WO2018010465A1 - Active-matrix organic light-emitting diode display screen and packaging method thereof, and terminal device - Google Patents

Active-matrix organic light-emitting diode display screen and packaging method thereof, and terminal device Download PDF

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WO2018010465A1
WO2018010465A1 PCT/CN2017/080878 CN2017080878W WO2018010465A1 WO 2018010465 A1 WO2018010465 A1 WO 2018010465A1 CN 2017080878 W CN2017080878 W CN 2017080878W WO 2018010465 A1 WO2018010465 A1 WO 2018010465A1
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package
metal
array substrate
substrate
metal plate
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欧阳世宏
刘康仲
郭伟
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华为技术有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8721Metallic sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8723Vertical spacers, e.g. arranged between the sealing arrangement and the OLED

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  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

Provided are an active-matrix organic light-emitting diode (AMOLED) display screen and a packaging method thereof, and a terminal device. The display screen comprises: an array substrate (10); a package substrate (20); and metal plates (60). The metal plates are located between the array substrate and the package substrate. At least one metal atom located at a first surface of the metal plate and at least one atom located at a packaging region (B) of the package substrate are bonded with the same ligand. Alternatively, the least one metal atom located at the first surface of the metal plate and at least one atom located at a packaging region (A) of the array substrate are bonded with the same ligand. The AMOLED display screen uses the metal plates positioned in the packaging regions to seal an organic light-emitting material therein, such that the organic light-emitting material is insulated from water vapor and oxygen in the ambient environment, thereby ensuring long-term reliable operation of the AMOLED display screen.

Description

有源矩阵有机发光二极体显示屏、其封装方法及终端设备Active matrix organic light emitting diode display screen, packaging method thereof and terminal device
本申请要求于2016年07月14日提交中国专利局、申请号为201610554221.2、发明名称为“有源矩阵有机发光二极体显示屏、其封装方法及终端设备”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims priority to Chinese Patent Application No. 201610554221.2, entitled "Active Matrix Organic Light Emitting Diode Display, Encapsulation Method and Terminal Equipment", filed on July 14, 2016, The entire contents of this application are incorporated herein by reference.
技术领域Technical field
本申请涉及显示屏封装技术领域,尤其涉及一种有源矩阵有机发光二极体显示屏及其封装方法,以及一种包括该有源矩阵有机发光二极体显示屏的终端设备。The present application relates to the field of display panel packaging technologies, and in particular, to an active matrix organic light emitting diode display screen and a packaging method thereof, and a terminal device including the active matrix organic light emitting diode display screen.
背景技术Background technique
有机电致发光器件是一种继无机半导体发光二极管之后的一种新型光源。An organic electroluminescent device is a novel light source following an inorganic semiconductor light emitting diode.
由于有机材料的环境稳定性相较于无机材料较差,使得有源矩阵有机发光二极体(Active-matrix organic light emitting diode,简称AMOLED)器件中使用的有机光电材料对周围环境中的水汽和氧气十分敏感,即使接触到极少量(10-6g/m2/day)的水汽或氧气时,也会导致AMOLED器件的性能发生衰退,影响AMOLED器件的发光性能。因此,为保证AMOLED器件的长期可靠工作,在AMOLED器件封装过程中,需要对其进行严密的封装,以便将AMOLED器件中的有机光电材料与周围环境中的水汽和氧气隔离。Since the environmental stability of the organic material is inferior to that of the inorganic material, the organic photoelectric material used in the active-matrix organic light emitting diode (AMOLED) device is suitable for the water vapor in the surrounding environment. Oxygen is very sensitive, even when exposed to a very small amount (10 -6 g / m 2 /day) of water vapor or oxygen, it will cause the performance of AMOLED devices to degrade, affecting the luminescence properties of AMOLED devices. Therefore, in order to ensure long-term reliable operation of the AMOLED device, it is required to be tightly packaged in the AMOLED device packaging process in order to isolate the organic photoelectric material in the AMOLED device from moisture and oxygen in the surrounding environment.
发明内容Summary of the invention
为解决上述技术问题,本申请提供了一种AMOLED显示屏及其封装方法,以及一种包括该AMOLED显示屏的终端设备,以对所述AMOLED显示屏中的有机发光材料进行密封,使其与周围环境中的水汽和氧气隔离,保证AMOLED显示屏的长期可靠工作。To solve the above technical problem, the present application provides an AMOLED display screen and a packaging method thereof, and a terminal device including the AMOLED display screen to seal the organic light emitting material in the AMOLED display screen to The water vapor and oxygen in the surrounding environment are isolated to ensure long-term reliable operation of the AMOLED display.
为解决上述问题,本申请提供了如下技术方案:To solve the above problem, the present application provides the following technical solutions:
第一方面,本申请提供了一种AMOLED显示屏的封装方法,该封装方法包括:In a first aspect, the present application provides a method for packaging an AMOLED display panel, the package method comprising:
分别在位于阵列基板第一表面的封装区域和位于封装基板第一表面的封装区域涂覆金属盐溶液,所述金属盐溶液包括溶剂、金属盐、配位剂和还原剂,所述阵列基板的第一表面与所述封装基板的第一表面相对;Coating a metal salt solution on the package region on the first surface of the array substrate and the package region on the first surface of the package substrate, the metal salt solution including a solvent, a metal salt, a complexing agent and a reducing agent, and the array substrate The first surface is opposite to the first surface of the package substrate;
对涂覆有所述金属盐溶液的所述阵列基板的封装区域进行加热处理,以使所述阵列基板的封装区域被金属纳米颗粒覆盖,以及,对涂覆有所述金属盐溶液的所述封装基板的封装区域进行加热处理,以使所述封装基板的封装区域被金属纳米颗粒覆盖;Heating a package region of the array substrate coated with the metal salt solution such that a package region of the array substrate is covered with metal nanoparticles, and, for the coating of the metal salt solution The package region of the package substrate is subjected to heat treatment such that the package region of the package substrate is covered by the metal nanoparticles;
将所述阵列基板表面的金属纳米颗粒和封装基板表面的金属纳米颗粒压接,形成包括所述阵列基板、所述封装基板以及位于所述阵列基板和所述封装基板之间的金属纳米颗粒层的三明治结构,所述封装基板的封装区域在所述阵列基板的第一表面的投影与所述阵列基板的封装区域相重合;Metal nanoparticles on the surface of the array substrate and metal nanoparticles on the surface of the package substrate are crimped to form a metal nanoparticle layer including the array substrate, the package substrate, and the array substrate and the package substrate a sandwich structure, a projection of the package region of the package substrate on a first surface of the array substrate coincides with a package region of the array substrate;
对所述三明治结构加热,以使所述金属纳米颗粒层熔接形成一金属板,且位于所述金属板第一表面的至少一个金属原子与位于所述封装基板的封装区域的至少一个原子均与所 述配位剂中同一配体相键结,或者,位于所述金属板第一表面的至少一个金属原子与位于所述阵列基板的封装区域的至少一个原子均与所述配位剂中同一配体相键结,进而得到所述AMOLED显示屏;其中,所述金属板的第一表面与所述金属板的第二表面相对。Heating the sandwich structure to fuse the metal nanoparticle layer to form a metal plate, and at least one metal atom located on the first surface of the metal plate and at least one atom located in a package region of the package substrate Place The same ligand is bonded in the complexing agent, or at least one metal atom located on the first surface of the metal plate and at least one atom located in the package region of the array substrate are the same as the complexing agent. The body phase is bonded to obtain the AMOLED display panel; wherein the first surface of the metal plate is opposite to the second surface of the metal plate.
结合第一方面,在第一种可能的实现方式中,所述金属盐为金属的醋酸盐或癸酸盐。In combination with the first aspect, in a first possible implementation, the metal salt is a metal acetate or citrate.
具体的,所述金属包括金、银、铜或铝。Specifically, the metal includes gold, silver, copper or aluminum.
结合第一方面或第一方面第一种可能的实现方式,在第二种可能的实现方式中,所述溶剂为醇类物质。In combination with the first aspect or the first possible implementation of the first aspect, in a second possible implementation, the solvent is an alcohol.
具体的,所述醇类物质包括:酒精、丙醇或丁醇。Specifically, the alcohol substance includes: alcohol, propanol or butanol.
结合第一方面或第一方面上述任一种可能的实现方式,在第三种可能的实现方式中,所述还原剂为多元醇类化合物或胺类化合物。In combination with the first aspect or the first possible implementation of the first aspect, in a third possible implementation, the reducing agent is a polyol compound or an amine compound.
具体的,所述还原剂包括:一乙醇胺、二乙醇胺或三乙醇胺。Specifically, the reducing agent comprises: monoethanolamine, diethanolamine or triethanolamine.
结合第一方面或第一方面上述任一种可能的实现方式,在第四种可能的实现方式中,所述配位剂为胺类或脂肪酸。In combination with the first aspect or any one of the above possible implementations of the first aspect, in a fourth possible implementation, the complexing agent is an amine or a fatty acid.
结合第一方面或第一方面上述任一种可能的实现方式,在第五种可能的实现方式中,所述金属盐溶液还包稳定剂。In combination with the first aspect or the first possible implementation of the first aspect, in the fifth possible implementation, the metal salt solution further comprises a stabilizer.
具体的,所述稳定剂为油酸。Specifically, the stabilizer is oleic acid.
结合第一方面或第一方面上述任一种可能的实现方式,在第六种可能的实现方式中,所述金属盐溶液的制作方法包括:With reference to the first aspect, or any one of the foregoing possible implementation manners of the first aspect, in a sixth possible implementation, the method for manufacturing the metal salt solution comprises:
将溶剂、金属盐、还原剂和配位剂按照预设质量比混合,形成透明、澄清的金属盐溶液。The solvent, metal salt, reducing agent, and complexing agent are mixed at a predetermined mass ratio to form a clear, clear metal salt solution.
具体的,所述将溶剂、金属盐、还原剂和配位剂按照预设质量比混合,形成透明、澄清的金属盐溶液包括:Specifically, the solvent, the metal salt, the reducing agent and the complexing agent are mixed according to a preset mass ratio to form a transparent, clear metal salt solution comprising:
将醋酸银、二乙醇胺和正丁醇按照预设质量比混合,形成透明、澄清的金属盐溶液。Silver acetate, diethanolamine and n-butanol are mixed in a predetermined mass ratio to form a clear, clear metal salt solution.
可选的,所述预设质量比为(0.8-1.5):(1.5-2):(5-10)。Optionally, the preset mass ratio is (0.8-1.5): (1.5-2): (5-10).
结合第一方面第六种可能的实现方式,在第七种可能的实现方式中,所述金属盐溶液的制作方法还包括:向所述透明澄清溶液中加入稳定剂。In conjunction with the sixth possible implementation of the first aspect, in a seventh possible implementation, the method for fabricating the metal salt solution further comprises: adding a stabilizer to the transparent clear solution.
具体的,所述稳定剂为油酸。Specifically, the stabilizer is oleic acid.
可选的,所述醋酸银、所述二乙醇胺、所述正丁醇和所述油酸的质量比为:(0.8-1.5):(1.5-2):(5-10):(0.05-0.2)。Optionally, the mass ratio of the silver acetate, the diethanolamine, the n-butanol, and the oleic acid is: (0.8-1.5): (1.5-2): (5-10): (0.05-0.2 ).
第二方面,本申请提供了一种AMOLED显示屏,包括:In a second aspect, the present application provides an AMOLED display panel, including:
阵列基板、封装基板和金属板,所述金属板位于所述阵列基板与所述封装基板之间;An array substrate, a package substrate, and a metal plate, the metal plate being located between the array substrate and the package substrate;
所述封装基板的第一表面与所述阵列基板的第一表面相对,所述封装基板的第一表面与所述阵列基板的第一表面均包括封装区域,且所述封装基板的封装区域在所述阵列基板的第一表面的投影与所述阵列基板的封装区域相重合;The first surface of the package substrate is opposite to the first surface of the array substrate, the first surface of the package substrate and the first surface of the array substrate both include a package area, and the package area of the package substrate is a projection of the first surface of the array substrate coincides with a package area of the array substrate;
位于所述金属板第一表面的至少一个金属原子与位于所述封装基板的封装区域的至少一个原子均与同一配体相键结,或者,位于所述金属板第一表面的至少一个金属原子与位于所述阵列基板的封装区域的至少一个原子均与同一配体相键结,所述金属板的第一表面 与所述金属板的第二表面相对。At least one metal atom located on the first surface of the metal plate and at least one atom located in the package region of the package substrate are bonded to the same ligand, or at least one metal atom located on the first surface of the metal plate Bonding to at least one atom of the package region of the array substrate with the same ligand, the first surface of the metal plate Opposite the second surface of the metal plate.
结合第二方面,在第一种可能的实现方式中,所述配体包括具有空余电子对的氮原子或硫原子。In conjunction with the second aspect, in a first possible implementation, the ligand comprises a nitrogen atom or a sulfur atom having a free electron pair.
结合第二方面或第二方面第一种可能的实现方式,在第二种可能的实现方式中,所述金属板内孔隙的孔径小于或等于10nm。In combination with the second aspect or the first possible implementation of the second aspect, in a second possible implementation, the pore size of the pores in the metal plate is less than or equal to 10 nm.
结合第二方面或第二方面上述任一种可能的实现方式,在第三种可能的实现方式中,所述阵列基板的第一表面还包括放置有机电致发光器件的区域,所述阵列基板的封装区域包围着所述放置有机电致发光器件的区域,且所述阵列基板的封装区域的内边缘与所述放置有机电致发光器件的区域的外边缘之间的间距大于或等于0.1mm且小于或等于0.3mm。With reference to the second aspect or the foregoing possible implementation manner of the second aspect, in a third possible implementation, the first surface of the array substrate further includes a region where the organic electroluminescent device is placed, the array substrate a package region surrounding the region where the organic electroluminescent device is placed, and a distance between an inner edge of the package region of the array substrate and an outer edge of the region where the organic electroluminescent device is placed is greater than or equal to 0.1 mm And less than or equal to 0.3mm.
结合第二方面或第二方面上述任一种可能的实现方式,在第四种可能的实现方式中,所述金属板的厚度大于或等于1μm且小于或等于10μm。In combination with the second aspect or the second possible implementation of the second aspect, in a fourth possible implementation, the thickness of the metal plate is greater than or equal to 1 μm and less than or equal to 10 μm.
结合第二方面或第二方面上述任一种可能的实现方式,在第五种可能的实现方式中,所述金属板内包括:金原子、银原子、铜原子或铝原子。With reference to the second aspect or the second aspect, the fifth possible implementation manner, in the fifth possible implementation, the metal plate comprises: a gold atom, a silver atom, a copper atom or an aluminum atom.
第三方面,本申请提供了一种终端设备,包括:上述任一可能的实现方式中提供的显示屏和电源,所述电源用于向所述显示屏内的有机电致发光器件提供电源信号,用于使所述有机电致发光器件产生可见光以形成图像。In a third aspect, the present application provides a terminal device, including: a display screen and a power supply provided in any of the above possible implementation manners, wherein the power supply is used to provide a power signal to an organic electroluminescent device in the display screen. And for causing the organic electroluminescent device to generate visible light to form an image.
与现有技术相比,上述技术方案具有以下优点:Compared with the prior art, the above technical solution has the following advantages:
本申请所提供的AMOLED显示屏及其封装方法中,所述封装基板的第一表面与所述阵列基板的第一表面相对,所述封装基板的第一表面与所述阵列基板的第一表面均包括封装区域,且所述封装基板的封装区域在所述阵列基板的第一表面的投影与所述阵列基板的封装区域相重合;位于所述金属板第一表面的至少一个金属原子与位于所述封装基板的封装区域的至少一个原子均与同一配体相键结,或者,位于所述金属板第一表面的至少一个金属原子与位于所述阵列基板的封装区域的至少一个原子均与同一配体相键结,所述金属板的第一表面与所述金属板的第二表面相对。由此可见,利用本申请所提供的封装方法封装的AMOLED显示屏,可以利用位于所述封装区域的金属板对所述AMOLED显示屏中的有机发光材料进行密封,使其与周围环境中的水汽和氧气隔离,保证AMOLED显示屏的长期可靠工作。In the AMOLED display screen and the packaging method thereof, the first surface of the package substrate is opposite to the first surface of the array substrate, and the first surface of the package substrate and the first surface of the array substrate Each includes a package area, and a projection of the package area of the package substrate on a first surface of the array substrate coincides with a package area of the array substrate; at least one metal atom located at a first surface of the metal board At least one atom of the package region of the package substrate is bonded to the same ligand, or at least one metal atom located on the first surface of the metal plate and at least one atom located in the package region of the array substrate The same ligand phase is bonded, and the first surface of the metal plate is opposite to the second surface of the metal plate. It can be seen that the AMOLED display panel encapsulated by the encapsulation method provided by the present application can seal the organic luminescent material in the AMOLED display panel with the metal plate located in the package area to make it and the surrounding water vapor. It is isolated from oxygen to ensure long-term reliable operation of the AMOLED display.
附图说明DRAWINGS
为了更清楚地说明本申请实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings to be used in the embodiments or the prior art description will be briefly described below. Obviously, the drawings in the following description are only It is a certain embodiment of the present application, and other drawings can be obtained according to the drawings without any creative work for those skilled in the art.
图1为本申请一个实施例所提供的AMOLED显示屏封装方法的流程图;FIG. 1 is a flowchart of a method for packaging an AMOLED display screen according to an embodiment of the present application;
图2-图5为本申请一个实施例所提供的AMOLED显示屏封装方法中部分结构示意图;FIG. 2 is a partial schematic structural diagram of an AMOLED display panel packaging method according to an embodiment of the present application; FIG.
图6为本申请一个实施例所提供的AMOLED显示屏的结构示意图。 FIG. 6 is a schematic structural diagram of an AMOLED display screen according to an embodiment of the present application.
具体实施方式detailed description
正如背景技术部分所述,为保证AMOLED器件的长期可靠工作,在AMOLED器件封装过程中,需要对其进行严密的封装,以便将AMOLED器件中的有机光电材料与周围环境中的水汽、氧气隔离。As described in the background section, in order to ensure long-term reliable operation of the AMOLED device, it is required to be tightly packaged in the AMOLED device packaging process in order to isolate the organic photoelectric material in the AMOLED device from moisture and oxygen in the surrounding environment.
有鉴于此,本申请实施例提供了一种AMOLED显示屏的封装方法,该封装方法包括:In view of this, the embodiment of the present application provides a method for packaging an AMOLED display screen, and the packaging method includes:
分别在位于阵列基板第一表面的封装区域和位于封装基板第一表面的封装区域涂覆金属盐溶液,所述金属盐溶液包括溶剂、金属盐、配位剂和还原剂,所述阵列基板的第一表面与所述封装基板的第一表面相对;Coating a metal salt solution on the package region on the first surface of the array substrate and the package region on the first surface of the package substrate, the metal salt solution including a solvent, a metal salt, a complexing agent and a reducing agent, and the array substrate The first surface is opposite to the first surface of the package substrate;
对涂覆有所述金属盐溶液的所述阵列基板的封装区域进行加热处理,以使所述阵列基板的封装区域被金属纳米颗粒覆盖,以及,对涂覆有所述金属盐溶液的所述封装基板的封装区域进行加热处理,以使所述封装基板的封装区域被金属纳米颗粒覆盖;Heating a package region of the array substrate coated with the metal salt solution such that a package region of the array substrate is covered with metal nanoparticles, and, for the coating of the metal salt solution The package region of the package substrate is subjected to heat treatment such that the package region of the package substrate is covered by the metal nanoparticles;
将所述阵列基板表面的金属纳米颗粒和封装基板表面的金属纳米颗粒压接,形成包括所述阵列基板、所述封装基板以及位于所述阵列基板和所述封装基板之间的金属纳米颗粒层的三明治结构,所述封装基板的封装区域在所述阵列基板的第一表面的投影与所述阵列基板的封装区域相重合;Metal nanoparticles on the surface of the array substrate and metal nanoparticles on the surface of the package substrate are crimped to form a metal nanoparticle layer including the array substrate, the package substrate, and the array substrate and the package substrate a sandwich structure, a projection of the package region of the package substrate on a first surface of the array substrate coincides with a package region of the array substrate;
对所述三明治结构加热,以使所述金属纳米颗粒层熔接形成一金属板,且位于所述金属板第一表面的至少一个金属原子与位于所述封装基板的封装区域的至少一个原子均与所述配位剂中同一配体相键结,或者,位于所述金属板第一表面的至少一个金属原子与位于所述阵列基板的封装区域的至少一个原子均与所述配位剂中同一配体相键结,进而得到所述AMOLED显示屏;其中,所述金属板的第一表面与所述金属板的第二表面相对。Heating the sandwich structure to fuse the metal nanoparticle layer to form a metal plate, and at least one metal atom located on the first surface of the metal plate and at least one atom located in a package region of the package substrate The same ligand is bonded to the ligand, or at least one metal atom located on the first surface of the metal plate and at least one atom located in the package region of the array substrate are the same as the complexing agent The ligand phase is bonded to obtain the AMOLED display panel; wherein the first surface of the metal plate is opposite to the second surface of the metal plate.
相应的,本申请实施例还提供了一种AMOLED显示屏及包括该AMOLED显示屏的终端设备,所述AMOLED显示屏包括:Correspondingly, the embodiment of the present application further provides an AMOLED display screen and a terminal device including the AMOLED display screen, where the AMOLED display screen includes:
阵列基板、封装基板和金属板,所述金属板位于所述阵列基板与所述封装基板之间;An array substrate, a package substrate, and a metal plate, the metal plate being located between the array substrate and the package substrate;
所述封装基板的第一表面与所述阵列基板的第一表面相对,所述封装基板的第一表面与所述阵列基板的第一表面均包括封装区域,且所述封装基板的封装区域在所述阵列基板的第一表面的投影与所述阵列基板的封装区域相重合;The first surface of the package substrate is opposite to the first surface of the array substrate, the first surface of the package substrate and the first surface of the array substrate both include a package area, and the package area of the package substrate is a projection of the first surface of the array substrate coincides with a package area of the array substrate;
位于所述金属板第一表面的至少一个金属原子与位于所述封装基板的封装区域的至少一个原子均与同一配体相键结,或者,位于所述金属板第一表面的至少一个金属原子与位于所述阵列基板的封装区域的至少一个原子均与同一配体相键结,所述金属板的第一表面与所述金属板的第二表面相对。At least one metal atom located on the first surface of the metal plate and at least one atom located in the package region of the package substrate are bonded to the same ligand, or at least one metal atom located on the first surface of the metal plate At least one atom located in a package region of the array substrate is bonded to the same ligand, and a first surface of the metal plate is opposite to a second surface of the metal plate.
由上可知,本申请实施例所提供的AMOLED显示屏及其封装方法,可以利用位于所述封装区域的金属板对所述AMOLED显示屏中的有机发光材料进行密封,使其与周围环境中的水汽和氧气隔离,保证AMOLED器件的长期可靠工作。It can be seen that the AMOLED display panel and the packaging method thereof provided by the embodiments of the present invention can seal the organic luminescent material in the AMOLED display panel with a metal plate located in the package area to make it and the surrounding environment Water vapor and oxygen are isolated to ensure long-term reliable operation of AMOLED devices.
而且,本申请实施例所提供的AMOLED器件封装方法中,所述金属盐溶液中包含有配位剂,可以加大所述金属盐在所述溶剂中的溶解度,使得所述金属盐溶液中不存在固体颗粒,不会在重力作用下发生沉淀现象,从而均匀涂覆在所述阵列基板和所述封装基板表面的封装区域后可以长期保持稳定,进而使得后续形成的金属纳米颗粒均匀覆盖在所述阵 列基板和所述封装基板的封装区域。Moreover, in the AMOLED device packaging method provided by the embodiment of the present application, the metal salt solution contains a complexing agent, which can increase the solubility of the metal salt in the solvent, so that the metal salt solution does not There is a solid particle which does not precipitate under the action of gravity, so that it can be stably applied for a long time after being uniformly coated on the package substrate surface of the array substrate and the package substrate, thereby uniformly covering the subsequently formed metal nanoparticles. Narrative a column substrate and a package region of the package substrate.
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。在下面的描述中阐述了很多具体细节以便于充分理解本申请,但是本申请还可以采用其他不同于在此描述的其它方式来实施,本领域技术人员可以在不违背本申请内涵的情况下做类似推广,因此本申请不受下面公开的具体实施例的限制。The technical solutions in the embodiments of the present application will be clearly and completely described in the following with reference to the accompanying drawings in the embodiments. In the following description, numerous specific details are set forth in order to facilitate a full understanding of the application, but the invention may be practiced in other ways than those described herein, and those skilled in the art can do without departing from the scope of the application. The invention is not limited by the specific embodiments disclosed below.
本申请实施例提供了一种AMOLED显示屏的封装方法,如图1所示,该封装方法包括:The embodiment of the present application provides a method for packaging an AMOLED display screen. As shown in FIG. 1 , the packaging method includes:
S1:如图2所示,分别在位于阵列基板10第一表面的封装区域A和位于封装基板20第一表面的封装区域B涂覆金属盐溶液30,所述金属盐溶液30包括溶剂、金属盐、配位剂和还原剂,所述阵列基板10的第一表面与所述封装基板20的第一表面相对。S1: as shown in FIG. 2, a metal salt solution 30 is coated on the package area A on the first surface of the array substrate 10 and the package area B on the first surface of the package substrate 20, respectively. The metal salt solution 30 includes a solvent and a metal. A first surface of the array substrate 10 is opposite to a first surface of the package substrate 20, a salt, a complexing agent, and a reducing agent.
需要说明的是,在本申请实施例中,所述阵列基板10的第一表面还包括放置有机电致发光器件的区域C,所述阵列基板10的封装区域A包围着所述放置有机电致发光器件的区域C。可选的,所述阵列基板10的封装区域A的内边缘与所述放置有机电致发光器件的区域C的外边缘之间的间距d大于或等于0.1mm且小于或等于0.3mm。It should be noted that, in the embodiment of the present application, the first surface of the array substrate 10 further includes a region C in which the organic electroluminescent device is placed, and the package region A of the array substrate 10 surrounds the organic electro-electrode Region C of the light emitting device. Optionally, a distance d between an inner edge of the package area A of the array substrate 10 and an outer edge of the area C where the organic electroluminescent device is placed is greater than or equal to 0.1 mm and less than or equal to 0.3 mm.
在上述实施例的基础上,在本申请的一个实施例中,所述金属盐溶液30中的金属盐中包括有易被还原为金属原子的金属离子,从而可以在特定条件下被所述还原剂还原为金属原子。具体的,在本申请的一个实施例中,所述溶剂为醇类物质;所述金属盐为金属的醋酸盐或癸酸盐;所述还原剂为多元醇类化合物或胺类化合物。但本申请对此并不做限定,只要保证在特定条件下所述金属盐中的金属离子可以被所述金属盐溶液30中的还原剂还原为金属原子即可。On the basis of the above embodiments, in one embodiment of the present application, the metal salt in the metal salt solution 30 includes metal ions which are easily reduced to metal atoms, so that the metal salt can be reduced under specific conditions. The agent is reduced to a metal atom. Specifically, in one embodiment of the present application, the solvent is an alcohol; the metal salt is a metal acetate or citrate; and the reducing agent is a polyol compound or an amine compound. However, the present application does not limit this as long as it is ensured that the metal ions in the metal salt can be reduced to metal atoms by the reducing agent in the metal salt solution 30 under specific conditions.
可选的,在上述实施例中,所述醇类物质包括:酒精、丙醇或丁醇;所述金属包括:金、银、铜或铝;所述还原剂包括:一乙醇胺、二乙醇胺或三乙醇胺。Optionally, in the above embodiment, the alcohol substance comprises: alcohol, propanol or butanol; the metal comprises: gold, silver, copper or aluminum; and the reducing agent comprises: monoethanolamine, diethanolamine or Triethanolamine.
需要说明的是,当所述溶剂为有机溶剂时,所述金属盐在所述溶剂中的溶解度较小,为了增大所述金属盐在所述溶剂中的溶解度,以形成透明、澄清的金属盐溶液,在本申请实施例中,所述金属盐溶液中还包括有配位剂,以利用所述配位剂粘附在所述金属盐的表面,增加所述金属盐在所述溶剂中的溶解度。可选的,所述配位剂为有机配位剂。It should be noted that when the solvent is an organic solvent, the solubility of the metal salt in the solvent is small, in order to increase the solubility of the metal salt in the solvent to form a transparent, clear metal. a salt solution, in the embodiment of the present application, the metal salt solution further includes a complexing agent to adhere to the surface of the metal salt by using the complexing agent, and increasing the metal salt in the solvent Solubility. Optionally, the complexing agent is an organic complexing agent.
在上述实施例的基础上,在本申请的一个实施例中,所述金属盐溶液的制作方法包括:将溶剂、金属盐、还原剂和配位剂按照预设质量比混合,形成透明、澄清的金属盐溶液。具体的,所述将溶剂、金属盐、还原剂和配位剂按照预设质量比混合,形成透明、澄清的金属盐溶液包括:将醋酸银、二乙醇胺和正丁醇按照预设质量比混合,形成透明、澄清的金属盐溶液。需要说明的是,在本申请实施例中,所述二乙醇胺既作为还原剂又作为配位剂。On the basis of the above embodiments, in one embodiment of the present application, the method for preparing the metal salt solution comprises: mixing a solvent, a metal salt, a reducing agent and a complexing agent according to a preset mass ratio to form a transparent and clarified Metal salt solution. Specifically, the solvent, the metal salt, the reducing agent and the complexing agent are mixed according to a preset mass ratio, and the transparent, clear metal salt solution comprises: mixing silver acetate, diethanolamine and n-butanol according to a preset mass ratio. A clear, clear metal salt solution is formed. It should be noted that, in the examples of the present application, the diethanolamine serves as both a reducing agent and a complexing agent.
可选的,所述预设质量比为(0.8-1.5):(1.5-2):(5-10)。Optionally, the preset mass ratio is (0.8-1.5): (1.5-2): (5-10).
在上述实施例的基础上,在本申请的一个实施例中,所述金属盐溶液的制作方法还包括:向所述透明澄清溶液中加入稳定剂,以形成透明、澄清、稳定的金属盐溶液。Based on the above embodiment, in one embodiment of the present application, the method for preparing the metal salt solution further comprises: adding a stabilizer to the transparent clear solution to form a transparent, clear, stable metal salt solution. .
可选的,在上述实施例的基础上,在本申请的一个具体实施例中,所述稳定剂为油酸,所述醋酸银、所述二乙醇胺、所述正丁醇和所述油酸的质量比为:(0.8-1.5):(1.5-2):(5-10): (0.05-0.2)。但本申请对此并不做限定,具体视情况而定。Optionally, based on the above embodiment, in a specific embodiment of the present application, the stabilizer is oleic acid, the silver acetate, the diethanolamine, the n-butanol, and the oleic acid. The mass ratio is: (0.8-1.5): (1.5-2): (5-10): (0.05-0.2). However, this application does not limit this, as the case may be.
由于所述金属盐溶液中包含有配位剂,可以加大所述金属盐在所述溶剂中的溶解度,使得所述金属盐溶液中不存在固体颗粒,不会在重力作用下发生沉淀现象,从而均匀涂覆在所述阵列基板10和所述封装基板20表面后可以长期保持稳定,进而使得后续形成的金属纳米颗粒均匀覆盖在所述阵列基板10和所述封装基板20的封装区域。Since the metal salt solution contains a complexing agent, the solubility of the metal salt in the solvent can be increased, so that no solid particles are present in the metal salt solution, and precipitation does not occur under the action of gravity. Therefore, it can be stably stabilized for a long time after being uniformly coated on the surface of the array substrate 10 and the package substrate 20, so that the subsequently formed metal nanoparticles uniformly cover the package regions of the array substrate 10 and the package substrate 20.
S2:如图3所示,对涂覆有所述金属盐溶液30的所述阵列基板10的封装区域A进行加热处理,以使所述阵列基板10的封装区域A被金属纳米颗粒40覆盖,以及,对涂覆有所述金属盐溶液30的所述封装基板20的封装区域B进行加热处理,以使所述封装基板20的封装区域B被金属纳米颗粒40覆盖。S2: heat-treating the package region A of the array substrate 10 coated with the metal salt solution 30 so that the package region A of the array substrate 10 is covered by the metal nanoparticles 40, as shown in FIG. And, the package region B of the package substrate 20 coated with the metal salt solution 30 is subjected to heat treatment so that the package region B of the package substrate 20 is covered with the metal nanoparticles 40.
具体的,对涂覆有所述金属盐溶液30的所述阵列基板10的封装区域A进行加热处理,利用所述金属盐溶液30中的还原剂将所述金属盐中的金属离子还原成金属原子,在所述阵列基板10的封装区域A形成金属纳米颗粒。需要说明的是,随着加热的进行,所述金属盐中的金属离子逐渐会逐渐被还原成金属原子,并在所述阵列基板10第一表面的封装区域A逐渐生长,直至所述金属盐中的金属离子全部被还原,使得所述阵列基板10第一表面的封装区域A被金属纳米颗粒覆盖。Specifically, the package region A of the array substrate 10 coated with the metal salt solution 30 is subjected to heat treatment, and the metal ions in the metal salt are reduced to metal by using a reducing agent in the metal salt solution 30. Atom, metal nanoparticles are formed in the package region A of the array substrate 10. It should be noted that as the heating progresses, the metal ions in the metal salt are gradually reduced to metal atoms, and gradually grow in the package region A of the first surface of the array substrate 10 until the metal salt The metal ions in the metal ions are all reduced, so that the package region A of the first surface of the array substrate 10 is covered by the metal nanoparticles.
同理,对涂覆有所述金属盐溶液30的所述封装基板20的封装区域B进行加热处理时,也会利用所述金属盐溶液30中的还原剂将所述金属盐中的金属离子还原成金属原子,直至所述金属盐中的金属离子全部被还原,使得所述封装基板20第一表面的封装区域B被金属纳米颗粒40覆盖。Similarly, when the package region B of the package substrate 20 coated with the metal salt solution 30 is subjected to heat treatment, the metal ions in the metal salt are also utilized by the reducing agent in the metal salt solution 30. The metal atoms are reduced until the metal ions in the metal salt are all reduced, so that the package region B of the first surface of the package substrate 20 is covered by the metal nanoparticles 40.
S3:如图4所示,将所述阵列基板10第一表面的金属纳米颗粒40和封装基板20第一表面的金属纳米颗粒40压接,形成包括所述阵列基板10、所述封装基板20以及位于所述阵列基板10和所述封装基板20之间的金属纳米颗粒层50的三明治结构,所述封装基板20的封装区域B在所述阵列基板10的第一表面的投影与所述阵列基板10的封装区域A相重合。S3: as shown in FIG. 4, the metal nanoparticles 40 on the first surface of the array substrate 10 and the metal nanoparticles 40 on the first surface of the package substrate 20 are crimped to form the array substrate 10 and the package substrate 20 And a sandwich structure of the metal nanoparticle layer 50 between the array substrate 10 and the package substrate 20, a projection of the package region B of the package substrate 20 on the first surface of the array substrate 10 and the array The package areas A of the substrate 10 are coincident.
S4:如图5所示,对所述三明治结构加热,以使所述金属纳米颗粒层50熔接形成一金属板60,且位于所述金属板60第一表面的至少一个金属原子与位于所述封装基板20的封装区域的至少一个原子均与所述配位剂中同一配体相键结,或者,位于所述金属板60第一表面的至少一个金属原子与位于所述阵列基板10的封装区域的至少一个原子均与所述配位剂中同一配体相键结,进而得到所述AMOLED显示屏;其中,所述金属板的第一表面与所述金属板的第二表面相对。S4: heating the sandwich structure to heat the metal nanoparticle layer 50 to form a metal plate 60, and at least one metal atom located on the first surface of the metal plate 60 is located in the At least one atom of the package region of the package substrate 20 is bonded to the same ligand in the complexing agent, or at least one metal atom located on the first surface of the metal plate 60 and the package located on the array substrate 10 At least one atom of the region is bonded to the same ligand in the complexing agent to obtain the AMOLED display screen; wherein the first surface of the metal plate is opposite to the second surface of the metal plate.
可选的,所述阵列基板10为玻璃基板,所述封装基板20也为玻璃基板,但本申请对此并不做限定,在本申请的其他实施例中,所述阵列基板10和所述封装基板20也可以为塑料基板等其他材料的基板,本申请对此并不做限定,只要所述阵列基板10和所述封装基板20为平整的基板,且所述封装基板20为透光基板,且所述金属板60对所述阵列基板10、所述封装基板20具有较好的粘接性即可。Optionally, the array substrate 10 is a glass substrate, and the package substrate 20 is also a glass substrate. However, the present application is not limited thereto. In other embodiments of the present application, the array substrate 10 and the The package substrate 20 may also be a substrate of other materials such as a plastic substrate, which is not limited in this application, as long as the array substrate 10 and the package substrate 20 are flat substrates, and the package substrate 20 is a transparent substrate. The metal plate 60 may have good adhesion to the array substrate 10 and the package substrate 20.
需要说明的是,在本申请实施例中,所述配位剂中包含有配体,所述配体可以促进所述金属板60中的金属原子与阵列基板10中的硅原子的配位连接,即位于所述金属板60第 一表面的至少一个金属原子与位于所述阵列基板10的封装区域的至少一个原子均与所述配位剂中同一配体相键结,以增强金属板60与阵列基板10之间的粘附性;同理,所述配位剂也可以促进金属板60中的金属原子与封装基板20中硅原子的配位连接,即位于所述金属板60第一表面的至少一个金属原子与位于所述阵列基板10的封装区域的至少一个原子均与所述配位剂中同一配体相键结,以增强金属板60与封装基板20之间的粘附性。It should be noted that, in the embodiment of the present application, the complexing agent contains a ligand, and the ligand can promote the coordination connection between the metal atoms in the metal plate 60 and the silicon atoms in the array substrate 10. That is located on the metal plate 60 At least one metal atom of a surface and at least one atom of the encapsulation region of the array substrate 10 are bonded to the same ligand in the complexing agent to enhance adhesion between the metal plate 60 and the array substrate 10. Similarly, the complexing agent can also promote the coordination connection of the metal atoms in the metal plate 60 with the silicon atoms in the package substrate 20, that is, at least one metal atom located at the first surface of the metal plate 60 At least one atom of the package region of the array substrate 10 is bonded to the same ligand in the complexing agent to enhance adhesion between the metal plate 60 and the package substrate 20.
需要说明的是,由于氨基的空间位阻最小,且氮原子的孤电子被分散程度最小,配位能力最强,故在本申请的一个可选实施例中,所述配位剂为胺类或脂肪酸。具体的,所述配位剂可以为一乙醇胺、二乙醇胺或三乙醇胺。It should be noted that, since the steric hindrance of the amino group is the smallest, and the lone electron of the nitrogen atom is dispersed to the smallest extent, the coordination ability is the strongest. Therefore, in an alternative embodiment of the present application, the complexing agent is an amine. Or fatty acids. Specifically, the complexing agent may be monoethanolamine, diethanolamine or triethanolamine.
可选的,在本申请一个实施例中,位于所述金属板60第一表面的至少一个金属原子与位于所述封装基板20的封装区域的至少一个原子均与所述配位剂中同一配体相键结,且位于所述金属板60第二表面的至少一个金属原子与位于所述阵列基板10的封装区域的至少一个原子均与所述配位剂中同一配体相键结,进而得到所述AMOLED显示屏,以同时增强所述阵列基板10与所述金属板60之间的牢固度以及所述封装基板20与所述金属板60之间的牢固度,从而增强所述AMOLED显示屏中,所述阵列基板10与所述封装基板20之间的固定牢固度,提高所述AMOLED显示屏的封装效果。Optionally, in one embodiment of the present application, at least one metal atom located on the first surface of the metal plate 60 and at least one atom located in the package region of the package substrate 20 are the same as the same in the complexing agent. The bulk phase is bonded, and at least one metal atom located on the second surface of the metal plate 60 and at least one atom located in the package region of the array substrate 10 are bonded to the same ligand in the complexing agent, thereby further Obtaining the AMOLED display panel to simultaneously enhance the robustness between the array substrate 10 and the metal plate 60 and the firmness between the package substrate 20 and the metal plate 60, thereby enhancing the AMOLED display In the screen, the fixing between the array substrate 10 and the package substrate 20 improves the packaging effect of the AMOLED display.
需要说明的是,在本申请实施例中,由于所述金属纳米颗粒层50中的金属纳米颗粒为纳米尺度,因此,所述金属纳米颗粒的熔点较低,大大降低了对所述三明治结构进行加热,以使所述金属纳米颗粒层50熔接形成一金属板60时的工艺温度。而且,由于金属的材质较软,因此,本申请实施例所提供的封装方法中,利用金属板作为封装结构,可以在一定程度上缓解内应力,避免所述AMOLED显示屏封装过程中,由于内应力过大,而导致封装失效,使得周围环境中的水汽和氧气进入AMOLED显示屏内部,从而使AMOLED显示屏性能快速老化。It should be noted that, in the embodiment of the present application, since the metal nanoparticles in the metal nanoparticle layer 50 are on a nanometer scale, the melting point of the metal nanoparticles is low, which greatly reduces the sandwich structure. The process temperature at which the metal nanoparticle layer 50 is welded to form a metal plate 60 is heated. Moreover, since the material of the metal is soft, in the packaging method provided by the embodiment of the present application, the metal plate is used as the package structure, the internal stress can be alleviated to some extent, and the AMOLED display packaging process is avoided. The stress is too large, which leads to the failure of the package, so that the water vapor and oxygen in the surrounding environment enter the inside of the AMOLED display, so that the performance of the AMOLED display is rapidly deteriorated.
具体的,在上述实施例的基础上,在本申请的一个实施例中,采用激光的方式,对所述三明治结构加热,以使所述金属纳米颗粒层50熔接形成一金属板60,但本申请对此并不做限定,在本申请的其他实施例中,还可以采用其他方式,对所述三明治结构加热,以使所述金属纳米颗粒层50熔接形成一金属板60,具体视情况而定。Specifically, in the embodiment of the present application, in the embodiment of the present application, the sandwich structure is heated by a laser to fuse the metal nanoparticle layer 50 to form a metal plate 60, but The application is not limited thereto. In other embodiments of the present application, the sandwich structure may be heated to weld the metal nanoparticle layer 50 to form a metal plate 60, as the case may be. set.
由上所述可知,利用本申请实施例所提供的封装方法封装的AMOLED显示屏,可以利用位于所述阵列基板10和所述封装基板20封装区域的金属板60对所述AMOLED显示屏中的有机发光材料进行密封,使其与周围环境中的水汽和氧气隔离,保证AMOLED显示屏的长期可靠工作。It can be seen from the above that the AMOLED display panel packaged by the encapsulation method provided by the embodiment of the present application can be used in the AMOLED display panel by using the metal plate 60 located in the package area of the array substrate 10 and the package substrate 20. The organic luminescent material is sealed to isolate it from moisture and oxygen in the surrounding environment to ensure long-term reliable operation of the AMOLED display.
而且,所述阵列基板10中有机发光材料能够耐受的温度一般低于100℃,当其受到的温度过高时会导致有机发光材料被破坏分解,影响所述AMOLED显示屏的发光性能,因此,为了保证阵列基板10中的有机发光材料在所述金属纳米颗粒层50熔接成金属板60过程中不被破坏分解,则需使得所述金属纳米颗粒层50与所述有机发光材料保持一定的安全距离,以使得金属纳米颗粒层50熔融时的温度蔓延至有机发光材料区域时,可以降低至有机发光材料可以承受的温度范围,故本申请实施例所提供的封装方法中,金属纳米颗粒层50熔接成的金属板60的工艺温度较低,不仅可以降低工艺难度,还可以缩小所述金属板 60与所述有机发光材料之间的安全距离,适应于AMOLED器件窄边框的发展趋势。Moreover, the temperature at which the organic light-emitting material in the array substrate 10 can withstand is generally lower than 100 ° C. When the temperature is too high, the organic light-emitting material is destroyed and decomposed, which affects the light-emitting performance of the AMOLED display screen. In order to ensure that the organic light-emitting material in the array substrate 10 is not broken and destroyed during the fusion of the metal nano-particle layer 50 into the metal plate 60, the metal nano-particle layer 50 and the organic light-emitting material need to be kept constant. The safety distance is such that when the temperature at which the metal nanoparticle layer 50 is melted is spread to the organic light-emitting material region, the temperature range to which the organic light-emitting material can withstand can be reduced. Therefore, in the packaging method provided by the embodiments of the present application, the metal nano-particle layer The process temperature of the 50-fused metal plate 60 is low, which not only reduces the process difficulty, but also reduces the metal plate. The safety distance between the 60 and the organic luminescent material is adapted to the development trend of the narrow frame of the AMOLED device.
相应的,本申请实施例还提供了一种AMOLED显示屏,不同于传统的无机半导体发光二极管,有机电致发光器件使用有机薄膜材料作为发光材料,通过化学合成不同的有机材料得到不同颜色的出射光,属于面发光器件,不仅可以在不使用任何外加部件的情况下实现大面积均匀发光,还具有轻薄、可柔性的特点,从而可以应用于军事、医疗、工程、娱乐和教育等众多领域,成为当前世界上照明显示技术领域研究的一个热点。有机电致发光器件通常制作于玻璃、塑料片或钢片等基板上,包括阳极、阴极以及位于阳极和阴极之间的两层或多层有机材料,其中,阳极和阴极中至少一个可以透过可见光,从而当阳极和阴极上施加电压之后,阳极中的空穴和阴极中的电子可以注入有机材料中,复合产生光子,发出可见光。Correspondingly, the embodiment of the present application further provides an AMOLED display screen. Unlike a conventional inorganic semiconductor light-emitting diode, the organic electroluminescent device uses an organic thin film material as a light-emitting material, and chemically synthesizes different organic materials to obtain different colors. The light-emitting device belongs to a surface-emitting device, which can realize large-area uniform illumination without using any additional components, and has the characteristics of being thin and flexible, and can be applied to many fields such as military, medical, engineering, entertainment, and education. It has become a hot spot in the research of lighting display technology in the world. The organic electroluminescent device is usually fabricated on a substrate such as glass, plastic sheet or steel sheet, and includes an anode, a cathode, and two or more organic materials between the anode and the cathode, wherein at least one of the anode and the cathode is permeable. Visible light, such that when a voltage is applied across the anode and cathode, the holes in the anode and the electrons in the cathode can be injected into the organic material to recombine to produce photons that emit visible light.
具体的,如图6所示,本申请实施例所提供的AMOLED显示屏包括:阵列基板10、封装基板20和金属板60,所述金属板60位于所述阵列基板10与所述封装基板20之间;Specifically, as shown in FIG. 6 , the AMOLED display panel provided by the embodiment of the present application includes: an array substrate 10 , a package substrate 20 , and a metal plate 60 . The metal plate 60 is located on the array substrate 10 and the package substrate 20 . between;
所述封装基板20的第一表面与所述阵列基板10的第一表面相对,所述封装基板20的第一表面与所述阵列基板10的第一表面均包括封装区域,且所述封装基板20的封装区域B在所述阵列基板10的第一表面的投影与所述阵列基板10的封装区域A相重合;The first surface of the package substrate 20 is opposite to the first surface of the array substrate 10, and the first surface of the package substrate 20 and the first surface of the array substrate 10 both include a package area, and the package substrate The projection of the package area B of 20 on the first surface of the array substrate 10 coincides with the package area A of the array substrate 10;
位于所述金属板60第一表面的至少一个金属原子与位于所述封装基板20的封装区域的至少一个原子均与同一配体相键结,或者,位于所述金属板60第一表面的至少一个金属原子与位于所述阵列基板10的封装区域的至少一个原子均与同一配体相键结,所述金属板60的第一表面与所述金属板60的第二表面相对。At least one metal atom located on the first surface of the metal plate 60 and at least one atom located in the package region of the package substrate 20 are bonded to the same ligand, or at least on the first surface of the metal plate 60. A metal atom is bonded to the same ligand to at least one atom of the package region of the array substrate 10, and the first surface of the metal plate 60 is opposed to the second surface of the metal plate 60.
需要说明的是,由于氨基的空间位阻最小,且氮原子的孤电子被分散程度最小,配位能力最强,故在本申请的一个可选实施例中,所述配体包括具有空余电子对的氮原子,在本申请的其他实施例中,所述配体还可以包括具有空余电子对的硫原子,本申请对此并不做限定,只要所述配体中包括具有空余电子对的原子、分子或离子即可。It should be noted that, since the steric hindrance of the amino group is the smallest, and the lone electron of the nitrogen atom is dispersed to a minimum, and the coordination ability is the strongest, in an alternative embodiment of the present application, the ligand includes the vacant electron. The nitrogen atom of the pair, in other embodiments of the present application, the ligand may further include a sulfur atom having a free electron pair, which is not limited in the application as long as the ligand includes a pair of free electrons. An atom, a molecule or an ion can be used.
在上述任一实施例的基础上,在本申请的一个实施例中,所述阵列基板10的第一表面还包括放置有机电致发光器件70的区域C,所述阵列基板10的封装区域A包围着所述放置有机电致发光器件70的区域C。可选的,所述阵列基板10的封装区域A的内边缘与所述放置有机电致发光器件70的区域C的外边缘之间的间距d大于或等于0.1mm且小于或等于0.3mm。On the basis of any of the above embodiments, in one embodiment of the present application, the first surface of the array substrate 10 further includes a region C in which the organic electroluminescent device 70 is placed, and a package region A of the array substrate 10 A region C in which the organic electroluminescent device 70 is placed is surrounded. Optionally, a distance d between an inner edge of the package area A of the array substrate 10 and an outer edge of the area C where the organic electroluminescent device 70 is placed is greater than or equal to 0.1 mm and less than or equal to 0.3 mm.
在上述实施例的基础上,在本申请的一个实施例中,所述金属板60内孔隙的孔径小于或等于10nm,以对所述AMOLED显示屏周围环境中的水汽和氧气隔离,避免所述AMOLED显示屏周围环境中的水汽和氧气进入所述放置有机电致发光器件的区域,保证AMOLED显示屏的长期可靠工作。On the basis of the above embodiments, in one embodiment of the present application, the aperture of the metal plate 60 has a hole diameter of less than or equal to 10 nm to isolate the water vapor and oxygen in the environment around the AMOLED display screen, thereby avoiding the The water vapor and oxygen in the environment around the AMOLED display enter the area where the organic electroluminescent device is placed, ensuring long-term reliable operation of the AMOLED display.
在上述任一实施例的基础上,在本申请的一个可选实施例中,所述金属板60的厚度大于或等于1μm且小于或等于10μm,以保证所述金属板60封装效果的同时减小所述金属板60的厚度,适应所述AMOLED显示屏轻薄化的发展。On the basis of any of the above embodiments, in an optional embodiment of the present application, the thickness of the metal plate 60 is greater than or equal to 1 μm and less than or equal to 10 μm to ensure the packaging effect of the metal plate 60 is reduced. The thickness of the metal plate 60 is small, and the development of the thinness and thinness of the AMOLED display screen is adapted.
在上述任一实施例的基础上,在本申请的一个具体实施例中,所述金属板60内包括:金原子、银原子、铜原子或铝原子。但本申请对此并不做限定,在本申请的其他实施例中, 所述金属板60还可以包括其他金属原子,具体视情况而定。Based on any of the above embodiments, in a specific embodiment of the present application, the metal plate 60 includes: a gold atom, a silver atom, a copper atom or an aluminum atom. However, this application does not limit this. In other embodiments of the present application, The metal plate 60 may also include other metal atoms, as the case may be.
可选的,所述阵列基板10为玻璃基板,所述封装基板20也为玻璃基板,但本申请对此并不做限定,在本申请的其他实施例中,所述阵列基板10和所述封装基板20也可以为塑料基板等其他材料的基板,本申请对此并不做限定,只要所述阵列基板10和所述封装基板20为平整的基板,且所述封装基板20为透光基板,且所述金属板60对所述阵列基板10、所述封装基板20具有较好的粘接性即可。Optionally, the array substrate 10 is a glass substrate, and the package substrate 20 is also a glass substrate. However, the present application is not limited thereto. In other embodiments of the present application, the array substrate 10 and the The package substrate 20 may also be a substrate of other materials such as a plastic substrate, which is not limited in this application, as long as the array substrate 10 and the package substrate 20 are flat substrates, and the package substrate 20 is a transparent substrate. The metal plate 60 may have good adhesion to the array substrate 10 and the package substrate 20.
需要说明的是,由于所述金属板60中的金属原子为纳米尺度,从而使其熔点较低,大大降低了所述金属板60制作时的工艺温度。另外,金属的材质较软,本申请实施例所提供的AMOLED显示屏,利用金属板作为封装结构,可以在一定程度上缓解内应力,避免所述AMOLED显示屏封装过程中,由于内应力过大,而导致封装失效,使得周围环境中的水汽和氧气进入AMOLED显示屏内部,从而使AMOLED显示屏性能快速老化。It should be noted that since the metal atoms in the metal plate 60 are on a nanometer scale, the melting point thereof is low, and the process temperature at the time of fabrication of the metal plate 60 is greatly reduced. In addition, the material of the metal is soft. The AMOLED display provided by the embodiment of the present invention can use the metal plate as the package structure to alleviate the internal stress to a certain extent, and avoid the internal stress being excessive during the packaging process of the AMOLED display. As a result, the package fails, so that the water vapor and oxygen in the surrounding environment enter the inside of the AMOLED display screen, so that the AMOLED display performance is rapidly deteriorated.
可选的,在上述任一实施例的基础上,在本申请一个实施例中,位于所述金属板60第一表面的至少一个金属原子与位于所述封装基板20的封装区域的至少一个原子均与所述配位剂中同一配体相键结,且位于所述金属板60第二表面的至少一个金属原子与位于所述阵列基板10的封装区域的至少一个原子均与所述配位剂中同一配体相键结,进而得到所述AMOLED显示屏,以同时增强所述阵列基板10与所述金属板60之间的牢固度以及所述封装基板20与所述金属板60之间的牢固度,从而增强所述AMOLED显示屏中,所述阵列基板10与所述封装基板20之间的固定牢固度,提高所述AMOLED显示屏的封装效果。Optionally, based on any of the foregoing embodiments, in one embodiment of the present application, at least one metal atom located on the first surface of the metal plate 60 and at least one atom located in the package area of the package substrate 20 All of which are bonded to the same ligand in the complexing agent, and at least one metal atom located on the second surface of the metal plate 60 and at least one atom located in the package region of the array substrate 10 are coordinated with the coordination The same ligand is bonded in the agent to obtain the AMOLED display panel to simultaneously enhance the adhesion between the array substrate 10 and the metal plate 60 and between the package substrate 20 and the metal plate 60. The fastness of the AMOLED display screen enhances the fixing between the array substrate 10 and the package substrate 20 to improve the packaging effect of the AMOLED display panel.
此外,本申请实施例还提供了一种终端设备,所述终端设备包括:显示屏和电源,其中,所述电源用于向所述显示屏内的有机电致发光器件提供电源信号,用于使所述有机电致发光器件产生可见光以形成图像;所述显示屏为本申请上述任一实施例所提供的AMOLED显示屏。In addition, the embodiment of the present application further provides a terminal device, where the terminal device includes: a display screen and a power source, wherein the power source is used to provide a power signal to the organic electroluminescent device in the display screen, for The organic electroluminescent device is caused to generate visible light to form an image; the display screen is an AMOLED display screen provided by any of the above embodiments of the present application.
综上所述,本申请实施例所提供的AMOLED显示屏及包括该AMOLED显示屏的终端设备,可以利用位于所述阵列基板10和所述封装基板20封装区域的金属板60对所述AMOLED显示屏中的有机电致发光器件进行密封,使其与周围环境中的水汽和氧气隔离,保证AMOLED显示屏的长期可靠工作。In summary, the AMOLED display panel and the terminal device including the AMOLED display panel of the present application can display the AMOLED by using the metal plate 60 located in the package area of the array substrate 10 and the package substrate 20. The organic electroluminescent device in the screen is sealed to isolate it from moisture and oxygen in the surrounding environment, ensuring long-term reliable operation of the AMOLED display.
本说明书中各个部分采用递进的方式描述,每个部分重点说明的都是与其他部分的不同之处,各个部分之间相同相似部分互相参见即可。Each part of this manual is described in a progressive manner. Each part focuses on the differences from other parts. The same similar parts between the parts can be referred to each other.
对所公开的实施例的上述说明,使本领域专业技术人员能够实现或使用本申请。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的,本文中所定义的一般原理可以在不脱离本申请的精神或范围的情况下,在其它实施例中实现。因此,本申请将不会被限制于本文所示的实施例,而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。 The above description of the disclosed embodiments enables those skilled in the art to make or use the application. Various modifications to these embodiments are obvious to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the application. Therefore, the application is not limited to the embodiments shown herein, but the broadest scope consistent with the principles and novel features disclosed herein.

Claims (12)

  1. 一种有源矩阵有机发光二极体AMOLED显示屏的封装方法,其特征在于,该封装方法包括:A method for packaging an active matrix organic light emitting diode AMOLED display screen, characterized in that the packaging method comprises:
    分别在位于阵列基板第一表面的封装区域和位于封装基板第一表面的封装区域涂覆金属盐溶液,所述金属盐溶液包括溶剂、金属盐、配位剂和还原剂,所述阵列基板的第一表面与所述封装基板的第一表面相对;Coating a metal salt solution on the package region on the first surface of the array substrate and the package region on the first surface of the package substrate, the metal salt solution including a solvent, a metal salt, a complexing agent and a reducing agent, and the array substrate The first surface is opposite to the first surface of the package substrate;
    对涂覆有所述金属盐溶液的所述阵列基板的封装区域进行加热处理,以使所述阵列基板的封装区域被金属纳米颗粒覆盖,以及,对涂覆有所述金属盐溶液的所述封装基板的封装区域进行加热处理,以使所述封装基板的封装区域被金属纳米颗粒覆盖;Heating a package region of the array substrate coated with the metal salt solution such that a package region of the array substrate is covered with metal nanoparticles, and, for the coating of the metal salt solution The package region of the package substrate is subjected to heat treatment such that the package region of the package substrate is covered by the metal nanoparticles;
    将所述阵列基板表面的金属纳米颗粒和封装基板表面的金属纳米颗粒压接,形成包括所述阵列基板、所述封装基板以及位于所述阵列基板和所述封装基板之间的金属纳米颗粒层的三明治结构,所述封装基板的封装区域在所述阵列基板的第一表面的投影与所述阵列基板的封装区域相重合;Metal nanoparticles on the surface of the array substrate and metal nanoparticles on the surface of the package substrate are crimped to form a metal nanoparticle layer including the array substrate, the package substrate, and the array substrate and the package substrate a sandwich structure, a projection of the package region of the package substrate on a first surface of the array substrate coincides with a package region of the array substrate;
    对所述三明治结构加热,以使所述金属纳米颗粒层熔接形成一金属板,且位于所述金属板第一表面的至少一个金属原子与位于所述封装基板的封装区域的至少一个原子均与所述配位剂中同一配体相键结,或者,位于所述金属板第一表面的至少一个金属原子与位于所述阵列基板的封装区域的至少一个原子均与所述配位剂中同一配体相键结,进而得到所述AMOLED显示屏;其中,所述金属板的第一表面与所述金属板的第二表面相对。Heating the sandwich structure to fuse the metal nanoparticle layer to form a metal plate, and at least one metal atom located on the first surface of the metal plate and at least one atom located in a package region of the package substrate The same ligand is bonded to the ligand, or at least one metal atom located on the first surface of the metal plate and at least one atom located in the package region of the array substrate are the same as the complexing agent The ligand phase is bonded to obtain the AMOLED display panel; wherein the first surface of the metal plate is opposite to the second surface of the metal plate.
  2. 根据权利要求1所述的封装方法,其特征在于,所述金属盐为金属的醋酸盐或癸酸盐。The encapsulation method according to claim 1, wherein the metal salt is a metal acetate or citrate.
  3. 根据权利要求1或2所述的封装方法,其特征在于,所述溶剂为醇类物质。The encapsulation method according to claim 1 or 2, wherein the solvent is an alcohol.
  4. 根据权利要求1至3任一项所述的封装方法,其特征在于,所述还原剂为多元醇类化合物或胺类化合物。The encapsulation method according to any one of claims 1 to 3, wherein the reducing agent is a polyol compound or an amine compound.
  5. 根据权利要求1至4任一项所述的封装方法,其特征在于,所述配位剂为胺类或脂肪酸。The encapsulation method according to any one of claims 1 to 4, wherein the complexing agent is an amine or a fatty acid.
  6. 一种有源矩阵有机发光二极体AMOLED显示屏,其特征在于,包括阵列基板、封装基板和金属板,所述金属板位于所述阵列基板与所述封装基板之间;An active matrix organic light emitting diode AMOLED display screen, comprising: an array substrate, a package substrate and a metal plate, wherein the metal plate is located between the array substrate and the package substrate;
    所述封装基板的第一表面与所述阵列基板的第一表面相对,所述封装基板的第一表面与所述阵列基板的第一表面均包括封装区域,且所述封装基板的封装区域在所述阵列基板的第一表面的投影与所述阵列基板的封装区域相重合;The first surface of the package substrate is opposite to the first surface of the array substrate, the first surface of the package substrate and the first surface of the array substrate both include a package area, and the package area of the package substrate is a projection of the first surface of the array substrate coincides with a package area of the array substrate;
    位于所述金属板第一表面的至少一个金属原子与位于所述封装基板的封装区域的至少一个原子均与同一配体相键结,或者,位于所述金属板第一表面的至少一个金属原子与位于所述阵列基板的封装区域的至少一个原子均与同一配体相键结,所述金属板的第一表面与所述金属板的第二表面相对。At least one metal atom located on the first surface of the metal plate and at least one atom located in the package region of the package substrate are bonded to the same ligand, or at least one metal atom located on the first surface of the metal plate At least one atom located in a package region of the array substrate is bonded to the same ligand, and a first surface of the metal plate is opposite to a second surface of the metal plate.
  7. 根据权利要求6所述的显示屏,其特征在于,所述配体包括具有空余电子对的氮原子或硫原子。The display screen according to claim 6, wherein said ligand comprises a nitrogen atom or a sulfur atom having a vacant electron pair.
  8. 根据权利要求6或7所述的显示屏,其特征在于,所述金属板内孔隙的孔径小于或 等于10nm。The display screen according to claim 6 or 7, wherein the aperture of the metal plate has a pore diameter smaller than or Equal to 10nm.
  9. 根据权利要求6至8任一项所述的显示屏,其特征在于,所述阵列基板的第一表面还包括放置有机电致发光器件的区域,所述阵列基板的封装区域包围着所述放置有机电致发光器件的区域,且所述阵列基板的封装区域的内边缘与所述放置有机电致发光器件的区域的外边缘之间的间距大于或等于0.1mm且小于或等于0.3mm。The display screen according to any one of claims 6 to 8, wherein the first surface of the array substrate further comprises a region where the organic electroluminescent device is placed, and the package region of the array substrate surrounds the placement A region of the organic electroluminescent device, and a distance between an inner edge of the package region of the array substrate and an outer edge of the region where the organic electroluminescent device is placed is greater than or equal to 0.1 mm and less than or equal to 0.3 mm.
  10. 根据权利要求6至9任一项所述的显示屏,其特征在于,所述金属板的厚度大于或等于1μm且小于或等于10μm。The display screen according to any one of claims 6 to 9, characterized in that the thickness of the metal plate is greater than or equal to 1 μm and less than or equal to 10 μm.
  11. 根据权利要求6至10任一项所述的显示屏,其特征在于,所述金属板内包括:金原子、银原子、铜原子或铝原子。The display screen according to any one of claims 6 to 10, characterized in that the metal plate comprises: a gold atom, a silver atom, a copper atom or an aluminum atom.
  12. 一种终端设备,包括如权利要求6至11任一项所述的显示屏和电源,所述电源用于向所述显示屏内的有机电致发光器件提供电源信号,用于使所述有机电致发光器件产生可见光以形成图像。 A terminal device comprising the display screen and the power source according to any one of claims 6 to 11, the power source for supplying a power signal to the organic electroluminescent device in the display screen for causing the Electroluminescent devices produce visible light to form an image.
PCT/CN2017/080878 2016-07-14 2017-04-18 Active-matrix organic light-emitting diode display screen and packaging method thereof, and terminal device WO2018010465A1 (en)

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