WO2017177408A1 - Gripping head, gripping system and method thereof - Google Patents
Gripping head, gripping system and method thereof Download PDFInfo
- Publication number
- WO2017177408A1 WO2017177408A1 PCT/CN2016/079221 CN2016079221W WO2017177408A1 WO 2017177408 A1 WO2017177408 A1 WO 2017177408A1 CN 2016079221 W CN2016079221 W CN 2016079221W WO 2017177408 A1 WO2017177408 A1 WO 2017177408A1
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- WIPO (PCT)
- Prior art keywords
- acoustic
- acoustic pressure
- gripping
- gripping head
- measurement device
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/02—Sensing devices
- B25J19/026—Acoustical sensing devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/02—Gripping heads and other end effectors servo-actuated
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
Abstract
A gripping head(1), a gripping system and a gripping method are disclosed. The gripping head(1) including a holding device(10) for applying holding force to a first part(P1), an acoustic pressure measurement device(11) for measuring a first acoustic pressure level of a first acoustic wave(W1) propagating from the first part(P1) resulted from a second acoustic pressure of a second acoustic wave(W2) ex-erted by an acoustic transducer against the first part (P1) held by the holding device (10), and a controller(12) for judging a contact of the first part(P1) with an second part(P2) using the measurement of the first acoustic pressure level output from the aco-ustic pressure measurement device(11). It is possible to detect contact of assembly p-arts(P1,P2) by measuring the acoustic pressure level of acoustic wave(W1,W2) tran-smitted from the gripped assembly part(P1,P2).
Description
The invention relates to gripping head, gripping system and method thereof, and more particularly to gripping head, gripping system and method thereof with sensing device.
Background Art
In consumer electronics part assembly, it is required for a relatively high accuracy for placing a part, for example 0.02~0.05mm level from geometry feature alignment point of view.
Contact of two assembly parts is a key information upon which such an accurate assembly is to be terminated. Too early part releasing will lose the aligned accuracy, while too late releasing will break the part that is usually fragile in consumer electronics product.
In traditional practice, force sensors are used for detecting a contact of two assembly parts when a robot places one of them on the other. One of the examples is disclosed by Pat. EP 2 492 065 entitled FORCE AND NORMALLY SENSING FOR END EFFECTOR CLAMP. According to Pat. EP 2 492 065, it teaches an end effector that is provided with an electromagnetic clamp. A force sensor is attached to end effector for measuring force exerted by the clamp against a working element surface.
However, the conventional way of using force sensor has the drawbacks of slow response, bulky mounting space, and short lifetime. This is due to the working principle of force sensor which requires a deformation. Even worse, since a so-called initial contacting occurs before the deformation, the force sensor is unable to detect the initial contact bring about negative effect on the accuracy of the assembly process.
Brief Summary of the Invention
According to an aspect of present invention, it provides a gripping head including: a holding device for applying holding force to a first part; an acoustic pressure measurement device for measuring a first acoustic pressure level of a first acoustic wave propagating from the first part resulted from a second acoustic pressure of a second acoustic wave exerted by an acoustic transducer against the first part held by the holding device; and a controller for judging a contact of the first part with an second part using the measurement of the first acoustic pressure level output from the acoustic pressure measurement device.
By having the gripping head according to the present invention, it is possible to detect contact of assembly parts by measuring the acoustic pressure level of acoustic wave transmitted from the gripped assembly part. Because the change of the contact status and the change of the acoustic impedance between the assembly parts occur almost simultaneously and the latter can be detected instantaneously, the gripping head exhibits a characteristics of faster response in detection of the assembly part contact, improving their aligned accuracy while preventing breaking the parts.
According to another aspect of present invention, it provides a method for gripping a first part including: applying holding force to a first part; measuring a first acoustic pressure of a first acoustic wave propagated from the first part resulted from a second acoustic pressure of a second acoustic wave against the held first part; and judging a contact of the first part with an second part using the measurement of the first acoustic pressure.
The method according to present invention makes it possible to detect contact of assembly parts by measuring the acoustic pressure level of acoustic wave transmitted from the gripped assembly part. Because the change of the contact status and the change of the acoustic impedance between the assembly parts occur almost simultaneously and the latter can be detected instantaneously, the gripping head exhibits a characteristics of faster response in detection of the assembly part contact, improving their aligned accuracy while preventing breaking the parts.
Preferably, the gripping head further includes: a substrate and an elastic member; wherein: the holding device is arranged on the substrate; and the acoustic pressure measurement device is arranged on the substrate through the elastic member urging the acoustic pressure measurement device in a predetermined direction to a predetermined maximum distance position farther than the holding position with respect to the substrate. When the holding device is holding the first part, the acoustic pressure measurement device is moved by the first part against the elastic element. This makes it possible to seal up the flow of the first acoustic wave from the first part to the acoustic pressure measurement device, and a portion of which, otherwise, would leak into the ambient atmosphere. The elastic member can be a spring or rubber.
Preferably, the holding force applied by the holding device is greater than or equal to the urging force applied by the elastic member. This is helpful improving the sealing up of the flow of the first acoustic wave from the first part to the acoustic pressure measurement device.
Preferably, the holding device is a vacuum holding device for applying suction force to the first part, which is suitable for the purpose of gripping an assembly part in 3C industry.
Preferably, the acoustic pressure measurement device includes: an acoustic pressure sensor, a tube and a resonator for amplifying the first acoustic pressure; wherein: the amplified first acoustic pressure can travel through air in the tube to the acoustic pressure sensor; and the resonator is arranged on the substrate. Therefore, a part of the acoustic pressure measurement device, the resonator, may be arranged on the substrate of the gripping head, while the rest parts may be mounted elsewhere. This is helpful for saving the mounting place for the acoustic pressure measurement device and making the gripping head more compact.
According to still another aspect of present invention, it provides a gripping system including: the gripping head and the acoustic transducer for transmitting the second acoustic wave propagating in a direction towards the second part and the first part. When the first part and the second part are in initial contact, the air interval with a relatively high acoustic impedance is bypassed by the contact area of the solid first part and the solid second part with a relatively low acoustic impedance. Consequently, the opposition that the gripping system presents to the acoustic flow decreases sharply, and the acoustic pressure resulting from the second wave is applied on the first part at a relatively high level, which is transmitted to the acoustic pressure measurement device by the first part in the flow of the first acoustic wave. The measurement of the first acoustic pressure level changes sharply accordingly, indicating the change from the non-contact state to the contact state. In this example, it is represented by a sharp increase of the measurement of the first acoustic pressure level. Based on the detection of a change of the measurement of the first acoustic pressure level, the gripping system determines whether the assembly parts come in an initial contact. Besides, because of the integration of the acoustic transducer and the acoustic pressure measurement device mounted on the gripping head, the gripping system becomes more compact.
Preferably, the gripping system further includes: an enclosure for housing the acoustic
transducer. In a housing, a housing structure with resonate effect can increase the second wave.
Preferably, the acoustic transducer is arranged in contact with the second part. The direct contact can reduce the energy loss of second ware in transferring through fixture.
According to still another aspect of present invention, it provides a gripping system including: the gripping head and the acoustic transducer is arranged on the substrate of the gripping head. When the first part and the second part are in initial contact, the air interval with a relatively high acoustic impedance is bypassed by the contact area of the solid first part and the solid second part with a relatively low acoustic impedance. Consequently, the opposition that the gripping system presents to the acoustic flow decreases sharply, and the acoustic pressure resulting from the second wave is applied on the first part at a relatively low level, which is transmitted to the acoustic pressure measurement device by the first part in the flow of the first acoustic wave. The measurement of the first acoustic pressure level changes sharply accordingly, indicating the change from the non-contact state to the contact state. In this example, it is represented by a sharp decrease of the measurement of the first acoustic pressure level. Based on the detection of a change of the measurement of the first acoustic pressure level, the gripping system determines whether the assembly parts come in an initial contact. Besides, because of the integration of the acoustic transducer and the acoustic pressure measurement device mounted on the gripping head, the gripping system becomes more compact.
Preferably, the acoustic transducer is arranged and configured to transmit the second acoustic wave propagating in a direction towards the first part; and the first acoustic wave results from a refraction of the second acoustic wave.
The subject matter of the invention will be explained in more detail in the following text with reference to preferred exemplary embodiments which are illustrated in the drawings, in which:
Figure 1 illustrates a gripping head according to a first embodiment of present invention;
Figure 2 illustrates a gripping head according to a second embodiment of present invention;
Figures 3A and 3B respectively show the arrangement of the elastic member according to the first embodiment of present invention in non-gripping state and gripping state;
Figure 4 shows the acoustic pressure measurement device according to an embodiment of present invention;
Figure 5A and 5B illustrating a gripping system according to a third embodiment of present invention; and
Figure 6A and 6B illustrating a gripping system according to a fourth embodiment of present invention.
The reference symbols used in the drawings, and their meanings, are listed in summary form in the list of reference symbols. In principle, identical parts are provided with the same reference symbols in the figures.
Preferred Embodiments of the Invention
In the following description, for purposes of explanation and not limitation, specific details
are set forth, such as particular circuits, circuit components, interfaces, techniques, etc. in order to provide a thorough understanding of the present invention. However, it will be apparent to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known methods and programming procedures, devices, and circuits are omitted so not to obscure the description of the present invention with unnecessary detail.
Figure 1 illustrates a gripping head according to a first embodiment of present invention. As shown in figure 1, the gripping head 1 includes a holding device 10, an acoustic pressure measurement device 11 and a controller 12.
The holding device 10 is a device for applying holding force to a first part P1, thus grasping and lifting up a first part conveyed by a belt conveyor or the like in a part assembly plant or the like where products are manufactured, for example. As shown in figure 1, the holding device 10, for example, can be a vacuum holding device which applies suction force to a surface of a first part guaranteeing a stable grasping between the first part and itself. The vacuum holding device 10, such as a vacuum cup, uses the negative fluid pressure of air to adhere to nonporous surfaces, creating a partial vacuum. The negative fluid pressure of air can be generated by a driver (not shown) under control of the controller 12. The working face 100 of the vacuum holding device 10 is made of elastic, flexible material and has a curved surface. When the working face 100 of the vacuum holding device 10 is pressed against a flat, non-porous surface of the first part P1, a vacuum is generated between the vacuum holding device 10 and the flat surface of the first part P1 by reducing the atmospheric air pressure inside the vacuum holding device 10. The pressure difference between the atmosphere on the outside of the vacuum holding device and the low-pressure cavity inside of the cup keeps it adhered to the surface. When the atmospheric air pressure is increased inside the vacuum holding device 10, the pressure difference decreases consequently. The first part P1 can thus be released from the vacuum holding device 10 and placed on the target place, for example on an second part. In particular in a part assembly process, the first part and the second part can be two parts to be assembled. In the present embodiment, an example of a configuration is presented in which a pair of vacuum holding devices 10 is provided, but the configuration is not limited to this example, and another option is a configuration in which the first part P1 is grasped by one or more than two vacuum holding devices 10, for example.
The acoustic pressure measurement device 11 is a transducer that converts acoustic pressure into an electrical signal. Where the holding device 10 holds the first part P1, an acoustic transducer (not shown) emits a second acoustic wave W2 with a predetermined frequency propagating towards and reaching the first part P1, either from the gripping head side or as an alternatively from the opposite, causing the latter to generate a first acoustic wave W1 substantially at the same frequency. The predetermined frequency can be selected identifying the first acoustic wave W1 and the second acoustic wave W2, for example as different from the frequency of the ambient sound. The predetermined frequency can be in the spectrum of audible sound or ultrasound. The acoustic pressure measurement device 11 can be disposed on a substrate 13 of the gripping head 1 with equal distance to either of the pair of the vacuum holding devices 10. The skilled person should understand the acoustic pressure measurement device 11 can be disposed other location with respective to the vacuum holding devices 10, so long that it contacts the first part P1 held by the vacuum holding devices 10. The acoustic pressure measurement device 11 is suitably designed depending on the size of the substrate 13, the signal strength of the transmitted first acoustic wave W1, and other factors. The acoustic pressure measurement device 11 can use electromagnetic induction, capacitance change or piezoelectricity to
produce an electrical signal from air acoustic pressure, such like a microphone. The acoustic pressure measurement device 11 can receive a sufficient amount of the first acoustic wave W1 propagating from the first part P1. The first acoustic wave W1 is generated as a result of the second acoustic pressure of the second acoustic wave W2 exerted by the acoustic transducer against the first part P1 held by the holding device 10. Due to its contact with the first part P1, the first acoustic wave W1 reaches the acoustic measurement device 11 without through a medium exhibiting relatively high acoustic impedance, such as air, and the acoustic pressure of the first acoustic wave W1 can be applied to the acoustic pressure measurement device 11 without much of loose. The acoustic pressure measurement device 11 is adapted for measuring the received first acoustic pressure level of the first acoustic wave W1 and sending the first acoustic pressure level to the controller 12.
The controller 12 can be disposed on an available location of the substrate 13 of the gripping head 1, or alternatively separate from the substrate 13. Before assembly, the holding device 10 holds the first part P1 in non-contact with the second part, for example the holding device 10 can grasping and lifting up the first part conveyed by the belt conveyor and transfer it to the position above the second part ready for the assembly with the second part. The skilled person should understand that the first part P1 and the second part to be assembled are of solid exhibiting less acoustic impedance than fluid, such as air. In the non-contact state, there exists a medium of air between the first part P1 and the second part. When the first part P1 comes in contact with the second part, namely two parts of solid are in contact, the acoustic impedance decreases significantly. Consequently, there is a significant change in the first acoustic pressure level from the non-contact state to the contact state. The controller 12 thereby can detect a contact of the first part with the second part using the measurement of the first acoustic pressure level output from the acoustic pressure measurement device 11.
Figure 2 illustrates a gripping head according to a second embodiment of present invention. The gripping head according to figure 2 is different from that according to figure 1 in that it uses finger elements as the holding device 20 in replacement of vacuum holding device.
As shown in figure 2, the gripping head 2 includes the holding device 20 for applying holding force to a first part P1, thus grasping and lifting up a first part conveyed by a belt conveyor or the like in a part assembly plant or the like where products are manufactured, for example. The holding device 20 includes a pair of the finger elements for grasping the first part P1. The gripping head 2 is configured comprising a finger element drive part (not shown) for driving the finger element under control of the controller 12. The pair of finger elements 20 comprises grasping surfaces which are contact surfaces in their distal ends, and the grasping surfaces are brought in contact with the grasped object to grasp and thereby lift up the object. In the present embodiment, an example of a configuration is presented in which a pair of finger elements is provided, but the configuration is not limited to this example, and another option is a configuration in which the object is grasped at three points of support by three finger elements 20, for example.
By having the gripping head according to the embodiment of the present invention, it is possible to detect contact of assembly parts by measuring the acoustic pressure level of acoustic wave transmitted from the gripped assembly part. Because the change of the contact status and the change of the acoustic impedance between the assembly parts occur almost simultaneously and the latter can be detected instantaneously, the gripping head according to present invention exhibits a characteristics of faster response in detection of the assembly part contact, improving their aligned accuracy while preventing breaking the
parts.
Preferably, the gripping head according to an embodiment of present invention may further includes an elastic member 14 disposed between the substrate 13 and the acoustic pressure measurement device 11. Figures 3A and 3B respectively show the arrangement of the elastic member according to the first embodiment of present invention in non-gripping state and gripping state. As shown in figure 3A, the holding device 10, for example the vacuum holding device, is arranged on the substrate 13. The acoustic pressure measurement device 11 is arranged on the substrate 13 through the elastic member 14, thus it is resiliently loaded in a predetermined direction of the arrow by the elastic member 14. The elastic member 14 urges the acoustic pressure measurement device 11 in the predetermined direction (arrow indicated) to a predetermined maximum distance position D farther than the holding position d with respect to the substrate 14. When the holding device 10 does not grip the first part P1, one end of the acoustic pressure measurement device 11 is disposed beyond the working surface 100 of the holding device 10 as a result of the resilient force of the elastic element 14. When the holding devices 10 suck the first part P1, as shown in figure 3B, vacuum builds up in the vacuum holding device and atmospheric pressure bears against the first part P1 in a reverse direction to the arrow overcoming the force of the elastic member 14. If the holding force applied by the holding device 10 is greater than or equal to the urging force applied by the elastic member 14, the acoustic pressure measurement device 11 is moved by the first part P1 against the elastic element 14 assuming gradual deformation. The acoustic pressure measurement device 11, and therefore, the first part P1, are held securely with each other. This makes it possible to seal up the flow of the first acoustic wave W1 from the first part P1 to the acoustic pressure measurement device 11, and a portion of which, otherwise, would leak into the ambient atmosphere. The elastic member 14 can be a spring or rubber.
The skilled person should understand that the elastic member 14 can also be used with the gripping head 2 according to the second embodiment of present invention.
Preferably, the acoustic pressure measurement device 11 may include an acoustic pressure sensor 110, a tube 111, and a resonator 112 for amplifying the first acoustic pressure. Figure 4 shows the acoustic pressure measurement device according to an embodiment of present invention. As shown in figure 4, the amplified first acoustic pressure can travel through air in the tube to the acoustic pressure sensor 110 and the resonator 112 is arranged on the substrate 14. The acoustic pressure sensor 110 can use electromagnetic induction, capacitance change or piezoelectricity to produce an electrical signal from air acoustic pressure, such like a microphone. Therefore, a part of the acoustic pressure measurement device 11, the resonator 112, may be arranged on the substrate 13 of the gripping head, while the rest parts may be mounted elsewhere. This is helpful for saving the mounting place for the acoustic pressure measurement device and making the gripping head more compact.
Figure 5A and 5B illustrating a gripping system according to a third embodiment of present invention. As shown in figures 5A and 5B, the gripping system 5 includes a gripping head and an acoustic transducer 50. The gripping head may be designed according to either of the first and the second embodiments of present invention. The gripping head 1 is described as an exemplary component of the gripping system 5 hereafter.
Figure 5A shows non-contract state of the first part P1 and the second part P2. As shown in figure 5A, the gripping head 1 holds the first part P1 by applying suction force a surface of a first part guaranteeing a stable grasping between the first part P1 and itself. The acoustic pressure measurement device 11 is disposed to a portion of the first part P1 such that it can convert the acoustic pressure transmitted by the first part P1 into an electrical signal,
outputting a signal representing the measurement of the acoustic pressure level. The acoustic transducer 50 is disposed opposite to the gripping head 1 with respective to the second part P2, and the second part P2 is supposed to be assembled with the first part P1. For example, the second part P2 may rest on a solid fixture 51, and the fixture 51 is placed between the second part P2 and the acoustic transducer 50. The acoustic transducer 50 may emit the second acoustic wave W2 with the predetermined frequency propagating towards the second part P2 and the first part P1. The second acoustic wave W2 flows through the fixture 51, the second part P2, the air interval A between the second part P2 and the first part P1, and reaches the first part P1. The vibration of the second acoustic wave W2 is transmitted by the first part P1 and received by the acoustic pressure measurement device 11.Because the air interval A exhibits a relatively high acoustic impedance to the acoustic flow starting from the acoustic transducer 50 to the acoustic pressure measurement device 11, the measurement of the acoustic pressure level in terms of the predetermined frequency will be relatively low, for example below a predetermined threshold.
Figure 5B shows contact state of the first part P1 and the second part P2. Before releasing the first part P1, it is desirable to detect its contact with the second part P2. The first part P1 is approaching to the second part P2 with the movement of the gripping head 1 until it comes in contact with the second part P2. It is desirable to identify the time point when the contact happens so as to avoid the release of the second part P2 occurs too early or too late. As shown in figure 5B, when the first part P1 and the second part P2 are in initial contact, the air interval A with a relatively high acoustic impedance is bypassed by the contact area of the solid first part P1 and the solid second part P2 with a relatively low acoustic impedance. Consequently, the opposition that the gripping system 5 presents to the acoustic flow decreases sharply, and the acoustic pressure resulting from the second wave W2 is applied on the first part P1 at a relatively high level, which is transmitted to the acoustic pressure measurement device 11 by the first part P1 in the flow of the first acoustic wave W1. The measurement of the first acoustic pressure level changes sharply accordingly, indicating the change from the non-contact state to the contact state. In this example, it is represented by a sharp increase of the measurement of the first acoustic pressure level.
Based on the detection of a change of the measurement of the first acoustic pressure level, the gripping system determines whether the assembly parts come in an initial contact. The acoustic transducer 50 may be disposed in a housing 52, or alternatively in contact with the second part P2. In a housing, a housing structure with resonate effect can increase the second wave. In contact with the second part P2, direct contact can reduce the energy loss of second ware in transferring through fixture.
Figure 6A and 6B illustrating a gripping system according to a fourth embodiment of present invention. As shown in figures 6A and 6B, the gripping system 6 includes a gripping head and an acoustic transducer. The gripping head may be designed according to either of the first and the second embodiments of present invention, and the acoustic transducer may be designed according to that of the third embodiment of present invention. The gripping head 1 are the acoustic transducer 50 are described as an exemplary component of the gripping system 6 hereafter.
Figure 6A shows non-contract state of the first part P1 and the second part P2. As shown in figure 6A, the gripping head 1 holds the first part P1 by applying suction force a surface of a first part guaranteeing a stable grasping between the first part P1 and itself. The acoustic pressure measurement device 11 is disposed to a portion of the first part P1 such that it can convert the acoustic pressure transmitted by the first part P1 into an electrical signal, outputting a signal representing the measurement of the acoustic pressure level. The
acoustic transducer 60 is arranged on the substrate 13 of the gripping head 1, thus both of the acoustic transducer 60 and the acoustic pressure measurement device 11 are disposed at the same side with respective to either of the first part P1 and the second part P2. For example, the acoustic transducer 60 and the acoustic pressure measurement device 11 may be integrated as one component of trans-receiver being disposed between the pair of vacuum holding devices 10. The acoustic transducer 60 may emit the second acoustic wave W2 with the predetermined frequency propagating towards the first part P1 and the second part P2. The second acoustic wave W2 flows through the first part P1, the air interval A between the second part P2 and the first part P1, and the second part P2. The first acoustic wave W1, as a result of the refraction of the second acoustic wave W2, reaches the acoustic pressure measurement device 11 and is received by the latter. Because the air interval A exhibits a relatively high acoustic impedance to the acoustic flow starting from the acoustic transducer 60 to the acoustic pressure measurement device 11, the measurement of the acoustic pressure level in terms of the predetermined frequency will be relatively high, for example above a predetermined threshold.
Figure 6B shows contact state of the first part P1 and the second part P2. Before releasing the first part P1, it is desirable to detect its contact with the second part P2. The first part P1 is approaching to the second part P2 with the movement of the gripping head 1 until it comes in contact with the second part P2. It is desirable to identify the time point when the contact happens so as to avoid the release of the second part P2 occurs too early or too late. As shown in figure 6B, when the first part P1 and the second part P2 are in initial contact, the air interval A with a relatively high acoustic impedance is bypassed by the contact area of the solid first part P1 and the solid second part P2 with a relatively low acoustic impedance. Consequently, the opposition that the gripping system 6 presents to the acoustic flow decreases sharply, and the acoustic pressure resulting from the second wave W2 is applied on the first part P1 at a relatively low level, which is transmitted to the acoustic pressure measurement device 11 by the first part P1 in the flow of the first acoustic wave W1. The measurement of the first acoustic pressure level changes sharply accordingly, indicating the change from the non-contact state to the contact state. In this example, it is represented by a sharp decrease of the measurement of the first acoustic pressure level.
Based on the detection of a change of the measurement of the first acoustic pressure level, the gripping system determines whether the assembly parts come in an initial contact. Besides, because of the integration of the acoustic transducer and the acoustic pressure measurement device mounted on the gripping head, the gripping system becomes more compact.
Though the present invention has been described on the basis of some preferred embodiments, those skilled in the art should appreciate that those embodiments should by no way limit the scope of the present invention. Without departing from the spirit and concept of the present invention, any variations and modifications to the embodiments should be within the apprehension of those with ordinary knowledge and skills in the art, and therefore fall in the scope of the present invention which is defined by the accompanied claims.
Claims (14)
- A gripping head, including:a holding device for applying holding force to a first part;an acoustic pressure measurement device for measuring a first acoustic pressure level of a first acoustic wave propagating from the first part resulted from a second acoustic pressure of a second acoustic wave exerted by an acoustic transducer against the first part held by the holding device; anda controller for judging a contact of the first part with an second part using the measurement of the first acoustic pressure level output from the acoustic pressure measurement device.
- The gripping head according to claim 1, further including:a substrate; andan elastic member;wherein:the holding device is arranged on the substrate; andthe acoustic pressure measurement device is arranged on the substrate through the elastic member urging the acoustic pressure measurement device in a predetermined direction to a predetermined maximum distance position farther than the holding position with respect to the substrate.
- The gripping head according to claim 2, wherein:when the holding device is holding the first part, the acoustic pressure measurement device is moved by the first part against the elastic element.
- The gripping head according to claim 3, wherein:the holding force applied by the holding device is greater than or equal to the urging force applied by the elastic member.
- The gripping head according to any of the preceding claims, wherein:the holding device is a vacuum holding device for applying suction force to the first part.
- The gripping head according to claim 5, wherein;the acoustic pressure measurement device includes:an acoustic pressure sensor;a tube; anda resonator for amplifying the first acoustic pressure;wherein:the amplified first acoustic pressure can travel through air in the tube to the acoustic pressure sensor; andthe resonator is arranged on the substrate.
- A gripping system, including:the gripping head according to any of claims 1 to 6; andthe acoustic transducer for transmitting the second acoustic wave propagating in a direction towards the second part and the first part.
- The gripping system according to claim 7, further including:an enclosure for housing the acoustic transducer.
- The gripping system according to claim 7, wherein:the acoustic transducer is arranged in contact with the second part.
- A gripping system, including:the gripping head according to any of claims 1 to 6; andthe acoustic transducer is arranged on the substrate of the gripping head.
- The gripping system according to claim 10, wherein:the acoustic transducer is arranged and configured to transmit the second acoustic wave propagating in a direction towards the first part; andthe first acoustic wave results from a refraction of the second acoustic wave.
- A method for gripping a first part, including:applying holding force to a first part;measuring a first acoustic pressure of a first acoustic wave propagated from the first part resulted from a second acoustic pressure of a second acoustic wave against the held first part; andjudging a contact of the first part with an second part using the measurement of the first acoustic pressure.
- The method according to claim 12, wherein:the second acoustic wave propagates in a direction towards the second part and the first part.
- The method according to claim 12, wherein:the second acoustic wave propagates in a direction towards the first part and refracted by an edge of the first part.
Priority Applications (2)
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PCT/CN2016/079221 WO2017177408A1 (en) | 2016-04-14 | 2016-04-14 | Gripping head, gripping system and method thereof |
CN201680084573.4A CN109070483B (en) | 2016-04-14 | 2016-04-14 | Clamping head, clamping system and method thereof |
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PCT/CN2016/079221 WO2017177408A1 (en) | 2016-04-14 | 2016-04-14 | Gripping head, gripping system and method thereof |
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WO2021197678A1 (en) * | 2020-03-31 | 2021-10-07 | Röhm Gmbh | Clamping device |
US11550278B1 (en) * | 2016-11-21 | 2023-01-10 | X Development Llc | Acoustic contact sensors |
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JP7124742B2 (en) * | 2019-02-06 | 2022-08-24 | オムロンヘルスケア株式会社 | Body sound measuring device, control method for body sound measuring device, control program for body sound measuring device |
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CN109070483B (en) | 2021-04-20 |
CN109070483A (en) | 2018-12-21 |
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