WO2018059144A1 - Cmp equipment polishing head wafer falling detection method and system - Google Patents

Cmp equipment polishing head wafer falling detection method and system Download PDF

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Publication number
WO2018059144A1
WO2018059144A1 PCT/CN2017/097356 CN2017097356W WO2018059144A1 WO 2018059144 A1 WO2018059144 A1 WO 2018059144A1 CN 2017097356 W CN2017097356 W CN 2017097356W WO 2018059144 A1 WO2018059144 A1 WO 2018059144A1
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WIPO (PCT)
Prior art keywords
polishing head
pressure
cmp apparatus
polishing
adsorption
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PCT/CN2017/097356
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French (fr)
Chinese (zh)
Inventor
孙浩明
路新春
雒建斌
温诗铸
王同庆
李昆
沈攀
Original Assignee
清华大学
天津华海清科机电科技有限公司
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Priority claimed from CN201621085173.9U external-priority patent/CN206105601U/en
Priority claimed from CN201610854416.9A external-priority patent/CN106425828A/en
Application filed by 清华大学, 天津华海清科机电科技有限公司 filed Critical 清华大学
Publication of WO2018059144A1 publication Critical patent/WO2018059144A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to the field of semiconductor technology, and in particular, to a CMP apparatus polishing head off-chip detecting method and system.
  • the planarization technology in the manufacturing process of semiconductor integrated circuit chips has become one of the indispensable key technologies that are equally important and interdependent with lithography and etching.
  • the Chemical Mechanical Planarization (CMP) process is currently the most effective and mature planarization technology.
  • the chemical mechanical polishing system is a chemical mechanical planarization technology that integrates polishing, cleaning, drying, on-line detection, and end point detection.
  • the CMP equipment is fully automated and does not require manual operation to ensure the safety of each part of the wafer during the production process. It is of great significance for safe production, reducing wear and tear, increasing productivity, increasing production capacity and increasing corporate profits. .
  • the CMP equipment mainly carries the polishing of the wafer onto the polishing pad through the polishing head for polishing, and after polishing, the polishing head is transported back to the wafer loading bracket to unload the release sheet.
  • the wafer may be detached from the adsorption film of the polishing head at various positions for various reasons.
  • the polishing disk is rotating, and the head is also rotating.
  • the wafer drop not only causes destructive damage to the wafer, but also damages the polishing head, the polishing disk, and the baffle.
  • the machine must be shut down for cleaning, replacement of consumables and maintenance and testing, loss of damaged wafers and consumables, reduced productivity and efficiency, and normal production and production for the enterprise. Profits have a big impact.
  • the first object of the present invention is to provide a CMP apparatus polishing head off-chip detecting method for detecting whether the adsorption film is dropped, thereby avoiding damage to the polishing head, the polishing disk and the baffle, and improving the productivity. And efficiency.
  • an embodiment of the present invention discloses a CMP apparatus polishing head off-chip detecting method, including The following steps: monitoring the vacuum adsorption pressure of the gripper region of the polishing head during the process of polishing the head vacuum gripper and the transport of the slide; determining the polishing head if the vacuum adsorption pressure exceeds a predetermined pressure threshold Drop the film and control to stop the polishing head.
  • the blade region of the polishing head includes a plurality of vacuum adsorption points, and the polishing is determined when a vacuum adsorption pressure of at least one adsorption point of the plurality of negative pressure adsorption points exceeds the predetermined pressure threshold The falling of the head.
  • the predetermined pressure threshold is set according to an adsorption pressure adopted by the grip area of the polishing head during normal gripping.
  • the method further includes: performing an alarm.
  • the pressure of the gripping area is detected in real time, and the pressure changes of the areas are compared and analyzed, thereby determining whether a falling piece occurs, thereby avoiding the polishing head.
  • polishing discs and baffles cause damage, increase productivity and efficiency.
  • a second object of the present invention is to provide a polishing head drop detection system for a CMP apparatus for detecting whether or not the adsorption film is dropped, thereby avoiding damage to the polishing head, the polishing disk, and the baffle, and improving productivity and efficiency.
  • an embodiment of the present invention discloses a polishing head drop detection system for a CMP apparatus, including: a pressure monitoring module, the pressure monitoring module being coupled to the polishing head to vacuum the blade in the polishing head And monitoring the vacuum adsorption pressure of the gripper region of the polishing head during the transport of the slide; the control module is respectively connected to the pressure monitoring module and the electronic control unit of the polishing head to When the vacuum adsorption pressure exceeds the predetermined pressure threshold, the polishing head is determined to be off-chip, and the polishing head is controlled to stop running after determining that the polishing head is dropped.
  • the gripper region of the polishing head includes a plurality of vacuum adsorption points
  • the control module is further configured to: when the vacuum adsorption pressure of the at least one adsorption point exists in the plurality of negative pressure adsorption points exceeds the predetermined pressure At the threshold, the polishing head is considered to be off-chip.
  • the predetermined pressure threshold is set according to an adsorption pressure adopted by the grip area of the polishing head during normal gripping.
  • the method further includes: an alarm module, wherein the alarm module is connected to the control module to perform an alarm according to an alarm signal sent by the control module; wherein the control module is further configured to determine that the polishing head is off-chip Thereafter, the signal is sent to the alarm module.
  • the polishing head off-chip detecting system of the CMP apparatus detects the pressure of the gripper area in real time, and compares and analyzes the pressure changes of the areas, thereby determining whether a falling piece occurs, thereby avoiding the polishing head. , polishing discs and baffles cause damage, increase productivity and efficiency.
  • a third object of the present invention is to provide an apparatus for detecting whether or not an adsorption film is dropped, thereby avoiding Damage to the polishing head, polishing disc, and baffle, increasing productivity and efficiency.
  • An apparatus comprising: one or more processors; a memory; one or more programs, the one or more programs being stored in the memory, when executed by the one or more processors, performing the above The CMP apparatus polishing head off-chip detecting method described in the embodiment.
  • the device and the above-mentioned CMP device polishing head off-chip detection method have the same advantages as those of the prior art, and are not described herein again.
  • a fourth object of the present invention is to provide a non-volatile computer storage medium which can improve the controllability and flexibility of key authorization and is simple and easy to implement.
  • a non-volatile computer storage medium storing one or more programs that, when executed by a device, cause the device to perform the CMP device of the above-described embodiments of the present invention Polishing head off film detection method.
  • the non-volatile computer storage medium has the same advantages as the prior art CMP device polishing head off-chip detection method, and details are not described herein again.
  • FIG. 1 is a flow chart of a method for detecting a falling of a polishing head of a CMP apparatus according to an embodiment of the present invention
  • FIGS. 2(a)-(c) are schematic views showing the wafer being attached, loosened, and detached from the polishing head in one embodiment of the present invention
  • Figure 3 is a graph showing the adsorption pressure of three negative pressure adsorption points in one embodiment of the present invention.
  • FIG. 4 is a block diagram showing the structure of a polishing head off-chip detecting system of a CMP apparatus according to an embodiment of the present invention.
  • a CMP apparatus polishing head off-chip detecting method includes the following steps:
  • FIGS. 2(a)-(c) are schematic views respectively showing the wafer being bonded, loosened, and detached from the polishing head in one embodiment of the present invention.
  • the wafer 2 is initially brought into contact with the polishing head 1, and if there is an abnormality, it may loosen and may fall off.
  • the pressure in the blade region is stable, and when the contact between the wafer 2 and the adsorption film 3 is loose, the pressure in the blade region may be A jump, by grasping this pressure jump, determines the contact state of the wafer 2 with the adsorption film 3, realizes the falling film monitoring of the polishing head 1, and stops the polishing head 1 under control.
  • the gripper region of the polishing head includes a plurality of vacuum adsorption points, and when the vacuum adsorption pressure of the at least one adsorption point of the plurality of negative pressure adsorption points exceeds a predetermined pressure threshold, the polishing head is determined Drop off.
  • Figure 3 is a graph of adsorption pressure using three vacuum adsorption points in one embodiment of the present invention.
  • the three curves represent the pressure profiles of the three vacuum adsorption points.
  • the horizontal axis coordinate represents the sampling point, or serial number, which is sampled every 200ms, and the horizontal axis has a total of 50 sampling points, and the total duration is 10s.
  • the pressures of the three vacuum adsorption points jump, and the pressure is greater than the predetermined pressure threshold (in this example, the predetermined pressure threshold is -1.5 psi), thereby determining that the polishing head is off. sheet.
  • the predetermined pressure threshold in this example, the predetermined pressure threshold is -1.5 psi
  • the negative pressure adsorption points may be one or more, and when there are a plurality of negative pressure adsorption points, one or more of the adsorption wafers may be randomly selected or selected.
  • the predetermined pressure threshold is set based on the suction pressure employed by the gripper region of the polishing head during normal gripping.
  • the normal gripper refers to the conforming state between the wafer and the polishing head, as shown in Fig. 2(a).
  • the predetermined pressure threshold is set according to the pressure value at the time of normal gripping, and the accuracy of the falling of the polishing head is high.
  • the method further includes: performing an alarm.
  • the manner of the alarm may include performing a buzzer alarm and an alarm to the designated terminal.
  • polishing head off-chip detecting method of the embodiment of the invention by monitoring the pressure change of the polishing head gripping area, it is judged whether the polishing head vacuum gripping piece and the slide piece are transported during the process of the falling piece, and the polishing is stopped in time when the falling piece is removed.
  • Head equipment effective protection of wafer and polishing head equipment, improved machine reliability and intelligent control.
  • a CMP equipment polishing head off-chip detecting system includes: a pressure monitoring module 210 and a control module 220.
  • the pressure monitoring module 210 is coupled to the polishing head to monitor the vacuum adsorption pressure of the blade region of the polishing head during the process of polishing the vacuum chuck of the polishing head and the transfer of the carrier.
  • the control module 220 is respectively connected to the pressure monitoring module 210 and the electronic control unit of the polishing head to determine that the polishing head is lost when the vacuum adsorption pressure exceeds the predetermined pressure threshold, and to control to stop the polishing head after the polishing head is determined to be off.
  • the gripper region of the polishing head includes a plurality of vacuum suction points
  • the control module 220 is further configured to: when the vacuum adsorption pressure of the at least one adsorption point of the plurality of negative pressure adsorption points exceeds a predetermined pressure threshold At the time, it was determined that the polishing head fell off.
  • the predetermined pressure threshold is set based on the suction pressure employed by the gripper region of the polishing head during normal gripping.
  • the CMP apparatus polishing head off-chip detecting system of the embodiment of the present invention further includes an alarm module, and the alarm module is connected to the control module to perform an alarm according to an alarm signal sent by the control module.
  • the control module 220 is configured to send a signal to the alarm module after determining that the polishing head is out of the film.
  • polishing head drop detection system of the CMP apparatus is similar to the specific implementation method of the CMP equipment polishing head off-chip detection method according to the embodiment of the present invention.
  • the specific implementation manner of the polishing head drop detection system of the CMP apparatus is similar to the specific implementation method of the CMP equipment polishing head off-chip detection method according to the embodiment of the present invention.
  • embodiments of the present invention disclose an apparatus comprising: one or more processors; a memory; one or more programs, one or more programs stored in the memory, when processed by one or more
  • the CMP apparatus polishing head off-chip detecting method of the above embodiment is executed.
  • the device is used to detect whether the adsorption film is dropped or not, thereby avoiding damage to the polishing head, the polishing disk and the baffle, and improving productivity and efficiency.
  • embodiments of the present invention disclose a non-volatile computer storage medium storing one or more programs that cause a device when one or more programs are executed by one device
  • the CMP apparatus polishing head off-chip detecting method of the above embodiment of the present invention is performed.
  • the non-volatile computer storage medium is used to detect whether the adsorption film is dropped, thereby avoiding damage to the polishing head, the polishing disk and the baffle, and improving productivity and efficiency.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A CMP equipment polishing head wafer falling detection method and system. The method comprises: monitoring, in a vacuum wafer grabbing process and a wafer carrying and conveying process of a polishing head, the vacuum adsorption pressure of a wafer grabbing area of the polishing head; and if the vacuum adsorption pressure exceeds a preset pressure threshold, determining that the wafer falls from the polishing head, and controlling the polishing head to stop operating. The method and system have the following advantages: the pressure of the wafer grabbing area is detected in real time, and changes in pressure of the areas are compared and analyzed as conditions to determine whether wafer falling happens. Therefore, the polishing head, a polishing disc, and a baffle are prevented from being damaged, and the productivity and efficiency are improved.

Description

CMP设备抛光头掉片检测方法和系统CMP equipment polishing head off film detection method and system
相关申请的交叉引用Cross-reference to related applications
本申请要求天津华海清科机电科技有限公司和清华大学于2016年09月27日提交的、发明名称为“CMP设备抛光头掉片检测方法和系统”的、中国专利申请号“201610854416.9”以及的清华大学于2016年09月27日提交的、发明名称为“CMP设备抛光头掉片检测系统”的、中国专利申请号“201621085173.9”优先权。This application claims Tianjin Huahai Qingke Electromechanical Technology Co., Ltd. and Tsinghua University on September 27, 2016, the invention name is "CMP equipment polishing head off film detection method and system", Chinese patent application number "201610854416.9" and The Chinese patent application number "201621085173.9", which was submitted by Tsinghua University on September 27, 2016 and entitled "CMP Equipment Polishing Head Drop Detection System", has priority.
技术领域Technical field
本发明涉及半导体技术领域，具体涉及一种CMP设备抛光头掉片检测方法和系统。The present invention relates to the field of semiconductor technology, and in particular, to a CMP apparatus polishing head off-chip detecting method and system.
背景技术Background technique
半导体集成电路芯片制造工艺中平坦化技术已成为与光刻和刻蚀同等重要且相互依赖的不可缺少的关键技术之一。而化学机械平坦化(Chemical Mechanical Planarization,CMP)工艺便是目前最有效、最成熟的平坦化技术。化学机械抛光系统是集抛光、清洗、干燥、在线检测、终点检测等技术于一体的化学机械平坦化技术。CMP设备是完全自动化的，不需要人为手动操作，保证晶圆在生产过程中每一模块每一环节的安全性，对于安全生产、降低损耗、提高生产率、增加产能、提高企业利润具有重要的意义。CMP设备主要是通过抛光头对晶圆吸附运载到抛光垫上进行抛光，抛光结束后再由抛光头运回晶圆装载支架卸载放片。The planarization technology in the manufacturing process of semiconductor integrated circuit chips has become one of the indispensable key technologies that are equally important and interdependent with lithography and etching. The Chemical Mechanical Planarization (CMP) process is currently the most effective and mature planarization technology. The chemical mechanical polishing system is a chemical mechanical planarization technology that integrates polishing, cleaning, drying, on-line detection, and end point detection. The CMP equipment is fully automated and does not require manual operation to ensure the safety of each part of the wafer during the production process. It is of great significance for safe production, reducing wear and tear, increasing productivity, increasing production capacity and increasing corporate profits. . The CMP equipment mainly carries the polishing of the wafer onto the polishing pad through the polishing head for polishing, and after polishing, the polishing head is transported back to the wafer loading bracket to unload the release sheet.
现有技术中，在吸附晶圆和载片传输的过程中，晶圆会因为各种原因在各个位置脱离抛光头的吸附膜发生掉片的情况，此时抛光盘在旋转，头也在旋转，那么晶圆掉落不仅会对晶圆造成破坏性的损伤，对抛光头、抛光盘以及挡板也会有造成损伤的可能性。另外，发生晶圆和设备损伤的情况时，机台必须停机清理，更换耗材并进行维护和测试，损失已损坏晶圆和耗材的同时，还降低了产能和效率，对企业的正常生产和生产利润造成很大的影响。In the prior art, during the process of adsorbing the wafer and transporting the wafer, the wafer may be detached from the adsorption film of the polishing head at various positions for various reasons. At this time, the polishing disk is rotating, and the head is also rotating. Then, the wafer drop not only causes destructive damage to the wafer, but also damages the polishing head, the polishing disk, and the baffle. In addition, when wafer and equipment damage occurs, the machine must be shut down for cleaning, replacement of consumables and maintenance and testing, loss of damaged wafers and consumables, reduced productivity and efficiency, and normal production and production for the enterprise. Profits have a big impact.
发明内容Summary of the invention
有鉴于此，本发明的第一个目的旨在提出一种CMP设备抛光头掉片检测方法，用于检测吸附膜是否掉片，从而避免对抛光头、抛光盘以及挡板造成损伤，提高产能和效率。In view of this, the first object of the present invention is to provide a CMP apparatus polishing head off-chip detecting method for detecting whether the adsorption film is dropped, thereby avoiding damage to the polishing head, the polishing disk and the baffle, and improving the productivity. And efficiency.
为了实现上述目的，本发明的实施例公开了一种CMP设备抛光头掉片检测方法，包括 以下步骤：在抛光头真空抓片的过程以及载片传送的过程中，监测所述抛光头的抓片区域的真空吸附压力；如果所述真空吸附压力超过预定压力阈值，则判定所述抛光头掉片，并控制停止运行所述抛光头。In order to achieve the above object, an embodiment of the present invention discloses a CMP apparatus polishing head off-chip detecting method, including The following steps: monitoring the vacuum adsorption pressure of the gripper region of the polishing head during the process of polishing the head vacuum gripper and the transport of the slide; determining the polishing head if the vacuum adsorption pressure exceeds a predetermined pressure threshold Drop the film and control to stop the polishing head.
进一步地，所述抛光头的抓片区域包括多个负压吸附点，当所述多个负压吸附点中存在至少一个吸附点的真空吸附压力超过所述预定压力阈值时，认定所述抛光头的掉片。Further, the blade region of the polishing head includes a plurality of vacuum adsorption points, and the polishing is determined when a vacuum adsorption pressure of at least one adsorption point of the plurality of negative pressure adsorption points exceeds the predetermined pressure threshold The falling of the head.
进一步地，所述预定压力阈值是根据所述抛光头的抓片区域在正常抓片时采用的吸附压力设定的。Further, the predetermined pressure threshold is set according to an adsorption pressure adopted by the grip area of the polishing head during normal gripping.
进一步地，在判断所述抛光头掉片后，还包括：进行报警。Further, after determining that the polishing head is dropped, the method further includes: performing an alarm.
根据本发明实施例的CMP设备抛光头掉片检测方法，实时检测抓片区域的压力，并对这些区域的压力变化进行比较分析，以此为条件来判断是否发生掉片，从而避免对抛光头、抛光盘以及挡板造成损伤，提高产能和效率。According to the CMP apparatus polishing head off-chip detecting method according to the embodiment of the present invention, the pressure of the gripping area is detected in real time, and the pressure changes of the areas are compared and analyzed, thereby determining whether a falling piece occurs, thereby avoiding the polishing head. , polishing discs and baffles cause damage, increase productivity and efficiency.
本发明的第二个目的在于提出一种CMP设备抛光头掉片检测系统，用于检测吸附膜是否掉片，从而避免对抛光头、抛光盘以及挡板造成损伤，提高产能和效率。A second object of the present invention is to provide a polishing head drop detection system for a CMP apparatus for detecting whether or not the adsorption film is dropped, thereby avoiding damage to the polishing head, the polishing disk, and the baffle, and improving productivity and efficiency.
为了实现上述目的，本发明的实施例公开了一种CMP设备抛光头掉片检测系统，包括：压力监测模块，所述压力监测模块与抛光头相连，以在所述抛光头真空抓片的过程以及载片传送的过程中，监测所述抛光头的抓片区域的真空吸附压力；控制模块，所述控制模块分别与所述压力监测模块和所述抛光头的电子控制单元相连，以在所述真空吸附压力超过预定压力阈值时判定所述抛光头掉片，并在判定所述抛光头掉片后控制停止运行所述抛光头。In order to achieve the above object, an embodiment of the present invention discloses a polishing head drop detection system for a CMP apparatus, including: a pressure monitoring module, the pressure monitoring module being coupled to the polishing head to vacuum the blade in the polishing head And monitoring the vacuum adsorption pressure of the gripper region of the polishing head during the transport of the slide; the control module is respectively connected to the pressure monitoring module and the electronic control unit of the polishing head to When the vacuum adsorption pressure exceeds the predetermined pressure threshold, the polishing head is determined to be off-chip, and the polishing head is controlled to stop running after determining that the polishing head is dropped.
进一步地，所述抛光头的抓片区域包括多个负压吸附点，所述控制模块进一步用于当所述多个负压吸附点中存在至少一个吸附点的真空吸附压力超过所述预定压力阈值时，认定所述抛光头掉片。Further, the gripper region of the polishing head includes a plurality of vacuum adsorption points, and the control module is further configured to: when the vacuum adsorption pressure of the at least one adsorption point exists in the plurality of negative pressure adsorption points exceeds the predetermined pressure At the threshold, the polishing head is considered to be off-chip.
进一步地，所述预定压力阈值是根据所述抛光头的抓片区域在正常抓片时采用的吸附压力设定的。Further, the predetermined pressure threshold is set according to an adsorption pressure adopted by the grip area of the polishing head during normal gripping.
进一步地，还包括：报警模块，所述报警模块与所述控制模块相连，以根据所述控制模块发送的报警信号进行报警；其中，所述控制模块还用于在认定所述抛光头掉片后，向所述报警模块发送所述信号。Further, the method further includes: an alarm module, wherein the alarm module is connected to the control module to perform an alarm according to an alarm signal sent by the control module; wherein the control module is further configured to determine that the polishing head is off-chip Thereafter, the signal is sent to the alarm module.
根据本发明实施例的CMP设备抛光头掉片检测系统，实时检测抓片区域的压力，并对这些区域的压力变化进行比较分析，以此为条件来判断是否发生掉片，从而避免对抛光头、抛光盘以及挡板造成损伤，提高产能和效率。The polishing head off-chip detecting system of the CMP apparatus according to the embodiment of the invention detects the pressure of the gripper area in real time, and compares and analyzes the pressure changes of the areas, thereby determining whether a falling piece occurs, thereby avoiding the polishing head. , polishing discs and baffles cause damage, increase productivity and efficiency.
本发明的第三个目的在于提出一种设备，该设备用于检测吸附膜是否掉片，从而避免 对抛光头、抛光盘以及挡板造成损伤，提高产能和效率。A third object of the present invention is to provide an apparatus for detecting whether or not an adsorption film is dropped, thereby avoiding Damage to the polishing head, polishing disc, and baffle, increasing productivity and efficiency.
为达到上述目的，本发明的技术方案是这样实现的：In order to achieve the above object, the technical solution of the present invention is achieved as follows:
一种设备，包括：一个或者多个处理器；存储器；一个或者多个程序，所述一个或者多个程序存储在所述存储器中，当被所述一个或者多个处理器执行时，执行上述实施例所述的CMP设备抛光头掉片检测方法。An apparatus comprising: one or more processors; a memory; one or more programs, the one or more programs being stored in the memory, when executed by the one or more processors, performing the above The CMP apparatus polishing head off-chip detecting method described in the embodiment.
所述的设备与上述的CMP设备抛光头掉片检测方法相对于现有技术所具有的优势相同，在此不再赘述。The device and the above-mentioned CMP device polishing head off-chip detection method have the same advantages as those of the prior art, and are not described herein again.
本发明的第四个目的在于提出一种非易失性计算机存储介质，该非易失性计算机存储介质可以提高钥匙授权的可控性和灵活性，简单易实现。A fourth object of the present invention is to provide a non-volatile computer storage medium which can improve the controllability and flexibility of key authorization and is simple and easy to implement.
为达到上述目的，本发明的技术方案是这样实现的：In order to achieve the above object, the technical solution of the present invention is achieved as follows:
一种非易失性计算机存储介质，所述计算机存储介质存储有一个或者多个程序，当所述一个或者多个程序被一个设备执行时，使得所述设备执行本发明上述实施例的CMP设备抛光头掉片检测方法。A non-volatile computer storage medium storing one or more programs that, when executed by a device, cause the device to perform the CMP device of the above-described embodiments of the present invention Polishing head off film detection method.
所述的非易失性计算机存储介质与上述的CMP设备抛光头掉片检测方法相对于现有技术所具有的优势相同，在此不再赘述。The non-volatile computer storage medium has the same advantages as the prior art CMP device polishing head off-chip detection method, and details are not described herein again.
附图说明DRAWINGS
构成本发明的一部分的附图用来提供对本发明的进一步理解，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：The accompanying drawings, which are incorporated in the claims In the drawing:
图1是本发明实施例的CMP设备抛光头掉片检测方法的流程图；1 is a flow chart of a method for detecting a falling of a polishing head of a CMP apparatus according to an embodiment of the present invention;
图2(a)-(c)分别是本发明一个实施例中晶圆与抛光头贴合、松动和脱落的示意图；2(a)-(c) are schematic views showing the wafer being attached, loosened, and detached from the polishing head in one embodiment of the present invention;
图3是本发明一个实施例中采用三个负压吸附点的吸附压力曲线图；Figure 3 is a graph showing the adsorption pressure of three negative pressure adsorption points in one embodiment of the present invention;
图4是本发明一个实施例的CMP设备抛光头掉片检测系统的结构框图。4 is a block diagram showing the structure of a polishing head off-chip detecting system of a CMP apparatus according to an embodiment of the present invention.
具体实施方式detailed description
需要说明的是，在不冲突的情况下，本发明中的实施例及实施例中的特征可以相互组合。It should be noted that the embodiments in the present invention and the features in the embodiments may be combined with each other without conflict.
下面将参考附图并结合实施例来详细说明本发明。The invention will be described in detail below with reference to the drawings in conjunction with the embodiments.
图1是本发明实施例的CMP设备抛光头掉片检测方法的流程图。如图1所示，一种CMP设备抛光头掉片检测方法，包括以下步骤：1 is a flow chart of a method for detecting a falling of a polishing head of a CMP apparatus according to an embodiment of the present invention. As shown in FIG. 1, a CMP apparatus polishing head off-chip detecting method includes the following steps:
S110：在抛光头真空抓片的过程以及载片传送的过程中，监测抛光头的抓片区域的真空吸附压力。 S110: Monitoring the vacuum adsorption pressure of the gripper region of the polishing head during the process of polishing the head vacuum gripper and the transport of the slide.
S120：如果真空吸附压力超过预定压力阈值，则认定抛光头掉片，并控制停止运行抛光头。S120: If the vacuum adsorption pressure exceeds the predetermined pressure threshold, it is determined that the polishing head is out of the sheet, and the polishing head is controlled to stop running.
具体地，图2(a)-(c)分别是本发明一个实施例中晶圆与抛光头贴合、松动和脱落的示意图。如图2(a)-(c)所示，晶圆2开始处于与抛光头1贴合状态，一旦有异常情况会有松动，进而会脱落。在晶圆2与吸附膜3紧密贴合与脱落的状态下，抓片区域压力都是平稳不变的，而在晶圆2与吸附膜3接触出现松动的瞬间，抓片区域的压力会有一个跳变，通过抓取这个压力跳变，来判断晶圆2与吸附膜3的接触状态，实现抛光头1的掉片监测，并在控制停止运行抛光头1。Specifically, FIGS. 2(a)-(c) are schematic views respectively showing the wafer being bonded, loosened, and detached from the polishing head in one embodiment of the present invention. As shown in Figs. 2(a)-(c), the wafer 2 is initially brought into contact with the polishing head 1, and if there is an abnormality, it may loosen and may fall off. In the state in which the wafer 2 and the adsorption film 3 are closely attached and detached, the pressure in the blade region is stable, and when the contact between the wafer 2 and the adsorption film 3 is loose, the pressure in the blade region may be A jump, by grasping this pressure jump, determines the contact state of the wafer 2 with the adsorption film 3, realizes the falling film monitoring of the polishing head 1, and stops the polishing head 1 under control.
在本发明的一个实施例中，抛光头的抓片区域包括多个负压吸附点，当多个负压吸附点中存在至少一个吸附点的真空吸附压力超过预定压力阈值时，认定抛光头的掉片。In an embodiment of the present invention, the gripper region of the polishing head includes a plurality of vacuum adsorption points, and when the vacuum adsorption pressure of the at least one adsorption point of the plurality of negative pressure adsorption points exceeds a predetermined pressure threshold, the polishing head is determined Drop off.
在本发明的一个示例中，图3是本发明一个实施例中采用三个负压吸附点的吸附压力曲线图。如图3所示，三条曲线分别代表三个负压吸附点的压力变化曲线。横轴坐标代表采样点，或者序号，每隔200ms采样一次，横轴总共50个采样点，总时长10s。在15×200ms-18×200ms期间，三个负压吸附点的压力发生跳变，且压力大于预定压力阈值(在本示例中，预定压力阈值为-1.5psi)，由此认定抛光头的掉片。需要说明的是，负压吸附点可以为一个或多个，且当负压吸附点为多个时，可以随机或选定其中的一个或多个吸附晶圆。In one example of the present invention, Figure 3 is a graph of adsorption pressure using three vacuum adsorption points in one embodiment of the present invention. As shown in Figure 3, the three curves represent the pressure profiles of the three vacuum adsorption points. The horizontal axis coordinate represents the sampling point, or serial number, which is sampled every 200ms, and the horizontal axis has a total of 50 sampling points, and the total duration is 10s. During 15 x 200 ms - 18 x 200 ms, the pressures of the three vacuum adsorption points jump, and the pressure is greater than the predetermined pressure threshold (in this example, the predetermined pressure threshold is -1.5 psi), thereby determining that the polishing head is off. sheet. It should be noted that the negative pressure adsorption points may be one or more, and when there are a plurality of negative pressure adsorption points, one or more of the adsorption wafers may be randomly selected or selected.
在本发明的一个实施例中，预定压力阈值是根据抛光头的抓片区域在正常抓片时采用的吸附压力设定的。正常抓片指的是晶圆与抛光头之间处于贴合状态，如图2(a)所示。根据正常抓片时的压力值设定预定压力阈值针对性强，对抛光头掉片判断准确性高。In one embodiment of the invention, the predetermined pressure threshold is set based on the suction pressure employed by the gripper region of the polishing head during normal gripping. The normal gripper refers to the conforming state between the wafer and the polishing head, as shown in Fig. 2(a). The predetermined pressure threshold is set according to the pressure value at the time of normal gripping, and the accuracy of the falling of the polishing head is high.
在本发明的一个实施例中，在判断抛光头掉片后，还包括：进行报警。报警的方式可以包括进行蜂鸣报警和向指定终端进行报警。In an embodiment of the present invention, after determining that the polishing head is dropped, the method further includes: performing an alarm. The manner of the alarm may include performing a buzzer alarm and an alarm to the designated terminal.
本发明实施例的CMP设备抛光头掉片检测方法，通过监测抛光头抓片区域的压力变化来判断抛光头真空抓片以及载片传送的过程中是否发生掉片，在掉片时及时停止抛光头设备，有效保护晶圆和抛光头设备、提高机台可靠性和智能化控制。In the CMP apparatus polishing head off-chip detecting method of the embodiment of the invention, by monitoring the pressure change of the polishing head gripping area, it is judged whether the polishing head vacuum gripping piece and the slide piece are transported during the process of the falling piece, and the polishing is stopped in time when the falling piece is removed. Head equipment, effective protection of wafer and polishing head equipment, improved machine reliability and intelligent control.
图4是本发明一个实施例的CMP设备抛光头掉片检测系统的结构框图。如图4所示，一种CMP设备抛光头掉片检测系统，包括：压力监测模块210和控制模块220。4 is a block diagram showing the structure of a polishing head off-chip detecting system of a CMP apparatus according to an embodiment of the present invention. As shown in FIG. 4, a CMP equipment polishing head off-chip detecting system includes: a pressure monitoring module 210 and a control module 220.
其中，压力监测模块210与抛光头相连，以在抛光头真空抓片的过程以及载片传送的过程中，监测抛光头的抓片区域的真空吸附压力。控制模块220分别与压力监测模块210和抛光头的电子控制单元相连，以在真空吸附压力超过预定压力阈值时则判认定抛光头掉片，并在认定抛光头掉片后控制停止运行抛光头。 Wherein, the pressure monitoring module 210 is coupled to the polishing head to monitor the vacuum adsorption pressure of the blade region of the polishing head during the process of polishing the vacuum chuck of the polishing head and the transfer of the carrier. The control module 220 is respectively connected to the pressure monitoring module 210 and the electronic control unit of the polishing head to determine that the polishing head is lost when the vacuum adsorption pressure exceeds the predetermined pressure threshold, and to control to stop the polishing head after the polishing head is determined to be off.
在本发明的一个实施例中，抛光头的抓片区域包括多个负压吸附点，控制模块220进一步用于当多个负压吸附点中存在至少一个吸附点的真空吸附压力超过预定压力阈值时，认定抛光头掉片。In an embodiment of the invention, the gripper region of the polishing head includes a plurality of vacuum suction points, and the control module 220 is further configured to: when the vacuum adsorption pressure of the at least one adsorption point of the plurality of negative pressure adsorption points exceeds a predetermined pressure threshold At the time, it was determined that the polishing head fell off.
在本发明的一个实施例中，预定压力阈值是根据抛光头的抓片区域在正常抓片时采用的吸附压力设定的。In one embodiment of the invention, the predetermined pressure threshold is set based on the suction pressure employed by the gripper region of the polishing head during normal gripping.
在本发明的一个实施例中，本发明实施例的CMP设备抛光头掉片检测系统还包括报警模块，报警模块与控制模块相连，以根据控制模块发送的报警信号进行报警。其中，控制模块220用于在认定抛光头掉片后，向报警模块发送信号。In an embodiment of the present invention, the CMP apparatus polishing head off-chip detecting system of the embodiment of the present invention further includes an alarm module, and the alarm module is connected to the control module to perform an alarm according to an alarm signal sent by the control module. The control module 220 is configured to send a signal to the alarm module after determining that the polishing head is out of the film.
需要说明的是，本发明实施例的CMP设备抛光头掉片检测系统的具体实施方式与本发明实施例的CMP设备抛光头掉片检测方法的具体实施方式类似，具体参见方法部分的描述，为了减少冗余，不作赘述。It should be noted that the specific implementation manner of the polishing head drop detection system of the CMP apparatus according to the embodiment of the present invention is similar to the specific implementation method of the CMP equipment polishing head off-chip detection method according to the embodiment of the present invention. For details, refer to the description of the method part, Reduce redundancy and do not go into details.
进一步地，本发明的实施例公开了一种设备，该设备包括：一个或者多个处理器；存储器；一个或者多个程序，一个或者多个程序存储在存储器中，当被一个或者多个处理器执行时，执行上述实施例的CMP设备抛光头掉片检测方法。该设备用于检测吸附膜是否掉片，从而避免对抛光头、抛光盘以及挡板造成损伤，提高产能和效率。Further, embodiments of the present invention disclose an apparatus comprising: one or more processors; a memory; one or more programs, one or more programs stored in the memory, when processed by one or more When the device is executed, the CMP apparatus polishing head off-chip detecting method of the above embodiment is executed. The device is used to detect whether the adsorption film is dropped or not, thereby avoiding damage to the polishing head, the polishing disk and the baffle, and improving productivity and efficiency.
进一步地，本发明的实施例公开了一种非易失性计算机存储介质，该非易失性计算机存储介质存储有一个或者多个程序，当一个或者多个程序被一个设备执行时，使得设备执行本发明上述实施例的CMP设备抛光头掉片检测方法。该非易失性计算机存储介质用于检测吸附膜是否掉片，从而避免对抛光头、抛光盘以及挡板造成损伤，提高产能和效率。Further, embodiments of the present invention disclose a non-volatile computer storage medium storing one or more programs that cause a device when one or more programs are executed by one device The CMP apparatus polishing head off-chip detecting method of the above embodiment of the present invention is performed. The non-volatile computer storage medium is used to detect whether the adsorption film is dropped, thereby avoiding damage to the polishing head, the polishing disk and the baffle, and improving productivity and efficiency.
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。 The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., which are included in the spirit and scope of the present invention, should be included in the present invention. Within the scope of protection.

Claims (10)

  1. 一种CMP设备抛光头掉片检测方法，其特征在于，包括以下步骤：A CMP apparatus polishing head off-chip detecting method, characterized in that the method comprises the following steps:
    在抛光头真空抓片的过程以及载片传送的过程中，监测所述抛光头的抓片区域的真空吸附压力；Monitoring the vacuum adsorption pressure of the gripper region of the polishing head during the process of polishing the head vacuum gripper and the transport of the slide;
    如果所述真空吸附压力超过预定压力阈值，则判定所述抛光头掉片，并控制停止运行所述抛光头。If the vacuum adsorption pressure exceeds a predetermined pressure threshold, it is determined that the polishing head is out of the sheet and control is stopped to operate the polishing head.
  2. 根据权利要求1所述的CMP设备抛光头掉片检测方法，其特征在于，所述抛光头的抓片区域包括多个负压吸附点，当所述多个负压吸附点中存在至少一个吸附点的真空吸附压力超过所述预定压力阈值时，认定所述抛光头的掉片。The CMP apparatus polishing head off-chip detecting method according to claim 1, wherein the blade region of the polishing head comprises a plurality of vacuum adsorption points, and at least one of the plurality of negative pressure adsorption points is present. When the vacuum adsorption pressure of the point exceeds the predetermined pressure threshold, the falling of the polishing head is determined.
  3. 根据权利要求1所述的CMP设备抛光头掉片检测方法，其特征在于，所述预定压力阈值是根据所述抛光头的抓片区域在正常抓片时采用的吸附压力设定的。The CMP apparatus polishing head off-chip detecting method according to claim 1, wherein the predetermined pressure threshold is set according to an adsorption pressure adopted by a grip area of the polishing head at a normal grip.
  4. 根据权利要求1所述的CMP设备抛光头掉片检测方法，其特征在于，在判断所述抛光头掉片后，还包括：The CMP apparatus polishing head off-chip detecting method according to claim 1, wherein after determining that the polishing head is dropped, the method further comprises:
    进行报警。Make an alarm.
  5. 一种CMP设备抛光头掉片检测系统，其特征在于，包括：A polishing head drop detection system for a CMP apparatus, characterized in that it comprises:
    压力监测模块，所述压力监测模块与抛光头相连，以在所述抛光头真空抓片的过程以及载片传送的过程中，监测所述抛光头的抓片区域的真空吸附压力；a pressure monitoring module, wherein the pressure monitoring module is coupled to the polishing head to monitor a vacuum adsorption pressure of the blade region of the polishing head during the process of the polishing head vacuum chuck and the transfer of the carrier;
    控制模块，所述控制模块分别与所述压力监测模块和所述抛光头的电子控制单元相连，以在所述真空吸附压力超过预定压力阈值时判定所述抛光头掉片，并在判定所述抛光头掉片后控制停止运行所述抛光头。a control module, wherein the control module is respectively connected to the pressure monitoring module and the electronic control unit of the polishing head to determine that the polishing head falls off when the vacuum adsorption pressure exceeds a predetermined pressure threshold, and determines Controlling the stop of the polishing head after the polishing head is dropped.
  6. 根据权利要求5所述的CMP设备抛光头掉片检测系统，其特征在于，所述抛光头的抓片区域包括多个负压吸附点，所述控制模块进一步用于当所述多个负压吸附点中存在至少一个吸附点的真空吸附压力超过所述预定压力阈值时，认定所述抛光头掉片。The CMP apparatus polishing head off-chip detecting system according to claim 5, wherein the blade region of the polishing head includes a plurality of vacuum suction points, and the control module is further configured to use the plurality of negative pressures When the vacuum adsorption pressure of the at least one adsorption point in the adsorption point exceeds the predetermined pressure threshold, the polishing head is determined to fall off.
  7. 根据权利要求5所述的CMP设备抛光头掉片检测系统，其特征在于，所述预定压力阈值是根据所述抛光头的抓片区域在正常抓片时采用的吸附压力设定的。A polishing head drop detection system for a CMP apparatus according to claim 5, wherein said predetermined pressure threshold is set according to an adsorption pressure employed by said blade region of said polishing head during normal gripping.
  8. 根据权利要求5所述的CMP设备抛光头掉片检测系统，其特征在于，还包括：The polishing head off-chip detecting system of a CMP apparatus according to claim 5, further comprising:
    报警模块，所述报警模块与所述控制模块相连，以根据所述控制模块发送的报警信号进行报警；An alarm module, wherein the alarm module is connected to the control module to perform an alarm according to an alarm signal sent by the control module;
    其中，所述控制模块还用于在认定所述抛光头掉片后，向所述报警模块发送所述信号。The control module is further configured to send the signal to the alarm module after determining that the polishing head is off-chip.
  9. 一种设备，其特征在于，包括： An apparatus, comprising:
    一个或者多个处理器；One or more processors;
    存储器；Memory
    一个或者多个程序，所述一个或者多个程序存储在所述存储器中，当被所述一个或者多个处理器执行时，执行如权利要求1-4任一项所述的CMP设备抛光头掉片检测方法。One or more programs, the one or more programs being stored in the memory, when executed by the one or more processors, performing the CMP apparatus polishing head of any of claims 1-4 Drop detection method.
  10. 一种非易失性计算机存储介质，其特征在于，所述计算机存储介质存储有一个或者多个程序，当所述一个或者多个程序被一个设备执行时，使得所述设备执行如权利要求1-4任一项所述的CMP设备抛光头掉片检测方法。 A non-volatile computer storage medium, characterized in that the computer storage medium stores one or more programs, when the one or more programs are executed by a device, causing the device to perform as claimed in claim 1. The CMP apparatus polishing head off-chip detecting method according to any one of the preceding claims.
PCT/CN2017/097356 2016-09-27 2017-08-14 Cmp equipment polishing head wafer falling detection method and system WO2018059144A1 (en)

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CN201621085173.9U CN206105601U (en) 2016-09-27 2016-09-27 CMP equipment polishing head falls piece detecting system
CN201610854416.9A CN106425828A (en) 2016-09-27 2016-09-27 CMP equipment polishing head chip falling detection method and system
CN201621085173.9 2016-09-27
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