WO2018120202A1 - Module de caméra médicale haute définition - Google Patents

Module de caméra médicale haute définition Download PDF

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Publication number
WO2018120202A1
WO2018120202A1 PCT/CN2016/113905 CN2016113905W WO2018120202A1 WO 2018120202 A1 WO2018120202 A1 WO 2018120202A1 CN 2016113905 W CN2016113905 W CN 2016113905W WO 2018120202 A1 WO2018120202 A1 WO 2018120202A1
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WO
WIPO (PCT)
Prior art keywords
signal processing
digital signal
image sensor
board
camera module
Prior art date
Application number
PCT/CN2016/113905
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English (en)
Chinese (zh)
Inventor
龚爱华
Original Assignee
广州华友明康光电科技有限公司
华亘致远（香港）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 广州华友明康光电科技有限公司, 华亘致远（香港）有限公司 filed Critical 广州华友明康光电科技有限公司
Priority to PCT/CN2016/113905 priority Critical patent/WO2018120202A1/fr
Publication of WO2018120202A1 publication Critical patent/WO2018120202A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the present invention relates to the field of medical devices, and in particular to a high-definition medical camera module.
  • the medical cameras on the top are mostly standard definition, and the digital signal processing circuit (DSP, DigitalSignalProcesso) has certain heating problems.
  • DSP DigitalSignalProcesso
  • an object of the present invention is to provide a high-definition medical camera module capable of solving the heat generation problem of the digital signal processing circuit of the medical camera.
  • a high-definition medical camera module comprising: a digital signal processing development board (DSP development board, DigitalSignalProcesso), a digital signal processing chip (DSP chip, DigitalSignalProcesso), a low dropout linear regulator (LDO, low dropout regulator) And an image sensor board, a lens and a light source, wherein the digital signal processing development board is provided with the digital signal processing chip, and the low voltage plug linear regulator is disposed on the other side of the digital processor board, and the image sensor board The acquired data is transmitted to the digital signal processing development board, the lens being coupled to an image sensor panel that provides illumination to the image sensor panel.
  • DSP development board DigitalSignalProcesso
  • DSP chip DigitalSignalProcesso
  • LDO low dropout linear regulator
  • the method comprises: a metal sleeve, the digital signal processing development board, and a digital signal A processing chip, a low dropout linear regulator, an image sensor panel, a lens, and a light source are disposed within the metal sleeve.
  • the method comprises: a thermal conductive silica gel, wherein the thermal conductive silica gel is in contact with the digital signal processing chip and the metal sleeve, respectively.
  • the image sensor board is a CMOS image sensor board.
  • the method further includes: a transmission line connected to the digital signal processing development board, the transmission line is further connected to the light source, and the transmission line supplies power to the light source.
  • the transmission is transmitted by wire.
  • the digital signal processing development board is vertically connected to the image sensor board.
  • the light source is an LED light, and the number of the LED lights is four.
  • the digital signal processing development board is vertically connected to the image sensor board.
  • the lens is a plastic lens.
  • the present invention has the beneficial effects that the present invention reduces digital signal processing chips by externally placing a low dropout regulator (LDO) on a digital signal processing chip (DSP chip, DigitalSignalProcesso).
  • LDO low dropout regulator
  • DSP chip DigitalSignalProcesso
  • the power consumption of the digital signal processing chip is conducted to the metal sleeve through the thermal conductive silica gel to solve the heat problem of the digital signal processing circuit of the medical camera.
  • FIG. 1 is a schematic structural view of a high definition medical camera module according to a preferred embodiment of the present invention.
  • a high-definition medical camera module as shown in FIG. 1 includes:
  • a digital signal processing development board 1 a digital signal processing chip 2, a low-dropout linear regulator 3, an image sensor board 4, a lens 5, and a light source 6.
  • the digital signal processing development board 1 is provided with the digital signal processing chip 2 on one side.
  • the digital signal processing chip is electrically mounted on the digital signal processing development board 1 to enable normal operation, and the low voltage insertion linear regulator 3 is disposed on the other side of the digital signal processing development board 1
  • the linear regulator 3 is electrically connected to the digital signal processing development board 1, and the image sensor board 4 transmits the collected data to the digital signal processing development board 1.
  • the digital signal processing development board 1 and The image sensor board 4 mainly has two interfaces, namely: an I2C interface and an MIPI interface, and the I2C interface is used to configure an image sensor board 4 for acquiring RGB data from the image sensor board 4, so the number
  • the signal processing development board 1 and the image sensor board 4 are specifically connected through an I2C interface and a MIPI interface, and the picture sensor board is specifically a CMOS image sensor board.
  • the low-dropout linear regulator (LDO, hereinafter not referred to as abbreviated statement) 3 uses TI's dual ultra-small low-dropout linear regulator (LDO), and the dual LDO size is: 1.5 mm long.
  • the lens 5 is connected to the image sensor board 4, the lens 5 is specifically a plastic lens, and the light source 6 provides illumination for the image sensor board 4, the light source 6 For the LED lamp, the number is preferably four or six or more.
  • a high-definition medical camera module as shown in FIG. 1 further includes: a metal sleeve 8, a conductor silicone 7 and a transmission line 9, the digital signal processing development board 1, a digital signal processing chip 2, and a low-dropout linear regulator 3.
  • the image sensor board 4, the plastic lens 5, and the LED lamp 6 are disposed in the metal sleeve 8, and the entire camera is surrounded by a metal sleeve 8, which has a diameter of 6 mm.
  • the thermal conductive silicone 7 is in contact with the digital signal processing chip 2 and the metal sleeve 8, respectively, and the transmission line 9 is 6 unshielded transmission lines, specifically wire transmission, which saves a lot of cost, and the invention discloses a
  • the HD medical camera module can be used once.
  • the external source provides a constant current source for the entire camera through the transmission line 6, and the transmission line 6 supplies a constant current source of an appropriate value to the light source 6, which generates a stable light source, and the image sensor board 4 is illuminated by the light source 6, Real-time high-definition RGB data is generated, and the data is transmitted to the digital signal processing development board 1, and signal processing and compression are performed. After the compression is completed, the data is transmitted to the external connected computer through the transmission line 9.
  • the low-dropout linear regulator 3 supplies power to the sensor on the image sensor board 4.
  • a part of the digital signal processing chip 2 supplies power to itself, and the other part supplies power to the sensor on the image sensor board 4. A large amount of heat will be generated.
  • the current flowing into the digital signal processing development board 1 needs to supply power to the DSP, and the image sensor board 4 does not need to pass through the digital signal processing development board 1
  • the heat dissipation pressure of the digital signal processing chip 2 package is reduced, and the digital signal processing chip 2 conducts heat to the metal sleeve 8 through the thermal conductive silica gel 7, thereby reducing internal heat.
  • a high-definition medical camera module which adopts a linearity of low-drop difference
  • the regulator (LDO, low dropout regulator) is externally placed on the digital signal processing chip (DSP chip, DigitalSignalProcesso) to reduce the power consumption of the digital signal processing chip.
  • DSP chip DigitalSignalProcesso
  • the digital signal processing chip transmits heat to the metal sleeve through the thermal conductive silica gel to solve the medical treatment. The heating problem of the digital signal processing circuit of the camera.

Abstract

La présente invention concerne un module de caméra médicale haute définition, caractérisé en ce qu'il comprend une carte de développement de traitement de signal numérique (1), une puce de traitement de signal numérique (2), un régulateur de tension linéaire à faible chute de tension (3), une carte de capteur d'image (4), une lentille de caméra (5) et une source de lumière (6); une surface de la carte de développement de traitement de signal numérique (1) est pourvue de la puce de traitement de signal numérique (2); l'autre surface de la carte de développement de traitement de signal numérique (1) est pourvue du régulateur de tension linéaire à faible chute de tension (3); la carte de capteur d'image (4) transmet les données collectées à la carte de développement de traitement de signal numérique (1); la lentille de caméra (5) est connectée à la carte de capteur d'image (4); et la source de lumière (6) fournit un éclairage pour la carte de capteur d'image (4). Le régulateur de tension linéaire à faible chute de tension (3) est disposé à l'extérieur de la puce de traitement de signal numérique (2), réduisant ainsi la consommation d'énergie de la puce de traitement de signal numérique (2); et la puce de traitement de signal numérique (2) conduit la chaleur vers un manchon métallique par l'intermédiaire d'une couche de silicone thermo-conductrice, ce qui permet de résoudre le problème de génération de chaleur d'un circuit de traitement de signal numérique de la caméra médicale.
PCT/CN2016/113905 2016-12-30 2016-12-30 Module de caméra médicale haute définition WO2018120202A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/113905 WO2018120202A1 (fr) 2016-12-30 2016-12-30 Module de caméra médicale haute définition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/113905 WO2018120202A1 (fr) 2016-12-30 2016-12-30 Module de caméra médicale haute définition

Publications (1)

Publication Number Publication Date
WO2018120202A1 true WO2018120202A1 (fr) 2018-07-05

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PCT/CN2016/113905 WO2018120202A1 (fr) 2016-12-30 2016-12-30 Module de caméra médicale haute définition

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WO (1) WO2018120202A1 (fr)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100225788A1 (en) * 2009-03-05 2010-09-09 Novatek Microelectronics Corp. Circuit and method for processing image abnormality caused by power supply
CN202634549U (zh) * 2012-04-13 2012-12-26 深圳市度申科技有限公司 一种vga工业相机
CN203057353U (zh) * 2012-12-26 2013-07-10 沈阳聚德视频技术有限公司 高清智能视觉一体机
CN203554567U (zh) * 2013-11-14 2014-04-16 东莞光阵显示器制品有限公司 5.5mm直径30万像素模拟输出模块产品
CN105338234A (zh) * 2015-12-16 2016-02-17 北京博视中自科技有限公司 一种内窥式智能相机
CN105487628A (zh) * 2016-01-12 2016-04-13 建荣集成电路科技(珠海)有限公司 Usb线供电电源系统及usb线供电方法
CN106791319A (zh) * 2016-12-30 2017-05-31 广州华友明康光电科技有限公司 一种高清医疗摄像头模组
CN206364905U (zh) * 2016-12-30 2017-07-28 广州华友明康光电科技有限公司 一种高清医疗摄像头模组

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100225788A1 (en) * 2009-03-05 2010-09-09 Novatek Microelectronics Corp. Circuit and method for processing image abnormality caused by power supply
CN202634549U (zh) * 2012-04-13 2012-12-26 深圳市度申科技有限公司 一种vga工业相机
CN203057353U (zh) * 2012-12-26 2013-07-10 沈阳聚德视频技术有限公司 高清智能视觉一体机
CN203554567U (zh) * 2013-11-14 2014-04-16 东莞光阵显示器制品有限公司 5.5mm直径30万像素模拟输出模块产品
CN105338234A (zh) * 2015-12-16 2016-02-17 北京博视中自科技有限公司 一种内窥式智能相机
CN105487628A (zh) * 2016-01-12 2016-04-13 建荣集成电路科技(珠海)有限公司 Usb线供电电源系统及usb线供电方法
CN106791319A (zh) * 2016-12-30 2017-05-31 广州华友明康光电科技有限公司 一种高清医疗摄像头模组
CN206364905U (zh) * 2016-12-30 2017-07-28 广州华友明康光电科技有限公司 一种高清医疗摄像头模组

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