WO2018174645A1 - Temperature measurement apparatus including dual temperature sensors - Google Patents

Temperature measurement apparatus including dual temperature sensors Download PDF

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Publication number
WO2018174645A1
WO2018174645A1 PCT/KR2018/003452 KR2018003452W WO2018174645A1 WO 2018174645 A1 WO2018174645 A1 WO 2018174645A1 KR 2018003452 W KR2018003452 W KR 2018003452W WO 2018174645 A1 WO2018174645 A1 WO 2018174645A1
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WO
WIPO (PCT)
Prior art keywords
temperature sensor
contact temperature
contact
measurement object
region
Prior art date
Application number
PCT/KR2018/003452
Other languages
French (fr)
Korean (ko)
Inventor
장세윤
신재원
Original Assignee
주식회사 모바일닥터
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Publication date
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Publication of WO2018174645A1 publication Critical patent/WO2018174645A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02Means for indicating or recording specially adapted for thermometers
    • G01K1/026Means for indicating or recording specially adapted for thermometers arrangements for monitoring a plurality of temperatures, e.g. by multiplexing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02Means for indicating or recording specially adapted for thermometers
    • G01K1/024Means for indicating or recording specially adapted for thermometers for remote indication
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00Thermometers specially adapted for specific purposes
    • G01K13/20Clinical contact thermometers for use with humans or animals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00Thermometers specially adapted for specific purposes
    • G01K13/20Clinical contact thermometers for use with humans or animals
    • G01K13/25Protective devices therefor, e.g. sleeves preventing contamination

Definitions

  • the present invention relates to a temperature measuring apparatus including a dual temperature sensor, and more particularly, to a temperature measuring apparatus including a dual temperature sensor capable of measuring a target temperature using a contact temperature sensor and a non-contact temperature sensor.
  • the temperature sensor is a sensor that detects heat and emits an electrical signal.
  • the temperature sensor may be classified into a contact temperature sensor and a non-contact temperature sensor.
  • the contact temperature sensor measures the temperature by directly contacting the sensor to the actual measurement object. In order to accurately detect the temperature of the measurement object, a sufficient contact surface must be secured.
  • the non-contact temperature sensor measures the hot wire radiated from the object to be measured. Although it has a fast response speed, the measurement result may be inaccurate due to the temperature rise of the non-contact temperature sensor itself.
  • the infant's body temperature can be accurately measured, but there may be the following problems when the infant's body temperature is continuously monitored using the temperature measuring device. .
  • the measurement results of the temperature measuring device may be inaccurate due to the temperature rise of the non-contact temperature sensor itself due to the long-term use of the temperature measuring device. Can be.
  • the problem to be solved by the present invention is a temperature measuring device including a dual temperature sensor that can accurately measure the temperature of the measurement object by using the measurement result of the non-contact temperature sensor when the measurement result of the contact temperature sensor is inaccurate To provide.
  • Another object of the present invention is to provide a dual temperature having a shape or structure that can accurately measure the temperature of the measurement object by not contacting the measurement object when the contact temperature sensor is in contact with the measurement object It is to provide a temperature measuring device including a sensor.
  • a temperature measuring device including a dual temperature sensor according to an embodiment of the present invention for solving the technical problem, the contact type temperature sensor for measuring the temperature of the measurement object; Non-contact temperature sensor for measuring the temperature of the measurement object; A processor that recognizes the result measured by the non-contact temperature sensor as the temperature of the measurement object when the result measured by the contact temperature sensor corresponds to a predetermined abnormal pattern; And a frame for fixing the temperature measuring device to the measurement object or the garment of the measurement object, wherein the contact temperature sensor is located in a first area of the frame, and the non-contact temperature sensor is spaced from the first area. And a frame, wherein the first region and the second region are not located on the same plane so that the first region in which the contact temperature sensor is located is located in the second region of the frame. When the measurement object is in contact with the measurement object, the second area in which the non-contact temperature sensor is located does not contact the measurement object.
  • a temperature measuring apparatus including a dual temperature sensor, the frame including a sensor surface having a bend or inclination; A contact temperature sensor positioned in the first region of the sensor surface; And a non-contact temperature sensor positioned in a second region of the sensor surface spaced apart from the first region of the sensor surface, wherein the first region and the second region in the frame are not located on the same plane.
  • the contact temperature sensor and the non-contact temperature sensor are included, when the measurement result of the contact temperature sensor is inaccurate, the measurement target temperature is accurately measured by using the measurement result of the non-contact temperature sensor. can do.
  • the non-contact temperature sensor since the non-contact temperature sensor has a shape or structure that does not contact the measurement object when the contact temperature sensor is in contact with the measurement object, it is possible to accurately measure the temperature of the measurement object.
  • 1 is a temperature measuring system according to an embodiment of the present invention.
  • FIG. 2 is a block diagram of a temperature measuring device according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of a temperature measuring device according to an embodiment of the present invention.
  • thermometer 4 is an embodiment in which the temperature measuring device according to an embodiment of the present invention is fixed to a garment of a measurement target.
  • FIG. 5 is a schematic diagram of a temperature measuring device according to another embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a temperature measuring device according to another embodiment of the present invention.
  • FIG. 7 is a schematic diagram of a temperature measuring device according to another embodiment of the present invention.
  • FIG. 8 is a configuration diagram of a temperature measuring device according to another embodiment of the present invention.
  • FIG. 9 is a flow chart of the operation of the temperature measuring device according to an embodiment of the present invention.
  • FIG. 10 is a flowchart of the operation of the temperature measuring device according to another embodiment of the present invention.
  • FIG. 11 is a flowchart of the operation of the temperature measuring device according to another embodiment of the present invention.
  • FIG. 1 a temperature measuring system according to an embodiment of the present invention will be described.
  • FIG. 1 there is shown a temperature measuring system in accordance with an embodiment of the present invention.
  • the temperature measuring system is a system for measuring and monitoring a temperature of a measurement target, and may include a temperature measuring device 100 and a user terminal 200.
  • the measurement target may be an infant
  • the temperature measuring system may be a system for measuring and monitoring the body temperature of the measurement target, but is not limited thereto.
  • the temperature measuring apparatus 100 may continuously measure the temperature of the measurement target and transmit the measurement result to the user terminal 200.
  • the temperature measuring device 100 may be fixed to the garment (eg, diaper, etc.) of the measurement object so as to be fixed to the measurement object itself or to measure the temperature of the measurement object.
  • the configuration, shape, or operation of the temperature measuring device 100 will be described later.
  • the temperature measuring device 100 in connection with the temperature measuring device 100 is fixed to the garment of the measurement object, the temperature measuring device 100 is formed in the waistband or belt line under the diaper, panties or pants, etc. It can be fixed in the area, and can be monitored by continuously measuring the temperature of the measurement object while being fixed.
  • the user terminal 200 may receive the measurement result from the temperature measuring device 100 and monitor the temperature of the measurement target.
  • the user terminal 200 may be, for example, a smartphone or a tablet PC, but the type of the user terminal 200 is not limited as long as it can receive the measurement result from the temperature measuring device 100.
  • an application for controlling the user terminal 200 to generate and display monitoring information about a measurement object using the measurement result transmitted from the temperature measuring apparatus 100 may be installed in the user terminal 200.
  • the user can check the measurement result transmitted from the temperature measuring device 100 through the user terminal 200, and the user is separated from the measurement object. Even if it is, the temperature of the measurement object can be easily monitored.
  • the measurement result of the temperature measuring device 100 may not be directly transmitted from the temperature measuring device 100 to the user terminal 200, but may be transmitted to the user terminal 200 via a server (not shown).
  • the measurement result of the temperature measuring apparatus 100 may be transmitted from the temperature measuring apparatus 100 to a server (not shown), and the measurement result may be transmitted to the user terminal 200 from the corresponding server (not shown). .
  • FIG. 2 a schematic diagram of a temperature measuring apparatus 100 according to an embodiment of the present invention is disclosed.
  • FIG. 3 a schematic diagram of a temperature measuring apparatus 100 according to an embodiment of the present invention is provided. 4 an embodiment in which the temperature measuring device 100 according to an embodiment of the present invention is fixed to a garment to be measured is disclosed.
  • FIG. 5 an embodiment according to another embodiment of the present invention is described. A schematic diagram of the temperature measuring device 100 is disclosed.
  • the temperature measuring device 100 is a contact temperature sensor 10, a non-contact temperature sensor 20, the processor 30, the communication module 40 and the frame 50 ) May be included. That is, the temperature measuring device 100 may include a contact temperature sensor 10 and a non-contact temperature sensor 20 simultaneously as dual sensors. However, the temperature measuring device 100 according to some embodiments may include more or less components than those included in FIG. 2.
  • the contact temperature sensor 10 may measure the temperature of the measurement object, and may be located in the first region of the frame 50, for example. Since a sufficient contact surface between the contact temperature sensor 10 and the measurement object must be secured, when the frame 50 is fixed to the measurement object or the garment of the measurement object, the contact temperature sensor located in the first area of the frame 50 (10) may contact the measurement object.
  • the non-contact temperature sensor 20 may measure the temperature of the measurement object, and may be located in a second area of the frame 50 spaced apart from the first area, for example. Since the non-contact temperature sensor 20 needs to measure the temperature of the measurement object without contacting the measurement object, when the frame 50 is fixed to the measurement object or the garment of the measurement object, the non-contact temperature sensor 20 measures the second area of the frame 50. The positioned non-contact temperature sensor 20 may not contact the measurement object.
  • the processor 30 may control the operation of the temperature measuring device 100. Since the temperature measuring device 100 includes both the contact temperature sensor 10 and the non-contact temperature sensor 20, the processor 30 operates each of the contact temperature sensor 10 and the non-contact temperature sensor 20 at any time. Whether or not, whether or not the temperature sensor of the contact temperature sensor 10 and the non-contact temperature sensor 20 to recognize the result of the measurement as the temperature of the measurement object can be determined.
  • the communication module 40 may communicate with an external device including the user terminal 200.
  • the communication module 40 may support a wired communication method and / or a wireless communication method.
  • USB 2.0 is a wired communication method.
  • Wireless communication methods include Wireless Broadband Internet, Wi-Fi, ZIGBEE, Bluetooth, Ultra Wide Band (UWB), Near Field Communication (NFC), Examples include, but are not limited to, third generation mobile communication (3G), fourth generation mobile communication (4G), and fifth generation mobile communication (5G).
  • the frame 50 may fix the temperature measuring device 100 to the measurement target or the garment of the measurement target so that the temperature measuring device 100 according to the present embodiment can measure the temperature of the measurement target.
  • the frame 50 may have a clip shape to be fixed to the garment of the measurement target, but the method of fixing the frame 50 to the measurement target or the garment of the measurement target is not limited thereto.
  • the contact temperature sensor 10 may be located in a first area of the frame 50, the non-contact temperature sensor 20 may be located in a second area of the frame 50 spaced apart from the first area, and the frame 50 may be located in the first area of the frame 50. ) May be formed so that the second area in which the non-contact temperature sensor 20 is positioned does not contact the measurement object when the first area in which the contact temperature sensor 10 is located touches the measurement object.
  • the reason why the frame 50 is formed is that the contact type temperature sensor 10 measures the temperature of the measurement object precisely while the temperature measuring device 100 is fixed to the measurement object or the garment of the measurement object. This is because the contact with the object to be measured is necessary, and the non-contact temperature sensor 20 needs to maintain a distance from the object to measure the temperature of the object to be precisely measured.
  • the frame 50 may include a sensor surface 51 having at least a portion of flexion or inclination, and the contact temperature sensor 10 may be formed of the sensor surface 51.
  • the non-contact temperature sensor 20 may be located in one region and may be located in a second region of the sensor surface 51 spaced apart from the first region of the sensor surface 51.
  • the sensor surface 51 includes a bend or inclination, and because the contact temperature sensor 10 and the non-contact temperature sensor 20 are spaced apart from each other on the sensor surface 51, the temperature measuring device Even if the first area in which the contact temperature sensor 10 is positioned is in contact with the measurement object while the 100 is fixed to the object to be measured or the garment of the object to be measured, the sensor surface 51 due to the bending or inclination of the sensor surface 51. Some regions of the second region (eg, the second region) may be spaced apart from the measurement object and do not contact the measurement object.
  • the sensor surface 51 may be coated with silicon (for example, medical silicone), and when the temperature measuring device 100 is fixed to the measurement object, the sensor surface 51 comes into contact with the measurement object. At this time, since the silicon formed on the sensor surface 51 may be in close contact with the measurement object, the contact temperature sensor 10 may secure a sufficient contact surface through which the contact object is measured.
  • silicon for example, medical silicone
  • the frame 50 may have a U-shape, for example, and the temperature is measured by inserting a waistband or a belt line of a garment (eg, a bottom) into an opening 53 of the frame 50.
  • the device 100 may be fixed to the garment of the measurement object.
  • the temperature measuring device 100 is in close contact with the measurement object while being fixed to the waistband or belt line of the garment while the sensor surface 51 faces the measurement object. It is done. That is, as the temperature measuring device 100 is fixed to the waistband or belt line of the garment, the waistband or beltline of the garment is tightened to the measurement object to maintain a close state as the contact type temperature sensor 10 is measured. You can stay in contact with Therefore, according to the temperature measuring apparatus 100 according to the present embodiment, the contact type temperature sensor 10 can secure a sufficient measuring surface for measuring the temperature of the measurement target.
  • the sensor surface 51 includes a curved or inclined surface and a plane in a direction away from the measurement object, the contact temperature sensor 10 is disposed in the plane of the sensor surface 51 and the non-contact temperature sensor 20 is a sensor surface ( 51) may be disposed on an inclined surface. Therefore, according to the present embodiment, according to the temperature measuring device 100, since the non-contact temperature sensor 20 can be fixed to the measurement target or the garment of the measurement target in a state spaced apart from the measurement target, the non-contact temperature sensor 20 It is possible to secure a sufficient space for measuring the temperature of the measurement object.
  • the non-contact temperature sensor 20 is relatively compared to the contact temperature sensor 10 in a state where the temperature measuring device 100 is fixed to the measurement object.
  • the contact temperature sensor 10 may be located in the upper region relative to the non-contact temperature sensor 20 with the temperature measuring device 100 fixed to the measurement object.
  • FIG. 5 there is shown a schematic diagram of a temperature measuring device according to another embodiment of the present invention.
  • the contact temperature sensor 10 is not formed in an adjacent region of the non-contact temperature sensor 20, and is formed to be spaced apart considerably.
  • the contact temperature sensor 10 may be located in the region where the silicon 52 is formed in the sensor surface 51.
  • FIG. 6 there is shown a schematic diagram of a temperature measuring device according to another embodiment of the present invention.
  • the temperature measuring device 100 may include first and second sensor surfaces 51a and 51b, and the contact temperature sensor 10 may include a first sensor.
  • the non-contact temperature sensor 20 may be formed on the surface 51a and may be formed on the second sensor surface 51b.
  • the first sensor surface 51a may protrude relative to the second sensor surface 51b, that is, the second sensor surface 51b may settle relative to the first sensor surface 51a.
  • the contact type temperature sensor 10 formed on the relatively protruding first sensor surface 51a contacts the measurement target to secure a sufficient contact surface.
  • the non-contact temperature sensor 20 formed on the second sensor surface 51b that is relatively sinking down can secure a sufficient separation distance from the measurement object.
  • the silicon 52 may be formed on the first sensor surface 51a.
  • FIG. 7 a schematic diagram of a temperature measuring device according to another embodiment of the present invention is shown.
  • the sensor surface 51 has a bend or inclination in a direction away from the measurement object, and the non-contact temperature sensor 20 is located at a lower portion relative to the contact temperature sensor 10.
  • the temperature sensor 20 may be located in an area of the sensor surface 51 spaced apart from the measurement object. Therefore, according to the present embodiment, according to the temperature measuring device 100, since the non-contact temperature sensor 20 can be fixed to the measurement target or the garment of the measurement target in a state spaced apart from the measurement target, the non-contact temperature sensor 20 It is possible to secure a sufficient space for measuring the temperature of the measurement object.
  • a temperature measuring device 100 according to another embodiment of the present invention will be described with reference to FIG. 8. However, the difference from the temperature measuring device 100 according to an embodiment of the present invention will be described mainly. Referring to FIG. 8, a configuration diagram of a temperature measuring device 100 according to another embodiment of the present invention is disclosed.
  • the temperature measuring device 100 may further include a storage unit 60.
  • the storage unit 60 may store various information including the measurement result of the contact type temperature sensor 10 and the measurement result of the non-contact temperature sensor 20.
  • the measurement result of the contact temperature sensor 10 or the measurement result of the non-contact temperature sensor 20 may not be transmitted in real time to the user terminal 200 through the communication module 40.
  • the measurement result of the contact temperature sensor 10 or the measurement result of the non-contact temperature sensor 20 may be stored in the storage unit 60, after which the communication module When the communication of 40 is enabled, it may be transmitted to the user terminal 200.
  • the processor 30 may store the measurement result of the contact temperature sensor 10 or the measurement result of the non-contact temperature sensor 20 in the storage unit 60 without being transmitted to the user terminal 200.
  • the temperature measuring device 100 may be controlled.
  • the contact temperature sensor 10 is first used, and the measurement result of the contact temperature sensor 10 corresponds to an abnormal pattern.
  • the measurement result of the non-contact temperature sensor 20 may be used. Therefore, when using the temperature measuring device 100 according to the present embodiment, even if the position of the temperature measuring device 100 is changed due to the movement or reversal of the measurement object, the measurement result of the contact type temperature sensor 10 becomes inaccurate. By using the measurement result of the non-contact temperature sensor 20, the temperature of a measurement object can be measured correctly.
  • the processor 30 may control the temperature measuring apparatus 100 to measure the temperature of the measurement target by using the contact temperature sensor 10 (S10).
  • the contact temperature sensor 10 can measure the temperature of the measurement object with high accuracy, in the temperature measuring device 100 according to an embodiment of the present invention, the contact temperature sensor ( 10) may be used preferentially.
  • the contact temperature sensor 10 and the non-contact temperature sensor 20 operate at all times, and the measurement result of the non-contact temperature sensor 20 corresponds to a predetermined abnormal pattern in which the measurement result of the contact temperature sensor 10 is determined. It may be controlled by the processor 30 to be used only when.
  • the contact temperature sensor 10 may operate at all times and the non-contact temperature sensor 20 may operate only when the measurement result of the contact temperature sensor 10 corresponds to a predetermined abnormal pattern. Can be controlled by In addition, in some embodiments, the processor 30 stops the operation of the contact temperature sensor 10 when the measurement result of the contact temperature sensor 10 corresponds to a predetermined abnormal pattern and the non-contact temperature sensor 20 is stopped. Can be operated.
  • the processor 30 may determine whether the result measured by the contact type temperature sensor 10 corresponds to a predetermined abnormal pattern (S20).
  • the temperature measuring device 100 may be fixed to the measurement object or the garment of the measurement object by the frame 50, when the measurement object is moved or flipped, the fixing of the temperature measurement device 100 may be loosened. The contact between the contact temperature sensor 10 and the measurement object may not be made. Therefore, in this case, it may be determined that the measurement result by the contact type temperature sensor 10 corresponds to a predetermined abnormal pattern, which is an inaccurate result.
  • the processor 30 may determine that the measurement result by the contact temperature sensor 10 corresponds to a predetermined abnormal pattern.
  • the body temperature of the infant should be maintained at least 34 degrees Celsius or more. If the measurement result of the contact temperature sensor 10 is measured for 3 minutes or more as the temperature of the measuring object is 34 degrees Celsius or less, Since the temperature sensor 10 is not in contact with the measurement object, the measurement result may be regarded as an inaccurate result.
  • the processor 30 may recognize the result measured by the contact temperature sensor 10 as the temperature of the measurement object. It may be (S30).
  • the processor 30 may determine the result measured by the contact temperature sensor 10 as a reliable result. . Therefore, the processor 30 may recognize the result measured by the contact type temperature sensor 10 as the temperature of the measurement object.
  • the processor 30 measures the temperature of the measurement target by using the non-contact temperature sensor 20. ) Can be controlled (S40).
  • the processor 30 recognizes the result measured by the contact temperature sensor 10 as an inaccurate result, and thus the non-contact temperature.
  • the non-contact temperature sensor 20 may be operated to use the result measured by the sensor 20 as the temperature of the measurement object.
  • the processor 30 may maintain the operation state of the contact temperature sensor 10 even after operating the non-contact temperature sensor 20. Through this, the processor 30 may continuously determine whether the measurement result of the contact type temperature sensor 10 corresponds to a predetermined abnormal pattern, and the fixed position of the temperature measuring device 100 may be adjusted or another method may be used. If the factor that caused the measurement result of the contact temperature sensor 10 to be inaccurate disappears, the processor 30 may use the measurement result of the contact temperature sensor 10.
  • the contact temperature sensor 10 and the non-contact temperature sensor 20 are always operated, and the measurement result of the non-contact temperature sensor 20 is measured in advance. It may be controlled by the processor 30 to be used only in the case of a predetermined abnormal pattern. In some embodiments, the processor 30 stops the operation of the contact temperature sensor 10 and operates the non-contact temperature sensor 20 when the measurement result of the contact temperature sensor 10 corresponds to a predetermined abnormal pattern. You can.
  • the processor 30 may recognize the result measured by the non-contact temperature sensor 20 as the temperature of the measurement target (S45).
  • the processor 30 may recognize the result measured by the non-contact temperature sensor 20 as the temperature of the measurement object.
  • the processor 30 may store or transmit the temperature of the measurement target (S50).
  • the processor 30 stores the measurement result of the non-contact temperature sensor 20 in the storage unit 60 as the temperature of the measurement object or the communication module 40.
  • the temperature measuring apparatus 100 may be controlled to be transmitted to the user terminal 200 through. That is, when the result measured by the contact temperature sensor 10 does not correspond to a predetermined abnormal pattern, the processor 30 recognizes the result measured by the contact temperature sensor 10 as the temperature of the measurement object.
  • the communication module 40 may be controlled to transmit the result measured by the contact type temperature sensor 10 to an external device.
  • the processor 30 stores the measurement result of the contact temperature sensor 10 as the temperature of the measurement object in the storage unit 60 or The temperature measuring device 100 may be controlled to transmit to the user terminal 200 through the communication module 40. That is, when the result measured by the contact temperature sensor 10 corresponds to a predetermined abnormal pattern, the processor 30 recognizes the result measured by the non-contact temperature sensor 20 as the temperature of the measurement object, The communication module 40 may be controlled to transmit the result measured by the non-contact temperature sensor 20 to an external device.
  • the temperature measuring device 100 since both the contact temperature sensor and the non-contact temperature sensor 20 are included, the measurement result of the contact temperature sensor 10 is inaccurate. In this case, by using the measurement result of the non-contact temperature sensor 20, it is possible to accurately measure the temperature of the measurement object.
  • the processor 30 may generate a notification signal.
  • the processor 30 when the result measured by the contact temperature sensor 10 corresponds to a predetermined abnormal pattern, the processor 30 generates a notification signal to the user. The temperature measuring device 100 may be notified that there is a problem.
  • the processor 30 generates an alarm related to a visual alarm, an audio alarm, and a vibration based on the temperature measuring device 100 itself, or transmits a notification signal through the communication module 40 to the user terminal 200.
  • An alarm may be transmitted to the user through the user terminal 200 by transmitting to.
  • the processor 30 may continuously determine whether the measurement result of the contact temperature sensor 10 corresponds to a predetermined abnormal pattern, and the measurement result of the contact temperature sensor 10 is previously determined. When not corresponding to a predetermined abnormal pattern, and the state is maintained for a predetermined time or more, the result measured by the contact temperature sensor 10 can be recognized as the temperature of the measurement object, the non-contact temperature sensor 20 Can be stopped.
  • FIG. 10 a flowchart of the operation of the temperature measuring device 100 according to another embodiment of the present invention is disclosed.
  • the processor 30 controls to measure the temperature of the measurement target using the non-contact temperature sensor 20 (S40), and then the non-contact temperature sensor. It may be determined whether the measurement result by 20 corresponds to a predetermined abnormal pattern (S60).
  • the processor 30 may determine that the measurement result by the non-contact temperature sensor 20 corresponds to a predetermined abnormal pattern, and the contactless type It can be recognized that the measurement result by the temperature sensor 20 is incorrect.
  • the processor 30 may generate an alarm signal when both the result measured by the contact temperature sensor 10 and the result measured by the non-contact temperature sensor 20 correspond to a predetermined abnormal pattern. (S65).
  • the processor 30 may notify the signal. By generating the to inform the user that there is a problem in the temperature measuring device 100.
  • the processor 30 may recognize the result measured by the non-contact temperature sensor 20 as the temperature of the measurement object ( S45).
  • FIG. 11 the operation of the temperature measuring apparatus 100 according to another embodiment of the present invention will be described. However, the differences from the operation of the temperature measuring device 100 according to an embodiment of the present invention will be described mainly. Referring to FIG. 11, a flowchart of the operation of the temperature measuring device 100 according to another embodiment of the present invention is disclosed.
  • the processor 30 controls to measure the temperature of the measurement target using the non-contact temperature sensor 20 (S40), and then the non-contact temperature sensor. It may be determined whether the usage time of 20 exceeds a predetermined time (S61).
  • the temperature of the non-contact temperature sensor 20 may increase as the temperature of the sensor itself decreases as the use time elapses, it is preferable to limit the use time of the non-contact temperature sensor 20 to a predetermined time.
  • an alarm signal is generated (S65) to alert the user to notify that the position adjustment of the temperature measuring device 100 is required or disabled. Therefore, when the use time of the non-contact temperature sensor 20 does not exceed the predetermined time, the result measured by the non-contact temperature sensor may be recognized as the temperature of the measurement object (S45).

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  • Spectroscopy & Molecular Physics (AREA)
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Abstract

A temperature measurement apparatus including dual temperature sensors according to one embodiment of the present invention comprises: a contact-type temperature sensor for measuring the temperature of a subject to be measured; a non-contact-type temperature sensor for measuring the temperature of a subject to be measured; and a processor for, when a result of the measurement by the contact-type temperature sensor corresponds to a predetermined abnormal pattern, recognizing, as the temperature of the subject to be measured, a result of the measurement by the non-contact-type temperature sensor.

Description

듀얼 온도 센서를 포함하는 온도 측정 장치Temperature measuring device with dual temperature sensors
본 발명은 듀얼 온도 센서를 포함하는 온도 측정 장치에 관한 것으로 보다 자세하게는 접촉식 온도 센서와 비접촉식 온도 센서를 이용하여 대상의 온도를 측정할 수 있는 듀얼 온도 센서를 포함하는 온도 측정 장치에 관한 것이다.The present invention relates to a temperature measuring apparatus including a dual temperature sensor, and more particularly, to a temperature measuring apparatus including a dual temperature sensor capable of measuring a target temperature using a contact temperature sensor and a non-contact temperature sensor.
온도 센서는 열을 감지하여 전기신호를 내는 센서로서, 일반적으로 접촉식 온도 센서와 비접촉식 온도 센서로 구분될 수 있다. 접촉식 온도 센서는 실제 측정대상에 센서를 직접 접촉시켜서 온도를 측정하는데, 측정대상의 온도를 정확하게 검출하기 위해서는 충분한 접촉면이 확보되어야 한다. 비접촉식 온도 센서는 측정대상으로부터 방사되는 열선을 측정하는데, 빠른 응답 속도를 가지지만 비접촉식 온도 센서 자체의 온도 상승으로 인해 측정결과가 부정확해질 수도 있다.The temperature sensor is a sensor that detects heat and emits an electrical signal. In general, the temperature sensor may be classified into a contact temperature sensor and a non-contact temperature sensor. The contact temperature sensor measures the temperature by directly contacting the sensor to the actual measurement object. In order to accurately detect the temperature of the measurement object, a sufficient contact surface must be secured. The non-contact temperature sensor measures the hot wire radiated from the object to be measured. Although it has a fast response speed, the measurement result may be inaccurate due to the temperature rise of the non-contact temperature sensor itself.
[선행기술문헌][Preceding technical literature]
(1) 일본특허공보 제5095949호(1) Japanese Patent No. 5095949
온도 측정 장치를 이용하여 영유아의 체온을 일시적으로 측정하는 경우에는 영유아의 체온이 정확하게 측정될 수 있지만, 온도 측정 장치를 이용하여 영유아의 체온을 지속적으로 모니터링하는 경우에는 다음과 같은 문제점이 있을 수 있다.In the case of temporarily measuring the infant's temperature using a temperature measuring device, the infant's body temperature can be accurately measured, but there may be the following problems when the infant's body temperature is continuously monitored using the temperature measuring device. .
접촉식 온도 센서를 포함하는 온도 측정 장치를 이용하여 영유아의 체온을 지속적으로 모니터링하는 경우, 영유아가 뒤척이거나 움직인다면, 기저귀에 고정된 접촉식 온도 센서의 위치가 변경되어 접촉식 온도 센서가 영유아의 체온을 검출하기 위한 충분한 접촉면을 확보하지 못함으로써 온도 측정 장치의 측정결과가 부정확해질 수 있다.In the case of continuous monitoring of the infant's body temperature using a temperature measuring device including a contact temperature sensor, if the infant turns over or moves, the position of the contact temperature sensor fixed to the diaper is changed so that the contact temperature sensor Failure to ensure sufficient contact surface to detect body temperature may result in inaccurate measurement results of the temperature measuring device.
또한, 비접촉식 온도 센서를 포함하는 온도 측정 장치를 이용하여 영유아의 체온을 지속적으로 모니터링하는 경우, 온도 측정 장치의 장시간 사용으로 인하여 비접촉식 온도 센서 자체의 온도 상승으로 인해 온도 측정 장치의 측정결과가 부정확해질 수 있다.In addition, when continuously monitoring the body temperature of infants and toddlers using a temperature measuring device including a non-contact temperature sensor, the measurement results of the temperature measuring device may be inaccurate due to the temperature rise of the non-contact temperature sensor itself due to the long-term use of the temperature measuring device. Can be.
이와 같이 온도 측정 장치의 측정결과가 부정확해진다면, 부모가 영유아의 상태를 정확히 파악하지 못하여 영유아에게 적절한 조치를 해줄 수 없기 때문에, 영유아의 체온을 정확하게 모니터링할 수 있는 방법이 필요하다.If the measurement result of the temperature measuring device is inaccurate as described above, since the parents do not accurately understand the condition of the infant and cannot take appropriate measures for the infant, a method for accurately monitoring the temperature of the infant is needed.
본 발명이 해결하고자 하는 과제는, 접촉식 온도 센서의 측정결과가 부정확한 경우 비접촉식 온도 센서의 측정결과를 이용함으로써, 측정대상의 온도를 정확하게 측정할 수 있는 듀얼 온도 센서를 포함하는 온도 측정 장치를 제공하는 것이다.The problem to be solved by the present invention is a temperature measuring device including a dual temperature sensor that can accurately measure the temperature of the measurement object by using the measurement result of the non-contact temperature sensor when the measurement result of the contact temperature sensor is inaccurate To provide.
본 발명이 해결하고자 하는 다른 과제는, 접촉식 온도 센서가 측정대상에 접촉한 경우 비접촉식 온도 센서는 측정대상에 접촉하지 않도록 함으로써, 측정대상의 온도를 정확하게 측정할 수 있는 형상 또는 구조를 가지는 듀얼 온도 센서를 포함하는 온도 측정 장치를 제공하는 것이다.Another object of the present invention is to provide a dual temperature having a shape or structure that can accurately measure the temperature of the measurement object by not contacting the measurement object when the contact temperature sensor is in contact with the measurement object It is to provide a temperature measuring device including a sensor.
다만, 본 발명이 해결하고자 하는 전술한 내용에 제한되지 않는다.However, the present invention is not limited to the above contents to be solved.
상기 기술적 과제를 해결하기 위한 본 발명의 일 실시예에 따른 듀얼 온도 센서를 포함하는 온도 측정 장치는, 측정대상의 온도를 측정하는 접촉식 온도 센서; 상기 측정대상의 온도를 측정하는 비접촉식 온도 센서; 상기 접촉식 온도 센서에 의해 측정된 결과가 미리 정해진 비정상적인 패턴에 해당하는 경우, 상기 비접촉식 온도 센서에 의해 측정된 결과를 상기 측정대상의 온도로 인식하는 프로세서; 및 상기 온도 측정 장치를 상기 측정대상 또는 상기 측정대상의 의복에 고정시키는 프레임으로서, 상기 접촉식 온도 센서는 상기 프레임의 제1 영역에 위치하고, 상기 비접촉식 온도 센서는 상기 제1 영역으로부터 이격된 상기 프레임의 제2 영역에 위치하는 것인, 프레임을 포함하고, 상기 프레임에서 상기 제1 영역과 상기 제2 영역은 동일 평면 상에 위치하지 않도록 형성되어 상기 접촉식 온도 센서가 위치한 상기 제1 영역이 상기 측정대상에 접촉한 경우 상기 비접촉식 온도 센서가 위치한 상기 제2 영역은 상기 측정대상에 접촉하지 않는다.A temperature measuring device including a dual temperature sensor according to an embodiment of the present invention for solving the technical problem, the contact type temperature sensor for measuring the temperature of the measurement object; Non-contact temperature sensor for measuring the temperature of the measurement object; A processor that recognizes the result measured by the non-contact temperature sensor as the temperature of the measurement object when the result measured by the contact temperature sensor corresponds to a predetermined abnormal pattern; And a frame for fixing the temperature measuring device to the measurement object or the garment of the measurement object, wherein the contact temperature sensor is located in a first area of the frame, and the non-contact temperature sensor is spaced from the first area. And a frame, wherein the first region and the second region are not located on the same plane so that the first region in which the contact temperature sensor is located is located in the second region of the frame. When the measurement object is in contact with the measurement object, the second area in which the non-contact temperature sensor is located does not contact the measurement object.
상기 기술적 과제를 해결하기 위한 본 발명의 다른 실시예에 따른 듀얼 온도 센서를 포함하는 온도 측정 장치는, 굴곡 또는 경사를 갖는 센서면을 포함하는 프레임; 상기 센서면의 제1 영역에 위치하는 접촉식 온도 센서; 및 상기 센서면의 상기 제1 영역으로부터 이격된 상기 센서면의 제2 영역에 위치하는 비접촉식 온도 센서를 포함하고, 상기 프레임에서 상기 제1 영역과 상기 제2 영역은 동일 평면 상에 위치하지 않도록 형성되어 상기 접촉식 온도 센서가 위치한 상기 제1 영역이 측정대상에 접촉한 경우 상기 비접촉식 온도 센서가 위치한 상기 제2 역은 상기 측정대상에 접촉하지 않는다.According to another aspect of the present invention, there is provided a temperature measuring apparatus including a dual temperature sensor, the frame including a sensor surface having a bend or inclination; A contact temperature sensor positioned in the first region of the sensor surface; And a non-contact temperature sensor positioned in a second region of the sensor surface spaced apart from the first region of the sensor surface, wherein the first region and the second region in the frame are not located on the same plane. Thus, when the first region in which the contact temperature sensor is located contacts the measurement object, the second station in which the non-contact temperature sensor is located does not contact the measurement object.
우선, 본 발명에 따르면, 접촉식 온도 센서와 비접촉식 온도 센서가 모두 포함되어 있기 때문에, 접촉식 온도 센서의 측정결과가 부정확한 경우 비접촉식 온도 센서의 측정결과를 이용함으로써, 측정대상의 온도를 정확하게 측정할 수 있다.First, according to the present invention, since both the contact temperature sensor and the non-contact temperature sensor are included, when the measurement result of the contact temperature sensor is inaccurate, the measurement target temperature is accurately measured by using the measurement result of the non-contact temperature sensor. can do.
또한, 본 발명에 따르면, 접촉식 온도 센서가 측정대상에 접촉한 경우 비접촉식 온도 센서는 측정대상에 접촉하지 않도록 하는 형상 또는 구조를 가지고 있으므로, 측정대상의 온도를 정확하게 측정할 수 있다.Further, according to the present invention, since the non-contact temperature sensor has a shape or structure that does not contact the measurement object when the contact temperature sensor is in contact with the measurement object, it is possible to accurately measure the temperature of the measurement object.
본 발명의 효과는 이상에서 언급한 효과들로 제한되지 않으며 이외의 발명의 효과도 청구범위의 기재로부터 명확하게 이해될 수 있다.The effects of the present invention are not limited to the effects mentioned above, and other effects of the present invention can be clearly understood from the description of the claims.
도 1은 본 발명의 일 실시예에 따른 온도 측정 시스템이다.1 is a temperature measuring system according to an embodiment of the present invention.
도 2는 본 발명의 일 실시예에 따른 온도 측정 장치의 구성도이다.2 is a block diagram of a temperature measuring device according to an embodiment of the present invention.
도 3은 본 발명의 일 실시예에 따른 온도 측정 장치의 개략도이다.3 is a schematic diagram of a temperature measuring device according to an embodiment of the present invention.
도 4은 본 발명의 일 실시예에 따른 온도 측정 장치를 측정대상의 의복에 고정시킨 실시예이다4 is an embodiment in which the temperature measuring device according to an embodiment of the present invention is fixed to a garment of a measurement target.
도 5는 본 발명의 다른 실시예에 따른 온도 측정 장치의 개략도이다.5 is a schematic diagram of a temperature measuring device according to another embodiment of the present invention.
도 6은 본 발명의 또 다른 실시예에 따른 온도 측정 장치의 개략도이다.6 is a schematic diagram of a temperature measuring device according to another embodiment of the present invention.
도 7은 본 발명의 또 다른 실시예에 따른 온도 측정 장치의 개략도이다.7 is a schematic diagram of a temperature measuring device according to another embodiment of the present invention.
도 8은 본 발명의 다른 실시예에 따른 온도 측정 장치의 구성도이다.8 is a configuration diagram of a temperature measuring device according to another embodiment of the present invention.
도 9는 본 발명의 일 실시예에 따른 온도 측정 장치의 작동에 관한 순서도이다.9 is a flow chart of the operation of the temperature measuring device according to an embodiment of the present invention.
도 10은 본 발명의 다른 실시예에 따른 온도 측정 장치의 작동에 관한 순서도이다.10 is a flowchart of the operation of the temperature measuring device according to another embodiment of the present invention.
도 11은 본 발명의 또 다른 실시예에 따른 온도 측정 장치의 작동에 관한 순서도이다.11 is a flowchart of the operation of the temperature measuring device according to another embodiment of the present invention.
본 발명의 이점 및 특징, 그리고 그것들을 달성하는 방법은 첨부되는 도면과 함께 상세하게 후술되어 있는 실시예들을 참조하면 명확해질 것이다. 그러나 본 발명은 이하에서 개시되는 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 구현될 것이며, 단지 본 실시예들은 본 발명의 개시가 완전하도록 하며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 발명의 범주를 완전하게 알려주기 위해 제공되는 것이며, 본 발명은 청구항의 범주에 의해 정의될 뿐이다. 아래 첨부된 도면을 참조하여 본 발명의 실시를 위한 구체적인 내용을 상세히 설명한다. 도면에 관계없이 동일한 부재번호는 동일한 구성요소를 지칭하며, "및/또는"은 언급된 아이템들의 각각 및 하나 이상의 모든 조합을 포함한다.Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention, and the general knowledge in the art to which the present invention pertains. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Regardless of the drawings, the same reference numbers refer to the same components, and “and / or” includes each and every combination of one or more of the items mentioned.
본 명세서에서 사용된 용어는 실시예들을 설명하기 위한 것이며 본 발명을 제한하고자 하는 것은 아니다. 본 명세서에서, 단수형은 문구에서 특별히 언급하지 않는 한 복수형도 포함한다. 명세서에서 사용되는 "포함한다(comprises)" 및/또는 "포함하는(comprising)"은 언급된 구성요소 외에 하나 이상의 다른 구성요소의 존재 또는 추가를 배제하지 않는다.The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, "comprises" and / or "comprising" does not exclude the presence or addition of one or more other components in addition to the mentioned components.
다른 정의가 없다면, 본 명세서에서 사용되는 모든 용어(기술 및 과학적 용어를 포함)는 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에게 공통적으로 이해될 수 있는 의미로 사용될 수 있을 것이다. 또 일반적으로 사용되는 사전에 정의되어 있는 용어들은 명백하게 특별히 정의되어 있지 않는 한 이상적으로 또는 과도하게 해석되지 않는다.Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. In addition, the terms defined in the commonly used dictionaries are not ideally or excessively interpreted unless they are specifically defined clearly.
우선, 도 1을 참조하여, 본 발명의 일 실시예에 따른 온도 측정 시스템을 설명한다. 도 1을 참조하면, 본 발명의 일 실시예에 따른 온도 측정 시스템이 도시된다.First, referring to FIG. 1, a temperature measuring system according to an embodiment of the present invention will be described. Referring to FIG. 1, there is shown a temperature measuring system in accordance with an embodiment of the present invention.
온도 측정 시스템은 측정대상의 온도를 측정하고 모니터링하는 시스템이며, 온도 측정 장치(100)와 사용자 단말(200)을 포함할 수 있다. 여기서, 측정대상은 영유아일 수 있고, 온도 측정 시스템은 측정대상의 체온을 측정하고 모니터링하는 시스템일 수 있지만, 이에 제한되지 않는다.The temperature measuring system is a system for measuring and monitoring a temperature of a measurement target, and may include a temperature measuring device 100 and a user terminal 200. Here, the measurement target may be an infant, and the temperature measuring system may be a system for measuring and monitoring the body temperature of the measurement target, but is not limited thereto.
온도 측정 장치(100)는 측정대상의 온도를 지속적으로 측정하고, 측정결과를 사용자 단말(200)에 전송할 수 있다. 측정대상의 온도를 측정하기 위해 온도 측정 장치(100)는 측정대상 자체에 고정되거나 측정대상의 온도를 측정할 수 있도록 측정대상의 의복(예컨대, 기저귀 등)에 고정될 수 있다. 온도 측정 장치(100)의 구성, 형상 또는 작동에 대해서는 후술한다.The temperature measuring apparatus 100 may continuously measure the temperature of the measurement target and transmit the measurement result to the user terminal 200. In order to measure the temperature of the measurement object, the temperature measuring device 100 may be fixed to the garment (eg, diaper, etc.) of the measurement object so as to be fixed to the measurement object itself or to measure the temperature of the measurement object. The configuration, shape, or operation of the temperature measuring device 100 will be described later.
구체적으로, 도 1을 참조하면, 온도 측정 장치(100)가 측정대상의 의복에 고정되는 것과 관련하여, 온도 측정 장치(100)는 기저귀, 팬티 또는 바지 등의 하의에서 허리밴드 또는 벨트라인이 형성되는 영역에 고정될 수 있으며, 고정된 채로 측정대상의 온도를 지속적으로 측정하여 모니터링할 수 있다.Specifically, referring to Figure 1, in connection with the temperature measuring device 100 is fixed to the garment of the measurement object, the temperature measuring device 100 is formed in the waistband or belt line under the diaper, panties or pants, etc. It can be fixed in the area, and can be monitored by continuously measuring the temperature of the measurement object while being fixed.
사용자 단말(200)은 온도 측정 장치(100)로부터 측정결과를 전송받아 측정대상의 온도를 모니터링할 수 있다. 사용자 단말(200)은 예컨대, 스마트폰 또는 태블릿 PC 등이 될 수 있지만, 온도 측정 장치(100)로부터 측정결과를 전송받을 수 있다면 사용자 단말(200)의 종류가 제한되지 않는다. 그리고, 온도 측정 장치(100)로부터 전송된 측정결과를 이용하여 측정대상에 대한 모니터링 정보를 생성하고 이를 표시하도록 사용자 단말(200)을 제어하는 어플리케이션이 사용자 단말(200) 내에 설치될 수 있다.The user terminal 200 may receive the measurement result from the temperature measuring device 100 and monitor the temperature of the measurement target. The user terminal 200 may be, for example, a smartphone or a tablet PC, but the type of the user terminal 200 is not limited as long as it can receive the measurement result from the temperature measuring device 100. In addition, an application for controlling the user terminal 200 to generate and display monitoring information about a measurement object using the measurement result transmitted from the temperature measuring apparatus 100 may be installed in the user terminal 200.
본 실시예의 온도 측정 시스템에 따르면, 사용자는 매번 측정대상의 온도를 측정하지 않더라도, 온도 측정 장치(100)로부터 전송되는 측정결과를 사용자 단말(200)을 통해 확인할 수 있으며, 사용자가 측정대상으로부터 떨어져 있더라도 측정대상의 온도를 용이하게 모니터링할 수 있다.According to the temperature measuring system of the present embodiment, even if the user does not measure the temperature of the measurement object every time, the user can check the measurement result transmitted from the temperature measuring device 100 through the user terminal 200, and the user is separated from the measurement object. Even if it is, the temperature of the measurement object can be easily monitored.
몇몇 실시예에서 온도 측정 장치(100)의 측정결과가 온도 측정 장치(100)로부터 사용자 단말(200)로 직접 전송되지 않고, 중간에 서버(미도시)를 거쳐서 사용자 단말(200)에 전송될 수도 있다. 예컨대, 온도 측정 장치(100)의 측정결과가 온도 측정 장치(100)로부터 서버(미도시)로 전송될 수 있고, 해당 서버(미도시)로부터 측정결과가 사용자 단말(200)로 전송될 수 있다.In some embodiments, the measurement result of the temperature measuring device 100 may not be directly transmitted from the temperature measuring device 100 to the user terminal 200, but may be transmitted to the user terminal 200 via a server (not shown). have. For example, the measurement result of the temperature measuring apparatus 100 may be transmitted from the temperature measuring apparatus 100 to a server (not shown), and the measurement result may be transmitted to the user terminal 200 from the corresponding server (not shown). .
이하, 도 2 내지 도 5를 참조하여, 본 발명의 일 실시예에 따른 온도 측정 장치(100)를 설명한다. 도 2를 참조하면, 본 발명의 일 실시예에 따른 온도 측정 장치(100)의 구성도가 개시되고, 도 3을 참조하면, 본 발명의 일 실시예에 따른 온도 측정 장치(100)의 개략도가 개시되고, 도 4를 참조하면, 본 발명의 일 실시예에 따른 온도 측정 장치(100)를 측정대상의 의복에 고정시킨 실시예가 개시되고, 도 5를 참조하면, 본 발명의 다른 실시예에 따른 온도 측정 장치(100)의 개략도가 개시된다.Hereinafter, the temperature measuring device 100 according to an embodiment of the present invention will be described with reference to FIGS. 2 to 5. Referring to FIG. 2, a schematic diagram of a temperature measuring apparatus 100 according to an embodiment of the present invention is disclosed. Referring to FIG. 3, a schematic diagram of a temperature measuring apparatus 100 according to an embodiment of the present invention is provided. 4, an embodiment in which the temperature measuring device 100 according to an embodiment of the present invention is fixed to a garment to be measured is disclosed. Referring to FIG. 5, an embodiment according to another embodiment of the present invention is described. A schematic diagram of the temperature measuring device 100 is disclosed.
도 2를 참조하면, 본 발명의 일 실시예에 따른 온도 측정 장치(100)는 접촉식 온도 센서(10), 비접촉식 온도 센서(20), 프로세서(30), 통신모듈(40) 및 프레임(50)을 포함할 수 있다. 즉, 온도 측정 장치(100)는 듀얼 센서로서 접촉식 온도 센서(10)와 비접촉식 온도 센서(20)를 동시에 포함할 수 있다. 다만, 몇몇 실시예에 따른 온도 측정 장치(100)는 도 2에 포함된 구성보다 더 많은 구성을 포함하거나 더 적은 구성을 포함할 수도 있다.2, the temperature measuring device 100 according to an embodiment of the present invention is a contact temperature sensor 10, a non-contact temperature sensor 20, the processor 30, the communication module 40 and the frame 50 ) May be included. That is, the temperature measuring device 100 may include a contact temperature sensor 10 and a non-contact temperature sensor 20 simultaneously as dual sensors. However, the temperature measuring device 100 according to some embodiments may include more or less components than those included in FIG. 2.
우선, 접촉식 온도 센서(10)는 측정대상의 온도를 측정할 수 있으며, 예컨대 프레임(50)의 제1 영역에 위치할 수 있다. 접촉식 온도 센서(10)과 측정대상 사이의 충분한 접촉면이 확보되어야 하기 때문에, 프레임(50)이 측정대상 또는 측정대상의 의복에 고정되면, 프레임(50)의 제1 영역에 위치한 접촉식 온도 센서(10)는 측정대상에 접촉할 수 있다.First, the contact temperature sensor 10 may measure the temperature of the measurement object, and may be located in the first region of the frame 50, for example. Since a sufficient contact surface between the contact temperature sensor 10 and the measurement object must be secured, when the frame 50 is fixed to the measurement object or the garment of the measurement object, the contact temperature sensor located in the first area of the frame 50 (10) may contact the measurement object.
비접촉식 온도 센서(20)는 측정대상의 온도를 측정할 수 있으며, 예컨대 제1 영역으로부터 이격된 프레임(50)의 제2 영역에 위치할 수 있다. 비접촉식 온도 센서(20)는 측정대상에 접촉하지 않은 상태에서 측정대상의 온도를 측정해야 하기 때문에, 프레임(50)이 측정대상 또는 측정대상의 의복에 고정되면, 프레임(50)의 제2 영역에 위치한 비접촉식 온도 센서(20)는 측정대상에 접촉하지 않을 수 있다.The non-contact temperature sensor 20 may measure the temperature of the measurement object, and may be located in a second area of the frame 50 spaced apart from the first area, for example. Since the non-contact temperature sensor 20 needs to measure the temperature of the measurement object without contacting the measurement object, when the frame 50 is fixed to the measurement object or the garment of the measurement object, the non-contact temperature sensor 20 measures the second area of the frame 50. The positioned non-contact temperature sensor 20 may not contact the measurement object.
프로세서(30)는 온도 측정 장치(100)의 작동을 제어할 수 있다. 온도 측정 장치(100)가 접촉식 온도 센서(10)와 비접촉식 온도 센서(20)를 모두 포함하기 때문에, 프로세서(30)는 접촉식 온도 센서(10)와 비접촉식 온도 센서(20) 각각을 언제 작동시킬지 여부, 접촉식 온도 센서(10)와 비접촉식 온도 센서(20) 중 어느 온도 센서로부터 측정된 결과를 측정대상의 온도로 인식할 것인지 여부 등을 결정할 수 있다.The processor 30 may control the operation of the temperature measuring device 100. Since the temperature measuring device 100 includes both the contact temperature sensor 10 and the non-contact temperature sensor 20, the processor 30 operates each of the contact temperature sensor 10 and the non-contact temperature sensor 20 at any time. Whether or not, whether or not the temperature sensor of the contact temperature sensor 10 and the non-contact temperature sensor 20 to recognize the result of the measurement as the temperature of the measurement object can be determined.
통신모듈(40)은 사용자 단말(200)을 포함하는 외부 장치와 통신이 가능하다. 통신모듈(40)은 유선 통신 방식 및/또는 무선 통신 방식을 지원할 수 있다. 유선 통신 방식으로는 USB 2.0을 예로 들 수 있다. 그리고 무선 통신 방식으로는 와이브로(Wireless Broadband Internet), 와이파이(WiFi), 지그비(ZIGBEE), 블루투스(Bluetooth), 울트라와이드밴드(Ultra Wide Band, UWB), 근거리무선통신(Near Field Communication, NFC), 3세대 이동 통신(3G), 4세대 이동 통신(4G), 및 5세대 이동 통신(5G)을 예로 들 수 있지만, 이에 제한되지 않는다.The communication module 40 may communicate with an external device including the user terminal 200. The communication module 40 may support a wired communication method and / or a wireless communication method. For example, USB 2.0 is a wired communication method. Wireless communication methods include Wireless Broadband Internet, Wi-Fi, ZIGBEE, Bluetooth, Ultra Wide Band (UWB), Near Field Communication (NFC), Examples include, but are not limited to, third generation mobile communication (3G), fourth generation mobile communication (4G), and fifth generation mobile communication (5G).
프레임(50)은 본 실시예에 따른 온도 측정 장치(100)가 측정대상의 온도를 측정할 수 있도록 온도 측정 장치(100)를 측정대상 또는 측정대상의 의복에 고정시킬 수 있다. 예컨대, 프레임(50)은 측정대상의 의복에 고정될 수 있도록 클립(clip) 형상일 수 있지만, 프레임(50)을 측정대상 또는 측정대상의 의복에 고정시키는 방법은 이에 제한되지 않는다.The frame 50 may fix the temperature measuring device 100 to the measurement target or the garment of the measurement target so that the temperature measuring device 100 according to the present embodiment can measure the temperature of the measurement target. For example, the frame 50 may have a clip shape to be fixed to the garment of the measurement target, but the method of fixing the frame 50 to the measurement target or the garment of the measurement target is not limited thereto.
그리고 접촉식 온도 센서(10)는 프레임(50)의 제1 영역에 위치하고, 비접촉식 온도 센서(20)는 제1 영역으로부터 이격된 프레임(50)의 제2 영역에 위치할 수 있으며, 프레임(50)은 접촉식 온도 센서(10)가 위치한 제1 영역이 측정대상에 접촉한 경우 비접촉식 온도 센서(20)가 위치한 제2 영역은 측정대상에 접촉하지 않도록 형성될 수 있다. 이와 같이, 프레임(50)이 형성되는 이유는, 온도 측정 장치(100)가 측정대상 또는 측정대상의 의복에 고정된 상태에서, 접촉식 온도 센서(10)는 측정대상의 온도를 정밀하게 측정하기 위해 측정대상과 접촉을 필요로 하고, 비접촉식 온도 센서(20)는 측정대상의 온도를 정밀하게 측정하기 위해 측정대상으로부터 거리를 유지하는 것을 필요로 하기 때문이다.The contact temperature sensor 10 may be located in a first area of the frame 50, the non-contact temperature sensor 20 may be located in a second area of the frame 50 spaced apart from the first area, and the frame 50 may be located in the first area of the frame 50. ) May be formed so that the second area in which the non-contact temperature sensor 20 is positioned does not contact the measurement object when the first area in which the contact temperature sensor 10 is located touches the measurement object. As such, the reason why the frame 50 is formed is that the contact type temperature sensor 10 measures the temperature of the measurement object precisely while the temperature measuring device 100 is fixed to the measurement object or the garment of the measurement object. This is because the contact with the object to be measured is necessary, and the non-contact temperature sensor 20 needs to maintain a distance from the object to measure the temperature of the object to be precisely measured.
도 3을 참조하면, 몇몇 실시예에서, 프레임(50)은 적어도 일부에 굴곡 또는 경사를 갖는 센서면(51)을 포함할 수 있으며, 접촉식 온도 센서(10)는 센서면(51)의 제1 영역에 위치하고, 비접촉식 온도 센서(20)는 센서면(51)의 제1 영역으로부터 이격된 센서면(51)의 제2 영역에 위치할 수 있다. 본 실시예에 따르면, 센서면(51)은 굴곡 또는 경사를 포함하고, 접촉식 온도 센서(10)와 비접촉식 온도 센서(20)가 센서면(51) 상에서 서로 이격되어 위치하기 때문에, 온도 측정 장치(100)가 측정대상 또는 측정대상의 의복에 고정된 상태에서 접촉식 온도 센서(10)가 위치한 제1 영역이 측정대상과 접촉하더라도, 센서면(51)의 굴곡 또는 경사로 인해 센서면(51)의 일부 영역(예컨대, 제2 영역)이 측정대상으로부터 이격되어 측정대상에 접촉하지 않을 수 있다.Referring to FIG. 3, in some embodiments, the frame 50 may include a sensor surface 51 having at least a portion of flexion or inclination, and the contact temperature sensor 10 may be formed of the sensor surface 51. The non-contact temperature sensor 20 may be located in one region and may be located in a second region of the sensor surface 51 spaced apart from the first region of the sensor surface 51. According to the present embodiment, the sensor surface 51 includes a bend or inclination, and because the contact temperature sensor 10 and the non-contact temperature sensor 20 are spaced apart from each other on the sensor surface 51, the temperature measuring device Even if the first area in which the contact temperature sensor 10 is positioned is in contact with the measurement object while the 100 is fixed to the object to be measured or the garment of the object to be measured, the sensor surface 51 due to the bending or inclination of the sensor surface 51. Some regions of the second region (eg, the second region) may be spaced apart from the measurement object and do not contact the measurement object.
한편, 센서면(51)의 적어도 일부에는 실리콘(예컨대, 의료용 실리콘)이 도포되어 있을 수 있으며, 온도 측정 장치(100)가 측정대상에 고정된 경우 센서면(51)은 측정대상과 맞닿게 되는데, 이 때 센서면(51)에 형성된 실리콘으로 인해 측정대상과 우수하게 밀착될 수 있으므로, 이를 통해 접촉식 온도 센서(10)가 측정대상과 접촉하는 충분한 접촉면을 확보할 수 있다.On the other hand, at least a portion of the sensor surface 51 may be coated with silicon (for example, medical silicone), and when the temperature measuring device 100 is fixed to the measurement object, the sensor surface 51 comes into contact with the measurement object. At this time, since the silicon formed on the sensor surface 51 may be in close contact with the measurement object, the contact temperature sensor 10 may secure a sufficient contact surface through which the contact object is measured.
도 3 및 도 4를 참조하면, 프레임(50)은 예컨대 U자 형상을 가질 수 있으며, 프레임(50)의 개구부(53)에 의복(예컨대, 하의)의 허리밴드 또는 벨트라인이 삽입됨으로써 온도 측정 장치(100)가 측정대상의 의복에 고정될 수 있다.3 and 4, the frame 50 may have a U-shape, for example, and the temperature is measured by inserting a waistband or a belt line of a garment (eg, a bottom) into an opening 53 of the frame 50. The device 100 may be fixed to the garment of the measurement object.
온도 측정 장치(100)가 측정대상에 고정된 상태를 살펴보면, 온도 측정 장치(100)는 센서면(51)이 측정대상을 향한 상태에서 의복의 허리밴드 또는 벨트라인에 고정된 채로 측정대상에 밀착해 있다. 즉, 온도 측정 장치(100)가 의복의 허리밴드 또는 벨트라인에 고정되고, 의복의 허리밴드 또는 벨트라인이 측정대상에 조여져서 밀착된 상태를 유지함에 따라 접촉식 온도 센서(10)는 측정대상에 지속적으로 접촉한 상태를 유지할 수 있다. 따라서, 본 실시예에 따른 온도 측정 장치(100)에 따르면, 접촉식 온도 센서(10)는 측정대상의 온도를 측정할 수 있는 충분한 측정면을 확보할 수 있다.Looking at the state in which the temperature measuring device 100 is fixed to the measurement object, the temperature measuring device 100 is in close contact with the measurement object while being fixed to the waistband or belt line of the garment while the sensor surface 51 faces the measurement object. It is done. That is, as the temperature measuring device 100 is fixed to the waistband or belt line of the garment, the waistband or beltline of the garment is tightened to the measurement object to maintain a close state as the contact type temperature sensor 10 is measured. You can stay in contact with Therefore, according to the temperature measuring apparatus 100 according to the present embodiment, the contact type temperature sensor 10 can secure a sufficient measuring surface for measuring the temperature of the measurement target.
그리고 센서면(51)은 측정대상으로부터 멀어지는 방향으로 굴곡 또는 경사면과 평면을 포함하며, 접촉식 온도 센서(10)는 센서면(51) 중 평면에 배치되고 비접촉식 온도 센서(20)는 센서면(51) 중 경사면에 배치될 수 있다. 따라서, 본 실시예에 따르면 온도 측정 장치(100)에 따르면, 비접촉식 온도 센서(20)는 측정대상으로부터 이격된 상태로 측정대상 또는 측정대상의 의복에 고정될 수 있기 때문에, 비접촉식 온도 센서(20)가 측정대상의 온도를 측정할 수 있는 공간을 충분히 확보할 수 있다.In addition, the sensor surface 51 includes a curved or inclined surface and a plane in a direction away from the measurement object, the contact temperature sensor 10 is disposed in the plane of the sensor surface 51 and the non-contact temperature sensor 20 is a sensor surface ( 51) may be disposed on an inclined surface. Therefore, according to the present embodiment, according to the temperature measuring device 100, since the non-contact temperature sensor 20 can be fixed to the measurement target or the garment of the measurement target in a state spaced apart from the measurement target, the non-contact temperature sensor 20 It is possible to secure a sufficient space for measuring the temperature of the measurement object.
한편, 본 발명의 일 실시예에 따른 온도 측정 장치(100)에서, 온도 측정 장치(100)가 측정대상에 고정된 상태에서 비접촉식 온도 센서(20)가 접촉식 온도 센서(10)에 비해 상대적으로 상부 영역에 위치해 있지만, 몇몇 실시예에서 온도 측정 장치(100)가 측정대상에 고정된 상태에서 접촉식 온도 센서(10)가 비접촉식 온도 센서(20)에 비해 상대적으로 상부 영역에 위치할 수도 있다.On the other hand, in the temperature measuring device 100 according to an embodiment of the present invention, the non-contact temperature sensor 20 is relatively compared to the contact temperature sensor 10 in a state where the temperature measuring device 100 is fixed to the measurement object. Although located in the upper region, in some embodiments the contact temperature sensor 10 may be located in the upper region relative to the non-contact temperature sensor 20 with the temperature measuring device 100 fixed to the measurement object.
이하, 도 5를 참조하여, 본 발명의 다른 실시예에 따른 온도 측정 장치를 설명한다. 다만, 본 발명의 일 실시예에 따른 온도 측정 장치와의 차이점을 위주로 설명한다. 도 5를 참조하면, 본 발명의 다른 실시예에 따른 온도 측정 장치의 개략도가 도시된다.Hereinafter, a temperature measuring device according to another embodiment of the present invention will be described with reference to FIG. 5. However, the differences from the temperature measuring device according to an embodiment of the present invention will be mainly described. 5, there is shown a schematic diagram of a temperature measuring device according to another embodiment of the present invention.
도 5를 참조하면, 본 발명의 다른 실시예에 따른 온도 측정 장치(100)에 따르면, 접촉식 온도 센서(10)가 비접촉식 온도 센서(20)의 인접 영역에 형성되지 않고, 상당히 이격되어 형성될 수 있으며, 접촉식 온도 센서(10)가 센서면(51) 중 실리콘(52)이 형성된 영역에 위치할 수도 있다.Referring to FIG. 5, according to the temperature measuring device 100 according to another embodiment of the present invention, the contact temperature sensor 10 is not formed in an adjacent region of the non-contact temperature sensor 20, and is formed to be spaced apart considerably. In addition, the contact temperature sensor 10 may be located in the region where the silicon 52 is formed in the sensor surface 51.
이하, 도 6을 참조하여, 본 발명의 또 다른 실시예에 따른 온도 측정 장치를 설명한다. 다만, 본 발명의 일 실시예에 따른 온도 측정 장치와의 차이점을 위주로 설명한다. 도 6을 참조하면, 본 발명의 또 다른 실시예에 따른 온도 측정 장치의 개략도가 도시된다.Hereinafter, a temperature measuring device according to another embodiment of the present invention will be described with reference to FIG. 6. However, the differences from the temperature measuring device according to an embodiment of the present invention will be mainly described. 6, there is shown a schematic diagram of a temperature measuring device according to another embodiment of the present invention.
도 6을 참조하면, 본 발명의 다른 실시예에 따른 온도 측정 장치(100)는 제1 및 제2 센서면(51a, 51b)를 포함할 수 있으며, 접촉식 온도 센서(10)는 제1 센서면(51a) 상에 형성되고 비접촉식 온도 센서(20)는 제2 센서면(51b) 상에 형성될 수 있다.Referring to FIG. 6, the temperature measuring device 100 according to another embodiment of the present invention may include first and second sensor surfaces 51a and 51b, and the contact temperature sensor 10 may include a first sensor. The non-contact temperature sensor 20 may be formed on the surface 51a and may be formed on the second sensor surface 51b.
여기서, 제1 센서면(51a)은 제2 센서면(51b)에 비해 상대적으로 돌출되어 있으며, 즉, 제2 센서면(51b)은 제1 센서면(51a)에 비해 상대적으로 침강할 수 있다. 이에 따라, 온도 측정 장치(100)가 측정대상의 의복에 고정된 경우, 상대적으로 돌출된 제1 센서면(51a) 상에 형성된 접촉식 온도 센서(10)는 측정대상에 접촉하여 충분한 접촉면을 확보할 수 있으며, 상대적으로 밑으로 가라앉은 제2 센서면(51b) 상에 형성된 비접촉식 온도 센서(20)는 측정대상과의 충분한 이격거리를 확보할 수 있다.Here, the first sensor surface 51a may protrude relative to the second sensor surface 51b, that is, the second sensor surface 51b may settle relative to the first sensor surface 51a. . Accordingly, when the temperature measuring device 100 is fixed to the garment of the measurement target, the contact type temperature sensor 10 formed on the relatively protruding first sensor surface 51a contacts the measurement target to secure a sufficient contact surface. In addition, the non-contact temperature sensor 20 formed on the second sensor surface 51b that is relatively sinking down can secure a sufficient separation distance from the measurement object.
한편, 본 발명의 다른 실시예에 따른 온도 측정 장치(100)에서 실리콘(52)은 제1 센서면(51a)에 형성될 수 있다.Meanwhile, in the temperature measuring apparatus 100 according to another embodiment of the present invention, the silicon 52 may be formed on the first sensor surface 51a.
이하, 도 7을 참조하여, 본 발명의 또 다른 실시예에 따른 온도 측정 장치를 설명한다. 다만, 본 발명의 일 실시예에 따른 온도 측정 장치와의 차이점을 위주로 설명한다. 도 7을 참조하면, 본 발명의 또 다른 실시예에 따른 온도 측정 장치의 개략도가 도시된다.Hereinafter, a temperature measuring device according to still another embodiment of the present invention will be described with reference to FIG. 7. However, the differences from the temperature measuring device according to an embodiment of the present invention will be mainly described. Referring to Fig. 7, a schematic diagram of a temperature measuring device according to another embodiment of the present invention is shown.
도 7을 참조하면, 센서면(51)은 측정대상으로부터 멀어지는 방향으로 굴곡 또는 경사를 가지고, 비접촉식 온도 센서(20)는 접촉식 온도 센서(10)에 비해 상대적으로 아래 부분에 위치하기 때문에, 비접촉식 온도 센서(20)는 센서면(51) 중 측정대상으로부터 이격된 영역에 위치할 수 있다. 따라서, 본 실시예에 따르면 온도 측정 장치(100)에 따르면, 비접촉식 온도 센서(20)는 측정대상으로부터 이격된 상태로 측정대상 또는 측정대상의 의복에 고정될 수 있기 때문에, 비접촉식 온도 센서(20)가 측정대상의 온도를 측정할 수 있는 공간을 충분히 확보할 수 있다.Referring to FIG. 7, the sensor surface 51 has a bend or inclination in a direction away from the measurement object, and the non-contact temperature sensor 20 is located at a lower portion relative to the contact temperature sensor 10. The temperature sensor 20 may be located in an area of the sensor surface 51 spaced apart from the measurement object. Therefore, according to the present embodiment, according to the temperature measuring device 100, since the non-contact temperature sensor 20 can be fixed to the measurement target or the garment of the measurement target in a state spaced apart from the measurement target, the non-contact temperature sensor 20 It is possible to secure a sufficient space for measuring the temperature of the measurement object.
이하, 도 8을 참조하여, 본 발명의 다른 실시예에 따른 온도 측정 장치(100)를 설명한다. 다만, 본 발명의 일 실시예에 따른 온도 측정 장치(100)와의 차이점을 위주로 설명한다. 도 8을 참조하면, 본 발명의 다른 실시예에 따른 온도 측정 장치(100)의 구성도가 개시된다.Hereinafter, a temperature measuring device 100 according to another embodiment of the present invention will be described with reference to FIG. 8. However, the difference from the temperature measuring device 100 according to an embodiment of the present invention will be described mainly. Referring to FIG. 8, a configuration diagram of a temperature measuring device 100 according to another embodiment of the present invention is disclosed.
도 8을 참조하면, 본 발명의 다른 실시예에 따른 온도 측정 장치(100)는 저장부(60)를 더 포함할 수 있다. 저장부(60)는 접촉식 온도 센서(10)의 측정결과와 비접촉식 온도 센서(20)의 측정결과를 포함한 다양한 정보가 저장될 수 있다.Referring to FIG. 8, the temperature measuring device 100 according to another embodiment of the present invention may further include a storage unit 60. The storage unit 60 may store various information including the measurement result of the contact type temperature sensor 10 and the measurement result of the non-contact temperature sensor 20.
몇몇 실시예에서 접촉식 온도 센서(10)의 측정결과 또는 비접촉식 온도 센서(20)의 측정 결과가 통신모듈(40)을 통해 사용자 단말(200)로 실시간으로 전송되지 않을 수 있다. 예컨대, 통신모듈(40)에 의한 통신이 불가능한 경우, 접촉식 온도 센서(10)의 측정결과 또는 비접촉식 온도 센서(20)의 측정결과는 저장부(60)에 저장될 수 있으며, 이후에 통신모듈(40)에 이한 통신이 가능해지는 경우 사용자 단말(200)로 전송될 수 있다. 그리고, 사용자의 선택에 따라 프로세서(30)는 접촉식 온도 센서(10)의 측정결과 또는 비접촉식 온도 센서(20)의 측정결과가 사용자 단말(200)로 전송되지 않고 저장부(60)에 저장되도록 온도 측정 장치(100)를 제어할 수도 있다.In some embodiments, the measurement result of the contact temperature sensor 10 or the measurement result of the non-contact temperature sensor 20 may not be transmitted in real time to the user terminal 200 through the communication module 40. For example, when communication by the communication module 40 is impossible, the measurement result of the contact temperature sensor 10 or the measurement result of the non-contact temperature sensor 20 may be stored in the storage unit 60, after which the communication module When the communication of 40 is enabled, it may be transmitted to the user terminal 200. In addition, according to a user's selection, the processor 30 may store the measurement result of the contact temperature sensor 10 or the measurement result of the non-contact temperature sensor 20 in the storage unit 60 without being transmitted to the user terminal 200. The temperature measuring device 100 may be controlled.
이하, 도 9를 참조하여, 본 발명의 일 실시예에 따른 온도 측정 장치(100)의 작동을 설명한다. 도 9를 참조하면, 본 발명의 일 실시예에 따른 온도 측정 장치(100)의 작동에 관한 순서도가 개시된다.Hereinafter, an operation of the temperature measuring device 100 according to an embodiment of the present invention will be described with reference to FIG. 9. 9, a flowchart of the operation of the temperature measuring apparatus 100 according to an embodiment of the present invention is disclosed.
본 발명의 일 실시예에 따른 온도 측정 장치(100)에서 측정대상의 온도를 측정하기 위해 접촉식 온도 센서(10)가 먼저 이용되고, 접촉식 온도 센서(10)의 측정결과가 비정상적인 패턴에 해당하는 경우 비접촉식 온도 센서(20)의 측정결과가 이용될 수 있다. 따라서, 본 실시예에 따른 온도 측정 장치(100)를 이용하면, 측정대상의 움직임 또는 뒤척임으로 인해 온도 측정 장치(100)의 위치가 변경되어 접촉식 온도 센서(10)의 측정결과가 부정확해지더라도 비접촉식 온도 센서(20)의 측정결과를 이용함으로써 측정대상의 온도를 정확하게 측정할 수 있다.In order to measure the temperature of the measurement target in the temperature measuring device 100 according to an embodiment of the present invention, the contact temperature sensor 10 is first used, and the measurement result of the contact temperature sensor 10 corresponds to an abnormal pattern. In this case, the measurement result of the non-contact temperature sensor 20 may be used. Therefore, when using the temperature measuring device 100 according to the present embodiment, even if the position of the temperature measuring device 100 is changed due to the movement or reversal of the measurement object, the measurement result of the contact type temperature sensor 10 becomes inaccurate. By using the measurement result of the non-contact temperature sensor 20, the temperature of a measurement object can be measured correctly.
구체적으로, 도 9를 참조하면, 우선, 프로세서(30)는 접촉식 온도 센서(10)를 이용하여 측정대상의 온도를 측정하도록 온도 측정 장치(100)를 제어할 수 있다(S10).Specifically, referring to FIG. 9, first, the processor 30 may control the temperature measuring apparatus 100 to measure the temperature of the measurement target by using the contact temperature sensor 10 (S10).
접촉식 온도 센서(10)는 높은 정확도로 측정대상의 온도를 측정할 수 있기 때문에, 본 발명의 일 실시예에 따른 온도 측정 장치(100)에서, 측정대상의 온도 측정을 위해 접촉식 온도 센서(10)가 우선적으로 이용될 수 있다. 몇몇 실시예에서 접촉식 온도 센서(10)와 비접촉식 온도 센서(20)는 상시 작동하고, 비접촉식 온도 센서(20)의 측정결과는 접촉식 온도 센서(10)의 측정결과가 미리 정해진 비정상적인 패턴에 해당하는 경우에만 이용되도록 프로세서(30)에 의해 제어될 수 있다.Since the contact temperature sensor 10 can measure the temperature of the measurement object with high accuracy, in the temperature measuring device 100 according to an embodiment of the present invention, the contact temperature sensor ( 10) may be used preferentially. In some embodiments, the contact temperature sensor 10 and the non-contact temperature sensor 20 operate at all times, and the measurement result of the non-contact temperature sensor 20 corresponds to a predetermined abnormal pattern in which the measurement result of the contact temperature sensor 10 is determined. It may be controlled by the processor 30 to be used only when.
그리고 몇몇 실시예에서 접촉식 온도 센서(10)는 상시 작동할 수 있고 비접촉식 온도 센서(20)는 접촉식 온도 센서(10)의 측정결과가 미리 정해진 비정상적인 패턴에 해당하는 경우에만 작동하도록 프로세서(30)에 의해 제어될 수 있다. 이 밖에, 몇몇 실시예에서 프로세서(30)는 접촉식 온도 센서(10)의 측정결과가 미리 정해진 비정상적인 패턴에 해당하는 경우에 접촉식 온도 센서(10)의 작동을 중지하고 비접촉식 온도 센서(20)를 작동시킬 수 있다.In some embodiments, the contact temperature sensor 10 may operate at all times and the non-contact temperature sensor 20 may operate only when the measurement result of the contact temperature sensor 10 corresponds to a predetermined abnormal pattern. Can be controlled by In addition, in some embodiments, the processor 30 stops the operation of the contact temperature sensor 10 when the measurement result of the contact temperature sensor 10 corresponds to a predetermined abnormal pattern and the non-contact temperature sensor 20 is stopped. Can be operated.
이어서, 프로세서(30)는 접촉식 온도 센서(10)에 의해 측정된 결과가 미리 정해진 비정상적인 패턴에 해당하는지 여부를 판단할 수 있다(S20).Subsequently, the processor 30 may determine whether the result measured by the contact type temperature sensor 10 corresponds to a predetermined abnormal pattern (S20).
온도 측정 장치(100)가 프레임(50)에 의해 측정대상 또는 측정대상의 의복에 고정될 수 있지만, 측정대상이 움직이거나 뒤척이는 경우, 온도 측정 장치(100)의 고정이 느슨해 질 수 있으며, 이로 인해 접촉식 온도 센서(10)와 측정대상 사이의 접촉이 이루어지지 않을 수도 있다. 따라서, 이러한 경우, 접촉식 온도 센서(10)에 의한 측정결과가 미리 정해진 비정상적인 패턴에 해당하여, 부정확한 결과인 것으로 판단될 수 있다.Although the temperature measuring device 100 may be fixed to the measurement object or the garment of the measurement object by the frame 50, when the measurement object is moved or flipped, the fixing of the temperature measurement device 100 may be loosened. The contact between the contact temperature sensor 10 and the measurement object may not be made. Therefore, in this case, it may be determined that the measurement result by the contact type temperature sensor 10 corresponds to a predetermined abnormal pattern, which is an inaccurate result.
예컨대, 측정대상의 온도가 미리 정해진 온도 이하로 미리 정해진 시간 이상 유지되는 경우, 프로세서(30)는 접촉식 온도 센서(10)에 의한 측정결과가 미리 정해진 비정상적인 패턴에 해당하는 것으로 판단할 수 있다. 측정대상이 영유아인 경우, 영유아의 체온이 적어도 섭씨 34도 이상은 유지되어야 하는데, 접촉식 온도 센서(10)의 측정결과 측정대상의 온도가 섭씨 34도 이하인 것으로 3분 이상 측정되었다면, 해당 접촉식 온도 센서(10)가 측정대상과 접촉되지 않은 상태이기 때문에 해당 측정결과는 부정확한 결과로 볼 수 있다.For example, when the temperature of the measurement target is maintained below the predetermined temperature for more than a predetermined time, the processor 30 may determine that the measurement result by the contact temperature sensor 10 corresponds to a predetermined abnormal pattern. In the case of the infant being measured, the body temperature of the infant should be maintained at least 34 degrees Celsius or more. If the measurement result of the contact temperature sensor 10 is measured for 3 minutes or more as the temperature of the measuring object is 34 degrees Celsius or less, Since the temperature sensor 10 is not in contact with the measurement object, the measurement result may be regarded as an inaccurate result.
이어서, 접촉식 온도 센서(10)에 의해 측정된 결과가 미리 정해진 비정상적인 패턴에 해당하지 않는 경우, 프로세서(30)는 접촉식 온도 센서(10)에 의해 측정된 결과를 측정대상의 온도로 인식할 수 있다(S30).Subsequently, when the result measured by the contact temperature sensor 10 does not correspond to a predetermined abnormal pattern, the processor 30 may recognize the result measured by the contact temperature sensor 10 as the temperature of the measurement object. It may be (S30).
접촉식 온도 센서(10)에 의해 측정된 결과가 미리 정해진 비정상적인 패턴에 해당하지 않는 경우, 프로세서(30)는 접촉식 온도 센서(10)에 의해 측정된 결과를 신뢰할 수 있는 결과로 판단할 수 있다. 따라서, 프로세서(30)는 접촉식 온도 센서(10)에 의해 측정된 결과를 측정대상의 온도로 인식할 수 있다.When the result measured by the contact temperature sensor 10 does not correspond to a predetermined abnormal pattern, the processor 30 may determine the result measured by the contact temperature sensor 10 as a reliable result. . Therefore, the processor 30 may recognize the result measured by the contact type temperature sensor 10 as the temperature of the measurement object.
한편, 접촉식 온도 센서(10)에 의해 측정된 결과가 미리 정해진 비정상적인 패턴에 해당하는 경우, 프로세서(30)는 비접촉식 온도 센서(20)를 이용하여 측정대상의 온도를 측정하도록 온도 측정 장치(100)를 제어할 수 있다(S40).Meanwhile, when the result measured by the contact temperature sensor 10 corresponds to a predetermined abnormal pattern, the processor 30 measures the temperature of the measurement target by using the non-contact temperature sensor 20. ) Can be controlled (S40).
접촉식 온도 센서(10)에 의해 측정된 결과가 미리 정해진 비정상적인 패턴에 해당하는 경우, 프로세서(30)는 접촉식 온도 센서(10)에 의해 측정된 결과를 부정확한 결과로 인식하기 때문에, 비접촉식 온도 센서(20)에 의해 측정된 결과를 측정대상의 온도로 이용하기 위해 비접촉식 온도 센서(20)를 작동시킬 수 있다. If the result measured by the contact temperature sensor 10 corresponds to a predetermined abnormal pattern, the processor 30 recognizes the result measured by the contact temperature sensor 10 as an inaccurate result, and thus the non-contact temperature. The non-contact temperature sensor 20 may be operated to use the result measured by the sensor 20 as the temperature of the measurement object.
다만, 프로세서(30)는 비접촉식 온도 센서(20)를 작동시킨 이후에도 접촉식 온도 센서(10)의 작동 상태를 유지할 수 있다. 이를 통해, 프로세서(30)는 접촉식 온도 센서(10)의 측정결과가 미리 정해진 비정상적인 패턴에 해당하는지 여부를 지속적으로 판단할 수 있으며, 온도 측정 장치(100)의 고정 위치가 조정되거나 다른 방법을 통해 접촉식 온도 센서(10)의 측정결과를 부정확하게 했던 요인이 사라지게 되면, 프로세서(30)는 접촉식 온도 센서(10)의 측정결과를 이용할 수 있다.However, the processor 30 may maintain the operation state of the contact temperature sensor 10 even after operating the non-contact temperature sensor 20. Through this, the processor 30 may continuously determine whether the measurement result of the contact type temperature sensor 10 corresponds to a predetermined abnormal pattern, and the fixed position of the temperature measuring device 100 may be adjusted or another method may be used. If the factor that caused the measurement result of the contact temperature sensor 10 to be inaccurate disappears, the processor 30 may use the measurement result of the contact temperature sensor 10.
전술한 바와 같이, 몇몇 실시예에서 접촉식 온도 센서(10)와 비접촉식 온도 센서(20)는 상시 작동하고, 비접촉식 온도 센서(20)의 측정결과는 접촉식 온도 센서(10)의 측정결과가 미리 정해진 비정상적인 패턴에 해당하는 경우에만 이용되도록 프로세서(30)에 의해 제어될 수 있다. 그리고 몇몇 실시예에서 프로세서(30)는 접촉식 온도 센서(10)의 측정결과가 미리 정해진 비정상적인 패턴에 해당하는 경우에 접촉식 온도 센서(10)의 작동을 중지하고 비접촉식 온도 센서(20)를 작동시킬 수 있다.As described above, in some embodiments, the contact temperature sensor 10 and the non-contact temperature sensor 20 are always operated, and the measurement result of the non-contact temperature sensor 20 is measured in advance. It may be controlled by the processor 30 to be used only in the case of a predetermined abnormal pattern. In some embodiments, the processor 30 stops the operation of the contact temperature sensor 10 and operates the non-contact temperature sensor 20 when the measurement result of the contact temperature sensor 10 corresponds to a predetermined abnormal pattern. You can.
이어서, 프로세서(30)는 비접촉식 온도 센서(20)에 의해 측정된 결과를 측정대상의 온도로 인식할 수 있다(S45).Subsequently, the processor 30 may recognize the result measured by the non-contact temperature sensor 20 as the temperature of the measurement target (S45).
프로세서(30)는 접촉식 온도 센서(10)에 의해 측정된 결과가 미리 정해진 비정상적인 패턴에 해당하는 경우, 비접촉식 온도 센서(20)에 의해 측정된 결과를 측정대상의 온도로 인식할 수 있다.When the result measured by the contact temperature sensor 10 corresponds to a predetermined abnormal pattern, the processor 30 may recognize the result measured by the non-contact temperature sensor 20 as the temperature of the measurement object.
이어서, 프로세서(30)는 측정대상의 온도를 저장하거나 전송할 수 있다(S50).Subsequently, the processor 30 may store or transmit the temperature of the measurement target (S50).
접촉식 온도 센서(10)의 측정결과가 비정상적인 패턴에 해당하는 경우, 프로세서(30)는 비접촉식 온도 센서(20)의 측정결과를 측정대상의 온도로 저장부(60)에 저장하거나 통신모듈(40)을 통해 사용자 단말(200)에 전송하도록 온도 측정 장치(100)를 제어할 수 있다. 즉, 프로세서(30)는, 접촉식 온도 센서(10)에 의해 측정된 결과가 미리 정해진 비정상적인 패턴에 해당하지 않는 경우, 접촉식 온도 센서(10)에 의해 측정된 결과를 측정대상의 온도로 인식하여, 접촉식 온도 센서(10)에 의해 측정된 결과가 외부 장치로 전송되도록 통신모듈(40)을 제어할 수 있다.When the measurement result of the contact temperature sensor 10 corresponds to an abnormal pattern, the processor 30 stores the measurement result of the non-contact temperature sensor 20 in the storage unit 60 as the temperature of the measurement object or the communication module 40. The temperature measuring apparatus 100 may be controlled to be transmitted to the user terminal 200 through. That is, when the result measured by the contact temperature sensor 10 does not correspond to a predetermined abnormal pattern, the processor 30 recognizes the result measured by the contact temperature sensor 10 as the temperature of the measurement object. Thus, the communication module 40 may be controlled to transmit the result measured by the contact type temperature sensor 10 to an external device.
그리고, 접촉식 온도 센서(10)의 측정결과가 비정상적인 패턴에 해당하지 않는 경우, 프로세서(30)는 접촉식 온도 센서(10)의 측정결과를 측정대상의 온도로 저장부(60)에 저장하거나 통신모듈(40)을 통해 사용자 단말(200)에 전송하도록 온도 측정 장치(100)를 제어할 수 있다. 즉, 프로세서(30)는, 접촉식 온도 센서(10)에 의해 측정된 결과가 미리 정해진 비정상적인 패턴에 해당하는 경우, 비접촉식 온도 센서(20)에 의해 측정된 결과를 측정대상의 온도로 인식하여, 비접촉식 온도 센서(20)에 의해 측정된 결과가 외부 장치로 전송되도록 통신모듈(40)을 제어할 수 있다.When the measurement result of the contact temperature sensor 10 does not correspond to an abnormal pattern, the processor 30 stores the measurement result of the contact temperature sensor 10 as the temperature of the measurement object in the storage unit 60 or The temperature measuring device 100 may be controlled to transmit to the user terminal 200 through the communication module 40. That is, when the result measured by the contact temperature sensor 10 corresponds to a predetermined abnormal pattern, the processor 30 recognizes the result measured by the non-contact temperature sensor 20 as the temperature of the measurement object, The communication module 40 may be controlled to transmit the result measured by the non-contact temperature sensor 20 to an external device.
따라서, 본 발명의 일 실시예에 따른 온도 측정 장치(100)를 이용하면, 접촉식 온도 센서와 비접촉식 온도 센서(20)가 모두 포함되어 있기 때문에, 접촉식 온도 센서(10)의 측정결과가 부정확한 경우 비접촉식 온도 센서(20)의 측정결과를 이용함으로써, 측정대상의 온도를 정확하게 측정할 수 있다.Therefore, when using the temperature measuring device 100 according to an embodiment of the present invention, since both the contact temperature sensor and the non-contact temperature sensor 20 are included, the measurement result of the contact temperature sensor 10 is inaccurate. In this case, by using the measurement result of the non-contact temperature sensor 20, it is possible to accurately measure the temperature of the measurement object.
한편, 몇몇 실시예에 따르면, 접촉식 온도 센서(10)에 의해 측정된 결과가 미리 정해진 비정상적인 패턴에 해당하는 경우, 프로세서(30)는 알림신호를 생성할 수 있다.Meanwhile, according to some embodiments, when the result measured by the contact temperature sensor 10 corresponds to a predetermined abnormal pattern, the processor 30 may generate a notification signal.
접촉식 온도 센서(10)에 의해 측정된 결과가 미리 정해진 비정상적인 패턴에 해당한다면, 온도 측정 장치(100)의 고정 위치에 문제가 있거나, 측정 대상을 둘러싸고 있는 의복 내의 공간에 이상 열평형이 발생한 상황일 수 있으므로, 비접촉식 온도 센서(20)에 의해 측정대상의 온도를 측정하더라도 측정결과를 신뢰하지 못할 수 있다. 따라서, 본 실시예에 따른 온도 측정 장치(100)에 따르면, 접촉식 온도 센서(10)에 의해 측정된 결과가 미리 정해진 비정상적인 패턴에 해당하는 경우, 프로세서(30)는 알림신호를 생성하여 사용자에게 온도 측정 장치(100)에 문제가 있음을 알릴 수 있다.If the result measured by the contact temperature sensor 10 corresponds to a predetermined abnormal pattern, there is a problem in a fixed position of the temperature measuring device 100 or an abnormal thermal equilibrium occurs in the space in the garment surrounding the measurement object. Since the temperature of the measurement target is measured by the non-contact temperature sensor 20, the measurement result may not be trusted. Therefore, according to the temperature measuring apparatus 100 according to the present embodiment, when the result measured by the contact temperature sensor 10 corresponds to a predetermined abnormal pattern, the processor 30 generates a notification signal to the user. The temperature measuring device 100 may be notified that there is a problem.
프로세서(30)는 알림신호에 기초하여 온도 측정 장치(100) 자체적으로 시각적인 알람, 청각적인 알람, 진동과 관련된 알람을 발생시키거나, 통신모듈(40)을 통해 알림신호를 사용자 단말(200)에 전송하여 사용자 단말(200)을 통해 사용자에게 알람이 전달되도록 할 수도 있다.The processor 30 generates an alarm related to a visual alarm, an audio alarm, and a vibration based on the temperature measuring device 100 itself, or transmits a notification signal through the communication module 40 to the user terminal 200. An alarm may be transmitted to the user through the user terminal 200 by transmitting to.
그리고, 몇몇 실시예에서 프로세서(30)는 접촉식 온도 센서(10)의 측정결과가 미리 정해진 비정상적인 패턴에 해당하는지 여부를 지속적으로 판단할 수 있으며, 접촉식 온도 센서(10)의 측정결과가 미리 정해진 비정상적인 패턴에 해당하지 않고, 해당되는 상태가 미리 정해진 시간 이상으로 유지되는 경우, 접촉식 온도 센서(10)에 의해 측정된 결과를 측정대상의 온도로 인식할 수 있으며, 비접촉식 온도 센서(20)의 작동을 중지시킬 수 있다.In addition, in some embodiments, the processor 30 may continuously determine whether the measurement result of the contact temperature sensor 10 corresponds to a predetermined abnormal pattern, and the measurement result of the contact temperature sensor 10 is previously determined. When not corresponding to a predetermined abnormal pattern, and the state is maintained for a predetermined time or more, the result measured by the contact temperature sensor 10 can be recognized as the temperature of the measurement object, the non-contact temperature sensor 20 Can be stopped.
이하, 도 10을 참조하여, 본 발명의 다른 실시예에 따른 온도 측정 장치(100)의 작동을 설명한다. 다만, 본 발명의 일 실시예에 따른 온도 측정 장치(100)의 작동과의 차이점을 위주로 설명한다. 도 10을 참조하면, 본 발명의 다른 실시예에 따른 온도 측정 장치(100)의 작동에 관한 순서도가 개시된다.Hereinafter, an operation of the temperature measuring device 100 according to another embodiment of the present invention will be described with reference to FIG. 10. However, the differences from the operation of the temperature measuring device 100 according to an embodiment of the present invention will be described mainly. Referring to FIG. 10, a flowchart of the operation of the temperature measuring device 100 according to another embodiment of the present invention is disclosed.
도 10을 참조하면, 본 실시예에 따른 온도 측정 장치(100)에서, 프로세서(30)는 비접촉식 온도 센서(20)를 이용하여 측정대상의 온도를 측정(S40)하도록 제어한 후, 비접촉식 온도 센서(20)에 의한 측정결과가 미리 정해진 비정상적인 패턴에 해당하는 지 여부를 판단할 수 있다(S60).Referring to FIG. 10, in the temperature measuring apparatus 100 according to the present exemplary embodiment, the processor 30 controls to measure the temperature of the measurement target using the non-contact temperature sensor 20 (S40), and then the non-contact temperature sensor. It may be determined whether the measurement result by 20 corresponds to a predetermined abnormal pattern (S60).
예컨대, 측정대상의 온도가 미리 정해진 온도 이하로 미리 정해진 시간 이상 유지되는 경우, 프로세서(30)는 비접촉식 온도 센서(20)에 의한 측정결과가 미리 정해진 비정상적인 패턴에 해당하는 것으로 판단할 수 있고, 비접촉식 온도 센서(20)에 의한 측정결과가 부정확한 것으로 인식할 수 있다.For example, when the temperature of the measurement target is maintained below the predetermined temperature for more than a predetermined time, the processor 30 may determine that the measurement result by the non-contact temperature sensor 20 corresponds to a predetermined abnormal pattern, and the contactless type It can be recognized that the measurement result by the temperature sensor 20 is incorrect.
이어서, 프로세서(30)는, 접촉식 온도 센서(10)에 의해 측정된 결과와 비접촉식 온도 센서(20)에 의해 측정된 결과가 모두 미리 정해진 비정상적인 패턴에 해당하는 경우, 알람 신호를 생성할 수 있다(S65).Subsequently, the processor 30 may generate an alarm signal when both the result measured by the contact temperature sensor 10 and the result measured by the non-contact temperature sensor 20 correspond to a predetermined abnormal pattern. (S65).
접촉식 온도 센서(10)에 의해 측정된 결과와 비접촉식 온도 센서(20)에 의해 측정된 결과가 모두 미리 정해진 비정상적인 패턴에 해당한다면, 양쪽 측정결과 모두가 부정확한 것이므로, 프로세서(30)는 알림신호를 생성하여 사용자에게 온도 측정 장치(100)에 문제가 있음을 알릴 수 있다.If the result measured by the contact temperature sensor 10 and the result measured by the non-contact temperature sensor 20 correspond to a predetermined abnormal pattern, since both measurement results are inaccurate, the processor 30 may notify the signal. By generating the to inform the user that there is a problem in the temperature measuring device 100.
한편, 프로세서(30)는 비접촉식 온도 센서(20)에 의해 측정된 결과가 미리 정해진 비정상적인 패턴에 해당하지 않는 경우 비접촉식 온도 센서(20)에 의해 측정된 결과를 측정대상의 온도로 인식할 수 있다(S45).Meanwhile, when the result measured by the non-contact temperature sensor 20 does not correspond to a predetermined abnormal pattern, the processor 30 may recognize the result measured by the non-contact temperature sensor 20 as the temperature of the measurement object ( S45).
이하, 도 11을 참조하여, 본 발명의 또 다른 실시예에 따른 온도 측정 장치(100)의 작동을 설명한다. 다만, 본 발명의 일 실시예에 따른 온도 측정 장치(100)의 작동과의 차이점을 위주로 설명한다. 도 11을 참조하면, 본 발명의 또 다른 실시예에 따른 온도 측정 장치(100)의 작동에 관한 순서도가 개시된다.Hereinafter, referring to FIG. 11, the operation of the temperature measuring apparatus 100 according to another embodiment of the present invention will be described. However, the differences from the operation of the temperature measuring device 100 according to an embodiment of the present invention will be described mainly. Referring to FIG. 11, a flowchart of the operation of the temperature measuring device 100 according to another embodiment of the present invention is disclosed.
도 11을 참조하면, 본 실시예에 따른 온도 측정 장치(100)에서, 프로세서(30)는 비접촉식 온도 센서(20)를 이용하여 측정대상의 온도를 측정(S40)하도록 제어한 후, 비접촉식 온도 센서(20)의 이용시간이 미리 정해진 시간을 도과하는 지 여부를 판단할 수 있다(S61).Referring to FIG. 11, in the temperature measuring device 100 according to the present embodiment, the processor 30 controls to measure the temperature of the measurement target using the non-contact temperature sensor 20 (S40), and then the non-contact temperature sensor. It may be determined whether the usage time of 20 exceeds a predetermined time (S61).
비접촉식 온도 센서(20)는 사용시간이 지남에 따라 센서 자체의 온도가 상승하여 측정 정확도가 떨어질 수 있기 때문에, 비접촉식 온도 센서(20)의 사용시간을 미리 정해진 시간으로 제한하는 것이 바람직하다.Since the temperature of the non-contact temperature sensor 20 may increase as the temperature of the sensor itself decreases as the use time elapses, it is preferable to limit the use time of the non-contact temperature sensor 20 to a predetermined time.
따라서, 비접촉식 온도 센서(20)의 이용시간이 미리 정해진 시간을 도과한 경우 알람신호를 생성(S65)하여 사용자에게 알람을 줌으로써 온도 측정 장치(100)의 위치 조정이 필요하거나 사용 중지가 필요함을 알릴 수 있으며, 따라서, 비접촉식 온도 센서(20)의 이용시간이 미리 정해진 시간을 도과하지 않은 경우 비접촉식 온도 센서에 의해 측정된 결과를 측정대상의 온도로 인식할 수 있다(S45).Therefore, when the use time of the non-contact temperature sensor 20 exceeds a predetermined time, an alarm signal is generated (S65) to alert the user to notify that the position adjustment of the temperature measuring device 100 is required or disabled. Therefore, when the use time of the non-contact temperature sensor 20 does not exceed the predetermined time, the result measured by the non-contact temperature sensor may be recognized as the temperature of the measurement object (S45).
이상 본 발명의 실시예들을 설명하였으나, 본 발명은 상기 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 제조될 수 있으며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다.Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments and can be manufactured in various forms, and a person of ordinary skill in the art to which the present invention pertains has the technical idea of the present invention. However, it will be understood that other specific forms may be practiced without changing the essential features. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Claims (12)

  1. 듀얼 온도 센서를 포함하는 온도 측정 장치로서,A temperature measuring device comprising a dual temperature sensor,
    측정대상의 온도를 측정하는 접촉식 온도 센서;A contact temperature sensor measuring a temperature of a measurement object;
    상기 측정대상의 온도를 측정하는 비접촉식 온도 센서;Non-contact temperature sensor for measuring the temperature of the measurement object;
    상기 접촉식 온도 센서에 의해 측정된 결과가 미리 정해진 비정상적인 패턴에 해당하는 경우, 상기 비접촉식 온도 센서에 의해 측정된 결과를 상기 측정대상의 온도로 인식하는 프로세서; 및A processor that recognizes the result measured by the non-contact temperature sensor as the temperature of the measurement object when the result measured by the contact temperature sensor corresponds to a predetermined abnormal pattern; And
    상기 온도 측정 장치를 상기 측정대상 또는 상기 측정대상의 의복에 고정시키는 프레임으로서, 상기 접촉식 온도 센서는 상기 프레임의 제1 영역에 위치하고, 상기 비접촉식 온도 센서는 상기 제1 영역으로부터 이격된 상기 프레임의 제2 영역에 위치하는 것인, 프레임A frame for fixing the temperature measuring device to the object to be measured or to the garment of the object to be measured, wherein the contact temperature sensor is located in a first region of the frame, and the non-contact temperature sensor of the frame is spaced apart from the first region. Located in the second region, the frame
    을 포함하고,Including,
    상기 프레임에서 상기 제1 영역과 상기 제2 영역은 동일 평면 상에 위치하지 않도록 형성되어 상기 접촉식 온도 센서가 위치한 상기 제1 영역이 상기 측정대상에 접촉한 경우 상기 비접촉식 온도 센서가 위치한 상기 제2 영역은 상기 측정대상에 접촉하지 않는 것인, 듀얼 온도 센서를 포함하는 온도 측정 장치.The second region in which the non-contact temperature sensor is positioned when the first region in which the contact temperature sensor is positioned is in contact with the measurement object because the first region and the second region are not disposed on the same plane in the frame. And a region does not contact the measurement object.
  2. 제1항에 있어서,The method of claim 1,
    상기 프로세서는, 상기 접촉식 온도 센서에 의해 측정된 결과가 상기 미리 정해진 비정상적인 패턴에 해당하는 경우, 상기 비접촉식 온도 센서를 작동시킴으로써 상기 비접촉식 온도 센서에 의해 측정된 결과를 상기 측정대상의 온도로 이용하는 것인, 온도 측정 장치.The processor is configured to use the result measured by the non-contact temperature sensor as the temperature of the measurement object by operating the non-contact temperature sensor when the result measured by the contact temperature sensor corresponds to the predetermined abnormal pattern. Phosphorus, temperature measuring device.
  3. 제2항에 있어서,The method of claim 2,
    상기 프로세서는 상기 비접촉식 온도 센서를 작동시킨 이후에도 상기 접촉식 온도 센서의 작동 상태를 유지하는 것인, 온도 측정 장치.Wherein the processor maintains an operational state of the contact temperature sensor even after operating the non-contact temperature sensor.
  4. 제2항에 있어서,The method of claim 2,
    상기 프로세서는, 상기 접촉식 온도 센서에 의해 측정된 상기 측정대상의 온도가 미리 정해진 온도 이하로 미리 정해진 시간 이상 유지되면, 상기 접촉식 온도 센서에 의해 측정된 결과가 상기 미리 정해진 비정상적인 패턴에 해당하는 것으로 판단하는 것인, 온도 측정 장치.When the temperature of the measurement target measured by the contact temperature sensor is maintained below a predetermined temperature for a predetermined time or more, a result measured by the contact temperature sensor corresponds to the predetermined abnormal pattern. It is judged that the temperature measuring device.
  5. 제1항에 있어서,The method of claim 1,
    외부 장치와 통신이 가능한 통신모듈을 더 포함하고,Further comprising a communication module capable of communicating with an external device,
    상기 프로세서는, 상기 접촉식 온도 센서에 의해 측정된 결과가 상기 미리 정해진 비정상적인 패턴에 해당하는 경우, 상기 비접촉식 온도 센서에 의해 측정된 결과를 상기 측정대상의 온도로 인식하여, 상기 비접촉식 온도 센서에 의해 측정된 결과가 외부 장치로 전송되도록 상기 통신모듈을 제어하는 것인, 온도 측정 장치.When the result measured by the contact temperature sensor corresponds to the predetermined abnormal pattern, the processor recognizes the result measured by the non-contact temperature sensor as the temperature of the measurement object, and by the non-contact temperature sensor. And controlling the communication module to transmit the measured result to an external device.
  6. 제1항에 있어서,The method of claim 1,
    상기 프로세서는, 상기 접촉식 온도 센서에 의해 측정된 결과와 상기 비접촉식 온도 센서에 의해 측정된 결과가 모두 상기 미리 정해진 비정상적인 패턴에 해당하는 경우, 알람 신호를 생성하는 것인, 온도 측정 장치.Wherein the processor generates an alarm signal when both the result measured by the contact temperature sensor and the result measured by the non-contact temperature sensor correspond to the predetermined abnormal pattern.
  7. 굴곡 또는 경사를 갖는 센서면을 포함하는 프레임;A frame comprising a sensor surface having a bend or inclination;
    상기 센서면의 제1 영역에 위치하는 접촉식 온도 센서; 및A contact temperature sensor positioned in the first region of the sensor surface; And
    상기 센서면의 상기 제1 영역으로부터 이격된 상기 센서면의 제2 영역에 위치하는 비접촉식 온도 센서A non-contact temperature sensor located in a second region of the sensor surface spaced from the first region of the sensor surface
    를 포함하고,Including,
    상기 프레임에서 상기 제1 영역과 상기 제2 영역은 동일 평면 상에 위치하지 않도록 형성되어 상기 접촉식 온도 센서가 위치한 상기 제1 영역이 측정대상에 접촉한 경우 상기 비접촉식 온도 센서가 위치한 상기 제2 영역은 상기 측정대상에 접촉하지 않는 것인, 듀얼 온도 센서를 포함하는 온도 측정 장치.In the frame, the first region and the second region are formed so as not to be disposed on the same plane, and the second region in which the non-contact temperature sensor is located when the first region in which the contact temperature sensor is in contact with a measurement object is located. Is not in contact with the measurement object, the temperature measuring device comprising a dual temperature sensor.
  8. 제7항에 있어서,The method of claim 7, wherein
    상기 프레임은 온도 측정의 측정대상 또는 상기 측정대상의 의복에 고정 가능한 형상 또는 구조를 가지고,The frame has a shape or structure that can be fixed to the measurement target or the garment of the measurement target,
    상기 프레임이 상기 측정대상 또는 상기 측정대상의 의복에 고정된 상태에서, 상기 프레임은 상기 접촉식 온도 센서가 위치한 상기 제1 영역이 상기 측정대상에 접촉한 경우 상기 비접촉식 온도 센서가 위치한 상기 제2 영역은 상기 측정대상에 접촉하지 않도록 형성된 것인, 온도 측정 장치.In the state where the frame is fixed to the measurement object or the garment of the measurement object, the frame is the second area where the non-contact temperature sensor is located when the first area where the contact temperature sensor is located touches the measurement object. The temperature measuring device is formed so as not to contact the measurement object.
  9. 제1항에 있어서,The method of claim 1,
    상기 접촉식 온도 센서가 위치한 상기 제1 영역이 상기 측정대상에 접촉한 경우 상기 비접촉식 온도 센서가 위치한 상기 제2 영역은 상기 측정대상으로부터 이격될 수 있도록, 상기 비접촉식 온도 센서가 위치한 상기 제2 영역은 경사를 갖는 영역인 것인, 온도 측정 장치.The second area in which the non-contact temperature sensor is located may be spaced apart from the measurement object so that the second area in which the non-contact temperature sensor is located when the first area in which the contact temperature sensor is located contacts the measurement object. It is an area | region which has a slope, The temperature measuring apparatus.
  10. 제7항에 있어서,The method of claim 7, wherein
    상기 접촉식 온도 센서가 위치한 상기 제1 영역이 상기 측정대상에 접촉한 경우 상기 비접촉식 온도 센서가 위치한 상기 제2 영역은 상기 측정대상으로부터 이격될 수 있도록, 상기 비접촉식 온도 센서가 위치한 상기 제2 영역은 경사를 갖는 영역인 것인, 온도 측정 장치.The second area in which the non-contact temperature sensor is located may be spaced apart from the measurement object so that the second area in which the non-contact temperature sensor is located when the first area in which the contact temperature sensor is located contacts the measurement object. It is an area | region which has a slope, The temperature measuring apparatus.
  11. 제1항에 있어서,The method of claim 1,
    상기 접촉식 온도 센서가 위치한 상기 제1 영역이 상기 측정대상에 접촉한 경우 상기 비접촉식 온도 센서가 위치한 상기 제2 영역은 상기 측정대상으로부터 이격될 수 있도록, 상기 접촉식 온도 센서가 위치한 상기 제1 영역은 상기 비접촉식 온도 센서가 위치한 상기 제2 영역에 비해 상대적으로 돌출되어 있는 것인, 온도 측정 장치.The first area in which the contact temperature sensor is located so that the second area in which the non-contact temperature sensor is located is spaced apart from the measurement object when the first area in which the contact temperature sensor is located contacts the measurement object. Is projected relative to the second region in which the non-contact temperature sensor is located.
  12. 제7항에 있어서,The method of claim 7, wherein
    상기 접촉식 온도 센서가 위치한 상기 제1 영역이 상기 측정대상에 접촉한 경우 상기 비접촉식 온도 센서가 위치한 상기 제2 영역은 상기 측정대상으로부터 이격될 수 있도록, 상기 접촉식 온도 센서가 위치한 상기 제1 영역은 상기 비접촉식 온도 센서가 위치한 상기 제2 영역에 비해 상대적으로 돌출되어 있는 것인, 온도 측정 장치.The first area in which the contact temperature sensor is located so that the second area in which the non-contact temperature sensor is located is spaced apart from the measurement object when the first area in which the contact temperature sensor is located contacts the measurement object. Is projected relative to the second region in which the non-contact temperature sensor is located.
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