WO2018014596A1 - 一种散热器 - Google Patents

一种散热器 Download PDF

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Publication number
WO2018014596A1
WO2018014596A1 PCT/CN2017/079897 CN2017079897W WO2018014596A1 WO 2018014596 A1 WO2018014596 A1 WO 2018014596A1 CN 2017079897 W CN2017079897 W CN 2017079897W WO 2018014596 A1 WO2018014596 A1 WO 2018014596A1
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Prior art keywords
heat
heat sink
heat dissipation
medium
dissipation
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Ceased
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PCT/CN2017/079897
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English (en)
French (fr)
Inventor
张羽
王京
赵志刚
蒋世用
刘克勤
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Gree Electric Appliances Inc of Zhuhai
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Gree Electric Appliances Inc of Zhuhai
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Publication of WO2018014596A1 publication Critical patent/WO2018014596A1/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

Definitions

  • the invention relates to the technical field of heat sinking of heat sink parts, and more particularly to a heat sink.
  • heat sinks are widely used for heat dissipation from heat sink components.
  • the common radiators on the market are mostly embedded in the aluminum tube in the aluminum plate. When the radiator is installed on the radiator, it is in contact with the copper tube. There is a flowing heat medium in the copper tube. The heat is transferred to the copper tube and the copper tube. It is then transferred to the heat sink and the heat is taken away.
  • this type of heat sink can achieve the effect of heat dissipation, the processing of the heat sink is complicated.
  • the heat sink must first process a semi-circular groove, put a heat insulating medium in the groove, and then press the copper tube into the groove;
  • a first object of the present invention is to provide a heat sink to simplify the structure of the heat sink.
  • the present invention provides the following technical solutions:
  • a heat sink includes a heat dissipation plate, an inlet medium port, and an outlet medium port, wherein an end surface of the heat dissipation plate is provided with a mounting surface capable of mounting a component to be heat sink, and when the heat sink member is mounted on the mounting surface, The heat sink member and the heat dissipation plate form a closed heat dissipation channel, and the inlet medium port and the outlet medium port communicate with the heat dissipation channel.
  • a sealing ring is further included, and the sealing ring is disposed on the mounting surface.
  • the heat dissipation passage is rectangular or circular.
  • the heat dissipation channel is a blind hole.
  • the opposite end faces of the heat dissipation plate are provided with mounting faces capable of mounting the components to be heatsink, and the blind holes are provided on each end face of the heat dissipation plate.
  • the blind holes on the two end faces each have a set of the inlet medium outlet and the outlet medium outlet, or the blind holes located at the two end faces correspond to a group of the inlets.
  • Media outlet and the outlet port are preferably, in the above heat sink.
  • the heat dissipation passages located at the two end faces are through holes.
  • the heat dissipation plate is an aluminum plate or a copper plate.
  • the heat sink in the present invention can directly mount the heat sink to be mounted on the mounting surface of the heat sink, so that the heat sink and the heat sink member form a closed heat dissipation channel, and the heat is dissipated through the medium inlet.
  • the medium is introduced into the heat dissipation channel, and the heat dissipation channel is discharged through the outlet port. Since the heat sink in the embodiment of the invention is used, the heat sink member directly contacts the heat dissipation medium in the heat dissipation channel, and the heat is directly transmitted to the heat dissipation medium.
  • the heat conduction process is reduced to accelerate heat dissipation, and therefore, the heat dissipation efficiency of the heat sink can be improved, and, in the heat sink of the present invention, only heat dissipation is required during processing.
  • the channel, the inlet port and the outlet port significantly simplify the structure of the radiator and reduce the processing difficulty compared with the prior art.
  • FIG. 1 is a schematic perspective structural view of a heat sink according to Embodiment 1 of the present invention.
  • FIG. 2 is a schematic view showing an exploded structure of a heat sink mounted with a heat sink member according to Embodiment 1 of the present invention
  • FIG. 3 is a schematic view showing an exploded structure of a heat sink to which a heat sink member is to be mounted according to a second embodiment of the present invention
  • FIG. 4 is a cross-sectional structural view of a heat sink mounted with a heat sink according to a second embodiment of the present invention.
  • 100 is a heat sink
  • 101 is a heat dissipation channel
  • 102 is a media inlet port
  • 103 is a media outlet port
  • 104 is a mounting surface
  • 200 is a sealing ring
  • 300 is a joint
  • 400 is a heat sink member.
  • the core of the present invention is to provide a heat sink to simplify the structure of the heat sink.
  • FIG. 1 is a schematic perspective view of a heat sink according to a first embodiment of the present invention.
  • FIG. 2 is a schematic view showing an exploded structure of a heat sink mounted with a heat sink according to an embodiment of the present invention.
  • the heat sink provided by the embodiment of the present invention includes a heat dissipation plate 100, an inlet medium port 102, and an outlet medium port 103.
  • the end surface of the heat dissipation plate 100 is provided with a mounting surface 104 capable of mounting the heat sink member 400, when the heat sink member 400 is mounted on When the surface 104 is mounted, the heat sink member 400 and the heat dissipation plate 100 form a closed heat dissipation channel 101, and the inlet medium port 102 and the outlet medium port 103 communicate with the heat dissipation channel 101.
  • the heat sink member 400 can be directly mounted on the mounting surface 104 of the heat dissipation plate 100 by using the heat sink of the present invention, so that the heat dissipation plate 100 and the heat sink member 400 form a closed heat dissipation channel 101, and the heat dissipation medium is passed through the medium port 102.
  • the heat dissipation channel 101 is inserted into the heat dissipation channel 101, and the heat dissipation channel 101 is discharged through the outlet port 103.
  • the heat sink member 400 directly contacts the heat dissipation medium in the heat dissipation channel 101 by using the heat sink in the embodiment of the present invention, and directly transfers heat to the heat dissipation channel 101.
  • the heat dissipating medium reduces the heat conduction process to accelerate heat dissipation, and therefore, the heat dissipation efficiency of the heat sink can be improved. Moreover, by using the heat sink of the present invention, only the heat dissipation channel 101, the inlet medium port 102, and the outlet medium port 103 are processed during processing. Compared with the technology, the structure of the heat sink is obviously simplified, and the processing difficulty of the heat sink is reduced.
  • the inlet medium port 102 and the outlet medium port 103 may be directly connected to the inlet medium tube and the discharge medium tube of the medium cooling system.
  • the heat sink further includes a joint 300, and the inlet medium port 102 and the outlet medium port 103 are each provided with a joint 300.
  • the joint 300 does not require additional processing for the molded part, and only the threaded hole for mounting the joint 300 needs to be processed at the inlet medium port 102 and the outlet medium port 103, wherein the sealing effect of the inlet medium port 102 and the joint 300 is improved, and
  • the sealing effect of the medium port 103 and the joint 300 is that the threaded holes processed by the inlet port 102 and the outlet port 103 are sealed threaded holes.
  • the heat sink member 400 can be directly adhered to the mounting surface 104.
  • the adhesive is an adhesive having an anti-media effect in order to ensure the sealing effect of the heat sink member 400 and the mounting surface 104 during the mounting process.
  • the heat sink member 400 is mounted on the mounting surface 104 by screws.
  • the mounting surface 104 is further provided with a mounting hole for mounting the heat sink member 400, and the screw cooperates with the mounting hole.
  • the sealing surface 200 is further disposed on the mounting surface 104.
  • the sealing ring 200 is closely deformed to fit the mounting surface 104 and the heat sink member 400.
  • the mounting surface 104 is further provided with a mounting groove, and the sealing ring 200 is disposed in the mounting groove.
  • the structure of the heat dissipation channel 101 may be rectangular, circular, elliptical or the like, and may also have some irregular shapes, wherein the shape of the heat dissipation channel 101 may be consistent with the shape of the mounting surface 104, that is, when the mounting surface When the 104 is a rectangular structure, the heat dissipation channel 101 is also a rectangular structure.
  • the mounting surface 104 has a circular structure
  • the heat dissipation channel 101 is also a circular structure, so that the arrangement can simplify the processing;
  • the shape of the heat dissipation passage 101 and the mounting surface 104 may also be different. While the shape of the mounting surface 104 matches the structure of the heat sink member 400, different mounting surfaces 104 may be employed for different heat sink members 400.
  • the heat dissipation channel 101 is a blind hole, and the number of the heat dissipation channels 101 on the heat dissipation plate 100 may be one or more.
  • each of the plurality of heat dissipation channels 101 has a corresponding one.
  • the medium inlet port 102 and the outlet medium port 103 are integrated, or the plurality of heat dissipation channels 101 correspond to a plurality of inlet media ports 102 and outlet media ports 103.
  • the inlet medium port 102 and the outlet medium port 103 corresponding to each heat dissipation channel 101 are oppositely disposed, and the arrangement can significantly improve the heat dissipation efficiency.
  • one end surface of the heat dissipation plate 100 is provided with a mounting surface 104 for mounting the heat sink member 400, wherein the end surface is provided with one or more mounting surfaces 104 for mounting the heat sink member 400, and There is a heat dissipation channel 101 corresponding to each mounting surface 104.
  • the heat dissipation channel 101 is a blind hole.
  • a mounting surface 104 for mounting the heat sink member 400 is disposed on two opposite end faces of the heat dissipation plate 100. Referring to FIG. 3 to FIG. 4, each end surface of the heat dissipation plate 100 is provided with a blind hole at two end faces.
  • the upper blind holes respectively have a set of the inlet medium port 102 and the outlet medium port 103; or the blind holes on the two end faces correspond to a set of the inlet medium port 102 and the outlet medium port 103.
  • the blind holes on the two end faces are connected to each other or independently of each other.
  • the heat dissipation channels 101 at the two end faces are through holes.
  • Each of the end faces is provided with a mounting surface 104, and mounting surfaces 104 on the two end faces are oppositely disposed, and each mounting surface 104 can be mounted with a heat sink member 400.
  • each of the end faces is provided with a plurality of mounting faces 104, and the mounting faces 104 on the two end faces are oppositely disposed.
  • Each of the mounting faces 104 can be mounted with a heat sink member 400.
  • the heat dissipation plate 100 is an aluminum plate or a copper plate.
  • the material used in the heat sink is relatively simple, which is convenient for processing and installation.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热器，包括散热板(100)、进介质口(102)和出介质口(103)，其中，所述散热板(100)的端面设置有能够安装待散热器件(400)的安装面(104)，当所述待散热器件(400)安装在所述安装面(104)时，所述待散热器件(400)与所述散热板(100)形成封闭的散热通道(101)，所述进介质口(102)和所述出介质口(103)与所述散热通道(101)相连通。由于采用该散热器，待散热器件(400)直接与散热通道(101)内的散热介质接触，并将热量直接传递给散热介质，因此，能够提高散热器的散热效率，而且，该散热器，加工时只需加工散热通道(101)、进介质口(102)和出介质口(103)，明显简化了散热器的结构，降低了加工难度。

Description

一种散热器
本申请要求于2016年07月22日提交中国专利局、申请号为201610584526.8、发明名称为“一种散热器”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及待散热器件散热技术领域，更具体地说，涉及一种散热器。
背景技术
在电子行业中，散热器广泛运用于待散热器件的散热。市场上常见的散热器多为铝板中嵌入铜管结构，待散热器件安装在散热器上，与铜管接触，铜管内有流动的散热介质，待散热器件将热量传给铜管，铜管再传递给散热介质，热量被带走。但是此种类的散热器虽能达到散热的效果，但是，散热器的加工较为复杂，散热器先要加工出半圆槽，在槽内放入隔热介质，再将铜管压入到槽内；
因此，如何简化散热器的结构，成为本领域技术人员亟待解决的技术问题。
发明内容
有鉴于此，本发明的第一个目的在于提供一种散热器，以简化散热器的结构。
为实现上述目的，本发明提供如下技术方案：
一种散热器，包括散热板、进介质口和出介质口，其中，所述散热板的端面设置有能够安装待散热器件的安装面，当所述待散热器件安装在所述安装面时，所述待散热器件与所述散热板形成封闭的散热通道，所述进介质口和所述出介质口与所述散热通道相连通。
优选地，在上述散热器中，还包括密封圈，所述密封圈设置在所述安装面。
优选地，在上述散热器中，所述散热通道为矩形或圆形。
优选地，在上述散热器中，所述散热通道为盲孔。
优选地，在上述散热器中，所述散热板相对的两个端面均设置有能够安装待散热器件的安装面，所述散热板每个端面均设置有所述盲孔。
优选地，在上述散热器中，位于两个端面的所述盲孔各自对应有一组所述进介质出口和所述出介质口，或者位于两个端面的所述盲孔对应一组所述进介质出口和所述出介质口。
优选地，在上述散热器中，位于两个端面的所述散热通道为通孔。
优选地，在上述散热器中，所述散热板为铝板或铜板。
从上述的技术方案可以看出，采用本发明中的散热器可以将待散热器件直接安装在散热板的安装面上，使得散热板与待散热器件形成封闭的散热通道，通过进介质口将散热介质通入至散热通道中，并通过出介质口排出散热通道，由于采用本发明实施例中的散热器，待散热器件直接与散热通道内的散热介质接触，并将热量直接传递给散热介质，减少热传导过程加快散热，因此，能够提高散热器的散热效率，而且，采用本发明中的散热器，加工时只需加工散热 通道、进介质口和出介质口，与现有技术相比明显简化了散热器的结构，降低了加工难度。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例一所提供的散热器的立体结构示意图；
图2为本发明实施例一所提供的散热器安装有待散热器件的爆炸结构示意图；
图3为本发明实施例二所提供的散热器安装有待散热器件的爆炸结构示意图；
图4为本发明实施例二所提供的散热器安装有待散热器件剖视结构示意图。
其中，100为散热板、101为散热通道、102为进介质口、103为出介质口、104为安装面、200为密封圈、300为接头、400为待散热器件。
具体实施方式
本发明的核心在于提供一种散热器，以简化散热器的结构。
以下，参照附图对实施例进行说明。此外，下面所示的实施例不对权利要求所记载的发明内容起任何限定作用。另外，下面实施例所表示的构成的全部内容不限于作为权利要求所记载的发明的解决方案所必需的。
请参阅图1至图2，图1为本发明实施例一所提供的散热器的立体结构示意图；图2为本发明实施例一所提供的散热器安装有待散热器件的爆炸结构示意图。
本发明实施例提供的散热器包括散热板100、进介质口102和出介质口103，其中，散热板100的端面设置有能够安装待散热器件400的安装面104，当待散热器件400安装在安装面104时，待散热器件400与散热板100形成封闭的散热通道101，进介质口102和出介质口103与散热通道101相连通。
采用本发明中的散热器可以将待散热器件400直接安装在散热板100的安装面104上，使得散热板100与待散热器件400形成封闭的散热通道101，通过进介质口102将散热介质通入至散热通道101中，并通过出介质口103排出散热通道101，由于采用本发明实施例中的散热器，待散热器件400直接与散热通道101内的散热介质接触，并将热量直接传递给散热介质，减少热传导过程加快散热，因此，能够提高散热器的散热效率，而且，采用本发明中的散热器，加工时只需加工散热通道101、进介质口102和出介质口103，与现有技术相比明显简化了散热器的结构，降低了散热器的加工难度。
本发明实施例中，进介质口102和出介质口103可以直接与介质冷系统的进介质管和排介质管连接。
为了进一步简化散热器的加工难度，该散热器还包括接头300，进介质口102和出介质口103均设置有接头300。接头300为成型部件不需要额外加工，只需要在进介质口102和出介质口103处加工用于安装接头300的螺纹孔，其中，为了提高进介质口102与接头300的密封效果，以及出介质口103与接头300的密封效果，进介质口102和出介质口103所加工的螺纹孔为密封螺纹孔。
待散热器件400可以直接粘在安装面104上，其中，为了保证其安装过程中待散热器件400与安装面104的密封效果，该粘结剂采用具有防介质效果的粘结剂。或者待散热器件400通过螺钉安装在安装面104上，此时，安装面104上还设置有用于安装待散热器件400的安装孔，螺钉与安装孔相配合。
为了保证密封效果，安装面104上还设置有密封圈200，待散热器件400安装在安装面104上时，密封圈200发生形变紧密的与安装面104和待散热器件400相贴合。
为了防止待散热器件400安装过程中密封圈200错位影响密封效果，安装面104上还设置有安装槽，密封圈200设置在安装槽内。
上述散热通道101的结构可以为矩形、圆形、椭圆形等一些规律形状，还可以为一些不规律的形状，其中散热通道101的形状可以与安装面104的形状相一致，即，当安装面104为矩形结构时，散热通道101也为矩形结构，当安装面104为圆形结构时，散热通道101也为圆形结构，如此设置能够简化加工；当然 散热通道101与安装面104的形状也可以不一致。而安装面104的形状与待散热器件400的结构相匹配，针对不同的待散热器件400，可以采用不同形状的安装面104。
在本发明实施例中，散热通道101为盲孔，散热板100上设置散热通道101的数量可以为一个也可以为多个，当为多个散热通道101时，多个散热通道101各自对应有一组进介质口102和出介质口103，或者多个散热通道101对应有一组进介质口102和出介质口103。
当为多个时，可以单排布置，也可双排布置。优选的采用单排布置，且每个散热通道101对应的进介质口102和出介质口103相对设置，如此设置能够显著提高散热效率。
上个各技术方案中，散热板100的一个端面上设置有用于安装待散热器件400的安装面104，其中，该端面上设置有一个或多个安装面104用以安装待散热器件400，且每个安装面104上均对应有一个散热通道101。
在本发明另一实施例中，散热通道101为盲孔。散热板100上两个相对的端面上均设置有用于安装待散热器件400的安装面104，请参照图3至图4，其中，散热板100每个端面均设置有盲孔，位于两个端面上的盲孔各自对应有一组进介质口102和出介质口103；或者位于两个端面上的盲孔对应有一组进介质口102和出介质口103。
位于两个端面的盲孔相互连通或者相互独立。
或者，位于两个端面的散热通道101为通孔。
每个端面设置有一个安装面104，位于两个端面上的安装面104相对布置，每个安装面104上能够安装有一个待散热器件400。或者，每个端面设置有多个个安装面104，位于两个端面上的安装面104相对布置，每个安装面104上能够安装有一个待散热器件400，其他结构可以参照上述各技术方案。
为了进一步优化散热效率，散热板100为铝板或铜板。本发明实施例中散热器所采用的材质比较单一，便于加工和安装。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此，本发明将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims (8)

  1. 一种散热器，其特征在于，包括散热板(100)、进介质口(102)和出介质口(103)，其中，所述散热板(100)的端面设置有能够安装待散热器件(400)的安装面(104)，当所述待散热器件(400)安装在所述安装面(104)时，所述待散热器件(400)与所述散热板(100)之间形成封闭的散热通道(101)，所述进介质口(102)和所述出介质口(103)与所述散热通道(101)相连通。
  2. 如权利要求1所述的散热器，其特征在于，还包括密封圈(200)，所述密封圈设置在所述安装面(104)。
  3. 如权利要求1所述的散热器，其特征在于，所述散热通道(101)为矩形或圆形。
  4. 如权利要求1所述的散热器，其特征在于，所述散热通道(101)为盲孔。
  5. 如权利要求4所述的散热器，其特征在于，所述散热板(100)相对的两个端面均设置有能够安装待散热器件(400)的安装面(104)，所述散热板(100)每个端面均设置有所述盲孔。
  6. 如权利要求5所述的散热器，其特征在于，位于两个端面的所述盲孔各自对应有一组所述进介质出口(102)和所述出介质口(103)，或者位于两个端面的所述盲孔对应一组所述进介质出口(102)和所述出介质口(103)。
  7. 如权利要求1所述的散热器，其特征在于，所述散热通道(101)为通孔。
  8. 如权利要求1所述的散热器，其特征在于，所述散热板(100)为铝板或铜板。
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