WO2018223384A1 - 通信设备及其通信系统 - Google Patents

通信设备及其通信系统 Download PDF

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Publication number
WO2018223384A1
WO2018223384A1 PCT/CN2017/087762 CN2017087762W WO2018223384A1 WO 2018223384 A1 WO2018223384 A1 WO 2018223384A1 CN 2017087762 W CN2017087762 W CN 2017087762W WO 2018223384 A1 WO2018223384 A1 WO 2018223384A1
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WO
WIPO (PCT)
Prior art keywords
pcb board
shield
communication device
buckle
contact
Prior art date
Application number
PCT/CN2017/087762
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English (en)
French (fr)
Inventor
冷鹏
黄名溟
王永栋
Original Assignee
海能达通信股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 海能达通信股份有限公司 filed Critical 海能达通信股份有限公司
Priority to PCT/CN2017/087762 priority Critical patent/WO2018223384A1/zh
Publication of WO2018223384A1 publication Critical patent/WO2018223384A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Definitions

  • the present invention relates to the field of communications technologies, and in particular, to a communication device and a communication system thereof.
  • GSM Global System for Mobile Communications
  • LTE Long Term Evolution
  • WIFI Wireless Fidelity
  • WLAN Wireless Fidelity
  • BT Bluetooth
  • GPS Global Positioning System
  • RFID Radio Frequency Identification
  • the communication equipment of the prior art includes a private network PCB board and a public network PCB board.
  • the public network PCB board is fixed on the private network PCB board by screws, and cannot achieve multiple points of common ground, thereby reducing the sensitivity of the communication equipment.
  • the technical problem to be solved by the present invention is to provide a communication device and a communication system thereof, which can realize multi-point common ground and improve sensitivity.
  • the present invention adopts a technical solution to provide a communication device including at least a first PCB board, a second PCB board, and a shield bracket.
  • the shield bracket is provided with at least two contact pieces, at least two.
  • the contact strips are respectively in contact with the first PCB board and the second PCB board, and the first PCB board and the second PCB board are shared by the shield bracket.
  • another technical solution adopted by the present invention is to provide a communication system including the above communication device.
  • the shielding bracket of the present invention is provided with at least two contact pieces, at least two contact pieces are respectively in contact with the first PCB board and the second PCB board, the first PCB board And the second PCB board realizes common ground through the shield bracket, and the first PCB board and the second PCB board can realize multi-point common ground through the shield bracket, and improve sensitivity.
  • FIG. 1 is an exploded perspective view of a communication device according to an embodiment of the present invention.
  • Figure 2 is a partial schematic structural view of the communication device of Figure 1;
  • FIG. 3 is a schematic structural view of the shield bracket of Figure 1;
  • FIG. 4 is a cross-sectional view of a communication device according to another embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of a communication system according to an embodiment of the present invention.
  • FIG. 1-2 is a schematic exploded view of a communication device according to an embodiment of the present invention
  • FIG. 2 is a partial structural diagram of the communication device of FIG.
  • the communication device 10 disclosed in this embodiment includes at least a first PCB board 11, a second PCB board 12, and a shield bracket 13.
  • the shield bracket 13 is provided with at least two contact pieces 131, and at least two contact pieces 131 are respectively associated with the first PCB.
  • the board 11 and the second PCB board 12 are in contact, and thus the first PCB board 11 and the second PCB board 12 are realized in common by the shield bracket 13.
  • the second PCB board 12 is disposed above the first PCB board 11 , and the shield bracket 13 is disposed between the first PCB board 11 and the second PCB board 12 .
  • the communication device 10 can be an electronic device such as a mobile phone or a tablet computer.
  • At least two contact pieces 131 may include at least one first contact piece 132 and at least one second contact piece 133, and the first contact piece 132 and the second contact piece 133 are respectively disposed on both sides of the shield bracket 13 .
  • the first contact piece 132 is for contacting the first PCB board 11 , that is, the side of the shield bracket 13 adjacent to the first PCB board 11 is provided with a folded first contact piece 132 , the folded first contact piece 132 and the first PCB The board 11 is in contact, and the shield bracket 13 is connected to the first PCB board 11 through the first contact piece 132.
  • the second contact piece 133 is for contacting the second PCB board 12, that is, the side of the shield bracket 13 adjacent to the second PCB board 12 is provided with a folded second contact piece 133, the folded second contact piece 133 and the second PCB The board 12 is in contact, so the shield bracket 13 achieves a multi-point connection with the second PCB board 12 through the plurality of second contact pieces 132.
  • the first contact piece 132 and the second contact piece 133 may each be a spring piece.
  • the shape of the first contact piece 132 and the shape of the second contact piece 133 may be set to be rectangular. In other embodiments, the shape of the first contact piece 132 and the shape of the first contact piece 133 may be set to other shapes, such as a circular shape.
  • the chord height of the first contact piece 132 ie, the height at which the first contact piece 132 is bent
  • the chord height of the second contact piece 133 ie, the second contact piece 133
  • the height of the bend may be greater than the spacing of the shield bracket 13 and the second PCB board 12.
  • the first PCB board 11 includes at least one first shield cover 111
  • the second PCB board 12 includes at least one second shield cover 121 for contacting the first shield cover 111. That is, the shield bracket 13 realizes multi-point common ground with the first shield 111 through the first contact piece 132.
  • the second contact piece 133 is for contacting the second shield cover 121, that is, the shield bracket 13 is multi-pointed by the second contact piece 133 and the second shield cover 121. Therefore, the first shield case 111 and the second shield case 121 can be effectively grounded.
  • the number of the first shielding covers 111 may be the same as the number of the first contact pieces 132, and the number of the second shielding covers 121 may be the same as the number of the second contact pieces 133.
  • the first PCB board 11 may be a narrow strip board (ie, a private network PCB board), and the second PCB board 12 may be a broadband board (ie, a public network PCB board).
  • the first PCB board 11 may be provided with a plurality of first communication modules, the first shield cover 111 is for covering the corresponding first communication module, and the first shield cover 111 is connected to the ground of the first PCB board 11.
  • the second PCB board 12 may be provided with a plurality of second communication modules, the second shield cover 121 is for covering the corresponding second communication module, and the second shield cover 121 is connected to the ground of the second PCB board 12.
  • the first communication module and the second communication module may specifically be a GSM module, an LTE module, a WIFI module, a BT module, a GPS module, or an RFID module.
  • the shield bracket 13 may be fixed to the first PCB board 11, and in other embodiments, the shield bracket 13 may be fixed to the second PCB board 12.
  • the opposite sides of the shielding bracket 13 are provided with a card hole 134.
  • the first PCB board 11 is provided with a buckle 112 corresponding to the card hole 134.
  • the buckle 112 is disposed on the first PCB board 11. On both sides.
  • the shield bracket 13 is fastened and fixed to the first PCB board 11.
  • the shield bracket 13 is fixed to the first PCB board 11 by snapping, and the assembly is simple.
  • the buckle 112 of the first PCB board 11 is provided with leakage copper to implement grounding treatment, and the shield bracket 13 is grounded through the buckle 112.
  • the material of the shield bracket 13 may include stainless steel or beryllium copper, and the elasticity is good, and the reliability of the grounding of the first contact piece 131 and the second contact piece 132 can be improved.
  • the first PCB board 11 further includes a screw hole 113, and the second PCB board 12 is fixed to the screw hole 113 of the first PCB board 11 by screws.
  • the card hole 134 of the shield bracket 13 is fastened to the buckle 112 of the first PCB board 11 so that the shield bracket 13 is fastened and fixed on the first PCB board 11, and the first contact piece 132 of the shield bracket 13 is The first shield cover 111 of a PCB board 11 is in contact, and thus the shield bracket 13 and the first PCB board 11 are realized in multiple points.
  • the second PCB board 12 is fixed to the screw hole 113 of the first PCB board 11 by screws, and the second PCB board 12 is fixed on the first PCB board 11, and the second contact piece 133 and the second PCB board of the shield bracket 13 are at this time.
  • the second shield cover 121 of the 12 contacts, and the shield bracket 13 and the second PCB board 12 are realized in multiple points.
  • the public network PCB board of the prior art is fixed on the special network PCB board by screws.
  • the level of the public network PCB board is inconsistent, resulting in inconsistent level of the special network PCB board, and then the special network PCB board
  • the sensitivity is reduced by 10dB.
  • a shield bracket 13 is disposed between the first PCB board 11 and the second PCB board 12.
  • the second PCB board 12 is in operation, the first PCB board 11 and the second PCB board 12 are multi-pointed by the shield bracket 13
  • the electrical average of the first PCB board 11 and the second PCB board 12 are consistent, thereby improving the sensitivity of the first PCB board 11.
  • the present invention further provides a communication device of another embodiment, which is different from the communication device 10 disclosed in the above embodiment in that, as shown in FIG. 4, the first PCB board 41 and the second PCB board 42 are juxtaposed, and the shield bracket is disposed. 43 is disposed on the first PCB board 41 and the second PCB board 42.
  • the shielding bracket 43 is provided with at least two contact pieces 431 on the side close to the first PCB board 41 and the second PCB board 42, and at least two contact pieces 431 are in contact with the first PCB board 41 and the second PCB board 42, respectively.
  • a first card hole 432 and a second card hole 433 are disposed on opposite sides of the shielding frame 43.
  • the first card plate 41 is disposed on the side away from the second PCB board 42 with a first buckle 412 corresponding to the first card hole 432.
  • a second buckle 422 corresponding to the second card hole 433 is disposed on a side of the second PCB board 42 away from the first PCB board 41.
  • the first card hole 432 is coupled to the first buckle 412 and the second card hole 433. Fastened to the second buckle 422.
  • the first buckle 412 and the second buckle 422 can be provided with leakage copper to achieve grounding treatment, and the shielding bracket 43 is grounded through the first buckle 412 and the second buckle 422.
  • the present invention further provides a communication system.
  • the communication system 50 of the present embodiment includes a communication device 51.
  • the communication device 51 is a communication device disclosed in the foregoing embodiment, and details are not described herein again.
  • the shielding bracket of the present invention is provided with at least two contact pieces, at least two contact pieces are respectively in contact with the first PCB board and the second PCB board, and the first PCB board and the second PCB board are realized by the shield bracket.
  • the first PCB board and the second PCB board can realize multi-point common ground through the shield bracket to improve sensitivity.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Telephone Set Structure (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本发明公开了一种通信设备及其通信系统。该通信设备至少包括第一PCB板、第二PCB板以及屏蔽支架，屏蔽支架设置有至少两个接触片，至少两个接触片分别与第一PCB板和第二PCB板接触，第一PCB板和第二PCB板通过屏蔽支架实现共地。本发明的第一PCB板和第二PCB板能够通过屏蔽支架实现多点共地，提高灵敏度。

Description

通信设备及其通信系统
【技术领域】
本发明涉及通信技术领域，特别是涉及一种通信设备及其通信系统。
【背景技术】
随着通信系统的发展，通信模式越来越多，通信设备通常需要集成GSM（Global System for Mobile Communications，全球移动通信系统）、LTE（Long Term Evolution，长期演进）、WIFI（Wireless Fidelity，无线局域网）、BT（Bluetooth，蓝牙）、GPS（Global Positioning System，全球定位系统）或者RFID（Radio Frequency Identification，无线射频技术）等多种模块。由于通信设备的体积受限，通信设备通常采用多PCB（ Printed Circuit Board，印刷电路板）板结构。
现有技术的通信设备包括专网PCB板和公网PCB板，公网PCB板通过螺丝固定在专网PCB板上，无法实现多点共地，进而降低通信设备的灵敏度。
【发明内容】
本发明主要解决的技术问题是提供一种通信设备及其通信系统，能够实现多点共地，提高灵敏度。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种通信设备，其至少包括第一PCB板、第二PCB板以及屏蔽支架，屏蔽支架设置有至少两个接触片，至少两个接触片分别与第一PCB板和第二PCB板接触，第一PCB板和第二PCB板通过屏蔽支架实现共地。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种通信系统，其包括上述通信设备。
本发明的有益效果是：区别于现有技术的情况，本发明的屏蔽支架设置有至少两个接触片，至少两个接触片分别与第一PCB板和第二PCB板接触，第一PCB板和第二PCB板通过屏蔽支架实现共地，进而第一PCB板和第二PCB板能够通过屏蔽支架实现多点共地，提高灵敏度。
【附图说明】
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要采用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。其中：
图1是本发明一实施例的通信设备的分解示意图；
图2是图1中通信设备的局部结构示意图；
图3是图1中屏蔽支架的结构示意图；
图4是本发明另一实施例的通信设备的剖面示意图
图5是本发明一实施例的通信系统的结构示意图。
【具体实施方式】
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性的劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参见图1-2所示，图1是本发明一实施例的通信设备的分解示意图；图2是图1中通信设备的局部结构示意图。本实施例所揭示的通信设备10至少包括第一PCB板11、第二PCB板12以及屏蔽支架13，屏蔽支架13设置有至少两个接触片131，至少两个接触片131分别与第一PCB板11和第二PCB板12接触，因此第一PCB板11和第二PCB板12通过屏蔽支架13实现共地。
其中，第二PCB板12设置在第一PCB板11的上方，屏蔽支架13设置在第一PCB板11和第二PCB板12之间。该通信设备10可为手机或者平板电脑等电子设备。
如图3所示，至少两个接触片131可包括至少一个第一接触片132和至少一个第二接触片133，第一接触片132和第二接触片133分别设置在屏蔽支架13的两侧。第一接触片132用于与第一PCB板11接触，即屏蔽支架13靠近第一PCB板11的一侧设置有折叠的第一接触片132，该折叠的第一接触片132与第一PCB板11接触，进而屏蔽支架13通过第一接触片132与第一PCB板11实现多点连接。第二接触片133用于与第二PCB板12接触，即屏蔽支架13靠近第二PCB板12的一侧设置有折叠的第二接触片133，该折叠的第二接触片133与第二PCB板12接触，因此屏蔽支架13通过多个第二接触片132与第二PCB板12实现多点连接。
其中，第一接触片132和第二接触片133均可为弹片。第一接触片132的形状和第二接触片133的形状可设置为长方形。在其他实施例中，第一接触片132的形状和第一接触片133的形状可设置为其他形状，例如圆形。此外，第一接触片132的弦高（即第一接触片132弯曲的高度）可大于屏蔽支架13和第一PCB板11的间距；第二接触片133的弦高（即第二接触片133弯曲的高度）可大于屏蔽支架13和第二PCB板12的间距。
如图1和2所示，第一PCB板11包括至少一个第一屏蔽罩111，第二PCB板12包括至少一个第二屏蔽罩121，第一接触片132用于与第一屏蔽罩111接触，即屏蔽支架13通过第一接触片132与第一屏蔽罩111实现多点共地。第二接触片133用于与第二屏蔽罩121接触，即屏蔽支架13通过第二接触片133与第二屏蔽罩121实现多点共地。因此，第一屏蔽罩111和第二屏蔽罩121能够有效接地。
其中，第一屏蔽罩111的数量与第一接触片132的数量可以相同，第二屏蔽罩121的数量与第二接触片133的数量可以相同。
其中，第一PCB板11可以为窄带板（即专网PCB板），第二PCB板12可以为宽带板（即公网PCB板）。具体地，第一PCB板11可以设置有多个第一通信模块，第一屏蔽罩111用于罩住对应的第一通信模块，并且第一屏蔽罩111与第一PCB板11的地连接。第二PCB板12可以设置多个第二通信模块，第二屏蔽罩121用于罩住对应的第二通信模块，并且第二屏蔽罩121与第二PCB板12的地连接。第一通信模块和第二通信模块具体可为GSM模块、LTE模块、WIFI模块、BT模块、GPS模块或者RFID模块。
屏蔽支架13可以固定在第一PCB板11上，在其他实施例中，屏蔽支架13可以固定在第二PCB板12上。
如图1-3所示，屏蔽支架13相对的两侧均设置有卡孔134，第一PCB板11设置有与卡孔134对应的卡扣112，卡扣112设置在第一PCB板11的两侧。在卡孔134扣合在卡扣112上时，屏蔽支架13扣合固定在第一PCB板11上。屏蔽支架13通过扣合固定在第一PCB板11上，装配简单。
可选地，第一PCB板11的卡扣112设置漏铜，实现接地处理，进而屏蔽支架13通过卡扣112接地。
可选地，屏蔽支架13的材料可包括不锈钢或者铍铜，弹性良好，能够提高第一接触片131和第二接触片132接地的可靠性。
如图2所示，第一PCB板11进一步包括螺丝孔113，第二PCB板12通过螺丝固定在第一PCB板11的螺丝孔113上。
以下详细描述第一PCB板11、第二PCB板12以及屏蔽支架13的装配过程。
屏蔽支架13的卡孔134扣合在第一PCB板11的卡扣112上，以使得屏蔽支架13扣合固定在第一PCB板11上，此时屏蔽支架13的第一接触片132与第一PCB板11的第一屏蔽罩111接触，进而屏蔽支架13与第一PCB板11实现多点共地。
第二PCB板12通过螺丝固定在第一PCB板11的螺丝孔113，进而第二PCB板12固定在第一PCB板11上，此时屏蔽支架13的第二接触片133与第二PCB板12的第二屏蔽罩121接触，进而屏蔽支架13与第二PCB板12实现多点共地。
现有技术的公网PCB板通过螺丝固定在专网PCB板上，在公网PCB板工作时，公网PCB板的电平不一致，导致专网PCB板的电平不一致，进而专网PCB板的灵敏度降低10dB。本实施例在第一PCB板11和第二PCB板12之间设置屏蔽支架13，在第二PCB板12工作时，由于第一PCB板11和第二PCB板12通过屏蔽支架13实现多点共地，因此第一PCB板11和第二PCB板12的电平均保持一致，进而提高第一PCB板11的灵敏度。
本发明进一步提供另一实施例的通信设备，其与上述实施例所揭示的通信设备10不同之处在于：如图4所示，第一PCB板41和第二PCB板42并列设置，屏蔽支架43设置在第一PCB板41和第二PCB板42上。屏蔽支架43在靠近第一PCB板41和第二PCB板42的一侧设置有至少两个接触片431，至少两个接触片431分别与第一PCB板41和第二PCB板42接触。
屏蔽支架43的相对两侧设置有第一卡孔432和第二卡孔433，第一PCB板41远离第二PCB板42的一侧设置有与第一卡孔432对应的第一卡扣412；第二PCB板42远离第一PCB板41的一侧设置有与第二卡孔433对应的第二卡扣422，第一卡孔扣432合在第一卡扣412，第二卡孔433扣合在第二卡扣422。
其中，第一卡扣412和第二卡扣422均可以设置有漏铜，实现接地处理，进而屏蔽支架43通过第一卡扣412和第二卡扣422接地。
本发明进一步提供一种通信系统，如图55所示，本实施例的通信系统50包括通信设备51，该通信设备51为上述实施例所揭示的通信设备，在此不再赘述。
综上所述，本发明的屏蔽支架设置有至少两个接触片，至少两个接触片分别与第一PCB板和第二PCB板接触，第一PCB板和第二PCB板通过屏蔽支架实现共地，进而第一PCB板和第二PCB板能够通过屏蔽支架实现多点共地，提高灵敏度。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (10)

  1. 一种通信设备，其中，所述通信设备至少包括第一PCB板、第二PCB板以及屏蔽支架，所述屏蔽支架设置有至少两个接触片，所述至少两个接触片分别与所述第一PCB板和所述第二PCB板接触，所述第一PCB板和所述第二PCB板通过所述屏蔽支架实现共地。
  2. 根据权利要求1所述的通信设备，其中，所述至少两个接触片包括至少一个第一接触片和至少一个第二接触片，所述第一接触片用于与所述第一PCB板接触，所述第二接触片用于与所述第二PCB板接触。
  3. 根据权利要求2所述的通信设备，其中，所述第一PCB板包括至少一个第一屏蔽罩，所述第二PCB板包括至少一个第二屏蔽罩，所述第一接触片用于与所述第一屏蔽罩接触，所述第二接触片用于与所述第二屏蔽罩接触。
  4. 根据权利要求3所述的通信设备，其中，所述第二PCB板设置在所述第一PCB板上，所述屏蔽支架设置在所述第一PCB板和所述第二PCB之间。
  5. 根据权利要求4所述的通信设备，其中，所述屏蔽支架固定在所述第一PCB板，所述屏蔽支架的相对两侧均设置有卡孔，所述第一PCB板设置有与所述卡孔对应的卡扣，所述卡孔扣合在所述卡扣上；所述第一PCB板的卡扣进一步设置漏铜，所述屏蔽支架通过所述卡扣接地。
  6. 根据权利要求3所述的通信设备，其中，所述第一PCB板和所述第二PCB板并列设置，所述屏蔽支架设置在所述第一PCB板和所述第二PCB板上。
  7. 根据权利要求6所述的通信设备，其中，所述屏蔽支架的相对两侧设置有第一卡孔和第二卡孔，所述第一PCB板远离所述第二PCB板的一侧设置有与所述第一卡孔对应的第一卡扣，所述第二PCB板远离所述第一PCB板的一侧设置有与所述第二卡孔对应的第二卡扣，所述第一卡孔扣合在所述第一卡扣，所述第二卡孔扣合在所述第二卡扣；
    所述第一卡扣和所述第二卡扣均设置有漏铜，所述屏蔽支架通过所述第一卡扣和所述第二卡扣接地。
  8. 根据权利要求1所述的通信设备，其中，所述屏蔽支架的材料包括不锈钢或者铍铜。
  9. 根据权利要求1所述的通信设备，其中，所述第一PCB板为窄带板，所述第二PCB板为宽带板。
  10. 一种通信系统，其中，所述通信系统包括如权利要求1-9任一所述的通信设备。
PCT/CN2017/087762 2017-06-09 2017-06-09 通信设备及其通信系统 WO2018223384A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1610834A (zh) * 2001-07-05 2005-04-27 英特泰克公司 用于电子电路的优化并行测试和访问的方法及设备
CN101415297A (zh) * 2007-10-19 2009-04-22 华为技术有限公司 一种印制板组件及其加工方法
CN204390122U (zh) * 2015-01-23 2015-06-10 邹士磊 绿色电脑
CN106209122A (zh) * 2016-07-18 2016-12-07 孙海华 发射机的射频一体化结构

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1610834A (zh) * 2001-07-05 2005-04-27 英特泰克公司 用于电子电路的优化并行测试和访问的方法及设备
CN101415297A (zh) * 2007-10-19 2009-04-22 华为技术有限公司 一种印制板组件及其加工方法
CN204390122U (zh) * 2015-01-23 2015-06-10 邹士磊 绿色电脑
CN106209122A (zh) * 2016-07-18 2016-12-07 孙海华 发射机的射频一体化结构

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