WO2018168233A1 - Curable composition, cured object, optical member, and lens - Google Patents

Curable composition, cured object, optical member, and lens Download PDF

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Publication number
WO2018168233A1
WO2018168233A1 PCT/JP2018/003179 JP2018003179W WO2018168233A1 WO 2018168233 A1 WO2018168233 A1 WO 2018168233A1 JP 2018003179 W JP2018003179 W JP 2018003179W WO 2018168233 A1 WO2018168233 A1 WO 2018168233A1
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group
curable composition
compound
cured product
atom
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PCT/JP2018/003179
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French (fr)
Japanese (ja)
Inventor
貴文 中山
直之 師岡
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富士フイルム株式会社
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Priority to JP2019505755A priority Critical patent/JP6743279B2/en
Publication of WO2018168233A1 publication Critical patent/WO2018168233A1/en

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/38Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/20Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F4/00Polymerisation catalysts
    • C08F4/28Oxygen or compounds releasing free oxygen
    • C08F4/32Organic compounds
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics

Definitions

  • the present invention relates to a curable composition, a cured product, an optical member, and a lens.
  • glass materials have been used for optical members of imaging modules such as cameras, video cameras, camera-equipped mobile phones, videophones, and camera doorphones. Glass materials have been used preferably because they have various optical properties and are excellent in environmental resistance. However, they have the disadvantages that weight reduction and size reduction are not easy, and workability and productivity are poor. On the other hand, the cured resin can be mass-produced and is excellent in workability, and has recently been used for various optical members.
  • Patent Document 1 discloses that a curable composition capable of forming a cured product having a low Abbe number can be obtained by using a compound having a fluorene skeleton and a compound having an aromatic ring condensed ring group. It is disclosed.
  • Patent Document 2 discloses an optical material containing a cage-type polysilsesquioxane derivative having a specific structure, a bifunctional (meth) acrylate having a fluorene structure, and a bifunctional fluorine-containing (meth) acrylate.
  • a resin precursor composition is disclosed.
  • the partial dispersion ratio ( ⁇ g, F) tends to decrease as the Abbe number ( ⁇ d) of the cured product increases, and the Abbe number ( ⁇ d) and the partial dispersion ratio ( ⁇ g, It is known that the value of F) has a negative correlation.
  • a partial dispersion ratio ( ⁇ g, F) higher than the predicted partial dispersion ratio ( ⁇ g, F) in a cured product having a predetermined Abbe number may be required.
  • Patent Documents 1 and 2 a sufficiently high partial dispersion ratio ( ⁇ g, F) in a cured product having a predetermined Abbe number has not been obtained. For this reason, development of the curable composition which can shape
  • the surface shape of the cured product is required to be highly accurate, and the development of a curable composition excellent in mold transferability is also required.
  • the present inventors have a partial dispersion ratio ( ⁇ g, F) that is higher than the partial dispersion ratio ( ⁇ g, F) predicted for a cured product having a predetermined Abbe number.
  • the present invention has been studied for the purpose of providing a curable composition capable of forming a cured product having).
  • the present inventors have also studied for the purpose of providing a curable composition having excellent mold transferability.
  • the concrete means for solving the above problems are as follows.
  • Compound A represented by the following general formula (A): Compound B having at least one fluorine atom and at least one radical crosslinkable group in one molecule; At least one selected from a thermal radical polymerization initiator and a photo radical polymerization initiator; A curable composition comprising:
  • Ar 11 and Ar 12 each independently represent an aryl group containing a benzene ring surrounded by a broken line or a heteroaryl group containing a benzene ring surrounded by a broken line as one of condensed rings;
  • X 1 , Y 1 , X 2 and Y 2 are each independently an oxygen atom, a sulfur atom, a nitrogen atom or a carbon atom, and Z 1 is a 5- to 7-membered aromatic ring together with X 1 —C ⁇ C—Y 1
  • Ar 11 to Ar 14 are each independently a condensed ring group containing an aromatic ring surrounded by a broken line as one of the condensed rings, a group having L 1 as a linking group, a group having L 2 as a linking group, and R 3 to R 6 may be each independently substituted with an aromatic ring surrounded by a broken line, or may be substituted with a condensed ring other than the aromatic ring surrounded by a broken line.
  • a curable composition capable of forming a cured product having a partial dispersion ratio ( ⁇ g, F) higher than an expected partial dispersion ratio ( ⁇ g, F) in a cured product having a predetermined Abbe number.
  • ⁇ g, F partial dispersion ratio
  • ⁇ g, F expected partial dispersion ratio
  • die transferability can be obtained.
  • a numerical range expressed using “to” means a range including numerical values described before and after “to” as a lower limit value and an upper limit value.
  • (meth) acrylate represents acrylate and methacrylate
  • (meth) acryloyl represents acryloyl and methacryloyl.
  • the monomer in the present invention is distinguished from oligomers and polymers, and refers to a compound having a weight average molecular weight of 1,000 or less.
  • the notation that does not indicate substitution and non-substitution includes those having no substituent and those having a substituent.
  • the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
  • the curable composition contains a compound A represented by the general formula (A) described later and a compound B having at least one fluorine atom and at least one radical crosslinkable group in one molecule.
  • the curable composition is molded into a cured product having a partial dispersion ratio ( ⁇ g, F) higher than the predicted partial dispersion ratio ( ⁇ g, F) in the cured product having a predetermined Abbe number. Can do. Also, it exhibits excellent mold transferability.
  • the Abbe number ( ⁇ d) and the partial dispersion ratio ( ⁇ g, F) of the cured product formed from the curable composition are values measured using an Abbe refractometer (manufactured by Kalnew Optical Industry Co., Ltd.). Specifically, the curable composition is poured into a transparent glass mold having a diameter of 10 mm and a thickness of 1 mm and heated at 200 ° C. in an atmosphere having an oxygen concentration of 1% or less to form a cured product (heating step). The Abbe number ( ⁇ d) and the partial dispersion ratio ( ⁇ g, F) are measured for the cured product. The Abbe number ( ⁇ d) and the partial dispersion ratio ( ⁇ g, F) of the cured product are calculated by the following equations.
  • ⁇ d (nd ⁇ 1) / (nF ⁇ nC) ⁇ g
  • F (ng ⁇ nF) / (nF ⁇ nC)
  • nd represents a refractive index at a wavelength of 587.56 nm
  • nF represents a refractive index at a wavelength of 486.13 nm
  • nC represents a refractive index at a wavelength of 656.27 nm
  • ng represents a refractive index at a wavelength of 435.83 nm.
  • the predicted partial dispersion ratio ( ⁇ g, F) is represented by the Abbe number ( ⁇ d) based on the d-line as the horizontal axis and the partial dispersion ratio ( ⁇ g, F) as the vertical axis.
  • the partial dispersion ratio ( ⁇ g, F) on this standard line is there.
  • Glass type A has an Abbe number ( ⁇ d) of 60.49 and a partial dispersion ratio ( ⁇ g, F) of 0.5436.
  • the Abbe number ( ⁇ d) of the glass type B is 36.26
  • the partial dispersion ratio ( ⁇ g, F) is 0.5828.
  • the standard line is a straight line connecting these two points.
  • ⁇ ( ⁇ g, F) is a difference between the partial dispersion ratio ( ⁇ g, F) of the object and the partial dispersion ratio ( ⁇ g, F) on the standard line, and is calculated by the following equation.
  • ⁇ ( ⁇ g, F) Partial dispersion ratio ( ⁇ g, F) of the object ⁇ Partial dispersion ratio ( ⁇ g, F) on the standard line having the same Abbe number ( ⁇ d) as the object It can be said that the higher the value of ⁇ ( ⁇ g, F) calculated by the above formula, the higher the partial dispersion ratio ( ⁇ g, F) than the predicted partial dispersion ratio ( ⁇ g, F).
  • ⁇ ( ⁇ g, F) is preferably 0.040 or more, more preferably 0.046 or more, further preferably 0.060 or more, and 0.080 or more. Is more preferable, and 0.100 or more is particularly preferable.
  • the Abbe number of the cured product formed from the curable composition of the present invention is not particularly limited, but the Abbe number of the cured product is preferably 35 or less, more preferably 30 or less, and 27 More preferably, it is more preferably 25 or less.
  • the curable composition of the present invention can exhibit excellent mold transferability.
  • the mold transferability can be evaluated based on the yield rate by curing 100 curable compositions and molding 100 cured products.
  • a product with fine irregularities (wrinkles) on the surface of the cured product is evaluated as a defective product, and a product with no unevenness is evaluated as a good product.
  • the non-defective rate is preferably 50% or more, more preferably 70% or more, and further preferably 90% or more.
  • the viscosity of the curable composition of the present invention is preferably 20,000 mPa ⁇ s or less, more preferably 15,000 mPa ⁇ s or less, and further preferably 13,000 mPa ⁇ s or less. 000 mPa ⁇ s or less is particularly preferable.
  • the viscosity of the curable composition is preferably 2,000 mPa ⁇ s or more, more preferably 3,000 mPa ⁇ s or more, further preferably 4,000 mPa ⁇ s or more, 000 mPa ⁇ s or more is particularly preferable.
  • a curable composition contains the compound A represented by the following general formula (A).
  • Ar 11 and Ar 12 each independently represent an aryl group containing a benzene ring surrounded by a broken line or a heteroaryl group containing a benzene ring surrounded by a broken line as one of condensed rings.
  • X 1 , Y 1 , X 2 and Y 2 are each independently an oxygen atom, a sulfur atom, a nitrogen atom or a carbon atom
  • Z 1 is a 5- to 7-membered aromatic ring together with X 1 —C ⁇ C—Y 1
  • Z 2 represents 5 to 7 together with X 2 —C ⁇ C—Y 2
  • An atomic group that forms a member aromatic ring and represents an atomic group that includes at least one selected from an oxygen atom, a sulfur atom, a nitrogen atom, and a carbon atom.
  • Ar 13 and Ar 14 each independently represent an arylene group containing an aromatic ring surrounded by a broken line or a heteroarylene group containing an aromatic ring surrounded by a broken line, and at least one of Ar 13 and Ar 14 is other than a phenylene group It is the basis of.
  • R 3 to R 6 each independently represents a substituent
  • q and r are each independently an integer of 0 to 4
  • v is an integer of 0 or more
  • w is an integer of 0 or more
  • L 1 and L 2 each independently represents a single bond, an oxygen atom or a sulfur atom
  • R 11 and R 12 each independently represent an ether bond, an ester bond, a thioether bond, a thioester bond, an amide bond, a carbonate bond and an alkylene.
  • a linking group containing at least one selected from a group or a single bond is represented, and R 21 and R 22 each independently represents a hydrogen atom or a methyl group.
  • Ar 11 to Ar 14 are each independently a condensed ring group containing an aromatic ring surrounded by a broken line as one of the condensed rings, a group having L 1 as a linking group, a group having L 2 as a linking group, and R 3 to R 6 may be each independently substituted with an aromatic ring surrounded by a broken line, or may be substituted with a condensed ring other than the aromatic ring surrounded by a broken line.
  • Ar 11 and Ar 12 each independently represent an aryl group containing a benzene ring surrounded by a broken line or a heteroaryl group containing a benzene ring surrounded by a broken line as one of condensed rings.
  • Ar 11 and Ar 12 are preferably each independently an aryl group containing a benzene ring surrounded by a broken line.
  • the aryl group is preferably an aryl group having 6 to 18 carbon atoms, and an aryl group having 6 to 14 carbon atoms More preferably, it is an aryl group having 6 to 10 carbon atoms.
  • Ar 11 and Ar 12 are particularly preferably each independently a phenyl group composed of only a benzene ring surrounded by a broken line.
  • the heteroaryl group is preferably a heteroaryl group having 9 to 14 ring members. More preferably, it is a heteroaryl group having 9 to 10 ring members.
  • examples of the hetero atom include a nitrogen atom, an oxygen atom, and a sulfur atom.
  • X 1 , Y 1 , X 2 and Y 2 are each independently an oxygen atom, a sulfur atom, a nitrogen atom or a carbon atom. All of X 1 , Y 1 , X 2 and Y 2 may be carbon atoms, and all of X 1 , Y 1 , X 2 and Y 2 may be atoms other than carbon (from oxygen atoms, sulfur atoms and nitrogen atoms). At least one selected).
  • At least a part of X 1 , Y 1 , X 2 and Y 2 is a carbon atom, and a part of X 1 , Y 1 , X 2 and Y 2 is selected from an oxygen atom, a sulfur atom and a nitrogen atom.
  • One kind may be sufficient.
  • Z 1 is an atomic group that forms a 5- to 7-membered aromatic ring with X 1 —C ⁇ C—Y 1 , and an atom containing at least one selected from an oxygen atom, a sulfur atom, a nitrogen atom, and a carbon atom
  • Z 2 represents an atomic group that forms a 5- to 7-membered aromatic ring together with X 2 —C ⁇ CY 2 , and is at least one selected from an oxygen atom, a sulfur atom, a nitrogen atom, and a carbon atom Represents a group of atoms including species.
  • Z 1 and Z 2 are each independently preferably an atomic group containing a carbon atom, and more preferably an atomic group consisting of a carbon atom.
  • Z 1 is preferably an atomic group that forms a 5- or 6-membered aromatic ring together with X 1 —C ⁇ CY 1 , and more preferably an atomic group that forms a 6-membered aromatic ring.
  • Z 2 is preferably an atomic group that forms a 5- or 6-membered aromatic ring together with X 2 —C ⁇ C—Y 2 , and more preferably an atomic group that forms a 6-membered aromatic ring.
  • Ar 13 and Ar 14 each independently represent an arylene group including an aromatic ring surrounded by a broken line or a heteroarylene group including an aromatic ring surrounded by a broken line.
  • the arylene group is preferably an arylene group having 6 to 18 carbon atoms, and an arylene group having 6 to 14 carbon atoms More preferably, it is an arylene group having 6 to 10 carbon atoms.
  • the heteroarylene group is preferably a heteroarylene group having 9 to 14 ring members. More preferably, it is a heteroarylene group having 9 to 10 ring members.
  • examples of the hetero atom include a nitrogen atom, an oxygen atom, and a sulfur atom.
  • At least one of Ar 13 and Ar 14 is a group other than a phenylene group. At least one of Ar 13 and Ar 14 is preferably a condensed ring group containing an aromatic ring surrounded by a broken line, or the aromatic ring surrounded by a broken line is a hetero ring. Among them, at least one of Ar 13 and Ar 14 is more preferably a condensed ring group containing an aromatic ring surrounded by a broken line, and examples of the condensed ring group include naphthylene. In particular, Ar 14 is preferably a condensed ring group containing an aromatic ring surrounded by a broken line.
  • the condensed ring contains a hetero atom, and a nitrogen atom can be illustrated preferably as a hetero atom.
  • Ar 13 and Ar 14 are preferably not the same group. In this case, the other of Ar 13 or Ar 14 is particularly preferably a phenylene group.
  • R 3 to R 6 each independently represents a substituent.
  • the substituent represented by R 3 to R 6 is not particularly limited, and examples thereof include halogen atoms, halogenated alkyl groups, alkyl groups, alkenyl groups, acyl groups, hydroxyl groups, hydroxyalkyl groups, alkoxy groups, aryl groups, and heteroaryls.
  • the substituent represented by R 3 to R 6 is preferably a halogen atom, an alkyl group, an alkoxy group, an aryl group or a cyano group, and is preferably a halogen atom, an alkyl group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 5 carbon atoms. More preferably a phenyl group or a cyano group, and particularly preferably a halogen atom, a methyl group, a methoxy group, a phenyl group or a cyano group.
  • R 3 and R 4 are preferably each independently a methyl group or a methoxy group
  • R 5 is preferably a halogen atom, a methyl group, or a methoxy group
  • R 6 is a halogen atom, a methyl group, or a methoxy group. It is preferably a group or a cyano group.
  • q and r are each independently an integer of 0 to 4, preferably an integer of 0 to 3, and more preferably an integer of 0 to 2.
  • V is an integer of 0 or more, and the maximum number of v is the maximum number of substituents that can be substituted on the ring formed by X 1 —C ⁇ C—Y 1 and Z 1 .
  • v is preferably an integer of 0 to 3, and more preferably an integer of 0 to 2.
  • w is an integer of 0 or more, and the maximum number of w is the maximum number of substituents that can be substituted on the ring formed by X 2 —C ⁇ C—Y 2 and Z 2 .
  • w is preferably an integer of 0 to 3, and more preferably an integer of 0 to 2.
  • all of q, r, v, and w may be 0.
  • the plurality of R 3 may be the same or different, and when r is an integer of 2 to 4, the plurality of R 4 may be the same. May be different.
  • v is an integer of 2 or more, the plurality of R 5 may be the same or different, and when w is an integer of 2 or more, the plurality of R 6 may be the same or different. Good.
  • L 1 and L 2 each independently represents a single bond, an oxygen atom or a sulfur atom.
  • L 1 and L 2 are each independently preferably an oxygen atom or a sulfur atom, and more preferably an oxygen atom.
  • R 11 and R 12 each independently represents a linking group containing at least one selected from an ether bond, an ester bond, a thioether bond, a thioester bond, an amide bond, a carbonate bond and an alkylene group, or a single bond.
  • R 11 and R 12 are each independently a linking group containing at least one selected from an ether bond, an ester bond, a carbonate bond and an alkylene group, or a single bond, preferably a linking group containing an alkylene group. It is more preferable. Among these, it is particularly preferable that R 11 and R 12 are each independently a linking group composed of an alkylene group.
  • the alkylene group preferably has 2 to 8 carbon atoms, more preferably 2 to 6 carbon atoms, and still more preferably 2 to 4 carbon atoms.
  • R 21 and R 22 each independently represents a hydrogen atom or a methyl group, and is preferably a hydrogen atom.
  • Ar 11 to Ar 14 are each independently a condensed ring group containing an aromatic ring surrounded by a broken line as one of the condensed rings, a group having L 1 as a linking group and a group having L 2 as a linking group , And R 3 to R 6 may be independently substituted with an aromatic ring surrounded by a broken line or may be substituted with a condensed ring other than the aromatic ring surrounded by a broken line.
  • MeO represents a methoxy group.
  • the compound A is preferably A-1, A-2, A-3, A-4, A-5, A-6, and A-1, A-2, A-3, A-5 A-6 is more preferable, and A-3 and A-6 are particularly preferable.
  • the content of Compound A in the curable composition is preferably 10 to 80% by mass, more preferably 20 to 70% by mass, and more preferably 30 to 60% by mass with respect to the total mass of the curable composition. More preferably, it is mass%.
  • the curable composition may contain two or more compounds A represented by the general formula (A). When 2 or more types of compounds A are contained, the total content is preferably within the above range.
  • the curable composition includes Compound B having at least one fluorine atom and at least one radical crosslinkable group in one molecule. By including such a compound, a curable composition excellent in mold transferability can be obtained.
  • the radical crosslinkable group possessed by Compound B include (meth) acryloyl group, ⁇ -fluoroacryloyl group, ⁇ -trifluoromethylacryloyl group, allyl group, vinyl group, vinyloxy group and the like.
  • a radical crosslinkable group is a (meth) acryloyl group or an allyl group.
  • Compound B may be (1) a monofunctional monomer having at least one fluorine atom and one radical crosslinkable group in one molecule, and (2) at least one fluorine atom and radical crosslinkable in one molecule. It may be a polyfunctional monomer having two or more groups, or (3) a reactive polymer having at least one fluorine atom and a radical crosslinkable group in the side chain. Further, as the compound B, two or more kinds selected from the above (1) monofunctional monomer, (2) polyfunctional monomer, and (3) reactive polymer may be used in combination.
  • Monofunctional monomers having at least one fluorine atom and one radical crosslinkable group in one molecule include, for example, 1H, 1H, 2H, 2H-heptadecafluorodecyl (meth) acrylate, 1H, 1H, 5H-octafluoropentyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, 2,2,2-trifluoroethyl (meth) acrylate, 2- (perfluorobutyl) ethyl (meth) ) Acrylate, 2- (perfluorohexyl) ethyl (meth) acrylate, and 2- (perfluorooctyl) ethyl (meth) acrylate.
  • Examples of the polyfunctional monomer having at least one fluorine atom and two or more radical crosslinkable groups in one molecule include 1,3-bis ⁇ (meth) acryloyloxy ⁇ -2,2-difluoropropane, 1,4-bis ⁇ (meth) acryloyloxy ⁇ -2,2,3,3-tetrafluorobutane, 1,5-bis ⁇ (meth) acryloyloxy ⁇ -2,2,3,3,4,4- Hexafluoropentane, 1,6-bis ⁇ (meth) acryloyloxy ⁇ -2,2,3,3,4,4,5,5-octafluorohexane, 1,7-bis ⁇ (meth) acryloyloxy ⁇ - 2,2,3,3,4,4,5,5,6,6-decafluoroheptane, 1,8-bis ⁇ (meth) acryloyloxy ⁇ -2,2,3,3,4,4,5 , 5,6,6,7,7-dodecaful Looctane,
  • Examples of the reactive polymer having at least one fluorine atom and radical crosslinkable group in the side chain include the structural unit (a) having a fluorine atom in the side chain and the structural unit having a crosslinkable group in the side chain. Mention may be made of polymers having (b).
  • the molecular weight (weight average molecular weight) of the reactive polymer having a radical crosslinkable group in the side chain is preferably 1,000 to 500,000, more preferably 3,000 to 300,000, More preferably, it is from 000 to 100,000.
  • the weight average molecular weight of the reactive polymer having a radical crosslinkable group in the side chain is a value calculated in terms of standard polystyrene by GPC (Gel Permeation Chromatography) method.
  • the structural unit (a) having a fluorine atom in the side chain a structural unit derived from a monofunctional monomer having one radical crosslinkable group in one molecule of (1) described above can be mentioned.
  • a structural unit (b) which has a crosslinkable group in a side chain the structural unit which has the following structures can be mentioned, for example.
  • R 1 and R 2 each independently represent a hydrogen atom or a methyl group.
  • a structural unit of the reactive polymer having at least one fluorine atom and a radical crosslinkable group in the side chain a structural unit other than the structural unit (a) and the structural unit (b) may be included.
  • the structural unit which has an aryl group in a side chain can be mentioned, for example.
  • the compatibility of the compound A and the compound B can be improved because the reactive polymer having a radical crosslinkable group in the side chain further has a structural unit having an aryl group in the side chain.
  • the structural unit which has the following structures can be mentioned, for example.
  • Ra represents hydrogen or a methyl group.
  • N represents an integer of 0 to 10, preferably 0 to 2, and more preferably 0 or 1.
  • Compound B has at least one fluorine atom in one molecule, and has at least one group selected from a fluoroalkyl group, a perfluoroalkyl group, a perfluoroalkylene group, and a perfluoroalkyleneoxy group. Preferably there is.
  • the proportion of fluorine atoms in one molecule of Compound B is preferably 5% by mass or more, more preferably 20% by mass or more, and further preferably 30% by mass or more.
  • the content of Compound B in the curable composition is preferably 5 to 70% by mass, more preferably 10 to 60% by mass, and more preferably 20 to 50% with respect to the total mass of the curable composition. More preferably, it is mass%.
  • the content of fluorine atoms contained in the curable composition is preferably 1% by mass or more, more preferably 5% by mass or more, and further preferably 7% by mass or more. It is particularly preferable that the content is at least mass%. Moreover, it is preferable that content of the fluorine atom contained in a curable composition is 30 mass% or less.
  • the curable composition may further contain other components in addition to Compound A and Compound B described above. Specific examples of other components include the following.
  • the curable composition further contains a (meth) acrylate monomer described later, a non-conjugated vinylidene group-containing compound, and at least one selected from a photoradical polymerization initiator and a thermal radical polymerization initiator. Also good.
  • the curable composition may contain a (meth) acrylate monomer.
  • the (meth) acrylate monomer may be a polyfunctional (meth) acrylate monomer having two or more (meth) acryloyl groups in the molecule, and may be a monofunctional (meta) having one (meth) acryloyl group in the molecule. ) May be an acrylate monomer.
  • Specific examples of the (meth) acrylate monomer include (meth) acrylate monomers described in paragraphs 0037 to 0046 of JP2012-107191A.
  • Examples of the (meth) acrylate monomer that can be preferably used in the present invention include a monofunctional (meth) acrylate monomer having an aromatic ring represented by monomer 1 (phenoxyethyl acrylate) or monomer 2 (benzyl acrylate), and monomer 3 Examples thereof include a monofunctional (meth) acrylate monomer having an aliphatic ring represented by (tricyclodecane dimethanol diacrylate) or monomer 4 (dicyclopentanyl acrylate).
  • the molecular weight of the (meth) acrylate monomer is preferably 100 to 500.
  • the method for obtaining the (meth) acrylate monomer is not particularly limited, and may be obtained commercially or may be produced by synthesis.
  • biscoat # 192 PEA (monomer 1) (manufactured by Osaka Organic Chemical Industry Co., Ltd.)
  • biscoat # 160 BZA (monomer 2) (manufactured by Osaka Organic Chemical Industry Co., Ltd.)
  • A-DCP Monomer 3) (manufactured by Shin-Nakamura Chemical Co., Ltd.)
  • FA-513AS monomer 4 (manufactured by Hitachi Chemical Co., Ltd.)
  • the content of the (meth) acrylate monomer is preferably 1 to 80% by mass with respect to the total mass of the curable composition, and is preferably 2 to 50%. More preferably, it is more preferably 3 to 40% by mass.
  • the curable composition may include a non-conjugated vinylidene group-containing compound.
  • a non-conjugated vinylidene group-containing compound compounds described in paragraphs 0016 to 0033 of JP2012-107191A can be used. This specification incorporates the contents described in paragraphs 0016 to 0033 of JP2012-107191A.
  • the molecular weight of the non-conjugated vinylidene group-containing compound is preferably 100 to 400, more preferably 120 to 350, and particularly preferably 130 to 300.
  • the method for obtaining the non-conjugated vinylidene group-containing compound is not particularly limited, and may be obtained commercially or synthesized.
  • ⁇ -caryophyllene manufactured by Inoue Fragrance Co., Ltd.
  • (+)-limonene manufactured by Tokyo Chemical Industry Co., Ltd.
  • the content of the non-conjugated vinylidene group-containing compound is preferably 0.5 to 30% by mass with respect to the total mass of the curable composition.
  • the content is more preferably 1 to 25% by mass, and further preferably 2 to 20% by mass.
  • the curable composition contains at least one selected from a thermal radical polymerization initiator and a photo radical polymerization initiator.
  • the curable composition preferably contains a thermal radical polymerization initiator.
  • cured material with high heat resistance can be shape
  • the following compounds can be used as the thermal radical polymerization initiator.
  • 1,1-di (t-hexylperoxy) cyclohexane 1,1-di (t-butylperoxy) cyclohexane, 2,2-di (4,4-di- (t-butylperoxy) cyclohexyl) propane, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurate, dicumyl peroxide, di-t-butylperoxide, t-butylperoxy-2 -Ethylhexanoate, t-hexylperoxy-2-ethylhexanoate, cumene hydroperoxide, t-butyl hydroperoxide, t-butylperoxy-2-ethylhexyl, 2,3-dimethyl-2,
  • a curable composition contains a hydroperoxide compound as a thermal radical polymerization initiator.
  • the hydroperoxide compound is a peroxide and a compound having a peroxy group.
  • one oxygen atom of the peroxy group (—O—O—) is substituted with a hydrogen atom, and includes a hydroperoxide group (—O—O—H).
  • a hydroperoxide compound having a hydroperoxide group in the molecule has an effect of promoting chain transfer during the polymerization of the non-conjugated vinylidene group-containing compound, and has more controllability of the three-dimensional structure when the curable composition is cured. It is possible to improve and impart deformability to the semi-cured product.
  • the method for obtaining the hydroperoxide compound is not particularly limited, and may be obtained commercially or synthesized.
  • Park Mill H-80 cumene hydroperoxide manufactured by Nippon Oil & Fats Co., Ltd. can be used.
  • the thermal radical polymerization initiator includes a hydroperoxide compound and another thermal radical polymerization initiator.
  • thermal radical polymerization initiators include non-hydroperoxide compounds.
  • the hydroperoxide compound generally has a high temperature for initiating thermal radical polymerization, it preferably contains both non-hydroperoxide compounds having a low thermal polymerization initiation temperature.
  • Non-hydroperoxide compounds include t-butyl peroxy-2-ethylhexanoate (Nippon Yushi Co., Ltd., Perbutyl O), t-butyl peroxy-2-ethylhexyl carbonate (Nippon Yushi Co., Ltd., Perbutyl E). It is preferable to use peroxyester compounds such as
  • the content of the thermal radical polymerization initiator is preferably 0.01 to 10% by mass, more preferably 0.05 to 5.0% by mass, based on the total mass of the curable composition. More preferably, it is 0.05 to 2.0% by mass.
  • a curable composition contains radical photopolymerization initiator.
  • the following compounds can be used as the radical photopolymerization initiator.
  • radical photopolymerization initiators BASF Corporation, Irgacure 184 (1-hydroxycyclohexyl phenyl ketone), Irgacure 819 (bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide), Irgacure 651 (2,2 -Dimethoxy-1,2-diphenylethane-1-one), 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-methyl- 1- (4-methylthiophenyl) -2-morpholinopropan-1-one can be preferably used.
  • the content of the radical photopolymerization initiator is preferably 0.01 to 5.0% by mass and more preferably 0.05 to 1.0% by mass with respect to the total mass of the curable composition. Preferably, it is 0.05 to 0.5% by mass.
  • the curable composition preferably contains both a radical photopolymerization initiator and a thermal radical polymerization initiator. In this case, the total content of the radical photopolymerization initiator and the thermal radical polymerization initiator is the curable composition. It is preferably 0.01 to 10% by mass, more preferably 0.05 to 5.0% by mass, and 0.05 to 3.0% by mass with respect to the total mass of the product. Further preferred.
  • the curable composition may further include a polymer having a radical polymerizable group in the side chain, in addition to the above-described compound.
  • the polymer having a radical polymerizable group in the side chain does not contain a fluorine atom. Since the polymer having a radically polymerizable group in the side chain functions to increase the viscosity of the curable composition, it can also be called a thickener or a thickening polymer.
  • the polymer which has a radically polymerizable group in a side chain can be added when it is necessary to adjust the viscosity of a curable composition in a desired range.
  • the polymer having a radical polymerizable group in the side chain may be a homopolymer or a copolymer. Especially, it is preferable that the polymer which has a radically polymerizable group in a side chain is a copolymer.
  • the polymer having a radical polymerizable group in the side chain is a copolymer, it is sufficient that at least one copolymer component has a radical polymerizable group.
  • the polymer having a radically polymerizable group in the side chain is a copolymer, it includes a monomer unit having a radically polymerizable group in the side chain and a monomer unit having an aryl group in the side chain. More preferably, it is a copolymer.
  • radical polymerizable group examples include (meth) acrylate group, vinyl group, styryl group, allyl group and the like.
  • the polymer having a radically polymerizable group in the side chain preferably contains 5 to 100% by weight of repeating units having a radically polymerizable group, and more preferably 10 to 90% by weight. 20 to 80% by mass is more preferable.
  • the polymer having a radically polymerizable group preferably used in the side chain is listed below, but the polymer having a radically polymerizable group in the side chain is not limited to the following structure.
  • Ra and Rb each independently represent hydrogen or a methyl group.
  • a plurality of Ra in one polymer may be the same or different.
  • N represents an integer of 0 to 10, preferably an integer of 0 to 2, and more preferably 0 or 1.
  • the molecular weight (weight average molecular weight) of the polymer having a radical polymerizable group in the side chain is preferably 1,000 to 10,000,000, more preferably 5,000 to 300,000. More preferably, it is from 1,000,000 to 200,000.
  • the glass transition temperature of the polymer having a radical polymerizable group in the side chain is preferably 50 to 400 ° C., more preferably 70 to 350 ° C., and further preferably 100 to 300 ° C. .
  • the content of the polymer having a radical polymerizable group in the side chain is preferably 40% by mass or less, more preferably 30% by mass or less, and more preferably 25% by mass with respect to the total mass of the curable composition. More preferably, it is% or less. In addition, 0 mass% may be sufficient as content of the polymer which has a radically polymerizable group in a side chain, and the aspect which does not add the polymer which has a radically polymerizable group in a side chain is also preferable.
  • the curable composition may contain additives, such as a polymer other than the component mentioned above, a monomer, a dispersing agent, a plasticizer, a heat stabilizer, and a mold release agent.
  • additives such as a polymer other than the component mentioned above, a monomer, a dispersing agent, a plasticizer, a heat stabilizer, and a mold release agent.
  • cured material includes the process of photocuring the curable composition mentioned above, and / or the process of thermosetting.
  • the method for producing a cured product includes a step of forming a semi-cured product by irradiating the curable composition with light or heating the curable composition, and irradiating the obtained semi-cured product with light or semi-cured. A step of forming a cured product by heating the cured product.
  • the step of forming the semi-cured product first includes a transfer step.
  • a transfer process is a process of pressing a metal mold
  • the transfer step the other mold is pressed against the curable composition injected into one of the pair of molds to spread the curable composition.
  • cured material is what performed the chromium nitride process. Thereby, a favorable mold releasability can be obtained in a release step performed in a later step, and the manufacturing efficiency of the optical member can be increased.
  • Examples of the chromium nitride treatment include a method of forming a chromium nitride film on the mold surface.
  • a method of forming a chromium nitride film on the mold surface there are, for example, a CVD (Chemical Vapor Deposition) method and a PVD (Physical Vapor Deposition) method.
  • the CVD method is a method of forming a chromium nitride film on a substrate surface by reacting a source gas containing chromium and a source gas containing nitrogen at a high temperature.
  • the PVD method is a method of forming a chromium nitride film on the surface of a substrate using an arc discharge (arc type vacuum deposition method).
  • arc type vacuum deposition method when a cathode (evaporation source) made of, for example, chromium is disposed in a vacuum vessel, an arc discharge is caused between the cathode and the wall of the vacuum vessel via a trigger, and the cathode is evaporated.
  • ionization of the metal by arc plasma is performed, a negative voltage is applied to the substrate, and a reaction gas such as nitrogen gas is introduced into the vacuum vessel by about several tens of mTorr (1.33 Pa), thereby bringing the ionized metal and the reaction gas into the substrate
  • a reaction gas such as nitrogen gas is introduced into the vacuum vessel by about several tens of mTorr (1.33 Pa), thereby bringing the ionized metal and the reaction gas into the substrate
  • the mold can be heated while pressing the contents by combining two molds, and when a low-viscosity composition is injected into the mold, the mold clearance is reached. Cause leakage. For this reason, it is preferable that the curable composition inject
  • a polymer having the above-described radical polymerizable group in the side chain may be added to the curable composition.
  • a step of forming a semi-cured product is provided.
  • the semi-cured product can be obtained by semi-curing the curable composition injected into the mold.
  • light irradiation or heating is performed.
  • such a process can also be called a semi-hardening process.
  • a semi-cured product In the step of forming a semi-cured product, at least one of light irradiation and heating is performed on the curable composition to obtain a semi-cured product having a complex viscosity of 10 5 to 10 8 mPa ⁇ s at 25 ° C. and a frequency of 10 Hz. It is preferable to form.
  • the “semi-cured product” in the present specification is a product obtained by polymerizing a curable composition, which is not completely solid and has a certain degree of fluidity.
  • a product having an upper limit value of complex viscosity of less than 1.0 ⁇ 10 9 mPa ⁇ s at 25 ° C. and a frequency of 10 Hz can be regarded as a semi-cured product. If the polymer of the curable composition has a complex viscosity of 10 5 to 10 8 mPa ⁇ s at 25 ° C. and a frequency of 10 Hz, the polymer is a semi-cured product.
  • the “cured product” is a product obtained by curing a curable composition by polymerization, and means a product in a completely solid state.
  • the light used for light irradiation is preferably ultraviolet light or visible light, and more preferably ultraviolet light.
  • a metal halide lamp, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a sterilization lamp, a xenon lamp, an LED (Light Emitting Diode) light source lamp, or the like is preferably used.
  • the atmosphere at the time of light irradiation is preferably air or an inert gas substitution atmosphere, and more preferably an atmosphere substituted with nitrogen until the oxygen concentration becomes 1% or less.
  • the heating semi-curing is performed so that the complex viscosity of the semi-cured product after heating at 25 ° C. and a frequency of 10 Hz is 10 5 to 10 8 mPa ⁇ s. preferable.
  • the present invention also relates to a semi-cured product produced by the method described above.
  • a semi-cured product can be preferably used in a method for producing a cured product to be described later.
  • the preferable range of the complex viscosity of the semi-cured product is the same as the preferable range of the complex viscosity of the semi-cured product in the step of forming the semi-cured product.
  • the radical photopolymerization initiator is completely consumed and may not be contained at all, or the radical photopolymerization initiator may remain.
  • the glass transition temperature of the semi-cured product is preferably ⁇ 150 to 0 ° C., more preferably ⁇ 50 to 0 ° C., and particularly preferably ⁇ 20 to 0 ° C.
  • the step of forming a cured product includes a polymerization step in which a semi-cured product is put into a mold and subjected to pressure deformation and heated to thermally polymerize or photopolymerized by light irradiation to obtain a cured product. Is preferred. In this specification, such a process can also be called a hardening process.
  • the light irradiation conditions and heating conditions in the process of forming the cured product are the same as the conditions in the semi-curing process described above.
  • the mold used in the polymerization process is also referred to as a thermoforming mold.
  • the thermoforming mold has a configuration in which two molds can be combined and heated while pressing the contents.
  • die as a shaping
  • a thermoforming mold for example, the one described in JP-A-2009-126011 can be used.
  • the metal mold has been subjected to a chromium nitride treatment.
  • the semi-cured product placed in the mold is subjected to pressure deformation, heated and thermally polymerized to obtain a cured product.
  • the pressure deformation and the heating may be performed at the same time, the heating may be performed after the pressure deformation, or the pressure deformation may be performed after the heating. It is preferable to carry out simultaneously. Further, it is also preferable that the pressure deformation and the heating are performed at the same time and the heating is further performed at a higher temperature after the pressure is stabilized.
  • the semi-cured product is heated and cured at a temperature of 150 ° C. or higher to obtain a cured product.
  • the heating temperature is 150 ° C. or higher, preferably 160 to 270 ° C., more preferably 165 to 250 ° C., and still more preferably 170 to 230 ° C.
  • the pressure in the pressure deformation is preferably 0.098 MPa to 9.8 MPa, more preferably 0.294 MPa to 4.9 MPa, and particularly preferably 0.294 MPa to 2.94 MPa.
  • the time for the thermal polymerization is preferably 30 to 1000 seconds, more preferably 30 to 500 seconds, and particularly preferably 60 to 300 seconds.
  • the atmosphere at the time of thermal polymerization is preferably air or an inert gas substitution atmosphere, and more preferably an atmosphere substituted with nitrogen until the oxygen concentration becomes 1% or less.
  • a release step is provided after the curing step.
  • thermal polymerization is performed in the curing step, it is preferable to pull the mold away from the cured product in the temperature range of 150 to 250 ° C. in the mold release step.
  • the temperature in the mold release step within the above range, the mold can be easily separated from the cured product, and the production efficiency can be increased.
  • cured material of this invention is not restricted to this, In the range which does not deviate from this invention, it can change suitably.
  • the mold used in the transfer process and the semi-curing process may be used as it is in the curing process. After performing the semi-curing process, the mold is separated from the semi-cured product, and this semi-cured product is separated from another mold.
  • the curing step may be performed by moving to a (thermoforming mold). In this case, it is preferable that the above-described chromium treatment is performed on the mold used in the semi-curing process and the curing process.
  • the curable composition in the mold may be irradiated with light and heated. Thereby, the semi-hardened material which has a desired degree of hardening can be obtained reliably.
  • the present invention also relates to a semi-cured product of the curable composition.
  • the semi-cured product is formed by semi-curing the above-described curable composition.
  • the semi-cured product of the present invention is preferably produced by the above-described method for producing a semi-cured product.
  • the semi-cured product preferably has a complex viscosity of 10 5 to 10 8 mPa ⁇ s at 25 ° C. and a frequency of 10 Hz.
  • the present invention also relates to a cured product of the curable composition.
  • the cured product is formed by curing the semi-cured component described above. It is preferable that the hardened
  • the cured product of the present invention preferably has a maximum thickness of 0.1 to 10 mm.
  • the maximum thickness is more preferably 0.1 to 5 mm, and particularly preferably 0.15 to 3 mm.
  • the cured product of the present invention preferably has a maximum diameter of 1 to 1000 mm.
  • the maximum diameter is more preferably 2 to 200 mm, and particularly preferably 2.5 to 100 mm.
  • the present invention also relates to an optical member including the above-described cured product. Since the hardened
  • the kind of the optical member of the present invention is not particularly limited. In particular, it can be suitably used as an optical member utilizing the excellent optical characteristics of the curable composition, particularly as an optical member that transmits light (so-called passive optical member).
  • optical functional device including such an optical member
  • various display devices liquid crystal display, plasma display, etc.
  • various projector devices OHP (Overhead projector), liquid crystal projector, etc.
  • optical fiber communication devices optical waveguide, An optical amplifier etc.
  • a photographing device such as a camera and a video, etc.
  • passive optical member used for an optical functional device for example, a lens, a prism, a prism sheet, a panel (plate-shaped molded body), a film, an optical waveguide (film-like or fiber-like), an optical disk, and an LED sealing Examples thereof include agents.
  • Such passive optical members include any coating layer, if necessary, such as a protective layer that prevents mechanical damage to the coated surface due to friction and wear, and an undesirable wavelength that causes deterioration of inorganic particles and substrates.
  • Light absorption layer that absorbs light transmission shielding layer that suppresses or prevents transmission of reactive low molecules such as moisture and oxygen gas, antiglare layer, antireflection layer, low refractive index layer, etc. It may be provided.
  • the optional coating layer include a transparent conductive film and gas barrier film made of an inorganic oxide coating layer, and a gas barrier film and hard coat film made of an organic coating layer.
  • a coating method for forming the coating layer a known coating method such as a vacuum deposition method, a CVD method, a sputtering method, a dip coating method, or a spin coating method can be used.
  • the optical member using the cured product of the present invention is particularly preferably used for a lens substrate.
  • the lens substrate produced using the curable composition of the present invention has a low Abbe number, and preferably has high refractive properties, light transmittance and light weight, and is excellent in optical properties.
  • the refractive index of the lens substrate can be arbitrarily adjusted by appropriately adjusting the type of monomer constituting the curable composition.
  • the “lens substrate” means a single member that can exhibit a lens function. A film or a member can be provided on the surface or the periphery of the lens substrate according to the use environment or application of the lens.
  • a protective film, an antireflection film, a hard coat film, or the like can be formed on the surface of the lens substrate. Moreover, it can be set as the compound lens laminated
  • the lens substrate When the lens substrate is used as a lens, the lens substrate itself may be used alone as a lens, or may be used as a lens by adding the above-described film, frame, or other lens substrate.
  • the type and shape of the lens using the lens substrate are not particularly limited.
  • the lens base material is preferably used for imaging lenses such as mobile phones and digital cameras, imaging lenses such as televisions and video cameras, vehicle-mounted lenses, and endoscope lenses.
  • Compound A-6 was synthesized in the same manner as in the synthesis of Compound A-3 except that Compound 6-1B was used instead of Compound 3-1B.
  • Compound B-1 2,2,2-trifluoroethyl acrylate (manufactured by Tokyo Chemical Industry)
  • Compound B-2 2,2,3,3,3-pentafluoropropyl acrylate (manufactured by Tokyo Chemical Industry)
  • Compound B-3 1H, 1H, 5H-octafluoropentyl acrylate (Osaka Organic Chemical Co., Ltd., Biscoat 8F)
  • Compound B-4 Diacrylic acid 2,2,3,3,4,4,5,5-octafluoro-1,6-hexanediol (manufactured by Tokyo Chemical Industry)
  • Examples 1 to 21 and Comparative Examples 1 to 3 Each component was added so that it might become a composition as described in the following table
  • Non-conjugated vinylidene group-containing compound ⁇ -caryophyllene (manufactured by Inoue Fragrance Co., Ltd.) or (+)-limonene (manufactured by Tokyo Chemical Industry Co., Ltd.) was used.
  • the optical isomer need not be particularly limited.
  • thermoset ⁇ Abbe number and partial dispersion ratio>
  • the curable compositions obtained in the examples and comparative examples were poured into a transparent glass mold having a diameter of 10 mm and a thickness of 1 mm, and heated to 200 ° C. in an atmosphere having an oxygen concentration of 1% or less to prepare a thermoset.
  • the Abbe number ( ⁇ d) and partial dispersion ratio ( ⁇ g, F) of the obtained thermoset were measured using an Abbe refractometer (manufactured by Kalnew Optical Industry Co., Ltd.).
  • ⁇ d (nd ⁇ 1) / (nF ⁇ nC) ⁇ g
  • F (ng ⁇ nF) / (nF ⁇ nC)
  • nd represents a refractive index at a wavelength of 587.56 nm
  • nF represents a refractive index at a wavelength of 486.13 nm
  • nC represents a refractive index at a wavelength of 656.27 nm
  • ng represents a refractive index at a wavelength of 435.83 nm.
  • ⁇ ( ⁇ g, F) was calculated.
  • ⁇ ( ⁇ g, F) is a graph in which the Abbe number ( ⁇ d) with respect to the d-line is the horizontal axis and the partial dispersion ratio ( ⁇ g, F) is the vertical axis, glass type A (Ohara Corporation, glass type name NSL7) Is the difference between the partial dispersion ratio ( ⁇ g, F) on the standard line and the partial dispersion ratio ( ⁇ g, F) of the target object, where the straight line connecting the glass and glass type B (Ohara Corporation, glass type name PBM2) is the standard line .
  • the thermosetting material was used for these measurements, even if it is the hardening material which performed the thermosetting after ultraviolet irradiation, there is no change in an Abbe number.
  • a cured product of the curable composition and the molding mold were separated at a rate of 0.05 mm / second to produce a composite lens (step of separating the mold). .
  • the above process was repeated 100 times to produce 100 compound lenses.

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Abstract

Provided is a curable composition from which a cured object having a given Abbe number can be molded, the cured object having a partial dispersion ratio (θg, F) higher than a partial dispersion ratio (θg, F) estimated from the Abbe number. The curable composition is excellent in terms of mold transferability. Also provided are the cured object, an optical member, and a lens. The curable composition comprises compound A represented by general formula (A), compound B having at least one fluorine atom and at least one radical-crosslinkable group in the molecule, and at least one initiator selected from among thermo-radical polymerization initiators and photo-radical polymerization initiators.

Description

硬化性組成物、硬化物、光学部材及びレンズCurable composition, cured product, optical member and lens
 本発明は、硬化性組成物、硬化物、光学部材及びレンズに関する。 The present invention relates to a curable composition, a cured product, an optical member, and a lens.
 従来、カメラ、ビデオカメラあるいはカメラ付携帯電話、テレビ電話あるいはカメラ付ドアホンなどの撮像モジュールの光学部材にはガラス材料が用いられていた。ガラス材料は様々な光学特性を備えており、環境耐性に優れるため好ましく用いられてきたが、軽量化や小型化が容易ではなく、加工性や生産性が悪いという欠点を有していた。これに対し、樹脂硬化物は、大量生産が可能であり、加工性にも優れているため、近年、様々な光学部材に用いられるようになってきている。 Conventionally, glass materials have been used for optical members of imaging modules such as cameras, video cameras, camera-equipped mobile phones, videophones, and camera doorphones. Glass materials have been used preferably because they have various optical properties and are excellent in environmental resistance. However, they have the disadvantages that weight reduction and size reduction are not easy, and workability and productivity are poor. On the other hand, the cured resin can be mass-produced and is excellent in workability, and has recently been used for various optical members.
 近年、撮像モジュールの小型化に伴い、撮像モジュールに用いられる光学部材を小型化することが求められているが、光学部材を小型化していくと、色収差の問題が生じる。樹脂硬化物を用いた光学部材においては、硬化性組成物に種々の添加物を加えて硬化後の特性を変えることで、アッベ数を調整して色収差の補正を行うことが検討されている。 In recent years, along with the downsizing of imaging modules, there has been a demand for downsizing optical members used in imaging modules. However, as optical members are downsized, problems of chromatic aberration arise. In optical members using a cured resin, it has been studied to correct chromatic aberration by adjusting the Abbe number by adding various additives to the curable composition to change the characteristics after curing.
 光学部材を製造するための硬化性組成物に用いられるモノマーとして、フルオレン骨格を有する化合物が用いられている。例えば、特許文献1には、フルオレン骨格を有する化合物であって、芳香環縮合環基を有する化合物を用いることで、低アッベ数である硬化物を成形し得る硬化性組成物が得られることが開示されている。また、特許文献2には、特定の構造を有するかご型ポリシルセスキオキサン誘導体と、フルオレン構造を有する2官能(メタ)アクリレートと、2官能含フッ素(メタ)アクリレートと、を含有する光学材料用樹脂前駆体組成物が開示されている。 As a monomer used in a curable composition for producing an optical member, a compound having a fluorene skeleton is used. For example, Patent Document 1 discloses that a curable composition capable of forming a cured product having a low Abbe number can be obtained by using a compound having a fluorene skeleton and a compound having an aromatic ring condensed ring group. It is disclosed. Patent Document 2 discloses an optical material containing a cage-type polysilsesquioxane derivative having a specific structure, a bifunctional (meth) acrylate having a fluorene structure, and a bifunctional fluorine-containing (meth) acrylate. A resin precursor composition is disclosed.
特許第5940496号公報Japanese Patent No. 5940496 特開2009-161487号公報JP 2009-161487 A
 光学特性を発揮し得る材料においては、硬化物のアッベ数(νd)が高くなるに従って、部分分散比(θg,F)は小さくなる傾向があり、アッベ数(νd)と部分分散比(θg,F)の値には負の相関関係があることが知られている。しかし、硬化物の用途によっては、所定のアッベ数を有する硬化物において予測される部分分散比(θg,F)よりも高い部分分散比(θg,F)が求められる場合がある。 In a material that can exhibit optical characteristics, the partial dispersion ratio (θg, F) tends to decrease as the Abbe number (νd) of the cured product increases, and the Abbe number (νd) and the partial dispersion ratio (θg, It is known that the value of F) has a negative correlation. However, depending on the use of the cured product, a partial dispersion ratio (θg, F) higher than the predicted partial dispersion ratio (θg, F) in a cured product having a predetermined Abbe number may be required.
 しかしながら、特許文献1及び2においては、所定のアッベ数を有する硬化物における部分分散比(θg,F)が十分に高いものが得られていなかった。このため、予測される部分分散比(θg,F)よりも高い部分分散比(θg,F)を発揮し得る硬化物を成形し得る硬化性組成物の開発が求められている。 However, in Patent Documents 1 and 2, a sufficiently high partial dispersion ratio (θg, F) in a cured product having a predetermined Abbe number has not been obtained. For this reason, development of the curable composition which can shape | mold the hardened | cured material which can exhibit a partial dispersion ratio ((theta) g, F) higher than the estimated partial dispersion ratio ((theta) g, F) is calculated | required.
 また、硬化物を成形する際には、硬化物の面形状の高精度化も求められており、金型転写性に優れた硬化性組成物の開発も求められている。 Also, when molding a cured product, the surface shape of the cured product is required to be highly accurate, and the development of a curable composition excellent in mold transferability is also required.
 そこで本発明者らは、このような従来技術の課題を解決するために、所定のアッベ数を有する硬化物において予測される部分分散比(θg,F)よりも高い部分分散比(θg,F)を有する硬化物を成形し得る硬化性組成物を提供することを目的として検討を進めた。また、本発明者らは、金型転写性に優れた硬化性組成物を提供することも目的として検討を進めた。 Therefore, in order to solve such problems of the prior art, the present inventors have a partial dispersion ratio (θg, F) that is higher than the partial dispersion ratio (θg, F) predicted for a cured product having a predetermined Abbe number. The present invention has been studied for the purpose of providing a curable composition capable of forming a cured product having). In addition, the present inventors have also studied for the purpose of providing a curable composition having excellent mold transferability.
 上記の課題を解決するための具体的手段は、以下の通りである。 The concrete means for solving the above problems are as follows.
[1] 下記一般式(A)で表される化合物Aと、
 少なくとも1つのフッ素原子及び少なくとも1つのラジカル架橋性基を1分子内に有する化合物Bと、
 熱ラジカル重合開始剤及び光ラジカル重合開始剤から選択される少なくとも1種と、
を含有する硬化性組成物;
Figure JPOXMLDOC01-appb-C000002

 一般式(A)中、Ar11及びAr12はそれぞれ独立に、破線で囲まれたベンゼン環を含むアリール基又は破線で囲まれたベンゼン環を縮合環のひとつとして含むヘテロアリール基を表す;
 X1、Y1、X2及びY2はそれぞれ独立に、酸素原子、硫黄原子、窒素原子又は炭素原子であり、Z1はX1-C=C-Y1とともに5~7員の芳香環を形成する原子群であって、酸素原子、硫黄原子、窒素原子及び炭素原子から選択される少なくとも1種を含む原子群を表し、Z2はX2-C=C-Y2とともに5~7員の芳香環を形成する原子群であって、酸素原子、硫黄原子、窒素原子及び炭素原子から選択される少なくとも1種を含む原子群を表す;
 Ar13及びAr14はそれぞれ独立に、破線で囲まれた芳香環を含むアリーレン基又は破線で囲まれた芳香環を含むヘテロアリーレン基を表し、Ar13とAr14のうち少なくとも一方はフェニレン基以外の基である;
 R3~R6はそれぞれ独立に、置換基を表し、q及びrはそれぞれ独立に、0~4の整数であり、vは0以上の整数であり、vの最大数は、X1-C=C-Y1とZ1が形成する環に置換可能な置換基の最大数であり、wは0以上の整数であり、wの最大数は、X2-C=C-Y2とZ2が形成する環に置換可能な置換基の最大数である;
 L1及びL2はそれぞれ独立に、単結合、酸素原子又は硫黄原子を表し、R11及びR12はそれぞれ独立に、エーテル結合、エステル結合、チオエーテル結合、チオエステル結合、アミド結合、カーボネート結合及びアルキレン基から選択される少なくとも1種を含む連結基、又は単結合を表し、R21及びR22はそれぞれ独立に、水素原子又はメチル基を表す;
 Ar11~Ar14がそれぞれ独立に破線で囲まれた芳香環を縮合環のひとつとして含む縮合環基である場合は、L1を連結基として有する基、L2を連結基として有する基、及びR3~R6はそれぞれ独立に、破線で囲まれた芳香環に置換していても、破線で囲まれた芳香環以外の縮合環に置換していてもよい。
[2] Ar13とAr14のうち少なくとも一方は、破線で囲まれた芳香環を含む縮合環基である[1]に記載の硬化性組成物。
[3] 化合物Bは、フルオロアルキル基、パーフルオロアルキル基、パーフルオロアルキレン基及びパーフルオロアルキレンオキシ基から選択される少なくとも1つの基と、少なくとも1つのラジカル架橋性基と、を1分子内に有する化合物である[1]又は[2]に記載の硬化性組成物。
[4] 非共役ビニリデン基含有化合物をさらに含有する[1]~[3]のいずれかに記載の硬化性組成物。
[5] 熱ラジカル重合開始剤を含み、熱ラジカル重合開始剤としてハイドロパーオキサイド化合物を含有する[1]~[4]のいずれかに記載の硬化性組成物。
[6] [1]~[5]のいずれかに記載の硬化性組成物の半硬化物であって、25℃、周波数10Hzにおける複素粘度が105~108mPa・sである半硬化物。
[7] [1]~[5]のいずれかに記載の硬化性組成物の硬化物。
[8] [7]記載の硬化物を含む光学部材。
[9] [7]記載の硬化物を含むレンズ。
[1] Compound A represented by the following general formula (A):
Compound B having at least one fluorine atom and at least one radical crosslinkable group in one molecule;
At least one selected from a thermal radical polymerization initiator and a photo radical polymerization initiator;
A curable composition comprising:
Figure JPOXMLDOC01-appb-C000002

In general formula (A), Ar 11 and Ar 12 each independently represent an aryl group containing a benzene ring surrounded by a broken line or a heteroaryl group containing a benzene ring surrounded by a broken line as one of condensed rings;
X 1 , Y 1 , X 2 and Y 2 are each independently an oxygen atom, a sulfur atom, a nitrogen atom or a carbon atom, and Z 1 is a 5- to 7-membered aromatic ring together with X 1 —C═C—Y 1 Represents an atomic group that includes at least one selected from an oxygen atom, a sulfur atom, a nitrogen atom, and a carbon atom, and Z 2 represents 5 to 7 together with X 2 —C═C—Y 2 A group of atoms forming a member aromatic ring, the group of atoms including at least one selected from an oxygen atom, a sulfur atom, a nitrogen atom and a carbon atom;
Ar 13 and Ar 14 each independently represent an arylene group containing an aromatic ring surrounded by a broken line or a heteroarylene group containing an aromatic ring surrounded by a broken line, and at least one of Ar 13 and Ar 14 is other than a phenylene group A group of
R 3 to R 6 each independently represents a substituent, q and r are each independently an integer of 0 to 4, v is an integer of 0 or more, and the maximum number of v is X 1 -C = The maximum number of substituents that can be substituted on the ring formed by CY 1 and Z 1 , w is an integer of 0 or more, and the maximum number of w is X 2 -C = CY 2 and Z 2 is the maximum number of substituents that can be substituted on the ring formed;
L 1 and L 2 each independently represents a single bond, an oxygen atom or a sulfur atom, and R 11 and R 12 each independently represent an ether bond, an ester bond, a thioether bond, a thioester bond, an amide bond, a carbonate bond and an alkylene. A linking group containing at least one selected from the group or a single bond, R 21 and R 22 each independently represents a hydrogen atom or a methyl group;
When Ar 11 to Ar 14 are each independently a condensed ring group containing an aromatic ring surrounded by a broken line as one of the condensed rings, a group having L 1 as a linking group, a group having L 2 as a linking group, and R 3 to R 6 may be each independently substituted with an aromatic ring surrounded by a broken line, or may be substituted with a condensed ring other than the aromatic ring surrounded by a broken line.
[2] The curable composition according to [1], wherein at least one of Ar 13 and Ar 14 is a condensed ring group including an aromatic ring surrounded by a broken line.
[3] Compound B contains at least one group selected from a fluoroalkyl group, a perfluoroalkyl group, a perfluoroalkylene group and a perfluoroalkyleneoxy group, and at least one radical crosslinkable group in one molecule. The curable composition according to [1] or [2], which is a compound having
[4] The curable composition according to any one of [1] to [3], further containing a non-conjugated vinylidene group-containing compound.
[5] The curable composition according to any one of [1] to [4], comprising a thermal radical polymerization initiator and containing a hydroperoxide compound as the thermal radical polymerization initiator.
[6] A semi-cured product of the curable composition according to any one of [1] to [5], having a complex viscosity of 10 5 to 10 8 mPa · s at 25 ° C. and a frequency of 10 Hz. .
[7] A cured product of the curable composition according to any one of [1] to [5].
[8] An optical member comprising the cured product according to [7].
[9] A lens comprising the cured product according to [7].
 本発明によれば、所定のアッベ数を有する硬化物において、予測される部分分散比(θg,F)よりも高い部分分散比(θg,F)を有する硬化物を成形し得る硬化性組成物を得ることができる。また、本発明によれば、金型転写性に優れた硬化性組成物を得ることができる。 According to the present invention, a curable composition capable of forming a cured product having a partial dispersion ratio (θg, F) higher than an expected partial dispersion ratio (θg, F) in a cured product having a predetermined Abbe number. Can be obtained. Moreover, according to this invention, the curable composition excellent in metal mold | die transferability can be obtained.
 以下において、本発明について詳細に説明する。以下に記載する構成要件の説明は、代表的な実施形態や具体例に基づいてなされることがあるが、本発明はそのような実施形態に限定されない。なお、本明細書において「~」を用いて表される数値範囲は「~」前後に記載される数値を下限値及び上限値として含む範囲を意味する。 Hereinafter, the present invention will be described in detail. The constituent elements described below may be described based on representative embodiments and specific examples, but the present invention is not limited to such embodiments. In the present specification, a numerical range expressed using “to” means a range including numerical values described before and after “to” as a lower limit value and an upper limit value.
 なお、本明細書中において、“(メタ)アクリレート”はアクリレート及びメタクリレートを表し、“(メタ)アクリロイル”はアクリロイル及びメタクリロイルを表す。本発明におけるモノマーは、オリゴマー及びポリマーと区別され、重量平均分子量が1,000以下の化合物をいう。
 また、本明細書における基の表記において、置換及び無置換を記していない表記は、置換基を有さないものと共に置換基を有するものをも包含する。例えば、「アルキル基」とは、置換基を有さないアルキル基(無置換アルキル基)のみならず、置換基を有するアルキル基(置換アルキル基)をも包含する。
In the present specification, “(meth) acrylate” represents acrylate and methacrylate, and “(meth) acryloyl” represents acryloyl and methacryloyl. The monomer in the present invention is distinguished from oligomers and polymers, and refers to a compound having a weight average molecular weight of 1,000 or less.
In addition, in the notation of groups in the present specification, the notation that does not indicate substitution and non-substitution includes those having no substituent and those having a substituent. For example, the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
(硬化性組成物)
 硬化性組成物は、後述する一般式(A)で表される化合物Aと、少なくとも1つのフッ素原子及び少なくとも1つのラジカル架橋性基を1分子内に有する化合物Bと、を含有する。硬化性組成物は、上記構成により、所定のアッベ数を有する硬化物において、予測される部分分散比(θg,F)よりも高い部分分散比(θg,F)を有する硬化物を成形することができる。また、優れた金型転写性を発揮する。
(Curable composition)
The curable composition contains a compound A represented by the general formula (A) described later and a compound B having at least one fluorine atom and at least one radical crosslinkable group in one molecule. The curable composition is molded into a cured product having a partial dispersion ratio (θg, F) higher than the predicted partial dispersion ratio (θg, F) in the cured product having a predetermined Abbe number. Can do. Also, it exhibits excellent mold transferability.
 硬化性組成物から成形される硬化物のアッベ数(νd)及び部分分散比(θg,F)は、アッベ屈折計(カルニュー光学工業株式会社製)を用いて測定した値である。具体的には、硬化性組成物を、直径10mm、厚み1mmの透明ガラス型に注入し、酸素濃度1%以下の雰囲気下200℃で加熱することで硬化物を成形し(加熱工程)、この硬化物についてアッベ数(νd)及び部分分散比(θg,F)を測定する。硬化物のアッベ数(νd)及び部分分散比(θg,F)は、下記式により算出される。なお、硬化物を成形する際には、上記加熱工程に代えて紫外線照射工程を採用してもよく、加熱工程と紫外線照射工程の両方を採用してもよい。
 νd=(nd-1)/(nF-nC)
 θg,F=(ng-nF)/(nF-nC)
 ここで、ndは波長587.56nmにおける屈折率、nFは波長486.13nmにおける屈折率、nCは波長656.27nmにおける屈折率、ngは波長435.83nmにおける屈折率を表す。
The Abbe number (νd) and the partial dispersion ratio (θg, F) of the cured product formed from the curable composition are values measured using an Abbe refractometer (manufactured by Kalnew Optical Industry Co., Ltd.). Specifically, the curable composition is poured into a transparent glass mold having a diameter of 10 mm and a thickness of 1 mm and heated at 200 ° C. in an atmosphere having an oxygen concentration of 1% or less to form a cured product (heating step). The Abbe number (νd) and the partial dispersion ratio (θg, F) are measured for the cured product. The Abbe number (νd) and the partial dispersion ratio (θg, F) of the cured product are calculated by the following equations. In addition, when shape | molding hardened | cured material, it may replace with the said heating process, may employ | adopt an ultraviolet irradiation process, and may employ | adopt both a heating process and an ultraviolet irradiation process.
νd = (nd−1) / (nF−nC)
θg, F = (ng−nF) / (nF−nC)
Here, nd represents a refractive index at a wavelength of 587.56 nm, nF represents a refractive index at a wavelength of 486.13 nm, nC represents a refractive index at a wavelength of 656.27 nm, and ng represents a refractive index at a wavelength of 435.83 nm.
 所定のアッベ数を有する硬化物において、予測される部分分散比(θg,F)は、d線を基準とするアッベ数(νd)を横軸、部分分散比(θg,F)を縦軸としたグラフにおいて、硝種A(株式会社オハラ、硝種名NSL7)と硝種B(株式会社オハラ、硝種名PBM2)を結ぶ直線を標準線としたとき、この標準線上の部分分散比(θg,F)である。硝種Aのアッベ数(νd)は60.49であり、部分分散比(θg,F)は0.5436である。また、硝種Bのアッベ数(νd)は36.26であり、部分分散比(θg,F)は0.5828である。標準線は、この2点を結ぶ直線である。
 Δ(θg,F)は、対象物の部分分散比(θg,F)と、標準線における部分分散比(θg,F)との差分であり、下記式により算出される。
 Δ(θg,F)=対象物の部分分散比(θg,F)-対象物と同じアッベ数(νd)の標準線における部分分散比(θg,F)
 上記式により算出されるΔ(θg,F)の値が大きい程、予測される部分分散比(θg,F)よりも高い部分分散比(θg,F)が得られていると言える。本発明においては、Δ(θg,F)は0.040以上であることが好ましく、0.046以上であることがより好ましく、0.060以上であることがさらに好ましく、0.080以上であることが一層好ましく、0.100以上であることが特に好ましい。Δ(θg,F)の値を上記範囲とすることにより、本発明の硬化性組成物から成形される硬化物において色収差の補正を効果的に行うことができる。
In a cured product having a predetermined Abbe number, the predicted partial dispersion ratio (θg, F) is represented by the Abbe number (νd) based on the d-line as the horizontal axis and the partial dispersion ratio (θg, F) as the vertical axis. In this graph, when the straight line connecting Glass Type A (Ohara Corporation, Glass Type Name NSL7) and Glass Type B (Ohara Corporation, Glass Type PBM2) is the standard line, the partial dispersion ratio (θg, F) on this standard line is there. Glass type A has an Abbe number (νd) of 60.49 and a partial dispersion ratio (θg, F) of 0.5436. Further, the Abbe number (νd) of the glass type B is 36.26, and the partial dispersion ratio (θg, F) is 0.5828. The standard line is a straight line connecting these two points.
Δ (θg, F) is a difference between the partial dispersion ratio (θg, F) of the object and the partial dispersion ratio (θg, F) on the standard line, and is calculated by the following equation.
Δ (θg, F) = Partial dispersion ratio (θg, F) of the object−Partial dispersion ratio (θg, F) on the standard line having the same Abbe number (νd) as the object
It can be said that the higher the value of Δ (θg, F) calculated by the above formula, the higher the partial dispersion ratio (θg, F) than the predicted partial dispersion ratio (θg, F). In the present invention, Δ (θg, F) is preferably 0.040 or more, more preferably 0.046 or more, further preferably 0.060 or more, and 0.080 or more. Is more preferable, and 0.100 or more is particularly preferable. By setting the value of Δ (θg, F) within the above range, it is possible to effectively correct chromatic aberration in a cured product formed from the curable composition of the present invention.
 本発明の硬化性組成物から成形される硬化物のアッベ数は特に限定されるものではないが、硬化物のアッベ数は35以下であることが好ましく、30以下であることがより好ましく、27以下であることがさらに好ましく、25以下であることが特に好ましい。 The Abbe number of the cured product formed from the curable composition of the present invention is not particularly limited, but the Abbe number of the cured product is preferably 35 or less, more preferably 30 or less, and 27 More preferably, it is more preferably 25 or less.
 本発明の硬化性組成物は、優れた金型転写性を発揮することができる。ここで、金型転写性は、硬化性組成物を硬化させて硬化物を100個成形し、その良品率により評価することができる。硬化物の表面に、微細な凹凸(シワ)が発生しているものを不良品、発生していないものを良品として評価する。良品率は、50%以上であることが好ましく、70%以上であることがより好ましく、90%以上であることがさらに好ましい。なお、金型転写性を評価する際に用いる硬化物を成形する際には、実施例の<複合レンズの作製>の工程に記載の方法で複合レンズを作製し、複合レンズの外観を株式会社キーエンス製デジタルマイクロスコープ(商品名:VHX-1000)を用いて評価する。 The curable composition of the present invention can exhibit excellent mold transferability. Here, the mold transferability can be evaluated based on the yield rate by curing 100 curable compositions and molding 100 cured products. A product with fine irregularities (wrinkles) on the surface of the cured product is evaluated as a defective product, and a product with no unevenness is evaluated as a good product. The non-defective rate is preferably 50% or more, more preferably 70% or more, and further preferably 90% or more. When molding a cured product used for evaluating mold transferability, a composite lens was prepared by the method described in the <Production of composite lens> example, and the appearance of the composite lens was Evaluation is performed using a Keyence digital microscope (trade name: VHX-1000).
 本発明の硬化性組成物の粘度は、20,000mPa・s以下であることが好ましく、15,000mPa・s以下であることがより好ましく、13,000mPa・s以下であることがさらに好ましく、10,000mPa・s以下であることが特に好ましい。硬化性組成物の粘度を上記範囲内とすることにより、硬化物を成形する際のハンドリング性を高め、高品質な硬化物を形成することができる。なお、硬化性組成物の粘度は、2,000mPa・s以上であることが好ましく、3,000mPa・s以上であることがより好ましく、4,000mPa・s以上であることがさらに好ましく、5,000mPa・s以上であることが特に好ましい。 The viscosity of the curable composition of the present invention is preferably 20,000 mPa · s or less, more preferably 15,000 mPa · s or less, and further preferably 13,000 mPa · s or less. 000 mPa · s or less is particularly preferable. By setting the viscosity of the curable composition within the above range, it is possible to improve the handling property when molding the cured product and form a high-quality cured product. The viscosity of the curable composition is preferably 2,000 mPa · s or more, more preferably 3,000 mPa · s or more, further preferably 4,000 mPa · s or more, 000 mPa · s or more is particularly preferable.
(化合物A)
 硬化性組成物は、下記一般式(A)で表される化合物Aを含む。
Figure JPOXMLDOC01-appb-C000003
(Compound A)
A curable composition contains the compound A represented by the following general formula (A).
Figure JPOXMLDOC01-appb-C000003
 一般式(A)中、Ar11及びAr12はそれぞれ独立に、破線で囲まれたベンゼン環を含むアリール基又は破線で囲まれたベンゼン環を縮合環のひとつとして含むヘテロアリール基を表す。
 X1、Y1、X2及びY2はそれぞれ独立に、酸素原子、硫黄原子、窒素原子又は炭素原子であり、Z1はX1-C=C-Y1とともに5~7員の芳香環を形成する原子群であって、酸素原子、硫黄原子、窒素原子及び炭素原子から選択される少なくとも1種を含む原子群を表し、Z2はX2-C=C-Y2とともに5~7員の芳香環を形成する原子群であって、酸素原子、硫黄原子、窒素原子及び炭素原子から選択される少なくとも1種を含む原子群を表す。
 Ar13及びAr14はそれぞれ独立に、破線で囲まれた芳香環を含むアリーレン基又は破線で囲まれた芳香環を含むヘテロアリーレン基を表し、Ar13とAr14のうち少なくとも一方はフェニレン基以外の基である。
 R3~R6はそれぞれ独立に、置換基を表し、q及びrはそれぞれ独立に、0~4の整数であり、vは0以上の整数であり、vの最大数は、X1-C=C-Y1とZ1が形成する環に置換可能な置換基の最大数であり、wは0以上の整数であり、wの最大数は、X2-C=C-Y2とZ2が形成する環に置換可能な置換基の最大数である。
 L1及びL2はそれぞれ独立に、単結合、酸素原子又は硫黄原子を表し、R11及びR12はそれぞれ独立に、エーテル結合、エステル結合、チオエーテル結合、チオエステル結合、アミド結合、カーボネート結合及びアルキレン基から選択される少なくとも1種を含む連結基、又は単結合を表し、R21及びR22はそれぞれ独立に、水素原子又はメチル基を表す。
 Ar11~Ar14がそれぞれ独立に破線で囲まれた芳香環を縮合環のひとつとして含む縮合環基である場合は、L1を連結基として有する基、L2を連結基として有する基、及びR3~R6はそれぞれ独立に、破線で囲まれた芳香環に置換していても、破線で囲まれた芳香環以外の縮合環に置換していてもよい。
In general formula (A), Ar 11 and Ar 12 each independently represent an aryl group containing a benzene ring surrounded by a broken line or a heteroaryl group containing a benzene ring surrounded by a broken line as one of condensed rings.
X 1 , Y 1 , X 2 and Y 2 are each independently an oxygen atom, a sulfur atom, a nitrogen atom or a carbon atom, and Z 1 is a 5- to 7-membered aromatic ring together with X 1 —C═C—Y 1 Represents an atomic group that includes at least one selected from an oxygen atom, a sulfur atom, a nitrogen atom, and a carbon atom, and Z 2 represents 5 to 7 together with X 2 —C═C—Y 2 An atomic group that forms a member aromatic ring, and represents an atomic group that includes at least one selected from an oxygen atom, a sulfur atom, a nitrogen atom, and a carbon atom.
Ar 13 and Ar 14 each independently represent an arylene group containing an aromatic ring surrounded by a broken line or a heteroarylene group containing an aromatic ring surrounded by a broken line, and at least one of Ar 13 and Ar 14 is other than a phenylene group It is the basis of.
R 3 to R 6 each independently represents a substituent, q and r are each independently an integer of 0 to 4, v is an integer of 0 or more, and the maximum number of v is X 1 -C = The maximum number of substituents that can be substituted on the ring formed by CY 1 and Z 1 , w is an integer of 0 or more, and the maximum number of w is X 2 -C = CY 2 and Z This is the maximum number of substituents that can be substituted on the ring formed by 2 .
L 1 and L 2 each independently represents a single bond, an oxygen atom or a sulfur atom, and R 11 and R 12 each independently represent an ether bond, an ester bond, a thioether bond, a thioester bond, an amide bond, a carbonate bond and an alkylene. A linking group containing at least one selected from a group or a single bond is represented, and R 21 and R 22 each independently represents a hydrogen atom or a methyl group.
When Ar 11 to Ar 14 are each independently a condensed ring group containing an aromatic ring surrounded by a broken line as one of the condensed rings, a group having L 1 as a linking group, a group having L 2 as a linking group, and R 3 to R 6 may be each independently substituted with an aromatic ring surrounded by a broken line, or may be substituted with a condensed ring other than the aromatic ring surrounded by a broken line.
 一般式(A)中、Ar11及びAr12はそれぞれ独立に、破線で囲まれたベンゼン環を含むアリール基又は破線で囲まれたベンゼン環を縮合環のひとつとして含むヘテロアリール基を表す。Ar11及びAr12はそれぞれ独立に、破線で囲まれたベンゼン環を含むアリール基であることが好ましい。Ar11及びAr12が、破線で囲まれたベンゼン環を含むアリール基である場合は、アリール基は、炭素数6~18のアリール基であることが好ましく、炭素数6~14のアリール基であることがより好ましく、炭素数6~10のアリール基であることが特に好ましい。中でも、Ar11及びAr12はそれぞれ独立に、破線で囲まれたベンゼン環のみから構成されるフェニル基であることが特に好ましい。なお、Ar11及びAr12が、破線で囲まれたベンゼン環を縮合環のひとつとして含むヘテロアリール基である場合は、ヘテロアリール基は、環員数9~14のヘテロアリール基であることが好ましく、環員数9~10のヘテロアリール基であることがより好ましい。Ar11及びAr12が、破線で囲まれたベンゼン環を縮合環のひとつとして含むヘテロアリール基である場合、ヘテロ原子としては、窒素原子、酸素原子、硫黄原子を挙げることができる。 In general formula (A), Ar 11 and Ar 12 each independently represent an aryl group containing a benzene ring surrounded by a broken line or a heteroaryl group containing a benzene ring surrounded by a broken line as one of condensed rings. Ar 11 and Ar 12 are preferably each independently an aryl group containing a benzene ring surrounded by a broken line. When Ar 11 and Ar 12 are aryl groups containing a benzene ring surrounded by a broken line, the aryl group is preferably an aryl group having 6 to 18 carbon atoms, and an aryl group having 6 to 14 carbon atoms More preferably, it is an aryl group having 6 to 10 carbon atoms. Among them, Ar 11 and Ar 12 are particularly preferably each independently a phenyl group composed of only a benzene ring surrounded by a broken line. When Ar 11 and Ar 12 are heteroaryl groups containing a benzene ring surrounded by a broken line as one of the condensed rings, the heteroaryl group is preferably a heteroaryl group having 9 to 14 ring members. More preferably, it is a heteroaryl group having 9 to 10 ring members. When Ar 11 and Ar 12 are heteroaryl groups containing a benzene ring surrounded by a broken line as one of the condensed rings, examples of the hetero atom include a nitrogen atom, an oxygen atom, and a sulfur atom.
 一般式(A)中、X1、Y1、X2及びY2はそれぞれ独立に、酸素原子、硫黄原子、窒素原子又は炭素原子である。X1、Y1、X2及びY2の全てが炭素原子であってもよく、X1、Y1、X2及びY2の全てが炭素以外の原子(酸素原子、硫黄原子及び窒素原子から選択される少なくとも1種)であってもよい。また、X1、Y1、X2及びY2の一部が炭素原子であり、X1、Y1、X2及びY2の一部が酸素原子、硫黄原子及び窒素原子から選択される少なくとも1種であってもよい。 In the general formula (A), X 1 , Y 1 , X 2 and Y 2 are each independently an oxygen atom, a sulfur atom, a nitrogen atom or a carbon atom. All of X 1 , Y 1 , X 2 and Y 2 may be carbon atoms, and all of X 1 , Y 1 , X 2 and Y 2 may be atoms other than carbon (from oxygen atoms, sulfur atoms and nitrogen atoms). At least one selected). Further, at least a part of X 1 , Y 1 , X 2 and Y 2 is a carbon atom, and a part of X 1 , Y 1 , X 2 and Y 2 is selected from an oxygen atom, a sulfur atom and a nitrogen atom. One kind may be sufficient.
 Z1はX1-C=C-Y1とともに5~7員の芳香環を形成する原子群であって、酸素原子、硫黄原子、窒素原子及び炭素原子から選択される少なくとも1種を含む原子群を表し、Z2はX2-C=C-Y2とともに5~7員の芳香環を形成する原子群であって、酸素原子、硫黄原子、窒素原子及び炭素原子から選択される少なくとも1種を含む原子群を表す。Z1及びZ2はそれぞれ独立に、炭素原子を含む原子群であることが好ましく、炭素原子からなる原子群であることがより好ましい。また、Z1はX1-C=C-Y1とともに5又は6員の芳香環を形成する原子群であることが好ましく、6員の芳香環を形成する原子群であることがより好ましい。Z2はX2-C=C-Y2とともに5又は6員の芳香環を形成する原子群であることが好ましく、6員の芳香環を形成する原子群であることがより好ましい。 Z 1 is an atomic group that forms a 5- to 7-membered aromatic ring with X 1 —C═C—Y 1 , and an atom containing at least one selected from an oxygen atom, a sulfur atom, a nitrogen atom, and a carbon atom Z 2 represents an atomic group that forms a 5- to 7-membered aromatic ring together with X 2 —C═CY 2 , and is at least one selected from an oxygen atom, a sulfur atom, a nitrogen atom, and a carbon atom Represents a group of atoms including species. Z 1 and Z 2 are each independently preferably an atomic group containing a carbon atom, and more preferably an atomic group consisting of a carbon atom. Z 1 is preferably an atomic group that forms a 5- or 6-membered aromatic ring together with X 1 —C═CY 1 , and more preferably an atomic group that forms a 6-membered aromatic ring. Z 2 is preferably an atomic group that forms a 5- or 6-membered aromatic ring together with X 2 —C═C—Y 2 , and more preferably an atomic group that forms a 6-membered aromatic ring.
 一般式(A)中、Ar13及びAr14はそれぞれ独立に、破線で囲まれた芳香環を含むアリーレン基又は破線で囲まれた芳香環を含むヘテロアリーレン基を表す。Ar13及びAr14が、破線で囲まれた芳香環を含むアリーレン基である場合は、アリーレン基は、炭素数6~18のアリーレン基であることが好ましく、炭素数6~14のアリーレン基であることがより好ましく、炭素数6~10のアリーレン基であることが特に好ましい。また、Ar13及びAr14が、破線で囲まれた芳香環を縮合環のひとつとして含むヘテロアリーレン基である場合は、ヘテロアリーレン基は、環員数9~14のヘテロアリーレン基であることが好ましく、環員数9~10のヘテロアリーレン基であることがより好ましい。Ar13及びAr14が、破線で囲まれた芳香環を縮合環のひとつとして含むヘテロアリーレン基である場合、ヘテロ原子としては、窒素原子、酸素原子、硫黄原子を挙げることができる。 In General Formula (A), Ar 13 and Ar 14 each independently represent an arylene group including an aromatic ring surrounded by a broken line or a heteroarylene group including an aromatic ring surrounded by a broken line. In the case where Ar 13 and Ar 14 are an arylene group containing an aromatic ring surrounded by a broken line, the arylene group is preferably an arylene group having 6 to 18 carbon atoms, and an arylene group having 6 to 14 carbon atoms More preferably, it is an arylene group having 6 to 10 carbon atoms. In addition, when Ar 13 and Ar 14 are heteroarylene groups containing an aromatic ring surrounded by a broken line as one of the condensed rings, the heteroarylene group is preferably a heteroarylene group having 9 to 14 ring members. More preferably, it is a heteroarylene group having 9 to 10 ring members. When Ar 13 and Ar 14 are a heteroarylene group containing an aromatic ring surrounded by a broken line as one of condensed rings, examples of the hetero atom include a nitrogen atom, an oxygen atom, and a sulfur atom.
 ここで、Ar13とAr14のうち少なくとも一方はフェニレン基以外の基である。Ar13とAr14のうち少なくとも一方は、破線で囲まれた芳香環を含む縮合環基であるか、もしくは破線で囲まれた芳香環がヘテロ環であることが好ましい。中でも、Ar13とAr14のうち少なくとも一方は、破線で囲まれた芳香環を含む縮合環基であることがより好ましく、縮合環基としては例えばナフチレンを挙げることができる。特に、Ar14が破線で囲まれた芳香環を含む縮合環基であることが好ましい。また、縮合環はヘテロ原子を含んでいることも好ましく、ヘテロ原子としては、窒素原子を好ましく例示できる。なお、Ar13とAr14は同じ基でないことが好ましい。この場合、Ar13もしくはAr14のもう一方はフェニレン基であることが特に好ましい。 Here, at least one of Ar 13 and Ar 14 is a group other than a phenylene group. At least one of Ar 13 and Ar 14 is preferably a condensed ring group containing an aromatic ring surrounded by a broken line, or the aromatic ring surrounded by a broken line is a hetero ring. Among them, at least one of Ar 13 and Ar 14 is more preferably a condensed ring group containing an aromatic ring surrounded by a broken line, and examples of the condensed ring group include naphthylene. In particular, Ar 14 is preferably a condensed ring group containing an aromatic ring surrounded by a broken line. Moreover, it is also preferable that the condensed ring contains a hetero atom, and a nitrogen atom can be illustrated preferably as a hetero atom. Ar 13 and Ar 14 are preferably not the same group. In this case, the other of Ar 13 or Ar 14 is particularly preferably a phenylene group.
 一般式(A)中、R3~R6はそれぞれ独立に、置換基を表す。R3~R6が表す置換基としては特に制限はないが、例えば、ハロゲン原子、ハロゲン化アルキル基、アルキル基、アルケニル基、アシル基、水酸基、ヒドロキシアルキル基、アルコキシ基、アリール基、ヘテロアリール基、脂肪族環基、シアノ基などを挙げることができる。R3~R6が表す置換基はハロゲン原子、アルキル基、アルコキシ基、アリール基又はシアノ基であることが好ましく、ハロゲン原子、炭素数1~5のアルキル基、炭素数1~5のアルコキシ基、フェニル基又はシアノ基であることがより好ましく、ハロゲン原子、メチル基、メトキシ基、フェニル基又はシアノ基であることが特に好ましい。中でも、R3及びR4は、それぞれ独立にメチル基又はメトキシ基であることが好ましく、R5はハロゲン原子、メチル基又はメトキシ基であることが好ましく、R6はハロゲン原子、メチル基、メトキシ基又はシアノ基であることが好ましい。 In general formula (A), R 3 to R 6 each independently represents a substituent. The substituent represented by R 3 to R 6 is not particularly limited, and examples thereof include halogen atoms, halogenated alkyl groups, alkyl groups, alkenyl groups, acyl groups, hydroxyl groups, hydroxyalkyl groups, alkoxy groups, aryl groups, and heteroaryls. A group, an aliphatic ring group, a cyano group, and the like. The substituent represented by R 3 to R 6 is preferably a halogen atom, an alkyl group, an alkoxy group, an aryl group or a cyano group, and is preferably a halogen atom, an alkyl group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 5 carbon atoms. More preferably a phenyl group or a cyano group, and particularly preferably a halogen atom, a methyl group, a methoxy group, a phenyl group or a cyano group. Among these, R 3 and R 4 are preferably each independently a methyl group or a methoxy group, R 5 is preferably a halogen atom, a methyl group, or a methoxy group, and R 6 is a halogen atom, a methyl group, or a methoxy group. It is preferably a group or a cyano group.
 q及びrはそれぞれ独立に、0~4の整数であり、0~3の整数であることが好ましく、0~2の整数であることがより好ましい。また、vは0以上の整数であり、vの最大数は、X1-C=C-Y1とZ1が形成する環に置換可能な置換基の最大数である。vは0~3の整数であることが好ましく、0~2の整数であることがより好ましい。wは0以上の整数であり、wの最大数は、X2-C=C-Y2とZ2が形成する環に置換可能な置換基の最大数である。wは0~3の整数であることが好ましく、0~2の整数であることがより好ましい。なお、q、r、v及びwのいずれもが0であってもよい。また、qが2~4の整数である場合、複数のR3は同じであっても異なっていてもよく、rが2~4の整数である場合、複数のR4は同じであっても異なっていてもよい。vが2以上の整数である場合、複数のR5は同じであっても異なっていてもよく、wが2以上の整数である場合、複数のR6は同じであっても異なっていてもよい。 q and r are each independently an integer of 0 to 4, preferably an integer of 0 to 3, and more preferably an integer of 0 to 2. V is an integer of 0 or more, and the maximum number of v is the maximum number of substituents that can be substituted on the ring formed by X 1 —C═C—Y 1 and Z 1 . v is preferably an integer of 0 to 3, and more preferably an integer of 0 to 2. w is an integer of 0 or more, and the maximum number of w is the maximum number of substituents that can be substituted on the ring formed by X 2 —C═C—Y 2 and Z 2 . w is preferably an integer of 0 to 3, and more preferably an integer of 0 to 2. In addition, all of q, r, v, and w may be 0. When q is an integer of 2 to 4, the plurality of R 3 may be the same or different, and when r is an integer of 2 to 4, the plurality of R 4 may be the same. May be different. When v is an integer of 2 or more, the plurality of R 5 may be the same or different, and when w is an integer of 2 or more, the plurality of R 6 may be the same or different. Good.
 一般式(A)中、L1及びL2はそれぞれ独立に、単結合、酸素原子又は硫黄原子を表す。L1及びL2はそれぞれ独立に、酸素原子又は硫黄原子であることが好ましく、酸素原子であることがより好ましい。 In general formula (A), L 1 and L 2 each independently represents a single bond, an oxygen atom or a sulfur atom. L 1 and L 2 are each independently preferably an oxygen atom or a sulfur atom, and more preferably an oxygen atom.
 R11及びR12はそれぞれ独立に、エーテル結合、エステル結合、チオエーテル結合、チオエステル結合、アミド結合、カーボネート結合及びアルキレン基から選択される少なくとも1種を含む連結基、又は単結合を表す。R11及びR12はそれぞれ独立に、エーテル結合、エステル結合、カーボネート結合及びアルキレン基から選択される少なくとも1種を含む連結基、又は単結合であることが好ましく、アルキレン基を含む連結基であることがより好ましい。中でも、R11及びR12はそれぞれ独立に、アルキレン基からなる連結基であることが特に好ましい。この場合、アルキレン基の炭素数は、2~8であることが好ましく、2~6であることがより好ましく、2~4であることがさらに好ましい。 R 11 and R 12 each independently represents a linking group containing at least one selected from an ether bond, an ester bond, a thioether bond, a thioester bond, an amide bond, a carbonate bond and an alkylene group, or a single bond. R 11 and R 12 are each independently a linking group containing at least one selected from an ether bond, an ester bond, a carbonate bond and an alkylene group, or a single bond, preferably a linking group containing an alkylene group. It is more preferable. Among these, it is particularly preferable that R 11 and R 12 are each independently a linking group composed of an alkylene group. In this case, the alkylene group preferably has 2 to 8 carbon atoms, more preferably 2 to 6 carbon atoms, and still more preferably 2 to 4 carbon atoms.
 R21及びR22はそれぞれ独立に、水素原子又はメチル基を表し、水素原子であることが好ましい。 R 21 and R 22 each independently represents a hydrogen atom or a methyl group, and is preferably a hydrogen atom.
 なお、Ar11~Ar14がそれぞれ独立に破線で囲まれた芳香環を縮合環のひとつとして含む縮合環基である場合は、L1を連結基として有する基、L2を連結基として有する基、及びR3~R6はそれぞれ独立に、破線で囲まれた芳香環に置換していても、破線で囲まれた芳香環以外の縮合環に置換していてもよい。 In the case where Ar 11 to Ar 14 are each independently a condensed ring group containing an aromatic ring surrounded by a broken line as one of the condensed rings, a group having L 1 as a linking group and a group having L 2 as a linking group , And R 3 to R 6 may be independently substituted with an aromatic ring surrounded by a broken line or may be substituted with a condensed ring other than the aromatic ring surrounded by a broken line.
 以下において、本発明の硬化性組成物に好ましく用いられる化合物Aの具体例を列挙するが、以下の化合物に限定されるものではない。なお、以下の構造式におけるMeOはメトキシ基を表す。 Hereinafter, specific examples of the compound A preferably used in the curable composition of the present invention will be listed, but the invention is not limited to the following compounds. In the following structural formulas, MeO represents a methoxy group.
Figure JPOXMLDOC01-appb-C000004
Figure JPOXMLDOC01-appb-C000004
 中でも、化合物Aは、A-1、A-2、A-3、A-4、A-5、A-6であることが好ましく、A-1、A-2、A-3、A-5、A-6であることがより好ましく、A-3、A-6であることが特に好ましい。 Among them, the compound A is preferably A-1, A-2, A-3, A-4, A-5, A-6, and A-1, A-2, A-3, A-5 A-6 is more preferable, and A-3 and A-6 are particularly preferable.
 硬化性組成物中における化合物Aの含有量は、硬化性組成物の全質量に対して、10~80質量%であることが好ましく、20~70質量%であることがより好ましく、30~60質量%であることがさらに好ましい。化合物Aの含有量を上記範囲内とすることにより、所定のアッベ数を有する硬化物において、予測される部分分散比(θg,F)よりも高い部分分散比(θg,F)が達成されやすくなる。また、化合物Aの含有量を上記範囲内とすることにより、硬化性組成物はより優れた金型転写性を発揮する。 The content of Compound A in the curable composition is preferably 10 to 80% by mass, more preferably 20 to 70% by mass, and more preferably 30 to 60% by mass with respect to the total mass of the curable composition. More preferably, it is mass%. By setting the content of Compound A within the above range, a cured product having a predetermined Abbe number can easily achieve a partial dispersion ratio (θg, F) higher than the predicted partial dispersion ratio (θg, F). Become. Moreover, by setting the content of Compound A within the above range, the curable composition exhibits more excellent mold transferability.
 硬化性組成物中には、一般式(A)で表される化合物Aが2種以上含有されていてもよい。化合物Aが2種以上含有されている場合は、合計の含有量が上記範囲内であることが好ましい。 The curable composition may contain two or more compounds A represented by the general formula (A). When 2 or more types of compounds A are contained, the total content is preferably within the above range.
(化合物B)
 硬化性組成物は、少なくとも1つのフッ素原子及び少なくとも1つのラジカル架橋性基を1分子内に有する化合物Bを含む。このような化合物を含むことで、金型転写性に優れた硬化性組成物を得ることができる。化合物Bが有するラジカル架橋性基としては、例えば、(メタ)アクリロイル基、α-フルオロアクリロイル基、α-トリフルオロメチルアクリロイル基、アリル基、ビニル基、ビニルオキシ基等が挙げられる。中でも、ラジカル架橋性基は、(メタ)アクリロイル基又はアリル基であることが好ましい。
(Compound B)
The curable composition includes Compound B having at least one fluorine atom and at least one radical crosslinkable group in one molecule. By including such a compound, a curable composition excellent in mold transferability can be obtained. Examples of the radical crosslinkable group possessed by Compound B include (meth) acryloyl group, α-fluoroacryloyl group, α-trifluoromethylacryloyl group, allyl group, vinyl group, vinyloxy group and the like. Especially, it is preferable that a radical crosslinkable group is a (meth) acryloyl group or an allyl group.
 化合物Bは、(1)1分子内に少なくとも1つのフッ素原子及びラジカル架橋性基を1つ有する単官能モノマーであってもよく、(2)1分子内に少なくとも1つのフッ素原子及びラジカル架橋性基を2つ以上有する多官能モノマーであってもよく、(3)側鎖に少なくとも1つのフッ素原子及びラジカル架橋性基を有する反応性ポリマーであってもよい。また、化合物Bとして、上記(1)単官能モノマー、(2)多官能モノマー及び(3)反応性ポリマーから選択される2種以上を併用してもよい。 Compound B may be (1) a monofunctional monomer having at least one fluorine atom and one radical crosslinkable group in one molecule, and (2) at least one fluorine atom and radical crosslinkable in one molecule. It may be a polyfunctional monomer having two or more groups, or (3) a reactive polymer having at least one fluorine atom and a radical crosslinkable group in the side chain. Further, as the compound B, two or more kinds selected from the above (1) monofunctional monomer, (2) polyfunctional monomer, and (3) reactive polymer may be used in combination.
 (1)1分子内に少なくとも1つのフッ素原子及びラジカル架橋性基を1つ有する単官能モノマーとしては、例えば、1H,1H,2H,2H-ヘプタデカフルオロデシル(メタ)アクリレート、1H,1H,5H-オクタフルオロペンチル(メタ)アクリレート、2,2,3,3-テトラフルオロプロピル(メタ)アクリレート、2,2,2-トリフルオロエチル(メタ)アクリレート、2-(パーフルオロブチル)エチル(メタ)アクリレート、2-(パーフルオロヘキシル)エチル(メタ)アクリレート、2-(パーフルオロオクチル)エチル(メタ)アクリレートを挙げることができる。 (1) Monofunctional monomers having at least one fluorine atom and one radical crosslinkable group in one molecule include, for example, 1H, 1H, 2H, 2H-heptadecafluorodecyl (meth) acrylate, 1H, 1H, 5H-octafluoropentyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, 2,2,2-trifluoroethyl (meth) acrylate, 2- (perfluorobutyl) ethyl (meth) ) Acrylate, 2- (perfluorohexyl) ethyl (meth) acrylate, and 2- (perfluorooctyl) ethyl (meth) acrylate.
 (2)1分子内に少なくとも1つのフッ素原子及びラジカル架橋性基を2つ以上有する多官能モノマーとしては、例えば、1,3-ビス{(メタ)アクリロイルオキシ}-2,2-ジフルオロプロパン、1,4-ビス{(メタ)アクリロイルオキシ}-2,2,3,3-テトラフルオロブタン、1,5-ビス{(メタ)アクリロイルオキシ}-2,2,3,3,4,4-ヘキサフルオロペンタン、1,6-ビス{(メタ)アクリロイルオキシ}-2,2,3,3,4,4,5,5-オクタフルオロヘキサン、1,7-ビス{(メタ)アクリロイルオキシ}-2,2,3,3,4,4,5,5,6,6-デカフルオロヘプタン、1,8-ビス{(メタ)アクリロイルオキシ}-2,2,3,3,4,4,5,5,6,6,7,7-ドデカフルオロオクタン、1,9-ビス{(メタ)アクリロイルオキシ}-2,2,3,3,4,4,5,5,6,6,7,7,8,8-テトラデカフルオロノナン、1,10-ビス{(メタ)アクリロイルオキシ}-2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9-ヘキサデカフルオロデカン、1,11-ビス{(メタ)アクリロイルオキシ}-2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10-オクタデカフルオロウンデカン、1,12-ビス{(メタ)アクリロイルオキシ}-2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11-エイコサフルオロドデカン、1,8-ビス{(メタ)アクリロイルオキシ}-2,7-ジヒドロキシ-4,4,5,5-テトラフルオロオクタン、1,7-ビス{(メタ)アクリロイルオキシ}-2,8-ジヒドロキシ-4,4,5,5-テトラフルオロオクタン、2,7-ビス{(メタ)アクリロイルオキシ}-1,8-ジヒドロキシ-4,4,5,5-テトラフルオロオクタン、1,10-ビス{(メタ)アクリロイルオキシ}-2,9-ジヒドロキシ-4,4,5,5,6,6,7,7-オクタフルオロデカン、1,9-ビス{(メタ)アクリロイルオキシ}-2,10-ジヒドロキシ-4,4,5,5,6,6,7,7-オクタフルオロデカン、2,9-ビス{(メタ)アクリロイルオキシ}-1,10-ジヒドロキシ-4,4,5,5,6,6,7,7-オクタフルオロデカン、1,2,7,8-テトラキス{(メタ)アクリロイルオキシ}-4,4,5,5-テトラフルオロデカン、1,2,8,9-テトラキス{(メタ)アクリロイルオキシ}-4,4,5,5,6,6-ヘキサフルオロノナン、1,2,9,10-テトラキス{(メタ)アクリロイルオキシ}-4,4,5,5,6,6,7,7-オクタフルオロデカン、1,2,10,11-テトラキス{(メタ)アクリロイルオキシ}-4,4,5,5,6,6,7,7,8,8-デカフルオロウンデカン、1,2,11,12-テトラキス{(メタ)アクリロイルオキシ}-4,4,5,5,6,6,7,7,8,8,9,9-ドデカフルオロドデカン、1,10-ビス(α-フルオロアクリロイルオキシ)-2,9-ジヒドロキシ-4,4,5,5,6,6,7,7-オクタフルオロデカン、1,9-ビス(α-フルオロアクリロイルオキシ)-2,10-ジヒドロキシ-4,4,5,5,6,6,7,7-オクタフルオロデカン、2,9-ビス(α-フルオロアクリロイルオキシ)-1,10-ジヒドロキシ-4,4,5,5,6,6,7,7-オクタフルオロデカン、1,2,9,10-テトラキス(α-フルオロアクリロイルオキシ)-4,4,5,5,6,6,7,7-オクタフルオロデカン、1,2,11,12-テトラキス(α-フルオロアクリロイルオキシ)-4,4,5,5,6,6,7,7,8,8,9,9-ドデカフルオロドデカン等を挙げることができる。また、(2)1分子内にラジカル架橋性基を2つ以上有する多官能モノマーとして、特開2013-76786号公報の段落0151~0155及び0160~0171に記載の化合物F-1~F-30、F-36~F-40、F-42~F-46、F-48~F-61、F-64~F-69、F-71~F-79、F81~F84等を用いることもできる。 (2) Examples of the polyfunctional monomer having at least one fluorine atom and two or more radical crosslinkable groups in one molecule include 1,3-bis {(meth) acryloyloxy} -2,2-difluoropropane, 1,4-bis {(meth) acryloyloxy} -2,2,3,3-tetrafluorobutane, 1,5-bis {(meth) acryloyloxy} -2,2,3,3,4,4- Hexafluoropentane, 1,6-bis {(meth) acryloyloxy} -2,2,3,3,4,4,5,5-octafluorohexane, 1,7-bis {(meth) acryloyloxy}- 2,2,3,3,4,4,5,5,6,6-decafluoroheptane, 1,8-bis {(meth) acryloyloxy} -2,2,3,3,4,4,5 , 5,6,6,7,7-dodecaful Looctane, 1,9-bis {(meth) acryloyloxy} -2,2,3,3,4,4,5,5,6,6,7,7,8,8-tetradecafluorononane, 1, 10-bis {(meth) acryloyloxy} -2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9-hexadecafluorodecane, 1, 11-bis {(meth) acryloyloxy} -2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10-octadecafluoro Undecane, 1,12-bis {(meth) acryloyloxy} -2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10 , 11,11-eicosafluorododecane, 1,8-bis {(meth) acryloyloxy} -2,7-dihydroxy-4,4,5, -Tetrafluorooctane, 1,7-bis {(meth) acryloyloxy} -2,8-dihydroxy-4,4,5,5-tetrafluorooctane, 2,7-bis {(meth) acryloyloxy} -1 , 8-dihydroxy-4,4,5,5-tetrafluorooctane, 1,10-bis {(meth) acryloyloxy} -2,9-dihydroxy-4,4,5,5,6,6,7, 7-octafluorodecane, 1,9-bis {(meth) acryloyloxy} -2,10-dihydroxy-4,4,5,5,6,6,7,7-octafluorodecane, 2,9-bis {(Meth) acryloyloxy} -1,10-dihydroxy-4,4,5,5,6,6,7,7-octafluorodecane, 1,2,7,8-tetrakis {(meth) acryloyloxy} -4 4,5,5-tetrafluorodecane, 1,2,8,9-tetrakis {(meth) acryloyloxy} -4,4,5,5,6,6-hexafluorononane, 1,2,9,10 -Tetrakis {(meth) acryloyloxy} -4,4,5,5,6,6,7,7-octafluorodecane, 1,2,10,11-tetrakis {(meth) acryloyloxy} -4,4 , 5,5,6,6,7,7,8,8-decafluoroundecane, 1,2,11,12-tetrakis {(meth) acryloyloxy} -4,4,5,5,6,6 7,7,8,8,9,9-dodecafluorododecane, 1,10-bis (α-fluoroacryloyloxy) -2,9-dihydroxy-4,4,5,5,6,6,7,7 -Octafluorodecane, 1,9-bis (α-fluoroactene Liloyloxy) -2,10-dihydroxy-4,4,5,5,6,6,7,7-octafluorodecane, 2,9-bis (α-fluoroacryloyloxy) -1,10-dihydroxy-4, 4,5,5,6,6,7,7-octafluorodecane, 1,2,9,10-tetrakis (α-fluoroacryloyloxy) -4,4,5,5,6,6,7,7 -Octafluorodecane, 1,2,11,12-tetrakis (α-fluoroacryloyloxy) -4,4,5,5,6,6,7,7,8,8,9,9-dodecafluorododecane, etc. Can be mentioned. (2) Compounds F-1 to F-30 described in paragraphs 0151 to 0155 and 0160 to 0171 of JP2013-76786A as polyfunctional monomers having two or more radically crosslinkable groups in one molecule F-36 to F-40, F-42 to F-46, F-48 to F-61, F-64 to F-69, F-71 to F-79, F81 to F84, etc. can also be used. .
 (3)側鎖に少なくとも1つのフッ素原子及びラジカル架橋性基を有する反応性ポリマーとしては、例えば、フッ素原子を側鎖に有する構成単位(a)と、架橋性基を側鎖に有する構成単位(b)を有するポリマーを挙げることができる。側鎖にラジカル架橋性基を有する反応性ポリマーの分子量(重量平均分子量)は、1,000~500,000であることが好ましく、3,000~300,000であることがより好ましく、5,000~100,000であることがさらに好ましい。側鎖にラジカル架橋性基を有する反応性ポリマーの重量平均分子量は、GPC(Gel Permeation Chromatography)法による標準ポリスチレン換算で算出した値である。 (3) Examples of the reactive polymer having at least one fluorine atom and radical crosslinkable group in the side chain include the structural unit (a) having a fluorine atom in the side chain and the structural unit having a crosslinkable group in the side chain. Mention may be made of polymers having (b). The molecular weight (weight average molecular weight) of the reactive polymer having a radical crosslinkable group in the side chain is preferably 1,000 to 500,000, more preferably 3,000 to 300,000, More preferably, it is from 000 to 100,000. The weight average molecular weight of the reactive polymer having a radical crosslinkable group in the side chain is a value calculated in terms of standard polystyrene by GPC (Gel Permeation Chromatography) method.
 フッ素原子を側鎖に有する構成単位(a)としては、上述した(1)の1分子内にラジカル架橋性基を1つ有する単官能モノマー由来の構成単位を挙げることができる。架橋性基を側鎖に有する構成単位(b)としては、例えば、以下の構造を有する構成単位を挙げることができる。 As the structural unit (a) having a fluorine atom in the side chain, a structural unit derived from a monofunctional monomer having one radical crosslinkable group in one molecule of (1) described above can be mentioned. As a structural unit (b) which has a crosslinkable group in a side chain, the structural unit which has the following structures can be mentioned, for example.
Figure JPOXMLDOC01-appb-C000005
Figure JPOXMLDOC01-appb-C000005
 なお、上記構造式中、R1及びR2はそれぞれ独立に水素原子又はメチル基を表す。 In the above structural formulas, R 1 and R 2 each independently represent a hydrogen atom or a methyl group.
 また、(3)側鎖に少なくとも1つのフッ素原子及びラジカル架橋性基を有する反応性ポリマーの構成単位として、構成単位(a)及び構成単位(b)以外の構成単位を含んでいてもよい。構成単位としては、例えば、側鎖にアリール基を有する構成単位を挙げることができる。(3)側鎖にラジカル架橋性基を有する反応性ポリマーが、側鎖にアリール基を有する構成単位をさらに有することで化合物Aと化合物Bの相溶性を高めることができる。なお、側鎖にアリール基を有する構成単位としては、例えば以下の構造を有する構成単位を挙げることができる。 (3) As a structural unit of the reactive polymer having at least one fluorine atom and a radical crosslinkable group in the side chain, a structural unit other than the structural unit (a) and the structural unit (b) may be included. As a structural unit, the structural unit which has an aryl group in a side chain can be mentioned, for example. (3) The compatibility of the compound A and the compound B can be improved because the reactive polymer having a radical crosslinkable group in the side chain further has a structural unit having an aryl group in the side chain. In addition, as a structural unit which has an aryl group in a side chain, the structural unit which has the following structures can be mentioned, for example.
Figure JPOXMLDOC01-appb-C000006
Figure JPOXMLDOC01-appb-C000006
 上記構造式中、Raは、水素又はメチル基を表す。また、nは0~10の整数を表し、0~2であることが好ましく、0又は1であることがより好ましい。 In the above structural formula, Ra represents hydrogen or a methyl group. N represents an integer of 0 to 10, preferably 0 to 2, and more preferably 0 or 1.
 化合物Bは、1分子内に少なくとも1つのフッ素原子を有しており、フルオロアルキル基、パーフルオロアルキル基、パーフルオロアルキレン基及びパーフルオロアルキレンオキシ基から選択される少なくとも1つの基を有するものであることが好ましい。化合物Bの一分子中に占めるフッ素原子の割合は、5質量%以上であることが好ましく、20質量%以上であることがより好ましく、30質量%以上であることがさらに好ましい。 Compound B has at least one fluorine atom in one molecule, and has at least one group selected from a fluoroalkyl group, a perfluoroalkyl group, a perfluoroalkylene group, and a perfluoroalkyleneoxy group. Preferably there is. The proportion of fluorine atoms in one molecule of Compound B is preferably 5% by mass or more, more preferably 20% by mass or more, and further preferably 30% by mass or more.
 以下において、本発明に好ましく用いられる化合物Bの具体例を列挙するが、以下の化合物に限定されるものではない。 In the following, specific examples of compound B preferably used in the present invention are listed, but are not limited to the following compounds.
Figure JPOXMLDOC01-appb-C000007
Figure JPOXMLDOC01-appb-C000007
 硬化性組成物中における化合物Bの含有量は、硬化性組成物の全質量に対して、5~70質量%であることが好ましく、10~60質量%であることがより好ましく、20~50質量%であることがさらに好ましい。
 また、硬化性組成物中に含まれるフッ素原子の含有量は、1質量%以上であることが好ましく、5質量%以上であることがより好ましく、7質量%以上であることがさらに好ましく、10質量%以上であることが特に好ましい。また、硬化性組成物中に含まれるフッ素原子の含有量は、30質量%以下であることが好ましい。硬化性組成物中における化合物B及び/又は硬化性組成物中に含まれるフッ素原子の含有量を上記範囲内とすることにより、硬化性組成物はより良好な金型転写性を発揮することができる。
The content of Compound B in the curable composition is preferably 5 to 70% by mass, more preferably 10 to 60% by mass, and more preferably 20 to 50% with respect to the total mass of the curable composition. More preferably, it is mass%.
The content of fluorine atoms contained in the curable composition is preferably 1% by mass or more, more preferably 5% by mass or more, and further preferably 7% by mass or more. It is particularly preferable that the content is at least mass%. Moreover, it is preferable that content of the fluorine atom contained in a curable composition is 30 mass% or less. By setting the content of the fluorine atom contained in Compound B and / or the curable composition in the curable composition within the above range, the curable composition can exhibit better mold transferability. it can.
(その他の成分)
 硬化性組成物は、上述した化合物A及び化合物Bの他に、さらにその他の成分を含んでいてもよい。その他の成分としては、具体的には以下のものが挙げられる。例えば、硬化性組成物は、後述する(メタ)アクリレートモノマーと、非共役ビニリデン基含有化合物と、光ラジカル重合開始剤及び熱ラジカル重合開始剤から選択される少なくとも1種と、をさらに含有してもよい。
(Other ingredients)
The curable composition may further contain other components in addition to Compound A and Compound B described above. Specific examples of other components include the following. For example, the curable composition further contains a (meth) acrylate monomer described later, a non-conjugated vinylidene group-containing compound, and at least one selected from a photoradical polymerization initiator and a thermal radical polymerization initiator. Also good.
<(メタ)アクリレートモノマー>
 硬化性組成物は、(メタ)アクリレートモノマーを含んでもよい。(メタ)アクリレートモノマーは、分子中に2つ以上の(メタ)アクリロイル基を有する多官能(メタ)アクリレートモノマーであってもよく、分子中に1つの(メタ)アクリロイル基を有する単官能(メタ)アクリレートモノマーであってもよい。
 (メタ)アクリレートモノマーの具体例としては、特開2012-107191号公報の段落0037~0046に記載の(メタ)アクリレートモノマーが挙げられる。
<(Meth) acrylate monomer>
The curable composition may contain a (meth) acrylate monomer. The (meth) acrylate monomer may be a polyfunctional (meth) acrylate monomer having two or more (meth) acryloyl groups in the molecule, and may be a monofunctional (meta) having one (meth) acryloyl group in the molecule. ) May be an acrylate monomer.
Specific examples of the (meth) acrylate monomer include (meth) acrylate monomers described in paragraphs 0037 to 0046 of JP2012-107191A.
 本発明で好ましく用いることができる(メタ)アクリレートモノマーとしては、例えば、モノマー1(フェノキシエチルアクリレート)又はモノマー2(ベンジルアクリレート)で表わされる芳香環を有する単官能(メタ)アクリレートモノマーや、モノマー3(トリシクロデカンジメタノールジアクリレート)又はモノマー4(ジシクロペンタニルアクリレート)で表わされる脂肪族環を有する単官能(メタ)アクリレートモノマーを挙げることができる。(メタ)アクリレートモノマーの分子量は100~500であることが好ましい。 Examples of the (meth) acrylate monomer that can be preferably used in the present invention include a monofunctional (meth) acrylate monomer having an aromatic ring represented by monomer 1 (phenoxyethyl acrylate) or monomer 2 (benzyl acrylate), and monomer 3 Examples thereof include a monofunctional (meth) acrylate monomer having an aliphatic ring represented by (tricyclodecane dimethanol diacrylate) or monomer 4 (dicyclopentanyl acrylate). The molecular weight of the (meth) acrylate monomer is preferably 100 to 500.
Figure JPOXMLDOC01-appb-C000008
Figure JPOXMLDOC01-appb-C000008

Figure JPOXMLDOC01-appb-C000009
Figure JPOXMLDOC01-appb-C000009
 (メタ)アクリレートモノマーの入手方法については特に制限は無く、商業的に入手してもよく、合成により製造してもよい。商業的に入手する場合は、例えば、ビスコート#192 PEA(モノマー1)(大阪有機化学工業株式会社製)、ビスコート#160 BZA(モノマー2)(大阪有機化学工業株式会社製)、A-DCP(モノマー3)(新中村化学工業株式会社製)、FA-513AS(モノマー4)(日立化成工業株式会社製)を好ましく用いることができる。 The method for obtaining the (meth) acrylate monomer is not particularly limited, and may be obtained commercially or may be produced by synthesis. When commercially available, for example, biscoat # 192 PEA (monomer 1) (manufactured by Osaka Organic Chemical Industry Co., Ltd.), biscoat # 160 BZA (monomer 2) (manufactured by Osaka Organic Chemical Industry Co., Ltd.), A-DCP ( Monomer 3) (manufactured by Shin-Nakamura Chemical Co., Ltd.) and FA-513AS (monomer 4) (manufactured by Hitachi Chemical Co., Ltd.) can be preferably used.
 硬化性組成物が(メタ)アクリレートモノマーを含有する場合、(メタ)アクリレートモノマーの含有量は、硬化性組成物の全質量に対して、1~80質量%であることが好ましく、2~50質量%であることがより好ましく、3~40質量%であることがさらに好ましい。 When the curable composition contains a (meth) acrylate monomer, the content of the (meth) acrylate monomer is preferably 1 to 80% by mass with respect to the total mass of the curable composition, and is preferably 2 to 50%. More preferably, it is more preferably 3 to 40% by mass.
<非共役ビニリデン基含有化合物>
 硬化性組成物は、非共役ビニリデン基含有化合物を含んでもよい。
 非共役ビニリデン基含有化合物としては、特開2012-107191号公報の段落0016~0033に記載の化合物を用いることができる。本明細書には、特開2012-107191号公報の段落0016~0033に記載の内容が組み込まれる。
<Non-conjugated vinylidene group-containing compound>
The curable composition may include a non-conjugated vinylidene group-containing compound.
As the non-conjugated vinylidene group-containing compound, compounds described in paragraphs 0016 to 0033 of JP2012-107191A can be used. This specification incorporates the contents described in paragraphs 0016 to 0033 of JP2012-107191A.
 非共役ビニリデン基含有化合物の分子量は、100~400であることが好ましく、120~350であることがより好ましく、130~300であることが特に好ましい。 The molecular weight of the non-conjugated vinylidene group-containing compound is preferably 100 to 400, more preferably 120 to 350, and particularly preferably 130 to 300.
 非共役ビニリデン基含有化合物の入手方法については特に制限は無く、商業的に入手してもよく、合成により製造してもよい。商業的に入手する場合は、例えば、β-カリオフィレン(株式会社井上香料製造所製)や(+)-リモネン(東京化成工業株式会社製)などを好ましく用いることができる。 The method for obtaining the non-conjugated vinylidene group-containing compound is not particularly limited, and may be obtained commercially or synthesized. When commercially available, for example, β-caryophyllene (manufactured by Inoue Fragrance Co., Ltd.) and (+)-limonene (manufactured by Tokyo Chemical Industry Co., Ltd.) can be preferably used.
 硬化性組成物が非共役ビニリデン基含有化合物を含有する場合、非共役ビニリデン基含有化合物の含有量は、硬化性組成物の全質量に対して、0.5~30質量%であることが好ましく、1~25質量%であることがより好ましく、2~20質量%であることがさらに好ましい。 When the curable composition contains a non-conjugated vinylidene group-containing compound, the content of the non-conjugated vinylidene group-containing compound is preferably 0.5 to 30% by mass with respect to the total mass of the curable composition. The content is more preferably 1 to 25% by mass, and further preferably 2 to 20% by mass.
(重合開始剤)
 硬化性組成物は、熱ラジカル重合開始剤及び光ラジカル重合開始剤から選択される少なくとも1種を含む。
(Polymerization initiator)
The curable composition contains at least one selected from a thermal radical polymerization initiator and a photo radical polymerization initiator.
<熱ラジカル重合開始剤>
 硬化性組成物は、熱ラジカル重合開始剤を含むことが好ましい。これにより、硬化性組成物を熱重合することにより、耐熱性が高い硬化物を成形することができる。
<Thermal radical polymerization initiator>
The curable composition preferably contains a thermal radical polymerization initiator. Thereby, the hardened | cured material with high heat resistance can be shape | molded by thermally polymerizing a curable composition.
 熱ラジカル重合開始剤としては、具体的には以下の化合物を用いることができる。例えば、1,1-ジ(t-ヘキシルペルオキシ)シクロヘキサン、1,1-ジ(t-ブチルペルオキシ)シクロヘキサン、2,2-ジ(4,4-ジ-(t-ブチルペルオキシ)シクロヘキシル)プロパン、t-ヘキシルペルオキシイソプロピルモノカーボネート、t-ブチルペルオキシ-3,5,5-トリメチルヘキサノエート、t-ブチルペルオキシラウレート、ジクミルパーオキサイド、ジ-t-ブチルパーオキサイド、t-ブチルペルオキシ-2-エチルヘキサノエート、t-ヘキシルペルオキシ-2-エチルヘキサノエート、クメンハイドロパーオキサイド、t-ブチルハイドロパーオキサイド、t-ブチルパーオキシ-2-エチルヘキシル、2,3-ジメチル-2,3-ジフェニルブタン等を挙げることができる。 Specifically, the following compounds can be used as the thermal radical polymerization initiator. For example, 1,1-di (t-hexylperoxy) cyclohexane, 1,1-di (t-butylperoxy) cyclohexane, 2,2-di (4,4-di- (t-butylperoxy) cyclohexyl) propane, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurate, dicumyl peroxide, di-t-butylperoxide, t-butylperoxy-2 -Ethylhexanoate, t-hexylperoxy-2-ethylhexanoate, cumene hydroperoxide, t-butyl hydroperoxide, t-butylperoxy-2-ethylhexyl, 2,3-dimethyl-2,3- And diphenylbutane.
 中でも、硬化性組成物は、熱ラジカル重合開始剤として、ハイドロパーオキサイド化合物を含むことが好ましい。ハイドロパーオキサイド化合物は、過酸化物であり、ペルオキシ基を有する化合物である。なお、ハイドロパーオキサイド化合物においては、ペルオキシ基(-O-O-)の一方の酸素原子には水素原子が置換しており、ハイドロパーオキサイド基(-O-O-H)を含む。分子内にハイドロパーオキサイド基を有するハイドロパーオキサイド化合物は非共役ビニリデン基含有化合物の重合中の連鎖移動を促進する効果があり、硬化性組成物が硬化する際の3次元構造のコントロール性がより向上し、半硬化物に変形性を付与することができる。 Especially, it is preferable that a curable composition contains a hydroperoxide compound as a thermal radical polymerization initiator. The hydroperoxide compound is a peroxide and a compound having a peroxy group. In the hydroperoxide compound, one oxygen atom of the peroxy group (—O—O—) is substituted with a hydrogen atom, and includes a hydroperoxide group (—O—O—H). A hydroperoxide compound having a hydroperoxide group in the molecule has an effect of promoting chain transfer during the polymerization of the non-conjugated vinylidene group-containing compound, and has more controllability of the three-dimensional structure when the curable composition is cured. It is possible to improve and impart deformability to the semi-cured product.
 ハイドロパーオキサイド化合物の入手方法については特に制限は無く、商業的に入手してもよく、合成により製造してもよい。商業的に入手する場合は、例えば、日本油脂株式会社製のパークミルH-80(クメンハイドロパーオキサイド)等を用いることができる。 The method for obtaining the hydroperoxide compound is not particularly limited, and may be obtained commercially or synthesized. When commercially obtained, for example, Park Mill H-80 (cumene hydroperoxide) manufactured by Nippon Oil & Fats Co., Ltd. can be used.
 熱ラジカル重合開始剤としては、ハイドロパーオキサイド化合物と、他の熱ラジカル重合開始剤を含むことが好ましい。他の熱ラジカル重合開始剤としては、非ハイドロパーオキサイド化合物を挙げることができる。ハイドロパーオキサイド化合物は熱ラジカル重合を開始する温度が一般に高いため、熱重合開始温度の低い非ハイドロパーオキサイド化合物を共に含むことが好ましい。非ハイドロパーオキサイド化合物としては、t-ブチルペルオキシ-2-エチルヘキサノエート(日本油脂株式会社製、パーブチルO)、t-ブチルパーオキシ-2-エチルヘキシルカーボネート(日本油脂株式会社製、パーブチルE)等のパーオキシエステル系化合物を用いることが好ましい。 It is preferable that the thermal radical polymerization initiator includes a hydroperoxide compound and another thermal radical polymerization initiator. Examples of other thermal radical polymerization initiators include non-hydroperoxide compounds. Since the hydroperoxide compound generally has a high temperature for initiating thermal radical polymerization, it preferably contains both non-hydroperoxide compounds having a low thermal polymerization initiation temperature. Non-hydroperoxide compounds include t-butyl peroxy-2-ethylhexanoate (Nippon Yushi Co., Ltd., Perbutyl O), t-butyl peroxy-2-ethylhexyl carbonate (Nippon Yushi Co., Ltd., Perbutyl E). It is preferable to use peroxyester compounds such as
 熱ラジカル重合開始剤の含有量は、硬化性組成物の全質量に対して、0.01~10質量%であることが好ましく、0.05~5.0質量%であることがより好ましく、0.05~2.0質量%であることがさらに好ましい。 The content of the thermal radical polymerization initiator is preferably 0.01 to 10% by mass, more preferably 0.05 to 5.0% by mass, based on the total mass of the curable composition. More preferably, it is 0.05 to 2.0% by mass.
<光ラジカル重合開始剤>
 硬化性組成物は、光ラジカル重合開始剤を含むことが好ましい。光ラジカル重合開始剤としては、具体的には以下の化合物を用いることができる。例えば、ビス(2,6-ジメトキシベンゾイル)-2,4,4-トリメチルペンチルホスフィンオキシド、ビス(2,6-ジメチルベンゾイル)-2,4,4-トリメチルペンチルホスフィンオキシド、ビス(2,4,6-トリメチルベンゾイル)-2,4,4-トリメチルペンチルホスフィンオキシド、ビス(2,6-ジクロルベンゾイル)-2,4,4-トリメチルペンチルホスフィンオキシド、1-フェニル-2-ヒドロキシ-2-メチルプロパン-1-オン、1-ヒドロキシシクロヘキシルフェニルケトン、1-(4-イソプロピルフェニル)-2-ヒドロキシ-2-メチルプロパン-1-オン、1,2-ジフェニルエタンジオン、メチルフェニルグリオキシレート、1-[4-(2-ヒドロキシエトキシ)-フェニル]-2-ヒドロキシ-2-メチル-1-プロパン-1-オン、2-ヒロドキシ-1-{4-[4-(2-ヒドロキシ-2-メチル-プロピオニル)-ベンジル]フェニル}-2-メチル-プロパン-1-オン、2,2-ジメトキシ-1,2-ジフェニルエタン-1-オン、2-メチル-1-(4-メチルチオフェニル)-2-モルフォリノプロパン-1-オン、2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)-ブタノン-1、2,4,6-トリメチルベンゾイル-ジフェニル-ホスフィンオキサイド、ビス(2,4,6-トリメチルベンゾイル)-フェニルホスフィンオキサイド等を挙げることができる。
<Radical radical polymerization initiator>
It is preferable that a curable composition contains radical photopolymerization initiator. Specifically, the following compounds can be used as the radical photopolymerization initiator. For example, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide, bis (2,6-dimethylbenzoyl) -2,4,4-trimethylpentylphosphine oxide, bis (2,4,4) 6-trimethylbenzoyl) -2,4,4-trimethylpentylphosphine oxide, bis (2,6-dichlorobenzoyl) -2,4,4-trimethylpentylphosphine oxide, 1-phenyl-2-hydroxy-2-methyl Propan-1-one, 1-hydroxycyclohexyl phenyl ketone, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 1,2-diphenylethanedione, methylphenylglyoxylate, 1 -[4- (2-hydroxyethoxy) -phenyl] -2-hydride Xyl-2-methyl-1-propan-1-one, 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl} -2-methyl-propane-1 -One, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one, 2-benzyl-2-dimethyl Examples include amino-1- (4-morpholinophenyl) -butanone-1,2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, and the like. it can.
 中でも、光ラジカル重合開始剤として、BASF社製、イルガキュア184(1-ヒドロキシシクロヘキシルフェニルケトン)、イルガキュア819(ビス(2,4,6-トリメチルベンゾイル)-フェニルホスフィンオキサイド)、イルガキュア651(2,2-ジメトキシ-1,2-ジフェニルエタン-1-オン)、1-[4-(2-ヒドロキシエトキシ)-フェニル]-2-ヒドロキシ-2-メチル-1-プロパン-1-オン、2-メチル-1-(4-メチルチオフェニル)-2-モルフォリノプロパン-1-オンを好ましく用いることができる。 Among these, as radical photopolymerization initiators, BASF Corporation, Irgacure 184 (1-hydroxycyclohexyl phenyl ketone), Irgacure 819 (bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide), Irgacure 651 (2,2 -Dimethoxy-1,2-diphenylethane-1-one), 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-methyl- 1- (4-methylthiophenyl) -2-morpholinopropan-1-one can be preferably used.
 光ラジカル重合開始剤の含有量は、硬化性組成物の全質量に対して、0.01~5.0質量%であることが好ましく、0.05~1.0質量%であることがより好ましく、0.05~0.5質量%であることがさらに好ましい。
 なお、硬化性組成物は、光ラジカル重合開始剤及び熱ラジカル重合開始剤の両方を含むことが好ましく、この場合、光ラジカル重合開始剤と熱ラジカル重合開始剤の合計含有量は、硬化性組成物の全質量に対して、0.01~10質量%であることが好ましく、0.05~5.0質量%であることがより好ましく、0.05~3.0質量%であることがさらに好ましい。
The content of the radical photopolymerization initiator is preferably 0.01 to 5.0% by mass and more preferably 0.05 to 1.0% by mass with respect to the total mass of the curable composition. Preferably, it is 0.05 to 0.5% by mass.
The curable composition preferably contains both a radical photopolymerization initiator and a thermal radical polymerization initiator. In this case, the total content of the radical photopolymerization initiator and the thermal radical polymerization initiator is the curable composition. It is preferably 0.01 to 10% by mass, more preferably 0.05 to 5.0% by mass, and 0.05 to 3.0% by mass with respect to the total mass of the product. Further preferred.
<ラジカル重合性基を側鎖に有する重合体>
 硬化性組成物は、上述した化合物とは別に、ラジカル重合性基を側鎖に有する重合体をさらに含んでもよい。但し、この場合、ラジカル重合性基を側鎖に有する重合体は、フッ素原子を含むものではない。ラジカル重合性基を側鎖に有する重合体は硬化性組成物の粘度を高める働きをするため、増粘剤もしくは増粘ポリマーと呼ぶこともできる。なお、ラジカル重合性基を側鎖に有する重合体は、硬化性組成物の粘度を所望の範囲内に調整する必要がある際に添加することができる。
<Polymer having radical polymerizable group in side chain>
The curable composition may further include a polymer having a radical polymerizable group in the side chain, in addition to the above-described compound. However, in this case, the polymer having a radical polymerizable group in the side chain does not contain a fluorine atom. Since the polymer having a radically polymerizable group in the side chain functions to increase the viscosity of the curable composition, it can also be called a thickener or a thickening polymer. In addition, the polymer which has a radically polymerizable group in a side chain can be added when it is necessary to adjust the viscosity of a curable composition in a desired range.
 ラジカル重合性基を側鎖に有する重合体は、単独重合体であってもよく、共重合体であってもよい。中でも、ラジカル重合性基を側鎖に有する重合体は共重合体であることが好ましい。ラジカル重合性基を側鎖に有する重合体が共重合体である場合は、少なくとも一方の共重合成分がラジカル重合性基を有していればよい。また、ラジカル重合性基を側鎖に有する重合体が共重合体である場合は、側鎖にラジカル重合性基を有する単量体単位と、側鎖にアリール基を有する単量体単位を含む共重合体であることがより好ましい。 The polymer having a radical polymerizable group in the side chain may be a homopolymer or a copolymer. Especially, it is preferable that the polymer which has a radically polymerizable group in a side chain is a copolymer. When the polymer having a radical polymerizable group in the side chain is a copolymer, it is sufficient that at least one copolymer component has a radical polymerizable group. Further, when the polymer having a radically polymerizable group in the side chain is a copolymer, it includes a monomer unit having a radically polymerizable group in the side chain and a monomer unit having an aryl group in the side chain. More preferably, it is a copolymer.
 ラジカル重合性基としては、(メタ)アクリレート基、ビニル基、スチリル基、アリル基等を挙げることができる。ラジカル重合性基を側鎖に有する重合体には、ラジカル重合性基を有する繰り返し単位が、5~100質量%含まれていることが好ましく、10~90質量%含まれていることがより好ましく、20~80質量%含まれていることがさらに好ましい。 Examples of the radical polymerizable group include (meth) acrylate group, vinyl group, styryl group, allyl group and the like. The polymer having a radically polymerizable group in the side chain preferably contains 5 to 100% by weight of repeating units having a radically polymerizable group, and more preferably 10 to 90% by weight. 20 to 80% by mass is more preferable.
 以下に好ましく用いられるラジカル重合性基を側鎖に有する重合体の具体例を列挙するが、ラジカル重合性基を側鎖に有する重合体は以下の構造に限定されるものではない。
 以下の構造式において、Ra及びRbは、それぞれ独立に、水素又はメチル基を表す。なお、1つのポリマー中における複数のRaは同一であっても、異なっていてもよい。また、nは0~10の整数を表し、0~2の整数であることが好ましく、0又は1であることがより好ましい。
Specific examples of the polymer having a radically polymerizable group preferably used in the side chain are listed below, but the polymer having a radically polymerizable group in the side chain is not limited to the following structure.
In the following structural formulas, Ra and Rb each independently represent hydrogen or a methyl group. A plurality of Ra in one polymer may be the same or different. N represents an integer of 0 to 10, preferably an integer of 0 to 2, and more preferably 0 or 1.
Figure JPOXMLDOC01-appb-C000010
Figure JPOXMLDOC01-appb-C000010
Figure JPOXMLDOC01-appb-C000011
Figure JPOXMLDOC01-appb-C000011
 ラジカル重合性基を側鎖に有する重合体の分子量(重量平均分子量)は、1,000~10,000,000であることが好ましく、5,000~300,000であることがより好ましく、10,000~200,000であることがさらに好ましい。また、ラジカル重合性基を側鎖に有する重合体のガラス転移温度は、50~400℃であることが好ましく、70~350℃であることがより好ましく、100~300℃であることがさらに好ましい。 The molecular weight (weight average molecular weight) of the polymer having a radical polymerizable group in the side chain is preferably 1,000 to 10,000,000, more preferably 5,000 to 300,000. More preferably, it is from 1,000,000 to 200,000. The glass transition temperature of the polymer having a radical polymerizable group in the side chain is preferably 50 to 400 ° C., more preferably 70 to 350 ° C., and further preferably 100 to 300 ° C. .
 ラジカル重合性基を側鎖に有する重合体の含有量は、硬化性組成物の全質量に対して、40質量%以下であることが好ましく、30質量%以下であることがより好ましく、25質量%以下であることがさらに好ましい。なお、ラジカル重合性基を側鎖に有する重合体の含有量は、0質量%であってもよく、ラジカル重合性基を側鎖に有する重合体を添加しない態様も好ましい。 The content of the polymer having a radical polymerizable group in the side chain is preferably 40% by mass or less, more preferably 30% by mass or less, and more preferably 25% by mass with respect to the total mass of the curable composition. More preferably, it is% or less. In addition, 0 mass% may be sufficient as content of the polymer which has a radically polymerizable group in a side chain, and the aspect which does not add the polymer which has a radically polymerizable group in a side chain is also preferable.
<その他の添加剤>
 本発明の趣旨に反しない限りにおいて、硬化性組成物は上述した成分以外のポリマーやモノマー、分散剤、可塑剤、熱安定剤、離型剤等の添加剤を含んでいてもよい。
<Other additives>
Unless it is contrary to the meaning of this invention, the curable composition may contain additives, such as a polymer other than the component mentioned above, a monomer, a dispersing agent, a plasticizer, a heat stabilizer, and a mold release agent.
(硬化物の製造方法)
 硬化物の製造方法は、上述した硬化性組成物を光硬化する工程及び/又は熱硬化する工程を含む。中でも、硬化物の製造方法は、硬化性組成物に光照射するか又は硬化性組成物を加熱することによって半硬化物を形成する工程と、得られた半硬化物に光照射するか又は半硬化物を加熱することによって硬化物を形成する工程と、を含むことが好ましい。
(Method for producing cured product)
The manufacturing method of hardened | cured material includes the process of photocuring the curable composition mentioned above, and / or the process of thermosetting. Among them, the method for producing a cured product includes a step of forming a semi-cured product by irradiating the curable composition with light or heating the curable composition, and irradiating the obtained semi-cured product with light or semi-cured. A step of forming a cured product by heating the cured product.
<半硬化物を形成する工程>
 半硬化物を形成する工程はまず転写工程を含むことが好ましい。転写工程は、上述した硬化性組成物に金型を押し当てる工程である。転写工程では、一対の金型の一方に注入された硬化性組成物に他方の金型を押し当てて硬化性組成物を押し広げる。
<Process for forming semi-cured product>
It is preferable that the step of forming the semi-cured product first includes a transfer step. A transfer process is a process of pressing a metal mold | die against the curable composition mentioned above. In the transfer step, the other mold is pressed against the curable composition injected into one of the pair of molds to spread the curable composition.
 硬化物の製造方法で用いる金型は、窒化クロム処理が施されたものであることが好ましい。これにより、後工程で行う離型工程で、良好な金型離型性を得ることができ、光学部材の製造効率を高めることができる。 It is preferable that the metal mold | die used with the manufacturing method of hardened | cured material is what performed the chromium nitride process. Thereby, a favorable mold releasability can be obtained in a release step performed in a later step, and the manufacturing efficiency of the optical member can be increased.
 窒化クロム処理としては、例えば金型表面に窒化クロム膜を成膜する方法を挙げることができる。金型表面に窒化クロム膜を製膜する方法としては、例えばCVD(Chemical Vapor Deposition)法とPVD(Physical Vapor Deposition)法とがある。CVD法は、クロムを含む原料ガスと窒素を含む原料ガスとを高温で反応させて基体表面に窒化クロム膜を形成する方法である。また、PVD法は、アーク放電を利用して基体表面に窒化クロム膜を形成する方法(アーク式真空蒸着法)である。このアーク式真空蒸着法は、真空容器内に例えばクロムよりなる陰極(蒸発源)を配置し、陰極と真空容器の壁面との間でトリガを介してアーク放電を起こさせ、陰極を蒸発させると同時にアークプラズマによる金属のイオン化を図り、基体に負の電圧をかけておき、かつ真空容器に反応ガス例えば窒素ガスを数10mTorr(1.33Pa)程度入れることにより、イオン化した金属と反応ガスを基体の表面で反応させて化合物の膜を作るという方法である。本発明における金型表面の窒化クロム処理は、上記CVD法、又はPVD法により実施されている。 Examples of the chromium nitride treatment include a method of forming a chromium nitride film on the mold surface. As a method of forming a chromium nitride film on the mold surface, there are, for example, a CVD (Chemical Vapor Deposition) method and a PVD (Physical Vapor Deposition) method. The CVD method is a method of forming a chromium nitride film on a substrate surface by reacting a source gas containing chromium and a source gas containing nitrogen at a high temperature. The PVD method is a method of forming a chromium nitride film on the surface of a substrate using an arc discharge (arc type vacuum deposition method). In this arc type vacuum deposition method, when a cathode (evaporation source) made of, for example, chromium is disposed in a vacuum vessel, an arc discharge is caused between the cathode and the wall of the vacuum vessel via a trigger, and the cathode is evaporated. At the same time, ionization of the metal by arc plasma is performed, a negative voltage is applied to the substrate, and a reaction gas such as nitrogen gas is introduced into the vacuum vessel by about several tens of mTorr (1.33 Pa), thereby bringing the ionized metal and the reaction gas into the substrate It is a method of making a film of a compound by reacting on the surface. The chromium nitride treatment of the mold surface in the present invention is carried out by the above CVD method or PVD method.
 ここで、金型は、一般的に2つの金型を組み合わせて内容物に加圧しながら加熱することができるようになっており、金型に低粘度の組成物を注入すると、成形型クリアランスへの漏れの原因となる。このため、金型に注入される硬化性組成物は、一定以上の粘度を有していることが好ましい。硬化性組成物の粘度を調整するために、硬化性組成物に上述したラジカル重合性基を側鎖に有する重合体を添加してもよい。 Here, in general, the mold can be heated while pressing the contents by combining two molds, and when a low-viscosity composition is injected into the mold, the mold clearance is reached. Cause leakage. For this reason, it is preferable that the curable composition inject | poured into a metal mold | die has a certain viscosity or more. In order to adjust the viscosity of the curable composition, a polymer having the above-described radical polymerizable group in the side chain may be added to the curable composition.
 金型を押し当てる工程の後には、半硬化物を形成する工程が設けられる。半硬化物は、金型内に注入された硬化性組成物を半硬化することで得られる。半硬化物を形成する工程では、光照射又は加熱を行う。本明細書では、このような工程を半硬化工程と呼ぶこともできる。 After the step of pressing the mold, a step of forming a semi-cured product is provided. The semi-cured product can be obtained by semi-curing the curable composition injected into the mold. In the step of forming the semi-cured product, light irradiation or heating is performed. In this specification, such a process can also be called a semi-hardening process.
 半硬化物を形成する工程では、硬化性組成物に対して光照射及び加熱のうち少なくとも一方を行って、25℃、周波数10Hzにおける複素粘度が105~108mPa・sの半硬化物を形成することが好ましい。 In the step of forming a semi-cured product, at least one of light irradiation and heating is performed on the curable composition to obtain a semi-cured product having a complex viscosity of 10 5 to 10 8 mPa · s at 25 ° C. and a frequency of 10 Hz. It is preferable to form.
 ここで、本明細書中において「半硬化物」とは、硬化性組成物を重合したものであり、完全に固体となっておらず、ある程度流動性を有する状態の物を意味する。25℃、周波数10Hzにおける複素粘度の上限値が1.0×109mPa・s未満の物は半硬化物とみなせる。硬化性組成物の重合体の、25℃、周波数10Hzにおける複素粘度が105~108mPa・sである場合、その重合体は半硬化物である。一方、「硬化物」とは、硬化性組成物を重合により硬化させたものであり、完全に固体となっている状態の物を意味する。 Here, the “semi-cured product” in the present specification is a product obtained by polymerizing a curable composition, which is not completely solid and has a certain degree of fluidity. A product having an upper limit value of complex viscosity of less than 1.0 × 10 9 mPa · s at 25 ° C. and a frequency of 10 Hz can be regarded as a semi-cured product. If the polymer of the curable composition has a complex viscosity of 10 5 to 10 8 mPa · s at 25 ° C. and a frequency of 10 Hz, the polymer is a semi-cured product. On the other hand, the “cured product” is a product obtained by curing a curable composition by polymerization, and means a product in a completely solid state.
 光照射に用いられる光は、紫外線又は可視光線であることが好ましく、紫外線であることがより好ましい。例えばメタルハライドランプ、低圧水銀ランプ、高圧水銀ランプ、超高圧水銀ランプ、殺菌ランプ、キセノンランプ、LED(Light Emitting Diode)光源ランプなどが好適に使用される。光照射時の雰囲気は、空気又は不活性ガス置換雰囲気であることが好ましく、酸素濃度1%以下になるまで窒素置換した雰囲気であることがより好ましい。 The light used for light irradiation is preferably ultraviolet light or visible light, and more preferably ultraviolet light. For example, a metal halide lamp, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a sterilization lamp, a xenon lamp, an LED (Light Emitting Diode) light source lamp, or the like is preferably used. The atmosphere at the time of light irradiation is preferably air or an inert gas substitution atmosphere, and more preferably an atmosphere substituted with nitrogen until the oxygen concentration becomes 1% or less.
 半硬化工程において、加熱半硬化工程を設ける場合、加熱半硬化は、加熱後の半硬化物の25℃、周波数10Hzにおける複素粘度が、105~108mPa・sとなるように行うことが好ましい。 In the semi-curing process, when a heating semi-curing process is provided, the heating semi-curing is performed so that the complex viscosity of the semi-cured product after heating at 25 ° C. and a frequency of 10 Hz is 10 5 to 10 8 mPa · s. preferable.
 本発明は、上述した方法で製造される半硬化物にも関する。このような半硬化物は、後述する硬化物の製造方法に好ましく用いることができる。ここで、半硬化物の複素粘度の好ましい範囲は、上述した半硬化物を形成する工程における半硬化物の複素粘度の好ましい範囲と同様である。 The present invention also relates to a semi-cured product produced by the method described above. Such a semi-cured product can be preferably used in a method for producing a cured product to be described later. Here, the preferable range of the complex viscosity of the semi-cured product is the same as the preferable range of the complex viscosity of the semi-cured product in the step of forming the semi-cured product.
 半硬化物には、光照射工程後において、光ラジカル重合開始剤が全て消費されていて全く含まれていなくてもよく、光ラジカル重合開始剤が残留していてもよい。 In the semi-cured product, after the light irradiation step, the radical photopolymerization initiator is completely consumed and may not be contained at all, or the radical photopolymerization initiator may remain.
 また、半硬化物のガラス転移温度は、-150~0℃であることが好ましく、-50~0℃であることがより好ましく、-20~0℃であることが特に好ましい。 The glass transition temperature of the semi-cured product is preferably −150 to 0 ° C., more preferably −50 to 0 ° C., and particularly preferably −20 to 0 ° C.
<硬化物を形成する工程>
 硬化物を形成する工程は、半硬化物を成形型に入れ加圧変形し、加熱して熱重合させるか、もしくは光照射を行うことで光重合させることにより硬化物を得る重合工程を含むことが好ましい。本明細書では、このような工程を硬化工程と呼ぶこともできる。なお、硬化物を形成する工程における光照射の条件と加熱条件は、上述した半硬化工程における条件と同様である。
<Step of forming a cured product>
The step of forming a cured product includes a polymerization step in which a semi-cured product is put into a mold and subjected to pressure deformation and heated to thermally polymerize or photopolymerized by light irradiation to obtain a cured product. Is preferred. In this specification, such a process can also be called a hardening process. In addition, the light irradiation conditions and heating conditions in the process of forming the cured product are the same as the conditions in the semi-curing process described above.
 硬化工程が熱重合工程である場合、重合工程で用いられる成形型のことを、熱成形用成形型とも言う。熱成形用成形型は、一般に2つの成形型を組み合わせて内容物に加圧しながら加熱することができる構成となっていることが好ましい。また、硬化物の製造方法では、硬化物を得る熱重合工程において、成形型として金型を用いることがより好ましい。このような熱成形用成形型としては、例えば、特開2009-126011号公報に記載のものを用いることができる。また、金型は、窒化クロム処理が施されたものであることが好ましい。 When the curing process is a thermal polymerization process, the mold used in the polymerization process is also referred to as a thermoforming mold. In general, it is preferable that the thermoforming mold has a configuration in which two molds can be combined and heated while pressing the contents. Moreover, in the manufacturing method of hardened | cured material, it is more preferable to use a metal mold | die as a shaping | molding die in the thermal polymerization process which obtains hardened | cured material. As such a thermoforming mold, for example, the one described in JP-A-2009-126011 can be used. Moreover, it is preferable that the metal mold has been subjected to a chromium nitride treatment.
 熱重合工程では、成形型に入れた半硬化物を、加圧変形し、加熱して熱重合させて硬化物を得る。ここで、加圧変形と加熱は同時に行ってもよく、加圧変形した後で加熱を行ってもよく、加熱した後で加圧変形を行ってもよいが、その中でも加圧変形と加熱を同時に行うことが好ましい。また、加圧変形と加熱を同時に行った上で、加圧が安定してからさらに高温に加熱することも好ましい。 In the thermal polymerization step, the semi-cured product placed in the mold is subjected to pressure deformation, heated and thermally polymerized to obtain a cured product. Here, the pressure deformation and the heating may be performed at the same time, the heating may be performed after the pressure deformation, or the pressure deformation may be performed after the heating. It is preferable to carry out simultaneously. Further, it is also preferable that the pressure deformation and the heating are performed at the same time and the heating is further performed at a higher temperature after the pressure is stabilized.
 熱重合工程では、半硬化物を150℃以上の温度で加熱して硬化させ、硬化物を得る。
 加熱温度は、150℃以上であり、160~270℃であることが好ましく、165~250℃であることがより好ましく、170~230℃であることがさらに好ましい。
 この硬化工程では、加熱を行うとともに加圧変形を行うことが好ましい。これにより金型内面の反転形状を硬化物に精度よく転写することができる。
In the thermal polymerization step, the semi-cured product is heated and cured at a temperature of 150 ° C. or higher to obtain a cured product.
The heating temperature is 150 ° C. or higher, preferably 160 to 270 ° C., more preferably 165 to 250 ° C., and still more preferably 170 to 230 ° C.
In this curing step, it is preferable to perform heating and pressure deformation. Thereby, the inverted shape of the inner surface of the mold can be accurately transferred to the cured product.
 加圧変形における圧力は、0.098MPa~9.8MPaであることが好ましく、0.294MPa~4.9MPaであることがより好ましく、0.294MPa~2.94MPaであることが特に好ましい。
 熱重合の時間は、30~1000秒であることが好ましく、30~500秒であることがより好ましく、60~300秒であることが特に好ましい。熱重合時の雰囲気は、空気又は不活性ガス置換雰囲気であることが好ましく、酸素濃度1%以下になるまで窒素置換した雰囲気であることがより好ましい。
The pressure in the pressure deformation is preferably 0.098 MPa to 9.8 MPa, more preferably 0.294 MPa to 4.9 MPa, and particularly preferably 0.294 MPa to 2.94 MPa.
The time for the thermal polymerization is preferably 30 to 1000 seconds, more preferably 30 to 500 seconds, and particularly preferably 60 to 300 seconds. The atmosphere at the time of thermal polymerization is preferably air or an inert gas substitution atmosphere, and more preferably an atmosphere substituted with nitrogen until the oxygen concentration becomes 1% or less.
 硬化工程の後には、離型工程が設けられる。硬化工程で熱重合を行った場合、離型工程では、150~250℃の温度範囲で硬化物から金型を引き離すことが好ましい。離型工程における温度を上記範囲内とすることにより、硬化物から金型を容易に引き離すことができ、製造効率を高めることができる。 A release step is provided after the curing step. When thermal polymerization is performed in the curing step, it is preferable to pull the mold away from the cured product in the temperature range of 150 to 250 ° C. in the mold release step. By setting the temperature in the mold release step within the above range, the mold can be easily separated from the cured product, and the production efficiency can be increased.
 以上、硬化物の製造方法の一例について説明したが、本発明の硬化物の製造方法はこれに限るものではなく、本発明を逸脱しない範囲で適宜変更が可能である。例えば、転写工程と半硬化工程で用いた金型を、そのまま硬化工程で用いてもよく、半硬化工程を行った後、半硬化物から金型を引き離し、この半硬化物を別の金型(熱成形用成形型)に移動させて硬化工程を行ってもよい。この場合、半硬化工程及び硬化工程で用いる金型には上述したクロム処理が施されていることが好ましい。
 また、半硬化工程で、金型内の硬化性組成物に光照射を行うとともに、加熱を行うようにしてもよい。これにより、所望の硬化度を有する半硬化物を確実に得ることができる。
As mentioned above, although an example of the manufacturing method of hardened | cured material was demonstrated, the manufacturing method of hardened | cured material of this invention is not restricted to this, In the range which does not deviate from this invention, it can change suitably. For example, the mold used in the transfer process and the semi-curing process may be used as it is in the curing process. After performing the semi-curing process, the mold is separated from the semi-cured product, and this semi-cured product is separated from another mold. The curing step may be performed by moving to a (thermoforming mold). In this case, it is preferable that the above-described chromium treatment is performed on the mold used in the semi-curing process and the curing process.
In the semi-curing step, the curable composition in the mold may be irradiated with light and heated. Thereby, the semi-hardened material which has a desired degree of hardening can be obtained reliably.
(半硬化物)
 本発明は、硬化性組成物の半硬化物にも関する。半硬化物は、上述した硬化性組成物を半硬化することにより形成される。本発明の半硬化物は、上述した半硬化物の製造方法によって製造されたものであることが好ましい。また、半硬化物は、25℃、周波数10Hzにおける複素粘度が105~108mPa・sであることが好ましい。
(Semi-cured product)
The present invention also relates to a semi-cured product of the curable composition. The semi-cured product is formed by semi-curing the above-described curable composition. The semi-cured product of the present invention is preferably produced by the above-described method for producing a semi-cured product. The semi-cured product preferably has a complex viscosity of 10 5 to 10 8 mPa · s at 25 ° C. and a frequency of 10 Hz.
(硬化物)
 本発明は、硬化性組成物の硬化物にも関する。硬化物は、上述した半硬化成分を硬化することにより形成される。本発明の硬化物は、上述した硬化物の製造方法によって製造されたものであることが好ましい。
(Cured product)
The present invention also relates to a cured product of the curable composition. The cured product is formed by curing the semi-cured component described above. It is preferable that the hardened | cured material of this invention is manufactured by the manufacturing method of the hardened material mentioned above.
(サイズ)
 本発明の硬化物は、最大厚みが0.1~10mmであることが好ましい。最大厚みは、より好ましくは0.1~5mmであり、特に好ましくは0.15~3mmである。本発明の硬化物は、最大直径が1~1000mmであることが好ましい。最大直径は、より好ましくは2~200mmであり、特に好ましくは2.5~100mmである。
(size)
The cured product of the present invention preferably has a maximum thickness of 0.1 to 10 mm. The maximum thickness is more preferably 0.1 to 5 mm, and particularly preferably 0.15 to 3 mm. The cured product of the present invention preferably has a maximum diameter of 1 to 1000 mm. The maximum diameter is more preferably 2 to 200 mm, and particularly preferably 2.5 to 100 mm.
(光学部材)
 本発明は、上述した硬化物を含む光学部材にも関する。本発明の硬化物は、光学特性に優れた成形体であるため、光学部材に好ましく用いられる。本発明の光学部材の種類は、特に制限されない。特に、硬化性組成物の優れた光学特性を利用した光学部材、特に光を透過する光学部材(いわゆるパッシブ光学部材)として好適に利用することができる。このような光学部材を備えた光学機能装置としては、例えば、各種ディスプレイ装置(液晶ディスプレイやプラズマディスプレイ等)、各種プロジェクタ装置(OHP(Overhead projector)、液晶プロジェクタ等)、光ファイバー通信装置(光導波路、光増幅器等)、カメラやビデオ等の撮影装置等が例示される。
(Optical member)
The present invention also relates to an optical member including the above-described cured product. Since the hardened | cured material of this invention is a molded object excellent in the optical characteristic, it is preferably used for an optical member. The kind of the optical member of the present invention is not particularly limited. In particular, it can be suitably used as an optical member utilizing the excellent optical characteristics of the curable composition, particularly as an optical member that transmits light (so-called passive optical member). Examples of the optical functional device including such an optical member include various display devices (liquid crystal display, plasma display, etc.), various projector devices (OHP (Overhead projector), liquid crystal projector, etc.), optical fiber communication devices (optical waveguide, An optical amplifier etc.), a photographing device such as a camera and a video, etc. are exemplified.
 また、光学機能装置に用いられるパッシブ光学部材としては、例えば、レンズ、プリズム、プリズムシート、パネル(板状成形体)、フィルム、光導波路(フィルム状やファイバー状等)、光ディスク、LEDの封止剤等が例示される。このようなパッシブ光学部材には、必要に応じて任意の被覆層、例えば摩擦や摩耗による塗布面の機械的損傷を防止する保護層、無機粒子や基材等の劣化原因となる望ましくない波長の光線を吸収する光線吸収層、水分や酸素ガス等の反応性低分子の透過を抑制あるいは防止する透過遮蔽層、防眩層、反射防止層、低屈折率層等や、任意の付加機能層が設けられてもよい。任意の被覆層の具体例としては、無機酸化物コーティング層からなる透明導電膜やガスバリア膜、有機物コーティング層からなるガスバリア膜やハードコート膜等が挙げられる。コーティング層を形成するためのコーティング法としては、真空蒸着法、CVD法、スパッタリング法、ディップコート法、スピンコート法等公知のコーティング法を用いることができる。 Moreover, as a passive optical member used for an optical functional device, for example, a lens, a prism, a prism sheet, a panel (plate-shaped molded body), a film, an optical waveguide (film-like or fiber-like), an optical disk, and an LED sealing Examples thereof include agents. Such passive optical members include any coating layer, if necessary, such as a protective layer that prevents mechanical damage to the coated surface due to friction and wear, and an undesirable wavelength that causes deterioration of inorganic particles and substrates. Light absorption layer that absorbs light, transmission shielding layer that suppresses or prevents transmission of reactive low molecules such as moisture and oxygen gas, antiglare layer, antireflection layer, low refractive index layer, etc. It may be provided. Specific examples of the optional coating layer include a transparent conductive film and gas barrier film made of an inorganic oxide coating layer, and a gas barrier film and hard coat film made of an organic coating layer. As a coating method for forming the coating layer, a known coating method such as a vacuum deposition method, a CVD method, a sputtering method, a dip coating method, or a spin coating method can be used.
(応用例)
 本発明の硬化物を用いた光学部材は、特にレンズ基材に好ましく用いられる。本発明の硬化性組成物を用いて製造されたレンズ基材は低アッベ数を有し、好ましくは、高屈折性、光線透過性、軽量性を併せ持ち、光学特性に優れている。また、硬化性組成物を構成するモノマーの種類を適宜調整することにより、レンズ基材の屈折率を任意に調節することが可能である。
 なお、本明細書中において「レンズ基材」とは、レンズ機能を発揮することができる単一部材を意味する。レンズ基材の表面や周囲には、レンズの使用環境や用途に応じて膜や部材を設けることができる。例えば、レンズ基材の表面には、保護膜、反射防止膜、ハードコート膜等を形成することができる。また、ガラスレンズ基材や、プラスチックレンズ基材に積層させた複合レンズにすることができる。さらにレンズ基材の周囲を基材保持枠などに嵌入して固定することもできる。但し、これらの膜や枠などは、レンズ基材に付加される部材であり、本明細書中でいうレンズ基材そのものとは区別される。
(Application examples)
The optical member using the cured product of the present invention is particularly preferably used for a lens substrate. The lens substrate produced using the curable composition of the present invention has a low Abbe number, and preferably has high refractive properties, light transmittance and light weight, and is excellent in optical properties. In addition, the refractive index of the lens substrate can be arbitrarily adjusted by appropriately adjusting the type of monomer constituting the curable composition.
In the present specification, the “lens substrate” means a single member that can exhibit a lens function. A film or a member can be provided on the surface or the periphery of the lens substrate according to the use environment or application of the lens. For example, a protective film, an antireflection film, a hard coat film, or the like can be formed on the surface of the lens substrate. Moreover, it can be set as the compound lens laminated | stacked on the glass lens base material or the plastic lens base material. Further, the periphery of the lens base material can be fitted and fixed to a base material holding frame or the like. However, these films and frames are members added to the lens base material, and are distinguished from the lens base material itself in this specification.
 レンズ基材をレンズとして利用するに際しては、レンズ基材そのものを単独でレンズとして用いてもよいし、上述した膜や枠、その他レンズ基材などを付加してレンズとして用いてもよい。レンズ基材を用いたレンズの種類や形状は、特に制限されない。
 レンズ基材は携帯電話やデジタルカメラ等の撮像用レンズやテレビ、ビデオカメラ等の撮映レンズ、さらには車載レンズ、内視鏡レンズに使用されることが好ましい。
When the lens substrate is used as a lens, the lens substrate itself may be used alone as a lens, or may be used as a lens by adding the above-described film, frame, or other lens substrate. The type and shape of the lens using the lens substrate are not particularly limited.
The lens base material is preferably used for imaging lenses such as mobile phones and digital cameras, imaging lenses such as televisions and video cameras, vehicle-mounted lenses, and endoscope lenses.
 以下に実施例と比較例を挙げて本発明の特徴をさらに具体的に説明する。以下の実施例に示す材料、使用量、割合、処理内容、処理手順等は、本発明の趣旨を逸脱しない限り適宜変更することができる。したがって、本発明の範囲は以下に示す具体例により限定的に解釈されるべきものではない。 Hereinafter, the features of the present invention will be described more specifically with reference to examples and comparative examples. The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention should not be construed as being limited by the specific examples shown below.
(化合物A)
 化合物Aとして下記の化合物を使用した。
Figure JPOXMLDOC01-appb-C000012
(Compound A)
The following compounds were used as Compound A.
Figure JPOXMLDOC01-appb-C000012
<化合物A-1の合成>
 特許第5940496号公報の段落0128~0129に記載の方法に従って、化合物A-1を合成した。
<Synthesis of Compound A-1>
Compound A-1 was synthesized according to the method described in Paragraphs 0128 to 0129 of Japanese Patent No. 5940496.
<化合物A-4の合成>
 特許第5940496号公報の段落0132~0133に記載の方法に従って、化合物A-4を合成した。
<Synthesis of Compound A-4>
Compound A-4 was synthesized according to the method described in Paragraphs 0132 to 0133 of Japanese Patent No. 5940496.
<化合物A-3の合成>
 5,6-ジメトキシ-1-インダノン290gと、オルトフタルアルデヒド204gを1500mLのメタノールに溶解させた。反応溶液を加温し、60℃に保ちつつ、水酸化カリウム255gをメタノール1750mLに溶解させたものを反応溶液に滴下した。5時間攪拌した後、反応溶液を室温に戻し、析出した結晶を濾取し、化合物3-1Aを230g得た。
Figure JPOXMLDOC01-appb-C000013
<Synthesis of Compound A-3>
290 g of 5,6-dimethoxy-1-indanone and 204 g of orthophthalaldehyde were dissolved in 1500 mL of methanol. The reaction solution was heated and maintained at 60 ° C., and 255 g of potassium hydroxide dissolved in 1750 mL of methanol was added dropwise to the reaction solution. After stirring for 5 hours, the reaction solution was returned to room temperature, and the precipitated crystals were collected by filtration to obtain 230 g of Compound 3-1A.
Figure JPOXMLDOC01-appb-C000013
 化合物3-1A 200gと、フェノール320gをメタンスルホン酸320mLに溶解させた。反応溶液を加温し、60℃に保ちつつ、3-メルカプトプロピオン酸3.2mLを滴下した。5時間攪拌後、反応溶液にメタノールを720mL滴下し、30分攪拌後、さらに1400mLのメタノールを滴下した。反応溶液を室温に戻し、析出した結晶を濾取し、化合物3-1Bを292g得た。
Figure JPOXMLDOC01-appb-C000014
200 g of compound 3-1A and 320 g of phenol were dissolved in 320 mL of methanesulfonic acid. While the reaction solution was heated and maintained at 60 ° C., 3.2 mL of 3-mercaptopropionic acid was added dropwise. After stirring for 5 hours, 720 mL of methanol was added dropwise to the reaction solution. After stirring for 30 minutes, 1400 mL of methanol was further added dropwise. The reaction solution was returned to room temperature, and the precipitated crystals were collected by filtration to obtain 292 g of Compound 3-1B.
Figure JPOXMLDOC01-appb-C000014
 2-ヒドロキシエチルアクリレート100gに、トリエチルアミン132mLと、酢酸ブチル650mLを加え攪拌した。反応溶液を5℃に保ちつつ、メタンスルホン酸クロリド70mLを1時間かけて滴下した。1時間攪拌後、反応溶液に水500mL加え、攪拌した後、水層を除去する操作を3回繰り返した。ジブチルヒドロキシトルエンを30mg加えた後、減圧することで酢酸ブチルを留去し、化合物3-1Cを160g得た。
Figure JPOXMLDOC01-appb-C000015
To 100 g of 2-hydroxyethyl acrylate, 132 mL of triethylamine and 650 mL of butyl acetate were added and stirred. While maintaining the reaction solution at 5 ° C., 70 mL of methanesulfonic acid chloride was added dropwise over 1 hour. After stirring for 1 hour, 500 mL of water was added to the reaction solution, and after stirring, the operation of removing the aqueous layer was repeated three times. After adding 30 mg of dibutylhydroxytoluene, butyl acetate was distilled off under reduced pressure to obtain 160 g of Compound 3-1C.
Figure JPOXMLDOC01-appb-C000015
 化合物3-1B 100gに酢酸ブチル500mL、ニトロベンゼン0.5mL、炭酸カリウム138g、及びテトラブチルアンモニウムブロマイド(TBAB)8gを加え攪拌した。反応溶液に、化合物3-1Cを150g加え、80℃に保ちつつ、5時間反応させた後、トルエンを250mL加え攪拌した。反応溶液に、水300mLを加え、60℃に保ちつつ攪拌した後、水層を除去する操作を3回繰り返した。残渣をカラムクロマトグラフィーで精製することにより、化合物A-3を120g得た。 To 100 g of compound 3-1B, 500 mL of butyl acetate, 0.5 mL of nitrobenzene, 138 g of potassium carbonate, and 8 g of tetrabutylammonium bromide (TBAB) were added and stirred. To the reaction solution, 150 g of compound 3-1C was added and reacted for 5 hours while maintaining at 80 ° C. Then, 250 mL of toluene was added and stirred. The operation of adding 300 mL of water to the reaction solution and stirring while maintaining the temperature at 60 ° C. was then repeated 3 times. The residue was purified by column chromatography to obtain 120 g of compound A-3.
<化合物A-2の合成>
 5,6-ジメトキシ-1-インダノンの代わりに6-メトキシ-1-インダノンを用いること以外は化合物A-3の合成と同様の操作を行い、化合物A-2を合成した。
<Synthesis of Compound A-2>
Compound A-2 was synthesized in the same manner as in the synthesis of Compound A-3 except that 6-methoxy-1-indanone was used instead of 5,6-dimethoxy-1-indanone.
<化合物A-6の合成>
 o-フェニレンジアミン21.6g及びニンヒドリン35.6gに対して、エタノール50mL、酢酸10mLを加えて70℃で3時間反応させた。反応溶液を室温まで冷却したのち、析出した結晶を濾取し、エタノールで洗浄、乾燥することで、化合物6-1Aを40.9g得た。
Figure JPOXMLDOC01-appb-C000016
<Synthesis of Compound A-6>
50 mL of ethanol and 10 mL of acetic acid were added to 21.6 g of o-phenylenediamine and 35.6 g of ninhydrin, and reacted at 70 ° C. for 3 hours. After the reaction solution was cooled to room temperature, the precipitated crystals were collected by filtration, washed with ethanol and dried to obtain 40.9 g of Compound 6-1A.
Figure JPOXMLDOC01-appb-C000016
 化合物6-1Aを20gと、2、6-ジメチルフェノール36gをメタンスルホン酸30mLに溶解させた。反応溶液を加温し、100℃に保ちつつ、3-メルカプトプロピオン酸0.3mLを滴下した。3時間攪拌後、反応溶液にトルエンを70mL滴下し、30分攪拌後、さらに140mLのトルエンを滴下した。反応溶液を室温に戻し、析出した結晶を濾取し、化合物6-1Bを29g得た。
Figure JPOXMLDOC01-appb-C000017
20 g of compound 6-1A and 36 g of 2,6-dimethylphenol were dissolved in 30 mL of methanesulfonic acid. While the reaction solution was heated and maintained at 100 ° C., 0.3 mL of 3-mercaptopropionic acid was added dropwise. After stirring for 3 hours, 70 mL of toluene was added dropwise to the reaction solution. After stirring for 30 minutes, 140 mL of toluene was further added dropwise. The reaction solution was returned to room temperature, and the precipitated crystals were collected by filtration to obtain 29 g of compound 6-1B.
Figure JPOXMLDOC01-appb-C000017
 化合物3-1Bの代わりに化合物6-1Bを用いること以外は化合物A-3の合成と同様の操作を行い、化合物A-6を合成した。 Compound A-6 was synthesized in the same manner as in the synthesis of Compound A-3 except that Compound 6-1B was used instead of Compound 3-1B.
<化合物A-8の合成>
 化合物6-1Aの代わりに4,5-ジアザフルオレン-9-オン(東京化成工業製)を用いること以外は化合物A-6の合成と同様の操作を行い、化合物A-8を合成した。
<Synthesis of Compound A-8>
Compound A-8 was synthesized in the same manner as in the synthesis of Compound A-6 except that 4,5-diazafluoren-9-one (manufactured by Tokyo Chemical Industry Co., Ltd.) was used instead of Compound 6-1A.
(比較化合物A)
 比較化合物Aとして下記の化合物RA-1を使用した。
Figure JPOXMLDOC01-appb-C000018
(Comparative Compound A)
The following compound RA-1 was used as comparative compound A.
Figure JPOXMLDOC01-appb-C000018
<化合物RA-1の合成>
 特許第5898551号公報の段落0097に記載の方法に従って、化合物RA-1を合成した。
<Synthesis of Compound RA-1>
Compound RA-1 was synthesized according to the method described in paragraph 0097 of Japanese Patent No. 5898551.
(化合物B)
 化合物Bとして下記の化合物を使用した。
Figure JPOXMLDOC01-appb-C000019
(Compound B)
The following compounds were used as Compound B.
Figure JPOXMLDOC01-appb-C000019
化合物B-1:2,2,2-トリフルオロエチルアクリレート(東京化成工業製)
化合物B-2:2,2,3,3,3-ペンタフルオロプロピルアクリレート(東京化成工業製)
化合物B-3:1H,1H,5H-オクタフルオロペンチルアクリレート(大阪有機化学工業株式会社製、ビスコート8F)
化合物B-4:ジアクリル酸2,2,3,3,4,4,5,5-オクタフルオロ-1,6-ヘキサンジオール(東京化成工業製)
Compound B-1: 2,2,2-trifluoroethyl acrylate (manufactured by Tokyo Chemical Industry)
Compound B-2: 2,2,3,3,3-pentafluoropropyl acrylate (manufactured by Tokyo Chemical Industry)
Compound B-3: 1H, 1H, 5H-octafluoropentyl acrylate (Osaka Organic Chemical Co., Ltd., Biscoat 8F)
Compound B-4: Diacrylic acid 2,2,3,3,4,4,5,5-octafluoro-1,6-hexanediol (manufactured by Tokyo Chemical Industry)
<化合物B-5の合成>
 特開2013-181140号公報の段落0177~0180に記載の方法に従って、化合物B-5を合成した。
<Synthesis of Compound B-5>
Compound B-5 was synthesized according to the method described in paragraphs 0177 to 0180 of JP2013-181140A.
<化合物B-6の合成>
 1H,1H,5H-オクタフルオロペンチルメタクリレート(大阪有機化学工業株式会社製、ビスコート8FM)25.0gと、ベンジルメタクリレート(大阪有機工業株式会社製)5.0gと、アリルメタクリレート(和光純薬工業株式会社製)20.0gを、メチルエチルケトン150.0gに溶解させ、これを70℃に加熱した。この溶液に、重合開始剤(和光純薬工業株式会社製、V-65)0.96gをメチルエチルケトン12.0gに溶解させた溶液を30分かけて滴下した。滴下終了後、さらに70℃で4.5時間反応させた。反応液を放冷後、ヘキサン900.0gに滴下し、析出した粉体を濾取し、乾燥させた。このようにして重合体B-6を41.0g得た。得られたポリマーの重量平均分子量は、GPC(Gel Permeation Chromatography)法による標準ポリスチレン換算で33,900であり、分散度(Mw/Mn)は、3.2であった。
<Synthesis of Compound B-6>
1H, 1H, 5H-octafluoropentyl methacrylate (Osaka Organic Chemical Co., Ltd., Viscoat 8FM) 25.0 g, benzyl methacrylate (Osaka Organic Industry Co., Ltd.) 5.0 g, allyl methacrylate (Wako Pure Chemical Industries, Ltd.) 20.0 g (made by company) was dissolved in 150.0 g of methyl ethyl ketone and heated to 70 ° C. To this solution, a solution prepared by dissolving 0.96 g of a polymerization initiator (V-65, manufactured by Wako Pure Chemical Industries, Ltd.) in 12.0 g of methyl ethyl ketone was dropped over 30 minutes. After completion of dropping, the reaction was further carried out at 70 ° C. for 4.5 hours. The reaction solution was allowed to cool and then added dropwise to 900.0 g of hexane, and the precipitated powder was collected by filtration and dried. In this way, 41.0 g of polymer B-6 was obtained. The weight average molecular weight of the obtained polymer was 33,900 in terms of standard polystyrene by GPC (Gel Permeation Chromatography) method, and the dispersity (Mw / Mn) was 3.2.
<化合物B-7の合成>
 1H,1H,5H-オクタフルオロペンチルメタクリレート(大阪有機化学工業株式会社製、ビスコート8FM)5.0gと、ベンジルメタクリレート(大阪有機工業株式会社製)25.0gと、アリルメタクリレート(和光純薬工業株式会社製)20.0gを、メチルエチルケトン150.0gに溶解させ、これを70℃に加熱した。この溶液に、重合開始剤(和光純薬工業株式会社製、V-65)0.96gをメチルエチルケトン12.0gに溶解させた溶液を30分かけて滴下した。滴下終了後、さらに70℃で4.5時間反応させた。反応液を放冷後、ヘキサン900.0gに滴下し、析出した粉体を濾取し、乾燥させた。このようにして重合体B-7を39.0g得た。得られたポリマーの重量平均分子量は、GPC(Gel Permeation Chromatography)法による標準ポリスチレン換算で39,200であり、分散度(Mw/Mn)は、3.7であった。
<Synthesis of Compound B-7>
1H, 1H, 5H-Octafluoropentyl methacrylate (Osaka Organic Chemical Co., Ltd., Viscoat 8FM) 5.0 g, benzyl methacrylate (Osaka Organic Industry Co., Ltd.) 25.0 g, and allyl methacrylate (Wako Pure Chemical Industries, Ltd.) 20.0 g (made by company) was dissolved in 150.0 g of methyl ethyl ketone and heated to 70 ° C. To this solution, a solution prepared by dissolving 0.96 g of a polymerization initiator (V-65, manufactured by Wako Pure Chemical Industries, Ltd.) in 12.0 g of methyl ethyl ketone was dropped over 30 minutes. After completion of dropping, the reaction was further carried out at 70 ° C. for 4.5 hours. The reaction solution was allowed to cool and then added dropwise to 900.0 g of hexane, and the precipitated powder was collected by filtration and dried. In this way, 39.0 g of polymer B-7 was obtained. The weight average molecular weight of the obtained polymer was 39,200 in terms of standard polystyrene by GPC (Gel Permeation Chromatography) method, and the dispersity (Mw / Mn) was 3.7.
(比較化合物B)
 比較化合物Bとして下記の化合物RB-1を使用した。
Figure JPOXMLDOC01-appb-C000020
(Comparative Compound B)
The following compound RB-1 was used as Comparative Compound B.
Figure JPOXMLDOC01-appb-C000020
<化合物RB-1の合成>
 1H,1H,5H-オクタフルオロペンチルメタクリレート(大阪有機化学工業株式会社製、ビスコート8FM)25.0gと、ベンジルメタクリレート(大阪有機工業株式会社製)25.0gを、メチルエチルケトン150.0gに溶解させ、これを70℃に加熱した。この溶液に、重合開始剤(和光純薬工業株式会社製、V-65)0.96gをメチルエチルケトン12.0gに溶解させた溶液を30分かけて滴下した。滴下終了後、さらに70℃で4.5時間反応させた。反応液を放冷後、ヘキサン900.0gに滴下し、析出した粉体を濾取し、乾燥させた。このようにして重合体B-7を36.0g得た。得られたポリマーの重量平均分子量は、GPC(Gel Permeation Chromatography)法による標準ポリスチレン換算で24,100であり、分散度(Mw/Mn)は、3.0であった。
<Synthesis of Compound RB-1>
25.0 g of 1H, 1H, 5H-octafluoropentyl methacrylate (Osaka Organic Chemical Co., Ltd., Viscoat 8FM) and 25.0 g of benzyl methacrylate (Osaka Organic Industry Co., Ltd.) were dissolved in 150.0 g of methyl ethyl ketone, This was heated to 70 ° C. To this solution, a solution prepared by dissolving 0.96 g of a polymerization initiator (V-65, manufactured by Wako Pure Chemical Industries, Ltd.) in 12.0 g of methyl ethyl ketone was dropped over 30 minutes. After completion of dropping, the reaction was further carried out at 70 ° C. for 4.5 hours. The reaction solution was allowed to cool and then added dropwise to 900.0 g of hexane, and the precipitated powder was collected by filtration and dried. In this way, 36.0 g of polymer B-7 was obtained. The weight average molecular weight of the obtained polymer was 24,100 in terms of standard polystyrene by GPC (Gel Permeation Chromatography) method, and the dispersity (Mw / Mn) was 3.0.
(実施例1~21及び比較例1~3)
 下記表に記載の組成となるように各成分を添加し、攪拌して均一にし、硬化性組成物を調製した。
(Examples 1 to 21 and Comparative Examples 1 to 3)
Each component was added so that it might become a composition as described in the following table | surface, it stirred and it was made uniform and the curable composition was prepared.
(その他の重合性化合物)
 その他の重合性化合物として、下記の化合物を使用した。
Figure JPOXMLDOC01-appb-C000021
(Other polymerizable compounds)
The following compounds were used as other polymerizable compounds.
Figure JPOXMLDOC01-appb-C000021
<非共役ビニリデン基含有化合物>
 非共役ビニリデン基含有化合物として、β-カリオフィレン(株式会社井上香料製造所製)又は(+)-リモネン(東京化成工業株式会社製)を使用した。なお、光学異性体は特に限定する必要はない。
Figure JPOXMLDOC01-appb-C000022
<Non-conjugated vinylidene group-containing compound>
As the non-conjugated vinylidene group-containing compound, β-caryophyllene (manufactured by Inoue Fragrance Co., Ltd.) or (+)-limonene (manufactured by Tokyo Chemical Industry Co., Ltd.) was used. The optical isomer need not be particularly limited.
Figure JPOXMLDOC01-appb-C000022
<光ラジカル重合開始剤>
 光ラジカル重合開始剤として、Irgacure819(ビス(2,4,6-トリメチルベンゾイル)-フェニルホスフィンオキサイド:BASF社製)を使用した。
<Radical radical polymerization initiator>
Irgacure 819 (bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide: manufactured by BASF) was used as a radical photopolymerization initiator.
<熱ラジカル重合開始剤>
 熱ラジカル重合開始剤として、パーブチルO(日本油脂株式会社製;t-ブチルペルオキシ-2-エチルヘキサノエート)及び/又はパークミルH-80(日本油脂株式会社製;クメンハイドロパーオキサイド)を使用した。
Figure JPOXMLDOC01-appb-C000023
<Thermal radical polymerization initiator>
Perbutyl O (Nippon Yushi Co., Ltd .; t-butylperoxy-2-ethylhexanoate) and / or Parkmill H-80 (Nippon Yushi Co., Ltd .; cumene hydroperoxide) was used as a thermal radical polymerization initiator. .
Figure JPOXMLDOC01-appb-C000023
(評価)
<アッベ数及び部分分散比>
 実施例及び比較例で得られた硬化性組成物を、直径10mm、厚み1mmの透明ガラス型に注入し、酸素濃度1%以下の雰囲気下、200℃に加熱することで熱硬化物を作製した。得られた熱硬化物のアッベ数(νd)及び部分分散比(θg,F)を、アッベ屈折計(カルニュー光学工業株式会社製)を用いて測定した。
 νd=(nd-1)/(nF-nC)
 θg,F=(ng-nF)/(nF-nC)
 ここで、ndは波長587.56nmにおける屈折率、nFは波長486.13nmにおける屈折率、nCは波長656.27nmにおける屈折率、ngは波長435.83nmでの屈折率を表す。
 次いで、Δ(θg,F)を算出した。Δ(θg,F)は、d線を基準とするアッベ数(νd)を横軸、部分分散比(θg,F)を縦軸としたグラフにおいて、硝種A(株式会社オハラ、硝種名NSL7)と硝種B(株式会社オハラ、硝種名PBM2)を結ぶ直線を標準線としたとき、標準線における部分分散比(θg,F)と、対象物の部分分散比(θg,F)の差分である。
 なお、これらの測定には、熱硬化物を用いたが、紫外線照射後に熱硬化を行った硬化物であってもアッベ数に変化はない。
(Evaluation)
<Abbe number and partial dispersion ratio>
The curable compositions obtained in the examples and comparative examples were poured into a transparent glass mold having a diameter of 10 mm and a thickness of 1 mm, and heated to 200 ° C. in an atmosphere having an oxygen concentration of 1% or less to prepare a thermoset. . The Abbe number (νd) and partial dispersion ratio (θg, F) of the obtained thermoset were measured using an Abbe refractometer (manufactured by Kalnew Optical Industry Co., Ltd.).
νd = (nd−1) / (nF−nC)
θg, F = (ng−nF) / (nF−nC)
Here, nd represents a refractive index at a wavelength of 587.56 nm, nF represents a refractive index at a wavelength of 486.13 nm, nC represents a refractive index at a wavelength of 656.27 nm, and ng represents a refractive index at a wavelength of 435.83 nm.
Next, Δ (θg, F) was calculated. Δ (θg, F) is a graph in which the Abbe number (νd) with respect to the d-line is the horizontal axis and the partial dispersion ratio (θg, F) is the vertical axis, glass type A (Ohara Corporation, glass type name NSL7) Is the difference between the partial dispersion ratio (θg, F) on the standard line and the partial dispersion ratio (θg, F) of the target object, where the straight line connecting the glass and glass type B (Ohara Corporation, glass type name PBM2) is the standard line .
In addition, although the thermosetting material was used for these measurements, even if it is the hardening material which performed the thermosetting after ultraviolet irradiation, there is no change in an Abbe number.
<複合レンズの作製>
 表面が窒化クロム処理された成形金型(硬化性組成物と接する面が非球面形状を有する)に実施例及び比較例で得た硬化性組成物を200mg注入し、硬化性組成物の成形金型と接していない側のすべての表面上を覆うように透明なガラスレンズ(硝材BK-7、直径33mm、中心厚み3mm、硬化性組成物と接する面の曲率半径=44.3mm、硬化性組成物と接しない面の曲率半径=330.9mmである凸レンズ)を被せて、硬化性組成物の直径が30mmとなるように押し広げた。この状態とした後、ガラスレンズの上方から、Execure3000(HOYA株式会社製)を用いて300mJ/cm2の紫外線を照射した(半硬化物を形成する工程)。なお、得られた半硬化物について、HAAKE社製レオメーターRS6000を用いて、25℃、周波数10Hzにおける複素粘度を測定したところ5.0×106mPa・sであった。次いで、成形金型及びガラスレンズによって挟まれた状態を維持したまま、硬化性組成物に0.196MPa(2kgf/cm2)の圧力を印加しながら200℃まで昇温し、硬化させた(硬化物を形成する工程)。ついで、金型温度を180℃に冷却した後、硬化性組成物の硬化物と成形金型とを0.05mm/秒の速度で引き離すことにより、複合レンズを作製した(金型を引き離す工程)。以下の評価に用いるために上記の工程を100回繰り返し、100個の複合レンズを作製した。
<Production of compound lens>
200 mg of the curable compositions obtained in the examples and comparative examples were injected into a molding die whose surface was treated with chromium nitride (the surface in contact with the curable composition had an aspherical shape). Transparent glass lens (glass material BK-7, diameter 33 mm, center thickness 3 mm, radius of curvature of the surface in contact with the curable composition = 44.3 mm, curable composition so as to cover all the surfaces on the side not in contact with the mold A convex lens having a radius of curvature of a surface not in contact with an object = 330.9 mm) was placed thereon, and the curable composition was spread so that the diameter of the curable composition was 30 mm. After this state, 300 mJ / cm 2 of ultraviolet rays were irradiated from above the glass lens using Execute 3000 (manufactured by HOYA Corporation) (step of forming a semi-cured product). In addition, about the obtained semi-hardened | cured material, when the complex viscosity in 25 degreeC and the frequency of 10 Hz was measured using the rheometer RS6000 made from HAAKE, it was 5.0 * 10 < 6 > mPa * s. Next, while maintaining the state sandwiched between the molding die and the glass lens, the temperature was raised to 200 ° C. while applying a pressure of 0.196 MPa (2 kgf / cm 2 ) to the curable composition and cured (cured). Forming a product). Then, after cooling the mold temperature to 180 ° C., a cured product of the curable composition and the molding mold were separated at a rate of 0.05 mm / second to produce a composite lens (step of separating the mold). . In order to use for the following evaluations, the above process was repeated 100 times to produce 100 compound lenses.
<金型転写性>
 上記のとおり作製した各複合レンズの外観を、株式会社キーエンス製デジタルマイクロスコープ(商品名:VHX-1000)を用いて評価した。複合レンズ表面に、微細な凹凸(シワ)が発生しているものを不良品、発生していないものを良品とした。作製した100個の複合レンズを評価し、そのうちの良品の割合を良品率とし、以下の基準で評価した。なお、ランク2以上を合格レベルとした。
 ランク4:良品率が90%以上であった。
 ランク3:良品率が70%以上90%未満であった。
 ランク2:良品率が50%以上70%未満であった。
 ランク1:良品率が50%未満であった。
<Mold transferability>
The appearance of each compound lens produced as described above was evaluated using a digital microscope (trade name: VHX-1000) manufactured by Keyence Corporation. Those having fine irregularities (wrinkles) on the surface of the compound lens were determined to be defective, and those having no unevenness were determined to be non-defective. 100 manufactured composite lenses were evaluated, and the ratio of non-defective products was defined as the non-defective rate, and evaluated according to the following criteria. In addition, the rank 2 or higher was regarded as an acceptable level.
Rank 4: The yield rate was 90% or higher.
Rank 3: The yield rate was 70% or more and less than 90%.
Rank 2: The yield rate was 50% or more and less than 70%.
Rank 1: The yield rate was less than 50%.
Figure JPOXMLDOC01-appb-T000024
Figure JPOXMLDOC01-appb-T000024
Figure JPOXMLDOC01-appb-T000025
Figure JPOXMLDOC01-appb-T000025
 実施例で得られた硬化性組成物より形成された硬化物においては、Δ(θg,F)の値が大きく、かつ硬化物を成形する際の金型転写性に優れていた。
 一方、比較例1では、所定構造を有さない化合物Aを用いているため、Δ(θg,F)の値が小さかった。また、比較例2では、化合物Bを含有していないため、金型転写性に劣っており、比較例3では、所定構造を有さない化合物Bを用いているため、硬化性組成物より形成した硬化物が白濁したため、評価ができなかった。
 
In the cured product formed from the curable compositions obtained in the examples, the value of Δ (θg, F) was large and the mold transferability when molding the cured product was excellent.
On the other hand, in Comparative Example 1, since the compound A having no predetermined structure was used, the value of Δ (θg, F) was small. In Comparative Example 2, since compound B is not contained, the mold transferability is inferior. In Comparative Example 3, since compound B having no predetermined structure is used, it is formed from a curable composition. The cured product became cloudy and could not be evaluated.

Claims (9)

  1.  下記一般式(A)で表される化合物Aと、
     少なくとも1つのフッ素原子及び少なくとも1つのラジカル架橋性基を1分子内に有する化合物Bと、
     熱ラジカル重合開始剤及び光ラジカル重合開始剤から選択される少なくとも1種と、
    を含有する硬化性組成物;
    Figure JPOXMLDOC01-appb-C000001

     一般式(A)中、Ar11及びAr12はそれぞれ独立に、破線で囲まれたベンゼン環を含むアリール基又は破線で囲まれたベンゼン環を縮合環のひとつとして含むヘテロアリール基を表す;
     X1、Y1、X2及びY2はそれぞれ独立に、酸素原子、硫黄原子、窒素原子又は炭素原子であり、Z1はX1-C=C-Y1とともに5~7員の芳香環を形成する原子群であって、酸素原子、硫黄原子、窒素原子及び炭素原子から選択される少なくとも1種を含む原子群を表し、Z2はX2-C=C-Y2とともに5~7員の芳香環を形成する原子群であって、酸素原子、硫黄原子、窒素原子及び炭素原子から選択される少なくとも1種を含む原子群を表す;
     Ar13及びAr14はそれぞれ独立に、破線で囲まれた芳香環を含むアリーレン基又は破線で囲まれた芳香環を含むヘテロアリーレン基を表し、Ar13とAr14のうち少なくとも一方はフェニレン基以外の基である;
     R3~R6はそれぞれ独立に、置換基を表し、q及びrはそれぞれ独立に、0~4の整数であり、vは0以上の整数であり、vの最大数は、X1-C=C-Y1とZ1が形成する環に置換可能な置換基の最大数であり、wは0以上の整数であり、wの最大数は、X2-C=C-Y2とZ2が形成する環に置換可能な置換基の最大数である;
     L1及びL2はそれぞれ独立に、単結合、酸素原子又は硫黄原子を表し、R11及びR12はそれぞれ独立に、エーテル結合、エステル結合、チオエーテル結合、チオエステル結合、アミド結合、カーボネート結合及びアルキレン基から選択される少なくとも1種を含む連結基、又は単結合を表し、R21及びR22はそれぞれ独立に、水素原子又はメチル基を表す;
     Ar11~Ar14がそれぞれ独立に破線で囲まれた芳香環を縮合環のひとつとして含む縮合環基である場合は、L1を連結基として有する基、L2を連結基として有する基、及びR3~R6はそれぞれ独立に、破線で囲まれた芳香環に置換していても、破線で囲まれた芳香環以外の縮合環に置換していてもよい。
    Compound A represented by the following general formula (A),
    Compound B having at least one fluorine atom and at least one radical crosslinkable group in one molecule;
    At least one selected from a thermal radical polymerization initiator and a photo radical polymerization initiator;
    A curable composition comprising:
    Figure JPOXMLDOC01-appb-C000001

    In general formula (A), Ar 11 and Ar 12 each independently represent an aryl group containing a benzene ring surrounded by a broken line or a heteroaryl group containing a benzene ring surrounded by a broken line as one of condensed rings;
    X 1 , Y 1 , X 2 and Y 2 are each independently an oxygen atom, a sulfur atom, a nitrogen atom or a carbon atom, and Z 1 is a 5- to 7-membered aromatic ring together with X 1 —C═C—Y 1 Represents an atomic group that includes at least one selected from an oxygen atom, a sulfur atom, a nitrogen atom, and a carbon atom, and Z 2 represents 5 to 7 together with X 2 —C═C—Y 2 A group of atoms forming a member aromatic ring, the group of atoms including at least one selected from an oxygen atom, a sulfur atom, a nitrogen atom and a carbon atom;
    Ar 13 and Ar 14 each independently represent an arylene group containing an aromatic ring surrounded by a broken line or a heteroarylene group containing an aromatic ring surrounded by a broken line, and at least one of Ar 13 and Ar 14 is other than a phenylene group A group of
    R 3 to R 6 each independently represents a substituent, q and r are each independently an integer of 0 to 4, v is an integer of 0 or more, and the maximum number of v is X 1 -C = The maximum number of substituents that can be substituted on the ring formed by CY 1 and Z 1 , w is an integer of 0 or more, and the maximum number of w is X 2 -C = CY 2 and Z 2 is the maximum number of substituents that can be substituted on the ring formed;
    L 1 and L 2 each independently represents a single bond, an oxygen atom or a sulfur atom, and R 11 and R 12 each independently represent an ether bond, an ester bond, a thioether bond, a thioester bond, an amide bond, a carbonate bond and an alkylene. A linking group containing at least one selected from the group or a single bond, R 21 and R 22 each independently represents a hydrogen atom or a methyl group;
    When Ar 11 to Ar 14 are each independently a condensed ring group containing an aromatic ring surrounded by a broken line as one of the condensed rings, a group having L 1 as a linking group, a group having L 2 as a linking group, and R 3 to R 6 may be each independently substituted with an aromatic ring surrounded by a broken line, or may be substituted with a condensed ring other than the aromatic ring surrounded by a broken line.
  2.  Ar13とAr14のうち少なくとも一方は、破線で囲まれた芳香環を含む縮合環基である請求項1に記載の硬化性組成物。 2. The curable composition according to claim 1, wherein at least one of Ar 13 and Ar 14 is a condensed ring group containing an aromatic ring surrounded by a broken line.
  3.  前記化合物Bは、フルオロアルキル基、パーフルオロアルキル基、パーフルオロアルキレン基及びパーフルオロアルキレンオキシ基から選択される少なくとも1つの基と、少なくとも1つのラジカル架橋性基と、を1分子内に有する化合物である請求項1又は2に記載の硬化性組成物。 The compound B is a compound having in a molecule at least one group selected from a fluoroalkyl group, a perfluoroalkyl group, a perfluoroalkylene group, and a perfluoroalkyleneoxy group and at least one radical crosslinkable group. The curable composition according to claim 1 or 2.
  4.  非共役ビニリデン基含有化合物をさらに含有する請求項1~3のいずれか1項に記載の硬化性組成物。 The curable composition according to any one of claims 1 to 3, further comprising a non-conjugated vinylidene group-containing compound.
  5.  熱ラジカル重合開始剤を含み、
     前記熱ラジカル重合開始剤としてハイドロパーオキサイド化合物を含有する請求項1~4のいずれか1項に記載の硬化性組成物。
    A thermal radical polymerization initiator,
    The curable composition according to any one of claims 1 to 4, comprising a hydroperoxide compound as the thermal radical polymerization initiator.
  6.  請求項1~5のいずれか1項に記載の硬化性組成物の半硬化物であって、25℃、周波数10Hzにおける複素粘度が105~108mPa・sである半硬化物。 A semi-cured product of the curable composition according to any one of claims 1 to 5, wherein the complex viscosity at 25 ° C and a frequency of 10 Hz is 10 5 to 10 8 mPa · s.
  7.  請求項1~5のいずれか1項に記載の硬化性組成物の硬化物。 A cured product of the curable composition according to any one of claims 1 to 5.
  8.  請求項7記載の硬化物を含む光学部材。 An optical member comprising the cured product according to claim 7.
  9.  請求項7記載の硬化物を含むレンズ。
     
    A lens comprising the cured product according to claim 7.
PCT/JP2018/003179 2017-03-15 2018-01-31 Curable composition, cured object, optical member, and lens WO2018168233A1 (en)

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