WO2017193596A1 - Image matching method and system for printed circuit board - Google Patents

Image matching method and system for printed circuit board Download PDF

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Publication number
WO2017193596A1
WO2017193596A1 PCT/CN2016/113120 CN2016113120W WO2017193596A1 WO 2017193596 A1 WO2017193596 A1 WO 2017193596A1 CN 2016113120 W CN2016113120 W CN 2016113120W WO 2017193596 A1 WO2017193596 A1 WO 2017193596A1
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Prior art keywords
feature point
printed circuit
circuit board
image
template
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PCT/CN2016/113120
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French (fr)
Chinese (zh)
Inventor
杨铭
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广州视源电子科技股份有限公司
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Publication of WO2017193596A1 publication Critical patent/WO2017193596A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/001Industrial image inspection using an image reference approach
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30141Printed circuit board [PCB]

Definitions

  • the present invention relates to the field of optical detection technology, and in particular, to a printed circuit board image matching method and system.
  • the method based on template matching is to match the corresponding image block and template image by sliding the image window on the input image.
  • the common measurement method is NCC (Normalized Cross Correlation method).
  • NCC Normalized Cross Correlation method
  • this method can only match non-rotating boards, and image matching is not possible for boards that may have varying degrees of rotational variation in an online automated optical inspection environment.
  • the matching method based on SIFT/SURF operator is to eliminate noise by multi-scale decomposition based on linear Gaussian pyramid, and extract significant feature points, and then match the input image with the feature points of the template to complete the image matching.
  • this kind of method requires a lot of computation time and computational resources in the matching process, which not only slows the calculation, but also limits the usage scenario of the AOI, and also increases the computational hardware cost;
  • the feature detection algorithm such as SIFT/SURF is based on linearity.
  • the Gaussian pyramid performs multi-scale decomposition. This decomposition method sacrifices local precision, which is easy to cause boundary blur and detail loss, which leads to matching errors and other results.
  • the conventional printed circuit board image matching method has a slow calculation speed, a high hardware cost, and a low accuracy.
  • a printed circuit board image matching method includes the following steps:
  • the above-mentioned printed circuit board image matching method performs feature point extraction on the template image and the test pattern of the obtained target printed circuit board, respectively, to obtain a first feature point set of the template image and a second feature point set of the test pattern. Recalculating a similarity value between the first feature point of the first feature point set and the second feature point of the second feature point set, and performing the first feature point and the second feature point according to the similarity value Pairing, obtaining a pair of feature points; calculating a conversion matrix of the template pattern of the target printed circuit board to the test pattern according to the feature point pair, and using the conversion matrix to find a printed circuit matching the template image in the test pattern Board image.
  • the printed circuit board image matching method of the invention realizes the fast matching of the printed circuit board image, and effectively improves the accuracy of the printed circuit board image matching method.
  • a printed circuit board image matching system comprising:
  • An acquisition module configured to obtain a template image and a test chart of the target printed circuit board; wherein the template image is an angle corrected image of the target printed circuit board, and the test chart is the target printed circuit An unangled image of the board;
  • An extraction module configured to perform feature point extraction on the template image and the test image respectively, and acquire a first feature point set of the template image and a second feature point set of the test image;
  • a pairing module configured to calculate a similarity value between the first feature point of the first feature point set and the second feature point of the second feature point set, and the first feature point and the second feature point according to the similarity value Feature points are paired to obtain feature point pairs;
  • a matching module configured to calculate a conversion matrix of the template map of the target printed circuit board to the test pattern according to the feature point pair, and use the conversion matrix to search for a printed circuit board image in the test chart that matches the template image .
  • the printed circuit board image matching system feature extraction is performed on the template image and the test pattern of the target printed circuit board acquired by the acquisition module by the extraction module, and the first feature point set and the test chart of the template image are obtained. a second feature point set; and calculating, by the pairing module, the first feature point of the first feature point set and the second feature point of the second feature point set a similarity value between the first feature point and the second feature point according to the similarity value to obtain a feature point pair; finally, the matching module is used to calculate the target printed circuit according to the feature point pair
  • the template map of the board to the conversion matrix of the test pattern, and the conversion matrix is used to find the printed circuit board image in the test chart that matches the template image.
  • FIG. 1 is a flow chart of a method for matching printed circuit board images according to an embodiment of the present invention
  • FIG. 2 is a flow chart of a method for matching printed circuit board images according to another embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a printed circuit board image matching system according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a printed circuit board image matching system according to another embodiment of the present invention.
  • FIG. 1 is a flowchart of a method for matching a printed circuit board image according to an embodiment of the present invention, including the following steps:
  • Step S101 Acquire a template image and a test chart of the target printed circuit board; wherein the template image is an angle-corrected image of the target printed circuit board, and the test chart is the target printed circuit board An image without angle correction;
  • the template points and test patterns of the target printed circuit board are obtained to prepare for feature point extraction in the subsequent steps.
  • the template image described in this step may only include an angle corrected target printed circuit board image
  • the test image may include one or more target printed circuit board images, and each The image of the board is not angle corrected and may be scattered anywhere in the image; in addition, the target printed circuit board may not be included in the test chart.
  • the step 101 of acquiring a template image and a test pattern of the target printed circuit board may include:
  • the printed circuit board image matching method of the present invention does not output any image; if the test image includes N target printed circuit boards, the present invention The printed circuit board image matching method outputs the successfully printed printed circuit board image in N times.
  • Step S102 performing feature point extraction on the template image and the test image respectively, and acquiring a first feature point set of the template image and a second feature point set of the test image;
  • the feature point detection and extraction are performed on the obtained target printed circuit board template map and the test image respectively, and the first feature point set of the template image and the second feature point set of the test image are obtained, which is convenient for subsequent The step of pairing the above feature points.
  • the number of feature points of the first feature point set is not necessarily equal to the number of feature points of the second feature point set.
  • the first feature point set is obtained.
  • the number of feature points is 1000.
  • the number of feature points of the second feature point set may be 1500.
  • the main purpose is The 1000 feature points of the first feature point set and the 1500 feature points of the second feature point set are searched and paired.
  • Step S103 calculating a similarity value between the first feature point of the first feature point set and the second feature point of the second feature point set, and the first feature point and the second feature point according to the similarity value Pairing to obtain feature point pairs;
  • the first feature point set and the second feature point set are extracted and matched by the first feature point set extracted in step S102, that is, by calculating the first feature point and the second feature of the first feature point set. And a similarity value between the second feature points of the point set, according to the similarity value, finding feature points corresponding to the one-to-one correspondence between the template image and the test image, and composing the first feature point set and the second feature point set Feature point pairs.
  • Step S104 Calculate a conversion matrix of the template of the target printed circuit board to the test pattern according to the feature point pair, and use the conversion matrix to search for a printed circuit board image in the test chart that matches the template image.
  • step S103 After retrieving the pairing to obtain a plurality of sets of feature point pairs in step S103, calculating a conversion matrix of the template map of the target printed circuit board to the test pattern according to the first feature point and the second feature point of the feature point pair, and The conversion matrix is used to find an image of the target printed circuit board in the test chart that matches the template image.
  • the above-mentioned printed circuit board image matching method performs feature point extraction on the template image and the test pattern of the obtained target printed circuit board, respectively, to obtain a first feature point set of the template image and a second feature point set of the test pattern. ; calculate the first a similarity value between the first feature point of the feature point set and the second feature point of the second feature point set, and the first feature point and the second feature point are paired according to the similarity value to obtain a feature point And calculating a conversion matrix of the template of the target printed circuit board to the test pattern according to the feature point pair, and using the conversion matrix to search for a printed circuit board image in the test chart that matches the template image.
  • the printed circuit board image matching method of the invention realizes the fast matching of the printed circuit board image, and effectively improves the accuracy of the printed circuit board image matching method.
  • the calculation of the template of the target printed circuit board to the conversion matrix of the test image according to the feature point pair, and using the conversion includes:
  • the method further includes:
  • Step S105 Shielding the feature point pairs to match other printed circuit board images in the plurality of target printed circuit board images.
  • the test chart contains images of a plurality of printed circuit boards. After the image matching of one printed circuit board is completed, in order to avoid matching the images of other printed circuit boards, it is necessary to clear the previous pairs. Feature points involved in matching the target printed circuit board image.
  • the conversion matrix calculated by the previous round of matching can find the printed circuit board image area corresponding to the printed circuit board image in the template image in the test chart, that is, by the template image
  • the printed circuit board image, the printed circuit board image area in the test chart obtained through the conversion matrix mapping, masks the feature points in the area, and only considers the remaining feature points when performing other printed circuit board image matching. It can not only avoid the influence of the previous round, but also improve the efficiency of matching other printed circuit board images.
  • the technical solution of the embodiment achieves fast matching of multiple printed circuit board images and improves the working efficiency of the printed circuit board image matching method.
  • the step of performing feature point extraction on the template image and the test image respectively includes:
  • the nonlinear scale space of a single linguistic layer is constructed by using a KAZE operator, and the feature points are extracted from the template map and the test map by using the nonlinear scale space.
  • the printed circuit board image matching method of this embodiment uses a KAZE operator to pass nonlinear expansion.
  • the spatial filtering is used to construct a stable nonlinear scale space of a single linguistice layer, and the feature points are extracted from the template graph and the test graph by using the nonlinear scale space, and the calculation is greatly improved under the premise that the precision is relatively unchanged.
  • Efficiency moreover, the KAZE operator is used to construct the nonlinear scale space of a single Octave layer, and the feature points of the rotated circuit board image can be extracted, which facilitates image matching in subsequent steps and reduces the printed circuit board.
  • the hardware cost of the image matching method is used to construct a stable nonlinear scale space of a single Octave layer, and the feature points are extracted from the template graph and the test graph by using the nonlinear scale space, and the calculation is greatly improved under the premise that the precision is relatively unchanged.
  • Efficiency moreover, the KAZE operator is used to construct the nonlinear scale space of a single Octave layer, and
  • L represents the image brightness of the template or test pattern of the target printed circuit board
  • t represents the scale parameter
  • c(x, y, t) represents the conduction function
  • the extracted feature points are represented by feature vectors, and are prepared for pairing the feature points in the subsequent steps.
  • the printed circuit board image matching method of the present invention calculates the similarity value between the first feature point of the first feature point set and the second feature point of the second feature point set.
  • the steps can include:
  • the feature points in the first feature point set and the second feature point set may be obtained by using, for example, a KAZE operator.
  • the high-dimensional vector of the 64-dimensional feature is represented; and the first feature point of the first feature point set and the second feature point of the second feature point set are indexed and retrieved by using the multi-probe LSH index function, and finally the feature point pair is obtained.
  • FIG. 2 is a flowchart of a method for matching a printed circuit board image according to another embodiment of the present invention, and the step of obtaining feature point pairs of the first feature point set and the second feature point set is performed. After that, you can also include:
  • Step S106 Calculate a best matching distance and a second best matching distance between the first feature point and the second feature point in the feature point pair;
  • Step S107 Determine the reliability of the feature point pair by comparing the difference between the best matching distance and the sub-optimal matching distance and the preset threshold value, and filter the feature point pair according to the reliability.
  • the feature points of the first feature point set and the second feature point set are searched and paired by using the multi-probe LSH index to obtain features. After the point is paired, certain measures can be taken to re-evaluate the reliability of the obtained feature point pairs. In the implementation, determining the feature point pair by comparing the difference between the best matching distance of the first feature point and the second feature point in the feature point pair and the sub-optimal matching distance and the preset threshold value Reliability, filtering the feature point pairs according to reliability, effectively improving the accuracy of the printed circuit board image matching method, and further improving the efficiency of the printed circuit board image matching method of the present invention.
  • the printed circuit board image matching method of the present invention determines the feature point pair by comparing the difference between the best matching distance and the sub-optimal matching distance and the preset threshold value.
  • the step S107 of filtering the feature point pairs according to the reliability may include:
  • the difference between the best matching distance and the sub-optimal matching distance is greater than a preset threshold, determining that the feature point pair is reliable; otherwise, determining that the feature point pair is unreliable, and filtering the feature point pair.
  • the feature point pair whose difference between the best matching distance and the second best matching distance is greater than the preset threshold is retained, and the difference between the best matching distance and the second best matching distance is not greater than the preset threshold.
  • the culling is performed to improve the accuracy of the printed circuit board image matching method of the present invention, and further improves the working efficiency of the printed circuit board image matching method of the present invention.
  • the printed circuit board image matching method of the present invention may further include: after the step of using the conversion matrix to search for an image of the printed circuit board that matches the template image in the test image, the method further includes:
  • Step S108 Correcting the printed circuit board image in the test chart according to the target printed circuit board image in the template image.
  • the printed circuit board image in the test chart can be printed according to the target printed circuit board image in the template image.
  • Image correction methods such as geometric correction, angle correction, etc., including but not limited to.
  • the calculating the conversion matrix of the first feature point to the second feature point of the plurality of sets of feature point pairs comprises:
  • the method may further include:
  • a random sample set algorithm may be used to calculate a conversion matrix of a first feature point to a second feature point of a plurality of sets of feature point pairs, in order to accurately describe a template map of the target printed circuit board to a test map. Relationship, the set of feature points with the smallest selection error is the calculated conversion matrix as the template of the target printed circuit board to the conversion matrix of the test chart.
  • first feature point and the second feature point may be represented in the form of coordinates or vectors, which is also advantageous for calculating the first feature point to the second feature point according to the first feature point and the second feature point. Conversion matrix.
  • the shape of the target printed circuit board in the test chart can be filtered a priori.
  • the printed circuit board image matching method of the present invention may further include: after the step of using the conversion matrix to search for a target printed circuit board image that matches the template image in the test pattern,
  • Step S109 filtering the target printed circuit board image in the test chart that is inconsistent with the morphological feature of the target printed circuit board image in the template image by comparing the morphological features of the target printed circuit board image in the test chart and the template image.
  • the printed circuit board image matching method of the present invention can determine whether the image area of the mapped target printed circuit board in the test chart is still a convex polygon and its area and the template image aims The image area of the printed circuit board is roughly equivalent to determine whether the match is successful. If the matching is successful, the geometrically corrected printed circuit board image that is matched this time is output, otherwise the matching process is ended.
  • FIG. 3 is a schematic structural diagram of a printed circuit board image matching system according to an embodiment of the present invention, including:
  • An obtaining module 101 configured to acquire a template image and a test chart of the target printed circuit board; wherein the template image is an angle-corrected image of the target printed circuit board, and the test chart is the target printing An unangled image of the board;
  • the template image described in the obtaining module 101 may include only one angle corrected target printed circuit board image, and the test image may include one or more target printed circuit board images, and Each board image is not angularly corrected and may be scattered anywhere in the image; in addition, the target printed circuit board may not be included in the test chart.
  • the acquisition module 101 can also be used to:
  • the printed circuit board image matching system of the present invention does not output any image; if the test chart includes N target printed circuit boards, the present invention The printed circuit board image matching system outputs the successfully matched board image in N outputs.
  • the extracting module 102 is configured to perform feature point extraction on the template graph and the test graph, respectively, and obtain a first feature point set of the template graph and a second feature point set of the test graph;
  • the feature point detection and extraction are performed on the acquired target printed circuit board template image and the test image respectively, and the first feature point set of the template image and the second feature point set of the test image are obtained.
  • the above feature points are paired for the subsequent steps.
  • the number of feature points of the first feature point set is not necessarily equal to the number of feature points of the second feature point set.
  • the first feature point set is obtained.
  • the number of feature points is 1000.
  • the number of feature points of the second feature point set may be 1500.
  • the main purpose is The 1000 feature points of the first feature point set and the 1500 feature points of the second feature point set are searched and paired.
  • the pairing module 103 is configured to calculate a similarity value between the first feature point of the first feature point set and the second feature point of the second feature point set, and the first feature point and the first feature point according to the similarity value Two feature points are paired to obtain feature point pairs;
  • the first feature point set extracted by the extraction module 102 and the feature points in the second feature point set are search-matched, that is, by calculating the first feature point of the first feature point set and And a similarity value between the second feature points of the second feature point set, according to the similarity value, finding a feature point corresponding to the template map and the test image, and forming the first feature point set and the second feature A feature point pair of a point set.
  • the matching module 104 is configured to calculate a conversion matrix of the template map of the target printed circuit board to the test pattern according to the feature point pair, and use the conversion matrix to search for a printed circuit board that matches the template image in the test pattern. image.
  • step S103 After retrieving the pairing to obtain a plurality of sets of feature point pairs in step S103, calculating a conversion matrix of the template map of the target printed circuit board to the test pattern according to the first feature point and the second feature point of the feature point pair, and The conversion matrix is used to find an image of the target printed circuit board in the test chart that matches the template image.
  • feature extraction is performed on the template image and the test pattern of the target printed circuit board acquired by the acquisition module 101 by the extraction module 102, and the first feature point set and test of the template image are obtained.
  • a second set of feature points of the graph a second set of feature points of the graph; and calculating, by the pairing module 103, a similarity value between the first feature point of the first feature point set and the second feature point of the second feature point set, according to the similarity value pair
  • the first feature point and the second feature point are paired to obtain a feature point pair.
  • the matching module 104 calculates a conversion matrix of the target printed circuit board template to the test pattern according to the feature point pair, and utilizes The conversion matrix looks for a printed circuit board image in the test pattern that matches the template map.
  • the matching module 104 can also be used to:
  • the method may further include:
  • the shielding module 105 is configured to shield the feature point pairs to match other printed circuit board images in the plurality of target printed circuit board images.
  • the test chart contains images of a plurality of printed circuit boards, and a printed circuit board is completed. After the image is matched, in order to avoid matching the other printed circuit board images, it is necessary to clear the feature points involved in the previous matching of the target printed circuit board image.
  • the conversion matrix calculated by the previous round of matching can find the printed circuit board image area corresponding to the printed circuit board image in the template image in the test chart, that is, by the template image
  • the printed circuit board image, the printed circuit board image area in the test chart obtained through the conversion matrix mapping, masks the feature points in the area, and only considers the remaining feature points when performing other printed circuit board image matching. It can not only avoid the influence of the previous round, but also improve the efficiency of matching other printed circuit board images.
  • the technical solution of the embodiment achieves fast matching of multiple printed circuit board images and improves the working efficiency of the printed circuit board image matching method.
  • the extraction module 102 can also be used to:
  • the nonlinear scale space of a single linguistic layer is constructed by using a KAZE operator, and the feature points are extracted from the template map and the test map by using the nonlinear scale space.
  • the extraction module 102 of the printed circuit board image matching system of the present embodiment constructs a stable nonlinear scale space of a single Octave layer by nonlinear diffusion filtering using a KAZE operator, and utilizes the nonlinear scale space.
  • Feature point extraction is performed on the template graph and the test graph, and the computational efficiency is greatly improved under the premise that the precision is relatively unchanged; moreover, the nonlinear scale space of a single linguistice layer is constructed by using the KAZE operator, and the rotation can also be performed.
  • the feature points of the changed printed circuit board image are extracted, which facilitates image matching in subsequent steps, and reduces the hardware cost of the printed circuit board image matching system.
  • L represents the image brightness of the template or test pattern of the target printed circuit board
  • t represents the scale parameter
  • c(x, y, t) represents the conduction function
  • the extracted feature points are represented by feature vectors, and are prepared for pairing the feature points in the subsequent steps.
  • the retrieval module 103 can also be used to:
  • the feature points in the first feature point set and the second feature point set may be obtained by using, for example, a KAZE operator.
  • the high-dimensional vector of the 64-dimensional feature is represented; and the first feature point of the first feature point set and the second feature point of the second feature point set are indexed and retrieved by using the multi-probe LSH index function, and finally the feature point pair is obtained.
  • the efficiency and the matching precision of the retrieval pairing are effectively improved, and the working efficiency of the printed circuit board image matching system is further improved.
  • FIG. 4 is a schematic structural diagram of a printed circuit board image matching system according to another embodiment of the present invention. After the calculating module 103, the method further includes:
  • the calculating module 106 is configured to calculate a best matching distance and a second best matching distance between the first feature point and the second feature point in the feature point pair;
  • the determining module 107 is configured to determine the reliability of the feature point pair by comparing the difference between the best matching distance and the sub-optimal matching distance and the preset threshold value, and filter the feature point pair according to the reliability.
  • the feature points of the first feature point set and the second feature point set are searched and paired by using the multi-probe LSH index to obtain features. After the point is paired, certain measures can be taken to identify the reliability of the obtained feature point pairs. In the implementation, determining the feature point pair by comparing the difference between the best matching distance of the first feature point and the second feature point in the feature point pair and the sub-optimal matching distance and the preset threshold value Reliability, filtering the feature point pairs according to reliability, effectively improving the accuracy of the printed circuit board image matching method, and further improving the efficiency of the printed circuit board image matching method of the present invention.
  • the printed circuit board image matching system of the present invention may also For:
  • the difference between the best matching distance and the sub-optimal matching distance is greater than a preset threshold, determining that the feature point pair is reliable; otherwise, determining that the feature point pair is unreliable, and filtering the feature point pair.
  • the feature point pair whose difference between the best matching distance and the second best matching distance is greater than the preset threshold is retained, and the difference between the best matching distance and the second best matching distance is not greater than the preset threshold. Elimination of the printed circuit board image matching system of the present invention improves the accuracy of the printed circuit board image matching system of the present invention.
  • the printed circuit board image matching system of the present invention after the matching module 104, further includes:
  • the correction module 108 is configured to correct the printed circuit board image in the test chart according to the target printed circuit board image in the template image.
  • the image correction method of the printed circuit board image in the test chart including but not limited to geometric correction, angle correction, etc., may be performed according to the target printed circuit board image in the template image.
  • the matching module 104 can also be used to:
  • a random sample set algorithm may be used to calculate a conversion matrix of a first feature point to a second feature point of a plurality of sets of feature point pairs, in order to accurately describe a template map of the target printed circuit board to a test map. Relationship, the set of feature points with the smallest selection error is the calculated conversion matrix as the template of the target printed circuit board to the conversion matrix of the test chart.
  • first feature point and the second feature point may be represented in the form of coordinates or vectors, which is also advantageous for calculating the first feature point to the second feature point according to the first feature point and the second feature point. Conversion matrix.
  • the target in the test chart can be printed.
  • the shape of the board is filtered a priori.
  • the printed circuit board image matching system of the present invention after the matching module 104, may further include:
  • the shape prior module 109 is configured to compare the morphological features of the target printed circuit board image in the test chart and the template image to print the target image in the test chart that is inconsistent with the morphological feature of the target printed circuit board image in the template image.
  • the board image is filtered.
  • the printed circuit board image matching system of the present invention can utilize the shape prior module 109 to determine whether the image area of the mapped target printed circuit board in the test chart is still a convex polygon and The area is roughly equivalent to the image area of the target printed circuit board in the template map to determine whether the match was successful. If the matching is successful, the geometrically corrected printed circuit board image that is matched this time is output, otherwise the matching process is ended.
  • the above-mentioned printed circuit board image matching method and system by performing feature point extraction on the template image and the test pattern of the obtained target printed circuit board respectively, obtaining the first feature point set of the template image and the second feature of the test chart a point set; recalculating a similarity value between the first feature point of the first feature point set and the second feature point of the second feature point set, and the first feature point and the second feature according to the similarity value Pointing is performed to obtain a pair of feature points; calculating a conversion matrix of the template of the target printed circuit board to the test pattern according to the feature point pair, and using the conversion matrix to find a print matching the template image in the test chart Board image.

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Abstract

An image matching method and system for a printed circuit board. The method comprises the following steps: obtaining a template image and a test image of a target printed circuit board (S101); separately extracting feature points of the template image and the test image to obtain a first feature point set of the template image and a second feature point set of the test image (S102); calculating the similarity values between first feature points of the first feature point set and second feature points of the second feature point set, and pairing the first feature points and the second feature points according to the similarity values to obtain feature point pairs (S103); and calculating, according to the feature point pairs, a conversion matrix from the template image of the target printed circuit board to the test image thereof, and using the conversion matrix to search for an image of the printed circuit board matching the template image in the test image (S104). According to the method, an image of a printed circuit board can be quickly matched, and the accuracy of the image matching method and system for a printed circuit board is improved.

Description

印制电路板图像匹配方法和系统Printed circuit board image matching method and system 技术领域Technical field
本发明涉及光学检测技术领域,特别是涉及一种印制电路板图像匹配方法和系统。The present invention relates to the field of optical detection technology, and in particular, to a printed circuit board image matching method and system.
背景技术Background technique
在自动光学检测系统(Automatic Optic Inspection,AOI)中,常常需要先对印刷电路板进行图像匹配,以便后续步骤的对印刷电路板的检测能够正常运行。In the Automatic Optic Inspection (AOI), it is often necessary to perform image matching on the printed circuit board so that the subsequent steps of the detection of the printed circuit board can operate normally.
对于印制电路板图像匹配,现有的技术方案主要有两种:一、基于模板匹配的方法;二、基于SIFT(Scale-invariant feature transform,尺度不变特征变换)/SURF(Speeded Up Robust Features,加速鲁棒特性)算子的匹配方法。For printed circuit board image matching, there are two main technical solutions: first, based on template matching; second, based on SIFT (Scale-invariant feature transform) / SURF (Speeded Up Robust Features) , acceleration robustness) operator matching method.
基于模板匹配的方法是通过在输入图像上滑动图像窗口对相应的图像块和模板图像进行匹配,常见的度量方法是NCC(Normalized Cross Correlation method,归一化积相关算法)。但是,该方法仅能匹配无旋转的电路板,对于在在线自动光学检测环境中拍摄的可能有不同程度的旋转变化的电路板无法进行图像匹配。The method based on template matching is to match the corresponding image block and template image by sliding the image window on the input image. The common measurement method is NCC (Normalized Cross Correlation method). However, this method can only match non-rotating boards, and image matching is not possible for boards that may have varying degrees of rotational variation in an online automated optical inspection environment.
基于SIFT/SURF算子的匹配方法是通过基于线性的高斯金字塔进行多尺度分解来消除噪声,并提取显著特征点,然后通过匹配输入图像与模板的特征点完成图像的匹配。但是,该类方法在匹配过程需要耗费大量的计算时间与计算资源,不仅计算速度慢,而且限制AOI的使用场景,还提高了计算硬件成本;另外,SIFT/SURF等特征检测算法是基于线性的高斯金字塔进行多尺度分解的,这种分解方法牺牲了局部精度,容易造成边界模糊和细节丢失,进而导致匹配错误等结果。The matching method based on SIFT/SURF operator is to eliminate noise by multi-scale decomposition based on linear Gaussian pyramid, and extract significant feature points, and then match the input image with the feature points of the template to complete the image matching. However, this kind of method requires a lot of computation time and computational resources in the matching process, which not only slows the calculation, but also limits the usage scenario of the AOI, and also increases the computational hardware cost; in addition, the feature detection algorithm such as SIFT/SURF is based on linearity. The Gaussian pyramid performs multi-scale decomposition. This decomposition method sacrifices local precision, which is easy to cause boundary blur and detail loss, which leads to matching errors and other results.
综上所述,传统的印制电路板图像匹配方法计算速度慢、硬件成本过高以及准确率较低。In summary, the conventional printed circuit board image matching method has a slow calculation speed, a high hardware cost, and a low accuracy.
发明内容Summary of the invention
基于此,有必要针对传统的印制电路板图像匹配方法计算速度慢、硬件成本过高以及准确率较低的技术问题,提供一种印制电路板图像匹配方法和系统。Based on this, it is necessary to solve the technical problems of slow speed, high hardware cost and low accuracy for the traditional printed circuit board image matching method, and provide a printed circuit board image matching method and system.
一种印制电路板图像匹配方法,包括如下步骤: A printed circuit board image matching method includes the following steps:
获取目标印制电路板的模板图和测试图;其中,所述模板图为所述目标印制电路板的经过角度矫正的图像,所述测试图为所述目标印制电路板的未经角度矫正的图像;Obtaining a template image and a test chart of the target printed circuit board; wherein the template image is an angle-corrected image of the target printed circuit board, the test chart is an angle of the target printed circuit board Corrected image;
分别对所述模板图和测试图进行特征点提取,获取所述模板图的第一特征点集和测试图的第二特征点集;Performing feature point extraction on the template graph and the test graph respectively, and acquiring a first feature point set of the template graph and a second feature point set of the test graph;
计算第一特征点集的第一特征点和第二特征点集的第二特征点之间的相似度值,根据所述相似度值对所述第一特征点和第二特征点进行配对,得到特征点对;Calculating a similarity value between the first feature point of the first feature point set and the second feature point of the second feature point set, and pairing the first feature point and the second feature point according to the similarity value, Obtaining feature point pairs;
根据所述特征点对计算所述目标印制电路板的模板图到测试图的转换矩阵,并利用所述转换矩阵查找测试图中与模板图相匹配的印制电路板图像。Calculating a conversion matrix of the template of the target printed circuit board to the test pattern according to the feature point pair, and using the conversion matrix to find a printed circuit board image in the test chart that matches the template image.
上述印制电路板图像匹配方法,通过分别对获取的目标印制电路板的模板图和测试图进行特征点提取,得到所述模板图的第一特征点集和测试图的第二特征点集;再计算第一特征点集的第一特征点和第二特征点集的第二特征点之间的相似度值,根据所述相似度值对所述第一特征点和第二特征点进行配对,得到特征点对;根据所述特征点对计算所述目标印制电路板的模板图到测试图的转换矩阵,并利用所述转换矩阵查找测试图中与模板图相匹配的印制电路板图像。通过上述技术方案,本发明的印制电路板图像匹配方法,实现了对印制电路板图像的快速匹配,有效地提高了印制电路板图像匹配方法的准确性。The above-mentioned printed circuit board image matching method performs feature point extraction on the template image and the test pattern of the obtained target printed circuit board, respectively, to obtain a first feature point set of the template image and a second feature point set of the test pattern. Recalculating a similarity value between the first feature point of the first feature point set and the second feature point of the second feature point set, and performing the first feature point and the second feature point according to the similarity value Pairing, obtaining a pair of feature points; calculating a conversion matrix of the template pattern of the target printed circuit board to the test pattern according to the feature point pair, and using the conversion matrix to find a printed circuit matching the template image in the test pattern Board image. Through the above technical solution, the printed circuit board image matching method of the invention realizes the fast matching of the printed circuit board image, and effectively improves the accuracy of the printed circuit board image matching method.
一种印制电路板图像匹配系统,包括:A printed circuit board image matching system comprising:
获取模块,用于获取目标印制电路板的模板图和测试图;其中,所述模板图为所述目标印制电路板的经过角度矫正的图像,所述测试图为所述目标印制电路板的未经角度矫正的图像;An acquisition module, configured to obtain a template image and a test chart of the target printed circuit board; wherein the template image is an angle corrected image of the target printed circuit board, and the test chart is the target printed circuit An unangled image of the board;
提取模块,用于分别对所述模板图和测试图进行特征点提取,获取所述模板图的第一特征点集和测试图的第二特征点集;An extraction module, configured to perform feature point extraction on the template image and the test image respectively, and acquire a first feature point set of the template image and a second feature point set of the test image;
配对模块,用于计算第一特征点集的第一特征点和第二特征点集的第二特征点之间的相似度值,根据所述相似度值对所述第一特征点和第二特征点进行配对,得到特征点对;a pairing module, configured to calculate a similarity value between the first feature point of the first feature point set and the second feature point of the second feature point set, and the first feature point and the second feature point according to the similarity value Feature points are paired to obtain feature point pairs;
匹配模块,用于根据所述特征点对计算所述目标印制电路板的模板图到测试图的转换矩阵,并利用所述转换矩阵查找测试图中与模板图相匹配的印制电路板图像。a matching module, configured to calculate a conversion matrix of the template map of the target printed circuit board to the test pattern according to the feature point pair, and use the conversion matrix to search for a printed circuit board image in the test chart that matches the template image .
上述印制电路板图像匹配系统,通过提取模块分别对获取模块获取到的目标印制电路板的模板图和测试图进行特征点提取,得到所述模板图的第一特征点集和测试图的第二特征点集;再通过配对模块计算第一特征点集的第一特征点和第二特征点集的第二特征点之 间的相似度值,根据所述相似度值对所述第一特征点和第二特征点进行配对,得到特征点对;最后,利用匹配模块根据所述特征点对计算所述目标印制电路板的模板图到测试图的转换矩阵,并利用所述转换矩阵查找测试图中与模板图相匹配的印制电路板图像。通过上述技术方案,本发明的印制电路板图像匹配系统,实现了对目标印制电路板图像的快速匹配,有效地提高了印制电路板图像匹配系统的准确性。In the above-mentioned printed circuit board image matching system, feature extraction is performed on the template image and the test pattern of the target printed circuit board acquired by the acquisition module by the extraction module, and the first feature point set and the test chart of the template image are obtained. a second feature point set; and calculating, by the pairing module, the first feature point of the first feature point set and the second feature point of the second feature point set a similarity value between the first feature point and the second feature point according to the similarity value to obtain a feature point pair; finally, the matching module is used to calculate the target printed circuit according to the feature point pair The template map of the board to the conversion matrix of the test pattern, and the conversion matrix is used to find the printed circuit board image in the test chart that matches the template image. Through the above technical solution, the printed circuit board image matching system of the invention realizes fast matching of the image of the target printed circuit board, and effectively improves the accuracy of the image matching system of the printed circuit board.
附图说明DRAWINGS
图1为本发明的一个实施例的印制电路板图像匹配方法流程图;1 is a flow chart of a method for matching printed circuit board images according to an embodiment of the present invention;
图2为本发明的另一个实施例的印制电路板图像匹配方法流程图;2 is a flow chart of a method for matching printed circuit board images according to another embodiment of the present invention;
图3为本发明的一个实施例的印制电路板图像匹配系统的结构示意图;3 is a schematic structural diagram of a printed circuit board image matching system according to an embodiment of the present invention;
图4为本发明的另一个实施例的印制电路板图像匹配系统的结构示意图。4 is a schematic structural view of a printed circuit board image matching system according to another embodiment of the present invention.
具体实施方式detailed description
为了更进一步阐述本发明所采取的技术手段及取得的效果,下面结合附图及较佳实施例,对本发明的技术方案,进行清楚和完整的描述。The technical solutions of the present invention will be clearly and completely described in the following with reference to the accompanying drawings and preferred embodiments.
如图1所示,图1为本发明的一个实施例的印制电路板图像匹配方法流程图,包括如下步骤:As shown in FIG. 1, FIG. 1 is a flowchart of a method for matching a printed circuit board image according to an embodiment of the present invention, including the following steps:
步骤S101:获取目标印制电路板的模板图和测试图;其中,所述模板图为所述目标印制电路板的经过角度矫正的图像,所述测试图为所述目标印制电路板的未经角度矫正的图像;Step S101: Acquire a template image and a test chart of the target printed circuit board; wherein the template image is an angle-corrected image of the target printed circuit board, and the test chart is the target printed circuit board An image without angle correction;
在本步骤中,通过获取目标印制电路板的模板图和测试图,为后续步骤的特征点提取做准备。In this step, the template points and test patterns of the target printed circuit board are obtained to prepare for feature point extraction in the subsequent steps.
在具体实施时,本步骤中所述的模板图里可以仅包含一张经过角度矫正的目标印制电路板图像,而测试图中可能包含一张或者多张目标印制电路板图像,且每张电路板图像均未经过角度矫正,并可能散落在图像中的任意位置;此外,测试图中还有可能不包含目标印制电路板。In a specific implementation, the template image described in this step may only include an angle corrected target printed circuit board image, and the test image may include one or more target printed circuit board images, and each The image of the board is not angle corrected and may be scattered anywhere in the image; in addition, the target printed circuit board may not be included in the test chart.
在其中一个实施例中,本发明的印制电路板图像匹配方法,所述获取目标印制电路板的模板图和测试图的步骤101可以包括: In one embodiment, the printed circuit board image matching method of the present invention, the step 101 of acquiring a template image and a test pattern of the target printed circuit board may include:
获取多个目标印制电路板的模板图和测试图;其中,所述模板图为所述多个目标印制电路板的经过角度矫正的图像,所述测试图为所述多个目标印制电路板的未经角度矫正的图像。Obtaining a template image and a test chart of the plurality of target printed circuit boards; wherein the template image is an angle-corrected image of the plurality of target printed circuit boards, and the test chart is printed for the plurality of targets An image without a corner correction of the board.
在具体实施时,若测试图中不包含目标印制电路板时,本发明的印制电路板图像匹配方法,则不输出任何图像;若测试图中包括N张目标印制电路板,本发明的印制电路板图像匹配方法,则分N次输出匹配成功的印制电路板图像。In a specific implementation, if the target printed circuit board is not included in the test chart, the printed circuit board image matching method of the present invention does not output any image; if the test image includes N target printed circuit boards, the present invention The printed circuit board image matching method outputs the successfully printed printed circuit board image in N times.
步骤S102:分别对所述模板图和测试图进行特征点提取,获取所述模板图的第一特征点集和测试图的第二特征点集;Step S102: performing feature point extraction on the template image and the test image respectively, and acquiring a first feature point set of the template image and a second feature point set of the test image;
在本步骤中,通过对获取的目标印制电路板模板图和测试图分别进行特征点检测与提取,得到所述模板图的第一特征点集和测试图的第二特征点集,便于后续步骤的对上述特征点进行配对。在具体实施时,第一特征点集的特征点个数与第二特征点集的特征点个数不一定相等,例如,经过对模板图进行特征点检测与提取,得到第一特征点集的特征点的个数为1000,经过对测试图进行特征点检测与提取,得到第二特征点集的特征点的个数可能为1500,在后续步骤的对上述特征点进行配对时,主要就是针对第一特征点集的1000个特征点和第二特征点集的1500个特征点进行检索配对。In this step, the feature point detection and extraction are performed on the obtained target printed circuit board template map and the test image respectively, and the first feature point set of the template image and the second feature point set of the test image are obtained, which is convenient for subsequent The step of pairing the above feature points. In a specific implementation, the number of feature points of the first feature point set is not necessarily equal to the number of feature points of the second feature point set. For example, after the feature point detection and extraction of the template image, the first feature point set is obtained. The number of feature points is 1000. After the feature points are detected and extracted, the number of feature points of the second feature point set may be 1500. When pairing the feature points in the subsequent steps, the main purpose is The 1000 feature points of the first feature point set and the 1500 feature points of the second feature point set are searched and paired.
步骤S103:计算第一特征点集的第一特征点和第二特征点集的第二特征点之间的相似度值,根据所述相似度值对所述第一特征点和第二特征点进行配对,得到特征点对;Step S103: calculating a similarity value between the first feature point of the first feature point set and the second feature point of the second feature point set, and the first feature point and the second feature point according to the similarity value Pairing to obtain feature point pairs;
在本步骤中,通过对步骤S102提取到的第一特征点集和第二特征点集中的特征点进行检索匹配,也就是说,通过计算第一特征点集的第一特征点和第二特征点集的第二特征点之间的相似度值,根据所述相似度值,查找到模板图和测试图中一一对应的特征点,并组成第一特征点集和第二特征点集的特征点对。In this step, the first feature point set and the second feature point set are extracted and matched by the first feature point set extracted in step S102, that is, by calculating the first feature point and the second feature of the first feature point set. And a similarity value between the second feature points of the point set, according to the similarity value, finding feature points corresponding to the one-to-one correspondence between the template image and the test image, and composing the first feature point set and the second feature point set Feature point pairs.
步骤S104:根据所述特征点对计算所述目标印制电路板的模板图到测试图的转换矩阵,并利用所述转换矩阵查找测试图中与模板图相匹配的印制电路板图像。Step S104: Calculate a conversion matrix of the template of the target printed circuit board to the test pattern according to the feature point pair, and use the conversion matrix to search for a printed circuit board image in the test chart that matches the template image.
在步骤S103检索配对得到多组特征点对之后,根据所述特征点对中的第一特征点和第二特征点,计算所述目标印制电路板的模板图到测试图的转换矩阵,并利用所述转换矩阵查找测试图中与模板图相匹配的目标印制电路板的图像。After retrieving the pairing to obtain a plurality of sets of feature point pairs in step S103, calculating a conversion matrix of the template map of the target printed circuit board to the test pattern according to the first feature point and the second feature point of the feature point pair, and The conversion matrix is used to find an image of the target printed circuit board in the test chart that matches the template image.
上述印制电路板图像匹配方法,通过分别对获取的目标印制电路板的模板图和测试图进行特征点提取,得到所述模板图的第一特征点集和测试图的第二特征点集;再计算第一 特征点集的第一特征点和第二特征点集的第二特征点之间的相似度值,根据所述相似度值对所述第一特征点和第二特征点进行配对,得到特征点对;根据所述特征点对计算所述目标印制电路板的模板图到测试图的转换矩阵,并利用所述转换矩阵查找测试图中与模板图相匹配的印制电路板图像。通过上述技术方案,本发明的印制电路板图像匹配方法,实现了对印制电路板图像的快速匹配,有效地提高了印制电路板图像匹配方法的准确性。The above-mentioned printed circuit board image matching method performs feature point extraction on the template image and the test pattern of the obtained target printed circuit board, respectively, to obtain a first feature point set of the template image and a second feature point set of the test pattern. ; calculate the first a similarity value between the first feature point of the feature point set and the second feature point of the second feature point set, and the first feature point and the second feature point are paired according to the similarity value to obtain a feature point And calculating a conversion matrix of the template of the target printed circuit board to the test pattern according to the feature point pair, and using the conversion matrix to search for a printed circuit board image in the test chart that matches the template image. Through the above technical solution, the printed circuit board image matching method of the invention realizes the fast matching of the printed circuit board image, and effectively improves the accuracy of the printed circuit board image matching method.
在具体实施时,若测试图中包含多个目标印制电路板图像,所述根据所述特征点对计算所述目标印制电路板的模板图到测试图的转换矩阵,并利用所述转换矩阵查找测试图中与模板图相匹配的印制电路板图像的步骤S104包括:In a specific implementation, if the test chart includes a plurality of target printed circuit board images, the calculation of the template of the target printed circuit board to the conversion matrix of the test image according to the feature point pair, and using the conversion The step S104 of the matrix finding the printed circuit board image matching the template image in the test chart includes:
根据所述特征点对计算其中一个目标印制电路板的模板图到测试图的转换矩阵,并利用所述转换矩阵查找测试图中与模板图相匹配的所述其中一个目标印制电路板图像。Calculating a conversion matrix of the template image of one of the target printed circuit boards to the test pattern according to the feature point pair, and using the conversion matrix to find the one of the target printed circuit board images in the test chart that matches the template image .
在所述利用所述转换矩阵查找测试图中与模板图相匹配的所述其中一个目标印制电路板图像的步骤之后,还包括:After the step of using the conversion matrix to find the one of the target printed circuit board images in the test chart that matches the template image, the method further includes:
步骤S105:将所述特征点对进行屏蔽,对多个目标印制电路板图像中的其他印制电路板图像进行匹配。Step S105: Shielding the feature point pairs to match other printed circuit board images in the plurality of target printed circuit board images.
在上述实施例中,测试图中包含了多张印制电路板的图像,在完成了一张印制电路板的图像匹配之后,为了避免对其他印制电路板图像的匹配,需要清除之前对目标印制电路板图像进行匹配时涉及到的特征点。举例来说,由上一轮匹配所计算得到的转换矩阵,可在测试图中查找到与模板图中的印制电路板图像相对应的印制电路板图像区域,即,由模板图中的印制电路板图像,经过转换矩阵映射得到的测试图中的印制电路板图像区域,屏蔽掉该区域中的特征点,在进行其他印制电路板图像匹配时,只用考虑剩余的特征点即可,不仅避免了受上一轮的影响,也提高了对其他印制电路板图像进行匹配的效率。本实施例的技术方案,实现了对多张印制电路板图像的快速匹配,提高了印制电路板图像匹配方法的工作效率。In the above embodiment, the test chart contains images of a plurality of printed circuit boards. After the image matching of one printed circuit board is completed, in order to avoid matching the images of other printed circuit boards, it is necessary to clear the previous pairs. Feature points involved in matching the target printed circuit board image. For example, the conversion matrix calculated by the previous round of matching can find the printed circuit board image area corresponding to the printed circuit board image in the template image in the test chart, that is, by the template image The printed circuit board image, the printed circuit board image area in the test chart obtained through the conversion matrix mapping, masks the feature points in the area, and only considers the remaining feature points when performing other printed circuit board image matching. It can not only avoid the influence of the previous round, but also improve the efficiency of matching other printed circuit board images. The technical solution of the embodiment achieves fast matching of multiple printed circuit board images and improves the working efficiency of the printed circuit board image matching method.
在其中一个实施例中,本发明的印制电路板图像匹配方法,所述分别对所述模板图和测试图进行特征点提取的步骤包括:In one embodiment, in the printed circuit board image matching method of the present invention, the step of performing feature point extraction on the template image and the test image respectively includes:
利用KAZE算子构造单个Octave层的非线性尺度空间,并利用所述非线性尺度空间对所述模板图和测试图进行特征点提取。The nonlinear scale space of a single Octave layer is constructed by using a KAZE operator, and the feature points are extracted from the template map and the test map by using the nonlinear scale space.
在实际应用时,本实施例的印制电路板图像匹配方法,利用KAZE算子通过非线性扩 散滤波来构造稳定的单个Octave层的非线性尺度空间,并利用所述非线性尺度空间对所述模板图和测试图进行特征点提取,在保持精度相对不变的前提下,大大提升了计算效率;而且,利用KAZE算子构造单个Octave层的非线性尺度空间,还可以对经过旋转变化的印制电路板图像的特征点进行提取,便于进行后续步骤的图像匹配,降低了印制电路板图像匹配方法的硬件成本。In practical application, the printed circuit board image matching method of this embodiment uses a KAZE operator to pass nonlinear expansion. The spatial filtering is used to construct a stable nonlinear scale space of a single Octave layer, and the feature points are extracted from the template graph and the test graph by using the nonlinear scale space, and the calculation is greatly improved under the premise that the precision is relatively unchanged. Efficiency; moreover, the KAZE operator is used to construct the nonlinear scale space of a single Octave layer, and the feature points of the rotated circuit board image can be extracted, which facilitates image matching in subsequent steps and reduces the printed circuit board. The hardware cost of the image matching method.
本实施例所述的非线性扩散滤波方法,是将目标印制电路板的模板图和测试图的图像亮度L在不同尺度上的变化视为某种形式的流动函数的散度:The nonlinear diffusion filtering method described in this embodiment considers the variation of the image brightness L of the target printed circuit board and the image brightness of the test pattern on different scales as the divergence of some form of the flow function:
Figure PCTCN2016113120-appb-000001
Figure PCTCN2016113120-appb-000001
式中,L表示所述目标印制电路板的模板图或者测试图的图像亮度,t表示尺度参数,c(x,y,t)表示传导函数。Where L represents the image brightness of the template or test pattern of the target printed circuit board, t represents the scale parameter, and c(x, y, t) represents the conduction function.
在具体实施时,为了有限保留宽度较大的区域,可以选择如下式所示的传导函数c(x,y,t):In the specific implementation, in order to limit the area with a large width, the conduction function c(x, y, t) shown in the following equation can be selected:
Figure PCTCN2016113120-appb-000002
Figure PCTCN2016113120-appb-000002
式中,c(x,y,t)表示传导函数,t表示尺度参数,
Figure PCTCN2016113120-appb-000003
表示高斯平滑后的图像Lσ的梯度,k表示控制扩散程度的常数。
Where c(x, y, t) represents the conduction function and t represents the scale parameter,
Figure PCTCN2016113120-appb-000003
A gradient representing the Gaussian smoothed image L σ and k representing a constant controlling the degree of diffusion.
在具体实施时,提取的特征点以特征向量进行表示,为后续步骤的对特征点进行配对做准备。In the specific implementation, the extracted feature points are represented by feature vectors, and are prepared for pairing the feature points in the subsequent steps.
在其中一个实施例中,本发明所述的印制电路板图像匹配方法,所述计算第一特征点集的第一特征点和第二特征点集的第二特征点之间的相似度值的步骤可以包括:In one embodiment, the printed circuit board image matching method of the present invention calculates the similarity value between the first feature point of the first feature point set and the second feature point of the second feature point set. The steps can include:
利用多探头索引函数对第一特征点集的第一特征点和第二特征点集的第二特征点进行索引检索,并计算所述第一特征点和第二特征点之间的度量距离;Indexing and retrieving the first feature point of the first feature point set and the second feature point of the second feature point set by using a multi-probe index function, and calculating a metric distance between the first feature point and the second feature point;
根据所述度量距离确定所述第一特征点和第二特征点之间的相似度值。And determining a similarity value between the first feature point and the second feature point according to the metric distance.
在本实施例中,由于得到的第一特征点集和第二特征点集中的特征点数量较多,可以将第一特征点集和第二特征点集中的特征点采用诸如KAZE算子得到的64维特征的高维向量来进行表示;再利用多探头LSH索引函数对第一特征点集的第一特征点和第二特征点集的第二特征点进行索引检索,并最终得到特征点对。通过上述技术方案,有效地提高了 检索配对的效率和配对精度,进一步提高了印制电路板图像匹配方法的效率。In this embodiment, since the obtained first feature point set and the second feature point set have a large number of feature points, the feature points in the first feature point set and the second feature point set may be obtained by using, for example, a KAZE operator. The high-dimensional vector of the 64-dimensional feature is represented; and the first feature point of the first feature point set and the second feature point of the second feature point set are indexed and retrieved by using the multi-probe LSH index function, and finally the feature point pair is obtained. . Through the above technical solutions, effectively improved Retrieving pairing efficiency and pairing accuracy further improves the efficiency of the printed circuit board image matching method.
如图2所示,图2为本发明的另一个实施例的印制电路板图像匹配方法流程图,在所述得到所述第一特征点集和第二特征点集的特征点对的步骤之后,还可以包括:As shown in FIG. 2, FIG. 2 is a flowchart of a method for matching a printed circuit board image according to another embodiment of the present invention, and the step of obtaining feature point pairs of the first feature point set and the second feature point set is performed. After that, you can also include:
步骤S106:计算所述特征点对中的第一特征点和第二特征点之间的最佳匹配距离和次佳匹配距离;Step S106: Calculate a best matching distance and a second best matching distance between the first feature point and the second feature point in the feature point pair;
步骤S107:通过比较所述最佳匹配距离与次佳匹配距离的差距与预设阈值的大小关系,判断所述特征点对的可靠性,根据可靠性对特征点对进行过滤。Step S107: Determine the reliability of the feature point pair by comparing the difference between the best matching distance and the sub-optimal matching distance and the preset threshold value, and filter the feature point pair according to the reliability.
在上述实施例中,为了进一步提高本发明的印制电路板图像匹配方法的准确率,在利用多探头LSH索引对第一特征点集和第二特征点集中的特征点进行检索配对,得到特征点对之后,可以采取一定的措施来对得到的特征点对的可靠性进行再次判断。在本实施中,通过比较所述特征点对中的第一特征点和第二特征点的最佳匹配距离与次佳匹配距离的差距与预设阈值的大小关系,判断所述特征点对的可靠性,根据可靠性对特征点对进行过滤,有效地提高了印制电路板图像匹配方法的准确性,进一步提高了本发明的印制电路板图像匹配方法的效率。In the above embodiment, in order to further improve the accuracy of the printed circuit board image matching method of the present invention, the feature points of the first feature point set and the second feature point set are searched and paired by using the multi-probe LSH index to obtain features. After the point is paired, certain measures can be taken to re-evaluate the reliability of the obtained feature point pairs. In the implementation, determining the feature point pair by comparing the difference between the best matching distance of the first feature point and the second feature point in the feature point pair and the sub-optimal matching distance and the preset threshold value Reliability, filtering the feature point pairs according to reliability, effectively improving the accuracy of the printed circuit board image matching method, and further improving the efficiency of the printed circuit board image matching method of the present invention.
在其中一个实施例中,本发明的印制电路板图像匹配方法,所述通过比较所述最佳匹配距离与次佳匹配距离的差距与预设阈值的大小关系,判断所述特征点对的可靠性,根据可靠性对特征点对进行过滤的步骤S107可以包括:In one embodiment, the printed circuit board image matching method of the present invention determines the feature point pair by comparing the difference between the best matching distance and the sub-optimal matching distance and the preset threshold value. The step S107 of filtering the feature point pairs according to the reliability may include:
若所述最佳匹配距离与次佳匹配距离的差距大于预设阈值,则判定所述特征点对可靠;否则,判定所述特征点对不可靠,并对所述特征点对进行过滤。If the difference between the best matching distance and the sub-optimal matching distance is greater than a preset threshold, determining that the feature point pair is reliable; otherwise, determining that the feature point pair is unreliable, and filtering the feature point pair.
在上述实施例中,通过将最佳匹配距离与次佳匹配距离的差距大于预设阈值的特征点对进行保留,将最佳匹配距离与次佳匹配距离的差距不大于预设阈值的特征点对进行剔除,提高了本发明的印制电路板图像匹配方法的准确性,进一步也提高了本发明的印制电路板图像匹配方法的工作效率。In the above embodiment, the feature point pair whose difference between the best matching distance and the second best matching distance is greater than the preset threshold is retained, and the difference between the best matching distance and the second best matching distance is not greater than the preset threshold. The culling is performed to improve the accuracy of the printed circuit board image matching method of the present invention, and further improves the working efficiency of the printed circuit board image matching method of the present invention.
在其中一个实施例中,本发明的印制电路板图像匹配方法,在所述利用所述转换矩阵查找测试图中与模板图相匹配的印制电路板的图像的步骤之后,还可以包括:In one embodiment, the printed circuit board image matching method of the present invention may further include: after the step of using the conversion matrix to search for an image of the printed circuit board that matches the template image in the test image, the method further includes:
步骤S108:根据所述模板图中的目标印制电路板图像对测试图中的印制电路板图像进行矫正。Step S108: Correcting the printed circuit board image in the test chart according to the target printed circuit board image in the template image.
在实际应用中,可以根据模板图中的目标印制电路板图像对测试图中的印制电路板图 像进行包括但不限于的几何矫正、角度矫正等图像矫正方法。In practical applications, the printed circuit board image in the test chart can be printed according to the target printed circuit board image in the template image. Image correction methods such as geometric correction, angle correction, etc., including but not limited to.
在其中一个实施例中,本发明的印制电路板图像匹配方法,所述计算所述多组特征点对中的第一特征点到第二特征点的转换矩阵的步骤包括:In one embodiment, the printed circuit board image matching method of the present invention, the calculating the conversion matrix of the first feature point to the second feature point of the plurality of sets of feature point pairs comprises:
利用随机样本集算法计算多组特征点对中的第一特征点到第二特征点的转换矩阵;Calculating a transformation matrix of the first feature point to the second feature point of the plurality of sets of feature point pairs by using a random sample set algorithm;
在所述利用随机样本集算法计算多组特征点对中的第一特征点到第二特征点的转换矩阵的步骤之后,还可以包括:After the step of calculating the conversion matrix of the first feature point to the second feature point of the plurality of sets of feature point pairs by using the random sample set algorithm, the method may further include:
选择误差最小的一组特征点对所计算得到的转换矩阵作为所述模板图到测试图的转换矩阵;其中,所述转换矩阵表示模板图中的目标印制电路板图像到与模板图中的目标印制电路板图像对应的测试图中的印制电路板图像的映射关系。Selecting a set of feature points with the smallest error pair as the conversion matrix of the template map to the test chart; wherein the conversion matrix represents the target printed circuit board image in the template image to the template image The mapping relationship of the printed circuit board images in the test chart corresponding to the target printed circuit board image.
在本实施例中,可以利用随机样本集算法计算多组特征点对中的第一特征点到第二特征点的转换矩阵,为了准确地描述目标印制电路板的模板图到测试图的映射关系,选择误差最小的一组特征点对计算得到的转换矩阵作为目标印制电路板的模板图到测试图的转换矩阵。In this embodiment, a random sample set algorithm may be used to calculate a conversion matrix of a first feature point to a second feature point of a plurality of sets of feature point pairs, in order to accurately describe a template map of the target printed circuit board to a test map. Relationship, the set of feature points with the smallest selection error is the calculated conversion matrix as the template of the target printed circuit board to the conversion matrix of the test chart.
在实际应用时,第一特征点和第二特征点可以以坐标或者向量的形式进行表示,这也有利于根据第一特征点和第二特征点,计算得到第一特征点到第二特征点的转换矩阵。In practical applications, the first feature point and the second feature point may be represented in the form of coordinates or vectors, which is also advantageous for calculating the first feature point to the second feature point according to the first feature point and the second feature point. Conversion matrix.
在具体实施时,如果测试图中没有目标印制电路板的图像,而模板图中只有一张该目标印制电路板的图像时,也有可能计算得到这样的转换矩阵,从而形成错误的配对。因此,为了进一步提高本发明的印制电路板图像匹配方法的准确率,可以对测试图中的目标印制电路板的形态先验进行过滤。In a specific implementation, if there is no image of the target printed circuit board in the test chart, and there is only one image of the target printed circuit board in the template image, it is also possible to calculate such a conversion matrix, thereby forming an incorrect pairing. Therefore, in order to further improve the accuracy of the printed circuit board image matching method of the present invention, the shape of the target printed circuit board in the test chart can be filtered a priori.
在其中一个实施例中,本发明的印制电路板图像匹配方法,在所述利用所述转换矩阵查找测试图中与模板图相匹配的目标印制电路板图像的步骤之后,还可以包括:In one embodiment, the printed circuit board image matching method of the present invention may further include: after the step of using the conversion matrix to search for a target printed circuit board image that matches the template image in the test pattern,
步骤S109:通过比较测试图和模板图中的目标印制电路板图像的形态特征,对测试图中与模板图中的目标印制电路板图像的形态特征不一致的目标印制电路板图像进行过滤。Step S109: filtering the target printed circuit board image in the test chart that is inconsistent with the morphological feature of the target printed circuit board image in the template image by comparing the morphological features of the target printed circuit board image in the test chart and the template image. .
由于印制电路板的图像区域一般为凸多边形,因此可假设模板图中的目标印制电路板的图像区域经过映射后,也应该是一个凸多边形;而且,经过测试图中的经过映射后的目标印制电路板的图像区域的面积,也应与模板图中的目标印制电路板的图像区域大致相当。因此,在实际应用中,本发明的印制电路板图像匹配方法,可以通过判断测试图中的经过映射后的目标印制电路板的图像区域是否仍为凸多边形且其面积与模板图中的目标 印制电路板的图像区域大致相当,来断定本次匹配是否成功。如果匹配成功,则输出本次匹配出来的经过几何矫正的印制电路板图像,否则结束本次匹配过程。Since the image area of the printed circuit board is generally a convex polygon, it can be assumed that the image area of the target printed circuit board in the template image is also a convex polygon after being mapped; and, after being mapped in the test chart The area of the image area of the target printed circuit board should also be approximately equivalent to the image area of the target printed circuit board in the template image. Therefore, in practical applications, the printed circuit board image matching method of the present invention can determine whether the image area of the mapped target printed circuit board in the test chart is still a convex polygon and its area and the template image aims The image area of the printed circuit board is roughly equivalent to determine whether the match is successful. If the matching is successful, the geometrically corrected printed circuit board image that is matched this time is output, otherwise the matching process is ended.
如图3所示,图3为本发明的一个实施例的印制电路板图像匹配系统的结构示意图,包括:As shown in FIG. 3, FIG. 3 is a schematic structural diagram of a printed circuit board image matching system according to an embodiment of the present invention, including:
获取模块101,用于获取目标印制电路板的模板图和测试图;其中,所述模板图为所述目标印制电路板的经过角度矫正的图像,所述测试图为所述目标印制电路板的未经角度矫正的图像;An obtaining module 101, configured to acquire a template image and a test chart of the target printed circuit board; wherein the template image is an angle-corrected image of the target printed circuit board, and the test chart is the target printing An unangled image of the board;
在具体实施时,获取模块101中所述的模板图里可以仅包含一张经过角度矫正的目标印制电路板图像,而测试图中可能包含一张或者多张目标印制电路板图像,且每张电路板图像均未经过角度矫正,并可能散落在图像中的任意位置;此外,测试图中还有可能不包含目标印制电路板。In a specific implementation, the template image described in the obtaining module 101 may include only one angle corrected target printed circuit board image, and the test image may include one or more target printed circuit board images, and Each board image is not angularly corrected and may be scattered anywhere in the image; in addition, the target printed circuit board may not be included in the test chart.
在其中一个实施例中,本发明的印制电路板图像匹配系统,所述获取模块101还可以用于:In one embodiment, the printed circuit board image matching system of the present invention, the acquisition module 101 can also be used to:
获取多个目标印制电路板的模板图和测试图;其中,所述模板图为所述多个目标印制电路板的经过角度矫正的图像,所述测试图为所述多个目标印制电路板的未经角度矫正的图像。Obtaining a template image and a test chart of the plurality of target printed circuit boards; wherein the template image is an angle-corrected image of the plurality of target printed circuit boards, and the test chart is printed for the plurality of targets An image without a corner correction of the board.
在具体实施时,若测试图中不包含目标印制电路板时,本发明的印制电路板图像匹配系统,则不输出任何图像;若测试图中包括N张目标印制电路板,本发明的印制电路板图像匹配系统,则分N次输出匹配成功的电路板图像。In a specific implementation, if the target printed circuit board is not included in the test chart, the printed circuit board image matching system of the present invention does not output any image; if the test chart includes N target printed circuit boards, the present invention The printed circuit board image matching system outputs the successfully matched board image in N outputs.
提取模块102,用于分别对所述模板图和测试图进行特征点提取,获取所述模板图的第一特征点集和测试图的第二特征点集;The extracting module 102 is configured to perform feature point extraction on the template graph and the test graph, respectively, and obtain a first feature point set of the template graph and a second feature point set of the test graph;
在上述提取模块102中,通过对获取的目标印制电路板模板图和测试图分别进行特征点检测与提取,得到所述模板图的第一特征点集和测试图的第二特征点集,便于后续步骤的对上述特征点进行配对。在具体实施时,第一特征点集的特征点个数与第二特征点集的特征点个数不一定相等,例如,经过对模板图进行特征点检测与提取,得到第一特征点集的特征点的个数为1000,经过对测试图进行特征点检测与提取,得到第二特征点集的特征点的个数可能为1500,在后续步骤的对上述特征点进行配对时,主要就是针对第一特征点集的1000个特征点和第二特征点集的1500个特征点进行检索配对。 In the above extraction module 102, the feature point detection and extraction are performed on the acquired target printed circuit board template image and the test image respectively, and the first feature point set of the template image and the second feature point set of the test image are obtained. The above feature points are paired for the subsequent steps. In a specific implementation, the number of feature points of the first feature point set is not necessarily equal to the number of feature points of the second feature point set. For example, after the feature point detection and extraction of the template image, the first feature point set is obtained. The number of feature points is 1000. After the feature points are detected and extracted, the number of feature points of the second feature point set may be 1500. When pairing the feature points in the subsequent steps, the main purpose is The 1000 feature points of the first feature point set and the 1500 feature points of the second feature point set are searched and paired.
配对模块103,用于计算第一特征点集的第一特征点和第二特征点集的第二特征点之间的相似度值,根据所述相似度值对所述第一特征点和第二特征点进行配对,得到特征点对;The pairing module 103 is configured to calculate a similarity value between the first feature point of the first feature point set and the second feature point of the second feature point set, and the first feature point and the first feature point according to the similarity value Two feature points are paired to obtain feature point pairs;
在上述配对模块103中,通过对提取模块102提取到的第一特征点集和第二特征点集中的特征点进行检索匹配,也就是说,通过计算第一特征点集的第一特征点和第二特征点集的第二特征点之间的相似度值,根据所述相似度值,查找到模板图和测试图中一一对应的特征点,并组成第一特征点集和第二特征点集的特征点对。In the pairing module 103, the first feature point set extracted by the extraction module 102 and the feature points in the second feature point set are search-matched, that is, by calculating the first feature point of the first feature point set and And a similarity value between the second feature points of the second feature point set, according to the similarity value, finding a feature point corresponding to the template map and the test image, and forming the first feature point set and the second feature A feature point pair of a point set.
匹配模块104,用于根据所述特征点对计算所述目标印制电路板的模板图到测试图的转换矩阵,并利用所述转换矩阵查找测试图中与模板图相匹配的印制电路板图像。The matching module 104 is configured to calculate a conversion matrix of the template map of the target printed circuit board to the test pattern according to the feature point pair, and use the conversion matrix to search for a printed circuit board that matches the template image in the test pattern. image.
在步骤S103检索配对得到多组特征点对之后,根据所述特征点对中的第一特征点和第二特征点,计算所述目标印制电路板的模板图到测试图的转换矩阵,并利用所述转换矩阵查找测试图中与模板图相匹配的目标印制电路板的图像。After retrieving the pairing to obtain a plurality of sets of feature point pairs in step S103, calculating a conversion matrix of the template map of the target printed circuit board to the test pattern according to the first feature point and the second feature point of the feature point pair, and The conversion matrix is used to find an image of the target printed circuit board in the test chart that matches the template image.
上述印制电路板图像匹配系统,通过提取模块102分别对获取模块101获取到的目标印制电路板的模板图和测试图进行特征点提取,得到所述模板图的第一特征点集和测试图的第二特征点集;再通过配对模块103计算第一特征点集的第一特征点和第二特征点集的第二特征点之间的相似度值,根据所述相似度值对所述第一特征点和第二特征点进行配对,得到特征点对;最后,利用匹配模块104根据所述特征点对计算所述目标印制电路板的模板图到测试图的转换矩阵,并利用所述转换矩阵查找测试图中与模板图相匹配的印制电路板图像。通过上述技术方案,本发明的印制电路板图像匹配系统,实现了对目标印制电路板图像的快速匹配,有效地提高了印制电路板图像匹配系统的准确性。In the above-mentioned printed circuit board image matching system, feature extraction is performed on the template image and the test pattern of the target printed circuit board acquired by the acquisition module 101 by the extraction module 102, and the first feature point set and test of the template image are obtained. a second set of feature points of the graph; and calculating, by the pairing module 103, a similarity value between the first feature point of the first feature point set and the second feature point of the second feature point set, according to the similarity value pair The first feature point and the second feature point are paired to obtain a feature point pair. Finally, the matching module 104 calculates a conversion matrix of the target printed circuit board template to the test pattern according to the feature point pair, and utilizes The conversion matrix looks for a printed circuit board image in the test pattern that matches the template map. Through the above technical solution, the printed circuit board image matching system of the invention realizes fast matching of the image of the target printed circuit board, and effectively improves the accuracy of the image matching system of the printed circuit board.
在具体实施时,若测试图中包含多个目标印制电路板图像,所述匹配模块104还可以用于:In a specific implementation, if the test chart includes multiple target printed circuit board images, the matching module 104 can also be used to:
根据所述特征点对计算其中一个目标印制电路板的模板图到测试图的转换矩阵,并利用所述转换矩阵查找测试图中与模板图相匹配的所述其中一个目标印制电路板图像。Calculating a conversion matrix of the template image of one of the target printed circuit boards to the test pattern according to the feature point pair, and using the conversion matrix to find the one of the target printed circuit board images in the test chart that matches the template image .
在所述匹配模块104之后,还可以包括:After the matching module 104, the method may further include:
屏蔽模块105,用于将所述特征点对进行屏蔽,对多个目标印制电路板图像中的其他印制电路板图像进行匹配。The shielding module 105 is configured to shield the feature point pairs to match other printed circuit board images in the plurality of target printed circuit board images.
在上述实施例中,测试图中包含了多张印制电路板的图像,在完成了一张印制电路板 的图像匹配之后,为了避免对其他印制电路板图像的匹配,需要清除之前对目标印制电路板图像进行匹配时涉及到的特征点。举例来说,由上一轮匹配所计算得到的转换矩阵,可在测试图中查找到与模板图中的印制电路板图像相对应的印制电路板图像区域,即,由模板图中的印制电路板图像,经过转换矩阵映射得到的测试图中的印制电路板图像区域,屏蔽掉该区域中的特征点,在进行其他印制电路板图像匹配时,只用考虑剩余的特征点即可,不仅避免了受上一轮的影响,也提高了对其他印制电路板图像进行匹配的效率。本实施例的技术方案,实现了对多张印制电路板图像的快速匹配,提高了印制电路板图像匹配方法的工作效率。In the above embodiment, the test chart contains images of a plurality of printed circuit boards, and a printed circuit board is completed. After the image is matched, in order to avoid matching the other printed circuit board images, it is necessary to clear the feature points involved in the previous matching of the target printed circuit board image. For example, the conversion matrix calculated by the previous round of matching can find the printed circuit board image area corresponding to the printed circuit board image in the template image in the test chart, that is, by the template image The printed circuit board image, the printed circuit board image area in the test chart obtained through the conversion matrix mapping, masks the feature points in the area, and only considers the remaining feature points when performing other printed circuit board image matching. It can not only avoid the influence of the previous round, but also improve the efficiency of matching other printed circuit board images. The technical solution of the embodiment achieves fast matching of multiple printed circuit board images and improves the working efficiency of the printed circuit board image matching method.
在其中一个实施例中,本发明的印制电路板图像匹配系统,所述提取模块102,还可以用于:In one embodiment, the printed circuit board image matching system of the present invention, the extraction module 102 can also be used to:
利用KAZE算子构造单个Octave层的非线性尺度空间,并利用所述非线性尺度空间对所述模板图和测试图进行特征点提取。The nonlinear scale space of a single Octave layer is constructed by using a KAZE operator, and the feature points are extracted from the template map and the test map by using the nonlinear scale space.
在实际应用时,本实施例的印制电路板图像匹配系统的提取模块102利用KAZE算子通过非线性扩散滤波来构造稳定的单个Octave层的非线性尺度空间,并利用所述非线性尺度空间对所述模板图和测试图进行特征点提取,在保持精度相对不变的前提下,大大提升了计算效率;而且,利用KAZE算子构造单个Octave层的非线性尺度空间,还可以对经过旋转变化的印制电路板图像的特征点进行提取,便于进行后续步骤的图像匹配,降低了印制电路板图像匹配系统的硬件成本。In practical application, the extraction module 102 of the printed circuit board image matching system of the present embodiment constructs a stable nonlinear scale space of a single Octave layer by nonlinear diffusion filtering using a KAZE operator, and utilizes the nonlinear scale space. Feature point extraction is performed on the template graph and the test graph, and the computational efficiency is greatly improved under the premise that the precision is relatively unchanged; moreover, the nonlinear scale space of a single Octave layer is constructed by using the KAZE operator, and the rotation can also be performed. The feature points of the changed printed circuit board image are extracted, which facilitates image matching in subsequent steps, and reduces the hardware cost of the printed circuit board image matching system.
本实施例所述的非线性扩散滤波方法,是将目标印制电路板的模板图和测试图的图像亮度L在不同尺度上的变化视为某种形式的流动函数的散度:The nonlinear diffusion filtering method described in this embodiment considers the variation of the image brightness L of the target printed circuit board and the image brightness of the test pattern on different scales as the divergence of some form of the flow function:
Figure PCTCN2016113120-appb-000004
Figure PCTCN2016113120-appb-000004
式中,L表示所述目标印制电路板的模板图或者测试图的图像亮度,t表示尺度参数,c(x,y,t)表示传导函数。Where L represents the image brightness of the template or test pattern of the target printed circuit board, t represents the scale parameter, and c(x, y, t) represents the conduction function.
在具体实施时,为了有限保留宽度较大的区域,可以选择如下式所示的传导函数c(x,y,t):In the specific implementation, in order to limit the area with a large width, the conduction function c(x, y, t) shown in the following equation can be selected:
Figure PCTCN2016113120-appb-000005
Figure PCTCN2016113120-appb-000005
式中,c(x,y,t)表示传导函数,t表示尺度参数,
Figure PCTCN2016113120-appb-000006
表示高斯平滑后的图像Lσ的梯度,k表示控制扩散程度的常数。
Where c(x, y, t) represents the conduction function and t represents the scale parameter,
Figure PCTCN2016113120-appb-000006
A gradient representing the Gaussian smoothed image L σ and k representing a constant controlling the degree of diffusion.
在具体实施时,提取的特征点以特征向量进行表示,为后续步骤的对特征点进行配对做准备。In the specific implementation, the extracted feature points are represented by feature vectors, and are prepared for pairing the feature points in the subsequent steps.
在其中一个实施例中,本发明所述的印制电路板图像匹配系统,所述检索模块103,还可以用于:In one embodiment, the printed circuit board image matching system of the present invention, the retrieval module 103 can also be used to:
利用多探头索引函数对第一特征点集的第一特征点和第二特征点集的第二特征点进行索引检索,并计算所述第一特征点和第二特征点之间的度量距离;Indexing and retrieving the first feature point of the first feature point set and the second feature point of the second feature point set by using a multi-probe index function, and calculating a metric distance between the first feature point and the second feature point;
根据所述度量距离确定所述第一特征点和第二特征点之间的相似度值。And determining a similarity value between the first feature point and the second feature point according to the metric distance.
在本实施例中,由于得到的第一特征点集和第二特征点集中的特征点数量较多,可以将第一特征点集和第二特征点集中的特征点采用诸如KAZE算子得到的64维特征的高维向量来进行表示;再利用多探头LSH索引函数对第一特征点集的第一特征点和第二特征点集的第二特征点进行索引检索,并最终得到特征点对。通过上述技术方案,有效地提高了检索配对的效率和配对精度,进一步提高了印制电路板图像匹配系统的工作效率。In this embodiment, since the obtained first feature point set and the second feature point set have a large number of feature points, the feature points in the first feature point set and the second feature point set may be obtained by using, for example, a KAZE operator. The high-dimensional vector of the 64-dimensional feature is represented; and the first feature point of the first feature point set and the second feature point of the second feature point set are indexed and retrieved by using the multi-probe LSH index function, and finally the feature point pair is obtained. . Through the above technical solution, the efficiency and the matching precision of the retrieval pairing are effectively improved, and the working efficiency of the printed circuit board image matching system is further improved.
如图4所示,图4为本发明的另一个实施例的印制电路板图像匹配系统的结构示意图,在所述计算模块103之后,还可以包括:As shown in FIG. 4, FIG. 4 is a schematic structural diagram of a printed circuit board image matching system according to another embodiment of the present invention. After the calculating module 103, the method further includes:
计算模块106,用于计算所述特征点对中的第一特征点和第二特征点之间的最佳匹配距离和次佳匹配距离;The calculating module 106 is configured to calculate a best matching distance and a second best matching distance between the first feature point and the second feature point in the feature point pair;
判断模块107,用于通过比较所述最佳匹配距离与次佳匹配距离的差距与预设阈值的大小关系,判断所述特征点对的可靠性,根据可靠性对特征点对进行过滤。The determining module 107 is configured to determine the reliability of the feature point pair by comparing the difference between the best matching distance and the sub-optimal matching distance and the preset threshold value, and filter the feature point pair according to the reliability.
在上述实施例中,为了进一步提高本发明的印制电路板图像匹配系统的准确率,在利用多探头LSH索引对第一特征点集和第二特征点集中的特征点进行检索配对,得到特征点对之后,可以采取一定的措施来对得到的特征点对的可靠性进行甄别。在本实施中,通过比较所述特征点对中的第一特征点和第二特征点的最佳匹配距离与次佳匹配距离的差距与预设阈值的大小关系,判断所述特征点对的可靠性,根据可靠性对特征点对进行过滤,有效地提高了印制电路板图像匹配方法的准确性,进一步提高了本发明的印制电路板图像匹配方法的效率。In the above embodiment, in order to further improve the accuracy of the printed circuit board image matching system of the present invention, the feature points of the first feature point set and the second feature point set are searched and paired by using the multi-probe LSH index to obtain features. After the point is paired, certain measures can be taken to identify the reliability of the obtained feature point pairs. In the implementation, determining the feature point pair by comparing the difference between the best matching distance of the first feature point and the second feature point in the feature point pair and the sub-optimal matching distance and the preset threshold value Reliability, filtering the feature point pairs according to reliability, effectively improving the accuracy of the printed circuit board image matching method, and further improving the efficiency of the printed circuit board image matching method of the present invention.
在其中一个实施例中,本发明的印制电路板图像匹配系统,所述判断模块107,还可 以用于:In one embodiment, the printed circuit board image matching system of the present invention, the determining module 107 may also For:
若所述最佳匹配距离与次佳匹配距离的差距大于预设阈值,则判定所述特征点对可靠;否则,判定所述特征点对不可靠,并对所述特征点对进行过滤。If the difference between the best matching distance and the sub-optimal matching distance is greater than a preset threshold, determining that the feature point pair is reliable; otherwise, determining that the feature point pair is unreliable, and filtering the feature point pair.
在上述实施例中,通过将最佳匹配距离与次佳匹配距离的差距大于预设阈值的特征点对进行保留,将最佳匹配距离与次佳匹配距离的差距不大于预设阈值的特征点对进行剔除,提高了本发明的印制电路板图像匹配系统的准确性,进一步也提高了本发明的印制电路板图像匹配系统的工作效率。In the above embodiment, the feature point pair whose difference between the best matching distance and the second best matching distance is greater than the preset threshold is retained, and the difference between the best matching distance and the second best matching distance is not greater than the preset threshold. Elimination of the printed circuit board image matching system of the present invention improves the accuracy of the printed circuit board image matching system of the present invention.
在其中一个实施例中,本发明的印制电路板图像匹配系统,在所述匹配模块104之后,还包括可以:In one embodiment, the printed circuit board image matching system of the present invention, after the matching module 104, further includes:
矫正模块108,用于根据所述模板图中的目标印制电路板图像对测试图中的印制电路板图像进行矫正。The correction module 108 is configured to correct the printed circuit board image in the test chart according to the target printed circuit board image in the template image.
在实际应用中,可以根据模板图中的目标印制电路板图像对测试图中的印制电路板图像进行包括但不限于的几何矫正、角度矫正等图像矫正方法。In practical applications, the image correction method of the printed circuit board image in the test chart, including but not limited to geometric correction, angle correction, etc., may be performed according to the target printed circuit board image in the template image.
在其中一个实施例中,本发明的印制电路板图像匹配系统,所述匹配模块104还可以用于:In one embodiment, the printed circuit board image matching system of the present invention, the matching module 104 can also be used to:
利用随机样本集算法计算多组特征点对中的第一特征点到第二特征点的转换矩阵;Calculating a transformation matrix of the first feature point to the second feature point of the plurality of sets of feature point pairs by using a random sample set algorithm;
选择误差最小的一组特征点对所计算得到的转换矩阵作为所述模板图到测试图的转换矩阵;其中,所述转换矩阵表示模板图中的目标印制电路板图像到与模板图中的目标印制电路板图像对应的测试图中的印制电路板图像的映射关系。Selecting a set of feature points with the smallest error pair as the conversion matrix of the template map to the test chart; wherein the conversion matrix represents the target printed circuit board image in the template image to the template image The mapping relationship of the printed circuit board images in the test chart corresponding to the target printed circuit board image.
在本实施例中,可以利用随机样本集算法计算多组特征点对中的第一特征点到第二特征点的转换矩阵,为了准确地描述目标印制电路板的模板图到测试图的映射关系,选择误差最小的一组特征点对计算得到的转换矩阵作为目标印制电路板的模板图到测试图的转换矩阵。In this embodiment, a random sample set algorithm may be used to calculate a conversion matrix of a first feature point to a second feature point of a plurality of sets of feature point pairs, in order to accurately describe a template map of the target printed circuit board to a test map. Relationship, the set of feature points with the smallest selection error is the calculated conversion matrix as the template of the target printed circuit board to the conversion matrix of the test chart.
在实际应用时,第一特征点和第二特征点可以以坐标或者向量的形式进行表示,这也有利于根据第一特征点和第二特征点,计算得到第一特征点到第二特征点的转换矩阵。In practical applications, the first feature point and the second feature point may be represented in the form of coordinates or vectors, which is also advantageous for calculating the first feature point to the second feature point according to the first feature point and the second feature point. Conversion matrix.
在具体实施时,如果测试图中没有目标印制电路板的图像,而模板图中只有一张该目标印制电路板的图像时,也有可能计算得到这样的转换矩阵,从而形成错误的配对。因此,为了进一步提高本发明的印制电路板图像匹配方法的准确率,可以对测试图中的目标印制 电路板的形态先验进行过滤。In a specific implementation, if there is no image of the target printed circuit board in the test chart, and there is only one image of the target printed circuit board in the template image, it is also possible to calculate such a conversion matrix, thereby forming an incorrect pairing. Therefore, in order to further improve the accuracy of the printed circuit board image matching method of the present invention, the target in the test chart can be printed. The shape of the board is filtered a priori.
在其中一个实施例中,本发明的印制电路板图像匹配系统,在所述匹配模块104之后,还可以包括:In one embodiment, the printed circuit board image matching system of the present invention, after the matching module 104, may further include:
形态先验模块109,用于通过比较测试图和模板图中的目标印制电路板图像的形态特征,对测试图中与模板图中的目标印制电路板图像的形态特征不一致的目标印制电路板图像进行过滤。The shape prior module 109 is configured to compare the morphological features of the target printed circuit board image in the test chart and the template image to print the target image in the test chart that is inconsistent with the morphological feature of the target printed circuit board image in the template image. The board image is filtered.
由于印制电路板的图像区域一般为凸多边形,因此可假设模板图中的目标印制电路板的图像区域经过映射后,也应该是一个凸多边形;而且,经过测试图中的经过映射后的目标印制电路板的图像区域的面积,也应与模板图中的目标印制电路板的图像区域大致相当。因此,在实际应用中,本发明的印制电路板图像匹配系统,可以利用形态先验模块109通过判断测试图中的经过映射后的目标印制电路板的图像区域是否仍为凸多边形且其面积与模板图中的目标印制电路板的图像区域大致相当,来断定本次匹配是否成功。如果匹配成功,则输出本次匹配出来的经过几何矫正的印制电路板图像,否则结束本次匹配过程。Since the image area of the printed circuit board is generally a convex polygon, it can be assumed that the image area of the target printed circuit board in the template image is also a convex polygon after being mapped; and, after being mapped in the test chart The area of the image area of the target printed circuit board should also be approximately equivalent to the image area of the target printed circuit board in the template image. Therefore, in practical applications, the printed circuit board image matching system of the present invention can utilize the shape prior module 109 to determine whether the image area of the mapped target printed circuit board in the test chart is still a convex polygon and The area is roughly equivalent to the image area of the target printed circuit board in the template map to determine whether the match was successful. If the matching is successful, the geometrically corrected printed circuit board image that is matched this time is output, otherwise the matching process is ended.
上述印制电路板图像匹配方法和系统,通过分别对获取的目标印制电路板的模板图和测试图进行特征点提取,得到所述模板图的第一特征点集和测试图的第二特征点集;再计算第一特征点集的第一特征点和第二特征点集的第二特征点之间的相似度值,根据所述相似度值对所述第一特征点和第二特征点进行配对,得到特征点对;根据所述特征点对计算所述目标印制电路板的模板图到测试图的转换矩阵,并利用所述转换矩阵查找测试图中与模板图相匹配的印制电路板图像。通过上述技术方案,本发明的印制电路板图像匹配方法,实现了对印制电路板图像的快速匹配,有效地提高了印制电路板图像匹配方法的准确性。The above-mentioned printed circuit board image matching method and system, by performing feature point extraction on the template image and the test pattern of the obtained target printed circuit board respectively, obtaining the first feature point set of the template image and the second feature of the test chart a point set; recalculating a similarity value between the first feature point of the first feature point set and the second feature point of the second feature point set, and the first feature point and the second feature according to the similarity value Pointing is performed to obtain a pair of feature points; calculating a conversion matrix of the template of the target printed circuit board to the test pattern according to the feature point pair, and using the conversion matrix to find a print matching the template image in the test chart Board image. Through the above technical solution, the printed circuit board image matching method of the invention realizes the fast matching of the printed circuit board image, and effectively improves the accuracy of the printed circuit board image matching method.
以上所述实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。The technical features of the above-described embodiments may be arbitrarily combined. For the sake of brevity of description, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be considered as the scope of this manual.
以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。 The above-described embodiments are merely illustrative of several embodiments of the present invention, and the description thereof is more specific and detailed, but is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be determined by the appended claims.

Claims (10)

  1. 一种印制电路板图像匹配方法,其特征在于,包括如下步骤:A printed circuit board image matching method, comprising the steps of:
    获取目标印制电路板的模板图和测试图;其中,所述模板图为所述目标印制电路板的经过角度矫正的图像,所述测试图为所述目标印制电路板的未经角度矫正的图像;Obtaining a template image and a test chart of the target printed circuit board; wherein the template image is an angle-corrected image of the target printed circuit board, the test chart is an angle of the target printed circuit board Corrected image;
    分别对所述模板图和测试图进行特征点提取,获取所述模板图的第一特征点集和测试图的第二特征点集;Performing feature point extraction on the template graph and the test graph respectively, and acquiring a first feature point set of the template graph and a second feature point set of the test graph;
    计算第一特征点集的第一特征点和第二特征点集的第二特征点之间的相似度值,根据所述相似度值对所述第一特征点和第二特征点进行配对,得到特征点对;Calculating a similarity value between the first feature point of the first feature point set and the second feature point of the second feature point set, and pairing the first feature point and the second feature point according to the similarity value, Obtaining feature point pairs;
    根据所述特征点对计算所述目标印制电路板的模板图到测试图的转换矩阵,并利用所述转换矩阵查找测试图中与模板图相匹配的印制电路板图像。Calculating a conversion matrix of the template of the target printed circuit board to the test pattern according to the feature point pair, and using the conversion matrix to find a printed circuit board image in the test chart that matches the template image.
  2. 根据权利要求1所述的印制电路板图像匹配方法,其特征在于,所述分别对所述模板图和测试图进行特征点提取的步骤包括:The printed circuit board image matching method according to claim 1, wherein the step of performing feature point extraction on the template map and the test map separately comprises:
    利用KAZE算子构造单个Octave层的非线性尺度空间,并利用所述非线性尺度空间对所述模板图和测试图进行特征点提取。The nonlinear scale space of a single Octave layer is constructed by using a KAZE operator, and the feature points are extracted from the template map and the test map by using the nonlinear scale space.
  3. 根据权利要求1所述的印制电路板图像匹配方法,其特征在于,所述计算第一特征点集的第一特征点和第二特征点集的第二特征点之间的相似度值的步骤包括:The printed circuit board image matching method according to claim 1, wherein the calculating a similarity value between the first feature point of the first feature point set and the second feature point of the second feature point set The steps include:
    利用多探头索引函数对第一特征点集的第一特征点和第二特征点集的第二特征点进行索引检索,并计算所述第一特征点和第二特征点之间的度量距离;Indexing and retrieving the first feature point of the first feature point set and the second feature point of the second feature point set by using a multi-probe index function, and calculating a metric distance between the first feature point and the second feature point;
    根据所述度量距离确定所述第一特征点和第二特征点之间的相似度值。And determining a similarity value between the first feature point and the second feature point according to the metric distance.
  4. 根据权利要求1所述的印制电路板图像匹配方法,其特征在于,在所述得到所述第一特征点集和第二特征点集的特征点对的步骤之后,还包括:The printed circuit board image matching method according to claim 1, further comprising: after the step of obtaining the feature point pairs of the first feature point set and the second feature point set, further comprising:
    计算所述特征点对中的第一特征点和第二特征点之间的最佳匹配距离和次佳匹配距离;Calculating a best matching distance and a second best matching distance between the first feature point and the second feature point in the pair of feature points;
    通过比较所述最佳匹配距离与次佳匹配距离的差距与预设阈值的大小关系,判断所述特征点对的可靠性,根据可靠性对特征点对进行过滤。The reliability of the feature point pair is determined by comparing the difference between the best matching distance and the sub-optimal matching distance and the preset threshold value, and the feature point pair is filtered according to the reliability.
  5. 根据权利要求4所述的印制电路板图像匹配方法,其特征在于,所述通过比较所述最佳匹配距离与次佳匹配距离的差距与预设阈值的大小关系,判断所述特征点对的可靠性,根据可靠性对特征点对进行过滤的步骤包括: The printed circuit board image matching method according to claim 4, wherein the determining the feature point pair by comparing a difference between the best matching distance and a sub-optimal matching distance and a preset threshold value Reliability, the steps of filtering feature point pairs based on reliability include:
    若所述最佳匹配距离与次佳匹配距离的差距大于预设阈值,则判定所述特征点对可靠;否则,判定所述特征点对不可靠,并对所述特征点对进行过滤。If the difference between the best matching distance and the sub-optimal matching distance is greater than a preset threshold, determining that the feature point pair is reliable; otherwise, determining that the feature point pair is unreliable, and filtering the feature point pair.
  6. 根据权利要求1所述的印制电路板图像匹配方法,其特征在于,所述计算所述多组特征点对中的第一特征点到第二特征点的转换矩阵的步骤包括:The printed circuit board image matching method according to claim 1, wherein the calculating the conversion matrix of the first feature point to the second feature point of the plurality of sets of feature point pairs comprises:
    利用随机样本集算法计算多组特征点对中的第一特征点到第二特征点的转换矩阵;Calculating a transformation matrix of the first feature point to the second feature point of the plurality of sets of feature point pairs by using a random sample set algorithm;
    在所述利用随机样本集算法计算多组特征点对中的第一特征点到第二特征点的转换矩阵的步骤之后,还包括:After the step of calculating a conversion matrix of the first feature point to the second feature point of the plurality of sets of feature point pairs by using the random sample set algorithm, the method further includes:
    选择误差最小的一组特征点对所计算得到的转换矩阵作为所述模板图到测试图的转换矩阵;其中,所述转换矩阵表示模板图中的目标印制电路板图像到与模板图中的目标印制电路板图像对应的测试图中的印制电路板图像的映射关系。Selecting a set of feature points with the smallest error pair as the conversion matrix of the template map to the test chart; wherein the conversion matrix represents the target printed circuit board image in the template image to the template image The mapping relationship of the printed circuit board images in the test chart corresponding to the target printed circuit board image.
  7. 根据权利要求1所述的印制电路板图像匹配方法,其特征在于,在所述利用所述转换矩阵查找测试图中与模板图相匹配的印制电路板的图像的步骤之后,还包括:The printed circuit board image matching method according to claim 1, wherein after the step of using the conversion matrix to search for an image of the printed circuit board that matches the template image in the test pattern, the method further includes:
    根据所述模板图中的印制电路板图像对测试图中的印制电路板图像进行矫正。The printed circuit board image in the test chart is corrected based on the printed circuit board image in the template map.
  8. 根据权利要求1所述的印制电路板图像匹配方法,其特征在于,所述获取目标印制电路板的模板图和测试图的步骤包括:The printed circuit board image matching method according to claim 1, wherein the step of acquiring a template map and a test pattern of the target printed circuit board comprises:
    获取多个目标印制电路板的模板图和测试图;其中,所述模板图为所述多个目标印制电路板的经过角度矫正的图像,所述测试图为所述多个目标印制电路板的未经角度矫正的图像;Obtaining a template image and a test chart of the plurality of target printed circuit boards; wherein the template image is an angle-corrected image of the plurality of target printed circuit boards, and the test chart is printed for the plurality of targets An unangled image of the board;
    所述根据所述特征点对计算所述目标印制电路板的模板图到测试图的转换矩阵,并利用所述转换矩阵查找测试图中与模板图相匹配的印制电路板图像的步骤包括:Calculating, according to the feature point pair, a template of the target printed circuit board to a conversion matrix of the test pattern, and using the conversion matrix to search for a printed circuit board image matching the template image in the test image, including :
    根据所述特征点对计算其中一个目标印制电路板的模板图到测试图的转换矩阵,并利用所述转换矩阵查找测试图中与模板图相匹配的所述其中一个目标印制电路板图像;Calculating a conversion matrix of the template image of one of the target printed circuit boards to the test pattern according to the feature point pair, and using the conversion matrix to find the one of the target printed circuit board images in the test chart that matches the template image ;
    在所述利用所述转换矩阵查找测试图中与模板图相匹配的所述其中一个目标印制电路板图像的步骤之后,还包括:After the step of using the conversion matrix to find the one of the target printed circuit board images in the test chart that matches the template image, the method further includes:
    将所述特征点对进行屏蔽,对多个目标印制电路板图像中的其他印制电路板图像进行匹配。The feature point pairs are masked to match other printed circuit board images in the plurality of target printed circuit board images.
  9. 根据权利要求1所述的印制电路板图像匹配方法,其特征在于,在所述利用所述转换矩阵查找测试图中与模板图相匹配的目标印制电路板图像的步骤之后,还包括: The printed circuit board image matching method according to claim 1, wherein after the step of using the conversion matrix to search for a target printed circuit board image matching the template image in the test pattern, the method further comprises:
    通过比较测试图和模板图中的目标印制电路板图像的形态特征,对测试图中与模板图中的目标印制电路板图像的形态特征不一致的目标印制电路板图像进行过滤。By comparing the morphological features of the target printed circuit board image in the test chart and the template image, the target printed circuit board image in the test chart that is inconsistent with the morphological features of the target printed circuit board image in the template image is filtered.
  10. 一种印制电路板图像匹配系统,其特征在于,包括:A printed circuit board image matching system, comprising:
    获取模块,用于获取目标印制电路板的模板图和测试图;其中,所述模板图为所述目标印制电路板的经过角度矫正的图像,所述测试图为所述目标印制电路板的未经角度矫正的图像;An acquisition module, configured to obtain a template image and a test chart of the target printed circuit board; wherein the template image is an angle corrected image of the target printed circuit board, and the test chart is the target printed circuit An unangled image of the board;
    提取模块,用于分别对所述模板图和测试图进行特征点提取,获取所述模板图的第一特征点集和测试图的第二特征点集;An extraction module, configured to perform feature point extraction on the template image and the test image respectively, and acquire a first feature point set of the template image and a second feature point set of the test image;
    配对模块,用于计算第一特征点集的第一特征点和第二特征点集的第二特征点之间的相似度值,根据所述相似度值对所述第一特征点和第二特征点进行配对,得到特征点对;a pairing module, configured to calculate a similarity value between the first feature point of the first feature point set and the second feature point of the second feature point set, and the first feature point and the second feature point according to the similarity value Feature points are paired to obtain feature point pairs;
    匹配模块,用于根据所述特征点对计算所述目标印制电路板的模板图到测试图的转换矩阵,并利用所述转换矩阵查找测试图中与模板图相匹配的印制电路板图像。 a matching module, configured to calculate a conversion matrix of the template map of the target printed circuit board to the test pattern according to the feature point pair, and use the conversion matrix to search for a printed circuit board image in the test chart that matches the template image .
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CN111340701B (en) * 2020-02-24 2022-06-28 南京航空航天大学 Circuit board image splicing method for screening matching points based on clustering method
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CN114018935A (en) * 2021-11-05 2022-02-08 苏州中锐图智能科技有限公司 Multipoint rapid calibration method
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CN116523852A (en) * 2023-04-13 2023-08-01 成都飞机工业(集团)有限责任公司 Foreign matter detection method of carbon fiber composite material based on feature matching

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