WO2017184635A1 - Échangeurs de chaleur à microcanaux stratifiés - Google Patents

Échangeurs de chaleur à microcanaux stratifiés Download PDF

Info

Publication number
WO2017184635A1
WO2017184635A1 PCT/US2017/028183 US2017028183W WO2017184635A1 WO 2017184635 A1 WO2017184635 A1 WO 2017184635A1 US 2017028183 W US2017028183 W US 2017028183W WO 2017184635 A1 WO2017184635 A1 WO 2017184635A1
Authority
WO
WIPO (PCT)
Prior art keywords
sheets
microchannels
cross
heat exchanger
thermally conductive
Prior art date
Application number
PCT/US2017/028183
Other languages
English (en)
Inventor
Richard Todd Miller
Steven G. Schon
Original Assignee
Oregon State University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oregon State University filed Critical Oregon State University
Priority to US16/072,501 priority Critical patent/US11732978B2/en
Priority to CN201780037866.1A priority patent/CN109416224B/zh
Priority to KR1020187033234A priority patent/KR102494649B1/ko
Priority to EP17786489.9A priority patent/EP3446059B1/fr
Publication of WO2017184635A1 publication Critical patent/WO2017184635A1/fr
Priority to IL263805A priority patent/IL263805A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • F28F7/02—Blocks traversed by passages for heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/24—Safety or protection arrangements; Arrangements for preventing malfunction for electrical insulation

Definitions

  • This invention relates to microchannel-based heat exchangers, including microchannel-based evaporators used to cool heat sources with high heat fluxes such as electronic devices.
  • Fluid heat exchangers are used to remove waste heat from high-heat flux heat sources (typically in excess of 5 watts/cm , and often substantially higher) by accepting and dissipating thermal energy therefrom.
  • high-heat flux heat sources include microelectronics, such as microprocessors and memory devices, solid-state light emitting diodes (LEDs) and lasers, insulated-gate bipolar transistor (IGBT) devices, such as power supplies, photovoltaic cells, radioactive thermal generators and fuel rods, and internal combustion engines.
  • the fluid heat exchangers dissipate heat by thermally conducting the heat into internal passages of the exchanger, through which a coolant fluid flows, absorbing the heat conducted across the walls of the exchanger, and then transporting the fluid outside the exchanger, where the heat is rejected to an external heat sink.
  • the coolant fluid flowing through the exchanger may be a gas, it is generally preferable to use a liquid, as liquids have higher heat capacities and heat transfer coefficients than gases.
  • the liquid may remain in a single phase, or the liquid may partially or completely evaporate within the internal passages of the exchanger.
  • the flow of coolant liquid fed to the fluid heat exchanger may be driven by a pump, or by natural convection due to density differences and/or elevation between the incoming and exiting fluid (e.g. thermosyphons), or by capillary action in the internal passages of the exchanger, or by a combination of these mechanisms.
  • a pump or by natural convection due to density differences and/or elevation between the incoming and exiting fluid (e.g. thermosyphons), or by capillary action in the internal passages of the exchanger, or by a combination of these mechanisms.
  • Evaporator-type exchangers rely on the boiling mode, and have the advantages of higher heat transfer coefficients (better heat transfer) per unit of fluid flow rate of the coolant fluid. They also require much less coolant flow, as the majority of the heat is absorbed through via the latent heat of vaporization of the boiling fluid, rather than the sensible heat (heat capacity) of a single-phase liquid or gas.
  • microchannels i.e. channels having cross-sections with a smallest dimension of less than 1000 microns, and more typically, in the range of 50 - 500 microns.
  • the invention features a microchannel heat exchanger that includes a cover, a base, and thermally conductive sheets between the cover and the base that each define a series of side-by-side lanes aligned with a flow direction.
  • the lanes each include aligned slots that define microchannel segments and are separated by cross ribs.
  • the sheets are stacked between the base and cover so as to cause at least some of the ribs to be offset from each other and allow the microchannel segments in the same lane in adjacent sheets to communicate with each other along the flow direction to define a plurality of microchannels in the heat exchanger.
  • the thermally conductive sheets can further define access channel openings at each end of the lanes, which when stacked create access channels for the microchannels.
  • the sheets can define a more dense packing of cross ribs in at least one inlet end of the heat exchanger to reduce the open cross-section at the inlet end of the lanes.
  • the aspect ratio of the microchannels can be above 4: 1.
  • the aspect ratio of the microchannels can be above 8: 1.
  • the apparatus can further include thermally conductive separator sheets located between groups of the thermally conductive sheets to form a multilayer heat exchanger.
  • the sheets can be made of at least one conductive metal.
  • the sheets can be made of sinterable thermally conductive ceramics. The sheets can be bonded or fused.
  • the microchannels can have a hydraulic diameter of below 500 microns.
  • the microchannels can have a hydraulic diameter of below 200 microns.
  • the base can be a base plate that is thicker than each of the sheets and the cover can include access channels in communication with the microchannels.
  • the base can be thermally conductive yet electrically insulating.
  • the heat exchanger can be constructed for boiling or evaporating fluid service, with the heat exchanger further including flow restrictors at the inlet ends of the microchannels.
  • the flow restrictors can be formed by alternately closing an end of the first slot in a lane of slots with cross-ribs that are wider than the bulk of the cross-ribs between slots, with the alternating closed-ended lanes of slots being staggered with respect to the lanes of slots above or below, in alternating layers of slotted sheets, such that, when the sheets are stacked and bonded together, the cross-section of the parallel channels that are formed have a checkerboard pattern across the inlets of the plurality of channels, which serve as integral flow restrictors covering substantially 50% of a cross- sectional area of the main channels.
  • Systems according to the invention can help to suppress Ledinegg effects and thereby allow heat exchangers to work with two-phase systems.
  • microchannel evaporators according to the invention can avoid flow instabilities, due to the Ledinegg effect, whereby boiling within multiple (parallel) microchannels might otherwise be non-uniform and due to the interaction of varying pressure drop as boiling develops in the various channels, resulting in periodic backflow into the inlet header or manifold. This can help to achieve stabilized and substantially uniform boiling flows and thereby result in improved and more stable thermal performance when cooling high-flux heat sources.
  • Fig. 1 is a plan view of a first type of grooved sheet for inclusion in a grooved laminate structure that can be used to implement a microchannel heat exchanger;
  • Fig. 2 is a plan view of a portion of the first type of grooved sheet of Fig. 1 shown in rectangle 2 on Fig. 1;
  • Fig. 3 is a plan view of a portion of a second type of grooved sheet for inclusion in the grooved laminate structure
  • Fig. 4 is a plan view of a separator sheet for inclusion in the grooved laminate structure
  • Fig. 5 is a perspective cutaway of the laminate structure formed by alternating first and second sheet types as shown Figs. 1-4 in an orientation shown by arrow 5 in Figs. 2 and 3;
  • Fig. 6 is a more detailed cutaway view of the grooved laminate structure of Fig. 5;
  • Fig. 7 is a second perspective cutaway of the laminate structure of Fig. 5 showing flow paths through the structure of Fig. 5 in an orientation shown by arrow 7 in Figs. 2 and 3;
  • Fig. 8 is an exploded view of the laminated sheets for assembly into a grooved laminate core using the grooved laminated structure presented in Figs. 1-7;
  • Fig. 9 is an exploded perspective view of a portion of a microchannel heat exchanger using the laminated core of Fig. 8;
  • Fig 10 is a cross-sectional view of the grooved laminate structure of Fig. 5, taken through a plane that defines flow restrictors in the grooved laminate structure.
  • a microchannel heat exchanger can be assembled using a grooved laminated structure made up of a plurality of thermally conductive sheets.
  • One such sheet of a first type 40 is shown in Fig. 1. It includes common cut-out areas 42 that are separated lines 44 of slots 46 that define the microchannels.
  • the sheet of the first type 40 includes a plurality of lines 44 of multiple slots 46, with the slots in a given line being separated by thin wall that functions as a cross-rib 48. These lines span between the common cut-out areas connected to the slots at either end of each line of slots. The common cut-out areas align with each other to form input and output manifolds when sheets are stacked.
  • alternating two or more types of sheets allows the microchannels to be defined in three-dimensions.
  • the laminated core structure is assembled by alternating slotted-and-ribbed sheets having the cross-ribs staggered with respect to each other when the sheets are stacked so that each line of slots forms a continuous but serpentine flow path (see also Figs. 5-7).
  • thermally conductive un-slotted separator sheets 60 having cut-out areas 62 that align with the common cut-out areas of the slotted- and-ribbed sheets can also be used on the top and bottom of the core and/or to separate layers of microchannels.
  • stacking sets of the alternating slotted-and-ribbed-sheets, flanked by un-slotted separator sheets allows the formation of a core structure that includes one or more layers each having a plurality of microchannels with interspersed cross-ribs that intermittently partially interrupt the flow path with providing lateral strengthening of the channel walls.
  • the number of alternating slotted-and-ribbed-sheets in each layer, along with the sheet thickness and slot width, determines the channel depth : width aspect ratio of the channel layers.
  • the layered stacked sheets are preferably bonded to ensure that all the sheets are in thermally conductive communication with each other.
  • the resulting sub-assembly can then be bonded to a base plate 74 to ensure that the base plate is in thermally conductive communication with the microchannel layers, and a cover 78 can be placed and sealed on top of the resulting assembly of microchannel layers 76 bonded to the base plate, thereby forming a complete microchannel heat exchanger assembly 70.
  • the input sides of the microchannels preferably include flow restrictors where the exchanger is used in boiling or evaporative service. These restrictors can be built into the laminate structure by providing extra cross-ribs 82 at the inputs of the microchannels.
  • the laminated structures described above enable microchannel heat exchangers having one or more layers of microchannels with hydraulic diameters of less than 500 microns, with the microchannels having arbitrarily high depth : width aspect ratios and with thin walls.
  • the channels have internal cross-ribs connecting the channel's walls, and provide mechanical strength to the channel walls and way of breaking up the fluid stream lines to improve heat transfer.
  • the thermally conductive sheet and base plate materials are preferably, but not limited to, metals and their alloys; non-metallic elements, thermally conductive carbon allotropes, or thermally conductive ceramics. Bonding of the sheets can be by any convenient means that ensure high thermal conduction between the sheets and the base plate.
  • microchannels are formed by inserting, between stacks of slotted- and-ribbed sheets, additional thermally conductive un-slotted separator sheets having cut-out areas that align with the common cut-out areas of the slotted- and-ribbed sheets.
  • the microchannels of any layer may have the same or different depth: width aspect ratio and hydraulic diameter compared to the microchannels in the other layers.
  • the depth: width aspect ratio of the resulting microchannels can be at least 2: 1, and preferably between 4: 1 and 15: 1.
  • the walls between the resulting microchannels can be less than 200 microns and preferably between 40 and 100 microns thick.
  • the base plate and microchannel walls can be fabricated from materials having thermal
  • the hydraulic diameter of the resulting microchannels can be less than 500 microns, and preferably between 50 and 200 microns.
  • the liquid inlet channels can be provided with flow restrictors, to prevent back- flow or two-phase flow instabilities.
  • These inlet restrictions are provided by closing-off the inlet-side ends of the slots (e.g. by adding additional cross-ribs) of alternate sheets in the stacks of slotted- and-ribbed sheets, thereby reducing the open cross- sectional area of the inlets to the channels relative to the main channel cross-section beyond the closed portions.
  • microchannels is at least 1 mm.
  • microchannel heat exchanger e.g. microchannel stacks, base plate, and over plate
  • the various components of the microchannel heat exchanger can be bonded or fused, so that the exchanger is hermetically sealed (with the exception of the fluid inlet and outlet ports that
  • Bonding or fusing may be accomplished by any convenient means.
  • microchannel heat exchanger e.g. microchannel stacks, base plate, and over plate
  • the various components of the microchannel heat exchanger can also be held together by mechanical means, with suitable seals between components, so that the exchanger can hold elevated internal pressures.
  • the bottom base of the layer of the microchannel exchanger is made from or is coated with a thermally conductive yet electrically insulating ceramic or dielectric solid, such as aluminum nitride, silicon carbide, beryllium oxide, diamond film, and the like.
  • the microchannel exchanger then serves as the substrate for (heat generating) electronic components, which are mounted on, and in thermal contact with, the electrically insulating but thermally conductive underside surface of the exchanger.
  • microchannel heat exchanger e.g. the thermally conductive base, the microchannel layers, manifolds, covers, fluid inlet and outlet ports, the slotted-and-ribbed sheets, etc.
  • thermally conductive base e.g. the thermally conductive base
  • microchannel layers e.g. the thermally conductive base
  • manifolds e.g. the thermally conductive base
  • covers e.g. the thermally conductive base
  • fluid inlet and outlet ports e.g. the thermally conductive base
  • slotted-and-ribbed sheets, etc. may be fabricated by any convenient means consistent with the final assembly of the heat exchangers. Such means may include, but are not limited to, the following methods and combinations thereof:
  • Subtractive manufacturing techniques such as mechanical machining, milling, etching, punching, photochemical machining, laser ablation or micromachining, electrical discharge machining (EDM), ultrasonic machining, water-jet cutting, etc.
  • the sheets may have repeating areas of the patterns, so that after bonding, the bonded assemblies may be cut or diced into individual microchannel exchangers or exchanger sub-assemblies.
  • additive manufacturing techniques (3-D printing) as selective laser sintering, direct metal laser sintering, selective laser melting, stereo-lithography, fused deposition modeling, etc.
  • Bonding or fusing techniques such diffusion bonding, brazing, soldering, welding, sintering, etc.
  • Embodiments according to the invention can be developed for a variety of different cooling configurations and applied to a variety of different cooling tasks. For example, they can implemented in connection with the teachings of published PCT application no. WO2009/085307, filed December 26, 2008 and published US application no. US-2009-0229794, filed on November 10, 2008, which are both herein incorporated by reference.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

Selon un aspect général, l'invention concerne un échangeur de chaleur à microcanaux. Ledit échangeur comprend un couvercle, une base et des feuilles thermoconductrices entre le couvercle et la base qui délimitent chacune une série de voies côte à côte alignées avec une direction d'écoulement. Les voies comprennent chacune des fentes alignées qui délimitent des segments de microcanaux et sont séparées par des nervures transversales. Les feuilles sont empilées entre la base et le couvercle de façon à amener au moins certaines des nervures à être décalées les unes par rapport aux autres et à permettre aux segments de microcanaux dans la même voie dans des feuilles adjacentes de communiquer les uns avec les autres dans la direction d'écoulement afin de délimiter une pluralité de microcanaux dans l'échangeur de chaleur.
PCT/US2017/028183 2016-04-18 2017-04-18 Échangeurs de chaleur à microcanaux stratifiés WO2017184635A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US16/072,501 US11732978B2 (en) 2016-04-18 2017-04-18 Laminated microchannel heat exchangers
CN201780037866.1A CN109416224B (zh) 2016-04-18 2017-04-18 层压微通道热交换器
KR1020187033234A KR102494649B1 (ko) 2016-04-18 2017-04-18 라미네이트 마이크로채널 열 교환기
EP17786489.9A EP3446059B1 (fr) 2016-04-18 2017-04-18 Échangeurs de chaleur à microcanaux stratifiés
IL263805A IL263805A (en) 2016-04-18 2018-12-18 Heat exchangers based on micro-channels with sheets

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201662324327P 2016-04-18 2016-04-18
US62/324,327 2016-04-18
US201715402511A 2017-01-10 2017-01-10
US15/402,511 2017-01-10

Publications (1)

Publication Number Publication Date
WO2017184635A1 true WO2017184635A1 (fr) 2017-10-26

Family

ID=60116305

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2017/028183 WO2017184635A1 (fr) 2016-04-18 2017-04-18 Échangeurs de chaleur à microcanaux stratifiés

Country Status (5)

Country Link
EP (1) EP3446059B1 (fr)
KR (1) KR102494649B1 (fr)
CN (1) CN109416224B (fr)
IL (1) IL263805A (fr)
WO (1) WO2017184635A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113446883A (zh) * 2021-06-25 2021-09-28 西安交通大学 一种基于弹性湍流的双流体回路错排波型微通道散热器
US11732978B2 (en) 2016-04-18 2023-08-22 Qcip Holdings, Llc Laminated microchannel heat exchangers
WO2024086850A1 (fr) * 2022-10-21 2024-04-25 Semiconductor Components Industries, Llc Modules de puissance moulés à substrats refroidis par canal fluidique

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI827117B (zh) * 2022-06-29 2023-12-21 國立勤益科技大學 3d列印微流體熱沉應用在彈性電子設備的散熱裝置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1158549A (zh) * 1996-02-29 1997-09-03 中国科学院上海光学精密机械研究所 微通道冷却热沉
US20070084585A1 (en) * 2005-10-05 2007-04-19 Seiko Epson Corporation Heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, electronic device unit, and electronic equipment
US20090283244A1 (en) * 2008-05-13 2009-11-19 Raschid Jose Bezama Stacked and Redundant Chip Coolers
US9310135B1 (en) 2010-05-28 2016-04-12 Cool Energy, Inc. Configureable heat exchanger

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2701554B1 (fr) * 1993-02-12 1995-05-12 Transcal Echangeur de chaleur pour composants électroniques et appareillages électro-techniques.
FR2763204A1 (fr) * 1997-05-12 1998-11-13 Ferraz Echangeur de chaleur pour composants electroniques et appareillages electrotechniques
US6446442B1 (en) * 1999-10-07 2002-09-10 Hydrocool Pty Limited Heat exchanger for an electronic heat pump
US20050189342A1 (en) * 2004-02-23 2005-09-01 Samer Kabbani Miniature fluid-cooled heat sink with integral heater
KR100594185B1 (ko) * 2004-12-02 2006-06-28 주식회사 이노윌 3차원 마이크로 채널을 구비한 플레이트 및 이를 이용한열교환기
CN1946278A (zh) * 2005-10-05 2007-04-11 精工爱普生株式会社 热交换器、其制造方法、液冷系统、光源装置、投影机、电子器件单元及电子设备
CN100584169C (zh) * 2006-04-21 2010-01-20 富准精密工业(深圳)有限公司 液冷散热装置
CN201830605U (zh) * 2010-10-12 2011-05-11 讯凯国际股份有限公司 液冷散热装置及其热交换器
CN201897410U (zh) * 2010-12-01 2011-07-13 杭州沈氏换热器有限公司 一种微通道换热器
CN102003899B (zh) * 2010-12-01 2012-05-02 杭州沈氏换热器有限公司 一种微通道换热器
JP5944104B2 (ja) * 2011-03-15 2016-07-05 株式会社東芝 熱交換器
PT2730878T (pt) * 2012-11-07 2019-05-30 Alfa Laval Corp Ab Bloco de placas e método de fazer um bloco de placas

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1158549A (zh) * 1996-02-29 1997-09-03 中国科学院上海光学精密机械研究所 微通道冷却热沉
US20070084585A1 (en) * 2005-10-05 2007-04-19 Seiko Epson Corporation Heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, electronic device unit, and electronic equipment
US20090283244A1 (en) * 2008-05-13 2009-11-19 Raschid Jose Bezama Stacked and Redundant Chip Coolers
US9310135B1 (en) 2010-05-28 2016-04-12 Cool Energy, Inc. Configureable heat exchanger

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3446059A4

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11732978B2 (en) 2016-04-18 2023-08-22 Qcip Holdings, Llc Laminated microchannel heat exchangers
CN113446883A (zh) * 2021-06-25 2021-09-28 西安交通大学 一种基于弹性湍流的双流体回路错排波型微通道散热器
WO2024086850A1 (fr) * 2022-10-21 2024-04-25 Semiconductor Components Industries, Llc Modules de puissance moulés à substrats refroidis par canal fluidique

Also Published As

Publication number Publication date
CN109416224B (zh) 2022-05-06
KR20190016489A (ko) 2019-02-18
EP3446059A4 (fr) 2020-01-01
EP3446059A1 (fr) 2019-02-27
IL263805A (en) 2019-03-31
CN109416224A (zh) 2019-03-01
KR102494649B1 (ko) 2023-01-31
EP3446059B1 (fr) 2024-06-26

Similar Documents

Publication Publication Date Title
EP3446058B1 (fr) Évaporateurs à microcanaux ayant une chute de pression réduite
US11732978B2 (en) Laminated microchannel heat exchangers
EP3446059B1 (fr) Échangeurs de chaleur à microcanaux stratifiés
US6935411B2 (en) Normal-flow heat exchanger
US7836597B2 (en) Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US7302998B2 (en) Normal-flow heat exchanger
US7278474B2 (en) Heat exchanger
JP5052350B2 (ja) マイクロチャネル冷却を備えたヒートシンク
US8561673B2 (en) Sealed self-contained fluidic cooling device
US20120006383A1 (en) Heat exchanger apparatus and methods of manufacturing cross reference
CN110364501B (zh) 一种微流道散热结构、制造方法及电子器件
JP2006202899A (ja) 半導体冷却装置
US20220282931A1 (en) Heat exchanger device
TW201315960A (zh) 疊層式散熱器
CN110335854B (zh) 一种强制对流微流道散热结构、制造方法及电子器件
WO2002055942A2 (fr) Echangeur thermique a debit normal
CN116666329A (zh) 冷却集成的氮化镓模块及其制备方法
JP2005209874A (ja) 放熱器
US20110100603A1 (en) Microchannel cooling device for small heat sources

Legal Events

Date Code Title Description
NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20187033234

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 2017786489

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2017786489

Country of ref document: EP

Effective date: 20181119

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17786489

Country of ref document: EP

Kind code of ref document: A1