WO2018076177A1 - Cooling package and power module - Google Patents

Cooling package and power module Download PDF

Info

Publication number
WO2018076177A1
WO2018076177A1 PCT/CN2016/103234 CN2016103234W WO2018076177A1 WO 2018076177 A1 WO2018076177 A1 WO 2018076177A1 CN 2016103234 W CN2016103234 W CN 2016103234W WO 2018076177 A1 WO2018076177 A1 WO 2018076177A1
Authority
WO
WIPO (PCT)
Prior art keywords
power module
cooling package
heat
components
module
Prior art date
Application number
PCT/CN2016/103234
Other languages
French (fr)
Inventor
Tai MA
Peihua LI
Original Assignee
Telefonaktiebolaget Lm Ericsson (Publ)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget Lm Ericsson (Publ) filed Critical Telefonaktiebolaget Lm Ericsson (Publ)
Priority to US16/344,640 priority Critical patent/US10959319B2/en
Priority to PCT/CN2016/103234 priority patent/WO2018076177A1/en
Priority to EP16920196.9A priority patent/EP3533303B1/en
Publication of WO2018076177A1 publication Critical patent/WO2018076177A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/025—Constructional details relating to cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/22—Cooling by heat conduction through solid or powdered fillings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H01F2027/065—Mounting on printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A cooling package in a power module (401,503) comprises a first side for placing one or more semiconductor components (406,501); one or more holes for placing one or more magnetic components (305); and a second side with one or more connection parts. Therefore, all components of a power module (401,503) which need to dissipate the heat have two thermal dissipation paths, therefore the heat inside the module can be greatly reduced.

Description

COOLING PACKAGE AND POWER MODULE TECHNICAL FIELD
The present disclosure relates to a cooling technology， and more particularly， to a cooling package for power modules.
BACKGROUND
In sealed environment， such as outdoor telecom radio units， the whole unit is water proof which means no fan inside the product， therefore the power module’s heat dissipation path is the only conduction through heat sink. Consequently， most of power modules need de-rating over 50％current (As shown by Fig. 1) in sealed environment.
For high power stranded power module， there are two technical solutions exist the prior art， one is multilayer PCB (Printed Circuit Board) power module (As shown by Fig. 2) ， the winding for magnetic component 107 is designed in the multilayer PCB 101， and another one is aluminum base power module (As shown by Fig. 3) ， it has two-story structure， all discrete power semiconductor 201 and magnetic component 202 is mounted in aluminum base board 205， control circuit is in control board 207， there is multiple connection pin 206 to connect this two board.
For multilayer PCB module， the top side contact with heat sink 102 for cooling by TIM (Thermal Interface Material) 103， input pin 104 and output pin 105 in bottom side is mounted to mother board 106 only for electrical connection. For aluminum base power module which is two-story structure， power semiconductor component 201 and magnetic components 202 is mounted to aluminum plate 203 which can contact heat-sink 204 by TIM 205 for cooling， small pin 206 in aluminum plate 203 connect with control board 207 for communication， input pin 208 and output pin 209 is mounted with mother board 210 for electrical connection. For aluminum board 203， between aluminum base 211 and copper 212， there is TIM 213 inside， the lower thermal resistance for TIM the higher cost.
Intension to increase power density， one way is increasing efficiency which is not economical and limited by electric technology； another way is minimizing thermal resistance with heat sink.
But both solutions have shortage， for PCB， and all components which need to dissipate the heat， includes magnetic component， power semiconductor component， and controller， only have one cooling path which is conduct the heat to heat-sink by TIMs， The TIM is used for compensating the mechanical tolerance. Therefore， the module has very high thermal resistance in system， for sealed environment； there is no airflow inside. Consequently， the power module has to de-rate the output power a lot.
SUMMARY
It is an object of the present disclosure to provide a cooling package， a power module and an electronic device， capable of greatly reducing the heat inside the module by using two thermal dissipation paths.
In a first aspect， a cooling package in a power module is provided. The cooling package comprising a first side for placing one or more semiconductor components； one or more holes for placing one or more magnetic components； and a second side with one or more connection parts.
In an embodiment， the connection parts are solder bumps using for heat conducting.
In a second aspect， a power module is provided. The power module comprising one or more semiconductor components； one or more magnetic components； and a cooling package， wherein the cooling package comprising a first side for placing one or more semiconductor components； one or more holes for placing one or more magnetic components； and a second side with one or more connection parts.
With the embodiments of the present disclosure， all components of a power module which need to dissipate the heat have two thermal dissipation paths， therefore the heat inside the module can be greatly reduced.
BRIEF DESCRIPTION OF THE DRAWINGS
The above and other objects， features and advantages will be more apparent from the following description of embodiments with reference to the figures， in which：
Fig. 1 is a figure illustrating a current de-rating of a power module in the prior art；
Fig. 2 is a figure illustrating a thermal dissipation in a multilayer PCB power module；
Fig. 3 is a figure illustrating a thermal dissipation in an aluminum base power module；
Fig. 4 is a figure illustrating a power module according to an embodiment of the present disclosure.
Fig. 5 is a figure illustrating a thermal dissipation of a power module according to an embodiment of the present disclosure.
Fig. 6 is a figure illustrating a thermal dissipation of a power module using two thermal dissipation paths according to an embodiment of the present disclosure.
Fig. 7 is a figure illustrating a thermal dissipation of a power module according to another embodiment of the present disclosure.
DETAILED DESCRIPTION
The embodiments of the disclosure will be detailed below with reference to the drawings. It should be noted that the following embodiments are illustrative only， rather than limiting the scope of the disclosure.
Fig. 4 is a figure illustrating a power module according to an embodiment of the present disclosure. A multilayer power module which have top side 301 and bottom side 302. All components are mounted on top side 301， the bottom side 302 reserved for connection parts. The connection parts can be pre-soldered as solder bumps 303 to provide good solder-ability. As an alternative， the connection parts can be metal connection pads or pins.
Meanwhile， a cooling package is illustrated， which comprising a top side 301 for placing one or more semiconductor components； one or more holes for placing one or more magnetic components 305； and a bottom side with one or more connection parts.
The module can be picked and placed by SMT (Surface Mount Technology) machine and reflow compatible. The board which power module mounted is host board. The module can be mounted on top side of host board or on the bottom side of host board based on different application scenarios.
Fig. 5 is a figure illustrating a thermal dissipation of a power module according to an embodiment of the present disclosure. As shown by Fig. 5， all solder bumps of multilayer PCB power module 401 will be soldered to equivalent solder pads on host board by soldering. Large areas of cooper internal and external which belong to reference net like GND on host board 402 connected by thermal vias 403 which can tightly contact to heat sink 404 directly without any TIM 405， therefore， the module can dissipate the heat through the host board 402， or through the baseplate or cover 407 then host board.
Fig. 6 is a figure illustrating a thermal dissipation of a power module using two thermal dissipation paths according to an embodiment of the present disclosure. By using the cooling package disclosed by the present disclosure， the multilayer PCB and all components which need to dissipate the heat can have two paths to conduct the heat：
For PCB： the first thermal dissipation path is from solder bumps to host board 402， another one is the side contact with heat sink 404 and TIM 405.
For semiconductor components 406， 501： Heat generated components on module like MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) ， Diodes， ICs and other semiconductor components will connect to solder bumps 502 of power module 503 through many via holes 504. At the same time， solder bumps of power module are connected to pads on host board. The pads on host board 505 will connect to large area copper 506 on inner layer or external layer through via holes as same reference net. Top side of host board can be connected to baseplate or cover 407 by TIMs for thermal transfer and heat balance. This net can spread heat out to the whole host board 505 through PCB materials.
For magnetic components 408： transformers and inductors are bottle neck for switch power module to output more power， because the temperature limit  normally is 125 degree and high power loss. For heat dissipation of cores in these components： one side can contact with cover/baseplate by TIM， another side can contact with heat-sink by TIM. For heat dissipation of windings in these components： one path is solder pads conduct the heat to host board， another path is through the semiconductor component’s case， as for most topology the magnetic component’s winding should connect with MOSFET or Diodes， also through the cores to dissipate the heat as normal power module.
Fig. 7 is a figure illustrating a thermal dissipation of a power module according to another embodiment of the present disclosure. In this embodiment， bottom side of host board does not have enough space for a power module， such as heat pipes in heat-sink. For this case， the module 601 can be mounted to another side of host board 602， the module still has double heat dissipation path， one path is that solder with host board by solder bumps 603 which contact with heat-sink 604， another path is contact with cover or baseplate 605 by TIM 606.
The disclosure has been described above with reference to embodiments thereof. It should be understood that various modifications， alternations and additions can be made by those skilled in the art without departing from the spirits and scope of the disclosure. Therefore， the scope of the disclosure is not limited to the above particular embodiments but only defined by the claims as attached.

Claims (10)

  1. A cooling package in a power module， comprising：
    -a first side for placing one or more semiconductor components；
    -one or more holes for placing one or more magnetic components； and
    -a second side with one or more connection parts.
  2. The cooling package of claim 1， wherein the connection parts are solder bumps using for heat conducting.
  3. The cooling package of claim 1， wherein one or more thermal vias are formed under the connection parts.
  4. The cooling package of claim 1， wherein a heat sink is mounted upon the first side.
  5. The cooling package of claim 1， wherein a host board is mounted upon the second side.
  6. The cooling package of claim 1， wherein a cover or a baseplate is mounted upon the second side.
  7. The cooling package of claim 1， wherein a cover or a baseplate is mounted upon the first side.
  8. The cooling package of claim 1， wherein a heat sink is mounted upon the second side.
  9. A power module， comprising：
    -one or more semiconductor components；
    -one or more magnetic components； and
    -a cooling package of any of claims 1-8.
  10. An electronic device， comprising a power module of claim 9.
PCT/CN2016/103234 2016-10-25 2016-10-25 Cooling package and power module WO2018076177A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US16/344,640 US10959319B2 (en) 2016-10-25 2016-10-25 Cooling package and power module
PCT/CN2016/103234 WO2018076177A1 (en) 2016-10-25 2016-10-25 Cooling package and power module
EP16920196.9A EP3533303B1 (en) 2016-10-25 2016-10-25 Power module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/103234 WO2018076177A1 (en) 2016-10-25 2016-10-25 Cooling package and power module

Publications (1)

Publication Number Publication Date
WO2018076177A1 true WO2018076177A1 (en) 2018-05-03

Family

ID=62024162

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/103234 WO2018076177A1 (en) 2016-10-25 2016-10-25 Cooling package and power module

Country Status (3)

Country Link
US (1) US10959319B2 (en)
EP (1) EP3533303B1 (en)
WO (1) WO2018076177A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018164324A (en) * 2017-03-24 2018-10-18 株式会社オートネットワーク技術研究所 Electric connection box
DE102018109920A1 (en) * 2018-04-25 2019-10-31 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Cooling of power electronic circuits
CN111354692A (en) * 2020-03-10 2020-06-30 上海瞻芯电子科技有限公司 Power heat dissipation device
US11751353B2 (en) 2020-07-24 2023-09-05 Texas Instruments Incorporated Power conversion module and method of forming the same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020054480A1 (en) 1999-05-12 2002-05-09 Ionel Jitaru Enhanced thermal coupling for electronic boards
US20050152117A1 (en) * 2003-04-28 2005-07-14 Belady Christian L. Stack up assembly
CN101802937A (en) * 2007-09-25 2010-08-11 弗莱克斯电子有限责任公司 thermally enhanced magnetic transformer
CN102917571A (en) * 2012-09-28 2013-02-06 深圳麦格米特电气股份有限公司 Power supply power device radiation structure
CN103650655A (en) * 2011-06-28 2014-03-19 瑞典爱立信有限公司 Electronic device with heat-dissipating structure
CN103929935A (en) * 2013-01-15 2014-07-16 起源技术美国股份有限公司 Radiating Emi/rfi Shielding Device
CN204859861U (en) * 2015-07-27 2015-12-09 台达电子企业管理（上海）有限公司 Module power source

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5608566A (en) * 1995-08-11 1997-03-04 The United States Of America As Represented By The Secretary Of The Army Multi-directional electro-optic switch
US6466454B1 (en) 1999-05-18 2002-10-15 Ascom Energy Systems Ag Component transformer
US6058013A (en) * 1998-07-02 2000-05-02 Motorola Inc. Molded housing with integral heatsink
US6940384B2 (en) * 2002-03-11 2005-09-06 Netpower Technologies, Inc. Packaging techniques for a high-density power converter
US7468648B2 (en) * 2004-03-10 2008-12-23 Det International Holding Limited Magnetic device
TWI292300B (en) * 2005-11-21 2008-01-01 Delta Electronics Inc Electronic device with dual heat dissipating structures
US9507391B2 (en) * 2011-11-28 2016-11-29 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Heat sink with orientable fins
US9439333B2 (en) 2013-01-15 2016-09-06 Genesis Technology Usa, Inc. Heat-dissipating EMI/RFI shield

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020054480A1 (en) 1999-05-12 2002-05-09 Ionel Jitaru Enhanced thermal coupling for electronic boards
US20050152117A1 (en) * 2003-04-28 2005-07-14 Belady Christian L. Stack up assembly
CN101802937A (en) * 2007-09-25 2010-08-11 弗莱克斯电子有限责任公司 thermally enhanced magnetic transformer
CN103650655A (en) * 2011-06-28 2014-03-19 瑞典爱立信有限公司 Electronic device with heat-dissipating structure
CN102917571A (en) * 2012-09-28 2013-02-06 深圳麦格米特电气股份有限公司 Power supply power device radiation structure
CN103929935A (en) * 2013-01-15 2014-07-16 起源技术美国股份有限公司 Radiating Emi/rfi Shielding Device
CN204859861U (en) * 2015-07-27 2015-12-09 台达电子企业管理（上海）有限公司 Module power source

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3533303A4

Also Published As

Publication number Publication date
EP3533303A4 (en) 2019-10-30
EP3533303A1 (en) 2019-09-04
EP3533303B1 (en) 2023-01-25
US10959319B2 (en) 2021-03-23
US20200068700A1 (en) 2020-02-27

Similar Documents

Publication Publication Date Title
US9425131B2 (en) Package structure
CN109427707B (en) Three-dimensional packaging structure and packaging method of power device
US10959319B2 (en) Cooling package and power module
US20040037044A1 (en) Heat sink for surface mounted power devices
US10199904B2 (en) Cooling a heat-generating electronic device
KR20090034889A (en) Chip module for complete power train
US7551455B2 (en) Package structure
US20120181067A1 (en) Circuit board
US8749990B2 (en) Multiple-board power converter
EP3364729A1 (en) Printed wiring board, air conditioner and a method for manufacturing printed wiring board
US20140321062A1 (en) Heat sink
WO2019218344A1 (en) Power supply device and printed circuit board device comprising same
US10957618B2 (en) Thermally conductive electronic packaging
CN110634813B (en) Packaging structure
US20210378133A1 (en) Surface Mounted Heat Buffer
JP4919689B2 (en) Module board
WO2021179989A1 (en) Power heat dissipation device
JP2010251582A (en) Dc-dc converter
WO2019237915A1 (en) High-integrated electronic control board and electrical appliance
WO2003019997A1 (en) Improved heat sink for surface mounted power devices
Liang et al. Thermal Management of GaN Power Modules Using Copper Core PCBs with Direct Heatsink Pads
JP3203643U (en) Electronic equipment with heat dissipation structure for heat-generating parts
JP2015046503A (en) Electronic module
JP2022022924A (en) Printed circuit board with heat dissipation terminal and heat sink for heat dissipation
JP2014179523A (en) Substrate unit

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16920196

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 2016920196

Country of ref document: EP

Effective date: 20190527