precursors to the alkali metal halide may be from 4:1 to 6:1 , such as 5:1.
  • the alkali metal halide may be NaCI and/or LiCI.
  • the metallic precursor may be a metal oxide (e.g. Fe 2 0 3 ) or a metal chloride (e.g. FeCI 2 ).
  • the transition metal dichalcogenide of formula I that is formed may be an alloy that has the formula II:
  • each of A to G is a different metal selected from one of the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Cd, Hf, Ta, W, and Re;
  • each of a to g is independently 0 to 0.99 and the sum of a+b+c+d+e+f+g is 1 ; and each of h to j is 0 to 2 and the sum of h+i+j is 2,
  • the formation of the alloy may be accomplished using a process where the temperature of the second temperature zone is from 600 to 850°C and/or the wt:wt ratio of the one or more metallic precursors to the alkali metal halide is from 5:1 to 7.5:1 , such as 5:1.
  • Suitable transition metal dichalcogenides of formula II may be selected from the group consisting of MoSe2xTe 2 (i-x), Mo 1-x Re x S 2 , MoS 2x Te2(i-x), Moi_ x Nb x Se 2 , Moi -x Nb x S 2 , ⁇ ⁇ ⁇ . x S 2y Se 2(1 . y) , WS 2x Te 2(1 . x) , WSe 2x Te 2(1 . x) , Mo 1-x W x Te 2 , NbS 2x Se 2(1 . x) , W 1-x Nb x S 2 , W 1 .
  • each of A to G is a different metal selected from one of the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Cd, Hf, Ta, W, and Re;
  • each of a to g is independently 0 to 0.99 and the sum of a+b+c+d+e+f+g is 1 ; and each of h to j is 0 to 2 and the sum of h+i+j is 2,
  • At least two of a to g is greater than 0 and/or at least two of h to j is greater than 0.
  • the transition metal dichalcogenide of formula II may be selected from the group consisting of MoSe 2x Te 2( . x) , Mo 1-x Re x S 2 , MoS 2x Te2 (1-x) , Moi -x Nb x Se 2 , Mo 1-x Nb x S 2 , Mo x Nbi -x S 2y Se 2(1 . y) , WS 2x Te 2( i- X) , WSe 2x Te 2 (i- x)) Mo 1-x W x Te 2 , NbS 2x Se 2(1 . x)> W 1-x Nb x S 2 , W 1 .
  • Fig. 1 Depicts the flow chart of the general growth process for the production of TMDs by the chemical vapour deposition method.
  • the growth of 2D TMDs can be classified into four routes based on different mass flux of metal precursor and growth rate.
  • High mass flux of metal precursor offers the opportunity to synthesize large-scale continuous monolayer polycrystalline films with small (route I) or large (route II) domains depending on the growth rate.
  • low mass flux of metal precursor results in discrete single-crystalline monolayers with different sizes.
  • Low growth rate leads to small crystal size with atom clusters decorated in the center and edge of the monocrystal (route III), while high growth rate gives rise to large monocrystals (route IV).
  • Fig. 2 Depicts: (a) the chemical vapour deposition (CVD) setup for the growth of TMD monolayers; and (b) the expanded view of the aluminium oxide boat 15 and the Si/Si0 2 wafer 20.
  • CVD chemical vapour deposition
  • Fig. 3 Depicts the optical images of 47 TMDs synthesized using the method in this application. These include 32 binary 2D crystals, 11 ternary alloys, a quaternary alloy, a quinary alloy, a 1 T MoTe 2 -2 H MoTe 2 in-plane and MoS 2 -NbSe 2 vertically stacked heterostructures.
  • Fig. 4 Depicts the optical images, Raman and photoluminescence characterisations of MoX 2 (X: S, Se and Te): (a, d and g) show the optical image of MoS 2 , MoSe 2 and MoTe 2 respectively; (b, e and h) show their respective Raman spectra; and (c and f) show the photoluminescence spectra of MoS 2 and MoSe 2 .
  • Fig. 5 Depicts the optical images, Raman and photoluminescence characterisations of WX 2 (X: S, Se and Te): (a, d and g) show the optical image of WS 2 , WSe 2 and WTe 2 respectively; (b, e and h) show their respective Raman spectra; and (c and f) show the photoluminescence spectra of WS 2 and WSe 2 .
  • Fig. 6 Depicts the optical images and Raman characterisations of TiX 2 (X: S, Se and Te): (a, c and e) show the optical image of TiS 2 , TiSe 2 and TiTe 2 respectively; and (b, d and f) show their respective Raman spectra.
  • Fig. 7 Depicts the optical images and Raman characterisations of ZrX 2 (X: S, Se and Te): (a, c and e) show the optical image of ZrS 2 , ZrSe 2 and ZrTe 2 respectively; and (b, d and f) show their respective Raman spectra.
  • Fig. 8 Depicts: (a, b and c) the optical images of MoS 2x Te 2(1 . X) , MoSe 2x Te 2( i -X) and WS 2x Te 2( i. X ) respectively; and (d, e and f) the respective Raman spectra.
  • Fig. 9 Depicts: (a and c) the optical images of quaternary alloy M0xNb 1-x S 2y Se 2( i-y ) and the quinary alloy V x W y Mo 1 . x . y S 2Z Se 2( i- Z) respectively; and (b and d) the respective Raman spectra.
  • Fig. 9 Depicts: (a and c) the optical images of quaternary alloy M0xNb 1-x S 2y Se 2( i-y ) and the quinary alloy V x W y Mo 1 . x . y S 2Z Se 2(
  • Fig. 11 Depicts the STEM images and the corresponding fast Fourier transform patterns and atomic structural models of (a) MoS 2 in the 1 H phase; (b) PtSe 2 in the 1 T phase; (c) WTe 2 in the 1 T' phase; and (d) ReSe 2 in the 1 T" phase.
  • Fig. 12 Depicts: (a) the EDS spectrum of MoTe 2 ; (b and c) atomic resolution STEM image and EELS spectrum of 2H MoTe 2 respectively; and (d and e) the STEM image and EELS spectrum of 1T MoTe 2 .
  • Fig. 13 Depicts: (a) the atomic resolution STEM image of a few-layer WTe 2 ; (b) the EDS spectrum; and (c) the EELS spectrum of WTe 2 .
  • Fig. 14 Depicts: (a) the atomic resolution STEM image; (b) the EDS spectrum; and (c) the EELS spectrum of TiS 2 monolayer.
  • Fig. 15 Depicts: (a) the atomic resolution STEM image of a few-layer ZrS 2 ; (b) the EDS spectrum; and (c) the EELS spectrum of ZrS 2 .
  • Fig. 16 Depicts: (a) STEM image (left) of the quinary monolayer alloy V x W y Moi- x - y S 2z Se 2(1 - z) , with the corresponding atomic model from atom-by-atom intensity mapping (right); (b) EDS spectra of the alloyed monolayer, confirming its chemical composition; and (c) line intensity profiles along dashed lines A (representing cation) and B (representing anion) in (a), indicating the different intensity of each chemical species.
  • Fig. 17 Depicts the intensity histogram of the V x W y Mo 1-x-y S 2z Se 2(1 . z) quinary alloy monolayer and EELS of the V atoms inside the lattice: (a) STEM image of Fig. 16a with a larger field of view; (b) respective intensity fitting of the cation and anion sites using the Gaussian models. The position of the peak intensity is highlighted with markers; (c and d) intensity histogram of the cation (c) and anion (d) sites.
  • the image intensity of different chemical species maintains a Gaussian distribution that is well separated, giving the ground to the correct assignment of the chemical composition of each atomic columns.
  • Fig. 18 Transport measurements of monolayer NbSe 2 and MoTe 2 2D crystals: (a and c) temperature dependence of longitudinal resistance R xx in a zero magnetic field from 300 K to 0.26 K of the monolayer NbSe 2 and MoTe 2 . Inset shows an expanded view of the low- temperature data; (b) temperature dependence of the longitudinal resistance R xx in different magnetic fields applied perpendicular to the NbSe 2 crystal plane; and (d) longitudinal resistance R xx as a function of magnetic field B at different temperatures for MoTe 2 .
  • Fig. 19 Depicts two-dimensional superconductivity in MoTe 2 : (a) magnetic field dependence of resistance under different tilt angles; and (b) angular dependence of upper critical fields H c2 (d).
  • the inset shows the arrangement of the experimental configuration.
  • Fig. 20 Depicts temperature dependence of the upper critical field H c2 of (a) NbSe 2 ; and (b) MoTe 2 .
  • the solid line is the linear fit to H c2 .
  • Fig. 21 Depicts transport measurements of monolayer MoS 2 and ReS 2 : (a and b) show the respective l d -V d and l CO nductivity-Vg plots of monolayer MoS 2 ; and (c and d) show the respective l d -V d and l d -V g plots of monolayer ReS 2 .
  • Fig. 22 Depicts the TG-DSC curves of salts mixed with the metal sources: (a) shows that the melting points of the systems after adding salt are all within the highlighted windows from 600 °C to 850 °C; and (b) shows the thermogravimetry versus time curves.
  • Fig. 23 Depicts the XPS spectra which reveal the existence of CI bonds to other elements, resulting from the intermediate products during the synthesis of Nb-, Mo- and W-based 2D crystals.
  • XPS spectra of Nb 3d, Mo 3d and W 4 f are shown in (a), (b) and (c), respectively.
  • Nb 3d 3 ' 2 and 3d 5 ' 2 , Mo 3d 3 ' 2 and 3d 5 ' 2 and W 4f 512 and 4f m are the core level energy states of Nb, Mo and W, respectively, all of which are well fitted with Gaussian peaks at energies indicating the bonding to CI.
  • Fig. 23 Depicts the XPS spectra which reveal the existence of CI bonds to other elements, resulting from the intermediate products during the synthesis of Nb-, Mo- and W-based 2D crystals.
  • XPS spectra of Nb 3d, Mo 3d and W 4 f are shown in
  • Fig. 25 Depicts the optical images of MoS 2 and growth rate without NaCI.
  • the inset shows the size evolution of MoS 2 single crystal monolayers and the main panel is the fitting results of single crystal size over distance.
  • Fig. 26 Depicts the optical image of MoS 2 and growth rate with NaCI. The inset shows the size evolution of MoS 2 single crystal monolayers and the main panel shows the fitting results of single crystal size over distance.
  • Fig. 27 Depicts the optical images of MoS 2 of various morphologies obtained by controlling the nucleation and growth rate.
  • the corresponding weight of MoCVNaCI sources used are: (a) 2mg/0.2mg; (b) 3mg/0.3mg; and (c) 10mg/0.8mg.
  • An increasing weight ratio of salt over M0O 3 increases the nucleation density for the growth of MoS 2 , thus the distribution of mono- layered MoS 2 transits from (a) low-density single crystal to (c) a continuous film.
  • Fig. 28 Depicts the optical images of MoS 2 of various thickness obtained by controlling the nucleation and growth rate. Nuclei of different sizes can be obtained by varying distance between the substrate and the MoCVNaCI sources: (a) 1.2 cm; (b) 0.8 cm; and (c) 0.6 cm.
  • Fig. 29 Depicts (a and b) optical images of MoS 2 and MoSe 2 grown at 750 °C, and (c) MoTe 2 grown at 700 °C; (d, e, and f) optical images of WS 2 , WSe 2l and WTe 2 grown at 800 °C, 810 °C and 820 °C respectively; and (g, h, and i) optical images of NbS 2 , NbSe 2 and NbTe 2 grown at 780 °C, 790 °C and 800 °C respectively.
  • Fig. 30 Depicts optical images of some 2D TMDs which show that most of the flakes are monolayer: (a) TiS 2 grown at 800 °C; (b) NbS 2 grown at 780 °C; (c) NbSe 2 grown at 790 °C; (d) PtSe 2 grown at 810 °C; (e) WTe 2 grown at 810 °C; and (f) MoTe 2 grown at 700 °C.
  • Fig. 31 Depicts the optical images of PtSe 2 grown at (a) 815 °C and at (b) 800 °C; and VTe 2 grown at (c) 750 °C and at (d) 700 °C.
  • Fig. 32 Depicts the linear sweep voltammograms of Vo.o3Wo.2Moo.77Si. 6 Se 0 .4 in comparison with MoS 2 , carried out using a typical three-electrode cell consisting of a working electrode, a graphite carbon counter electrode and a saturated calomel reference electrode (SCE), with 0.5 M H 2 S0 4 as the electrolyte.
  • Fig. 33 Depicts the temperature dependence of square resistance of various samples of MoSe x Te 2 - x containing different ratios of Se to Te. This shows a transition from semiconductor to metal with a decreasing ratio of Se to Te.
  • TMDs transition metal dichalcogenides
  • This process can be used to deposit a monolayer or a few layers of TMD onto a substrate by controlling the weight of the source materials.
  • This process enables TMD crystals having a thickness of from 1 nm to less than 1 pm to be formed expeditiously.
  • M is selected from one or more of the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Cd, Hf, Ta, W, and Re: and
  • X is selected from one or more of the group consisting of S, Se, and Te, the process comprising the step of depositing the transition metal dichalcogenide of formula I on a substrate by chemical vapour deposition, wherein the vapour deposition is accomplished by: passing a carrier gas through a fluid pathway in a furnace, where the fluid pathway comprises a first temperature zone housing one or more of elemental sulfur, selenium or tellurium and a second temperature zone that houses a substrate above a mixture of one or more metallic precursors and an alkali metal halide, where the wt.wt ratio of the one or more metallic precursors to the alkali metal halide is from 1 :2 to 15:1 , where:
  • the temperature of the first temperature zone is from 150 to 500°C;
  • the temperature of the second temperature zone is from 350 to 950°C;
  • the substrate is from 0.01 to 2.0 cm above the mixture of one or more metallic precursors and the alkali metal halide;
  • the one or more metallic precursors are selected from an elemental metal, a metal oxide or a metal halide, where each respective metal is selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Cd, Hf, Ta, W, and Re, wherein the growth rate of the two-dimensional transition metal dichalcogenide of formula I on the substrate is from 0.01 ⁇ /s to 10 ⁇ /s.
  • the word “comprising” may be interpreted as requiring the features mentioned, but not limiting the presence of other features. Alternatively, the word “comprising” may also relate to the situation where only the components/features listed are intended to be present (e.g. the word “comprising” may be replaced by the phrases “consists of or “consists essentially of). It is explicitly contemplated that both the broader and narrower interpretations can be applied to all aspects and embodiments of the present invention. In other words, the word “comprising” and synonyms thereof may be replaced by the phrase “consisting of or the phrase "consists essentially of or synonyms thereof and vice versa.
  • the TMDs formed using this process may relate to materials containing a single metal and a single chalcogenide (e.g. TaS 2 ), but also enables the formation of any suitable alloy (e.g. TaSo. 8 Se 0 .2, Hfo.3Tao.7S2, Fe 0 .3Vo.3Pto.4So.5Seo.2Teo. 3 ) > where the alloy may contain up to six metals and multiple chalcogenides (i.e. S, Se, Te).
  • any suitable alloy e.g. TaSo. 8 Se 0 .2, Hfo.3Tao.7S2, Fe 0 .3Vo.3Pto.4So.5Seo.2Teo. 3
  • the alloy may contain up to six metals and multiple chalcogenides (i.e. S, Se, Te).
  • houses when used herein may refer to material(s) deposited directly onto a particular region of the fluid pathway, or it may refer to the use of a suitable container/vessel that contains the desired material(s) situated within a particular region of the fluid pathway.
  • the process relies on the use of a furnace having a fluid path through it.
  • This fluid path may be created by any suitable means, such as the use of a quartz/glass tube of a suitable diameter to enable the positioning of the substrate, a first boat (containing the chalcogenide(s) may be placed upstream of the substrate and a second boat may be placed beneath the substrate and containing the metal source(s) and alkali metal halide.
  • the furnace is also adapted to provide two separate temperature zones. The first temperature zone is upstream of the second temperature zone and houses the first boat, which contains the chalcogenide(s), the second temperature zone is downstream from the first temperature zone and houses the substrate and second boat, which boat contains the metal precursor and alkali metal halide.
  • the first temperature zone is heated up to and maintained at a temperature capable of vaporising the chalcogenide(s), such a temperature may be from 150 to 500°C.
  • the second temperature zone is heated up to and maintained at a temperature of from 350 to 950°C in order to vaporise the metal source.
  • a carrier gas is passed through the fluid path and first comes into contact with the first boat and vaporised chalcogenide(s).
  • the vaporised chalcogenide(s) is then carried to the second temperature zone by the carrier gas where it mixes with the vaporised metal and forms a deposited TMD on the surface of the substrate.
  • the carrier gas exits through an outlet and it may still contain traces of the chalcogenide(s), metal source/metal and alkali metal salts.
  • the carrier gas may be any suitable gas for chemical vapour deposition. In certain embodiments, there may be a single carrier gas and in others there may be more than one.
  • the gas is suitably an inert gas, such as nitrogen or argon.
  • the gas may be made from a mixture of an inert gas (e.g. nitrogen and/or argon) and hydrogen gas.
  • the flow rate of the inert gas whether used alone or in combination is from 30 to 200 standard cubic centimetres per minute (seem), such as from 60 to 120 seem.
  • the flow rate of the hydrogen gas is independently from 1 to 20 seem (e.g. from 5 to 20 seem, such as 10 to 15 seem).
  • the fluid pathway may be purged by applying a vacuum to the fluid pathway to remove the gas present and then allowing the carrier gas (e.g. an inert gas) to flow into the pathway, which steps may be repeated a suitable number of times (e.g. 3 to 5 times).
  • the carrier gas e.g. an inert gas
  • the flow rate of the carrier gas(es) may be varied during the deposition of the transition metal dichalcogenide in order to provide different phases of material.
  • an in-plane heterostructure of MoTe 2 was obtained by first using a flow rate of 80 seem Ar and 20 seem H 2 to deposit MoTe 2 in the 1T phase, followed by changing the flow rate in the same deposition run to 20 seem Ar and 4 seem H 2 to deposit MoTe 2 in the 2H phase.
  • the substrate may be any suitable substrate.
  • a typical example of a substrate is a silicon substrate.
  • the substrate is placed above the boat containing the metal source and alkali metal salt.
  • a gap of from 0.01 to 2.0 cm is used (e.g. 0.1 to 2.0 cm, such as 0.5 cm to 1.9 cm, such as 0.7 to 1.5 cm).
  • boat refers to any suitable vessel for holding the chalcogenide(s), metal source/metal and alkali metal salts that is capable of surviving the temperatures used in the process.
  • the resulting thickness of the deposited TMD may be from 1 nm to 1 pm (e.g.
  • the layer of deposited TMD material may be a monolayer (e.g. 1 nm thick) or may be formed from several layers of the same TMD stacked on top of one another.
  • the thickness of the layer deposited may be controlled by the reaction time and the amount of material provided.
  • a second TMD may be deposited on the first TMD deposition, which can be repeated any number of times. This second (and subsequent) deposition may deposit the same TMD as already on the surface of the substrate (e.g.
  • each TMD layer deposited is in contact with a TMD that is different to it (e.g. all TMD layers are distinct or a second TMD layer may be sandwiched between a first and third TMD layer, where the first and third TMD layers are the same TMD, while the second TMD layer is a different material (e.g. substrate/WS 2 /HfSe 2 WS 2 )).
  • the processing conditions outlined above enable the formation of the TMDs at a fast rate on the surface of the substrate once the deposition has been initiated. That is, the growth rate may be from 0.01 pm/s to 10 pm/s (e.g.
  • TMDs having a size of from 5 pm to 1 ,000 pm may be grown quickly on the surface of the substrate. Indeed, growth time needed for many of the TMDs may be less than 30 seconds.
  • TMDs produced under the conditions above that may be produced in less than 30 seconds include, but are not limited to, MoS 2 , MoSe 2 , MoTe 2 , WS 2 , WSe 2 , WTe 2 , VS 2 , VSe 2 , ReS 2 , ReSe 2 , TiS 2 , TiSe 2 , TaS 2 , TaSe 2 , NbS 2 and NbSe 2 .
  • the one or more metallic precursors are selected from an elemental metal, a metal oxide or a metal halide.
  • the oxides and chlorides mentioned herein may be non-stoichiometric or, more particularly, stoichiometric in nature.
  • thermoelectric material particularly non-stoichiometric compounds that may be mentioned herein are iron and tungsten oxides.
  • An advantage of the currently disclosed process is that the temperatures needed to heat the metal source may be significantly below those conventionally used.
  • the temperature of the second temperature zone when the desired transition metal dichalcogenide is WS 2 the temperature of the second temperature zone may be from 600 to 670°C.
  • the transition metal dichalcogenide when the transition metal dichalcogenide is WSe 2 the temperature of the second temperature zone may be from 650 to 670°C.
  • TMDs and their associated alloys are provided below.
  • any suitable alkali metal salt (or mixture thereof) may be used in the process disclosed here.
  • suitable alkali metal salts include, but are not limited to, NaCI, KCI, LiCI, Nal, KBr, LiBr, NaBr, Kl, Lil and mixtures thereof.
  • the wt:wt ratio of the one or more metallic precursors to the alkali metal halide may be from 1 :2 to 15:1, such as from 1.5:1 to 15:1 , from 1.6:1 to 13:1 , from 4:1 to 10:1 , from 5:1 to 8:1, such as 6:1.
  • Other suitable ratios are presented in the experimental section and below.
  • the temperature of the second temperature zone may be from 350 to 800°C (e.g. from 350 to 600°C, such as from 350 to 500°C) and the wt:wt ratio of the one or more metallic precursors to the alkali metal halide may be from 5:1 to 10:1 (e.g. 6:1).
  • the temperature of the second temperature zone may be from 550 to 900°C (e.g.
  • the wt:wt ratio of the one or more metallic precursors to the alkali metal halide may be from 5:1 to 10:1 (e.g. 6:1 ).
  • the metallic precursor may be a molybdenum oxide (e.g. Mo0 3 ).
  • any suitable alkali metal salt may be used, a particular alkali metal salt that may be mentioned in these processes is NaCI.
  • the temperature of the second temperature zone may be from 750 to 860°C and the wt:wt ratio of the one or more metallic precursors to the alkali metal halide is from 8:1 to 12:1.
  • the wt.wt ratio of the one or more metallic precursors to the alkali metal halide may be 10:1 and/or the alkali metal halide may be any suitable salt, such as NaCI.
  • a suitable metallic precursor for Pd may be PdCI 2 and a suitable a suitable metallic precursor for Pd may be PtCI 2 .
  • the process described herein may be used to make a transition metal dichalcogenide that is selected from the group consisting of HfTe 2 , HfSe 2 , HfS 2 , VTe 2 , VSe 2 , VS 2 , TiTe 2 , TiSe 2 , TiS 2 , NbTe 2 , NbSe 2 , NbS 2 , ZrTe 2 , ZrSe 2 , ZrS 2) TaTe 2 , TaSe 2 , TaS 2 , MoTe 2 , and WTe 2 , where the temperature of the second temperature zone may be from 600 to 860°C and the wt:wt ratio of the one or more metallic precursors to the alkali metal halide (e.g.
  • NaCI may be from 1.6:1 to 4:1.
  • the metal Hf may be used as the precursor for TMDs containing Hf, while for each of V, Ti, Nb, Zr, Ta, Mo and W the metallic precursor may be a metal oxide.
  • the process described herein may be used to make a transition metal dichalcogenide that is FeS 2 , FeSe 2 or FeTe 2 , where the temperature of the second temperature zone is from 500 to 850°C (e.g. from 500 to 600°C) and the w wt ratio of the one or more metallic precursors to the alkali metal halide (e.g. NaCI and/or LiCI) is from 4:1 to 6:1 , such as 5:1.
  • the metallic precursor for Fe may be a metal oxide (e.g. Fe 2 0 3 or a non-stoichiometric oxide) or a metal chloride (e.g. FeCI 2 ).
  • transition metal dichalcogenide that is an alloy of formula II:
  • each of A to G is a different metal selected from one of the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Cd, Hf, Ta, W, and Re;
  • each of a to g is independently 0 to 0.99 and the sum of a+b+c+d+e+f+g is 1 ; and each of h to j is 0 to 2 and the sum of h+i+j is 2,
  • the wt:wt ratio of the one or more metallic precursors to the alkali metal halide may be from 5:1 to 7.5:1 , such as 5:1 and/or the temperature of the second temperature zone may be from 600 to 850°C. As will be noted, there may be up to six metals and three chalcogenides in the alloy.
  • x, y and z are greater than 0 and less than 1.
  • transition metal dichalcogenide alloy of formula II per se which are as defined above. These alloys may have particularly good catalytic properties compared to other materials.
  • Fig. 1 shows a flow chart of the general growth process for the production of TMDs by the chemical vapour deposition method, based on the competition between mass flux of metal precursors and reaction rate of the domains.
  • the mass flux determines the amount of metal precursors involved in the reaction for the formation of nucleus and the growth of domains, while the growth rate dominates the grain size of the as-grown films.
  • low growth rate results in monolayer polycrystalline film (Route I) with small grain, and high growth rate tends to form continuous monolayer films with large grain (up to millimeter size, Route II) (Dumcenco, D. et al. ACS Nano, 2015, 9, 4611-4620).
  • Low mass flux low growth rate leads to form small flakes. Tiny nucleus are often observed at the center of the flakes (Li, B. et al. Angew. Chem. Int.
  • Fig. 2a The setup of the reaction is shown in Fig. 2a with an expanded view of the middle section shown in Fig. 2b.
  • the 2D compounds and heterostructures were synthesised in a quartz tube 10 having a 1 inch (2.54 cm) diameter and a length of approximately 70 cm.
  • the length of the furnace was about 36 cm.
  • a carrier gas 35 e.g. mixture of H 2 /Ar gas
  • An aluminium oxide boat 15 with dimensions of about 8 cm x 1 .1 cm x 1.2 cm, containing a mixture of precursor powder 25 and salt 45, was placed in the center of the tube 10.
  • a Si substrate 20 with a 285 nm top layer of Si0 2 was placed on boat 15 with the polished surface down; the distance between the sources and substrate was set at a distance of from 0.2 cm to 1.2 cm.
  • Another aluminium boat (of similar dimension) containing S or Se or Te powder 30 was placed on the upstream (upwind) of the tube furnace at 200 °C, 300 °C and 450 °C, respectively.
  • the distance between the S or Se or Te boat 30 and the precursor boat was about 18 cm, 16 cm and 15 cm, respectively.
  • the heating rate of all reactions was 50 °C min "1 . All the reactions were carried out at atmospheric pressure. The temperature was cooled down to room temperature naturally. All reaction materials were bought from Alfa Aesar with a purity of more than 99%.
  • the synthesis conditions and parameters for each compound made are summarised in Tables 1-
  • the weight ratio between salt and metal precursor(s), or the weight ratio between the different metal precursors or chalcogenides (for alloys) can be tuned in accordance with the needs of the starting materials and/or desired properties of the final TMDs. Taking Mo ⁇ Re ⁇ and WS x Te 2 - x as examples, by tuning the ratio between Mo and Re, and between S and Te, it is possible to control the value of x.
  • Raman measurements were performed on a WITEC alpha 200R Confocal Raman system, with an excitation laser of 532 nm and with a laser power of less than 1 mW. Prior to Raman characterisation of the samples, the system was calibrated against a silicon standard with a Raman peak centered at 520 cm "1 . The laser powers are less than 1 mW to avoid overheating of the samples. Photoluminescence measurements were also performed on the same system. The optical images of the as-synthesised samples were obtained using a light microscope. Fig. 3 shows the optical images of 47 TMDs synthesised using the general method above from Ti to Pt, in which various morphologies including triangles, hexagons, ribbons and films can be observed.
  • the TMDs synthesised include 32 binary 2D crystals, 11 ternary alloys, a quaternary alloy, a quinary alloy and a 1 T MoTe 2 -2 H MoTe 2 in-plane and MoS 2 - NbSe 2 vertically stacked heterostructures.
  • All of the materials display a purple color because they were directly grown on 285 nm Si0 2 .
  • the size of the 2D TMDs can reach as large as one millimeter in the case of MoS 2 , WS 2 and WSe 2 . It is notable that ⁇ -, Nb-, V-, Fe-, Zr-, Pd-, Hf-, Ta- and Pt-based TMDs have rarely been synthesised before.
  • STEM Scanning Transmission Electron Microscopy
  • EDS Energy-Dispersive X-ray Spectroscopy
  • EELS Electron Energy Loss Spectroscopy
  • STEM samples were prepared with a poly(methyl methacrylate) (PMMA)-assisted method or PMMA-free method with the assistance of an iso-propyl alcohol droplet.
  • PMMA poly(methyl methacrylate)
  • STEM imaging and EELS analysis were performed on a JEOL 2100 F with a cold field-emission gun and an aberration corrector (the DELTA corrector) operating at 60 kV.
  • a low-voltage modified Gatan GIF Quantum spectrometer was used for recording the EELS spectra.
  • the inner and outer collection angles for the STEM image ( ⁇ 1 and ⁇ 2) were 62 mrad and 129-140 mrad, respectively, with a convergence semi-angle of 35 mrad.
  • the beam current was about 15 pA for the annular dark-field (ADF) imaging and the EELS chemical analyses. EDS analyses were also carried out using the same instrument.
  • the atomic structures of most 2D crystals can be classified into four types: (1 ) the trigonal prismatic 1 H phase; (2) the undistorted 1 T phase with the metal atom located at the centre of an octahedral unit; (3) the one-dimensional distorted 1 T phase (called the 1 T' phase), in which pairs of metal atoms move closer to each other perpendicularly, resulting in a quasi- one-dimensional chain-like structure consisting of distorted octahedral units; and (4) and the two-dimensional distorted 1 T phase (called the 1 T" phase), in which four nearby metal atoms move closer to each other to form a new unit cell, producing repeatable diamond-like patterns.
  • the 2D TMDs for group IV and X metals were observed to be highly sensitive to water and oxygen under ambient conditions, thus, they were easily oxidised during the transfer process before they were characterised structurally. As such, there are some missing data points due to the difficulties in characterising the TMDs, including the degraded samples.
  • XPS X-ray Photoelectron Spectroscopy
  • Atomic Force Microscopy (AFM) AFM measurements on the thickness of the TMDs were carried out using the Asylum Research, Cypher S system. During the measurement, some dots were often found on the surface on the AFM images due to the oxidation of some of the TMDs. Given this, the thickness morphology of some of the TMDs was also confirmed using STEM. Reference to the methodology involving the AFM step heights and identifying layer thicknesses can be found in Shearer, C. J., et al., Nanotechnology, 2016, 27, 125704.
  • the AFM images and the corresponding thicknesses of the 2D TMDs were measured. All the sulphides except PdS 2 were found to be monolayer. In comparison to sulfides, only some selenides such as MoSe 2 , WSe 2 , NbSe 2 , VSe 2 , PtSe 2 and ReS 2 were confirmed as monolayer crystals. For the tellurides, monolayer WTe 2 and MoTe 2 were obtained easily, which were confirmed by the AFM images and STEM results. As a comparison, other few- layer tellurides such as Ti-, V-, Nb-, Zr-, and TaTe 2 were obtained.
  • TMDs like TiSe 2 , HfSe 2 , ZrSe 2 , and TaSe 2 were easily oxidised as observed from the AFM images which often showed dots found on the surface of the materials. Given this, the AFM images cannot accurately reveal the information on the precise thickness. Fortunately, this can be distinguished from the STEM results which showed that the monolayer zone was often found.
  • Table 1a depicts the synthesis conditions and parameters for the 32 binary compounds (based on transition metals Ti, Zr, Hf, V, Nb, Ta, Mo, W, Re, Pt, Pd and Fe) obtained from initial studies, while Table 1b depicts the synthesis conditions and parameters obtained after repeated studies.
  • Table 2a depict the synthesis conditions and parameters for the 13 alloys (including 11 ternary, one quaternary and one quinary) obtained from initial studies, while Table 2b depicts the synthesis conditions and parameters obtained after repeated studies.
  • MoS 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b.
  • a large MoS 2 single crystal with a size up to 1.2 mm was synthesised with corresponding photoluminescence (PL) peak at 675 nm (Fig. 4a and c).
  • the Raman spectrum of the monolayer MoS 2 crystal shows the distance between the two peaks to be about 19 nm, indicating the monolayer nature of the MoS 2 crystal (Fig. 4b).
  • Fig. 11a shows the STEM image of monolayer MoS 2 in 1 H phase, with the corresponding atomic structural model.
  • the patterns obtained by fast Fourier transform further indicate that the 1 H phase maintains a hexagonal unit cell.
  • the thickness of the monolayer was measured to be 0.7 nm by AFM (Table 4).
  • Example 2 Synthesis and characterisation of MoSe 2
  • MoSe 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b.
  • a MoSe 2 single crystal with a size up to 1.0 mm was synthesised (Fig. 4d) and the PL spectrum is shown in Fig. 4f.
  • the Raman spectrum of MoSe 2 shows a A 1g peak at 249 cm "1 , which is in agreement with previous report (Fig. 4e) (Gong, Y. J. et al., Adv. Fund. Mater., 2016, 26, 2009-2015).
  • the as-synthesised MoSe 2 was determined to be in 1 H phase by STEM and the thickness was measured to be 0.7 nm by AFM (Tables 3 and 4 respectively).
  • MoTe 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1b. In comparison with MoS 2 and MoSe 2 , MoTe 2 has two phases which are 2H and 1T ⁇ The synthesis of the few-layer 2H- and 1T- MoTe 2 films have been reported by tellurisation of the Mo or Mo0 3 film (Zhou, L. et al., J. Am. Chem. Soc, 2015, 137, 11892-11895; Park, J. C. er a/., ACS Nano, 2015, 9, 6548-6554). The monolayer 1T MoTe 2 crystal with a size smaller than 10 pm was also obtained by a similar method (Naylor, C. H.
  • the as-synthesised MoTe 2 thin film has 1T and 2H phases, which should show semiconducting and semi-metallic behaviour, respectively.
  • Fig. 12a shows the EDS spectrum of MoTe 2 thin film where the signals due to Te and Mo elements were observed strongly, therefore confirming the high purity of MoTe 2 .
  • the Au signals appear to be from the Au TEM grid bars and signals for Cu may come from the contaminations during the samples transfer. This confirms the high purity of the as-synthesised MoTe 2 .
  • Fig. 12b and d The high-resolution Z-contrast STEM images of few-layer 2H and 1 MoTe 2 are shown in Fig. 12b and d, respectively.
  • a hexagonal crystal structure of the 2H phase MoTe 2 was observed which confirms the AA' structure (Fig. 12b). It is evident that the atomic structure of few-layer MoTe 2 in 1 phase is different from the 2H phase (Fig. 12d).
  • the EELS spectrum of 2H phase MoTe 2 is different from that of 1T phase MoTe 2 , in which an additional small pre-peak at around 30 eV was observed for the 1 ⁇ phase (Fig. 12c and e). This may be caused by different Mo-Te chemical bonding in the 2H and 1T phases, which can be used as a "fingerprint" for differentiating these two phases.
  • the thickness of the monolayer was measured to be 0.8 nm by AFM (Table 4).
  • WS 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1b.
  • the synthesis of WS 2 monolayer has been reported by CVD method.
  • large size WS 2 was usually obtained with long-time growth at high temperature of 900 to 1100 °C (Rong, Y. M. et a/. Nanoscale, 2014, 6, 12096-12103).
  • WS 2 monolayer as large as 0.5 mm was achieved in a short time of 3 min and at a reduced temperature (Fig. 5a).
  • the Raman spectrum and PL peak (at 635 nm) of the monolayer are shown in Fig. 5b and c.
  • the as-synthesised WS 2 was determined to be in 1 H phase by STEM and the thickness was measured to be 0.8 nm by AFM (Tables 3 and 4 respectively).
  • WSe 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b.
  • the synthesis of a large-size monolayer WSe 2 crystal was achieved as shown in Fig. 5d and the corresponding Raman spectrum of the monolayer crystal (Fig. 5e) is consistent with values in previous report (Huang, J. K. er a/., ACS Nano, 2014, 8, 923-930).
  • the peak of the PL spectrum at -760 nm suggests that the WSe 2 is a monolayer (Fig. 5f).
  • the as-synthesised WSe 2 was also characterised by STEM and determined to be in 1 H phase, while the thickness was measured to be 0.9 nm by AFM (Tables 3 and 4 respectively).
  • Example 6 Synthesis and characterisation of WTe 2
  • WTe 2 was synthesised in accordance to the above general procedure with the growth conditions and parameters in Tables 1a and 1 b.
  • Monolayer and bilayer of WTe 2 with size up to 600 ⁇ was synthesised (Fig. 5g), and the Raman spectra of monolayer shown in Fig. 5h is in agreement with previous report.
  • WTe 2l a semimetal is only stable in 1T phase (usually called 1Td phase in bulk due to the small misalignment in stacking) in nature. Tungsten chains are formed within the dichalcogenide layers along the a axis of the unit cell, making the compound structurally one dimensional.
  • Fig. 11 c shows the STEM image of monolayer WTe 2 in 1T phase with the corresponding atomic structural model. The patterns obtained by fast Fourier transform further indicate that the lT phase forms a rectangular unit cell owing to one-dimensional metal-pair distortion.
  • Fig. 13a shows the STEM image of the as-grown WTe 2 in the 1T phase, where the chain-like structure can still be observed.
  • the EDS and EELS spectra in Fig 13b and c respectively further confirm the chemical composition and purity of the WTe 2 sample.
  • the thickness of the sample was measured to be 0.7 nm by AFM (Table 4).
  • TiS 2 was synthesised in accordance to the above general procedure with the growth conditions and parameters in Tables 1a and 1 b.
  • the synthesis of a monolayer TiS 2 with a size of up to 50 ⁇ was achieved (Fig. 6a).
  • the Raman peaks located at 230 cm “1 and 332 cm “1 are the same as the reported result, confirming that the flakes are TiS 2 (Fig. 6b).
  • Fig. 14a shows the STEM image of the TiS 2 layers, revealing the 1T phase with the hexagonal crystal structure.
  • the EDS and EELS spectra are shown in Fig. 14b and c respectively, which further confirm the chemical composition of the as-synthesised TiS 2 .
  • the thickness of the sample was measured to be 0.9 nm by AFM (Table 4).
  • Example 8 Synthesis and characterisation of TiSe 2 TiSe 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. A few-layer TiSe 2 with a size up to 30 pm was synthesised, with Raman peaks located at 190 cm “1 and 250 cm “1 corresponding to the A 1g mode and E g mode of TiSe 2 respectively (Fig. 6c and d). The thickness was measured to be 2.0 nm by AFM (Table 4).
  • Example 9 Synthesis and characterisation of TiTe 2 TiTe 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1b. A TiTe 2 ultra-thin film was synthesised (Fig. 6e). The Raman peaks locating at ⁇ 90 cm “1 , 120 cm “1 , and 140 cm “1 are in agreement with the reported result, in which the latter two peaks correspond to the vibration of A 1g and Ei g respectively (Fig. 6f). The thickness was measured to be 5.0 nm by AFM (Table 4).
  • Example 10 Synthesis and characterisation of ZrS 2 ZrS 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1b.
  • the Raman spectrum of ZrS 2 is shown in Fig. 7b, with a Raman peak locating at 305 cm "1 corresponding to A 2u vibration.
  • the atomic structure of a monolayer ZrS 2 consists of S-Zr-S sandwich structure in the octahedral 1T phase. Fig.
  • ZrSe 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1b.
  • a ZrSe 2 monolayer was synthesised as shown in Fig. 7c.
  • the corresponding Raman intensity of the monolayer ZrSe 2 shown in Fig. 7d is weaker than that in bulk ZrSe 2 .
  • the thickness of the monolayer was measured to be 2.0 nm by AFM (Table 4).
  • ZrTe 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b.
  • the optical image of ZrTe 2 is shown in Fig. 7e and the Raman spectrum confirms that the flake is ZrTe 2 crystal (Fig. 7f).
  • the thickness of the monolayer was measured to be 2.0 nm by AF (Table 4).
  • HfS 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b.
  • the optical image of HfS 2 is shown in Fig. 3.
  • the as- synthesised HfS 2 was also characterised by Raman spectroscopy in which the A 1g vibration mode is in agreement with the reported result.
  • the as-synthesised HfS 2 was characterised by STEM and was determined to be a semiconductor in octahedral 1T phase with van der Waals interaction between the layers. This is similar to the structure of ZrS 2 since both Zr and Hf are group IVB elements. HfS 2 is not stable in air, which therefore restricts the structural characterisation of the HfS 2 atomic layers.
  • the STEM images of the as-synthesised HfS 2 flake showed that it was heavily oxidised and this made the identification of the exact atomic structure challenging.
  • the EDS spectrum showed strong Hf and S signals. Together with the corresponding EELS spectrum, which also showed the Hf and S EELS fingerprints spectra, it was confirmed that the flakes should be the HfS 2 crystal, before they were oxidised.
  • the thickness of the monolayer was measured to be 1.0 nm by AFM (Table 4).
  • Example 14 Synthesis and characterisation of HfSe 2 HfSe 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. A HfSe 2 monolayer of around 15 m was synthesised and the optical image is shown in Fig. 3. It was also characterised by Raman spectroscopy which showed the A 1g mode in the spectrum. In addition, the thickness of the monolayer was measured to be 1.0 nm by AFM (Table 4).
  • HfTe 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1b. A few-layer HfTe 2 was synthesised and the optical image is as shown in Fig. 3. The flake was characterised by Raman spectroscopy in which the spectrum confirmed that the flake is HfTe 2 crystal. Example 16. Synthesis and characterisation of VS 2
  • VS 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b.
  • the optical image of VS 2 is shown in Fig. 3.
  • the as- synthesised VS 2 was characterised by Raman spectroscopy and the spectrum showed the 2-photonon and A g vibrations which are the same as the values reported.
  • the VS 2 was characterised by STEM and it was determined to be in 1T phase whereby it is composed of layers of VS 6 octahedral separated by a van der Waals gap and it belongs to space group P3m1.
  • the hexagonal atomic arrangement observed at the edges confirmed the 1T structure of VS 2 .
  • the EDS spectrum showed the presence of only S and V atoms in this region and the EELS spectrum collected along the edge further confirmed the high quality of the as-synthesised VS 2 .
  • the thickness of the as-synthesised sample was measured to be 0.7 nm by AFM (Table 4).
  • Example 17 Synthesis and characterisation of VSe 2 VSe 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. A monolayer of VSe 2 of 50 ⁇ was synthesised and the optical image is shown in Fig. 3. The sample was also characterised by Raman spectroscopy. The STEM image of few-layer VSe 2 show the hexagonal arrangement of atomic columns in alternate bright and dark pattern results from the stacking of the few layers in 1T structure. The EDS and EELS spectra collected in the same region further confirmed the high purity of the as-synthesised VSe 2 . The thickness of the as-synthesised sample was measured to be 0.9 nm by AFM (Table 4).
  • VTe 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b.
  • a monolayer of VTe 2 was synthesised and the optical image is shown in Fig. 3.
  • the as-synthesised sample was also characterised by Raman spectroscopy and the Raman spectrum showed peaks at 1 17 cm “1 and 137 cm “1 which were slightly shifted as compared to reported values.
  • the thickness of the sample was measured to be 3.0 nm by AFM (Table 4).
  • NbS 2 was synthesised in accordance to the above general procedures with growth conditions and parameters in Tables 1a and 1b.
  • the synthesis of a monolayer of NbS 2 of a size up to 80 m was achieved and the optical image is shown in Fig. 3.
  • the sample was also characterised by Raman spectrum which confirmed that the as-synthesised flake is an NbS 2 crystal.
  • the NbS 2 crystal generally exists in 2H phase (or 1 H in the case of a single layer).
  • the STEM image of a monolayer NbS 2 showed that the 2H phase of NbS 2 can be directly identified by the hexagons composed by Nb and S 2 columns with different contrast profile - this is similar to the well-known atomic structure of MoS 2 .
  • the EDS and EELS spectra showed the presence of Nb and S, therefore confirming the chemical composition of NbS 2 .
  • the thickness of the sample was measured to be 0.7 nm by AFM (Table 4).
  • NbSe 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b.
  • the optical image of monolayer NbSe 2 with a size up to 50 pm is shown in Fig. 3 and the Raman spectrum confirmed that the as- synthesised sample is NbSe 2 .
  • NbSe 2 is generally in the 2H phase, where the Nb and Se 2 atomic columns are arranged in a hexagonal manner.
  • the STEM image of NbSe 2 showed the presence of both monolayer and bilayer regions.
  • the hexagonal atomic structure in the monolayer similar to those observed in NbS 2 , confirmed that the monolayer is in 1H phase.
  • the uniform intensity of each atomic site in the bilayer revealed the as-synthesised NbSe 2 is in the 2H stacking phase.
  • the EDS and EELS spectra collected in the same region confirmed the chemical composition of NbSe 2 .
  • the Cu signals were from the background signals of the Cu TEM grid used.
  • the thickness of the sample was measured to be 0.8 nm by AFM (Table 4).
  • Example 21 Synthesis and characterisation of NbTe 2 NbSe 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1b.
  • NbTe 2 is a layered-structure compound and was reported to demonstrate charge-density wave (CDW) effect and superconducting behaviour (Nagata, S., et al., J. Phys. Chem. Solids, 1993, 54, 895-899.
  • CDW charge-density wave
  • the synthesis of NbTe 2 flakes has not been reported by CVD method.
  • large-size NbTe 2 obtained using CVD method was achieved and the optical image is shown in Fig. 3.
  • the sample was characterised by Raman spectroscopy which revealed that the flake is NbTe 2 crystal. Like other telluride-based materials, the bulk crystal structure of NbTe 2 is monoclinic, belonging to space group C2/m. NbTe 2 is known to demonstrate charge density wave (CDW) transition when the temperature drops to the transition point.
  • CDW charge density wave
  • the STEM image of a NbTe 2 monolayer showed hexagonal patterns of atom arrangement instead of the MoTe 2 - like 1T phase, therefore suggesting that the NbTe 2 monolayer is presumably in 1T phase.
  • the corresponding EDS and EELS spectra further confirmed that the flakes were only composed of Nb and Te elements.
  • the thickness of the sample was measured to be 4.0 nm by AFM (Table 4).
  • TaS 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b.
  • the optical image of TaS 2 film with a size up to 70 ⁇ is shown in Fig. 3.
  • the sample was also characterised by Raman spectroscopy.
  • TaS 2 monolayer can exist stably in 1 H and 1T phase.
  • a high resolution Z-contrast STEM image of a monolayer region and bilayer region of TaS 2 showed the hexagonal patterns which indicated that the Ta (bright spots) and S 2 were arranged similarly to that of MoS 2 . This therefore confirmed the 1 H phase of the as-synthesized TaS 2 .
  • the bilayer region showed a 3R stacking order, similar to that of CVD-grown MoS 2 .
  • the EDS and EELS spectra were collected in the same region where the image was collected. This confirmed the chemical composition of the sample which consists of Ta and S without any other obvious impurities.
  • the thickness of the sample was measured to be 0.8 nm by AFM (Table 4) ⁇
  • Example 23 Synthesis and characterisation of TaSe 2 TaSe 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1b.
  • the optical image of TaSe 2 is shown in Fig. 3 and the sample was also characterised by Raman spectroscopy.
  • the thickness of the sample was measured to be 2.0 nm by AFM (Table 4).
  • TaTe 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1b. TaSe 2 with a size up to 20 pm is shown in Fig. 3. The sample was also characterised by Raman spectroscopy and the thickness of the sample was measured to be 5.0 nm by AFM (Table 4).
  • Example 25 Synthesis and characterisation of ReS 2 ReS 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b.
  • the optical image of monolayer ReS 2 with a size up to 50 pm is shown in Fig. 3.
  • the sample was also characterised by Raman spectroscopy.
  • ReS 2 is a semiconductor with a distorted 1T structure which is defined as 1T" phase.
  • a high resolution Z-contrast STEM image of a ReS 2 monolayer showed a diamond shape pattern of the Re atoms due to the two-dimensional distortion from the 1T phase.
  • the Re atoms are observed clearly as bright spots, while the S atoms are generally not observable due to the smaller size as compared to Re atom.
  • the EDS and EELS spectra showed Re and S characteristic peaks, without any other obvious impurities, therefore confirming the composition of the material.
  • the thickness of the sample was measured to be 0.9 nm by AFM (Table 4).
  • Example 26 Synthesis and characterisation of ReSe 2 ReSe 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. The optical image of ReSe 2 is shown in Fig. 3. The sample was also characterised by Raman spectroscopy.
  • Fig.11d shows the STEM image of monolayer ReSe 2 in 1T" phase, with the corresponding atomic structural model.
  • the patterns obtained by fast Fourier transform further indicate that the 1T" phase changes to a much larger hexagonal cell owing to the aggregation of four metal atoms into a new unit cell.
  • the EDS spectrum collected from a larger region confirms the presence of Re and Se.
  • the Mo signals were likely to be from the TEM Mo grid bar, while the Cu may be from clusters that were attached to the sample during the transfer.
  • the EELS spectrum further demonstrated that only Re and S characteristic peaks were found, which confirmed the chemical composition of the film.
  • the thickness of the sample was measured to be 0.8 nm by AFM (Table 4).
  • FeSe was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b.
  • the optical image of the monolayer flake is shown in Fig. 3 and the Raman spectrum of the sample confirmed that the as-synthesised flake is FeSe crystal.
  • the two different phases of FeSe are the tetragonal phase ⁇ -FeSe with PbO-structure, and the NiAs-type ⁇ -phase with a wide range of homogeneity showing a transformation from hexagonal to monoclinic symmetry.
  • FeSe is also known to demonstrate superconductivity property.
  • a hexagonal phase of monolayer FeSe was obtained as shown by the high- resolution Z-contrast STEM image of a monolayer region collected in the as-grown FeSe sample.
  • this hexagonal phase viewed along [001] zone axis, maintained a layered structure, which is similar to the 1 H phase observed in MoS 2 .
  • This phase has not been reported for FeSe.
  • the chemical composition was first confirmed by the EDS spectrum of a large flake which only showed the presence of Fe and Se.
  • the EELS spectrum showed that only Fe and Se characteristic core-loss peaks were present. This further confirmed the high purity of the FeSe sample and a new phase of FeSe may have been obtained.
  • the Mo signals were from the Mo TEM grid. The thickness of the sample was measured to be 1.2 nm by AFM (Table 4).
  • PtS 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b.
  • the optical image of PtS 2 is shown in Fig. 3 and the sample was also characterised by Raman spectroscopy.
  • the thickness of the sample was measured to be 1.0 nm by AFM (Table 4).
  • PtSe 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b.
  • the optical image of PtSe 2 is shown in Fig. 3 and the Raman spectrum of PtSe 2 showed the A 1g and E g vibration modes.
  • a PtSe 2 monolayer has the octahedral 1T phase and is able to perform like a semiconductor.
  • the few-layer counterpart demonstrates metallic property due to the strong interlayer interaction.
  • Fig.11 b shows the STEM image of monolayer PtSe 2 in 1T phase, with the corresponding atomic structural model.
  • the patterns obtained by fast Fourier transform further indicated that the 1T phase maintain a hexagonal unit cell.
  • Some holes observed on the samples during STEM characterisation due to irradiation damage from the electron beam) further confirmed the presence of a single monolayer.
  • both the EDS and EELS spectra indicated the characteristic features of Pt and Se, therefore further confirming the chemical composition of the as-synthesised PtSe 2 film. .
  • the thickness of the sample was measured to be 0.9 nm by AFM (Table 4).
  • PdS 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b.
  • the optical image of PdS 2 with hexagonal shapes is shown in Fig. 3.
  • the sample was also characterised by Raman spectroscopy.
  • the thickness of the sample was measured to be 1.5 nm by AFM (Table 4).
  • PdSe 2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b.
  • the optical images of PdSe 2 with hexagonal shapes is shown in Fig. 3.
  • the sample was also characterised by Raman spectroscopy.
  • the thickness of the sample was measured to be 3.0 nm by AFM (Table 4).
  • Example 32 Synthesis and characterisation of MoS 2 xTe 2( i-x ) , MoSe 2x Te 2( i_ X) , WS 2 xTe 2( i-x ) , WSe2xTe 2( i- X) and NbS 2 Se 2(1 -. X)
  • MoSe 0 . 3 Tei. 7 was obtained as follows:
  • Fig. 3 The optical images of the as-synthesised ternary samples are shown in Fig. 3 and the samples were also characterised by Raman spectroscopy.
  • some other representative images of MoS 2 xTe 2 (i-x), MoSe 2 xTe 2(1 -x), WS 2 xTe 2(1 -x ) are shown in Fig. 8a-c, along with the respective Raman spectra in Fig. 8d-f.
  • Example 33 Synthesis and characterisation of Moi_ x Nb x Se 2 , Mo 1 -xRe x S 2 , W 1 - x Nb x S 2 , W 1 - x Nb x Se 2 , Mo x Nbi_ x S 2 and Mo x W ⁇ x Te 2
  • Mo 1 -xNb x Se 2 , Mo 1 -xRe x S 2 , W ⁇ xNbxSa, W 1 - x Nb x Se 2 , Mo x Nb 1 -xS 2 and Mo x W 1 -xTe 2) were synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 2a and 2b.
  • the aluminium oxide boat placed in the center of the quartz tube will contain a mixture of two metal precursors in a weight ratio from 0.01 :1 to 1 :0.01.
  • the optical images of the as- synthesised ternary samples are shown in Fig. 3 and the samples were also characterised by Raman spectroscopy.
  • Fig. 9a The optical image of the as-synthesised sample is shown in Fig. 9a and the corresponding Raman spectrum is shown in Fig. 9b.
  • the quinary TMD was also synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 2a and 2b.
  • Vo.03W02 oo.77SL6Seo.4 can be obtained as follows:
  • Another aluminium oxide boat containing S and Se powder of weight ratio from 1 :10 to 10:1 was placed in the upstream.
  • the furnace was heated with a ramp rate of 50 °C min "1 to the growth temperature (760-840 °C) and held at this temperature for 10-20 min before cooling down to room temperature naturally.
  • Ar/H 2 with a flow rate of 100/5 seem was used as the carrier gas.
  • the optical image of the as-synthesised quinary sample is shown in Fig. 9c and the corresponding Raman spectrum is shown in Fig. 9d.
  • FIG. 16a A STEM image of a quinary V x WyMoi- x - y S 2 zSe2 ( i-z ) monolayer alloy is shown in Fig. 16a, where the chemical composition was verified by the EDS spectrum (Fig. 16b). Different chemical species give rise to the distinct atomic contrast in the image. Combined with the intensity histogram analysis of the cation and anion sites (Fig. 17), each atomic column can be directly associated with their chemical identities using the image contrast, as shown by the representative line intensity profile in Fig. 16c. The atom-by-atom mapping further confirms the successful synthesis of a quinary alloyed monolayer.
  • Example 36 Synthesis and characterisation of 1 T ⁇ 2 -2 ⁇ oTe 2 in-plane heterostructure
  • a mixed powder of 4 mg NaCI and 14 mg M0O 3 in the aluminium oxide boat was placed in the centre of the quartz tube. Another aluminium oxide boat containing Te powder was placed in the upstream.
  • the furnace was heated to a growth temperature of 720 °C with a ramp rate of 50 °C min "1 and held for 3 min, and then quickly cooled to a growth temperature of 650 °C and held for 5 min and then cooled down to room temperature naturally.
  • 1 T MoTe 2 was first synthesised using an Ar/H 2 flow rate of 80/20 seem. This was then followed by the growth of 2H MoTe 2 on the as-synthesised 1 T' MoTe 2 using an Ar/H 2 flow rate of 20/4 seem to obtain the 1 T MoTe 2 -2 H MoTe 2 in-plane heterostructure.
  • Fig. 10a shows the optical image of 1T MoTe 2 -2H MoTe 2 in-plane heterostructure.
  • the shape of 2H MoTe 2 is hexagonal while the shape of 1T MoTe 2 is rectangular.
  • the Raman spectra of corresponding 1T' MoTe 2 and 2H MoTe 2 in the heterostructure confirmed the formation of in-plane heterojunction (Fig. 10b)
  • MoS 2 was synthesised first. A mixed powder of 0.5 mg NaCI and 3 mg Mo0 3 in the aluminium oxide boat was placed in the centre of the tube. Another aluminium oxide boat containing S powder was placed in the upstream. The furnace was heated to the growing temperature (600-800 °C) with a ramp rate of 50 °C min -1 . The growth time was 3 min. Ar (or Ar/H 2 ) with a flow rate of 80 seem (or 80/5 seem) was used as the carrier gas. The as- obtained MoS 2 was quickly transferred to another furnace for heterostructure growth. For the NbSe 2 growth, a mixed powder of 2 mg NaCI and 10 mg Nb 2 0 5 and in the aluminium oxide boat was placed in the centre of the quartz tube.
  • Another aluminium oxide boat containing Se powder was placed in the upstream.
  • the furnace was heated with a ramp rate of 50 °C min "1 to the growth temperature of 700 °C and held at this temperature for 10 min before cooling down to room temperature naturally.
  • Ar/H 2 with a flow rate of 60/4 seem was used as carrier gas.
  • Fig. 20a and b show the upper critical field H cZ -T c phase diagrams, where the superconducting transition temperature T c under different magnetic fields is defined as the temperature at which the resistance drops to 10% of the normal state resistance R .
  • a linear relationship between H c2 and T c (closer to T c ) was observed, which is regarded as a characteristic property of 2D superconductors.
  • the observation of superconductivity in the as-synthesised monolayer NbSe 2 and MoTe 2 represents the realisation of superconductivity in non-ultrahigh-vacuum-grown monolayer materials. Combined with the high mobility of monolayer MoS 2 and ReS 2 (in Example 40), these results indicate the high quality of the as-prepared 2D TMDs.
  • Example 40 Transport measurements of monolayer oS 2 and ReS 2
  • Fig. 21a and b show the l d -V d and l C onduct ty- g of monolayer MoS 2 .
  • the mobility of MoS 2 which is about 30 cm 2 V V 1 can be calculated from Fig. 21b.
  • the on/off ratio is as high as 10 8 , which is similar to the reported result of monolayer MoS 2 using CVD method (Najmaei, S. et al., Nat. Mater., 2013, 12, 754-759).
  • Fig. 21c and d show the l d -V d and l d -V g of monolayer ReS 2 .
  • the mobility of ReS 2 was about 6.5 cmW 1 can be calculated from Fig. 21c and this is similar to the reported result of monolayer ReS 2 using CVD method (Keyshar, K. et al., Adv. Mater, 2015, 27, 4640-4648).
  • Example 41 Melting points of salt and metal precursors mixtures, determined using thermogravimetry and different scanning calorimetry (TG-DSC)
  • Thermogravimetry and differential scanning calorimetry (TG-DSC) measurements were performed using a Netzsch STA 449 C thermal analyser. Approximately 10 mg of the sample were loaded into an aluminium oxide crucible and heated at 10 K min "1 from 20 °C to 920 °C. The 95 vol% Ar/5 vol% H 2 with a flow rate of 40 ml_ min "1 was used as the carrier gas.
  • XRD was carried out using Bruker D8 Advance XRD with a Cu-Ka radiation at 40kV and 40 mA.
  • Nucleation is the first and a key step for the growth of TMD layers.
  • the nucleation density will dominate the geometries of TMD layers.
  • metal oxychlorides like MoCl x O y , WCI x O y , NbCl x O y will be formed.
  • the high volatility nature of metal oxychlorides can result in a higher nucleation rate as compared to those without the use of salts. This was observed experimentally where the use of salt during the synthesis process of ReX 2 , TiX 2 , and WX 2 (X: S, Se, Te) gave large number of nucleation (Fig. 24a, c and e). When no salt was used, almost no nucleus were formed on the substrate (Fig. 24b, d, and f)
  • Fig. 26 shows the growth time of MoS 2 with NaCI and the growth rate was up to 8 ⁇ s "1 (Fig. 26), owing to the high chemical activities of oxychloride during the reaction.
  • the growth rates can be determined from the ratio of the sample size over the growth time.
  • Fig. 25 shows the optical image of MoS 2 and growth rate without NaCI while
  • Fig. 26 shows the optical image of molten-salt-assisted MoS 2 and the relationship between the growth rate and the distance from the center of substrate to the edge of the substrate.
  • MoCI 2 0 2 it was observed that the growth time was ⁇ 3 min.
  • TMD 2D materials with various morphologies can be realised.
  • the parameters can be controlled to form large-size MoS 2 monolayer, continual MoS 2 film and MoS 2 flake with different layers, accordingly.
  • the layer-controlled growth of MoS 2 needs large size nuclei to provide enough source for the layer-by-layer growth, so the distance between the substrate and the MoCVNaCI sources was shortened to 0.6 cm and the carrier gas flow rate was decreased to 60 seem to increase the size of the nucleus. Decreasing the flow rate of carrier gas can make the nuclei surplus so that the nuclei will grow larger.
  • the growth time was increased to 15 min to ensure sufficient time for layer-by-layer growth, considering that the in-plane growth was generally faster than out-of-plane growth.
  • the growth temperature was set at 750 °C. The corresponding optical images are shown in Fig. 28a-c.
  • Fig. 29 to 31 The optical images of different 2D TMDs under different growing conditions are as shown in Fig. 29 to 31 , which indicate the uniformity of the as-synthesised 2D TMDs.
  • Fig. 29a-c show the optical images of MoS 2 and MoSe 2 grown at 750 °C, and MoTe 2 grown at 700 °C.
  • Fig. 29d-f show the optical images of WS 2 , WSe 2 and WTe 2 grown at 800 °C, 810 °C and 820 °C respectively
  • Fig. 29g-i show the optical images of NbS 2 , NbSe 2 and NbTe 2 grown at 780 °C, 790 °C and 800 °C respectively. Due to the rate constant k s >k Se >k Te , TMD 2D films with an increasing thickness can be obtained. Generally, few-layered selenide and telluride compounds can be obtained easily.
  • the optical images of various TMDs grown in various growing temperatures are as shown in Fig. 30a-f at 800 °C, 780 °C, 790 °C, 810 °C, 810 °C and 700 °C, respectively.
  • the thickness of the TMDs can be controlled by varying the temperature. It was observed that monolayer PtSe 2 can be obtained with a higher growing temperature of 815 °C (in Fig. 31a), as compared to 800 °C which gave few- layer PtSe 2 (Fig. 31 b). Similar observation was made for VTe 2 (in Fig. 31 c) in which a monolayer was obtained at a higher temperature of 750 °C, as compared to 700 °C (Fig. 31d).
  • Example 46 Comparison of the properties of Vo.o3Wo.2Moo.77S 1 6 Seo.4 with MoS 2 for catalysing hydrogen evolution reaction (HER)
  • Electrochemical measurements of Vo.o3Wo. 2 Moo.77Si. 6 Seo.4 were carried out using a typical three-electrode cell consisting of a working electrode, a graphite carbon counter electrode and a saturated calomel reference electrode (SCE), with 0.5 M H 2 S0 4 as the electrolyte.
  • the electrochemical cell was connected to an electrochemical workstation (CHI760) coupled with a rotating disk electrode (RDE) system (AFMSRCE3529, Pine Research Instrumentation, USA).
  • a glassy carbon electrode (GCE) covered with catalyst samples was used as the working electrode.
  • Example 47 Properties of MoSe x Te 2 . x containing different ratios of Se to Te
  • the properties of MoSe x Te 2 - x can be adjusted by varying the ratio of Se:Te.
  • Fig. 33 shows the temperature dependence of square resistance of pristine MoTe 2 in comparison with different MoSe x Te 2-x containing different ratios of Se to Te.

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Abstract

The present invention relates to the manufacture of a wide range of two-dimensional transition metal dichalcogenide on a substrate using a salt-assisted chemical vapour deposition method, wherein the metal dichalcogenide is a binary, tertiary, quaternary, or quinary compound. The transition metal in the dichalcogenide compound is preferably titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zinc, zirconium, niobium, molybdynum, cadmium, hafnium, tantalum, tungsten, or rhenium, and the salt used in the method is an alkali metal halide, preferably sodium chloride and potassium iodide.

Description

Synthesis of Atomically-thin Metal Dichalcogenides
Field of Invention This invention relates to a method to synthesise a wide range of two-dimensional transition metal dichalcogenides.
Background The listing or discussion of a prior-published document in this specification should not necessarily be taken as an acknowledgement that the document is part of the state of the art or is common general knowledge.
Two-dimensional transition-metal dichalcogenides (TMDs) have demonstrated interesting physical phenomena, including the quantum spin Hall effect,1,2 valley polarization3,4 and two- dimensional superconductivity,5 suggesting their potential applications for functional devices,6"10 universal band gap engineering and heterogeneous catalysis.11"14 Although 2D TMDs are by far the largest family in the field of 2D crystals, only a limited number of them have been produced, commonly via chemical vapour deposition (CVD).
In the past few years, most of the synthetic work on TMDs has been focused on Group VI MX2 (M: Mo, W; X: S, Se) compounds and more than forty TMDs are left to be explored. Many of them were predicted in theory to possess diverse and novel properties. For example, Group IV TMDs (Ti, Zr and Hf) are predicted to have properties of high mobility and phase transition, while Group V TMDs are predicted to possess ferromagnetic, superconducting and charge density wave effects. In addition, Group VI tellurides are predicted to behave like type-ll Weyl semimetals and topological insulators.
The Mo- and W-based TMDs have been synthesised, typically via sulfurisation15"19, selenisation20"21 and tellurisation22 of metals and metal compounds. Many other TMDs remain inaccessible due to the high melting points and low vapour pressure of the metal precursors (such as oxides of Ti, Zr, Hf, Nb, Ta, W, P and Pd).
Given the potentially useful properties and applications of TMDs, there remains a need to develop an effective and general synthetic method to produce a wide range of 2D TMDs. This will open up opportunities for studying the properties and potential application of a wide variety of 2D TMDs. Other than gaining access to the desired TMDs, there are inherent requirements on what an ideal synthesis method needs to demonstrate. In the first instance, it is important that the method is applicable to a wide range of TMDs and should allow the user to have the flexibility to control the properties of the materials accordingly. The method should also allow the production of high quality (with little or no defects), large size TMDs crystals which are highly desired for practical use.
Summary of Invention It has been surprisingly discovered that the use of salts in combination with a transition metal or metal oxide enables the facile formation of two-dimensional transition metal dichalcogenides. Thus, in a first aspect of the invention, there is provided a process of forming a two-dimensional transition metal dichalcogenide of formula I: MX2 I
where:
M is selected from one or more of the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Cd, Hf, Ta, W, and Re: and
X is selected from one or more of the group consisting of S, Se, and Te, the process comprising the step of depositing the transition metal dichalcogenide of formula I on a substrate by chemical vapour deposition, wherein the vapour deposition is accomplished by: passing a carrier gas through a fluid pathway in a furnace, where the fluid pathway comprises a first temperature zone housing one or more of elemental sulfur, selenium or tellurium and a second temperature zone that houses a substrate above a mixture of one or more metallic precursors and an alkali metal halide, where the wt:wt ratio of the one or more metallic precursors to the alkali metal halide is from 1 :2 to 15:1 , where:
the temperature of the first temperature zone is from 150 to 500°C;
the temperature of the second temperature zone is from 350 to 950°C;
the substrate is from 0.01 to 2.0 cm above the mixture of one or more metallic precursors and the alkali metal halide; and
the one or more metallic precursors are selected from an elemental metal, a metal oxide or a metal halide, where each respective metal is selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Cd, Hf, Ta, W, and Re, wherein the growth rate of the two-dimensional transition metal dichalcogenide of formula I on the substrate is from 0.01 pm/s to 10 pm/s. Embodiments of the first aspect of the invention that may be generally applicable include those in which:
(a) the carrier gas may comprise an inert gas having a flow rate of from 30 to 200 seem and may optionally further comprise hydrogen, the hydrogen having a flow rate of from 1 to 20 seem, optionally the inert gas may be argon and/or nitrogen;
(b) the alkali metal halide may be selected from one or more of the group consisting of NaCI, KCI, LiCI, NaBr, KBr, LiBr, Nal, Kl, and Lil;
(c) the thickness of the deposited transition metal dichalcogenide may be from 1 nm to less than 1 μιη (e.g. from 1 nm to 500 nm);
(d) the process may further comprise laying one or more further layers of a two- dimensional transition metal dichalcogenide of formula I onto a substrate that has already undergone the deposition process described above, optionally wherein the two-dimensional transition metal dichalcogenide of formula I deposited in each further layer is different to the layer on the surface of the substrate;
(e) the wt:wt ratio of the one or more metallic precursors to the alkali metal halide may be from 1.5:1 to 15:1 , such as from 1.5:1 to 5:1 ;
(f) the flow rate of the carrier gas is varied during the process to provide an in- plane heterostructure. In embodiments of the first aspect of the invention, when the transition metal dichalcogenide of formula I is WS2 the temperature of the second temperature zone is from 600 to 670°C, or when the transition metal dichalcogenide of formula I is WSe2 the temperature of the second temperature zone is from 650 to 670°C. In certain embodiments of the invention, the transition metal dichalcogenide of formula I that is formed may be MoS2 or MoSe2. When the process relates to the formation of MoS2, the temperature of the second temperature zone may be from 350 to 800°C (e.g. from 350 to 600°C) and the w wt ratio of the one or more metallic precursors to the alkali metal halide may be from 5:1 to 10:1. When the process relates to the formation of MoSe2, the temperature of the second temperature zone may be from 550 to 900°C (e.g. from 550 to 650°C, such as from 550 to 600°C) and the wt:wt ratio of the one or more metallic precursors to the alkali metal halide may be from 5:1 to 10:1.
In embodiments where the transition metal dichalcogenide of formula I that is formed is MoS2 or MoSe2:
(a) the wt:wt ratio of the one or more metallic precursors to the alkali metal halide may be 6:1 ; and/or (b) the metallic precursor may be Mo03; and/or
(c) the alkali metal halide may be NaCI.
In certain embodiments of the invention, the transition metal dichalcogenide of formula I that is formed may be one selected from the group consisting of PdTe2> PdSe2, PdS2, PtTe2, PtSe2, and PtS2) where the temperature of the second temperature zone in the process may be from 750 to 860°C and the w wt ratio of the one or more metallic precursors to the alkali metal halide may be from 8:1 to 12:1 (e.g. 10:1). In these embodiments, the alkali metal halide may be NaCI. In embodiments where the transition metal dichalcogenide of formula I contains Pd, the metallic precursor may be PdCI2. In embodiments where the transition metal dichalcogenide of formula I contains Pt, the metallic precursor may be PtCI2.
In certain embodiments of the invention, the transition metal dichalcogenide of formula I that is formed may be one selected from the group consisting of HfTe2, HfSe2, HfS2, VTe2, VSe2, VS2) TiTe2, TiSe2, TiS2, NbTe2, NbSe2l NbS2, ZrTe2, ZrSe2, ZrS2, TaTe2, TaSe2, TaS2, MoTe2, and WTe2, where the temperature of the second temperature zone in the process may be from 600 to 860°C and the wt:wt ratio of the one or more metallic precursors to the alkali metal halide may be from 1.6:1 to 4:1. In these embodiments, the alkali metal halide may be NaCI. In embodiments where the transition metal dichalcogenide of formula I contains Hf, the metallic precursor may be Hf. In embodiments where the transition metal dichalcogenide of formula I is selected from V, Ti, Nb, Zr, Ta, Mo, W, the metallic precursor may be a metal oxide of the respective metal.
In certain embodiments of the invention, the transition metal dichalcogenide of formula I that is formed may be one selected from the group consisting of FeS2, FeSe2 or FeTe2, the temperature of the second temperature zone in the process may be from 500 to 850°C (e.g. from 500 to 600°C) and the wtwt ratio of the one or more metallic precursors to the alkali metal halide may be from 4:1 to 6:1 , such as 5:1. In these embodiments, the alkali metal halide may be NaCI and/or LiCI. In embodiments where the transition metal dichalcogenide of formula I contains Fe, the metallic precursor may be a metal oxide (e.g. Fe203) or a metal chloride (e.g. FeCI2).
In certain embodiments of the invention, the transition metal dichalcogenide of formula I that is formed may be an alloy that has the formula II:
AaBbCcDdEeFfGgShSeJej II
where: each of A to G is a different metal selected from one of the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Cd, Hf, Ta, W, and Re;
each of a to g is independently 0 to 0.99 and the sum of a+b+c+d+e+f+g is 1 ; and each of h to j is 0 to 2 and the sum of h+i+j is 2,
provided that at least two of a to g is greater than 0 and/or at least two of h to j is greater than 0. In certain embodiments, the formation of the alloy may be accomplished using a process where the temperature of the second temperature zone is from 600 to 850°C and/or the wt:wt ratio of the one or more metallic precursors to the alkali metal halide is from 5:1 to 7.5:1 , such as 5:1. Suitable transition metal dichalcogenides of formula II that may be formed from the process described above may be selected from the group consisting of MoSe2xTe2(i-x), Mo1-xRexS2, MoS2xTe2(i-x), Moi_xNbxSe2, Moi-xNbxS2, Μοχ ^. xS2ySe2(1.y), WS2xTe2(1.x), WSe2xTe2(1.x), Mo1-xWxTe2, NbS2xSe2(1.x), W1-xNbxS2, W1.xNbxSe2, and VxWyMO(1-x.y)S2zSe2(1.z). It will be appreciated that in each case x, y and z are greater than zero and less than 1.
In a second aspect of the invention, there is provided a transition metal dichalcogenide alloy of formula II:
AaBbCcDdEeFfGgShSeiTej II
where:
each of A to G is a different metal selected from one of the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Cd, Hf, Ta, W, and Re;
each of a to g is independently 0 to 0.99 and the sum of a+b+c+d+e+f+g is 1 ; and each of h to j is 0 to 2 and the sum of h+i+j is 2,
provided that at least two of a to g is greater than 0 and/or at least two of h to j is greater than 0.
In an embodiment of the second aspect of the invention, the transition metal dichalcogenide of formula II may be selected from the group consisting of MoSe2xTe2( .x), Mo1-xRexS2, MoS2xTe2(1-x), Moi-xNbxSe2, Mo1-xNbxS2, MoxNbi-xS2ySe2(1.y), WS2xTe2(i-X), WSe2xTe2(i-x)) Mo1-xWxTe2, NbS2xSe2(1.x)> W1-xNbxS2, W1.xNbxSe2, and VxWyMo(1.x-y)S2zSe2(1.z). It will be appreciated that in each case x, y and z are greater than zero and less than 1.
Brief Description of Drawings
Fig. 1 Depicts the flow chart of the general growth process for the production of TMDs by the chemical vapour deposition method. The growth of 2D TMDs can be classified into four routes based on different mass flux of metal precursor and growth rate. High mass flux of metal precursor offers the opportunity to synthesize large-scale continuous monolayer polycrystalline films with small (route I) or large (route II) domains depending on the growth rate. On the other hand, low mass flux of metal precursor results in discrete single-crystalline monolayers with different sizes. Low growth rate leads to small crystal size with atom clusters decorated in the center and edge of the monocrystal (route III), while high growth rate gives rise to large monocrystals (route IV).
Fig. 2 Depicts: (a) the chemical vapour deposition (CVD) setup for the growth of TMD monolayers; and (b) the expanded view of the aluminium oxide boat 15 and the Si/Si02 wafer 20.
Fig. 3 Depicts the optical images of 47 TMDs synthesized using the method in this application. These include 32 binary 2D crystals, 11 ternary alloys, a quaternary alloy, a quinary alloy, a 1 T MoTe2-2 H MoTe2 in-plane and MoS2-NbSe2 vertically stacked heterostructures.
Fig. 4 Depicts the optical images, Raman and photoluminescence characterisations of MoX2 (X: S, Se and Te): (a, d and g) show the optical image of MoS2, MoSe2 and MoTe2 respectively; (b, e and h) show their respective Raman spectra; and (c and f) show the photoluminescence spectra of MoS2 and MoSe2.
Fig. 5 Depicts the optical images, Raman and photoluminescence characterisations of WX2 (X: S, Se and Te): (a, d and g) show the optical image of WS2, WSe2 and WTe2 respectively; (b, e and h) show their respective Raman spectra; and (c and f) show the photoluminescence spectra of WS2 and WSe2.
Fig. 6 Depicts the optical images and Raman characterisations of TiX2 (X: S, Se and Te): (a, c and e) show the optical image of TiS2, TiSe2 and TiTe2 respectively; and (b, d and f) show their respective Raman spectra.
Fig. 7 Depicts the optical images and Raman characterisations of ZrX2 (X: S, Se and Te): (a, c and e) show the optical image of ZrS2, ZrSe2 and ZrTe2 respectively; and (b, d and f) show their respective Raman spectra.
Fig. 8 Depicts: (a, b and c) the optical images of MoS2xTe2(1.X), MoSe2xTe2(i-X) and WS2xTe2(i. X) respectively; and (d, e and f) the respective Raman spectra. Fig. 9 Depicts: (a and c) the optical images of quaternary alloy M0xNb1-xS2ySe2(i-y) and the quinary alloy VxWyMo1.x.yS2ZSe2(i-Z) respectively; and (b and d) the respective Raman spectra. Fig. 10 Depicts the optical images and Raman characterisations of heterostructures: (a and b) optical image and Raman spectrum of 1 ΜοΤβ2-2Η MoTe2 in-plane heterostructure; (c and d) optical image and Raman spectrum of MoS2-NbSe2 vertically stacked heterostructure.
Fig. 11 Depicts the STEM images and the corresponding fast Fourier transform patterns and atomic structural models of (a) MoS2 in the 1 H phase; (b) PtSe2 in the 1 T phase; (c) WTe2 in the 1 T' phase; and (d) ReSe2 in the 1 T" phase.
Fig. 12 Depicts: (a) the EDS spectrum of MoTe2; (b and c) atomic resolution STEM image and EELS spectrum of 2H MoTe2 respectively; and (d and e) the STEM image and EELS spectrum of 1T MoTe2.
Fig. 13 Depicts: (a) the atomic resolution STEM image of a few-layer WTe2; (b) the EDS spectrum; and (c) the EELS spectrum of WTe2. Fig. 14 Depicts: (a) the atomic resolution STEM image; (b) the EDS spectrum; and (c) the EELS spectrum of TiS2 monolayer.
Fig. 15 Depicts: (a) the atomic resolution STEM image of a few-layer ZrS2; (b) the EDS spectrum; and (c) the EELS spectrum of ZrS2.
Fig. 16 Depicts: (a) STEM image (left) of the quinary monolayer alloy VxWyMoi-x-yS2zSe2(1-z), with the corresponding atomic model from atom-by-atom intensity mapping (right); (b) EDS spectra of the alloyed monolayer, confirming its chemical composition; and (c) line intensity profiles along dashed lines A (representing cation) and B (representing anion) in (a), indicating the different intensity of each chemical species.
Fig. 17 Depicts the intensity histogram of the VxWyMo1-x-yS2zSe2(1.z) quinary alloy monolayer and EELS of the V atoms inside the lattice: (a) STEM image of Fig. 16a with a larger field of view; (b) respective intensity fitting of the cation and anion sites using the Gaussian models. The position of the peak intensity is highlighted with markers; (c and d) intensity histogram of the cation (c) and anion (d) sites. The image intensity of different chemical species maintains a Gaussian distribution that is well separated, giving the ground to the correct assignment of the chemical composition of each atomic columns. The local concentration of each chemical species based on atom counting in this image: cation - V 3.7%, Mo 95.6%, W 0.7%; anion - S 93.6%, Se 6.4%; and (e) EELS of a single atom in the cation site that has the lower intensity, showing the characteristic V L2,3 ionization edge which confirms the presence of V.
Fig. 18 Transport measurements of monolayer NbSe2 and MoTe2 2D crystals: (a and c) temperature dependence of longitudinal resistance Rxx in a zero magnetic field from 300 K to 0.26 K of the monolayer NbSe2 and MoTe2. Inset shows an expanded view of the low- temperature data; (b) temperature dependence of the longitudinal resistance Rxx in different magnetic fields applied perpendicular to the NbSe2 crystal plane; and (d) longitudinal resistance Rxx as a function of magnetic field B at different temperatures for MoTe2.
Fig. 19 Depicts two-dimensional superconductivity in MoTe2: (a) magnetic field dependence of resistance under different tilt angles; and (b) angular dependence of upper critical fields Hc2(d). The inset shows the arrangement of the experimental configuration.
Fig. 20 Depicts temperature dependence of the upper critical field Hc2 of (a) NbSe2; and (b) MoTe2. The solid line is the linear fit to Hc2. Fig. 21 Depicts transport measurements of monolayer MoS2 and ReS2: (a and b) show the respective ld-Vd and lCOnductivity-Vg plots of monolayer MoS2; and (c and d) show the respective ld-Vd and ld-Vg plots of monolayer ReS2.
Fig. 22 Depicts the TG-DSC curves of salts mixed with the metal sources: (a) shows that the melting points of the systems after adding salt are all within the highlighted windows from 600 °C to 850 °C; and (b) shows the thermogravimetry versus time curves.
Fig. 23 Depicts the XPS spectra which reveal the existence of CI bonds to other elements, resulting from the intermediate products during the synthesis of Nb-, Mo- and W-based 2D crystals. XPS spectra of Nb 3d, Mo 3d and W 4 f are shown in (a), (b) and (c), respectively. Nb 3d3'2 and 3d5'2, Mo 3d3'2 and 3d5'2 and W 4f512 and 4fm are the core level energy states of Nb, Mo and W, respectively, all of which are well fitted with Gaussian peaks at energies indicating the bonding to CI. Fig. 24 Depicts the comparison of nucleation of TMD with and without salt: (a, c, and e) show the SEM images of the nuclei during synthesis of ReX2, TiX2, and WX2 with salt promoter; and (b, d, and f) show the SEM images of the nuclei during synthesis of ReX2, TiX2, and WX2 without salt promoter.
Fig. 25 Depicts the optical images of MoS2 and growth rate without NaCI. The inset shows the size evolution of MoS2 single crystal monolayers and the main panel is the fitting results of single crystal size over distance.
Fig. 26 Depicts the optical image of MoS2 and growth rate with NaCI. The inset shows the size evolution of MoS2 single crystal monolayers and the main panel shows the fitting results of single crystal size over distance.
Fig. 27 Depicts the optical images of MoS2 of various morphologies obtained by controlling the nucleation and growth rate. The corresponding weight of MoCVNaCI sources used are: (a) 2mg/0.2mg; (b) 3mg/0.3mg; and (c) 10mg/0.8mg. An increasing weight ratio of salt over M0O3 increases the nucleation density for the growth of MoS2, thus the distribution of mono- layered MoS2 transits from (a) low-density single crystal to (c) a continuous film.
Fig. 28 Depicts the optical images of MoS2 of various thickness obtained by controlling the nucleation and growth rate. Nuclei of different sizes can be obtained by varying distance between the substrate and the MoCVNaCI sources: (a) 1.2 cm; (b) 0.8 cm; and (c) 0.6 cm.
Fig. 29 Depicts (a and b) optical images of MoS2 and MoSe2 grown at 750 °C, and (c) MoTe2 grown at 700 °C; (d, e, and f) optical images of WS2, WSe2l and WTe2 grown at 800 °C, 810 °C and 820 °C respectively; and (g, h, and i) optical images of NbS2, NbSe2 and NbTe2 grown at 780 °C, 790 °C and 800 °C respectively.
Fig. 30 Depicts optical images of some 2D TMDs which show that most of the flakes are monolayer: (a) TiS2 grown at 800 °C; (b) NbS2 grown at 780 °C; (c) NbSe2 grown at 790 °C; (d) PtSe2 grown at 810 °C; (e) WTe2 grown at 810 °C; and (f) MoTe2 grown at 700 °C.
Fig. 31 Depicts the optical images of PtSe2 grown at (a) 815 °C and at (b) 800 °C; and VTe2 grown at (c) 750 °C and at (d) 700 °C.
Fig. 32 Depicts the linear sweep voltammograms of Vo.o3Wo.2Moo.77Si.6Se0.4 in comparison with MoS2, carried out using a typical three-electrode cell consisting of a working electrode, a graphite carbon counter electrode and a saturated calomel reference electrode (SCE), with 0.5 M H2S04 as the electrolyte. Fig. 33 Depicts the temperature dependence of square resistance of various samples of MoSexTe2-x containing different ratios of Se to Te. This shows a transition from semiconductor to metal with a decreasing ratio of Se to Te.
Description
As noted above, the inventors have surprisingly found a generic method to manufacture a wide range of two-dimensional transition metal dichalcogenides (TMDs) in a rapid manner and a low temperature. This process can be used to deposit a monolayer or a few layers of TMD onto a substrate by controlling the weight of the source materials. This process enables TMD crystals having a thickness of from 1 nm to less than 1 pm to be formed expeditiously. Thus, there is provided a process of forming a two-dimensional transition metal dichalcogenide of formula I:
MX2 I
where:
M is selected from one or more of the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Cd, Hf, Ta, W, and Re: and
X is selected from one or more of the group consisting of S, Se, and Te, the process comprising the step of depositing the transition metal dichalcogenide of formula I on a substrate by chemical vapour deposition, wherein the vapour deposition is accomplished by: passing a carrier gas through a fluid pathway in a furnace, where the fluid pathway comprises a first temperature zone housing one or more of elemental sulfur, selenium or tellurium and a second temperature zone that houses a substrate above a mixture of one or more metallic precursors and an alkali metal halide, where the wt.wt ratio of the one or more metallic precursors to the alkali metal halide is from 1 :2 to 15:1 , where:
the temperature of the first temperature zone is from 150 to 500°C;
the temperature of the second temperature zone is from 350 to 950°C;
the substrate is from 0.01 to 2.0 cm above the mixture of one or more metallic precursors and the alkali metal halide; and
the one or more metallic precursors are selected from an elemental metal, a metal oxide or a metal halide, where each respective metal is selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Cd, Hf, Ta, W, and Re, wherein the growth rate of the two-dimensional transition metal dichalcogenide of formula I on the substrate is from 0.01 μηΊ/s to 10 μιτι/s.
When used herein, the word "comprising" may be interpreted as requiring the features mentioned, but not limiting the presence of other features. Alternatively, the word "comprising" may also relate to the situation where only the components/features listed are intended to be present (e.g. the word "comprising" may be replaced by the phrases "consists of or "consists essentially of). It is explicitly contemplated that both the broader and narrower interpretations can be applied to all aspects and embodiments of the present invention. In other words, the word "comprising" and synonyms thereof may be replaced by the phrase "consisting of or the phrase "consists essentially of or synonyms thereof and vice versa.
It will be appreciated that the TMDs formed using this process may relate to materials containing a single metal and a single chalcogenide (e.g. TaS2), but also enables the formation of any suitable alloy (e.g. TaSo.8Se0.2, Hfo.3Tao.7S2, Fe0.3Vo.3Pto.4So.5Seo.2Teo.3)> where the alloy may contain up to six metals and multiple chalcogenides (i.e. S, Se, Te).
The term "houses" when used herein may refer to material(s) deposited directly onto a particular region of the fluid pathway, or it may refer to the use of a suitable container/vessel that contains the desired material(s) situated within a particular region of the fluid pathway.
As noted above, the process relies on the use of a furnace having a fluid path through it. This fluid path may be created by any suitable means, such as the use of a quartz/glass tube of a suitable diameter to enable the positioning of the substrate, a first boat (containing the chalcogenide(s) may be placed upstream of the substrate and a second boat may be placed beneath the substrate and containing the metal source(s) and alkali metal halide. The furnace is also adapted to provide two separate temperature zones. The first temperature zone is upstream of the second temperature zone and houses the first boat, which contains the chalcogenide(s), the second temperature zone is downstream from the first temperature zone and houses the substrate and second boat, which boat contains the metal precursor and alkali metal halide. The first temperature zone is heated up to and maintained at a temperature capable of vaporising the chalcogenide(s), such a temperature may be from 150 to 500°C. The second temperature zone is heated up to and maintained at a temperature of from 350 to 950°C in order to vaporise the metal source. In operation, a carrier gas is passed through the fluid path and first comes into contact with the first boat and vaporised chalcogenide(s). The vaporised chalcogenide(s) is then carried to the second temperature zone by the carrier gas where it mixes with the vaporised metal and forms a deposited TMD on the surface of the substrate. The carrier gas exits through an outlet and it may still contain traces of the chalcogenide(s), metal source/metal and alkali metal salts. The carrier gas may be any suitable gas for chemical vapour deposition. In certain embodiments, there may be a single carrier gas and in others there may be more than one. When there is a single carrier gas, the gas is suitably an inert gas, such as nitrogen or argon. When there is more than one carrier gas the gas may be made from a mixture of an inert gas (e.g. nitrogen and/or argon) and hydrogen gas. The flow rate of the inert gas, whether used alone or in combination is from 30 to 200 standard cubic centimetres per minute (seem), such as from 60 to 120 seem. The flow rate of the hydrogen gas is independently from 1 to 20 seem (e.g. from 5 to 20 seem, such as 10 to 15 seem). As will be appreciated, it may be advantageous to remove oxygen from the fluid pathway before the process is conducted. This may be achieved purging the system with a stream of the carrier gas (or at least the inert gas) for a period of time (e.g. 5 minutes to 1 hour). Alternatively the fluid pathway may be purged by applying a vacuum to the fluid pathway to remove the gas present and then allowing the carrier gas (e.g. an inert gas) to flow into the pathway, which steps may be repeated a suitable number of times (e.g. 3 to 5 times). As noted herein, it is possible to obtain an in-plane heterostructure (i.e. a single layer of material on the substrate made of a single transition metal dichalcogenide in two or more phases (e.g. from 2 to 5, such as 2 to 4, such as 2 to 3 phases). In order to obtain such heterostructures, the flow rate of the carrier gas(es) may be varied during the deposition of the transition metal dichalcogenide in order to provide different phases of material. As an example of such a process, an in-plane heterostructure of MoTe2 was obtained by first using a flow rate of 80 seem Ar and 20 seem H2 to deposit MoTe2 in the 1T phase, followed by changing the flow rate in the same deposition run to 20 seem Ar and 4 seem H2 to deposit MoTe2 in the 2H phase. The substrate may be any suitable substrate. A typical example of a substrate (but not limited thereto) is a silicon substrate. The substrate is placed above the boat containing the metal source and alkali metal salt. In order to ensure that there is a flow path for the carrier gas between the substrate and the second boat (i.e. second mixture) a gap of from 0.01 to 2.0 cm is used (e.g. 0.1 to 2.0 cm, such as 0.5 cm to 1.9 cm, such as 0.7 to 1.5 cm). When used herein, the term "boat" refers to any suitable vessel for holding the chalcogenide(s), metal source/metal and alkali metal salts that is capable of surviving the temperatures used in the process. The resulting thickness of the deposited TMD may be from 1 nm to 1 pm (e.g. 1 nm to 500 nm) on the surface of the substrate. That is, the layer of deposited TMD material may be a monolayer (e.g. 1 nm thick) or may be formed from several layers of the same TMD stacked on top of one another. The thickness of the layer deposited may be controlled by the reaction time and the amount of material provided. As will be appreciated, it is possible to repeat the process outlined above using the newly-coated substrate as the substrate, in which case a second TMD may be deposited on the first TMD deposition, which can be repeated any number of times. This second (and subsequent) deposition may deposit the same TMD as already on the surface of the substrate (e.g. if there is a need for a particularly thick coating of said TMD), but may particularly facilitate the formation of a heterostructure, where each TMD layer deposited is in contact with a TMD that is different to it (e.g. all TMD layers are distinct or a second TMD layer may be sandwiched between a first and third TMD layer, where the first and third TMD layers are the same TMD, while the second TMD layer is a different material (e.g. substrate/WS2/HfSe2 WS2)). As noted above, the processing conditions outlined above enable the formation of the TMDs at a fast rate on the surface of the substrate once the deposition has been initiated. That is, the growth rate may be from 0.01 pm/s to 10 pm/s (e.g. from 0.05 pm/s to 10 pm/s, such as, more particularly, from 1 pm/s to 10 pm/s, such as from 2.5 to 7.5 pm/s), which allows TMDs having a size of from 5 pm to 1 ,000 pm to be grown quickly on the surface of the substrate. Indeed, growth time needed for many of the TMDs may be less than 30 seconds. Examples of TMDs produced under the conditions above that may be produced in less than 30 seconds include, but are not limited to, MoS2, MoSe2, MoTe2, WS2, WSe2, WTe2, VS2, VSe2, ReS2, ReSe2, TiS2, TiSe2, TaS2, TaSe2, NbS2 and NbSe2. The one or more metallic precursors are selected from an elemental metal, a metal oxide or a metal halide. The oxides and chlorides mentioned herein may be non-stoichiometric or, more particularly, stoichiometric in nature. Particular non-stoichiometric compounds that may be mentioned herein are iron and tungsten oxides. An advantage of the currently disclosed process is that the temperatures needed to heat the metal source may be significantly below those conventionally used. As such, in certain embodiments of the invention, when the desired transition metal dichalcogenide is WS2 the temperature of the second temperature zone may be from 600 to 670°C. Alternatively, when the transition metal dichalcogenide is WSe2 the temperature of the second temperature zone may be from 650 to 670°C. Particular embodiments for other TMDs and their associated alloys are provided below.
It will be appreciated that any suitable alkali metal salt (or mixture thereof) may be used in the process disclosed here. Examples of suitable alkali metal salts include, but are not limited to, NaCI, KCI, LiCI, Nal, KBr, LiBr, NaBr, Kl, Lil and mixtures thereof. In the process, the wt:wt ratio of the one or more metallic precursors to the alkali metal halide may be from 1 :2 to 15:1, such as from 1.5:1 to 15:1 , from 1.6:1 to 13:1 , from 4:1 to 10:1 , from 5:1 to 8:1, such as 6:1. Other suitable ratios are presented in the experimental section and below.
When the process above is used to make the transition metal dichalcogenide MoS2, the temperature of the second temperature zone may be from 350 to 800°C (e.g. from 350 to 600°C, such as from 350 to 500°C) and the wt:wt ratio of the one or more metallic precursors to the alkali metal halide may be from 5:1 to 10:1 (e.g. 6:1). When the process above is used to make the transition metal dichalcogenide MoSe2, the temperature of the second temperature zone may be from 550 to 900°C (e.g. from 550 to 650°C, such as from 550 to 600°C) and the wt:wt ratio of the one or more metallic precursors to the alkali metal halide may be from 5:1 to 10:1 (e.g. 6:1 ).
When the process above is used to make the transition metal dichalcogenides MoS2 or MoSe2, the metallic precursor may be a molybdenum oxide (e.g. Mo03). In addition, while any suitable alkali metal salt may be used, a particular alkali metal salt that may be mentioned in these processes is NaCI.
When the process above is used to make the transition metal dichalcogenides PdTe2, PdSe2, PdS2, PtTe2, PtSe2, and PtS2, the temperature of the second temperature zone may be from 750 to 860°C and the wt:wt ratio of the one or more metallic precursors to the alkali metal halide is from 8:1 to 12:1. In these processes, the wt.wt ratio of the one or more metallic precursors to the alkali metal halide may be 10:1 and/or the alkali metal halide may be any suitable salt, such as NaCI. In addition, a suitable metallic precursor for Pd may be PdCI2 and a suitable a suitable metallic precursor for Pd may be PtCI2. The process described herein may be used to make a transition metal dichalcogenide that is selected from the group consisting of HfTe2, HfSe2, HfS2, VTe2, VSe2, VS2, TiTe2, TiSe2, TiS2, NbTe2, NbSe2, NbS2, ZrTe2, ZrSe2, ZrS2) TaTe2, TaSe2, TaS2, MoTe2, and WTe2, where the temperature of the second temperature zone may be from 600 to 860°C and the wt:wt ratio of the one or more metallic precursors to the alkali metal halide (e.g. NaCI) may be from 1.6:1 to 4:1. In particular embodiments of these processes, the metal Hf may be used as the precursor for TMDs containing Hf, while for each of V, Ti, Nb, Zr, Ta, Mo and W the metallic precursor may be a metal oxide.
The process described herein may be used to make a transition metal dichalcogenide that is FeS2, FeSe2 or FeTe2, where the temperature of the second temperature zone is from 500 to 850°C (e.g. from 500 to 600°C) and the w wt ratio of the one or more metallic precursors to the alkali metal halide (e.g. NaCI and/or LiCI) is from 4:1 to 6:1 , such as 5:1. The metallic precursor for Fe may be a metal oxide (e.g. Fe203 or a non-stoichiometric oxide) or a metal chloride (e.g. FeCI2).
As discussed above, the process disclosed herein may be used to manufacture a transition metal dichalcogenide that is an alloy of formula II:
AaBbCcDdEeFfGgShSe ej II
where:
each of A to G is a different metal selected from one of the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Cd, Hf, Ta, W, and Re;
each of a to g is independently 0 to 0.99 and the sum of a+b+c+d+e+f+g is 1 ; and each of h to j is 0 to 2 and the sum of h+i+j is 2,
provided that at least two of a to g is greater than 0 and/or at least two of h to j is greater than 0. In embodiments relating to alloy formation, the wt:wt ratio of the one or more metallic precursors to the alkali metal halide may be from 5:1 to 7.5:1 , such as 5:1 and/or the temperature of the second temperature zone may be from 600 to 850°C. As will be noted, there may be up to six metals and three chalcogenides in the alloy.
Particular alloys that may be made using the above process include, but are not limited to alloys selected from the group consisting of MoSe2xTe2(1-X), Mo1-xRexS2, MoS2xTe2(1.x), Mo1-xNbxSe2, Mo1-xNbxS2, MoxNbl-xS2ySe2(1.y), WS2xTe2(1.x), WSe2xTe2(i-x), Mo1-xWxTe2, NbS2xSe2(1-x), W1-xNbxS2, W1-xNbxSe2, and VxWyMo(1-x.y)S22Se2(1-z). It will be appreciated that x, y and z are greater than 0 and less than 1. Also disclosed herein are transition metal dichalcogenide alloy of formula II per se, which are as defined above. These alloys may have particularly good catalytic properties compared to other materials. The invention will now be further described by reference to the following non-limiting examples. Examples
Fig. 1 shows a flow chart of the general growth process for the production of TMDs by the chemical vapour deposition method, based on the competition between mass flux of metal precursors and reaction rate of the domains.
The mass flux determines the amount of metal precursors involved in the reaction for the formation of nucleus and the growth of domains, while the growth rate dominates the grain size of the as-grown films. At high mass flux, low growth rate results in monolayer polycrystalline film (Route I) with small grain, and high growth rate tends to form continuous monolayer films with large grain (up to millimeter size, Route II) (Dumcenco, D. et al. ACS Nano, 2015, 9, 4611-4620). On the other hand, at low mass flux, low growth rate leads to form small flakes. Tiny nucleus are often observed at the center of the flakes (Li, B. et al. Angew. Chem. Int. Edit, 2016, 55, 10656-10661 ), suggesting that the extra adatoms or atom clusters will consistently attach to an existing nucleus or the edge during the growth (Route III), while high reaction rate prefers to produce individual large single crystalline 2D monolayer (Route IV) (Gong, Y. J. er a/. Adv. Func Mater., 2016, 26, 2009-2015).
Unfortunately, for many TMDs, such as Nb, Pt and Ti based ones, it is very difficult to produce them because their metal or metal oxides precursors have high melting points and low vapor pressure, which leads to very low mass flux and therefore limits the occurrence of the reaction. It has been surprisingly found that the use of a molten salt mixture can increase the mass flux by reducing the melting point of the metal precursors and forming oxyhalides (e.g. oxychlorides) via reaction with some of the metal/metal oxide of the precursor, which helps to facilitate the desired reactions.
Materials and Methods
General procedure for synthesis of the 2D TMDs The setup of the reaction is shown in Fig. 2a with an expanded view of the middle section shown in Fig. 2b. The 2D compounds and heterostructures were synthesised in a quartz tube 10 having a 1 inch (2.54 cm) diameter and a length of approximately 70 cm. The length of the furnace was about 36 cm. A carrier gas 35 (e.g. mixture of H2/Ar gas) was used, with the direction of gas flow as shown in Figs. 2a and b. An aluminium oxide boat 15 with dimensions of about 8 cm x 1 .1 cm x 1.2 cm, containing a mixture of precursor powder 25 and salt 45, was placed in the center of the tube 10. A Si substrate 20 with a 285 nm top layer of Si02 was placed on boat 15 with the polished surface down; the distance between the sources and substrate was set at a distance of from 0.2 cm to 1.2 cm. Another aluminium boat (of similar dimension) containing S or Se or Te powder 30 was placed on the upstream (upwind) of the tube furnace at 200 °C, 300 °C and 450 °C, respectively. The distance between the S or Se or Te boat 30 and the precursor boat was about 18 cm, 16 cm and 15 cm, respectively. The heating rate of all reactions was 50 °C min"1. All the reactions were carried out at atmospheric pressure. The temperature was cooled down to room temperature naturally. All reaction materials were bought from Alfa Aesar with a purity of more than 99%. The synthesis conditions and parameters for each compound made are summarised in Tables 1-
2.
The weight ratio between salt and metal precursor(s), or the weight ratio between the different metal precursors or chalcogenides (for alloys) can be tuned in accordance with the needs of the starting materials and/or desired properties of the final TMDs. Taking Mo^Re^ and WSxTe2-x as examples, by tuning the ratio between Mo and Re, and between S and Te, it is possible to control the value of x. Optical imaging, Raman and photoluminescence spectroscopy
Raman measurements were performed on a WITEC alpha 200R Confocal Raman system, with an excitation laser of 532 nm and with a laser power of less than 1 mW. Prior to Raman characterisation of the samples, the system was calibrated against a silicon standard with a Raman peak centered at 520 cm"1. The laser powers are less than 1 mW to avoid overheating of the samples. Photoluminescence measurements were also performed on the same system. The optical images of the as-synthesised samples were obtained using a light microscope. Fig. 3 shows the optical images of 47 TMDs synthesised using the general method above from Ti to Pt, in which various morphologies including triangles, hexagons, ribbons and films can be observed. The TMDs synthesised include 32 binary 2D crystals, 11 ternary alloys, a quaternary alloy, a quinary alloy and a 1 T MoTe2-2 H MoTe2 in-plane and MoS2- NbSe2 vertically stacked heterostructures.
All of the materials display a purple color because they were directly grown on 285 nm Si02. The size of the 2D TMDs can reach as large as one millimeter in the case of MoS2, WS2 and WSe2. It is notable that ΊΠ-, Nb-, V-, Fe-, Zr-, Pd-, Hf-, Ta- and Pt-based TMDs have rarely been synthesised before.
Scanning Transmission Electron Microscopy (STEM), Energy-Dispersive X-ray Spectroscopy (EDS) and Electron Energy Loss Spectroscopy (EELS).
STEM samples were prepared with a poly(methyl methacrylate) (PMMA)-assisted method or PMMA-free method with the assistance of an iso-propyl alcohol droplet. For some water- sensitive materials, we used a non-aqueous transfer method. STEM imaging and EELS analysis were performed on a JEOL 2100 F with a cold field-emission gun and an aberration corrector (the DELTA corrector) operating at 60 kV. A low-voltage modified Gatan GIF Quantum spectrometer was used for recording the EELS spectra. The inner and outer collection angles for the STEM image (β1 and β2) were 62 mrad and 129-140 mrad, respectively, with a convergence semi-angle of 35 mrad. The beam current was about 15 pA for the annular dark-field (ADF) imaging and the EELS chemical analyses. EDS analyses were also carried out using the same instrument.
The atomic structures and chemical compositions of the as-synthesised 2D crystals and compounds can be further revealed by these techniques. Most 2D crystals in the metal chalcogenide family maintain a chemical stoichiometry of MX2 (M=metal, X = chalcogen) with an X-M-X structure, where the layer of the metal atoms is sandwiched by the other two chalcogen layers.
The atomic structures of most 2D crystals can be classified into four types: (1 ) the trigonal prismatic 1 H phase; (2) the undistorted 1 T phase with the metal atom located at the centre of an octahedral unit; (3) the one-dimensional distorted 1 T phase (called the 1 T' phase), in which pairs of metal atoms move closer to each other perpendicularly, resulting in a quasi- one-dimensional chain-like structure consisting of distorted octahedral units; and (4) and the two-dimensional distorted 1 T phase (called the 1 T" phase), in which four nearby metal atoms move closer to each other to form a new unit cell, producing repeatable diamond-like patterns. As the image intensity in Z-contrast STEM imaging is directly related to the atomic number of the imaged species, the structural phase of each synthesised material can be determined by the Z-contrast STEM image. A summary of different phases for the as-synthesised 2D materials that have been examined is shown in Table 3.
Notably, the 2D TMDs for group IV and X metals were observed to be highly sensitive to water and oxygen under ambient conditions, thus, they were easily oxidised during the transfer process before they were characterised structurally. As such, there are some missing data points due to the difficulties in characterising the TMDs, including the degraded samples.
X-ray Photoelectron Spectroscopy (XPS)
XPS measurements were performed using a monochromated Al Ka source (hv = 1486.6 eV) and a 128-channel mode detection Physical Electronics Inc. original detector. XPS spectra were acquired at a pass energy of 140 eV and a take-off angle of 45°.
Atomic Force Microscopy (AFM) AFM measurements on the thickness of the TMDs were carried out using the Asylum Research, Cypher S system. During the measurement, some dots were often found on the surface on the AFM images due to the oxidation of some of the TMDs. Given this, the thickness morphology of some of the TMDs was also confirmed using STEM. Reference to the methodology involving the AFM step heights and identifying layer thicknesses can be found in Shearer, C. J., et al., Nanotechnology, 2016, 27, 125704.
The AFM images and the corresponding thicknesses of the 2D TMDs were measured. All the sulphides except PdS2 were found to be monolayer. In comparison to sulfides, only some selenides such as MoSe2, WSe2, NbSe2, VSe2, PtSe2 and ReS2 were confirmed as monolayer crystals. For the tellurides, monolayer WTe2 and MoTe2 were obtained easily, which were confirmed by the AFM images and STEM results. As a comparison, other few- layer tellurides such as Ti-, V-, Nb-, Zr-, and TaTe2 were obtained.
Some TMDs like TiSe2, HfSe2, ZrSe2, and TaSe2 were easily oxidised as observed from the AFM images which often showed dots found on the surface of the materials. Given this, the AFM images cannot accurately reveal the information on the precise thickness. Fortunately, this can be distinguished from the STEM results which showed that the monolayer zone was often found.
A summary of the sample thickness for the as-synthesised 2D materials that have been examined is shown in Table 4.
Synthesis Conditions and summaries of phases/thicknesses of resulting products
Table 1a depicts the synthesis conditions and parameters for the 32 binary compounds (based on transition metals Ti, Zr, Hf, V, Nb, Ta, Mo, W, Re, Pt, Pd and Fe) obtained from initial studies, while Table 1b depicts the synthesis conditions and parameters obtained after repeated studies.
Table 2a depict the synthesis conditions and parameters for the 13 alloys (including 11 ternary, one quaternary and one quinary) obtained from initial studies, while Table 2b depicts the synthesis conditions and parameters obtained after repeated studies.
The phases of the 2D TMD samples examined by high-resolution STEM is summarised in Table 3, while the thickness of the samples examined by AFM is summarised in Table 4.
Table 1a. Synthesis conditions and parameters for 32 binary TMD obtained from initial studies
Figure imgf000022_0001
Figure imgf000023_0001
Figure imgf000024_0001
Figure imgf000025_0001
Figure imgf000026_0001
Table 1b. Synthesis conditions and parameters for 32 binary TMD obtained after repeated studies
Figure imgf000027_0001
Figure imgf000028_0001
Figure imgf000029_0001
Figure imgf000030_0001
Table 2a. Synthesis conditions and parameters for the13 alloys obtained from initial studies.
Figure imgf000030_0002
Figure imgf000031_0001
Figure imgf000032_0001
Figure imgf000033_0001
Table 3. Summary of the phases of the 2D TMD samples examined by high-resolution STEM
Figure imgf000034_0001
Table 4. Summary of the thickness of the 2D TMD samples examined by AFM
Figure imgf000034_0002
Example 1. Synthesis and characterisation of MoS2
MoS2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. A large MoS2 single crystal with a size up to 1.2 mm was synthesised with corresponding photoluminescence (PL) peak at 675 nm (Fig. 4a and c). The Raman spectrum of the monolayer MoS2 crystal shows the distance between the two peaks to be about 19 nm, indicating the monolayer nature of the MoS2 crystal (Fig. 4b). Fig. 11a shows the STEM image of monolayer MoS2 in 1 H phase, with the corresponding atomic structural model. The patterns obtained by fast Fourier transform further indicate that the 1 H phase maintains a hexagonal unit cell. In addition, the thickness of the monolayer was measured to be 0.7 nm by AFM (Table 4). Example 2. Synthesis and characterisation of MoSe2
MoSe2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. A MoSe2 single crystal with a size up to 1.0 mm was synthesised (Fig. 4d) and the PL spectrum is shown in Fig. 4f. The Raman spectrum of MoSe2 shows a A1g peak at 249 cm"1, which is in agreement with previous report (Fig. 4e) (Gong, Y. J. et al., Adv. Fund. Mater., 2016, 26, 2009-2015).
The as-synthesised MoSe2 was determined to be in 1 H phase by STEM and the thickness was measured to be 0.7 nm by AFM (Tables 3 and 4 respectively).
Example 3. Synthesis and characterisation of MoTe2
MoTe2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1b. In comparison with MoS2 and MoSe2, MoTe2 has two phases which are 2H and 1T\ The synthesis of the few-layer 2H- and 1T- MoTe2 films have been reported by tellurisation of the Mo or Mo03 film (Zhou, L. et al., J. Am. Chem. Soc, 2015, 137, 11892-11895; Park, J. C. er a/., ACS Nano, 2015, 9, 6548-6554). The monolayer 1T MoTe2 crystal with a size smaller than 10 pm was also obtained by a similar method (Naylor, C. H. ef al., Nano Lett., 2016, 16, 4297-4304). However, using the method as disclosed in this application, the synthesis of a large-size MoTe2 monolayer film of up to 150 μιτι was achieved and was characterised by Raman spectroscopy (Fig. 4g and h). More importantly, the growth of 2H- and 1T- MoTe2 can be controlled by varying the amount of Te sources (this is described in detail in Example 36, which relates to the synthesis of 1T MoTe2 - 2H MoTe2 in-plane heterostructures).
The as-synthesised MoTe2 thin film has 1T and 2H phases, which should show semiconducting and semi-metallic behaviour, respectively. Fig. 12a shows the EDS spectrum of MoTe2 thin film where the signals due to Te and Mo elements were observed strongly, therefore confirming the high purity of MoTe2.The Au signals appear to be from the Au TEM grid bars and signals for Cu may come from the contaminations during the samples transfer. This confirms the high purity of the as-synthesised MoTe2.
The high-resolution Z-contrast STEM images of few-layer 2H and 1 MoTe2 are shown in Fig. 12b and d, respectively. A hexagonal crystal structure of the 2H phase MoTe2 was observed which confirms the AA' structure (Fig. 12b). It is evident that the atomic structure of few-layer MoTe2 in 1 phase is different from the 2H phase (Fig. 12d).
The EELS spectrum of 2H phase MoTe2 is different from that of 1T phase MoTe2, in which an additional small pre-peak at around 30 eV was observed for the 1Γ phase (Fig. 12c and e). This may be caused by different Mo-Te chemical bonding in the 2H and 1T phases, which can be used as a "fingerprint" for differentiating these two phases. The thickness of the monolayer was measured to be 0.8 nm by AFM (Table 4).
Example 4. Synthesis and characterisation of WS2
WS2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1b. The synthesis of WS2 monolayer has been reported by CVD method. However, large size WS2 was usually obtained with long-time growth at high temperature of 900 to 1100 °C (Rong, Y. M. et a/. Nanoscale, 2014, 6, 12096-12103). Using the method disclosed in this application, WS2 monolayer as large as 0.5 mm was achieved in a short time of 3 min and at a reduced temperature (Fig. 5a). The Raman spectrum and PL peak (at 635 nm) of the monolayer are shown in Fig. 5b and c.
The as-synthesised WS2 was determined to be in 1 H phase by STEM and the thickness was measured to be 0.8 nm by AFM (Tables 3 and 4 respectively).
Example 5. Synthesis and characterisation of WSe2
WSe2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. The synthesis of a large-size monolayer WSe2 crystal was achieved as shown in Fig. 5d and the corresponding Raman spectrum of the monolayer crystal (Fig. 5e) is consistent with values in previous report (Huang, J. K. er a/., ACS Nano, 2014, 8, 923-930). The peak of the PL spectrum at -760 nm suggests that the WSe2 is a monolayer (Fig. 5f).
The as-synthesised WSe2 was also characterised by STEM and determined to be in 1 H phase, while the thickness was measured to be 0.9 nm by AFM (Tables 3 and 4 respectively). Example 6. Synthesis and characterisation of WTe2
WTe2 was synthesised in accordance to the above general procedure with the growth conditions and parameters in Tables 1a and 1 b. Monolayer and bilayer of WTe2 with size up to 600 μιη was synthesised (Fig. 5g), and the Raman spectra of monolayer shown in Fig. 5h is in agreement with previous report. WTe2l a semimetal, is only stable in 1T phase (usually called 1Td phase in bulk due to the small misalignment in stacking) in nature. Tungsten chains are formed within the dichalcogenide layers along the a axis of the unit cell, making the compound structurally one dimensional. Fig. 11 c shows the STEM image of monolayer WTe2 in 1T phase with the corresponding atomic structural model. The patterns obtained by fast Fourier transform further indicate that the lT phase forms a rectangular unit cell owing to one-dimensional metal-pair distortion.
In addition, Fig. 13a shows the STEM image of the as-grown WTe2 in the 1T phase, where the chain-like structure can still be observed. The EDS and EELS spectra in Fig 13b and c respectively further confirm the chemical composition and purity of the WTe2 sample. The thickness of the sample was measured to be 0.7 nm by AFM (Table 4).
Example 7. Synthesis and characterisation of TiS2
TiS2 was synthesised in accordance to the above general procedure with the growth conditions and parameters in Tables 1a and 1 b. The synthesis of a monolayer TiS2 with a size of up to 50 μιτη was achieved (Fig. 6a). The Raman peaks located at 230 cm"1 and 332 cm"1 are the same as the reported result, confirming that the flakes are TiS2 (Fig. 6b).
TiS2 is a semimetal with a small band gap opening when thinned down to few layers, and it maintains the 1T structure which belongs to the space group P3m1 with a crystal lattice of a= 3.4071 A, c=5.6953 A. Fig. 14a shows the STEM image of the TiS2 layers, revealing the 1T phase with the hexagonal crystal structure. The EDS and EELS spectra are shown in Fig. 14b and c respectively, which further confirm the chemical composition of the as-synthesised TiS2. The thickness of the sample was measured to be 0.9 nm by AFM (Table 4).
Example 8. Synthesis and characterisation of TiSe2 TiSe2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. A few-layer TiSe2 with a size up to 30 pm was synthesised, with Raman peaks located at 190 cm"1 and 250 cm"1 corresponding to the A1g mode and E g mode of TiSe2 respectively (Fig. 6c and d). The thickness was measured to be 2.0 nm by AFM (Table 4).
Example 9. Synthesis and characterisation of TiTe2 TiTe2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1b. A TiTe2 ultra-thin film was synthesised (Fig. 6e). The Raman peaks locating at ~90 cm"1, 120 cm"1, and 140 cm"1 are in agreement with the reported result, in which the latter two peaks correspond to the vibration of A1g and Eig respectively (Fig. 6f). The thickness was measured to be 5.0 nm by AFM (Table 4).
Example 10. Synthesis and characterisation of ZrS2 ZrS2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1b. A monolayer ZrS2 of size up to 30 pm was synthesised (Fig. 7a). The Raman spectrum of ZrS2 is shown in Fig. 7b, with a Raman peak locating at 305 cm"1 corresponding to A2u vibration. ZrS2 crystal is a semiconductor with crystal constants a = b = 3.66 A and c = 5.82 A. The atomic structure of a monolayer ZrS2 consists of S-Zr-S sandwich structure in the octahedral 1T phase. Fig. 15a shows a STEM image of a few-layer ZrS2 crystal. Hexagonal arrangement of atoms was observed in the projected view, an evidence of the presence of 1T phase. It is noted that Zr-based compounds are highly sensitive to the ambient conditions. The image shown here is a few-layer ZrS2 film covered by substantial amount of oxidised residual. The corresponding EDS and EELS spectra (Fig. 15b and c respectively) show the Zr and S signal, which confirms the chemical composition of the as-synthesised ZrS2 flakes. In addition, the thickness of the monolayer was measured to be 1.0 nm by AFM (Table 4). Example 11. Synthesis and characterisation of ZrSe2
ZrSe2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1b. A ZrSe2 monolayer was synthesised as shown in Fig. 7c. The corresponding Raman intensity of the monolayer ZrSe2 shown in Fig. 7d is weaker than that in bulk ZrSe2. In addition, the thickness of the monolayer was measured to be 2.0 nm by AFM (Table 4).
Example 12. Synthesis and characterisation of ZrTe2
ZrTe2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. The optical image of ZrTe2 is shown in Fig. 7e and the Raman spectrum confirms that the flake is ZrTe2 crystal (Fig. 7f). In addition, the thickness of the monolayer was measured to be 2.0 nm by AF (Table 4).
Example 13. Synthesis and characterisation of HfS2
HfS2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. The optical image of HfS2 is shown in Fig. 3. The as- synthesised HfS2 was also characterised by Raman spectroscopy in which the A1g vibration mode is in agreement with the reported result.
The as-synthesised HfS2 was characterised by STEM and was determined to be a semiconductor in octahedral 1T phase with van der Waals interaction between the layers. This is similar to the structure of ZrS2 since both Zr and Hf are group IVB elements. HfS2 is not stable in air, which therefore restricts the structural characterisation of the HfS2 atomic layers. The STEM images of the as-synthesised HfS2 flake showed that it was heavily oxidised and this made the identification of the exact atomic structure challenging. However, the EDS spectrum showed strong Hf and S signals. Together with the corresponding EELS spectrum, which also showed the Hf and S EELS fingerprints spectra, it was confirmed that the flakes should be the HfS2 crystal, before they were oxidised.
In addition, the thickness of the monolayer was measured to be 1.0 nm by AFM (Table 4).
Example 14. Synthesis and characterisation of HfSe2 HfSe2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. A HfSe2 monolayer of around 15 m was synthesised and the optical image is shown in Fig. 3. It was also characterised by Raman spectroscopy which showed the A1g mode in the spectrum. In addition, the thickness of the monolayer was measured to be 1.0 nm by AFM (Table 4).
Example 15. Synthesis and characterisation of HfTe2
HfTe2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1b. A few-layer HfTe2 was synthesised and the optical image is as shown in Fig. 3. The flake was characterised by Raman spectroscopy in which the spectrum confirmed that the flake is HfTe2 crystal. Example 16. Synthesis and characterisation of VS2
VS2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. The optical image of VS2 is shown in Fig. 3. The as- synthesised VS2 was characterised by Raman spectroscopy and the spectrum showed the 2-photonon and A g vibrations which are the same as the values reported.
The VS2 was characterised by STEM and it was determined to be in 1T phase whereby it is composed of layers of VS6 octahedral separated by a van der Waals gap and it belongs to space group P3m1. The hexagonal atomic arrangement observed at the edges confirmed the 1T structure of VS2. The EDS spectrum showed the presence of only S and V atoms in this region and the EELS spectrum collected along the edge further confirmed the high quality of the as-synthesised VS2. In addition, the thickness of the as-synthesised sample was measured to be 0.7 nm by AFM (Table 4).
Example 17. Synthesis and characterisation of VSe2 VSe2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. A monolayer of VSe2 of 50 μηι was synthesised and the optical image is shown in Fig. 3. The sample was also characterised by Raman spectroscopy. The STEM image of few-layer VSe2 show the hexagonal arrangement of atomic columns in alternate bright and dark pattern results from the stacking of the few layers in 1T structure. The EDS and EELS spectra collected in the same region further confirmed the high purity of the as-synthesised VSe2. The thickness of the as-synthesised sample was measured to be 0.9 nm by AFM (Table 4).
Example 18. Synthesis and characterisation of VTe2
VTe2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. A monolayer of VTe2 was synthesised and the optical image is shown in Fig. 3. The as-synthesised sample was also characterised by Raman spectroscopy and the Raman spectrum showed peaks at 1 17 cm"1 and 137 cm"1 which were slightly shifted as compared to reported values. The thickness of the sample was measured to be 3.0 nm by AFM (Table 4).
Example 19. Synthesis and characterisation of NbS2
NbS2 was synthesised in accordance to the above general procedures with growth conditions and parameters in Tables 1a and 1b. The synthesis of a monolayer of NbS2 of a size up to 80 m was achieved and the optical image is shown in Fig. 3. The sample was also characterised by Raman spectrum which confirmed that the as-synthesised flake is an NbS2 crystal.
The NbS2 crystal generally exists in 2H phase (or 1 H in the case of a single layer). The STEM image of a monolayer NbS2 showed that the 2H phase of NbS2 can be directly identified by the hexagons composed by Nb and S2 columns with different contrast profile - this is similar to the well-known atomic structure of MoS2. The EDS and EELS spectra showed the presence of Nb and S, therefore confirming the chemical composition of NbS2. The thickness of the sample was measured to be 0.7 nm by AFM (Table 4).
Example 20. Synthesis and characterisation of NbSe2
NbSe2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. The optical image of monolayer NbSe2 with a size up to 50 pm is shown in Fig. 3 and the Raman spectrum confirmed that the as- synthesised sample is NbSe2.
NbSe2 is generally in the 2H phase, where the Nb and Se2 atomic columns are arranged in a hexagonal manner. The STEM image of NbSe2 showed the presence of both monolayer and bilayer regions. The hexagonal atomic structure in the monolayer, similar to those observed in NbS2, confirmed that the monolayer is in 1H phase. The uniform intensity of each atomic site in the bilayer, on the other hand, revealed the as-synthesised NbSe2 is in the 2H stacking phase. The EDS and EELS spectra collected in the same region confirmed the chemical composition of NbSe2. The Cu signals were from the background signals of the Cu TEM grid used. The thickness of the sample was measured to be 0.8 nm by AFM (Table 4). Example 21. Synthesis and characterisation of NbTe2 NbSe2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1b. NbTe2 is a layered-structure compound and was reported to demonstrate charge-density wave (CDW) effect and superconducting behaviour (Nagata, S., et al., J. Phys. Chem. Solids, 1993, 54, 895-899. However, the synthesis of NbTe2 flakes has not been reported by CVD method. Here, large-size NbTe2 obtained using CVD method was achieved and the optical image is shown in Fig. 3. The sample was characterised by Raman spectroscopy which revealed that the flake is NbTe2 crystal. Like other telluride-based materials, the bulk crystal structure of NbTe2 is monoclinic, belonging to space group C2/m. NbTe2 is known to demonstrate charge density wave (CDW) transition when the temperature drops to the transition point. The STEM image of a NbTe2 monolayer showed hexagonal patterns of atom arrangement instead of the MoTe2- like 1T phase, therefore suggesting that the NbTe2 monolayer is presumably in 1T phase. The corresponding EDS and EELS spectra further confirmed that the flakes were only composed of Nb and Te elements. The thickness of the sample was measured to be 4.0 nm by AFM (Table 4).
Example 22. Synthesis and characterisation of TaS2
TaS2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. The optical image of TaS2 film with a size up to 70 μιη is shown in Fig. 3. The sample was also characterised by Raman spectroscopy. TaS2 monolayer can exist stably in 1 H and 1T phase. A high resolution Z-contrast STEM image of a monolayer region and bilayer region of TaS2 showed the hexagonal patterns which indicated that the Ta (bright spots) and S2 were arranged similarly to that of MoS2. This therefore confirmed the 1 H phase of the as-synthesized TaS2. In addition, the bilayer region showed a 3R stacking order, similar to that of CVD-grown MoS2. The EDS and EELS spectra were collected in the same region where the image was collected. This confirmed the chemical composition of the sample which consists of Ta and S without any other obvious impurities. The thickness of the sample was measured to be 0.8 nm by AFM (Table 4)· Example 23. Synthesis and characterisation of TaSe2 TaSe2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1b. The optical image of TaSe2 is shown in Fig. 3 and the sample was also characterised by Raman spectroscopy. The thickness of the sample was measured to be 2.0 nm by AFM (Table 4).
Example 24. Synthesis and characterisation of TaTe2
TaTe2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1b. TaSe2 with a size up to 20 pm is shown in Fig. 3. The sample was also characterised by Raman spectroscopy and the thickness of the sample was measured to be 5.0 nm by AFM (Table 4).
Example 25. Synthesis and characterisation of ReS2 ReS2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. The optical image of monolayer ReS2 with a size up to 50 pm is shown in Fig. 3. The sample was also characterised by Raman spectroscopy.
ReS2 is a semiconductor with a distorted 1T structure which is defined as 1T" phase. A high resolution Z-contrast STEM image of a ReS2 monolayer showed a diamond shape pattern of the Re atoms due to the two-dimensional distortion from the 1T phase. Typically, the Re atoms are observed clearly as bright spots, while the S atoms are generally not observable due to the smaller size as compared to Re atom. The EDS and EELS spectra showed Re and S characteristic peaks, without any other obvious impurities, therefore confirming the composition of the material. The thickness of the sample was measured to be 0.9 nm by AFM (Table 4).
Example 26. Synthesis and characterisation of ReSe2 ReSe2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. The optical image of ReSe2 is shown in Fig. 3. The sample was also characterised by Raman spectroscopy.
Fig.11d shows the STEM image of monolayer ReSe2 in 1T" phase, with the corresponding atomic structural model. The patterns obtained by fast Fourier transform further indicate that the 1T" phase changes to a much larger hexagonal cell owing to the aggregation of four metal atoms into a new unit cell. The EDS spectrum collected from a larger region confirms the presence of Re and Se. The Mo signals were likely to be from the TEM Mo grid bar, while the Cu may be from clusters that were attached to the sample during the transfer. The EELS spectrum further demonstrated that only Re and S characteristic peaks were found, which confirmed the chemical composition of the film. In addition, the thickness of the sample was measured to be 0.8 nm by AFM (Table 4).
Example 27. Synthesis and characterisation of FeSe
FeSe was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. The optical image of the monolayer flake is shown in Fig. 3 and the Raman spectrum of the sample confirmed that the as-synthesised flake is FeSe crystal.
The two different phases of FeSe are the tetragonal phase α-FeSe with PbO-structure, and the NiAs-type β-phase with a wide range of homogeneity showing a transformation from hexagonal to monoclinic symmetry. Specifically, the single crystal α-FeSe can undergo a clear tetragonal to orthorhombic phase transition at temperature T = 91 K and at Tc= 9.3 K. In addition, FeSe is also known to demonstrate superconductivity property. In this case, a hexagonal phase of monolayer FeSe was obtained as shown by the high- resolution Z-contrast STEM image of a monolayer region collected in the as-grown FeSe sample. Interestingly, this hexagonal phase, viewed along [001] zone axis, maintained a layered structure, which is similar to the 1 H phase observed in MoS2. However, this phase has not been reported for FeSe. The chemical composition was first confirmed by the EDS spectrum of a large flake which only showed the presence of Fe and Se. The EELS spectrum showed that only Fe and Se characteristic core-loss peaks were present. This further confirmed the high purity of the FeSe sample and a new phase of FeSe may have been obtained. The Mo signals were from the Mo TEM grid. The thickness of the sample was measured to be 1.2 nm by AFM (Table 4).
Example 28. Synthesis and characterisation of PtS2
PtS2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. The optical image of PtS2 is shown in Fig. 3 and the sample was also characterised by Raman spectroscopy. The thickness of the sample was measured to be 1.0 nm by AFM (Table 4). Example 29. Synthesis and characterisation of PtSe2
PtSe2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. The optical image of PtSe2 is shown in Fig. 3 and the Raman spectrum of PtSe2 showed the A1g and Eg vibration modes.
PtSe2 crystal is an emerging new layered two-dimensional metal dichalcogenide material with group X metal cation. It has a structure similar to Cdl2, which belongs to the space group P3m1 with the lattice constant of a = 3.724 A, c = 5.062 A. A PtSe2 monolayer has the octahedral 1T phase and is able to perform like a semiconductor. On the other hand, the few-layer counterpart demonstrates metallic property due to the strong interlayer interaction.
Fig.11 b shows the STEM image of monolayer PtSe2 in 1T phase, with the corresponding atomic structural model. The patterns obtained by fast Fourier transform further indicated that the 1T phase maintain a hexagonal unit cell. Some holes observed on the samples during STEM characterisation (due to irradiation damage from the electron beam) further confirmed the presence of a single monolayer. In addition, both the EDS and EELS spectra indicated the characteristic features of Pt and Se, therefore further confirming the chemical composition of the as-synthesised PtSe2 film. . The thickness of the sample was measured to be 0.9 nm by AFM (Table 4).
Example 30. Synthesis and characterisation of PdS2
PdS2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. The optical image of PdS2 with hexagonal shapes is shown in Fig. 3. The sample was also characterised by Raman spectroscopy. The thickness of the sample was measured to be 1.5 nm by AFM (Table 4).
Example 31. Synthesis and characterisation of PdSe2
PdSe2 was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 1a and 1 b. The optical images of PdSe2 with hexagonal shapes is shown in Fig. 3. The sample was also characterised by Raman spectroscopy. The thickness of the sample was measured to be 3.0 nm by AFM (Table 4). Example 32. Synthesis and characterisation of MoS2xTe2(i-x), MoSe2xTe2(i_X), WS2xTe2(i-x), WSe2xTe2(i-X) and NbS2 Se2(1-.X)
MoS2xTe2(i-X), MoSe2xTe2(i-X), WS2xTe2{1-x ), WSe2xTe2(1-.x )and NbS2xSe2(i-X) Were synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 2a and 2b.
Specifically, MoSe0.3Tei.7 was obtained as follows:
Mixed powder of NaCI and Mo03 with weight of 2 mg and 10 mg in the alumina boat was placed in the center of the tube. Another alumina boat containing mixed powder of Se and Te in a weight ratio of 3:7 (Se:Te) was placed in the upstream. The furnace was heated with a ramp rate of 50 °C/min to the growth temperature 700-800 °C and held at the temperature for 10-20 mins before cooled down to room temperature naturally. The mixed Ar/H2 with a flow rate of 100/5 seem was used as the carrier gas.
The optical images of the as-synthesised ternary samples are shown in Fig. 3 and the samples were also characterised by Raman spectroscopy. For example, some other representative images of MoS2xTe2(i-x), MoSe2xTe2(1-x), WS2xTe2(1-x ) are shown in Fig. 8a-c, along with the respective Raman spectra in Fig. 8d-f.
Example 33. Synthesis and characterisation of Moi_xNbxSe2, Mo1-xRexS2, W1-xNbxS2, W1-xNbxSe2, MoxNbi_xS2 and MoxW^xTe2
Mo1-xNbxSe2, Mo1-xRexS2, W^xNbxSa, W1-xNbxSe2, MoxNb1-xS2 and MoxW1-xTe2) were synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 2a and 2b. For the synthesis of this group of ternary alloys, the aluminium oxide boat placed in the center of the quartz tube will contain a mixture of two metal precursors in a weight ratio from 0.01 :1 to 1 :0.01. The optical images of the as- synthesised ternary samples are shown in Fig. 3 and the samples were also characterised by Raman spectroscopy.
Example 34. Synthesis and characterisation of MoxNbi-xS2ySe2(i-y)
The quaternary TMD, MoxNb1-xS2ySe2(i-y), was synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 2a and 2b. Specifically, the aluminium oxide boat placed in the center of the quartz tube will contain a mixture of Nb205:Mo03 in a weight ratio from 0.01 :1 to 1 :0.01 , while another aluminium oxide boat containing S and Se powder was placed in the upstream.
The optical image of the as-synthesised sample is shown in Fig. 9a and the corresponding Raman spectrum is shown in Fig. 9b.
Example 35. Synthesis and characterisation of
Figure imgf000047_0001
The quinary TMD,
Figure imgf000047_0002
was also synthesised in accordance to the above general procedure with growth conditions and parameters in Tables 2a and 2b.
Specifically, Vo.03W02 oo.77SL6Seo.4 can be obtained as follows:
A powder mixture of 2 mg NaCI and 10 mg of V205:Mo03:W03 = 1 :5:3 in the aluminium oxide boat was placed in the centre of the quartz tube. Another aluminium oxide boat containing S and Se powder of weight ratio from 1 :10 to 10:1 was placed in the upstream. The furnace was heated with a ramp rate of 50 °C min"1 to the growth temperature (760-840 °C) and held at this temperature for 10-20 min before cooling down to room temperature naturally. Ar/H2 with a flow rate of 100/5 seem was used as the carrier gas. The optical image of the as-synthesised quinary sample is shown in Fig. 9c and the corresponding Raman spectrum is shown in Fig. 9d. A STEM image of a quinary VxWyMoi-x-yS2zSe2(i-z) monolayer alloy is shown in Fig. 16a, where the chemical composition was verified by the EDS spectrum (Fig. 16b). Different chemical species give rise to the distinct atomic contrast in the image. Combined with the intensity histogram analysis of the cation and anion sites (Fig. 17), each atomic column can be directly associated with their chemical identities using the image contrast, as shown by the representative line intensity profile in Fig. 16c. The atom-by-atom mapping further confirms the successful synthesis of a quinary alloyed monolayer. Example 36. Synthesis and characterisation of 1 T ΜοΤβ2-2 Η oTe2 in-plane heterostructure
The 1 T MoTe2-2 H MoTe2 in-plane heterostructure was synthesised as follows:
A mixed powder of 4 mg NaCI and 14 mg M0O3 in the aluminium oxide boat was placed in the centre of the quartz tube. Another aluminium oxide boat containing Te powder was placed in the upstream. The furnace was heated to a growth temperature of 720 °C with a ramp rate of 50 °C min"1 and held for 3 min, and then quickly cooled to a growth temperature of 650 °C and held for 5 min and then cooled down to room temperature naturally. 1 T MoTe2 was first synthesised using an Ar/H2 flow rate of 80/20 seem. This was then followed by the growth of 2H MoTe2 on the as-synthesised 1 T' MoTe2 using an Ar/H2 flow rate of 20/4 seem to obtain the 1 T MoTe2-2 H MoTe2 in-plane heterostructure.
Fig. 10a shows the optical image of 1T MoTe2-2H MoTe2 in-plane heterostructure. The shape of 2H MoTe2 is hexagonal while the shape of 1T MoTe2 is rectangular. The Raman spectra of corresponding 1T' MoTe2 and 2H MoTe2 in the heterostructure confirmed the formation of in-plane heterojunction (Fig. 10b)
Example 37. Synthesis and characterisation of MoS2-NbSe2 vertically stacked heterostructure
MoS2 was synthesised first. A mixed powder of 0.5 mg NaCI and 3 mg Mo03 in the aluminium oxide boat was placed in the centre of the tube. Another aluminium oxide boat containing S powder was placed in the upstream. The furnace was heated to the growing temperature (600-800 °C) with a ramp rate of 50 °C min-1. The growth time was 3 min. Ar (or Ar/H2) with a flow rate of 80 seem (or 80/5 seem) was used as the carrier gas. The as- obtained MoS2 was quickly transferred to another furnace for heterostructure growth. For the NbSe2 growth, a mixed powder of 2 mg NaCI and 10 mg Nb205 and in the aluminium oxide boat was placed in the centre of the quartz tube. Another aluminium oxide boat containing Se powder was placed in the upstream. The furnace was heated with a ramp rate of 50 °C min"1 to the growth temperature of 700 °C and held at this temperature for 10 min before cooling down to room temperature naturally. Ar/H2 with a flow rate of 60/4 seem was used as carrier gas.
The optical image of MoS2-NbSe2 vertically stacked heterostructure is shown in Fig. 10c. The Raman spectra in Fig. 10d confirmed the formation of vertically stacked heterojunction. Example 38. Comparison of the as-synthesised 2D TMD with previous reports
In this experiment, the synthesis of more than 40 different styles of 2D TMDs was demonstrated. As a comparison, many previous reported works on VS2, VSe2 and NbS2 showed that thick flakes of these materials were obtained using normal CVD method (Table 5). The work on the synthesis of WS2 and WSe2 using salt was also reported (Table 5). In that work, only WS2 and WSe2 were obtained with no growth mechanism discussed. Table 5. Comparison of the as-synthesised 2D TMD with previous reports
Figure imgf000049_0001
Ref. 1 - Li, S. et al. Applied Materials Today, 2015, 1, 60-66.
Ref. 2 - Boscher, N. D., et al., Appl. Surf. Sci., 2007, 253, 6041-6046.
Ref. 3 - Yuan, J. T. et al. Adv. Mater., 2015, 27, 5605-5609.
Ref. 4 - Ge, W. Y., et al., Nanoscale, 2013, 5, 5773-5778.
In addition, the growth conditions and the size of MoX2, WX2 and NbX2 obtained were compared with the reported values (Table 6). Table 6. Comparison of the as-synthesised 2D TMD with previous reports
Figure imgf000049_0002
References:
1 ) Gong, Y. J. er a/., Adv. Fund Mater., 2016, 26, 2009-2015.
2) Rong, Y. M. et al., Nanoscale, 2014, 6, 12096-12103.
3) van der Zande, A. M. er a/., Nat. Mater., 2013, 12, 554-561.
4) Zhao, S. H. et al., 2D Mater., 2016, 3, 025027. Example 39. Superconductivity of as-synthesised MoTe2 and NbSe2 monolayers
Method
The transport experiments were carried out in a top-loading Helium-3 cryostat equipped with a 15-T superconducting magnet. Standard low-frequency lock-in technique was employed to measure the longitudinal resistance Rxx. An ac probe current
Figure imgf000050_0001
nA at 30.9 Hz was applied from the source to the drain. Then a lock-in amplifier was used to monitor the longitudinal Rxx through two additional electrical contacts. Discussion
Superconductivity has been demonstrated to exist in high-quality exfoliated NbSe2 monolayers and in bulk TaS2 and MoTe2 (Xi, X. X. er a/., Nat. Phys., 2016, 12, 139-143; Navarro-Moratalla, E. er a/., Nat. Commun. 2016, 7, 11043; Qi, Y. P. er a/., Nat. Commun., 2016, 7, 11038).
To examine the quality of the as-grown 2D crystals, Hall-bar devices were fabricated with their transport properties measured. The transport results for the as-synthesised monolayer NbSe2 and MoTe2 are shown in Fig. 18a and c respectively, and for bilayer MoTe2 in Fig. 19. Interestingly, these two materials exhibited similar transport behaviors. At high temperatures, they exhibited metallic behavior, with dR/dT > 0. When the temperature was reduced to 1.5 K, the superconducting transition began to emerge; zero resistance was finally obtained at 7"co = 0.4 K and 0.5 K for the monolayer NbSe2 and MoTe2, respectively. From the temperature and field dependence of the longitudinal resistance Rxx shown in Fig. 18b and d, the phase diagrams of the upper critical field Hc2(T) as a function of temperature were obtained (Fig. 20a and b). To the best of our knowledge, this represents the first observation of superconductivity in monolayer MoTe2. Similar superconducting behavior has also been observed in NbSe2 and MoTe2 layered samples with different thicknesses.
Fig. 20a and b show the upper critical field HcZ-Tc phase diagrams, where the superconducting transition temperature Tc under different magnetic fields is defined as the temperature at which the resistance drops to 10% of the normal state resistance R . A linear relationship between Hc2 and Tc (closer to Tc) was observed, which is regarded as a characteristic property of 2D superconductors. The observation of superconductivity in the as-synthesised monolayer NbSe2 and MoTe2 represents the realisation of superconductivity in non-ultrahigh-vacuum-grown monolayer materials. Combined with the high mobility of monolayer MoS2 and ReS2 (in Example 40), these results indicate the high quality of the as-prepared 2D TMDs.
Example 40. Transport measurements of monolayer oS2 and ReS2
The transport measurements of monolayer MoS2 and ReS2 were carried out. Fig. 21a and b show the ld-Vd and lConduct ty- g of monolayer MoS2. The mobility of MoS2 which is about 30 cm2 V V1 can be calculated from Fig. 21b. The on/off ratio is as high as 108, which is similar to the reported result of monolayer MoS2 using CVD method (Najmaei, S. et al., Nat. Mater., 2013, 12, 754-759).
Fig. 21c and d show the ld-Vd and ld-Vg of monolayer ReS2. The mobility of ReS2 was about 6.5 cmW1 can be calculated from Fig. 21c and this is similar to the reported result of monolayer ReS2 using CVD method (Keyshar, K. et al., Adv. Mater, 2015, 27, 4640-4648). The mobility was calculated using the equation μ = dlds/dVbg * Lch (WchCox ds), where μ is the mobility, W is the channel width, L is the channel length, and Cox (Cox = 1.26 χ 10"4 F/m2) is the capacitance per unit area of the Si02 layer.
Example 41. Melting points of salt and metal precursors mixtures, determined using thermogravimetry and different scanning calorimetry (TG-DSC)
Method
Thermogravimetry and differential scanning calorimetry (TG-DSC) measurements were performed using a Netzsch STA 449 C thermal analyser. Approximately 10 mg of the sample were loaded into an aluminium oxide crucible and heated at 10 K min"1 from 20 °C to 920 °C. The 95 vol% Ar/5 vol% H2 with a flow rate of 40 ml_ min"1 was used as the carrier gas.
Discussion
The melting points of the precursors for all binary 2D systems were obtained using TG-DSC measurements. They all fell within the temperature window from 600 °C to 850 °C, as shown in Fig. 22a, which matches the temperature range in which the resulting materials grow. This is further supported by the thermogravimetry versus time curves in Fig. 22b. During the growth, coarsening forms a stable nucleus (Fig. 24), then adatoms and atom clusters of chalcogen and metal attach to the edges of as-grown 2D monolayers and grow quickly owing to their high mobility. This helps to produce millimetre-sized single-crystal 2D TMDs, such as the W-, Nb- and Mo-based TMDs (Fig. 3). Example 42. Determining the existence of intermediate products, metal oxychlorides, using X-ray photoelectron spectroscopy (XPS) and X-ray Powder Diffraction (XRD)
Method
XRD was carried out using Bruker D8 Advance XRD with a Cu-Ka radiation at 40kV and 40 mA.
Discussion
To confirm the existence of metal oxychloride, the intermediate products were collected and analysed by X-ray photoelectron spectroscopy (XPS) during the synthesis of monolayer NbX2> MoX2 and WX2 (X = S, Se, Te). The signals from M-CI and M-O (M = W, Nb, Mo) bonds in Nb 3d, Mo 3d and W 4f confirmed the existence of the oxychloride compounds NbOxCly , MoOxClyand WOxCly (Fig. 23a-c). These values are in agreement with reported values (Wu, H.-M., et al., Synth. Met., 1987, 20, 169-183; Alov, N. V„ Phys. Stat. Solidi C, 2015, 12, 263-266; McGuire, G. E., et al., Inorg. Chem., 1973, 12, 2450-2453).The XRD spectrum of the materials obtained during the synthesis of NbX2 (X: S, Se, Te) indicated the formation of the intermediate metal oxychloride (NbOCI3). The (101 ) and (111 ) peaks located at 23.6° and 25.5° are in agreement with previous report (Z. Anorg. Allg. Chem., 2002, 628, 488-491 ). Example 43. Nucleation of TMD with and without salt
Nucleation is the first and a key step for the growth of TMD layers. The nucleation density will dominate the geometries of TMD layers. In the reaction between metal oxides and NaCI, metal oxychlorides like MoClxOy, WCIxOy, NbClxOy will be formed. The high volatility nature of metal oxychlorides can result in a higher nucleation rate as compared to those without the use of salts. This was observed experimentally where the use of salt during the synthesis process of ReX2, TiX2, and WX2 (X: S, Se, Te) gave large number of nucleation (Fig. 24a, c and e). When no salt was used, almost no nucleus were formed on the substrate (Fig. 24b, d, and f)
Example 44. Comparing the growth rate of MoS2 monolayer single crystal with and without NaCI
It was observed that the growth time of MoS2 with NaCI was as short as 3 min and the growth rate was up to 8 μηη s"1(Fig. 26), owing to the high chemical activities of oxychloride during the reaction. The growth rates can be determined from the ratio of the sample size over the growth time. Fig. 25 shows the optical image of MoS2 and growth rate without NaCI while Fig. 26 shows the optical image of molten-salt-assisted MoS2 and the relationship between the growth rate and the distance from the center of substrate to the edge of the substrate. For the formation MoCI202, it was observed that the growth time was ~3 min.
Example 45. Morphologies of 2D TMD controlled by the nucleation and growth rate
By controlling the nucleation and growth rate, TMD 2D materials with various morphologies can be realised. For example, the parameters can be controlled to form large-size MoS2 monolayer, continual MoS2 film and MoS2 flake with different layers, accordingly.
To synthesise continuous MoS2 monolayer, high carrier gas flow rate of 100 seem was used to increase the concentration of S vapour, which can react with metal oxide (or oxychloride) nuclei (Fig. 27). The distance between the substrate and MoCyNaCI sources was 1.2 cm with growth temperature at 750 °C and growth time of 3 min. The corresponding weight of MoCyNaCI sources are: (a) 2mg/0.2mg, (b) 3mg/0.3mg and (c) 10mg/0.8mg. An increasing weight ratio of salt over Mo03 increases the nucleation density for the growth of MoS2, thus the distribution of monolayered MoS2 transits from low-density single crystal (Fig 27a), to mediate-density single crystal, to high-density single crystal (high coverage) and finally to a continual film (Fig. 27c).
Controlling the thickness of MoS?
The layer-controlled growth of MoS2 needs large size nuclei to provide enough source for the layer-by-layer growth, so the distance between the substrate and the MoCVNaCI sources was shortened to 0.6 cm and the carrier gas flow rate was decreased to 60 seem to increase the size of the nucleus. Decreasing the flow rate of carrier gas can make the nuclei surplus so that the nuclei will grow larger. The growth time was increased to 15 min to ensure sufficient time for layer-by-layer growth, considering that the in-plane growth was generally faster than out-of-plane growth. The growth temperature was set at 750 °C. The corresponding optical images are shown in Fig. 28a-c.
The optical images of different 2D TMDs under different growing conditions are as shown in Fig. 29 to 31 , which indicate the uniformity of the as-synthesised 2D TMDs. Fig. 29a-c show the optical images of MoS2 and MoSe2 grown at 750 °C, and MoTe2 grown at 700 °C. Fig. 29d-f show the optical images of WS2, WSe2 and WTe2 grown at 800 °C, 810 °C and 820 °C respectively, and Fig. 29g-i show the optical images of NbS2, NbSe2 and NbTe2 grown at 780 °C, 790 °C and 800 °C respectively. Due to the rate constant ks>kSe>kTe, TMD 2D films with an increasing thickness can be obtained. Generally, few-layered selenide and telluride compounds can be obtained easily.
The optical images of various TMDs grown in various growing temperatures are as shown in Fig. 30a-f at 800 °C, 780 °C, 790 °C, 810 °C, 810 °C and 700 °C, respectively.
In addition, the thickness of the TMDs (from monolayer to few layers) can be controlled by varying the temperature. It was observed that monolayer PtSe2 can be obtained with a higher growing temperature of 815 °C (in Fig. 31a), as compared to 800 °C which gave few- layer PtSe2 (Fig. 31 b). Similar observation was made for VTe2 (in Fig. 31 c) in which a monolayer was obtained at a higher temperature of 750 °C, as compared to 700 °C (Fig. 31d).
Example 46. Comparison of the properties of Vo.o3Wo.2Moo.77S1 6Seo.4 with MoS2 for catalysing hydrogen evolution reaction (HER)
Electrochemical measurements of Vo.o3Wo.2Moo.77Si.6Seo.4 were carried out using a typical three-electrode cell consisting of a working electrode, a graphite carbon counter electrode and a saturated calomel reference electrode (SCE), with 0.5 M H2S04 as the electrolyte. The electrochemical cell was connected to an electrochemical workstation (CHI760) coupled with a rotating disk electrode (RDE) system (AFMSRCE3529, Pine Research Instrumentation, USA). A glassy carbon electrode (GCE) covered with catalyst samples was used as the working electrode. The potential, measured against a SCE electrode, was converted to the potential versus the reversible hydrogen electrode (RHE) according to ERHE = ESCE + E°SCE (0.2412) + (0.059 x pH). Linear Sweep Voltammetry (LSV) was conducted in 0.5 M H2S04 with a scan rate of 2 mVs"1 under 1500 rpm. The current density vs potential data plots were corrected for 90% ohmic compensation throughout the system.
TMDs have been proposed as promising candidates for catalysing HER. In comparison to MoS2, the quniary alloy Vo.o3Wo.2Moo.77S1.6Seo.4 gave an overpotential of -65 mV which was significantly lower than that of MoS2 (Fig. 32). This shows that the alloy has better catalytic activity than MoS2 as the alloy has a smaller Gibbs free energy according to the following reaction formula: H++e ^H*- 1/2H2
Example 47. Properties of MoSexTe2.x containing different ratios of Se to Te The properties of MoSexTe2-x can be adjusted by varying the ratio of Se:Te. Fig. 33 shows the temperature dependence of square resistance of pristine MoTe2 in comparison with different MoSexTe2-x containing different ratios of Se to Te.
The square resistances of the samples at room temperature generally varied from 63 Ω to 3120 Ω and it was observed that a larger resistance was obtained with an increase in Se doping. This demonstrates that MoSexTe2-x can transit from semiconductor to metal with decreasing ratio of Se to Te. At a lower temperature, samples of MoSexTe2-x with x ranging from 1.1 to 1.3 showed a semiconductor behaviour, while MoSexTe2-x with x ranging from 0 to 1.0 gave metallic behaviour which finally became superconducting at extremely low temperature. However, phase transition at 150K to 250K from 1Γ to Td were not observed.
References
1. Zhang, Y. B. et al., Nature, 2005, 438, 201-204.
2. Qian, X. F. et al., Science, 2014, 346, 1344-1347.
3. Xiao, D. et al., Phys. Rev. Lett, 2012, 108, 196802.
4. Zeng, H. L. ef a/., Nat. Nanotechnol., 2012, 7, 490-493.
5. Saito, Y. et al., Nat. Rev. Mater., 2017, 2, 16094.
6. Novoselov, K. S. et al., Science, 2004, 306, 666-669.
7. Radisavljevic, B. and Kis, A., Nat. Mater., 2013, 12, 815-820.
8. Wang, Q. H. ef al., Nat. Nanotechnol., 2012, 7, 699-712.
9. Roy, K. et al., Nat. Nanotechnol. 2013, 8, 826-830.
10. Lopez-Sanchez, O. et al., Nat. Nanotechnol., 2013, 8, 497-501.
11. Chen, Y. F. er a/., ACS Nano, 2013, 7, 4610-4616.
12. Gong, Y. J. et al., Nano Lett., 2014, 14, 442-449.
13. Lin, Z. er a/., Apl. Mater. 2014, 2, 092514.
14. Azizi, A. et al., Nano Lett, 2016, 16, 6982-6987.
15. Zhan, Y. J. er a/., Small, 2012, 8, 966-971.
16. van der Zande, A. M. et al., Nat. Mater., 2013, 12, 554-561.
17. Lee, Y. H. et al., Adv. Mater., 2012, 24, 2320-2325.
18. Lin, Y. C. er a/., Nanoscale, 2012, 4, 6637-6641.
19. Ellas, A. L. er a/., ACS Nano, 2013, 7, 5235-5242.
20. Lu, X. et al., Nano Lett., 2014, 14, 2419-2425.
21. Huang, J. K. et al., ACS Nano, 2014, 8, 923-930.
22. Park, J. C. et al., ACS Nano, 2015, 9, 6548-6554.

Claims

Claims
1. A process of forming a two-dimensional transition metal dichalcogenide of formula I:
MX2 I
where:
M is selected from one or more of the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Cd, Hf, Ta, W, and Re: and
X is selected from one or more of the group consisting of S, Se, and Te, the process comprising the step of depositing the transition metal dichalcogenide of formula I on a substrate by chemical vapour deposition, wherein the vapour deposition is accomplished by: passing a carrier gas through a fluid pathway in a furnace, where the fluid pathway comprises a first temperature zone housing one or more of elemental sulfur, selenium or tellurium and a second temperature zone that houses a substrate above a mixture of one or more metallic precursors and an alkali metal halide, where the wt:wt ratio of the one or more metallic precursors to the alkali metal halide is from 1 :2 to 15:1 , where:
the temperature of the first temperature zone is from 150 to 500°C;
the temperature of the second temperature zone is from 350 to 950°C;
the substrate is from 0.01 to 2.0 cm above the mixture of one or more metallic precursors and the alkali metal halide; and
the one or more metallic precursors are selected from an elemental metal, a metal oxide or a metal halide, where each respective metal is selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Cd, Hf, Ta, W, and Re, wherein the growth rate of the two-dimensional transition metal dichalcogenide of formula I on the substrate is from 0.01 pm/s to 10 pm/s.
2. The process according to Claim 1 , wherein the carrier gas comprises an inert gas having a flow rate of from 30 to 200 seem, optionally where the inert gas is argon and/or nitrogen.
3. The process according to Claim 2, wherein the carrier gas further comprises hydrogen, the hydrogen having a flow rate of from 1 to 20 seem.
4. The process according to any one of the preceding claims, wherein the alkali metal halide is selected from one or more of the group consisting of NaCI, KCI, LiCI, NaBr, KBr, LiBr, Nal, Kl, and Lil.
5. The process according to any one of the preceding claims, wherein the thickness of the deposited transition metal dichalcogenide is from 1 nm to less than 1 pm (e.g. from 1 nm to 500 nm).
6. The process according to any one of the preceding claims, wherein the process further comprises laying one or more further layers of a two-dimensional transition metal dichalcogenide of formula I onto a substrate that has already undergone the deposition process described in the preceding claims, optionally wherein the two-dimensional transition metal dichalcogenide of formula I deposited in each further layer is different to the layer on the surface of the substrate.
7. The process according to any one of the preceding claims, wherein the wt:wt ratio of the one or more metallic precursors to the alkali metal halide is from 1.5:1 to 5:1.
8. The process according to any one of the preceding claims, wherein the flow rate of the carrier gas is varied during the process to provide an in-plane heterostructure.
9. The process according to any one of Claims 1 to 6, wherein when the transition metal dichalcogenide of formula I is MoS2, the temperature of the second temperature zone is from 350 to 800°C (e.g. from 350 to 600°C) and the wtwt ratio of the one or more metallic precursors to the alkali metal halide is from 5:1 to 10: .
10. The process according to any one of Claims 1 to 6, wherein when the transition metal dichalcogenide of formula I is MoSe2, the temperature of the second temperature zone is from 550 to 900°C (e.g. from 550 to 650°C, such as from 550 to 600°C) and the wt:wt ratio of the one or more metallic precursors to the alkali metal halide is from 5:1 to 10:1.
11. The process according to Claim 9 or Claim 10, wherein:
(a) the wtwt ratio of the one or more metallic precursors to the alkali metal halide is 6:1 ; and/or
(b) the metallic precursor is Mo03; and/or
(c) the alkali metal halide is NaCI.
12. The process according to any one of Claims 1 to 6, wherein when the transition metal dichalcogenide of formula I is selected from the group consisting of PdTe2, PdSe2, PdS2l PtTe2, PtSe2, and PtS2, the temperature of the second temperature zone is from 750 to 860°C and the wtwt ratio of the one or more metallic precursors to the alkali metal halide is from 8:1 to 12:1.
13. The process according to Claim 12, wherein:
(a) the wtwt ratio of the one or more metallic precursors to the alkali metal halide is 10:1 ; and/or
(b) the metallic precursor for Pd is PdCI2 and the metallic precursor for Pt is PtCI2; and/or
(c) the alkali metal halide is NaCI.
14. The process according to any one of Claims 1 to 7, wherein when the transition metal dichalcogenide of formula I is selected from the group consisting of HfTe2> HfSe2, HfS2, VTe2, VSe2, VS2, TiTe2, TiSe2, TiS2, NbTe2, NbSe2, NbS2, ZrTe2, ZrSe2, ZrS2l TaTe2, TaSe2, TaS2, MoTe2, and WTe2> the temperature of the second temperature zone is from 600 to 860°C and the wt:wt ratio of the one or more metallic precursors to the alkali metal halide is from 1.6:1 to 4:1.
15. The process according to Claim 14, wherein:
(a) the metallic precursor for Hf is Hf and the metallic precursor for each of V, Ti, Nb, Zr, Ta, Mo and W is a metal oxide of each respective metal; and/or
(b) the alkali metal halide is NaCI.
16. The process according to any one of Claims 1 to 6, wherein when the transition metal dichalcogenide of formula I is FeS2, FeSe2 or FeTe2, the temperature of the second temperature zone is from 500 to 850°C (e.g. from 500 to 600°C) and the wt:wt ratio of the one or more metallic precursors to the alkali metal halide is from 4:1 to 6:1 , such as 5:1.
17. The process according to Claim 16, wherein:
(a) the metallic precursor for Fe is a metal oxide (e.g. Fe203) or a metal chloride (e.g. FeCI2); and/or
(b) the alkali metal halide is NaCI and/or LiCI.
18. The process according to any one of Claims 1 to 6, wherein the transition metal dichalcogenide of formula I has the formula II:
AaBbCcDdEeFfGgShSeiTej II
where: each of A to G is a different metal selected from one of the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Cd, Hf, Ta, W, and Re;
each of a to g is independently 0 to 0.99 and the sum of a+b+c+d+e+f+g is 1 ; and each of h to j is 0 to 2 and the sum of h+i+j is 2,
provided that at least two of a to g is greater than 0 and/or at least two of h to j is greater than 0.
19. The process according to Claim 18, wherein:
(a) the wt:wt ratio of the one or more metallic precursors to the alkali metal halide is from 5:1 to 7.5:1 , such as 5:1 ; and/or
(b) the temperature of the second temperature zone is from 600 to 850°C.
20. The process according to Claim 18 or Claim 19, wherein the transition metal dichalcogenide of formula II is selected from the group consisting of MoSe2xTe2(i.x), Mo1-xRexS2, MoS2xTe2(i-x), Mo1-xNbxSe2, Md.xNbxSz, MoxNb1-xS2ySe2(1-y), WS2xTe2(1.x), WSe2xTe2(1.x), Mo xWxTes, NbS2xSe2(1.x), \N . b£2, W^Nb^, and VxvVyMo(1.x.y)S2zSe2(1.z).
21. A transition metal dichalcogenide alloy of formula II:
AaBbCcDdEeFfGgShSeiTej II
where:
each of A to G is a different metal selected from one of the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Cd, Hf, Ta, W, and Re;
each of a to g is independently 0 to 0.99 and the sum of a+b+c+d+e+f+g is 1 ; and each of h to j is 0 to 2 and the sum of h+i+j is 2,
provided that at least two of a to g is greater than 0 and/or at least two of h to j is greater than 0.
22. The alloy according to Claim 21 , wherein the transition metal dichalcogenide of formula II is selected from the group consisting of MoSe2xTe2(i.x), Mo1-xRexS2, MoS2xTe2(i.x), Moi-xNbxSe2, Mo1-xNbxS2, MoxNb1.xS2ySe2(i.y), WS2xTe2(1-x), WSe2xTe2(1.x), Moi-xWxTe2, NbS2xSe2(1.x), W1-xNbxS2, W1-xNbxSe2, and VxWyMo(1-x.y)S2zSe2(1.2).
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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105197998A (en) * 2015-09-14 2015-12-30 天津大学 One-step method for preparing high-quality tungsten disulfide nanosheet through chemical vapor deposition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105197998A (en) * 2015-09-14 2015-12-30 天津大学 One-step method for preparing high-quality tungsten disulfide nanosheet through chemical vapor deposition

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
KIM Y. ET AL.: "Alloyed 2D Metal- Semiconductor Heterojunctions: Origin of Interface States Reduction and Schottky Barrier Lowering", NANO LETTERS, vol. 16, no. 9, 23 August 2016 (2016-08-23), pages 5928 - 5933, XP055561559, Retrieved from the Internet <URL:DOI:10.1021/acs.nanolett.6b02893> [retrieved on 20180713] *
LI S. ET AL.: "Halide-assisted atmospheric pressure growth of large WSe2 and WS2 monolayer crystals", APPLIED MATERIALS TODAY, vol. 1, no. 1, 23 September 2015 (2015-09-23), pages 60 - 66, XP055546050, Retrieved from the Internet <URL:https://doi.org/10.1016/j.apmt.2015.09.001> [retrieved on 20180713] *
QIN J.-K. ET AL.: "Chemical Vapor Deposition Growth of Degenerate p-Type Mo-Doped ReS2 Films and Their Homojunction", ACS APPLIED MATERIALS & INTERFACES, vol. 9, no. 18, 25 April 2017 (2017-04-25), pages 15583 - 15591, XP055561547, Retrieved from the Internet <URL:doi:10.1021/acsami.7b02101> [retrieved on 20180713] *
YU P. ET AL.: "Metal- Semiconductor Phase-Transition in WSe2(1-x)Te2x Monolayer", ADVANCED MATERIALS, vol. 29, no. 4, 22 November 2016 (2016-11-22), pages 1603991-1 - 8, XP055564563, Retrieved from the Internet <URL:https://doi.org/10.1002/adma.201603991> [retrieved on 20180713] *
ZHANG Q. ET AL., IODINE-MEDIATED CHEMICAL VAPOR DEPOSITION GROWTH OF METASTABLE TRANSITION METAL DICHALCOGENIDES. CHEMISTRY OF MATERIALS, vol. 29, no. 11, 18 May 2017 (2017-05-18), pages 4641 - 4644, XP055561543, Retrieved from the Internet <URL:DOI:10.1021/acs.chemmater.6b05065> [retrieved on 20180713] *

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