WO2018090900A1 - Method and apparatus for measuring arrival time of high-energy photons - Google Patents

Method and apparatus for measuring arrival time of high-energy photons Download PDF

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Publication number
WO2018090900A1
WO2018090900A1 PCT/CN2017/110864 CN2017110864W WO2018090900A1 WO 2018090900 A1 WO2018090900 A1 WO 2018090900A1 CN 2017110864 W CN2017110864 W CN 2017110864W WO 2018090900 A1 WO2018090900 A1 WO 2018090900A1
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sensor unit
time
visible light
detected
energy
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PCT/CN2017/110864
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French (fr)
Chinese (zh)
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龚政
赵指向
许剑锋
翁凤花
黄秋
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中派科技(深圳)有限责任公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/003Scintillation (flow) cells
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05GX-RAY TECHNIQUE
    • H05G1/00X-ray apparatus involving X-ray tubes; Circuits therefor
    • H05G1/08Electrical details
    • H05G1/26Measuring, controlling or protecting

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  • the present invention relates to the field of photon measurement, and in particular to a method and apparatus for measuring high energy photon arrival time.
  • detector systems In the field of high-energy photons (eg, X-ray, gamma photon, etc.) detection, detector systems typically consist of components such as scintillation crystals, photosensors, and readout circuitry.
  • the positron emission imaging system will be described below as an example.
  • scintillation crystals such as barium strontium citrate (BGO), strontium silicate (LYSO), lanthanum bromide (LaBr3), etc., can convert gamma photons into visible light subgroups.
  • Photoelectric sensors such as photomultiplier tubes (PMTs), silicon photomultiplier tubes (SiPMs), avalanche photodiodes (APDs), etc., can convert optical signals of the visible sub-group into electrical signals.
  • the readout circuit can obtain the energy of the gamma photon and the time the gamma photon reaches the detector system (ie, the arrival time of the gamma photon) by measuring the electrical signal output by the photosensor.
  • the detector system can be divided into a discrete crystal based detector system and a continuous crystal based detector system. Due to the complexity of the readout circuit, crystal surface treatment, etc., in the commercial positron emission imaging system, a discrete crystal based detector system is used.
  • the scintillation crystal layer of the discrete crystal based detector system consists of a discrete crystal array.
  • a 10 mm x 3 mm x 20 mm crystal can be used to form a 10 x 10 array with a total crystal array size of 30 mm x 30 mm x 20 mm.
  • decoding discrete crystal the gamma photon hits
  • the time measurement accuracy of the detector system based on discrete crystals is affected by the intrinsic time performance of the crystal and the size of the crystal (the gamma photons are converted into visible sub-groups at different positions in the crystal, and the time of these visible sub-groups reaching the photosensor is different), The influence of the response time stability (jitter) of the photoelectric sensor and the time measurement accuracy of the readout circuit.
  • the most important bottleneck is the response time stability of photoelectric sensors. Due to the existence of this bottleneck, the detector system consisting of the most commonly used strontium silicate (LSO) crystals (3 mm ⁇ 3 mm ⁇ 30 mm) In theory, the optimal time resolution cannot be better than 70ps.
  • the actual commercial positron emission imaging system has a time resolution of about 500 ps, and the optimal is not better than 320 ps.
  • a method for measuring high energy photon arrival time includes: obtaining an arrival time associated with a photon generated by a high-energy photon and a scintillation crystal detected by each sensor unit in the photosensor array, wherein the scintillation crystal is a continuous crystal, and the photosensor array includes a plurality of sensor units coupled to the scintillation crystal; obtaining each of the selected at least partial sensor units in the photosensor array based on at least an arrival time associated with the visible light sub-detected by each of the photosensor arrays Corresponding average time to be averaged; and averaging time to be averaged corresponding to each of at least some of the sensor units to obtain an arrival time of the high energy photon.
  • an apparatus for measuring the arrival time of high energy photons includes a time acquisition module for acquiring an arrival time associated with a photon generated by a high-energy photon and a scintillation crystal detected by each sensor unit in the photosensor array, wherein the scintillation crystal is a continuous crystal
  • the photosensor array includes a plurality of sensor units coupled to the scintillation crystal; an average time acquisition module for obtaining and photosensors based on at least an arrival time associated with the photons detected by each of the photosensor arrays Each of the selected at least some of the sensor units in the array corresponds to an average time to be averaged; and an averaging module for averaging the time to average corresponding to each of the at least some of the sensor units to obtain high energy photons Arrival time.
  • a higher time resolution can be obtained by averaging the average time to be obtained corresponding to the arrival time of the visible light for a plurality of sensor units.
  • FIG. 1 shows a schematic diagram of a continuous crystal based detector system in accordance with one embodiment of the present invention
  • FIG. 2 shows a flow diagram of a method for measuring high energy photon arrival time, in accordance with one embodiment of the present invention
  • FIG. 3 is a flow chart showing a method for measuring a high energy photon arrival time according to another embodiment of the present invention.
  • FIG. 4 is a flow chart showing a method for measuring a high energy photon arrival time according to still another embodiment of the present invention.
  • FIG. 5 is a simulation result of simulating the energy distribution of visible light particles detected by a photosensor array based on nine different reaction positions, in accordance with one embodiment of the present invention
  • FIG. 6 is a schematic diagram showing waveforms of two different magnitudes of electrical signals output by a sensor unit and trigger times corresponding to the two electrical signals, respectively, according to an embodiment of the invention
  • FIG. 7 is a diagram showing the relationship between a target reaction position of a high-energy photon in a scintillation crystal and a sensor unit according to an embodiment of the present invention
  • FIG. 8 is a schematic diagram showing high-energy photons and high-energy photons corresponding thereto incident on respective flicker crystals according to an embodiment of the present invention
  • FIG. 9 is a schematic diagram showing high-energy photons and high-energy photons corresponding thereto incident on respective flicker crystals according to another embodiment of the present invention.
  • Figure 10 shows a schematic diagram of an improved continuous crystal based detector system in accordance with one embodiment of the present invention.
  • Figure 11 shows a schematic block diagram of an apparatus for measuring high energy photon arrival times in accordance with one embodiment of the present invention.
  • the present invention proposes a method and apparatus for measuring high energy photon arrival time for a continuous crystal based ultra high temporal resolution detector system.
  • the scintillation crystal layer of a continuous crystal based detector system can be composed of a single continuous crystal.
  • a crystal of 30 mm x 30 mm x 20 mm can be used to directly form a scintillation crystal layer.
  • FIG. 1 shows a schematic diagram of a continuous crystal based detector system 100 in accordance with one embodiment of the present invention.
  • detector system 100 includes a continuous crystal 110, a photosensor array 120, a readout circuit 130, and a data processing module 140.
  • photosensor array 120 can be disposed below continuous crystal 110 and coupled to the continuous crystal 110.
  • the other faces of the continuous crystal can be covered with different types of reflective materials.
  • the photosensor array 120 can also be disposed on any other surface of the continuous crystal, and the invention is not limited.
  • the photosensor array 120 can also be a plurality of photosensor arrays disposed on any one, two, three, four, five or six faces of the continuous crystal, and the other faces can be covered with different types of reflective materials, The invention is not limited.
  • the photosensor array 120 can include a plurality of sensor units, for example, the photosensor array can be a 4x4 array including 16 sensor units.
  • a high energy photon e.g., a gamma photon
  • the visible light sub-groups are directed or reflected onto the photosensor array 120 and are received by a number of sensor units in the photosensor array 120.
  • high energy photons are present and react with the continuous crystal 110, there are typically more than one sensor unit that detects visible light.
  • Each of the photosensor arrays 120 can convert the detected optical signal of the visible light into an electrical signal and output the electrical signal to the readout circuit 130 connected thereto. It can be understood that for a sensor unit that does not detect a photon, the electrical signal outputted can be zero.
  • the readout circuit 130 can read the electrical signals output by the plurality of sensor units in parallel, and output the energy and the arrival time associated with the visible light sub-detectors of each of the sensor units, respectively. It should be understood that the time of arrival of the output of the readout circuitry 130 described herein may be an electrical signal containing time information, and the energy output by the readout circuitry 130 described herein may be an electrical signal containing energy information.
  • the readout circuit 130 can correlate the energy associated with the visible light detected by each sensor unit The amount and arrival time are output to the data processing module 140 connected thereto, and the data processing module 140 performs calculation of the arrival time of the high energy photon.
  • readout circuitry 130 can be a separate circuit or can include multiple discrete circuits.
  • readout circuitry 130 can be a separate circuit that is coupled to all of the sensor units in photosensor array 120 and can read the electrical signals output by all of the sensor units in parallel.
  • the photosensor array 120 includes 16 sensor units
  • the readout circuit 130 can include 16 discrete circuits, 16 discrete circuits are connected in one-to-one correspondence with 16 sensor units, and each discrete circuit is used for reading. Take the electrical signal output by the corresponding sensor unit.
  • the implementation of the above-mentioned readout circuit 130 is merely an example, and the readout circuit 130 may have any suitable circuit structure, which is not limited by the present invention.
  • Data processing module 140 may implement the methods described herein for measuring high energy photons. Illustratively, data processing module 140 can be implemented using any suitable hardware, software, and/or firmware. A method for measuring high energy photon arrival time proposed by the present invention will be described below with reference to the accompanying drawings.
  • method 200 shows a flow diagram of a method 200 for measuring high energy photon arrival times, in accordance with one embodiment of the present invention. As shown in FIG. 2, method 200 includes the following steps.
  • step S210 an arrival time associated with a visible light generated by a high-energy photon and a scintillation crystal detected by each sensor unit in the photosensor array is acquired, wherein the scintillation crystal is a continuous crystal, and the photosensor array includes A plurality of sensor units coupled by a scintillation crystal.
  • the readout circuit 130 can output the energy and arrival time associated with the visible light detected by each sensor unit to the data processing module 140 connected thereto, and the data processing module 140 can receive the output of the readout circuit 130. Energy and time information.
  • an average to be averaged corresponding to each of the selected at least partial sensor units in the photosensor array is obtained based at least on an arrival time associated with the visible light sub-detected by each sensor unit in the photosensor array. time.
  • the at least part of the sensor unit includes all of the sensor units in the photosensor array, and the arrival time associated with the visible light sub-detected by all of the sensor units in the photosensor array can be directly used as the photosensor array. At least some of the sensor units respectively correspond to the average time to be averaged, that is, no processing is performed on each arrival time received from the readout circuit, and these arrival times are directly averaged to obtain high-energy photons. Time of arrival.
  • the at least a portion of the sensor units include a portion of the sensor units in the array of photosensors rather than all of the sensor units.
  • the sensor unit may first be selected, for example, only the sensor unit whose energy associated with the detected photons is greater than the preset energy may be selected as at least part of the sensor unit described herein. Subsequently, in a subsequent step S130, the arrival times associated with the selected photons detected by at least some of the sensor units are averaged to determine the arrival time of the high energy photons.
  • the at least a portion of the sensor units include all of the sensor units in the array of photosensors.
  • the arrival time associated with the visible light sub-detected by each sensor unit may be first corrected, and the corrected arrival time is used as the average time to participate in the subsequent averaging operation. The manner in which the arrival time is corrected will be described below.
  • the at least a portion of the sensor units include a portion of the sensor units in the photosensor array and not all of the sensor units.
  • the sensor unit may first be selected, for example, only the sensor unit whose energy associated with the detected photons is greater than the preset energy may be selected as at least part of the sensor unit described herein. Then, the arrival time associated with the visible light sub-detected by each of the selected sensor units may be first corrected, and the corrected arrival time is taken as the average time to participate in the subsequent averaging operation.
  • the arrival time associated with the visible light sub-detected by all of the sensor units in the photosensor array can also be corrected, and then the at least part of the sensor units can be selected from all of the sensor units, and at least part of the selected The corrected arrival time corresponding to the sensor unit is averaged to determine the arrival time of the high energy photon.
  • the average time to be averaged corresponding to each of at least some of the sensor units is averaged to obtain an arrival time of the high energy photons.
  • the average time to be averaged corresponding to at least some of the sensor units described above may be averaged.
  • the method of averaging can be a simple arithmetic average or a weighted average.
  • a single sensor unit is typically used to detect high energy photon generation events (eg, gamma events), and the time of arrival associated with the photons detected by the sensor unit is considered to be the arrival time of the high energy photons.
  • a plurality of sensor units are used to detect the same high-energy photon generation event, and the readout circuit obtains a plurality of arrival times related to the visible light sub-subjects according to the electrical signal outputted by the plurality of sensor units, which is equivalent to measuring a high-energy photon. Multiple arrival times can also be understood as multiple measurements of the same high-energy photon, with one arrival time per measurement.
  • the spectroscopy-related arrival time is averaged, and the average time obtained is regarded as the actual arrival time of the high-energy photon.
  • the arrival time associated with the visible light detected by the sensor unit can be appropriately corrected to improve the accuracy of the arrival time associated with the visible light, thereby improving the high energy photon obtained by averaging. The accuracy of the arrival time.
  • the error caused by the response time stability of each sensor unit in the photosensor array, and the time measurement error of the readout circuit are independent random variables. Noise (eg, response time) due to averaging the time of arrival (or corrected arrival time) obtained for measurements of multiple sensor units in the sensor array, and the magnitude of the signal (ie, the true arrival time of the high energy photons) is constant.
  • the magnitude of the stability error, or the time measurement error of the readout circuit can be reduced to:
  • Noise final is the averaged noise
  • Noise detector is the error caused by the response time stability of a single sensor unit, or a single readout channel of the readout circuit (one sensor per readout channel) Time measurement error of the unit).
  • the error of the response time stability of a single sensor unit is 50 ps
  • the photosensor array includes 25 sensor units
  • 25 read channel outputs After the arrival time is averaged, the measurement error of the arrival time of the high-energy photon is reduced to 10 ps. That is to say, since the arrival time of the high-energy photons is determined by the averaging method in the embodiment of the present invention, the measurement error of the arrival time of the high-energy photons by the method 200 provided by the embodiment of the present invention is greatly reduced as compared with the prior art.
  • the present invention reduces the influence of the response time stability of the photosensor on the time measurement by detecting the same high-energy photon generation event (corresponding to multiple parallel measurements) using a plurality of sensor units.
  • the main advantages of the method for measuring high energy photon arrival time (and the device for measuring high energy photon arrival time described below) provided by the embodiments of the present invention are as follows:
  • the time measurement accuracy is likely to reach 10ps or higher.
  • the photon travel distance is only 3 mm in 10 ps. Therefore, the time measurement accuracy of 10 ps means that direct locating imaging of the annihilation position of positrons (annihilation into a pair of opposite-direction gamma photons) can be performed without image reconstruction by image reconstruction algorithms. Therefore, the sensitivity and image signal-to-noise ratio of a 10 ps time-resolution positron emission imaging system can be increased by a factor of 7 compared to a conventional 500 ps time-resolution positron emission imaging system. This will have revolutionary and far-reaching effects in the clinical application of positron emission imaging systems.
  • step S220 may include: selecting at least part of the sensor unit; and correcting, for each of the at least part of the sensor units, an arrival time associated with the visible light sub-detected by the sensor unit to obtain The average time to be averaged by the sensor unit.
  • the sensor units may include some or all of the sensor units 120 described above.
  • a portion of the sensor units can be selected from the plurality of sensor units of the photosensor array 120 as the at least a portion of the sensor units as needed.
  • all sensor units in the photosensor array can be directly used as the at least part of the sensor unit.
  • the time of arrival associated with the detected photons of each of at least a portion of the sensor units may be corrected. Since there are some errors in the time measurement process, such as errors caused by the trigger level used by the readout circuit 130, these errors can be corrected first, and the corrected arrival time is taken as the average time to participate in the subsequent average.
  • Correcting the arrival time associated with the visible light sub-sigment can improve the accuracy of the arrival time of the high-energy photons obtained by averaging, that is, the time measurement accuracy of the method 200 can be further improved.
  • method 200 is modified for each of at least a portion of the sensor units to determine an arrival time associated with the visible light sub-detected by the sensor unit to obtain a time to average corresponding to the sensor unit Still further comprising: obtaining energy associated with the visible light sub-detected by each of the sensor cells in the photosensor array; for each of the at least a portion of the sensor cells, an arrival time associated with the photodetector detected by the sensor unit Performing the correction to obtain the average time to be averaged corresponding to the sensor unit may include, for each of the at least some of the sensor units, detecting at least the energy pair associated with the visible light sub-detected by the sensor unit The photon-related arrival time is corrected to obtain a time to average corresponding to the sensor unit.
  • FIG. 3 illustrates a flow diagram of a method 300 for measuring high energy photon arrival times in accordance with another embodiment of the present invention.
  • Steps S310 and S350 of the method 300 shown in FIG. 3 and FIG. The steps S210 and S230 of the method 200 shown in FIG. 2 are corresponding to those skilled in the art, and the embodiments of steps S310 and S350 can be understood by the above description about FIG. 2, and details are not described herein again.
  • step S220 shown in FIG. 2 may specifically include steps S330 and S340 shown in FIG. 3, and before step S340, method 300 may further include step S320.
  • step S320 energy associated with the visible light sub-detected by each sensor unit in the photosensor array is acquired.
  • the readout circuit 130 may determine the energy associated with the visible light sub-detected by the sensor unit based on the magnitude (or intensity or amplitude) of the electrical signal. Therefore, as described above, the readout circuit 130 can output the energy associated with the visible light sub-detected by each sensor unit in addition to the arrival time associated with the visible light sub-detected by each sensor unit. Data processing module 140 can receive the energy of the photons.
  • step S330 at least a portion of the sensor units are selected. This step can be understood according to the above description, and will not be described again here.
  • step S340 for each of at least some of the sensor units, the arrival time associated with the visible light sub-detected by the sensor unit is corrected based on at least the energy associated with the visible light sub-detected by the sensor unit to obtain The average time to be averaged by the sensor unit.
  • the readout circuit 130 measures the arrival time associated with the visible light sub-sector, the time at which the electrical signal it receives exceeds the threshold is typically considered to be the arrival time of the visible light sub-score.
  • the distance between the visible light and the different sensor units is different, so that the arrival time associated with the visible light sub-measure will be greatly different, that is, the error is large. Since the energy of the visible light is the same as the size of the electrical signal, the time associated with the visible light can be corrected based on the energy associated with the visible light.
  • step S320 of method 300 shown in FIG. 3 may be performed after step S330, or both.
  • step S340 may include: calculating a target reaction position of the high energy photon in the scintillation crystal according to the energy associated with the visible light sub-detected by all the sensor units in the photosensor array; for each of at least part of the sensor unit One, based on the energy pair associated with the visible light detected by the sensor unit, is visible to the sensor unit The photon-related arrival time is corrected to obtain a correction time corresponding to the sensor unit; for each of at least some of the sensor units, the correction time corresponding to the sensor unit is corrected according to the target reaction position to obtain the sensor The average time to be averaged for the unit.
  • step S410-S430 and S470 of the method 400 shown in FIG. 4 respectively correspond to steps S310-S330 and S350 of the method 300 shown in FIG. 3, and those skilled in the art can understand steps S410-S430 by the above description about FIG. And the implementation of S470 will not be described again.
  • step S340 shown in FIG. 3 may specifically include steps S440-S460 shown in FIG. 4.
  • the target reaction position of the high energy photon in the scintillation crystal is calculated based on the energy associated with the photons detected by all of the sensor units in the photosensor array.
  • n r is the refractive index of the visible light in the scintillation crystal.
  • the refractive index of a 420 nm wavelength visible light is about 1.8
  • the speed is 0.56 times the vacuum light speed. Therefore, in order to obtain accurate time measurement results, it is necessary to compensate for the measurement error caused by the difference in speed between the high-energy photons and the photons in the scintillation crystal.
  • the target reaction position of the high energy photon can be determined first.
  • the target reaction position of the high energy photon can be calculated by using the energy information obtained by measuring the electrical signal output based on the photosensor array 120.
  • the calculation method of the target reaction position will be described below with reference to FIG. 5 is a simulation result simulating the energy distribution of photons detected by a photosensor array based on nine different reaction positions, in accordance with one embodiment of the present invention.
  • the lower left corner of Figure 5 shows the xyz coordinate system used for the simulation.
  • the parameters of the detector system participating in the simulation are as follows: the scintillation crystal is an LSO crystal having a size of 60 mm x 60 mm x 20 mm; the photosensor array is 10 x 10 in size, a single sensor The size of the unit is 6 mm x 6 mm.
  • Figure 5 shows simulation results based on nine different reaction locations, each of which can be referred to as an energy profile.
  • the values on the x-axis and y-axis in each energy profile are the lateral and longitudinal numbers of the 10 x 10 photosensor array, respectively, and the z-axis is from the 10 x 10 photosensor array.
  • the size of the electrical signal read by each sensor unit is in the number of photons. It should be understood that the magnitude of the electrical signal output by the sensor unit and the magnitude of the energy associated with the visible light sub-detected by the sensor unit are corresponding.
  • the depths of the reaction positions of the gamma photons in the scintillation crystal are set to 2 mm, 4 mm, 6 mm, ..., respectively, in order from the upper left corner to the lower right corner. Millimeter. Further, for each energy profile, the gamma photons are incident from a position close to the central axis of the scintillation crystal. It can be seen from Fig. 5 that the reaction positions of the gamma photons in the scintillation crystal are different, and the energy distribution (or light distribution) of the visible light particles measured by the 10 ⁇ 10 photosensor array is also different.
  • the depth of the reaction position of the gamma photon is 2 mm. Since the photosensor array below is far away, the generated photons are scattered, and the photodetector sensor is detected. More units. Referring to the last energy distribution diagram in the lower right corner, the depth of the reaction position of the gamma photon is 18 mm. Since the photosensor array below is relatively close, the generated visible light is concentrated, and the sensor unit detecting the visible light is less. In addition, the energy distribution diagram shown in FIG.
  • the method of position calculation may be any existing or future possible position calculation method, such as a center of gravity method, an artificial neural network, an analytical method, etc., which is not limited by the present invention.
  • step S450 for each of at least some of the sensor units, the arrival time associated with the visible light sub-detected by the sensor unit is corrected according to the energy associated with the visible light sub-detected by the sensor unit to obtain The correction time corresponding to the sensor unit.
  • the readout circuitry 130 can measure the arrival time associated with the visible light sub-detector using a constant voltage triggering method.
  • the time measuring circuit of the readout circuit can typically adopt two trigger modes, one is a constant ratio trigger mode, and the trigger level is fixed at the amplitude of the input signal (ie, the electrical signal output by the sensor unit). A certain ratio (for example, 10%); the other is a constant voltage trigger mode, the trigger level is fixed at a preset voltage.
  • the constant ratio trigger method has two disadvantages: (a) the circuit is more complicated; (b) it is more difficult to implement The trigger level ratio is set low. Due to the high time resolution detector system, it is generally required to trigger the level of the first few photons occurring in the visible light sub-group that first arrive at the photosensor, ie the trigger level is required to be sufficiently low. Therefore, the constant ratio triggering method is not well suited for detector systems with ultra-high time resolution.
  • the constant voltage trigger mode Compared with the constant ratio trigger mode, the constant voltage trigger mode has a simple circuit structure and a low circuit cost because the trigger level is fixed. Therefore, the constant voltage triggering method can be used to realize the time measurement of the visible light.
  • the disadvantage of the constant voltage triggering method is mainly that the triggering time is related to the size of the input signal.
  • 6 is a diagram showing waveforms of two differently sized electrical signals output by a sensor unit and trigger times corresponding to the two electrical signals, respectively, in accordance with an embodiment of the present invention.
  • the amplitude of the electrical signal W2 is about 20% smaller than the electrical signal W1.
  • the actual trigger time of the electrical signal W2 is 45 ps later than the electrical signal W1. Therefore, it is necessary to correct (ie, calibrate) the time measurement obtained by the constant voltage triggering method so that the time measurement result is independent of the magnitude of the input signal.
  • the manner of correction of the arrival time associated with the visible light sub-sense may include polynomial correction, for example linear correction may be employed.
  • the formula for linear correction is as follows:
  • T A,k T m,k + ⁇ E m,k (2)
  • T A,k is a correction time corresponding to the kth sensor unit in at least part of the sensor units, and T m,k and E m,k are respectively detected with the kth sensor unit
  • the time and energy of the visible light correlation, ⁇ is the correction factor.
  • the correction process in step S450 may be referred to as trigger level correction, and the purpose of the trigger level correction is to correct the time measurement result corresponding to the sensor unit by the energy measurement result corresponding to each sensor unit.
  • step S460 for each of at least some of the sensor units, the correction time corresponding to the sensor unit is corrected according to the target reaction position to obtain a time to average corresponding to the sensor unit.
  • Figure 7 illustrates the target reaction of high energy photons in a scintillation crystal in accordance with one embodiment of the present invention. Schematic diagram of the relationship between position and sensor unit.
  • the depth of the target reaction position of the high-energy photon obtained by the position calculation in the scintillation crystal is h
  • the distance from the target reaction position to the center position of a certain sensor unit in the photosensor array is d.
  • the distance from the target reaction location to the fourth row of the first column of sensor elements in the photosensor array is d 4,1
  • the distance from the target reaction location to the second row and fourth column of the photosensor array is d 2,4 .
  • the speed of light correction can be performed using the following formula:
  • T B,k is the average time corresponding to the kth sensor unit
  • n r is the refractive index of the visible light in the scintillation crystal
  • c is the vacuum light speed
  • d k is the target reaction position to the The distance from the center position of the k sensor units
  • h is the depth of the target reaction position.
  • the correction process in step S460 can be referred to as a light speed correction.
  • Trigger level correction and light speed correction can be performed simultaneously using equation (4).
  • the accuracy of the arrival time associated with the visible light sub-score is improved, and the arrival time of the last calculated high-energy photon can be greatly improved.
  • Figure 8 is a schematic diagram showing high energy photons and high energy photons corresponding thereto incident on respective flicker crystals, in accordance with one embodiment of the present invention.
  • FIG. 9 is a schematic diagram showing high-energy photons and high-energy photons corresponding thereto incident on respective flicker crystals according to another embodiment of the present invention. It is assumed that the position A shown in Fig. 9 is the target reaction position of the high-energy photon a which needs to measure the arrival time, and the position B is the reaction position of the high-energy photon b which coincides with the high-energy photon a, that is, the opposite side reaction position described herein. In the case shown in FIG.
  • the target reaction position A and the opposite reaction position can be connected after calculating the reaction positions A and B of the two gamma photons a and b in opposite directions in the respective corresponding scintillation crystals. B, to obtain a response line AB of positron annihilation. Subsequently, the response line AB can be extended until the sensor array of the detector system for detecting high energy photons a is reached, the length of the extension line (e.g., the length from the position A in Fig. 9 to the extension of the sensor array) can be recorded as A. In this case, equation (3) can be modified to:
  • T B,k is the average time to be correlated with the kth sensor unit in at least part of the sensor units
  • n r is the refractive index of the visible light in the scintillation crystal
  • c is the vacuum light speed
  • d k is the target reaction position to The distance from the center position of the kth sensor unit
  • l is the line between the opposite side reaction position and the target reaction position in the scintillation crystal arranged on the opposite side of the scintillation crystal along the high energy photon corresponding to the high energy photon.
  • the target reaction position begins to extend until the length of the extension of the photosensor array is reached. It can be understood that l in the formula (5) represents the above 1 A .
  • the formulas (5) and (6) are more widely used than the formulas (3) and (4).
  • a person skilled in the art can select an appropriate formula to perform the light speed correction according to the need.
  • the light speed correction can also be performed by combining the two methods.
  • step S440 may be performed before or at the same time as step S430, and step S440 may also be performed after or at the same time as step S450.
  • trigger level correction may be performed only on the arrival time associated with the visible light sub-detected by at least part of the sensor units, and the arrival time obtained by the trigger level correction is the average time to be used for participating in subsequent averaging operating.
  • the speed of light correction may be performed only for the arrival time associated with the visible light sub-detected by at least a portion of the sensor unit, and the arrival time obtained by the speed of light correction is the average time to be used for participating in the subsequent averaging operation.
  • suitable corrections either individually or in combination, to correct the arrival time associated with the visible light sub-particles, all falling within the scope of the present invention.
  • step S230 (S350 or S470) can be implemented by the following formula:
  • T final is the arrival time of the high energy photon
  • T B,k is the average time to be averaged corresponding to the kth sensor unit in at least some of the sensor units
  • n is the number of at least part of the sensor units.
  • equation (7) can be expressed as:
  • Equations (7) and (8) represent an implementation method of averaging average time by arithmetic averaging, which is relatively simple and computationally intensive.
  • step S230 (S350 or S470) can be implemented by the following formula:
  • T final is the arrival time of the high energy photon
  • T B,k is the average time corresponding to the kth sensor unit in at least part of the sensor units
  • C k is related to the kth sensor unit.
  • Weight coefficient n is the number of at least part of the sensor unit.
  • equation (9) can be expressed as:
  • Equations (9) and (10) represent an implementation in which the average time is averaged by the weighted average method. Compared with the arithmetic averaging method, the weighted averaging method is more complicated, and the calculated arrival time of high-energy photons is more accurate.
  • the weight coefficient C k associated with each sensor unit may be the energy E k associated with the visible light sub-detected by the sensor unit or with the sensor unit A function of the detected energy-related energy E k .
  • equation (10) can be expressed as:
  • the weighting factor Ck associated with each sensor unit may be a theoretical or empirical value that is independent of energy.
  • the weight coefficients respectively associated with all sensor units in the photosensor array may be initially set to the same value, and then the weight coefficients associated with each sensor unit may be updated by experiments or the like, and finally obtained and The appropriate weighting factor associated with each sensor unit.
  • the method 200 may further include: acquiring energy related to the visible light sub-detected by each sensor unit in the photosensor array; selecting at least part of the sensor unit may include: A sensor unit whose energy associated with the detected visible light is greater than the preset energy is selected from all of the sensor units in the photosensor array as at least part of the sensor unit.
  • the arithmetic mean (refer to equation (7)) or the weighted average (reference equation (9)) may be obtained only for the average time of the sensor unit whose energy is greater than a certain preset value in the photosensor array. Since the visible light propagates in the scintillation crystal, it may be directed to the sensor unit, or it may arrive at the sensor unit after one or more reflections. The arrival time error of the visible light reaching the sensor unit after reflection is large, and the arrival time of the high-energy photon cannot be correctly reflected.
  • the arrival time of such a visible light sub-segment can be filtered out so that it does not participate in the subsequent averaging operation.
  • Such processing can reduce the time measurement error caused by some of the sensor units that are not directly reflected from the reaction position of the gamma photons to the photons of the sensor unit.
  • the method (and apparatus) for measuring high energy photon arrival times provided by the present invention is applied is described herein in connection with FIG. 1, it is merely an example and not a limitation of the present invention.
  • the method (and apparatus) for measuring high energy photon arrival time provided by the present invention can also be applied to a detector system obtained based on the improvement of the detector system shown in FIG. Some examples of detector systems obtained based on improvements in the detector system shown in Figure 1 are described below.
  • the method (and apparatus) for measuring high energy photon arrival time provided by the present invention is applied to the detector system shown in FIG. 1, when a high-energy photon (for example, gamma photon) is in a reaction position in the continuous crystal 110 When in close proximity to the photosensor array 120, the visible light will be too concentrated on some of the sensor units in the photosensor array 120. The excessive concentration of the visible light causes a decrease in the number of sensor units actually participating in the average of the operations of the equations (7) to (11), thereby reducing the accuracy of the time measurement result.
  • a high-energy photon for example, gamma photon
  • the detector system shown in Fig. 1 can be improved.
  • the method (and apparatus) for measuring high energy photon arrival time provided by the present invention is suitable for such improved detectors
  • the flow of the system, method (and the corresponding functional modules of the device) is basically the same, but some of the data involved may need to be changed in some way.
  • a light guide can be inserted between the continuous crystal 110 and the photosensor array 120 such that the visible light ions can be more evenly distributed across the photosensor array 120.
  • the thickness of the light guide can be determined experimentally or by simulation. For such a detector system, the effects of the light guide need to be taken into account when applying the method (and apparatus) for measuring the arrival time of high energy photons to the detector system.
  • the method provided by the present invention is described above in connection with the detector system illustrated in Figure 1, it is assumed that the continuous crystal 110 is directly coupled to the photosensor array 120 with no gap therebetween.
  • the calculation method of the target reaction position of the high-energy photon described above needs to be changed.
  • the calculation of the target reaction position in the case of inserting the light guide can be implemented by a conventional algorithm in the art, and will not be described herein.
  • the equations (3) to (6) also need to be changed accordingly, and it is necessary to take into account the propagation time of the visible light in the light guide.
  • a photosensor array can be coupled on multiple faces of the continuous crystal 110.
  • a photosensor array can be coupled on two opposing faces of a continuous crystal.
  • a photosensor array can be coupled across all six faces of a continuous crystal.
  • Figure 10 shows a schematic diagram of an improved continuous crystal based detector system in accordance with one embodiment of the present invention. As shown in Figure 10, two opposing faces of the continuous crystal (exemplarily defined as an upper bottom surface and a lower bottom surface) are coupled to the photosensor array.
  • the readout circuit can be used to measure the arrival time of the photons detected by all photosensor arrays coupled to the plurality of faces of the continuous crystal, and will be associated with the continuous crystal
  • the arrival time of the visible light sub-detected by all of the photosensor arrays coupled by the plurality of faces is output to the data processing module.
  • the data processing module implements a method for measuring the arrival time of high energy photons. That is, all or at least a portion of all of the photosensor arrays coupled to the plurality of faces of the continuous crystal participate in the calculation of the arrival time of the high energy photons.
  • the depth h of the target reaction position (see equations (3) and (4)) is when the light velocity correction is performed for the photosensor array coupled to the different faces.
  • the length l of the extension line (see equations (5) and (6)) is also different.
  • the depth h of the target reaction position is the vertical distance between the target reaction position of the gamma photon and the upper bottom surface of the continuous crystal; for the photosensor array coupled to the lower bottom surface of the continuous crystal, the calculation is performed with each of the photosensor arrays
  • the depth h of the target reaction position when the sensor unit corresponds to the average time T B,k is the vertical distance between the target reaction position of the gamma photon and the lower bottom surface of the continuous crystal.
  • FIG. 10 shows a schematic block diagram of an apparatus 1100 for measuring high energy photon arrival times, in accordance with one embodiment of the present invention.
  • the device 1100 includes a time acquisition module 1110, an average time acquisition module 1120, and an averaging module 1130.
  • the time acquisition module 1110 is configured to acquire an arrival time associated with a visible light generated by a high-energy photon and a scintillation crystal detected by each sensor unit in the photosensor array, wherein the scintillation crystal is a continuous crystal.
  • the photosensor array includes a plurality of sensor units coupled to the scintillation crystal.
  • the averaging time obtaining module 1120 is configured to obtain at least a portion of the selected at least one of the photosensor arrays based on an arrival time associated with the photodetector detected by each of the photosensor arrays Each of them corresponds to the average time to be averaged.
  • the averaging module 1130 is configured to average the time to average corresponding to each of the at least some of the sensor units to obtain an arrival time of the high energy photons.
  • the averaging time obtaining module 1120 may include: a sensor selection sub-module for selecting at least a portion of the sensor unit; and a correction sub-module for detecting, for each of the at least some of the sensor units, the sensor unit The arrival time of the visible photons associated is corrected to obtain the average time to be averaged corresponding to the sensor unit.
  • the apparatus 1100 may further include: an energy acquisition module for acquiring and light The visible light sub-related energy detected by each sensor unit in the electrical sensor array; the correction sub-module may include: a correction unit for each of the at least part of the sensor units, at least according to the detection with the sensor unit The visible light-related energy is corrected for the arrival time associated with the visible light detected by the sensor unit to obtain a time to average corresponding to the sensor unit.
  • the correction unit may include: a position calculation sub-unit for calculating a target reaction position of the high-energy photon in the scintillation crystal according to the energy associated with the visible light sub-detected by all the sensor units in the photosensor array; a subunit for correcting, for each of the at least some of the sensor units, an arrival time associated with the visible light sub-detected by the sensor unit based on energy associated with the visible light sub-detected by the sensor unit to obtain a correction time corresponding to the sensor unit; a second correction subunit, configured to correct, for each of the at least some of the sensor units, a correction time corresponding to the sensor unit according to the target reaction position to obtain a corresponding to the sensor unit Waiting for the average time.
  • the first correction subunit may include a first correction component for correcting an arrival time associated with the visible light sub-detected by each of the at least some of the sensor units by the following formula:
  • T A,k T m,k + ⁇ E m,k ,
  • T A,k is the correction time corresponding to the kth sensor unit in at least part of the sensor units
  • T m,k and E m,k are respectively the arrivals associated with the visible light sub-detected by the k-th sensor unit Time and energy
  • is the correction factor
  • the second correction subunit may include a second correction component for correcting the correction time corresponding to each of the at least partial sensor units by the following formula:
  • T B,k is the average time corresponding to the kth sensor unit
  • n r is the refractive index of the visible light in the scintillation crystal
  • c is the vacuum light speed
  • d k is the target reaction position to the kth sensor unit The distance from the center position, where h is the depth of the target reaction position.
  • the second correction subunit may include a third correction component for correcting the correction time corresponding to each of the at least partial sensor units by the following formula:
  • T B,k is the average time to be correlated with the kth sensor unit
  • n r is the refractive index of the visible light in the scintillation crystal
  • c is the vacuum light speed
  • d k is the target reaction position to the kth sensor unit
  • the distance from the center position, l is the line connecting the opposite-side reaction position and the target reaction position in the scintillation crystal arranged on the opposite side of the scintillation crystal, along with the high-energy photon, extending from the target reaction position until The length of the extension line that reaches the photosensor array.
  • the averaging module 1130 can include an averaging sub-module for averaging the average time to be averaged corresponding to each of at least some of the sensor units by the following formula:
  • T final is the arrival time of the high energy photon
  • T B,k is the average time corresponding to the kth sensor unit in at least part of the sensor units
  • C k is the weight coefficient associated with the kth sensor unit
  • n is The number of at least some of the sensor units.
  • Ck is a function of the energy associated with the photon detected by the kth sensor unit or the energy associated with the photon detected by the kth sensor unit.
  • Ck is the empirical value associated with the kth sensor unit.
  • the apparatus 1100 may further include: an energy acquisition module, configured to acquire energy related to the visible light sub-detected by each of the photosensor arrays;
  • the sensor selection sub-module may include: a selection unit, configured to Among all the sensor units in the photosensor array, a sensor unit whose energy related to the detected visible light is greater than the preset energy is selected as at least part of the sensor unit.
  • the arrival time associated with the visible light sub- can be replaced with “the arrival time of the visible light sub-”, both of which represent the same meaning.
  • the "energy associated with the visible light” can be replaced by the “energy of the visible light”, both of which represent the same meaning.
  • the alternative expression can also be obtained in a similar manner. For example, “the arrival time associated with the visible light sub-detected by each sensor unit in the photosensor array” may be replaced with "the arrival time of the visible light sub-detected by each sensor unit in the photosensor array.”
  • the disclosed apparatus and method may be implemented in other manners.
  • the device embodiments described above are merely illustrative.
  • the division of the unit is only a logical function division.
  • there may be another division manner for example, multiple units or components may be combined or Can be integrated into another device, or some features can be ignored or not executed.

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Abstract

A method and apparatus for measuring an arrival time of high-energy photons. The method comprises: acquiring an arrival time associated with visible photons which are detected by each sensor unit in a photosensor array (120) and which are generated by means of a reaction between high-energy photons and scintillation crystals, wherein the scintillation crystals is continuous crystals (110), and the photosensor array (120) comprises a plurality of sensor units coupled to the scintillation crystals (S210, S310, S410); acquiring an average waiting time corresponding to each of at least part of sensor units selected from among the photosensor array (120), respectively, at least on the basis of the arrival time associated with the visible photons detected by each sensor unit in the photosensor array (120) (S220); and, calculating a mean value on the average waiting time respectively corresponding to each of the at least part of the sensor units, so as to obtain an arrival time of the high-energy photons (S230, S350, S470). According to the method and apparatus, by calculating a mean value of the average waiting time acquired by a plurality of sensor units, a higher temporal resolution may be obtained.

Description

用于测量高能光子到达时间的方法及装置Method and apparatus for measuring high energy photon arrival time 技术领域Technical field
本发明涉及光子测量领域,具体地,涉及一种用于测量高能光子到达时间的方法及装置。The present invention relates to the field of photon measurement, and in particular to a method and apparatus for measuring high energy photon arrival time.
背景技术Background technique
在高能光子(例如X射线、伽玛光子等)检测领域,检测器系统一般由闪烁晶体、光电传感器和读出电路等部件组成。下面以正电子发射成像系统为例进行描述。在正电子发射成像系统中,闪烁晶体,例如锗酸铋(BGO)、硅酸钇镥(LYSO)、溴化镧(LaBr3)等,可以将伽玛光子转变为可见光子群。光电传感器,例如光电倍增管(PMT)、硅光电倍增管(SiPM)、雪崩光电二极管(APD)等,可以将可见光子群的光信号转变为电信号。读出电路可以通过测量光电传感器输出的电信号来得到伽玛光子的能量和伽玛光子到达检测器系统的时间(即伽玛光子的到达时间)。In the field of high-energy photons (eg, X-ray, gamma photon, etc.) detection, detector systems typically consist of components such as scintillation crystals, photosensors, and readout circuitry. The positron emission imaging system will be described below as an example. In positron emission imaging systems, scintillation crystals, such as barium strontium citrate (BGO), strontium silicate (LYSO), lanthanum bromide (LaBr3), etc., can convert gamma photons into visible light subgroups. Photoelectric sensors, such as photomultiplier tubes (PMTs), silicon photomultiplier tubes (SiPMs), avalanche photodiodes (APDs), etc., can convert optical signals of the visible sub-group into electrical signals. The readout circuit can obtain the energy of the gamma photon and the time the gamma photon reaches the detector system (ie, the arrival time of the gamma photon) by measuring the electrical signal output by the photosensor.
根据闪烁晶体的构型的不同,检测器系统可以分为基于离散晶体的检测器系统和基于连续晶体的检测器系统。由于读出电路复杂度、晶体表面处理等方面的原因,在商品化正电子发射成像系统中,均采用基于离散晶体的检测器系统。Depending on the configuration of the scintillation crystal, the detector system can be divided into a discrete crystal based detector system and a continuous crystal based detector system. Due to the complexity of the readout circuit, crystal surface treatment, etc., in the commercial positron emission imaging system, a discrete crystal based detector system is used.
基于离散晶体的检测器系统的闪烁晶体层由离散晶体阵列组成。例如,可以用3毫米×3毫米×20毫米的晶体,组成10×10的阵列,晶体阵列总大小为30毫米×30毫米×20毫米。通过设计相应的光电传感器阵列和读出电路,可以确认伽玛光子打到哪个离散晶体中(称为解码)。The scintillation crystal layer of the discrete crystal based detector system consists of a discrete crystal array. For example, a 10 mm x 3 mm x 20 mm crystal can be used to form a 10 x 10 array with a total crystal array size of 30 mm x 30 mm x 20 mm. By designing the corresponding photosensor array and readout circuitry, it can be confirmed which discrete crystal the gamma photon hits (called decoding).
基于离散晶体的检测器系统的时间测量精度,受晶体本征时间性能、晶体的尺寸(伽玛光子在晶体中不同位置转换为可见光子群,这些可见光子群到达光电传感器的时间不一样)、光电传感器的响应时间稳定性(jitter)、读出电路的时间测量精度等因素的影响。有研究表明,在上述因素中,最主要的瓶颈是光电传感器的响应时间稳定性。由于这个瓶颈的存在,由最常用的硅酸镥(LSO)晶体(3毫米×3毫米×30毫米)构成的检测器系 统在理论上的最优时间分辨率不可能优于70ps。实际的商品化正电子发射成像系统的时间分辨率一般在500ps左右,最优不优于320ps。The time measurement accuracy of the detector system based on discrete crystals is affected by the intrinsic time performance of the crystal and the size of the crystal (the gamma photons are converted into visible sub-groups at different positions in the crystal, and the time of these visible sub-groups reaching the photosensor is different), The influence of the response time stability (jitter) of the photoelectric sensor and the time measurement accuracy of the readout circuit. Studies have shown that among the above factors, the most important bottleneck is the response time stability of photoelectric sensors. Due to the existence of this bottleneck, the detector system consisting of the most commonly used strontium silicate (LSO) crystals (3 mm × 3 mm × 30 mm) In theory, the optimal time resolution cannot be better than 70ps. The actual commercial positron emission imaging system has a time resolution of about 500 ps, and the optimal is not better than 320 ps.
因此,需要提供一种用于测量高能光子到达时间的方法,以至少部分地解决现有技术中存在的上述问题。Accordingly, it is desirable to provide a method for measuring high energy photon arrival times to at least partially address the above-discussed problems in the prior art.
发明内容Summary of the invention
为了至少部分地解决现有技术中存在的问题,根据本发明的一个方面,提供一种用于测量高能光子到达时间的方法。该方法包括:获取与光电传感器阵列中的每个传感器单元所检测到的、高能光子与闪烁晶体发生反应所产生的可见光子相关的到达时间,其中,闪烁晶体是连续晶体,光电传感器阵列包括与闪烁晶体耦合的多个传感器单元;至少基于与光电传感器阵列中的每个传感器单元所检测到的可见光子相关的到达时间,获得与光电传感器阵列中的选定的至少部分传感器单元中的每一个分别对应的待平均时间;以及对与至少部分传感器单元中的每一个分别对应的待平均时间求平均,以获得高能光子的到达时间。In order to at least partially solve the problems in the prior art, according to one aspect of the present invention, a method for measuring high energy photon arrival time is provided. The method includes: obtaining an arrival time associated with a photon generated by a high-energy photon and a scintillation crystal detected by each sensor unit in the photosensor array, wherein the scintillation crystal is a continuous crystal, and the photosensor array includes a plurality of sensor units coupled to the scintillation crystal; obtaining each of the selected at least partial sensor units in the photosensor array based on at least an arrival time associated with the visible light sub-detected by each of the photosensor arrays Corresponding average time to be averaged; and averaging time to be averaged corresponding to each of at least some of the sensor units to obtain an arrival time of the high energy photon.
根据本发明的另一方面,提供一种用于测量高能光子到达时间的装置。该装置包括:时间获取模块,用于获取与光电传感器阵列中的每个传感器单元所检测到的、高能光子与闪烁晶体发生反应所产生的可见光子相关的到达时间,其中,闪烁晶体是连续晶体,光电传感器阵列包括与闪烁晶体耦合的多个传感器单元;待平均时间获得模块,用于至少基于与光电传感器阵列中的每个传感器单元所检测到的可见光子相关的到达时间,获得与光电传感器阵列中的选定的至少部分传感器单元中的每一个分别对应的待平均时间;以及平均模块,用于对与至少部分传感器单元中的每一个分别对应的待平均时间求平均,以获得高能光子的到达时间。According to another aspect of the invention, an apparatus for measuring the arrival time of high energy photons is provided. The apparatus includes a time acquisition module for acquiring an arrival time associated with a photon generated by a high-energy photon and a scintillation crystal detected by each sensor unit in the photosensor array, wherein the scintillation crystal is a continuous crystal The photosensor array includes a plurality of sensor units coupled to the scintillation crystal; an average time acquisition module for obtaining and photosensors based on at least an arrival time associated with the photons detected by each of the photosensor arrays Each of the selected at least some of the sensor units in the array corresponds to an average time to be averaged; and an averaging module for averaging the time to average corresponding to each of the at least some of the sensor units to obtain high energy photons Arrival time.
根据本发明实施例的方法和装置,通过对针对多个传感器单元获得的、与可见光子的到达时间相对应的待平均时间求平均,可以获得较高的时间分辨率。According to the method and apparatus of the embodiments of the present invention, a higher time resolution can be obtained by averaging the average time to be obtained corresponding to the arrival time of the visible light for a plurality of sensor units.
在发明内容中引入了一系列简化的概念,这些概念将在具体实施方式部分中进一步详细说明。本发明内容部分并不意味着要试图限定所要求保护的技术方案的关键特征和必要技术特征,更不意味着试图确定所要求保护的技术方案的保护范围。 A series of simplified concepts are introduced in the Summary of the Invention, which are further described in detail in the Detailed Description section. The summary is not intended to limit the key features and essential technical features of the claimed embodiments, and is not intended to limit the scope of protection of the claimed embodiments.
以下结合附图,详细说明本发明的优点和特征。Advantages and features of the present invention are described in detail below with reference to the accompanying drawings.
附图说明DRAWINGS
本发明的下列附图在此作为本发明的一部分用于理解本发明。附图中示出了本发明的实施方式及其描述,用来解释本发明的原理。在附图中,The following drawings of the invention are hereby incorporated by reference in their entirety in their entirety. The embodiments of the invention and the description thereof are shown in the drawings In the drawing,
图1示出根据本发明一个实施例的基于连续晶体的检测器系统的示意图;1 shows a schematic diagram of a continuous crystal based detector system in accordance with one embodiment of the present invention;
图2示出根据本发明一个实施例的用于测量高能光子到达时间的方法的流程示意图;2 shows a flow diagram of a method for measuring high energy photon arrival time, in accordance with one embodiment of the present invention;
图3示出根据本发明另一个实施例的用于测量高能光子到达时间的方法的流程示意图;3 is a flow chart showing a method for measuring a high energy photon arrival time according to another embodiment of the present invention;
图4示出根据本发明又一实施例的用于测量高能光子到达时间的方法的流程示意图;4 is a flow chart showing a method for measuring a high energy photon arrival time according to still another embodiment of the present invention;
图5是根据本发明一个实施例的基于九个不同反应位置对光电传感器阵列所检测到的可见光子的能量分布进行仿真的仿真结果;5 is a simulation result of simulating the energy distribution of visible light particles detected by a photosensor array based on nine different reaction positions, in accordance with one embodiment of the present invention;
图6示出根据本发明一个实施例的传感器单元输出的两种不同大小的电信号的波形及与这两种电信号分别对应的触发时间的示意图;6 is a schematic diagram showing waveforms of two different magnitudes of electrical signals output by a sensor unit and trigger times corresponding to the two electrical signals, respectively, according to an embodiment of the invention;
图7示出根据本发明一个实施例的高能光子在闪烁晶体内的目标反应位置与传感器单元之间的距离关系的示意图;7 is a diagram showing the relationship between a target reaction position of a high-energy photon in a scintillation crystal and a sensor unit according to an embodiment of the present invention;
图8示出根据本发明一个实施例的高能光子及与其相符合的高能光子入射到各自对应的闪烁晶体的示意图;8 is a schematic diagram showing high-energy photons and high-energy photons corresponding thereto incident on respective flicker crystals according to an embodiment of the present invention;
图9示出根据本发明另一个实施例的高能光子及与其相符合的高能光子入射到各自对应的闪烁晶体的示意图;9 is a schematic diagram showing high-energy photons and high-energy photons corresponding thereto incident on respective flicker crystals according to another embodiment of the present invention;
图10示出根据本发明一个实施例的改进的基于连续晶体的检测器系统的示意图;以及Figure 10 shows a schematic diagram of an improved continuous crystal based detector system in accordance with one embodiment of the present invention;
图11示出根据本发明一个实施例的用于测量高能光子到达时间的装置的示意性框图。Figure 11 shows a schematic block diagram of an apparatus for measuring high energy photon arrival times in accordance with one embodiment of the present invention.
具体实施方式detailed description
在下文的描述中,提供了大量的细节以便能够彻底地理解本发明。然而,本领域技术人员可以了解,如下描述仅涉及本发明的较佳实施例,本 发明可以无需一个或多个这样的细节而得以实施。此外,为了避免与本发明发生混淆,对于本领域公知的一些技术特征未进行描述。In the following description, numerous details are provided in order to provide a thorough understanding of the invention. However, those skilled in the art will appreciate that the following description relates only to the preferred embodiment of the present invention, The invention may be practiced without one or more of such details. Moreover, in order to avoid confusion with the present invention, some of the technical features well known in the art are not described.
为了解决上述问题,本发明提出一种用于测量高能光子到达时间的方法和装置,其用于基于连续晶体的超高时间分辨率检测器系统。基于连续晶体的检测器系统的闪烁晶体层可以由一整块连续晶体组成。例如,可以用一块30毫米×30毫米×20毫米的晶体,直接构成闪烁晶体层。通过设计相应的光电传感器阵列和读出电路,可以确认伽玛光子打到连续晶体中的哪个位置(称为解码)。In order to solve the above problems, the present invention proposes a method and apparatus for measuring high energy photon arrival time for a continuous crystal based ultra high temporal resolution detector system. The scintillation crystal layer of a continuous crystal based detector system can be composed of a single continuous crystal. For example, a crystal of 30 mm x 30 mm x 20 mm can be used to directly form a scintillation crystal layer. By designing the corresponding photosensor array and readout circuitry, it can be confirmed which position (called decoding) the gamma photon hits into the continuous crystal.
图1示出根据本发明一个实施例的基于连续晶体的检测器系统100的示意图。如图1所示,检测器系统100包括连续晶体110、光电传感器阵列120、读出电路130和数据处理模块140。FIG. 1 shows a schematic diagram of a continuous crystal based detector system 100 in accordance with one embodiment of the present invention. As shown in FIG. 1, detector system 100 includes a continuous crystal 110, a photosensor array 120, a readout circuit 130, and a data processing module 140.
如图1所示,光电传感器阵列120可以安置在连续晶体110下方,与该连续晶体110耦合。连续晶体的其他面可以覆盖有不同类型的反光材料。光电传感器阵列120也可以安置在连续晶体其他任何一个面上,本发明不做限制。光电传感器阵列120也可以是多个光电传感器阵列,安置在连续晶体其他任何一个,两个,三个,四个,五个或者六个面上,其他面可以覆盖有不同类型的反光材料,本发明不做限制。As shown in FIG. 1, photosensor array 120 can be disposed below continuous crystal 110 and coupled to the continuous crystal 110. The other faces of the continuous crystal can be covered with different types of reflective materials. The photosensor array 120 can also be disposed on any other surface of the continuous crystal, and the invention is not limited. The photosensor array 120 can also be a plurality of photosensor arrays disposed on any one, two, three, four, five or six faces of the continuous crystal, and the other faces can be covered with different types of reflective materials, The invention is not limited.
光电传感器阵列120可以包括多个传感器单元,例如,光电传感器阵列可以是4×4的阵列,包括16个传感器单元。当高能光子(例如伽玛光子)入射到连续晶体110中时,可以与连续晶体110发生反应,产生能量较低的可见光子群。可见光子群直射或反射到光电传感器阵列120上,由光电传感器阵列120中的若干传感器单元接收。当高能光子出现并与连续晶体110发生反应时,检测到可见光子的传感器单元通常不止一个。The photosensor array 120 can include a plurality of sensor units, for example, the photosensor array can be a 4x4 array including 16 sensor units. When a high energy photon (e.g., a gamma photon) is incident into the continuous crystal 110, it can react with the continuous crystal 110 to produce a lower energy subset of visible light. The visible light sub-groups are directed or reflected onto the photosensor array 120 and are received by a number of sensor units in the photosensor array 120. When high energy photons are present and react with the continuous crystal 110, there are typically more than one sensor unit that detects visible light.
光电传感器阵列120中的每个传感器单元可以将检测到的可见光子的光信号转换为电信号,并将电信号输出到与其相连的读出电路130。可以理解,对于未检测到可见光子的传感器单元,其输出的电信号可以是0。读出电路130可以并行读取多个传感器单元输出的电信号,并分别输出与每个传感器单元所检测到的可见光子相关的能量和到达时间。应理解,本文所描述的、读出电路130输出的到达时间可以是包含时间信息的电信号,本文所描述的、读出电路130输出的能量可以是包含能量信息的电信号。Each of the photosensor arrays 120 can convert the detected optical signal of the visible light into an electrical signal and output the electrical signal to the readout circuit 130 connected thereto. It can be understood that for a sensor unit that does not detect a photon, the electrical signal outputted can be zero. The readout circuit 130 can read the electrical signals output by the plurality of sensor units in parallel, and output the energy and the arrival time associated with the visible light sub-detectors of each of the sensor units, respectively. It should be understood that the time of arrival of the output of the readout circuitry 130 described herein may be an electrical signal containing time information, and the energy output by the readout circuitry 130 described herein may be an electrical signal containing energy information.
读出电路130可以将与每个传感器单元所检测到的可见光子相关的能 量和到达时间输出到与其相连的数据处理模块140中,由数据处理模块140进行高能光子的到达时间的计算。The readout circuit 130 can correlate the energy associated with the visible light detected by each sensor unit The amount and arrival time are output to the data processing module 140 connected thereto, and the data processing module 140 performs calculation of the arrival time of the high energy photon.
示例性地,读出电路130可以是一个独立的电路或者可以包括多个分立的电路。例如,读出电路130可以是一个独立的电路,其与光电传感器阵列120中的所有传感器单元连接,并且可以并行读取所有传感器单元输出的电信号。又例如,假设光电传感器阵列120包括16个传感器单元,则读出电路130可以包括16个分立的电路,16个分立的电路与16个传感器单元一一对应连接,每个分立的电路用于读取对应的传感器单元输出的电信号。当然,上述读出电路130的实现方式仅是示例,读出电路130可以具有任何合适的电路结构,本发明不对此进行限制。Illustratively, readout circuitry 130 can be a separate circuit or can include multiple discrete circuits. For example, readout circuitry 130 can be a separate circuit that is coupled to all of the sensor units in photosensor array 120 and can read the electrical signals output by all of the sensor units in parallel. For another example, if the photosensor array 120 includes 16 sensor units, the readout circuit 130 can include 16 discrete circuits, 16 discrete circuits are connected in one-to-one correspondence with 16 sensor units, and each discrete circuit is used for reading. Take the electrical signal output by the corresponding sensor unit. Of course, the implementation of the above-mentioned readout circuit 130 is merely an example, and the readout circuit 130 may have any suitable circuit structure, which is not limited by the present invention.
数据处理模块140可以实现本文所述的用于测量高能光子的方法。示例性地,数据处理模块140可以采用任何合适的硬件、软件和/或固件实现。下面结合附图描述本发明提出的用于测量高能光子到达时间的方法。 Data processing module 140 may implement the methods described herein for measuring high energy photons. Illustratively, data processing module 140 can be implemented using any suitable hardware, software, and/or firmware. A method for measuring high energy photon arrival time proposed by the present invention will be described below with reference to the accompanying drawings.
图2示出根据本发明一个实施例的用于测量高能光子到达时间的方法200的流程示意图。如图2所示,方法200包括以下步骤。2 shows a flow diagram of a method 200 for measuring high energy photon arrival times, in accordance with one embodiment of the present invention. As shown in FIG. 2, method 200 includes the following steps.
在步骤S210,获取与光电传感器阵列中的每个传感器单元所检测到的、高能光子与闪烁晶体发生反应所产生的可见光子相关的到达时间,其中,闪烁晶体是连续晶体,光电传感器阵列包括与闪烁晶体耦合的多个传感器单元。In step S210, an arrival time associated with a visible light generated by a high-energy photon and a scintillation crystal detected by each sensor unit in the photosensor array is acquired, wherein the scintillation crystal is a continuous crystal, and the photosensor array includes A plurality of sensor units coupled by a scintillation crystal.
如上文所述,读出电路130可以将与每个传感器单元所检测到的可见光子相关的能量和到达时间输出到与其相连的数据处理模块140中,数据处理模块140可以接收读出电路130输出的能量和时间信息。As described above, the readout circuit 130 can output the energy and arrival time associated with the visible light detected by each sensor unit to the data processing module 140 connected thereto, and the data processing module 140 can receive the output of the readout circuit 130. Energy and time information.
在步骤S220,至少基于与光电传感器阵列中的每个传感器单元所检测到的可见光子相关的到达时间,获得与光电传感器阵列中的选定的至少部分传感器单元中的每一个分别对应的待平均时间。At step S220, an average to be averaged corresponding to each of the selected at least partial sensor units in the photosensor array is obtained based at least on an arrival time associated with the visible light sub-detected by each sensor unit in the photosensor array. time.
在一个示例中,所述至少部分传感器单元包括光电传感器阵列中的所有传感器单元,可以直接将与光电传感器阵列中的所有传感器单元所检测到的可见光子相关的到达时间作为与光电传感器阵列中的至少部分传感器单元中的每一个分别对应的待平均时间,也就是说,不对从读出电路接收到的各到达时间进行任何处理,直接对这些到达时间进行后续的平均,以求得高能光子的到达时间。 In one example, the at least part of the sensor unit includes all of the sensor units in the photosensor array, and the arrival time associated with the visible light sub-detected by all of the sensor units in the photosensor array can be directly used as the photosensor array. At least some of the sensor units respectively correspond to the average time to be averaged, that is, no processing is performed on each arrival time received from the readout circuit, and these arrival times are directly averaged to obtain high-energy photons. Time of arrival.
在另一个示例中,所述至少部分传感器单元包括光电传感器阵列中的一部分传感器单元而非所有传感器单元。在这种情况下,可以首先对传感器单元进行挑选,例如,可以仅将与其所检测到的可见光子相关的能量大于预设能量的传感器单元挑选出来作为本文所述的至少部分传感器单元。随后,在后续的步骤S130中,对与挑选出来的至少部分传感器单元所检测到的可见光子相关的到达时间求平均,以求得高能光子的到达时间。In another example, the at least a portion of the sensor units include a portion of the sensor units in the array of photosensors rather than all of the sensor units. In this case, the sensor unit may first be selected, for example, only the sensor unit whose energy associated with the detected photons is greater than the preset energy may be selected as at least part of the sensor unit described herein. Subsequently, in a subsequent step S130, the arrival times associated with the selected photons detected by at least some of the sensor units are averaged to determine the arrival time of the high energy photons.
在又一个示例中,所述至少部分传感器单元包括光电传感器阵列中的所有传感器单元。在本示例中,可以首先对与每个传感器单元所检测到的可见光子相关的到达时间进行修正,将经修正的到达时间作为待平均时间参与后续的求平均操作。到达时间的修正方式将在下文描述。In yet another example, the at least a portion of the sensor units include all of the sensor units in the array of photosensors. In this example, the arrival time associated with the visible light sub-detected by each sensor unit may be first corrected, and the corrected arrival time is used as the average time to participate in the subsequent averaging operation. The manner in which the arrival time is corrected will be described below.
在再一个示例中,所述至少部分传感器单元包括光电传感器阵列中的一部分传感器单元而非所有传感器单元。在这种情况下,可以首先对传感器单元进行挑选,例如,可以仅将与其所检测到的可见光子相关的能量大于预设能量的传感器单元挑选出来作为本文所述的至少部分传感器单元。然后,可以首先对与挑选出的传感器单元中的每个传感器单元所检测到的可见光子相关的到达时间进行修正,将经修正的到达时间作为待平均时间参与后续的平均化操作。替代地,也可以对与光电传感器阵列中的所有传感器单元所检测到的可见光子相关的到达时间进行修正,随后从所有传感器单元中挑选出所述至少部分传感器单元,对与挑选出的至少部分传感器单元对应的经修正的到达时间求平均,以求得高能光子的到达时间。In still another example, the at least a portion of the sensor units include a portion of the sensor units in the photosensor array and not all of the sensor units. In this case, the sensor unit may first be selected, for example, only the sensor unit whose energy associated with the detected photons is greater than the preset energy may be selected as at least part of the sensor unit described herein. Then, the arrival time associated with the visible light sub-detected by each of the selected sensor units may be first corrected, and the corrected arrival time is taken as the average time to participate in the subsequent averaging operation. Alternatively, the arrival time associated with the visible light sub-detected by all of the sensor units in the photosensor array can also be corrected, and then the at least part of the sensor units can be selected from all of the sensor units, and at least part of the selected The corrected arrival time corresponding to the sensor unit is averaged to determine the arrival time of the high energy photon.
在步骤S230,对与至少部分传感器单元中的每一个分别对应的待平均时间求平均,以获得高能光子的到达时间。At step S230, the average time to be averaged corresponding to each of at least some of the sensor units is averaged to obtain an arrival time of the high energy photons.
可以对与上述至少部分传感器单元对应的待平均时间求平均。求平均的方式可以是简单的算数平均或加权平均等。The average time to be averaged corresponding to at least some of the sensor units described above may be averaged. The method of averaging can be a simple arithmetic average or a weighted average.
在现有技术中,通常采用单个传感器单元对高能光子发生事件(例如伽玛事件)进行检测,与该传感器单元检测到的可见光子相关的到达时间即被视为是高能光子的到达时间。在本发明中,采用多个传感器单元针对同一高能光子发生事件进行检测,读出电路根据多个传感器单元输出的电信号测量获得多个与可见光子相关的到达时间,相当于是测量获得一个高能光子的多个到达时间,其也可以理解为对同一高能光子进行了多次测量,每次测量获得一个到达时间。随后,可以对与多个传感器单元所检测到的 可见光子相关的到达时间求平均,将平均获得的时间视为高能光子的实际到达时间。当然,在求平均之前,还可以对与传感器单元所检测到的可见光子相关的到达时间进行适当的修正,以提高与可见光子相关的到达时间的准确度,进而提高通过求平均获得的高能光子的到达时间的准确度。In the prior art, a single sensor unit is typically used to detect high energy photon generation events (eg, gamma events), and the time of arrival associated with the photons detected by the sensor unit is considered to be the arrival time of the high energy photons. In the present invention, a plurality of sensor units are used to detect the same high-energy photon generation event, and the readout circuit obtains a plurality of arrival times related to the visible light sub-subjects according to the electrical signal outputted by the plurality of sensor units, which is equivalent to measuring a high-energy photon. Multiple arrival times can also be understood as multiple measurements of the same high-energy photon, with one arrival time per measurement. Subsequently, it can be detected with multiple sensor units The spectroscopy-related arrival time is averaged, and the average time obtained is regarded as the actual arrival time of the high-energy photon. Of course, before the averaging, the arrival time associated with the visible light detected by the sensor unit can be appropriately corrected to improve the accuracy of the arrival time associated with the visible light, thereby improving the high energy photon obtained by averaging. The accuracy of the arrival time.
本领域技术人员可知,在每次针对高能光子的到达时间的测量中,光电传感器阵列中的每个传感器单元的响应时间稳定性所造成的误差,以及读出电路的时间测量误差,在理论上都分别是相互独立的随机变量。由于对针对传感器阵列中的多个传感器单元测量获得的到达时间(或经过修正的到达时间)求平均,并且信号(即高能光子的真实到达时间)的幅度不变,因此噪声(例如,响应时间稳定性误差,或者读出电路的时间测量误差)的幅度可以降低为:Those skilled in the art will appreciate that in each measurement of the arrival time of high energy photons, the error caused by the response time stability of each sensor unit in the photosensor array, and the time measurement error of the readout circuit, in theory They are independent random variables. Noise (eg, response time) due to averaging the time of arrival (or corrected arrival time) obtained for measurements of multiple sensor units in the sensor array, and the magnitude of the signal (ie, the true arrival time of the high energy photons) is constant The magnitude of the stability error, or the time measurement error of the readout circuit, can be reduced to:
Figure PCTCN2017110864-appb-000001
Figure PCTCN2017110864-appb-000001
在式(1)中,Noisefinal为求平均后的噪声,Noisedetector为单个传感器单元的响应时间稳定性所造成的误差,或者读出电路的单个读出通道(每个读出通道对应一个传感器单元)的时间测量误差。In equation (1), Noise final is the averaged noise, Noise detector is the error caused by the response time stability of a single sensor unit, or a single readout channel of the readout circuit (one sensor per readout channel) Time measurement error of the unit).
假设单个传感器单元(每个传感器单元是一个光电传感器)的响应时间稳定性造成的误差为50ps,并且假设光电传感器阵列包括25个传感器单元,则根据式(1),对25个读出通道输出的到达时间进行平均之后,高能光子的到达时间的测量误差降低到10ps。也就是说,由于本发明实施例中采用求平均方式确定高能光子的到达时间,因此与现有技术相比,本发明实施例提供的方法200对高能光子的到达时间的测量误差大大减小。Assuming that the error of the response time stability of a single sensor unit (each sensor unit is one photoelectric sensor) is 50 ps, and assuming that the photosensor array includes 25 sensor units, according to equation (1), 25 read channel outputs After the arrival time is averaged, the measurement error of the arrival time of the high-energy photon is reduced to 10 ps. That is to say, since the arrival time of the high-energy photons is determined by the averaging method in the embodiment of the present invention, the measurement error of the arrival time of the high-energy photons by the method 200 provided by the embodiment of the present invention is greatly reduced as compared with the prior art.
由上可知,本发明通过使用多个传感器单元对同一高能光子发生事件进行检测(相当于多次并行测量),来减少光电传感器的响应时间稳定性对时间测量的影响。本发明实施例提供的用于测量高能光子到达时间的方法(及下文所述的用于测量高能光子到达时间的装置)的主要优点如下:As can be seen from the above, the present invention reduces the influence of the response time stability of the photosensor on the time measurement by detecting the same high-energy photon generation event (corresponding to multiple parallel measurements) using a plurality of sensor units. The main advantages of the method for measuring high energy photon arrival time (and the device for measuring high energy photon arrival time described below) provided by the embodiments of the present invention are as follows:
(1)时间测量精度有可能达到10ps甚至更高。在10ps内光子的飞行距离只有3毫米。因此,10ps的时间测量精度意味着可以对正电子(湮灭成一对方向相反的伽玛光子)的湮灭位置进行直接定位成像,而不需要通过图像重建算法来进行图像重建。因此,与传统的500ps时间分辨率的正电子发射成像系统相比,10ps时间分辨率的正电子发射成像系统的灵敏度和图像信噪比可以提高7倍。这将在正电子发射成像系统的临床应用领域产生革命性的深远影响。 (1) The time measurement accuracy is likely to reach 10ps or higher. The photon travel distance is only 3 mm in 10 ps. Therefore, the time measurement accuracy of 10 ps means that direct locating imaging of the annihilation position of positrons (annihilation into a pair of opposite-direction gamma photons) can be performed without image reconstruction by image reconstruction algorithms. Therefore, the sensitivity and image signal-to-noise ratio of a 10 ps time-resolution positron emission imaging system can be increased by a factor of 7 compared to a conventional 500 ps time-resolution positron emission imaging system. This will have revolutionary and far-reaching effects in the clinical application of positron emission imaging systems.
(2)对光电传感器的减少响应时间稳定性影响的要求,以及对读出电路的时间测量精度的要求都可以大幅度降低,这有利于降低检测器系统的成本。(2) The requirements for reducing the response time stability of the photoelectric sensor and the time measurement accuracy of the readout circuit can be greatly reduced, which is advantageous for reducing the cost of the detector system.
根据本发明实施例,步骤S220可以包括:选择至少部分传感器单元;以及对于至少部分传感器单元中的每一个,对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的待平均时间。According to an embodiment of the present invention, step S220 may include: selecting at least part of the sensor unit; and correcting, for each of the at least part of the sensor units, an arrival time associated with the visible light sub-detected by the sensor unit to obtain The average time to be averaged by the sensor unit.
如上文所述,至少部分传感器单元可以包括上述光电传感器阵列120中的一部分传感器单元或者所有传感器单元。示例性地,可以根据需要从光电传感器阵列120的所有传感器单元中选择一部分传感器单元作为所述至少部分传感器单元。示例性地,可以直接将光电传感器阵列中的所有传感器单元作为所述至少部分传感器单元。As described above, at least a portion of the sensor units may include some or all of the sensor units 120 described above. Illustratively, a portion of the sensor units can be selected from the plurality of sensor units of the photosensor array 120 as the at least a portion of the sensor units as needed. Illustratively, all sensor units in the photosensor array can be directly used as the at least part of the sensor unit.
在确定参与平均的至少部分传感器单元之后,可以对与至少部分传感器单元中的每一个所检测到的可见光子相关的到达时间进行修正。由于在时间测量过程中,存在一些误差,例如读出电路130所采用的触发电平造成的误差等,可以首先对这些误差进行修正,将经过修正的到达时间作为待平均时间参与后续的平均。After determining at least a portion of the sensor units participating in the averaging, the time of arrival associated with the detected photons of each of at least a portion of the sensor units may be corrected. Since there are some errors in the time measurement process, such as errors caused by the trigger level used by the readout circuit 130, these errors can be corrected first, and the corrected arrival time is taken as the average time to participate in the subsequent average.
对与可见光子相关的到达时间进行修正可以提高通过求平均获得的高能光子的到达时间的准确度,也就是可以进一步提高方法200的时间测量精度。Correcting the arrival time associated with the visible light sub-sigment can improve the accuracy of the arrival time of the high-energy photons obtained by averaging, that is, the time measurement accuracy of the method 200 can be further improved.
根据本发明实施例,在对于至少部分传感器单元中的每一个,对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的待平均时间之前,方法200可以进一步包括:获取与光电传感器阵列中的每个传感器单元所检测到的可见光子相关的能量;对于至少部分传感器单元中的每一个,对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的待平均时间可以包括:对于至少部分传感器单元中的每一个,至少根据与该传感器单元所检测到的可见光子相关的能量对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的待平均时间。In accordance with an embodiment of the present invention, method 200 is modified for each of at least a portion of the sensor units to determine an arrival time associated with the visible light sub-detected by the sensor unit to obtain a time to average corresponding to the sensor unit Still further comprising: obtaining energy associated with the visible light sub-detected by each of the sensor cells in the photosensor array; for each of the at least a portion of the sensor cells, an arrival time associated with the photodetector detected by the sensor unit Performing the correction to obtain the average time to be averaged corresponding to the sensor unit may include, for each of the at least some of the sensor units, detecting at least the energy pair associated with the visible light sub-detected by the sensor unit The photon-related arrival time is corrected to obtain a time to average corresponding to the sensor unit.
图3示出根据本发明另一个实施例的用于测量高能光子到达时间的方法300的流程示意图。图3所示的方法300的步骤S310和S350分别与图 2所示的方法200的步骤S210和S230相对应,本领域技术人员通过以上关于图2的描述可以理解步骤S310和S350的实施方式,不再赘述。根据本实施例,图2所示的步骤S220可以具体包括图3所示的步骤S330和S340,并且在步骤S340之前,方法300可以进一步包括步骤S320。FIG. 3 illustrates a flow diagram of a method 300 for measuring high energy photon arrival times in accordance with another embodiment of the present invention. Steps S310 and S350 of the method 300 shown in FIG. 3 and FIG. The steps S210 and S230 of the method 200 shown in FIG. 2 are corresponding to those skilled in the art, and the embodiments of steps S310 and S350 can be understood by the above description about FIG. 2, and details are not described herein again. According to the present embodiment, step S220 shown in FIG. 2 may specifically include steps S330 and S340 shown in FIG. 3, and before step S340, method 300 may further include step S320.
具体地,在步骤S320,获取与光电传感器阵列中的每个传感器单元所检测到的可见光子相关的能量。Specifically, in step S320, energy associated with the visible light sub-detected by each sensor unit in the photosensor array is acquired.
读出电路130在接收到每个传感器单元输出的电信号之后,可以根据电信号的大小(或称为强度或幅度)确定与传感器单元所检测到的可见光子相关的能量。因此,如上文所述,读出电路130除了可以输出与每个传感器单元所检测到的可见光子相关的到达时间之外,还可以输出与每个传感器单元所检测到的可见光子相关的能量。数据处理模块140可以接收可见光子的能量。After receiving the electrical signal output by each sensor unit, the readout circuit 130 may determine the energy associated with the visible light sub-detected by the sensor unit based on the magnitude (or intensity or amplitude) of the electrical signal. Therefore, as described above, the readout circuit 130 can output the energy associated with the visible light sub-detected by each sensor unit in addition to the arrival time associated with the visible light sub-detected by each sensor unit. Data processing module 140 can receive the energy of the photons.
在步骤S330,选择至少部分传感器单元。根据上文描述可以理解该步骤,在此不再赘述。At step S330, at least a portion of the sensor units are selected. This step can be understood according to the above description, and will not be described again here.
在步骤S340,对于至少部分传感器单元中的每一个,至少根据与该传感器单元所检测到的可见光子相关的能量对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的待平均时间。In step S340, for each of at least some of the sensor units, the arrival time associated with the visible light sub-detected by the sensor unit is corrected based on at least the energy associated with the visible light sub-detected by the sensor unit to obtain The average time to be averaged by the sensor unit.
由于在读出电路130测量与可见光子相关的到达时间时,典型地将其接收到的电信号超出阈值的时刻视为可见光子的到达时间。然而,高能光子在产生大量可见光子时,可见光子与不同传感器单元的距离不同,这样测量获得的与可见光子相关的到达时间将差异较大,也就是误差较大。由于可见光子的能量大小与电信号的大小一致,因此,可以根据与可见光子相关的能量来修正与可见光子相关的时间。Since the readout circuit 130 measures the arrival time associated with the visible light sub-sector, the time at which the electrical signal it receives exceeds the threshold is typically considered to be the arrival time of the visible light sub-score. However, when a high-energy photon generates a large amount of visible light, the distance between the visible light and the different sensor units is different, so that the arrival time associated with the visible light sub-measure will be greatly different, that is, the error is large. Since the energy of the visible light is the same as the size of the electrical signal, the time associated with the visible light can be corrected based on the energy associated with the visible light.
应当理解,图3所示的方法300的各步骤的执行顺序仅是示例而非限制,方法300可以具有其他合适的执行顺序。例如,图3所示的方法300的步骤S320可以在步骤S330之后执行,或者二者同时执行。It should be understood that the order of execution of the various steps of method 300 illustrated in FIG. 3 is merely an example and not a limitation, and method 300 may have other suitable order of execution. For example, step S320 of method 300 shown in FIG. 3 may be performed after step S330, or both.
根据本发明实施例,步骤S340可以包括:根据与光电传感器阵列中的所有传感器单元所检测到的可见光子相关的能量计算高能光子在闪烁晶体中的目标反应位置;对于至少部分传感器单元中的每一个,根据与该传感器单元所检测到的可见光子相关的能量对与该传感器单元所检测到的可见 光子相关的到达时间进行修正,以获得与该传感器单元对应的修正时间;对于至少部分传感器单元中的每一个,根据目标反应位置对与该传感器单元对应的修正时间进行修正,以获得与该传感器单元对应的待平均时间。According to an embodiment of the present invention, step S340 may include: calculating a target reaction position of the high energy photon in the scintillation crystal according to the energy associated with the visible light sub-detected by all the sensor units in the photosensor array; for each of at least part of the sensor unit One, based on the energy pair associated with the visible light detected by the sensor unit, is visible to the sensor unit The photon-related arrival time is corrected to obtain a correction time corresponding to the sensor unit; for each of at least some of the sensor units, the correction time corresponding to the sensor unit is corrected according to the target reaction position to obtain the sensor The average time to be averaged for the unit.
图4示出根据本发明又一实施例的用于测量高能光子到达时间的方法400的流程示意图。图4所示的方法400的步骤S410-S430和S470分别与图3所示的方法300的步骤S310-S330和S350相对应,本领域技术人员通过以上关于图3的描述可以理解步骤S410-S430和S470的实施方式,不再赘述。根据本实施例,图3所示的步骤S340可以具体包括图4所示的步骤S440-S460。4 shows a flow diagram of a method 400 for measuring high energy photon arrival times in accordance with yet another embodiment of the present invention. Steps S410-S430 and S470 of the method 400 shown in FIG. 4 respectively correspond to steps S310-S330 and S350 of the method 300 shown in FIG. 3, and those skilled in the art can understand steps S410-S430 by the above description about FIG. And the implementation of S470 will not be described again. According to the embodiment, step S340 shown in FIG. 3 may specifically include steps S440-S460 shown in FIG. 4.
在步骤S440,根据与光电传感器阵列中的所有传感器单元所检测到的可见光子相关的能量计算高能光子在闪烁晶体中的目标反应位置。At step S440, the target reaction position of the high energy photon in the scintillation crystal is calculated based on the energy associated with the photons detected by all of the sensor units in the photosensor array.
高能光子(例如伽玛光子)在闪烁晶体中的速度接近真空光速c,而高能光子和闪烁晶体发生反应后,产生的可见光子的速度为:v=c/nr。nr为可见光子在闪烁晶体中的折射率。例如,在LSO晶体中,420nm波长的可见光子的折射率为1.8左右,速度为真空光速的0.56倍。因此,为了获得准确的时间测量结果,有必要对由高能光子和可见光子在闪烁晶体中的速度差异而造成的测量误差进行补偿。为了补偿速度差异造成的误差,需要知道可见光子在闪烁晶体中的传输距离,其等于高能光子的目标反应位置到检测到可见光子的传感器单元的距离。因此,可以首先确定高能光子的目标反应位置。The velocity of a high-energy photon (such as a gamma photon) in a scintillation crystal is close to the vacuum speed c, and after the high-energy photon and the scintillation crystal react, the velocity of the generated photon is: v=c/n r . n r is the refractive index of the visible light in the scintillation crystal. For example, in an LSO crystal, the refractive index of a 420 nm wavelength visible light is about 1.8, and the speed is 0.56 times the vacuum light speed. Therefore, in order to obtain accurate time measurement results, it is necessary to compensate for the measurement error caused by the difference in speed between the high-energy photons and the photons in the scintillation crystal. In order to compensate for the error caused by the speed difference, it is necessary to know the transmission distance of the visible light in the scintillation crystal, which is equal to the distance from the target reaction position of the high energy photon to the sensor unit in which the visible light is detected. Therefore, the target reaction position of the high energy photon can be determined first.
高能光子的目标反应位置可以通过利用基于光电传感器阵列120输出的电信号测量获得的能量信息来计算。下面结合图5描述目标反应位置的计算方法。图5是根据本发明一个实施例的基于九个不同反应位置对光电传感器阵列所检测到的可见光子的能量分布进行仿真的仿真结果。图5左下角示出仿真使用的xyz坐标系。The target reaction position of the high energy photon can be calculated by using the energy information obtained by measuring the electrical signal output based on the photosensor array 120. The calculation method of the target reaction position will be described below with reference to FIG. 5 is a simulation result simulating the energy distribution of photons detected by a photosensor array based on nine different reaction positions, in accordance with one embodiment of the present invention. The lower left corner of Figure 5 shows the xyz coordinate system used for the simulation.
在图5所示的实施例中,参与仿真的检测器系统的参数如下:闪烁晶体为LSO晶体,其大小为60毫米×60毫米×20毫米;光电传感器阵列的大小为10×10,单个传感器单元的大小为6毫米×6毫米。In the embodiment shown in Figure 5, the parameters of the detector system participating in the simulation are as follows: the scintillation crystal is an LSO crystal having a size of 60 mm x 60 mm x 20 mm; the photosensor array is 10 x 10 in size, a single sensor The size of the unit is 6 mm x 6 mm.
图5示出基于九个不同反应位置的仿真结果,每个仿真结果可以称为一个能量分布图。每个能量分布图中的x轴和y轴上的数值分别是10×10光电传感器阵列的横向和纵向编号,z轴表示从10×10光电传感器阵列中 的每个传感器单元读出的电信号的大小,其单位为光子数目。应当理解,传感器单元输出的电信号的大小和与传感器单元所检测到的可见光子相关的能量的大小是对应的。Figure 5 shows simulation results based on nine different reaction locations, each of which can be referred to as an energy profile. The values on the x-axis and y-axis in each energy profile are the lateral and longitudinal numbers of the 10 x 10 photosensor array, respectively, and the z-axis is from the 10 x 10 photosensor array. The size of the electrical signal read by each sensor unit is in the number of photons. It should be understood that the magnitude of the electrical signal output by the sensor unit and the magnitude of the energy associated with the visible light sub-detected by the sensor unit are corresponding.
在图5所示的9个能量分布图中,按照从左上角到右下角的顺序,伽玛光子在闪烁晶体中的反应位置的深度分别设定为2毫米、4毫米、6毫米、…18毫米。此外,对于每个能量分布图来说,伽玛光子都是从接近闪烁晶体的中心轴的位置处入射。由图5可见,伽玛光子在闪烁晶体中的反应位置不同,10×10光电传感器阵列测量得到的可见光子的能量分布(或称光分布)也不同。In the nine energy profiles shown in FIG. 5, the depths of the reaction positions of the gamma photons in the scintillation crystal are set to 2 mm, 4 mm, 6 mm, ..., respectively, in order from the upper left corner to the lower right corner. Millimeter. Further, for each energy profile, the gamma photons are incident from a position close to the central axis of the scintillation crystal. It can be seen from Fig. 5 that the reaction positions of the gamma photons in the scintillation crystal are different, and the energy distribution (or light distribution) of the visible light particles measured by the 10×10 photosensor array is also different.
具体地,可以参见左上角第一个能量分布图,伽玛光子的反应位置的深度为2毫米,由于距离下方的光电传感器阵列比较远,所以产生的可见光子比较分散,检测到可见光子的传感器单元较多。参见右下角最后一个能量分布图,伽玛光子的反应位置的深度为18毫米,由于距离下方的光电传感器阵列比较近,所以产生的可见光子比较集中,检测到可见光子的传感器单元较少。另外,图5所示的能量分布图均为在伽玛光子从接近闪烁晶体的中心轴的位置处入射的情况下仿真获得的,应当理解,如果伽玛光子的入射位置在xy平面上移动,则在能量分布图中,可见光子的能量集中区域也会跟随入射位置的移动方向变化。因此,通过可见光子的能量分布,可以反推出伽玛光子在闪烁晶体中的反应位置,称为位置计算。位置计算的方法可以是任何现有的或将来可能实现的位置计算方法,例如重心法、人工神经网络、解析法等方法,本发明不对此进行限制。Specifically, refer to the first energy distribution diagram in the upper left corner. The depth of the reaction position of the gamma photon is 2 mm. Since the photosensor array below is far away, the generated photons are scattered, and the photodetector sensor is detected. More units. Referring to the last energy distribution diagram in the lower right corner, the depth of the reaction position of the gamma photon is 18 mm. Since the photosensor array below is relatively close, the generated visible light is concentrated, and the sensor unit detecting the visible light is less. In addition, the energy distribution diagram shown in FIG. 5 is obtained by simulation in the case where the gamma photon is incident from a position close to the central axis of the scintillation crystal, and it should be understood that if the incident position of the gamma photon moves on the xy plane, Then, in the energy distribution map, the energy concentration region of the visible light also changes in accordance with the moving direction of the incident position. Therefore, by the energy distribution of the visible light, the reaction position of the gamma photon in the scintillation crystal can be reversed, which is called position calculation. The method of position calculation may be any existing or future possible position calculation method, such as a center of gravity method, an artificial neural network, an analytical method, etc., which is not limited by the present invention.
在步骤S450,对于至少部分传感器单元中的每一个,根据与该传感器单元所检测到的可见光子相关的能量对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的修正时间。In step S450, for each of at least some of the sensor units, the arrival time associated with the visible light sub-detected by the sensor unit is corrected according to the energy associated with the visible light sub-detected by the sensor unit to obtain The correction time corresponding to the sensor unit.
根据本发明一个实施例,读出电路130可以采用恒压触发方式测量与可见光子相关的到达时间。According to one embodiment of the invention, the readout circuitry 130 can measure the arrival time associated with the visible light sub-detector using a constant voltage triggering method.
在检测器系统中,读出电路的时间测量电路可以典型地采用两种触发方式,一种为恒比触发方式,其触发电平固定在输入信号(即传感器单元输出的电信号)的幅度的一定比例(例如10%)上;另一种为恒压触发方式,其触发电平固定在一个预设的电压上。In the detector system, the time measuring circuit of the readout circuit can typically adopt two trigger modes, one is a constant ratio trigger mode, and the trigger level is fixed at the amplitude of the input signal (ie, the electrical signal output by the sensor unit). A certain ratio (for example, 10%); the other is a constant voltage trigger mode, the trigger level is fixed at a preset voltage.
恒比触发方式有两个缺点:(a)电路较为复杂;(b)比较难以实现把 触发电平比例设得很低。由于高时间分辨率的检测器系统,一般要求触发发生在可见光子群中最早到达光电传感器的前几个光子的水平,即要求触发电平足够低。因此,恒比触发方式不太适合用于超高时间分辨率的检测器系统。The constant ratio trigger method has two disadvantages: (a) the circuit is more complicated; (b) it is more difficult to implement The trigger level ratio is set low. Due to the high time resolution detector system, it is generally required to trigger the level of the first few photons occurring in the visible light sub-group that first arrive at the photosensor, ie the trigger level is required to be sufficiently low. Therefore, the constant ratio triggering method is not well suited for detector systems with ultra-high time resolution.
与恒比触发方式相比,恒压触发方式由于触发电平是固定的,因此其所需的电路结构较为简单,电路成本低。因此,可以采用恒压触发方式来实现可见光子的时间测量。Compared with the constant ratio trigger mode, the constant voltage trigger mode has a simple circuit structure and a low circuit cost because the trigger level is fixed. Therefore, the constant voltage triggering method can be used to realize the time measurement of the visible light.
恒压触发方式的缺点主要在于触发的时间和输入信号的大小有关联。图6示出根据本发明一个实施例的传感器单元输出的两种不同大小的电信号的波形及与这两种电信号分别对应的触发时间的示意图。The disadvantage of the constant voltage triggering method is mainly that the triggering time is related to the size of the input signal. 6 is a diagram showing waveforms of two differently sized electrical signals output by a sensor unit and trigger times corresponding to the two electrical signals, respectively, in accordance with an embodiment of the present invention.
如图6所示,电信号W2的幅值比电信号W1小大约20%。在恒压触发情况下,电信号W2的实际触发时间比电信号W1晚45ps。因此,有必要对通过恒压触发方式获得的时间测量结果进行修正(即校准),使得时间测量结果和输入信号的大小无关。As shown in FIG. 6, the amplitude of the electrical signal W2 is about 20% smaller than the electrical signal W1. In the case of a constant voltage trigger, the actual trigger time of the electrical signal W2 is 45 ps later than the electrical signal W1. Therefore, it is necessary to correct (ie, calibrate) the time measurement obtained by the constant voltage triggering method so that the time measurement result is independent of the magnitude of the input signal.
示例性地,与可见光子相关的到达时间的修正方式可以包括多项式修正,例如可以采用线性修正。线性修正的公式如下:Illustratively, the manner of correction of the arrival time associated with the visible light sub-sense may include polynomial correction, for example linear correction may be employed. The formula for linear correction is as follows:
TA,k=Tm,k+αEm,k(2)T A,k =T m,k +αE m,k (2)
在式(2)中,TA,k为与至少部分传感器单元中的第k个传感器单元对应的修正时间,Tm,k和Em,k分别为与第k个传感器单元所检测到的可见光子相关的到达时间和能量,α为修正系数。In the formula (2), T A,k is a correction time corresponding to the kth sensor unit in at least part of the sensor units, and T m,k and E m,k are respectively detected with the kth sensor unit The time and energy of the visible light correlation, α is the correction factor.
可以将步骤S450中的修正过程称为触发电平修正,触发电平修正的目的是通过与每个传感器单元对应的能量测量结果来修正与该传感器单元对应的时间测量结果。The correction process in step S450 may be referred to as trigger level correction, and the purpose of the trigger level correction is to correct the time measurement result corresponding to the sensor unit by the energy measurement result corresponding to each sensor unit.
在步骤S460,对于至少部分传感器单元中的每一个,根据目标反应位置对与该传感器单元对应的修正时间进行修正,以获得与该传感器单元对应的待平均时间。In step S460, for each of at least some of the sensor units, the correction time corresponding to the sensor unit is corrected according to the target reaction position to obtain a time to average corresponding to the sensor unit.
如上文所述,高能光子和可见光子在闪烁晶体中的速度存在差异,导致读出电路130的时间测量结果存在误差。为了获得准确的时间测量结果,有必要对由高能光子和可见光子在闪烁晶体中的速度差异而造成的测量误差进行补偿。As described above, there is a difference in the speed of the high-energy photons and the visible light in the scintillation crystal, resulting in an error in the time measurement result of the readout circuit 130. In order to obtain accurate time measurements, it is necessary to compensate for the measurement error caused by the difference in speed between the high-energy photons and the photons in the scintillation crystal.
图7示出根据本发明一个实施例的高能光子在闪烁晶体内的目标反应 位置与传感器单元之间的距离关系的示意图。Figure 7 illustrates the target reaction of high energy photons in a scintillation crystal in accordance with one embodiment of the present invention. Schematic diagram of the relationship between position and sensor unit.
如图7所示,假设通过位置计算得到的高能光子在闪烁晶体中的目标反应位置的深度为h,该目标反应位置到光电传感器阵列中的某一传感器单元的中心位置的距离为d。例如,在图7中目标反应位置到光电传感器阵列中第四行第一列传感器单元的距离为d4,1,目标反应位置到光电传感器阵列中第二行第四列传感器单元的距离为d2,4。可以使用下式进行光速修正:As shown in FIG. 7, it is assumed that the depth of the target reaction position of the high-energy photon obtained by the position calculation in the scintillation crystal is h, and the distance from the target reaction position to the center position of a certain sensor unit in the photosensor array is d. For example, in Figure 7, the distance from the target reaction location to the fourth row of the first column of sensor elements in the photosensor array is d 4,1 , and the distance from the target reaction location to the second row and fourth column of the photosensor array is d 2,4 . The speed of light correction can be performed using the following formula:
Figure PCTCN2017110864-appb-000002
Figure PCTCN2017110864-appb-000002
在式(3)中,TB,k为与第k个传感器单元对应的待平均时间,nr为可见光子在闪烁晶体中的折射率,c为真空光速,dk为目标反应位置到第k个传感器单元的中心位置的距离,h为目标反应位置的深度。In the formula (3), T B,k is the average time corresponding to the kth sensor unit, n r is the refractive index of the visible light in the scintillation crystal, c is the vacuum light speed, and d k is the target reaction position to the The distance from the center position of the k sensor units, h is the depth of the target reaction position.
可以将式(2)代入式(3),得到:You can substitute equation (2) into equation (3) to get:
Figure PCTCN2017110864-appb-000003
Figure PCTCN2017110864-appb-000003
可以将步骤S460中的修正过程称为光速修正。可以使用式(4)同时进行触发电平修正和光速修正。The correction process in step S460 can be referred to as a light speed correction. Trigger level correction and light speed correction can be performed simultaneously using equation (4).
经过上述触发电平修正和光速修正,与可见光子相关的到达时间的准确度提高,可以使得最后计算获得的高能光子的到达时间也大大提高。After the above-mentioned trigger level correction and light speed correction, the accuracy of the arrival time associated with the visible light sub-score is improved, and the arrival time of the last calculated high-energy photon can be greatly improved.
需要指出的是,式(3)和(4)是在假定正电子湮灭后产生的一对伽玛光子垂直入射到连续晶体中(如图8所示)的情况下获得的。图8示出根据本发明一个实施例的高能光子及与其相符合的高能光子入射到各自对应的闪烁晶体的示意图。It is to be noted that the equations (3) and (4) are obtained in the case where a pair of gamma photons generated after the positron annihilation is assumed to be perpendicularly incident into the continuous crystal (as shown in FIG. 8). Figure 8 is a schematic diagram showing high energy photons and high energy photons corresponding thereto incident on respective flicker crystals, in accordance with one embodiment of the present invention.
事实上,图8所示的情况只是一种特例。更多的情况下,连续晶体检测器是按照一定几何配置排列的,例如如图9所示的那样沿着圆排列成圆环。图9示出根据本发明另一个实施例的高能光子及与其相符合的高能光子入射到各自对应的闪烁晶体的示意图。假设图9所示的位置A为需要测量到达时间的高能光子a的目标反应位置,位置B为与高能光子a相符合的高能光子b的反应位置,即本文所述的对侧反应位置。在图9所示的情况下,可以在计算得到方向相反的两个伽玛光子a和b分别在各自对应的闪烁晶体中的反应位置A和B之后,连接目标反应位置A和对侧反应位置B,以得到正电子湮灭的响应线AB。随后,可以延长响应线AB直到到达用于检测高能光子a的检测器系统的传感器阵列,延长线的长度(例如 图9中的从位置A延长到传感器阵列的延长部分的长度)可以记为lA。在这种情况下,式(3)可以修改为:In fact, the situation shown in Figure 8 is only a special case. More often, the continuous crystal detectors are arranged in a geometric configuration, such as a circular arrangement along a circle as shown in FIG. FIG. 9 is a schematic diagram showing high-energy photons and high-energy photons corresponding thereto incident on respective flicker crystals according to another embodiment of the present invention. It is assumed that the position A shown in Fig. 9 is the target reaction position of the high-energy photon a which needs to measure the arrival time, and the position B is the reaction position of the high-energy photon b which coincides with the high-energy photon a, that is, the opposite side reaction position described herein. In the case shown in FIG. 9, the target reaction position A and the opposite reaction position can be connected after calculating the reaction positions A and B of the two gamma photons a and b in opposite directions in the respective corresponding scintillation crystals. B, to obtain a response line AB of positron annihilation. Subsequently, the response line AB can be extended until the sensor array of the detector system for detecting high energy photons a is reached, the length of the extension line (e.g., the length from the position A in Fig. 9 to the extension of the sensor array) can be recorded as A. In this case, equation (3) can be modified to:
Figure PCTCN2017110864-appb-000004
Figure PCTCN2017110864-appb-000004
其中,TB,k为与至少部分传感器单元中的第k个传感器单元相关的待平均时间,nr为可见光子在闪烁晶体中的折射率,c为真空光速,dk为目标反应位置到第k个传感器单元的中心位置的距离,l为沿着与高能光子相符合的高能光子在布置于闪烁晶体对侧的闪烁晶体中的对侧反应位置与目标反应位置之间的连线、从目标反应位置开始延长直到到达光电传感器阵列的延长线的长度。可以理解,式(5)中的l表示上述lAWhere T B,k is the average time to be correlated with the kth sensor unit in at least part of the sensor units, n r is the refractive index of the visible light in the scintillation crystal, c is the vacuum light speed, and d k is the target reaction position to The distance from the center position of the kth sensor unit, l is the line between the opposite side reaction position and the target reaction position in the scintillation crystal arranged on the opposite side of the scintillation crystal along the high energy photon corresponding to the high energy photon. The target reaction position begins to extend until the length of the extension of the photosensor array is reached. It can be understood that l in the formula (5) represents the above 1 A .
可以将式(2)代入式(5),得到:You can substitute equation (2) into equation (5) to get:
Figure PCTCN2017110864-appb-000005
Figure PCTCN2017110864-appb-000005
与式(3)和式(4)相比,式(5)和式(6)的应用更广泛。本领域技术人员可以根据需要选择合适的公式来进行光速修正,当然,也可以通过组合这两种方式来进行光速修正。The formulas (5) and (6) are more widely used than the formulas (3) and (4). A person skilled in the art can select an appropriate formula to perform the light speed correction according to the need. Of course, the light speed correction can also be performed by combining the two methods.
应当理解,图4所示的方法400中的各步骤的执行顺序仅是示例而非限制,方法400可以具有其他合适的执行顺序。例如,步骤S440可以在步骤S430之前或与其同时执行,步骤S440也可以在步骤S450之后或与其同时执行。It should be understood that the order of execution of the various steps in the method 400 illustrated in FIG. 4 is merely an example and not a limitation, and the method 400 may have other suitable order of execution. For example, step S440 may be performed before or at the same time as step S430, and step S440 may also be performed after or at the same time as step S450.
虽然图4所示的方法400中实施了触发电平修正和光速修正,但是应当理解的是,这两种修正方法可以择一实现。示例性地,可以仅对与至少部分传感器单元所检测的可见光子相关的到达时间进行触发电平修正,经过触发电平修正所获得的到达时间即为待平均时间,用于参与随后的求平均操作。示例性地,可以仅对与至少部分传感器单元所检测的可见光子相关的到达时间进行光速修正,经过光速修正所获得的到达时间即为待平均时间,用于参与随后的求平均操作。当然,还可以单独地或以组合方式采用其他合适的修正方式来对与可见光子相关的到达时间进行修正,其均落入本发明的保护范围内。Although the trigger level correction and the light speed correction are implemented in the method 400 shown in FIG. 4, it should be understood that the two correction methods may alternatively be implemented. Illustratively, trigger level correction may be performed only on the arrival time associated with the visible light sub-detected by at least part of the sensor units, and the arrival time obtained by the trigger level correction is the average time to be used for participating in subsequent averaging operating. Illustratively, the speed of light correction may be performed only for the arrival time associated with the visible light sub-detected by at least a portion of the sensor unit, and the arrival time obtained by the speed of light correction is the average time to be used for participating in the subsequent averaging operation. Of course, it is also possible to use other suitable corrections, either individually or in combination, to correct the arrival time associated with the visible light sub-particles, all falling within the scope of the present invention.
根据本发明一个实施例,步骤S230(S350或S470)可以通过以下公式实现:According to an embodiment of the present invention, step S230 (S350 or S470) can be implemented by the following formula:
Figure PCTCN2017110864-appb-000006
Figure PCTCN2017110864-appb-000006
在式(7)中,Tfinal为高能光子的到达时间,TB,k为与至少部分传感器 单元中的第k个传感器单元对应的待平均时间,n为至少部分传感器单元的数目。In equation (7), T final is the arrival time of the high energy photon, T B,k is the average time to be averaged corresponding to the kth sensor unit in at least some of the sensor units, and n is the number of at least part of the sensor units.
假设参与平均的至少部分传感器单元为光电传感器阵列中的所有传感器单元,光电传感器阵列是M×N的阵列,则式(7)可以表示为:Assuming that at least part of the sensor units participating in the averaging are all sensor units in the photosensor array, and the photosensor array is an M×N array, equation (7) can be expressed as:
Figure PCTCN2017110864-appb-000007
Figure PCTCN2017110864-appb-000007
式(7)和式(8)表示的是通过算术平均法对待平均时间求平均的实现方式,这种方法比较简单,计算量小。Equations (7) and (8) represent an implementation method of averaging average time by arithmetic averaging, which is relatively simple and computationally intensive.
根据本发明另一实施例,步骤S230(S350或S470)可以通过以下公式实现:According to another embodiment of the present invention, step S230 (S350 or S470) can be implemented by the following formula:
Figure PCTCN2017110864-appb-000008
Figure PCTCN2017110864-appb-000008
在式(9)中,Tfinal为高能光子的到达时间,TB,k为与至少部分传感器单元中的第k个传感器单元对应的待平均时间,Ck为与第k个传感器单元相关的权重系数,n为至少部分传感器单元的数目。In equation (9), T final is the arrival time of the high energy photon, T B,k is the average time corresponding to the kth sensor unit in at least part of the sensor units, and C k is related to the kth sensor unit. Weight coefficient, n is the number of at least part of the sensor unit.
假设参与平均的至少部分传感器单元为光电传感器阵列中的所有传感器单元,光电传感器阵列是M×N的阵列,则式(9)可以表示为:Assuming that at least part of the sensor units participating in the average are all sensor units in the photosensor array, and the photosensor array is an M×N array, equation (9) can be expressed as:
Figure PCTCN2017110864-appb-000009
Figure PCTCN2017110864-appb-000009
式(9)和式(10)表示的是通过加权平均法对待平均时间求平均的实现方式。与算术平均方法相比,加权平均方法更复杂,所计算出的高能光子的到达时间更准确。Equations (9) and (10) represent an implementation in which the average time is averaged by the weighted average method. Compared with the arithmetic averaging method, the weighted averaging method is more complicated, and the calculated arrival time of high-energy photons is more accurate.
示例性地,在用加权平均方法计算高能光子的到达时间时,与每个传感器单元相关的权重系数Ck可以是与该传感器单元所检测到的可见光子相关的能量Ek或者与该传感器单元所检测到的可见光子相关的能量Ek的函数。Illustratively, when calculating the arrival time of the high energy photon by the weighted averaging method, the weight coefficient C k associated with each sensor unit may be the energy E k associated with the visible light sub-detected by the sensor unit or with the sensor unit A function of the detected energy-related energy E k .
例如,式(10)可以表示为:For example, equation (10) can be expressed as:
Figure PCTCN2017110864-appb-000010
Figure PCTCN2017110864-appb-000010
示例性地,在用加权平均方法计算高能光子的到达时间时,与每个传感器单元相关的权重系数Ck可以是与能量无关的理论值或经验值。例如,可以在初始将与光电传感器阵列中的所有传感器单元分别相关的权重系数设置为相同的值,随后可以通过实验等方式对与每个传感器单元相关的权 重系数进行更新,最终可以获得与每个传感器单元相关的合适的权重系数。Illustratively, when calculating the arrival time of a high energy photon by a weighted averaging method, the weighting factor Ck associated with each sensor unit may be a theoretical or empirical value that is independent of energy. For example, the weight coefficients respectively associated with all sensor units in the photosensor array may be initially set to the same value, and then the weight coefficients associated with each sensor unit may be updated by experiments or the like, and finally obtained and The appropriate weighting factor associated with each sensor unit.
根据本发明实施例,在选择至少部分传感器单元之前,上述方法200可以进一步包括:获取与光电传感器阵列中的每个传感器单元所检测到的可见光子相关的能量;选择至少部分传感器单元可以包括:从光电传感器阵列中的所有传感器单元中选择与其所检测到的可见光子相关的能量大于预设能量的传感器单元作为至少部分传感器单元。According to an embodiment of the present invention, before the selecting at least part of the sensor unit, the method 200 may further include: acquiring energy related to the visible light sub-detected by each sensor unit in the photosensor array; selecting at least part of the sensor unit may include: A sensor unit whose energy associated with the detected visible light is greater than the preset energy is selected from all of the sensor units in the photosensor array as at least part of the sensor unit.
本实施例中的能量获取步骤可以参考图3所示的方法300的步骤S320或图4所示的方法400的步骤S420,在此不再赘述。可以只对光电传感器阵列中,能量大于一定预设值的传感器单元的待平均时间求算术平均值(参考式(7))或者加权平均值(参考式(9))。由于可见光子在闪烁晶体中传播时,可能直射到传感器单元上,也可能经过一次或多次反射之后才到达传感器单元。经过反射之后到达传感器单元的可见光子的到达时间误差较大,无法正确反映高能光子的到达时间,因此可以将这样的可见光子的到达时间过滤掉,使其不参与后续的求平均操作。这样处理可以减少由于某些传感器单元所检测到的未从伽玛光子的反应位置直射到达该传感器单元的可见光子所带来的时间测量误差。For the energy acquisition step in this embodiment, reference may be made to step S320 of the method 300 shown in FIG. 3 or step S420 of the method 400 shown in FIG. 4, and details are not described herein again. The arithmetic mean (refer to equation (7)) or the weighted average (reference equation (9)) may be obtained only for the average time of the sensor unit whose energy is greater than a certain preset value in the photosensor array. Since the visible light propagates in the scintillation crystal, it may be directed to the sensor unit, or it may arrive at the sensor unit after one or more reflections. The arrival time error of the visible light reaching the sensor unit after reflection is large, and the arrival time of the high-energy photon cannot be correctly reflected. Therefore, the arrival time of such a visible light sub-segment can be filtered out so that it does not participate in the subsequent averaging operation. Such processing can reduce the time measurement error caused by some of the sensor units that are not directly reflected from the reaction position of the gamma photons to the photons of the sensor unit.
虽然本文结合图1描述了本发明提供的用于测量高能光子到达时间的方法(及装置)所适用的检测器系统的构造,然而,其仅是示例而非对本发明的限制。例如,本发明提供的用于测量高能光子到达时间的方法(及装置)还可以适用于基于图1所示的检测器系统进行改进所获得的检测器系统。下面描述基于图1所示的检测器系统进行改进所获得的检测器系统的一些示例。Although the construction of the detector system to which the method (and apparatus) for measuring high energy photon arrival times provided by the present invention is applied is described herein in connection with FIG. 1, it is merely an example and not a limitation of the present invention. For example, the method (and apparatus) for measuring high energy photon arrival time provided by the present invention can also be applied to a detector system obtained based on the improvement of the detector system shown in FIG. Some examples of detector systems obtained based on improvements in the detector system shown in Figure 1 are described below.
在将本发明提供的用于测量高能光子到达时间的方法(及装置)应用于图1所示的检测器系统的情况下,当高能光子(例如伽玛光子)在连续晶体110中的反应位置距离光电传感器阵列120很近时,可见光子将过于集中在光电传感器阵列120中的某几个传感器单元上。可见光子的过于集中会导致在式(7)至(11)的运算过程中实际参与平均的传感器单元的数目减少,从而降低时间测量结果的准确度。In the case where the method (and apparatus) for measuring high energy photon arrival time provided by the present invention is applied to the detector system shown in FIG. 1, when a high-energy photon (for example, gamma photon) is in a reaction position in the continuous crystal 110 When in close proximity to the photosensor array 120, the visible light will be too concentrated on some of the sensor units in the photosensor array 120. The excessive concentration of the visible light causes a decrease in the number of sensor units actually participating in the average of the operations of the equations (7) to (11), thereby reducing the accuracy of the time measurement result.
因此,为了提高用于测量高能光子到达时间的方法(及装置)的时间测量结果的准确度,可以对图1所示的检测器系统进行改进。本发明提供的用于测量高能光子到达时间的方法(及装置)适用于这类改进的检测器 系统,方法的流程(及装置的相应功能模块)基本不变,不过所涉及的某些数据的计算方式可能需要发生一些改变。Therefore, in order to improve the accuracy of the time measurement results of the method (and apparatus) for measuring the arrival time of high energy photons, the detector system shown in Fig. 1 can be improved. The method (and apparatus) for measuring high energy photon arrival time provided by the present invention is suitable for such improved detectors The flow of the system, method (and the corresponding functional modules of the device) is basically the same, but some of the data involved may need to be changed in some way.
在一个示例中,可以在连续晶体110与光电传感器阵列120中间插入光导,使得可见光子能够更均匀地分布在光电传感器阵列120上。光导的厚度可以通过实验或者仿真的方法来确定。对于这样的检测器系统来说,在将用于测量高能光子到达时间的方法(及装置)应用于该检测器系统时,需要将光导的影响考虑进去。在上文结合图1所示的检测器系统描述本发明提供的方法时,假定连续晶体110与光电传感器阵列120是直接耦合的,二者之间不存在空隙。在连续晶体110与光电传感器阵列120中间插入光导的话,由于光导存在一定厚度,其对可见光子的传播发生影响,因此上文所述的高能光子的目标反应位置的计算方式需要改变。在插入光导的情况下的目标反应位置的计算可以采用本领域常规算法实现,本文不做赘述。此外,式(3)至(6)也需要做出相应改变,需要将可见光子在光导中的传播时间考虑进去。In one example, a light guide can be inserted between the continuous crystal 110 and the photosensor array 120 such that the visible light ions can be more evenly distributed across the photosensor array 120. The thickness of the light guide can be determined experimentally or by simulation. For such a detector system, the effects of the light guide need to be taken into account when applying the method (and apparatus) for measuring the arrival time of high energy photons to the detector system. When the method provided by the present invention is described above in connection with the detector system illustrated in Figure 1, it is assumed that the continuous crystal 110 is directly coupled to the photosensor array 120 with no gap therebetween. When a light guide is inserted between the continuous crystal 110 and the photosensor array 120, since the light guide has a certain thickness, which affects the propagation of the visible light, the calculation method of the target reaction position of the high-energy photon described above needs to be changed. The calculation of the target reaction position in the case of inserting the light guide can be implemented by a conventional algorithm in the art, and will not be described herein. In addition, the equations (3) to (6) also need to be changed accordingly, and it is necessary to take into account the propagation time of the visible light in the light guide.
在另一示例中,可以在连续晶体110的多个面上耦合光电传感器阵列。例如,可以在连续晶体的两个相对的面上耦合光电传感器阵列。再例如,可以在连续晶体的所有六个面上都耦合光电传感器阵列。图10示出根据本发明一个实施例的改进的基于连续晶体的检测器系统的示意图。如图10所示,连续晶体的两个相对的面(示例性地定义为上底面和下底面)均与光电传感器阵列耦合。对于在连续晶体的多个面上耦合光电传感器阵列的情况,可以利用读出电路测量与连续晶体的多个面耦合的所有光电传感器阵列所检测到的可见光子的到达时间,并将与连续晶体的多个面耦合的所有光电传感器阵列所检测到的可见光子的到达时间输出到数据处理模块。数据处理模块实现用于测量高能光子到达时间的方法。也就是说,与连续晶体的多个面耦合的所有光电传感器阵列中的全部或至少部分传感器单元参与高能光子的到达时间的运算。In another example, a photosensor array can be coupled on multiple faces of the continuous crystal 110. For example, a photosensor array can be coupled on two opposing faces of a continuous crystal. As another example, a photosensor array can be coupled across all six faces of a continuous crystal. Figure 10 shows a schematic diagram of an improved continuous crystal based detector system in accordance with one embodiment of the present invention. As shown in Figure 10, two opposing faces of the continuous crystal (exemplarily defined as an upper bottom surface and a lower bottom surface) are coupled to the photosensor array. For the case of coupling a photosensor array on multiple faces of a continuous crystal, the readout circuit can be used to measure the arrival time of the photons detected by all photosensor arrays coupled to the plurality of faces of the continuous crystal, and will be associated with the continuous crystal The arrival time of the visible light sub-detected by all of the photosensor arrays coupled by the plurality of faces is output to the data processing module. The data processing module implements a method for measuring the arrival time of high energy photons. That is, all or at least a portion of all of the photosensor arrays coupled to the plurality of faces of the continuous crystal participate in the calculation of the arrival time of the high energy photons.
对于在连续晶体的多个面上耦合光电传感器阵列的情况,在针对与不同的面耦合的光电传感器阵列进行光速修正时,目标反应位置的深度h(参见式(3)和(4))是不同的,同理,延长线的长度l(参见式(5)和(6))也是不同的。以图10所示的检测器系统为例,对于与连续晶体的上底面耦合的光电传感器阵列来说,计算与该光电传感器阵列中的每个传感器单元 对应的待平均时间TB,k时,目标反应位置的深度h是伽玛光子的目标反应位置与连续晶体的上底面之间的垂直距离;对于与连续晶体的下底面耦合的光电传感器阵列来说,计算与该光电传感器阵列中的每个传感器单元对应的待平均时间TB,k时,目标反应位置的深度h是伽玛光子的目标反应位置与连续晶体的下底面之间的垂直距离。式(5)和式(6)中的l的情况与h类似,不再赘述。虽然上面以图10所示的在连续晶体的两个面上耦合光电传感器阵列的检测器系统作为示例进行描述,然而,本领域技术人员参考以上描述可以理解在连续晶体的其他数目的面上耦合光电传感器阵列时h和l的计算方式,不再赘述。总之,对于在连续晶体的多个面上耦合光电传感器阵列的情况,在针对每个传感器单元进行光速修正时,需要考虑该传感器单元所属的光电传感器阵列相对于连续晶体的位置。根据本发明另一方面,提供一种用于测量高能光子到达时间的装置。图11示出根据本发明一个实施例的用于测量高能光子到达时间的装置1100的示意性框图。For the case where the photosensor array is coupled on multiple faces of a continuous crystal, the depth h of the target reaction position (see equations (3) and (4)) is when the light velocity correction is performed for the photosensor array coupled to the different faces. Different, the same reason, the length l of the extension line (see equations (5) and (6)) is also different. Taking the detector system shown in FIG. 10 as an example, for the photosensor array coupled to the upper surface of the continuous crystal , when the average time T B,k corresponding to each sensor unit in the photosensor array is calculated, The depth h of the target reaction position is the vertical distance between the target reaction position of the gamma photon and the upper bottom surface of the continuous crystal; for the photosensor array coupled to the lower bottom surface of the continuous crystal, the calculation is performed with each of the photosensor arrays The depth h of the target reaction position when the sensor unit corresponds to the average time T B,k is the vertical distance between the target reaction position of the gamma photon and the lower bottom surface of the continuous crystal. The case of l in the formula (5) and the formula (6) is similar to h, and will not be described again. Although the above described detector system for coupling a photosensor array on both sides of a continuous crystal as shown in FIG. 10 is described as an example, it will be understood by those skilled in the art with reference to the above description that coupling is performed on other numbers of faces of the continuous crystal. The calculation method of h and l in the photosensor array will not be described again. In summary, in the case of coupling a photosensor array on a plurality of faces of a continuous crystal, when performing light velocity correction for each sensor unit, it is necessary to consider the position of the photosensor array to which the sensor unit belongs with respect to the continuous crystal. According to another aspect of the invention, an apparatus for measuring the arrival time of high energy photons is provided. Figure 11 shows a schematic block diagram of an apparatus 1100 for measuring high energy photon arrival times, in accordance with one embodiment of the present invention.
如图11所示,装置1100包括时间获取模块1110、待平均时间获得模块1120和平均模块1130。As shown in FIG. 11, the device 1100 includes a time acquisition module 1110, an average time acquisition module 1120, and an averaging module 1130.
时间获取模块1110用于获取与光电传感器阵列中的每个传感器单元所检测到的、高能光子与闪烁晶体发生反应所产生的可见光子相关的到达时间,其中,所述闪烁晶体是连续晶体,所述光电传感器阵列包括与所述闪烁晶体耦合的多个传感器单元。The time acquisition module 1110 is configured to acquire an arrival time associated with a visible light generated by a high-energy photon and a scintillation crystal detected by each sensor unit in the photosensor array, wherein the scintillation crystal is a continuous crystal. The photosensor array includes a plurality of sensor units coupled to the scintillation crystal.
待平均时间获得模块1120用于至少基于与所述光电传感器阵列中的每个传感器单元所检测到的可见光子相关的到达时间,获得与所述光电传感器阵列中的选定的至少部分传感器单元中的每一个分别对应的待平均时间。The averaging time obtaining module 1120 is configured to obtain at least a portion of the selected at least one of the photosensor arrays based on an arrival time associated with the photodetector detected by each of the photosensor arrays Each of them corresponds to the average time to be averaged.
平均模块1130用于对与所述至少部分传感器单元中的每一个分别对应的待平均时间求平均,以获得所述高能光子的到达时间。The averaging module 1130 is configured to average the time to average corresponding to each of the at least some of the sensor units to obtain an arrival time of the high energy photons.
示例性地,待平均时间获得模块1120可以包括:传感器选择子模块,用于选择至少部分传感器单元;以及修正子模块,用于对于至少部分传感器单元中的每一个,对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的待平均时间。Illustratively, the averaging time obtaining module 1120 may include: a sensor selection sub-module for selecting at least a portion of the sensor unit; and a correction sub-module for detecting, for each of the at least some of the sensor units, the sensor unit The arrival time of the visible photons associated is corrected to obtain the average time to be averaged corresponding to the sensor unit.
示例性地,装置1100可以进一步包括:能量获取模块,用于获取与光 电传感器阵列中的每个传感器单元所检测到的可见光子相关的能量;修正子模块可以包括:修正单元,用于对于至少部分传感器单元中的每一个,至少根据与该传感器单元所检测到的可见光子相关的能量对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的待平均时间。Illustratively, the apparatus 1100 may further include: an energy acquisition module for acquiring and light The visible light sub-related energy detected by each sensor unit in the electrical sensor array; the correction sub-module may include: a correction unit for each of the at least part of the sensor units, at least according to the detection with the sensor unit The visible light-related energy is corrected for the arrival time associated with the visible light detected by the sensor unit to obtain a time to average corresponding to the sensor unit.
示例性地,修正单元可以包括:位置计算子单元,用于根据与光电传感器阵列中的所有传感器单元所检测到的可见光子相关的能量计算高能光子在闪烁晶体中的目标反应位置;第一修正子单元,用于对于至少部分传感器单元中的每一个,根据与该传感器单元所检测到的可见光子相关的能量对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的修正时间;第二修正子单元,用于对于至少部分传感器单元中的每一个,根据目标反应位置对与该传感器单元对应的修正时间进行修正,以获得与该传感器单元对应的待平均时间。Illustratively, the correction unit may include: a position calculation sub-unit for calculating a target reaction position of the high-energy photon in the scintillation crystal according to the energy associated with the visible light sub-detected by all the sensor units in the photosensor array; a subunit for correcting, for each of the at least some of the sensor units, an arrival time associated with the visible light sub-detected by the sensor unit based on energy associated with the visible light sub-detected by the sensor unit to obtain a correction time corresponding to the sensor unit; a second correction subunit, configured to correct, for each of the at least some of the sensor units, a correction time corresponding to the sensor unit according to the target reaction position to obtain a corresponding to the sensor unit Waiting for the average time.
示例性地,第一修正子单元可以包括第一修正组件,用于通过以下公式对与至少部分传感器单元中的每一个所检测到的可见光子相关的到达时间进行修正:Illustratively, the first correction subunit may include a first correction component for correcting an arrival time associated with the visible light sub-detected by each of the at least some of the sensor units by the following formula:
TA,k=Tm,k+αEm,kT A,k =T m,k +αE m,k ,
其中,TA,k为与至少部分传感器单元中的第k个传感器单元对应的修正时间,Tm,k和Em,k分别为与第k个传感器单元所检测到的可见光子相关的到达时间和能量,α为修正系数。Where T A,k is the correction time corresponding to the kth sensor unit in at least part of the sensor units, and T m,k and E m,k are respectively the arrivals associated with the visible light sub-detected by the k-th sensor unit Time and energy, α is the correction factor.
示例性地,第二修正子单元可以包括第二修正组件,用于通过以下公式对与至少部分传感器单元中的每一个对应的修正时间进行修正:Illustratively, the second correction subunit may include a second correction component for correcting the correction time corresponding to each of the at least partial sensor units by the following formula:
Figure PCTCN2017110864-appb-000011
Figure PCTCN2017110864-appb-000011
其中,TB,k为与第k个传感器单元对应的待平均时间,nr为可见光子在闪烁晶体中的折射率,c为真空光速,dk为目标反应位置到第k个传感器单元的中心位置的距离,h为目标反应位置的深度。Where T B,k is the average time corresponding to the kth sensor unit, n r is the refractive index of the visible light in the scintillation crystal, c is the vacuum light speed, and d k is the target reaction position to the kth sensor unit The distance from the center position, where h is the depth of the target reaction position.
示例性地,第二修正子单元可以包括第三修正组件,用于通过以下公式对与至少部分传感器单元中的每一个对应的修正时间进行修正:Illustratively, the second correction subunit may include a third correction component for correcting the correction time corresponding to each of the at least partial sensor units by the following formula:
Figure PCTCN2017110864-appb-000012
Figure PCTCN2017110864-appb-000012
其中,TB,k为与第k个传感器单元相关的待平均时间,nr为可见光子在闪烁晶体中的折射率,c为真空光速,dk为目标反应位置到第k个传感 器单元的中心位置的距离,l为沿着与高能光子相符合的高能光子在布置于闪烁晶体对侧的闪烁晶体中的对侧反应位置与目标反应位置之间的连线、从目标反应位置开始延长直到到达光电传感器阵列的延长线的长度。Where T B,k is the average time to be correlated with the kth sensor unit, n r is the refractive index of the visible light in the scintillation crystal, c is the vacuum light speed, and d k is the target reaction position to the kth sensor unit The distance from the center position, l is the line connecting the opposite-side reaction position and the target reaction position in the scintillation crystal arranged on the opposite side of the scintillation crystal, along with the high-energy photon, extending from the target reaction position until The length of the extension line that reaches the photosensor array.
示例性地,平均模块1130可以包括平均子模块,用于通过以下公式对与至少部分传感器单元中的每一个分别对应的待平均时间求平均:Illustratively, the averaging module 1130 can include an averaging sub-module for averaging the average time to be averaged corresponding to each of at least some of the sensor units by the following formula:
Figure PCTCN2017110864-appb-000013
Figure PCTCN2017110864-appb-000013
其中,Tfinal为高能光子的到达时间,TB,k为与至少部分传感器单元中的第k个传感器单元对应的待平均时间,Ck为与第k个传感器单元相关的权重系数,n为至少部分传感器单元的数目。Where T final is the arrival time of the high energy photon, T B,k is the average time corresponding to the kth sensor unit in at least part of the sensor units, and C k is the weight coefficient associated with the kth sensor unit, n is The number of at least some of the sensor units.
示例性地,Ck为与第k个传感器单元所检测到的可见光子相关的能量或者为与第k个传感器单元所检测到的可见光子相关的能量的函数。Illustratively, Ck is a function of the energy associated with the photon detected by the kth sensor unit or the energy associated with the photon detected by the kth sensor unit.
示例性地,Ck为与第k个传感器单元相关的经验值。Illustratively, Ck is the empirical value associated with the kth sensor unit.
示例性地,装置1100可以进一步包括:能量获取模块,用于获取与光电传感器阵列中的每个传感器单元所检测到的可见光子相关的能量;传感器选择子模块可以包括:选择单元,用于从光电传感器阵列中的所有传感器单元中选择与其所检测到的可见光子相关的能量大于预设能量的传感器单元作为至少部分传感器单元。Illustratively, the apparatus 1100 may further include: an energy acquisition module, configured to acquire energy related to the visible light sub-detected by each of the photosensor arrays; the sensor selection sub-module may include: a selection unit, configured to Among all the sensor units in the photosensor array, a sensor unit whose energy related to the detected visible light is greater than the preset energy is selected as at least part of the sensor unit.
本领域技术人员根据以上关于用于测量高能光子到达时间的方法的描述以及附图1至10,能够理解本文所公开的用于测量高能光子到达时间的装置1100的实施方式及其优点等,为了简洁,本文不对此进行赘述。Those skilled in the art can understand the embodiments of the apparatus 1100 for measuring high energy photon arrival time and its advantages, etc., in accordance with the above description of the method for measuring high energy photon arrival time and FIGS. 1 to 10, in order to understand Concise, this article does not repeat this.
在本文的描述中,“与可见光子相关的到达时间”可以替换为“可见光子的到达时间”,二者表示相同的含义。类似地,“与可见光子相关的能量”可以替换为“可见光子的能量”,二者表示相同的含义。在“可见光子”前面具有定语的情况下,同样可以按照类似方式获得替代表达。例如,“与光电传感器阵列中的每个传感器单元所检测到的可见光子相关的到达时间”可以替换为“光电传感器阵列中的每个传感器单元所检测到的可见光子的到达时间”。In the description herein, "the arrival time associated with the visible light sub-" can be replaced with "the arrival time of the visible light sub-", both of which represent the same meaning. Similarly, the "energy associated with the visible light" can be replaced by the "energy of the visible light", both of which represent the same meaning. In the case where there is an attribute before the "visible light", the alternative expression can also be obtained in a similar manner. For example, "the arrival time associated with the visible light sub-detected by each sensor unit in the photosensor array" may be replaced with "the arrival time of the visible light sub-detected by each sensor unit in the photosensor array."
本发明已经通过上述实施例进行了说明,但应当理解的是,上述实施例只是用于举例和说明的目的,而非意在将本发明限制于所描述的实施例范围内。此外本领域技术人员可以理解的是,本发明并不局限于上述实施例,根据本发明的教导还可以做出更多种的变型和修改,这些变型和修改 均落在本发明所要求保护的范围以内。本发明的保护范围由附属的权利要求书及其等效范围所界定。The present invention has been described by the above-described embodiments, but it should be understood that the above-described embodiments are only for the purpose of illustration and description. Further, it will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and various modifications and changes can be made in accordance with the teachings of the present invention. All fall within the scope of the claimed invention. The scope of the invention is defined by the appended claims and their equivalents.
本领域普通技术人员可以意识到,结合本文中所公开的实施例描述的各示例的单元及算法步骤,能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行,取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能,但是这种实现不应认为超出本发明的范围。Those of ordinary skill in the art will appreciate that the elements and algorithm steps of the various examples described in connection with the embodiments disclosed herein can be implemented in electronic hardware or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the solution. A person skilled in the art can use different methods for implementing the described functions for each particular application, but such implementation should not be considered to be beyond the scope of the present invention.
在本申请所提供的几个实施例中,应该理解到,所揭露的装置和方法,可以通过其它的方式实现。例如,以上所描述的装置实施例仅仅是示意性的,例如,所述单元的划分,仅仅为一种逻辑功能划分,实际实现时可以有另外的划分方式,例如多个单元或组件可以结合或者可以集成到另一个设备,或一些特征可以忽略,或不执行。 In the several embodiments provided by the present application, it should be understood that the disclosed apparatus and method may be implemented in other manners. For example, the device embodiments described above are merely illustrative. For example, the division of the unit is only a logical function division. In actual implementation, there may be another division manner, for example, multiple units or components may be combined or Can be integrated into another device, or some features can be ignored or not executed.

Claims (22)

  1. 一种用于测量高能光子到达时间的方法,包括:A method for measuring high energy photon arrival time, comprising:
    获取与光电传感器阵列中的每个传感器单元所检测到的、高能光子与闪烁晶体发生反应所产生的可见光子相关的到达时间,其中,所述闪烁晶体是连续晶体,所述光电传感器阵列包括与所述闪烁晶体耦合的多个传感器单元;Obtaining an arrival time associated with a photon generated by each sensor unit in the photosensor array, wherein the scintillation crystal is a continuous crystal, and the photosensor array includes a plurality of sensor units coupled to the scintillation crystal;
    至少基于与所述光电传感器阵列中的每个传感器单元所检测到的可见光子相关的到达时间,获得与所述光电传感器阵列中的选定的至少部分传感器单元中的每一个分别对应的待平均时间;以及Obtaining an average to be averaged corresponding to each of the selected at least partial sensor units in the photosensor array based at least on an arrival time associated with the visible light sub-detected by each of the photosensor arrays Time;
    对与所述至少部分传感器单元中的每一个分别对应的待平均时间求平均,以获得所述高能光子的到达时间。An average time to be averaged corresponding to each of the at least some of the sensor units is averaged to obtain an arrival time of the high energy photons.
  2. 根据权利要求1所述的方法,其特征在于,所述至少基于与所述光电传感器阵列中的每个传感器单元所检测到的可见光子相关的到达时间,获得与所述光电传感器阵列中的选定的至少部分传感器单元中的每一个分别对应的待平均时间包括:The method of claim 1 wherein said obtaining is selected from said photosensor array based at least on an arrival time associated with a photon detected by each of said photosensor arrays The corresponding average time to be determined for each of the at least some of the sensor units includes:
    选择所述至少部分传感器单元;以及Selecting at least a portion of the sensor unit;
    对于所述至少部分传感器单元中的每一个,对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的待平均时间。For each of the at least some sensor units, the arrival time associated with the visible light sub-detected by the sensor unit is modified to obtain a time to average corresponding to the sensor unit.
  3. 根据权利要求2所述的方法,其特征在于,The method of claim 2 wherein:
    在所述对于所述至少部分传感器单元中的每一个,对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的待平均时间之前,所述方法进一步包括:Determining, for each of the at least some of the sensor units, an arrival time associated with the visible light sub-detected by the sensor unit to obtain a time to average after the sensor unit is corresponding to the method include:
    获取与所述光电传感器阵列中的每个传感器单元所检测到的可见光子相关的能量;Obtaining energy associated with the visible light sub-detected by each sensor unit in the photosensor array;
    所述对于所述至少部分传感器单元中的每一个,对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的待平均时间包括:For each of the at least some sensor units, correcting an arrival time associated with the visible light sub-detected by the sensor unit to obtain a time to average corresponding to the sensor unit includes:
    对于所述至少部分传感器单元中的每一个,至少根据与该传感器单元所检测到的可见光子相关的能量对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的待平均时间。 For each of the at least some sensor units, the arrival time associated with the visible light sub-detected by the sensor unit is modified based at least on the energy associated with the visible light sub-detected by the sensor unit to obtain the sensor The average time to be averaged for the unit.
  4. 根据权利要求3所述的方法,其特征在于,所述对于所述至少部分传感器单元中的每一个,至少根据与该传感器单元所检测到的可见光子相关的能量对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的待平均时间包括:The method according to claim 3, wherein said detecting, for each of said at least some of said sensor units, at least based on an energy pair associated with a visible light sub-detected by said sensor unit The spectroscopy-related arrival time is corrected to obtain a time to average corresponding to the sensor unit including:
    根据与所述光电传感器阵列中的所有传感器单元所检测到的可见光子相关的能量计算所述高能光子在所述闪烁晶体中的目标反应位置;Calculating a target reaction position of the high energy photon in the scintillation crystal according to energy associated with photons detected by all sensor units in the photosensor array;
    对于所述至少部分传感器单元中的每一个,For each of the at least some of the sensor units,
    根据与该传感器单元所检测到的可见光子相关的能量对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的修正时间;Correcting an arrival time associated with the visible light sub-detected by the sensor unit according to energy associated with the visible light detected by the sensor unit to obtain a correction time corresponding to the sensor unit;
    根据所述目标反应位置对与该传感器单元对应的修正时间进行修正,以获得与该传感器单元对应的待平均时间。Correcting the correction time corresponding to the sensor unit according to the target reaction position to obtain a time to be averaged corresponding to the sensor unit.
  5. 根据权利要求4所述的方法,其特征在于,所述对于所述至少部分传感器单元中的每一个,根据与该传感器单元所检测到的可见光子相关的能量对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的修正时间通过以下公式实现:The method according to claim 4, wherein said detecting, with respect to each of said at least some of said sensor units, an energy pair associated with a visible light sub-detected by said sensor unit The visible time-dependent arrival time is corrected to obtain a correction time corresponding to the sensor unit by the following formula:
    TA,k=Tm,k+αEm,kT A,k =T m,k +αE m,k ,
    其中,TA,k为与所述至少部分传感器单元中的第k个传感器单元对应的修正时间,Tm,k和Em,k分别为与所述第k个传感器单元所检测到的可见光子相关的到达时间和能量,α为修正系数。Where T A,k is a correction time corresponding to the kth sensor unit in the at least part of the sensor units, and T m,k and E m,k are respectively visible light detected with the kth sensor unit The sub-correlation time and energy, α is the correction factor.
  6. 根据权利要求5所述的方法,其特征在于,所述对于所述至少部分传感器单元中的每一个,根据所述目标反应位置对与该传感器单元对应的修正时间进行修正,以获得与该传感器单元对应的待平均时间通过以下公式实现:The method according to claim 5, wherein said correcting time corresponding to said sensor unit is corrected for each of said at least some sensor units based on said target reaction position to obtain a sensor The average time to be compared for the unit is implemented by the following formula:
    Figure PCTCN2017110864-appb-100001
    Figure PCTCN2017110864-appb-100001
    其中,TB,k为与所述第k个传感器单元对应的待平均时间,nr为可见光子在所述闪烁晶体中的折射率,c为真空光速,dk为所述目标反应位置到所述第k个传感器单元的中心位置的距离,h为所述目标反应位置的深度。Where T B,k is the average time corresponding to the kth sensor unit, n r is the refractive index of the visible light in the scintillation crystal, c is the vacuum light speed, and d k is the target reaction position to The distance from the center position of the kth sensor unit, h is the depth of the target reaction position.
  7. 根据权利要求5所述的方法,其特征在于,所述对于所述至少部分传感器单元中的每一个,根据所述目标反应位置对与该传感器单元对应的 修正时间进行修正,以获得与该传感器单元对应的待平均时间通过以下公式实现:The method according to claim 5, wherein said for each of said at least some sensor units corresponds to said sensor unit according to said target reaction position The correction time is corrected to obtain the average time to be averaged corresponding to the sensor unit by the following formula:
    Figure PCTCN2017110864-appb-100002
    Figure PCTCN2017110864-appb-100002
    其中,TB,k为与所述第k个传感器单元相关的待平均时间,nr为可见光子在所述闪烁晶体中的折射率,c为真空光速,dk为所述目标反应位置到所述第k个传感器单元的中心位置的距离,l为沿着与所述高能光子相符合的高能光子在布置于所述闪烁晶体对侧的闪烁晶体中的对侧反应位置与所述目标反应位置之间的连线、从所述目标反应位置开始延长直到到达所述光电传感器阵列的延长线的长度。Where T B,k is the average time to be correlated with the kth sensor unit, n r is the refractive index of the visible light in the scintillation crystal, c is the vacuum light speed, and d k is the target reaction position to a distance from a central position of the kth sensor unit, 1 being a reaction between the opposite side of the high-energy photon that coincides with the high-energy photon in a scintillation crystal disposed on the opposite side of the scintillation crystal The line between the locations extends from the target reaction location until the length of the extension of the photosensor array is reached.
  8. 根据权利要求1至7任一项所述的方法,其特征在于,所述对与所述至少部分传感器单元中的每一个分别对应的待平均时间求平均,以获得所述高能光子的到达时间通过以下公式实现:The method according to any one of claims 1 to 7, wherein the pair of average time corresponding to each of the at least some sensor units is averaged to obtain an arrival time of the high-energy photon It is implemented by the following formula:
    Figure PCTCN2017110864-appb-100003
    Figure PCTCN2017110864-appb-100003
    其中,Tfinal为所述高能光子的到达时间,TB,k为与所述至少部分传感器单元中的第k个传感器单元对应的待平均时间,Ck为与所述第k个传感器单元相关的权重系数,n为所述至少部分传感器单元的数目。Where T final is the arrival time of the high energy photon, T B,k is the average time to be averaged corresponding to the kth sensor unit in the at least part of the sensor units, and C k is related to the kth sensor unit The weighting factor, n is the number of the at least partial sensor units.
  9. 根据权利要求8所述的方法,其特征在于,Ck为与所述第k个传感器单元所检测到的可见光子相关的能量或者为与所述第k个传感器单元所检测到的可见光子相关的能量的函数。The method according to claim 8, wherein C k is energy associated with the visible light sub-detected by the k-th sensor unit or is related to the visible light sub-detected by the k-th sensor unit The function of energy.
  10. 根据权利要求8所述的方法,其特征在于,Ck为与所述第k个传感器单元相关的经验值。The method of claim 8 wherein C k is an empirical value associated with said kth sensor unit.
  11. 根据权利要求2所述的方法,其特征在于,The method of claim 2 wherein:
    在所述选择所述至少部分传感器单元之前,所述方法进一步包括:Before the selecting the at least a portion of the sensor unit, the method further comprises:
    获取与所述光电传感器阵列中的每个传感器单元所检测到的可见光子相关的能量;Obtaining energy associated with the visible light sub-detected by each sensor unit in the photosensor array;
    所述选择所述至少部分传感器单元包括:The selecting the at least part of the sensor unit comprises:
    从所述光电传感器阵列中的所有传感器单元中选择与其所检测到的可见光子相关的能量大于预设能量的传感器单元作为所述至少部分传感器单元。A sensor unit whose energy associated with the detected visible light is greater than a preset energy is selected from all of the sensor units in the photosensor array as the at least part of the sensor unit.
  12. 一种用于测量高能光子到达时间的装置,包括: A device for measuring the arrival time of high energy photons, comprising:
    时间获取模块,用于获取与光电传感器阵列中的每个传感器单元所检测到的、高能光子与闪烁晶体发生反应所产生的可见光子相关的到达时间,其中,所述闪烁晶体是连续晶体,所述光电传感器阵列包括与所述闪烁晶体耦合的多个传感器单元;a time acquisition module, configured to acquire an arrival time associated with a photon generated by a high-energy photon and a scintillation crystal detected by each sensor unit in the photosensor array, wherein the scintillation crystal is a continuous crystal The photosensor array includes a plurality of sensor units coupled to the scintillation crystal;
    待平均时间获得模块,用于至少基于与所述光电传感器阵列中的每个传感器单元所检测到的可见光子相关的到达时间,获得与所述光电传感器阵列中的选定的至少部分传感器单元中的每一个分别对应的待平均时间;以及An averaging time acquisition module for obtaining at least a portion of selected sensor cells in the photosensor array based on at least an arrival time associated with a photodetector detected by each of the photosensor arrays Each of the corresponding average time to be averaged;
    平均模块,用于对与所述至少部分传感器单元中的每一个分别对应的待平均时间求平均,以获得所述高能光子的到达时间。An averaging module for averaging the average time to be corresponding to each of the at least some of the sensor units to obtain an arrival time of the high energy photons.
  13. 根据权利要求12所述的装置,其特征在于,所述待平均时间获得模块包括:The device according to claim 12, wherein the to-average time obtaining module comprises:
    传感器选择子模块,用于选择所述至少部分传感器单元;以及a sensor selection sub-module for selecting the at least a portion of the sensor unit;
    修正子模块,用于对于所述至少部分传感器单元中的每一个,对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的待平均时间。And a correction submodule configured to, for each of the at least some of the sensor units, correct an arrival time associated with the visible light sub-detected by the sensor unit to obtain a time to average corresponding to the sensor unit.
  14. 根据权利要求13所述的装置,其特征在于,The device of claim 13 wherein:
    所述装置进一步包括:能量获取模块,用于获取与所述光电传感器阵列中的每个传感器单元所检测到的可见光子相关的能量;The apparatus further includes: an energy acquisition module, configured to acquire energy associated with the visible light sub-detected by each of the photosensor arrays;
    所述修正子模块包括:修正单元,用于对于所述至少部分传感器单元中的每一个,至少根据与该传感器单元所检测到的可见光子相关的能量对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的待平均时间。The correction sub-module includes: a correction unit, configured, for each of the at least part of the sensor units, at least according to an energy pair associated with the visible light sub-detected by the sensor unit, the photo-detection detected with the sensor unit The associated arrival time is corrected to obtain a time to average corresponding to the sensor unit.
  15. 根据权利要求14所述的装置,其特征在于,所述修正单元包括:The apparatus according to claim 14, wherein said correction unit comprises:
    位置计算子单元,用于根据与所述光电传感器阵列中的所有传感器单元所检测到的可见光子相关的能量计算所述高能光子在所述闪烁晶体中的目标反应位置;a position calculation subunit, configured to calculate a target reaction position of the high energy photon in the scintillation crystal according to energy associated with a photon detected by all sensor units in the photosensor array;
    第一修正子单元,用于对于所述至少部分传感器单元中的每一个,根据与该传感器单元所检测到的可见光子相关的能量对与该传感器单元所检测到的可见光子相关的到达时间进行修正,以获得与该传感器单元对应的修正时间; a first correcting subunit, configured, for each of the at least part of the sensor units, to perform an arrival time related to the visible light sub-detected by the sensor unit according to energy associated with the visible light sub-detected by the sensor unit Correcting to obtain a correction time corresponding to the sensor unit;
    第二修正子单元,用于对于所述至少部分传感器单元中的每一个,根据所述目标反应位置对与该传感器单元对应的修正时间进行修正,以获得与该传感器单元对应的待平均时间。And a second correction subunit, configured to correct, for each of the at least part of the sensor units, a correction time corresponding to the sensor unit according to the target reaction position to obtain a time to be averaged corresponding to the sensor unit.
  16. 根据权利要求15所述的装置,其特征在于,所述第一修正子单元包括第一修正组件,用于通过以下公式对与所述至少部分传感器单元中的每一个所检测到的可见光子相关的到达时间进行修正:The apparatus according to claim 15, wherein said first correction subunit comprises a first correction component for correlating the visible light sub-detections detected with each of said at least partial sensor units by the following formula The arrival time is corrected:
    TA,k=Tm,k+αEm,kT A,k =T m,k +αE m,k ,
    其中,TA,k为与所述至少部分传感器单元中的第k个传感器单元对应的修正时间,Tm,k和Em,k分别为与所述第k个传感器单元所检测到的可见光子相关的到达时间和能量,α为修正系数。Where T A,k is a correction time corresponding to the kth sensor unit in the at least part of the sensor units, and T m,k and E m,k are respectively visible light detected with the kth sensor unit The sub-correlation time and energy, α is the correction factor.
  17. 根据权利要求16所述的装置,其特征在于,所述第二修正子单元包括第二修正组件,用于通过以下公式对与所述至少部分传感器单元中的每一个对应的修正时间进行修正:The apparatus according to claim 16, wherein said second correction subunit comprises a second correction component for correcting a correction time corresponding to each of said at least partial sensor units by:
    Figure PCTCN2017110864-appb-100004
    Figure PCTCN2017110864-appb-100004
    其中,TB,k为与所述第k个传感器单元对应的待平均时间,nr为可见光子在所述闪烁晶体中的折射率,c为真空光速,dk为所述目标反应位置到所述第k个传感器单元的中心位置的距离,h为所述目标反应位置的深度。Where T B,k is the average time corresponding to the kth sensor unit, n r is the refractive index of the visible light in the scintillation crystal, c is the vacuum light speed, and d k is the target reaction position to The distance from the center position of the kth sensor unit, h is the depth of the target reaction position.
  18. 根据权利要求16所述的方法,其特征在于,所述第二修正子单元包括第三修正组件,用于通过以下公式对与所述至少部分传感器单元中的每一个对应的修正时间进行修正:The method according to claim 16, wherein said second correction subunit comprises a third correction component for correcting a correction time corresponding to each of said at least partial sensor units by the following formula:
    Figure PCTCN2017110864-appb-100005
    Figure PCTCN2017110864-appb-100005
    其中,TB,k为与所述第k个传感器单元相关的待平均时间,nr为可见光子在所述闪烁晶体中的折射率,c为真空光速,dk为所述目标反应位置到所述第k个传感器单元的中心位置的距离,l为沿着与所述高能光子相符合的高能光子在布置于所述闪烁晶体对侧的闪烁晶体中的对侧反应位置与所述目标反应位置之间的连线、从所述目标反应位置开始延长直到到达所述光电传感器阵列的延长线的长度。Where T B,k is the average time to be correlated with the kth sensor unit, n r is the refractive index of the visible light in the scintillation crystal, c is the vacuum light speed, and d k is the target reaction position to a distance from a central position of the kth sensor unit, 1 being a reaction between the opposite side of the high-energy photon that coincides with the high-energy photon in a scintillation crystal disposed on the opposite side of the scintillation crystal The line between the locations extends from the target reaction location until the length of the extension of the photosensor array is reached.
  19. 根据权利要求12至18任一项所述的装置,其特征在于,所述平均模块包括平均子模块,用于通过以下公式对与所述至少部分传感器单元中的每一个分别对应的待平均时间求平均: The apparatus according to any one of claims 12 to 18, wherein the averaging module comprises an averaging submodule for averaging time corresponding to each of the at least some sensor units by the following formula Average:
    Figure PCTCN2017110864-appb-100006
    Figure PCTCN2017110864-appb-100006
    其中,Tfinal为所述高能光子的到达时间,TB,k为与所述至少部分传感器单元中的第k个传感器单元对应的待平均时间,Ck为与所述第k个传感器单元相关的权重系数,n为所述至少部分传感器单元的数目。Where T final is the arrival time of the high energy photon, T B,k is the average time to be averaged corresponding to the kth sensor unit in the at least part of the sensor units, and C k is related to the kth sensor unit The weighting factor, n is the number of the at least partial sensor units.
  20. 根据权利要求19所述的装置,其特征在于,Ck为与所述第k个传感器单元所检测到的可见光子相关的能量或者为与所述第k个传感器单元所检测到的可见光子相关的能量的函数。The apparatus according to claim 19, wherein C k is energy associated with the visible light sub-detected by the k-th sensor unit or is related to the visible light sub-detected by the k-th sensor unit The function of energy.
  21. 根据权利要求19所述的装置,其特征在于,Ck为与所述第k个传感器单元相关的经验值。The apparatus of claim 19 wherein C k is an empirical value associated with said kth sensor unit.
  22. 根据权利要求13所述的装置,其特征在于,The device of claim 13 wherein:
    所述装置进一步包括:能量获取模块,用于获取与所述光电传感器阵列中的每个传感器单元所检测到的可见光子相关的能量;The apparatus further includes: an energy acquisition module, configured to acquire energy associated with the visible light sub-detected by each of the photosensor arrays;
    所述传感器选择子模块包括:选择单元,用于从所述光电传感器阵列中的所有传感器单元中选择与其所检测到的可见光子相关的能量大于预设能量的传感器单元作为所述至少部分传感器单元。 The sensor selection sub-module includes: a selection unit, configured to select, from all of the sensor units in the photosensor array, a sensor unit whose energy associated with the detected visible light is greater than a preset energy as the at least part of the sensor unit .
PCT/CN2017/110864 2016-11-15 2017-11-14 Method and apparatus for measuring arrival time of high-energy photons WO2018090900A1 (en)

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