WO2017171868A1

WO2017171868A1 - Package-integrated hybrid haptic actuators

Info

Publication number: WO2017171868A1
Application number: PCT/US2016/025702
Authority: WO
Inventors: Georgios C. Dogiamis; Feras EID
Original assignee: Intel Corporation
Priority date: 2016-04-01
Filing date: 2016-04-01
Publication date: 2017-10-05

Abstract

A hybrid haptic actuator includes a package-integrated piezoelectric haptic actuator and a package-integrated electromagnetic haptic actuator disposed in, on, or about a void space formed in a first surface of a dielectric substrate. The hybrid haptic actuator includes an elastomeric member that covers the hybrid haptic actuator and a magnetic member embedded in the elastomeric member that is displaced by the magnetic fields produced by the electromagnetic haptic actuator. In operation, the magnetic member may be displaced from a neutral position to a first position by applying a voltage to the piezoelectric haptic actuator. The magnetic member may be oscillated at a frequency by applying an alternating current at the frequency to the electromagnetic haptic actuator. Such a hybrid haptic actuator beneficially consumes about half the power of a single haptic actuator having an equal displacement.

Description

PACKAGE-INTEGRATED HYBRID HAPTIC ACTUATORS

GEORGIOS C. DOGIAMIS

FERAS EID

TECHNICAL FIELD

The present disclosure relates to package-integrated haptic feedback devices.

BACKGROUND

Haptic feedback devices are used to provide a device user with tactile feedback, usually as an acknowledgement of received input (e.g. , receipt of a keystroke) or as a notification of an occurrence of one or more defined events (e.g. , arrival of an email, arrival of a text message). Such feedback is readily perceived without being overly distractive to either the device user or those proximate the device user. Today's haptic feedback usually involves a vibration of the entire device using bulky and relatively inefficient electromechanical motors. Such haptic feedback typically occurs as the user interacts with the device and is considered "global" haptic feedback that is not localized at a specific location, such as the user's hand (for smartphones) or the user' s wrist (for smartwatches).

BRIEF DESCRIPTION OF THE DRAWINGS

Features and advantages of various embodiments of the claimed subject matter will become apparent as the following Detailed Description proceeds, and upon reference to the

Drawings, wherein like numerals designate like parts, and in which:

FIG. 1A provides a schematic diagram of an illustrative package integrated

piezoelectric/electromagnetic (P/EM) hybrid actuator disposed proximate a void space in a surface of a dielectric substrate, in accordance with at least one embodiment of the present disclosure;

FIG. IB provides a schematic diagram of the illustrative package integrated P/EM hybrid actuator depicted in FIG 1A in a first (offset) operative state, in accordance with at least one embodiment of the present disclosure; FIG. 1C provides a schematic diagram of the illustrative package integrated P/EM hybrid actuator depicted in FIG 1A in a second (oscillating) operative state, in accordance with at least one embodiment of the present disclosure;

FIG. ID provides a schematic diagram of the illustrative package integrated P/EM hybrid actuator depicted in FIG 1A in a different second (oscillating) operative state, in accordance with at least one embodiment of the present disclosure;

FIG. 2A provides a cross- sectional elevation of an illustrative P/EM hybrid actuator that includes a number of package-integrated piezoelectric haptic actuators, each including a piezoelectric material disposed between two electrodes formed on a dielectric substrate, and a package-integrated electromagnetic haptic actuator that includes a coil and core member formed in a dielectric substrate, in accordance with at least one embodiment of the present disclosure;

FIG. 2B provides a schematic diagram of the illustrative package integrated P/EM hybrid actuator depicted in FIG 2A in a first (offset) operative state, in accordance with at least one embodiment of the present disclosure;

FIG. 2C provides a schematic diagram of the illustrative package integrated P/EM hybrid actuator depicted in FIG 2A in a second (oscillating) operative state, in accordance with at least one embodiment of the present disclosure;

FIG. 3A depicts a plan view of an illustrative P/EM hybrid actuator that includes a single, package-integrated, piezoelectric haptic actuator formed on a first surface of a dielectric substrate and a single, package-integrated, electromagnetic haptic actuator formed at least partially in the dielectric substrate, in accordance with at least one embodiment of the present disclosure;

FIG. 3B provides a cross- sectional elevation of the illustrative package integrated P/EM hybrid actuator depicted in FIG 3 A along section line A- A', in accordance with at least one embodiment of the present disclosure;

FIG 4 provides a perspective view of an illustrative electronic device in which a number of package integrated P/EM hybrid actuators have been incorporated, in accordance with at least one embodiment of the present disclosure;

FIG. 5 provides a high-level block flow diagram of an illustrative method of forming a hybrid haptic actuation system on a dielectric substrate, in accordance with at least one embodiment of the present disclosure; and FIG.6 provides a high-level block flow diagram of an illustrative method of operating a hybrid haptic actuation system, in accordance with at least one embodiment of the present disclosure.

Although the following Detailed Description will proceed with reference being made to illustrative embodiments, many alternatives, modifications and variations thereof will be apparent to those skilled in the art.

DETAILED DESCRIPTION

The systems and methods disclosed herein provide piezoelectric haptic feedback devices formed directly on a dielectric or printed circuit substrate. The next generation of haptic feedback devices focuses on the creation of localized, small or miniaturized, haptic actuators that provide independent localized actuation of the user's skin in a manner that is discernable by the user. By employing such localized haptic actuators, the user may be notified at different locations on the hand or wrist, for example to provide a tactile indication of different notification types and/or classes. Other potential applications include the transmission of texture or similar surface features to the user.

Certain physical characteristics are advantageous when considering the skin deflection caused by a small or miniaturized haptic actuator. Such physical characteristics may include, frequency of actuation as well as penetration depth (or skin displacement). Human perception threshold at the fingertips falls in a frequency range of 1 Hertz to 200 Hertz and a displacement range of 10 micrometers (μιη) to 200 μιη. Generally, as haptic feedback frequency increases, the skin displacement may be reduced while maintaining user perceptibility. Different physical locations on the body may exhibit different perception thresholds, thus haptic feedback devices may be tailored to a specific application, use or device. Another characteristic of haptic perception is the distance between haptic feedback locations distinguishable by the body - typically about 2 millimeters at the fingertips for static mechanical stimulation. Such hybrid haptic feedback devices may be deposited directly on a printed circuit board and therefore offer significant advantages in both cost and overall thickness when compared to surface-mount or similar haptic devices. The systems and methods described herein beneficially and

advantageously provide a hybrid approach based on piezoelectric and electromagnetic (EM) package-integrated actuation compatible with various high-volume package substrate fabrication technology. Such hybrid approach might enable lower power consumption or higher

displacements at a given power consumption level when compared to only PE or EM approaches alone.

The hybrid actuators disclosed herein may include released structures or elements such as cantilevers or beams that are free to move along one or more axes such that the movement or motion of the structure or element is discernable to a user when the piezoelectric actuator is positioned in contact with and/or proximate the skin of the user. The hybrid haptic actuators disclosed herein include a piezoelectric haptic actuator having one or more piezoelectric material layers disposed at least partially between electrodes used to apply a bias voltage between the electrodes, forming an electric field within the piezoelectric material layer disposed between the electrodes. The electric field produces a stress in the piezoelectric material, causing the stack, and thus the entire released structure to move. This, in turn, provides a mechanical deflection of the actuator.

Larger actuator displacements are possible by combining an electromagnetic haptic actuator with the piezoelectric haptic actuator. In such instances, an initial offset of the actuator (e.g. , a 200 μιη offset) by applying a bias voltage (V i_as) to the piezoelectric haptic actuator followed by application of an alternating current (z_Coii) at a first frequency (f_\) to the

electromagnetic haptic actuator which creates an oscillatory displacement of the actuator (e.g., a 200 μηι oscillatory displacement) that, when combined with the offset contributed by the piezoelectric haptic actuator creates a cumulative total displacement (e.g., 400 μιη).

In some implementations, a larger oscillatory displacement may be achieved by varying the voltage applied to the piezoelectric haptic actuator between the bias voltage level (e.g. , V_bi_as) and higher and/or lower voltage level (e.g. , V i_as + _d; V i_as - _d). Examples of variable voltage sources include, but are not limited to, a sinusoidal voltage, a switched voltage, or combinations thereof. Application of a variable voltagecauses the piezoelectric haptic actuator to oscillate between the offset displacement and a greater displacement. When the variable voltage applied to the piezoelectric haptic actuator synchronizes with the frequency of the alternating current applied to the electromagnetic haptic actuator, the actuator displacement will again be cumulative (offset + electromagnetic haptic actuator oscillatory displacement + piezoelectric haptic actuator oscillatory displacement). The hybrid haptic actuators disclosed herein are beneficially smaller, thinner, and may be actuated using less power compared to a single discrete electromechanical motor (or linear resonant actuator) used in current haptic devices. Advantageously, such hybrid haptic actuators may be manufactured as part of the substrate fabrication process with no need for purchasing and assembling discrete components. Such construction beneficially enables high volume manufacturability and resultant lower cost haptic actuators.

As used herein, the term "hybrid haptic actuator" and the plural "hybrid haptic actuators" refer to package mounted haptic actuators that may be fabricated using various deposition, patterning, and/or etching processes. Such hybrid haptic actuators may include one or more package integrated electromagnetic haptic actuators and one or more package-integrated piezoelectric haptic actuators. Such hybrid haptic actuators may beneficially reduce the power required to achieve a defined actuator displacement and/or oscillatory frequency.

As used herein, the terms "top," "bottom," "up," "down," "upward," "downward," "upwardly," "downwardly" and similar directional terms should be understood in their relative and not absolute sense. Thus, a component described as being "upwardly displaced" may be considered "laterally displaced" if the device carrying the component is rotated 90 degrees and may be considered "downwardly displaced" if the device carrying the component is inverted. Such implementations should be considered as included within the scope of the present disclosure.

A hybrid haptic actuator system is provided. The system may include a dielectric substrate having a first surface and a transversely opposed second surface, the dielectric substrate at least partially defining a void space formed in the first surface of the dielectric substrate and extending at least partially through the dielectric substrate. The system may additionally include an electromagnetic haptic actuator embedded at least partially in the dielectric substrate proximate the void space, a piezoelectric haptic actuator disposed on the first surface of the dielectric substrate and at least partially spanning the void space formed in the first surface, an elastomeric membrane disposed proximate the piezoelectric haptic actuator, and a magnetic member disposed within the elastomeric membrane, the magnetic member spaced apart from and axially aligned with the electromagnetic haptic actuator.

A wearable electronic device is provided. The wearable electronic device may include a wearable device housing having an exterior surface, a hybrid haptic actuator controller disposed at least partially within the wearable device housing, and a plurality of hybrid haptic actuators forming at least a portion of the exterior surface of the wearable device housing, each of the plurality of hybrid haptic actuators conductively coupled to the hybrid haptic actuator controller. Each of the hybrid haptic actuators may include a dielectric substrate having a first surface and a transversely opposed second surface, the dielectric substrate at least partially defining a void space formed in the first surface of the dielectric substrate and extending at least partially through the dielectric substrate, an electromagnetic haptic actuator embedded at least partially in the dielectric substrate proximate the void space, a piezoelectric haptic actuator disposed on the first surface of the dielectric substrate proximate the void space, an elastomeric membrane disposed proximate the piezoelectric haptic actuator, and a magnetic member disposed within the elastomeric membrane, the magnetic member spaced apart from and axially aligned with the electromagnetic haptic actuator.

A hybrid haptic feedback method is provided. The method may include driving a magnetic member embedded in an elastomeric membrane by applying a voltage to a

piezoelectric haptic actuator formed on a first surface of a dielectric substrate to cause a displacement of the magnetic member and applying an alternating current at a first frequency to an electromagnetic haptic actuator formed at least partially in the dielectric substrate proximate the piezoelectric haptic actuator to cause an oscillatory displacement of the displaced magnetic member at the first frequency.

A hybrid haptic feedback system is provided. The system may include a means for driving a magnetic member embedded in an elastomeric membrane. The means for driving a magnetic member embedded in an elastomeric membrane may include a means for applying a voltage to a piezoelectric haptic actuator formed on a first surface of a dielectric substrate to cause a displacement of the magnetic member and a means for applying an alternating current at a first frequency to an electromagnetic haptic actuator formed at least partially in the dielectric substrate proximate the piezoelectric haptic actuator to cause an oscillatory displacement of the displaced magnetic member at the first frequency.

A method of forming hybrid haptic actuator system is provided. The method may include forming an electromagnetic haptic actuator in a dielectric substrate by: depositing a plurality of alternating dielectric layers and metal layers to form a conductive coil having a central axis, each of the metal layers conductively coupled by a via that penetrates a dielectric layer disposed between the respective metal layers and forming a piezoelectric haptic actuator on a first surface of the dielectric substrate, proximate the electromagnetic actuator subsystem. Forming a piezoelectric haptic actuator may include forming a first electrode proximate the first surface of the dielectric substrate, forming a piezoelectric layer proximate the first electrode, and forming a second electrode proximate the piezoelectric layer. The method may further include: depositing an elastic membrane proximate the piezoelectric haptic actuator, affixing a magnetic member to the elastic membrane, the magnetic member coaxial with the central axis of the coil, and removing at least a portion of the first surface of the dielectric substrate proximate the first electrode.

A system for forming hybrid haptic actuator is provided. The system may include a means for forming an electromagnetic haptic actuator in a dielectric substrate that includes a means for depositing a plurality of alternating dielectric layers and metal layers to form a coil having a central axis, each of the metal layers conductively coupled by a via that penetrates a dielectric layer disposed between the respective metal layers. The system may further include a means for forming a piezoelectric haptic actuator on a first surface of the dielectric substrate, proximate the electromagnetic haptic actuator that includes: a means for forming a first electrode proximate the first surface of the dielectric substrate, a means for forming a piezoelectric layer proximate the first electrode, and a means for forming a second electrode proximate the piezoelectric layer. The system may further include a means for depositing an elastic membrane proximate the piezoelectric haptic actuator, a means for affixing a magnetic member to the elastic membrane, the magnetic member coaxial with the central axis of the coil, and a means for removing at least a portion of the first surface of the dielectric substrate proximate the first electrode.

FIG. 1A provides a schematic diagram of a hybrid haptic actuation system 100 that includes an illustrative hybrid haptic actuator 110 mounted in, on, or about a dielectric 120, in accordance with at least one embodiment of the present disclosure. In some implementations, the hybrid actuator stack 110 may include at least one package-integrated piezoelectric haptic actuator 110 and at least one package-integrated electromagnetic haptic actuator 140. The at least one piezoelectric haptic actuator 110 and the at least one electromagnetic haptic actuator 140 may be disposed in, on, or about a dielectric substrate 120 having a first surface 122 and a transversely opposed second surface 124. In implementations, the magnetic member 180 may be at least partially embedded in an elastomeric material 170 that covers at least a portion of the hybrid haptic actuation system 100.

In operation, the piezoelectric haptic actuator 110 and the electromagnetic haptic actuator 140 may synergistically cooperate to cause a displacement 190 and oscillation 192, 194 of a magnetic member 180 disposed proximate the piezoelectric haptic actuator 110 and

electromagnetic haptic actuator 140. For example, in some operating states, a steady-state voltage may be applied to the piezoelectric haptic actuator 110 to cause an initial offset of the hybrid haptic actuator followed by applying an alternating current to the electromagnetic haptic actuator 140 to cause an oscillatory displacement of the hybrid haptic actuator 110.

In another example, in other operating states, a voltage signal that includes a DC offset component and a switched voltage component (e.g. , switched at a first frequency between the DC offset and a higher voltage) may be applied to the piezoelectric haptic actuator 110 to cause an oscillatory displacement of the hybrid haptic actuator about an offset displacement and applying an alternating current at the first frequency to the electromagnetic haptic actuator 140 to cause a further oscillatory displacement of the hybrid haptic actuator 110.

In yet another example, in other operating states, a sinusoidally varying voltage that includes a DC offset component combined with a sinusoidally varying component at a first frequency may be applied to the piezoelectric haptic actuator 110 to cause an oscillatory displacement of the hybrid haptic actuator about the offset displacement and applying an alternating current at the first frequency to the electromagnetic haptic actuator 140 to cause a further oscillatory displacement of the hybrid haptic actuator 110.

To permit a system user to distinguish feedback received from the hybrid haptic actuation system 100, each of a number of hybrid haptic actuation systems 110 may be spaced apart from one or more neighboring hybrid haptic actuation systems 100. In implementations, the minimum spacing between neighboring hybrid haptic actuation systems 100 may be about 1 millimeters (mm) or more; about 5mm or more; about 10mm or more; about 15mm or more; or about 20mm or more.

The elastomeric layer 170 may include any current or future developed material capable of accommodating the operational displacement of the magnetic member 180. The elastomeric layer 170 may include one or more materials deposited in, on, or about the hybrid haptic actuation system 100. In some implementations, the elastomeric layer 170 may include one or more hypoallergenic and/or biocompatible materials. In some implementations, the elastomeric layer 170 may include all or a portion of an exterior surface of a wearable electronic or computing device such as a smartwatch or a wearable accessory or garment that includes or otherwise incorporates an electronic or computing device.

The magnetic member 180 may be at least partially embedded within the elastomeric layer 170. The magnetic member 180 may include any type, combination, and/or number of any current or future developed magnetic materials. In some implementations, the magnetic member 180 may include a plurality of magnetic members. The haptic force produced by the hybrid haptic actuation system 100 is proportional to the magnetic field strength of the electromagnetic haptic actuator 140 and to the surface area of the magnetic member 180. The haptic force produced by the hybrid haptic actuation system 100 may be altered or adjusted, at least in part, by adjusting the physical geometry of the magnetic member 180. The haptic force produced by the hybrid haptic actuation system 100 may be altered or adjusted based at least in part on the permittivity of the material or materials used to fabricate the magnetic member 180.

FIG. IB depicts an illustrative hybrid haptic actuation system 100 in a first (offset) operative state, in accordance with at least one embodiment of the present disclosure. In the first state depicted in FIG IB, a steady-state bias voltage (V_bi_as - depicted chart 180) applied to the piezoelectric haptic actuator 110 deforms the actuator 110, causing an upward directed force 190 on the elastomeric membrane 170. In some implementations, the piezoelectric haptic actuator 110 may deflect in a direction normal to the first surface 122 of the dielectric substrate 120. The upward force exerted by the deformed piezoelectric haptic actuator 110 causes an upward deflection of the elastomeric layer 170 and the magnetic member 180. Such a deflection may be perceptible by a user of the device carrying the hybrid haptic actuation system 100. In embodiments, application of a bias voltage to the piezoelectric haptic actuator 110 may cause a displacement of the magnetic member 180 of about 10 micrometers (μιη); about 20 μιη; about 30 μιη; about 50 μιη; about 100 μιη; about 150 μιη; or about 200 μιη.

FIG 1C depicts an illustrative hybrid haptic actuation system 100 in a second (oscillating) operative state, in accordance with at least one embodiment of the present disclosure. In operation, the application of the steady-state bias voltage (V_bi_as - depicted in chart 182) to the electrodes of the piezoelectric haptic actuator 110 causes an initial upward deflection of the elastomeric layer 180 and the magnetic member 190, an alternating current may be passed through electromagnetic haptic actuator 140. The passage of the alternating current (z^' _COii - depicted in chart 184) through the electromagnetic haptic actuator 140 creates an alternating upward force 192 and downward force 194 on the magnetic member 180. The frequency (f) of the alternating current flow through the electromagnetic haptic actuator 140 may correspond to an oscillation frequency of the magnetic member 180. In embodiments, the magnetic member 180 may have a fixed or variable oscillation frequency. In embodiments, the magnetic member 180 may have an oscillation frequency of from about 1 hertz (Hz) to about 50 Hz; about 1 hertz (Hz) to about 100 Hz; about 1 hertz (Hz) to about 150 Hz; about 1 hertz (Hz) to about 200 Hz; about 1 hertz (Hz) to about 300 Hz; about 1 hertz (Hz) to about 500 Hz; or about 1 hertz (Hz) to about 1000 Hz.

In operation, application of a positive voltage bias to the piezoelectric haptic actuator 110 causes a physical deformation of the actuator from a neutral position to a first position (e.g., an upward position with respect to the first surface 122 of the dielectric substrate 120). Removal of the positive voltage bias causes the piezoelectric haptic actuator 110 to return to the neutral position. On the other hand, application of a negative voltage bias to the piezoelectric haptic actuator 110 causes the actuator to deflect to a second position (e.g., a downward position with respect to the first surface 122 of the dielectric substrate 120) that may be in a direction opposite the first position.

FIG ID depicts an illustrative hybrid haptic actuation system 100 in a second (oscillating) operative state, in accordance with at least one embodiment of the present disclosure. In operation, the application of the steady-state bias voltage (V_bi_as - depicted in chart 186) to the electrodes of the piezoelectric haptic actuator 110 causes an initial upward deflection of the elastomeric layer 180 and the magnetic member 190. In addition to the bias voltage applied to the electrodes of the piezoelectric haptic actuator 110, a time- varying voltage may also be applied to the electrodes in addition to the steady state voltage (V_bi_as). In some implementations the time-varying voltage may vary at a first frequency (f_\) as depicted in chart 186. In some implementations, the varying voltage may include a voltage switched (e.g., V i_as + _d; V_bi_as - _d) at the first frequency or a sinusoidally varying voltage (e.g. , V_bi_as + Vsin(t)). The application of such a time-varying voltage to the piezoelectric haptic actuator 110 causes an alternating upward force and downward force on the elastomeric membrane 170 and magnetic element 180, oscillating the membrane 170 at the first frequency. In addition, an alternating current may be passed through the coil of the electromagnetic haptic actuator 140. The passage of the alternating current (z^' _COii - depicted in chart 184) through the electromagnetic haptic actuator 140 creates an additional alternating upward force 192 and downward force 194 on the magnetic member 180. The first frequency

of the alternating current flow through the electromagnetic haptic actuator 140 may correspond to the first frequency of the switched voltage applied to the electromagnetic haptic actuator 140 and the oscillation frequency of the magnetic member 180. In embodiments, the magnetic member 180 may have a fixed or variable oscillation frequency. In embodiments, the magnetic member 180 may have an oscillation frequency of from about 1 hertz (Hz) to about 50 Hz; about 1 hertz (Hz) to about 100 Hz; about 1 hertz (Hz) to about 150 Hz; about 1 hertz (Hz) to about 200 Hz; about 1 hertz (Hz) to about 300 Hz; about 1 hertz (Hz) to about 500 Hz; or about 1 hertz (Hz) to about 1000 Hz.

Switching the voltage bias (i.e., from a neutral-positive bias-neutral) at one or more frequencies may cause the piezoelectric haptic actuator 110 to oscillate between the neutral position and the first position at the one or more switching frequencies. Similarly, switching the voltage bias (i.e., from a positive bias-negative bias-positive bias) at one or more frequencies may cause the piezoelectric haptic actuator 110 to oscillate between the first position and the second position at the one or more switching frequencies. Such oscillations may be felt as a physical displacement of the user's skin (i.e., haptic feedback) when the hybrid haptic actuation system 100 is positioned proximate a user's skin.

In embodiments, the dielectric substrate 120 may include a void space 130. In some implementations, all or a portion of the piezoelectric haptic actuator 110 may be disposed proximate the void space 130 formed in the first surface 122 of the dielectric substrate 120. The presence of the void space 130 beneficially permits the deflection of the piezoelectric haptic actuator 110 in both an upwards and a downwards direction as the voltage bias applied to the piezoelectric haptic actuator 110 is switched from a positive bias to a negative bias.

The void space 130 may be formed in the dielectric substrate 120 using any number of processes, procedures, and/or technologies. In one example, all or a portion of the void space 130 may be formed using a laminated dielectric structure in which at least a portion of the uppermost layers of forming the laminated dielectric include an aperture in the region or area occupied by the void space 130. Such construction advantageously reduces or even eliminates the need for post processing to remove material from the dielectric substrate 120. In other examples, all or a portion of the void space 130 may be formed by removing dielectric material from the first surface 122 of the dielectric substrate 120 positioned beneath all or a portion of the piezoelectric haptic actuator 110. Such material may be removed from the dielectric substrate 120 using any material removal technology, such as mechanical abrasion, laser ablation, wet etching, dry etching (e.g. reactive ion etching), etc.

The synergistic use of the piezoelectric haptic actuator 110 and the electromagnetic haptic actuator 140 reduces the overall power demand of the hybrid haptic actuation system 100 by a factor of two (2) over haptic feedback systems using only a piezoelectric haptic actuator 110 or only an electromagnetic haptic actuator 140 and for equal displacements. The power dissipated by the piezoelectric haptic actuator 110 and the electromagnetic haptic actuator 140 depends on the square of the voltage and current supplied to each actuator (P = ½ CV for the piezoelectric haptic actuator 110 and P = I R for the electromagnetic haptic actuator 140), respectively. However, the displacement of the magnetic member 180 is almost linearly dependent on the supplied voltage and current (displacement -voltage for the electromagnetic haptic actuator 140 and displacement ~ current for the electromagnetic haptic actuator 140). Splitting a total displacement of X into ½X provided by the piezoelectric haptic actuator 110 and ½X provided by the electromagnetic haptic actuator 140 leads to a net reduction of ½ in the total power required to achieve the displacement. In portable electronic devices that often rely upon battery power, such a reduction in power consumption to achieve an equivalent haptic output represents a significant advantage over solutions using only a piezoelectric haptic actuator 110 or an electromagnetic haptic actuator 140.

FIG 2A depicts an illustrative hybrid haptic actuation system 200 that includes a package-integrated first piezoelectric haptic actuator 110A and a package-integrated second piezoelectric haptic actuator 110B disposed on the first surface 122 of the dielectric substrate 120, and an electromagnetic haptic actuator 140 disposed at least partially in the dielectric substrate 120, in accordance with one or more embodiments described herein. As depicted in FIG 2A, each of the piezoelectric haptic actuators 110A, 110B may include a piezoelectric material layer 212A, 212B (collectively, "piezoelectric material layer 212") sandwiched between a first electrode 214A, 214B (collectively, "first electrode 214") and a second electrode 216A, 216B (collectively, "second electrode 216"). Also as depicted in FIG 2A, each of the electromagnetic haptic actuators 140 may include a coil 250 that includes a number of turns 252 and may additionally include a core member 260 disposed at least partially within the coil 250.

Each piezoelectric haptic actuator 110 may include a piezoelectric layer 212 at least partially disposed between the first electrode 214, and the second electrode 216 such that the piezoelectric material layer 212 deforms, distorts, or is otherwise physically altered in the presence of a voltage bias between the first electrode 214 and the second electrode 216. In some implementations, the first electrode 214 may be disposed in, on, or about the first surface 122 of the dielectric layer 120. In some implementations, although not depicted in FIG 2A, the first electrode 214 may be disposed at least partially in, on, or about a passivation or other electrically non-conductive layer that is, in turn, disposed in, on, or about the first surface 122 of the dielectric layer 120. In some implementations, either or both the first electrode 214 and/or the second electrode 216 may be electrically conductively coupled to a trace, pad, or similar conductive element disposed in, on, or about the dielectric layer 120. In at least some implementations, all or a portion of the piezoelectric haptic actuator 110 may be disposed proximate a void space 130 formed in the first surface 122 of the dielectric substrate 120.

In embodiments, the piezoelectric haptic actuator 110 may be patterned, formed, or otherwise deposited onto a portion of the first surface 122 of the dielectric 120. Any number of piezoelectric haptic actuators 1 lOA-110η may be disposed in a regular or irregular pattern across all or a portion of either the first surface 122 and/or the second surface 124 of the dielectric 120. In some implementations, such as that depicted in FIG 2A, a plurality of piezoelectric haptic actuators 1 lOA-110η may populate all or a portion of the first surface 122 of the dielectric 120.

In embodiments, the first electrode 214 may be disposed in, on, or about the first surface 122 of the dielectric substrate 120. For example, the first electrode 214 may include all or a portion of one or more traces, pads, or similar conductive structures disposed in, on, or about the first surface 122 of the dielectric 120. In some implementations, all or a portion of the first electrode 214 may include a plurality of electrodes that, collectively, form the respective portion of the first electrode 214. In embodiments, the first electrode 214 may be deposited, patterned, sputtered, electroplated, printed, or otherwise positioned on some or all of the first surface 122 of the dielectric substrate 120. In some implementations, the first electrode 214 may be electrically conductively coupled to one or more traces, pads, or similar conductive structures disposed in, on, or about the dielectric substrate 120. Although not depicted in FIG. 2A, in other embodiments, one or more passivation, electrically insulative, electrically non-conductive, or dielectric substrate layers and/or materials may be interposed between all or a portion of the first electrode 214 and the first surface 122 of the dielectric substrate 120.

The piezoelectric material layer 212 may include one or more current or future developed piezoelectric materials. Such piezoelectric materials may include any single or combination of materials capable of undergoing a physical deflection when placed in an electric field created by applying a voltage differential across the piezoelectric material. Some or all of the piezoelectric material layer 212 may be deposited, patterned, sputtered, or otherwise positioned on some or all of the first electrode 214 and/or the second electrode 216. Example piezoelectric materials include, but are not limited to, quartz (Si0₂); Berlinite (A1P0₄); Gallium orthophosphate

(GaP0₄); Tourmaline; Barium titanate (BaTi0₃); Zinc oxide (ZnO); Aluminum nitride (A1N); Polyvinylidine fluoride (PVDF); Lithium titanate; Lanthanum gallium silicate; Potassium sodium tartrate; Potassium niobium oxide (KNb0₃); Barium sodium niobium oxide

(Ba₂NaNbs0₅); Lithium niobium oxide (LiNb0₃); Strontium titanate (SrTi0₃); Lead zirconate titanate (Pb(ZnTi)0₃); Lithium tantalumoxide (LiTa0₃); and Bismuth ferrous oxide (BiFe0₃).

In embodiments, the second electrode 216 may be disposed proximate all or a portion of the piezoelectric material layer 212. In some implementations, all or a portion of the

piezoelectric material layer 212 may separate the second electrode 216 from the first surface 122 of the dielectric substrate 120. Although not depicted in FIG. 2A, in other embodiments, one or more passivation, electrically insulative, electrically non-conductive, or dielectric substrate layers and/or materials may be interposed between all or a portion of the second electrode 216 and the first surface 122 of the dielectric substrate 120. In some implementations, all or a portion of the second electrode 216 may include a plurality of electrodes that, collectively, form the respective portion of the second electrode 216. In embodiments, the second electrode 216 may be deposited, patterned, sputtered, electroplated, printed, or otherwise positioned on some or all of the piezoelectric material layer 212. In some implementations, the second electrode 216 may be electrically conductively coupled to one or more traces, pads, or similar conductive structures disposed in, on, or about the dielectric substrate 120.

The dielectric substrate 120 may include any number and/or combination of any current or future developed electrically non-conductive, insulative, or dielectric materials. The dielectric substrate 120 may include a first surface 122 and a transversely opposed second surface 124. In some implementations, all or a portion of the dielectric substrate 120 may include a single layer or multi-layer printed circuit board substrate. In some implementations, all or a portion of the dielectric substrate 120 may include a rigid sheet or member. In some

implementations, all or a portion of the dielectric substrate 120 may include a flexible sheet or member. The dielectric substrate 120 may have any physical shape, size, or configuration. In some implementations, the dielectric substrate 120 may include any number of traces, vias, and similar conductive structures to provide one or more electrically conductive circuits. The dielectric substrate 120 may include any number and/or combination of surface mount or through-hole electrical components and/or semiconductor devices.

Each electromagnetic haptic actuator 140 may include a coil 250 having a number of turns 252A-252n. In embodiments, the dielectric substrate 120 may include a laminated dielectric substrate 120 and each of the turns 252 may be formed, patterned, and/or deposited on a respective one of the layers forming the laminated dielectric substrate 120. In embodiments, each turn 252 of the coil 250 may be deposited, patterned, or otherwise formed on a respective layer of a multi-layer dielectric substrate 120. In such embodiments, each turn 252_x may be conductively coupled to the neighboring turns 252_x+1, 252_x-1, using one or more thru-layer conductive structures such as one or more vias.

In some implementations, the interconnects between turns 252 may be lithographically defined to follow the shape of the turn 252. Such implementations may increase the effective thickness of each turn 252, reducing the resistance of the coil 250. Such may beneficially reduce the power consumption of the hybrid haptic actuation system 100 and may also beneficially reduce Joule heating within the dielectric substrate 120.

In embodiments, some or all of the electromagnetic haptic actuators 140 may include a core member 260 disposed at least partially within the coil 250. In such embodiments, the core member 260 may include a soft magnetic material, a composite magnetic material, or similar magnetic compound. In some implementations, an electrically non-conductive material may be disposed proximate the exposed "top" of the core member 260. In embodiments, the core 260 may be axially aligned with the magnetic member 180. In embodiments, the core 260 may partially or completely align with the void space 130 proximate the piezoelectric haptic actuator 110. In embodiments, the core member 260 may be screen printed or dispensed within a cavity formed in the first surface 122 of the dielectric substrate 120. In embodiments, the use of a core member may increase the magnetic flux (and consequently the strength of the magnetic field) about the magnetic member 180, increasing the displacement of the magnetic member 180 and/or reducing the power required to achieve a defined displacement of the magnetic member 180.

FIG 2B depicts the illustrative hybrid haptic actuation system 200 in a first mode or first

(offset) operative state, in accordance with at least one embodiment of the present disclosure. In the first state depicted in FIG 2B, a bias voltage has been applied between the first electrode 214 and the second electrode 216. The application of the bias voltage causes the piezoelectric material layer 212 to deform creating an upward directed force 190 on the elastomeric membrane 170. The upward directed force displaces the magnetic member 180 a defined distance upward, away from the first surface 122 of the dielectric substrate 120. In some implementations, the piezoelectric haptic actuator 110 may deflect in a direction normal to the first surface 122 of the dielectric substrate 120. The displacement of the magnetic member 180 by the elastomeric layer 170 may, in some instances, be perceptible by a user of the device carrying the hybrid haptic actuation system 100.

FIG 2C depicts an illustrative hybrid haptic actuation system 200 in a second (oscillating) operative state, in accordance with at least one embodiment of the present disclosure. In operation, after the piezoelectric haptic actuator 1 10 causes an initial upward deflection of the elastomeric layer 180 and the magnetic member 190, an alternating current may be passed through the coil 250 of the electromagnetic haptic actuator 140. The passage of the alternating current through the coil 250 creates an alternating upward force 192 and downward force 194 on the magnetic member 180. The frequency of the alternating current flow through the coil 250 may correspond to the output oscillation frequency of the magnetic member 180. In

embodiments, the magnetic member 180 may have a fixed or variable oscillation frequency. In other embodiments the piezoelectric haptic actuator 110 may be operated with a variable voltage (e.g. , a switched or sinusoidally varying voltage) that, when combined with the oscillatory displacement of the electromagnetic haptic actuator 140 may cause an extended oscillatory displacement of the PE actuator.

FIG 3A depicts a plan view of an illustrative hybrid haptic actuation system 300 that includes an illustrative package-integrated piezoelectric haptic actuator 110 having four elements 302A-302D formed on a first surface 122 of a dielectric substrate 120 and positioned coaxially above an illustrative package-integrated electromagnetic haptic actuator 140 having a double coil 252 and core member 260, in accordance with at least one embodiment of the present disclosure. FIG 3B is a cross-sectional elevation of the illustrative hybrid haptic actuation system 300 depicted in FIG 3A, in accordance with at least one embodiment of the present disclosure. As depicted in FIG 3B, the hybrid haptic actuation system 300 may have an overall height

(including both the piezoelectric haptic actuator 110 and the electromagnetic haptic actuator 140) of from about 500 micrometers (μιη) to about 2000μιη.

As depicted in FIG 3A, the piezoelectric haptic actuator 110 may include a number of piezoelectric actuators 302A-302n (collectively "piezoelectric actuators 302"), which span the void space 130. Each of the piezoelectric actuators 302 may include a piezoelectric material layer 212 positioned between a first electrode 214 and a second electrode 216. Application of a voltage bias between the first electrode 214 and the second electrode 216 causes the piezoelectric material layer 212 sandwiched between the electrodes to physically deform causing an upward, downward, and/or oscillating deflection of the magnetic member 180 and elastomeric layer 170. In some implementations, the magnetic member 280 and the elastomeric layer 170 may deflect along an axis 320 that is generally normal to the first surface 122 of the dielectric substrate 120.

Application of an alternating current to the coil 250 creates an oscillating magnetic field, the strength of which may be enhanced by positioning a coil member 260 within at least a portion of the coil 250. The oscillating magnetic field causes the magnetic member 180 to oscillate along axis 320. The oscillation frequency of the magnetic field may be proportional or equal to the frequency of the alternating current supplied to the coil 250. The combined offset caused by the piezoelectric haptic actuator 110 and the oscillation caused by the electromagnetic haptic actuator 140 causes a displacement of the magnetic member 180 of from about 10 micrometer (μιη) to about 400μιη.

As depicted in FIG 3B, the dielectric substrate 120 may include a number of laminated dielectric sheets 310A-310n (collectively, "dielectric layers 310"). A turn 252 of the coil 250 may be deposited, for example by using lithography and electroplating, electroless plating, or sputtering, on each of some or all of the dielectric layers 310. In some implementations, each dielectric layer 310 may include an aperture formed through a central portion of the turn 252, when the dielectric layers 310A-310η are stacked, the apertures align and form a void extending along all or a portion of the coil 250. In some implementations, the core member 260 may be disposed in at least a portion of the void extending along the coil 250.

FIG. 4 is a perspective view of an illustrative device 400 that includes a number of hybrid haptic actuation systems 100A- 100F disposed in, on, or about the device 400, in accordance with at least one embodiment of the present disclosure. Although depicted as disposed on a portion of a smartwatch band 402 in FIG 4, any number of hybrid haptic actuation systems 100 may be disposed in, on, or about any clothing, article, accessory, wearable computer, or device capable of being placed in contact with a skin surface of a user. In embodiments, each of the hybrid haptic actuation systems 100 and/or combinations of haptic actuation systems 100 may provide the user with different alerts, alarms, indications, or notifications. Using the smartwatch band 402 as an example, alerts may be defined within the smartwatch or a communicably coupled device such as a smartphone such that hybrid haptic actuation system 100A actuates in response to a calendar event; hybrid haptic actuation system 100B actuates in response to an incoming text message; hybrid haptic actuation system lOOC actuates in response to an incoming email message; and a combination of hybrid haptic actuation systems 100B and lOOC actuates in response to an incoming telephone call.

In embodiments, each of the hybrid haptic actuation systems 100 may have an operating frequency (e.g. , the vibration frequency) of from about 1 hertz (Hz) to about 200 Hz. In some implementations, the some or all of the hybrid haptic actuation systems 100 may selectively operate at one of a number of frequencies within the defined range, with each of the operating frequencies representing a different alert or a different alert level. For example, an email or text message designated as urgent may cause hybrid haptic actuation system 100A to operate at a low frequency (e.g. , 50 Hz) upon receipt of the message; an intermediate frequency (e.g., 100 Hz) if the message is not read after 5 minutes; and a high frequency (e.g. , 200 Hz) if the message is not read after 10 minutes.

Each of the hybrid haptic actuation systems 100 may have an operating displacement (e.g. , the vibration amplitude) of from about 10 micrometers (μιη) to about 200 μηι. In some implementations, the some or all of the hybrid haptic actuation systems 100 may selectively operate at one of a number of operating displacements within the defined range, with each of the operating displacements representing a different alert or a different alert level. For example, an incoming telephone call received from an unknown party may cause a small displacement such as 50 μηι; an incoming telephone call from a friend may cause an intermediate displacement such as 100 μιη; and an incoming telephone call from a family member may cause a large displacement such as 200 μιη.

The two-point discrimination threshold for discriminating between two neighboring hybrid haptic actuation systems 100 is approximately 2 millimeters (mm) at the fingertip. The discrimination threshold varies with location on the human body. To provide spacing sufficient for the system user to distinguish between hybrid haptic actuation systems 100, neighboring hybrid haptic actuation systems 100 may be spaced a distance 204 of about 1 mm or more; about 3 mm or more; about 5 mm or more; about 10 mm or more; about 15 mm or more; or about 20 mm or more.

FIG 5 is a high-level block flow diagram of an illustrative method 500 of forming a hybrid haptic actuation system 100 on a dielectric substrate 120, in accordance with at least one embodiment of the present disclosure. The method 500 commences at 502.

At 504, a plurality of alternating metal layers and dielectric layers 310 are stacked to form a coil 250 having a number of turns 252. In some implementations, one or more vias or through layer conductors may be deposited, fabricated, or otherwise formed to electrically conductively couple adjacent turns 252 to form the coil 250. In some implementations, two or more sets of concentric turns 252 may be deposited on each layer to provide two or more concentric coils 250. The completed coil 250 may be electrically continuous and embedded partially or completely within the dielectric substrate 120.

At 506, a patterned metal layer is formed on a first surface 122 of the dielectric substrate 120. In embodiments, the dielectric substrate 120 may include a printed circuit substrate that includes a single layer or multiple layers. The patterned metal layer may include any number of conductors, traces, pads, or similar structures capable of providing a first electrode 114. The patterned metal layer 324 may be formed on the first surface 122 of the dielectric substrate 120 using any current or future developed deposition technology. Such deposition technologies include, but are not limited to, sputtering, electroplating, electro-less plating, printing, or combinations thereof.

At 508, a piezoelectric layer 112 is deposited proximate at least a portion of the first electrode 114. The piezoelectric layer 112 may include any current or future developed material capable of undergoing a physical deformation when a bias voltage is applied across the material. The piezoelectric layer 112 may be formed proximate the first electrode 114 using any current or future developed deposition technology. Such deposition technologies may include, but are not limited to, sputtering, evaporation, printing, or combinations thereof.

At 510, a second electrode 116 is deposited proximate at least a portion of the piezoelectric layer 112. The second electrode 116 may have any size, shape, or physical configuration. The second electrode 116 may include one or more conductive metals, one or more conductive non-metals, or any combination thereof. The second electrode 116 may be formed on at least a portion of the piezoelectric layer using any current or future developed deposition technology. Such deposition technologies include, but are not limited to, sputtering, electroplating, electro-less plating, or combinations thereof.

At 512, a portion of the dielectric substrate 120 proximate the first electrode 114 may be removed to provide a void space or cavity 130 beneath the piezoelectric haptic actuator 110.

Such a void space 130 beneficially permits the displacement of the hybrid haptic actuation system 100 in the vertical direction (e.g., away from or towards surface 122 in FIG 1). In some embodiments, the portion removed from the dielectric substrate 120 to create the void or cavity may be removed using any current or future developed material removal technique or technology. Example material removal technologies include, but are not limited to, mechanical abrasion, laser ablation, chemical etching (e.g. wet or dry etching), etc.

At 514 an elastomeric material 170 may be deposited across all or a portion of the piezoelectric haptic actuator 110 and/or the electromagnetic haptic actuator 140. In

embodiments, the elastomeric material 170 may isolate the piezoelectric haptic actuator 110 and the electromagnetic haptic actuator 140 from user contact.

At 516, a magnetic member 180 may be affixed to the elastomeric material 170. In some implementations, the magnetic member 180 may be partially or completely embedded in the elastomeric material 170. The magnetic member 180 may have any size and/or shape. The method 500 concludes at 518.

FIG.6 provides a high-level block flow diagram of an illustrative method 600 of operating a hybrid haptic actuation system 100, in accordance with at least one embodiment of the present disclosure. The method 600 commences at 602.

At 604, a voltage bias is applied to a piezoelectric haptic actuator 110 to cause an offset of a magnetic member 180. In some implementations, application of a voltage bias to the piezoelectric haptic actuator 110 causes a physical deformation of the piezoelectric material layer 112 included in the actuator. The physical deformation of the piezoelectric material layer 112 creates a force 190 that can displace the magnetic member 180 a distance of from about 1 micrometer (μιη) to about 200μιη. In some implementations, the voltage bias between the first electrode 114 and the second electrode 116 may be maintained while the electromagnetic haptic actuator 140 is actuated at 606. In some implementations, the voltage bias may include a voltage switched between the bias voltage and a higher voltage at a first frequency. In some

implementations, the voltage applied to the piezoelectric haptic actuator 110 may include a bias voltage or offset voltage component and a time-varying voltage component at the first frequency, such as a switched voltage at the first frequency or a sinusoidally varying voltage at the first frequency.

At 606, an alternating current is supplied to the coil 250 in an electromagnetic haptic actuator 140. The application of an alternating current to the coil 250 creates an oscillating magnetic field which may be strengthened or otherwise enhanced through the use of a core member 260. The oscillating magnetic field created by the passage of the alternating current through the coil 250 causes the magnetic member 180 to oscillate upward 192 and downward 194. The frequency of oscillation of the magnetic member 180 may approximately equal the frequency of the alternating current supplied to the coil 250. In embodiments, the magnetic member may have an oscillation frequency of from about 1 Hertz (Hz) to about 200 Hz. In embodiments, the magnetic field produced by the coil 250 may cause a variable displacement of the magnetic member 180 of from about 10 micrometer (μιη) to about 200μιη.

Beneficially, the voltage bias applied to the piezoelectric haptic actuator 110 and the alternating current applied to the electromagnetic haptic actuator 140 may reduce the power consumed by the hybrid haptic actuation system 100 by a factor of two when compared to a piezoelectric haptic actuator 110 or an electromagnetic haptic actuator 140 capable of producing an equivalent displacement. Such reduction in power requirements may be particularly advantageous in battery powered portable electronic devices capable of providing haptic feedback. The method 600 concludes at 608.

Additionally, operations for the embodiments have been further described with reference to the above figures and accompany ng examples. Some of the figures may include a logic flow. Although such figures presented herein may include a particular logic flow, it can be appreciated thai the logic flow merely provides an example of how the general functionality described herein can be implemented. Further, the given logic flow does not necessarily have to be executed in the order presented unless otherwise indicated. In addition, the given logic flow may be

implemented by a hardware element, a software element executed by a processor, or any combination thereof. The embodiments are not limited to th s context.

Various features, aspects, and embodiments have been described herein. The features, aspects, and embodiments are susceptible to combination with one another as well as to variation and modification, as will be understood by those having skill in the art. The present disclosure should, therefore, be considered to encompass such combinations, variations, and modifications. Thus, the breadth and scope of the present invention should not be limited by any of the above- described exemplary embodiments, but should be defined only in accordance with the following claims and their equivalents.

As used in any embodiment herein, the term "module" may refer to software, firmware and/or circuitry configured to perform any of the aforementioned operations. Software may be embodied as a software package, code, instructions, instruction sets and/or data recorded on non- transitory computer readable storage medium. Firmware may be embodied as code, instructions or instruction sets and/or data that are hard-coded (e.g., nonvolatile) in memory devices.

"Circuitry", as used in any embodiment herein, may comprise, for example, singly or in any combination, hardwired circuitry, programmable circuitry such as computer processors comprising one or more individual instruction processing cores, state machine circuitry, and/or firmware that stores instructions executed by programmable circuitry. The modules may, collectively or individually, be embodied as circuitry that forms part of a larger system, for example, an integrated circuit (IC), system on-chip (SoC), desktop computers, laptop computers, tablet computers, servers, smart phones, etc.

Any of the operations described herein may be implemented in a system that includes one or more storage mediums having stored thereon, individually or in combination, instructions that when executed by one or more processors perform the methods. Here, the processor may- include, for example, a server CPU, a mobile device CPU, and/or other programmable circuitry. Also, it is intended that operations described herein may be distributed across a plurality of physical devices, such as processing structures at more than one different physical location. The storage medium may include any type of tangible medium, for example, any type of disk including hard disks, floppy disks, optical disks, compact disk read-only memories (CD-ROMs), compact disk rewritables (CD-RWs), and magneto-optical disks, semiconductor devices such as read-only memories (ROMs), random access memories (RAMs) such as dynamic and static RAM s, erasable programmable read-only memories (EPROMs), electrically erasable

programmable read-only memories (EEPROMs), flash memories, Solid State Disks (SSDs), magnetic or optical cards, or any type of media suitable for storing electronic instructions. Other embodiments may be implemented as software modules executed by a programmable control device. The storage medium may be non-transitory.

The terms and expressions which have been employed herein are used as terms of description and not of limitation, and there is no intention, in the use of such terms and expressions, of excluding any equivalents of the features shown and described (or portions thereof), and it is recognized that various modifications are possible within the scope of the claims. Accordingly, the claims are intended to cover all such equivalents. Various features, aspects, and embodiments have been described herein. The features, aspects, and embodiments are susceptible to combination with one another as well as to variation and modification, as will be understood by those having skill in the art. The present disclosure should, therefore, be considered to encompass such combinations, variations, and modifications.

As described herein, various embodiments may be implemented using hardware elements, software elements, or any combination thereof. Examples of hardware elements may include processors, microprocessors, circuits, circuit elements (e.g., transistors, resistors, capacitors, inductors, and so forth), integrated circuits, application specific integrated circuits (ASIC), programmable logic devices (PLD), digital signal processors (DSP), field programmable gate array (FPGA), logic gates, registers, semiconductor device, chips, microchips, chip sets, and so forth.

Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or

characteristics may be combined in any suitable manner in one or more embodiments. The following examples pertain to further embodiments. The following examples of the present disclosure may comprise subject material such as a device, a method, means for performing acts based on the method and/or a system for providing haptic actuation using a package-integrated hybrid haptic actuation system 100 that includes a piezoelectric haptic actuator 110 and an electromagnetic haptic actuator 140 formed on a dielectric substrate 120 proximate a void space 130.

According to example 1, there is provided a hybrid haptic actuator system. The system may include a dielectric substrate having a first surface and a transversely opposed second surface, the dielectric substrate at least partially defining a void space formed in the first surface of the dielectric substrate and extending at least partially through the dielectric substrate. The system may additionally include an electromagnetic haptic actuator embedded at least partially in the dielectric substrate proximate the void space, a piezoelectric haptic actuator disposed on the first surface of the dielectric substrate and at least partially spanning the void space formed in the first surface, an elastomeric membrane disposed proximate the piezoelectric haptic actuator, and a magnetic member disposed within the elastomeric membrane, the magnetic member spaced apart from and axially aligned with the electromagnetic haptic actuator.

Example 2 may include elements of example 1 where the electromagnetic haptic actuator may include a coil disposed at least partially within the dielectric substrate.

Example 3 may include elements of example 2 where the electromagnetic haptic actuator further may include a core member disposed at least partially within the coil.

Example 4 may include elements of example 2 where the dielectric substrate may include a printed circuit substrate having a plurality of layers, each of the layers including at least a portion of at least one turn of the coil and where each of the plurality of layers may include at least one via electrically conductively coupling the turns of the coil on successive layers of the printed circuit substrate.

Example 5 may include elements of example 2 where the piezoelectric haptic actuator may include a first electrode, a second electrode spaced apart from the first electrode, and a piezoelectric material layer at least partially disposed between the first electrode and the second electrode. Example 6 may include elements of example 5 where the first electrode may include at least one of the number of conductive traces formed on the first surface of the printed circuit substrate.

Example 7 may include elements of example 5, and may additionally include a haptic actuation controller that, in operation, may supply to the piezoelectric haptic actuator at least one of: a bias voltage to cause a physical offset of the magnetic member away from the first surface of the dielectric substrate; a time-varying voltage to cause an oscillatory displacement of a physically offset magnetic member at a first frequency; or combinations thereof.

Example 8 may include elements of example 7 where the haptic actuation controller, in operation, may further supply an alternating current to the electromagnetic haptic actuator to cause an oscillatory displacement of the offset magnetic member.

Example 9 may include elements of any of examples 1 through 8 where the dielectric substrate may include a flexible printed circuit substrate.

According to example 10, there is provided a wearable electronic device. The wearable electronic device may include a wearable device housing having an exterior surface, a hybrid haptic actuator controller disposed at least partially within the wearable device housing, and a plurality of hybrid haptic actuators forming at least a portion of the exterior surface of the wearable device housing, each of the plurality of hybrid haptic actuators conductively coupled to the hybrid haptic actuator controller. Each of the hybrid haptic actuators may include a dielectric substrate having a first surface and a transversely opposed second surface, the dielectric substrate at least partially defining a void space formed in the first surface of the dielectric substrate and extending at least partially through the dielectric substrate, an electromagnetic haptic actuator embedded at least partially in the dielectric substrate proximate the void space, a piezoelectric haptic actuator disposed on the first surface of the dielectric substrate proximate the void space, an elastomeric membrane disposed proximate the piezoelectric haptic actuator, and a magnetic member disposed within the elastomeric membrane, the magnetic member spaced apart from and axially aligned with the electromagnetic haptic actuator.

Example 11 may include elements of example 10 where the electromagnetic haptic actuator may include a coil disposed at least partially within the dielectric substrate.

Example 12 may include elements of example 11 where the electromagnetic haptic actuator may further include a core member disposed at least partially within the coil. Example 13 may include elements of example 12 where the dielectric substrate may include a printed circuit substrate having a plurality of layers, each of the layers including at least a portion of at least one turn of the coil and where each of the plurality of layers may include at least one via electrically conductively coupling the turns of the coil on successive layers of the printed circuit substrate.

Example 14 may include elements of example 11 where the piezoelectric haptic actuator may include a first electrode, a second electrode spaced apart from the first electrode, and a piezoelectric layer at least partially disposed between the first electrode and the second electrode.

Example 15 may include elements of example 14 where the first electrode may include at least one of the number of conductive traces formed on the first surface of the printed circuit substrate.

Example 16 may include elements of example 14 where, in operation, the hybrid haptic actuation controller may supply to the piezoelectric haptic actuator at least one of: a bias voltage to cause a physical offset of the magnetic member away from the first surface of the dielectric substrate; a time-varying voltage to cause an oscillatory displacement of a physically offset magnetic member at a first frequency; or a combination thereof.

Example 17 may include elements of example 16 where the physical offset may include a distance of from about 1 micrometer (μιη) to about 400 μιη away from the first surface of the dielectric substrate.

Example 18 may include elements of example 16 where, in operation, the hybrid haptic actuation controller may supply an alternating current to the coil to cause an oscillatory displacement of the offset magnetic member.

Example 19 may include elements of example 18 where the hybrid haptic actuator controller may supply alternating current at a frequency of from about 1 Hertz to about 200 Hertz to the coil.

Example 20 may include elements of example 19 where the oscillatory displacement may include a displacement of from about 1 micrometers (μιη) to about 400 μιη.

Example 21 may include elements of any of examples 10 through 20 where the dielectric substrate may include a flexible printed circuit substrate.

Example 22 may include elements of any of examples 10 through 20 where each of the plurality of hybrid haptic actuators may be positioned to form a two-dimensional matrix on at least a portion of the exterior surface, the two-dimensional matrix having a spacing between neighboring hybrid haptic actuators of at least 2 millimeters.

According to example 23, there is provided a hybrid haptic feedback method. The method may include driving a magnetic member embedded in an elastomeric membrane by applying a voltage to a piezoelectric haptic actuator formed on a first surface of a dielectric substrate to cause a displacement of the magnetic member and applying an alternating current at a first frequency to an electromagnetic haptic actuator formed at least partially in the dielectric substrate proximate the piezoelectric haptic actuator to cause an oscillatory displacement of the displaced magnetic member at the first frequency.

Example 24 may include elements of example 23 where applying a voltage to a piezoelectric haptic actuator formed on a first surface of a dielectric substrate to cause a displacement of the magnetic member may include at least one of: applying a voltage to a piezoelectric haptic actuator formed on a first surface of a dielectric substrate sufficient to offset the magnetic member through a displacement of from about 1 micrometer (μιη) to about 200μιη; or applying a voltage having a steady-state bias voltage component and a time-varying voltage component at the first frequency sufficient to cause an oscillatory displacement of the magnetic member through a displacement of from about 1 micrometer (μιη) to about 400μιη.

Example 25 may include elements of example 23 where applying an alternating current at a first frequency to an electromagnetic haptic actuator formed at least partially in the dielectric substrate proximate the piezoelectric haptic actuator to cause an oscillatory displacement of the offset magnetic member at the first frequency may include applying the alternating current at the first frequency to the electromagnetic haptic actuator to cause an oscillatory displacement of the offset magnetic member of from about 1 micrometer (μιη) to about 400μιη.

Example 26 may include elements of example 25 where applying an alternating current at a first frequency to an electromagnetic haptic actuator formed at least partially in the dielectric substrate proximate the piezoelectric haptic actuator to cause an oscillatory displacement of the offset magnetic member at the first frequency may include applying the alternating current to the electromagnetic haptic actuator to cause an oscillatory displacement of the offset magnetic member, the oscillatory displacement having a frequency of from about 1 Hertz (Hz) to about 200 Hz. According to example 27, there is provided a hybrid haptic feedback system. The system may include a means for driving a magnetic member embedded in an elastomeric membrane. The means for driving a magnetic member embedded in an elastomeric membrane may include a means for applying a voltage to a piezoelectric haptic actuator formed on a first surface of a dielectric substrate to cause a displacement of the magnetic member and a means for applying an alternating current at a first frequency to an electromagnetic haptic actuator formed at least partially in the dielectric substrate proximate the piezoelectric haptic actuator to cause an oscillatory displacement of the displaced magnetic member at the first frequency.

Example 28 may include elements of example 27 where the means for applying a voltage to a piezoelectric haptic actuator formed on a first surface of a dielectric substrate to cause a displacement of the magnetic member may include a means for applying a voltage to a piezoelectric haptic actuator formed on a first surface of a dielectric substrate sufficient to offset the magnetic member through a displacement of from about 1 micrometer (μιη) to about 400μιη.

Example 29 may include elements of example 27 where the means for applying an alternating current at a first frequency to an electromagnetic haptic actuator formed at least partially in the dielectric substrate proximate the piezoelectric haptic actuator to cause an oscillatory displacement of the offset magnetic member at the first frequency may include a means for applying the alternating current at the first frequency to the electromagnetic haptic actuator to cause an oscillatory displacement of the offset magnetic member of from about 1 micrometer (μιη) to about 400μιη.

Example 30 may include elements of example 29 where the means for applying an alternating current at a first frequency to an electromagnetic haptic actuator formed at least partially in the dielectric substrate proximate the piezoelectric haptic actuator to cause an oscillatory displacement of the offset magnetic member at the first frequency may include a means for applying the alternating current to the electromagnetic haptic actuator to cause an oscillatory displacement of the offset magnetic member, the oscillatory displacement having a frequency of from about 1 Hertz (Hz) to about 200 Hz.

According to example 31 , there is provided a method of forming hybrid haptic actuator system. The method may include forming an electromagnetic haptic actuator in a dielectric substrate by: depositing a plurality of alternating dielectric layers and metal layers to form a conductive coil having a central axis, each of the metal layers conductively coupled by a via that penetrates a dielectric layer disposed between the respective metal layers and forming a piezoelectric haptic actuator on a first surface of the dielectric substrate, proximate the electromagnetic actuator subsystem. Forming a piezoelectric haptic actuator may include forming a first electrode proximate the first surface of the dielectric substrate, forming a piezoelectric layer proximate the first electrode, and forming a second electrode proximate the piezoelectric layer. The method may further include: depositing an elastic membrane proximate the piezoelectric haptic actuator, affixing a magnetic member to the elastic membrane, the magnetic member coaxial with the central axis of the coil, and removing at least a portion of the first surface of the dielectric substrate proximate the first electrode.

Example 32 may include elements of example 31 where forming an electromagnetic haptic actuator in a dielectric substrate may further include removing at least a portion of the first surface of the dielectric substrate along the central axis of the at least one coil structure to define a core void space within at least a portion of the at least one coil structure and forming a core member that extends along the central axis of the at least one coil structure within at least a portion of the core void space.

Example 33 may include elements of example 32 where forming an electromagnetic haptic actuator in a dielectric substrate may further include filling at least a portion of the core void space proximate the core member with a sacrificial material.

Example 34 may include elements of example 32 where forming a core member that extends along the central axis of the at least one coil structure within at least a portion of the core void space may include forming a core member using a soft magnetic material that extends along the central axis of the at least one coil structure within at least a portion of the core void space.

Example 35 may include elements of example 31 where forming an electromagnetic haptic actuator in a dielectric substrate may include forming the electromagnetic haptic actuator in a printed circuit substrate.

Example 36 may include elements of example 31 where forming a first electrode proximate the first surface of the dielectric substrate may include depositing a passivation layer on at least a portion of the first surface of the dielectric substrate, and forming the first electrode on at least a portion of the deposited passivation layer.

According to example 37, there is provided a system for forming hybrid haptic actuator system. The system may include a means for forming an electromagnetic haptic actuator in a dielectric substrate that includes a means for depositing a plurality of alternating dielectric layers and metal layers to form a coil having a central axis, each of the metal layers conductively coupled by a via that penetrates a dielectric layer disposed between the respective metal layers. The system may further include a means for forming a piezoelectric haptic actuator on a first surface of the dielectric substrate, proximate the electromagnetic haptic actuator that includes: a means for forming a first electrode proximate the first surface of the dielectric substrate, a means for forming a piezoelectric layer proximate the first electrode, and a means for forming a second electrode proximate the piezoelectric layer. The system may further include a means for depositing an elastic membrane proximate the piezoelectric haptic actuator, a means for affixing a magnetic member to the elastic membrane, the magnetic member coaxial with the central axis of the coil, and a means for removing at least a portion of the first surface of the dielectric substrate proximate the first electrode.

Example 38 may include elements of example 37 where the means for forming an electromagnetic haptic actuator in a dielectric substrate may further include a means for removing at least a portion of the first surface of the dielectric substrate along the central axis of the coil to define a core void space within at least a portion of the at least one coil structure and a means for forming a core member that extends along the central axis of the coil within at least a portion of the core void space.

Example 39 may include elements of example 38 where the means for forming an electromagnetic haptic actuator in a dielectric substrate may further include a means for filling at least a portion of the core void space proximate the core member with a sacrificial material.

Example 40 may include elements of example 38 where the means for forming a core member that extends along the central axis of the coil within at least a portion of the core void space may include a means for forming a core member using a soft magnetic material that extends along the central axis of the coil within at least a portion of the core void space.

Example 41 may include elements of example 37 where the means for forming an electromagnetic haptic actuator in a dielectric substrate may include a means for forming the electromagnetic haptic actuator in a printed circuit substrate.

Example 42 may include elements of example 37 where the means for forming a first electrode proximate the first surface of the dielectric substrate may include a means for depositing a passivation layer on at least a portion of the first surface of the dielectric substrate, and a means for forming the first electrode on at least a portion of the deposited passivation layer.

The terms and expressions which have been employed herein are used as terms of description and not of limitation, and there is no intention, in the use of such terms and expressions, of excluding any equivalents of the features shown and described (or portions thereof), and it is recognized that various modifications are possible within the scope of the claims. Accordingly, the claims are intended to cover all such equivalents.

Claims

WHAT IS CLAIMED:

1. A hybrid haptic actuator system, comprising:

a dielectric substrate having a first surface and a transversely opposed second surface, the dielectric substrate at least partially defining a void space formed in the first surface of the dielectric substrate and extending at least partially through the dielectric substrate; and

an electromagnetic haptic actuator embedded at least partially in the dielectric substrate proximate the void space;

a piezoelectric haptic actuator disposed on the first surface of the dielectric substrate proximate the void space;

an elastomeric membrane disposed proximate the piezoelectric haptic actuator; and a magnetic member disposed within the elastomeric membrane, the magnetic member spaced apart from and axially aligned with the electromagnetic haptic actuator.

2. The hybrid haptic actuator system of claim 1 wherein the electromagnetic haptic actuator comprises:

a coil disposed at least partially within the dielectric substrate.

3. The hybrid haptic actuator system of claim 2 wherein the electromagnetic haptic actuator further comprises:

a core member disposed at least partially within the coil.

4. The hybrid haptic actuator system of claim 2:

wherein the dielectric substrate comprises a printed circuit substrate having a plurality of layers, each of the layers including at least a portion of at least one turn of the coil; and

wherein each of the plurality of layers includes at least one via electrically conductively coupling the turns of the coil on successive layers of the printed circuit substrate.

5. The hybrid haptic actuator system of claim 2 wherein the piezoelectric haptic actuator comprises:

a first electrode; a second electrode spaced apart from the first electrode; and

a piezoelectric material layer at least partially disposed between the first electrode and the second electrode.

6. The hybrid haptic actuator system of claim 5 wherein the first electrode comprises at least one of the number of conductive traces formed on the first surface of the printed circuit substrate.

7. The hybrid haptic actuator system of claim 5, further comprising a haptic actuation controller that, in operation:

supplies to the piezoelectric haptic actuator at least one of: a bias voltage to cause a physical offset of the magnetic member away from the first surface of the dielectric substrate; a time-varying voltage to cause an oscillatory displacement of a physically offset magnetic member at a first frequency; or a combination thereof.

8. The hybrid haptic actuator system of claim 7 wherein the haptic actuation controller, in operation, further:

supplies an alternating current to the electromagnetic haptic actuator to cause an oscillatory displacement of the magnetic member.

9. A wearable electronic device, comprising:

a wearable device housing having an exterior surface;

a hybrid haptic actuator controller disposed at least partially within the wearable device housing; and

a plurality of hybrid haptic actuators forming at least a portion of the exterior surface of the wearable device housing, each of the plurality of hybrid haptic actuators conductively coupled to the hybrid haptic actuator controller and including:

a dielectric substrate having a first surface and a transversely opposed second surface, the dielectric substrate at least partially defining a void space formed in the first surface of the dielectric substrate and extending at least partially through the dielectric substrate; and an electromagnetic haptic actuator embedded at least partially in the dielectric substrate proximate the void space;

10. The wearable electronic device of claim 9 wherein the electromagnetic haptic actuator comprises:

a coil disposed at least partially within the dielectric substrate.

11. The wearable electronic device of claim 10 wherein the electromagnetic haptic actuator further comprises:

a core member disposed at least partially within the coil.

12. The wearable electronic device of claim 10:

13. The wearable electronic device of claim 11 wherein the piezoelectric haptic actuator comprises:

a first electrode;

a second electrode spaced apart from the first electrode; and

a piezoelectric layer at least partially disposed between the first electrode and the second electrode.

14. The wearable electronic device of claim 13 wherein the first electrode comprises at least one of the number of conductive traces formed on the first surface of the printed circuit substrate.

15. The wearable electronic device of claim 13 wherein, in operation, the hybrid haptic actuation controller:

16. The wearable electronic device of claim 15 wherein the physical offset comprises a distance of from about 10 micrometer (μιη) to about 400 μιη away from the first surface of the dielectric substrate.

17. The wearable electronic device of claim 15 wherein, in operation, the hybrid haptic actuation controller further:

supplies an alternating current to the coil to cause an oscillatory displacement of the magnetic member.

18. The wearable electronic device of claim 17 wherein the hybrid haptic actuator controller supplies alternating current at a frequency of from about 1 Hertz to about 200 Hertz to the coil.

19. The wearable electronic device of claim 18 wherein the oscillatory displacement comprises a displacement of from about 10 micrometers (μιη) to about 400 μιη.

20. The wearable electronic device of claim 9 wherein each of the plurality of hybrid haptic actuators are positioned to form a two-dimensional matrix on at least a portion of the exterior surface, the two-dimensional matrix having a spacing between neighboring hybrid haptic actuators of at least 1 millimeter.

21. A hybrid haptic feedback method comprising:

driving a magnetic member embedded in an elastomeric membrane by:

applying a voltage to a piezoelectric haptic actuator proximate a void formed on a first surface of a dielectric substrate to cause a displacement of the magnetic member; and

applying an alternating current at a first frequency to an electromagnetic haptic actuator formed at least partially in the dielectric substrate proximate the piezoelectric haptic actuator to cause an oscillatory displacement of the displaced magnetic member at the first frequency.

22. The method of claim 21 wherein applying a voltage to a piezoelectric haptic actuator formed on a first surface of a dielectric substrate to cause a displacement of the magnetic member comprises:

applying at least one of: a steady-state bias voltage to a piezoelectric haptic actuator formed on a first surface of a dielectric substrate sufficient to offset the magnetic member through a displacement of from about 1 micrometer (μιη) to about 200μιη; a time-varying voltage sufficient to cause an oscillatory displacement of the magnetic member of from about 10 micrometers (μιη) to about 400μιη at a first frequency of from about 1 Hertz (Hz) to about 200 Hz; or a combination thereof.

23. The method of claim 21 wherein applying an alternating current at a first frequency to an electromagnetic haptic actuator formed at least partially in the dielectric substrate proximate the piezoelectric haptic actuator to cause an oscillatory displacement of the offset magnetic member at the first frequency comprises:

applying the alternating current at the first frequency to the electromagnetic haptic actuator to cause an oscillatory displacement of the offset magnetic member of from about 10 micrometers (μιη) to about 400μιη.

24. A hybrid haptic feedback system comprising:

a means for driving a magnetic member embedded in an elastomeric membrane that includes: a means for applying a voltage to a piezoelectric haptic actuator disposed proximate a void formed on a first surface of a dielectric substrate to cause a displacement of the magnetic member; and

a means for applying an alternating current at a first frequency to an electromagnetic haptic actuator formed at least partially in the dielectric substrate proximate the piezoelectric haptic actuator to cause an oscillatory displacement of the displaced magnetic member at the first frequency.