WO2018223249A1 - 一种单纤双向组件 - Google Patents

一种单纤双向组件 Download PDF

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Publication number
WO2018223249A1
WO2018223249A1 PCT/CN2017/079036 CN2017079036W WO2018223249A1 WO 2018223249 A1 WO2018223249 A1 WO 2018223249A1 CN 2017079036 W CN2017079036 W CN 2017079036W WO 2018223249 A1 WO2018223249 A1 WO 2018223249A1
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Prior art keywords
fpc substrate
package
filter
chip
fiber
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PCT/CN2017/079036
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English (en)
French (fr)
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孙辉
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深圳市亚派光电器件有限公司
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Priority to PCT/CN2017/079036 priority Critical patent/WO2018223249A1/zh
Priority to CN201780000439.6A priority patent/CN109716190A/zh
Publication of WO2018223249A1 publication Critical patent/WO2018223249A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers

Definitions

  • the invention belongs to the technical field of optical fiber communication, and particularly relates to a single-fiber bidirectional component.
  • the single-fiber bidirectional component (BOSA, BidirectionalOpticalSubassembly) is the core device of modern optical communication.
  • the single-fiber bidirectional component is a photoelectric conversion device that integrates transmission and reception, and adopts an optical fiber to realize bidirectional transmission of data.
  • Commonly used single-fiber bidirectional components generally use two wavelengths for transmitting and receiving optical signals. One wavelength is used to emit an optical signal and the other wavelength is used to receive an optical signal.
  • the existing single-fiber bidirectional components generally have an LD component, a PD component, an optical fiber, and the like coaxially disposed on a base or a square seat, and in the actual production process, the above-mentioned structure has a long production cycle and a high production cost.
  • the object of the present invention is to overcome the above-mentioned deficiencies of the prior art, and to provide a single-fiber bidirectional component, which adopts a method of integrating an LD chip and a PD chip on an FPC substrate, has a simple structure, a short production cycle, and low production cost.
  • a single-fiber bidirectional component including an FPC substrate, a filter, an optical fiber, and a package, wherein an LD chip and a PD chip are integrated on the FPC substrate, and one end of the FPC substrate is further provided.
  • a gold finger, a focusing lens is integrated on the package, a fiber optic interface is disposed on the package, the optical fiber is disposed in the optical fiber interface, and the package is used to encapsulate the filter,
  • the FPC substrate, after the FPC substrate is encapsulated by the package, the gold finger is located outside the package.
  • an MPD chip is further integrated on the FPC substrate.
  • an amplifier module is further integrated on the FPC substrate.
  • a filter capacitor is further integrated on the FPC substrate.
  • the FPC substrate includes an FPC circuit board and a reinforcing plate disposed under the FPC circuit board.
  • the filter is fixed in the package by a filter holder.
  • the filter comprises a 0 degree filter parallel to the FPC substrate and a 45 degree filter disposed at an angle of 45 degrees to the 0 degree filter.
  • the axis of the fiber coincides with the centerline of the 45 degree filter.
  • the package is made of plastic.
  • the invention provides a single-fiber bidirectional component, which adopts the method of integrating an LD chip and a PD chip on an FPC substrate, has a simple structure, a short production cycle and low production cost.
  • FIG. 1 is a schematic cross-sectional view of a single-fiber bidirectional component according to an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a single-fiber bidirectional component according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of an optical path of a single-fiber bidirectional component according to an embodiment of the present invention.
  • a single-fiber bidirectional component includes an FPC substrate 1 , a filter 2 , an optical fiber 3 , and a package 4 .
  • the LD chip 5 and the PD chip are integrated on the FPC substrate 1 . 6.
  • the FPC substrate 1 is further provided with a gold finger 13 at one end thereof, a focusing lens 41 is integrated on the package 4, a fiber optic interface 42 is disposed on the package 4, the optical fiber 3 is disposed in the optical fiber interface 42, and the package 4 is used for packaging and filtering. After the optical sheet 2 and the FPC board 1 are packaged by the package 4, the gold finger 13 is located outside the package 4.
  • a single-fiber bidirectional component is provided in the embodiment of the present invention, wherein a series of circuits are integrated on the FPC substrate 1 , and the FPC substrate 1 includes an FPC circuit board 11 and is disposed on the FPC board 1 .
  • the reinforcing plate 12 under the FPC circuit board 11 and the reinforcing plate 12 can play a supporting role.
  • the laser light and the receiving laser are used for packaging.
  • the component 4 functions as a package, and an optical path structure is distributed thereon, and a concentrating lens is integrated on the package 4;
  • the FPC substrate 1 is further provided with a gold finger 13 at one end thereof, and the FPC substrate 1 is encapsulated by the package 4, the golden finger 13 is located outside the package 4, and the gold finger 13 can be directly connected to the external PCB board, which is more convenient to use and saves the subsequent process cost.
  • the filter 2 can be fixed in the package 4 through the filter holder 7.
  • the filter 2 includes a 0 degree filter 21 parallel to the FPC substrate 1, and a filter with 0 degrees.
  • the light sheet 21 is a 45 degree filter 22 disposed at an angle of 45 degrees, wherein the 0 degree filter 21 can isolate the incident light and prevent crosstalk, and the 45 degree filter 22 can function as a light splitting, that is, A part of the wavelength of light is transmitted, and a part of the wavelength of light is reflected.
  • the optical fiber 3 is specifically a pigtail, and the axis of the pigtail coincides with the center line of the 45-degree filter 22, as shown in FIG. 3, and further, the LD chip 5 emits light through the package 4.
  • the focusing lens 41 is focused and reflected, and then enters the pigtail through the 45° filter 22; the light signal from the pigtail is reflected by the 45° filter 22 and then filtered by the 0 degree filter 21 to The PD chip 6 is further converted into a current.
  • the optical fiber 3 can be fixed to the optical fiber interface 42 through the adjusting ring 31 (metal) and the metal sleeve 32, that is, fixed by the splicing.
  • the FPC substrate 1 can also be integrated with an MPD chip (backlight detector chip).
  • the MPD chip is generally used for monitoring the backlight of the laser chip, and can be used for monitoring the optical power of the LD chip 5, that is, The transmission power of the LD chip 5 is monitored.
  • the FPC substrate 1 is further integrated with an amplifier module.
  • the amplifier module may include a preamplifier TIA, a limiting amplifier LA, etc., and the optical signal coming from the pigtail is filtered by 45°. After the light sheet 22 is reflected, it is filtered by the 0 degree filter 21 to be irradiated onto the PD chip 6, and then converted into a current, and the amplifier module can amplify and output the current.
  • the FPC substrate 1 is further integrated with a filter capacitor, and the filter capacitor can function as a filter.
  • the material of the package 4 is plastic, and the package 4 and the focusing lens 41 can be integrally formed, that is, one injection molding, which saves cost.
  • the photovoltaic chip (LD chip, PD chip, etc.) and the circuit integrated patch are mounted on the FPC substrate, and the structure is simple and cost-saving.
  • Optoelectronic chip integration and lens integration reduce product processing steps and save costs.
  • the gold finger on the FPC board can be directly connected to the external PCB board, which is more convenient to use and saves the subsequent process cost.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

一种单纤双向组件，包括FPC基板（1）、滤光片（2）、光纤（3）、封装件（4），其中， FPC基板（1）上集成有LD芯片（5）、PD芯片（6），FPC基板（1）的一端还设有金手指（13），封装件（4）上集成有聚焦透镜（41），封装件（4）上设有光纤接口（42），光纤（3）设于光纤接口（42）中，封装件（4）用于封装滤光片（2）、FPC基板（1）， FPC基板（1）由封装件（4）封装后，金手指（13）位于封装件（4）外侧。单纤双向组件采用FPC基板（1）上集成LD芯片（5）、PD芯片（6）的方式，结构简单，生产周期短，生产成本低。

Description

—种单纤双向组件 技术领域
本发明属于光纤通讯技术领域，具体涉及到一种单纤双向组件。
背景技术
单纤双向组件（BOSA,BidirectionalOpticalSubassembly)是现代光通信的核心器件。单纤双向组件是集发射和接收于一体的光电转换器件，其采用一根光纤实现数据双向传输的功能。
常用的单纤双向组件一般是采用两种波长进行光信号的发射和接收。一种波长用于发射光信号，另一种波长用于接收光信号。现有的单纤双向组件一般均是在基体或者四方座上同轴设置LD组件、PD组件、光纤等，而在实际生产过程中，上述结构的生产周期较长、生产成本较高。
发明内容
本发明的目的在于克服上述现有技术的不足，提供了一种单纤双向组件，其采用FPC基板上集成LD芯片、PD芯片的方式，结构简单，生产周期短，生产成本低。
本发明是这样实现的：一种单纤双向组件，包括FPC基板、滤光片、光纤、封装件，其中，所述FPC基板上集成有LD芯片、PD芯片，所述FPC基板的一端还设有金手指，所述封装件上集成有聚焦透镜，所述封装件上设有光纤接口，所述光纤设于所述光纤接口中，所述封装件用于封装所述滤光片、所述FPC基板，所述FPC基板由所述封装件封装后，所述金手指位于所述封装件外侧。
作为本发明的一个优选方案，所述FPC基板上还集成有MPD芯片。
作为本发明的一个优选方案，所述FPC基板上还集成有放大器模块。
作为本发明的一个优选方案，所述FPC基板上还集成有滤波电容。
作为本发明的一个优选方案，所述FPC基板包括FPC电路板以及设于所述FPC电路板下方的补强板。
作为本发明的一个优选方案，所述滤光片通过滤光片支架固定在所述封装件中。
作为本发明的一个优选方案，所述滤光片包括与FPC基板平行的0度滤光片、以及与0度滤光片成45度夹角设置的45度滤光片。
作为本发明的一个优选方案，所述光纤的轴线与所述45度滤光片的中心线重合。
作为本发明的一个优选方案，所述封装件的材质为塑胶。
本发明提供的一种单纤双向组件，其采用FPC基板上集成LD芯片、PD芯片的方式，结构简单，生产周期短，生产成本低。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
以下附图仅旨在于对本发明做示意性说明和解释，并不限定本发明的范围。
图1是本发明实施例提供的单纤双向组件的截面示意图；
图2是本发明实施例提供的单纤双向组件的结构示意图；
图3是本发明实施例提供的单纤双向组件的光路示意图；
附图标号说明：
1、FPC基板，1KFPC电路板；12、加强板；13、金手指；
2、滤光片；21、0度滤光片；22、45度滤光片；
3、光纤；31、调节环；32、金属套管；
4、封装件；41、聚焦透镜；42、光纤接口;
5、LD芯片;
6、PD芯片;
7、滤光片支架。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一歩详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
实施例
如图1、图2、图3所示，一种单纤双向组件，包括FPC基板1、滤光片2、光纤3、封装件4，其中，FPC基板1上集成有LD芯片5、PD芯片6，FPC基板1的一端还设有金手指13，封装件4上集成有聚焦透镜41，封装件4上设有光纤接口42，光纤3设于光纤接口42中，封装件4用于封装滤光片2、FPC基板1，FPC基板1由封装件4封装后，金手指13位于封装件4外侧。
由上述描述可知，如图1、图2所示，本发明实施例提供的一种单纤双向组件，其中，FPC基板1上集成有一系列的电路，FPC基板1包括FPC电路板11以及设于FPC电路板11下方的补强板12，补强板12可起到可起到支撑作用，LD芯片5、PD芯片6集成在FPC电路板11上后，分别用于发射激光和接收激光，封装件4起到封装的作用，其上分布有光路结构，且封装件4上集成有聚光透镜；FPC基板1的一端还设有金手指13，FPC基板1由封装件4封装后，金手指13位于封装件4外侧，进而金手指13可与外接的PCB板直接悍接，使用更方便，节省了后续工艺成本。
在本实施例中，滤光片2可通过滤光片支架7固定在封装件4中，具体的，滤光片2包括与FPC基板1平行的0度滤光片21、以及与0度滤光片21成45度夹角设置的45度滤光片22，其中，0度滤光片21可起到隔离入射光，防止串扰的作用，45度滤光片22可起到分光作用，即一部分波长的光透射，一部分波长的光反射。
在本实施例中，光纤3具体为尾纤，且该尾纤的轴线与45度滤光片22的中心线重合，如图3所示，进而，LD芯片5发射光，经过封装件4中的聚焦透镜41聚焦后反射，然后透过45°滤光片22进入尾纤中；从尾纤中过来的光信号由45°滤光片22反射后经过0度滤光片21滤光照射到PD芯片6上，进而转换为电流。
在本实施例中，如图1所示，光纤3可以通过调节环31(材质为金属）、金属套管32固定在光纤接口42处，即通过悍接固定。
更佳的，在本实施例中，FPC基板1上还可集成有MPD芯片（背光探测器芯片），MPD芯片一般用于监控激光器芯片背光，即可用于监测LD芯片5的光功率大小，即监测LD芯片5的发射功率。
更佳的，在本实施例中，FPC基板1上还集成有放大器模块，具体的，放大器模块可包括前置放大器TIA、限幅放大器LA等，从尾纤中过来的光信号由45°滤光片22反射后经过0度滤光片21滤光照射到PD芯片6上，进而转换为电流，放大器模块可以将该电流放大输出。 更佳的，在本实施例中，FPC基板1上还集成有滤波电容，滤波电容可以起到滤波作用。
更佳的，封装件4的材质为塑胶，进而封装件4与聚焦透镜41可以为一体成型，即一次注塑成型，节约成本。
由上述描述可知，本发明提供的一种单纤双向组件，具有以下优点：
1、将聚焦透镜和光路集成在封装件4上，一体成型，结构简单，节省成本。
2、将光电芯片（LD芯片、PD芯片等）和电路集成贴片在FPC基板上，结构简单，节省成本。
3、光电芯片集成和透镜集成，缩减产品加工工序，节省成本。
4、提高芯片贴片精度，发射和接收一次耦合完成。
5、FPC基板上的金手指可与外接的PCB板直接悍接，使用更方便，节省了后续工艺成本。
以上仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换或改进等，均应包含在本发明的保护范围之内。

Claims (9)

  1. 一种单纤双向组件，其特征在于，包括FPC基板、滤光片、光纤、封装件，其中，所述FPC基板上集成有LD芯片、PD芯片，所述FPC基板的一端还设有金手指，所述封装件上集成有聚焦透镜，所述封装件上设有光纤接口，所述光纤设于所述光纤接口中，所述封装件用于封装所述滤光片、所述FPC基板，所述FPC基板由所述封装件封装后，所述金手指位于所述封装件外侧。
  2. 如权利要求1所述的单纤双向组件，其特征在于，所述FPC基板上还集成有MPD芯片。
  3. 如权利要求1所述的单纤双向组件，其特征在于，所述FPC基板上还集成有放大器模块。
  4. 如权利要求1所述的单纤双向组件，其特征在于，所述FPC基板上还集成有滤波电容。
  5. 如权利要求1所述的单纤双向组件，其特征在于，所述FPC基板包括FPC电路板以及设于所述FPC电路板下方的补强板。
  6. 如权利要求1所述的单纤双向组件，其特征在于，所述滤光片
    通过滤光片支架固定在所述封装件中。
  7. 如权利要求6所述的单纤双向组件，其特征在于，所述滤光片包括与FPC基板平行的O度滤光片、以及与0度滤光片成45度夹角设置的45度滤光片。
  8. 如权利要求7所述的单纤双向组件，其特征在于，所述光纤的轴线与所述45度滤光片的中心线重合。
  9. 如权利要求1-8任一项所述的单纤双向组件，其特征在于，所述封装件的材质为塑胶。
PCT/CN2017/079036 2017-06-09 2017-06-09 一种单纤双向组件 WO2018223249A1 (zh)

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CN106646769A (zh) * 2015-11-04 2017-05-10 江苏飞格光电有限公司 波分复用光收发一体单纤双向器件
CN105487183A (zh) * 2016-01-15 2016-04-13 深圳市恒宝通光电子股份有限公司 一种双通道的cwdm收发一体光电模块

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