WO2018180960A1

WO2018180960A1 - Manufacturing method for liquid crystal cell and manufacturing method for scanning antenna

Info

Publication number: WO2018180960A1
Application number: PCT/JP2018/011628
Authority: WO
Inventors: 敢三宅
Original assignee: シャープ株式会社
Priority date: 2017-03-30
Filing date: 2018-03-23
Publication date: 2018-10-04

Abstract

This manufacturing method for a liquid crystal cell C is for manufacturing a liquid crystal cell C which includes a set of a TFT substrate 101 and a slot substrate 201 that face one another with a liquid crystal layer LC sandwiched therebetween, and in which a plurality of antenna units U are arrayed. The manufacturing method for a liquid crystal cell C comprises: a first coating film formation step in which a first orientation agent is applied on a pre-TFT substrate to form a first coating film ; a second coating film formation step in which a second orientation agent is applied on a pre-slot substrate to form a second coating film; a first oriented film formation step in which the first coating film is heat-treated and a first oriented film OM1 is formed on the TFT substrate without rubbing orientation treatment or light orientation treatment; and a second oriented film formation step in which the second coating film is heat-treated and a second oriented film OM2 is formed on the pre-slot substrate without rubbing orientation treatment or light orientation treatment.

Description

Method for manufacturing liquid crystal cell and method for manufacturing scanning antenna

The present invention relates to a liquid crystal cell manufacturing method and a scanning antenna manufacturing method.

Antennas used for mobile communications and satellite broadcasting require a beam scanning function that can change the beam direction. As an antenna having such a function, a scanning antenna using a large dielectric anisotropy (birefringence) of a liquid crystal material (including a nematic liquid crystal and a polymer dispersed liquid crystal) has been proposed (for example, Patent Document 1). .

This type of scanning antenna has a liquid crystal cell with a plurality of antenna units. The liquid crystal cell includes a pair of substrates with electrodes and a liquid crystal layer disposed between the two substrates, and each antenna unit is configured by an electrode of each substrate and a liquid crystal layer between them.

The scanning antenna controls the voltage applied to the liquid crystal layer of each antenna unit, and adjusts the capacitance of each antenna unit by changing the effective dielectric constant of the liquid crystal layer of each antenna unit. And the phase difference according to the electrostatic capacitance of each antenna unit is given to the electromagnetic waves transmitted and received by the scanning antenna.

An alignment film for controlling the alignment direction of liquid crystal molecules is provided on the liquid crystal layer side of the substrate of the liquid crystal cell.

International Publication No. 2015/126550

(Problems to be solved by the invention)
Conventionally, in a liquid crystal cell for a scanning antenna, the relationship between the antenna characteristics and the alignment direction of the liquid crystal molecules by the alignment film has not been verified at all.

For example, when an alignment film that has been subjected to an alignment treatment by rubbing or light irradiation is used like an alignment film for conventional liquid crystal display applications, the liquid crystal molecules are not affected by the action of the alignment film (alignment). (Regulatory force) while being aligned in one direction within the substrate surface. FIG. 15 is an explanatory diagram showing a state in which liquid crystal molecules are aligned in one direction with respect to the substrate surface 101P by the action of an alignment film in a conventional liquid crystal cell.

Among the liquid crystal molecules arranged in a row in this way, the substrate surface 101P rises in a polar angle direction at a predetermined angle (for example, 2 to 3 °) and has a predetermined azimuth angle direction (for example, an azimuth angle of 0 °). Liquid crystal molecules lc1 (hereinafter referred to as first liquid crystal molecules lc1) oriented in the direction) and the first liquid crystal molecules lc1 in a state of being 180 ° opposite (for example, the direction having an azimuth angle of 180 °) There are liquid crystal molecules lc2 (hereinafter referred to as second liquid crystal molecules lc2) that are aligned in a state of rising by a predetermined angle.

Although liquid crystal molecules are independent of each other, it is known that the nematic phase behaves as a continuous body (continuum) as a whole. For this reason, the first liquid crystal molecule lc1 and the second liquid crystal molecule lc2 whose azimuth directions are opposite to each other as described above are inevitably required due to the demand for continuity of the liquid crystal alignment in the nematic phase. In addition, there are liquid crystal molecules lc3 (hereinafter referred to as third liquid crystal molecules lc3) in a state parallel to the substrate surface 101P. Such a third liquid crystal molecule lc3 has a polar angle (pretilt angle) of 0 °, which causes a decrease in the pretilt angle of the entire liquid crystal molecule.

If liquid crystal molecules (third liquid crystal molecule lc3) having a pretilt angle of 0 ° are present in the liquid crystal molecules constituting the liquid crystal layer, the response speed of the capacity change of the liquid crystal cell becomes slow, which is a problem. It was.

An object of the present invention is to provide a method for manufacturing a liquid crystal cell for a scanning antenna having a high response speed of capacitance change, and a method for manufacturing a scanning antenna including the liquid crystal cell.

(Means for solving the problem)
A method of manufacturing a liquid crystal cell according to the present invention is a method of manufacturing a liquid crystal cell having a pair of TFT substrates and a slot substrate facing each other with a liquid crystal layer sandwiched therebetween, wherein a plurality of antenna units are arranged. On the pre-TFT substrate having a substrate, a plurality of TFTs supported by the first dielectric substrate, and a plurality of patch electrodes electrically connected to the TFTs, a first alignment agent is applied to the first coating. A second alignment agent is formed on a preslot substrate having a first coating film forming step for forming a film, a second dielectric substrate, and a slot electrode including a plurality of slots supported by the second dielectric substrate. A second coating film forming step for forming a second coating film, and heat-treating the first coating film to form a first alignment film on the pre-TFT substrate without performing a rubbing alignment process or a photo-alignment process. A first alignment film forming step to be formed; 2 coating film to heat treatment, in the press lot substrate without being subjected to the rubbing orientation treatment or optical alignment process, and a second alignment layer formation step of forming a second alignment film.

In the method for manufacturing a liquid crystal cell, the first alignment film and the second alignment film preferably align liquid crystal molecules constituting the liquid crystal layer in all azimuth directions.

In the method for manufacturing a liquid crystal cell, the first alignment agent and the second alignment agent preferably include a polyimide resin.

Another method of manufacturing a liquid crystal cell according to the present invention is a method of manufacturing a liquid crystal cell having a pair of TFT substrates and a slot substrate facing each other with a liquid crystal layer interposed therebetween, wherein a plurality of antenna units are arranged. A first alkali diluted solution is applied on a pre-TFT substrate having one dielectric substrate, a plurality of TFTs supported by the first dielectric substrate, and a plurality of patch electrodes electrically connected to the TFTs. A first hydrophilic surface forming step for forming a first hydrophilic surface, a second dielectric substrate, and a preslot substrate having a slot electrode including a plurality of slots supported by the second dielectric substrate; And a second hydrophilic surface forming step of forming a second hydrophilic surface by applying a dilute alkali solution.

In the method for producing a liquid crystal cell, the first hydrophilic surface and the second hydrophilic surface preferably align liquid crystal molecules constituting the liquid crystal layer in all azimuth directions.

In the manufacturing method of the liquid crystal cell, in the first hydrophilic surface forming step, after the first alkali diluted solution is applied, the pre-TFT substrate is washed with water, and in the second hydrophilic surface forming step, the second hydrophilic surface forming step. It is preferable to wash the pre-slot substrate with water after applying the alkali diluted solution.

In the method for manufacturing a liquid crystal cell, in the first hydrophilic surface forming step and the second hydrophilic surface forming step, it is preferable that the first alkali diluted solution and the second alkali diluted solution are made of a sodium hydroxide aqueous solution.

Another method of manufacturing a liquid crystal cell according to the present invention is a method of manufacturing a liquid crystal cell having a pair of TFT substrates and a slot substrate facing each other with a liquid crystal layer interposed therebetween, wherein a plurality of antenna units are arranged. A bonding step in which the TFT substrate and the slot substrate are bonded to each other via a sealing material to form an empty cell in which the liquid crystal layer is not interposed between the TFT substrate and the slot substrate, and the empty cell The liquid crystal material constituting the liquid crystal layer is injected between the TFT substrate and the slot substrate by a vacuum injection method, and the liquid crystal material is fluidly aligned using the flow at the time of the injection. .

A method for manufacturing a liquid crystal cell, comprising: a pair of TFT substrates and a slot substrate facing each other with a liquid crystal layer sandwiched therebetween, wherein a plurality of antenna units are arranged, wherein the TFT substrate and the slot substrate A drawing step of drawing a sealing material in a frame shape on any one of the substrates, and a liquid crystal material constituting the liquid crystal layer by a dropping injection method on the one substrate on which the sealing material is drawn A fluid alignment step of fluidly aligning the liquid crystal material using a flow when the dropped liquid crystal material spreads on the substrate, and the one substrate and the other substrate are fluidly aligned. And a bonding step in which the liquid crystal materials are bonded to each other through the sealing material.

In the liquid crystal cell manufacturing method, in the fluid alignment step, the liquid crystal material is preferably fluidly aligned so that the liquid crystal molecules constituting the liquid crystal material are aligned in all azimuth directions.

Preferably, the liquid crystal cell manufacturing method includes a heat treatment step of heat-treating the liquid crystal layer under a temperature condition lower than a nematic-isotropic phase transition temperature of the liquid crystal material.

In the manufacturing method of the liquid crystal cell, the TFT substrate includes a first dielectric substrate, a plurality of TFTs supported by the first dielectric substrate, and a plurality of patch electrodes electrically connected to the TFTs, A first alignment film formed on the first dielectric substrate so as to cover the patch electrode, and the slot substrate includes a second dielectric substrate and a plurality of support layers supported by the second dielectric substrate. It is preferable to have a slot electrode including a slot and a second alignment film formed on the second dielectric substrate so as to cover the slot electrode.

In the method for producing a liquid crystal cell, the liquid crystal molecules constituting the liquid crystal layer are preferably of a horizontal alignment type. In the present specification, the horizontal alignment type liquid crystal molecule means a liquid crystal molecule in which the major axis direction of the liquid crystal molecule is arranged substantially parallel to the substrate surface when no voltage is applied.

Further, in the method for manufacturing a scanning antenna according to the present invention, the step of disposing a reflective conductive plate on the outer main surface of the slot substrate included in any of the liquid crystal cells according to any of the above, with a dielectric layer interposed therebetween. Is provided.

(The invention's effect)
ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the liquid crystal cell for scanning antennas with the quick response speed of a capacity | capacitance change, and the manufacturing method of the scanning antenna provided with the said liquid crystal cell can be provided.

Sectional drawing which represented a part of scanning antenna which concerns on Embodiment 1 typically A plan view schematically showing a TFT substrate provided in a scanning antenna A plan view schematically showing a slot substrate included in the scanning antenna Cross-sectional view schematically showing the antenna unit area of the TFT substrate A plan view schematically showing the antenna unit area of the TFT substrate Sectional view schematically showing the antenna unit area of the slot substrate Cross-sectional view schematically showing a TFT substrate, a liquid crystal layer, and a slot substrate constituting an antenna unit of a scanning antenna Cross-sectional view schematically showing the configuration of the liquid crystal cell Explanatory drawing which shows the orientation vector of the liquid crystal molecule which aligns with a predetermined polar angle under the action of the orientation film Explanatory drawing showing the alignment state of liquid crystal molecules subjected to the action of the alignment film An explanatory view schematically showing the direction of an electric field vector when a voltage is applied between the TFT substrate and the slot substrate. Sectional drawing which represented a part of scanning antenna concerning Embodiment 2 typically Sectional drawing which represented a part of scanning antenna which concerns on Embodiment 3 typically Explanatory diagram schematically showing how liquid crystal material is injected into an empty cell by vacuum injection In a conventional liquid crystal cell, an explanatory diagram showing a state in which liquid crystal molecules are aligned in one direction with respect to the substrate surface by the action of an alignment film

Embodiment 1
(Basic structure of scanning antenna)
The scanning antenna has a beam scanning function capable of changing the beam direction, and has a structure including a plurality of antenna units using anisotropy (birefringence) of a large dielectric constant m (εm) of a liquid crystal material. . The scanning antenna controls the voltage applied to the liquid crystal layer of each antenna unit, and changes the effective dielectric constant m (εm) of the liquid crystal layer of each antenna unit, so that a plurality of antenna units having different capacitances can be used. A two-dimensional pattern is formed. Since the dielectric constant of the liquid crystal material has frequency dispersion, in this specification, the dielectric constant in the microwave frequency band is particularly expressed as “dielectric constant m (εm)”.

A phase difference corresponding to the capacitance of each antenna unit is given to an electromagnetic wave (for example, a microwave) emitted from the scanning antenna or received by the scanning antenna, and is caused by a plurality of antenna units having different capacitances. Depending on the formed two-dimensional pattern, it has a strong directivity in a specific direction (beam scanning). For example, the electromagnetic wave emitted from the scanning antenna is obtained by integrating the spherical wave obtained as a result of the input electromagnetic wave entering each antenna unit and being scattered by each antenna unit in consideration of the phase difference given by each antenna unit. Obtained by.

Here, the basic structure of the scanning antenna according to Embodiment 1 will be described with reference to FIG. FIG. 1 is a cross-sectional view schematically showing a part of the scanning antenna 1000 according to the first embodiment. The scanning antenna 1000 of this embodiment is a radial inline slot antenna in which slots 57 are arranged concentrically. FIG. 1 schematically shows a part of a cross section along the radial direction from a feed pin 72 provided in the vicinity of the center of the concentrically arranged slots. In other embodiments, the slot arrangement may be any of various known arrangements (for example, spiral or matrix).

The scanning antenna 1000 mainly includes a TFT substrate 101, a slot substrate 201, a liquid crystal layer LC disposed therebetween, and a reflective conductive plate 65. The scanning antenna 1000 is configured to transmit and receive microwaves from the TFT substrate 101 side. The TFT substrate 101 and the slot substrate 201 are arranged to face each other with the liquid crystal layer LC interposed therebetween.

The TFT substrate 101 includes a dielectric substrate (first dielectric substrate) 1 such as a glass substrate, a plurality of patch electrodes 15 formed on the liquid crystal layer LC side of the dielectric substrate 1 and a plurality of TFTs (thin film transistors) 10. And an alignment film OM1 (first alignment film) formed on the outermost surface on the liquid crystal layer LC side. A gate bus line and a source bus line (not shown in FIG. 1) are connected to each TFT 10.

The slot substrate 201 is formed on a dielectric substrate (second dielectric substrate) 51 such as a glass substrate, a slot electrode 55 formed on the liquid crystal layer LC side of the dielectric substrate 51, and an outermost surface on the liquid crystal layer LC side. Alignment film OM2 (second alignment film). The slot electrode 55 includes a plurality of slots 57.

The

dielectric substrates

1 and 51 used for the TFT substrate 101 and the slot substrate 201 preferably have a small dielectric loss with respect to microwaves, and a plastic substrate can be used in addition to the glass substrate. The thickness of the

dielectric substrates

1 and 51 is not particularly limited, but is preferably 400 μm or less, and more preferably 300 μm or less. The lower limit of the thickness of the

dielectric substrates

1 and 51 is not particularly limited as long as it has strength that can withstand the manufacturing process.

The reflective conductive plate 65 is disposed so as to face the slot substrate 201 through the air layer 54. In other embodiments, instead of the air layer 54, a layer formed of a dielectric having a low dielectric constant m with respect to microwaves (for example, a fluororesin such as PTFE) may be used. In the scanning antenna 1000 of this embodiment, the slot electrode 55, the reflective conductive plate 65, the dielectric substrate 51 and the air layer 54 therebetween function as the waveguide 301.

The patch electrode 15, the portion of the slot electrode 55 including the slot 57 (hereinafter sometimes referred to as “slot electrode unit 57 U”), and the liquid crystal layer LC therebetween constitute an antenna unit U. In each antenna unit U, one island-like patch electrode 15 is opposed to one hole-like slot 57 (slot electrode unit 57U) via the liquid crystal layer LC, and each has a liquid crystal capacitance. Composed. In the scanning antenna 1000 of this embodiment, a plurality of antenna units U are arranged concentrically. The antenna unit U includes an auxiliary capacitor connected in parallel with the liquid crystal capacitor.

The slot electrode 55 constitutes an antenna unit U in each slot electrode unit 57U and also functions as a wall of the waveguide 301. Therefore, the slot electrode 55 is required to have a function of suppressing the transmission of microwaves, and is composed of a relatively thick metal layer. Examples of such a metal layer include a Cu layer and an Al layer. For example, in order to reduce the 10 GHz microwave to 1/150, the thickness of the Cu layer is set to 3.3 μm or more, and the thickness of the Al layer is set to 4.0 μm or more. Further, in order to reduce the 30 GHz microwave to 1/150, the thickness of the Cu layer is set to 1.9 μm or more, and the thickness of the Al layer is set to 2.3 μm or more. The upper limit of the thickness of the metal layer constituting the slot electrode 55 is not particularly limited, but considering the formation of the alignment film OM2 as described later, it can be said that the thinner is preferable. In addition, when a Cu layer is used as the metal layer, there is an advantage that it can be made thinner than the Al layer. As a method for forming the slot electrode 55, a thin film deposition method used in the technology of a conventional liquid crystal display device or other methods such as attaching a metal foil (for example, Cu foil, Al foil) on a substrate is used. May be. The thickness of the metal layer is set to, for example, 2 μm or more and 30 μm or less. Moreover, when forming a metal layer using a thin film deposition method, the thickness of a metal layer is set to 5 micrometers or less, for example. As the reflective conductive plate 65, for example, an aluminum plate or a copper plate having a thickness of several mm can be used.

Since the patch electrode 15 does not constitute the waveguide 301 unlike the slot electrode 55, the patch electrode 15 is constituted by a metal layer having a thickness smaller than that of the slot electrode 55. It is preferable that the resistance is low in order to avoid a loss that changes into heat when vibration of free electrons near the slot 57 of the slot electrode 55 induces vibration of free electrons in the patch electrode 15. From the viewpoint of mass productivity and the like, it is preferable to use an Al layer rather than a Cu layer, and the thickness of the Al layer is preferably 0.5 μm or more and 2 μm or less, for example.

The arrangement pitch of the antenna units U is set to, for example, λ / 4 or less and / or λ / 5 or less, where λ is the wavelength of the microwave. The wavelength λ is, for example, 25 mm, and the arrangement pitch in that case is set to, for example, 6.25 mm or less and / or 5 mm or less.

The scanning antenna 1000 changes the phase of the microwave excited (re-radiated) from each patch electrode 15 by changing the capacitance value of the liquid crystal capacitance of the antenna unit U. Accordingly, the liquid crystal layer LC preferably has a large anisotropy (Δεm) of dielectric constant m (εm) with respect to microwaves and a small tan δm (dielectric loss tangent with respect to microwaves).

Although the dielectric constant of the liquid crystal material generally has frequency dispersion, the dielectric anisotropy Δεm for microwaves has a positive correlation with the refractive index anisotropy Δn for visible light. Therefore, it can be said that the liquid crystal material for the antenna unit for microwaves is preferably a material having a large refractive index anisotropy Δn for visible light. Here, when Δn (birefringence index) with respect to light of 550 nm is used as an index, nematic liquid crystal having Δn of 0.3 or more, preferably 0.4 or more is used for an antenna unit for microwaves. The upper limit of Δn is not particularly limited. The thickness of the liquid crystal layer LC is set to, for example, 1 μm or more and 500 μm or less.

The details of the liquid crystal material (liquid crystal compound) constituting the liquid crystal layer LC will be described later.

FIG. 2 is a plan view schematically showing the TFT substrate 101 provided in the scanning antenna 1000, and FIG. 3 is a plan view schematically showing the slot substrate 201 provided in the scanning antenna 1000. Note that the region of the TFT substrate 101 corresponding to the antenna unit U and the region of the slot substrate 201 are both referred to as “antenna unit regions” for convenience of explanation, and the same reference numerals as those of the antenna units are used as those reference symbols. Further, as shown in FIGS. 2 and 3, in the TFT substrate 101 and the slot substrate 201, an area defined by a plurality of antenna unit areas U arranged in a two-dimensional manner is referred to as a “transmission / reception area R1”. An area other than the area R1 is referred to as a “non-transmission / reception area R2”. The non-transmission / reception region R2 is provided with a terminal portion, a drive circuit, and the like.

The transmission / reception area R1 has an annular shape when viewed in plan. The non-transmission / reception region R2 includes a first non-transmission / reception region R2a located at the center of the transmission / reception region R1 and a second non-transmission / reception region R2b arranged at the periphery of the transmission / reception region R1. The outer diameter of the transmission / reception region R1 is, for example, not less than 200 mm and not more than 1,500 mm, and is appropriately set according to the communication amount.

In the transmission / reception region R1 of the TFT substrate 101, a plurality of gate bus lines GL and a plurality of source bus lines SL supported by the dielectric substrate 1 are provided, and driving of each antenna unit region U is performed using these wirings. Is controlled. Each antenna unit region U includes a TFT 10 and a patch electrode 15 electrically connected to the TFT 10. The source electrode of the TFT 10 is electrically connected to the source bus line SL, and the gate electrode is electrically connected to the gate bus line GL. The drain electrode of the TFT 10 is electrically connected to the patch electrode 15.

A non-transmission / reception area R2 (first non-transmission / reception area R2a, second non-transmission / reception area R2b) is provided with a seal area Rs in which a seal material (not shown) is formed so as to surround the transmission / reception area R1. The sealing material has a function of adhering the TFT substrate 101 and the slot substrate 201 to each other and sealing a liquid crystal material (liquid crystal layer LC) between the

substrates

101 and 201.

In the non-transmission / reception region R2, the gate terminal portion GT, the gate driver GD, the source terminal portion ST, and the source driver SD are disposed outside the seal region R2. Each gate bus line GL is connected to the gate driver GD via the gate terminal portion GT, and each source bus line SL is connected to the source driver SD via the source terminal portion ST. In this embodiment, both the source driver SD and the gate driver GD are formed on the dielectric substrate 1 of the TFT substrate 101, but one or both of these drivers are the dielectric substrate of the slot substrate 201. 51 may be formed.

Further, a plurality of transfer terminal portions PT are provided in the non-transmission / reception region R2. The transfer terminal portion PT is electrically connected to the slot electrode 55 of the slot substrate 201. In the present embodiment, transfer terminal portions PT are disposed in both the first non-transmission / reception region R2a and the second non-transmission / reception region R2b. In other embodiments, the transfer terminal portion PT may be disposed only in one of the regions. In the present embodiment, the transfer terminal portion PT is disposed in the seal region Rs. Therefore, a conductive resin containing conductive particles (conductive beads) is used as the sealing material.

As shown in FIG. 3, in the slot substrate 201, the slot electrode 55 is formed on the dielectric substrate 51 over the transmission / reception region R1 and the non-transmission / reception region R2. 3 shows the surface of the slot substrate 201 viewed from the liquid crystal layer LC side, and the alignment film OM2 formed on the outermost surface is removed for convenience of explanation.

In the transmission / reception region R1 of the slot substrate 201, the slot electrode 55 is provided with a plurality of slots 57. One of these slots 57 is assigned to each antenna unit region U of the TFT substrate 101. In the present embodiment, the plurality of slots 57 are concentrically arranged with a pair of slots 57 extending in directions substantially orthogonal to each other so as to constitute a radial inline slot antenna. Since it has such a pair of slots 57, the scanning antenna 1000 can transmit and receive circularly polarized waves.

In the non-transmission / reception region R2 of the slot substrate 201, a plurality of terminal portions IT of the slot electrodes 55 are provided. The terminal part IT is electrically connected to the transfer terminal part PT of the TFT substrate 101. In the present embodiment, the terminal portion IT is disposed in the seal region Rs, and as described above, the transfer terminal portion corresponding to the seal portion made of the conductive resin including the conductive particles (conductive beads). It is electrically connected to PT.

Further, the first non-transmission / reception region R2a is provided with a power supply pin 72 so as to be arranged at the center of a concentric circle formed by the slot 57. Microwaves are supplied to the waveguide 301 constituted by the slot electrode 55, the reflective conductive plate 65 and the dielectric substrate 51 by the power supply pin 72. The power supply pin 72 is connected to the power supply device 70. Note that the power feeding method may be either a direct power feeding method or an electromagnetic coupling method, and a known power feeding structure may be employed.

Hereinafter, the TFT substrate 101, the slot substrate 201, and the waveguide 301 will be described in detail.

(Structure of TFT substrate 101)
4 is a cross-sectional view schematically showing the antenna unit region U of the TFT substrate 101, and FIG. 5 is a plan view schematically showing the antenna unit region U of the TFT substrate 101. As shown in FIG. 4 and 5 each show a partial cross-sectional configuration of the transmission / reception region R1.

Each antenna unit region U of the TFT substrate 101 includes a dielectric substrate (first dielectric substrate) 1, a TFT 10 supported on the dielectric substrate 1, a first insulating layer 11 covering the TFT 10, and a first insulating layer. 11, a patch electrode 15 that is electrically connected to the TFT 10, a second insulating layer 17 that covers the patch electrode 15, and an alignment film OM <b> 1 that covers the second insulating layer 17.

The TFT 10 includes a gate electrode 3, an island-shaped semiconductor layer 5, a gate insulating layer 4 disposed between the gate electrode 3 and the semiconductor layer 5, a source electrode 7S, and a drain electrode 7D. The TFT 10 of this embodiment is a channel etch type having a bottom gate structure. In other embodiments, TFTs having other structures may be used.

The gate electrode 3 is electrically connected to the gate bus line GL, and a scanning signal is supplied from the gate bus line GL. The source electrode 7S is electrically connected to the source bus line SL, and data signals are supplied from the source bus line SL. The gate electrode 3 and the gate bus line GL may be formed from the same conductive film (gate conductive film). Further, the source electrode 7S, the drain electrode 7D, and the source bus line SL may be formed from the same conductive film (source conductive film). The gate conductive film and the source conductive film are made of, for example, a metal film. Note that a layer formed using the gate conductive film may be referred to as a “gate metal layer”, and a layer formed using the source conductive film may be referred to as a “source metal layer”.

The semiconductor layer 5 is disposed so as to overlap the gate electrode 3 with the gate insulating layer 4 interposed therebetween. As shown in FIG. 5, the source contact layer 6 </ b> S and the drain contact layer 6 </ b> D are formed on the semiconductor layer 5. The source contact layer 6S and the drain contact layer 6D are respectively arranged so as to face both sides of a region (channel region) where a channel is formed in the semiconductor layer 5. In the case of this embodiment, the semiconductor layer 5 is a substantial amorphous silicon (ia-Si) layer, and the source contact layer 6S and the drain contact layer 6D are composed of an n ⁺ type amorphous silicon (n ⁺ -a-Si) layer. In other embodiments, the semiconductor layer 5 may be composed of a polysilicon layer, an oxide semiconductor layer, or the like.

The source electrode 7S is provided in contact with the source contact layer 6S, and is connected to the semiconductor layer 5 through the source contact layer 6S. The drain electrode 7D is provided so as to be in contact with the drain contact layer 6D, and is connected to the semiconductor layer 5 through the drain contact layer 6D.

The first insulating layer 11 includes a contact hole CH1 reaching the drain electrode 7D of the TFT 10.

The patch electrode 15 is provided on the first insulating layer 11 and in the contact hole CH1, and is in contact with the drain electrode 7D in the contact hole CH1. The patch electrode 15 is mainly composed of a metal layer. Note that the patch electrode 15 may be a metal electrode formed of only a metal layer. The material of the patch electrode 15 may be the same as that of the source electrode 7S and the drain electrode 7D. The thickness of the metal layer in the patch electrode 15 (in the case where the patch electrode 15 is a metal electrode, the thickness of the patch electrode 15) may be the same as the thickness of the source electrode 7S and the drain electrode 7D, but it is larger. Is preferred. When the thickness of the patch electrode 15 is large, the transmittance of the electromagnetic wave is kept low, the sheet resistance of the patch electrode is reduced, and the loss that the vibration of free electrons in the patch electrode changes into heat is reduced.

Further, the CS bus line CL may be provided using the same conductive film as the gate bus line GL. The CS bus line CL may be disposed so as to overlap the drain electrode 7D (or an extension of the drain electrode 7D) with the gate insulating layer 4 interposed therebetween, and configure the auxiliary capacitor CS using the gate insulating layer 4 as a dielectric layer. Good.

In this embodiment, the patch electrode 15 is formed in a layer different from the source metal layer. For this reason, the thickness of the source metal layer and the thickness of the patch electrode 15 can be controlled independently of each other.

The patch electrode 15 may include a Cu layer or an Al layer as a main layer. The performance of the scanning antenna correlates with the electric resistance of the patch electrode 15, and the thickness of the main layer is set so as to obtain a desired resistance. It is preferable that the patch electrode 15 has a low resistance so as not to inhibit the vibration of electrons. The thickness of the metal layer in the patch electrode 15 is set to 0.5 μm or more, for example, when formed with an Al layer.

The alignment film OM1 is made of, for example, a polyimide resin. Details of the alignment film OM1 will be described later.

The TFT substrate 101 is manufactured, for example, by the method shown below. First, a dielectric substrate (first dielectric substrate) 1 is prepared. As the derivative substrate 1, for example, a glass substrate, a heat-resistant plastic substrate, or the like can be used. A gate metal layer including the gate electrode 3 and the gate bus line GL is formed on the dielectric substrate 1.

The gate electrode 3 can be formed integrally with the gate bus line GL. Here, a gate conductive film (thickness: for example, 50 nm to 500 nm) is formed on the dielectric substrate 1 by sputtering or the like. Next, the gate electrode 3 and the gate bus line GL are formed by patterning the gate conductive film. The material of the gate conductive film is not particularly limited. For example, aluminum (Al), tungsten (W), molybdenum (Mo), tantalum (Ta), chromium (Cr), titanium (Ti), copper (Cu), etc. A film containing a metal, an alloy thereof, or a metal nitride thereof can be used as appropriate. Here, a laminated film in which MoN (thickness: for example, 50 nm), Al (thickness: for example, 200 nm), and MoN (thickness: for example, 50 nm) are laminated in this order is formed as the gate conductive film.

Next, the gate insulating layer 4 is formed so as to cover the gate metal layer. The gate insulating layer 4 can be formed by a CVD method or the like. As the gate insulating layer 4, a silicon oxide (SiO ₂ ) layer, a silicon nitride (SiNx) layer, a silicon oxynitride (SiOxNy; x> y) layer, a silicon nitride oxide (SiNxOy; x> y) layer, or the like is appropriately used. Can do. The gate insulating layer 4 may have a stacked structure. Here, a SiNx layer (thickness: 410 nm, for example) is formed as the gate insulating layer 4.

Next, the semiconductor layer 5 and the contact layer are formed on the gate insulating layer 4. Here, an intrinsic amorphous silicon film (thickness: 125 nm, for example) and an n ⁺ -type amorphous silicon film (thickness: 65 nm, for example) are formed in this order and patterned to obtain the island-shaped semiconductor layer 5 and the contact layer. The semiconductor film used for the semiconductor layer 5 is not limited to an amorphous silicon film. For example, an oxide semiconductor layer may be formed as the semiconductor layer 5. In this case, a contact layer may not be provided between the semiconductor layer 5 and the source / drain electrodes.

Next, a conductive film for source (thickness: for example, 50 nm or more and 500 nm or less) is formed on the gate insulating layer 4 and the contact layer, and is patterned to include the source electrode 7S, the drain electrode 7D, and the source bus line SL. A source metal layer is formed. At this time, the contact layer is also etched to form the source contact layer 6S and the drain contact layer 6D which are separated from each other.

The material of the source conductive film is not particularly limited, and examples thereof include aluminum (Al), tungsten (W), molybdenum (Mo), tantalum (Ta), chromium (Cr), titanium (Ti), and copper (Cu). A film containing a metal, an alloy thereof, or a metal nitride thereof can be used as appropriate. Here, a laminated film in which MoN (thickness: for example 30 nm), Al (thickness: for example 200 nm), and MoN (thickness: for example 50 nm) are laminated in this order is formed as the source conductive film.

Here, for example, the source conductive film is formed by sputtering, and the source conductive film is patterned (source / drain separation) by wet etching. Thereafter, by dry etching, for example, a portion of the contact layer located on the region to be the channel region of the semiconductor layer 5 is removed to form a gap portion, which is separated into the source contact layer 6S and the drain contact layer 6D. . At this time, the vicinity of the surface of the semiconductor layer 5 is also etched in the gap portion (overetching).

Next, the first insulating layer 11 is formed so as to cover the TFT 10. In this example, the first insulating layer 11 is disposed in contact with the channel region of the semiconductor layer 5. Further, a contact hole CH1 reaching the drain electrode 7D is formed in the first insulating layer 11 by a known photolithography technique.

The first insulating layer 11 is an inorganic material such as a silicon oxide (SiO ₂ ) film, a silicon nitride (SiNx) film, a silicon oxynitride (SiOxNy; x> y) film, or a silicon nitride oxide (SiNxOy; x> y) film. An insulating layer may be used. Here, as the first insulating layer 11, a SiNx layer having a thickness of, for example, 330 nm is formed by, eg, CVD.

Next, a conductive film for patch is formed on the first insulating layer 11 and in the contact hole CH1, and this is patterned. Thereby, the patch electrode 15 is formed in the transmission / reception region R1. In the non-transmission / reception region R2, a patch connection portion made of the same conductive film (patch conductive film) as the patch electrode 15 is formed. The patch electrode 15 is in contact with the drain electrode 7D in the contact hole CH1.

As the material for the conductive film for patch, the same material as the conductive film for gate or the conductive film for source can be used. However, the patch conductive film is preferably set to be thicker than the gate conductive film and the source conductive film. A suitable thickness of the patch conductive film is, for example, not less than 1 μm and not more than 30 μm. If it is thinner than this, the electromagnetic wave transmittance will be about 30%, the sheet resistance will be 0.03 Ω / sq or more, which may cause a problem of increased loss, and if it is thicker, the patterning property of the slot 57 will deteriorate. May arise.

Here, a laminated film (MoN / Al / MoN) in which MoN (thickness: for example, 50 nm), Al (thickness: for example, 1000 nm) and MoN (thickness: for example, 50 nm) are laminated in this order is formed as the patch conductive film. .

Next, a second insulating layer (thickness: 100 nm or more and 300 nm or less) 17 is formed on the patch electrode 15 and the first insulating layer 11. The second insulating layer 17 is not particularly limited, and for example, a silicon oxide (SiO ₂ ) film, a silicon nitride (SiNx) film, a silicon oxynitride (SiOxNy; x> y) film, a silicon nitride oxide (SiNxOy; x> y) ) A film or the like can be used as appropriate. Here, as the second insulating layer 17, for example, a SiNx layer having a thickness of 200 nm is formed.

Thereafter, the inorganic insulating film (the second insulating layer 17, the first insulating layer 11, and the gate insulating layer 4) is collectively etched by, for example, dry etching using a fluorine-based gas. In the etching, the patch electrode 15, the source bus line SL, and the gate bus line GL function as an etch stop. As a result, a second contact hole reaching the gate bus line GL is formed in the second insulating layer 17, the first insulating layer 11, and the gate insulating layer 4, and the source bus is formed in the second insulating layer 17 and the first insulating layer 11. A third contact hole reaching the line SL is formed. In addition, a fourth contact hole reaching the above-described patch connection portion is formed in the second insulating layer 17.

Next, a conductive film (thickness: 50 nm or more and 200 nm or less) is formed by sputtering, for example, on the second insulating layer 17 and in the second contact hole, the third contact hole, and the fourth contact hole. As the conductive film, for example, a transparent conductive film such as an ITO (indium tin oxide) film, an IZO film, or a ZnO film (zinc oxide film) can be used. Here, an ITO film having a thickness of, for example, 100 nm is used as the conductive film.

Next, by patterning the transparent conductive film, an upper connection part for a gate terminal, an upper connection part for a source terminal, and an upper connection part for a transfer terminal are formed. The upper connection part for gate terminals, the upper connection part for source terminals, and the upper connection part for transfer terminals are used to protect the electrode or wiring exposed at each terminal part. Thus, the gate terminal part GT, the source terminal part ST, and the transfer terminal part PT are obtained.

Next, a coating film (first coating film) is formed using a later-described alignment agent (first alignment agent) so as to cover the second insulating film 17 and the like (a first coating film forming process described later), and then The alignment film (first alignment film) OM1 is formed by heating the coating film to remove the solvent and the like (first alignment film forming step described later). In this way, the TFT substrate 101 can be manufactured. In this specification, the substrate before the alignment film OM1 is formed (that is, the substrate in which the alignment film OM1 is removed from the TFT substrate 101) is referred to as a “pre-TFT substrate”.

As will be described later, the alignment film OM1 is not subjected to alignment treatment such as rubbing treatment or photo-alignment treatment. Details of the method of forming the alignment film OM1 will be described later.

(Structure of slot substrate 201)
Next, the structure of the slot substrate 201 will be described more specifically. FIG. 6 is a cross-sectional view schematically showing the antenna unit region U of the slot substrate 201.

The slot substrate 201 is mainly formed on a dielectric substrate (second dielectric substrate) 51 and one plate surface of the dielectric substrate 51 (a plate surface facing the liquid crystal layer side, a plate surface facing the TFT substrate 101 side) 51a. The formed slot electrode 55, a third insulating layer 58 that covers the slot electrode 55, and an alignment film OM2 that covers the third insulating layer 58 are provided.

A plurality of slots 57 are formed in the slot electrode 55 in the transmission / reception region R1 of the slot substrate 201 (see FIG. 3). The slot 57 is an opening (groove) that penetrates the slot electrode 55. In this example, one slot 57 is assigned to each antenna unit area U.

The slot electrode 55 includes a main layer 55M such as a Cu layer or an Al layer. The slot electrode 55 may have a stacked structure including a main layer 55M and an upper layer 55U and a lower layer 55L arranged so as to sandwich the main layer 55M. The thickness of the main layer 55M is set in consideration of the skin effect depending on the material, and may be, for example, 2 μm or more and 30 μm or less. The thickness of the main layer 55M is typically set larger than the thickness of the upper layer 55U and the lower layer 55L.

In this example, the main layer 55M is made of a Cu layer, and the upper layer 55U and the lower layer 55L are made of a Ti layer. By disposing the lower layer 55L between the main layer 55M and the dielectric substrate 51, the adhesion between the slot electrode 55 and the dielectric substrate 51 can be improved. Moreover, by providing the upper layer 55U, corrosion of the main layer 55M (for example, Cu layer) can be suppressed.

The third insulating layer 58 is formed on the slot electrode 55 and in the slot 57. The material of the third insulating layer 52 is not particularly limited. For example, a silicon oxide (SiO ₂ ) film, a silicon nitride (SiNx) film, a silicon oxynitride (SiOxNy; x> y) film, a silicon nitride oxide (SiNxOy; x> y) A film or the like is appropriately used.

The alignment film OM2 is made of a polyimide resin like the alignment film OM1 of the TFT substrate 101. Details of the alignment film OM2 will be described later.

Note that a terminal part IT is provided in the non-transmission / reception region R2 of the slot substrate 201 (see FIG. 3). The terminal portion IT includes a part of the slot electrode 55, a third insulating layer 58 that covers a part of the slot electrode 55, and an upper connection part. The third insulating layer 58 has an opening (contact hole) reaching a part of the slot electrode 55. The upper connecting portion is in contact with a part of the slot electrode 55 in the opening. In the present embodiment, the terminal portion IT is made of a conductive layer such as an ITO film or an IZO film, and is disposed in the seal region Rs, and is made of a seal resin containing conductive particles (for example, conductive beads such as Au beads). It is connected to the transfer terminal portion PT in the TFT substrate 101.

The slot substrate 201 is manufactured, for example, by the method shown below. First, the dielectric substrate 51 is prepared. As the dielectric substrate 51, a glass substrate, a resin substrate or the like having a high transmittance with respect to electromagnetic waves (low dielectric constant and dielectric loss) can be used. The dielectric substrate 51 is preferably thin in order to suppress attenuation of electromagnetic waves. For example, after forming components such as the slot electrode 55 on the surface of the glass substrate by a process described later, the glass substrate may be thinned from the back side. Thereby, the thickness of a glass substrate can be set to 500 micrometers or less, for example. In general, resin has smaller dielectric constant and dielectric loss than glass. When the dielectric substrate 51 is made of a resin substrate, the thickness is, for example, 3 μm or more and 300 μm or less. As a material for the resin base material, polyimide or the like is used.

A slot electrode 55 having a plurality of slots 57 is obtained by forming a metal film on the dielectric substrate 51 and patterning the metal film. As the metal film, a Cu film (or Al film) having a thickness of 2 μm or more and 5 μm or less may be used. Here, a laminated film in which a Ti film, a Cu film, and a Ti film are laminated in this order is used.

Next, a third insulating layer (thickness: for example, not less than 100 nm and not more than 200 nm) 58 is formed on the slot electrode 55 and in the slot 57. Here, the third insulating layer 52 is made of a silicon oxide (SiO ₂ ) film.

Thereafter, an opening (contact hole) reaching a part of the slot electrode 55 is formed in the third insulating layer 58 in the non-transmission / reception region R2.

Next, a transparent conductive film is formed on the third insulating layer 58 and in the opening of the third insulating layer 58, and is patterned to form an upper connection portion in contact with a part of the slot electrode 55 in the opening. As a result, a terminal portion IT for connecting to the transfer terminal portion PT of the TFT substrate 101 is obtained.

Thereafter, a coating film (second coating film) is formed using an alignment agent (second alignment agent) described later so as to cover the third insulating layer 58, and then the coating film is heated to remove the solvent, etc. By performing (the 2nd coating-film formation process mentioned later), alignment film (2nd alignment film) OM2 is formed. In this way, the slot substrate 201 can be manufactured. In the present specification, a substrate in a state before the alignment film OM2 is formed (that is, a substrate in which the alignment film OM2 is removed from the slot substrate 201) is referred to as a “pre-slot substrate”.

As will be described later, the alignment film OM2 is not subjected to an alignment process such as a rubbing process or a photo-alignment process, like the alignment film OM1. Details of the method of forming the alignment film OM2 will be described later.

(Configuration of Waveguide 301)
The waveguide 301 is configured such that the reflective conductive plate 65 faces the slot electrode 55 with the dielectric substrate 51 interposed therebetween. The reflective conductive plate 65 is disposed so as to face the back surface (outer main surface) of the slot substrate 201 (dielectric substrate 51) with the air layer 54 interposed therebetween. Since the reflective conductive plate 65 constitutes the wall of the waveguide 301, the reflective conductive plate 65 preferably has a thickness of 3 times or more, preferably 5 times or more of the skin depth. As the reflective conductive plate 65, for example, an aluminum plate, a copper plate, or the like that is manufactured by cutting and has a thickness of several millimeters can be used.

For example, when the scanning antenna 1000 transmits, the waveguide 301 spreads the microwaves supplied from the feed pins 72 arranged at the centers of the plurality of antenna units U arranged concentrically radially outward. Lead. When the microwave moves through the waveguide 301, it is cut off at each slot 57 of each antenna unit U, so that an electric field is generated according to the principle of the so-called slot antenna, and an electric charge is induced in the slot electrode 55 by the action of the electric field. (That is, the microwave is converted into vibration of free electrons in the slot electrode 55). In each antenna unit U, the phase of free electron vibration induced in the patch electrode 15 is controlled by changing the capacitance value of the liquid crystal capacitance through the alignment control of the liquid crystal. When an electric charge is induced in the patch electrode 15, an electric field is generated (that is, the vibration of free electrons in the slot electrode 55 moves to the vibration of free electrons in the patch electrode 15), and the patch electrode 15 of each antenna unit U. A microwave (radio wave) is oscillated from the outside toward the outside of the TFT substrate 101. The azimuth angle of the beam is controlled by adding the microwaves (radio waves) having different phases oscillated from the respective antenna units U.

In other embodiments, the waveguide may have a two-layer structure in which the waveguide is divided into an upper layer and a lower layer. In this case, the microwaves supplied from the power supply pins first move so as to spread radially from the center toward the outside, and then rise to the upper layer at the outer wall portion of the lower layer and gather the upper layer from the outside to the center. Move to. By adopting such a two-layer structure, it becomes easy to spread the microwaves uniformly to each antenna unit U.

FIG. 7 is a cross-sectional view schematically showing the TFT substrate 101, the liquid crystal layer LC, and the slot substrate 201 constituting the antenna unit U of the scanning antenna 1000. As shown in FIG. 7, in the antenna unit U, the island-shaped patch electrode 15 of the TFT substrate 101 and the hole-shaped (groove-shaped) slot 57 (slot electrode unit 57U) included in the slot electrode 55 of the slot substrate 201 Are opposed to each other with the liquid crystal layer LC interposed therebetween. Such a scanning antenna 1000 includes a liquid crystal layer LC and a pair of TFT substrates 101 and slot substrates 201 including alignment films OM1 and OM2 on the surface of each liquid crystal layer LC with the liquid crystal layer LC interposed therebetween. A liquid crystal cell C is provided. In the present specification, the antenna unit U includes one patch electrode 15 and a slot electrode 55 (slot electrode unit 57U) in which at least one slot 57 corresponding to the patch electrode 15 is disposed. .

FIG. 8 is a cross-sectional view schematically showing the configuration of the liquid crystal cell C. A sealing material S is disposed between the TFT substrate 101 as a pair of substrates constituting the liquid crystal cell C and the slot substrate 201 so as to surround the liquid crystal layer LC. The sealing material S has a function of bonding the TFT substrate 101 and the slot substrate 201 to each other and bonding the TFT substrate 101 and the slot substrate 201 to each other. Note that the TFT substrate 101 and the slot substrate 201 form a pair of substrates facing each other with the liquid crystal layer LC interposed therebetween.

The sealing material S is made of a cured product of a sealing material composition containing a curable resin. As the sealing material composition, a solventless type is basically used. As the curable resin, a resin having photocurability that is cured by light (for example, ultraviolet light, visible light, and the like) and / or thermosetting that is cured by heat is used. The kind of the sealing material S is appropriately selected according to the injection method of the liquid crystal material. For example, when the liquid crystal material is injected into the liquid crystal cell C by the drop injection method (ODF method), as the curable resin, the curing is easily controlled in two stages of temporary curing and main curing. A curable resin having photocurability (for example, visible light curability) and thermosetting is used. Examples of such a curable resin include those made of a mixture of an epoxy resin and an acrylic resin (trade name “UVAC 1561” (manufactured by Daicel UCB)). When the liquid crystal material is injected into the liquid crystal cell C by a vacuum injection method, a photocurable resin or a thermosetting resin is used as the curable resin.

(Liquid Crystal Layer LC (Liquid Crystal Compound))
As the liquid crystal material (liquid crystal compound) constituting the liquid crystal layer LC, a liquid crystal compound having a large dielectric anisotropy (Δε) is used. For example, a liquid crystal compound having a dielectric anisotropy (Δε) of 10 or more (1 kHz, 20 ° C.) is used. Specific examples of highly polar liquid crystal compounds that can be used in the liquid crystal cell C for a scanning antenna include the following chemical formulas (1-1) to (1-4) having an NCS group (isothiocyanate group) at the terminal. The liquid crystal compound shown by these is mentioned.

In the above chemical formulas (1-1) to (1-4), R ¹ , R ² , R ³ and R ⁴ are all linear alkyl groups having 2 to 5 carbon atoms (for example, an ethyl group ( C ₂ H ₅ ), a propyl group (C ₃ H ₇ ), a butyl group (C ₄ H ₉ ), and a pentyl group (C ₅ H ₁₁ )). In the above chemical formulas (1-1) to (1-4), X ¹ , X ² , X ³ , X ⁴ , X ⁵ , X ⁶ , X ⁷ , X ⁸ , X ⁹ , X ¹⁰ , X ¹¹ , X ¹² , X ¹³ , X ¹⁴ and X ¹⁵ are independent of each other, and they are any of H (hydrogen atom), F (fluorine atom), CH ₃ (methyl group) and Cl (chloro group). It is.

For example, a liquid crystal composition having a dielectric anisotropy (Δε) of 10 or more can be obtained by appropriately combining the liquid crystal compounds represented by the chemical formulas (1-1) to (1-4). The liquid crystal compound having high polarity as described above is suitable for, for example, a scanning antenna and a liquid crystal lens described later.

(Alignment film OM (OM1, OM2))
Examples of the alignment films OM1 and OM2 (sometimes collectively referred to as “alignment film OM”) used for the TFT substrate 101 and the slot substrate 201 of the present embodiment are represented by the following chemical formula (2). What imidized the polyamic acid suitably is mentioned. Note that the alignment film OM of the present embodiment is not subjected to alignment treatment by rubbing or light irradiation. In this specification, the alignment film OM included in the TFT substrate 101 is referred to as a first alignment film OM1, and the alignment film OM included in the slot substrate 201 is referred to as a second alignment film OM2.

In the above chemical formula (2), p is an arbitrary natural number. In the chemical formula (2), X has a structure represented by the following chemical formula (3-1) to chemical formula (3-16).

In the chemical formula (2), Y has a structure represented by the following chemical formula (4-1) to chemical formula (4-24).

In the chemical formula (2), Z represents a side chain. The structure of Z is not particularly limited as long as the object of the present invention is not impaired. Z may not be present. In the chemical formula (2), when Z is absent, the bonding groups of the chemical formula (4-1) to the chemical formula (4-24) may be at any two positions.

The imidization of the polyamic acid represented by the chemical formula (2) is performed by, for example, heat-treating the polyamic acid at a high temperature (for example, 200 to 250 ° C.). Further, for example, a chemical imidation method using acetic anhydride or the like as a dehydrating agent and using pyridine or the like as a catalyst may be used.

The imidation ratio of the polyimide resin constituting the alignment film OM is not particularly limited as long as the object of the present invention is not impaired, and is preferably 40% or more and 95% or less, for example.

The alignment film OM is a horizontal alignment type alignment film in which the alignment direction is substantially horizontal with respect to the substrate surface. The pretilt angle of the liquid crystal molecules is controlled in the range of 1 ° to 20 ° (preferably 1 ° to 10 °). The pretilt angle is preferably 1 ° to 20 ° from the viewpoint of response speed, and 1 ° to 10 ° is particularly preferable in order to increase the capacity modulation.

The polymerization method of the polyamic acid is not particularly limited, and a known method can be used. The polyamic acid is appropriately dissolved in an organic solvent and prepared as a liquid or sol composition (alignment agent) having fluidity.

(Method for forming alignment film)
When forming the alignment film OM, first, an alignment agent having fluidity in an uncured state containing the polyamic acid represented by the chemical formula (2) is applied onto the surfaces of the pre-TFT substrate and the pre-slot substrate. It is applied using a machine (first coating film forming step and second coating film forming step). The coating method is not particularly limited, and for example, a spin coater or the like is used. In this specification, the alignment agent applied on the pre-TFT substrate to form the first alignment film OM1 is referred to as a first alignment agent, and the pre-slot is used to form the second alignment film OM2. The alignment agent applied on the substrate is referred to as a second alignment agent.

The coating film made of the coating material on each substrate is first calcined (for example, heat treatment at 80 ° C. for 2 minutes) for the purpose of removing the organic solvent, and then for the purpose of imidation of polyamic acid and the like. Main baking (for example, heat treatment at 210 ° C. for 10 minutes) is performed. In this specification, the coating film made of the first alignment agent formed on the pre-TFT substrate is referred to as a first coating film, and the coating film made of the second alignment agent formed on the pre-slot substrate is the second coating film. It is called a coating film. When such a heat treatment is applied to the coating films (first coating film, second coating film), alignment films OM (first alignment film OM1, second alignment film OM2) are obtained. The heating time and heating temperature in the pre-baking and main baking are appropriately set according to the purpose.

The thickness of the alignment film OM is not particularly limited as long as the object of the present invention is not impaired, but is preferably 10 nm to 300 nm, for example.

In addition, as a material constituting the alignment film OM, other materials such as polyamic acid other than the polyamic acid represented by the above chemical formula (2) and acrylic polymer may be used as long as the object of the present invention is not impaired. .

(Alignment characteristics of alignment film OM)
The alignment film OM of this embodiment is not subjected to alignment treatment by rubbing or light irradiation. In such an alignment film OM, in a state where no voltage is applied between the

substrates

101 and 201, the liquid crystal molecules rise from the substrate surface in a polar angle direction at a predetermined angle (for example, 1 to 10 °), and all of the alignment films OM It acts to be oriented in the azimuth direction.

FIG. 9 is an explanatory diagram showing an alignment vector n of liquid crystal molecules aligned at a predetermined polar angle θ under the action of the alignment film OM. Note that the alignment vector n shown in FIG. 9 is that of an arbitrary liquid crystal molecule constituting the liquid crystal layer LC. In FIG. 9, the X-axis and Y-axis of the orthogonal coordinate axes are arranged in the plane (substrate surface) of the alignment film OM, and the Z-axis is arranged vertically above the alignment film OM.

The polar angle θ of the orientation vector n is an angle formed by the orientation vector n and the xy plane, and means the pretilt angle of the liquid crystal molecules. The azimuth angle Φ of the orientation vector n is an angle formed between the orientation vector n projected in the xy plane and the x axis.

The liquid crystal molecules are inclined at a predetermined polar angle θ so as to rise slightly from the alignment film OM under the action of the alignment film OM.

The polar angle θ (pretilt angle) of the liquid crystal molecules is mainly determined by the interaction between the liquid crystal molecules and the alignment film OM. In the present embodiment, the polar angle θ (pretilt angle) of the liquid crystal molecules is set in the range of 1 ° to 10 °. The polar angle θ of the liquid crystal molecules can be adjusted by appropriately setting the structure of the liquid crystal molecules, the structure of the alignment film, the thickness of the alignment film, and the like.

Also, liquid crystal molecules are not constrained in all azimuth directions. Therefore, the azimuth angle Φ of the liquid crystal molecules can take any value (angle) as long as it is in the range of 0 ° to 360 ° (0 ° ≦ Φ <360 °). Therefore, the entire liquid crystal molecules are aligned in all azimuth directions with a predetermined pretilt angle in the direction of the polar angle θ.

Ideally, the orientation distribution in the azimuth direction is uniformly present in the range of 0 ° to 360 ° (0 ° ≦ Φ <360 °) for the entire liquid crystal molecule. Note that some liquid crystal molecules may be unintentionally aligned in a predetermined azimuth direction due to the effect of the step on the substrate surface, electrode shape, etc. Strictly speaking, the alignment of the entire liquid crystal molecules in the azimuth direction The distribution may not be uniform in the range of 0 ° to 360 ° (0 ° ≦ Φ <360 °). However, if the alignment film OM is not subjected to an alignment process (rubbing process, photo-alignment process, etc.), the alignment film OM is generally uniformly aligned in all azimuth directions with respect to the entire liquid crystal molecules. Will act as follows.

As described above, the alignment film OM of the present embodiment has a liquid crystal alignment force for aligning liquid crystal molecules in all azimuth directions at a predetermined pretilt angle, and is obtained by an alignment process such as rubbing or light irradiation. This is significantly different from the uniaxial orientation. Further, the liquid crystal alignment force of the alignment film OM is greatly different from the conventional multi-domain alignment having only a specific alignment direction achieved by the photo alignment.

FIG. 10 is an explanatory diagram showing the alignment state of the liquid crystal molecules lc4, lc5, and lc6 subjected to the action of the alignment film OM. Each of the liquid crystal molecules lc4, lc5, and lc6 in FIG. 10 is aligned in directions of different azimuth angles in the presence of a predetermined pretilt angle in response to the action from the alignment film OM. In FIG. 10, the liquid crystal molecules lc4 and the liquid crystal molecules lc5 are shown to be aligned in directions different from each other in azimuth angle by 180 ° for convenience of explanation. Since the liquid crystal molecules lc4, lc5, and lc6 are not constrained in all azimuth directions, the liquid crystal molecules lc6 between the liquid crystal molecules lc4 and lc5 are degenerate in energy due to the demand for continuity of liquid crystal alignment. It is possible to take a state that is. Therefore, in this embodiment, the occurrence of liquid crystal molecules having the pretilt angle of 0 ° (the third liquid crystal molecule) is suppressed, the average pretilt angle of the entire liquid crystal molecules is increased, and the response speed of capacitance modulation is high. Become.

(Alignment distribution of liquid crystal molecules)
In this specification, in the range of 100 μm × 100 μm of the antenna unit U (square range), if the orientation degree A of the liquid crystal molecules is in the range of 1 to 10, the liquid crystal molecules in the liquid crystal cell C are aligned in the azimuth direction. It can be considered that the orientation distribution in is uniformly present in the range of 0 ° to 360 ° (0 ° ≦ Φ <360 °). The degree of orientation A is defined by the formula “A = A1 / A2”.

A1 in the above formula is the minimum value of light intensity obtained in the transmission mode or reflection mode of a polarizing microscope with a photomultiplier (in principle, the light intensity at the azimuth angle where the existence probability of the liquid crystal orientation vector is the highest). A2 is a value of light intensity at an azimuth angle obtained by adding 45 ° to the azimuth angle at which A1 is obtained.

When measuring the orientation degree A with a polarizing microscope, the transparent part is preferably in the transmission mode and the crossed Nicols condition, and the reflective electrode part is preferably measured in the reflection mode. When measurement is not possible in the transmission mode or the reflection mode (for example, when there is a light-shielding electrode and it does not reflect), measurement is performed by using a portion other than the antenna unit U that is not shielded.

The orientation degree A is preferably in the range of 1 to 3, and is most preferably 1. When the orientation degree A is 1, the liquid crystal molecules are most preferred because they are oriented in all directions and randomly. A liquid crystal material having an orientation degree A of 1 is called a schlieren texture. For reference, the degree of orientation in a general liquid crystal cell for liquid crystal display is 500 or more.

(Relation between liquid crystal molecules and electric field vectors)
FIG. 11 is an explanatory view schematically showing the direction of the electric field vector E when a voltage is applied between the TFT substrate 101 and the slot substrate 201. The patch electrode 15 of the TFT substrate 101 and the slot electrode 51 of the slot substrate 201 are patterned into a predetermined shape to constitute the antenna unit U. When a voltage (alternating voltage) is applied between the TFT substrate 101 having such an electrode and the slot electrode 201, the angle θ1 with respect to the substrate surface is less than 90 ° between the

substrates

101 and 201. An oblique electric field is generated. FIG. 11 schematically shows the direction of an oblique electric field vector (electric field vector) E. That is, the patch electrode 15 and / or the slot electrode 51 are patterned so that an oblique electric field is applied between the TFT substrate 101 and the slot substrate 201. Thus, when an oblique electric field is applied between both the

substrates

101 and 201, an effect equivalent to giving a predetermined pretilt angle to the liquid crystal molecules (positive liquid crystal molecules) can be obtained. In the case of negative liquid crystal molecules, the arrangement of the liquid crystal molecules is appropriately changed. In order to make the electric field vector oblique with respect to the substrate, it can be achieved by patterning the electrode, arranging a patterning derivative on the electrode, or the like.

(Method for Manufacturing Scanning Antenna According to Embodiment 1)
First, a method for manufacturing the liquid crystal cell C of the scanning antenna will be described. Examples of the method for injecting the liquid crystal layer LC (liquid crystal material) between the TFT substrate 101 and the slot substrate 201 of the liquid crystal cell C include a drop injection method (ODF method) and a vacuum injection method. Here, a manufacturing method of the liquid crystal cell C using the vacuum injection method will be described.

<Method for Manufacturing Liquid Crystal Cell according to Embodiment 1>
The manufacturing method of the liquid crystal cell C of this embodiment includes at least a first coating film forming process, a second coating film forming process, a first alignment film forming process, and a second alignment film forming process. As described above, the liquid crystal cell C includes a pair of TFT substrates 101 and a slot substrate 201 facing each other with the liquid crystal layer LC interposed therebetween, and has a configuration in which a plurality of antenna units U are arranged.

The first coating film forming step includes a dielectric substrate (first dielectric substrate) 1, a plurality of TFTs 10 supported on the dielectric substrate 1, and a plurality of patch electrodes 15 electrically connected to the TFTs 10. This is a step of forming a first coating film by applying a first alignment agent on the TFT substrate. The first alignment agent is made of, for example, a composition obtained by dissolving a polyimide resin such as polyamic acid in an organic solvent.

In the second coating film forming step, a second orientation is formed on a preslot substrate having a dielectric substrate (second dielectric substrate) 51 and a slot electrode 55 including a plurality of slots 57 supported by the dielectric substrate 51. This is a step of forming a second coating film by applying an agent. As the second alignment agent, the same type as the first alignment agent is used.

The first alignment film forming step is a step of heat-treating the first coating film to form the first alignment film OM1 on the pre-TFT substrate. As the heat treatment, pre-firing for the purpose of removing the organic solvent and subsequent main firing are performed. The temperature for pre-baking is set, for example, in the range of 75 ° C. to 95 ° C., and the time for pre-baking is set, for example, in the range of 0.5 to 5 minutes. Further, the temperature of the main baking is set, for example, in a range of 190 ° C. to 230 ° C., and the time of the main baking is set, for example, in a range of 5 minutes to 15 minutes. The main baking is performed for the purpose of curing the coating film or the like (particularly for the purpose of imidization or the like when the first coating film contains a polyamic acid). When the first alignment film OM1 is formed on the pre-TFT substrate, the TFT substrate 101 is obtained. The first alignment film OM1 formed through the first alignment film forming step has a function of aligning liquid crystal molecules constituting the liquid crystal layer LC in all azimuth directions. Further, the first alignment film OM1 is not subjected to a rubbing alignment process or a photo alignment process.

The second alignment film forming step is a step of forming the second alignment film OM2 on the preslot substrate by heat-treating the second coating film. The heat treatment in the second alignment film formation step may be basically the same as the heat treatment in the first alignment film formation step. When the second alignment film OM2 is formed on the preslot substrate, the slot substrate 201 is obtained. The second alignment film OM2 formed through the second alignment film formation step has a function of aligning liquid crystal molecules constituting the liquid crystal layer LC in all azimuth directions. Further, the second alignment film OM2 is not subjected to a rubbing alignment process or a photo alignment process.

On the TFT substrate 101 or the slot substrate 201 obtained as described above (here, referred to as the TFT substrate 101), the sealing material composition for vacuum injection method uses a sealing plate or the like. Is granted. A sealing material composition consists of what contains a thermosetting epoxy resin etc., for example.

Next, the sealing material composition on the substrate is heated and temporarily cured. Thereafter, the substrate (TFT substrate 101) and the other substrate (slot substrate 201) are bonded together with the temporarily cured sealing material composition interposed therebetween. Thereafter, the sealing material composition is heated and fully cured to form an empty cell in which the TFT substrate 101 and the slot substrate 201 are bonded to each other through the sealing material.

Subsequently, a liquid crystal material is injected into the empty cell from an injection port provided in a part of the sealing material under reduced pressure by an in-vacuum injection method. Thereafter, a thermosetting or photocurable sealing material composition is applied so as to close the injection port under normal pressure. And a sealing material composition is hardened | cured with a heat | fever or light (ultraviolet rays etc.), and a sealing material composition turns into a sealing part. As described above, the liquid crystal material can be injected into the liquid crystal cell C by using the vacuum injection method.

After the liquid crystal material is injected into the liquid crystal cell C, the liquid crystal material is heat-treated under predetermined conditions (temperature, time). The temperature of the heat treatment of the liquid crystal material may be a temperature equal to or higher than the nematic-isotropic phase transition temperature (Tni), or may be a temperature lower than the nematic-isotropic phase transition temperature (Tni). Thus, when the liquid crystal material is heat-treated, a liquid crystal cell C is obtained.

After the liquid crystal cell C is manufactured as described above, the reflective conductive plate 65 is appropriately faced to the outer main surface of the slot substrate 201 (second dielectric substrate 51) via the dielectric (air layer) 54. Is assembled to the cell side. The scanning antenna of this embodiment is manufactured through such steps.

[Embodiment 2]
Next, a scanning antenna 1000A according to Embodiment 2 of the present invention will be described with reference to FIG. FIG. 12 is a cross-sectional view schematically showing a part of the scanning antenna 1000A according to the second embodiment. The scanning antenna 1000A of the present embodiment includes a liquid crystal cell CA having a TFT substrate 101A, a slot substrate 201A, and a liquid crystal layer LC disposed therebetween. Both the TFT substrate 101A and the slot substrate 201A do not include the alignment film as in the first embodiment, but instead include hydrophilic surfaces P1 and P2. Note that the basic configuration of the scanning antenna 1000A (configuration other than the hydrophilic surfaces P1 and P2) is the same as that of the first embodiment, and a description thereof will be omitted. In FIG. 12, the same components as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment. Note that the TFT substrate 101A before the hydrophilic surface P1 is formed is referred to as a pre-TFT substrate, and the slot substrate 201A before the hydrophilic surface P2 is formed is referred to as a pre-slot substrate. The pre-TFT substrate is obtained by removing the alignment film OM1 from the TFT substrate 101 of the first embodiment, and the pre-slot substrate is obtained by removing the alignment film OM2 from the slot substrate 201 of the first embodiment. In this specification, the hydrophilic surface P1 included in the TFT substrate 101 may be referred to as a first hydrophilic surface P1, and the hydrophilic surface P2 included in the slot substrate 201 may be referred to as a second hydrophilic surface P2.

(Method for forming hydrophilic surfaces P1, P2)
The hydrophilic surfaces P1 and P2 are made hydrophilic by bringing an alkaline aqueous solution (alkaline diluted solution) into contact with each surface (liquid crystal layer LC side) of the pre-TFT substrate and the pre-slot substrate, respectively. Made up of. Examples of the alkaline substance to be used include sodium hydroxide. The alkali concentration in the alkali diluted solution is not particularly limited as long as the object of the present invention is not impaired, but is set to, for example, 0.1 to 10% by mass. Specific examples of the alkali diluted solution include an aqueous sodium hydroxide solution (NaOH concentration: 0.1 to 10% by weight). In the present specification, an alkali diluted solution used for forming the first hydrophilic surface P1 is referred to as a first alkali diluted solution, and an alkali diluted solution used for forming the second hydrophilic surface P2 is referred to as an alkali diluted solution used for forming the second hydrophilic surface P2. May be referred to as a second alkali diluted solution.

The alkaline diluted aqueous solution is applied to the surface of the pre-TFT substrate and the surface of the pre-slot substrate using a known application method. After the alkali diluted aqueous solution is applied to the pre-TFT substrate and the pre-slot substrate, the surface of the pre-TFT substrate and the surface of the pre-slot substrate may be washed with water (pure water) as necessary.

When the hydrophilic surface (first hydrophilic surface) P1 is formed on the surface of the pre-TFT substrate, the TFT substrate 101A is obtained, and when the hydrophilic surface (second hydrophilic surface) P2 is formed on the surface of the pre-slot substrate, the slot substrate 201A. Is obtained. By using the slot substrate 101A and the TFT substrate 201A, the liquid crystal cell CA can be basically manufactured by the same method as in the first embodiment.

(Method for Producing Liquid Crystal Cell According to Embodiment 2)
Here, a manufacturing method of the liquid crystal cell CA according to the second embodiment will be described. As a method for injecting the liquid crystal layer LC (liquid crystal material) between the TFT substrate 101A and the slot substrate 201A of the liquid crystal cell CA, as in the first embodiment, for example, a drop injection method (ODF method), a vacuum injection method, or the like. Is mentioned. Here, a manufacturing method of the liquid crystal cell CA using the vacuum injection method will be described.

The manufacturing method of the liquid crystal cell CA of the present embodiment includes at least a first hydrophilic surface forming step and a second hydrophilic surface forming step. As described above, the liquid crystal cell CA includes a pair of TFT substrates 101A and a slot substrate 201A facing each other with the liquid crystal layer LC interposed therebetween, and has a configuration in which a plurality of antenna units U are arranged.

The first hydrophilic surface forming step includes a dielectric substrate (first dielectric substrate) 1, a plurality of TFTs 10 supported on the dielectric substrate 1, and a plurality of patch electrodes 15 electrically connected to the TFTs 10. In this step, the first alkali diluted solution is applied on the TFT substrate to form the first hydrophilic surface P1. As the first alkali diluted solution, the above-described sodium hydroxide aqueous solution or the like is used. In the first hydrophilic surface forming step, it is preferable that after the first alkali diluted solution is applied, the surface of the pre-TFT substrate to which the first alkali diluted solution is applied is washed with water (for example, pure water). Thus, by washing with water, corrosion of the patch electrode 15 and the like can be suppressed while maintaining the first hydrophilic surface P1. The first hydrophilic surface P1 formed through the first hydrophilic surface forming step has a function of aligning liquid crystal molecules constituting the liquid crystal layer LC in all azimuth directions, as will be described later.

In the second hydrophilic surface forming step, a second alkali is formed on a preslot substrate having a dielectric substrate (second dielectric substrate) 51 and a slot electrode 55 including a plurality of slots 57 supported by the dielectric substrate 51. This is a step of forming a second hydrophilic surface P2 by applying a diluted solution. As the second alkali diluted solution, the same kind as the first alkali diluted solution is used. In the second hydrophilic surface forming step, it is preferable that after the second alkali diluted solution is applied, the surface of the preslot substrate to which the second alkali diluted solution is applied is washed with water (for example, pure water). Thus, by washing with water, corrosion of the slot electrode 55 and the like can be suppressed while maintaining the second hydrophilic surface P2. The second hydrophilic surface P2 formed through the second hydrophilic surface forming step has a function of aligning liquid crystal molecules constituting the liquid crystal layer LC in all azimuth directions, as will be described later.

In the method of manufacturing the liquid crystal cell CA according to this embodiment, after the liquid crystal material is injected into the liquid crystal cell CA, the liquid crystal material is heat-treated under predetermined conditions (temperature, time). The temperature of the heat treatment at that time may be a temperature equal to or higher than the nematic-isotropic phase transition temperature (Tni), or may be a temperature lower than the nematic-isotropic phase transition temperature (Tni).

As described above, when the TFT substrate 101A and the slot substrate 201A of the liquid crystal cell CA have the first hydrophilic surface P1 and the second hydrophilic surface P2, respectively, the hydrophilic groups formed on the hydrophilic surfaces P1 and P2 are liquid crystal molecules. As in the first embodiment, the liquid crystal molecules that act on the hydrophilic group and the hydrophobic group included in the liquid crystal molecules are subjected to a predetermined pretilt angle (for example, in a state where no voltage is applied between the

substrates

101A and 201A, for example, 1) to 10 degrees), and the film is uniformly oriented in all azimuth directions.

Similarly to the first embodiment, in the range of 100 μm × 100 μm of the antenna unit U (square range), if the orientation degree A of the liquid crystal molecules is in the range of 1 to 10, the liquid crystal molecules in the liquid crystal cell CA are It can be considered that the orientation distribution in the azimuth direction exists evenly in the range of 0 ° to 360 ° (0 ° ≦ Φ <360 °). The measuring method and preferred range of the orientation degree A are the same as those in the first embodiment.

In view of easy orientation of liquid crystal molecules in all azimuth directions (the degree of orientation A is easily adjusted to 1 to 10), the heat treatment temperature of the liquid crystal material is a nematic-isotropic phase transition temperature. The temperature is preferably lower than (Tni).

In the liquid crystal cell CA of this embodiment as well, the generation of liquid crystal molecules having the pretilt angle of 0 ° (the third liquid crystal molecule) is suppressed, the average pretilt angle of the entire liquid crystal molecules is increased, and the capacitance modulation is performed. The response speed becomes faster.

In addition, after manufacturing the liquid crystal cell CA as described above, as in the first embodiment, a dielectric (air layer) 54 is appropriately disposed on the main surface outside the slot substrate 201A (second dielectric substrate 51). A reflective conductive plate 65 is assembled on the cell side so as to face each other. The scanning antenna of this embodiment is manufactured through such steps.

[Embodiment 3]
Next, a scanning antenna B according to Embodiment 3 of the present invention will be described with reference to FIG. FIG. 13 is a cross-sectional view schematically showing a part of the scanning antenna 1000B according to the third embodiment. The scanning antenna 1000B of this embodiment includes a liquid crystal cell CB having a TFT substrate 101B, a slot substrate 201B, and a liquid crystal layer LCB disposed therebetween. The liquid crystal material constituting the liquid crystal layer LCB of the present embodiment is a material that is heat-treated at a temperature lower than the nematic-isotropic phase transition temperature (Tni) in the manufacturing process. Such a liquid crystal material exhibits an orientation (flow orientation) corresponding to the flow of the liquid crystal material generated when it is injected into the liquid crystal cell CB (empty cell) in the manufacturing process of the liquid crystal cell CB. Further, the alignment film OM11 of the TFT substrate 101B and the alignment film OM12 of the slot substrate 201B are basically made of the same material as that of the first embodiment. In the present embodiment, unlike the first embodiment, the alignment films OM11 and OM12 may be subjected to an alignment process such as a rubbing process or an optical alignment process. The other basic configuration of the scanning antenna 1000A is the same as that of the first embodiment, and a description thereof will be omitted. In FIG. 13, the same components as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment.

The TFT substrate 101B and the slot substrate 201B of the present embodiment have the same configuration as the TFT substrate 101 and the slot substrate 201 of the first embodiment, except that the alignment films OM11 and 12 are subjected to an alignment process. . In the present embodiment, it is not essential to apply the alignment films OM11 and OM12, and it is not necessary to perform the alignment treatment as in the first embodiment. As a method for injecting the liquid crystal layer LCB (liquid crystal material) between the TFT substrate 101B and the slot substrate 201B, for example, the drop injection method (ODF method) and the vacuum injection method can be cited as in the first embodiment. It is done. Here, a manufacturing method of the liquid crystal cell CB using the vacuum injection method will be described.

(Method for Manufacturing Liquid Crystal Cell According to Embodiment 3)
Here, a manufacturing method of the liquid crystal cell CB according to the third embodiment will be described. In this embodiment, a vacuum injection method is used as a method for injecting a liquid crystal layer LCB (liquid crystal material) between the TFT substrate 101B and the slot substrate 201B of the liquid crystal cell CB.

The manufacturing method of the liquid crystal cell CB of the present embodiment includes at least a bonding step and a flow alignment step. The liquid crystal cell CB includes a pair of TFT substrates 101B and a slot substrate 201B facing each other with the liquid crystal layer LCB interposed therebetween, and has a configuration in which a plurality of antenna units U are arranged.

The bonding process is a process in which the TFT substrate 101B and the slot substrate 201B are bonded to each other through a sealant to form an empty cell in which the liquid crystal layer LCB is not interposed between the TFT substrate 101B and the slot substrate 201B. is there. The TFT substrate 101B and the slot substrate 201B are basically manufactured by the same manufacturing method as the TFT substrate 101 and the slot substrate 201 of the first embodiment.

In the bonding step, a sealing material composition for vacuum injection is formed on one of the TFT substrate 101B and the slot substrate 201B (here, referred to as TFT substrate 101B) as in the first embodiment, as in a sealing plate or the like. It is given using.

Next, the sealing material composition on the substrate is heated and temporarily cured. Thereafter, the substrate (TFT substrate 101B) and the other substrate (slot substrate 201B) are bonded together with the temporarily cured sealing material composition interposed therebetween. Thereafter, the sealing material composition is heated and fully cured to form an empty cell in which the TFT substrate 101B and the slot substrate 201B are bonded to each other through the sealing material.

In the fluid alignment step, a liquid crystal material constituting a liquid crystal layer is injected between the empty cell TFT substrate 101B and the slot substrate 201B by a vacuum injection method, and the liquid crystal material is fluidly aligned using the flow during the injection. It is a process.

FIG. 14 is an explanatory view schematically showing a state in which the liquid crystal material (liquid crystal layer) LCB is injected into the empty cell 300 by the vacuum injection method. As shown in FIG. 14, a liquid crystal material (liquid crystal layer) LCB is injected into the empty cell 300 from an injection port s <b> 1 provided in a part of the sealing material S under reduced pressure by an in-vacuum injection method. For convenience of explanation, the slot substrate 201B of the empty cell 300 is omitted in FIG.

Thereafter, a thermosetting or photocurable sealing material composition is applied so as to close the inlet s1 under normal pressure. And a sealing material composition is hardened | cured with a heat | fever or light (ultraviolet rays etc.), and a sealing material composition turns into a sealing part. In this manner, the liquid crystal material can be injected into the liquid crystal cell CB by using the vacuum injection method.

By the way, the liquid crystal material injected into the empty cell 300 as described above flows so as to spread in a plane between the alignment film OM11 of the TFT substrate 101B and the alignment film OM12 of the slot substrate 201B, and finally. It flows so that there is no gap between them. When the liquid crystal material flows in this manner, in the finally obtained liquid crystal cell CB, the liquid crystal molecules have a predetermined pretilt angle in a state where no voltage is applied between the

substrates

101B and 201B as in the first embodiment. (For example, 1 ° to 10 °), and a fluid orientation that uniformly aligns in all azimuthal directions.

After the liquid crystal material is injected into the liquid crystal cell CB as described above, in this embodiment, the liquid crystal material (liquid crystal layer LCB) is subjected to a heat treatment under a temperature condition lower than the nematic-isotropic phase transition temperature (Tni). Need to be done (heat treatment step). When the liquid crystal material is heated at a temperature equal to or higher than the nematic-isotropic phase transition temperature (Tni), the flow alignment of the liquid crystal material (liquid crystal molecules) is eliminated, and the liquid crystal affected by the alignment films OM11 and OM12 subjected to the alignment treatment The molecules will be oriented along a predetermined azimuthal direction.

In the present embodiment, as in the first embodiment, if the orientation degree A of the liquid crystal molecules is in the range of 1 to 10 in the range of 100 μm × 100 μm of the antenna unit U (square range), the liquid crystal cell It can be considered that the liquid crystal molecules in CB are evenly present in the orientation distribution in the azimuth direction in the range of 0 ° to 360 ° (0 ° ≦ Φ <360 °). The measuring method and preferred range of the orientation degree A are the same as those in the first embodiment.

In the liquid crystal cell CB of this embodiment as well, the generation of liquid crystal molecules having the pretilt angle of 0 ° (the third liquid crystal molecule) is suppressed, the average pretilt angle of the entire liquid crystal molecules is increased, and the capacity modulation is performed. The response speed becomes faster.

Further, after the liquid crystal cell CB is manufactured as described above, as in the first embodiment, the outer main surface of the slot substrate 201B (second dielectric substrate 51) is appropriately inserted through the dielectric (air layer) 54. A reflective conductive plate 65 is assembled on the cell side so as to face each other. The scanning antenna of this embodiment is manufactured through such steps.

In this embodiment, the liquid crystal material is fluidly aligned by a vacuum injection method. However, in other embodiments, the liquid crystal material may be fluidly aligned by a drop injection method (ODF method). However, the vacuum injection method is preferable in consideration of damage to the liquid crystal molecules due to seal curing light and the accompanying decrease in voltage holding ratio.

(Manufacturing method of liquid crystal cell using dropping injection method)
Here, the manufacturing method of a liquid crystal cell provided with the fluid alignment process using the dropping injection method is demonstrated. This manufacturing method of a liquid crystal cell includes a drawing process, a flow alignment process, and a bonding process.

The drawing step is a step of drawing a sealing material in a frame shape on one of the TFT substrate and the slot substrate. In the flow alignment step, a liquid crystal material constituting a liquid crystal layer is dropped on one substrate on which a sealing material is drawn by a dropping injection method, and the flow when the dropped liquid crystal material spreads on the substrate is used. This is a step of fluidly aligning the liquid crystal material. The bonding step is a step of bonding one substrate on which the sealing material is drawn and the other substrate to each other through the sealing material while sandwiching the liquid-oriented liquid crystal material.

In the liquid crystal cell finally obtained by flowing the liquid crystal material supplied by the dropping injection method so as to spread on the substrate, the liquid crystal molecules are interposed between the TFT substrate and the slot substrate in the same manner as in the first embodiment. In a state where no voltage is applied, a flow orientation is obtained in which the orientation is uniform in all azimuth directions while having a predetermined pretilt angle (for example, 1 ° to 10 °).

Note that after the liquid crystal material is injected, the liquid crystal material (liquid crystal layer) needs to be heat-treated at a temperature lower than the nematic-isotropic phase transition temperature (Tni), as in the case of using the vacuum injection method. There is (heat treatment process).

After the liquid crystal cell is manufactured using the dropping injection method as described above, a dielectric (air layer) is appropriately interposed on the outer main surface of the slot substrate (second dielectric substrate) as in the first embodiment. The reflective conductive plate is assembled on the cell side so as to face each other. A scanning antenna is manufactured through these steps.

[Other Embodiments]
In addition to the above-described embodiment, the alignment film of the liquid crystal cell is subjected to a photo-alignment treatment with a correlation length of the liquid crystal material (liquid crystal molecule) or less so that the liquid crystal molecule has a predetermined pretilt angle (eg, 1 °) as in the first embodiment. ˜10 °), it can be uniformly oriented in all azimuth directions. Even in such a liquid crystal cell, generation of liquid crystal molecules having the pretilt angle of 0 ° (the third liquid crystal molecule) is suppressed, the average pretilt angle of the entire liquid crystal molecules is increased, and the response speed of capacitance modulation is high. Become.

Hereinafter, the present invention will be described in more detail based on examples. In addition, this invention is not limited at all by these Examples.

[Example 1]
(Production of liquid crystal cell for scanning antenna)
A TFT substrate having the same basic configuration as the TFT substrate 101 included in the liquid crystal cell C of the scanning antenna 1000 described above, and a slot substrate having the same basic configuration as the slot substrate 201 included in the liquid crystal cell C, respectively. Prepared. Both the alignment film (first alignment film) of the TFT substrate and the alignment film (second alignment film) of the slot substrate were formed using a polyimide-based alignment agent (first alignment agent, second alignment agent).

The polyimide-based alignment agent is composed of a liquid composition in which polyamic acid (see the above chemical formula (2)) and an organic solvent are mixed.

When forming an alignment film on each of the TFT substrate and the slot substrate, first, the alignment agent is applied on each substrate (pre-TFT substrate and pre-slot substrate) using a spin coater, and the alignment agent is applied on each substrate. The coating films (first coating film, second coating film) made of each were formed (first coating film forming process, second coating film forming process). Next, the coating film on each substrate was heated at 70 ° C. for 5 minutes, and further heated at 200 ° C. for 10 minutes to remove the solvent in the coating film, imidize the polyamic acid, and the like. In this way, an alignment film made of the alignment agent was formed on each surface of the TFT substrate and the slot substrate (first alignment film forming step, second alignment film forming step). In addition, the conventional alignment process (rubbing process, optical alignment process) is not performed with respect to the alignment film on each board | substrate.

Note that a measurement electrode for measuring a voltage holding ratio (VHR) between these substrates is formed on each of the TFT substrate and the slot substrate on which the alignment film is formed in an evaluation test described later. The measurement electrode is made of a transparent conductive film (ITO), and is formed on the surface of each substrate on the liquid crystal layer side (under the alignment film). The area of the measurement electrode in plan view is 1 cm ² and is provided on each substrate so as to face each other.

A thermosetting sealing material (trade name “HC-1413FP”, manufactured by Mitsui Chemicals, Inc.) is drawn on the surface (liquid crystal layer side, alignment film side) of the TFT substrate in a frame shape using a seal dispenser. The TFT substrate and the slot substrate were bonded together via the sealant so as to sandwich the sealant, and heated at 130 ° C. for 40 minutes to produce an empty cell in which no liquid crystal material was sealed. Then, in the empty cell, a liquid crystal material (Δε = 20, 1 kHz, 20 ° C., Tni =, using an injection port provided in a part of the frame-shaped thermosetting sealing material by a vacuum injection method. 120 ° C.) was enclosed. The inlet was sealed using a sealing material (trade name “TB3026E”, manufactured by Three Bond Co., Ltd.).

Thereafter, the cell in which the liquid crystal material is sealed is heated at 110 ° C. (temperature lower than Tni of the liquid crystal material) for 20 minutes to perform heat treatment of the liquid crystal molecules, and the liquid crystal molecules have a predetermined pretilt angle with respect to the substrate surface. A horizontal alignment type liquid crystal cell was obtained, in which the liquid crystal molecules were aligned in all directions in the substrate plane.

Note that the electrodes are patterned on both substrates, and an oblique electric field is applied between the substrates.

[Evaluation: Response time measurement]
With respect to the liquid crystal cell of Example 1, the response time of capacitance modulation was measured by the method shown below using the measurement electrode. The product name “AG1200” (manufactured by Yokogawa Electric Corporation) as an arbitrary waveform generator, the product name “TDS3034” (manufactured by Tektronix (manufactured by TFF Corporation)) as an oscilloscope, and the product name “high speed” as a voltage amplifier. The voltage response waveform of the liquid crystal cell of Example 1 was measured using “power amplifier 4055” (manufactured by NF Electronics Instruments). The applied voltage is 10 kHz, 34 Vpp, and a triangular wave. The current I at V = 0 while applying this triangular wave is derived from the equation I = dV / dt · C (dV / dt: time differentiation of potential difference between electrodes, C: capacitance between electrodes). The response time of capacitance modulation defined as follows was measured from the time-dependent plot of capacitance C thus obtained. The response time was defined as the time to reach 95% of the value of the capacity C after 16.67 ms (milliseconds) after applying the voltage.

As a result of the measurement, the response time of the liquid crystal cell of Example 1 was 1.5 ms (milliseconds), and it was confirmed that the response speed was faster than that of the liquid crystal cell of Comparative Example 1 described later. The degree of alignment of the liquid crystal cell of Example 1 was 1.

In the liquid crystal cell of Example 1, since the liquid crystal molecules are not bound in all azimuth directions, the liquid crystal molecules can exist in a degenerative state due to the demand for continuity of the liquid crystal alignment (FIG. 10). Liquid crystal molecule lc6). Therefore, in Example 1, the occurrence of liquid crystal molecules having the pretilt angle of 0 ° (the third liquid crystal molecule) is suppressed, the average pretilt angle of the entire liquid crystal molecules is increased, and the response speed of the capacity modulation is fast. Presumed to be.

[Comparative Example 1]
As in Example 1, a TFT substrate having the same basic configuration as the TFT substrate 101 included in the liquid crystal cell C, and a slot substrate having the same basic configuration as the slot substrate 201 included in the liquid crystal cell C are used. Each prepared. Both the alignment film of the TFT substrate and the alignment film of the slot substrate were formed using a polyimide-based alignment agent.

The polyimide-based alignment agent is composed of a liquid composition in which a polyamic acid having an azobenzene structure as a photoreactive functional group (see the above chemical formula (2)) and an organic solvent are mixed.

As in Example 1, the alignment agent was applied onto each substrate using a spin coater, and a coating film made of the alignment agent was formed on each substrate. Next, the coating film on each substrate was heated at 70 ° C. for 5 minutes, and further heated at 220 ° C. for 40 minutes to remove the solvent in the coating film, imidize the polyamic acid, and the like. Then, the photo-alignment process which irradiates the coating film on each board | substrate from the orthogonal | vertical direction on the conditions of 5 J / cm < ² > on polarized ultraviolet light (wavelength: 365 nm) was performed.

Note that the same measurement electrodes as in Example 1 are formed on the TFT substrate and the slot substrate of Comparative Example 1 as well.

On the surface of the TFT substrate (liquid crystal layer side, alignment film side), a thermosetting sealing material is drawn in a frame shape using a seal dispenser as in Example 1, and then the TFT substrate is sandwiched between the sealing materials. And a slot substrate were bonded together via the sealing material, and heated at 130 ° C. for 40 minutes to produce an empty cell in which no liquid crystal material was sealed. Then, in the empty cell, the same liquid crystal material as in Example 1 by using the injection port provided in a part of the frame-shaped thermosetting sealing material by vacuum injection as in Example 1. (Δε = 20, 1 kHz, 20 ° C., Tni = 120 ° C.) was enclosed. The inlet was sealed using the same sealing material as in Example 1.

Thereafter, the cell in which the liquid crystal material is sealed is heated at 130 ° C. (temperature higher than Tni of the liquid crystal material) for 20 minutes, thereby heat-treating the liquid crystal molecules, and uniaxially oriented along a predetermined azimuth direction. An alignment type liquid crystal cell was obtained.

[Evaluation: Response time measurement]
For the liquid crystal cell of Comparative Example 1, the response time of capacity modulation was measured in the same manner as in Example 1. As a result, the response time of the liquid crystal cell of Comparative Example 1 was 1.9 ms (milliseconds). The degree of alignment of the liquid crystal cell of Comparative Example 1 was 1000.

In the liquid crystal cell of Comparative Example 1, since the liquid crystal molecules are aligned along a predetermined azimuth angle direction under the action of the alignment film, the liquid crystal molecules having a pretilt angle of 0 ° (see the third liquid crystal molecule lc3 in FIG. 15). It is presumed that the pretilt angle of the entire liquid crystal molecules is smaller than that in Example 1. Therefore, it is presumed that the response speed of the liquid crystal cell of Comparative Example 1 was slow.

[Example 2]
The TFT substrate 101A having the same basic configuration as the TFT substrate 101A provided with the liquid crystal cell CA of the scanning antenna 1000A described above, and the slot substrate 201A provided with the liquid crystal cell CA and provided with no alignment film. And slot substrates having the same basic configuration were prepared.

The surface (liquid crystal layer side) of each substrate is hydrophilized by washing with a sodium hydroxide diluted aqueous solution (NaOH concentration: 2 wt%) and pure water (hydrophilic surfaces (first hydrophilic surface, second hydrophilic surface)). Are formed (first hydrophilic surface forming step, second hydrophilic surface forming step). An alignment film made of an organic material such as a polyimide resin is not formed on the surface of each substrate.

Note that the same measurement electrodes as in Example 1 are formed on the TFT substrate and the slot substrate of Example 2.

On the surface (liquid crystal layer side) of the TFT substrate, as in Example 1, a thermosetting sealing material is drawn in a frame shape using a seal dispenser, and then the TFT substrate and the slot substrate are sandwiched between the sealing materials. Were bonded together through the sealing material and heated at 130 ° C. for 40 minutes to produce an empty cell in which no liquid crystal material was sealed. Then, in the empty cell, the same liquid crystal material as in Example 1 by using the injection port provided in a part of the frame-shaped thermosetting sealing material by vacuum injection as in Example 1. (Δε = 20, 1 kHz, 20 ° C., Tni = 120 ° C.) was enclosed. The inlet was sealed using the same sealing material as in Example 1.

[Evaluation: Response time measurement]
For the liquid crystal cell of Example 2, the response time of capacity modulation was measured in the same manner as in Example 1. As a result, the response time of the liquid crystal cell of Example 2 was 1.5 ms (milliseconds). Thus, it was confirmed that Example 2 had a shorter response time and a faster response speed than Comparative Example 1. The degree of alignment of the liquid crystal cell of Example 2 was 1.

Even if the alignment film is not formed in the liquid crystal cell as in Example 2, instead of forming a hydrophilic surface on each substrate surface, the liquid crystal molecules are transferred to the substrate surface. It can be oriented in all directions.

Example 3
A TFT substrate having the same basic configuration as the TFT substrate 101B included in the liquid crystal cell CB and a slot substrate having the same basic configuration as the slot substrate 201B included in the liquid crystal cell CB were prepared. Both the alignment film of the TFT substrate and the alignment film of the slot substrate were formed by using the polyimide-based alignment agent containing polyamic acid containing an azobenzene structure as a photoreactive functional group, which was used in Comparative Example 1.

As in Example 1, the alignment agent was applied on each substrate (pre-TFT substrate, pre-slot substrate) using a spin coater, and a coating film made of the alignment agent was formed on each substrate. Next, the coating film on each substrate was heated at 70 ° C. for 5 minutes, and further heated at 220 ° C. for 40 minutes to remove the solvent in the coating film, imidize the polyamic acid, and the like. Then, the photo-alignment process which irradiates the coating film on each board | substrate from the orthogonal | vertical direction on the conditions of 1J / cm < ² > polarized ultraviolet light (wavelength: 365 nm) is performed.

Note that the same measurement electrodes as in Example 1 are formed on the TFT substrate and the slot substrate of Example 3.

On the surface (liquid crystal layer side) of the TFT substrate, as in Example 1, a thermosetting sealing material is drawn in a frame shape using a seal dispenser, and then the TFT substrate and the slot substrate are sandwiched between the sealing materials. Were bonded together through the sealing material and heated at 130 ° C. for 40 minutes to produce an empty cell in which no liquid crystal material was sealed (bonding step). Then, in the empty cell, the same liquid crystal material as in Example 1 by using the injection port provided in a part of the frame-shaped thermosetting sealing material by vacuum injection as in Example 1. (Δε = 20, 1 kHz, 20 ° C., Tni = 120 ° C.) was enclosed (flow orientation step). The inlet was sealed using the same sealing material as in Example 1.

Thereafter, the cell in which the liquid crystal material is sealed is heated at 110 ° C. (temperature lower than Tni of the liquid crystal material) for 20 minutes, so that the liquid crystal material is heat-treated, and the liquid crystal molecules constituting the liquid crystal material are applied to the substrate surface. Thus, a horizontal alignment type liquid crystal cell was obtained which rose at a predetermined pretilt angle and in which liquid crystal molecules were aligned in all directions within the substrate surface.

[Evaluation: Response time measurement]
For the liquid crystal cell of Example 3, the response time of capacity modulation was measured in the same manner as in Example 1. As a result, the response time of the liquid crystal cell of Example 3 was 1.6 ms (milliseconds). Thus, it was confirmed that Example 3 had a shorter response time and a higher response speed than those of Comparative Example 1 described above. The degree of alignment of the liquid crystal cell of Example 3 was 10.

Even if an alignment process that is not originally required to be performed on the alignment film as in Example 3, the alignment regulation force of the alignment film is because the processing conditions are weak or the alignment film is thin. Is insufficient, the fluid alignment of the liquid crystal material is maintained unless the liquid crystal material is heated at a temperature equal to or higher than the nematic-isotropic phase transition temperature (Tni). The flow alignment of the liquid crystal material is an alignment state of the liquid crystal material (liquid crystal molecules) formed by fluidly expanding the liquid crystal material when the liquid crystal material is injected into the empty cell. In the liquid crystal material thus fluidly aligned, each liquid crystal molecule rises at a predetermined pretilt angle with respect to the substrate surface, and each liquid crystal molecule is aligned in all directions within the substrate surface.

In Example 3, the photo-alignment process was performed as the alignment process. However, even if the alignment film is subjected to the alignment process by rubbing, the liquid crystal material is subjected to fluid alignment if the alignment control force of the alignment film is weak. If maintained, each liquid crystal molecule rises at a predetermined pretilt angle with respect to the substrate surface, and each liquid crystal molecule is aligned in all directions in the substrate surface.

DESCRIPTION OF SYMBOLS 1 ... Dielectric substrate (1st dielectric substrate), 3 ... Gate electrode, 4 ... Gate insulating layer, 5 ... Semiconductor layer, 6D ... Drain contact layer, 6S ... Source contact layer, 7D ... Drain electrode, 7S ... Source electrode DESCRIPTION OF SYMBOLS 10 ... TFT, 11 ... 1st insulating layer, 15 ... Patch electrode, 17 ... 2nd insulating layer, 51 ... Dielectric substrate (2nd dielectric substrate), 55 ... Slot electrode, 55L ... Lower layer, 55M ... Main layer , 55U ... upper layer, 57 ... slot, 57U ... slot electrode unit, 58 ... third insulating layer, 70 ... feeder, 72 ... feeder pin, 101, 101A ... TFT substrate, 201, 201A ... slot substrate, 1000 ... scanning antenna , U ... antenna unit (antenna unit region), CH1 ... contact hole, LC ... liquid crystal layer, C, CA ... liquid crystal cell, GD ... gate driver, GL ... gate bus line, G ... Gate terminal part, SD ... Source driver, SL ... Source bus line, ST ... Source terminal part, PT ... Transfer terminal part, R1 ... Transmission / reception area, R2 ... Non-transmission / reception area, Rs ... Sealing area, S ... Sealing material, OM , OM1, OM2 ... orientation film, P1, P2 ... hydrophilic surface

Claims

A method of manufacturing a liquid crystal cell having a pair of TFT substrates and a slot substrate facing each other with a liquid crystal layer sandwiched therebetween, wherein a plurality of antenna units are arranged,
A first alignment agent is provided on a pre-TFT substrate having a first dielectric substrate, a plurality of TFTs supported by the first dielectric substrate, and a plurality of patch electrodes electrically connected to the TFTs. A first coating film forming step for forming the first coating film;
A second coating film is formed by applying a second alignment agent on a pre-slot substrate having a second dielectric substrate and a slot electrode including a plurality of slots supported by the second dielectric substrate. Coating film forming process;
Heat-treating the first coating film, and forming a first alignment film on the pre-TFT substrate without performing a rubbing alignment process or a photo-alignment process; and
A liquid crystal cell manufacturing method comprising: a second alignment film forming step of forming a second alignment film on the pre-slot substrate without subjecting the second coating film to a heat treatment and performing a rubbing alignment process or a photo-alignment process.
The method for producing a liquid crystal cell according to claim 1, wherein the first alignment film and the second alignment film align liquid crystal molecules constituting the liquid crystal layer in all azimuth directions.
The method for producing a liquid crystal cell according to claim 1 or 2, wherein the first alignment agent and the second alignment agent contain a polyimide resin.
A method of manufacturing a liquid crystal cell having a pair of TFT substrates and a slot substrate facing each other with a liquid crystal layer sandwiched therebetween, wherein a plurality of antenna units are arranged,
A first alkali diluted solution is applied on a pre-TFT substrate having a first dielectric substrate, a plurality of TFTs supported by the first dielectric substrate, and a plurality of patch electrodes electrically connected to the TFTs. A first hydrophilic surface forming step of forming the first hydrophilic surface;
A second hydrophilic surface is formed by applying a second alkali diluted solution on a pre-slot substrate having a second dielectric substrate and a slot electrode including a plurality of slots supported by the second dielectric substrate. A manufacturing method of a liquid crystal cell provided with 2 hydrophilic surface formation processes.
The liquid crystal cell manufacturing method according to claim 4, wherein the first hydrophilic surface and the second hydrophilic surface align liquid crystal molecules constituting the liquid crystal layer in all azimuth directions.
In the first hydrophilic surface forming step, after applying the first alkali diluted solution, the pre-TFT substrate is washed with water,
6. The method of manufacturing a liquid crystal cell according to claim 4, wherein, in the second hydrophilic surface forming step, the preslot substrate is washed with water after the second alkali diluted solution is applied.
7. The method according to claim 4, wherein, in the first hydrophilic surface forming step and the second hydrophilic surface forming step, the first alkali diluted solution and the second alkali diluted solution are made of a sodium hydroxide aqueous solution. A method for producing a liquid crystal cell according to claim 1.
A method of manufacturing a liquid crystal cell having a pair of TFT substrates and a slot substrate facing each other with a liquid crystal layer sandwiched therebetween, wherein a plurality of antenna units are arranged,
A bonding step in which the TFT substrate and the slot substrate are bonded to each other via a sealing material to form an empty cell in which the liquid crystal layer is not interposed between the TFT substrate and the slot substrate;
Flow alignment in which the liquid crystal material constituting the liquid crystal layer is injected between the TFT substrate and the slot substrate of the empty cell by a vacuum injection method, and the liquid crystal material is fluidly aligned using the flow at the time of the injection. A method for producing a liquid crystal cell comprising the steps.
A method of manufacturing a liquid crystal cell having a pair of TFT substrates and a slot substrate facing each other with a liquid crystal layer sandwiched therebetween, wherein a plurality of antenna units are arranged,
A drawing step of drawing a sealing material in a frame shape on any one of the TFT substrate and the slot substrate;
A liquid crystal material constituting the liquid crystal layer is dropped on one of the substrates on which the sealing material is drawn by a dropping injection method, and the flow when the dropped liquid crystal material spreads on the substrate is utilized. A fluid alignment step of fluidly aligning the liquid crystal material;
A method of manufacturing a liquid crystal cell, comprising: a bonding step in which one substrate and the other substrate are bonded to each other through the sealant while sandwiching the liquid crystal material that has been fluidly aligned.
10. The method for producing a liquid crystal cell according to claim 8, wherein in the fluid alignment step, the liquid crystal material is fluidly aligned so that liquid crystal molecules constituting the liquid crystal material are aligned in all azimuth directions.
11. The method of manufacturing a liquid crystal cell according to claim 8, further comprising a heat treatment step of heat-treating the liquid crystal layer under a temperature condition lower than a nematic-isotropic phase transition temperature of the liquid crystal material. .
The TFT substrate includes a first dielectric substrate, a plurality of TFTs supported on the first dielectric substrate, a plurality of patch electrodes electrically connected to the TFTs, and a cover covering the patch electrodes. A first alignment film formed on one dielectric substrate,
The slot substrate is formed on the second dielectric substrate so as to cover the second dielectric substrate, a slot electrode including a plurality of slots supported by the second dielectric substrate, and the slot electrode. The method for producing a liquid crystal cell according to any one of claims 8 to 11, comprising a two-alignment film.
The method for producing a liquid crystal cell according to claim 1, wherein the liquid crystal molecules constituting the liquid crystal layer are of a horizontal alignment type.
A scanning antenna comprising a step of disposing a reflective conductive plate on a main surface outside the slot substrate provided in the liquid crystal cell according to any one of claims 1 to 13 so as to face each other through a dielectric layer. Manufacturing method.