WO2018170807A1 - 音频系统及耳机 - Google Patents

音频系统及耳机 Download PDF

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Publication number
WO2018170807A1
WO2018170807A1 PCT/CN2017/077774 CN2017077774W WO2018170807A1 WO 2018170807 A1 WO2018170807 A1 WO 2018170807A1 CN 2017077774 W CN2017077774 W CN 2017077774W WO 2018170807 A1 WO2018170807 A1 WO 2018170807A1
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digital
divided
frequency
signals
earphone
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PCT/CN2017/077774
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English (en)
French (fr)
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王文祺
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深圳市汇顶科技股份有限公司
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Priority to CN201780000376.4A priority Critical patent/CN108966690A/zh
Priority to PCT/CN2017/077774 priority patent/WO2018170807A1/zh
Publication of WO2018170807A1 publication Critical patent/WO2018170807A1/zh

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  • the present application relates to an audio system and an earphone, and more particularly to an audio system and an earphone that can accurately split a sound to a multi-channel unit.
  • the prior art utilizes a plurality of balanced armature units playing different frequency band sounds to cooperate with a passive crossover to solve the problem that the balanced armature single frequency band is too narrow, wherein the passive sound splitter represents a passive component (such as A crossover made up of resistors, capacitors or inductors.
  • the equivalent inductance of the balanced armature unit is quite large, so that when the passive splitter uses the inductance to filter, it is difficult for the balanced armature unit and the passive splitter to achieve good low-pass filtering effect, resulting in different sounds.
  • the sound effects of the single cells overlap each other; in addition, when the passive splitter uses resistors and capacitors for filtering, it not only reduces the audio output power, but also causes the frequency response of the output signal to be uneven.
  • the main purpose of the present application is to provide an audio system and earphone that can accurately split the sound to a multi-channel unit to improve the disadvantages of the prior art.
  • the present application provides an audio system applied to an earphone.
  • the audio system includes a digital audio splitter for receiving a digital audio signal and generating a plurality of divided digital signals; and a plurality of cells coupled to the digital crossover for generating corresponding A plurality of divided sound effects of a plurality of divided digital signals.
  • the digital sound separator is disposed on a headphone jack of the earphone.
  • the audio system further includes a parallel-to-serial converter, disposed in the earphone connector, coupled to the digital crossover, and transmitting the plurality of frequency-divided digital signals to one in a serial manner Transmission medium.
  • a parallel-to-serial converter disposed in the earphone connector, coupled to the digital crossover, and transmitting the plurality of frequency-divided digital signals to one in a serial manner Transmission medium.
  • the transmission medium is a headphone lead.
  • At least one of the plurality of monomers is a balanced armature monomer.
  • the digital splitter includes a plurality of digital filters for generating the plurality of divided digital signals based on the digital audio signals.
  • the audio system includes a signal processing module coupled between the digital crossover and the plurality of cells, and configured to generate a plurality of frequency division simulations according to the plurality of divided digital signals. a signal; wherein the plurality of cells generate the plurality of divided sound effects corresponding to the plurality of divided analog signals.
  • the signal processing module includes a plurality of digital-to-analog converters coupled to the digital frequency divider for converting the plurality of frequency-divided digital signals into the plurality of frequency-divided analog signals.
  • the signal processing module further includes a plurality of amplifiers coupled to the plurality of digital-to-analog converters for amplifying the plurality of frequency-divided analog signals to generate a plurality of amplified frequency-divided signals to the plurality of a plurality of cells; wherein the plurality of cells generate the plurality of frequency-divided sound effects according to the plurality of amplified frequency-divided signals.
  • a plurality of amplifiers coupled to the plurality of digital-to-analog converters for amplifying the plurality of frequency-divided analog signals to generate a plurality of amplified frequency-divided signals to the plurality of a plurality of cells; wherein the plurality of cells generate the plurality of frequency-divided sound effects according to the plurality of amplified frequency-divided signals.
  • the signal processing module is disposed in a headphone body of the earphone.
  • the audio system further includes a serial to parallel converter coupled between the digital crossover and the plurality of cells.
  • the present application further provides an earphone, comprising a headphone connector, comprising a digital crossover device for receiving a digital audio signal and generating a plurality of frequency division digital signals; and a headphone body comprising: a plurality of single bodies, Coupled to the digital crossover for generating a plurality of frequency-divided digital signals corresponding to A crossover sound.
  • the present application utilizes a digital crossover to perform a digital frequency division operation in the digital domain, which has the advantages of improving the sound separation effect, reducing the production cost and the circuit area.
  • FIG. 1 is a schematic diagram of a headset according to an embodiment of the present application.
  • FIG. 2 is a schematic functional block diagram of an audio system according to an embodiment of the present application.
  • FIG. 3 is a schematic functional block diagram of a headset according to an embodiment of the present application.
  • FIG. 4 is a schematic diagram of a frequency spectrum of a frequency division digital signal of the present application.
  • FIG. 1 is a schematic diagram of a headphone 10 according to an embodiment of the present application.
  • FIG. 2 is a functional block diagram of an audio system 20 according to an embodiment of the present application.
  • the audio system 20 is disposed in the earphone 10.
  • the earphone 10 includes a headphone jack 12, a headphone body 14, and a headphone lead 16.
  • the earphone 10 can be inserted into an electronic device such as a mobile phone or a tablet computer through the earphone connector 12 (which is an interface) to receive a digital audio signal DA from the electronic device.
  • the earphone lead 16 is a transmission medium for connecting the earphone connector 12 and the earphone body 14, and the earphone body 14 is for generating a sound corresponding to the digital audio signal DA.
  • the frequency range corresponding to the digital audio signal DA covers 20 Hz to 20 kHz.
  • the audio system 20 includes a digital crossover 120, a Parallel-To-Serial Converter (P/S) 122, and a serial-to-parallel converter (S). /P) 140, a signal processing module 142 and a plurality of monomers, wherein the digital crossover 120 and the parallel-serial converter 122 can be disposed in the earphone connector 12, the serial-to-parallel converter 140, and a signal processing module 142. And a plurality of cells can be disposed in the earphone body 14, and in addition, the signal processing module The 142 includes a plurality of Digital-to-Analog Convertor DACs and a plurality of amplifiers AMP.
  • the earphone 10/audio system 20 is a Three-Way earphone
  • the digital sound separator 120 is a three-way crossover. That is, the digital sound separator 120 can divide the digital audio signal DA into three frequency-divided digital signals at a high frequency, an intermediate frequency, and a low frequency, and pass the three-divided digital signals through a parallel-to-serial converter 122. The manner of (Serial) is transmitted to a transmission medium such as the headphone lead 16.
  • the digital crossover 120 can include a digital high pass filter HPF, a digital band pass filter MPF, and a digital low pass filter LPF for dividing the digital audio signal DA to generate one.
  • the high frequency digital signal DHF, an intermediate frequency digital signal DMF and a low frequency digital signal DLF digital signals DHF, DMF, DLF corresponding to three frequency division digital signals, the spectrum of which is shown in Figure 4).
  • the parallel to serial converter 122 generates a serial digital signal DAS to the earphone lead 16 based on the digital signals DHF, DMF, DLF, the headphone lead 16 passes the serial digital signal DAS to the headphone body 14, and the serial to parallel converter 140 will serialize the digital
  • the signal DAS is restored to Parallel digital signals DHF, DMF, and DLF, and the digital signals DHF, DMF, and DLF are respectively output to the digital-to-analog converter DAC corresponding to the high-pitched path, the intermediate sound path, and the low-range path.
  • the digital-to-analog converter DAC converts the digital signals DHF, DMF, and DLF into analog signals, and generates a high-frequency analog signal AHF, an intermediate-frequency analog signal AMF, and a low-frequency analog signal ALF (the analog signals AHF, AMF, and ALF are three Divided analog signal).
  • the amplifier AMP then amplifies the analog signals AHF, AMF, and ALF to generate the amplified frequency-divided signals ApHF, ApMF, and ApLF and outputs them to the three cells Mm_HF, Mm_MF, and Mm_LF corresponding to the high-pitched, intermediate, and low-range paths.
  • the cells Mm_HF, Mm_MF, and Mm_LF can generate three divided sound effects corresponding to the high sound path, the middle sound path, and the low sound path according to the amplified frequency division signals ApHF, ApMF, and ApLF.
  • the monomers Mm_HF, Mm_MF, and Mm_LF are all balanced armature monomers.
  • the present application first utilizes a digital crossover 120 (disposed on the earphone connector 12) to perform a digital frequency division operation on the digital audio signal DA in a digital domain to generate a high-pitched sound path. And three frequency-divided digital signals of the low-frequency path; and the signal processing module 142 (disposed on the earphone body 14) is used to convert the three frequency-divided digital signals into corresponding high-pitched circuits,
  • the three divided analog signals of the sound path and the low sound path, the single Mm_HF, Mm_MF, and Mm_LF can generate three frequency-divided sound effects corresponding to the high sound path, the middle sound path, and the low sound path.
  • the digital filters HPF, MPF, and LPF in the digital crossover 120 have better frequency response characteristics (eg, high-order digital filters HPF, MPF, and LPF have sharper transition bands). (Transition Band)), the digital sound separator 120 has a precise sound splitting effect, and is not affected by the balance armature unit impedance characteristics.
  • the digital sound separator 120 can be implemented by an integrated circuit to implement a high-order digital filter.
  • the production cost and volume/area occupied by HPF, MPF, and LPF are also much smaller than the production cost and volume/area required for Passive Crossover, thereby reducing production costs and circuit area.
  • the earphone is not limited to a three-way earphone, and the earphone of the present application may be a two-way or a multi-way, and is also within the scope of the present application.
  • the single body in the earphone body is not limited to being a fully balanced armature unit, and the single body in the earphone body may be a moving coil unit, which is also within the scope of the present application.
  • the signal processing module is not limited to being disposed in the earphone body, and the signal processing module may be disposed in the earphone connector.
  • the digital sound separator is not limited to being disposed in the earphone connector, and the digital sound separator may be disposed in the earphone body. Also within the scope of this application.
  • the present application can be applied to a wireless earphone, that is, the earphone body of the present application can be a wireless earphone body.
  • the transmission medium between the parallel-serial converter and the serial-to-parallel converter in the audio system can be air, and belongs to The scope of this application.
  • FIG. 3 is a schematic functional block diagram of a headset 30 according to an embodiment of the present application.
  • the earphone 30 includes a headphone connector 32, a left channel earphone body 14_L and a right channel earphone body 14_R.
  • the earphone connector 32 includes digital crossovers 120_L and 120_R for respectively respectively for the left channel digital audio signal DA_L and the right sound.
  • the digital audio signal DA_R is subjected to a sound dividing operation to generate left channel divided digital signals DHF_L, DMF_L, DLF_L and right channel divided digital signals DHF_R, DMF_R, DLF_R to a parallel-to-serial converter 322, and left (right
  • the channel headphone body 14_L (14_R) is connected to the earphone connector 32 through the earphone lead 16, and generates a digital frequency-divided signal DHF_L, DMF_L, DLF_L (DHF_R, A plurality of crossover sound effects of DMF_R, DLF_R) are also within the scope of the present application.
  • the parallel-to-serial converter 322 is not limited to performing parallel-to-serial conversion on the left-channel divided digital signals DHF_L, DMF_L, DLF_L, and the right-channel divided digital signals DHF_R, DMF_R, and DLF_R in a specific order.
  • DHF_L left-channel divided digital signals
  • DMF_L left-channel divided digital signals
  • DLF_L right-channel divided digital signals
  • DHF_R, DMF_R, and DLF_R in a specific order.
  • the present application utilizes a digital crossover to perform a digital frequency division operation in the digital domain. Since the digital crossover is implemented by a digital filter, a high-order digital filter can be utilized to obtain a filter frequency having a steep transition band. Respond to get accurate crossover effects. On the other hand, the production cost and the volume/area occupied by the high-order digital filter are much smaller than the production cost and volume/area required for the passive splitter. Therefore, the application has the advantages of accurate sound separation effect, low production cost and low circuit area.

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Abstract

本申请提供了一种音频系统，应用于一耳机，所述音频系统包括一数字分音器，用来接收一数字音频信号，并产生多个分频数字信号；以及多个单体，耦接于所述数字分音器，用来产生对应于所述多个分频数字信号的多个分频音效。

Description

音频系统及耳机 技术领域
本申请涉及一种音频系统及耳机，尤其涉及一种可准确分音给多音路单体的音频系统及耳机。
背景技术
消费者会利用手机、电脑等电子装置收听音乐或收看电影，为了收到良好的影音效果并且不影响他人，消费者会使用耳机。长久以来，耳机利用动圈(Moving Core)单体来达成扬声功能。近几年来，平衡电枢单体(Balanced Armature)因具有体积小、效率高且音质佳等优点，而逐渐被导入耳机应用中。然而，平衡电枢单体的缺点是其频带较窄，也就是说，单一平衡电枢单体不足以覆盖20Hz～20KHz的音频频带。
现有技术利用播放不同频带音效的多个平衡电枢单体配合被动分音器(Passive Crossover)，来解决平衡电枢单体频带过窄的问题，其中被动分音器代表以被动组件(如电阻、电容或电感)所组成的分音器。然而，平衡电枢单体的等效电感相当大，使得当被动分音器利用电感来进行滤波时，平衡电枢单体与被动分音器难以达成良好的低通滤波效果，而导致不同音路的单体所发出的音效相互重迭；另外，当被动分音器利用电阻及电容来进行滤波时，不但会降低音频输出功率，还会造成输出信号的频率响应不平坦。
因此，现有技术实有改进的必要。
发明内容
因此，本申请的主要目的即在于提供一种可准确分音给多音路单体的音频系统及耳机，以改善现有技术的缺点。
为了解决上述技术问题，本申请提供了一种音频系统，应用于一耳机， 所述音频系统包括一数字分音器，用来接收一数字音频信号，并产生多个分频数字信号；以及多个单体，耦接于所述数字分音器，用来产生对应于所述多个分频数字信号的多个分频音效。
例如，所述数字分音器设置于所述耳机的一耳机接头。
例如，所述的音频系统还包括一并串转换器，设置于所述耳机接头，耦接于所述数字分音器，并将所述多个分频数字信号以串行的方式传递至一传输介质。
例如，所述传输介质为一耳机导线。
例如，所述多个单体中至少一单体为一平衡电枢单体。
例如，所述数字分音器包含多个数字滤波器，用来根据所述数字音频信号，产生所述多个分频数字信号。
例如，所述的音频系统包括一信号处理模块，耦接于所述数字分音器与所述多个单体之间，用来根据所述多个分频数字信号，产生多个分频模拟信号；其中，所述多个单体产生对应于所述多个分频模拟信号的所述多个分频音效。
例如，所述信号处理模块包括多个数模转换器，耦接于所述数字分音器，用来将所述多个分频数字信号转换成所述多个分频模拟信号。
例如，所述信号处理模块还包括多个放大器，耦接于所述多个数模转换器，用来将所述多个分频模拟信号放大，以产生多个放大分频信号至所述多个单体；其中，所述多个单体根据所述多个放大分频信号，产生所述多个分频音效。
例如，所述信号处理模块设置于所述耳机的一耳机本体中。
例如，所述的音频系统还包括一串并转换器，耦接于所述数字分音器与所述多个单体之间。
本申请另提供了一种耳机，包括一耳机接头，包括一数字分音器，用来接收一数字音频信号，并产生多个分频数字信号；以及一耳机本体，包括：多个单体，耦接于所述数字分音器，用来产生对应于所述多个分频数字信号的多 个分频音效。
本申请利用数字分音器，于数字域中进行数字分频操作，具有提升分音效果，降低生产成本及电路面积的优点。
附图说明
图1为本申请实施例一耳机的示意图。
图2为本申请实施例一音频系统的功能方块示意图。
图3为本申请实施例一耳机的功能方块示意图。
图4为本申请分频数字信号的频谱示意图。
具体实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本申请，并不用于限定本申请。
请参考图1及图2，图1为本申请实施例一耳机10的示意图，图2为本申请实施例一音频系统20的功能方块示意图，音频系统20设置于耳机10中。详细来说，耳机10包括耳机接头12、耳机本体14以及一耳机导线16。耳机10可通过耳机接头12(其为一接口)插入如手机或平板计算机等电子装置，以自电子装置接收一数字音频信号DA。耳机导线16为一传输介质，用来连接耳机接头12以及耳机本体14，耳机本体14用来产生对应于数字音频信号DA的音效(Sound)。其中，数字音频信号DA所对应的频率范围涵盖20Hz～20KHz。另外，音频系统20包括一数字分音器(Digital Crossover)120、一并串转换器(Parallel-To-Serial Converter，P/S)122、一串并转换器(Serial-to-Parallel Converter，S/P)140、一信号处理模块142以及多个单体(Monomer)，其中数字分音器120及并串转换器122可设置于耳机接头12中，串并转换器140、一信号处理模块142以及多个单体可设置耳机本体14中，另外，信号处理模块 142包括多个数模转换器(Digital-to-Analog Convertor)DAC、多个放大器AMP。
于图2所示的实施例中，耳机10/音频系统20为一三音路(Three-Way)耳机，数字分音器120为一三音路分音器。也就是说，数字分音器120可将数字音频信号DA分成位于高频、中频、低频的三个分频数字信号，并通过并串转换器122，将这三个分频数字信号以串行(Serial)的方式传递至诸如耳机导线16等传输介质。
具体来说，数字分音器120可包括一数字高通滤波器HPF、一数字带通滤波器MPF以及一数字低通滤波器LPF，其用来对数字音频信号DA进行分频操作，分别产生一高频数字信号DHF、一中频数字信号DMF以及一低频数字信号DLF(数字信号DHF、DMF、DLF即对应三个分频数字信号，其频谱绘示于图4)。并串转换器122根据数字信号DHF、DMF、DLF产生一串行数字信号DAS至耳机导线16，耳机导线16将串行数字信号DAS传递至耳机本体14，而串并转换器140将串行数字信号DAS还原成并行(Parallel)的数字信号DHF、DMF、DLF，并将数字信号DHF、DMF、DLF分别输出至高音路、中音路、低音路所对应的数模转换器DAC。数模转换器DAC将数字信号DHF、DMF、DLF转换成模拟信号，而产生一高频模拟信号AHF、一中频模拟信号AMF以及一低频模拟信号ALF(模拟信号AHF、AMF、ALF即为三个分频模拟信号)。放大器AMP再将模拟信号AHF、AMF、ALF放大，而产生放大分频信号ApHF、ApMF、ApLF并输出至对应高音路、中音路、低音路的三个单体Mm_HF、Mm_MF、Mm_LF。单体Mm_HF、Mm_MF、Mm_LF即可根据放大分频信号ApHF、ApMF、ApLF，产生对应于高音路、中音路、低音路的三个分频音效。例如，单体Mm_HF、Mm_MF、Mm_LF皆为平衡电枢单体。
由上述可知，本申请先利用(设置于耳机接头12的)数字分音器120，对数字音频信号DA于数字域(Digital Domain)中进行数字分频操作，产生对应于高音路、中音路、低音路的三个分频数字信号；再利用(设置于耳机本体14的)信号处理模块142，将该三个分频数字信号转换成为对应于高音路、中 音路、低音路的三个分频模拟信号，单体Mm_HF、Mm_MF、Mm_LF即可产生对应于高音路、中音路、低音路的三个分频音效。需注意的是，因数字分音器120中的数字滤波器HPF、MPF、LPF具有较佳的频率响应特性(如高阶的数字滤波器HPF、MPF、LPF具有较陡峭(Sharp)的过渡频带(Transition Band))，使得数字分音器120具有精准的分音效果，而不受到平衡电枢单体阻抗特性影响，另外，数字分音器120可用集成电路来实现，实现高阶数字滤波器HPF、MPF、LPF的生产成本及所占用的体积/面积也远小于被动分音器(Passive Crossover)所需的生产成本及体积/面积，进而降低生产成本及电路面积。
需注意的是，前述实施例用来说明本申请的概念，本领域具通常知识者当可据以做不同之修饰，而不限于此。举例来说，耳机不限于三音路耳机，本申请的耳机可为二音路(Two-Way)或多音路(Multi-Way)，亦属于本申请的范畴。另外，于耳机本体中的单体不限于全为平衡电枢单体，于耳机本体中的单体可为动圈单体，亦属于本申请的范畴。另外，信号处理模块不限于设置于耳机本体中，信号处理模块亦可设置于耳机接头中，同样地，数字分音器不限于设置于耳机接头中，数字分音器亦可设置于耳机本体中，亦属于本申请的范畴。另外，本申请可应用于无线耳机，即本申请的耳机本体可为无线耳机本体，在此情形下，音频系统中并串转换器与串并转换器之间的传输介质可为空气，亦属于本申请的范畴。
另外，本申请的概念可应用于具有左右声道的耳机。请参考图3，图3为本申请实施例一耳机30的功能方块示意图。耳机30包括一耳机接头32、一左声道耳机本体14_L以及一右声道耳机本体14_R，耳机接头32包括数字分音器120_L、120_R，分别用来对左声道数字音频信号DA_L、右声道数字音频信号DA_R进行分音操作，以产生左声道分频数字信号DHF_L、DMF_L、DLF_L以及右声道分频数字信号DHF_R、DMF_R、DLF_R至一并串转换器322，另外，左(右)声道耳机本体14_L(14_R)透过耳机导线16连接于耳机接头32，利用多个单体产生对应于数字分频信号DHF_L、DMF_L、DLF_L(DHF_R、 DMF_R、DLF_R)的多个分频音效，亦属于本申请的范畴。其中，并串转换器322不限于利用特定顺序对左声道分频数字信号DHF_L、DMF_L、DLF_L以及右声道分频数字信号DHF_R、DMF_R、DLF_R进行并串转换。关于耳机30的详细操作，请参考前述相关段落，于此不再赘述。
综上所述，本申请利用数字分音器，于数字域中进行数字分频操作，由于数字分音器以数字滤波器实现，可利用高阶数字滤波器以取得具有陡峭过渡频带的滤波频率响应，而得到精准的分音效果。另一方面，实现高阶数字滤波器的生产成本及所占用的体积/面积也远小于被动分音器所需的生产成本及体积/面积。因此，本申请具有精准分音效果，低生产成本及低电路面积的优点。
以上所述仅为本申请的部分实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (20)

  1. 一种音频系统，应用于一耳机，其中，所述音频系统包括：
    一数字分音器，用来接收一数字音频信号，并产生多个分频数字信号；以及
    多个单体，耦接于所述数字分音器，用来产生对应于所述多个分频数字信号的多个分频音效。
  2. 如权利要求1所述的音频系统，其中，所述数字分音器设置于所述耳机的一耳机接头。
  3. 如权利要求2所述的音频系统，还包括：
    一并串转换器，设置于所述耳机接头，耦接于所述数字分音器，并将所述多个分频数字信号以串行的方式传递至一传输介质。
  4. 如权利要求3所述的音频系统，其中，所述传输介质为一耳机导线。
  5. 如权利要求1所述的音频系统，其中，所述多个单体中至少一单体为一平衡电枢单体。
  6. 如权利要求1所述的音频系统，其中，所述数字分音器包含：
    多个数字滤波器，用来根据所述数字音频信号，产生所述多个分频数字信号。
  7. 如权利要求1所述的音频系统，包括：
    一信号处理模块，耦接于所述数字分音器与所述多个单体之间，用来根据所述多个分频数字信号，产生多个分频模拟信号；
    其中，所述多个单体产生对应于所述多个分频模拟信号的所述多个分频音效。
  8. 如权利要求7所述的音频系统，其中，所述信号处理模块包括：
    多个数模转换器，耦接于所述数字分音器，用来将所述多个分频数字信号转换成所述多个分频模拟信号。
  9. 如权利要求8所述的音频系统，其中，所述信号处理模块还包括：
    多个放大器，耦接于所述多个数模转换器，用来将所述多个分频模拟信号放大，以产生多个放大分频信号至所述多个单体；
    其中，所述多个单体根据所述多个放大分频信号，产生所述多个分频音效。
  10. 如权利要求7所述的音频系统，其中，所述信号处理模块设置于所述耳机的一耳机本体中。
  11. 如权利要求1所述的音频系统，还包括：
    一串并转换器，耦接于所述数字分音器与所述多个单体之间。
  12. 一种耳机，包括：
    一耳机接头，包括：
    一数字分音器，用来接收一数字音频信号，并产生多个分频数字信号；以及
    一耳机本体，包括：
    多个单体，耦接于所述数字分音器，用来产生对应于所述多个分频数字信号的多个分频音效。
  13. 如权利要求13所述的耳机，其中，所述耳机接头还包括：
    一并串转换器，耦接于所述数字分音器，并将所述多个分频数字信号以串行的方式传递至一传输介质。
  14. 如权利要求13所述的耳机，其中，所述传输介质为一耳机导线。
  15. 如权利要求12所述的耳机，其中，所述多个单体中至少一单体为一平衡电枢单体。
  16. 如权利要求12所述的耳机，其中，所述数字分音器包含：
    多个数字滤波器，用来根据所述数字音频信号，产生所述多个分频数字信号。
  17. 如权利要求12所述的耳机，包括：
    一信号处理模块，耦接于所述数字分音器与所述多个单体之间，用来根据所述多个分频数字信号，产生多个分频模拟信号；
    其中，所述多个单体产生对应于所述多个分频模拟信号的所述多个分频音效。
  18. 如权利要求17所述的耳机，其中，所述信号处理模块包括：
    多个数模转换器，耦接于所述数字分音器，用来将所述多个分频数字信号转换成所述多个分频模拟信号。
  19. 如权利要求18所述的耳机，其中，所述信号处理模块还包括：
    多个放大器，耦接于所述多个数模转换器，用来将所述多个分频模拟信号放大，以产生多个放大分频信号至所述多个单体；
    其中，所述多个单体根据所述多个放大分频信号，产生所述多个分频音效。
  20. 如权利要求12所述的耳机，还包括：
    一串并转换器，耦接于所述数字分音器与所述多个单体之间。
PCT/CN2017/077774 2017-03-22 2017-03-22 音频系统及耳机 WO2018170807A1 (zh)

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