WO2018147694A1 - Afficheur à led transparent souple d'un panneau électro-optique à led et son procédé de fabrication - Google Patents

Afficheur à led transparent souple d'un panneau électro-optique à led et son procédé de fabrication Download PDF

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Publication number
WO2018147694A1
WO2018147694A1 PCT/KR2018/001805 KR2018001805W WO2018147694A1 WO 2018147694 A1 WO2018147694 A1 WO 2018147694A1 KR 2018001805 W KR2018001805 W KR 2018001805W WO 2018147694 A1 WO2018147694 A1 WO 2018147694A1
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WIPO (PCT)
Prior art keywords
flexible transparent
led
metal pattern
transparent film
film metal
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PCT/KR2018/001805
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English (en)
Korean (ko)
Inventor
전용선
위인호
Original Assignee
주식회사 에스오엘
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Publication of WO2018147694A1 publication Critical patent/WO2018147694A1/fr

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
    • H05B33/28—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode of translucent electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/81—Electrodes
    • H10K30/82—Transparent electrodes, e.g. indium tin oxide [ITO] electrodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2380/00—Specific applications
    • G09G2380/02—Flexible displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a flexible transparent LED display of the LED electro-optical panel and a method of manufacturing the same, more specifically, does not use a heat sink for dissipating heat of the LED chip without using a substrate PCB, (+) electrode wire,
  • the driver IC and the 1R1G1B LED chip are provided in one basic unit package, which is provided at each point connected to a flexible flexible film film pattern having flexible data lines and three lines of negative electrode lines. Fabricates a flexible transparent film metal pattern assembly of a mounted and continuously assembled structure, and is formed in the same flexible transparent film metal pattern circuit together with a driver IC and a 1R1G1B LED chip to generate an LED chip during operation.
  • PCB-less flexible transparent LED display that dissipates heat quickly to itself It manufactures flexible transparent LED display and has flexibility by using flexible transparent film metal pattern materials such as aluminum (Al) and copper (Cu) with various functions as a city aesthetic, design, visual effect and visual advertisement delivery media.
  • LED Light Emitting Diode
  • a P-type semiconductor is formed of an n-type semiconductor whose majority carrier is an electron and a p-type semiconductor which has a majority carrier is a hole.
  • the signal is output by converting it into light having a wavelength band, and it is mainly used for microcomputer chip built-in LED, indoor lighting equipment, outdoor LED billboard, traffic signal lamp, street light, automobile headlight LED.
  • the LED driving method uses a DC driving circuit, an AC driving circuit, a pulse driving circuit (PWM control) that provides light color and color temperature control by changing the light output by pulse width modulation (PWM) of the LED, or LED
  • PWM control pulse driving circuit
  • the driving IC for controlling the constant voltage, the constant current, and the power factor may be used.
  • LEDs are classified into i) lamp type shell type LEDs, ii) Surface Mounted Device (SMD) packages, and iii) Chip on Board (COB) packages.
  • the outdoor LED billboard is powered by a waterproof microcomputer board.
  • LED signboards are available in single color and RGB tricolor or full color LED signboards.
  • the advertising images are displayed by the LED light of the surface light source, and large buildings, pharmacies / hospitals, restaurants / karaokes / hobby houses, cram schools, beauty salons, and opticians Mainly used in gas stations, gas stations, theaters, etc.
  • PCB printed circuit board
  • the LED signboard of FIG. 1 used for indoor and outdoor use is composed of an image providing controller, an operating PC, a network, and an LED signboard as shown in FIG. 2, and one of them is an oval type RGB (Red, Green, Blue). It is a structure that is equipped with several unit PCB (Printed Circuit Board) constituting the entire large area screen and an Oval type LED Chip (Package) or LED Chip mounted on the board.
  • PCB Print Circuit Board
  • a conventional LED display board uses mostly elliptical LEDs or LED chips, and heatsinks and cooling fans are provided on the rear portion of the PCB to smooth heat dissipation generated during circuit operation.
  • heatsinks and cooling fans are provided on the rear portion of the PCB to smooth heat dissipation generated during circuit operation.
  • Patent Registration No. 10-0992383 discloses a LED driving plate of a dynamic driving method and a driving method thereof capable of minimizing a flicker phenomenon by shortening a lighting traveling distance.
  • An LED display board is a LED display board for driving a plurality of LED elements in a dynamic driving method, the LED module is divided into regions each of the LED elements m x n (where m, n is a natural number of two or more);
  • a control unit for generating a selection control signal for electrically connecting any one LED element to each area at the same time;
  • M x n selectors connected to one LED element per said region and electrically connecting the connected LED elements simultaneously for 1 / m x n periods in response to said selection control signal;
  • an active circuit for supplying driving data to the LED elements electrically connected by the selector.
  • Patent Registration No. 10-1372861 shows that the LED single-panel electronic display panel displays information in both directions, which can reduce its own weight, reduce its thickness, and reduce costs.
  • a bidirectional LED signboard that can be used.
  • Bi-directional LED single panel display case A PCB mounted inside the case; A plurality of LED chips disposed at predetermined intervals on the front and rear surfaces of the PCB; A driving circuit electrically connected to control driving of the LED chip; And a control unit for transmitting a pattern signal to the driving circuit.
  • PCB printed circuit board
  • forced cooling circulation using a fan is used to solve the heat generated by the operation of the device. It uses a heat dissipation system.
  • the size of the LED module that makes up the display screen by connecting controller connection terminals, connectors, and cables for each device driving and signal processing with the unit board of each PCB is very heavy and manufactured. It is damaging and providing a harmful environment for interior design and interior.
  • the LED module for the electronic board has a board PCB and an Oval type LED chip (Package), a rear frame, and an SMPS structure mounted on the board PCB.
  • Package Oval type LED chip
  • a rear frame Oval type LED chip
  • an SMPS structure mounted on the board PCB.
  • the outdoor electronic signboard is essentially equipped with a fan for heat dissipation for each unit board and performs convection by forcibly circulating external air.
  • An object of the present invention for solving the problems of the prior art is generally used by applying a flexible transparent film metal pattern circuit having three lines of (+) electrode line, data line, (-) electrode line
  • the operation circuit for mounting the driver IC and the 1R1G1B LED chip is continuously arranged in series and in parallel.
  • LED electro-optic which does not use heatsink to solve the heat problem that 1R1G1B LED chip generates during operation, and disperses itself in flexible transparent film metal pattern circuit to prolong life of LED chip and maintain brightness It offers panel flexible transparent LED display.
  • Another object of the present invention is to provide a method of manufacturing a flexible transparent LED display of an LED electro-optical panel.
  • the flexible transparent LED display of the LED electro-optical panel uses a conductive flexible transparent film metal pattern material, (+) electrode line, data line, (-) A flexible transparent film metal pattern circuit composed of electrode lines and having flexibility to bend or bend;
  • Each 1R1G1B LED chip mounted by soldering is provided for each unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit, and the RGB combinational color signal is transmitted to the data line to drive the 1R1G1B LED chip.
  • Driver IC And supply power to the (+) electrode line of the flexible transparent film metal pattern circuit, ground the ( ⁇ ) electrode line, and transmit the RGB combined color signal to the data line to drive the LED display. Includes a control board to be displayed,
  • the conductive flexible transparent film metal pattern material has an excellent thermal conductivity of the flexible transparent film using an alloy of aluminum, beryllium oxide (BeO), or aluminum oxide (Al 2 O 3 , Aluminum oxide).
  • the flexible transparent film metal pattern circuit emits heat generated when the 1R1G1B LED chip is operated without using a heat sink, and operates without a substrate PCB.
  • a method of manufacturing a flexible transparent LED display of the LED electro-optical panel (a) does not use a substrate PCB, and has a conductive transparent transparent film metal pattern after the artwork (Flexible Transparent Film Metal Pattern) Material) and the surface of each unit package provided at each point of the flexible transparent film metal pattern circuit having flexible flexibility composed of (+) electrode line, data line, (-) electrode line and matrix structure connected to the metal guide line Mounting the driver IC and the 1R1G1B LED chip by mounting technology (SMT); (b) mounting a driver IC and a 1R1G1B LED chip at each point connected to the flexible transparent film metal pattern circuit; (c) A base cover using an acrylic plate or PC (polycarbonate) or glass (glass) is adhered to the lower plate of the completed flexible transparent film metal pattern assembly.
  • artwork Flexible Transparent Film Metal Pattern
  • the conductive flexible transparent film metal pattern material has an excellent thermal conductivity of the flexible transparent film using an alloy of aluminum, beryllium oxide (BeO), or aluminum oxide (Al 2 O 3 , Aluminum oxide).
  • the flexible transparent film metal pattern circuit itself emits heat generated when the 1R1G1B LED chip is operated without using a heat sink, and operates without a substrate PCB.
  • the flexible transparent LED display of the LED electro-optical panel and a method of manufacturing the same according to the present invention are firstly provided with a flexible transparent film metal pattern having three lines of a (+) electrode line, a data line, and a (-) electrode line.
  • the driver IC and the 1R1G1B LED chip are configured in one unit package provided at each point connected to the circuit, and the size of the LED package can be minimized because the volume of devices occupied by three LED chips can be reduced to one within the same volume. Can be.
  • raw materials can be significantly reduced in assembling 1R1G1B LED chips.
  • 1R1G1B LED chips are manufactured by a manufacturing process mounted at each point of a matrix structure in a flexible transparent film metal pattern assembly circuit, thus saving LED PCBs by reducing PCB PCB, ITO pattern, and silver paste.
  • Productivity is improved and production cost is greatly reduced due to manufacturing cost and simplified manufacturing process.
  • the flexible transparent LED display to which the flexible transparent film metal pattern circuit of the present invention is applied has a relatively small line resistance due to the thickness and distance of the line, and has a flexible transparent film metal pattern having flexibility of bending or bending.
  • Transparent Film Metal Pattern material is used, and its structure is simple due to its small size and light weight, and it can be attached and detached anytime and anywhere.
  • the Noise between the metal patterns generated when driving the device can be improved by reducing the number of circuit patterns, and within the control board
  • the signal processing unit to be configured can be miniaturized and the user's convenience can be achieved.
  • Flexible transparent LED display using a flexible flexible film metal pattern circuit is used in media facades, electronic displays, smart glass panels and the like used for information transmission of advertising billboards.
  • FIG. 2 is a configuration diagram of a conventional LED display.
  • FIG. 3 is a configuration diagram of a conventional elliptic (Oval) type LED module.
  • FIG. 4 is a photograph of a flexible transparent film metal pattern artwork according to the present invention.
  • FIG. 5 is a process diagram of a completed flexible transparent film metal pattern circuit.
  • FIG. 6 is a photograph illustrating a process of mounting a driver IC and a 1R1G1B LED chip by a surface mounted technology (SMT) technology in a flexible transparent film metal pattern circuit.
  • SMT surface mounted technology
  • FIG. 7 is a photograph showing a process in which a driver IC and a 1R1G1B LED chip are mounted at each point connected to a flexible transparent film metal pattern circuit, and then a FPCB (Film Printed Circuit Board) for connecting a driver board circuit is mounted.
  • FPCB Flexible Printed Circuit Board
  • FIG. 8A illustrates a flexible transparent film metal pattern assembly in which a driver IC and a 1R1G1B LED chip are mounted by soldering in a unit package provided at each point of a matrix structure connected to a flexible transparent film metal pattern circuit according to the present invention.
  • This is a picture showing a process of testing (Flexible Transparent Film Metal Pattern Assembly) and 1R1G1B LED Chip operation.
  • FIG. 8B is a flexible transparent film metal pattern including three lines of (+) electrode line, data line, and (-) electrode line, and each point of the matrix structure connected to the flexible transparent film metal pattern circuit.
  • the driver IC and the 1R1G1B LED chip are mounted.
  • FIG. 9 is a diagram illustrating a process of connecting a flexible transparent film metal pattern assembly and a driver board to supply and control an electrical signal.
  • FIG. 10 is a bottom cover acrylic plate or polycarbonate according to the present invention assembled from FIG. 9 and window cover acrylic plate or polycarbonate assembled and fabricated, and completed a flexible transparent LED display (Flexible Transparent LED Display) The picture shows the process.
  • FIG. 11 is a configuration diagram showing a flexible transparent LED display manufacturing process to which a flexible transparent film metal pattern circuit according to the present invention is applied.
  • a flexible transparent LED display to which a flexible transparent film metal pattern circuit according to the present invention is applied, does not use a substrate PCB and a heat sink, and has three (+) electrode lines, data lines, and (-) electrode lines.
  • an operation circuit diagram of mounting a driver IC and a 1R1G1B LED chip is illustrated.
  • FIG. 13 is an actual driving picture connected to a control board (MCU) of a flexible transparent LED display to which a flexible transparent film metal pattern circuit according to the present invention is applied.
  • MCU control board
  • the present invention applies a flexible transparent film metal pattern circuit (hereinafter referred to as a film metal pattern) circuit, and does not use a substrate PCB that is generally used. ), And the operation circuit to install the driver IC and the 1R1G1B LED chip, does not use heatsink to solve the heat problem generated during the operation of the 1R1G1B LED chip, and a plurality of flexible transparent film metal pattern circuit
  • the present invention provides a flexible transparent LED display (LED) of an electro-optical panel and a method of manufacturing the same, which self-disperse heat generated from LED chips to prolong the life of the LED chip and stably maintain brightness.
  • the present invention is applied to media facades, electronic displays, signal processing or transmission and display boards, and smart glass panels, which are used for information transmission to a large number of unspecified public at short distances and long distances.
  • the driver IC and the light source of the 1R1G1B (Red, Green, Blue) LED chip for each point of the matrix structure mounted on the LED panel are The heat dissipation structure of the 1G1G1B LED chip, the flexible transparent film metal pattern circuit structure, and the flexible transparent LED display (Flexible) that smoothly dissipate heat generated when driving the 1R1G1B LED chip for stable, efficient and individual driving. Transparent LED Display) manufacturing method.
  • Flexible Transparent LED Display dissipates heat by applying Flexible Transparent Film Metal Pattern circuits applied to media facades, electronic displays, flexible transparent LED displays, smart panels, etc. No heatsink was used, and a new structure without a substrate PCB was applied. Flexible Transparent Film Metal Patterns are manufactured without a substrate PCB and form the basic circuitry that dissipates heat from the 1R1G1B LED chip itself without the use of heat sinks.
  • FIG. 4 is a photograph of a flexible transparent film metal pattern artwork according to the present invention.
  • FIG. 5 is a photograph of a material showing a completed flexible transparent film metal pattern circuit.
  • FIG. 6 is a photograph illustrating a process of mounting a driver IC and a 1R1G1B LED chip by a surface mounted technology (SMT) technology in a flexible transparent film metal pattern circuit.
  • SMT surface mounted technology
  • FIG. 7 is a photograph showing a process in which a driver IC and a 1R1G1B LED chip are mounted at each point connected to a flexible transparent film metal pattern circuit, and then a FPCB (Film Printed Circuit Board) for connecting a driver board circuit is mounted.
  • FPCB Flexible Printed Circuit Board
  • FIG. 8 is a flexible transparent film metal pattern assembly in which a driver IC and a 1R1G1B LED chip are mounted by soldering in a unit package provided at each point of a matrix structure connected to a flexible transparent film metal pattern circuit according to the present invention.
  • This is a picture showing a process of testing (Flexible Transparent Film Metal Pattern Assembly) and 1R1G1B LED Chip operation.
  • a flexible transparent film metal pattern circuit that does not use a substrate PCB is artwork.
  • the flexible transparent film metal pattern circuit material having the artwork work is manufactured according to the manufacturing process.
  • the driver IC and the 1R1G1B LED are provided in one unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit in which the artwork is completed.
  • the operation circuit for mounting the chip is continuously configured. That is, the surface mount technology (SMT) mounts the driver IC and the 1R1G1B LED chip in each unit package of each point of the matrix structure in the flexible transparent film metal pattern circuit.
  • SMT surface mount technology
  • the area of the flexible transparent film metal pattern increases.
  • the number of 1R1G1B LED chips increases and the number of flexible transparent film metal patterns circuits. If the increase is increased, the transparency, visibility and transmittance difference of the flexible transparent LED display occurs due to the difference in the pixel spacing configured per unit area.
  • the metal pattern circuit 2 includes a positive electrode line 10 connected to an anode of each 1R1G1B LED chip 14 and a data line 11 connected to a driver IC; And three wires including a negative electrode line 12 connected to a cathode of each 1R1G1B LED chip 14.
  • the data line 11 transmits an RGB combined color signal from a control board (MCU).
  • the 1R1G1B LED chip contains one red LED, one green LED, and one blue LED.
  • FIG. 6 is a photograph showing a process of mounting a driver IC and a 1R1G1B LED chip in a flexible transparent film metal pattern circuit by SMT (Surface Mounted Technology) technology.
  • FIG. 7 shows a process in which a driver IC and a 1R1G1B LED chip are mounted at each point connected to a flexible transparent film metal pattern circuit, and then a FPCB (Film Printed Circuit Board) for connecting a driver board circuit is mounted. It is a photograph.
  • FPCB Flexible Printed Circuit Board
  • FIG. 8 shows a flexible transparent film metal having a driver IC and a 1R1G1B LED chip mounted in a unit package provided at each point of a matrix structure connected to a flexible transparent film metal pattern circuit according to the present invention by soldering. This is a picture showing a process of testing the operation of a flexible transparent film metal pattern assembly and a 1R1G1B LED chip.
  • FIG. 9 illustrates a process of connecting a flexible transparent film metal pattern assembly to a driver board for supplying and controlling an electrical signal.
  • FIG. 10 is a bottom cover acrylic plate or polycarbonate according to the present invention assembled in FIG. 9, window cover acrylic plate or polycarbonate assembled and fabricated, completed flexible This is a picture showing the process of Flexible Transparent LED Display.
  • FIG. 11 is a configuration diagram illustrating a manufacturing process of a flexible transparent LED display to which a flexible transparent film metal pattern circuit according to the present invention is applied.
  • FIG. 11 is a flexible transparent LED display using a flexible transparent film metal pattern circuit according to the present invention does not use a substrate PCB and a heat sink, (+) electrode line, data line, (-) electrode line
  • One unit package provided at each point of the matrix structure connected to a flexible transparent film metal pattern circuit having three wires of is a circuit diagram of an operation circuit in which a driver IC and a 1R1G1B LED chip are mounted. .
  • Flexible Transparent Film Metal Pattern circuit for flexible transparent LED display emits heat generated when operating 1R1G1B LED chip without using heat sink, and operates without circuit board PCB. It is characterized by the configuration.
  • the flexible transparent film metal pattern circuit can dissipate the heat generated from the 1R1G1B LED chip to preserve the life of the 1R1G1B LED chip due to heat generation, minimize the brightness deterioration problem, and realize a lightweight flexible transparent LED display product.
  • the flexible transparent film metal pattern circuit configures an operation circuit by mounting a 1R1G1B LED chip on a film metal pattern (Film Metal Pattern) by a reflow soldering operation without using a substrate PCB, and is generated when driving a 1R1G1B LED chip. It uses a manufacturing method that does not use a separate heat generating heat sink and does not use a substrate PCB constituting a metal pattern circuit. It is distributed in a flexible transparent film metal pattern having flexibility of bending or bending heat. By implementing a flexible transparent LED display.
  • the method of increasing the number of pixels in a predetermined space is used.
  • the number of 1R1B1G LED chips is increased, power consumption and heat generation amount are increased. This increasing problem is solved and the heat dissipation problem which affects the lifetime and brightness deterioration of 1R1G1B LED chip is improved and presented.
  • the flexible transparent film metal pattern circuit is a flexible transparent film metal pattern material, that is, aluminum (Al) or copper, in which 1R1G1B LED chips transmit heat generated during operation to the outside or radiate in a radiation form. It is a flexible transparent film metal pattern circuit produced by (Cu).
  • FIG. 8B is a flexible transparent film metal pattern including three lines of (+) electrode line, data line, and (-) electrode line, and each point of the matrix structure connected to the flexible transparent film metal pattern circuit.
  • the driver IC and the 1R1G1B LED chip are mounted.
  • Flexible Transparent Film Metal Pattern material is an alloy composed mainly of Aluminum, Beryllium Oxide (BeO) or Aluminum Oxide (Al 2 O 3 )
  • BeO Beryllium Oxide
  • Al 2 O 3 Aluminum Oxide
  • the driver IC and the 1R1G1B LED chip are mounted at each point of the matrix structure and soldered and assembled.
  • FIG. 11 is a configuration diagram showing a flexible transparent LED display manufacturing process to which a flexible transparent film metal pattern circuit according to the present invention is applied.
  • the flexible transparent film metal pattern circuit itself emits heat generated when the 1R1G1B LED chip is operated without using a heat sink, and operates without a substrate PCB.
  • the method is equipped with a driver IC and a 1R1G1B LED chip by soldering in one unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit, and the flexible transparent film metal pattern circuit and each 1R1G1B A positive electrode line connected to an anode of the LED; A data line connected to the driver IC; And three wires including a negative electrode line connected to a cathode of each 1R1G1B LED, wherein the data line is configured to transmit an RGB combined color signal from the control board (MCU). It includes more.
  • the method may include an app for controlling the LED light by connecting the control board to a computer for controlling the LED light through an RS-232 serial interface or a wired cable, or by connecting a Wi-Fi or Bluetooth communication with a communication unit.
  • the method further includes communicating with the installed smartphone.
  • Reference numeral 1 denotes a flexible transparent film pattern artwork
  • reference numeral 2 denotes a flexible transparent metal pattern wiring
  • reference numeral 3 denotes a 1R1G1B LED chip
  • reference numeral 4 denotes a flexible 1R1G1B LED Chip mounted on a Flexible Transparent Flim Metal Pattern circuit
  • reference numeral 4.1 denotes a 1R1G1B LED Chip mounted on a flexible transparent film metal pattern
  • 5 denotes a Flexible Transparent Film Metal Pattern assembly.
  • FPCB Flexible Printed Circuit Board
  • 6 Flexible transparent film metal pattern assembly and driver board
  • 7 Flexible assembled from silver acrylic or polycarbonate plates or glass Transparent film LED display
  • 8 is acrylic or polycarbonate, or glass (glass)
  • 9 is window cover acrylic or polycarbonate, glass ).
  • a flexible transparent LED display to which a flexible transparent film metal pattern circuit according to the present invention is applied, does not use a substrate PCB and a heat sink, and has three (+) electrodes, data lines, and (-) electrodes.
  • One unit package provided at each point connected to the flexible transparent film metal pattern circuit is an operation circuit configuration for mounting a driver IC and a 1R1G1B LED chip.
  • Electrode line 10 is connected to the anode of each of the R, G, B LED; A data line 11 connected to the driver IC; And three (-) electrode lines 12 connected to the Cathode of each of the R, G, and B LEDs.
  • the data line receives RGB combination color signals from a control board (MCU).
  • the 1R1G1B LED chip contains one red LED, one green LED, and one blue LED.
  • a flexible transparent film metal pattern circuit can comprise a serial / parallel circuit according to a circuit structure.
  • Flexible conductive film using conductive conductive material consisting of (+) electrode line 10, data line 11, (-) electrode line 12, flexible to bend or bend Flexible transparent film metal pattern circuit having a;
  • the 1R1G1B LED chip 14 mounted by soldering for each unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit, and the 1R1G1B LED by receiving an RGB combined color signal through the data line.
  • a driver IC 13 for driving a chip; And supply power to the (+) electrode line 10 of the flexible transparent film metal pattern circuit, ground the ( ⁇ ) electrode line 12, and drive the data line 11 to drive the LED display. It includes a control board (control board, MCU) to transmit the RGB combination color signal to display the color,
  • the flexible transparent film metal pattern circuit emits heat generated when the 1R1G1B LED chip is operated without using a heat sink and is a circuit that operates without a PCB.
  • the control board adjusts the duty cycle of the current using LED output control, light brightness control, color temperature control, and pulse width modulation (PWM) for each port to dynamically output the advertising image of the LED. Provides dimming control to scale.
  • PWM pulse width modulation
  • the control board is connected to a computer for controlling the LED light with an RS-232 serial interface or a wired cable, or a smartphone with an app for controlling the LED light with Wi-Fi or Bluetooth communication connected to a communication unit. Can be communicated with.
  • the computer or smartphone may be operated to transmit the LED lighting control signal to the control board to dynamically output the advertising image of the LED.
  • the flexible transparent film metal pattern circuit may include aluminum (Al), which is a flexible transparent film metal pattern material, which serves to transmit heat generated during operation of the 1R1G1B LED chip to the outside or radiate it in a radiant form.
  • Al aluminum
  • Cu copper
  • the conductive film metal pattern material is made of an alloy of aluminum, beryllium oxide (BeO) or aluminum oxide (Al 2 O 3 , Aluminum oxide), which has extremely excellent thermal conductivity. Implement a pattern circuit.
  • FIG. 13 is an actual driving picture connected to a control board (MCU) of a flexible transparent LED display to which a flexible transparent film metal pattern circuit according to the present invention is applied.
  • MCU control board
  • the flexible transparent LED display to which the flexible transparent film metal pattern circuit having the flexibility of the present invention is applied has a relatively small line resistance due to the thickness and distance of the line, and has the flexibility to bend or bend the flexible transparent film metal pattern.
  • Pattern) material and small and light weight make the structure simple and detachable at anytime and anywhere.
  • Flexible transparent LED display using a flexible flexible film metal pattern circuit is used in media facades, electronic displays, smart glass panels and the like used for information transmission of advertising billboards.
  • the flexible transparent LED display of the LED electro-optical panel and a method of manufacturing the same according to the present invention are firstly provided with a flexible transparent film metal pattern having three lines of a (+) electrode line, a data line, and a (-) electrode line.
  • the driver IC and the 1R1G1B LED chip are configured in one unit package provided at each point connected to the circuit, and the size of the LED package can be minimized because the volume of devices occupied by three LED chips can be reduced to one within the same volume. Can be.
  • raw materials can be significantly reduced in assembling 1R1G1B LED chips.
  • 1R1G1B LED chips are manufactured by a manufacturing process mounted at each point of a matrix structure in a flexible transparent film metal pattern assembly circuit, thus saving LED PCBs by reducing PCB PCB, ITO pattern, and silver paste.
  • Productivity is improved and production cost is greatly reduced due to manufacturing cost and simplified manufacturing process.
  • the flexible transparent LED display to which the flexible transparent film metal pattern circuit of the present invention is applied has a relatively small line resistance due to the thickness and distance of the line, and has a flexible transparent film metal pattern having flexibility of bending or bending.
  • Transparent Film Metal Pattern material is used, and its structure is simple due to its small size and light weight, and it can be attached and detached anytime and anywhere.
  • the Noise between the metal patterns generated when driving the device can be improved by reducing the number of circuit patterns, and within the control board
  • the signal processing unit to be configured can be miniaturized and the user's convenience can be achieved.
  • Flexible transparent LED display using a flexible flexible film metal pattern circuit is used in media facades, electronic displays, smart glass panels and the like used for information transmission of advertising billboards.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electromagnetism (AREA)

Abstract

L'invention concerne un afficheur à LED transparent souple d'un panneau électro-optique à LED et son procédé de fabrication. L'afficheur à LED transparent souple du panneau électro-optique à LED adopte une configuration de circuit métallique en film transparent souple équipé de trois lignes dont : une ligne d'électrode (+), une ligne de données et une ligne d'électrode (-), laquelle n'utilise pas un circuit imprimé faisant substrat. Dans un boîtier unitaire disposé au niveau de chaque point d'une structure en matrice reliée à la configuration de circuit métallique en film transparent souple, un circuit de fonctionnement équipé d'une puce de LED 1R1G1B et un circuit intégré d'attaque sont disposés continuellement en série et en parallèle. L'afficheur à LED transparent souple du panneau électro-optique à LED selon la présente invention n'utilise pas de dissipateur thermique pour résoudre le problème de la chaleur générée pendant le fonctionnement de la puce de LED 1R1G1B, et réalise une génération de chaleur à auto-dispersion dans la configuration de circuit métallique en film transparent souple ayant une flexibilité, ce qui a pour effet de prolonger la durée de vie de la puce de LED et de maintenir sa luminosité stable.
PCT/KR2018/001805 2017-02-13 2018-02-12 Afficheur à led transparent souple d'un panneau électro-optique à led et son procédé de fabrication WO2018147694A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2017-0019635 2017-02-13
KR1020170019635A KR101789139B1 (ko) 2017-02-13 2017-02-13 Led 전기 광학 판넬의 플렉시블 투명 led 디스플레이 및 그 제조 방법

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WO2018147694A1 true WO2018147694A1 (fr) 2018-08-16

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Cited By (2)

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CN112863353A (zh) * 2021-01-21 2021-05-28 深圳市伽弥科技有限公司 一种柔性透明屏的制作方法
CN113411990A (zh) * 2021-06-16 2021-09-17 珠海中京电子电路有限公司 一种led透明屏主板制作方法

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KR101942393B1 (ko) 2018-01-08 2019-01-29 주식회사 엔앤비 투명 led 디스플레이 및 그 제조 방법
KR102193201B1 (ko) * 2018-04-25 2020-12-21 문대식 디스플레이 장치
KR102364569B1 (ko) 2018-08-24 2022-02-17 주식회사 엘지화학 투명 발광소자 디스플레이용 전극 기판 및 이를 포함하는 투명 발광소자 디스플레이
KR102173410B1 (ko) 2019-04-29 2020-11-03 위인호 투명한 ｌｅｄ 스크린에 콘텐츠 영상을 표시하고 디지털 정보를 출력하는 투명한 ｌｅｄ 디스플레이
KR102421764B1 (ko) * 2021-12-07 2022-07-19 주식회사 일상의진화 스마트 트램폴린 시스템
KR20230172935A (ko) 2022-06-16 2023-12-26 이강 플렉시블 발광시트

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KR20160015110A (ko) * 2014-07-30 2016-02-12 류승봉 복합구조 형태를 갖는 투명 플렉시블 전극
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CN112863353A (zh) * 2021-01-21 2021-05-28 深圳市伽弥科技有限公司 一种柔性透明屏的制作方法
CN113411990A (zh) * 2021-06-16 2021-09-17 珠海中京电子电路有限公司 一种led透明屏主板制作方法

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