WO2018168129A1

WO2018168129A1 - Method for forming plating

Info

Publication number: WO2018168129A1
Application number: PCT/JP2017/044723
Authority: WO
Inventors: 坂本　一三; 雅史鈴木; 裕平藤岡
Original assignee: オムロン株式会社
Priority date: 2017-03-13
Filing date: 2017-12-13
Publication date: 2018-09-20
Also published as: CN110268103A; DE112017007235T5; JP2018150587A; US20200010971A1

Abstract

According to the present invention, plating is formed on one side of a negative electrode by: coating the one side of the negative electrode with a paste formed by mixing particles in a plating liquid; disposing, on one side of a positive electrode, a liquid holding member impregnated with the plating liquid; making the negative electrode and the positive electrode face each other; bringing the liquid holding member and the paste into contact with each other; and applying a voltage between the negative electrode and the positive electrode.

Description

Plating formation method

This disclosure relates to a method for forming a plating.

In Patent Document 1, when a plating film having a fluororesin film having a film thickness of 5 μm or less is formed on an electroless plating film or an electroless composite plating film, the fluororesin film and the fluororesin particles are converted to a cationic surfactant. There is disclosed a method of forming a plating that uses a solution dispersed in water with an agent.

Further, in Patent Document 2, a cathode is disposed at a lower position in the vertical direction in the plating tank, and dispersed particles dispersed in the plating solution are gradually settled toward the cathode and deposited on the cathode. A method of forming a plating is disclosed.

JP 2007-39711 A JP 2016-141862 A

However, in the plating forming method, the base material and the electrode are immersed in the plating solution accommodated in the plating tank in order to form the plating. For this reason, there is a problem that the equipment is large and expensive. In addition, it is necessary to maintain a large amount of plating solution or to perform waste solution treatment, which also leads to an increase in cost.

In the latter method, the plating solution may be stirred to replenish the plating metal that is consumed near the cathode. However, it is difficult to form a high-concentration plating film because particles in the plating solution move. is there. In addition, there are significant structural restrictions such as the need to install the cathode horizontally.

This disclosure is intended to provide a plating forming method capable of forming a high-concentration plating film with simple and inexpensive equipment using a small amount of plating solution.

As a means for solving the above problems, the present disclosure provides:
On one side of the cathode, apply a paste made by mixing particles in the plating solution,
A liquid retaining member impregnated with the plating solution is disposed on one side of the anode,
With the cathode and the anode facing each other, the liquid retaining member and the paste are brought into contact with each other,
There is provided a plating forming method of forming a plating on one side of the cathode by applying a voltage between the cathode and the anode.

According to the present disclosure, the liquid retaining member is arranged on one side of the anode and the paste is applied to one side of the cathode, so that a high concentration can be obtained at low cost without requiring large-scale equipment or a large amount of plating solution. A plating film can be formed.

It is a schematic explanatory drawing of the plating formation apparatus which concerns on this embodiment.

Hereinafter, embodiments according to the present disclosure will be described with reference to the accompanying drawings. In addition, the following description is only an illustration essentially and does not intend restrict | limiting this indication, its application thing, or its use. Further, the drawings are schematic, and the ratio of each dimension is different from the actual one.

FIG. 1 shows a plating apparatus according to this embodiment. In this plating forming apparatus, a plate-like anode 1 and a plate-like cathode 2 are arranged so that their plate surfaces face each other, and a surface of the anode 1 facing the cathode 2 is impregnated with a plating solution 6. The paste 4 is applied to the surface of the cathode 2 facing the anode, and the liquid retaining member 3 and the paste 4 are in contact with each other.

As the anode 1, a flat plate made of a platinum insoluble anode is used. Here, the insoluble anode 1 is used as the anode 1, but soluble materials such as Ag, Au, Pd, Rh, Ni, and Cr can also be used.

The cathode 2 is a flat plate made of a tough pitch copper (C1100) cathode. The cathode 2 has a larger surface area on one side (that is, the facing surface) than the anode 1.

A DC power supply 5 is connected between the anode 1 and the cathode 2.

ウレタン Urethane sponge is used for the liquid retaining member 3. The urethane sponge has a flat plate shape, has substantially the same area as the cathode 2 and faces the cathode 2. In this case, the thickness of the liquid retaining member 3 is 10 mm or less. Thereby, the current from the anode can be transmitted efficiently. The liquid retaining member 3 is impregnated with a palladium / nickel plating solution. However, the plating solution 6 that can be impregnated is not limited thereto, and various other plating solutions 6 such as an Ag plating solution and an Au plating solution can be used depending on the application.

The paste 4 is a mixture of the plating solution 6 and the particles 7. That is, the paste 4 is mainly composed of the plating solution 6 and the particles 7 and can be applied to the surface of the cathode 2 as an object. is doing. As the plating solution 6, the same one as impregnated in the liquid retaining member 3 can be used. Here, a palladium / nickel plating solution is used. For the particles 7, zinc oxide coated with silica is used. The particle diameter of the particles 7 is such that the primary particle diameter is 0.6 μm or less. The reason why the particle size of the particles 7 is set to 0.6 μm or less is to sufficiently increase the packing density of the particles in the plating film.

However, the particles 7 are not limited to zinc oxide, and metal materials, synthetic resin materials such as fluororesin, nylon, and polyethylene, and compounds such as graphite, fluorinated graphite, molybdenum dioxide, and boron nitride may be used. it can. In this case, for example, if a fluororesin is used, wettability can be imparted in addition to the performance of the conventional metal plating film.

Further, the paste 4, the plating solution 6 and the particles 7 are modified with a surfactant as a dispersion aid. Examples of the surfactant that can be used include a cationic surfactant, an amphoteric surfactant exhibiting a cationic property corresponding to the pH of the plating solution 6, and a nonionic surfactant. By using the surfactant, the wettability of the plating surface can be improved, plating defects such as no plating and pits can be prevented, and generation of mist from the plating solution 6 can be suppressed.

In the plating forming apparatus having the above-described configuration, the liquid retaining member 3 impregnated with the plating solution 6 is disposed on one surface (that is, the facing surface) of the anode 1, and the paste 4 is applied to one surface (that is, the facing surface) of the cathode 2. . The paste 4 is applied by a dispenser, a squeegee or the like, and the thickness is 0.1 mm to 0.5 mm. By setting the thickness of the paste 4 in this way, the current from the anode can be efficiently transmitted to the cathode 2.

Then, the anode 1 and the cathode 2 are arranged to face each other, and the liquid retaining member 3 and the paste 4 are brought into surface contact. In this case, the anode 1 and the cathode 2 may be opposed in the vertical direction, or may be opposed in other directions such as the horizontal direction.

In this state, the anode 1 and the cathode 2 are brought close to each other, and the liquid retaining member 3 and the paste 4 are pressurized. Further, the anode 1 is vibrated to vibrate the paste 4 through the liquid retaining member 3. Thereby, the particle | grains 7 in the paste 4 can be aggregated. When a voltage is applied between the anode 1 and the cathode 2, a plating film is formed on the surface of the cathode 2. That is, metal ions in the plating solution 6 contained in the paste 4 are reduced on the surface of the cathode 2, and a plating film is formed while entraining the particles 7 in the paste 4 due to current wraparound. In this case, the formed plating film has the properties of the incorporated particles 7 in addition to the properties of the metal in the plating solution 6, and has a characteristic as a composite plating film.

Thus, since the paste 4 is applied to the cathode 2 and the anode 1 is impregnated with the plating solution 6 in the liquid retaining member 3, the following advantages are obtained.
(1) Since the plating solution 6 is only contained in the paste 4 and the liquid retaining member 3, the usage amount of the plating solution 6 can be significantly suppressed as compared with the case where the plating solution 6 is stored in a conventional plating tank. For this reason, a large-scale installation becomes unnecessary and the maintenance of the plating solution 6 and the waste liquid treatment can be simplified.
(2) Since the paste 4 in which the particles 7 are mixed with the plating solution 6 is used, a high-concentration plating film can be formed.
(3) In the formed plating film, in addition to the effect by the composition of the plating solution 6, the effect by the particles 7 can also be exhibited. For example, combining fluororesin particles with high hardness Ni plating can exhibit the effects of high wear resistance and low rolling resistance, and can be used for mechanical sliding parts and bearing parts. In addition, by combining Ag plating with low electrical resistance value with metal material (for example, zinc oxide) particles with low sublimation temperature, the electrical resistance is low, and the generated arc can be cooled and extinguished. It can be used. Combining fluororesin particles with high hardness Ni plating can provide high wear resistance and low sliding resistance, and when used in a mold, can exhibit excellent releasability.

An experiment for forming a plating film under the following conditions was performed.
That is, the anode 1 is a platinum insoluble anode, the cathode 2 is tough pitch copper (C1100), the liquid retaining member 3 is urethane sponge, and the plating solution 6 is mixed with a commercially available Pd—Ni (palladium / nickel) plating solution. For the particles 7, silica-coated zinc oxide was used. Moreover, as described in Table 1 below, the plating solution 6 used for the paste 4 was 10 ml. In addition, two kinds of particles 7 mixed in the plating solution 6 having a primary particle diameter of 35 nm (0.035 μm) and 20 nm (0.02 μm) were prepared and their weights were prepared in the range of 1.5 g to 8.5 g. The plating time was 5, 10, or 15 minutes, and the current density between the anode 1 and the cathode 2 was 5 to 25 A / dm ² .

As is clear from Table 1, the composite plating particle concentration of the plating film formed can be increased by reducing the primary particle diameter of the particles and increasing the contained weight. Moreover, the film thickness of the plating film obtained was able to be enlarged by raising a current density.

Although various embodiments in the present disclosure have been described in detail above with reference to the drawings, finally, various aspects of the present disclosure will be described. In the following description, reference numerals are also given as an example.

The plating method according to the first aspect of the present disclosure includes:
On one side of the cathode 2, a paste 4 obtained by mixing particles 7 in a plating solution 6 is applied,
A liquid retaining member 3 impregnated with the plating solution 6 is disposed on one surface of the anode 1,
With the cathode 2 and the anode 1 facing each other, the liquid retaining member 3 and the paste 4 are brought into contact with each other,
By applying a voltage between the cathode 2 and the anode 1, plating is formed on one side of the cathode 2.

According to the plating method of the first aspect, the plating film can be formed by simply placing the liquid retaining member 3 on one side of the anode 1 and applying the paste 4 on one side of the cathode 2. Therefore, a plating film can be formed at low cost without requiring large-scale equipment or a large amount of plating solution 6.

The plating method according to the second aspect of the present disclosure includes:
The paste 4 is mixed with a surfactant.

According to the plating formation method of the second aspect, the wettability of the plating surface can be improved, plating defects such as no plating and pits can be prevented, and generation of mist from the plating solution 6 can be suppressed.

In the plating forming method according to the third aspect of the present disclosure, the particles 7 are made of either metal or resin.

In the plating formation method according to the fourth aspect of the present disclosure, the particle 7 has a particle size of 0.02 μm or more and 0.6 μm or less.

According to the plating method of the fourth aspect, since the particle size of the particles 7 is set in the range of 0.02 μm or more and 0.6 μm or less, an effect that current flows around the particles and efficiently flows can be obtained.

In the plating formation method according to the fifth aspect of the present disclosure, the particle 7 is 10 wt% or more and 72 wt% or less with respect to the paste 4.

According to the plating method of the fifth aspect, since the paste 4 is used, the particles 7 can be contained at a high concentration, so that a high concentration plating film can be formed.

In the plating forming method according to the sixth aspect of the present disclosure, a sponge is used for the liquid retaining member 3.

It should be noted that, by appropriately combining any of the various embodiments or modifications, the effects possessed by them can be produced. In addition, combinations of the embodiments, combinations of the examples, or combinations of the embodiments and examples are possible, and combinations of features in different embodiments or examples are also possible.

Although the present disclosure has been fully described in connection with preferred embodiments with reference to the accompanying drawings, various variations and modifications will be apparent to those skilled in the art. Such changes and modifications are to be understood as included within the scope of the present disclosure as set forth in the appended claims.

The plating forming method according to the present disclosure can be used to form plating films on the surfaces of various materials such as mechanical sliding parts, electrical contacts, and mold surfaces.

DESCRIPTION OF SYMBOLS 1 ... Anode 2 ... Cathode 3 ... Liquid holding member 4 ... Paste 5 ... DC power supply 6 ... Plating solution 7 ... Particle

Claims

On one side of the cathode, apply a paste made by mixing particles in the plating solution,
A liquid retaining member impregnated with the plating solution is disposed on one side of the anode,
With the cathode and the anode facing each other, the liquid retaining member and the paste are brought into contact with each other,
A plating method, wherein a voltage is applied between the cathode and the anode to form a plating on one side of the cathode.
The method for forming a plating according to claim 1, wherein the paste is mixed with a surfactant.
The method for forming a plating according to claim 1 or 2, wherein the particles are made of either metal or resin.
The method for forming a plating according to any one of claims 1 to 3, wherein the particles have a particle size of 0.02 µm or more and 0.6 µm or less.
The method for forming a plating according to any one of claims 1 to 4, wherein the particles are 10 wt% or more and 72 wt% or less with respect to the paste.
The method for forming a plating according to any one of claims 1 to 5, wherein the liquid retaining member is a sponge.