WO2017184335A1

WO2017184335A1 - Self-sealing ejector pin for composite consolidation molding and process of using a self-sealing ejector pin for composite consolidation molding

Info

Publication number: WO2017184335A1
Application number: PCT/US2017/026107
Authority: WO
Inventors: Christopher Wall
Original assignee: Sabic Global Technologies B.V.
Priority date: 2016-04-19
Filing date: 2017-04-05
Publication date: 2017-10-26

Abstract

A self-sealing ejector pin apparatus includes an ejector pin including an ejector pin barrel configured to be arranged in an ejector pin guide of a molding machine and an ejector pin head arranged at a first end of the ejector pin. The ejector pin head and the ejector pin barrel are configured to move in a first direction in the ejector pin guide to an extended position to eject a molded component. The apparatus further includes an ejector pin biasing component located at a second end of the ejector pin, the second end opposite the first end and the ejector pin biasing component configured to bias the ejector pin head and the ejector pin barrel in the second direction to the retracted position. The ejector pin head is tapered such that a width of the ejector pin head is wider than a diameter of the ejector pin barrel.

Description

SELF-SEALING EJECTOR PIN FOR COMPOSITE CONSOLIDATION MOLDING AND PROCESS OF USING A SELF-SEALING EJECTOR PIN FOR COMPOSITE

CONSOLIDATION MOLDING

BACKGROUND OF THE DISCLOSURE

1 . Field of the Disclosure

[0001] This disclosure is directed to a self-sealing ejector pin, and particularly to a self-sealing ejector pin and process for composite consolidation molding.

2. Related Art

[0002] When forming composites, it is common to have issues with ejection systems. In this regard, it is common to make tooling without ejector pins so as to avoid any issues with ejection and simply remove parts by hand. Hand removal becomes more difficult when more complex geometry is involved with the tooling and a mechanical ejection system is necessary. Moreover, hand removal is slow and labor intensive. As previously noted and illustrated in FIG. 5, mechanical ejection systems 3 become problematic in mold consolidation of composites 6. In particular, a tool 1 reaches high temperatures, to a point that material is flowing within the mold (to fully consolidate the composite), then material will typically flow into small clearances 4. These small clearances 4 are typically fine in processes such as injection molding. However, for consolidation of composites 6, the conventional ejection system 3 is no longer plausible for preventing material from flashing into the small clearances 4 associated with an ejector pin 2 of the ejection system 3. In this regard, the plastic material can make its way into the small clearances 4 in and around the ejector pin 2 and prevent the ejector pin 2 from moving once the material solidifies. [0003] What is needed is an ejector pin that prevents material from flashing into ejector systems during a composite consolidation or forming process.

SUMMARY OF THE DISCLOSURE

[0004] According to an aspect of the disclosure, a self-sealing ejector pin apparatus for a molding machine includes an ejector pin including an ejector pin barrel configured to be arranged in an ejector pin guide of the molding machine, an ejector pin head arranged at a first end of the ejector pin, the ejector pin head and the ejector pin barrel are configured to move in a first direction in the ejector pin guide to an extended position to eject a molded component, the ejector pin head and the ejector pin barrel are configured to move in a second direction in the ejector pin guide to a retracted position, the second direction opposite the first direction, an ejector pin biasing component located at a second end of the ejector pin, the second end opposite the first end, and the ejector pin biasing component configured to bias the ejector pin head and the ejector pin barrel in the second direction to the retracted position. The ejector pin head is tapered such that a width of the ejector pin head is wider than a diameter of the ejector pin barrel.

[0005] According to an aspect of the disclosure, a method of ejecting a product from a molding machine includes arranging an ejector pin including an ejector pin barrel in an ejector pin guide of the molding machine, arranging an ejector pin head arranged at a first end of the ejector pin, moving the ejector pin head and the ejector pin barrel in a second direction in the ejector pin guide to a retracted position, the second direction opposite a first direction, arranging an ejector pin biasing component located at a second end of the ejector pin, the second end opposite the first end, biasing the ejector pin with a biasing component configured to bias the ejector pin head and the ejector pin barrel in the second direction to the retracted position, forming a molded component in the molding machine, and moving the ejector pin head and the ejector pin barrel in the first direction in the ejector pin guide to an extended position to eject the molded component. The ejector pin head is tapered such that a width of the ejector pin head is wider than a diameter of the ejector pin barrel.

[0006] Additional features, advantages, and aspects of the disclosure may be set forth or apparent from consideration of the following detailed description, drawings, and claims. Moreover, it is to be understood that both the foregoing summary of the disclosure and the following detailed description are exemplary and intended to provide further explanation without limiting the scope of the disclosure as claimed.

[0007] When attempting to consolidate and/or form composite material within a compression mold, high temperatures beyond a matrix resin's glass transition temperature are needed. The high temperatures may be in the range of 400° F (204.4 degree Celsius) to 600° F (315.6 degree Celsius). Other temperature ranges are contemplated as well. In this regard, temperature ranges will vary for given matrix resin. In one aspect using a polycarbonate matrix resin, the polycarbonate matrix resin may flow at 400° F (204.4 degree Celsius) and beyond. In one aspect using polypropylene, the polypropylene may melt at about 257° F (about 125° degree Celsius). In one aspect using polyetherimide, the polyetherimide may require upwards of 600° F (315.6 degree Celsius) in order to achieve material flow given that polyetherimide has a glass transition temperature of about 425° F (about 218.3 degree Celsius) and is typically processed near 700° F (near 371 .1 degree Celsius). During this step, material will typically flow. With a conventional ejector pin, a clearance around the ejector pin will allow material to flow adjacent the ejector pin causing the ejector pin to stick.

[0008] More specifically, in composite compression forming it is quite common for material to flow within the mold when trying to conduct high temperature forming or consolidation operations. This can then turn into a problem when you introduce ejector pins into the mold to eject the part. This can be a problem because when material flows at high temperatures, the viscosity of the material can be low enough to cause material to flow into the clearance around the ejector pin. If material flows adjacent the ejector pins, then the ejector pins will not move and therefore not eject the part. This is commonly combatted by tight tolerance ejector pins. However, these tight tolerances can be a problem due to thermal expansion of the tool material being used because galling can occur, for example, if the entire tool is not of a uniform temperature.

[0009] The ejector pin of the disclosure prevents and/or limits this from occurring during a composite consolidation/forming process and other similar processes. In this regard, the disclosure addresses this problem by creating a sealed surface to prevent material from flowing into the clearance areas. For example, a steel to steel sealed surface. In one aspect, a spring may be located at a base of the ejector pin and the spring applies pressure during the forming and/or the consolidation process to prevent any material from flowing into the clearances. In other aspects, a different component may apply a pressure on the ejection pin during the forming and/or the consolidation process to prevent any material from flowing into the clearances. [0010] In one aspect, the ejector pin of the disclosure solves this problem by being spring loaded, tapered and therefore forming a surface shutoff. The disclosed ejector system prevents and/or limits material from flowing into ejection clearance areas as well as making tight tolerance pins unnecessary. Another issue that the disclosed ejector system solves is the non-uniformity of temperature between the ejector pins and a mold surface. Utilizing the disclosed surface shutoff, there may be a more intimate contact between the ejector pins and the mold surface, therefore there may be better thermal conduction between the mold and the ejector pins. This results in a more uniform temperature between the ejector pins and the mold surface. Moreover, decreases in thermal differences due to improved thermal contact between the ejection pin and the mold may lead to a more homogenous surface finish as well for a molded component.

[0011] Additionally, the disclosed ejector system allows for a more robust, more reliable ejection system allowing for a more continuous operation of the tool. Previous composite consolidation tools with conventional ejector pins have not been able to cycle for long periods (<100 cycles) as the ejector pins clog very quickly. Accordingly, the typical approach has been to simply not use ejector pins, and pry each part out of the mold cavity individually. This is very time consuming and strenuous. Moreover, this manual approach often results in a warped and/or damaged part.

[0012] In one aspect, an ejector pin of the disclosure may be used for a composite forming/consolidating tool. The ejector pin design is a self-sealing pin that may prevent material from flowing into ejector holes. A spring may apply pressure on a chamfered surface of the ejector pin allowing the ejector pin to have a seal preventing material from flowing by it.

[0013] In one aspect, the disclosure is directed to a spring loaded ejector pin that is tapered at the molding surface. The ejector pin would be subjected to a pressure forcing the pin downwards, effectively creating a shutoff surface that is under pressure. In some aspects, a tapered surface at a compression molding surface is configured to prevent material flow, a spring loaded mechanism to apply constant pressure when the composite material is being formed and/or consolidated, a clearance at the base of the ejector pin so as to provide the ejector pin room to float downwards and therefore forming a sealing surface. The spring may have multiple alternatives including a coil spring, Bellville spring, and the like. In some aspects, a pressurized air cylinder, hydraulic pressure or the like can be used in addition to the spring or in lieu of the spring.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings, which are included to provide a further understanding of the disclosure, are incorporated in and constitute a part of this specification, illustrate aspects of the disclosure and together with the detailed description serve to explain the principles of the disclosure. No attempt is made to show structural details of the disclosure in more detail than may be necessary for a fundamental understanding of the disclosure and the various ways in which it may be practiced. In the drawings: [0015] FIG. 1 shows an ejection system including an ejector pin constructed according to the principles of the disclosure.

[0016] FIG. 2 shows details of one end of the ejector pin of FIG. 1 during a molding process.

[0017] FIG. 3 shows details of one end of the ejector pin of FIG. 1 during the ejection process.

[0018] FIG. 4 shows details of another end of the ejector pin of FIG. 1 .

[0019] FIG. 5 shows a flowchart of a process of composite consolidation molding according to the principles of the disclosure with the ejector pin of FIG. 1 .

[0020] FIG. 6 shows a prior art ejector pin.

DETAILED DESCRIPTION OF THE DISCLOSURE

[0021] The aspects of the disclosure and the various features and advantageous details thereof are explained more fully with reference to the non-limiting aspects and examples that are described and/or illustrated in the accompanying drawings and detailed in the following description. It should be noted that the features illustrated in the drawings are not necessarily drawn to scale, and features of one aspect may be employed with other aspects as the skilled artisan would recognize, even if not explicitly stated herein. Descriptions of well-known components and processing techniques may be omitted so as to not unnecessarily obscure the aspects of the disclosure. The examples used herein are intended merely to facilitate an understanding of ways in which the disclosure may be practiced and to further enable those of skill in the art to practice the aspects of the disclosure. Accordingly, the examples and aspects herein should not be construed as limiting the scope of the disclosure, which is defined solely by the appended claims and applicable law. Moreover, it is noted that like reference numerals represent similar parts throughout the several views of the drawings.

[0022] FIG. 1 shows an ejection system including an ejector pin constructed according to the principles of the disclosure. In particular, FIG. 1 partially shows a molding machine 100 having an ejection system 150. The molding machine 100 may include a mold cavity 1 10 and a mold core 106. The mold core 106 may be configured to extend into the mold cavity 1 10 to form a molded component 108. During an initial molding process, the ejection system 150 is stationary and retracted.

[0023] The ejection system 150 includes an ejector pin 102. The ejector pin 102 may have a generally cylindrical cross-section along a portion 128 of its length. The portion 128 forming an ejector pin barrel. The ejector pin 102 may have other cross- sections including oval, square, polygonal, and the like. The ejector pin 102 may have a metallic construction. In one aspect the ejector pin 102 may be steel. In other aspects, the ejector pin 102 may be aluminum, brass, stainless steel, and the like. The ejector pin 102 may have other material constructions based on the application of the molding machine 100.

[0024] The mold cavity 1 10 may have a metallic construction. In one aspect, the mold cavity 1 10 may be steel. In other aspects, the mold cavity 1 10 may be aluminum, brass, stainless steel, and the like. The mold cavity 1 10 may have other material constructions based on the application of the molding machine 100. In one aspect, the mold cavity 1 10 may have the same material construction as the ejector pin 102. In one aspect, the mold cavity 1 10 may have a different material construction as the ejector pin 102. In one aspect, the mold cavity 1 10 may have a different material construction from the ejector pin 102, but both materials may have a similar coefficient of thermal expansion to reduce or limit galling.

[0025] The ejection system 150 may further include an ejector pin guide 1 12. The ejector pin guide 1 12 may have a cross-section having a similar shape to the ejector pin 102, but having a slightly larger size. The ejector pin guide 1 12 may extend from a first end 130 of the molding machine 100 to a second end 132 of the molding machine 100. The ejector pin guide 1 12 may allow the ejector pin 102 to move as shown by arrow 126 from an retracted position shown in FIG. 1 to an extended position shown in FIG. 3.

[0026] The ejector pin 102 may further include an ejector pin head 104 that contacts a surface of the molded component 108 at the first end 130 of the molding machine 100 along an edge of the molded component 108 when the ejection system 150 is retracted. The ejector pin head 104 may be constructed with the ejector pin 102. In one aspect, the ejector pin head 104 may be machined from a single piece of material with the ejector pin 102. For example, the machining may include drilling, boring, reaming, milling, and the like.

[0027] In one aspect, the ejector pin head 104 may be formed from a single piece of material with the ejector pin 102 utilizing metalworking. The metalworking may include bending, coining, decambering, deep drawing, flowforming, hydroforming, hot metal gas forming, hot press hardening, incremental forming, spinning, shear forming, flowforming, raising, roll forming, roll bending, repousse and chasing, rubber pad forming, shearing, stamping, superplastic forming, wheeling using an english wheel (wheeling machine), and the like. In one aspect, the ejector pin head 104 may be formed from a single piece of material with the ejector pin 102 utilizing casting.

[0028] Alternatively, the ejector pin head 104 may be a separate construction and attached to the ejector pin 102. In this regard, the ejector pin head 104 may be formed and attached to the ejector pin 102 with a mechanical fastener, threaded surfaces, welding, press fitting and the like.

[0029] The ejection system 150 may further include a biasing component configured to bias the ejector pin 102 in the direction of arrow 134. The biasing component may be a spring 1 16. The spring 1 16 may be configured to contact the ejector pin 102 directly or in directly to provide a force on the ejector pin 102 in a direction as shown by the arrow 134 to bias or urge the ejector pin 102 into the retracted position.

[0030] In some aspects, the ejection system 150 may use an additional biasing component to apply a force on the ejector pin 102 in the direction of the arrow 134 to urge the ejector pin 102 into the retracted position. The additional component may include a hydraulic actuator, a pneumatic actuator, an electromagnetic actuator, or the like.

[0031] In some aspects, the ejection system 150 may use an additional component to apply a force on the ejector pin 102 as shown by the arrow 134 to urge the ejector pin 102 into the retracted position in lieu of the spring 1 16. This additional component may include a hydraulic actuator, a pneumatic actuator, an electromagnetic actuator, or the like. [0032] If a hydraulic actuator is utilized, the hydraulic actuator may include a hydraulic cylinder and a source of pressurized hydraulic fluid configured as a hydraulic system. If a pneumatic actuator is utilized, the pneumatic actuator may include a pneumatic cylinder and a source of pressurized pneumatic fluid configured as a pneumatic system. If an electromagnetic actuator is utilized, the electromagnetic actuator may include a solenoid and a source of electrical power to operate the solenoid configured as an electromagnetic system. Other implementations of the additional component are contemplated as well.

[0033] In some aspects, the ejector pin 102 may further include an ejector pin end cap 120. The ejector pin end cap 120 may be a separate component from the ejector pin 102. Alternatively, the ejector pin end cap 120 may be formed from the ejector pin 102 by metalworking. The ejector pin end cap 120 may include a surface 1 18 configured to engage the spring 1 16 and receive a force from the spring 1 16 and apply the force to the ejector pin 102 as shown by the arrow 134 to urge the ejector pin 102 into the retracted position. The ejection system 150 may further include another surface 1 14 configured to contact another end of the spring 1 16. The ejector pin end cap 120 may be connected to the ejector pin 102 with a mechanical fastener, threaded surfaces, welding, press fitting and the like. In the aspect shown in FIG. 1 , the ejector pin end cap 120 may be connected to the ejector pin 102 with a mechanical fastener 122 having a mechanical fastener head 124. The mechanical fastener 122 may be a bolt, screw, pin, or the like.

[0034] The ejection system 150 may further include an ejector plate 140 configured to contact the second end 132 of the ejector pin 102 directly or indirectly to move the ejector pin 102 in the direction of arrow 142. The ejector plate 140 in some aspects may contact the ejector pin 102. The ejector plate 140 in some aspects may contact the ejector pin end cap 120. In some aspects, the ejector plate 140 may contact a plurality of ejector pins 102 in an ejection system 150 having a plurality of ejector pins 102. In some aspects, the ejector plate 140 may contact a plurality of ejector pin end caps 120 in an ejection system 150 having a plurality of ejector pins 102.

[0035] In operation, the ejector plate 140 may move in the direction of arrow 142 and contact the ejector pin 102 directly or indirectly to move a pin support structure 144 in the direction of arrow 142 with respect to the mold cavity 1 10 until a stop block 138 contacts the mold cavity 1 10 or some other intervening structure such as a lower surface 146 of the mold cavity 1 10. Thereafter, movement of the ejector plate 140, the pin support structure 144, and the ejector pin 102 may be stopped. Thereafter, the ejector plate 140 may be moved in the direction of arrow 134 with the assistance of a biasing component 136, which may be a spring or other structure. Likewise, movement of the ejector plate 140 may allow the ejector pin 102 and the pin support structure 144 to move in the direction of the arrow 134 as well.

[0036] FIG. 2 shows details of one end of the ejector pin of FIG. 1 during a molding process. In particular, FIG. 2 shows the ejector pin 102 and details of the ejector pin head 104. In this regard, the ejector pin head 104 may include an inclined surface that forms an ejector pin engagement surface 204. Likewise, the ejection system 150 at the first end 130 may include an inclined surface that forms a mold engagement surface 206 within the mold cavity 1 10. The mold engagement surface 206 may be formed as part of the ejector pin guide 1 12. The ejector pin head 104 may have a circular cross-section. In some aspects, the ejector pin head 104 may have other cross-sections including oval, square, polygonal, and the like. The ejector pin head 104 may have a conical shape in the region of the ejector pin engagement surface 204. A mold engagement surface 206 may likewise have a conical shape. In one aspect, the shape of the mold engagement surface 206 and the shape of the mold engagement surface 206 may be complementary to form a tight engagement 212 therebetween. In one aspect, the shape of the mold engagement surface 206 and the shape of the mold engagement surface 206 may be complementary chamfered surfaces. Other shapes for the ejector pin engagement surface 204 and the mold engagement surface 206 are contemplated as well as long as the shapes provide a tight engagement 212 therebetween.

[0037] The tight engagement 212 between the ejector pin engagement surface 204 and the mold engagement surface 206 ensures that plastic and other materials, during the composite consolidation molding process, do not enter or enter to a very limited extent, a clearance 210 between the ejector pin 102 and the ejector pin guide 1 12. Moreover, the tight engagement 212 allows the clearance 210 between the ejector pin 102 and the ejector pin guide 1 12 to be larger than prior art ejector pin clearances. In one aspect, the clearance 210 may be .002 inches (0.00508 centimeter) to .013 inches (0.03302 centimeter). In one aspect, the clearance 210 may be .004 inches (0.01016 centimeter) to .01 1 inches (0.02794 centimeter). In one aspect, the clearance 210 may be .005 inches (0.0127 centimeter) to .01 inches (0.0254 centimeter). In one aspect, the clearance 210 may be .007 inches (0.01778 centimeter) to .009 inches (0.02286 centimeter). In one aspect, the clearance 210 may be greater than .002 inches (0.00508 centimeter). In one aspect, the clearance 210 may be greater than .004 inches (0.01016 centimeter). In one aspect, the clearance 210 may be greater than .005 inches (0.0127 centimeter). In one aspect, the clearance 210 may be greater than .007 inches (0.01778 centimeter).

[0038] In one aspect, the tight engagement 212 between the ejector pin engagement surface 204 and the mold engagement surface 206 also ensures greater uniformity of temperature between the ejector pins 102 and a mold surface 214. In this regard, utilizing the tight engagement 212 between the ejector pin engagement surface 204 and the mold engagement surface 206, may result in a more intimate contact between the ejector pins 102 and the mold surface 214. Accordingly, there may be better thermal conduction between the mold surface 214 and the ejector pins 102. This results in a more uniform temperature between the ejector pins 102 and the mold surface 214. Moreover, decreases in thermal differences due to improved thermal contact between the ejector pin 102 and the mold surface 214 may lead to a more homogenous surface finish for the molded component 108 as well.

[0039] The tight engagement 212 between the ejector pin engagement surface 204 and the mold engagement surface 206 may be formed at an angle 208 between an axis of the ejector pin 102. In one aspect, the angle 208 may be between 10 degrees and 50 degrees with respect to a line shown in FIG. 2. In one aspect, the angle 208 may be between 10 degrees and 20 degrees with respect to a line shown in FIG. 2. In one aspect, the angle 208 may be between 20 degrees and 40 degrees with respect to a line shown in FIG. 2. In one aspect, the angle 208 may be between 25 degrees and 35 degrees with respect to a line shown in FIG. 2. In one aspect, the angle 208 may be about 30 degrees with respect to a line shown in FIG. 2. A value modified by a term or terms, such as "about," is intended to include a degree of error associated with measurement of the particular quantity based upon the equipment available at the time of filing this application. In some aspects, a smaller angle 208 may likely be more desirable as a pressure over a projected area at the surface 204 may increase with a smaller angle, therefore making a hard shutoff more effective in preventing material flow.

[0040] The ejector pin head 104 may further include an ejector pin contact surface 202. In one aspect, the ejector pin contact surface 202 may have a generally flat construction as shown in FIG. 2. In one aspect, the ejector pin contact surface 202 may have a generally flat construction as shown in FIG. 2 that is in the same plane as a mold surface 214. In one aspect, the ejector pin contact surface 202 may have a non- flat construction. In one aspect, the ejector pin contact surface 202 may have a non-flat construction such that edges of the ejector pin contact surface 202 are in the same plane as an edge of the mold surface 214. This aspect may be utilized when a molded component 108 has a curved surface or non-flat surface in proximity to the ejector pin engagement surface 204. In other words, the ejector pin engagement surface 204 may be shaped consistent with the molded component 108.

[0041] FIG. 3 shows details of one end of the ejector pin of FIG. 1 during the ejection process. In particular, the ejector pin 102 is shown having been actuated and extended in the direction shown by arrow 142. More specifically, the ejector pin 102 may be actuated and extended by an actuator 310 as noted in greater detail below. Moreover, during the ejection process, the mold core 106 has been removed from contact with the molded component 108. Accordingly, the ejector pin head 104 now extends in the direction of the arrow 142 displacing the molded component 108 in the direction of arrow 142.

[0042] FIG. 4 shows details of another end of the ejector pin of FIG. 1 . In particular, FIG. 4 shows details of the second end 132. The ejector pin end cap 120 may include an aperture 304 configured to receive a mechanical fastener 122 having a mechanical fastener head 124. More specifically, the aperture 304 may be sized to receive and hold the mechanical fastener head 124. The ejector pin 102 may further receive a threaded portion of the mechanical fastener 122 such that threads 302 of the mechanical fastener 122 engage corresponding threads of an aperture 308 of the ejector pin 102. Accordingly, the ejector pin end cap 120 may be rigidly held on the end of the ejector pin 102. Other constructions for attaching the ejector pin end cap 120 to the ejector pin 102 are contemplated as well. Other constructions for applying a bias force to the ejector pin 102 are contemplated as well.

[0043] As further detailed in FIG. 4, the ejector plate 140 may be arranged above a mold base 306. The mold base 306 may include an aperture 314 that is arranged for an actuator 310 and an actuator component 312 to extend through to contact the ejector plate 140. In operation, the actuator 310 may be actuated to extend the actuator component 312 through the aperture 314 to contact the ejector plate 140 to extend the ejector pin 102.

[0044] The actuator 310 may be a hydraulic actuator, a pneumatic actuator, an electromagnetic actuator, or the like. If a hydraulic actuator is utilized, the hydraulic actuator may include a hydraulic cylinder and a source of pressurized hydraulic fluid. If a pneumatic actuator is utilized, the pneumatic actuator may include a pneumatic cylinder and a source of pressurized pneumatic fluid. If an electromagnetic actuator is utilized, the electromagnetic actuator may include a solenoid and a source of electrical power to operate the solenoid.

[0045] FIG. 5 shows a flowchart of a process of composite consolidation molding according to the principles of the disclosure with the ejector pin of FIG. 1 . In particular, FIG. 5 shows a composite consolidation molding process using a self-sealing ejector pin 500.

[0046] In box 502, a mold cavity is configured with a self-sealing ejector pin of the disclosure. In particular, the ejector pin 102 may be configured with a tight engagement 212. The tight engagement 212 between the ejector pin engagement surface 204 and the mold engagement surface 206 ensures that plastic and other materials, during the composite consolidation molding process, do not enter or enter to a very limited extent, a clearance 210 between the ejector pin 102 and the ejector pin guide 1 12.

[0047] In box 504, composite materials may be inserted into the mold cavity and a mold core is inserted into the mold cavity. In one aspect, the composite materials inserted into the mold cavity 1 10 may be a layup that includes an un-consolidated arrangement of composite materials. In another aspect, the composite materials inserted into the mold cavity 1 10 can be a pre-consolidated laminate that is being formed. In one aspect, combined reinforcing and matrix materials may be inserted into the mold cavity 1 10. The materials may be previously combined and simply placed into the mold cavity 1 10. In another aspect, the materials may be separately inserted into the mold cavity 1 10.

[0048] In box 506, a component to be molded is compressed in the mold cavity 1 10 and heat is applied. In this regard, the materials may be compacted to undergo a melding event.

[0049] In box 508, a mold cavity may be cooled. In one aspect, the cooling may be implemented through the application of a coolant, such as water, circulated through the molding machine 100. Alternatively, the cooling may be implemented by exposure to ambient temperatures. Other cooling technologies are contemplated as well.

[0050] In box 510, a mold core is removed from the mold cavity 1 10. In this regard, the mold core 106 may be removed from the mold cavity 1 10 exposing the molded component 108.

[0051] In box 512, the ejector pin 102 is actuated to extend the molded component from the mold cavity. More specifically, after the mold cavity 1 10 has been removed, the actuator 310 may be operated to extend the actuator component 312 to contact directly or indirectly the ejector pin 102 to eject the molded component 108 out of the mold cavity 1 10.

[0052] The ejector pin of the disclosure prevents and/or limits the aforementioned issues of the prior art ejector pins from occurring during a composite consolidation/forming process and other similar processes. In this regard, the disclosure addresses this problem by creating a sealed surface to prevent material from flowing into the clearance areas. Aspects of the disclosure have already been prototyped and work effectively. The tool was cycled over a 100 times with no issues with the ejector pins getting stuck. Previous tools have had issues with ejector pins getting stuck after less than 5 parts being made. This would result in having to remove the tool and disassembling the ejector pins to address the failure.

[0053] A surprising effect was how well the thermal conductivity was between the ejector pins and the rest of the mold. The uniformity was surprising, less than a 10 degree Celsius (18 degree Fahrenheit difference) difference between the ejector pin and a mold surface.

Examples

[0054] Example 1 . A self-sealing ejector pin apparatus for a molding machine, the apparatus comprising: an ejector pin including an ejector pin barrel configured to be arranged in an ejector pin guide of the molding machine; an ejector pin head arranged at a first end of the ejector pin; the ejector pin head and the ejector pin barrel are configured to move in a first direction in the ejector pin guide to an extended position to eject a molded component; the ejector pin head and the ejector pin barrel are configured to move in a second direction in the ejector pin guide to a retracted position, the second direction opposite the first direction; an ejector pin biasing component located at a second end of the ejector pin, the second end opposite the first end; and the ejector pin biasing component configured to bias the ejector pin head and the ejector pin barrel in the second direction to the retracted position, wherein the ejector pin head is tapered such that a width of the ejector pin head is wider than a diameter of the ejector pin barrel. [0055] Example 2. The self-sealing ejector pin apparatus of Example 1 , wherein the ejector pin guide is tapered such that an angle of a taper of the ejector pin guide matches an angle of a taper of the ejector pin head.

[0056] Example 3. The self-sealing ejector pin apparatus of Examples 1 -2 further comprising a base coupled to the second end of the ejector pin, the base configured to receive a force from the ejector pin biasing component.

[0057] Example 4. The self-sealing ejector pin apparatus of Examples 1 -3 further comprising an opening in the base configured to receive a mechanical fastener to fasten the base to the ejector pin.

[0058] Example 5. The self-sealing ejector pin apparatus of Examples 1 -4, wherein the ejector pin biasing component comprises a spring coupled to the base.

[0059] Example 6. The self-sealing ejector pin apparatus of Examples 1 -5, wherein the spring is configured to apply the force on the ejector pin forcing the ejector pin in the second direction to the retracted position.

[0060] Example 7. The self-sealing ejector pin apparatus of Examples 1 -6, wherein the ejector pin biasing component comprises at least one of the following: a coil spring, a Bellville spring, a pneumatic system, a hydraulic system, and an electromagnetic system.

[0061] Example 8. The self-sealing ejector pin apparatus of Examples 1 -7, wherein a seal is formed between the taper of the ejector pin guide and the taper of the ejector pin head such that material held in a mold of the molding machine is prevented from flowing past the ejector pin head. [0062] Example 9. The self-sealing ejector pin apparatus of Examples 1 -8, wherein the ejector pin head comprises a partially conical shape.

[0063] Example 10. The self-sealing ejector pin apparatus of Examples 1 -9, wherein a clearance between the ejector pin and the ejector pin guide is greater than .002 inches (0.00508 centimeter).

[0064] Example 1 1 . A method of ejecting a product from a molding machine, the method comprising: arranging an ejector pin including an ejector pin barrel in an ejector pin guide of the molding machine; arranging an ejector pin head arranged at a first end of the ejector pin; moving the ejector pin head and the ejector pin barrel in a second direction in the ejector pin guide to a retracted position, the second direction opposite a first direction; arranging an ejector pin biasing component located at a second end of the ejector pin, the second end opposite the first end; biasing the ejector pin with a biasing component configured to bias the ejector pin head and the ejector pin barrel in the second direction to the retracted position; forming a molded component in the molding machine; and moving the ejector pin head and the ejector pin barrel in the first direction in the ejector pin guide to an extended position to eject the molded component, wherein the ejector pin head is tapered such that a width of the ejector pin head is wider than a diameter of the ejector pin barrel.

[0065] Example 12. The method of Example 1 1 , wherein the ejector pin guide is tapered such that an angle of a taper of the ejector pin guide matches an angle of a taper of the ejector pin head. [0066] Example 13. The method of Examples 1 1 -12 further comprising arranging a base coupled to the second end of the ejector pin, the base configured to receive a force from the ejector pin biasing component.

[0067] Example 14. The method of Examples 1 1 -13 further comprising arranging an opening in the base configured to receive a mechanical fastener.

[0068] Example 15. The method of Examples 1 1 -14, wherein the ejector pin biasing component comprises a spring coupled to the base.

[0069] Example 16. The method of Examples 1 1 -15, wherein the spring is configured to apply the force on the ejector pin forcing the ejector pin in the second direction to the retracted position.

[0070] Example 17. The method of Examples 1 1 -16, wherein the ejector pin biasing component comprises at least one of the following: a coil spring, a Bellville spring, a pneumatic system, a hydraulic system, and an electromagnetic system.

[0071] Example 18. The method of Examples 1 1 -17, further comprising forming a seal between the taper of the ejector pin guide and the taper of the ejector pin head such that material held in a mold of the molding machine is prevented from flowing past the ejector pin head.

[0072] Example 19. The method of Examples 1 1 -18, wherein the ejector pin head comprises a partially conical shape.

[0073] Example 20. The method of Examples 1 1 -19, wherein a clearance between the ejector pin and the ejector pin guide is greater than .002 inches (0.00508 centimeter). [0074] While the disclosure has been described in terms of exemplary aspects, those skilled in the art will recognize that the disclosure can be practiced with modifications in the spirit and scope of the appended claims. These examples given above are merely illustrative and are not meant to be an exhaustive list of all possible designs, aspects, applications or modifications of the disclosure.

Claims

What is claimed is:

1 . A self-sealing ejector pin apparatus for a molding machine, the apparatus comprising:

an ejector pin including an ejector pin barrel configured to be arranged in an ejector pin guide of the molding machine;

an ejector pin head arranged at a first end of the ejector pin;

the ejector pin head and the ejector pin barrel are configured to move in a first direction in the ejector pin guide to an extended position to eject a molded component; the ejector pin head and the ejector pin barrel are configured to move in a second direction in the ejector pin guide to a retracted position, the second direction opposite the first direction;

an ejector pin biasing component located at a second end of the ejector pin, the second end opposite the first end; and

the ejector pin biasing component configured to bias the ejector pin head and the ejector pin barrel in the second direction to the retracted position,

wherein the ejector pin head is tapered such that a width of the ejector pin head is wider than a diameter of the ejector pin barrel.

2. The self-sealing ejector pin apparatus of claim 1 , wherein the ejector pin guide is tapered such that an angle of a taper of the ejector pin guide matches an angle of a taper of the ejector pin head.

3. The self-sealing ejector pin apparatus of claim 1 further comprising a base coupled to the second end of the ejector pin, the base configured to receive a force from the ejector pin biasing component.

4. The self-sealing ejector pin apparatus of claim 3 further comprising an opening in the base configured to receive a mechanical fastener to fasten the base to the ejector pin.

5. The self-sealing ejector pin apparatus of claim 3, wherein the ejector pin biasing component comprises a spring coupled to the base.

6. The self-sealing ejector pin apparatus of claim 5, wherein the spring is configured to apply the force on the ejector pin forcing the ejector pin in the second direction to the retracted position.

7. The self-sealing ejector pin apparatus of claim 1 , wherein the ejector pin biasing component comprises at least one of the following: a coil spring, a Bellville spring, a pneumatic system, a hydraulic system, and an electromagnetic system.

8. The self-sealing ejector pin apparatus of claim 2, wherein a seal is formed between the taper of the ejector pin guide and the taper of the ejector pin head such that material held in a mold of the molding machine is prevented from flowing past the ejector pin head.

9. The self-sealing ejector pin apparatus of claim 1 , wherein the ejector pin head comprises a partially conical shape.

10. The self-sealing ejector pin apparatus of claim 1 , wherein a clearance between the ejector pin and the ejector pin guide is greater than .002 inches (0.00508 centimeter).

1 1 . A method of ejecting a product from a molding machine, the method comprising:

arranging an ejector pin including an ejector pin barrel in an ejector pin guide of the molding machine;

arranging an ejector pin head arranged at a first end of the ejector pin;

moving the ejector pin head and the ejector pin barrel in a second direction in the ejector pin guide to a retracted position, the second direction opposite a first direction; arranging an ejector pin biasing component located at a second end of the ejector pin, the second end opposite the first end;

biasing the ejector pin with a biasing component configured to bias the ejector pin head and the ejector pin barrel in the second direction to the retracted position; forming a molded component in the molding machine; and

moving the ejector pin head and the ejector pin barrel in the first direction in the ejector pin guide to an extended position to eject the molded component, wherein the ejector pin head is tapered such that a width of the ejector pin head is wider than a diameter of the ejector pin barrel.

12. The method of claim 1 1 , wherein the ejector pin guide is tapered such that an angle of a taper of the ejector pin guide matches an angle of a taper of the ejector pin head.

13. The method of claim 1 1 further comprising arranging a base coupled to the second end of the ejector pin, the base configured to receive a force from the ejector pin biasing component.

14. The method of claim 13 further comprising arranging an opening in the base configured to receive a mechanical fastener.

15. The method of claim 13, wherein the ejector pin biasing component comprises a spring coupled to the base.

16. The method of claim 15, wherein the spring is configured to apply the force on the ejector pin forcing the ejector pin in the second direction to the retracted position.

17. The method of claim 1 1 , wherein the ejector pin biasing component comprises at least one of the following: a coil spring, a Bellville spring, a pneumatic system, a hydraulic system, and an electromagnetic system.

18. The method of claim 12, further comprising forming a seal between the taper of the ejector pin guide and the taper of the ejector pin head such that material held in a mold of the molding machine is prevented from flowing past the ejector pin head.

19. The method of claim 1 1 , wherein the ejector pin head comprises a partially conical shape.

20. The method of claim 14, wherein a clearance between the ejector pin and the ejector pin guide is greater than .002 inches (0.00508 centimeter).