WO2018098645A1

WO2018098645A1 - Production process for anti-tear rfid tag

Info

Publication number: WO2018098645A1
Application number: PCT/CN2016/107817
Authority: WO
Inventors: 方钦爽
Original assignee: 温州沸鼎智能科技有限公司
Priority date: 2016-11-30
Filing date: 2016-11-30
Publication date: 2018-06-07

Abstract

A production process for an anti-tear radio frequency identification (RFID) tag, relating to the field of radio frequency identification, and comprising the following steps: binding a chip on an RFID tag antenna; cutting a carrier layer of the antenna having the bound RFID tag, and controlling a cutting depth so that the carrier layer is either cut through or cutting lines which do not cut through are formed, thus controlling the RFID tag antenna so that the same is not cut off; after cutting, the RFID tag antenna bound with the chip is attached to a surface paper layer to form an RFID tag; during the cutting process, the path of at least one cutting line intersects the path of the RFID tag antenna. Said process has the advantages of a simple production process and low manufacturing costs, while a grid structure of the carrier layer allows fragments formed following the cutting of the carrier layer to be easily torn off along with the outer packaging, thus the aim of preventing tearing is achieved, and anti-tear and anti-transfer effects of an RFID tag are improved.

Description

Production process of tamper-evident RFID tag

Technical field

The invention relates to the field of radio frequency identification, in particular to a production process of an anti-tear RFID tag.

Background technique

RFID is a wireless communication technology that can identify specific targets and read and write related data through radio signals without identifying mechanical or optical contact between the system and a specific target. The radio signal is modulated by the electromagnetic field of the radio frequency. It is transmitted from the label attached to the item to automatically identify and track the item. Some labels can receive energy from the electromagnetic field emitted by the identifier when identifying, and do not need the battery; also the label itself has power and can Actively emits radio waves. The tag contains electronically stored information that can be identified within a few meters. Unlike a bar code, the RF tag does not need to be within the line of sight of the recognizer or it can be embedded within the object being tracked.

Radio frequency identification electronic tag technology is widely used, typical applications: animal wafer, access control, air package identification, document tracking management, parcel tracking identification, animal husbandry, logistics management, mobile commerce, long-distance running anti-counterfeiting, sports timing, ticket management, automotive Chip anti-theft device, parking lot control, production line automation, material management and other fields.

At the same time, with the increasing popularity of radio frequency tags, RFID tag products are also making progress in the anti-tear manufacturing process. The existing tamper-evident RFID tag manufacturing process mainly includes:

1. The silver paste is printed on the wrapping paper, and the silver paste line forms an RFID antenna. However, this method has the disadvantages of inconsistent production quality and unstable identification effect. At the same time, the silver paste is easily hardened after being used for a long time, and the phenomenon that the RFID tag has failed due to the end of the product life is not terminated.

2. Before making an RFID tag, it is necessary to use a cost-effective dedicated RFID tag fragile antenna. In the production process, the carrier layer of the RFID tag antenna must also be removed. The method of generating such a method is complicated, the processing efficiency is not high, and the production cost is high.

3. The four corners of the RFID tag are cut with a mold, so that the cutting opening of the RFID tag is saw-toothed, so that it is easy to tear when it is opened. However, since the cutting area can only be in a blank area without an RFID antenna, there is a problem that it cannot be torn (the RFID tag fails).

Summary of the invention

The invention is directed to the shortcomings of the prior art that the RFID tag can not be tamper-evidently provided, and provides a production process of the anti-tear RFID tag.

In order to solve the above technical problems, the present invention has been solved by the following technical solutions.

A production process for tamper-evident RFID tags, comprising the following steps:

Binding the chip on the RFID tag antenna;

The carrier layer to which the RFID tag antenna is attached is cut, and the depth of the cut is controlled, the carrier layer is cut through or the cut line is formed in an uncut state, and the RFID tag antenna is controlled not to be cut.

Preferably, after cutting, the RFID tag antenna bound to the chip is bonded to the face paper layer to form an RFID tag.

Preferably, at least one of the cut passes intersects the RFID tag antenna line during the cutting process.

Preferably, the cutting depth is controlled to select a cutting method that is easy to cut through the carrier layer or form a cutting line without cutting the RFID tag antenna.

Preferably, the RFID tag antenna is placed at a position below the carrier layer, and the cutting direction is cut from the upper carrier layer toward the lower RFID tag antenna.

Preferably, the cutting device selected for the cutting method selected is a laser cutting machine.

Preferably, the laser cutting machine has a wavelength of 10.6 um.

Preferably, the carrier layer is made of a PET material.

Laser cutting uses laser dicing. Laser dicing uses a high-energy-density laser to scan the surface of a brittle material, causing the material to evaporate out of a small groove and then apply a certain pressure. The brittle material will follow the small groove. split. Lasers for laser scribing are generally Q-switched lasers and CO2 lasers. Controlling the fracture is a steep temperature distribution created by laser engraving, creating local thermal stresses in the brittle material that cause the material to break along the small grooves.

Laser cutting processing replaces the traditional mechanical knife, with high precision, fast cutting, not limited to cutting pattern limitation, automatic typesetting saves materials, smooth cut, low processing cost, etc. The mechanical part of the laser head has no contact with the workpiece, at work. The surface of the workpiece will not be scratched; the laser cutting speed is fast, the incision is smooth and flat, and generally no subsequent processing is required; the cutting heat affected zone is small, the sheet deformation is small, the slit is narrow (0.1 mm~0.3 mm); the slit has no mechanical stress. No shear burr; high processing precision, good repeatability, no damage to the surface of the material; NC programming, can process any plan, can cut the whole board with large format, no need to open the mold, economic and time saving.

A conventional carrier layer with an RFID tag antenna is attached to the face paper layer to form an RFID tag. If the film is cut at four corners (cut or cut through), since the face paper layer is often the outermost surface layer, the upper surface layer is The pattern is often attached, and the shape is cut to affect the appearance. At the same time, the four corners are cut to avoid the RFID tag antenna. If the RFID tag antenna area is cut, the integrity of the RFID tag antenna is directly damaged, and if the RFID tag antenna is avoided, Then even if the four corners are cut, it is only a small extent of damage, or more precisely just the damage outside the area of the RFID tag antenna. If you are careful, you can transfer the entire label.

The invention selects a new method for cutting the carrier layer bound with the RFID tag antenna. The RFID tag antenna is above the carrier layer, and the cutting direction is cutting from the lower carrier layer to the upper RFID tag antenna to control the cutting depth. Mainly to select the cutting method, especially "sensitive" to the carrier layer, or to cut through the carrier layer or form an uncut state cutting line, and control the RFID tag antenna made of materials such as copper and aluminum is not cut, mainly However, it is not limited to the purpose of melting (or semi-melting) the carrier layer without melting the RFID tag antenna based on the different thermal melting point temperatures of the carrier layer and the copper-aluminum.

Based on the above ideas, the selection of the method and the selection of the device can be performed.

Since the laser cutting machine has the above characteristics, the above-mentioned technical effects can be achieved by selecting a laser cutting machine having a wavelength of 10.6 um.

Even if the carrier layer is cut, the carrier layer to which the RFID tag antenna is attached is bonded to the face paper layer to form an RFID tag, and the carrier layer which is cut after bonding is adhered to the paper layer or adhered to other carriers. Therefore, the cut carrier layer is not scattered or the position or the like is changed.

The present invention has the significant technical effect by adopting the above technical solution: the invention makes the structure of the carrier layer fragmented and meshed by cutting the carrier layer of the outer layer of the RFID tag. Through this structural change, it has the following advantages:

1. In normal use, when the customer uncovers the wrapping paper and the packaging tape, due to the gridded structure of the carrier layer, the fragments after the carrier layer is cut are easily uncovered with the outer packaging, thereby achieving the ineffectiveness of the tearing. The purpose is to improve the anti-tear and anti-transfer effect of the RFID tag.

2. The criminals want to remove the RFID tag on the outer packaging of the genuine product and transfer it to the outer packaging of the counterfeit product. Because the fragmented carrier layer is pasted and wrapped on the outer packaging, it is easy to control the force and it is easy to be The tearing of the RFID tag causes the RFID tag to be destroyed, so that the RFID tag cannot be transferred, and the authenticity rate of the goods on the market is guaranteed.

3, the entire process is more convenient, to ensure the high yield requirements of RFID electronic tag production, so it is suitable for low-cost, high-volume production, improve processing efficiency, lower processing costs, and reduce production costs. Low cost means that RFID tags are used in large scale in various fields.

detailed description

Example 1

Attaching the RFID tag antenna to the carrier layer;

The carrier layer bound with the RFID tag antenna is cut, the RFID tag antenna is above the carrier layer, the carrier layer is made of PET material, the cutting depth is controlled, the carrier layer is cut through, and the RFID tag antenna is not cut, the cutting process Among them, there are three cutting paths that intersect the RFID tag antenna line. The cutting depth is controlled to select a cutting method that cuts through the carrier layer without cutting the RFID tag antenna.

The RFID tag antenna is placed at a position below the carrier layer, and the cutting direction is cut from the upper carrier layer toward the lower RFID tag antenna. The cutting direction is from the top to the bottom. The cutting direction is better from the bottom to the top. If the cutting is from the bottom to the top, the laser will directly contact the RFID tag antenna, which will cause a slight burn to the RFID tag antenna. In the opposite direction, the carrier layer shields the RFID tag antenna from being easily burned and also protects the operator's eyes.

The cutting device selected for the cutting method is a laser cutting machine. The wavelength of the laser cutting machine is 10.6 um. The laser cutting by the wavelength laser has a cutting effect only on the carrier layer, and the metal is not damaged, and the RFID tag is protected. The main structure of the antenna.

After cutting, the RFID tag antenna of the bonded chip is bonded to the face paper layer to form an RFID tag.

Example 2

A production process of the tamper-evident RFID tag differs from the first embodiment in that the carrier layer is not cut to form a cut line in an uncut state.

The invention has the advantages of high precision by dividing the carrier layer on the RFID tag and cutting by using a laser device. Compared with the conventional die, the laser device can only be cut in the carrier layer region where the RFID tag antenna is not coincident. The carrier layer on the RFID tag antenna is cut to have a good cutting effect. Such a structure is easier to uncover when used, making the RFID tag more vulnerable to damage, and then returning to the merchant, the RF reader does not reach the RF signal, and the purpose of verifying whether the product is opened is achieved.

In summary, the above are only preferred embodiments of the present invention, and all changes and modifications made by the scope of the present invention should be covered by the present invention.

Claims

A production process for a tear-proof RFID tag, comprising the steps of:

Binding the chip on the RFID tag antenna;

2 . The production process of the tamper-evident RFID tag according to claim 1 , wherein after the cutting, the RFID tag antenna bound to the chip is bonded to the face paper layer to form an RFID tag. 3 .

3. A process for producing a tamper-evident RFID tag according to claim 1 or 2, wherein at least one of the cut paths intersects the RFID tag antenna line during the cutting process.

4 . The production process of the tamper-evident RFID tag according to claim 3 , wherein the cutting depth is controlled to select a cutting method that is easy to cut through the carrier layer or form a cutting line, and does not cut the RFID tag antenna .

The process for producing a tamper-evident RFID tag according to claim 1 or 2, wherein the RFID tag antenna is placed at a position below the carrier layer, and the cutting direction is RFID from the upper carrier layer downward. The tag antenna is cut in the direction.

6. The process for producing a tamper-evident RFID tag according to claim 4, wherein the cutting device selected for the cutting method is a laser cutting machine.

7. The process for producing a tamper-evident RFID tag according to claim 6, wherein the laser cutting machine has a wavelength of 10.6 um.

8. The process for producing a tamper-evident RFID tag according to claim 1, wherein the carrier layer is made of a PET material.