WO2018121793A1 - Module de réseau photographique séparable et son procédé de fabrication - Google Patents

Module de réseau photographique séparable et son procédé de fabrication Download PDF

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Publication number
WO2018121793A1
WO2018121793A1 PCT/CN2018/070009 CN2018070009W WO2018121793A1 WO 2018121793 A1 WO2018121793 A1 WO 2018121793A1 CN 2018070009 W CN2018070009 W CN 2018070009W WO 2018121793 A1 WO2018121793 A1 WO 2018121793A1
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WO
WIPO (PCT)
Prior art keywords
camera module
array camera
circuit board
photosensitive
lens
Prior art date
Application number
PCT/CN2018/070009
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English (en)
Chinese (zh)
Inventor
王明珠
陈振宇
赵波杰
田中武彦
郭楠
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201611269070.2A external-priority patent/CN108270949B/zh
Priority claimed from CN201621491163.5U external-priority patent/CN206807579U/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Publication of WO2018121793A1 publication Critical patent/WO2018121793A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the invention relates to the field of camera modules, and further relates to a split array camera module and a manufacturing method thereof.
  • the dual camera can capture images with the cooperation of two cameras, enabling a richer image acquisition function.
  • the existing dual cameras can be divided into two categories according to their functions: one is to use three cameras to generate stereo vision, to obtain the depth of field of the image, to use the depth of field information for background blur, 3D scanning, auxiliary focus, motion recognition, etc., or to utilize The information of the two pictures is fused; the other type is to use two different pictures on the left and right to achieve better resolution, better color, dynamic range and other better image quality or optical zoom function. .
  • the pixel requirements of the camera module are getting higher and higher, and the number of lenses of the lens is increasing. From the original two or three pieces to the current five, six or even more pieces, facing the high-pixel camera module.
  • the requirement is that the volume is small, on the other hand, the problem of good optical imaging quality is required, and the module for multi-camera is also faced with such a problem, how to make the module as a whole suitable for high pixels, and stable or safe to two or
  • the plurality of camera modules cooperate with each other to form an integral module to meet the requirements of the multi-camera module in the development of the existing camera module, which is a problem to be solved.
  • the consistency of the optical axis between multiple cameras is an important aspect of the optical design of the multi-camera camera module. How to ensure that multiple camera modules can be assembled in one body and ensure the consistency of the optical axis. This is a multi-camera. A problem to be considered in the manufacture of camera modules.
  • two mutually matched cameras respectively collect image information, and the accuracy of the image acquisition and the image quality are closely related to the incident light of the two cameras, and the optical axis consistency between the two cameras ensures the imaging quality of the camera module.
  • Foundation That is to say, how to improve the optical axis consistency of the two camera modules on the basis of stably and compactly fixing two cameras, or to make the error within a predetermined range, thereby improving the precision of the installation and making it more accurate Good image quality is another important issue to consider for the development of dual cameras.
  • the conventional camera module is usually a camera module assembled by a COB method, and the basic structure thereof comprises a circuit board, a photosensitive element, a lens holder, a lens and a filter element, wherein the photosensitive element is attached
  • the circuit board is electrically connected to the circuit board by a gold wire
  • the lens holder is mounted on the circuit board by glue
  • the lens is mounted on the lens holder
  • the filter element is mounted on the lens holder
  • the circuit The board is usually provided with protruding electronic components.
  • the lens holder is usually bonded to the circuit board after being manufactured by injection molding, and the mounting condition of the lens is not provided with good flatness, and the bonding fixing method increases the cumulative tolerance.
  • the electronic component protrudes from the circuit board, so the installation space needs to be reserved when the mirror mount is installed, so that the overall required area of the circuit board is large, and the electronic component is exposed to the space inside the camera module, and the surface is contaminated with dust. Impurities can easily affect the imaging effect of the camera module. In short, the traditional COB placement camera module has many unfavorable factors, especially not suitable for the existing high-pixel camera module.
  • An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the split array camera module includes at least two camera module units that are separately disposed, so that the camera modules can be relatively independent.
  • the unit performs active calibration so that the optical axes of the camera module units are identical.
  • An object of the present invention is to provide a split-type array camera module and a manufacturing method thereof, wherein the split-type array camera module includes an assembly body, and the assembly body stably assembles and fixes each of the camera module units. One whole.
  • An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the assembly has a receiving chamber, and each of the camera module units is received therein, so that the split array camera module
  • the outer shape is more regular and easy to install and use.
  • An object of the present invention is to provide a split array camera module and a method of fabricating the same, wherein the assembly includes at least one partition wall, the partition wall separating the receiving chambers, so that each of the camera module units Set in isolation to reduce electromagnetic interference between each other.
  • An object of the present invention is to provide a split-type array camera module and a manufacturing method thereof, wherein the assembly body includes at least one supporting edge extending toward the receiving chamber to stably support and mount each of the camera module units. .
  • An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the camera module includes a photosensitive component, and the photosensitive component includes a base and a circuit board, and the base is integrated Formed on the circuit board, it has good flatness, and can provide flat mounting conditions for the mounted components, thereby improving the optical axis consistency of the camera module unit.
  • An object of the present invention is to provide a split-type array camera module and a method of fabricating the same, wherein the base has a light window to provide a light path for a photosensitive element, and the inner side wall of the base is obliquely disposed, Small stray light is reflected to the photosensitive element.
  • An object of the present invention is to provide a split-type array camera module, wherein the photosensitive element has at least one photosensitive area and a non-sensitive area, and the base integrally encapsulates at least a portion of the non-photosensitive area of the photosensitive element to An integral package area of the pedestal is expanded.
  • An object of the present invention is to provide a split array camera module and a method of fabricating the same, wherein the circuit board includes a circuit board body and at least one electronic component, the electronic component protruding from the circuit board body, The base is integrally formed on the circuit board main body to cover the electronic component to reduce space occupation.
  • An object of the present invention is to provide a split-type array camera module and a method of fabricating the same, wherein the photosensitive element is electrically connected to the circuit board body through at least one electrical connection element, and the base covers the electrical connection element .
  • An object of the present invention is to provide a split array camera module and a method of fabricating the same, wherein the base includes a support member, and the support member is spaced apart from the circuit board and the base body to facilitate The wiring board and the photosensitive member are protected during the manufacturing process.
  • An object of the present invention is to provide a split array camera module and a method of fabricating the same, wherein the camera module unit includes a filter element, and the filter element is mounted to the base body.
  • An object of the present invention is to provide a split-type array camera module and a manufacturing method thereof, wherein the camera module unit includes a seat, the holder is mounted with the base body, and a filter element is mounted on The support.
  • An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the circuit board main body has a sinking region, and the photosensitive element is disposed in the sinking region to reduce the photosensitive element and The relative height of the main body of the circuit board.
  • An object of the present invention is to provide a split-type array camera module and a manufacturing method thereof, wherein the circuit board body comprises a first board body and a second board body, and the first board body is electrically conductively passed through a conductive adhesive Connected to the second plate.
  • An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the height and size of each of the camera module units can be freely assembled to facilitate cooperation of different types of camera module units.
  • an aspect of the present invention provides an array camera module including: at least two camera module units and an assembly, wherein each of the camera module units is respectively fixed to the assembly In order to form a whole.
  • the assembly includes an upper cover for fixedly connecting each of the camera module units.
  • the assembly body includes a main body, and the main body forms a receiving chamber, and each of the camera module units is housed in the receiving chamber.
  • the assembly body includes an upper cover, the upper cover is adapted to cover the receiving compartment, and the upper cover has at least two lens ports, so that each of the camera module units is accommodated in When the housing is in the housing chamber, the lens is illuminated by the lens port.
  • the upper cover is integrally connected to the body. It is to be understood that the assembly may be implemented only to have only the above upper cover, or to have the main body forming the receiving chamber described above and the upper cover integrally formed on the main body, or without the upper cover. And only the body of the side wall and the like are suitable structures.
  • the assembly body includes a partition wall, and the partition wall is located in the receiving chamber, and the receiving chamber is partitioned into at least two portions for respectively accommodating each of the camera module units.
  • the partition wall material is selected from one or more of a plastic, a resin, a rubber, and a metal.
  • the assembly includes at least one partition wall that divides the receiving chamber into at least two portions for respectively accommodating each of the camera module units, and the partition wall is connected to the Cover the cover.
  • the assembly includes at least one support edge extending inwardly from the body to facilitate support of each of the camera module units.
  • the support edge is a boss structure.
  • each of the camera module units includes a photosensitive component and a lens, wherein the lens is located in a photosensitive path of the photosensitive component, and the photosensitive component comprises a circuit board, a photosensitive element and a base.
  • the base is integrally formed on the circuit board, the photosensitive element is electrically connected to the circuit board, the lens is located in a photosensitive path of the photosensitive element, and the base has at least one light window.
  • the photosensitive element provides a light path.
  • the photosensitive element is located inside the base.
  • the photosensitive member includes the base integrally encapsulating the wiring board and at least a portion of the non-photosensitive area of the photosensitive element.
  • the base encass the electrical connection element.
  • the circuit board includes at least one electronic component that encapsulates the electronic component.
  • the support member is disposed on the circuit board body to facilitate protection of the circuit board body and the photosensitive member during manufacturing.
  • the support member is disposed in a non-photosensitive region of the photosensitive member to facilitate protection of the photosensitive member during manufacture.
  • each of the camera units includes a seat that is mounted to the base to facilitate mounting a filter element.
  • the mount is at least partially connected to the circuit board.
  • each of the mounts of each of the camera module units is integrally connected.
  • the photosensitive element is disposed in the sinker zone to facilitate lowering the relative height of the photosensitive element and the wiring board.
  • the circuit board includes a first board body and a second board body, and the second board body is fixedly coupled to the first board body by a connecting medium.
  • the connection medium is an anisotropic conductive paste.
  • the base includes an extension mounting portion that extends at least partially upwardly from the base body to form a limit slot that limits the component being mounted.
  • the photosensitive member is disposed on the flip-chip to facilitate mounting the photosensitive member to the wiring board in a flip chip manner.
  • the circuit boards of each of the camera module units are integrally connected.
  • each camera module unit is separately provided.
  • the bottom of each of the camera module units has a height difference.
  • each of the camera module units includes a lens support member, the lens is mounted to the lens support member, and the lens support member is mounted to the base.
  • the lens supporting component is a driving component, so that the camera module unit forms a moving focus camera module.
  • the lens supporting element is a barrel element, so that the camera module unit constitutes a certain focus camera module.
  • At least two of the camera module units are fixed focus camera modules.
  • At least two of the camera module units are dynamic focus camera modules.
  • At least one of each of the camera module units is a focus camera module, and at least one is a fixed focus camera module.
  • each of the array camera modules includes a filter element, and the filter element is mounted to the base.
  • the type of circuit board is selected from the group consisting of a hard board, a soft board, a hard and soft board, and a soft board.
  • FIG. 1 is a perspective view of a split-type array camera module in accordance with a first preferred embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of a split-type array camera module in accordance with a first preferred embodiment of the present invention.
  • FIG. 3 is a schematic diagram of an assembly process of a split-type array camera module in accordance with a first preferred embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a split-type array camera module in accordance with a first preferred embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of a split-type array camera module in accordance with a second preferred embodiment of the present invention.
  • FIG. 6 is a cross-sectional view of a split-type array camera module in accordance with a third preferred embodiment of the present invention.
  • FIG. 7 is a cross-sectional view of a split-type array camera module in accordance with a fourth preferred embodiment of the present invention.
  • 8A, 8B are schematic cross-sectional views of a split-type array camera module in accordance with a fifth preferred embodiment of the present invention.
  • FIG. 9 is a cross-sectional view of a split-type array camera module in accordance with a sixth preferred embodiment of the present invention.
  • FIG. 10 is a cross-sectional view of a split-type array camera module in accordance with a seventh preferred embodiment of the present invention.
  • FIG. 11 is a cross-sectional view of a split-type array camera module in accordance with an eighth preferred embodiment of the present invention.
  • Figure 12 is a cross-sectional view showing a split type array camera module in accordance with a ninth preferred embodiment of the present invention.
  • Figure 13 is a cross-sectional view showing a split type array camera module in accordance with a tenth preferred embodiment of the present invention.
  • Figure 14 is a schematic diagram of a split-type array camera module in accordance with a twelfth preferred embodiment of the present invention.
  • 15A, 15B, and 15C are cross-sectional views showing different embodiments of a split type array camera module according to a tenth preferred embodiment of the present invention.
  • Figure 16 is a top plan view of a split-type array camera module in accordance with an eleventh preferred embodiment of the present invention.
  • 17 is a block diagram of a method of fabricating a split-type array camera module in accordance with the above-described preferred embodiment of the present invention.
  • FIG. 18 is a schematic diagram of the application of a split-type array camera module in accordance with the above-described preferred embodiment of the present invention.
  • the camera module of the multi-camera is an important trend in the recent development of the camera module, especially when the various performances of the camera module tend to be extreme, the pixels of the camera module are getting higher and higher, and the number of lenses of the lens is increasing. Under the development of multi-camera camera modules has become an important trend and direction.
  • the combination of multiple camera modules can achieve more functions, such as using stereo camera to generate stereo vision, obtaining depth of field of image, using background depth information for background blur, 3D scanning, auxiliary focusing, motion recognition, etc., or using two The information of the picture is fused; or the two different pictures on the left and right are used for fusion, in order to obtain higher resolution, better color, dynamic range and other better image quality or optical zoom function.
  • a split-type array camera module which includes at least two camera module units and an assembly, and each of the camera module units is separately assembled by the assembly, so that each camera The modules have little influence on each other, and the structure is formed as a whole, and the appearance is regular, which is convenient for installation and application.
  • each of the camera module units includes at least one photosensitive component
  • the photosensitive component includes a base and a circuit board
  • the base is mounted or integrally formed by
  • the circuit board is preferably integrally formed to provide a flat mounting plane, which is superior to the conventional COB assembly method, improves the optical performance of the camera module, and is optimized in volume and process.
  • the camera module unit can be manufactured as different types of camera modules. Therefore, the specific optimized structure of the camera module unit of the present invention is combined with the assembly structure of the camera module unit of the present invention to provide a structural regularity.
  • the optical imaging performance and volume optimized array camera module enable the same or different camera modules to be assembled stably and safely to form a whole and realize more functions.
  • the split array camera module of the present invention can be applied to an electronic device, such as but not limited to, a smart phone, a notebook computer, a tablet computer, a camera, a monitoring device, a wearable device,
  • the split dual camera array camera module 100 composed of two camera module units will be described below as an example.
  • the split array camera module 100 may include more of the camera module units, and the present invention is not limited in this regard.
  • the split-type array camera module 100 includes at least two camera module units and an assembly 30, and each of the camera module units is separately assembled to the assembly 30 to form a unit.
  • the two camera module units are a first camera module unit 10 and a second camera module unit 20, respectively.
  • the assembly body 30 includes a main body 31 and has a receiving chamber 32.
  • the first camera module unit 10 and the second camera module unit 20 are housed in the receiving chamber 32.
  • the main body 31 forms the accommodating chamber 32, and the first camera module unit 10 and the second camera module unit 20 are limited and fixed therein, so that the first camera module is
  • the unit 10 and the second camera module unit 20 are integrally formed to facilitate installation of an application.
  • the accommodating chamber 32 is not a closed structure, but a semi-open structure, so that each of the camera module units can perform lighting and provide an electrically connectable position.
  • the assembly may not form the obvious receiving chamber, for example, the first camera module unit 10 and the second camera module unit 20 are fixed by spaced apart plate members. .
  • first camera module unit 10 and the second camera module unit 20 are respectively fixed to the side wall of the main body 31 of the assembly 30, for example, by glue bonding, thereby passing through
  • the main body 31 provides a fixed position for the first camera module unit 10 and the second camera module unit 20, so that the first camera module unit 10 and the second camera module unit 20 are opposite.
  • the position is determined to form an array structure.
  • the array described in the present invention is used to describe that each camera module unit forms a positional layout relationship, and is not limited to being arranged in a column manner, and the layout mode can be based on requirements and array camera modules.
  • the number and type are determined, such as linear arrangement, triangular arrangement, symmetric arrangement, and the like.
  • the assembly body 30 may be a square frame structure, so that each of the camera module units is constrained and assembled in a square structured structure to facilitate installation applications, such as mounting on electronics. device.
  • the structure of the assembly 30 may be deformed according to the size and structure of each camera module unit, thereby forming a regular or irregular structure, so that each of the camera modules The unit can be assembled stably.
  • the assembly 30 includes an upper cover 33 adapted to block the main body 31 to facilitate closing the receiving chamber 32.
  • the upper cover 33 has at least two lens ports 331 corresponding to the camera module units, so that each of the camera module units performs daylighting through the lens port 331.
  • the upper cover 33 is integrally connected to the main body 31, thereby constructing an integral receiving structure.
  • the upper cover 33 may not be provided, or the upper cover 33 may be connected separately from the main body 31, or only the upper cover 33 may be connected without connecting the main 31. It should be understood by those skilled in the art that the arrangement of the upper cover 33, and the manner of connection, are not limitations of the present invention.
  • the assembly process of the split-type array camera module 100 may be performed by first inverting the assembly 30, applying glue on the top of the camera module units 10, 20, and then The first camera module unit 10 and the second camera module unit 20 are respectively actively calibrated, so that the first camera module unit 10 is pre-assembled. And the optical axis of the second camera module unit 20 is consistent, and then the first camera module unit 10 and the second camera module unit 20 are solidified, so that the first camera module unit 10 and The second camera module unit 20 is fixedly coupled to the assembly 30.
  • the fixed position of the camera module unit 10, 20 and the assembly body 30 may be a top portion or a side wall.
  • the side wall of the main body 31 of the assembly 30 and the camera module unit may be fixed at the time of bonding, and/or the upper cover 33 of the assembly 30 may be attached during bonding. And fixed to the camera module unit.
  • the assembly 30 may be free of the upper cover 33, and the camera module units 10, 20 are connected to the side wall or the bottom wall of the assembly 30. It will be understood by those skilled in the art that the bonding position of the glue is not a limitation of the present invention.
  • the assembly body 30 may include a supporting edge 34 disposed at the bottom of the main body 31 to facilitate supporting the first camera module unit 10 and the The second camera module unit 20 is described. Specifically, the supporting edge 34 extends from the main body 31 into the receiving chamber 32 to form a boss for providing support for the first camera module unit 10 and the second camera module unit 20. position.
  • the upper cover 33 is detachably coupled to the main body 31.
  • the supporting edge 34 limits the first camera module unit 10 and the second camera module unit 20 such that the first camera module unit 10 and the second camera module unit 20 are in a predetermined state. position. It is to be noted that, in this embodiment of the present invention, the heights of the supporting edges 34 corresponding to the first camera module unit 10 and the second camera module unit 20 are the same, when two camera modules are used. When the heights of the units are the same, the heights of the ends of the camera module units can be made uniform. In other embodiments of the present invention, the positions of the first camera module unit 10 and the second camera module unit 20 may be different according to the height of the support side 34, so that different limit heights may be provided.
  • the height difference between the first camera module unit 10 and the second camera module unit 20 can be compensated by the support edge 34, so that the split type The ends of the array camera module 100 are identical.
  • the top heights of the first camera module unit 10 and the second camera module unit 20 may be inconsistent, and the present invention is not limited in this regard. That is, the support side 34 may be a convex plane of the same plane, or may be a different plane of the boss.
  • the height of the camera module may be the same or different, and the first camera module unit 10 and The tops of the second camera module units 20 may or may not be identical, and the present invention is not limited in these respects.
  • the first camera module unit 10 and the second camera module unit 20 are separately disposed, so that the first camera module unit 10 and the second camera are The mutual influence of the module unit 20 is small, and the assembly of the assembly body 30 ensures the consistency of the optical axes of the first camera module unit 10 and the second camera module unit 20.
  • the first camera module unit 10 and the second camera module unit 20 may be pre-assembled into the assembly body 30, and then the first camera module unit 10 and / or the second camera module unit 20 performs automatic calibration, so that the optical axes of the first camera module unit 10 and the second camera module unit 20 are identical, or the angle of the optical axis is at a predetermined error.
  • the relative position within the range or a certain distance. If the first camera module unit 10 and the second camera module unit 20 are fixedly connected, and the influence between each other is large, that is, when one of the camera module units is adjusted It will inevitably affect another camera module unit, and cannot achieve the purpose of independent active calibration in the present invention.
  • the basic structure of the first camera module unit 10 and the second camera module unit 20 are identical, that is, the first camera module unit 10 and the first The second camera module unit 20 can be the same type of camera module.
  • the first camera module can be of different types, and the invention is not limited in this respect.
  • the first camera module unit 10 includes a first photosensitive component 11 , a first lens 12 , a first lens supporting component 13 and a first filter component 14 .
  • the first lens 12 is located in a photosensitive path of the first photosensitive member 11, the first lens 12 is mounted on the first lens supporting member 13, and the first lens supporting member 13 is mounted on the first lens a photosensitive member 11 such that the first lens 12 is located in a photosensitive path of the first photosensitive member 11, and the first filter element 14 is mounted to the first photosensitive member 11 such that Light from a lens 12 passes through the first filter element 14 to reach the first photosensitive member 11.
  • the first photosensitive member 11 includes a first wiring board 111, a first photosensitive element 113, and a first pedestal 112.
  • the first photosensitive element 113 is electrically connected to the first circuit board 111 to transmit photosensitive information to the first circuit board 111, and the first lens 12 is located in a photosensitive path of the first photosensitive element 113. In order to allow the first photosensitive element 113 to receive light, it is photosensitive.
  • the first photosensitive element 113 may be disposed on the first circuit board 111 by a surface mount technology (SMT) and electrically connected through at least one first electrical connection element 1133. Connected to the first circuit board 111.
  • SMT surface mount technology
  • the first electrical connection element 1133 is exemplified by, but not limited to, a gold wire, a silver wire, a copper wire, an aluminum wire, a pad, a pin, or the like.
  • the first photosensitive element 113 has a first photosensitive area 1131 for performing photosensitivity, and a first non-sensitive area 1132 for electrically connecting to the The first circuit board 111.
  • the first non-photosensitive area 1132 is electrically connected to the first wiring board 111 through the electrical connection element.
  • the first photosensitive element 113 is located inside the first pedestal 112, that is, not encapsulated by the pedestal.
  • the first photosensitive element 113 needs to be attached to the first wiring board 111, such as glue bonding, so that the first photosensitive element 113 is stably fixed, and then The first photosensitive element 113 is electrically connected to the first circuit board 111 through the first electrical connection element 1133, and is electrically connected to the first circuit board 111, for example, by a gold wire.
  • the first pedestal 112 is integrally connected to the first circuit board 111.
  • the first pedestal 112 includes a first pedestal body 1121 and has a first light window 1122.
  • the first light window 1122 provides a light path for the first photosensitive element 113.
  • the first photosensitive element 113 is located in the first light window 1122, and the photosensitive path of the first photosensitive element 113 is in the same direction as the first light window 1122.
  • the first pedestal body 1121 forms the first light window 1122 to provide a light path for the first photosensitive element 113.
  • the first base body 1121 is a closed loop structure that accommodates the shape of the first photosensitive element 113.
  • the first base body 1121 has a first inner side wall having an angle of inclination to facilitate mold fabrication and to reduce stray light reflection to the photosensitive element.
  • first inner side wall having an angle of inclination to facilitate mold fabrication and to reduce stray light reflection to the photosensitive element.
  • the side wall is at a vertical angle
  • the incident angle of the light reaching the first base body 1111 is relatively large, so that the reflection angle of the light is large, and it is relatively easy to reflect to the inside, that is, to the photosensitive element.
  • Position reflection When the first inner side wall is inclined, the incident angle of the light is small, the light incident in the same direction, and the reflected light is offset from the position away from the photosensitive element, so that the oblique arrangement helps to reduce the interference of stray light.
  • the magnitude of the tilt angle can be set as desired.
  • the first inner sidewall of the first base body 1121 may be vertically disposed, that is, the tilt angle is not present.
  • the first pedestal 112 is disposed on the first circuit board 111 by integral molding, such as molding, thereby the first pedestal 112 and the The first circuit board 111 is stably fixed and reduces an additional mounting and fixing process. For example, the process of reducing the glue bonding, the connection is more stable, the height of the glue connection is omitted, and the height of the camera module unit is lowered.
  • the first pedestal 112 may be integrally formed on the first circuit board 111 by mold molding, such as molding in a circuit board, which is different from the conventional COB (Chip On Board) mode.
  • mold molding such as molding in a circuit board, which is different from the conventional COB (Chip On Board) mode.
  • COB Chip On Board
  • the shape of the molding and the flatness of the surface can be better controlled, for example, such that the first base body 1121 has a better flatness, thereby being a mounted component, such as the lens supporting member.
  • the first filter element 14 provides a flat mounting condition to help improve the optical axis uniformity of the first camera module unit 10.
  • the first circuit board 111 includes a first circuit board body 1111 and at least one first electronic component 1112, and the first electronic component 1112 protrudes from the first circuit board.
  • the main body 1111 is configured to cooperate with the operation of the first circuit board main body 1111.
  • the first pedestal 112 is integrally formed on the first circuit board main body 1111 and covers the first electronic component 1112, thereby reducing the occupied space of the first electronic component 1112.
  • the first electronic component 1112 is by way of example and not limitation, a resistor, a capacitor, a driver, or the like.
  • the first electronic component 1112 may not be disposed or the first electronic component 1112 may protrude from the first circuit board body 1111, such as embedded in the first The circuit board main body 1111, the present invention is not limited in this respect.
  • Each of the first electronic components 1112 may be mounted on an edge region of the first wiring board 111, such as outside the first photosensitive member 113, by being spaced apart from each other by, for example, an SMT process. It is worth mentioning that each of the first electronic components 1112 may be located on the same side or opposite side of the first circuit board 111, for example, in one specific example, the first photosensitive element 113 and each of the The first electronic components 1112 may be respectively located on the same side of the first circuit board 111, and the first photosensitive elements 113 are mounted on the chip mounting area of the first circuit board 111, each of the first An electronic component 1112 is attached to the edge region of the first wiring board 111 at a distance from each other.
  • the first pedestal 112 covers each of the first electronic components 1112 after molding to isolate adjacent first electronic components 1112 and isolate the first electronic components by the first pedestal 112 1112 and the first photosensitive element 113.
  • the manner in which the first pedestal 112 covers each of the first electronic components 1112 after molding has many advantages.
  • the first pedestal 112 includes Each of the first electronic components 1112 is covered so that mutual interference between adjacent first electronic components 1112 does not occur, even when the distance between adjacent first electronic components 1112 is relatively close.
  • the imaging quality of the camera module unit can be ensured, so that a larger number of the first electronic components 1112 can be mounted on the first circuit board 111 of a small area, thereby making the camera module
  • the structure of the unit is more compact, so as to improve the imaging quality of the camera module unit based on controlling the size of the camera module unit;
  • the first base 112 covers each of the first An electronic component 1112 such that no safety distance is required between the first pedestal 112 and each of the first electronic components 1112, whether in the horizontal direction or in the height direction, to enable The size of the camera module unit.
  • the first pedestal 112 covers each of the first electronic components 1112, so that no glue is needed for connection and leveling between the first pedestal 112 and the first circuit board 111.
  • the first pedestal 112 covers each of the first electronic components 1112, and in the process of subsequently transporting and assembling the camera module unit to form the split array camera module 100, The first pedestal 112 can prevent the first electronic component 1112 from shaking and falling off, thereby facilitating structural stability of the split-type array camera module 100.
  • the first pedestal 112 covers each of the first electronic components 1112, and can be prevented during the subsequent transportation and assembly of the camera module unit to form the split array camera module 100. Contaminants contaminate each of the first electronic components 1112, or contaminants on the surface of the electronic components are shed to contaminate the photosensitive elements to ensure image quality of the first camera module unit 10.
  • the first electronic component 1112 can be insulated from the air. In this manner, the oxidation rate of the metal portion of the first electronic component 1112 can be slowed down. The environment stability of the first electronic component 1112 and the split array camera module 100 is improved.
  • the first pedestal 112 is integrally formed on the first circuit board main body 1111 and covers the first electronic component 1112 of the first circuit board 111, thereby making the first The pedestal 112 and the first circuit board main body 1111 have a large connection area, the connection is more stable, and the structural strength is better by integral molding, so the first pedestal 112 can be firmly and reliably supported.
  • the components of the first camera module unit 10 are fixed, thereby ensuring the yield of the product.
  • the number of lenses of the lens is increasing, for example, up to 5p, 6p, and 6p, etc., and when the number of lenses of the camera module lens increases, it needs to be satisfied at the same time.
  • the filter element is mounted to the pedestal integrally formed such that the filter element can be provided with flat mounting conditions and can pass through the pedestal
  • the height is effectively controlled to control the height position at which the filter element is mounted, and thus the structure of the present invention is more suitable for a high-pixel camera module.
  • the first pedestal 112 has a first mounting slot 1123 communicating with the first optical window 1122.
  • the first filter element 14 is located between the first lens 12 and the first photosensitive element 113 to facilitate filtering light passing through the first lens 12 to the first photosensitive element 113.
  • the first filter element 14 is mounted to the first mounting groove 1123.
  • the first filter element 14 can be implemented as an infrared cut filter, a full transmissive spectrum filter, a blue glass filter, or the like.
  • the second camera module unit 20 includes a second photosensitive component 21 , a second lens 22 , a second lens supporting component 23 and a second filter component 24 .
  • the second lens 22 is located in the photosensitive path of the second photosensitive member 21, the second lens 22 is mounted on the second lens supporting member 23, and the second lens supporting member 23 is mounted on the first lens a photosensitive member 21 such that the second lens 22 is located in a photosensitive path of the second photosensitive member 21, and the second filter element 24 is mounted to the second photosensitive member 21 such that The light of the two lenses 22 passes through the second filter element 24 to reach the second photosensitive member 21.
  • the second photosensitive component 21 includes a second circuit board 211, a second photosensitive element 213, and a second base 212.
  • the second photosensitive element 213 is electrically connected to the second circuit board 211 to transmit photosensitive information to the second circuit board 211, and the second lens 22 is located in the photosensitive path of the second photosensitive element 213.
  • the second photosensitive element 213 is exposed to light to perform light sensing.
  • the second photosensitive element 213 may be disposed on the second circuit board 211 by a surface mount technology (SMT) and electrically connected through the at least one second electrical connection element 2133. Connected to the second circuit board 211.
  • SMT surface mount technology
  • the second electrical connection element 2133 is exemplified by, but not limited to, a gold wire, a silver wire, a copper wire, an aluminum wire, a pad, a pin, or the like.
  • the second photosensitive element 213 has a second photosensitive area 2131 for performing photosensitivity, and a second non-sensitive area 2132 for electrically connecting to the The second circuit board 211.
  • the second non-photosensitive area 2132 is electrically connected to the second wiring board 211 through the electrical connection element.
  • the second photosensitive element 213 is located inside the second pedestal 212, that is, not encapsulated by the pedestal.
  • the second photosensitive element 213 needs to be attached to the second circuit board 211, such as glue bonding, so that the second photosensitive element 213 is stably fixed, and then The second photosensitive element 213 is electrically connected to the second circuit board 211 through the second electrical connection element 2133, and is electrically connected to the second circuit board 211, for example, by a gold wire.
  • the second pedestal 212 is integrally connected to the second circuit board 211.
  • the second base 212 includes a second base body 2121 and a second light window 2122.
  • the second light window 2122 provides a light path for the second photosensitive element 213.
  • the second photosensitive element 213 is located in the second light window 2122, and the photosensitive path of the second photosensitive element 213 is aligned with the second light window 2122.
  • the second pedestal body 2121 forms the second light window 2122 to provide a light path for the second photosensitive element 21313.
  • the second base body 2121. is a closed loop structure that accommodates the shape of the second photosensitive element 213.
  • the second base body 2121 has a second inner side wall having an inclination angle ⁇ to facilitate mold manufacturing and reduce stray light reflection to the photosensitive element.
  • the incident angle of the light reaching the second base body 2121 is large, so that the reflection angle of the light is large, and it is relatively easy to reflect to the inside, that is, to the photosensitive element.
  • Position reflection When the second inner side wall is inclined, the incident angle of the light is small, and the light incident in the same direction is offset from the position of the photosensitive element in the direction of the reflected light, so that the oblique arrangement helps to reduce the interference of stray light.
  • the magnitude of the tilt angle ⁇ can be set as desired.
  • the second inner side wall of the second base body 2121 may be vertically disposed, that is, the tilt angle ⁇ is not present.
  • the second pedestal 212 may be integrally formed on the second circuit board 211 by mold molding, such as molding in a circuit board, which is different from the conventional COB (Chip On Board) mode.
  • mold molding such as molding in a circuit board, which is different from the conventional COB (Chip On Board) mode.
  • COB Chip On Board
  • the shape of the molding and the flatness of the surface can be better controlled, for example, such that the second base body 2121 has a better flatness, thereby being a mounted component, such as the second lens supporting member. 23.
  • the second filter element 24 provides flat mounting conditions to help improve optical axis uniformity of the second camera module unit 20.
  • the second circuit board 211 includes a second circuit board body 2111 and at least one second electronic component 2112, and the second electronic component 2112 protrudes from the second circuit board.
  • the main body 2111 is configured to cooperate with the operation of the second circuit board main body 2111.
  • the second pedestal 212 is integrally formed on the second circuit board main body 2111 and covers at least part of the second electronic component 2112, thereby reducing the occupied space of the second electronic component 2112.
  • the second electronic component 2112 is by way of example and not limitation, a resistor, a capacitor, a driver, or the like.
  • the second electronic component 2112 may not be disposed or the second electronic component 2112 may not protrude from the second circuit board body 2111, such as embedded in the first The second circuit board main body 2111, the present invention is not limited in this respect.
  • the types of the first circuit board main body 1111 and the second circuit board main body 2111 are selected from a soft board, a hard board, and a soft and hard board.
  • Each of the second electronic components 2112 may be mounted on an edge region of the second wiring board 211, such as outside the second photosensitive member 213, by being spaced apart from each other by, for example, an SMT process. It is worth mentioning that each of the second electronic components 2112 may be located on the same side or opposite side of the second circuit board 211, for example, in one specific example, the second photosensitive element 213 and each The second electronic component 2112 may be respectively located on the same side of the second circuit board 211, and the second photosensitive element 213 is mounted on the chip mounting area of the second circuit board 211, each of the The two electronic components 2112 are respectively mounted on the edge regions of the second wiring board 211 at intervals.
  • the second pedestal 212 covers each of the second electronic components 2112 after molding to isolate adjacent second electronic components 2112 and isolate the second electronic components by the second pedestal 212 2112 and the second photosensitive element 213.
  • the first and second bases can also be respectively disposed on the first and second circuit boards by means of glue mounting.
  • at least one of the first and second bases is disposed on the corresponding circuit board by integral molding.
  • two of the bases are integrally formed on the corresponding circuit board, or one of the bases is integrally formed on the corresponding circuit board, and the other of the bases is conventional.
  • the bracket is disposed on the corresponding circuit board by means of mounting.
  • first lens supporting element 13 and the second lens supporting element 23 can be implemented as a driving element or a barrel element to form a moving focus camera module or a fixed focus camera module.
  • the drive element is by way of example and not limitation, a voice coil motor, a piezoelectric motor or the like.
  • both the first camera module unit 10 and the second camera module unit 20 are The moving focus camera module, that is, the split array camera module 100 is composed of two moving focus camera modules.
  • the first camera module unit 10 is a dynamic focus camera module
  • the The two camera module unit 20 is a fixed focus camera module, that is, the split array camera module 100 is composed of a moving focus camera module and a fixed focus camera module.
  • the first lens supporting component 13 is implemented as a lens barrel component and the second lens 22 component is implemented as a driving component
  • the first camera module unit 1010 is a fixed focus camera module
  • the The two camera module unit 20 is a dynamic focus camera module.
  • the first lens supporting member 13 and the second lens supporting member 23 are both implemented as the barrel member
  • the first camera module unit 10 and the second camera module unit 20 are both Fixed focus camera module.
  • the first lens support element 13 or the second lens support element 23 when the first lens support element 13 or the second lens support element 23 is implemented as a drive element, the first lens support element 13 and the second The lens supporting member 23 is electrically connected to the first circuit board 111 or the second circuit board 211 to facilitate driving the first lens 12 or the second lens 22 to operate.
  • the first lens supporting member 13 and the second lens supporting member 23 may be electrically connected to the first circuit board 111 or the second circuit board 211 by providing pins, pads or leads or the like. .
  • the types of the first camera module unit 10 and the second camera module unit 20 can be configured according to requirements, so as to achieve better image acquisition effects by mutual cooperation, and the invention is not limited in this respect.
  • the first photosensitive element 113 and the second photosensitive element 213 of the first camera module unit 10 and the second camera module unit 20 The types may be the same or different, thereby forming camera module units of different functions.
  • FIG. 5 a cross-sectional view of a split-type array camera module 100 in accordance with a second preferred embodiment of the present invention.
  • the second pedestal 212 of the second photosensitive component 21 of the second camera module unit 20 integrally encapsulates at least part of the second non-the second photosensitive element 213 Photosensitive area 2132.
  • the second susceptor 212 integrally encapsulates the second circuit board 211 and the second photosensitive element 213 such that the second photosensitive element 213 is stably fixed and the The formable area of the second pedestal 212 is described.
  • the second pedestal 212 covers the second electrical connection element 2133.
  • the second pedestal 212 is molded in a manner of the photosensitive element.
  • the range in which integral molding can be performed is extended to the second non-photosensitive area 2132 of the second photosensitive element 213, thereby increasing the number without affecting the normal photosensitive operation of the second photosensitive element 213 a connection area at the bottom of the second pedestal 212, so that the second pedestal 212 and the second circuit board 211 and the second photosensitive element 213 are more stably connected, and the top portion may be other components, as described
  • the second lens 22, the second lens support member 23, etc. provide a larger mountable area.
  • the second electrical connection element 2133 is covered by the second pedestal 212, thereby avoiding external interference with the second electrical connection element 2133, and preventing the second electrical connection element 2133 from oxidizing or contaminating dust.
  • FIG. 6 is a cross-sectional view of a split-type array camera module 100 in accordance with a third preferred embodiment of the present invention.
  • the assembly body 30 includes a partition wall 35 disposed in the accommodating chamber 32 to partition the accommodating chamber 32 to accommodate each of the camera module units.
  • the partition wall 35 may be made of a material such as plastic, resin, rubber, metal, etc., in order to reduce electromagnetic interference of the first camera module unit 10 and the second camera module unit 20.
  • the partition wall 35 is fixedly coupled to the upper cover 33 such that when the upper cover 33 closes the receiving chamber 32, the partition wall 35 will be the first The camera module unit 10 and the second camera module unit 20 are isolated.
  • the partition wall 35 is fixedly connected to the side wall of the main body 31, and the receiving chamber 32 is divided into two parts to respectively accommodate the first camera module unit 10 and the The second camera module unit 20 is described. That is, when the first camera module unit 10 and the second camera module unit 20 are mounted to the assembly 30, the first camera module unit 10 and the second camera module The group unit 20 is isolated by the partition wall 35.
  • the partition wall 35 may also be other structures and materials, and the invention is not limited in this respect.
  • FIG. 7 is a cross-sectional view of a split-type array camera module 100 in accordance with a fourth preferred embodiment of the present invention.
  • the first pedestal 112 includes a first support member 1124 for supporting the mold during manufacture to prevent the first circuit board 111 or the first photosensitive element 113 from being damage. That is, during the manufacturing process, the manufacturing mold may be abutted against the first supporting member 1124 such that the mold does not directly contact the first wiring board 111 or the first photosensitive element 113, And the molding material is prevented from overflowing to the inside.
  • first support member 1124 may have an annular structure that conforms to the shape of the edge of the first base body 1121.
  • the first support element 1124 has elasticity, such as, but not limited to, a glue coating or a pad.
  • the second pedestal 212 includes a second support member 2124 for supporting the mold during manufacture to prevent damage to the second wiring board 211 or the second photosensitive element 213. That is, during the manufacturing process, the manufacturing mold may be abutted against the second support member 2124 such that the mold does not directly contact the first circuit board 111 or the second photosensitive element 213. And the molding material is prevented from overflowing to the inside.
  • the second supporting member 2124 may have an annular structure conforming to the shape of the edge of the second base body 2121.
  • the second support element 2124 has elasticity, such as, but not limited to, a glue coating or a pad.
  • the first camera module unit 10 includes a first support 15 for mounting other components, such as the first filter element 14, the first lens. 12 or the first lens support element 13.
  • the first mount 15 is mounted to the first base body 1121, and the first filter element 14 is mounted to the first mount 15.
  • the first mount 15 sinks within the first light window 1122 of the first pedestal 112 such that the position of the first filter element 14 sinks, close to the first
  • the photosensitive element 113 reduces the back focus occupancy of the first camera module unit 10 and reduces the required area of the first filter element 14.
  • the second holder 25 is mounted to the second base body 2121, and the second filter element 24 is mounted to the second holder 25.
  • the second mount 25 sinks within the second light window 2122 of the second pedestal 212 such that the position of the second filter element 24 sinks, near the second
  • the photosensitive element 213 reduces the back focus occupancy of the second camera module unit 20 and reduces the required area of the second filter element 24.
  • the array camera module may include only one of the supports, such as the first support 15 or the second support 25, as will be understood by those skilled in the art. Yes, the number of the supports is not a limitation of the present invention.
  • the first support 15 is mounted to the first mounting slot 1123 of the first base 112, and the second mount 25 is mounted to the second base 212.
  • the first base body 1121 and the second base body 2121 may be a platform structure, and the first support 15 and the second support 25 may also be combined. Without falling down, and being directly mounted to the platform structure of the first support 15 and the second support 25, those skilled in the art should understand that the mounting position and specific structure of the support It is not a limitation of the invention.
  • the holder may form the light window in cooperation with the base, that is, the base may have an opening and communicate with the outside, and the A holder may be added to the opening to form a closed window of light.
  • the mount can be extended to the circuit board body to form a closed light window.
  • the first abutment 15 and the second abutment 25 are integrally connected. That is, the portions of the first pedestal 15 and the second pedestal 25 are connected to each other so as to be mountable to the first pedestal 112 and the second pedestal 212 at one time, and provide relative Consistent installation conditions.
  • the second circuit board main body 2111 has a second sinking area 21111, and the second photosensitive element 213 is sunkenly disposed on the second The sinking area 21111 is arranged to reduce the relative heights of the second photosensitive element 213 and the second wiring board main body 2111.
  • the second sinker region 21111 can be implemented as a groove or a through hole. That is, the two sides of the second circuit board main body 2111 may be disconnected or connected.
  • the second sinker region 21111 is a groove
  • the second photosensitive member 213 is disposed at the bottom of the groove, and is electrically connected to the second circuit board main body 2111 through the second electrical connection member 2133.
  • the outer end of the second electrical connection element 2133 may be electrically connected to the groove bottom of the groove or may be electrically connected to the outer side of the second sinker region 21111, and the invention is not limited in this respect.
  • the top surface of the second photosensitive element 213 may coincide with the top surface of the second circuit board main body 2111, or be higher than the top surface of the second circuit board main body 2111, or lower than the second line.
  • the top surface of the plate main body 2111, that is, the present invention does not limit the sinking depth.
  • the second sinker region 21111 is a through hole, that is, both sides of the second circuit board 211 are communicated through the through hole.
  • the second circuit board 211 of the second camera module unit 20 includes a second bottom plate 1113 disposed on the bottom of the second circuit board main body 2111 so as to support the photosensitive element and enhance the The structural strength of the two circuit board main body 2111. That is, the second photosensitive element 213 is sunkly disposed in the second sinker region 21111 and supported by the bottom plate 1113.
  • the second photosensitive element 213 is electrically connected to the second wiring board main body 2111 through the second electrical connection element 2133.
  • the bottom plate 1113 may be a metal plate disposed on the bottom of the second circuit board main body 2111 by attaching.
  • the first susceptor 112 of the first photosensitive component 11 of the first camera module unit 10 integrally encapsulates the first photosensitive element 113 At least a portion of the first non-photosensitive region 1132.
  • the first susceptor 112 integrally encapsulates the first wiring board 111 and the first photosensitive element 113 such that the first photosensitive element 113 is stably fixed, and the The formable area of the first pedestal 112 is described.
  • the first pedestal 112 covers the first electrical connection element 1133.
  • the first pedestal 112 is molded into the photosensitive element in a manner that the first pedestal 112 is formed only on the first circuit board 111 in the first embodiment.
  • the range in which the integral molding can be performed is extended to the first non-photosensitive region 1132 of the first photosensitive member 113, thereby increasing the number without affecting the normal photosensitive operation of the first photosensitive member 113.
  • a connection area at the bottom of a pedestal 112 so that the first pedestal 112 and the first circuit board 111 and the first photosensitive element 113 can be more stably connected, and the top portion can be other components, as described
  • the first lens 12, the first lens support member 13, etc. provide a larger mountable area.
  • the electrical connection element is covered by the first pedestal 112, thereby avoiding external interference with the electrical connection element, and preventing the electrical connection element from oxidizing or contaminating dust to affect the imaging quality of the camera module unit.
  • the second pedestal 212 of the second photosensitive component 21 of the second camera module unit 20 integrally encapsulates at least a portion of the second non-photosensitive region 2132 of the second photosensitive element 213.
  • the second susceptor 212 integrally encapsulates the second circuit board 211 and the second photosensitive element 213 such that the second photosensitive element 213 is stably fixed and the The formable area of the second pedestal 212 is described.
  • the second pedestal 212 covers the second electrical connection element 2133.
  • the second circuit board main body 2111 has a second sinking area 21111, and the second photosensitive element 213 is sunkenly disposed in the second sinking area 21111 to facilitate lowering.
  • the second sinker region 21111 can be implemented as a groove or a through hole. That is, the two sides of the second circuit board main body 2111 may be disconnected or connected.
  • the second sinker region 21111 is a groove
  • the second photosensitive member 213 is disposed at the bottom of the groove, and is electrically connected to the second circuit board main body 2111 through the second electrical connection member 2133.
  • the outer end of the second electrical connection element 2133 may be electrically connected to the groove bottom of the groove or may be electrically connected to the outer side of the second sinker region 21111, and the invention is not limited in this respect.
  • the top surface of the second photosensitive element 213 may coincide with the top surface of the second circuit board main body 2111, or be higher than the top surface of the second circuit board main body 2111, or lower than the second line.
  • the top surface of the plate main body 2111, that is, the present invention does not limit the sinking depth.
  • the second sinker region 21111 is a through hole, that is, both sides of the second circuit board 211 are communicated through the through hole.
  • the second photosensitive element 213 and the second electrical connection element 2133 are integrally packaged by the second pedestal 212, so the second photosensitive element can be fixed by the second pedestal 212. 213.
  • a second bottom plate may be disposed at the bottom of the second circuit board 211, or the second bottom plate may not be disposed.
  • the first susceptor 212 of the first photosensitive component 21 of the first camera module unit 20 integrally encapsulates the first photosensitive element 213 At least a portion of the first non-photosensitive region 2132.
  • the first susceptor 212 integrally encapsulates the first wiring board 211 and the first photosensitive element 213 such that the first photosensitive element 213 is stably fixed and the seat is enlarged.
  • a formable region of the first pedestal 212 is described.
  • the first pedestal 212 covers the first electrical connection element 2133.
  • the first circuit board body 1111 includes a first board body 11112 and a second board body 11113.
  • the first board body 11112 and the second board body 11113 are fixedly connected by a connecting medium 11114.
  • the first plate 11112 may be a hard plate
  • the second plate 11113 may be a soft plate
  • the connecting medium 11114 may be an anisotropic conductive adhesive.
  • the first board 11113 may further include an interface end, such as a connector, to facilitate electrical connection to an electronic device.
  • the first base body 1121 is integrally formed with the first plate body 11112
  • the second plate body 11113 is overlapped with one end of the first plate body 11112
  • the first circuit board body 1111 may be formed by the first board body 11112 and the second board body 11113, and then integrally formed, or may be first in the first board body 11112.
  • the first plate body 11113 is electrically connected to the first plate body 11112, for example, and is fixed to the first plate body 11112 by the anisotropic conductive adhesive.
  • the second circuit board body 2111 can also be constructed in the above manner, and the present invention is not limited in this regard.
  • the second circuit board main body 2111 is provided with a second reverse groove 21115, and the photosensitive element is mounted on the second reverse groove 21115 in an inverted manner.
  • the second photosensitive element 213 is attached to the second wiring board main body 2111 by means of an FC (Flip Chip).
  • FC Flexible Chip
  • the second photosensitive element 213 is mounted from the second circuit board main body 2111 to the second circuit board main body 2111, and the second photosensitive element 213 is second.
  • the photosensitive region 2131 is photo-sensitized through the upper opening of the second light window 2122 and the second reverse groove 21115.
  • the first camera module unit 10 can also be configured in the above manner.
  • FIG. 13 is a cross-sectional view of a split-type array camera module 100 in accordance with a tenth preferred embodiment of the present invention.
  • the second pedestal 212 of the second photosensitive component 21 of the second camera module unit 20 integrally encapsulates the second photosensitive element 213 At least a portion of the second non-photosensitive region 2132.
  • the second susceptor 212 integrally encapsulates the second circuit board 211 and the second photosensitive element 213 such that the second photosensitive element 213 is stably fixed and the The formable area of the second pedestal 212 is described.
  • the second pedestal 212 covers the second electrical connection element 2133.
  • the second base 212 includes a second extension mounting portion 2125 extending at least partially upward from the second base body 2121 and forming a second limiting slot 21251 for limiting the mounting of the second base.
  • Lens 2224 or the second lens support element 2325 In this embodiment of the invention, the second lens 22 is mounted to the second extension mounting portion 2125, and the second extension mounting portion 2125 replaces the second lens support member 23 to form a certain focus Camera module.
  • the first camera module unit 10 may also be configured as described above.
  • FIG. 14 is a schematic diagram of a split-type array camera module 100 in accordance with an eleventh preferred embodiment of the present invention.
  • the first circuit board main body 1111 and the second circuit board main body 2111 are integrally connected to form a unitary structure
  • a pedestal 112 and the second pedestal 212 are respectively formed in different regions of the overall structure, that is, regions corresponding to the first circuit board main body 1111 and the second circuit board 211.
  • the split-type array camera module 100 is composed of two camera module units of different heights, and the first camera module unit 10 and the second camera module unit 20 The relative position can be arranged according to the needs. For example, referring to FIG. 15A, the top ends of the first camera module unit 10 and the second camera module unit 20 are aligned, and there is a height difference at the bottom. For example, referring to FIG. 15B, the first camera module is made. The unit 10 and the bottom of the second camera module unit 20 are identical, and there is a height difference at the top.
  • two of the first camera module unit 10 and the second camera module unit 20 are caused.
  • the ends are inconsistent and there is a height difference at both ends. It should be understood by those skilled in the art that the type and height of the camera module unit are not limited by the present invention.
  • the split-type array camera module 100 is composed of two camera module units of different sizes, and the first camera module unit 10 and the second camera module unit 20 The relative position can be arranged according to the needs.
  • the structure of the assembly body 30 may vary with the size of the camera module, such as a position where the cross section of the camera module is large, so that the opening area of the assembly body 30 is large, and the camera module unit is The position of the cross section is small, so that the opening area of the assembly body 30 is small, so as to adapt to the size of each of the camera module units.
  • FIG. 17 is a block diagram of a method of fabricating a split-type array camera module 100 in accordance with the above-described preferred embodiment of the present invention.
  • the present invention provides a method 1000 for fabricating a split array camera module, the method comprising the steps of:
  • Each camera module unit is assembled by an assembly 30.
  • the method includes the following steps:
  • a base is integrally formed on a circuit board.
  • a lens is disposed on the photosensitive path of the photosensitive element
  • the step 10012 may be before the step 10011 or after the step 10011.
  • the method may include the steps of: integrally forming the base on the circuit board and the photosensitive element, for example, integrally molding a base on a circuit board and at least a portion of the non-photosensitive area of a photosensitive element.
  • the circuit board and the photosensitive element are integrally packaged.
  • the method includes the following steps:
  • the present invention further provides an electronic device 300, wherein the electronic device includes an electronic device body 200 and at least one split array camera module 100, wherein the split array camera module 100 is respectively disposed on the electronic device body 200, for acquiring images.
  • the type of the electronic device body 200 is not limited.
  • the electronic device body 200 may be a smart phone, a wearable device, a tablet computer, a notebook computer, an e-book, a personal digital assistant, a camera, and a monitor. Any device or the like that can be configured with the camera module. It will be understood by those skilled in the art that although the electronic device body 200 is implemented as a smart phone in FIG. 35, it does not constitute a limitation on the content and scope of the present invention.

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Abstract

L'invention concerne un module de réseau photographique séparable comprenant : deux unités modulaires photographiques ou plus, au moins une des deux unités modulaires photographiques ou plus comprenant un module de capteur photosensible et une lentille. Le module de capteur photosensible comprend au moins une carte de circuit imprimé, un capteur d'image et une base. Le capteur d'image est électriquement relié à la carte de circuit imprimé. La base forme une partie intégrante de la carte de circuit imprimé et est configurée pour être une fenêtre pour fournir un trajet optique au capteur d'image. La lentille est située au niveau du trajet optique vers le capteur d'image. Le module de réseau photographique séparable comprend en outre une partie d'assemblage dans laquelle les unités modulaires photographiques respectives sont fixées pour former un ensemble.
PCT/CN2018/070009 2016-12-31 2018-01-02 Module de réseau photographique séparable et son procédé de fabrication WO2018121793A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201611269070.2A CN108270949B (zh) 2016-12-31 2016-12-31 分体式阵列摄像模组及其制造方法
CN201621491163.5U CN206807579U (zh) 2016-12-31 2016-12-31 分体式阵列摄像模组
CN201621491163.5 2016-12-31
CN201611269070.2 2016-12-31

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WO2018121793A1 true WO2018121793A1 (fr) 2018-07-05

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111050057A (zh) * 2020-01-03 2020-04-21 昆山丘钛微电子科技有限公司 摄像头模组及电子产品
CN113114913A (zh) * 2021-04-27 2021-07-13 维沃移动通信有限公司 摄像头及电子设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100044814A1 (en) * 2008-08-25 2010-02-25 Cheng Uei Precision Industry Co., Ltd. Camera Module and Manufacturing Method Thereof
CN105681637A (zh) * 2016-03-15 2016-06-15 宁波舜宇光电信息有限公司 阵列摄像模组及其感光组件和制造方法
CN105744131A (zh) * 2016-03-15 2016-07-06 宁波舜宇光电信息有限公司 阵列摄像模组及其线路板组件和制造方法
CN205545559U (zh) * 2015-12-30 2016-08-31 南昌欧菲光电技术有限公司 成像模组及电子装置
CN206807579U (zh) * 2016-12-31 2017-12-26 宁波舜宇光电信息有限公司 分体式阵列摄像模组

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100044814A1 (en) * 2008-08-25 2010-02-25 Cheng Uei Precision Industry Co., Ltd. Camera Module and Manufacturing Method Thereof
CN205545559U (zh) * 2015-12-30 2016-08-31 南昌欧菲光电技术有限公司 成像模组及电子装置
CN105681637A (zh) * 2016-03-15 2016-06-15 宁波舜宇光电信息有限公司 阵列摄像模组及其感光组件和制造方法
CN105744131A (zh) * 2016-03-15 2016-07-06 宁波舜宇光电信息有限公司 阵列摄像模组及其线路板组件和制造方法
CN206807579U (zh) * 2016-12-31 2017-12-26 宁波舜宇光电信息有限公司 分体式阵列摄像模组

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111050057A (zh) * 2020-01-03 2020-04-21 昆山丘钛微电子科技有限公司 摄像头模组及电子产品
CN113114913A (zh) * 2021-04-27 2021-07-13 维沃移动通信有限公司 摄像头及电子设备

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