WO2018219683A1 - Integral deformation sensor and method for measuring the deformation of a surface of a solid - Google Patents

Integral deformation sensor and method for measuring the deformation of a surface of a solid Download PDF

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Publication number
WO2018219683A1
WO2018219683A1 PCT/EP2018/063015 EP2018063015W WO2018219683A1 WO 2018219683 A1 WO2018219683 A1 WO 2018219683A1 EP 2018063015 W EP2018063015 W EP 2018063015W WO 2018219683 A1 WO2018219683 A1 WO 2018219683A1
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WO
WIPO (PCT)
Prior art keywords
face
coating
sensor
sensor according
film
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Application number
PCT/EP2018/063015
Other languages
French (fr)
Inventor
Samuel BEHAR
Jean-Jacques BOIS
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Nanolike
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Publication of WO2018219683A1 publication Critical patent/WO2018219683A1/en

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/20Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • G01L1/2293Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges of the semi-conductor type

Definitions

  • the invention relates to a deformation sensor capable of measuring the deformation of a surface of a solid, and to a method for measuring the deformation of a surface of a solid using such a deformation sensor.
  • the measurement of the surface deformation of solids is useful in many applications for the control of the mechanical behavior of solids for example for prevention, design, maintenance, metrology, automation ...
  • the measurement of the surface deformation of a solid makes it possible not only to determine the deformation undergone on the surface by the solid, but also to determine the forces and / or stresses experienced by the solid under the effect of stresses of all types: traction and / or compression and / or bending, twisting and / or shearing.
  • At least one sensitive element is applied, or at least one deformation sensor incorporating at least one such sensitive element on the surface of the solid.
  • a sensitive element generally improperly qualified as a "strain gauge” (the term “strain gauge” being more appropriate but less common) has at least one electrical characteristic (generally resistance or capacitance) which varies according to a state of deformation of the surface of the solid.
  • the traditional strain gauges known for more than fifty years are formed of flexible films carrying a conductive material track (metal alloy) arranged in a coil.
  • Piezoelectric strain gauges based on semiconductor materials are also known which have a better sensitivity but a less good linearity and a greater sensitivity to temperature variations.
  • Strain gauges based on nanoparticles for example metal nanoparticles, in particular gold or carbon, assembled by deposition on a flexible film, which are of interest for a very high gauge factor, are also known. wide deformation range and low power consumption (see in particular "High- According to Cosmin Farcau et al., ACS Nano, 2011, 5 (9), pp. 7137-7143, DOI: 10.1021 / nn201833y; or "Influence of the Humidity on Nanoparticle-Based Resistive Strain Gauges” Lucas Digianantonio et al, J. Phys. Chem. C, 2016, 120 (10), pp. 5848-5854, DOI: 10.1021 / acs.jpcc.6b00822; US7116209).
  • connection between the flexible film of the sensitive element and the surface of the solid must be perfect, that is to say in theory have an infinite rigidity, so that any deformation of the surface of the solid can be reflected on the sensing element.
  • Mechanical assembly connections (screws, bolts, rivets, welds ...) are very long and expensive and are now abandoned in most applications.
  • the strain gauges are glued by rigid adhesives such as cyanoacrylate or epoxy glues on the surface of the solid. Nevertheless, this bonding operation is in practice extremely delicate, relatively long (typically of several tens of minutes) and requires an important know-how that few operators master completely.
  • such mechanical assemblies of the strain gauge to a support before it is bonded to the surface of the solid part to be tested necessarily imply an interference of the mechanical properties (mass, inertia, rigidity, etc.) of this support with respect to the strain gauge and with respect to the deformations of the surface of the solid part, and therefore the malfunctions or reliability of the latter.
  • WO 2016/030752 discloses a stretchable sensor patch comprising a stretchable elastic film layer carrying at least one elastic capacitive strip or at least one resilient resistive filament and an integrated circuit, and a flexible stretchable flexible protective layer for protecting said at least one strip and the integrated circuit.
  • the elastic stretch film can also carry a wireless transmission circuit and a source of electrical power.
  • the thickness of this patch is less than a few millimeters, and may for example be between 40 ⁇ and 20 ⁇ . In addition to being limited to measuring tensile deformities on human or animal organs, such a patch is fragile and difficult to handle, store, transport, pack, and install on a surface.
  • the invention aims to overcome these disadvantages.
  • It aims in particular to provide a deformation sensor whose attachment to a surface of a solid whose deformation must be measured is simplified, fast, reliable, and which also has a sufficiently large gauge factor and provides reliable results and specific. It also aims to provide such a deformation sensor whose handling, storage, transport, packaging and installation on a solid surface are simple, do not require special precautions, can be performed by operators non-specialized, and do not in any way affect the performance of the sensor.
  • the object of the invention is more particularly to provide such a deformation sensor that can be used in a very large number of applications, including those in which the deformations to be measured are of low amplitude, and which is compatible with a large number of materials. different constituents of the surface of the solid whose deformation must be measured.
  • a strain gauge is connected to an electronic circuit which makes it possible to measure the variation of the electrical characteristic of the strain gauge as a function of the deformation, and to deliver a corresponding measurement signal.
  • Such an electronic circuit generally incorporates components for calibrating and thermally compensating the measurement signal delivered by the sensor.
  • the invention aims more particularly at providing such a deformation sensor which can integrate such an electronic circuit and which is therefore entirely prefabricated in the form of a sensor in one single autonomous, precalibrated.
  • the invention aims in particular to provide such a deformation sensor capable of delivering a measurement signal in a format compatible with most systems and automation capable of exploiting such a measurement signal.
  • the invention thus aims to propose a deformation sensor whose implementation is particularly simple and only requires its attachment to the surface a solid whose deformation must be measured, and the connection of the sensor to a system for exploiting the measurement signal delivered by the sensor.
  • the invention also aims at providing such a sensor whose manufacture is particularly simple, reliable and inexpensive.
  • the invention also aims at providing a method for measuring the deformation of the surface of a solid having the same advantages.
  • the invention therefore relates to a deformation sensor having a free face, called a fixing face, adapted to be applied to a surface of a solid whose deformation must be measured, and comprising:
  • At least one sensitive element whose electrical characteristic varies according to its deformation arranged in such a way that said electrical characteristic of the sensitive element varies as a function of a deformation state of at least a portion of said fixing face
  • said fixing face of the sensor is entirely constituted by a free face of a piece of film, this piece of film having a face, said support face, opposite to said fixing face, and a constant thickness between said fixing face; and said support face,
  • At least one sensitive element is applied to said support face
  • the fixing face of a sensor according to the invention being a free face of a piece of film has a smooth surface, so smooth, continuous and free of asperities, discontinuities, slots, recesses, lights or d interfaces between several materials.
  • united applied to a surface designates the fact that this surface is free of asperities and is continuous, that is to say can be entirely traversed by moving a pencil held in contact of this surface without having to break this contact.
  • the attachment face is formed by a single piece of film, which is a solid material homogeneous by nature (that is to say a piece of film free of gaps, lights, or heterogeneities). Consequently, the sensor according to the invention can be fixed to the surface of a solid exclusively via this fixing face, in particular by bonding with an adhesive compatible with said piece of film and with the solid surface.
  • said piece of film is formed of a single layer of homogeneous material of constant thickness and has no adhesive layer.
  • the fixing face is not itself adhesive and the bonding of the fixing face is achieved by means of a glue attached to this attachment face or on the surface of the solid on which the The sensor must be attached, or an adhesive that is an integral part of this surface, or even using a double-sided adhesive or a layer of transfer adhesive applied by transfer on the attachment face.
  • said fixing face is adapted to be fixed by gluing to a surface of an object with an adhesive selected from the group consisting of cyanoacrylate adhesives, glues epoxy, polyurethane glues, silicone glues, nitrile glues and neoprene glues.
  • said piece of film has an adhesive bonding layer forming said fixing face.
  • said piece of film may advantageously be formed of a layer of flexible homogeneous dielectric material adapted to receive and support each sensitive element, and of a layer of adhesive composition superimposed on this layer of dielectric material.
  • Such a layer of adhesive composition may be chosen in particular from pressure-sensitive adhesives at ambient temperature, heat-activatable adhesives, ultraviolet-activatable adhesives and chemically activatable adhesives (in particular by the humidity of the ambient air and or by addition of an activating agent).
  • This piece of film forming a support on which is applied at least one element sensitive to deformation is necessarily already inherently compatible with a collage.
  • the coating extending around each sensitive element opposite the fixing face makes it possible to protect each sensitive element from various external aggressions, and, above all, facilitates the handling, the transport, the storage, the packaging and installation of a sensor according to the invention, and this by non-specialized operators, that is to say other than the operators specializing in the bonding operations of traditional strain gages.
  • a sensor according to the invention is therefore capable of being fixed on a surface of a solid exclusively by said fixing face, and thus by means of said piece of film which constitutes the sole element of the sensor according to the invention. in contact with this solid surface.
  • the coating does not come into contact with the surface of the solid on which the sensor is attached, does not interfere with this surface of the solid, and therefore has only a minimal influence on the mechanical behavior of each sensitive element and the sensor from the point of view of the detection of deformations. This influence is all the more negligible that the coating itself is sufficiently flexible and that the gauge factor of each sensitive element is in itself sufficiently important, the decrease of the gauge factor by the presence of the remaining coating acceptable.
  • a sensor according to some embodiments of the invention is advantageously at least one sensitive element formed of a nanoparticle-based strain gauge applied to said support face .
  • said nanoparticles are chosen from the group of metal nanoparticles, semiconductor nanoparticles and their aggregates, assembled via an insulating material or a semiconductor material. More particularly, these are nanoparticles chosen from the group of gold nanoparticles and carbon nanoparticles.
  • the senor according to the invention comprises a resistive strain gauge formed of at least one wire of colloidal gold nanoparticles extending between two electrodes as described by Cosmin Farcau et al. Lucas Digianantonio et al publication cited above or US7116209.
  • Such strain gauges based on nanoparticles have a very high gauge factor, especially greater than 20. Surprisingly, it has been found that a sensor according to the invention can thus have a gauge factor greater than 15, despite the presence of the coating.
  • each sensitive element, said coating and said piece of film are chosen so that the sensor has (after bonding to a solid surface via a rigid glue such as a cyanoacrylate glue) a higher gauge factor. at 5, in particular greater than 10, in particular greater than 15.
  • the nanoparticles are directly deposited on said support face of said piece of film, the latter thus constituting the substrate supporting the nanoparticles forming the strain gauge.
  • the film constituting said piece of film forming said fixing face and said support face is a flexible film supporting at least one deformation-sensitive element applied directly on said support face of this flexible film during manufacture. Consequently, the mechanical properties of this flexible film are, by their nature, perfectly adapted to the appropriate operation of each sensitive element for the detection of the deformations of the surface of the solid on which the sensor according to the invention is then fixed.
  • a sensitive element comprises a flexible film pellet on which the nanoparticles are deposited, and the strain gauge thus formed is itself applied to said support face of said piece of film, possibly via a layer of glue.
  • the flexible film forming the substrate supporting the nanoparticles is itself applied to said support face of said piece of film.
  • Said piece of film may then be formed of a film of the same nature as the flexible film constituting the substrate supporting the nanoparticles.
  • said film constituting said piece of film is a film of polymeric material for example selected from the group consisting of polyimide polyolefins (especially polyethylene terephthalate (PET), polypropylene (PP), polyethylene naphthalate (PEN), and cycloolefin copolymer (COQ), polymethylmethacrylate (PMMA), polycarbonate (PC), polyetheretherketone (PEEK), polyvinyl chloride (PVC), acrylonitrile butadiene styrene (ABS), and halocarbon polymers (especially fluorocarbons such as polytetrafluoroethene (PTFE) and polyvinylidene fluoride (PVDF)).
  • polyimide polyolefins especially polyethylene terephthalate (PET), polypropylene (PP), polyethylene naphthalate (PEN), and cycloolefin copolymer (COQ)
  • PMMA polymethylmethacrylate
  • PC polycarbonate
  • the constituent material of said piece of film is also chosen so as to have a high modulus of elasticity - in particular greater than 1 GPa, for example of the order of 2.5 Gpa- so as to transmit the deformations between the surface of the solid on which the sensor is applied and each sensitive element.
  • said piece of film in particular for the measurement of flexural deformations, must be flexible, that is to say have a low flexural stiffness value, so that it can easily be deformed in flexion according to the flexural deformations of the solid surface.
  • said piece of film advantageously has a thickness of less than 1 mm, in particular between 5 ⁇ and 50 ⁇ , for example of the order of 25 ⁇ -.
  • said piece of film has a flexural stiffness lower than that of the coating.
  • the coating extending opposite said fixing face may have a flexural stiffness a little larger than that of said piece of film.
  • said coating of a sensor according to the invention is a solid-state coating which may be formed into a peripheral shape and of suitable dimensions which may be subject to numerous variations depending on the applications and embodiments of the sensor.
  • a sensor according to the invention has a free peripheral outer surface forming a free peripheral outer surface of the sensor according to the invention.
  • the peripheral outer surface of a sensor according to the invention is entirely formed by said coating and by said piece of film.
  • a sensor according to the invention may be free of rigid peripheral housing, said coating conferring on the sensor its mechanical strength and its general shape, allowing it to be handled in one piece.
  • a reinforcement or a protective cover is provided with a reinforcement or a protective cover. But this reinforcement or protective cover is arranged not to disturb the operation of each sensitive element of the sensor according to the invention, and in particular is in any case remote from said fixing face so as not to come into contact with the surface of the solid on which the sensor according to the invention is applied.
  • Said coating of a sensor according to the invention is sufficiently flexible to preserve a sufficiently large gauge factor value to the sensor according to the invention.
  • said coating is formed of at least one layer of at least one material, each material having a modulus of elasticity of less than 10 MPa.
  • each constituent material of said coating has a modulus of elasticity lower than the modulus of elasticity of the material constituting said piece of film-in particular less than one-hundredth of this modulus of elasticity-.
  • a sensor according to the invention is a sensor in one piece (monoblock) mainly constituted, seen from the outside, of said piece of film and said coating.
  • the modulus of elasticity of said coating - in particular of each material constituting said coating - is preferably greater than 100 kPa.
  • said coating may be formed by molding directly on said support face.
  • said coating advantageously has a thickness greater than 2 mm, in particular between 5 mm and 5 cm, for example of the order of 0.5 cm to 1 cm -1.
  • the thickness of the coating is greater than 5 times - especially between 100 times and 10,000 times, in particular is of the order of 1000 times - the thickness of said piece of film. It can be formed of a single block of the same solid material, a mixture of solid materials or a composite material; or on the contrary in several successive layers of the same material or of different materials, superimposed on said support face and parallel to the latter to each other, rigidly and irremovably connected to each other.
  • At least one first layer of the coating extending in contact with said support face is formed of a dielectric material covering at least each sensitive element applied to said support face.
  • the coating is entirely formed of dielectric material (s), that is to say constitutes a dielectric coating.
  • said coating is formed of at least one polymeric material selected from the group of thermoplastic polymeric materials, viscoelastic polymeric materials, thermosetting polymeric materials, elastomers, their blends. and composite materials. More particularly, said polymeric material may advantageously be chosen from the group of flexible polyurethanes, flexible polyepoxides, and polysiloxanes (silicones).
  • said coating comprises a first coating layer made of a first dielectric material - in particular flexible polyurethane - applied above each sensitive element and said support face and a block of a second polymeric material - in particular a polyepoxide - applied over said first layer, said block having a thickness greater than said first layer.
  • said coating is formed of a single block of a flexible polymeric material, in particular a polyepoxide or a polyurethane. Other embodiments are possible.
  • the coating of a sensor according to the invention is rigidly fixed irremovably to the support face of the piece of film, that is to say is not suitable to be removed after fixing the sensor on a surface of a solid.
  • the coating may be applied to cover said support face by at least one deposition of a curable composition, each deposit forming a layer of the coating. Such deposition can be achieved by simple application or by molding of said curable composition.
  • Each curable composition is cured in situ after deposition, and thus secured rigidly and immovably to the underlying layer, in particular to said piece of film.
  • the constituent material of each layer of the coating can thus be chosen to promote this rigid connection between the layers, and in particular between the coating and said piece of film.
  • At least one layer of the coating is fixed rigidly by gluing with a glue on an underlying layer.
  • the glue which is an integral part of the coating, must also be chosen to have mechanical properties which are those required for the coating.
  • a sensor according to the invention can thus comprise:
  • At least one sensitive element embedded in said coating at a distance from said support face, one or more sensitive elements applied to said support face, and one or more sensitive elements embedded in said coating, at a distance from said support face.
  • said coating extends around each sensitive element and from the support face of the film piece. Consequently, each sensing element extends parallel to said support face in an area less than the total area of this support face.
  • said support face has an area greater than that of each sensitive element parallel to said support face, and greater than the total area of said at least one sensitive element parallel to said support face, that is to say say greater than the total area parallel to said support surface of the surface occupied by the different sensitive elements parallel to said support face when the sensor comprises a plurality of such sensitive elements.
  • a sensor according to the invention has electrical connection pads for electrically connecting this sensitive element to an electronic circuit adapted to measure said electrical characteristic of the sensitive element.
  • a sensor according to the invention is also characterized in that it comprises an electronic circuit:
  • said electronic circuit is integrally included inside the coating, and comprises for this purpose all the components necessary for the measurement of the electrical characteristic of each sensing element, and to the wireless transmission - particularly radio frequency - of the measurement signal outside the coating on sensor according to the invention for an external system such as a computer system.
  • the electronic circuit incorporates in particular a source of electrical power which can be formed for example of at least one battery and / or a photovoltaic component.
  • the electronic circuit may be electrically powered from outside the coating, for example by induction or photoelectric effect.
  • a sensor according to the invention is also characterized in that it comprises a connection port which extends outside said coating and in that said electronic circuit is adapted to deliver said measurement signal on this connection port.
  • connection port may be carried by a plate of said electronic circuit which protrudes outwardly from said coating, for example protruding outwardly from a peripheral face of said coating, in particular a side face of said coating. extending from a peripheral edge of said piece of film forming said attachment face.
  • the only source of rigidity incorporated in a sensor according to the invention is possibly the electronic circuit which can be formed from at least one plate (or printed circuit board) more or less rigid. However, nothing prevents forming the electronic circuit in flexible form, from a flexible substrate plate, at least in its part included inside the coating.
  • the electronic circuit of a sensor according to the invention may comprise a wafer applied in contact with said support face and coated by the coating, and / or a wafer embedded within the thickness of the coating, without coming into contact with said support face.
  • the wafer of the electronic circuit interferes less mechanically with the deformation of said piece of film, and therefore with the operation of each sensitive element.
  • the electronic circuit can be electrically connected to the pads of each sensing element by connecting wires included in said coating (by wire wiring, called "wire”). bonding "in English), or by direct connection (in particular by a flip-chip type assembly).
  • a sensor according to the invention consists of said piece of film forming said fixing face and a polymeric coating extending from said support face opposite to said fixing face, and wherein at least one of a single sensing element is embedded on said support face and said electronic circuit, said connection port extending outside the coating.
  • the sensor further comprises a wireless communication module extending outside said coating and connected to said connection port.
  • connection port of a sensor according to the invention may be adapted to make a wired connection of the sensor according to the invention with an external system such as a computer system.
  • the connection port of a sensor according to the invention may be adapted to receive a connector of a wireless communication module extending outside the coating and adapted to allow the establishing a communication link with an external system.
  • a sensor according to the invention comprises a wireless communication module extending outside the encapsulation and electrically connected to said connection port.
  • a wireless communication module can be chosen for example from a radio frequency communication module, an infrared communication module, an optical communication module, a magnetic communication module, an induction communication module.
  • it may be a radiofrequency module for transmitting the measurement signal according to any appropriate radio frequency protocol (Wi-Fi®, Bluetooth®, ZigBee®, SigFox®, LoRaWan®, mobile telephony protocol (GPRS, UMTS , LTE, WiMax Certainly a radio frequency protocol (Wi-Fi®, Bluetooth®, ZigBee®, SigFox®, LoRaWan®, mobile telephony protocol (GPRS, UMTS , LTE, WiMax ”).
  • Wi-Fi® Wi-Fi®, Bluetooth®, ZigBee®, SigFox®, LoRaWan®, mobile telephony protocol (GPRS, UMTS , LTE, WiMax ).
  • such a wireless communication module may be formed of a rigid plate adapted to be able to extend along a flat face of the coating opposite to the fixing face.
  • such a wafer forming a communication module extends away from this flat face, this wafer having a lateral connector adapted to be connected to said connection port extending projecting from a lateral face of the coating.
  • such a wafer forming a communication module is instead embedded in a recess conjugate coating.
  • a sensor according to the invention thus formed is particularly compact and easy to handle and install.
  • the electronic circuit of a sensor according to the invention may comprise one or more electrical circuits extending between each sensitive element and said connection port.
  • the electronic circuit is adapted to deliver a digital measurement signal, in particular in a format compatible with said wireless communication module and / or with a digital network, for example a format compatible with the Internet network.
  • the electronic circuit is adapted to firstly perform an analog measurement of the electrical characteristic of each sensitive element, and secondly to transform this analog measurement into a digital signal delivered on said connection port, which can be a connector compatible with a computing device and / or with a wireless communication module.
  • a sensor according to the invention can be qualified as digital deformation sensor.
  • a sensor according to the invention comprising an electronic circuit
  • said piece of film and the attachment face extend opposite each sensitive element and at least a part of the electronic circuit.
  • the area of the attachment face is greater than the area occupied by each sensitive element on said support face parallel to said attachment face.
  • a sensor according to the invention can have all shapes and sizes, depending on the applications, and in particular according to the number of sensitive elements and their nature.
  • the general shape of a sensor according to the invention is defined by that of the coating.
  • the coating may be generally prismatic or in the general parallelepiped shape (with the exception of the attachment face whose shape is adapted to that of the solid surface on which the sensor must be fixed as indicated below ).
  • the coating has a planar face opposite to the attachment face as indicated above.
  • a sensor according to the invention has a generally parallelepipedal shape with a width greater than 0.5 cm - in particular less than 10 cm, for example of the order of 1 cm to 2 cm -1 and a length greater than 2 cm - especially less than 50 cm, for example of the order of 2 cm to 5 cm -1. All other forms (cylinder portion, cap, prismatic, non-remarkable shape ...) and dimensions are possible.
  • the shape of the fixing face may be arbitrary, and is adapted to that of the surface of the solid on which the sensor must be fixed.
  • This form of the fixing face depends on that given to said piece of film, the latter depending on the coating superimposed on this piece of film, and which therefore determines its general shape at rest.
  • the coating may be formed by molding as indicated above, a piece of the mold being applied against the fixing face during curing of the coating to give it the desired shape.
  • the fixing face may be flat.
  • the attachment face may be a left surface, for example cylindrical or a cap or a polyhedral surface or the like.
  • the fixing face can be chosen for example from the group consisting of planar faces, cylindrical faces-notably cylindrical of concave-revolution, cylindrical faces-in particular cylindrical of convex-revolution, concave spherical caps, convex spherical caps. concave dish caps, convex dish caps, concave polyhedral faces and convex polyhedral faces.
  • the attachment face may also have any unspecified left shape, neither convex nor concave.
  • the invention applies to a sensor comprising, as sensitive element, any sensitive element of which at least one electrical characteristic varies depending on its deformation. More particularly, in some preferred embodiments, at least one-in particular each-sensitive element is formed of a strain gauge whose impedance varies as a function of its deformation. The electronic circuit is then adapted to electrically power each sensitive element so as to allow the measurement of its impedance.
  • at least one-in particular each-sensitive element is formed of a resistive strain gauge and the electronic circuit is adapted to electrically power each resistive strain gauge.
  • the invention particularly relates to a deformation sensor -in particular a flexural deformation sensor- having a free face, called a fixing face, adapted to be applied to a surface of a solid whose deformation-in particular the bending deformation - must be measured, and including:
  • At least one sensitive element whose electrical characteristic varies according to its deformation arranged in such a way that said electrical characteristic of the sensitive element varies as a function of a deformation state of at least a portion of said fixing face
  • said fixing face of the sensor is entirely constituted by a solid free face of a piece of film, this piece of film having a face, said support face, opposite to said fixing face, and a constant thickness between said face of said film face; fixing and said support face,
  • At least one sensitive element in particular at least one sensitive element based on nanoparticles, is applied to said support face,
  • said piece of film has a thickness of less than 1 mm, in particular between 5 ⁇ and 50 ⁇ , for example of the order of 25 ⁇ -,
  • said coating extends from said support surface of said piece of film to a thickness greater than-in particular greater than 5 times, in particular between
  • said thickness of said coating is greater than 2 mm, in particular between 5 mm and 5 cm, more particularly of the order of 0.5 cm to 1 cm,
  • the modulus of elasticity of said coating - in particular of each material constituting said coating - is greater than 100 kPa, and less than 10 MPa
  • said piece of film is formed of a material having a modulus of elasticity greater than 1 GPa
  • said piece of film has a flexural stiffness lower than that of the coating
  • o adapted to measure said electrical characteristic of each sensitive element, and to deliver a signal, said measurement signal, representative of said electrical characteristic of each sensitive element.
  • the invention makes it possible in particular to obtain, for the first time, a digital deformation sensor in one piece (monoblock), autonomous in its operation, precalibrated, ready to be fixed on a solid surface in one step bonding and to be directly connected to a computer system by a simple connection or establishment of a wireless communication link.
  • the invention also extends to a method of using a sensor according to the invention. It therefore also extends to a method for measuring the deformation of a surface of a solid in which: a deformation sensor according to the invention is chosen,
  • the fixing face of the sensor is fixed on the surface of the solid.
  • the senor is fixed on the surface of the solid by gluing -particularly exclusively by gluing- the fixing face of the sensor on the surface of the solid.
  • the sensor is connected to a computer system so as to transmit to this computer system the measurement signal delivered by the sensor.
  • the sensor is connected to a computer system via the sensor connection port, and this by a wired connection or via a wireless communication module connected to said connection port.
  • the invention also extends to a method of manufacturing a sensor according to the invention. It therefore relates to a method of manufacturing a deformation sensor in which:
  • At least one sensitive element is applied to a face, called the support face, of a piece of film, this piece of film having a face, called the attachment face, opposite to the support face and a constant thickness between the face fixing and the support side,
  • a coating is fixed rigidly and irremovably to said support face so as to extend around each sensitive element, from said support face completely opposite to said attachment face, to a thickness greater than the thickness of said piece of film.
  • the invention also relates to a deformation sensor, a deformation measuring method and a method of manufacturing such a sensor characterized, in combination or not, by all or some of the characteristics mentioned above or below.
  • the various characteristics mentioned above or below must not be considered as closely or inextricably linked together, the invention may relate to only one of these structural or functional features, or only some of these structural or functional characteristics, or only part of one of these structural or functional characteristics, or any grouping, combination or juxtaposition of all or part of these structural or functional characteristics.
  • FIG. 1 is a schematic perspective view of a sensor according to a first embodiment of the invention
  • FIG. 2 is a schematic view from above of the sensor of FIG. 1,
  • FIG. 3 is a schematic side view of the sensor of FIG. 1 shown fixed on a surface of a solid and connected to a computer system,
  • FIGS. 4 and 5 are schematic views in perspective and, respectively, of a sensor according to a second embodiment of the invention.
  • FIG. 6 is a schematic perspective view of a sensor according to a third embodiment of the invention.
  • FIG. 7 is a schematic side view of the sensor of FIG. 6 shown fixed on a surface of a solid and connected to a computer system
  • FIGS. 8 and 9 are schematic side views of a sensor according to a fourth embodiment of the invention, respectively according to a fifth embodiment of the invention.
  • FIG. 10 is a diagram illustrating test results for determining the gage factor of a sensor according to the invention.
  • FIGS. 11 and 12 are diagrams illustrating measurement signals delivered by a strain gauge according to the state of the art and, respectively, by a sensor according to the invention integrating the same strain gauge,
  • FIG. 13 is a block diagram of an exemplary embodiment of an electronic circuit of a sensor according to the invention.
  • the one-piece sensor according to the first embodiment of the invention shown in FIGS. 1 to 3 comprises a rectangular chip 11 of a flexible film of polyimide having a thickness of the order of 25 ⁇ on one side, called the support face 14, of which is applied a strain gauge 12 formed of son of colloidal gold nanoparticles extending between two electrodes 13, which constitute electrical connection pads of the strain gauge 12, as described by the publication Cosmin Farcau et al. by Lucas Digianantonio et al, cited above.
  • An electronic circuit in the form of a printed circuit board also extends in contact with the support face 14, adjacent the strain gauge 12. Connecting wires 16 electrically connect the electrodes 13 of the strain gauge 12 to the electronic circuit.
  • the connecting wires 16 are embedded in the coating 17.
  • the connection port 18 projects outwardly from a side face 19 of the coating 17.
  • the coating 17 has a generally parallelepiped shape. In the figures, it is presumed to be transparent for illustrative purposes.
  • the pellet 11 has a rectangular face, called the fixing face 20, opposite the support face 14 and the coating 17.
  • This fixing face 20 is a free face which allows the bonding of the sensor thus formed on the surface 21 d a solid whose deformations or stresses must be measured, as represented in FIG. 3, by means of a layer 24 of glue which is for example a layer of cyanoacrylate glue or a layer of epoxy glue.
  • the sensor according to the invention thus has a free peripheral outer surface 31 which is formed by said fixing face 20 by the edges peripherals of the pellet 11 and by the coating 17, except for the connection port 18 which protrudes outside the coating 17. This being so, this sensor is free of any rigid peripheral housing. Its mechanical properties making it possible on the one hand easy handling and, on the other hand, the proper operation of the strain gauge 12, are conferred exclusively by the flexible film pellet 11, by the electronic circuit and by the coating 17. .
  • the port 18 of connection is connected by wires 22 (preferably in the form of a network cable such as a USB cable or an Ethernet cable) to a computer system 23 which allows on the one hand the power supply of the circuit 15 electronics, on the other hand the transmission of the measurement signals delivered by the electronic circuit to the computer system 23.
  • wires 22 preferably in the form of a network cable such as a USB cable or an Ethernet cable
  • the strain gauge 12 is a resistive strain gauge, that is to say that its resistance varies as a function of the deformation of the fastening face, which itself depends on the deformation of the surface 21 of the solid on which sensor is glued.
  • the second embodiment shown in FIGS. 4 and 5 differs from the first embodiment in that the sensor comprises a pressure sensitive adhesive layer at ambient temperature integral with the wafer 11, the fixing face 20 of the the pellet 11 being formed by the free face of this adhesive layer 25 which completely covers the face of the flexible film opposite to the support face 14.
  • This layer 25 of adhesive is protected before use of the sensor by a removable sheet 26 formed for example of a silicone paper. To fix such a sensor on the surface of a solid, it is sufficient to remove the removable sheet 26 and apply the sensor with the adhesive layer 25 in contact with the surface 21 of the solid to achieve the bonding.
  • This adhesive layer may be applied to the flexible film by printing or transfer, or be formed of a double-sided adhesive previously bonded to the flexible film.
  • the third embodiment shown in FIGS. 6 and 7 differs from the first embodiment on the one hand in that the coating 17 is formed of several layers, namely a first layer 28 placed overlapping the support face 14 and the strain gauge 12, of relatively small thickness, for example of the order of 1 mm to 2 mm, and a second layer 29 overlying the first layer 28.
  • the first layer 28 is formed of polyurethane
  • the second layer 29 is formed of polyepoxide and has a greater thickness, for example of the order of 0.5 cm to 1.5 cm.
  • the electronic circuit is not in contact with the wafer 11 of flexible film, but is embedded within the thickness of the second layer 29 of the coating 17, at a distance from the support face 14.
  • the senor may be connected in communication with a computer system 23 by a wireless communication module 27 connected to the connection port 18.
  • This wireless communication module 27 allows remote transmission by radio frequency of the measurement signals to the computer system 23.
  • the wireless communication module 27 may be a low-energy and / or long-distance transmission module. Any radio frequency transmission protocol can be envisaged: Wi-Fi®, Bluetooth®, ZigBee®, SigFox®, LoRaWan®, mobile phone protocol (GPRS, UMTS, LTE, WiMax ...) ... None also prevents to consider an infrared communication module 27 or optically.
  • the wireless communication module 27 is for example in the form of a rectangular plate and advantageously extends above the coating 17, that is to say parallel and along a free face 30 of this coating 17 opposite the fixing face 20.
  • this wireless communication module 27 is carried by the connection port 18 and extends away from the free face 30 of the coating 17, so as not to interfere with the deformation of the sensor. However, nothing prevents the wireless communication module 27 from being placed in another arrangement with respect to the coating 17.
  • the attachment face 20 is a rectangular planar face. Nevertheless, any other form can be envisaged, and for example a concave cylindrical shape as shown in Figure 8, or a convex cylindrical shape as shown in Figure 9 or other.
  • the electronic circuit is formed of any suitable circuit for electrically supplying the strain gauge 12, and measuring its resistance.
  • a circuit is well known in itself. It therefore comprises a voltage source supply circuit delivering a DC voltage VCC.
  • the strain gauge 12 is shown in FIG. 13 as a variable resistor connected in series between the ground and a series resistor forming a divider bridge fed by the voltage VCC.
  • the output of the strain gauge 12 is connected to the non-inverting input of an operational amplifier 37 mounted with a resistor 36 for feedback, and two resistors 38, 39 parallel input.
  • the analog signal delivered by the operational amplifier 37 is converted into a digital signal by an analog / digital converter 38 powered by the voltage VCC.
  • the converter 38 provides a measurement signal in a format compatible with digital networks, in particular in a format compatible with the Internet.
  • the measurement signal delivered on the connection port 18 by the converter 38 is therefore directly usable by any computer system 23.
  • Such an electronic circuit can be miniaturized and extend over a printed circuit board of small dimensions, for example having a width of the order of 1 cm for a length of the order of 2 cm.
  • the strain gauge 12 is produced by deposition on the wafer 11 of flexible polyimide film.
  • the electronic circuit is placed on the support face 14 and the electrical connection is made between the strain gauge 12 and the electronic circuit with the connecting wires 16.
  • the pellet 11 of flexible film is placed on a mandrel having a shape corresponding to that of the solid surface 21 on which the sensor must be fixed, without sticking the pellet 11 on the mandrel, and so as to deform the flexible film according to the shape of the mandrel.
  • a mold is placed around the pellet 11 of flexible film, the connection port 18 passing through a recess of a side wall of the mold.
  • a moldable liquid composition is deposited in this mold above the support face 14 to form the coating 17 by embedding the strain gauge, the connecting wires 16 and the electronic circuit. This composition is then cured to obtain the coating 17.
  • the deposition and hardening steps can be repeated if the coating 17 is formed of a plurality of successive layers.
  • strain gauge of 5 mm x 3 mm based on gold nanoparticles deposited on a piece of polyimide film 33 mm x 20 mm x 6 mm, having a modulus of elasticity of 2, 5 Gpa,
  • the coating comprises a first layer of polyurethane resin 140 covering the strain gauge and the piece of polyimide film,
  • the electronic circuit is formed of a card of 28 mm x 14 mm x 2 mm placed next to the strain gauge and connected to the latter by connecting threads, but elevated with respect to the polyurethane layer by means of pads of PDMS (polydimethylsiloxane),
  • a parallelepipedal PDMS block having a modulus of elasticity of between 360 kPa and 870 kPa is molded above the polyurethane layer by drowning the electronic circuit, with the exception of the connection port which protrudes from a side face of this block.
  • FIG. 10 represents the variations of the relative electrical resistance AR / R 0 of the strain gauge 12 as a function of the deformation ⁇ . As can be seen, a gage factor of 14.34 is obtained.
  • Example 1 The sensor of Example 1 was tested on a MTS Criterion® traction bench marketed by MTS Systems Corporation, Eden Prairie, USA. A three-point bending test with a span of 90 mm was carried out using a 140 mm ⁇ 30 mm ⁇ 5 mm aluminum test tube carrying the sensor according to the invention and, for comparison, a dipstick. constraints identical to that of the sensor according to the invention but "bare", that is to say without any coating or coating, connected to an ohmmeter. The signals delivered are transmitted to an electronic interface card with a computer.
  • a prestress of 10 N was applied and five cycles were carried out successively, with a deformation of 0.1% of ⁇ test piece.
  • the diagram of FIG. 11 represents the signals obtained with the bare strain gauge of the state of the art.
  • the diagram of FIG. 12 represents the signals obtained with the sensor according to the invention.
  • the sensor according to the invention provides a measurement signal that is almost identical in its shape and amplitude to that of the strain gauge according to the state of the art.
  • the adhesive strength of the sensor of Example 1 was evaluated by subjecting the specimen on which the sensor is bonded to a deformation ramp of 0 to 2%. No detachment of the sensor was found.
  • the invention can be the subject of many alternative embodiments and applications other than those described above.
  • the various structural and functional characteristics of each of the embodiments described above should not be considered as combined and / or closely and / or inextricably linked to each other, but to contrary as mere juxtapositions.
  • the structural and / or functional characteristics of the various embodiments described above may be wholly or partly the subject of any different juxtaposition or any different combination.
  • the strain gauge may be formed of nanoparticles deposited not directly on the support surface 14, but on the contrary on a substrate pellet of smaller dimensions than the rectangular pellet 11, this strain gauge thus formed being applied, in particular by gluing, on the support face 14.
  • a cover placed above the coating for example to protect the wireless communication module.

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Abstract

The invention relates to a deformation sensor comprising at least one sensing element (12) of which one electrical characteristic varies as a function of the deformation thereof, applied to one face, referred to as support face (14), of a film part (11). The attachment face (20) of the sensor is entirely made up of a free face of the film part. A coating (17) is rigidly and permanently attached to said support face, extending entirely opposite the attachment face, over a thickness greater than that of said film part.

Description

CAPTEUR DE DÉFORMATION MONOBLOC ET PROCÉDÉ DE MESURE DE LA DÉFORMATION D'UNE SURFACE D'UN SOLIDE  MONOBLOC DEFORMATION SENSOR AND METHOD FOR MEASURING THE DEFORMATION OF A SURFACE OF A SOLID
L'invention concerne un capteur de déformation apte à mesurer la déformation d'une surface d'un solide, et un procédé de mesure de la déformation d'une surface d'un solide à l'aide d'un tel capteur de déformation.  The invention relates to a deformation sensor capable of measuring the deformation of a surface of a solid, and to a method for measuring the deformation of a surface of a solid using such a deformation sensor.
La mesure de la déformation de surface des solides est utile dans de très nombreuses applications pour le contrôle du comportement mécanique des solides par exemple à des fins de prévention, de conception, de maintenance, de métrologie, pour les automatismes... La mesure de la déformation de surface d'un solide permet non seulement de déterminer la déformation subie en surface par le solide, mais également de déterminer les efforts et/ou contraintes subis par le solide sous l'effet de sollicitations de toutes natures : traction et/ou compression et/ou flexion, torsion et/ou cisaillement.  The measurement of the surface deformation of solids is useful in many applications for the control of the mechanical behavior of solids for example for prevention, design, maintenance, metrology, automation ... The measurement of the surface deformation of a solid makes it possible not only to determine the deformation undergone on the surface by the solid, but also to determine the forces and / or stresses experienced by the solid under the effect of stresses of all types: traction and / or compression and / or bending, twisting and / or shearing.
Pour mesurer la déformation en surface d'un solide, on applique au moins un élément sensible, ou au moins un capteur de déformation intégrant au moins un tel élément sensible sur la surface du solide. Un tel élément sensible, généralement qualifié de façon impropre de « jauge de contraintes » (la terminologie «jauge de déformation » étant plus appropriée mais moins courante) présente au moins une caractéristique électrique (en général la résistance ou la capacité) qui varie en fonction d'un état de déformation de la surface du solide. Les jauges de contraintes traditionnelles connues depuis plus d'une cinquantaine d'années sont formées de films flexibles portant une piste de matériau conducteur (alliage métallique) disposée en serpentin. On connaît également des jauges de contraintes piézoélectriques à base de matériaux semi-conducteurs qui présentent une meilleure sensibilité mais une moins bonne linéarité et une plus grande sensibilité aux variations de température. On connaît également des jauges de contraintes à base de nanoparticules, par exemple des nanoparticules métalliques, notamment d'or ou de carbone, assemblées par dépôt sur un film flexible, qui présentent l'intérêt d'un facteur de jauge très élevé, d'une large plage de déformation et d'une faible consommation électrique (cf. notamment « High- sensitivity strain gauge based on a single wire of gold nanoparticles fabricated by stop- and-go convective self-assembly » Cosmin Farcau et al, ACS Nano, 2011, 5 (9), pp 7137-7143, DOI: 10.1021/nn201833y ; ou « Influence of the Humidity on Nanoparticle-Based Résistive Strain Gauges » Lucas Digianantonio et al, J. Phys. Chem. C, 2016, 120 (10), pp 5848-5854, DOI: 10.1021/acs.jpcc.6b00822 ; US7116209). To measure the surface deformation of a solid, at least one sensitive element is applied, or at least one deformation sensor incorporating at least one such sensitive element on the surface of the solid. Such a sensitive element, generally improperly qualified as a "strain gauge" (the term "strain gauge" being more appropriate but less common) has at least one electrical characteristic (generally resistance or capacitance) which varies according to a state of deformation of the surface of the solid. The traditional strain gauges known for more than fifty years are formed of flexible films carrying a conductive material track (metal alloy) arranged in a coil. Piezoelectric strain gauges based on semiconductor materials are also known which have a better sensitivity but a less good linearity and a greater sensitivity to temperature variations. Strain gauges based on nanoparticles, for example metal nanoparticles, in particular gold or carbon, assembled by deposition on a flexible film, which are of interest for a very high gauge factor, are also known. wide deformation range and low power consumption (see in particular "High- According to Cosmin Farcau et al., ACS Nano, 2011, 5 (9), pp. 7137-7143, DOI: 10.1021 / nn201833y; or "Influence of the Humidity on Nanoparticle-Based Resistive Strain Gauges" Lucas Digianantonio et al, J. Phys. Chem. C, 2016, 120 (10), pp. 5848-5854, DOI: 10.1021 / acs.jpcc.6b00822; US7116209).
L'utilisation de telles jauges de contraintes pose de nombreuses difficultés pratiques.  The use of such strain gauges poses many practical difficulties.
Tout d'abord, la liaison entre le film flexible de l'élément sensible et la surface du solide doit être parfaite, c'est-à-dire en théorie présenter une rigidité infinie, de telle sorte que toute déformation de la surface du solide puisse être répercutée sur l'élément sensible. Les liaisons par assemblage mécanique (vis, boulons, rivets, soudures...) sont très longues et coûteuses et maintenant abandonnées dans la plupart des applications. Dans la plupart des cas lorsque la surface de l'objet solide s'y prête, les jauges de contraintes sont collées par des colles rigides telles que des colles cyanoacrylates ou époxy sur la surface du solide. Néanmoins, cette opération de collage est en pratique extrêmement délicate, relativement longue (typiquement de plusieurs dizaines de minutes) et nécessite un savoir-faire important que peu d'opérateurs maîtrisent de façon complète.  Firstly, the connection between the flexible film of the sensitive element and the surface of the solid must be perfect, that is to say in theory have an infinite rigidity, so that any deformation of the surface of the solid can be reflected on the sensing element. Mechanical assembly connections (screws, bolts, rivets, welds ...) are very long and expensive and are now abandoned in most applications. In most cases when the surface of the solid object is suitable, the strain gauges are glued by rigid adhesives such as cyanoacrylate or epoxy glues on the surface of the solid. Nevertheless, this bonding operation is in practice extremely delicate, relatively long (typically of several tens of minutes) and requires an important know-how that few operators master completely.
II a été proposé par le passé d'intégrer un ou plusieurs éléments sensibles dans un boîtier lui-même fixé rigidement à la surface du solide ce qui facilite leur maintien en place pendant le durcissement de la colle et ultérieurement. Il a également été proposé d'enrober une jauge de contraintes dans un enrobage appliqué après collage de la jauge sur la surface du solide pour former barrière à l'humidité et isolant thermique. Toutes ces solutions nécessitent encore un collage particulièrement précis du film flexible de l'élément sensible sur la surface du solide et augmentent en réalité la complexité de pose du capteur.  It has been proposed in the past to integrate one or more sensitive elements in a housing itself rigidly fixed to the surface of the solid which facilitates their retention in place during the curing of the adhesive and subsequently. It has also been proposed to coat a strain gauge in a coating applied after sticking the dipstick on the surface of the solid to form a moisture barrier and thermal insulation. All these solutions still require a particularly precise bonding of the flexible film of the sensitive element on the surface of the solid and actually increase the complexity of laying the sensor.
Il a également été proposé d'associer une ou plusieurs jauges de contraintes à un support, ce support étant ensuite fixé sur la surface d'une pièce solide à tester. Ces solutions ne sont cependant pas non plus entièrement satisfaisantes dans la mesure où le problème de la fixation de ce support à la surface de la pièce solide à tester reste posé. En outre, de tels montages intermédiaires induisent nécessairement des pertes de transmission entre la surface solide et chaque élément sensible, au détriment du facteur de jauge global du capteur ainsi formé. Or, les jauges de contraintes étant déjà peu sensibles (nécessitant dans la plupart des situations des montages en pont de Wheatstone), l'utilisation de tels supports intermédiaires n'est possible que dans des applications dans lesquelles les déformations de la surface du solide ou les valeurs des contraintes ou des efforts sont très importantes. Plus généralement, de tels assemblages mécaniques de la jauge de contraintes à un support avant son collage en surface de la pièce solide à tester impliquent nécessairement une interférence des propriétés mécaniques (masse, inertie, rigidité...) de ce support par rapport à la jauge de contraintes et par rapport aux déformations de la surface de la pièce solide, et donc des défauts de fonctionnement ou de fiabilité de cette dernière. It has also been proposed to associate one or more strain gauges with a support, this support then being fixed on the surface of a solid part to test. These solutions, however, are not entirely satisfactory either, since the problem of fixing this support to the surface of the solid part to be tested remains. In addition, such intermediate assemblies necessarily induce transmission losses between the solid surface and each sensitive element, to the detriment of the overall gauge factor of the sensor thus formed. Since the strain gauges are already insensitive (requiring in most cases Wheatstone bridge arrangements), the use of such intermediate supports is only possible in applications in which the deformations of the surface of the solid or the values of the stresses or efforts are very important. More generally, such mechanical assemblies of the strain gauge to a support before it is bonded to the surface of the solid part to be tested necessarily imply an interference of the mechanical properties (mass, inertia, rigidity, etc.) of this support with respect to the strain gauge and with respect to the deformations of the surface of the solid part, and therefore the malfunctions or reliability of the latter.
WO 2016/030752 décrit un patch capteur étirable comprenant une couche de film élastique étirable portant au moins une bande capacitive élastique ou au moins un filament résistif élastique et un circuit intégré, et une couche de protection flexible étirable étanche pour protéger ladite au moins une bande et le circuit intégré. Le film élastique étirable peut également porter un circuit de transmission sans fil et une source d'énergie électrique. L'épaisseur de ce patch est inférieure à quelques millimètres, et peut par exemple être comprise entre 40 μηι et 20 μηι. Outre qu'il est limité à une mesure de déformations en traction sur des organes d'un homme ou d'un animal, un tel patch est fragile et difficile à manipuler, stocker, transporter, emballer, et installer sur une surface.  WO 2016/030752 discloses a stretchable sensor patch comprising a stretchable elastic film layer carrying at least one elastic capacitive strip or at least one resilient resistive filament and an integrated circuit, and a flexible stretchable flexible protective layer for protecting said at least one strip and the integrated circuit. The elastic stretch film can also carry a wireless transmission circuit and a source of electrical power. The thickness of this patch is less than a few millimeters, and may for example be between 40 μηι and 20 μηι. In addition to being limited to measuring tensile deformities on human or animal organs, such a patch is fragile and difficult to handle, store, transport, pack, and install on a surface.
L'invention vise à pallier ces inconvénients.  The invention aims to overcome these disadvantages.
Elle vise en particulier à proposer un capteur de déformation dont la fixation sur une surface d'un solide dont la déformation doit être mesurée est simplifiée, rapide, fiable, et qui en outre présente un facteur de jauge suffisamment important et procure des résultats fiables et précis. Elle vise également à proposer un tel capteur de déformation dont les manipulations, le stockage, le transport, l'emballage et l'installation sur une surface d'un solide sont simples, ne nécessitent pas de précautions particulières, puissent être réalisées par des opérateurs non spécialisés, et ne risquent en aucune manière d'affecter les performances du capteur. It aims in particular to provide a deformation sensor whose attachment to a surface of a solid whose deformation must be measured is simplified, fast, reliable, and which also has a sufficiently large gauge factor and provides reliable results and specific. It also aims to provide such a deformation sensor whose handling, storage, transport, packaging and installation on a solid surface are simple, do not require special precautions, can be performed by operators non-specialized, and do not in any way affect the performance of the sensor.
Elle vise également à proposer un tel capteur de déformation qui soit protégé vis-à-vis de l'environnement extérieur, notamment vis-à-vis de l'humidité ou des agressions chimiques ou mécaniques, et des variations de température.  It also aims to provide such a deformation sensor which is protected vis-à-vis the external environment, especially with respect to moisture or chemical or mechanical aggression, and temperature variations.
L'invention vise plus particulièrement à proposer un tel capteur de déformation qui puisse être utilisé dans un très grand nombre d'applications, y compris celles dans lesquelles les déformations à mesurer sont de faible amplitude, et qui soit compatible avec un grand nombre de matériaux différents constitutifs de la surface du solide dont la déformation doit être mesurée.  The object of the invention is more particularly to provide such a deformation sensor that can be used in a very large number of applications, including those in which the deformations to be measured are of low amplitude, and which is compatible with a large number of materials. different constituents of the surface of the solid whose deformation must be measured.
Par ailleurs, une jauge de contraintes est reliée à un circuit électronique qui permet de mesurer la variation de la caractéristique électrique de la jauge de contraintes en fonction de la déformation, et de délivrer un signal de mesure correspondant. Un tel circuit électronique incorpore en général des composants permettant de calibrer et de compenser thermiquement le signal de mesure délivré par le capteur.  Moreover, a strain gauge is connected to an electronic circuit which makes it possible to measure the variation of the electrical characteristic of the strain gauge as a function of the deformation, and to deliver a corresponding measurement signal. Such an electronic circuit generally incorporates components for calibrating and thermally compensating the measurement signal delivered by the sensor.
L'invention vise plus particulièrement à proposer un tel capteur de déformation qui puisse intégrer un tel circuit électronique et qui soit donc entièrement préfabriqué sous forme d'un capteur d'un seul tenant autonome, précalibré.  The invention aims more particularly at providing such a deformation sensor which can integrate such an electronic circuit and which is therefore entirely prefabricated in the form of a sensor in one single autonomous, precalibrated.
L'invention vise en particulier à proposer un tel capteur de déformation apte à délivrer un signal de mesure sous un format compatible avec la plupart des systèmes et automatismes susceptibles d'exploiter un tel signal de mesure.  The invention aims in particular to provide such a deformation sensor capable of delivering a measurement signal in a format compatible with most systems and automation capable of exploiting such a measurement signal.
L'invention vise ainsi à proposer un capteur de déformation dont la mise en œuvre est particulièrement simple et ne nécessite que sa fixation à la surface d'un solide dont la déformation doit être mesurée, et la liaison du capteur à un système destiné à exploiter le signal de mesure délivré par le capteur. The invention thus aims to propose a deformation sensor whose implementation is particularly simple and only requires its attachment to the surface a solid whose deformation must be measured, and the connection of the sensor to a system for exploiting the measurement signal delivered by the sensor.
L'invention vise également à proposer un tel capteur dont la fabrication soit particulièrement simple, fiable et peu coûteuse.  The invention also aims at providing such a sensor whose manufacture is particularly simple, reliable and inexpensive.
L'invention vise également à proposer un procédé de mesure de la déformation de la surface d'un solide présentant les mêmes avantages.  The invention also aims at providing a method for measuring the deformation of the surface of a solid having the same advantages.
L'invention concerne donc un capteur de déformation présentant une face libre, dite face de fixation, adaptée pour pouvoir être appliquée sur une surface d'un solide dont la déformation doit être mesurée, et comprenant :  The invention therefore relates to a deformation sensor having a free face, called a fixing face, adapted to be applied to a surface of a solid whose deformation must be measured, and comprising:
- au moins un élément sensible dont une caractéristique électrique varie en fonction de sa déformation agencé de telle sorte que ladite caractéristique électrique de l'élément sensible varie en fonction d'un état de déformation d'au moins une portion de ladite face de fixation,  at least one sensitive element whose electrical characteristic varies according to its deformation arranged in such a way that said electrical characteristic of the sensitive element varies as a function of a deformation state of at least a portion of said fixing face,
- un enrobage s' étendant autour de chaque élément sensible,  a coating extending around each sensitive element,
caractérisé en ce que : characterized in that
- ladite face de fixation du capteur est entièrement constituée par une face libre d'une pièce de film, cette pièce de film présentant une face, dite face de support, opposée à ladite face de fixation, et une épaisseur constante entre ladite face de fixation et ladite face de support,  said fixing face of the sensor is entirely constituted by a free face of a piece of film, this piece of film having a face, said support face, opposite to said fixing face, and a constant thickness between said fixing face; and said support face,
- au moins un élément sensible est appliqué sur ladite face de support, at least one sensitive element is applied to said support face,
- ledit enrobage : said coating:
o est fixé rigidement de façon inamovible à ladite face de support de ladite pièce de film,  o is rigidly fixed irremovably to said support face of said piece of film,
o s'étend à partir de ladite face de support de ladite pièce de film, entièrement à l'opposé de ladite face de fixation,  o extends from said support surface of said piece of film, entirely opposite said fixing face,
o sur une épaisseur supérieure à l'épaisseur de ladite pièce de film.  o over a thickness greater than the thickness of said piece of film.
La combinaison des caractéristiques d'un capteur selon l'invention permet de procurer de nombreux avantages inédits et d'envisager en conséquence un développement considérable de l'utilisation de tels capteurs de déformation. The combination of the characteristics of a sensor according to the invention makes it possible to provide numerous novel advantages and to envisage in consequently a considerable development of the use of such deformation sensors.
La face de fixation d'un capteur selon l'invention étant une face libre d'une pièce de film présente une surface unie, donc lisse, continue et exempte d'aspérités, de discontinuités, de fentes, de renfoncements, de lumières ou d'interfaces entre plusieurs matériaux. (Dans tout le texte, le terme « unie » appliqué à une surface désigne le fait que cette surface est exempte d'aspérités et est continue, c'est-à-dire peut être intégralement parcourue par déplacement d'un crayon maintenu au contact de cette surface sans avoir à rompre ce contact.)  The fixing face of a sensor according to the invention being a free face of a piece of film has a smooth surface, so smooth, continuous and free of asperities, discontinuities, slots, recesses, lights or d interfaces between several materials. (Throughout the text, the term "united" applied to a surface designates the fact that this surface is free of asperities and is continuous, that is to say can be entirely traversed by moving a pencil held in contact of this surface without having to break this contact.)
En outre, la face de fixation est formée par une seule et même pièce de film, qui est en un matériau solide homogène par nature (c'est-à-dire un morceau de film exempt de lacunes, lumières, ou hétérogénéités). En conséquence, le capteur selon l'invention peut être fixé à la surface d'un solide exclusivement par l'intermédiaire de cette face de fixation, notamment par collage à l'aide d'une colle compatible avec ladite pièce de film et avec la surface du solide.  In addition, the attachment face is formed by a single piece of film, which is a solid material homogeneous by nature (that is to say a piece of film free of gaps, lights, or heterogeneities). Consequently, the sensor according to the invention can be fixed to the surface of a solid exclusively via this fixing face, in particular by bonding with an adhesive compatible with said piece of film and with the solid surface.
Dans une première variante de réalisation possible, ladite pièce de film est formée d'une seule couche de matériau homogène d'épaisseur constante et ne comporte pas de couche adhésive. Dans cette première variante, la face de fixation n'est pas elle-même adhésive et le collage de la face de fixation est réalisé à l'aide d'une colle rapportée sur cette face de fixation ou sur la surface du solide sur laquelle le capteur doit être fixé, ou d'une colle faisant partie intégrante de cette surface, voire même à l'aide d'un adhésif double face ou d'une couche d'un adhésif transfert appliquée par transfert sur la face de fixation.  In a first possible embodiment, said piece of film is formed of a single layer of homogeneous material of constant thickness and has no adhesive layer. In this first variant, the fixing face is not itself adhesive and the bonding of the fixing face is achieved by means of a glue attached to this attachment face or on the surface of the solid on which the The sensor must be attached, or an adhesive that is an integral part of this surface, or even using a double-sided adhesive or a layer of transfer adhesive applied by transfer on the attachment face.
Par exemple, dans certains modes de réalisation avantageux d'un capteur selon l'invention ladite face de fixation est adaptée pour pouvoir être fixée par collage sur une surface d'un objet avec une colle choisie dans le groupe formé des colles cyanoacrylates, des colles époxy, des colles polyuréthane, des colles silicone, des colles nitriles et des colles néoprènes. Dans une deuxième variante de réalisation possible, ladite pièce de film présente une couche adhésive de collage formant ladite face de fixation. Dans cette deuxième variante, ladite pièce de film peut être avantageusement formée d'une couche de matériau diélectrique homogène souple adaptée pour recevoir et supporter chaque élément sensible, et d'une couche de composition adhésive superposée à cette couche de matériau diélectrique. Une telle couche de composition adhésive peut être en particulier choisie parmi les adhésifs sensibles à la pression à température ambiante, les adhésifs thermoréactivables, les adhésifs activables sous ultraviolets et les adhésifs activables par voie chimique (notamment par l'humidité de l'air ambiant et/ou par adjonction d'un agent activateur). For example, in certain advantageous embodiments of a sensor according to the invention, said fixing face is adapted to be fixed by gluing to a surface of an object with an adhesive selected from the group consisting of cyanoacrylate adhesives, glues epoxy, polyurethane glues, silicone glues, nitrile glues and neoprene glues. In a second possible embodiment, said piece of film has an adhesive bonding layer forming said fixing face. In this second variant, said piece of film may advantageously be formed of a layer of flexible homogeneous dielectric material adapted to receive and support each sensitive element, and of a layer of adhesive composition superimposed on this layer of dielectric material. Such a layer of adhesive composition may be chosen in particular from pressure-sensitive adhesives at ambient temperature, heat-activatable adhesives, ultraviolet-activatable adhesives and chemically activatable adhesives (in particular by the humidity of the ambient air and or by addition of an activating agent).
Cette pièce de film formant un support sur lequel est appliqué au moins un élément sensible à la déformation est nécessairement déjà par nature compatible avec un collage. En outre, l'enrobage s'étendant autour de chaque élément sensible à l'opposé de la face de fixation permet de protéger chaque élément sensible des agressions extérieures diverses, et, surtout, facilite la manipulation, le transport, le stockage, l'emballage et l'installation d'un capteur selon l'invention, et ce par des opérateurs non spécialisés, c'est-à-dire autres que les opérateurs spécialisés dans les opérations de collage des jauges de contraintes traditionnelles.  This piece of film forming a support on which is applied at least one element sensitive to deformation is necessarily already inherently compatible with a collage. In addition, the coating extending around each sensitive element opposite the fixing face makes it possible to protect each sensitive element from various external aggressions, and, above all, facilitates the handling, the transport, the storage, the packaging and installation of a sensor according to the invention, and this by non-specialized operators, that is to say other than the operators specializing in the bonding operations of traditional strain gages.
Pour l'installation d'un capteur de déformation selon l'invention, il suffit de coller ladite face de fixation à la surface du solide en une seule étape et de relier le capteur selon l'invention à un système destiné à exploiter le signal de mesure délivré par le capteur.  For the installation of a deformation sensor according to the invention, it suffices to glue the said fixing face to the surface of the solid in a single step and to connect the sensor according to the invention to a system intended to exploit the signal of measurement delivered by the sensor.
L'enrobage s'étendant à l'opposé de la face de fixation, aucune portion de cette dernière n'est formée par l'enrobage. Un capteur selon l'invention est donc susceptible d'être fixé sur une surface d'un solide exclusivement par ladite face de fixation, et donc par l'intermédiaire de ladite pièce de film qui constitue l'unique élément du capteur selon l'invention au contact de cette surface solide. Ainsi, l'enrobage ne vient pas au contact de la surface du solide sur laquelle le capteur est fixé, n'interfère pas avec cette surface du solide, et n'a donc qu'une influence minime sur le comportement mécanique de chaque élément sensible et du capteur du point de vue de la détection des déformations. Cette influence est d'autant plus négligeable que l'enrobage est lui-même suffisamment flexible et que le facteur de jauge de chaque élément sensible est en lui-même suffisamment important, la diminution du facteur de jauge par la présence de l'enrobage restant acceptable. The coating extending opposite the fixing face, no portion of the latter is formed by the coating. A sensor according to the invention is therefore capable of being fixed on a surface of a solid exclusively by said fixing face, and thus by means of said piece of film which constitutes the sole element of the sensor according to the invention. in contact with this solid surface. Thus, the coating does not come into contact with the surface of the solid on which the sensor is attached, does not interfere with this surface of the solid, and therefore has only a minimal influence on the mechanical behavior of each sensitive element and the sensor from the point of view of the detection of deformations. This influence is all the more negligible that the coating itself is sufficiently flexible and that the gauge factor of each sensitive element is in itself sufficiently important, the decrease of the gauge factor by the presence of the remaining coating acceptable.
Ainsi, bien que l'invention soit applicable avec toutes sortes d'élément(s) sensible(s) dont au moins une caractéristique électrique varie en fonction de sa déformation (y compris les jauges de contraintes à pistes de matériau métallique, semi-conducteur ou carboné, massif ou nanostructuré, et les jauges de contraintes piézoélectriques), un capteur selon certains modes de réalisation de l'invention est avantageusement au moins un élément sensible formé d'une jauge de contraintes à base de nanoparticules appliquée sur ladite face de support. Plus particulièrement, lesdites nanoparticules sont choisies dans le groupe des nanoparticules métalliques, des nanoparticules semi-conductrices et de leurs agrégats, assemblées par l'intermédiaire d'un matériau isolant ou d'un matériau semi-conducteur. Plus particulièrement, il s'agit de nanoparticules choisies dans le groupe des nanoparticules d'or et des nanoparticules de carbone. Dans un mode de réalisation particulièrement avantageux, le capteur selon l'invention comprend une jauge de contraintes résistive formée d'au moins fil de nanoparticules d'or colloïdales s' étendant entre deux électrodes comme décrit par la publication Cosmin Farcau et al ou par la publication Lucas Digianantonio et al susmentionnées ou par US7116209.  Thus, although the invention is applicable with all kinds of sensitive element (s) whose at least one electrical characteristic varies as a function of its deformation (including strain gauges with tracks of metallic material, semiconductor or carbonaceous, solid or nanostructured, and piezoelectric strain gauges), a sensor according to some embodiments of the invention is advantageously at least one sensitive element formed of a nanoparticle-based strain gauge applied to said support face . More particularly, said nanoparticles are chosen from the group of metal nanoparticles, semiconductor nanoparticles and their aggregates, assembled via an insulating material or a semiconductor material. More particularly, these are nanoparticles chosen from the group of gold nanoparticles and carbon nanoparticles. In a particularly advantageous embodiment, the sensor according to the invention comprises a resistive strain gauge formed of at least one wire of colloidal gold nanoparticles extending between two electrodes as described by Cosmin Farcau et al. Lucas Digianantonio et al publication cited above or US7116209.
De telles jauges de contraintes à base de nanoparticules présentent un facteur de jauge très élevé, notamment supérieur à 20. Il a été constaté avec surprise qu'un capteur selon l'invention peut ainsi présenter un facteur de jauge supérieur à 15, malgré la présence de l'enrobage. Ainsi, chaque élément sensible, ledit enrobage et ladite pièce de film sont choisis de telle sorte que le capteur présente (après collage sur une surface solide à l'intermédiaire d'une colle rigide telle qu'une colle cyanoacrylate) un facteur de jauge supérieur à 5, notamment supérieur à 10, en particulier supérieur à 15. Selon une première variante, les nanoparticules sont directement déposées sur ladite face de support de ladite pièce de film, cette dernière constituant donc le substrat supportant les nanoparticules formant la jauge de contraintes. Le film constituant ladite pièce de film formant ladite face de fixation et ladite face de support est un film flexible supportant au moins un élément sensible à la déformation appliqué directement sur ladite face de support de ce film flexible à la fabrication. En conséquence, les propriétés mécaniques de ce film flexible sont par nature parfaitement adaptées au fonctionnement approprié de chaque élément sensible pour la détection des déformations de la surface du solide sur laquelle le capteur selon l'invention est ensuite fixé. Such strain gauges based on nanoparticles have a very high gauge factor, especially greater than 20. Surprisingly, it has been found that a sensor according to the invention can thus have a gauge factor greater than 15, despite the presence of the coating. Thus, each sensitive element, said coating and said piece of film are chosen so that the sensor has (after bonding to a solid surface via a rigid glue such as a cyanoacrylate glue) a higher gauge factor. at 5, in particular greater than 10, in particular greater than 15. According to a first variant, the nanoparticles are directly deposited on said support face of said piece of film, the latter thus constituting the substrate supporting the nanoparticles forming the strain gauge. The film constituting said piece of film forming said fixing face and said support face is a flexible film supporting at least one deformation-sensitive element applied directly on said support face of this flexible film during manufacture. Consequently, the mechanical properties of this flexible film are, by their nature, perfectly adapted to the appropriate operation of each sensitive element for the detection of the deformations of the surface of the solid on which the sensor according to the invention is then fixed.
Selon une autre variante possible, un élément sensible comprend une pastille de film flexible sur laquelle les nanoparticules sont déposées, et la jauge de contraintes ainsi formée est elle-même appliquée sur ladite face de support de ladite pièce de film, éventuellement par l'intermédiaire d'une couche de colle. Dans cette variante, le film flexible formant le substrat supportant les nanoparticules est lui-même appliqué sur ladite face de support de ladite pièce de film. Ladite pièce de film peut alors être formée d'un film de même nature que le film flexible constituant le substrat supportant les nanoparticules. Ces deux films peuvent même être identiques. Rien n'empêche au contraire de prévoir que le film constituant ladite pièce de film soit différent dans sa nature et/des dimensions du film formant le substrat d'une jauge de contraintes d'un capteur selon l'invention.  According to another possible variant, a sensitive element comprises a flexible film pellet on which the nanoparticles are deposited, and the strain gauge thus formed is itself applied to said support face of said piece of film, possibly via a layer of glue. In this variant, the flexible film forming the substrate supporting the nanoparticles is itself applied to said support face of said piece of film. Said piece of film may then be formed of a film of the same nature as the flexible film constituting the substrate supporting the nanoparticles. These two films can even be identical. On the contrary, nothing prevents the film constituting said piece of film from being different in its nature and from the dimensions of the film forming the substrate of a strain gauge of a sensor according to the invention.
Dans tous les cas, et en particulier dans le cas d'une jauge de contraintes à base de nanoparticules telle que mentionnée ci-dessus, ledit film constituant ladite pièce de film est un film de matériau polymérique par exemple choisi dans le groupe formé du polyimide, des polyoléfines (notamment du poly(téréphtalate d'éthylène) (PET), du polypropylène (PP), du polyéthylène naphtalate (PEN), et du copolymère cyclo-oléfine (COQ), du polyméthacrylate de méthyle (PMMA), du polycarbonate (PC), du polyétheréthercétone (PEEK), du poly(chlorure de vinyle) (PVC), de l'acrylonitrile butadiène styrène (ABS), et des polymères halogénocarbonés (notamment fluorocarbonés tels que le Polytétrafluoroéthène (PTFE) et le poly(fluorure de vinylidène) (PVDF)). In all cases, and in particular in the case of a strain gauge based on nanoparticles as mentioned above, said film constituting said piece of film is a film of polymeric material for example selected from the group consisting of polyimide polyolefins (especially polyethylene terephthalate (PET), polypropylene (PP), polyethylene naphthalate (PEN), and cycloolefin copolymer (COQ), polymethylmethacrylate (PMMA), polycarbonate (PC), polyetheretherketone (PEEK), polyvinyl chloride (PVC), acrylonitrile butadiene styrene (ABS), and halocarbon polymers (especially fluorocarbons such as polytetrafluoroethene (PTFE) and polyvinylidene fluoride (PVDF)).
Avantageusement, le matériau constitutif de ladite pièce de film est aussi choisi de façon à présenter un module d'élasticité élevé -notamment supérieur à 1 GPa, par exemple de l'ordre de 2,5 Gpa- de façon à bien transmettre les déformations entre la surface du solide sur laquelle le capteur est appliqué et chaque élément sensible.  Advantageously, the constituent material of said piece of film is also chosen so as to have a high modulus of elasticity - in particular greater than 1 GPa, for example of the order of 2.5 Gpa- so as to transmit the deformations between the surface of the solid on which the sensor is applied and each sensitive element.
Néanmoins, en particulier pour la mesure de déformations en flexion, ladite pièce de film doit être flexible, c'est-à-dire présenter une faible valeur de raideur en flexion, pour pouvoir aisément se déformer en flexion selon les déformations en flexion de la surface du solide. Pour ce faire, ladite pièce de film présente avantageusement une épaisseur inférieure à 1 mm -notamment comprise entre 5 μηι et 50 μηι, par exemple de l'ordre de 25 μηι-.  Nevertheless, in particular for the measurement of flexural deformations, said piece of film must be flexible, that is to say have a low flexural stiffness value, so that it can easily be deformed in flexion according to the flexural deformations of the solid surface. To do this, said piece of film advantageously has a thickness of less than 1 mm, in particular between 5 μηι and 50 μηι, for example of the order of 25 μηι-.
Dans un capteur selon l'invention, en particulier pour la mesure de déformations en flexion, ladite pièce de film présente une raideur en flexion plus faible que celle de l'enrobage. En effet, l'enrobage s'étendant à l'opposé de ladite face de fixation peut présenter une raideur en flexion un peu plus importante que celle de ladite pièce de film.  In a sensor according to the invention, in particular for the measurement of bending deformations, said piece of film has a flexural stiffness lower than that of the coating. Indeed, the coating extending opposite said fixing face may have a flexural stiffness a little larger than that of said piece of film.
Par ailleurs, avantageusement, ledit enrobage d'un capteur selon l'invention est un enrobage à l'état solide qui peut être formé selon une forme périphérique et des dimensions appropriées qui peuvent faire l'objet de très nombreuses variantes selon les applications et les modes de réalisation du capteur.  Furthermore, advantageously, said coating of a sensor according to the invention is a solid-state coating which may be formed into a peripheral shape and of suitable dimensions which may be subject to numerous variations depending on the applications and embodiments of the sensor.
Avantageusement, dans certains modes de réalisation possible d'un capteur selon l'invention ledit enrobage présente une surface externe périphérique libre formant une surface externe périphérique libre du capteur selon l'invention. Ainsi, la surface externe périphérique d'un capteur selon l'invention est entièrement formée par ledit enrobage et par ladite pièce de film. Dans ces modes de réalisation, un capteur selon l'invention peut être exempt de boîtier rigide périphérique, ledit enrobage conférant au capteur sa tenue mécanique et sa forme générale, permettant de le manipuler d'un seul tenant. Advantageously, in certain possible embodiments of a sensor according to the invention said coating has a free peripheral outer surface forming a free peripheral outer surface of the sensor according to the invention. Thus, the peripheral outer surface of a sensor according to the invention is entirely formed by said coating and by said piece of film. In these embodiments, a sensor according to the invention may be free of rigid peripheral housing, said coating conferring on the sensor its mechanical strength and its general shape, allowing it to be handled in one piece.
Cela étant, rien n'empêche en variante de prévoir qu'un capteur selon l'invention soit doté d'un renfort ou d'un capot protecteur. Mais ce renfort ou capot protecteur est agencé pour ne pas perturber le fonctionnement de chaque élément sensible du capteur selon l'invention, et en particulier est en tout état de cause à distance de ladite face de fixation de façon à ne pas venir au contact de la surface du solide sur laquelle capteur selon l'invention est appliqué.  However, nothing prevents alternatively to provide a sensor according to the invention is provided with a reinforcement or a protective cover. But this reinforcement or protective cover is arranged not to disturb the operation of each sensitive element of the sensor according to the invention, and in particular is in any case remote from said fixing face so as not to come into contact with the surface of the solid on which the sensor according to the invention is applied.
Ledit enrobage d'un capteur selon l'invention est suffisamment flexible pour préserver une valeur de facteur de jauge suffisamment importante au capteur selon l'invention. En particulier, avantageusement et selon l'invention, ledit enrobage est formé d'au moins une couche d'au moins un matériau, chaque matériau présentant un module d'élasticité inférieur à 10 MPa. Ainsi, chaque matériau constitutif dudit enrobage présente un module d'élasticité inférieur au module d'élasticité du matériau constitutif de ladite pièce de film -notamment inférieur au centième de ce module d'élasticité-.  Said coating of a sensor according to the invention is sufficiently flexible to preserve a sufficiently large gauge factor value to the sensor according to the invention. In particular, advantageously and according to the invention, said coating is formed of at least one layer of at least one material, each material having a modulus of elasticity of less than 10 MPa. Thus, each constituent material of said coating has a modulus of elasticity lower than the modulus of elasticity of the material constituting said piece of film-in particular less than one-hundredth of this modulus of elasticity-.
Cela étant, ledit enrobage est également adapté, c'est-à-dire suffisamment rigide, pour permettre la manipulation, le transport, le stockage, l'emballage, et la fixation du capteur sur une pièce solide à tester. Ainsi, un capteur selon l'invention est un capteur d'un seul tenant (monobloc) constitué principalement, vu de l'extérieur, de ladite pièce de film et dudit enrobage. Pour ce faire, le module d'élasticité dudit enrobage - notamment de chaque matériau constitutif dudit enrobage- est de préférence supérieur à 100 kPa. Avantageusement, ledit enrobage peut être formé par moulage directement sur ladite face de support.  However, said coating is also adapted, that is to say sufficiently rigid, to allow the handling, transport, storage, packaging, and fixing of the sensor on a solid part to be tested. Thus, a sensor according to the invention is a sensor in one piece (monoblock) mainly constituted, seen from the outside, of said piece of film and said coating. To do this, the modulus of elasticity of said coating - in particular of each material constituting said coating - is preferably greater than 100 kPa. Advantageously, said coating may be formed by molding directly on said support face.
En outre, ledit enrobage présente avantageusement une épaisseur supérieure à 2 mm -notamment comprise entre 5 mm et 5 cm, par exemple de l'ordre de 0,5 cm à 1 cm-. Ainsi, l'épaisseur de l'enrobage est supérieure à 5 fois -notamment entre 100 fois et 10 000 fois, en particulier est de l'ordre de 1000 fois- l'épaisseur de ladite pièce de film. Il peut être formé d'un seul bloc d'un même matériau solide, d'un mélange de matériaux solides ou d'un matériau composite ; ou au contraire en plusieurs couches successives d'un même matériau ou de plusieurs matériaux différents, superposées à ladite face de support et parallèlement à cette dernière les unes aux autres, liées rigidement et de façon inamovible les unes aux autres. In addition, said coating advantageously has a thickness greater than 2 mm, in particular between 5 mm and 5 cm, for example of the order of 0.5 cm to 1 cm -1. Thus, the thickness of the coating is greater than 5 times - especially between 100 times and 10,000 times, in particular is of the order of 1000 times - the thickness of said piece of film. It can be formed of a single block of the same solid material, a mixture of solid materials or a composite material; or on the contrary in several successive layers of the same material or of different materials, superimposed on said support face and parallel to the latter to each other, rigidly and irremovably connected to each other.
Au moins une première couche de l'enrobage s'étendant au contact de ladite face de support est formée d'un matériau diélectrique recouvrant au moins chaque élément sensible appliqué sur ladite face de support. De préférence, l'enrobage est entièrement formé en matériau(x) diélectrique(s), c'est-à-dire constitue un enrobage diélectrique.  At least one first layer of the coating extending in contact with said support face is formed of a dielectric material covering at least each sensitive element applied to said support face. Preferably, the coating is entirely formed of dielectric material (s), that is to say constitutes a dielectric coating.
Dans certains modes de réalisation avantageux d'un capteur selon l'invention ledit enrobage est formé d'au moins un matériau polymérique choisi dans le groupe des matériaux polymériques thermoplastiques, des matériaux polymériques viscoélastiques, des matériaux polymériques thermodurcissables, des élastomères, de leurs mélanges et des matériaux composites. Plus particulièrement, ledit matériau polymérique peut être avantageusement choisi dans le groupe des polyuréthanes flexibles, des polyépoxydes flexibles, et des polysiloxanes (silicones).  In certain advantageous embodiments of a sensor according to the invention said coating is formed of at least one polymeric material selected from the group of thermoplastic polymeric materials, viscoelastic polymeric materials, thermosetting polymeric materials, elastomers, their blends. and composite materials. More particularly, said polymeric material may advantageously be chosen from the group of flexible polyurethanes, flexible polyepoxides, and polysiloxanes (silicones).
Selon un premier mode de réalisation possible d'un capteur selon l'invention, ledit enrobage comprend une première couche de revêtement en un premier matériau diélectrique -notamment en polyuréthane flexible- appliquée au- dessus de chaque élément sensible et de ladite face de support et un bloc d'un deuxième matériau polymérique -notamment en un polyépoxyde- appliqué au-dessus de ladite première couche, ledit bloc présentant une épaisseur supérieure à ladite première couche. Selon un deuxième mode de réalisation possible d'un capteur selon l'invention, ledit enrobage est formé d'un seul et même bloc d'un matériau polymérique flexible, en particulier d'un polyépoxyde ou d'un polyuréthane. D'autres modes de réalisation sont possibles.  According to a first possible embodiment of a sensor according to the invention, said coating comprises a first coating layer made of a first dielectric material - in particular flexible polyurethane - applied above each sensitive element and said support face and a block of a second polymeric material - in particular a polyepoxide - applied over said first layer, said block having a thickness greater than said first layer. According to a second possible embodiment of a sensor according to the invention, said coating is formed of a single block of a flexible polymeric material, in particular a polyepoxide or a polyurethane. Other embodiments are possible.
L'enrobage d'un capteur selon l'invention est fixé rigidement de façon inamovible à la face de support de la pièce de film, c'est-à-dire n'est pas adapté pour pouvoir être ôté après fixation du capteur sur une surface d'un solide. L'enrobage peut être appliqué à recouvrement de ladite face de support par au moins un dépôt d'une composition durcissable, chaque dépôt formant une couche de l'enrobage. Un tel dépôt peut être réalisé par simple application ou par moulage de ladite composition durcissable. Chaque composition durcissable est durcie in situ après dépôt, et donc solidarisée rigidement et de façon inamovible à la couche sous-jacente, notamment à ladite pièce de film. Le matériau constitutif de chaque couche de l'enrobage peut ainsi être choisi pour favoriser cette liaison rigide entre les couches, et en particulier entre l'enrobage et ladite pièce de film. The coating of a sensor according to the invention is rigidly fixed irremovably to the support face of the piece of film, that is to say is not suitable to be removed after fixing the sensor on a surface of a solid. The coating may be applied to cover said support face by at least one deposition of a curable composition, each deposit forming a layer of the coating. Such deposition can be achieved by simple application or by molding of said curable composition. Each curable composition is cured in situ after deposition, and thus secured rigidly and immovably to the underlying layer, in particular to said piece of film. The constituent material of each layer of the coating can thus be chosen to promote this rigid connection between the layers, and in particular between the coating and said piece of film.
Cela étant, rien n'empêche en variante de prévoir qu'au moins une couche de l'enrobage soit fixée rigidement par collage à l'aide d'une colle sur une couche sous-jacente. Dans cette variante de réalisation, la colle, qui fait partie intégrante de l'enrobage, doit être choisie également pour présenter des propriétés mécaniques qui sont celles requises pour l'enrobage.  However, nothing prevents alternatively to provide that at least one layer of the coating is fixed rigidly by gluing with a glue on an underlying layer. In this embodiment, the glue, which is an integral part of the coating, must also be chosen to have mechanical properties which are those required for the coating.
Le choix du nombre, de la nature, de l'orientation et de l'agencement du(des) élément(s) sensible(s) d'un capteur selon l'invention peut faire l'objet de toutes variantes, par application des méthodes bien connues en elles-mêmes à ce titre dans le domaine des jauges de contraintes, en fonction des applications et des mesures de déformation à effectuer sur la surface du solide (qui peuvent être des déformations en flexion et/ou en compression et/ou en traction et/ou en cisaillement et/ou en torsion). Un capteur selon l'invention peut ainsi comporter :  The choice of the number, the nature, the orientation and the arrangement of the sensitive element (s) of a sensor according to the invention may be the subject of any variant, by application of the methods well known in this respect in the field of strain gages, depending on the applications and the deformation measurements to be made on the surface of the solid (which may be deformations in flexion and / or in compression and / or in tension and / or in shear and / or in torsion). A sensor according to the invention can thus comprise:
- un unique élément sensible appliqué sur ladite face de support ;  a single sensitive element applied on said support face;
- une pluralité d'éléments sensibles distincts dont au moins un est appliqué sur ladite face de support -notamment une pluralité d'éléments sensibles appliqués sur ladite face de support- ;  a plurality of distinct sensitive elements, at least one of which is applied to said support face, in particular a plurality of sensitive elements applied to said support face;
- plusieurs éléments sensibles distincts tous appliqués sur ladite face de support ;  a plurality of distinct sensitive elements all applied to said support face;
- au moins un élément sensible noyé dans ledit enrobage, à distance de ladite face de support, - un ou plusieurs éléments sensibles appliqués sur ladite face de support, et un ou plusieurs éléments sensibles noyés dans ledit enrobage, à distance de ladite face de support. at least one sensitive element embedded in said coating, at a distance from said support face, one or more sensitive elements applied to said support face, and one or more sensitive elements embedded in said coating, at a distance from said support face.
Dans un capteur de déformation selon l'invention, ledit enrobage s'étend autour de chaque élément sensible et à partir de la face de support de la pièce de film. En conséquence, chaque élément sensible s'étend parallèlement à ladite face de support selon une aire inférieure à l'aire totale de cette face de support. En outre, ladite face de support présente une aire supérieure à celle de chaque élément sensible parallèlement à ladite face de support, et supérieure à l'aire totale dudit au moins un élément sensible parallèlement à ladite face de support, c'est-à-dire supérieure à l'aire totale parallèlement à ladite face de support de la surface occupée par les différents éléments sensibles parallèlement à ladite face de support lorsque le capteur comprend plusieurs tels éléments sensibles.  In a deformation sensor according to the invention, said coating extends around each sensitive element and from the support face of the film piece. Consequently, each sensing element extends parallel to said support face in an area less than the total area of this support face. In addition, said support face has an area greater than that of each sensitive element parallel to said support face, and greater than the total area of said at least one sensitive element parallel to said support face, that is to say say greater than the total area parallel to said support surface of the surface occupied by the different sensitive elements parallel to said support face when the sensor comprises a plurality of such sensitive elements.
Chaque élément sensible d'un capteur selon l'invention présente des plots de connexion électrique permettant de relier électriquement cet élément sensible à un circuit électronique adapté pour mesurer ladite caractéristique électrique de l'élément sensible. Dans certains modes de réalisation avantageux un capteur selon l'invention est aussi caractérisé en ce qu'il comprend un circuit électronique :  Each sensitive element of a sensor according to the invention has electrical connection pads for electrically connecting this sensitive element to an electronic circuit adapted to measure said electrical characteristic of the sensitive element. In some advantageous embodiments, a sensor according to the invention is also characterized in that it comprises an electronic circuit:
- relié électriquement aux plots de chaque élément sensible,  - electrically connected to the pads of each sensitive element,
- adapté pour mesurer ladite caractéristique électrique de chaque élément sensible, et pour délivrer un signal, dit signal de mesure, représentatif de ladite caractéristique électrique de chaque élément sensible,  adapted to measure said electrical characteristic of each sensitive element, and to deliver a signal, said measurement signal, representative of said electrical characteristic of each sensitive element,
et en ce que ledit circuit électronique est au moins pour partie inclus dans ledit enrobage. and in that said electronic circuit is at least partly included in said coating.
Dans certains modes de réalisation possibles d'un capteur selon l'invention, ledit circuit électronique est intégralement inclus à l'intérieur de l'enrobage, et comporte à cet effet l'intégralité des composants nécessaires à la mesure de la caractéristique électrique de chaque élément sensible, et à la transmission sans fil -notamment par radiofréquence- du signal de mesure à l'extérieur de l'enrobage le capteur selon l'invention à destination d'un système externe tel qu'un système informatique. Dans ces modes de réalisation particuliers, le circuit électronique incorpore en particulier une source de puissance électrique qui peut être formée par exemple d'au moins une pile et/ou d'un composant photovoltaïque. En variante, le circuit électronique peut être alimenté électriquement depuis l'extérieur de l'enrobage, par exemple par induction ou effet photoélectrique. In certain possible embodiments of a sensor according to the invention, said electronic circuit is integrally included inside the coating, and comprises for this purpose all the components necessary for the measurement of the electrical characteristic of each sensing element, and to the wireless transmission - particularly radio frequency - of the measurement signal outside the coating on sensor according to the invention for an external system such as a computer system. In these particular embodiments, the electronic circuit incorporates in particular a source of electrical power which can be formed for example of at least one battery and / or a photovoltaic component. Alternatively, the electronic circuit may be electrically powered from outside the coating, for example by induction or photoelectric effect.
Cela étant, dans certains modes de réalisation préférentiels avantageux un capteur selon l'invention est aussi caractérisé en ce qu'il comprend un port de connexion qui s'étend à l'extérieur dudit enrobage et en ce que ledit circuit électronique est adapté pour délivrer ledit signal de mesure sur ce port de connexion.  However, in certain preferred advantageous embodiments a sensor according to the invention is also characterized in that it comprises a connection port which extends outside said coating and in that said electronic circuit is adapted to deliver said measurement signal on this connection port.
Ce port de connexion peut être porté par une plaque dudit circuit électronique qui s'étend en saillie vers l'extérieur dudit enrobage, par exemple en saillie vers l'extérieur d'une face périphérique dudit enrobage, notamment d'une face latérale dudit enrobage s'étendant à partir d'un bord périphérique de ladite pièce du film formant ladite face de fixation.  This connection port may be carried by a plate of said electronic circuit which protrudes outwardly from said coating, for example protruding outwardly from a peripheral face of said coating, in particular a side face of said coating. extending from a peripheral edge of said piece of film forming said attachment face.
Il est à noter que la seule source de rigidité incorporée dans un capteur selon l'invention est éventuellement le circuit électronique qui peut être formé à partir d'au moins une plaquette (ou carte de circuit imprimé) plus ou moins rigide. Rien n'empêche cependant de former le circuit électronique sous forme flexible, à partir d'une plaque de substrat souple, au moins dans sa partie incluse à l'intérieur de l'enrobage.  It should be noted that the only source of rigidity incorporated in a sensor according to the invention is possibly the electronic circuit which can be formed from at least one plate (or printed circuit board) more or less rigid. However, nothing prevents forming the electronic circuit in flexible form, from a flexible substrate plate, at least in its part included inside the coating.
Par ailleurs, le circuit électronique d'un capteur selon l'invention peut comporter une plaquette appliquée au contact de ladite face de support et revêtue par l'enrobage, et/ou une plaquette noyée au sein de l'épaisseur de l'enrobage, sans venir au contact de ladite face de support. Dans cette deuxième variante, la plaquette du circuit électronique interfère moins du point de vue mécanique avec la déformation de ladite pièce de film, et donc avec le fonctionnement de chaque élément sensible. Le circuit électronique peut être relié électriquement aux plots de chaque élément sensible par des fils de liaison inclus dans ledit enrobage (par un câblage par fils, dit « wire bonding » en anglais), ou par connexion directe (notamment par un montage de type puce retournée, dit « flip-chip » en anglais). Furthermore, the electronic circuit of a sensor according to the invention may comprise a wafer applied in contact with said support face and coated by the coating, and / or a wafer embedded within the thickness of the coating, without coming into contact with said support face. In this second variant, the wafer of the electronic circuit interferes less mechanically with the deformation of said piece of film, and therefore with the operation of each sensitive element. The electronic circuit can be electrically connected to the pads of each sensing element by connecting wires included in said coating (by wire wiring, called "wire"). bonding "in English), or by direct connection (in particular by a flip-chip type assembly).
Ainsi, dans certains modes de réalisation possibles, un capteur selon l'invention est constitué de ladite pièce de film formant ladite face de fixation et d'un enrobage polymérique s' étendant à partir de ladite face de support opposée à ladite face de fixation, et dans lequel sont noyés au moins un -notamment un unique- élément sensible appliqué sur ladite face de support et ledit circuit électronique, ledit port de connexion s'étendant à l'extérieur de l'enrobage. Selon une variante, le capteur comprend en outre un module de communication sans fil s'étendant à l'extérieur dudit enrobage et connecté audit port de connexion. D'autres variantes sont possibles comme indiqué ci-dessus ou ci-après.  Thus, in certain possible embodiments, a sensor according to the invention consists of said piece of film forming said fixing face and a polymeric coating extending from said support face opposite to said fixing face, and wherein at least one of a single sensing element is embedded on said support face and said electronic circuit, said connection port extending outside the coating. According to one variant, the sensor further comprises a wireless communication module extending outside said coating and connected to said connection port. Other variants are possible as indicated above or below.
Le port de connexion d'un capteur selon l'invention peut être adapté pour réaliser une connexion filaire du capteur selon l'invention avec un système externe tel qu'un système informatique. En variante ou en combinaison, le port de connexion d'un capteur selon l'invention peut être adapté pour recevoir un connecteur d'un module de communication sans fil s'étendant à l'extérieur de l'enrobage et adapté pour permettre l'établissement d'une liaison de communication avec un système externe. Ainsi, dans certains modes de réalisation un capteur selon l'invention comprend un module de communication sans fil s'étendant à l'extérieur de l'enrobage et connecté électriquement audit port de connexion. Un tel module de communication sans fil peut être choisi par exemple parmi un module de communication radiofréquence, un module de communication infrarouge, un module de communication optique, un module de communication magnétique, un module de communication par induction. Avantageusement, il peut s'agir d'un module radiofréquence permettant la transmission du signal de mesure selon tout protocole radiofréquence approprié (Wi-Fi®, Bluetooth®, ZigBee®, SigFox®, LoRaWan®, protocole de téléphonie mobile (GPRS, UMTS, LTE, WiMax... )...).  The connection port of a sensor according to the invention may be adapted to make a wired connection of the sensor according to the invention with an external system such as a computer system. Alternatively or in combination, the connection port of a sensor according to the invention may be adapted to receive a connector of a wireless communication module extending outside the coating and adapted to allow the establishing a communication link with an external system. Thus, in some embodiments a sensor according to the invention comprises a wireless communication module extending outside the encapsulation and electrically connected to said connection port. Such a wireless communication module can be chosen for example from a radio frequency communication module, an infrared communication module, an optical communication module, a magnetic communication module, an induction communication module. Advantageously, it may be a radiofrequency module for transmitting the measurement signal according to any appropriate radio frequency protocol (Wi-Fi®, Bluetooth®, ZigBee®, SigFox®, LoRaWan®, mobile telephony protocol (GPRS, UMTS , LTE, WiMax ...) ...).
Dans certains modes de réalisation avantageux, un tel module de communication sans fil peut être formé d'une plaquette rigide adaptée pour pouvoir s'étendre le long d'une face plane de l'enrobage opposée à la face de fixation. Dans certaines variantes de réalisation, une telle plaquette formant module de communication s'étend à distance de cette face plane, cette plaquette présentant un connecteur latéral adapté pour être relié audit port de connexion s' étendant en saillie d'une face latérale de l'enrobage. Dans d'autres variantes possibles, une telle plaquette formant module de communication est au contraire encastrée dans un renfoncement conjugué de l'enrobage. Un capteur selon l'invention ainsi formé est particulièrement compact et facile à manipuler et à installer. In certain advantageous embodiments, such a wireless communication module may be formed of a rigid plate adapted to be able to extend along a flat face of the coating opposite to the fixing face. In certain embodiments, such a wafer forming a communication module extends away from this flat face, this wafer having a lateral connector adapted to be connected to said connection port extending projecting from a lateral face of the coating. In other possible variants, such a wafer forming a communication module is instead embedded in a recess conjugate coating. A sensor according to the invention thus formed is particularly compact and easy to handle and install.
Le circuit électronique d'un capteur selon l'invention peut comporter un ou plusieurs circuits électriques s 'étendant entre chaque élément sensible et ledit port de connexion. Dans certains modes de réalisation avantageux, le circuit électronique est adapté pour délivrer un signal de mesure numérique, notamment sous un format compatible avec ledit module de communication sans fil et/ou avec un réseau numérique, par exemple un format compatible avec le réseau Internet. Ainsi, le circuit électronique est adapté pour d'une part réaliser une mesure analogique de la caractéristique électrique de chaque élément sensible, et d'autre part pour transformer cette mesure analogique en un signal numérique délivré sur ledit port de connexion, qui peut être un connecteur compatible avec un dispositif informatique et/ou avec un module de communication sans fil. Dans ces modes de réalisation, un capteur selon l'invention peut être qualifié de capteur de déformation numérique.  The electronic circuit of a sensor according to the invention may comprise one or more electrical circuits extending between each sensitive element and said connection port. In certain advantageous embodiments, the electronic circuit is adapted to deliver a digital measurement signal, in particular in a format compatible with said wireless communication module and / or with a digital network, for example a format compatible with the Internet network. Thus, the electronic circuit is adapted to firstly perform an analog measurement of the electrical characteristic of each sensitive element, and secondly to transform this analog measurement into a digital signal delivered on said connection port, which can be a connector compatible with a computing device and / or with a wireless communication module. In these embodiments, a sensor according to the invention can be qualified as digital deformation sensor.
Dans certains modes de réalisation possibles d'un capteur selon l'invention comprenant un circuit électronique, ladite pièce de film et la face de fixation s'étendent en regard de chaque élément sensible et d'au moins une partie du circuit électronique. L'aire de la face de fixation est donc supérieure à l'aire occupée par chaque élément sensible sur ladite face de support parallèlement à ladite face de fixation.  In certain possible embodiments of a sensor according to the invention comprising an electronic circuit, said piece of film and the attachment face extend opposite each sensitive element and at least a part of the electronic circuit. The area of the attachment face is greater than the area occupied by each sensitive element on said support face parallel to said attachment face.
Un capteur selon l'invention peut présenter toutes formes et toutes dimensions, selon les applications, et en particulier selon le nombre d'éléments sensibles et leur nature. La forme générale d'un capteur selon l'invention est définie par celle de l'enrobage. En particulier, l'enrobage peut être globalement prismatique ou en forme générale de parallélépipède (à l'exception de la face de fixation dont la forme est adaptée à celle de la surface du solide sur lequel le capteur doit être fixé comme indiqué ci-dessous). Avantageusement, l'enrobage présente une face plane opposée à la face de fixation comme indiqué ci-dessus. A sensor according to the invention can have all shapes and sizes, depending on the applications, and in particular according to the number of sensitive elements and their nature. The general shape of a sensor according to the invention is defined by that of the coating. In particular, the coating may be generally prismatic or in the general parallelepiped shape (with the exception of the attachment face whose shape is adapted to that of the solid surface on which the sensor must be fixed as indicated below ). Advantageously, the coating has a planar face opposite to the attachment face as indicated above.
Dans certains modes de réalisation possibles, un capteur selon l'invention présente une forme globalement parallélépipédique avec une largeur supérieure à 0,5 cm -notamment inférieure à 10 cm, par exemple de l'ordre de 1 cm à 2 cm- et une longueur supérieure à 2 cm -notamment inférieure à 50 cm, par exemple de l'ordre de 2 cm à 5 cm-. Toutes autres formes (portion de cylindre, calotte, prismatique, forme non remarquable...) et dimensions sont possibles.  In certain possible embodiments, a sensor according to the invention has a generally parallelepipedal shape with a width greater than 0.5 cm - in particular less than 10 cm, for example of the order of 1 cm to 2 cm -1 and a length greater than 2 cm - especially less than 50 cm, for example of the order of 2 cm to 5 cm -1. All other forms (cylinder portion, cap, prismatic, non-remarkable shape ...) and dimensions are possible.
La forme de la face de fixation peut être quelconque, et est adaptée à celle de la surface du solide sur laquelle le capteur doit être fixé. Cette forme de la face de fixation dépend de celle donnée à ladite pièce de film, cette dernière dépendant de l'enrobage superposé à cette pièce de film, et qui détermine donc sa forme générale au repos. En particulier, l'enrobage peut être formé par moulage comme indiqué ci-dessus, une pièce du moule étant appliquée contre la face de fixation lors du durcissement de l'enrobage afin de lui conférer la forme souhaitée. En particulier, la face de fixation peut être plane. En variante, la face de fixation peut être une surface gauche, par exemple cylindrique ou une calotte ou une surface polyédrique ou autre. Ainsi, la face de fixation peut être choisie par exemple dans le groupe formé des faces planes, des faces cylindriques -notamment cylindriques de révolution- concaves, des faces cylindriques -notamment cylindriques de révolution- convexes, des calottes sphériques concaves, des calottes sphériques convexes, des calottes paraboloïdes concaves, des calottes paraboloïdes convexes, des faces polyédriques concaves et des faces polyédriques convexes. La face de fixation peut également présenter une forme gauche quelconque non remarquable, ni convexe ni concave.  The shape of the fixing face may be arbitrary, and is adapted to that of the surface of the solid on which the sensor must be fixed. This form of the fixing face depends on that given to said piece of film, the latter depending on the coating superimposed on this piece of film, and which therefore determines its general shape at rest. In particular, the coating may be formed by molding as indicated above, a piece of the mold being applied against the fixing face during curing of the coating to give it the desired shape. In particular, the fixing face may be flat. Alternatively, the attachment face may be a left surface, for example cylindrical or a cap or a polyhedral surface or the like. Thus, the fixing face can be chosen for example from the group consisting of planar faces, cylindrical faces-notably cylindrical of concave-revolution, cylindrical faces-in particular cylindrical of convex-revolution, concave spherical caps, convex spherical caps. concave dish caps, convex dish caps, concave polyhedral faces and convex polyhedral faces. The attachment face may also have any unspecified left shape, neither convex nor concave.
Comme indiqué ci-dessus, l'invention s'applique à un capteur comprenant, à titre d'élément sensible, tout élément sensible dont au moins une caractéristique électrique varie en fonction de sa déformation. Plus particulièrement, dans certains modes de réalisation préférentiels, au moins un -notamment chaque- élément sensible est formé d'une jauge de contraintes dont l'impédance varie en fonction de sa déformation. Le circuit électronique est alors adapté pour alimenter électriquement chaque élément sensible de façon à permettre la mesure de son impédance. Avantageusement et selon l'invention, au moins un -notamment chaque- élément sensible est formé d'une jauge de contrainte résistive et le circuit électronique est adapté pour alimenter électriquement chaque jauge de contrainte résistive. As indicated above, the invention applies to a sensor comprising, as sensitive element, any sensitive element of which at least one electrical characteristic varies depending on its deformation. More particularly, in some preferred embodiments, at least one-in particular each-sensitive element is formed of a strain gauge whose impedance varies as a function of its deformation. The electronic circuit is then adapted to electrically power each sensitive element so as to allow the measurement of its impedance. Advantageously and according to the invention, at least one-in particular each-sensitive element is formed of a resistive strain gauge and the electronic circuit is adapted to electrically power each resistive strain gauge.
L'invention concerne en particulier un capteur de déformation -notamment un capteur de déformation en flexion- présentant une face libre, dite face de fixation, adaptée pour pouvoir être appliquée sur une surface d'un solide dont la déformation -notamment la déformation en flexion- doit être mesurée, et comprenant :  The invention particularly relates to a deformation sensor -in particular a flexural deformation sensor- having a free face, called a fixing face, adapted to be applied to a surface of a solid whose deformation-in particular the bending deformation - must be measured, and including:
- au moins un élément sensible dont une caractéristique électrique varie en fonction de sa déformation agencé de telle sorte que ladite caractéristique électrique de l'élément sensible varie en fonction d'un état de déformation d'au moins une portion de ladite face de fixation,  at least one sensitive element whose electrical characteristic varies according to its deformation arranged in such a way that said electrical characteristic of the sensitive element varies as a function of a deformation state of at least a portion of said fixing face,
- un enrobage s' étendant autour de chaque élément sensible,  a coating extending around each sensitive element,
- ladite face de fixation du capteur est entièrement constituée par une face libre unie d'une pièce de film, cette pièce de film présentant une face, dite face de support, opposée à ladite face de fixation, et une épaisseur constante entre ladite face de fixation et ladite face de support,  said fixing face of the sensor is entirely constituted by a solid free face of a piece of film, this piece of film having a face, said support face, opposite to said fixing face, and a constant thickness between said face of said film face; fixing and said support face,
- au moins un élément sensible -notamment au moins un élément sensible à base de nanoparticules- est appliqué sur ladite face de support,  at least one sensitive element, in particular at least one sensitive element based on nanoparticles, is applied to said support face,
- ledit enrobage :  said coating:
o est fixé rigidement de façon inamovible à ladite face de support de ladite pièce de film,  o is rigidly fixed irremovably to said support face of said piece of film,
o s'étend à partir de ladite face de support de ladite pièce de film, entièrement à l'opposé de ladite face de fixation, caractérisé en ce que : o extends from said support surface of said piece of film, entirely opposite said fixing face, characterized in that
- ladite pièce de film présente une épaisseur inférieure à 1 mm -notamment comprise entre 5 μηι et 50 μηι, par exemple de l'ordre de 25 μηι-,  said piece of film has a thickness of less than 1 mm, in particular between 5 μηι and 50 μηι, for example of the order of 25 μηι-,
- ledit enrobage s'étend à partir de ladite face de support de ladite pièce de film sur une épaisseur supérieure à -notamment supérieure à 5 fois, en particulier entre said coating extends from said support surface of said piece of film to a thickness greater than-in particular greater than 5 times, in particular between
100 fois et 10 000 fois, plus particulièrement de l'ordre de 1000 fois- l'épaisseur de ladite pièce de film ; en particulier, ladite épaisseur dudit enrobage est supérieure à 2 mm, en particulier comprise entre 5 mm et 5 cm, plus particulièrement de l'ordre de 0,5 cm à 1 cm, 100 times and 10,000 times, more particularly of the order of 1000 times the thickness of said piece of film; in particular, said thickness of said coating is greater than 2 mm, in particular between 5 mm and 5 cm, more particularly of the order of 0.5 cm to 1 cm,
- le module d'élasticité dudit enrobage -notamment de chaque matériau constitutif dudit enrobage- est supérieur à 100 kPa, et inférieur à 10 MPa,  the modulus of elasticity of said coating - in particular of each material constituting said coating - is greater than 100 kPa, and less than 10 MPa,
- ladite pièce de film est formée d'un matériau présentant un module d'élasticité supérieur à 1 GPa,  said piece of film is formed of a material having a modulus of elasticity greater than 1 GPa,
- ladite pièce de film présente une raideur en flexion plus faible que celle de l'enrobage,  said piece of film has a flexural stiffness lower than that of the coating,
- il comprend un circuit électronique :  - it includes an electronic circuit:
o au moins pour partie inclus dans ledit enrobage,  at least partly included in said coating,
o relié électriquement à chaque élément sensible,  o electrically connected to each sensitive element,
o adapté pour mesurer ladite caractéristique électrique de chaque élément sensible, et pour délivrer un signal, dit signal de mesure, représentatif de ladite caractéristique électrique de chaque élément sensible.  o adapted to measure said electrical characteristic of each sensitive element, and to deliver a signal, said measurement signal, representative of said electrical characteristic of each sensitive element.
Ainsi, l'invention permet en particulier d'obtenir, pour la première fois, un capteur numérique de déformation d'un seul tenant (monobloc), autonome dans son fonctionnement, précalibré, prêt à être fixé sur une surface de solide en une étape de collage et à être directement relié à un système informatique par un simple branchement ou par établissement d'une liaison de communication sans fil.  Thus, the invention makes it possible in particular to obtain, for the first time, a digital deformation sensor in one piece (monoblock), autonomous in its operation, precalibrated, ready to be fixed on a solid surface in one step bonding and to be directly connected to a computer system by a simple connection or establishment of a wireless communication link.
L'invention s'étend également à un procédé d'utilisation d'un capteur selon l'invention. Elle s'étend donc également à un procédé de mesure de la déformation d'une surface d'un solide dans lequel : - on choisit un capteur de déformation selon l'invention, The invention also extends to a method of using a sensor according to the invention. It therefore also extends to a method for measuring the deformation of a surface of a solid in which: a deformation sensor according to the invention is chosen,
- on fixe la face de fixation du capteur sur la surface du solide.  the fixing face of the sensor is fixed on the surface of the solid.
Avantageusement et selon l'invention, on fixe le capteur sur la surface du solide par collage -notamment exclusivement par collage- de la face de fixation du capteur sur la surface du solide. En outre, avantageusement et selon l'invention, on relie le capteur à un système informatique de façon à transmettre à ce système informatique le signal de mesure délivré par le capteur. En particulier, on relie le capteur à un système informatique via le port de connexion du capteur, et ce par une liaison filaire ou par l'intermédiaire d'un module de communication sans fil relié audit port de connexion.  Advantageously and according to the invention, the sensor is fixed on the surface of the solid by gluing -particularly exclusively by gluing- the fixing face of the sensor on the surface of the solid. In addition, advantageously and according to the invention, the sensor is connected to a computer system so as to transmit to this computer system the measurement signal delivered by the sensor. In particular, the sensor is connected to a computer system via the sensor connection port, and this by a wired connection or via a wireless communication module connected to said connection port.
L'invention s'étend également à un procédé de fabrication d'un capteur selon l'invention. Elle concerne donc un procédé de fabrication d'un capteur de déformation dans lequel :  The invention also extends to a method of manufacturing a sensor according to the invention. It therefore relates to a method of manufacturing a deformation sensor in which:
- au moins un élément sensible est appliqué sur une face, dite face de support, d'une pièce de film, cette pièce de film présentant une face, dite face de fixation, opposée à la face de support et une épaisseur constante entre la face de fixation et la face de support,  at least one sensitive element is applied to a face, called the support face, of a piece of film, this piece of film having a face, called the attachment face, opposite to the support face and a constant thickness between the face fixing and the support side,
- un enrobage est fixé rigidement et de façon inamovible à ladite face de support de façon à s'étendre autour de chaque élément sensible, à partir de ladite face de support entièrement à l'opposé de ladite face de fixation, sur une épaisseur supérieure à l'épaisseur de ladite pièce de film.  a coating is fixed rigidly and irremovably to said support face so as to extend around each sensitive element, from said support face completely opposite to said attachment face, to a thickness greater than the thickness of said piece of film.
L'invention concerne également un capteur de déformation, un procédé de mesure de déformation et un procédé de fabrication d'un tel capteur caractérisés, en combinaison ou non, par tout ou partie des caractéristiques mentionnées ci-dessus ou ci-après. Quelle que soit la présentation formelle qui en est donnée, sauf indication contraire explicite, les différentes caractéristiques mentionnées ci-dessus ou ci-après ne doivent pas être considérées comme étroitement ou inextricablement liées entre elles, l'invention pouvant concerner l'une seulement de ces caractéristiques structurelles ou fonctionnelles, ou une partie seulement de ces caractéristiques structurelles ou fonctionnelles, ou une partie seulement de l'une de ces caractéristiques structurelles ou fonctionnelles, ou encore tout groupement, combinaison ou juxtaposition de tout ou partie de ces caractéristiques structurelles ou fonctionnelles. The invention also relates to a deformation sensor, a deformation measuring method and a method of manufacturing such a sensor characterized, in combination or not, by all or some of the characteristics mentioned above or below. Whatever the formal presentation given, unless expressly stated otherwise, the various characteristics mentioned above or below must not be considered as closely or inextricably linked together, the invention may relate to only one of these structural or functional features, or only some of these structural or functional characteristics, or only part of one of these structural or functional characteristics, or any grouping, combination or juxtaposition of all or part of these structural or functional characteristics.
D'autres buts, caractéristiques et avantages de l'invention apparaîtront à la lecture de la description suivante donnée à titre non limitatif et qui se réfère aux figures annexées dans lesquelles :  Other objects, features and advantages of the invention will appear on reading the following non-limiting description which refers to the appended figures in which:
- la figure 1 est une vue schématique en perspective d'un capteur selon un premier mode de réalisation de l'invention,  FIG. 1 is a schematic perspective view of a sensor according to a first embodiment of the invention,
- la figure 2 est une vue schématique de dessus du capteur de la figure 1, FIG. 2 is a schematic view from above of the sensor of FIG. 1,
- la figure 3 est une vue schématique de côté du capteur de la figure 1 représenté fixé sur une surface d'un solide et relié à un système informatique, FIG. 3 is a schematic side view of the sensor of FIG. 1 shown fixed on a surface of a solid and connected to a computer system,
- les figures 4 et 5 sont des vues schématiques en perspective et, respectivement, de côté d'un capteur selon un deuxième mode de réalisation de l'invention,  FIGS. 4 and 5 are schematic views in perspective and, respectively, of a sensor according to a second embodiment of the invention,
- la figure 6 est une vue schématique en perspective d'un capteur selon un troisième mode de réalisation de l'invention  FIG. 6 is a schematic perspective view of a sensor according to a third embodiment of the invention
- la figure 7 est vue schématique de côté du capteur de la figure 6 représenté fixé sur une surface d'un solide et relié à un système informatique,  FIG. 7 is a schematic side view of the sensor of FIG. 6 shown fixed on a surface of a solid and connected to a computer system,
- les figures 8 et 9 sont des vues schématiques de côté d'un capteur selon un quatrième mode de réalisation de l'invention, respectivement selon un cinquième mode de réalisation de l'invention,  FIGS. 8 and 9 are schematic side views of a sensor according to a fourth embodiment of the invention, respectively according to a fifth embodiment of the invention,
- la figure 10 est un diagramme illustrant des résultats d'essais permettant de déterminer le facteur de jauge d'un capteur selon l'invention,  FIG. 10 is a diagram illustrating test results for determining the gage factor of a sensor according to the invention,
- les figures 11 et 12 sont des diagrammes illustrant des signaux de mesure délivrés par une jauge de contraintes selon l'état de la technique et, respectivement par un capteur selon l'invention intégrant la même jauge de contraintes,  FIGS. 11 and 12 are diagrams illustrating measurement signals delivered by a strain gauge according to the state of the art and, respectively, by a sensor according to the invention integrating the same strain gauge,
- la figure 13 est un schéma synoptique d'un exemple de réalisation d'un circuit électronique d'un capteur selon l'invention. Sur les figures, les échelles ne sont pas nécessairement respectées, notamment en épaisseur, et ce à des fins d'illustration. Le capteur monobloc selon le premier mode de réalisation de l'invention représenté figures 1 à 3 comprend une pastille 11 rectangulaire d'un film flexible de polyimide ayant une épaisseur de l'ordre de 25 μηι sur une face, dite face 14 de support, de laquelle est appliquée une jauge 12 de contraintes formée de fils de nanoparticules d'or colloïdales s'étendant entre deux électrodes 13, qui constituent des plots de connexion électrique de la jauge 12 de contraintes, comme décrit par la publication Cosmin Farcau et al ou par la publication Lucas Digianantonio et al susmentionnées. FIG. 13 is a block diagram of an exemplary embodiment of an electronic circuit of a sensor according to the invention. In the figures, the scales are not necessarily respected, especially in thickness, and this for the purposes of illustration. The one-piece sensor according to the first embodiment of the invention shown in FIGS. 1 to 3 comprises a rectangular chip 11 of a flexible film of polyimide having a thickness of the order of 25 μηι on one side, called the support face 14, of which is applied a strain gauge 12 formed of son of colloidal gold nanoparticles extending between two electrodes 13, which constitute electrical connection pads of the strain gauge 12, as described by the publication Cosmin Farcau et al. by Lucas Digianantonio et al, cited above.
Un circuit 15 électronique sous forme d'une plaque de circuit imprimé s'étend également au contact de la face 14 de support, en jouxtant la jauge 12 de contraintes. Des fils 16 de liaison relient électriquement les électrodes 13 de la jauge 12 de contraintes au circuit 15 électronique.  An electronic circuit in the form of a printed circuit board also extends in contact with the support face 14, adjacent the strain gauge 12. Connecting wires 16 electrically connect the electrodes 13 of the strain gauge 12 to the electronic circuit.
Un enrobage 17 flexible polymérique diélectrique, par exemple transparent, recouvre l'intégralité de la face 14 de support et s'étend en épaisseur au- dessus de cette dernière en recouvrant la jauge 12 de contraintes et le circuit 15 électronique, à l'exception d'un port 18 de connexion de ce dernier. Les fils 16 de liaison sont noyés dans l'enrobage 17. Le port 18 de connexion s'étend en saillie vers l'extérieur d'une face 19 latérale de l'enrobage 17. L'enrobage 17 présente une forme globalement parallélépipédique. Sur les figures, il est présumé être transparent pour des raisons d'illustration.  A dielectric polymeric flexible coating 17, for example transparent, covers the entire support face 14 and extends in thickness over the latter by covering the strain gauge 12 and the electronic circuit, with the exception of a port 18 connection of the latter. The connecting wires 16 are embedded in the coating 17. The connection port 18 projects outwardly from a side face 19 of the coating 17. The coating 17 has a generally parallelepiped shape. In the figures, it is presumed to be transparent for illustrative purposes.
La pastille 11 présente une face rectangulaire, dite face 20 de fixation, opposée à la face 14 de support et à l'enrobage 17. Cette face 20 de fixation est une face libre qui permet le collage du capteur ainsi formé sur la surface 21 d'un solide dont les déformations ou les contraintes doivent être mesurées, comme représenté figure 3, par l'intermédiaire d'une couche 24 de colle qui est par exemple une couche de colle cyanoacrylate ou une couche de colle époxy.  The pellet 11 has a rectangular face, called the fixing face 20, opposite the support face 14 and the coating 17. This fixing face 20 is a free face which allows the bonding of the sensor thus formed on the surface 21 d a solid whose deformations or stresses must be measured, as represented in FIG. 3, by means of a layer 24 of glue which is for example a layer of cyanoacrylate glue or a layer of epoxy glue.
Le capteur selon l'invention présente ainsi une surface 31 externe périphérique libre qui est formée par ladite face 20 de fixation, par les chants périphériques de la pastille 11 et par l'enrobage 17, à l'exception du port 18 de connexion qui s'étend en saillie à l'extérieur de l'enrobage 17. Cela étant, ce capteur est exempt de tout boîtier périphérique rigide. Ses propriétés mécaniques permettant d'une part sa manipulation aisée et, d'autre part, le fonctionnement approprié de la jauge 12 de contraintes, sont conférées exclusivement par la pastille 11 de film flexible, par le circuit 15 électronique et par l'enrobage 17. The sensor according to the invention thus has a free peripheral outer surface 31 which is formed by said fixing face 20 by the edges peripherals of the pellet 11 and by the coating 17, except for the connection port 18 which protrudes outside the coating 17. This being so, this sensor is free of any rigid peripheral housing. Its mechanical properties making it possible on the one hand easy handling and, on the other hand, the proper operation of the strain gauge 12, are conferred exclusively by the flexible film pellet 11, by the electronic circuit and by the coating 17. .
Le port 18 de connexion est relié par des fils 22 (de préférence sous forme d'un câble réseau tel qu'un câble USB ou un câble Ethernet) à un système informatique 23 qui permet d'une part l'alimentation électrique du circuit 15 électronique, d'autre part la transmission des signaux de mesure délivrés par le circuit 15 électronique au système 23 informatique.  The port 18 of connection is connected by wires 22 (preferably in the form of a network cable such as a USB cable or an Ethernet cable) to a computer system 23 which allows on the one hand the power supply of the circuit 15 electronics, on the other hand the transmission of the measurement signals delivered by the electronic circuit to the computer system 23.
La jauge 12 de contraintes est une jauge de contraintes résistive, c'est-à-dire que sa résistance varie en fonction de la déformation de la face 20 de fixation, qui dépend elle-même de la déformation de la surface 21 du solide sur laquelle le capteur est collé.  The strain gauge 12 is a resistive strain gauge, that is to say that its resistance varies as a function of the deformation of the fastening face, which itself depends on the deformation of the surface 21 of the solid on which sensor is glued.
Le deuxième mode de réalisation représenté sur les figures 4 et 5 diffère du premier mode de réalisation par le fait que le capteur comporte une couche 25 d'adhésif sensible à la pression à température ambiante solidaire de la pastille 11, la face 20 de fixation de la pastille 11 étant formée par la face libre de cette couche 25 d'adhésif qui recouvre entièrement la face du film flexible opposée à la face 14 de support. Cette couche 25 d'adhésif est protégée avant utilisation du capteur par une feuille 26 amovible formée par exemple d'un papier siliconé. Pour fixer un tel capteur sur la surface d'un solide, il suffit donc d'ôter cette feuille 26 amovible et d'appliquer le capteur avec la couche 25 d'adhésif au contact de la surface 21 du solide pour réaliser le collage. Cette couche 25 d'adhésif peut être appliquée sur le film flexible par impression ou par transfert, ou être formée d'un adhésif double face préalablement collé sur le film flexible.  The second embodiment shown in FIGS. 4 and 5 differs from the first embodiment in that the sensor comprises a pressure sensitive adhesive layer at ambient temperature integral with the wafer 11, the fixing face 20 of the the pellet 11 being formed by the free face of this adhesive layer 25 which completely covers the face of the flexible film opposite to the support face 14. This layer 25 of adhesive is protected before use of the sensor by a removable sheet 26 formed for example of a silicone paper. To fix such a sensor on the surface of a solid, it is sufficient to remove the removable sheet 26 and apply the sensor with the adhesive layer 25 in contact with the surface 21 of the solid to achieve the bonding. This adhesive layer may be applied to the flexible film by printing or transfer, or be formed of a double-sided adhesive previously bonded to the flexible film.
Le troisième mode de réalisation représenté figures 6 et 7 diffère du premier mode de réalisation d'une part par le fait que l'enrobage 17 est formé de plusieurs couches, à savoir une première couche 28 placée à recouvrement de la face 14 de support et de la jauge 12 de contraintes, d'épaisseur relativement faible, par exemple de l'ordre de 1 mm à 2 mm, et une deuxième couche 29 surmontant la première couche 28. Par exemple, la première couche 28 est formée en polyuréthane, tandis que la deuxième couche 29 est formée en polyépoxyde et présente une plus grande épaisseur, par exemple de l'ordre de 0,5 cm à 1,5 cm. En outre, le circuit 15 électronique n'est pas au contact de la pastille 11 de film flexible, mais est noyé au sein de l'épaisseur de la deuxième couche 29 de l'enrobage 17, à distance de la face 14 de support. The third embodiment shown in FIGS. 6 and 7 differs from the first embodiment on the one hand in that the coating 17 is formed of several layers, namely a first layer 28 placed overlapping the support face 14 and the strain gauge 12, of relatively small thickness, for example of the order of 1 mm to 2 mm, and a second layer 29 overlying the first layer 28. For example, the first layer 28 is formed of polyurethane, while the second layer 29 is formed of polyepoxide and has a greater thickness, for example of the order of 0.5 cm to 1.5 cm. In addition, the electronic circuit is not in contact with the wafer 11 of flexible film, but is embedded within the thickness of the second layer 29 of the coating 17, at a distance from the support face 14.
En outre, comme représenté figure 7 le capteur peut être relié en communication avec un système 23 informatique par un module 27 de communication sans fil connecté au port 18 de connexion. Ce module 27 de communication sans fil permet la transmission à distance par radiofréquence des signaux de mesure au système 23 informatique. Avantageusement, le module 27 de communication sans fil peut être un module de transmission à basse énergie et/ou à longue distance. Tout protocole de transmission radiofréquence peut être envisagé : Wi-Fi®, Bluetooth®, ZigBee®, SigFox®, LoRaWan®, protocole de téléphonie mobile (GPRS, UMTS, LTE, WiMax...)... Rien n'empêche également d'envisager un module 27 de communication infrarouge ou par voie optique. Le module 27 de communication sans fil est par exemple sous forme d'une plaque rectangulaire et s'étend avantageusement au-dessus de l'enrobage 17, c'est-à-dire parallèlement et le long d'une face libre 30 de cet enrobage 17 opposée à la face 20 de fixation. De préférence, ce module 27 de communication sans fil est porté par le port 18 de connexion et s'étend à distance de la face libre 30 de l'enrobage 17, de façon à ne pas interférer avec la déformation du capteur. Rien n'empêche cependant de placer le module 27 de communication sans fil selon une autre disposition par rapport à l'enrobage 17.  In addition, as shown in FIG. 7, the sensor may be connected in communication with a computer system 23 by a wireless communication module 27 connected to the connection port 18. This wireless communication module 27 allows remote transmission by radio frequency of the measurement signals to the computer system 23. Advantageously, the wireless communication module 27 may be a low-energy and / or long-distance transmission module. Any radio frequency transmission protocol can be envisaged: Wi-Fi®, Bluetooth®, ZigBee®, SigFox®, LoRaWan®, mobile phone protocol (GPRS, UMTS, LTE, WiMax ...) ... Nothing also prevents to consider an infrared communication module 27 or optically. The wireless communication module 27 is for example in the form of a rectangular plate and advantageously extends above the coating 17, that is to say parallel and along a free face 30 of this coating 17 opposite the fixing face 20. Preferably, this wireless communication module 27 is carried by the connection port 18 and extends away from the free face 30 of the coating 17, so as not to interfere with the deformation of the sensor. However, nothing prevents the wireless communication module 27 from being placed in another arrangement with respect to the coating 17.
Dans les modes de réalisation décrits ci-dessus, la face 20 de fixation est une face plane rectangulaire. Néanmoins, toute autre forme peut être envisagée, et par exemple une forme cylindrique concave comme représenté figure 8, ou une forme cylindrique convexe comme représenté figure 9 ou autre. In the embodiments described above, the attachment face 20 is a rectangular planar face. Nevertheless, any other form can be envisaged, and for example a concave cylindrical shape as shown in Figure 8, or a convex cylindrical shape as shown in Figure 9 or other.
Le circuit 15 électronique est formé de tout circuit adapté pour alimenter électriquement la jauge 12 de contraintes, et mesurer sa résistance. Un tel circuit est bien connu en lui-même. Il comprend donc un circuit d'alimentation formant source de tension délivrant une tension continue VCC.  The electronic circuit is formed of any suitable circuit for electrically supplying the strain gauge 12, and measuring its resistance. Such a circuit is well known in itself. It therefore comprises a voltage source supply circuit delivering a DC voltage VCC.
La jauge 12 de contraintes est représentée figure 13 sous forme d'une résistance variable reliée en série entre la masse et une résistance 35 série formant un pont diviseur alimenté par la tension VCC. La sortie de la jauge 12 de contraintes est reliée à l'entrée non inverseuse d'un amplificateur 37 opérationnel monté avec une résistance 36 de contre-réaction, et deux résistances 38, 39 parallèles d'entrée.  The strain gauge 12 is shown in FIG. 13 as a variable resistor connected in series between the ground and a series resistor forming a divider bridge fed by the voltage VCC. The output of the strain gauge 12 is connected to the non-inverting input of an operational amplifier 37 mounted with a resistor 36 for feedback, and two resistors 38, 39 parallel input.
Le signal analogique délivré par l'amplificateur 37 opérationnel est transformé en un signal numérique par un convertisseur 38 analogique/numérique alimenté par la tension VCC. De préférence, le convertisseur 38 fournit un signal de mesure selon un format compatible avec les réseaux numériques, notamment selon un format compatible avec le réseau Internet. Le signal de mesure délivré sur le port 18 de connexion par le convertisseur 38 est donc directement exploitable par tout système 23 informatique. Un tel circuit électronique peut être miniaturisé et s'étendre sur une plaque de circuit imprimé de faibles dimensions, par exemple ayant une largeur de l'ordre de 1 cm pour une longueur de l'ordre de 2 cm.  The analog signal delivered by the operational amplifier 37 is converted into a digital signal by an analog / digital converter 38 powered by the voltage VCC. Preferably, the converter 38 provides a measurement signal in a format compatible with digital networks, in particular in a format compatible with the Internet. The measurement signal delivered on the connection port 18 by the converter 38 is therefore directly usable by any computer system 23. Such an electronic circuit can be miniaturized and extend over a printed circuit board of small dimensions, for example having a width of the order of 1 cm for a length of the order of 2 cm.
Le procédé suivant peut par exemple être utilisé pour fabriquer un capteur selon l'invention. Dans une première étape, on fabrique la jauge 12 de contraintes par dépôt sur la pastille 11 de film flexible en polyimide. Dans une deuxième étape, on place le circuit 15 électronique sur la face 14 de support et on réalise la liaison électrique entre la jauge 12 de contraintes et le circuit 15 électronique avec les fils 16 de liaison. Dans une troisième étape, on place la pastille 11 de film flexible sur un mandrin présentant une forme correspondant à celle de la surface 21 de solide sur laquelle le capteur doit être fixé, sans coller la pastille 11 sur le mandrin, et de façon à déformer le film flexible selon la forme du mandrin. Dans une quatrième étape, on place un moule autour de la pastille 11 de film flexible, le port 18 de connexion passant par un évidement d'une paroi latérale de ce moule. Dans une cinquième étape, on dépose dans ce moule au-dessus de la face 14 de support une composition liquide durcissable pour former l'enrobage 17 en noyant la jauge de contraintes, les fils 16 de liaison et le circuit 15 électronique. On fait ensuite durcir cette composition pour obtenir l'enrobage 17. Les étapes de dépôt et de durcissement peuvent être réitérées si l'enrobage 17 est formé d'une pluralité de couches successives. The following method can for example be used to manufacture a sensor according to the invention. In a first step, the strain gauge 12 is produced by deposition on the wafer 11 of flexible polyimide film. In a second step, the electronic circuit is placed on the support face 14 and the electrical connection is made between the strain gauge 12 and the electronic circuit with the connecting wires 16. In a third step, the pellet 11 of flexible film is placed on a mandrel having a shape corresponding to that of the solid surface 21 on which the sensor must be fixed, without sticking the pellet 11 on the mandrel, and so as to deform the flexible film according to the shape of the mandrel. In a fourth step, a mold is placed around the pellet 11 of flexible film, the connection port 18 passing through a recess of a side wall of the mold. In a fifth step, a moldable liquid composition is deposited in this mold above the support face 14 to form the coating 17 by embedding the strain gauge, the connecting wires 16 and the electronic circuit. This composition is then cured to obtain the coating 17. The deposition and hardening steps can be repeated if the coating 17 is formed of a plurality of successive layers.
Pour fabriquer un capteur selon le troisième mode de réalisation, il suffit de maintenir en place le circuit 15 électronique à distance de la pastille l lpendant le durcissement de la deuxième couche 29 de l'enrobage 17, par exemple grâce à des plots d'écartement formés d'une matière similaire à, ou compatible avec celle de l'enrobage.  In order to manufacture a sensor according to the third embodiment, it suffices to keep the electronic circuit in place at a distance from the pellet 1 during the hardening of the second layer 29 of the coating 17, for example by means of spacing studs formed of a material similar to, or compatible with, that of the coating.
Exemple 1  Example 1
Un capteur selon le troisième mode de réalisation de l'invention a été réalisé avec les caractéristiques suivantes :  A sensor according to the third embodiment of the invention has been realized with the following characteristics:
- dimensions générales : 33 mm x 20 mm x 6 mm,  - overall dimensions: 33 mm x 20 mm x 6 mm,
- jauge de contraintes de 5 mm x 3 mm à base de fils de nanop articule s d'or déposées sur une pièce d'un film de polyimide de 33 mm x 20 mm x 6 mm, ayant un module d'élasticité de 2,5 Gpa,  strain gauge of 5 mm x 3 mm based on gold nanoparticles deposited on a piece of polyimide film 33 mm x 20 mm x 6 mm, having a modulus of elasticity of 2, 5 Gpa,
- l'enrobage comprend une première couche de résine de polyuréthane 140 recouvrant la jauge de contraintes et la pièce de film polyimide,  the coating comprises a first layer of polyurethane resin 140 covering the strain gauge and the piece of polyimide film,
- le circuit électronique est formé d'une carte de 28 mm x 14 mm x 2 mm posée à côté de la jauge de contraintes et reliée à cette dernière par des fils de liaison, mais surélevée par rapport à la couche de polyuréthane grâce à des plots de PDMS (polydiméthylsiloxane),  the electronic circuit is formed of a card of 28 mm x 14 mm x 2 mm placed next to the strain gauge and connected to the latter by connecting threads, but elevated with respect to the polyurethane layer by means of pads of PDMS (polydimethylsiloxane),
- un bloc de PDMS parallélépipédique ayant un module d'élasticité compris entre 360 kPa et 870 kPa est moulé au-dessus de la couche de polyuréthane en noyant le circuit électronique, à l'exception du port de connexion qui s'étend en saillie d'une face latérale de ce bloc. a parallelepipedal PDMS block having a modulus of elasticity of between 360 kPa and 870 kPa is molded above the polyurethane layer by drowning the electronic circuit, with the exception of the connection port which protrudes from a side face of this block.
La figure 10 représente les variations de la résistance électrique relative AR/R0 de la jauge 12 de contraintes en fonction de la déformation ε. Comme on le voit, on obtient un facteur de jauge égal à 14,34. FIG. 10 represents the variations of the relative electrical resistance AR / R 0 of the strain gauge 12 as a function of the deformation ε. As can be seen, a gage factor of 14.34 is obtained.
Exemple 2  Example 2
Le capteur de l'exemple 1 a été testé sur un banc de traction MTS Criterion® commercialisé par la société MTS Systems Corporation, Eden Prairie, USA. Un essai en flexion à trois points avec une portée de 90 mm a été réalisé à l'aide d'une éprouvette en aluminium de 140 mm x 30 mm x 5 mm portant le capteur selon l'invention et, à titre comparatif, une jauge de contraintes identique à celle du capteur selon l'invention mais « nue », c'est-à-dire sans aucun revêtement ni enrobage, reliée à un ohmmètre. Les signaux délivrés sont transmis à une carte électronique d'interfaçage avec un ordinateur.  The sensor of Example 1 was tested on a MTS Criterion® traction bench marketed by MTS Systems Corporation, Eden Prairie, USA. A three-point bending test with a span of 90 mm was carried out using a 140 mm × 30 mm × 5 mm aluminum test tube carrying the sensor according to the invention and, for comparison, a dipstick. constraints identical to that of the sensor according to the invention but "bare", that is to say without any coating or coating, connected to an ohmmeter. The signals delivered are transmitted to an electronic interface card with a computer.
Une précontrainte de 10 N a été appliquée et cinq cycles ont été réalisés successivement, avec une déformation de 0,1 % de Γ éprouvette.  A prestress of 10 N was applied and five cycles were carried out successively, with a deformation of 0.1% of Γ test piece.
Le diagramme de la figure 11 représente les signaux obtenus avec la jauge de contraintes nue de l'état de la technique. Le diagramme de la figure 12 représente les signaux obtenus avec le capteur selon l'invention. Comme on le voit, le capteur selon l'invention fournit un signal de mesure quasi identique dans son allure et dans son amplitude à celui de la jauge de contraintes conforme à l'état de la technique.  The diagram of FIG. 11 represents the signals obtained with the bare strain gauge of the state of the art. The diagram of FIG. 12 represents the signals obtained with the sensor according to the invention. As can be seen, the sensor according to the invention provides a measurement signal that is almost identical in its shape and amplitude to that of the strain gauge according to the state of the art.
Exemple 3  Example 3
La résistance au collage du capteur de l'exemple 1 a été évaluée en soumettant l'éprouvette sur laquelle le capteur est collé à une rampe de déformation de 0 à 2 %. Aucun décollement du capteur n'a été constaté.  The adhesive strength of the sensor of Example 1 was evaluated by subjecting the specimen on which the sensor is bonded to a deformation ramp of 0 to 2%. No detachment of the sensor was found.
En exerçant une flexion manuelle sur l'enrobage 17 en vue de chercher à décoller le capteur, on constate que le capteur finit par se décoller de l'éprouvette, l'enrobage 17 restant néanmoins solidaire de la pastille 11. L'invention peut faire l'objet de nombreuses variantes de réalisation et applications autres que celles décrites ci-dessus. En particulier, il va de soi que sauf indication contraire les différentes caractéristiques structurelles et fonctionnelles de chacun des modes de réalisation décrits ci-dessus ne doivent pas être considérées comme combinées et/ou étroitement et/ou inextricablement liées les unes aux autres, mais au contraire comme de simples juxtapositions. En outre, les caractéristiques structurelles et/ou fonctionnelles des différents modes de réalisation décrits ci-dessus peuvent faire l'objet en tout ou partie de toute juxtaposition différente ou de toute combinaison différente. By exerting a manual bending on the coating 17 in order to seek to take off the sensor, it is found that the sensor finally detaches from the test piece, the coating 17 nevertheless remaining integral with the pellet 11. The invention can be the subject of many alternative embodiments and applications other than those described above. In particular, it goes without saying that unless otherwise indicated the various structural and functional characteristics of each of the embodiments described above should not be considered as combined and / or closely and / or inextricably linked to each other, but to contrary as mere juxtapositions. In addition, the structural and / or functional characteristics of the various embodiments described above may be wholly or partly the subject of any different juxtaposition or any different combination.
En particulier, la jauge de contraintes peut être formée de nanoparticules déposées non pas directement sur la face 14 de support, mais au contraire sur une pastille formant substrat de plus petites dimensions que la pastille 11 rectangulaire, cette jauge de contraintes ainsi formée étant appliquée, notamment par collage, sur la face 14 de support. Rien n'empêche de prévoir un capot posé au-dessus de l'enrobage, par exemple pour protéger le module de communication sans fil. Rien n'empêche également d'encastrer le module de communication sans fil et/ou tout ou partie du circuit électronique dans un renfoncement ménagé depuis l'extérieur de l'enrobage.  In particular, the strain gauge may be formed of nanoparticles deposited not directly on the support surface 14, but on the contrary on a substrate pellet of smaller dimensions than the rectangular pellet 11, this strain gauge thus formed being applied, in particular by gluing, on the support face 14. Nothing prevents to provide a cover placed above the coating, for example to protect the wireless communication module. Nothing also prevents embedding the wireless communication module and / or all or part of the electronic circuit in a recess formed from outside the coating.

Claims

REVENDICATIONS
1/ - Capteur de déformation présentant une face libre, dite face (20) de fixation, adaptée pour pouvoir être appliquée sur une surface d'un solide dont la déformation doit être mesurée, et comprenant :  1 / - deformation sensor having a free face, said face (20) of attachment, adapted to be applied on a surface of a solid whose deformation must be measured, and comprising:
- au moins un élément (12) sensible dont une caractéristique électrique varie en fonction de sa déformation, agencé de telle sorte que ladite caractéristique électrique de l'élément sensible varie en fonction d'un état de déformation d'au moins une portion de ladite face de fixation,  at least one sensitive element whose electrical characteristic varies as a function of its deformation, arranged in such a way that said electrical characteristic of the sensitive element varies as a function of a state of deformation of at least a portion of said fixing face,
- un enrobage (17) s'étendant autour de chaque élément (12) sensible, - ladite face (20) de fixation du capteur étant entièrement constituée par une face libre d'une pièce (11) de film, cette pièce de film présentant une face, dite face (14) de support, opposée à ladite face de fixation et une épaisseur constante entre ladite face (20) de fixation et ladite face (14) de support,  a coating (17) extending around each sensitive element (12), said sensor fixing face (20) consisting entirely of a free face of a piece (11) of film, this piece of film exhibiting a face, said face (14) of support, opposite to said fixing face and a constant thickness between said face (20) of attachment and said face (14) of support,
- au moins un élément (12) sensible appliqué sur ladite face (14) de support, - ledit enrobage (17) :  at least one sensitive element (12) applied to said support face (14), said coating (17):
o étant fixé rigidement de façon inamovible à ladite face (14) de support de ladite pièce (11) de film,  o being rigidly fixed irremovably to said support face (14) of said piece (11) of film,
o s'étendant à partir de ladite face (14) de support de ladite pièce (11) de film, entièrement à l'opposé de ladite face (20) de fixation,  o extending from said support face (14) of said piece (11) of film, completely opposite said fixing face (20),
caractérisé en ce que ledit enrobage (17) s'étend à partir de ladite face (14) de support de ladite pièce (11) de film sur une épaisseur supérieure à l'épaisseur de ladite pièce (11) de film. characterized in that said coating (17) extends from said support surface (14) of said film piece (11) to a thickness greater than the thickness of said film piece (11).
21 - Capteur selon la revendication 1 caractérisé en ce que ledit enrobage (17) est formé d'au moins une couche d'au moins un matériau, chaque matériau présentant un module d'élasticité inférieur à 10 Mpa.  21 - Sensor according to claim 1 characterized in that said coating (17) is formed of at least one layer of at least one material, each material having a modulus of elasticity less than 10 MPa.
3/ - Capteur selon l'une quelconque des revendications 1 ou 2 caractérisé en ce que ledit enrobage (17) présente une surface externe périphérique libre formant une surface (31) externe périphérique libre du capteur. 4/ - Capteur selon l'une des revendications 1 à 3 caractérisé en ce qu'au moins un élément (12) sensible est formé d'une jauge de contraintes à base de nanoparticules appliquée sur ladite face (14) de support. 3 / - Sensor according to any one of claims 1 or 2 characterized in that said coating (17) has a free peripheral outer surface forming a free outer peripheral surface (31) of the sensor. 4 / - Sensor according to one of claims 1 to 3 characterized in that at least one element (12) sensitive is formed of a strain gauge based on nanoparticles applied to said face (14) of support.
5/ - Capteur selon l'une des revendications 1 à 4 caractérisé en ce que ladite pièce (11) de film présente une raideur en flexion plus faible que celle de l'enrobage.  5 / - Sensor according to one of claims 1 to 4 characterized in that said piece (11) of film has a bending stiffness lower than that of the coating.
6/ - Capteur selon l'une des revendications 1 à 5 caractérisé en ce que chaque élément (12) sensible présentant des plots (13) de connexion électrique, il comprend un circuit (15) électronique :  6 / - Sensor according to one of claims 1 to 5 characterized in that each element (12) sensitive having pads (13) for electrical connection, it comprises an electronic circuit (15):
- relié électriquement aux plots (13) de chaque élément (12) sensible,  - electrically connected to the pads (13) of each sensitive element (12),
- adapté pour mesurer ladite caractéristique électrique de chaque élément (12) sensible, et pour délivrer un signal, dit signal de mesure, représentatif de ladite caractéristique électrique de chaque élément sensible,  adapted to measure said electrical characteristic of each sensitive element (12), and to deliver a signal, said measurement signal, representative of said electrical characteristic of each sensitive element,
et en ce que ledit circuit (15) électronique est au moins pour partie inclus dans ledit enrobage (17). and in that said electronic circuit (15) is at least partly included in said coating (17).
11 - Capteur selon la revendication 6 caractérisé en ce qu'il comprend un port (18) de connexion qui s'étend à l'extérieur dudit enrobage (17) et en ce que ledit circuit (15) électronique est adapté pour délivrer ledit signal de mesure sur ce port (18) de connexion.  11 - Sensor according to claim 6 characterized in that it comprises a connection port (18) which extends outside said coating (17) and in that said electronic circuit (15) is adapted to deliver said signal measurement on this port (18) of connection.
8/ - Capteur selon la revendication 7 caractérisé en ce qu'il comprend un module (27) de communication sans fil s 'étendant à l'extérieur de l'enrobage (17) et connecté électriquement audit port (18) de connexion.  8 / - Sensor according to claim 7 characterized in that it comprises a wireless communication module (27) extending outside the coating (17) and electrically connected to said port (18) connection.
91 - Capteur selon l'une des revendications 6 à 8 caractérisé en ce que ledit circuit (15) électronique est adapté pour délivrer un signal de mesure numérique.  91 - Sensor according to one of claims 6 to 8 characterized in that said circuit (15) is adapted to deliver a digital measurement signal.
10/ - Capteur selon l'une des revendications 6 à 9 caractérisé en ce qu'au moins un élément (12) sensible est formé d'une jauge de contraintes résistive, et en ce que le dit circuit (15) électronique est adapté pour alimenter électriquement chaque jauge (12) de contraintes résistive. 11/ - Capteur selon l'une des revendications 1 à 10 caractérisé en ce que ledit enrobage (17) est formé d'au moins un matériau polymérique choisi dans le groupe des matériaux polymériques thermoplastiques, des matériaux polymériques viscoélastiques, des matériaux polymériques thermodurcissables, des élastomères, de leurs mélanges et des matériaux composites. 10 / - Sensor according to one of claims 6 to 9 characterized in that at least one sensitive element (12) is formed of a resistive strain gauge, and in that said electronic circuit (15) is adapted to electrically supplying each gauge (12) with resistive stresses. 11 / - Sensor according to one of claims 1 to 10 characterized in that said coating (17) is formed of at least one polymeric material selected from the group of thermoplastic polymeric materials, viscoelastic polymeric materials, thermosetting polymeric materials, elastomers, their blends and composite materials.
12/ - Capteur selon l'une des revendications 1 à 11 caractérisé en ce que ladite pièce (11) de film présente une épaisseur inférieure à 1 mm et en ce que ledit enrobage (17) présente une épaisseur supérieure à 2 mm.  12 / - Sensor according to one of claims 1 to 11 characterized in that said piece (11) of film has a thickness of less than 1 mm and in that said coating (17) has a thickness greater than 2 mm.
13/ - Capteur selon l'une des revendications 1 à 12 caractérisé en ce que :  13 / - Sensor according to one of claims 1 to 12 characterized in that:
- le module d'élasticité de chaque matériau constitutif dudit enrobage est supérieur à 100 kPa,  the modulus of elasticity of each material constituting said coating is greater than 100 kPa,
- ladite pièce de film est formée d'un matériau présentant un module d'élasticité supérieur à 1 Gpa.  said piece of film is formed of a material having a modulus of elasticity greater than 1 Gpa.
14/ - Procédé de mesure de la déformation d'une surface d'un solide dans lequel :  14 / - Method for measuring the deformation of a surface of a solid in which:
- on choisit un capteur de déformation selon l'une des revendications 1 à 13, a deformation sensor according to one of claims 1 to 13 is chosen,
- on fixe la face (20) de fixation du capteur sur la surface du solide. the fixing surface (20) of the sensor is fixed on the surface of the solid.
15/ - Procédé selon la revendication 14 caractérisé en ce qu'on relie le capteur à un système (23) informatique de façon à transmettre à ce système (23) informatique le signal de mesure délivré par le capteur.  15 / - Method according to claim 14 characterized in that the sensor connects to a system (23) computer so as to transmit to the system (23) computer measurement signal delivered by the sensor.
PCT/EP2018/063015 2017-05-29 2018-05-17 Integral deformation sensor and method for measuring the deformation of a surface of a solid WO2018219683A1 (en)

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FR17.54692 2017-05-29
FR1754692A FR3066814B1 (en) 2017-05-29 2017-05-29 MONOBLOC DEFORMATION SENSOR AND METHOD FOR MEASURING THE DEFORMATION OF A SURFACE OF A SOLID

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