WO2018000767A1 - Method and system for controlling temperature of engine - Google Patents

Abstract

A method and system for controlling the temperature of an engine. A semiconductor refrigeration assembly is arranged on an outer surface of the engine. The method comprises: acquiring a current temperature of an engine, and determining whether the current temperature is greater than a pre-set temperature threshold value (S10); when the current temperature is greater than the pre-set temperature threshold value, determining a pre-set temperature interval matching the current temperature of the engine (S20); and performing a heat dissipation operation on the engine in a temperature control mode of the semiconductor refrigeration assembly corresponding to the matched pre-set temperature interval (S30). The control method not only reduces the heat dissipation cost, but also makes the heat dissipation of an engine more refined, thereby ensuring that the engine can run at normal temperature.

Description

 Engine temperature control method and system

Technical field

The invention relates to the technical field of new energy application, in particular to a method and a system for controlling engine temperature.

Background technique

An engine is a machine that converts a certain type of energy into mechanical energy. Its function is to convert the chemical energy of liquid or gas combustion into heat by combustion, and then convert the heat energy into mechanical energy through expansion and externally output power, so that the automobile and the aircraft And the ship can operate normally. However, a large amount of heat is generated in the engine work, which not only affects the working efficiency of the engine, but also, if the engine is operated in a high temperature environment for a long time, it is easy to age, thereby reducing the service life of the engine.

At present, there are many ways to dissipate heat from the engine, but each type of heat dissipation requires multiple heat sinks to form a complex heat dissipation system to dissipate heat from the engine and dissipate excess heat to the atmosphere to maintain normal engine operation. Working temperature, for example, a motor vehicle generally uses a water-cooled type to dissipate heat from the engine. The water-cooled heat-dissipating system is composed of a water pump, a radiator, a fan, a thermostat, and a water jacket, and uses the circulation of the cooling water to heat the high-temperature parts. Dissipating to the atmosphere through the radiator to maintain the normal operating temperature of the engine not only increases the heat dissipation cost of the engine, but also causes a large amount of waste of resources.

Summary of the invention

The main object of the present invention is to provide a method and system for controlling engine temperature, which aims to solve the problem that a complex heat dissipation system is formed by a plurality of heat dissipating devices to dissipate heat from the engine and dissipate excess heat to the atmosphere.

In order to achieve the above object, the present invention provides a method of controlling an engine temperature, wherein an outer surface of the engine is provided with a semiconductor refrigeration assembly, and the method for controlling the temperature of the engine includes the following steps:

Obtaining a current temperature of the engine, determining whether the current temperature is greater than a preset temperature threshold;

Determining a preset temperature interval that the current temperature of the engine matches when the current temperature is greater than a preset temperature threshold;

Performing a heat dissipation operation on the engine by using a temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval, and conducting a direct connection between the semiconductor refrigeration component and the battery to transmit the power generated by the semiconductor refrigeration component to The battery to which the semiconductor refrigeration unit is connected, wherein the semiconductor refrigeration unit converts the absorbed heat into a quantity of electricity;

When the current temperature is greater than the temperature of all the preset temperature intervals, the heat dissipation operation is performed on the engine according to the temperature control mode corresponding to the preset temperature range with the highest temperature, and an alarm operation is performed.

Wherein, the temperature control mode of the semiconductor refrigeration component includes a preset heat dissipation duration and/or a preset number of semiconductor refrigeration and cooling fins, and the temperature control mode pair of the semiconductor refrigeration component corresponding to the matched preset temperature interval is used. The steps of the engine performing a heat dissipation operation include:

The heat dissipation operation is performed by matching the heat dissipation duration corresponding to the preset temperature interval and/or the number of refrigerant sheets in the semiconductor refrigeration unit.

The step of performing the heat dissipation operation by using the matching heat dissipation duration corresponding to the preset temperature interval and/or the number of the cooling fins in the semiconductor refrigeration component includes:

Obtaining the number of cooling pieces corresponding to the preset preset temperature interval;

And charging the cooling sheet corresponding to the number of the cooling pieces obtained in the semiconductor refrigeration unit, and controlling the cooling piece to power on the matching heat-preserving time interval corresponding to the matched preset temperature interval, and then powering down to perform heat dissipation operation on the engine .

In addition, in order to achieve the above object, the present invention also provides a method for controlling engine temperature, wherein an outer surface of the engine is provided with a semiconductor refrigeration assembly, and the method for controlling the temperature of the engine includes:

Obtaining a current temperature of the engine, determining whether the current temperature is greater than a preset temperature threshold;

Determining a preset temperature interval that the current temperature of the engine matches when the current temperature is greater than a preset temperature threshold;

The engine is subjected to a heat dissipation operation using a temperature control mode of the semiconductor refrigeration unit corresponding to the matched preset temperature interval.

Wherein, the step of performing the heat dissipation operation of the engine by using the temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval is performed:

Directly connecting the semiconductor refrigeration component to the battery to transfer the amount of electricity generated by the semiconductor refrigeration component to a battery connected to the semiconductor refrigeration component, wherein the semiconductor refrigeration component converts the absorbed heat into a quantity of electricity.

The step of performing the heat dissipation operation on the engine by using the temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval further includes:

When the current temperature is greater than the temperature of all the preset temperature intervals, the heat dissipation operation is performed on the engine according to the temperature control mode corresponding to the preset temperature range with the highest temperature, and an alarm operation is performed.

Wherein, the temperature control mode of the semiconductor refrigeration component includes a preset heat dissipation duration and/or a preset number of semiconductor refrigeration and cooling fins, and the temperature control mode pair of the semiconductor refrigeration component corresponding to the matched preset temperature interval is used. The steps of the engine performing a heat dissipation operation include:

The heat dissipation operation is performed by matching the heat dissipation duration corresponding to the preset temperature interval and/or the number of refrigerant sheets in the semiconductor refrigeration unit.

The step of performing the heat dissipation operation by using the matching heat dissipation duration corresponding to the preset temperature interval and/or the number of the cooling fins in the semiconductor refrigeration component includes:

Obtaining the number of cooling pieces corresponding to the preset preset temperature interval;

And charging the cooling sheet corresponding to the number of the cooling pieces obtained in the semiconductor refrigeration unit, and controlling the cooling piece to power on the matching heat-preserving time interval corresponding to the matched preset temperature interval, and then powering down to perform heat dissipation operation on the engine .

In addition, in order to achieve the above object, the present invention also provides a control system for an engine temperature, the outer surface of the engine is provided with a semiconductor refrigeration assembly, and the control system for the engine temperature includes:

a first determining module, configured to acquire a current temperature of the engine, and determine whether the current temperature is greater than a preset temperature threshold;

a second determining module, configured to determine a preset temperature interval that matches a current temperature of the engine when the current temperature is greater than a preset temperature threshold;

The first heat dissipation module is configured to perform a heat dissipation operation on the engine by using a temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval.

Wherein, the engine temperature control system further comprises:

a connection module, configured to conduct a direct connection between the semiconductor refrigeration component and the battery, to transfer power generated by the semiconductor refrigeration component to a battery connected to the semiconductor refrigeration component, wherein the semiconductor refrigeration component will absorb heat Convert to power.

Wherein, the engine temperature control system further comprises:

The second heat dissipation module is configured to perform heat dissipation operation on the engine according to a temperature control mode corresponding to a preset temperature range with the highest temperature when the current temperature is greater than a temperature of all the preset temperature intervals, and perform an alarm operation.

The temperature control mode of the semiconductor refrigeration component includes a preset heat dissipation time and/or a preset number of semiconductor refrigeration and cooling fins, and the first heat dissipation module is further configured to:

The heat dissipation operation is performed by matching the heat dissipation duration corresponding to the preset temperature interval and/or the number of refrigerant sheets in the semiconductor refrigeration unit.

The first heat dissipation module is further configured to:

Obtaining the number of cooling pieces corresponding to the preset preset temperature interval;

And charging the cooling sheet corresponding to the number of the cooling pieces obtained in the semiconductor refrigeration unit, and controlling the cooling piece to power on the matching heat-preserving time interval corresponding to the matched preset temperature interval, and then powering down to perform heat dissipation operation on the engine .

The invention determines whether the current temperature is greater than a preset temperature threshold by acquiring a current temperature of the engine, and determines a preset temperature interval that the current temperature of the engine matches when the current temperature is greater than a preset temperature threshold, and adopts a matching preset temperature interval corresponding to The temperature control mode of the semiconductor refrigeration unit performs heat dissipation operation on the engine. Since the present invention pre-stages the temperature that can be achieved by the engine during operation into a plurality of preset temperature intervals, each preset temperature interval corresponds to a temperature control mode of a semiconductor refrigeration component, and each interval is preset after starting the engine operation. Time detecting the current temperature of the engine, determining a preset temperature interval in which the current temperature of the engine matches, and performing heat dissipation operation on the engine according to the temperature control mode of the semiconductor refrigeration component according to the preset temperature interval, thereby not only reducing the heat dissipation cost, but also This makes the heat dissipation of the engine finer, thus ensuring that the engine can operate at normal temperature.

DRAWINGS

1 is a schematic flow chart of a first embodiment of a method for controlling engine temperature according to the present invention;

2 is a schematic flow chart of a second embodiment of a method for controlling engine temperature according to the present invention;

3 is a schematic flow chart of a third embodiment of a method for controlling engine temperature according to the present invention;

4 is a schematic flow chart of a fourth embodiment of a method for controlling engine temperature according to the present invention;

FIG. 5 is a schematic flowchart of a refinement step of step S13 in the fourth embodiment shown in FIG. 4 according to the present invention;

Figure 6 is a schematic diagram of the functional modules of the first embodiment of the engine temperature control system of the present invention;

Figure 7 is a schematic diagram of functional modules of a second embodiment of the engine temperature control system of the present invention;

Figure 8 is a schematic diagram of functional modules of a third embodiment of the engine temperature control system of the present invention.

The implementation, functional features, and advantages of the present invention will be further described in conjunction with the embodiments.

detailed description

It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Based on the above problems, the present invention provides a method of controlling engine temperature.

Referring to Fig. 1, there is shown a flow chart of a first embodiment of a method for controlling engine temperature according to the present invention.

In this embodiment, the method for controlling the engine temperature includes:

Step S10, obtaining a current temperature of the engine, and determining whether the current temperature is greater than a preset temperature threshold;

In this embodiment, when the engine start of the device is detected, if the engine start of the automobile is detected, the current temperature of the engine is acquired every preset time interval, and it is determined whether the current temperature of the engine is greater than a preset temperature threshold. Wherein, the preset temperature threshold may be a normal temperature of 25 ° C, or may be a temperature that ensures the normal operation of the engine.

Step S20, determining a preset temperature interval that the current temperature of the engine matches when the current temperature is greater than the preset temperature threshold;

A plurality of preset temperature intervals are preset in the device, for example, 25 ° C < T1 ≤ 50 ° C, 50 ° C < T1 ≤ 80 ° C and 80 ° C < T1 ≤ 100 ° C. When it is determined that the current temperature of the engine is greater than the preset temperature threshold, the current temperature value of the engine is compared with each temperature in the preset temperature interval to determine a preset temperature interval that the current temperature of the engine matches.

Step S30, performing heat dissipation operation on the engine by using a temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval.

A temperature control mode corresponding to one semiconductor refrigeration component is set in the device in advance, and after determining a preset temperature interval matched by the current temperature of the engine, and further preset from the device In the temperature control mode of the semiconductor refrigeration component, the preset temperature range matched with the current temperature is selected to correspond to the temperature control mode of the semiconductor refrigeration component, and the engine is subjected to a heat dissipation operation according to the temperature control mode of the semiconductor refrigeration component. The outer surface of the engine is bonded with a plurality of semiconductor refrigerating sheets. The cooling principle of the semiconductor refrigerating sheet is to attach the cold end of the semiconductor refrigerating sheet to the outside of the engine, and the hot end and the temperature difference semiconductor sheet power generating sheet in the semiconductor refrigerating unit are performed. In association, when the semiconductor refrigerating sheet is energized, the cold end of the semiconductor refrigerating sheet absorbs excess heat generated by the engine, and the hot end of the semiconductor refrigerating sheet exotherms to perform a heat dissipating operation on the engine. The number of the semiconductor refrigerating sheets depends on the actual conditions of the engine, and the number of the semiconductor refrigerating sheets is not limited in this embodiment.

It should be noted that when the semiconductor refrigerating sheet is energized, the voltage applied to the semiconductor refrigerating sheet is larger, the longer the heat dissipation time of the engine is, and/or the more the amount of energization of the semiconductor refrigerating sheet is, the more the engine is The better the heat dissipation effect, the different temperature control modes of the semiconductor refrigeration components correspond to different preset temperature intervals to achieve heat dissipation operation for different current temperatures of the engine. In the preset temperature range, the temperature control mode of the specific semiconductor refrigeration component of the device is matched as shown in Table 1.

Table 1

Preset temperature interval	Temperature control mode of semiconductor refrigeration components
25°C<T1≤50°C	First temperature control mode
50 ° C < T1 ≤ 80 ° C	Second temperature control mode
80°C<T1≤100°C	Third temperature control mode

The first temperature control mode can be understood as a semiconductor refrigeration chip that is turned on by 1/3, the voltage applied to the semiconductor refrigeration chip is 3V, and the heat dissipation time of the engine is 2 minutes; the second temperature control mode can be understood. In order to turn on the 2/3 semiconductor refrigerating sheet, the voltage applied to the semiconductor refrigerating sheet is 6V and the heat dissipation time of the engine is 5 minutes; the third temperature control mode can be understood as turning on all the semiconductor refrigerating sheets, plus The voltage on the semiconductor cooling sheet was 12 V and the heat dissipation time for the engine was 10 minutes.

In the temperature control mode of the semiconductor refrigeration component corresponding to the preset temperature range matched by the current temperature of the engine, during the heat dissipation operation of the engine, when the temperature control mode of the semiconductor refrigeration component is operated to the preset time, the detection is performed. Whether the preset temperature interval matched by the current temperature of the engine changes, and if it is determined that the preset temperature interval matched by the current temperature of the engine does not change, controlling the semiconductor refrigeration component to continue to match the preset temperature interval according to the current temperature Performing a heat dissipation operation on the engine, and if it is determined that the preset temperature range matched by the current temperature of the engine changes, controlling the semiconductor refrigeration component according to a temperature control mode corresponding to a preset temperature range in which the temperature changes currently changing, The engine performs a heat dissipation operation. For example, obtaining the current temperature of the engine is 80 ° C, and by matching with the temperature value in the preset temperature interval in the device, determining that the current temperature of the engine matches the preset temperature interval is 50 ° C < T1 ≤ 80 ° C And determining, according to the preset temperature interval of 50 ° C < T1 ≤ 80 ° C, using the second temperature control mode to perform heat dissipation operation on the engine, and in the heat dissipation process of the engine according to the second temperature control mode, reaching the second temperature When the heat dissipation time set in the control mode is 5 minutes, the current temperature of the engine is detected to be 45 ° C, and the engine is subjected to heat dissipation operation according to the first temperature control mode in which the current temperature of the engine is 45 ° C, and so on. I will not repeat them here.

In this embodiment, the current temperature of the engine is obtained to determine whether the current temperature is greater than a preset temperature threshold. When the current temperature is greater than the preset temperature threshold, the preset temperature interval matched by the current temperature of the engine is determined, and the matched preset temperature interval is adopted. The temperature control mode of the corresponding semiconductor refrigeration component performs a heat dissipation operation on the engine. Since the present invention pre-stages the temperature that can be achieved by the engine during operation into a plurality of preset temperature intervals, each preset temperature interval corresponds to a temperature control mode of a semiconductor refrigeration component, and each interval is preset after starting the engine operation. Time detecting the current temperature of the engine, determining a preset temperature interval in which the current temperature of the engine matches, and performing heat dissipation operation on the engine according to the temperature control mode of the semiconductor refrigeration component according to the preset temperature interval, thereby not only reducing the heat dissipation cost, but also This makes the heat dissipation of the engine finer, thus ensuring that the engine can operate at normal temperature.

Further, based on the first embodiment described above, referring to FIG. 2, a schematic flowchart of a second embodiment of a method for controlling engine temperature according to the present invention is proposed. In the second embodiment, the engine temperature is simultaneously performed while the S30 is being executed. The control methods include:

In step S40, the semiconductor refrigeration component is directly connected to the battery to transfer the power generated by the semiconductor refrigeration component to the battery connected to the semiconductor refrigeration component, wherein the semiconductor refrigeration component converts the absorbed heat into a quantity of electricity.

In this embodiment, each of the temperature difference semiconductor wafers in the conductor refrigeration assembly is associated with each of the semiconductor refrigeration sheets in the conductor refrigeration assembly, wherein the end of the temperature difference semiconductor wafer associated with the hot end of the semiconductor refrigeration sheet absorbs the semiconductor refrigeration sheet. The heat released from the hot end forms a temperature difference from the cold end of the temperature difference semiconductor piece, and the temperature difference semiconductor piece converts the absorbed heat into a quantity according to the Seebeck effect, and turns on the temperature difference semiconductor piece in the semiconductor refrigeration component and the device The battery is connected to transfer the amount of electricity generated by the temperature difference semiconductor chip to the battery connected to the semiconductor refrigeration unit. The present invention does not limit the low temperature holding mode of the cold end of the temperature difference semiconductor.

It can be understood that when the first temperature control mode of the semiconductor refrigeration component is activated, 1/3 of the semiconductor refrigeration chip is turned on in the first temperature control mode, and the heat absorbed when the temperature difference semiconductor chip is energized When converting into a quantity of electricity, the temperature difference semiconductor piece that is consistent with the number and position of the semiconductor cooling fins of the first temperature control mode may be turned on; when the second temperature control mode or the third temperature control mode of the semiconductor refrigeration component is activated. For the manner in which the number and position of the temperature difference semiconductor chips are turned on, the manner in which the number and position of the temperature difference semiconductor chips are turned on in the first temperature control mode can be referred to, and details are not described herein again.

The present embodiment directly connects the semiconductor refrigeration unit to the battery to transfer the amount of electricity generated by the semiconductor refrigeration unit to the battery to which the semiconductor refrigeration unit is connected, wherein the semiconductor refrigeration unit converts the absorbed heat into a quantity of electricity. Due to the association between the hot end of the temperature difference semiconductor wafer in the semiconductor refrigeration module and the hot end of the semiconductor refrigeration chip, the temperature difference semiconductor wafer recovers the waste heat of the engine absorbed, and converts the absorbed heat into a current according to the Seebeck effect. Thereby realizing resource reuse and avoiding waste of resources.

Further, based on the first embodiment described above, referring to FIG. 3, a schematic flowchart of a third embodiment of a method for controlling engine temperature according to the present invention is proposed. In the third embodiment, before S30, the method for controlling the engine temperature includes :

In step S50, when the current temperature is greater than the temperature of all the preset temperature intervals, the heat dissipation operation is performed on the engine according to the temperature control mode corresponding to the preset temperature range with the highest temperature, and an alarm operation is performed.

When the current temperature of the engine is greater than all preset temperature intervals, such as greater than 100 ° C, the engine is dissipated according to the temperature control mode corresponding to the highest temperature preset temperature interval, for example, according to the pre-position of 100 ° C The third temperature control mode corresponding to the temperature interval is used to perform heat dissipation operation on the engine, and at the same time, an alarm command is sent to the alarm system in the device to perform an alarm until the current temperature of the acquired engine matches the corresponding preset temperature interval.

It should be noted that when it is determined that the current temperature of the engine is less than the preset temperature threshold, for example, when it is detected that the current temperature of the engine is less than the normal temperature of 25 ° C, the semiconductor refrigeration component is stopped to perform a heat dissipation operation on the engine, thereby The engine can work at room temperature.

In this embodiment, when the current temperature is greater than the temperature of all the preset temperature intervals, the heat dissipation operation is performed on the engine according to the temperature control mode corresponding to the preset temperature range with the highest temperature, and an alarm operation is performed, by lowering the temperature of the transmitter. To avoid the problem that the engine is prone to aging when it is operated under high temperature for a long time.

Further, based on any of the above embodiments, please refer to FIG. 4, which is a schematic flowchart of a fourth embodiment of a method for controlling engine temperature according to the present invention. In the fourth embodiment, a method for controlling engine temperature includes:

Step S11, obtaining a current temperature of the engine, and determining whether the current temperature is greater than a preset temperature threshold;

Step S12, determining a preset temperature interval that the current temperature of the engine matches when the current temperature is greater than the preset temperature threshold;

Step S11 and step S12 in the third embodiment of the present invention are similar to those described in step S10 and step S20 in the first embodiment shown in FIG. 1, and details are not described herein again.

In step S13, the heat dissipation operation is performed by using the heat dissipation duration corresponding to the matched preset temperature interval and/or the number of the cooling sheets in the semiconductor refrigeration unit.

In this embodiment, when it is detected that the current temperature of the engine is a certain temperature, the temperature control mode of the semiconductor refrigeration component corresponding to the preset temperature interval matched with the temperature is adopted, and the temperature control mode of the semiconductor refrigeration component is corresponding to The heat dissipation time and/or the number of cooling fins in the semiconductor refrigeration unit heats the engine. For example, when the engine is running at a lower temperature ambient temperature, the current temperature of the engine is detected to be 75 ° C, and the second temperature control corresponding to the preset temperature interval of 50 ° C < T1 ≤ 80 ° C matched with the 75 ° C is adopted. The mode performs a heat dissipation operation on the engine, and the number of the cooling sheets in the semiconductor refrigeration unit corresponding to the second temperature control mode and the heat dissipation time corresponding to the second temperature control mode are used to dissipate the engine during the heat dissipation process; When the engine is running at a higher temperature ambient temperature, the current temperature of the engine is detected to be 75 ° C, and the second temperature control mode corresponding to the predetermined temperature interval of 50 ° C < T1 ≤ 80 ° C matched with the 75 ° C is used. The engine performs a heat dissipation operation, and the heat dissipation operation is performed on the engine by using the number of the cooling fins in the semiconductor refrigeration unit corresponding to the second temperature control mode during the heat dissipation process, but the heat dissipation duration corresponding to the second temperature control mode is not limited.

In this embodiment, the current temperature of the engine is obtained to determine whether the current temperature is greater than a preset temperature threshold. When the current temperature is greater than the preset temperature threshold, the preset temperature interval matched by the current temperature of the engine is determined, and the matched preset temperature interval is adopted. The corresponding heat dissipation time and/or the number of the cooling fins in the semiconductor refrigeration unit perform heat dissipation operation to avoid excessive absorption of heat of the engine or insufficient heat dissipation, thereby causing an operational burden on the engine.

Further, based on the above four embodiments, please refer to FIG. 5, which is a schematic flowchart of the refinement step of step S13 in the fourth embodiment of the present invention. The refinement step of step S13 includes:

Step S131, obtaining a number of cooling pieces corresponding to the matched preset temperature interval;

In this embodiment, when determining a preset temperature interval in which the current temperature of the engine matches, acquiring a temperature control mode of the semiconductor refrigeration component corresponding to the preset temperature interval, and obtaining a temperature control mode of the semiconductor refrigeration component needs to be turned on. The number of semiconductor refrigeration sheets.

It can be understood that, in order to achieve better heat dissipation effect, the number of semiconductor cooling fins corresponding to each temperature control mode of the semiconductor refrigeration component is different, and the positions of the semiconductor cooling fins corresponding to the respective temperature control modes are also different. The design of the position of the semiconductor refrigerating sheet is related to the structure of the engine, and the position of the semiconductor refrigerating sheet of the present invention is not limited.

Step S132, powering on the cooling sheet corresponding to the number of cooling pieces obtained in the semiconductor refrigeration unit, and controlling the heat dissipation time corresponding to the preset temperature interval matched by the cooling operation of the cooling piece, and then powering down to perform heat dissipation operation on the engine.

When the number of semiconductor refrigerating sheets corresponding to the temperature control mode of the semiconductor refrigeration unit matched with the preset temperature interval is obtained, the semiconductor refrigerating sheet is powered on, the heat dissipation operation is performed on the engine, and the heat dissipation operation is performed to the temperature of the semiconductor refrigeration unit. When the preset heat dissipation duration corresponding to the control mode is controlled, the semiconductor cooling chip is controlled to be powered down.

In this embodiment, after the number of the cooling pieces corresponding to the preset preset temperature interval is obtained, the cooling piece corresponding to the number of the cooling pieces obtained in the semiconductor refrigeration component is powered on, and the heat dissipation time corresponding to the preset temperature interval matched by the cooling operation of the cooling piece is controlled. Power down to dissipate heat from the engine, allowing the engine to operate stably at normal operating temperatures.

The invention further provides a control system for engine temperature.

Referring to Figure 6, Figure 6 is a schematic diagram of the functional modules of the first embodiment of the engine temperature control system of the present invention.

In this embodiment, the engine temperature control system includes: a first determining module 10, a second determining module 20, and a first heat dissipation module 30.

The first determining module 10 is configured to acquire a current temperature of the engine, and determine whether the current temperature is greater than a preset temperature threshold;

In this embodiment, when detecting the engine start of the device, if the engine start of the automobile is detected, the first determining module 10 acquires the current temperature of the engine every preset time interval, and determines whether the current temperature of the engine is greater than the pre-predetermined time. Set the temperature threshold. Wherein, the preset temperature threshold may be a normal temperature of 25 ° C, or may be a temperature that ensures the normal operation of the engine.

The second determining module 20 is configured to determine a preset temperature interval that matches a current temperature of the engine when the current temperature is greater than the preset temperature threshold;

A plurality of preset temperature intervals are preset in the device, for example, 25 ° C < T1 ≤ 50 ° C, 50 ° C < T1 ≤ 80 ° C and 80 ° C < T1 ≤ 100 ° C. When the first determining module 10 determines that the current temperature of the engine is greater than the preset temperature threshold, the second determining module 20 compares the current temperature value of the engine with each temperature in the preset temperature interval to determine the current temperature of the engine. The preset temperature range that is matched.

The first heat dissipation module 30 is configured to perform heat dissipation operation on the engine by using a temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval.

The temperature control mode corresponding to one semiconductor refrigeration component is set in the device in advance, and after the second determining module 20 determines the preset temperature interval that the current temperature of the engine matches, the first heat dissipation module 30. From a temperature control mode of the semiconductor refrigeration component preset in the device, selecting a preset temperature interval matched to the current temperature corresponds to a temperature control mode of the semiconductor refrigeration component, and the engine is controlled according to a temperature control mode of the semiconductor refrigeration component Perform heat dissipation operations. The outer surface of the engine is bonded with a plurality of semiconductor refrigerating sheets. The cooling principle of the semiconductor refrigerating sheet is to attach the cold end of the semiconductor refrigerating sheet to the outside of the engine, and the hot end and the temperature difference semiconductor sheet power generating sheet in the semiconductor refrigerating unit are performed. In association, when the semiconductor refrigerating sheet is energized, the cold end of the semiconductor refrigerating sheet absorbs excess heat generated by the engine, and the hot end of the semiconductor refrigerating sheet exotherms to perform a heat dissipating operation on the engine. The number of the semiconductor refrigerating sheets depends on the actual conditions of the engine, and the number of the semiconductor refrigerating sheets is not limited in this embodiment.

It should be noted that when the semiconductor refrigerating sheet is energized, the voltage applied to the semiconductor refrigerating sheet is larger, the longer the heat dissipation time of the engine is, and/or the more the amount of energization of the semiconductor refrigerating sheet is, the more the engine is The better the heat dissipation effect, the different temperature control modes of the semiconductor refrigeration components correspond to different preset temperature intervals to achieve heat dissipation operation for different current temperatures of the engine. In the preset temperature range, the temperature control mode of the specific semiconductor refrigeration component of the device is matched as shown in Table 1.

Table 1

Preset temperature interval	Temperature control mode of semiconductor refrigeration components
25°C<T1≤50°C	First temperature control mode
50 ° C < T1 ≤ 80 ° C	Second temperature control mode
80°C<T1≤100°C	Third temperature control mode

The first temperature control mode can be understood as a semiconductor refrigeration chip that is turned on by 1/3, the voltage applied to the semiconductor refrigeration chip is 3V, and the heat dissipation time of the engine is 2 minutes; the second temperature control mode can be understood. In order to turn on the 2/3 semiconductor refrigerating sheet, the voltage applied to the semiconductor refrigerating sheet is 6V and the heat dissipation time of the engine is 5 minutes; the third temperature control mode can be understood as turning on all the semiconductor refrigerating sheets, plus The voltage on the semiconductor cooling sheet was 12 V and the heat dissipation time for the engine was 10 minutes.

In the temperature control mode of the semiconductor refrigeration component corresponding to the preset temperature range matched by the current temperature of the engine, during the heat dissipation operation of the engine, when the temperature control mode of the semiconductor refrigeration component is operated to the preset time, the detection is performed. Whether the preset temperature interval matched by the current temperature of the engine changes, and if it is determined that the preset temperature interval matched by the current temperature of the engine does not change, controlling the semiconductor refrigeration component to continue to match the preset temperature interval according to the current temperature Performing a heat dissipation operation on the engine, and if it is determined that the preset temperature range matched by the current temperature of the engine changes, controlling the semiconductor refrigeration component according to a temperature control mode corresponding to a preset temperature range in which the temperature changes currently changing, The engine performs a heat dissipation operation. For example, obtaining the current temperature of the engine is 80 ° C, and by matching with the temperature value in the preset temperature interval in the device, determining that the current temperature of the engine matches the preset temperature interval is 50 ° C < T1 ≤ 80 ° C And determining, according to the preset temperature interval of 50 ° C < T1 ≤ 80 ° C, using the second temperature control mode to perform heat dissipation operation on the engine, and in the heat dissipation process of the engine according to the second temperature control mode, reaching the second temperature When the heat dissipation time set in the control mode is 5 minutes, the current temperature of the engine is detected to be 45 ° C, and the engine is subjected to heat dissipation operation according to the first temperature control mode in which the current temperature of the engine is 45 ° C, and so on. I will not repeat them here.

The first heat dissipation module 30 is further configured to perform a heat dissipation operation by using a matching heat dissipation time period corresponding to the preset temperature interval and/or the number of the cooling sheets in the semiconductor refrigeration component.

In this embodiment, when it is detected that the current temperature of the engine is a certain temperature, the first heat dissipation module 30 adopts a temperature control mode of the semiconductor refrigeration component corresponding to the preset temperature interval matched by the temperature, and passes through the semiconductor refrigeration component. The temperature control mode corresponds to the heat dissipation time and/or the number of cooling fins in the semiconductor refrigeration unit to perform heat dissipation operation on the engine. For example, when the engine is running at a lower temperature ambient temperature, the current temperature of the engine is detected to be 75 ° C, and the second temperature control corresponding to the preset temperature interval of 50 ° C < T1 ≤ 80 ° C matched with the 75 ° C is adopted. The mode performs a heat dissipation operation on the engine, and the number of the cooling sheets in the semiconductor refrigeration unit corresponding to the second temperature control mode and the heat dissipation time corresponding to the second temperature control mode are used to dissipate the engine during the heat dissipation process; When the engine is running at a higher temperature ambient temperature, the current temperature of the engine is detected to be 75 ° C, and the second temperature control mode corresponding to the predetermined temperature interval of 50 ° C < T1 ≤ 80 ° C matched with the 75 ° C is used. The engine performs a heat dissipation operation, and the heat dissipation operation is performed on the engine by using the number of the cooling fins in the semiconductor refrigeration unit corresponding to the second temperature control mode during the heat dissipation process, but the heat dissipation duration corresponding to the second temperature control mode is not limited.

The first heat dissipation module 30 is further configured to obtain a number of cooling pieces corresponding to the matched preset temperature interval;

In this embodiment, when determining a preset temperature interval in which the current temperature of the engine matches, the first heat dissipation module 30 acquires a temperature control mode of the semiconductor refrigeration component corresponding to the preset temperature interval, thereby acquiring the temperature of the semiconductor refrigeration component. The number of semiconductor cooling fins that need to be turned on in the control mode.

It can be understood that, in order to achieve better heat dissipation effect, the number of semiconductor cooling fins corresponding to each temperature control mode of the semiconductor refrigeration component is different, and the positions of the semiconductor cooling fins corresponding to the respective temperature control modes are also different. The design of the position of the semiconductor refrigerating sheet is related to the structure of the engine, and the position of the semiconductor refrigerating sheet of the present invention is not limited.

The first heat dissipation module 30 is further configured to power on the cooling sheet corresponding to the number of cooling pieces obtained in the semiconductor refrigeration component, and control the heat dissipation time corresponding to the preset temperature interval matched by the cooling operation of the cooling piece, and then power down to the engine. Perform heat dissipation operations.

When acquiring the number of semiconductor refrigeration sheets corresponding to the temperature control mode of the semiconductor refrigeration component that matches the preset temperature interval, the first heat dissipation module 30 powers up the semiconductor refrigeration chip, performs a heat dissipation operation on the engine, and performs the heat dissipation operation to the When the temperature control mode of the semiconductor refrigeration component corresponds to a preset heat dissipation time, the semiconductor cooling chip is controlled to be powered down.

In this embodiment, the first determining module 10 obtains the current temperature of the engine, and determines whether the current temperature is greater than a preset temperature threshold. When the current temperature is greater than the preset temperature threshold, the second determining module 20 determines a preset that matches the current temperature of the engine. In the temperature interval, the first heat dissipation module 30 performs a heat dissipation operation on the engine by using a temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval. Since the present invention pre-stages the temperature that can be achieved by the engine during operation into a plurality of preset temperature intervals, each preset temperature interval corresponds to a temperature control mode of a semiconductor refrigeration component, and each interval is preset after starting the engine operation. Time detecting the current temperature of the engine, determining a preset temperature interval in which the current temperature of the engine matches, and performing heat dissipation operation on the engine according to the temperature control mode of the semiconductor refrigeration component according to the preset temperature interval, thereby not only reducing the heat dissipation cost, but also This makes the heat dissipation of the engine finer, thus ensuring that the engine can operate at normal temperature.

Further, based on the first embodiment, a second embodiment of the control system for the engine temperature of the present invention is proposed. In the present embodiment, referring to FIG. 7, the engine temperature control system further includes: a connection module 40.

The connection module 40 is configured to conduct a direct connection between the semiconductor refrigeration component and the battery to transfer the power generated by the semiconductor refrigeration component to the battery connected to the semiconductor refrigeration component, wherein the semiconductor refrigeration component converts the absorbed heat into a quantity of electricity.

In this embodiment, each of the temperature difference semiconductor wafers in the conductor refrigeration assembly is associated with each of the semiconductor refrigeration sheets in the conductor refrigeration assembly, wherein the end of the temperature difference semiconductor wafer associated with the hot end of the semiconductor refrigeration sheet absorbs the semiconductor refrigeration sheet. The heat released from the hot end forms a temperature difference from the cold end of the temperature difference semiconductor piece, and the temperature difference semiconductor piece converts the absorbed heat into a quantity according to the Seebeck effect, and the connection module 40 turns on the temperature difference semiconductor piece in the semiconductor refrigeration component and the The connection of the battery in the device is to transfer the amount of electricity generated by the temperature difference semiconductor chip to the battery connected to the semiconductor refrigeration unit. The present invention does not limit the low temperature holding mode of the cold end of the temperature difference semiconductor.

It can be understood that when the first temperature control mode of the semiconductor refrigeration component is activated, 1/3 of the semiconductor refrigeration chip is turned on in the first temperature control mode, and the heat absorbed when the temperature difference semiconductor chip is energized When converting into a quantity of electricity, the temperature difference semiconductor piece that is consistent with the number and position of the semiconductor cooling fins of the first temperature control mode may be turned on; when the second temperature control mode or the third temperature control mode of the semiconductor refrigeration component is activated. For the manner in which the number and position of the temperature difference semiconductor chips are turned on, the manner in which the number and position of the temperature difference semiconductor chips are turned on in the first temperature control mode can be referred to, and details are not described herein again.

The present embodiment directly connects the semiconductor refrigeration unit to the battery to transfer the amount of electricity generated by the semiconductor refrigeration unit to the battery to which the semiconductor refrigeration unit is connected, wherein the semiconductor refrigeration unit converts the absorbed heat into a quantity of electricity. Due to the association between the hot end of the temperature difference semiconductor wafer in the semiconductor refrigeration module and the hot end of the semiconductor refrigeration chip, the temperature difference semiconductor wafer recovers the waste heat of the engine absorbed, and converts the absorbed heat into a current according to the Seebeck effect. Thereby realizing resource reuse and avoiding waste of resources.

Further, based on the first embodiment, a third embodiment of the control system for the engine temperature of the present invention is proposed. In the present embodiment, referring to FIG. 8, the engine temperature control system further includes: a second heat dissipation module 50.

The second heat dissipation module 50 is configured to perform a heat dissipation operation on the engine according to a temperature control mode corresponding to a preset temperature range with the highest temperature when the current temperature is greater than the temperature of all the preset temperature intervals, and perform an alarm operation.

When the current temperature of the engine is greater than all the preset temperature intervals, such as greater than 100 ° C, the second heat dissipation module 50 performs a heat dissipation operation on the engine according to a temperature control mode corresponding to the highest temperature preset temperature interval, for example, according to The third temperature control mode corresponding to the preset temperature range where 100 °C is located performs heat dissipation operation on the engine, and at the same time, sends an alarm command to the alarm system in the device to perform an alarm until the current temperature of the obtained engine matches the corresponding pre- Set the temperature range.

It should be noted that when it is determined that the current temperature of the engine is less than the preset temperature threshold, for example, when it is detected that the current temperature of the engine is less than the normal temperature of 25 ° C, the semiconductor refrigeration component is stopped to perform a heat dissipation operation on the engine, thereby The engine can work at room temperature.

In this embodiment, when the current temperature is greater than the temperature of all the preset temperature intervals, the heat dissipation operation is performed on the engine according to the temperature control mode corresponding to the preset temperature range with the highest temperature, and an alarm operation is performed, by lowering the temperature of the transmitter. To avoid the problem that the engine is prone to aging when it is operated under high temperature for a long time.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalent structure or equivalent process transformations made by the description of the present invention and the drawings are directly or indirectly applied to other related technical fields. The same is included in the scope of patent protection of the present invention.

Claims (13)

1. A method for controlling engine temperature, characterized in that the outer surface of the engine is provided with a semiconductor refrigeration assembly, and the method for controlling the temperature of the engine comprises the following steps:

   Obtaining a current temperature of the engine, determining whether the current temperature is greater than a preset temperature threshold;

   Determining a preset temperature interval that the current temperature of the engine matches when the current temperature is greater than a preset temperature threshold;

   Performing a heat dissipation operation on the engine by using a temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval, and conducting a direct connection between the semiconductor refrigeration component and the battery to transmit the power generated by the semiconductor refrigeration component to The battery to which the semiconductor refrigeration unit is connected, wherein the semiconductor refrigeration unit converts the absorbed heat into a quantity of electricity;

   When the current temperature is greater than the temperature of all the preset temperature intervals, the heat dissipation operation is performed on the engine according to the temperature control mode corresponding to the preset temperature range with the highest temperature, and an alarm operation is performed.
2. The engine temperature control method according to claim 1, wherein the temperature control mode of the semiconductor refrigeration component comprises a preset heat dissipation time period and/or a preset number of semiconductor refrigeration and cooling fins, and the matching is performed. The step of the temperature control mode of the semiconductor refrigeration component corresponding to the preset temperature interval is to perform a heat dissipation operation on the engine, including:

   The heat dissipation operation is performed by matching the heat dissipation duration corresponding to the preset temperature interval and/or the number of refrigerant sheets in the semiconductor refrigeration unit.
3. The engine temperature control method according to claim 2, wherein the step of performing a heat dissipation operation by using a matching heat dissipation time period corresponding to the preset temperature interval and/or the number of the cooling fins in the semiconductor refrigeration unit comprises:

   Obtaining the number of cooling pieces corresponding to the preset preset temperature interval;

   And charging the cooling sheet corresponding to the number of the cooling pieces obtained in the semiconductor refrigeration unit, and controlling the cooling piece to power on the matching heat-preserving time interval corresponding to the matched preset temperature interval, and then powering down to perform heat dissipation operation on the engine .
4. A method for controlling engine temperature, characterized in that the outer surface of the engine is provided with a semiconductor refrigeration assembly, and the method for controlling the temperature of the engine comprises the following steps:

   Obtaining a current temperature of the engine, determining whether the current temperature is greater than a preset temperature threshold;

   Determining a preset temperature interval that the current temperature of the engine matches when the current temperature is greater than a preset temperature threshold;

   The engine is subjected to a heat dissipation operation using a temperature control mode of the semiconductor refrigeration unit corresponding to the matched preset temperature interval.
5. The engine temperature control method according to claim 4, wherein the step of performing a heat dissipation operation on the engine by using a temperature control mode of the semiconductor refrigeration unit corresponding to the matched preset temperature interval is performed:

   Directly connecting the semiconductor refrigeration component to the battery to transfer the amount of electricity generated by the semiconductor refrigeration component to a battery connected to the semiconductor refrigeration component, wherein the semiconductor refrigeration component converts the absorbed heat into a quantity of electricity.
6. The method of controlling the engine temperature according to claim 4, wherein the step of performing a heat dissipation operation on the engine by using a temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval further comprises:

   When the current temperature is greater than the temperature of all the preset temperature intervals, the heat dissipation operation is performed on the engine according to the temperature control mode corresponding to the preset temperature range with the highest temperature, and an alarm operation is performed.
7. The engine temperature control method according to claim 4, wherein the temperature control mode of the semiconductor refrigeration component comprises a preset heat dissipation time period and/or a preset number of semiconductor refrigeration and cooling sheets, and the matching is performed. The step of the temperature control mode of the semiconductor refrigeration component corresponding to the preset temperature interval is to perform a heat dissipation operation on the engine, including:

   The heat dissipation operation is performed by matching the heat dissipation duration corresponding to the preset temperature interval and/or the number of refrigerant sheets in the semiconductor refrigeration unit.
8. The engine temperature control method according to claim 7, wherein the step of performing a heat dissipation operation by using a matching heat dissipation time period corresponding to the preset temperature interval and/or the number of the cooling fins in the semiconductor refrigeration unit comprises:

   Obtaining the number of cooling pieces corresponding to the preset preset temperature interval;

   And charging the cooling sheet corresponding to the number of the cooling pieces obtained in the semiconductor refrigeration unit, and controlling the cooling piece to power on the matching heat-preserving time interval corresponding to the matched preset temperature interval, and then powering down to perform heat dissipation operation on the engine .
9. A control system for engine temperature, characterized in that the outer surface of the engine is provided with a semiconductor refrigeration component, and the control system of the engine temperature comprises:

   a first determining module, configured to acquire a current temperature of the engine, and determine whether the current temperature is greater than a preset temperature threshold;

   a second determining module, configured to determine a preset temperature interval that matches a current temperature of the engine when the current temperature is greater than a preset temperature threshold;

   The first heat dissipation module is configured to perform a heat dissipation operation on the engine by using a temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval.
10. The engine temperature control system of claim 9 wherein said engine temperature control system further comprises:

    a connection module, configured to conduct a direct connection between the semiconductor refrigeration component and the battery, to transfer power generated by the semiconductor refrigeration component to a battery connected to the semiconductor refrigeration component, wherein the semiconductor refrigeration component will absorb heat Convert to power.
11. The engine temperature control system of claim 9 wherein said engine temperature control system further comprises:

    a second heat dissipation module, configured to perform heat dissipation operation on the engine according to a temperature control mode corresponding to the preset temperature range with the highest temperature when the current temperature is greater than a temperature of all the preset temperature intervals, and perform an alarm operating.
12. The engine temperature control system according to claim 9, wherein the temperature control mode of the semiconductor refrigeration component comprises a preset heat dissipation time and/or a preset number of semiconductor refrigeration fins, the first heat dissipation Module, also used to:

    The heat dissipation operation is performed by matching the heat dissipation duration corresponding to the preset temperature interval and/or the number of refrigerant sheets in the semiconductor refrigeration unit.
13. The engine temperature control system according to claim 12, wherein the first heat dissipation module is further configured to:

    Obtaining the number of cooling pieces corresponding to the preset preset temperature interval;

    And charging the cooling sheet corresponding to the number of the cooling pieces obtained in the semiconductor refrigeration unit, and controlling the cooling piece to power on the matching heat-preserving time interval corresponding to the matched preset temperature interval, and then powering down to perform heat dissipation operation on the engine .