WO2018010064A1 - Mems microphone and electronic apparatus - Google Patents

Mems microphone and electronic apparatus Download PDF

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Publication number
WO2018010064A1
WO2018010064A1 PCT/CN2016/089637 CN2016089637W WO2018010064A1 WO 2018010064 A1 WO2018010064 A1 WO 2018010064A1 CN 2016089637 W CN2016089637 W CN 2016089637W WO 2018010064 A1 WO2018010064 A1 WO 2018010064A1
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WIPO (PCT)
Prior art keywords
mems microphone
pressure sensing
sensing element
backbone
diaphragm
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PCT/CN2016/089637
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French (fr)
Inventor
Quanbo Zou
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Goertek Inc
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Goertek Inc
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Publication date
Application filed by Goertek Inc filed Critical Goertek Inc
Priority to US16/316,527 priority Critical patent/US10687147B2/en
Priority to PCT/CN2016/089637 priority patent/WO2018010064A1/en
Priority to CN201680087538.8A priority patent/CN109565634B/en
Publication of WO2018010064A1 publication Critical patent/WO2018010064A1/en
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/02—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension

Definitions

  • the present invention relates to the technology of MEMS, and in particular, to a MEMS microphone and an electronic apparatus.
  • MEMS The Micro-Electro-Mechanical Systems, or MEMS, refers to a miniaturized mechanical and electro-mechanical member (i.e., devices and structures) that are made using the techniques of microfabrication.
  • a MEMS microphone is a microphone which is based on MEMS technology. In the prior art, most MEMS microphones are condenser microphone.
  • piezoelectric MEMS microphone has been proposed.
  • a high performance piezoelectric MEMS microphone was proposed in the article of Robert John Littrell, et al, “High Performance Piezoelectric MEMS Microphones” , Ph. D. thesis, Univ. Michigan, 2010, which is hereby incorporated herein by reference.
  • the piezoelectric thin films for cantilever diaphragms do not have a base structure.
  • a stress/stress gradient will cause a diaphragm curvature of the cantilever diaphragm.
  • the acoustic performance and/or manufacturability will be impacted.
  • the cantilever diaphragms are fragile and are not robust. Consequently, the manufacturing yield is low and operation is not reliable.
  • One object of this invention is to provide a new technical solution for MEMS microphone.
  • a MEMS microphone comprising: a pressure sensing element, for sensing pressure applied thereon; a diaphragm attached to the pressure sensing element and applying pressure to the pressure sensing element; and a backbone attached to the pressure sensing element and supporting the pressure sensing element.
  • the pressure sensing element is a piezoelectric element.
  • the piezoelectric element is made of AlN, SnO 2 or PZT.
  • a diameter or side-length of the piezoelectric element is of 10 ⁇ 300 ⁇ m, and a diameter or side-length of the diaphragm is of 500 ⁇ 2000 ⁇ m.
  • the diaphragm is attached to one side electrode of the piezoelectric element, and the backbone is attached to another side electrode of the piezoelectric element.
  • the backbone includes one or more beams.
  • At least one of the beams is of 1 ⁇ 50 ⁇ m in width and 1 ⁇ 50um in thickness.
  • the MEMS microphone further comprises a first pad and a second pad, wherein t first electrode of the pressure sensing element is connected to the first pad via the backbone, and a second electrode of the pressure sensing element is connected to the second pad via the diaphragm.
  • the MEMS microphone further comprises a substrate, wherein the pressure sensing element, the diaphragm and the backbone are mounted on the substrate.
  • an electronic apparatus comprising a MEMS microphone according to the present invention.
  • An embodiment of this invention proposes a MEMS microphone with a new structure of backbone supporting a pressure sensing element.
  • the MEMS microphone has a relatively robust MEMS structure.
  • Figure 1 is a lateral view of a portion of a MEMS microphone according to a first embodiment.
  • Figure 2 is a top view of the MEMS microphone of Figure 1.
  • Figure 3 is a top view of a portion of a MEMS microphone according to a second embodiment.
  • Figure 4 shows a schematic diagram of an electronic apparatus with a MEMS microphone according to embodiments of this invention.
  • the MEMS microphone contains piezoelectric films for cantilever diaphragms without base structure.
  • the fragile diaphragm structure leads to low manufacturing yield and/or operation reliability issues.
  • the pressure sensing element could be a piezoelectric element or a piezo-resistive element.
  • the MEMS microphone will have a relatively robust MEMS structure. Furthermore, the manufacturability/yield thereof will be improved.
  • the following embodiments will be described with reference to a piezoelectric element. It will be appreciated by a person skilled in the art that a piezo-resistive element will be also possible.
  • Figure 1 shows a lateral view of a portion of a MEMS microphone according to a first embodiment.
  • Figure 2 shows a top view of the MEMS microphone of Figure 1
  • the MEMS microphone comprises a pressure sensing element 3, a diaphragm 2 and a backbone 4.
  • the sensing element 3 is for sensing pressure applied thereon.
  • the diaphragm 2 is attached to the pressure sensing element 3 and is for applying pressure to the pressure sensing element 3.
  • the backbone 4 is attached to the pressure sensing element and is for supporting the pressure sensing element 3. The backbone 4 is rigid and thus provides the piezoelectric element 3 with a robust support.
  • the diaphragm 3 can be supported by a substrate 1 at periphery. Compared with the piezoelectric solution of the prior art, this structure provides a relatively robust diaphragm.
  • the pressure sensing element 3 is a piezoelectric element.
  • the piezoelectric material of the piezoelectric element is a crystal material which can produce a voltage between two sides thereof under pressure.
  • the material of the piezoelectric element 3 can be AlN, SnO 2 or PZT.
  • a high quality piezoelectric (like AlN) element 3 is manufactured on a standard MEMS wafer (not shown) , followed by a low-temperature back-end process to attach it to a rigid backbone 4.
  • a standard MEMS wafer not shown
  • a low-temperature back-end process to attach it to a rigid backbone 4.
  • the size of piezoelectric element 3 is much smaller than that of the diaphragm 2.
  • the pressure intensity applied on the piezoelectric element 3 will be increased and thus the Signal-Noise-Ratio (SNR) of the microphone will be improved.
  • the piezoelectric element 3 is in a shape of round or square.
  • the diameter or side-length of the piezoelectric element 3 is of 10 ⁇ 300 ⁇ m, and the diameter or side-length of the diaphragm is of 500 ⁇ 2000 ⁇ m, for example.
  • the diaphragm 2 is attached to one side electrode of the piezoelectric element 3, and the backbone 4 is attached to another side electrode of the piezoelectric element 3, for example.
  • the backbone 4 can be attached with the piezoelectric element 3 in other manners as long as the backbone 4 can provide the piezoelectric element 3 with a robust support.
  • the piezoelectric element 3 can be embedded in the backbone 4.
  • the backbone 4 can include one or more beams.
  • backbone 4 has two beams 41, 42.
  • the piezoelectric element 3 is located at the cross point of the beams 41, 42.
  • the beams 41, 42 form a relatively robust structure.
  • at least one of the beams 41, 42 is of 1 ⁇ 50 ⁇ m in width and 1 ⁇ 50um in thickness.
  • the MEMS microphone further comprises a first pad 61 and a second pad 62.
  • a first electrode of the pressure sensing element 3 is connected to the first pad 61 via the backbone 4.
  • the backbone 4 can be electrically conductive or a conductive lead is provided on the backbone 4.
  • a second electrode of the pressure sensing element 3 is connected to the second pad 61 via the diaphragm 2.
  • the diaphragm 2 can be electrically conductive or a conductive lead is provided on the diaphragm.
  • the first pad 61 and the second pad 62 are used to output signals, for example.
  • the MEMS microphone further comprises the substrate 1.
  • the pressure sensing element 3, the diaphragm 2 and the backbone 4 are mounted on the substrate 1 through bonding or gluing, for example.
  • the pressure sensing element 3, the diaphragm 2 and the backbone 4 are mounted on the substrate 1 via dielectric layers 51, 52, 53, 54.
  • the piezoelectric element is not used as a cantilever diaphragm. This can, on one hand, produce a relatively stable structure. On the other hand, this provides a freedom of design of the pressure sensing element, for example, to reduce the parasitic capacitance between two electrodes of the piezoelectric element.
  • the dimension of the backbone 4 is much smaller than that of the diaphragm 2, the acoustic damping/resistance between the diaphragm and the backbone is minimized.
  • Figure 3 shows a top view of a portion of a MEMS microphone according to a second embodiment. The repetitive contents with the first embodiment will be omitted.
  • the MEMS microphone includes a pressure sensing element 3’ , a diaphragm 2’ and a backbone 41’ .
  • the MEMS microphone further includes a first pad 61’ and a second pad 62’ .
  • the diaphragm 2’ and the backbone 41’ are mounted on a substrate 1’ .
  • the configuration of the MEMS microphone of the second embodiment is similar with that of the first embodiment except that the backbone includes just one beam 41’ . By this configuration, the dimension of the backbone is further reduced and the acoustic damping/resistance between the diaphragm and the backbone can be further lowered.
  • Figure 4 shows a schematic diagram of an electronic apparatus with a MEMS microphone according to embodiments of this invention.
  • the electronic apparatus 200 comprises a MEMS microphone 201.
  • the MEMS microphone 201 can be the MEMS microphone according to the first embodiment or the second embodiment, as shown in Figures 1, 2, 3, for example.
  • the electronic apparatus 200 can be a smart phone, pad, notebook and so on.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)

Abstract

The present invention discloses a MEMS microphone and an electronic apparatus. The MEMS microphone comprises: a pressure sensing element, for sensing pressure applied thereon； a diaphragm attached to the pressure sensing element and applying pressure to the pressure sensing element; and a backbone attached to the pressure sensing element and supporting the pressure sensing element.

Description

MEMS MICROPHONE AND ELECTRONIC APPARATUS FIELD OF THE INVENTION
The present invention relates to the technology of MEMS, and in particular, to a MEMS microphone and an electronic apparatus.
BACKGROUND OF THE INVENTION
The Micro-Electro-Mechanical Systems, or MEMS, refers to a miniaturized mechanical and electro-mechanical member (i.e., devices and structures) that are made using the techniques of microfabrication. A MEMS microphone is a microphone which is based on MEMS technology. In the prior art, most MEMS microphones are condenser microphone.
Recently, piezoelectric MEMS microphone has been proposed. For example, a high performance piezoelectric MEMS microphone was proposed in the article of Robert John Littrell, et al, “High Performance Piezoelectric MEMS Microphones” , Ph. D. dissertation, Univ. Michigan, 2010, which is hereby incorporated herein by reference.
In the piezoelectric MEMS microphone of the prior art, the piezoelectric thin films for cantilever diaphragms do not have a base structure. Thus, a stress/stress gradient will cause a diaphragm curvature of the cantilever diaphragm. As a result, the acoustic performance and/or manufacturability will be impacted. Furthermore, the cantilever diaphragms are fragile and are not robust. Consequently, the manufacturing yield is low and operation is not reliable.
Therefore, there is a demand in the art that a new MEMS microphone shall be proposed to address at least one of the problems in the prior art.
SUMMARY OF THE INVENTION
One object of this invention is to provide a new technical solution for MEMS microphone.
According to a first aspect of the present invention, there is provided a MEMS microphone, comprising: a pressure sensing element, for sensing pressure applied thereon； a diaphragm attached to the pressure sensing element and applying pressure to the pressure sensing  element； and a backbone attached to the pressure sensing element and supporting the pressure sensing element.
Alternatively or in addition, the pressure sensing element is a piezoelectric element.
Alternatively or in addition, the piezoelectric element is made of AlN, SnO2 or PZT.
Alternatively or in addition, a diameter or side-length of the piezoelectric element is of 10～300μm, and a diameter or side-length of the diaphragm is of 500～2000μm.
Alternatively or in addition, the diaphragm is attached to one side electrode of the piezoelectric element, and the backbone is attached to another side electrode of the piezoelectric element.
Alternatively or in addition, the backbone includes one or more beams.
Alternatively or in addition, at least one of the beams is of 1～50μm in width and 1～50um in thickness.
Alternatively or in addition, the MEMS microphone further comprises a first pad and a second pad, wherein t first electrode of the pressure sensing element is connected to the first pad via the backbone, and a second electrode of the pressure sensing element is connected to the second pad via the diaphragm.
Alternatively or in addition, the MEMS microphone further comprises a substrate, wherein the pressure sensing element, the diaphragm and the backbone are mounted on the substrate.
According to a second aspect of the present invention, there is provided an electronic apparatus comprising a MEMS microphone according to the present invention.
An embodiment of this invention proposes a MEMS microphone with a new structure of backbone supporting a pressure sensing element. The MEMS microphone has a relatively robust MEMS structure.
Further features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments according to the present invention with reference to the attached drawings.
BRIEF DISCRIPTION OF THE DRAWINGS
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description thereof, serve to explain the principles of the invention.
Figure 1 is a lateral view of a portion of a MEMS microphone according to a first embodiment.
Figure 2 is a top view of the MEMS microphone of Figure 1.
Figure 3 is a top view of a portion of a MEMS microphone according to a second embodiment.
Figure 4 shows a schematic diagram of an electronic apparatus with a MEMS microphone according to embodiments of this invention.
DETAILED DESCRIPTION OF THE EMBODIMENTS
Various exemplary embodiments of the present invention will now be described in detail with reference to the drawings. It should be noted that the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods and apparatus as known by one of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all of the examples illustrated and discussed herein, any specific values should be interpreted to be illustrative only and non-limiting. Thus, other examples of the exemplary embodiments could have different values.
Notice that similar reference numerals and letters refer to similar items in the following figures, and thus once an item is defined in one figure, it is possible that it need not be further discussed for following figures.
In the prior art, the MEMS microphone contains piezoelectric films for cantilever diaphragms without base structure. Thus, the fragile diaphragm structure leads to low manufacturing yield and/or operation reliability issues.
In this invention, a new structure of pressure sensing element is proposed. The pressure sensing element could be a piezoelectric element or a piezo-resistive element. By means of this structure, the MEMS microphone will have a relatively robust MEMS structure. Furthermore, the manufacturability/yield thereof will be improved. The following embodiments will be described with reference to a piezoelectric element. It will be appreciated by a person skilled in the art that a piezo-resistive element will be also possible.
An embodiment will be described with reference to Figures 1 and 2. Figure 1 shows a lateral view of a portion of a MEMS microphone according to a first embodiment. Figure 2 shows a top view of the MEMS microphone of Figure 1
As shown in Figure 1, the MEMS microphone comprises a pressure sensing element 3, a diaphragm 2 and a backbone 4.
The sensing element 3 is for sensing pressure applied thereon. The diaphragm 2 is attached to the pressure sensing element 3 and is for applying pressure to the pressure sensing element 3. The backbone 4 is attached to the pressure sensing element and is for supporting the pressure sensing element 3. The backbone 4 is rigid and thus provides the piezoelectric element 3 with a robust support.
In this invention, the diaphragm 3 can be supported by a substrate 1 at periphery. Compared with the piezoelectric solution of the prior art, this structure provides a relatively robust diaphragm.
In an example, the pressure sensing element 3 is a piezoelectric element. For example, the piezoelectric material of the piezoelectric element is a crystal material which can produce a voltage between two sides thereof under pressure. The material of the piezoelectric element 3 can be AlN, SnO2 or PZT.
For example, a high quality piezoelectric (like AlN) element 3 is manufactured on a standard MEMS wafer (not shown) , followed by a low-temperature back-end process to attach it to a rigid backbone 4. It will be understood by a person skilled in the art that the  above examples are only intended to be illustrative but not to limit the scope of the present invention.
In the embodiment, the size of piezoelectric element 3 is much smaller than that of the diaphragm 2. By this configuration, the pressure intensity applied on the piezoelectric element 3 will be increased and thus the Signal-Noise-Ratio (SNR) of the microphone will be improved. For example, the piezoelectric element 3 is in a shape of round or square. The diameter or side-length of the piezoelectric element 3 is of 10～300μm, and the diameter or side-length of the diaphragm is of 500～2000μm, for example.
As shown in Figures 1 and 2, the diaphragm 2 is attached to one side electrode of the piezoelectric element 3, and the backbone 4 is attached to another side electrode of the piezoelectric element 3, for example. It will be appreciated by a person skilled in the art that the backbone 4 can be attached with the piezoelectric element 3 in other manners as long as the backbone 4 can provide the piezoelectric element 3 with a robust support. For example, the piezoelectric element 3 can be embedded in the backbone 4.
The backbone 4 can include one or more beams. In Figure 2, backbone 4 has two  beams  41, 42. The piezoelectric element 3 is located at the cross point of the  beams  41, 42. The  beams  41, 42 form a relatively robust structure. For example, at least one of the  beams  41, 42 is of 1～50μm in width and 1～50um in thickness.
As shown in Figures 1 and 2, the MEMS microphone further comprises a first pad 61 and a second pad 62. A first electrode of the pressure sensing element 3 is connected to the first pad 61 via the backbone 4. For example, the backbone 4 can be electrically conductive or a conductive lead is provided on the backbone 4. A second electrode of the pressure sensing element 3 is connected to the second pad 61 via the diaphragm 2. The diaphragm 2 can be electrically conductive or a conductive lead is provided on the diaphragm. The first pad 61 and the second pad 62 are used to output signals, for example.
As shown in Figure 2, the MEMS microphone further comprises the substrate 1. The pressure sensing element 3, the diaphragm 2 and the backbone 4 are mounted on the substrate 1 through bonding or gluing, for example. For example, as shown in Figure 1, the pressure sensing  element 3, the diaphragm 2 and the backbone 4 are mounted on the substrate 1 via dielectric layers 51, 52, 53, 54.
Unlike the prior art piezoelectric MEMS microphone, the piezoelectric element is not used as a cantilever diaphragm. This can, on one hand, produce a relatively stable structure. On the other hand, this provides a freedom of design of the pressure sensing element, for example, to reduce the parasitic capacitance between two electrodes of the piezoelectric element.
Furthermore, since the dimension of the backbone 4 is much smaller than that of the diaphragm 2, the acoustic damping/resistance between the diaphragm and the backbone is minimized.
Figure 3 shows a top view of a portion of a MEMS microphone according to a second embodiment. The repetitive contents with the first embodiment will be omitted.
As shown in Figure 3, the MEMS microphone includes a pressure sensing element 3’ , a diaphragm 2’ and a backbone 41’ . The MEMS microphone further includes a first pad 61’ and a second pad 62’ . The diaphragm 2’ and the backbone 41’ are mounted on a substrate 1’ . The configuration of the MEMS microphone of the second embodiment is similar with that of the first embodiment except that the backbone includes just one beam 41’ . By this configuration, the dimension of the backbone is further reduced and the acoustic damping/resistance between the diaphragm and the backbone can be further lowered.
Figure 4 shows a schematic diagram of an electronic apparatus with a MEMS microphone according to embodiments of this invention.
As shown in Figure 4, the electronic apparatus 200 comprises a MEMS microphone 201. The MEMS microphone 201 can be the MEMS microphone according to the first embodiment or the second embodiment, as shown in Figures 1, 2, 3, for example. The electronic apparatus 200 can be a smart phone, pad, notebook and so on.
Although some specific embodiments of the present invention have been demonstrated in detail with examples, it should be understood by a person skilled in the art that the above examples are only intended to be illustrative but not to limit the scope of the present invention. It should be understood by a person skilled in the art that the above  embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the attached claims.

Claims (10)

  1. A MEMS microphone, comprising:
    a pressure sensing element, for sensing pressure applied thereon；
    a diaphragm attached to the pressure sensing element and applying pressure to the pressure sensing element； and
    a backbone attached to the pressure sensing element and supporting the pressure sensing element.
  2. The MEMS microphone according to claim 1, wherein the pressure sensing element is a piezoelectric element.
  3. The MEMS microphone according to claim 2, wherein the piezoelectric element is made of AlN, SnO2 or PZT.
  4. The MEMS microphone according to claim 2, wherein a diameter or side-length of the piezoelectric element is of 10～300μm, and a diameter or side-length of the diaphragm is of 500～2000μm.
  5. The MEMS microphone according to claim 2, wherein the diaphragm is attached to one side electrode of the piezoelectric element, and the backbone is attached to another side electrode of the piezoelectric element.
  6. The MEMS microphone according to claim 2, wherein the backbone includes one or more beams.
  7. The MEMS microphone according to claim 6, wherein at least one of the beams is of 1～50μm in width and 1～50um in thickness.
  8. The MEMS microphone according to claim 1, further comprising a first pad and a second pad, wherein a first electrode of the pressure sensing element is connected to the first pad via the backbone, and a second electrode of the pressure sensing element is connected to the second pad via the diaphragm.
  9. The MEMS microphone according to claim 1, further comprising a substrate, wherein the pressure sensing element, the diaphragm and the backbone are mounted on the substrate.
  10. An electronic apparatus, comprising a MEMS microphone according to claim 1.
PCT/CN2016/089637 2016-07-11 2016-07-11 Mems microphone and electronic apparatus Ceased WO2018010064A1 (en)

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT201900007317A1 (en) * 2019-05-27 2020-11-27 St Microelectronics Srl MICROELECTROMECHANICAL PIEZOELECTRIC ACOUSTIC TRANSDUCER WITH IMPROVED CHARACTERISTICS AND RELATED MANUFACTURING PROCESS
CN112087695B (en) * 2020-06-16 2021-12-31 歌尔微电子有限公司 Absolute pressure sensing micro-electro-mechanical system microphone, microphone monomer and electronic equipment
US12302063B2 (en) * 2021-09-16 2025-05-13 Skyworks Solutions, Inc. Acoustic device with connected cantilever
EP4258691B1 (en) 2022-04-08 2026-01-21 STMicroelectronics S.r.l. Membrane microelectromechanical electroacustic transducer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102647657A (en) * 2012-05-25 2012-08-22 中北大学 Monolithic integrated MEMS piezoresistive ultrasonic sensor
US20120266686A1 (en) * 2011-04-19 2012-10-25 Huffman James D Mems composite transducer including compliant membrane
CN103546845A (en) * 2012-07-11 2014-01-29 罗伯特·博世有限公司 Component having a micromechanical microphone pattern

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2239961A1 (en) * 2009-04-06 2010-10-13 Nxp B.V. Backplate for microphone
US9029963B2 (en) * 2012-09-25 2015-05-12 Sand 9, Inc. MEMS microphone
US9143870B2 (en) * 2012-11-09 2015-09-22 Invensense, Inc. Microphone system with mechanically-coupled diaphragms
US8942410B2 (en) * 2012-12-31 2015-01-27 Apple Inc. Magnetically biased electromagnet for audio applications
KR102056287B1 (en) * 2013-11-27 2019-12-16 한국전자통신연구원 Microphone
US9631996B2 (en) * 2014-07-03 2017-04-25 Infineon Technologies Ag Motion detection using pressure sensing
US20160037245A1 (en) * 2014-07-29 2016-02-04 Knowles Electronics, Llc Discrete MEMS Including Sensor Device
CN105989929B (en) * 2015-02-27 2017-11-10 中芯国际集成电路制造(上海)有限公司 A kind of conductive film preparation method and conductive film
CN106744664B (en) * 2016-11-22 2019-01-18 歌尔股份有限公司 The method and MEMS sensor of filter screen are formed in MEMS sensor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120266686A1 (en) * 2011-04-19 2012-10-25 Huffman James D Mems composite transducer including compliant membrane
CN102647657A (en) * 2012-05-25 2012-08-22 中北大学 Monolithic integrated MEMS piezoresistive ultrasonic sensor
CN103546845A (en) * 2012-07-11 2014-01-29 罗伯特·博世有限公司 Component having a micromechanical microphone pattern

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US20190297427A1 (en) 2019-09-26

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