WO2018066759A1 - Boîtier de surveillance de température utilisant un réseau de capteurs et procédé associé - Google Patents

Boîtier de surveillance de température utilisant un réseau de capteurs et procédé associé Download PDF

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Publication number
WO2018066759A1
WO2018066759A1 PCT/KR2016/015069 KR2016015069W WO2018066759A1 WO 2018066759 A1 WO2018066759 A1 WO 2018066759A1 KR 2016015069 W KR2016015069 W KR 2016015069W WO 2018066759 A1 WO2018066759 A1 WO 2018066759A1
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WIPO (PCT)
Prior art keywords
temperature
sensor array
monitoring box
measurement object
average
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PCT/KR2016/015069
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English (en)
Korean (ko)
Inventor
김선국
이민구
이성호
정의현
Original Assignee
경희대학교산학협력단
전자부품연구원
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Publication of WO2018066759A1 publication Critical patent/WO2018066759A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer

Definitions

  • the present invention relates to a temperature monitoring box using a sensor array and a method thereof, and more particularly to attaching a temperature sensor array including a plurality of temperature sensors to a measurement object requiring temperature control, and measuring an average value of temperature.
  • a temperature monitoring box and a method for monitoring a measurement object in real time are particularly preferred.
  • the conventional wireless thermometer mainly used a short range thermometer using RFID and NFC.
  • the RFID wireless thermometer is a method of obtaining temperature information when a user tags a measurement object
  • the NFC wireless thermometer is a method of transmitting temperature information obtained from a measurement object to a user terminal (or a smart device).
  • the conventional wireless thermometer is a thin thin film, which can be attached to the desired place of the user mainly has a purpose for measuring the body temperature.
  • the conventional wireless thermometer is capable of low power short-range wireless communication using NFC and RFID, but because it operates on a principle of transmitting only one temperature information measured based on a predetermined time setting, rather than delivering a lot of information obtained. There was a problem that it is not suitable as a real-time temperature measuring device.
  • the conventional wireless thermometer is measured from one temperature sensor, there is a problem that it is not possible to measure the temperature information in a large area or a different area of the measurement object, the reliability of the information measured by one temperature sensor There was a limit of low.
  • An object of the present invention is to measure the average temperature for a measurement object that requires temperature control from a temperature sensor array including a plurality of temperature sensors formed in a multi-channel sensor that can reduce the error for the different resistance value of each temperature sensor To provide a temperature monitoring box using the array and a method thereof.
  • Another object of the present invention is to provide a temperature monitoring box and a method using the sensor array that can measure the exact temperature of the contact area of the measurement object by fabricating a temperature sensor array including a plurality of temperature sensors in a patch form will be.
  • Another object of the present invention is to sense the temperature in a wide contact area or different areas of the measurement object, calculate the average value of the temperature to provide the user with accurate temperature information of the measurement object, the user through the terminal It is to provide a temperature monitoring box and a method using a sensor array that can monitor the temperature of the sensor in real time.
  • the temperature monitoring box using the sensor array is a box case having an internal space formed to store a plurality of measurement targets that require temperature control, a plurality of connected to the box case, a plurality of channels formed A temperature sensor array formed on the substrate, wherein the temperature sensor includes a terminal for measuring a resistance value with respect to the temperature of the measurement object, and the temperature sensor array and the temperature sensor array respectively attached to the measurement object; And an average temperature calculator configured to calculate an average value of temperatures for each of the measured objects based on the resistance values measured from the measured values.
  • the temperature monitoring box using the sensor array may further include a communication unit for transmitting the average value of the calculated temperature to the outside and a power supply unit for supplying driving power.
  • Each of the plurality of temperature sensors is formed by transferring the multichannel patterned by a photolithography process onto the substrate, and the multichannel is formed on a film formed of a polyimide solution. ) May be formed into a thin film.
  • Each of the plurality of temperature sensors may include the multichannel formed in a meander pattern, and the multichannel may be a thermistor.
  • the temperature sensor array may be connected to an IC circuit formed on the substrate to form a patch structure.
  • the average temperature calculator calculates an average value of the temperature based on the resistance value measured from the remaining temperature sensors, except for a temperature sensor indicating the highest or lowest temperature among the plurality of temperature sensors based on the measured resistance value. can do.
  • the average temperature calculator may calculate the average value of the temperature by excluding a temperature sensor detecting a sudden temperature change exceeding a predetermined reference among the plurality of temperature sensors.
  • the substrate may be formed of at least one material of paper, polymer, woven fabric, and insulated metal foil.
  • a temperature monitoring method using a sensor array that monitors a temperature of a measurement object requiring temperature control using a temperature monitoring box using a sensor array includes measuring the temperature from an array of temperature sensors attached to the measurement object. Detecting the presence or absence of a change in resistance value with respect to the temperature of the object and calculating an average value of the temperature for the measurement object based on the resistance value measured from the temperature sensor array, wherein the temperature sensor array includes a box A plurality of temperature sensors connected to the case and formed in a multi-channel, wherein the temperature sensors include terminals for measuring the resistance value with respect to the temperature of the measurement object. Attached to each.
  • a temperature sensor array including a plurality of temperature sensors may be manufactured in a patch to measure an accurate temperature of a contact area of a measurement object.
  • the user by detecting the temperature in a wide contact area or different areas of the measurement object, calculate the average value of the temperature to provide the user with accurate temperature information of the measurement object, the user through the terminal
  • the temperature of the measuring object can be monitored in real time.
  • FIG. 1 shows an example of implementing a temperature monitoring box using a sensor array according to an embodiment of the present invention.
  • FIG. 2 is a block diagram illustrating a configuration of a temperature monitoring box using a sensor array according to an exemplary embodiment of the present invention.
  • FIG. 3 is a diagram illustrating an embodiment of a temperature sensor array according to an embodiment of the present invention.
  • Figure 4 shows an example of monitoring the temperature of the measurement object using a temperature monitoring box according to an embodiment of the present invention.
  • 5A and 5B show results of resistance values according to temperature changes of a measurement object using one temperature sensor.
  • 6A and 6B illustrate results of average values according to temperature changes of a measurement object using a temperature sensor array formed of a plurality of temperature sensors.
  • FIG. 7 illustrates a result of deviation according to temperature change of a measurement object using a temperature sensor array formed of a plurality of temperature sensors.
  • FIG. 8 is a flowchart illustrating a temperature monitoring method using a sensor array for monitoring a temperature of a measurement object requiring temperature control using a temperature monitoring box using a sensor array according to an embodiment of the present invention.
  • an embodiment As used herein, “an embodiment”, “an example”, “side”, “an example”, etc., should be construed that any aspect or design described is better or advantageous than other aspects or designs. It is not.
  • the term 'or' means inclusive or 'inclusive or' rather than 'exclusive or'.
  • the expression 'x uses a or b' means any one of natural inclusive permutations.
  • FIG. 1 shows an example of implementing a temperature monitoring box using a sensor array according to an embodiment of the present invention.
  • a temperature monitoring box 100 using a sensor array may include a temperature sensor array 130 attached to a box case 110, an upper cover 120, and a measurement object 140. And a connection line 131 connected to the temperature sensor array 130.
  • the box case 110 has an inner space formed therein to store a plurality of measurement objects 140 requiring temperature control, and the inner space is a box case 110 so that the plurality of measurement objects 140 can flow in and out.
  • the top of the has an open structure.
  • the measurement object 140 may be any one of wine, an experimental biological sample, and blood, but is not limited thereto.
  • the measurement object 140 may be a medical object and food requiring temperature control during shipping and storage.
  • the upper cover 120 is detachably coupled to the box case 110 and provided to shield the internal space of the box case 110, and one side thereof may be connected to the box case 110, and the box case ( 110 may be provided separately.
  • the temperature sensor array 130 is connected through a connection line 131 with the temperature monitoring box 110, and a plurality of temperature sensors formed in a multichannel are attached to each of the measurement objects 140 in a form formed on a substrate.
  • the temperature monitoring box 100 using the sensor array according to the embodiment of the present invention calculates an average temperature for calculating an average value of temperatures for each of the measurement targets 140 based on the resistance value measured from the temperature sensor array 130. It includes a portion (not shown).
  • the temperature monitoring box 100 using the sensor array further comprises a communication unit (not shown) for transmitting the average value of the calculated temperature to the outside and a power supply unit (not shown) for supplying driving power.
  • a refrigerant panel (not shown) may be further included to maintain freshness of the plurality of measurement objects 140 stored in the inner space of the box case 110.
  • FIG. 2 is a block diagram illustrating a configuration of a temperature monitoring box using a sensor array according to an exemplary embodiment of the present invention.
  • a temperature monitoring box 200 using a sensor array includes a temperature sensor array connected to a box case and attached to a measurement object including a plurality of temperature sensors formed in a multichannel. An average value of the temperatures for each measurement object is calculated using (210).
  • the temperature monitoring box 200 using the sensor array includes a temperature sensor array 210 and the average temperature calculator 220.
  • the temperature sensor array 210 is connected to the box case, is formed on the substrate including a plurality of temperature sensors formed in a multi-channel, and are attached to the measurement object, respectively.
  • the temperature sensor includes a terminal for measuring a resistance value with respect to the temperature of the measurement object.
  • the temperature sensor array 210 is connected to the IC circuit formed on the substrate to form a patch structure.
  • IC circuits can handle signal filtering, amplification, digitization, and processing functions by utilizing integrated technology, and in some embodiments, IC circuits integrate and multifunctional integrated circuit sensors that process signals within a substrate. Can be.
  • the substrate may be formed of at least one material of paper, polymer, woven fabric, and insulated metal foil.
  • the substrate is a polyimide, polycarbonate, polyacylate, polyether imide, polyehtersulfone, polyethylene terephthalate, which can be attached to the skin. ) And polyethylene naphthalate.
  • FIG. 3 is a diagram illustrating an embodiment of a temperature sensor array according to an embodiment of the present invention.
  • the temperature sensor array 310 includes a plurality of temperature sensors 311, and the plurality of temperature sensors 311 is formed of a multichannel 312.
  • Each of the plurality of temperature sensors 311 is formed by transferring a multichannel 312 patterned by a photolithography process onto a substrate, and the multichannel 312 is formed of a polyimide solution. ) May be formed as a thin film of platinum (Pt).
  • the multichannel 312 may be formed in a meander pattern having a serpentine shape to cover a relatively large area.
  • the multi-channel 312 is a spiral, a meander pattern having a rectangular loop, a pair of interlocking meander patterns, a pair of independent self-identification patterns in which the inner spiral is formed in the outer spiral.
  • multichannel 312 may be a negative temperature coefficient thermistor.
  • the multichannel 312 may use a print negative temperature coefficient (NTC) thermistor, but is not limited to print NTC thermistors.
  • NTC print negative temperature coefficient
  • the multichannel 312 is equally applicable to any flexible temperature sensor whose resistance varies with temperature, and includes a positive temperature coefficient (PTC) thermistor, resistance temperature device (RTD), and a flexible substrate. It may be formed of at least one of any device fabricated on the material.
  • the plurality of temperature sensors 311 includes a terminal 313 for measuring a resistance value with respect to a temperature of a measurement target.
  • the terminal 313 may be connected to both ends of the multichannel 312, and may measure a resistance value of the measurement object.
  • the terminal 313 may be formed in each of the temperature sensors 311, and may measure a resistance value by the temperature sensor array 310 composed of the plurality of temperature sensors 311.
  • the temperature sensor array 310 measures the temperature at various points of the measurement object according to the position where each of the plurality of temperature sensors 311 is disposed and provides the average temperature calculator 220 to the average temperature calculator 220. Can be.
  • the temperature sensor array 310 may be implemented in the form of a patch to measure the exact temperature of the contact surface of the measurement object. More specifically, the temperature sensor array 310 may be implemented in a patch form in order to be in close contact with the measurement object.
  • the shape of the temperature sensor array 310 may be formed according to the area or characteristics of the measurement object, and may be attached to at least one measurement object. That is, the temperature sensor array 310 may measure a resistance value according to an average temperature of a plurality of points of the measurement object having a large area.
  • the average temperature calculator 220 of the temperature monitoring box 200 using the sensor array may measure each object based on the resistance value measured from the temperature sensor array 210. Calculate the average value of the temperature for.
  • the average temperature calculator 220 may measure the average temperature of the plurality of temperature sensors by excluding a specific temperature sensor among the plurality of temperature sensors based on the temperature detected by the temperature sensor array 210.
  • the average temperature calculator 220 calculates a temperature of a different value from each of the plurality of temperature sensors. Can be received. Accordingly, the average temperature calculator 220 may calculate the average temperature for the temperatures having different values to measure the correct temperature of the measurement target and improve the temperature accuracy.
  • the average temperature calculator 220 except for a temperature sensor indicating the highest or lowest temperature among the plurality of temperature sensors based on the measured resistance value, the average of the temperature by the resistance value measured from the remaining temperature sensor The value can be calculated.
  • the average temperature calculator 220 may calculate an average temperature based on temperatures sensed by the plurality of temperature sensors.
  • the average temperature calculator 220 may compare the average temperature with each of the sensed temperatures and detect a temperature value having the largest difference from the average temperature. That is, since the temperature value having the largest difference from the average temperature may correspond to the highest or lowest temperature among the sensed temperatures, the average temperature calculator 220 excludes the corresponding temperature to average the plurality of temperature sensors. The temperature can be measured.
  • the average temperature calculator 220 may compare the detected temperatures with each other and measure the average temperature by excluding a temperature value having the largest difference. That is, the highest or lowest temperature among the sensed temperatures may have the largest difference as a result of mutual comparison with other sensed temperatures. Accordingly, the average temperature calculator 220 may measure the average temperature of the plurality of temperature sensors except for the corresponding temperature.
  • the average temperature calculator 220 may calculate the average value of the temperature by excluding a temperature sensor that detects a sudden temperature change exceeding a predetermined reference among the plurality of temperature sensors.
  • the average temperature calculator 220 may measure the average temperature of the plurality of temperature sensors except for the corresponding temperature. have.
  • the average temperature calculator 220 is included in the temperature monitoring box 200 using the sensor array according to the exemplary embodiment of the present invention, but according to the exemplary embodiment, the average temperature calculator 220 may be included and formed on the substrate of the temperature sensor array 210. have.
  • the temperature monitoring box 200 using the sensor array may include a communication unit 230 for transmitting the average value of the calculated temperature to the outside and a power supply unit 240 for supplying driving power. It may further include.
  • the communicator 230 may transmit an average value for the measurement object measured by the average temperature calculator 220 to the outside.
  • the communication unit 230 may transmit and receive the average value of the temperature in different transmission bandwidths, and at least one of the ZigBee, Bluetooth, ZWAVE, and Wi-Fi may be applied according to coverage.
  • the power supply unit 240 may supply driving power of at least one of the temperature sensor array 210, the average temperature calculator 220, and the communicator 230.
  • the power supply unit 240 may be configured as an active device using an ultra-small charge / discharge battery or an ultra-supercapacitor.
  • the power supply 240 may be a primary battery such as a coin battery or a secondary battery such as a lithium-polymer battery.
  • a primary battery such as a coin battery
  • a secondary battery such as a lithium-polymer battery.
  • the power supply unit 240 may be charged by an external power source, and in the case of a primary battery such as a coin battery, it may be exchanged.
  • the power supply 240 may be included on the substrate of the temperature sensor array 210 and may supply driving power of the temperature sensor.
  • the temperature monitoring box 200 using the sensor array may further include a control unit (not shown), the control unit controls the overall operation of the temperature monitoring box 200, the temperature sensor The array 210, the average temperature calculator 220, the communicator 230, and the power supply 240 may control a control flow or data flow.
  • Figure 4 shows an example of monitoring the temperature of the measurement object using a temperature monitoring box according to an embodiment of the present invention.
  • the temperature monitoring box 410 using the sensor array may transmit and receive data with the user terminal 420a and the external server 420b through a network.
  • the temperature monitoring box 410 using the sensor array provides the average value of the calculated temperature of the measurement object to the external user terminal 420a or the external server 420b in real time.
  • the user terminal 420a or the external server 420b may store, analyze, process, and monitor the average value information of the temperature in real time.
  • the average value information of the temperature may be stored in an external database and provided at the request of the user terminal 420a or the external server 420b.
  • the user terminal 420a may receive the average value information of the temperature of the measurement object in real time from the temperature monitoring box 410 using the sensor array according to the exemplary embodiment of the present invention.
  • the user terminal 420a may calculate the average value information of the temperature for the measurement object received from the temperature monitoring box 410 using the temperature sensor array based on the reference value for the preset temperature information.
  • An image, a picture, a graph, a message, and an audio may be output to at least one, and according to embodiments, a notification signal including at least one of a warning message, an alarm, a voice, a light, and a vibration may be provided.
  • the user terminal 420a may control the temperature sensor array or the temperature monitoring box 410 based on a control command input from the user.
  • the user terminal 420a may be at least one of a terminal, a smartphone, a tablet PC, and a PC possessed by the user, and the type of the terminal is not limited thereto.
  • the user terminal 420a may include at least one of average value information of temperatures for the measurement object received from the temperature monitoring box 410 using the temperature sensor array and temperature information inside the temperature monitoring box 410.
  • One or more information may be transmitted to the external server 420b.
  • the user terminal 420a may include an application processor for data transmission and reception and control with the temperature monitoring box 410.
  • the external server 420b comprehensively manages average value information of temperatures for the measurement object received from the temperature monitoring box 410 or the user terminal 420a using the sensor array according to an embodiment of the present invention, and stores the average value information.
  • the change trend may be analyzed and transmitted to the user terminal 420a.
  • the external server 420b may provide information to an expert or an administrator who manages the measurement object, and manage and prevent the measurement object from the user terminal 420a based on an analysis result of the average value information of the temperature of the measurement object. It may also provide a real-time service for.
  • the external server 420b may further provide a service for managing the temperature of various measurement targets in addition to the above-described service, and thus may be configured to establish a database or to communicate with another external server. It doesn't happen.
  • 5A and 5B show results of resistance values according to temperature changes of a measurement object using one temperature sensor.
  • Figure 5a is a graph of the result of measuring the resistance value for the object to be measured at intervals of 10 °C from 30 °C to 80 °C using a temperature sensor array including one temperature sensor
  • Figure 5b is one temperature It is a graph of the result of measuring the resistance value for the measurement object at a temperature interval of 1 °C from 30 °C to 40 °C using a temperature sensor array including a sensor, and 0.5 °C interval from 36 °C to 38 °C.
  • the temperature sensor array including one temperature sensor exhibits limitations in accurately measuring the temperature of the measurement target to be measured by changing the accuracy of the temperature according to the attachment position or area of the measurement target. You can see that.
  • 6A and 6B illustrate results of average values according to temperature changes of a measurement object using a temperature sensor array formed of a plurality of temperature sensors.
  • FIG. 6A is a graph illustrating a result of resistance according to temperature change of a measurement object using a temperature sensor array including one temperature sensor
  • FIG. 6B uses a temperature sensor array including four temperature sensors. Is a graph showing the results of the resistance value and the average value of each temperature sensor according to the temperature change of the measurement object.
  • the accuracy and reliability of the average value of the temperature calculated from the temperature sensor array consisting of four plurality of temperature sensors is higher than the temperature sensor array consisting of one temperature sensor as in FIG. 6A. It can be confirmed that high.
  • FIG. 7 illustrates a result of deviation according to temperature change of a measurement object using a temperature sensor array formed of a plurality of temperature sensors.
  • FIG. 7 is a graph showing a deviation result according to a temperature change from 0 ° C. to 50 ° C. using a temperature sensor array including one temperature sensor and a temperature sensor array including four temperature sensors. .
  • the temperature sensor array formed of the plurality of temperature sensors has a small error due to external factors. It can be seen that the temperature can be measured constantly with high accuracy.
  • FIG. 8 is a flowchart illustrating a temperature monitoring method using a sensor array for monitoring a temperature of a measurement object requiring temperature control using a temperature monitoring box using a sensor array according to an embodiment of the present invention.
  • step 810 the presence or absence of a resistance value with respect to the temperature of the measurement object is detected from a temperature sensor array attached to the measurement object, respectively.
  • the temperature sensor array is connected to a box case, is formed on a substrate including a plurality of temperature sensors formed in a multi-channel, each attached to the measurement object, the terminal for measuring the resistance value of the temperature sensor to the temperature of the measurement object It includes.
  • the average value of the temperature for the measurement object is calculated based on the resistance value measured from the temperature sensor array.
  • step 820 may be a step of measuring an average temperature of the plurality of temperature sensors excluding a specific one of the plurality of temperature sensors based on the temperature sensed by the temperature sensor array.
  • step 820 is a temperature of the object to be measured with the resistance value measured from the remaining temperature sensors, except for a temperature sensor indicating the highest or lowest temperature among the plurality of temperature sensors based on the measured resistance value. It may be a step of calculating the average value of.
  • step 820 may be a step of calculating an average value of the temperature excluding a temperature sensor detecting a sudden temperature change exceeding a predetermined reference among the plurality of temperature sensors.
  • the method according to the embodiment may be embodied in the form of program instructions that can be executed by various computer means and recorded in a computer readable medium.
  • the computer readable medium may include program instructions, data files, data structures, etc. alone or in combination.
  • the program instructions recorded on the media may be those specially designed and constructed for the purposes of the embodiments, or they may be of the kind well-known and available to those having skill in the computer software arts.
  • Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks, and magnetic tape, optical media such as CD-ROMs, DVDs, and magnetic disks, such as floppy disks.
  • Examples of program instructions include not only machine code generated by a compiler, but also high-level language code that can be executed by a computer using an interpreter or the like.
  • the hardware device described above may be configured to operate as one or more software modules to perform the operations of the embodiments, and vice versa.

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Abstract

La présente invention concerne un boîtier de surveillance de température et un procédé associé, le boîtier de surveillance de température comprenant un étui de boîtier dans lequel un espace interne est défini de manière à pouvoir stocker une pluralité d'objets à mesurer nécessitant une régulation de température ; des réseaux de capteurs de température qui sont reliés à l'étui de boîtier, qui comprennent une pluralité de capteurs de température qui sont formés en tant que canal multiple, comprenant un terminal de mesure d'une valeur de résistance par rapport à la température de l'objet à mesurer, et qui sont formés sur un substrat, et qui sont fixés aux objets à mesurer, respectivement ; et une unité de calcul de température moyenne qui calcule une valeur moyenne de la température pour chaque objet à mesurer sur la base de la valeur de résistance mesurée à partir des réseaux de capteurs de température, et la température des objets à mesurer pouvant être surveillée en temps réel en mesurant la température moyenne pour une large zone de contact ou diverses zones des objets à mesurer.
PCT/KR2016/015069 2016-10-06 2016-12-22 Boîtier de surveillance de température utilisant un réseau de capteurs et procédé associé WO2018066759A1 (fr)

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KR102402793B1 (ko) * 2018-05-24 2022-05-30 한국전자기술연구원 고전압 배선선로용 온도 모니터링 장치 및 시스템
KR102112843B1 (ko) * 2018-08-27 2020-05-19 씨제이제일제당 (주) 온도 측정 시스템과, 온도분석방법 및 가열조리식품의 가열시간 설정방법
KR102179728B1 (ko) 2020-06-30 2020-11-17 (주)휴톤 저온시설 온도 모니터링 시스템

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009264804A (ja) * 2008-04-23 2009-11-12 Murata Mfg Co Ltd 面状温度検出センサ
JP2011033358A (ja) * 2009-07-29 2011-02-17 Mitsubishi Materials Corp 温度センサ
JP2012506535A (ja) * 2008-10-21 2012-03-15 ライフスキャン・インコーポレイテッド モデル化を伴う多重温度測定
KR20140119795A (ko) * 2012-01-30 2014-10-10 피에스티 센서스 (피티와이) 리미티드 대면적 온도 센서
JP2016038277A (ja) * 2014-08-07 2016-03-22 株式会社東光高岳 電気設備温度監視装置および電気設備温度監視システム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009264804A (ja) * 2008-04-23 2009-11-12 Murata Mfg Co Ltd 面状温度検出センサ
JP2012506535A (ja) * 2008-10-21 2012-03-15 ライフスキャン・インコーポレイテッド モデル化を伴う多重温度測定
JP2011033358A (ja) * 2009-07-29 2011-02-17 Mitsubishi Materials Corp 温度センサ
KR20140119795A (ko) * 2012-01-30 2014-10-10 피에스티 센서스 (피티와이) 리미티드 대면적 온도 센서
JP2016038277A (ja) * 2014-08-07 2016-03-22 株式会社東光高岳 電気設備温度監視装置および電気設備温度監視システム

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