WO2017214995A1 - 抛光剂、铜件及其抛光处理方法 - Google Patents
抛光剂、铜件及其抛光处理方法 Download PDFInfo
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- WO2017214995A1 WO2017214995A1 PCT/CN2016/086285 CN2016086285W WO2017214995A1 WO 2017214995 A1 WO2017214995 A1 WO 2017214995A1 CN 2016086285 W CN2016086285 W CN 2016086285W WO 2017214995 A1 WO2017214995 A1 WO 2017214995A1
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- Prior art keywords
- parts
- polishing agent
- polishing
- copper
- water
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 98
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 69
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 20
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims abstract description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 30
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 24
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims abstract description 22
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract description 12
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229960000583 acetic acid Drugs 0.000 claims abstract description 11
- 239000012362 glacial acetic acid Substances 0.000 claims abstract description 11
- 235000006408 oxalic acid Nutrition 0.000 claims abstract description 11
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims abstract description 11
- 229910001380 potassium hypophosphite Inorganic materials 0.000 claims abstract description 7
- CRGPNLUFHHUKCM-UHFFFAOYSA-M potassium phosphinate Chemical compound [K+].[O-]P=O CRGPNLUFHHUKCM-UHFFFAOYSA-M 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims description 32
- 229910052802 copper Inorganic materials 0.000 claims description 32
- 238000005406 washing Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims 1
- 238000002161 passivation Methods 0.000 claims 1
- 239000004615 ingredient Substances 0.000 abstract description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005202 decontamination Methods 0.000 description 1
- 230000003588 decontaminative effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/06—Other polishing compositions
- C09G1/14—Other polishing compositions based on non-waxy substances
Definitions
- Polishing agent copper piece and polishing treatment method thereof
- the present invention relates to the field of iron surface treatment technology, and in particular, to a polishing agent, a copper member, and a polishing treatment method thereof.
- the surface treatment technology of the workpiece is usually applied.
- the surface treatment processes of copper, aluminum, iron and their alloys are well-established in a wide range of industries.
- most workpieces require pre-treatment before surface treatment, for example, cleaning, decontamination and degreasing, and metal workpieces for certain applications need to be polished.
- a safe and environmentally friendly polishing agent a copper member polishing treatment method, and a copper member obtained by polishing treatment are provided.
- a polishing agent comprising, by weight of 100 parts by weight, of the following components: a component comprising the following parts by weight: 5-10 parts of sodium hypophosphite or potassium hypophosphite, 2-10 parts of phosphoric acid, 10 -30 parts glacial acetic acid, 5-10 parts ethanol, 2-5 parts oxalic acid and the balance water.
- a copper member polishing treatment method comprising the steps of: formulating a polishing agent as described above; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to water in the polishing agent solution is 1: 1-2; The copper piece is immersed in the polishing agent solution, and after a predetermined daytime treatment, the copper piece is washed.
- An embodiment of the present invention provides a polishing agent for surface pretreatment of copper parts, comprising 100 parts by weight of the following components by weight: comprising the following parts by weight: 5-10 parts of sodium hypophosphite Or potassium hypophosphite, 2-10 parts of phosphoric acid, 10-30 parts of glacial acetic acid, 5-10 parts of ethanol, 2-5 parts of oxalic acid and the balance water.
- the parts by weight of the sodium hypophosphite or potassium hypophosphite are preferably 6-8 parts by weight.
- the weight fraction of the phosphoric acid is preferably 4-8 parts
- the weight fraction of the glacial acetic acid is preferably 15-25 parts
- the weight fraction of the ethanol is preferably 6-8 parts.
- the parts by weight of the oxalic acid are preferably 3-4 parts, and the polishing agent is used in a ratio of 1:1-1:2.
- Embodiments of the present invention also provide a copper member polishing treatment method, comprising the steps of: formulating a polishing agent as described above; dissolving the polishing agent in water to prepare a polishing agent solution, and polishing the polishing agent in the polishing agent solution
- the ratio of water preparation is 1: 1-2; the copper parts are immersed in the polishing agent solution, and after the predetermined daytime treatment, the copper parts are washed.
- the ratio of the polishing agent to water in the polishing agent solution is 1:1-2, and the predetermined daytime is 1-3 minutes. Further, after polishing, it is passivated, then washed with water and dried. After polishing, the temperature is controlled at 20 ° C - 25 ° C, that is, polishing at room temperature. Further, pretreatment such as degreasing and degreasing is performed before polishing.
- Embodiments of the present invention also provide a copper member which is subjected to a polishing treatment by a copper member polishing treatment method as described above to form a copper member to form a clean and bright surface.
- a polishing treatment method as described above to form a copper member to form a clean and bright surface.
- Embodiment 1 [0017] The ingredients are mixed in the following parts by weight (total amount of 100 parts by weight): 5 parts of sodium hypophosphite, 2 parts of phosphoric acid
- Processing method preparing a polishing agent; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1:1; the copper material is first degreased, after washing, and then The copper piece is immersed in the polishing agent solution, and after being treated for 3 minutes, the copper piece is washed, then passivated, washed with water, and dried.
- the ingredients are mixed in the following parts by weight (total 100 parts by weight): 7 parts of sodium hypophosphite, 4 parts of phosphoric acid
- Processing method preparing a polishing agent; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1:1; the copper material is first degreased, after washing, and then The copper piece is immersed in the polishing agent solution, and after being treated for 3 minutes, the copper piece is washed, then passivated, washed with water, and dried.
- the ingredients are mixed in the following parts by weight (total amount of 100 parts by weight): 9 parts of sodium hypophosphite, 6 parts of phosphoric acid
- Treatment method preparing a polishing agent; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1:1; the copper material is first degreased, after washing, and then The copper piece was immersed in the polishing agent solution, and after 3 minutes of treatment, the copper piece was washed, then passivated, and washed with water.
- the ingredients were mixed in the following parts by weight: 10 parts of sodium hypophosphite, 10 parts of phosphoric acid, 30 parts of glacial acetic acid, 10 parts of ethanol, 5 parts of oxalic acid and the balance of water.
- Processing method preparing a polishing agent; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1: 2; the copper piece is first degreased, after washing, and then Immerse the copper piece into the toss In the photo-solvent solution, after 3 minutes of treatment, the copper parts are washed, then passivated, washed with water, and dried.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
一种抛光剂、铜件及其抛光处理方法,抛光剂用于铜件表面预处理,以100重量份计,包括如下重量份数的成分:5-10份次磷酸钠或次磷酸钾,2-10份磷酸,10-30份冰醋酸,5-10份乙醇,2-5份草酸和余量水。经过上述抛光剂处理后,铜件表面清洁光亮,而且整个抛光处理方法工艺简单、环保,无NO 2逸出,操作方便,使用成本低。
Description
抛光剂、 铜件及其抛光处理方法 技术领域
[0001] 本发明涉及铁表面处理技术领域, 具体涉及一种抛光剂、 铜件及其抛光处理方 法。
背景技术
[0002] 为提高产品表面性能或者外观, 通常对工件表面处理技术。 例如, 铜、 铝、 铁 及其合金的表面处理工艺深入各行各业中。 而且, 大多数工件在进行表面处理 前还需要经过预处理, 例如, 进行清洗, 除污除油, 某些用途的金属工件还需 要进行抛光化处理。
[0003] 一般在机械加工及电子电气行业, 常见的有铜及铜合金清洁光亮处理, 即抛光 处理。 传统的抛光剂一般采用三酸处理, 即浓硝酸, 浓硫酸, 浓磷酸, 此三酸 污染大, 危险也大。
技术问题
[0004] 有鉴于此, 提供一种安全环保的抛光剂, 以及铜件抛光处理方法和经过抛光处 理后制得的铜件。
问题的解决方案
技术解决方案
[0005] 一种抛光剂, 以 100重量份计, 其包括如下重量份数的成分: 包括如下重量份 数的成分: 5-10份次磷酸钠或次磷酸钾, 2-10份磷酸, 10-30份冰醋酸, 5-10份乙 醇, 2-5份草酸和余量水。
[0006] 一种铜件抛光处理方法, 其包括下列步骤: 配制如上所述的抛光剂; 将抛光剂 溶于水中配制成抛光剂溶液, 在抛光剂溶液中抛光剂与水配制比例为 1 : 1-2; 将 铜件浸入抛光剂溶液中, 经过预定吋间处理后, 水洗铜件。
[0007] 以及, 一种铜件, 其表面通过如上所述的铜件抛光处理方法进行抛光。
发明的有益效果
有益效果
[0008] 经过上述抛光剂处理后, 铜件表面清洁光亮, 而且整个抛光处理方法工艺简单 、 环保, 无 NO 2逸出, 操作方便, 使用成本低。
本发明的实施方式
[0009] 以下将结合具体实施例对本发明进行详细说明。
[0010] 本发明实施例提供一种抛光剂, 用于铜件表面预处理, 以 100重量份计, 包括 如下重量份数的成分: 包括如下重量份数的成分: 5-10份次磷酸钠或次磷酸钾, 2-10份磷酸, 10-30份冰醋酸, 5-10份乙醇, 2-5份草酸和余量水。
[0011] 具体地, 所述次磷酸钠或次磷酸钾的重量份数优选为 6-8份。 所述磷酸的重量 份数优选为 4-8份, 所述冰醋酸的重量份数优选为 15-25份, 所述乙醇的重量份数 优选为 6-8份。 所述草酸的重量份数优选为 3-4份, 抛光剂使用吋与水配制比例为 1: 1-1: 2。
[0012] 在上述抛光剂中, 通过控制各成分配比平衡, 以达到较佳抛光效果。 次磷酸钠 或次磷酸钾稳定槽液 PH值, 磷酸、 冰醋酸、 草酸为主要抛光成分、 乙醇使工件 能够均匀的被抛光。
[0013] 本发明实施例还提供一种铜件抛光处理方法, 其包括下列步骤: 配制如上所述 的抛光剂; 将抛光剂溶于水中配制成抛光剂溶液, 在抛光剂溶液中抛光剂与水 配制比例为 1 : 1-2; 将铜件浸入抛光剂溶液中, 经过预定吋间处理后, 水洗铜件
, 干燥。
[0014] 具体地, 在抛光剂溶液中抛光剂与水配制比例为 1 : 1-2, 所述预定吋间为 1-3分 钟。 进一步地, 在经过抛光后, 再钝化, 然后水洗, 干燥。 抛光处理吋, 温度 控制在 20°C-25°C, 即常温下进行抛光处理。 更进一步地, 在抛光前, 先进行除 油脱酯等预处理。
[0015] 本发明实施例还提供一种铜件, 其通过如上所述的铜件抛光处理方法进行抛光 处理, 使铜件形成清洁光亮的表面。 经过上述抛光剂处理后, 铜件表面清洁光 亮, 而且整个抛光处理方法工艺简单、 环保, 无 NO 2逸出, 操作方便, 使用成 本低。
[0016] 实施例 1
[0017] 按照下列重量份数混合各成分 (总量为 100重量份) : 5份次磷酸钠, 2份磷酸
, 10份冰醋酸, 5份乙醇 ,2份草酸和余量水。
[0018] 处理方法: 配制好抛光剂; 将抛光剂溶于水中配制成抛光剂溶液, 在抛光剂溶 液中抛光剂与水配制比例为 1 : 1 ; 铜件先除油, 水洗处理后, 再将铜件浸入抛 光剂溶液中, 经过 3分钟处理后, 水洗铜件, 再钝化, 水洗, 干燥。
[0019] 经过上述抛光剂溶液处理后, 观察工件表面, 整个表面清洁光亮, 亮度比抛光 之前提高许多。
[0020] 实施例 2
[0021] 按照下列重量份数混合各成分 (总量为 100重量份) : 7份次磷酸钠, 4份磷酸
, 15份冰醋酸, 7份乙醇 ,3份草酸和余量水。
[0022] 处理方法: 配制好抛光剂; 将抛光剂溶于水中配制成抛光剂溶液, 在抛光剂溶 液中抛光剂与水配制比例为 1 : 1 ; 铜件先除油, 水洗处理后, 再将铜件浸入抛 光剂溶液中, 经过 3分钟处理后, 水洗铜件, 再钝化, 水洗, 干燥。
[0023] 经过上述抛光剂溶液处理后, 观察工件表面, 整个表面清洁光亮, 亮度比抛光 之前提高许多。
[0024] 实施例 3
[0025] 按照下列重量份数混合各成分 (总量为 100重量份) : 9份次磷酸钠, 6份磷酸
, 20份冰醋酸, 9份乙醇 ,4份草酸和余量水。
[0026] 处理方法: 配制好抛光剂; 将抛光剂溶于水中配制成抛光剂溶液, 在抛光剂溶 液中抛光剂与水配制比例为 1 : 1 ; 铜件先除油, 水洗处理后, 再将铜件浸入抛 光剂溶液中, 经过 3分钟处理后, 水洗铜件, 再钝化, 水洗。
[0027] 经过上述抛光剂溶液处理后, 观察工件表面, 整个表面清洁光亮, 亮度比抛光 之前提高许多。
[0028] 实施例 4
[0029] 按照下列重量份数混合各成分 (总量为 100重量份) : 10份次磷酸钠, 10份磷 酸, 30份冰醋酸, 10份乙醇, 5份草酸和余量水。
[0030] 处理方法: 配制好抛光剂; 将抛光剂溶于水中配制成抛光剂溶液, 在抛光剂溶 液中抛光剂与水配制比例为 1 : 2; 铜件先除油, 水洗处理后, 再将铜件浸入抛
光剂溶液中, 经过 3分钟处理后, 水洗铜件, 再钝化, 水洗, 干燥。
[0031] 经过上述抛光剂溶液处理后, 观察工件表面, 整个表面清洁光亮, 亮度比抛光 之前提高许多。
[0032] 需要说明的是, 本发明并不局限于上述实施方式, 根据本发明的创造精神, 本 领域技术人员还可以做出其他变化, 这些依据本发明的创造精神所做的变化, 都应包含在本发明所要求保护的范围之内。
Claims
[权利要求 1] 一种抛光剂, 其特征在于, 以 100重量份计, 包括如下重量份数的成 分: 5-10份次磷酸钠或次磷酸钾, 2-10份磷酸, 10-30份冰醋酸, 5-10 份乙醇, 2-5份草酸和余量水。
[权利要求 2] 如权利要求 1所述的抛光剂, 其特征在于, 所述次磷酸钠或次磷酸钾 的重量份数为 6-8份。
[权利要求 3] 如权利要求 1所述的抛光剂, 其特征在于, 所述磷酸的重量份数为 4-8 份。
[权利要求 4] 如权利要求 1所述的抛光剂, 其特征在于, 所述冰醋酸的重量份数为 1
5-25份。
[权利要求 5] 如权利要求 1所述的抛光剂, 其特征在于, 所述乙醇的重量份数为 6-8 份。
[权利要求 6] 如权利要求 1所述的抛光剂, 其特征在于, 所述草酸的重量份数为 3-4 份。
[权利要求 7] 如权利要求 1所述的抛光剂, 其特征在于, 所述抛光剂使用吋与水配 制比例为 1 : 1-1: 2。
[权利要求 8] 一种铜件抛光处理方法, 其包括下列步骤: 配制如权利要求 1-6任一 项所述的抛光剂; 将抛光剂溶于水中配制成抛光剂溶液, 在抛光剂溶 液中抛光剂与水配制比例为 1 : 1-1: 2; 将铜件浸入抛光剂溶液中, 使用震机不断的震动, 经过预定吋间处理后, 水洗铜件, 进入下一道 工序。
[权利要求 9] 如权利要求 7所述的铜件抛光处理方法, 其特征在于, 在经过抛光后 , 再钝化, 然后水洗干燥, 所述预定吋间为 1-3分钟。
[权利要求 10] 一种铜件, 其特征在于, 所述铜件表面通过如权利要求 8所述的铜件 抛光处理方法进行抛光。
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