WO2018065268A1

WO2018065268A1 - Arrangement comprising a spacer and a printed circuit board

Info

Publication number: WO2018065268A1
Application number: PCT/EP2017/074448
Authority: WO
Inventors: Marco Braun; Sven ISSING; Steffen Meier; Frank Fischer; Stefan Schlatter; Johannes Hirschle
Original assignee: Robert Bosch Gmbh
Priority date: 2016-10-06
Filing date: 2017-09-27
Publication date: 2018-04-12
Also published as: DE102016219423A1

Abstract

The invention relates to an arrangement, comprising a mold body (15), a spacer (20), and a printed circuit board (25), wherein at least one electrical connection (110, 115) connects the mold body to a conductor path (70, 75) of the printed circuit board. The spacer is connected to the mold body and is arranged on a side that faces the printed circuit board. The spacer is arranged offset with respect to the electrical connection, wherein the spacer determines a predefined space (di) between the bottom side (45) of the mold body and the printed circuit board.

Description

description

title

ARRANGEMENT WITH A SPACER HOLDER AND A PCB

The invention relates to an arrangement according to claim 1. Prior art

From US Pat. No. 7,138,583 B2 an arrangement with a printed circuit is known, wherein the printed circuit has a first electrical contact, wherein the first electrical contact comprises a contact area.

Disclosure of the invention

It is an object of the invention to provide an improved arrangement.

This object is achieved by means of an arrangement according to claim 1. Advantageous embodiments are given in the dependent claims.

It has been appreciated that an improved arrangement can be provided by comprising a mold body, a spacer and a circuit board, at least one electrical connection connecting the mold body to a circuit trace of the circuit board, the spacer being connected to the mold body and mounted on a mold is arranged to the circuit board side facing, wherein the spacer is arranged offset to the electrical connection, wherein the spacer defines a predefined distance between a bottom of the mold body and the circuit board.

This embodiment has the advantage that a tilting of the mold body relative to the circuit board can be prevented, so that the distance between the Moldkorper and the printed circuit board is predefined set. Furthermore, a deterioration of the electrical connection is reliably prevented by the spacer.

In a further embodiment, the spacer has a first spacer element. The first spacer is connected to the Moldkorper with a fixed end. The circuit board has a support element. The support element has an electrically conductive material. A free end of the first spacer element faces the support element and preferably lies in sections on the support element. Preferably, the support element is potential-free.

In a further embodiment, the support element is arranged offset to a contact element of the circuit board. The electrical connection is formed between the mold body and the contact element. The contact element is electrically insulated from the support element.

In a further embodiment, the support element has a first bearing surface and the contact element has a contact surface. The support element and the contact surface are arranged in a common first plane.

In a further embodiment, the spacer comprises a second spacer element. The second spacer is connected to a fixed end with mold body. The first spacer element and the second spacer element are arranged on a common side of the mold body. The first spacer element has a first end face at a free end and the second spacer element has a second end face at a free end. The first end face and the second end face are arranged in a common second plane.

In a further embodiment, the first spacer element and the second spacer element are aligned in parallel. In a further embodiment, the mold body has a side surface, wherein the side surface and the bottom adjoin one another at an edge, wherein the first spacer is arranged adjacent to the edge. In a further embodiment, the circuit board has a heat sink, wherein the mold body and the heat sink are connected to each other by means of a thermal connection, wherein the first spacer between the electrical connection and the thermal connection is arranged.

In a further embodiment, the arrangement has a further spacer and a housing, wherein the further spacer is arranged between the housing and a further side surface of the mold body. The further spacer defines a further predefined distance between the mold body and the housing.

In a further embodiment, the housing has a further heat sink, wherein the mold body is thermally connected by means of a further thermal connection with the further heat sink, wherein the further thermal connection comprises a heat conducting means, wherein the second spacer is embedded in the heat conducting means.

In a further embodiment, the further spacer has a third spacer element, wherein the third spacer element is connected to the mold body with a fixed end, the third spacer element having a third end face at a free end of the third spacer element, wherein the third end face rests against the housing.

In a further embodiment, the third spacer element and the first spacer element are arranged in a common fourth plane.

In a further embodiment, the further spacer has a fourth spacer element, wherein the fourth spacer element is connected with a fixed end to the mold body, wherein at a free end of the fourth spacer element. Standing elements, the fourth spacer element has a fourth end face, wherein the fourth end face and the third end face are arranged in a common fifth plane.

The invention will be explained in more detail with reference to figures. Showing:

Figure 1 is a sectional view through an arrangement according to a first embodiment;

Figure 2 is a sectional view through the arrangement shown in Figure 1 after a first assembly step;

Figure 3 is a sectional view through the arrangement shown in Figure 1 after a second assembly step;

Figure 4 is a sectional view through an arrangement according to a second embodiment;

Figure 5 is a sectional view through the arrangement shown in Figure 4 during the manufacture of the arrangement;

Figure 6 is a bottom view of a mold body of the arrangement shown in Figures 4 and 5;

Figure 7 is a side view of the mold body shown in Figure 6;

Figure 8 is a plan view of a printed circuit board of the arrangement shown in Figures 4 to 7;

FIG. 9 shows a sectional view along a sectional plane AA shown in FIG. 8 through the printed circuit board shown in FIG. 8; Figure 10 is a bottom view of an arrangement according to a third embodiment;

Figure 1 1 is a side view of the arrangement shown in Figure 10;

Figure 12 is a plan view of a circuit board of the arrangement shown in Figures 10 and 11;

Figure 13 is a bottom view of an assembly according to a fourth embodiment;

Figure 14 is a plan view of a circuit board of the arrangement shown in Figure 13;

Fig. 15 is a sectional view taken along a sectional plane B-B shown in Fig. 14 through the circuit board shown in Fig. 14;

Figure 16 is a plan view of an arrangement according to a fifth embodiment.

In the following figures, reference is made to a coordinate system 5. The coordinate system 5 is exemplified as a legal system and has an x-axis, a y-axis and a z-axis.

FIG. 1 shows a sectional view through an arrangement 10 according to a first embodiment.

The arrangement 10 has a mold body 15, a first spacer 20, a printed circuit board 25, a housing 30 and in addition to the first spacer 20 by way of example a second spacer 35.

The housing 30 has a design suitable for "slug-up" components, and the housing has a heat sink 40 opposite the mold body 15. The mold body 15 is disposed between the circuit board 25 and the housing 30. The mold body 15 has a lower side 45 and an upper side 50. The top 50 faces the housing 30. The bottom 45 faces the circuit board 25. Furthermore, the mold body 15 has a first side surface 55 and a second side surface 60. The first side surface 55 is disposed opposite to the second side surface 60.

In the mold body 15, an electronic component 80 is embedded. The electronic component 80 is electrically connected to a first contact element 85, which is arranged, for example, on the first side surface 55. Furthermore, the electronic component 80 may be electrically connected to a second contact element 90, which is arranged, for example, on the second side surface 60. Furthermore, the number of contact elements 85, 90 may be formed differently than shown in FIG. Also, the first contact element 85 and / or the second contact element 90 may be arranged on the underside 45.

The Moldköper 15 forms a housing for the electronic component 80. The Moldkorper is produced by molding. During molding, electronic components 80, in particular wire-bonded, soldered or glued microelectronic assemblies, are protected with a thermomechanically adapted, robust encapsulation material, in particular with epoxy resins. In particular, the encapsulation material forms the mold body 15. Several variants can be distinguished, in particular casting, premolding, compression molding and transfer molding. Depending on the material used, expansion coefficients <10 ppm / K

(eg SiO 2 filled epoxy resins) can be realized. It is advantageous that microelectronic modules can be realized with very high reliability even for extreme environmental conditions. Preferably, a material, in particular encapsulation material, is used in the mold body 15, which has good heat conduction, in particular good thermal conductivity. For example, the heat conduction or the thermal conductivity of the material is formed such that the mold body 15 can conduct the heat energy arising during operation of the electronic component 80, in particular can lead away from it, in particular predominantly predominantly, preferably substantially completely. The printed circuit board 25 has a carrier matrix 65, at least one first printed conductor 70, preferably a second printed conductor 75, a third contact element 95 and preferably at least one fourth contact element 100. The third contact element 95 and the fourth contact element 100 are arranged on an upper side 105 of the printed circuit board 25. The third contact element 95 is electrically connected to the first interconnect 70 and the fourth contact element 100 is electrically connected to the second interconnect 75. The conductor track 70, 75 may be embedded in the carrier matrix 65 of the printed circuit board 25.

The first contact element 85 is electrically connected to the third contact element 95 by means of a first electrical connection 1 10. The second contact element 90 is connected to the fourth contact element 100 by means of a second electrical connection 15.

The electrical connection 1 10, 1 15 may be formed, for example, as a bonding wire, Gullwin pin or solder joint. The electrical connection 1 10, 1 15 also mechanically connects the mold body 15 with the circuit board 25th

In addition, the printed circuit board 25 may have a first support element 120 and / or a second support element 125. The support element 120, 125 is connected to the carrier matrix 65 and formed floating. In this case, the term potential free is understood to mean that the support element 120, 125 has no connection to a conductor track 70, 75 of the printed circuit board 25. The freedom of potential of the support element 120, 125 is achieved in that the support element 120, 125 offset in the longitudinal direction (x-direction) to the third and / or fourth contact element 95, 100 and / or the conductor track 70, 75 is arranged.

It is of particular advantage in this case if the support element 120, 125 has the same material as the third and / or fourth contact element 95, 100 and / or the first and / or second conductor track 70, 75.

Furthermore, it is of particular advantage if the third contact element 95 has a contact surface 130, the first support element 120 a first contact surface 135, the second support element 125 has a second contact surface 140 and the fourth contact element 100 has a further contact surface 150. The contact surface 130, the further contact surface 150 and the first and second support elements 120, 125 are preferably arranged in a common first plane 155. The first level 155 is formed as an xy plane and preferably arranged parallel to the bottom 45.

The first spacer 20 has a first spacer element 160 and preferably at least one second spacer element 165. The first distance element 160 is offset from the second distance element 165. The first

Distance element 160 is connected to the mold body 15 with a fixed end. In this case, by way of example, the first spacer element 160 and the second spacer element 165 are arranged between the underside 45 and the printed circuit board 25. The first spacer 160 and the second spacer 165 are aligned parallel to each other and extend in the z-direction in the embodiment by way of example. Of course, the first spacer element 160 and the second spacer element 165 may also be aligned with each other inclined. Also, a different orientation than shown in Figure 1 to the z-axis, conceivable.

At a free end, the first spacer element 160 has a first end face 170. The first end face 170 bears against the first support element 120. The second spacer 165 is connected to the mold body 15 with a fixed end. At a free end, the second spacer 165 has a second end face 175, wherein with the second end face 175, the second

Distance element 165 rests against the second support element 125.

The first end face 170 and the second end face 175 are arranged in a common second plane 180. In this case, the second plane 180 can be arranged to overlap the first plane 155 when the first and second end faces 170, 175 have a contact contact with the respective associated bearing element 120, 125. The second plane 180 can also be arranged offset relative to the first plane 155 if the first end face 170 is arranged at a distance from the first contact surface 135 and the second end face 175 is arranged at a distance from the second contact surface 140. The arrangement of the first spacer 20 between the mold body 15 and the circuit board 25, a predefined first distance di exactly between the bottom 45 of the mold body 15 and the circuit board 25 can be adjusted. In particular, this is characterized in that the first and second end face

170, 175 of the first and second spacer elements 160, 165 seated on the respective associated support element 120, 125, a tolerance chain within the assembly 10 is reduced, so that the first distance di can be set very precisely.

The first spacer element 160 and / or the second spacer element 165 may be formed in one piece and with the same material as the mold body 15. Also, the first spacer 160 and / or the second spacer 165 may have a different material to the mold body 15 and be connected for example via a cohesive connection, in particular an adhesive bond, with the bottom 45 of the mold body 15.

The arrangement of the first spacer element 160 and the second spacer element 165 on a common bottom 45 of the mold body 15, a tilting of the mold body 15 relative to the circuit board 25 is reliably avoided in the manufacture of the assembly 10. As a result, a parallel alignment of the mold body 15 with respect to the printed circuit board 25 can be ensured. The heat sink 40 is connected to the mold body 15 by means of a thermal connection 220. The thermal connection 220 preferably has, for example, a heat conducting means 215. The heat conducting 215 may be formed, for example, as a thermal paste. Also, the thermal connection 220 may be different. For example, it is also conceivable that the thermal connection 220 is designed, for example, as a heat pipe.

The second spacer 35 has a third spacer element 185 and preferably at least a fourth spacer element 190. The third spacer 185 is connected at a fixed end to the top 50 of the mold body 15. At a free end, the third spacer 185 has a third end face 195 on. The fourth spacer element 190 is connected at a fixed end to the upper side 50 of the mold body 15. At a free end, the fourth spacer 190 has a fourth end face 200. The second spacer 35 has a third spacer element 185. The third spacer 185 is connected at a fixed end to the top 50 of the mold body 15. The third spacer 185 has a third end face 195 at a free end. Furthermore, the second spacer 35 has a fourth spacer element 190. The fourth spacer 190 is connected at a fixed end to the top 50 of the mold body 15. At a free end, the fourth spacer 190 has a fourth end face 200.

Of particular advantage here is when the third end face 195 and the fourth end face 200 are arranged in a common third plane 205. Furthermore, it is of particular advantage if the third plane 205 is aligned parallel to the first plane 155 and / or to the second plane 180. In the embodiment, by way of example, the third end face 195 and the fourth end face 200 abut on a housing surface 210 which is arranged on the heat sink 40. In order to ensure a reliable heat transfer between the mold body 15 and the heat sink 40, the mold body 15 is thermally connected by means of a heat conducting means 215, which is formed by way of example in the embodiment as a thermal paste. By way of example, the second spacer 35 is preferably completely embedded in the heat conducting means 215. As a result, a reliable thermal connection 220 between the heat sink 40 and the mold body 15 can be ensured.

By means of the second spacer 35, a predefined second distance 2 between the upper side 50 and the housing surface 210 can be kept particularly well. As a result, the arrangement 10 can be aligned particularly precisely. In particular, tilting of, for example, the housing 30 relative to the printed circuit board 25 and / or tilting of the molded body 15 relative to the housing 30 and / or the printed circuit board 25 is also reliably avoided in this case. Furthermore, a reliable function of the thermal connection 220 is ensured. By way of example, the third spacing element 185 and the fourth spacing element 190 are also aligned parallel to one another. Furthermore, the third spacer element 185 and the first spacer element 160 are arranged directly above one another, that is to say in a common fourth plane 225, which is designed to extend in the yz direction. The fourth plane 225 is arranged perpendicular to the second plane 180. Furthermore, the second spacer element 165 and the fourth spacer element 190 are arranged in a common fifth plane 230. The fifth plane 230 is arranged by way of example in the x-direction offset to the fourth plane 225.

The spacer 20, 35 may be made of metal and / or plastic, for example. The spacer 20, 35 can also be realized by a selective removal process, for example precision milling or etching, of the mold body 15, in which the spacer 20, 35 is retained. Also, the spacer 20, 35 can be made separately and connected to the mold body 15, for example, glued be. FIG. 2 shows a sectional view through the arrangement 10 shown in FIG. 1 after a first assembly step.

In the first assembly step, the mold body 15 is attached to the circuit board 25 and the electrical connection 1 10, 1 15 prepared. Furthermore, the first spacer 20 and the second spacer 35 are fastened to the mold body 15 or produced on the mold body 15. Furthermore, the heat conducting means 215 is applied to the housing surface 210 of the housing 30. For mounting in the second assembly step, the mold body 15 is mounted together with the printed circuit board 25 in the reverse position, so that the mold body 15 points downward with its upper side 50 shown in FIG. The housing 30 is also rotated so that the housing surface 210 faces upward.

FIG. 3 shows a sectional view through the arrangement 10 shown in FIG. 1 during a second assembly step. In the second assembly step, an assembly force FA is introduced onto the printed circuit board 25 from top to bottom. On a side facing away from the mold body 15, the housing 30 is supported and a counterforce FB is provided for the assembly force FA. The mounting force FA and the counterforce FB are transmitted between the circuit board 25 and the mold body 15 via the first spacer 20 and between the Moldkorper 1 5 and the housing 30 via the second spacer 35. In this case, the second spacer 35 is pressed into the heat conducting means 21 5. A transmission of force directly from the housing 30 via the heat conducting means 21 5 in the mold body 1 5 is avoided, so that tilting of the mold body 15 relative to the housing surface 21 0 is reliably avoided. As a result, a gap between the mold body 15 and the heat conducting means 21 5 is avoided, so that reliable thermal dissipation of heat from the mold body 1 5 to the heat sink 40 via the thermal connection 220 is reliably ensured. Furthermore, high assembly forces FA of greater than 100 N can be transmitted via the spacers 20, 35, so that the mold body 1 5 is reliably pressed between the printed circuit board 25 and the housing 30. Furthermore, a power transmission via the electrical connection 1 1 0, 1 1 5 reliably avoided.

In summary, the spacers 20, 35 prevent damage to other components of the arrangement 10.

FIG. 4 shows a sectional view through an arrangement 10 according to a second embodiment.

The arrangement 10 is similar to the arrangement 10 shown in FIG. By way of derogation, the housing 30 and the second spacer 35 shown in FIGS. 1 to 3 are dispensed with. Deviating from this, the printed circuit board 25 has a further heat sink 235. The further heat sink 235 is arranged substantially centrally with respect to the mold body 15 relative to the mold body 15. The further heat sink 235 is connected to the mold body 15 by means of a further thermal connection 240. The further thermal connection 240 has the heat conducting means 215. The heat conducting 21 comprises 21 In the embodiment, for example, a solder, so that the further thermal connection 240 is formed as a solder joint. Alternatively, the thermal interface 215 may also include the thermal grease. The first spacer 160 is disposed between the further thermal connection 240 and the first electrical connection 110. The second spacer 165 is disposed between the second electrical connection 15 and the further thermal connection 240. In the embodiment, the electrical connection 1 10, 1 15 is wirelessly formed by a solder between the first contact element 85 and the third contact element 95 and the second electrical connection 1 15 wirelessly by a solder between the second contact element 90 and the fourth contact element 100.

By providing the first spacer 20, the first distance di between the bottom 45 of the mold body 15 and the printed circuit board 25 is increased compared to the conventional configuration of the arrangement 10. In order to form the solder joint particularly well, is also the first

Contact element 85 and the second contact element 90 are respectively arranged on the underside 45 of the mold body 15. Due to the enlarged first distance di of the underside 45 with respect to the printed circuit board 25, the electrical connection 1 10, 1 15 is elongated in the z-direction, so that in a reflow soldering process the solder travels a particularly long distance between the first contact element 85 and the first contact element 85 second contact element 90 and between the second contact element 90 and the fourth contact element 100 has to bridge.

As a result, in the case of a follow-up inspection of the arrangement 10, the electrical connection 1 10, 15 can be checked particularly easily by means of optical control, in particular with optical image acquisition.

FIG. 5 shows a sectional view through the arrangement 10 shown in FIG. 4 during the production of the arrangement 10. The first spacer 20 reduces tilting of the mold body 15, shown symbolically in dashed lines in FIG. 5, for example about the y-axis. For example, indicates the first distance di a value of 50 μηι, so is a maximum tilt of the mold body 15 with respect to the first level 155 and / or the circuit board 25 to a maximum of 0 at a size of the mold body 15 of 8 mm in the y direction and 8 mm in the x direction , 5 ° minimized. As a result, the tilt is reduced by a factor of 3 compared to conventionally produced moldings.

FIG. 6 shows a bottom view of the arrangement 10 shown in FIGS. 4 and 5. The illustration of the printed circuit board 25 is omitted for reasons of clarity.

In addition, the first spacer 20 has a fifth spacer element 245, wherein the fifth spacer element 245 is arranged offset in the y direction relative to the first and second spacer elements 160, 165. Between the spacer elements 160, 165, 245, the mold body 15 has a first heat transfer surface 276. The first heat transfer surface 276 is connected to the further heat sink 235 by means of the further thermal connection 240. Providing at least three spacer elements 160, 165, 245 ensures reliable tilting safety both about the y-axis and about the x-axis.

In the embodiment, numerous first and second contact elements 85, 90 are provided, wherein additionally at least one further contact element 249 can be provided, which are arranged on the underside 45 of the mold body 15.

In the embodiment, in each case a plurality of first, second and further contact elements 85, 90, 249 are provided, each of which is arranged next to one another on a straight line. The first spacer 160 is eccentrically, preferably arranged adjacent to a corner of the mold body 15. Likewise, adjacent to the second side surface 60, the second spacer 165 is disposed off-center in the x and y directions adjacent to each other. The fifth spacer element 245 is centered in the x direction and eccentrically in the y direction toward a direction away from the first and second spacer elements 160, 165 on the mold body 15 arranged so that the first spacer 160, the second spacer 165 and the fifth spacer 245 are arranged in an isosceles triangle to each other. The fifth spacer 245 is between the thermal connection

220 and the further contact element 249 arranged. As a result, a particularly large distance a between the individual spacer elements 160, 165, 245 is ensured, so that the tilting in the production of the arrangement 10, as shown in FIG. 5, is possible only to a small extent.

FIG. 7 shows a side view of the arrangement 10 shown in FIGS. 4 to 6. In the x-direction, the fifth spacer element 245 is made wider than the first and second spacer elements 160, 165, so that the number of spacer elements 160, 165, 245 of the arrangement shown in FIGS 4 to 6 shown first spacer 20 can be limited to three. As a result, the arrangement 10 can be produced particularly quickly and inexpensively.

FIG. 8 shows a top view of a printed circuit board 25 of the arrangement 10 shown in FIGS. 4 to 7.

The first and second support element 120, 125 and the third support element 250, which is provided in addition to the fifth distance element 245, are each designed and aligned correspondingly to the geometric configuration of the respectively assigned distance element 160, 165, 245. Due to the potential-free arrangement of the support element 120, 125, 250, the support element 120, 125, 250 has no electrical connection to the third and / or fourth contact element 95, 100. The support element 120, 125, 250 is thereby electrically insulated from the third and fourth contact elements 95, 100 by the carrier matrix 65 on the printed circuit board 25.

Furthermore, the further heat sink 235 is also electrically insulated from the support element 120, 125, 250. In the embodiment, the further heat sink 235 has, for example, the same material as the support element 120, 125, 250 as well as the third and / or fourth contact element 95, 100, so that a particularly good heat dissipation over the further thermal connection 240 from the mold body 15 is ensured.

FIG. 9 shows a sectional view along a sectional plane A-A shown in FIG. 8 through the printed circuit board 25 shown in FIG.

In the embodiment, the first plane 155 and the second plane 180 overlap. In order to ensure a reliable solder connection for producing the first and second electrical connections 110, 115 and the further thermal connection 240, the circuit board 25 additionally has a solder stop layer 260 on. The solder stop layer 260 covers an upper side of the carrier matrix 65 of the printed circuit board 25. The third and fourth contact elements 95, 100 and the support element 120, 125, 250 and the further heat sink 235 are free of the solder stop layer 260 The support element 120, 125, 250, the number of elements within a tolerance chain can be additionally reduced, and so the assembly 10 are particularly easily manufactured precisely.

FIG. 10 shows a bottom view of an arrangement 10 according to a third embodiment.

The arrangement 10 is formed substantially identical to the arrangement 10 shown in FIGS. 6 to 9. Deviating from this, the first spacer 20 has a sixth spacer element 265 in addition to the fifth spacer element 245. Here are the first, second, fifth and sixth spacer element

160, 165, 245, 265 each adjacent to an edge 270, on which the side surface 55, 60 adjacent to the bottom 45, respectively.

FIG. 11 shows a side view of the arrangement 10 shown in FIG. 10. As a result, the distance a between the first, second, fifth and sixth spacer elements 160, 165, 245, 265 can be kept particularly great and tilting particularly low.

FIG. 12 shows a plan view of the printed circuit board 25 of the arrangement 10 shown in FIGS. 10 and 11. The printed circuit board 25 additionally has a further fourth support element 275, wherein the fourth support element 275 is arranged corresponding to the sixth spacer element 265. In each case, the third or fourth contact element 95, 100 and the first to third support elements 120, 125, 250 are arranged in respective common fifth planes 230.

FIG. 13 shows the bottom view of an arrangement 10 according to a fourth embodiment. The arrangement 10 is essentially designed as a combination of the arrangement 10 shown in FIGS. 1 to 9. In this case, the further heat sink 235 is dispensed with and the mold body 15 is cooled on the upper side via the heat sink 40.

Further, by the lateral arrangement of the first and second contact elements 85, 90, the first, second and fifth spacer elements 160, 165, 245 are placed particularly close to the edge 270, so that tilting of the mold body 15 relative to the first plane 155 are kept particularly low can.

FIG. 14 shows a plan view of the printed circuit board 25 of the arrangement 10 shown in FIG. 13. The printed circuit board 25 is made particularly simple by omitting the further heat sink 235.

FIG. 15 shows a sectional view along a sectional plane B-B shown in FIG. 14 through the printed circuit board 25 shown in FIG.

As a result of the lateral arrangement of the first and second contact elements 85, 90, the distance a between the support element 120, 125, 250 can also be kept particularly high so that tilting is particularly low in the production of the arrangement 10.

FIG. 16 shows a bottom view of an arrangement 10 according to a fifth embodiment. The arrangement 10 is essentially a combination of the arrangement 10 shown in FIGS. 1 to 9. By contrast, the mold body 15 additionally has a second 280 and preferably a third heat transfer surface 285 on the underside in addition to the (first) heat transfer surface 276. The heat transfer surface 276, 280, 285 is thermally connected in each case via a separate further thermal connection 240 with the further heat sink 235, while each of the heat transfer surfaces 276, 280, 285 arranged off-center, in each case between the first and / or second contact element 85th 90, a first, second and / or fifth spacer element 160, 165, 245 is respectively arranged.

As a result, a high heat transfer from the mold body 15 to the further heat sink 235 can be ensured and, at the same time, tilting can be ensured by the triangular arrangement of the spacer element 160, 165, 245.

Due to the above-described embodiments of the arrangement 10 in addition to a tilting of the mold body 15, an electrical connection 1 10, 1 15 can be made reliable in addition. In particular, a scrap in the production of the assembly 10, in particular in the context of a reflow soldering process can be reduced. Furthermore, an optical test of the arrangement 10, for example in the context of an optical examination of solder point menisci at the electrical connection 1 10, 1 15, can be improved. In particular, in the embodiment of the electrical connection 1 10, 15, a so-called pin modification can be achieved exclusively by solder, in which a pin wettable by solder is produced on the first and second contact elements 85, 90 by special processes. In this case, in particular, the scattering of the meniscus height (by limiting the tilting of the mold body 15) as well as an average value (by deliberately increasing the first distance di) can be improved and the solder joint inspection can be facilitated.

Furthermore, an increased solder joint reliability at the electrical connection 1 10, 1 15 is achieved. By deliberately adjusting the first distance di, it can be adjusted such that the first distance di is optimal for increased solder joint reliability. So the first distance di goes linearly into the Solder joint reliability of the assembly 10 a. An increase in the first distance di leads to an increase in solder joint reliability. At the same time scattering z. B. be minimized by the tilting of the mold body 15.

By providing the support elements 120, 125, 250, 275 special Tabuzonen can be kept on the circuit board 25, which are provided exclusively for the support of the spacer 20, 35. This taboo can be easily set early as part of a development process.

Although the invention has been further illustrated and described in detail by the preferred embodiment, the invention is not limited by the disclosed examples, and other variations can be derived therefrom by those skilled in the art without departing from the scope of the invention. In particular, it is conceivable that the features shown in the figures can also be combined differently with each other.

Claims

claims

1 . Arrangement (10)

with a mold body (15), a spacer (20) and a printed circuit board (25),

- wherein at least one electrical connection (1 10, 1 15) connects the mold body (15) with a conductor track (70, 75) of the printed circuit board (25),

- wherein the spacer (20) is connected to the mold body (15) and arranged on a side facing the printed circuit board (25), - wherein the spacer (20) is arranged offset to the electrical connection (1 10, 1 15)

- Wherein the spacer (20) defines a predefined distance (di) between a bottom (45) of the mold body (15) and the circuit board (25).

2. Arrangement (10) according to one of the preceding claims,

- wherein the spacer (20) comprises a first spacer element (160),

- wherein the first spacer element (160) is connected with a fixed end to the mold body (15),

- wherein the circuit board (25) has a support element (120, 125),

- wherein the support element (120, 125) preferably comprises an electrically conductive material,

- wherein a free end of the first spacer element (160) faces the support element (120, 125) and preferably rests on the support element (120, 125) at least in sections,

- Preferably wherein the support element (120, 125) is potential-free.

3. Arrangement (10) according to claim 2, - wherein the support element (120, 125) is arranged offset to a contact element (95, 100) of the printed circuit board (25),

- Wherein the electrical connection (1 10, 1 15) between the mold body (15) and the contact element (95, 100) is formed.

Arrangement (10) according to claim 2 or 3,

- wherein the support element (120, 125) has a contact surface (135, 140) and the contact element (95, 100) has a contact surface (130, 150),

- Wherein the bearing surface (135, 140) and the contact surface (130, 150) in a common first plane (155) are arranged.

Arrangement (10) according to one of claims 2 to 4,

- wherein the spacer (20) comprises a second spacer element (165),

- wherein the second spacer element (165) is connected to the mold body (15) with a fixed end,

- Wherein the first spacer element (160) and the second spacer element (165) are arranged on a common side of the mold body (15),

- wherein the first spacer element (160) has a first end face (170) at the free end and the second spacer element (165) has a second end face (175) at the free end,

- Wherein the first end face (170) and the second end face (175) are arranged in a common second plane (180).

Arrangement (10) according to claim 5,

- Wherein the first spacer element (160) and the second spacer element (165) are aligned in parallel.

Arrangement (10) according to one of the preceding claims,

- wherein the mold body (15) has a side surface (55, 60),

- wherein the side surface (55, 60) and the bottom (45) at an edge (270) adjacent to each other, - Wherein the first spacer (20) is disposed adjacent to the edge (270).

8. Arrangement (10) according to one of the preceding claims,

- wherein the printed circuit board (25) has a heat sink (40),

- wherein the mold body (15) and the heat sink (40) by means of a thermal connection (220, 240) are interconnected,

- Wherein the first spacer (20) between the electrical connection (1 10, 1 15) and the thermal connection (220, 240) is arranged.

9. Arrangement (10) according to one of the preceding claims,

comprising a further spacer (35) and a housing (30),

- wherein the further spacer (35) between the housing (30) and a further side surface (50, 55, 60) of the mold body (15) is arranged,

- Wherein the further spacer (35) defines a further predefined distance 2 between the mold body (15) and the housing (30).

10. Arrangement (10) according to claim 9,

- wherein the housing (30) has a further heat sink (235),

- wherein the mold body (15) by means of another thermal connection (220) is thermally connected to the further heat sink (235,

- wherein the further thermal connection (220, 240) comprises a heat conducting means (215),

- Wherein the second spacer (35) is embedded in the heat conducting means (215).

1 1. Arrangement (10) according to one of claims 9 or 10,

- wherein the further spacer (35) comprises a third spacer element (185), - wherein the third spacer element (185) is connected with a fixed end to the mold body (15),

- wherein at a free end of the third spacer element (185), the third spacer element (185) has a third end face (195),

- Wherein the third end face (195) rests against the housing (30).

12. Arrangement (10) according to claim 1 1,

- Wherein the third spacer element (185) and the first spacer element (160) in a common fourth plane (225) are arranged.

13. Arrangement (10) according to claim 1 1 or 12,

- wherein the further spacer (35) comprises a fourth spacer element (190),

- wherein the fourth spacer element (190) is connected with a fixed end to the mold body (15),

- Wherein at a free end of the fourth spacer element (190), the fourth spacer element (190) has a fourth end face (200),

- Wherein the fourth end face (200) and the third end face (195) in a common fifth plane (230) are arranged.