WO2017170932A1 - Curable composition, conformal coating agent and cured product - Google Patents

Curable composition, conformal coating agent and cured product Download PDF

Info

Publication number
WO2017170932A1
WO2017170932A1 PCT/JP2017/013398 JP2017013398W WO2017170932A1 WO 2017170932 A1 WO2017170932 A1 WO 2017170932A1 JP 2017013398 W JP2017013398 W JP 2017013398W WO 2017170932 A1 WO2017170932 A1 WO 2017170932A1
Authority
WO
WIPO (PCT)
Prior art keywords
acrylate
curable composition
polyisocyanate
meth
hydrogenated
Prior art date
Application number
PCT/JP2017/013398
Other languages
French (fr)
Japanese (ja)
Inventor
謙太郎 北澤
堤 洋介
孝彦 佃
伸行 松岡
Original Assignee
ハリマ化成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ハリマ化成株式会社 filed Critical ハリマ化成株式会社
Priority to CN201780021562.6A priority Critical patent/CN109071695B/en
Publication of WO2017170932A1 publication Critical patent/WO2017170932A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • C08G18/10Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04Polyurethanes

Definitions

  • the present invention relates to a curable composition, a conformal coating agent, and a cured product.
  • an electrical insulation process may be performed on the electronic circuit board after soldering.
  • Patent Document 1 discloses (meth) acrylate oligomer (A) having an average of 1.5 or more (meth) acryloyl groups in one molecule and a diene-based or hydrogenated diene-based skeleton. A compound having one (meth) acryloyl group whose homopolymer has a glass transition temperature of 50 ° C.
  • a photopolymerization initiator (D) having no isocyanate-reactive group which is a photocuring type combined with moisture curing for coating an electronic circuit containing components (A) to (D) in a specific ratio Compositions have been proposed.
  • Patent Document 2 discloses a photocurable drip-proof material used as a material for forming a coating film that covers a flux residue in a soldering portion, and includes (A) hydrogenated polybutadiene acrylate and (B) isocyanate in one molecule.
  • a photocurable drip-proof material characterized by containing each component of a polyisocyanate having 3 or more groups, (C) a reactive solvent, and (D) a photopolymerization initiator has been proposed.
  • Patent Document 3 includes (a) an organic polyisocyanate compound and (b) a polyester polyol having a number average molecular weight of 8000 or less and containing at least one of dimer acid, dimer diol and hydrogenated compounds as a copolymer component. Is reacted so that the NCO / OH ratio of (a) / (b) is 1.8 to 2.3, and 50 to 90% of the number of terminal NCO groups of the polyurethane prepolymer obtained is photopolymerizable ( A one-component photo-curing and moisture-curing combined coating agent modified with a (meth) acryloyl group has been proposed.
  • the moisture-curing combined photo-curable composition of Patent Document 1 has insufficient electrical insulation and transparency in both the ultraviolet irradiation part and the ultraviolet non-irradiation part of the cured product, and is not moisture curable. It has the problem of being sufficient.
  • the photocurable drip-proof material of Patent Document 2 also has a problem that electrical insulation is insufficient in both the ultraviolet irradiation part and the ultraviolet non-irradiation part of the cured product.
  • the one-component photocuring / moisture-curing combined coating agent of Patent Document 3 has insufficient electrical insulation in both the ultraviolet irradiation part and the ultraviolet non-irradiation part of the cured product, and the ultraviolet irradiation part and the ultraviolet ray of the cured product. Any of the non-irradiated portions has a problem that cracks occur due to expansion and contraction due to changes in temperature (low crack resistance).
  • the cured product has excellent electrical insulation and crack resistance in both irradiated and non-irradiated portions of active energy rays such as ultraviolet rays, and the cured product has high transparency and active energy.
  • a curable composition using both moisture curing and photocuring that is sufficiently cured (excellent in moisture curable property) even when irradiation with rays is insufficient, and a conformal coating agent using the curable composition and Provide a cured product.
  • the curable composition of the present invention has a hydrogenated butadiene-based skeleton and / or a hydrogenated isoprene-based skeleton, and contains a hydrogenated polybutadiene polyol and / or a hydrogenated polyisoprene polyol (a1- 1) a polymer containing an alcohol (a1) containing polyisocyanate (a2) as monomer components, the equivalent ratio of isocyanate groups in the polyisocyanate (a2) to hydroxyl groups in the alcohol (a1) ( (Isocyanate group / hydroxyl group) is a polymer of a monomer having a value greater than 1 and 8 or less, and the polyisocyanate (a2) has 2 to 6 monocyclic alicyclic structures or 3 Urethane resin (A) containing polyisocyanate having ⁇ 7 monocyclic aromatic rings; A monofunctional (meth) acrylate (B) having no ring structure and having an alkyl group having 10 or less carbon atoms; And
  • the curable composition of the present invention comprises a urethane resin (A) having a hydrogenated butadiene skeleton and / or a hydrogenated isoprene skeleton, A monofunctional (meth) acrylate (B) having no ring structure and having an alkyl group having 10 or less carbon atoms; A curable composition comprising a photopolymerization initiator (C),
  • the urethane resin (A) is a polymer containing, as monomer components, an alcohol (a1) containing a polyol (a1-1) containing a hydrogenated polybutadiene polyol and / or a hydrogenated polyisoprene polyol, and a polyisocyanate (a2).
  • the equivalent ratio of the isocyanate group in the polyisocyanate (a2) to the hydroxyl group in the alcohol (a1) containing the alcohol (a1) and the polyisocyanate (a2) (isocyanate group / hydroxyl group) is 1
  • a polyisocyanate having a ring is included.
  • the curable composition of the present invention has the above-described configuration, a cured product having excellent electrical insulation and excellent crack resistance even in a portion where light curing is insufficient is obtained. be able to.
  • the curable composition of the present invention includes a urethane resin (A) having a hydrogenated butadiene-based skeleton and / or a hydrogenated isoprene-based skeleton, and an alkyl group having no ring structure and having 10 or less carbon atoms.
  • the urethane resin (A) has a hydrogenated butadiene skeleton (hydrogenated butadiene skeleton) and / or a hydrogenated isoprene skeleton (hydrogenated isoprene skeleton).
  • the urethane resin (A) is a polymer containing, as monomer components, an alcohol (a1) containing a polyol (a1-1) containing a hydrogenated polybutadiene polyol and / or a hydrogenated polyisoprene polyol and a polyisocyanate (a2). . That is, the urethane resin (A) is a polymer of a monomer containing an alcohol (a1) containing a polyol (a1-1) containing a hydrogenated polybutadiene polyol and / or a hydrogenated polyisoprene polyol and a polyisocyanate (a2). .
  • hydrogenated polybutadiene polyol examples include hydrogenated products of polybutadiene diol.
  • Hydrogenated polybutadiene diols are, for example, trade names “GI-1000” and “GI-2000” and trade name “GI-3000” from Nippon Soda Co., Ltd., trade names “Krazol HLBH-P2000” and trade names from Clay Valley. It is commercially available under the name “Krasol HLBH-P3000”.
  • Hydrogenated polybutadiene polyols may be used alone or in combination of two or more.
  • the degree of hydrogenation of the hydrogenated polybutadiene polyol can be determined by the iodine value.
  • the iodine value of the hydrogenated polybutadiene polyol is preferably 50 or less, more preferably 40 or less, particularly preferably 30 or less, and most preferably 25 or less.
  • the iodine value is a value obtained by converting the amount of halogen to be bonded to the number of g of iodine when halogen is reacted with 100 g of a sample, and can be measured by a method defined in JIS K0070. it can.
  • hydrogenated polyisoprene polyol examples include hydrogenated products of polyisoprene diol.
  • Hydrogenated polyisoprene is commercially available, for example, from Idemitsu Kosan Co., Ltd. under the trade name “EPOL”.
  • Hydrogenated polyisoprene polyols may be used alone or in combination of two or more.
  • the hydrogenated polyisoprene polyol part or all of the unsaturated double bond contained in the polyisoprene polyol is hydrogenated.
  • the degree of hydrogenation of the hydrogenated polyisoprene polyol can be determined by the iodine value.
  • the iodine value of the hydrogenated polyisoprene polyol is preferably 40 or less, more preferably 30 or less, particularly preferably 20 or less, and most preferably 10 or less.
  • the cured product of the curable composition is excellent in electrical insulation, hydrogenated polybutadiene polyol is preferable. Since the cured product of the curable composition has excellent crack resistance, hydrogenated polyisoprene polyol is preferred.
  • the number average molecular weight of the polyol (a1-1) is preferably 500 to 10,000, more preferably 1000 to 5000, and still more preferably 2100 to 4000.
  • the number average molecular weight is 500 or more, the crack resistance and electrical insulation of the cured product of the curable composition are improved.
  • the number average molecular weight is 10,000 or less, the adhesiveness of the cured product immediately after curing of the curable composition is reduced, and the protective performance of the cured product resulting from adhesion of metal powder and dust in the atmosphere to the cured product. The decrease can be suppressed.
  • the number average molecular weight of the polyol (a1-1) refers to a value obtained by converting the molecular weight measured by gel permeation chromatography (GPC) into polystyrene. For example, it can be measured under the following measurement conditions.
  • the content of the polyol (a1-1) component in the urethane resin (A) is preferably 1 to 99% by mass, more preferably 20 to 95% by mass, and particularly preferably 30 to 85% by mass.
  • the urethane resin (A) may contain a hydroxyl group-containing (meth) acrylate (a1-2) as a monomer component.
  • a monofunctional (meth) acrylate and, if necessary, are added to the crosslinked structure formed by the urethane resin (A).
  • the cross-linked structure formed by the polyfunctional (meth) acrylate can be incorporated.
  • cured material of a curable composition improves.
  • (meth) acrylate means an acrylate or a methacrylate.
  • the hydroxyl group-containing (meth) acrylate (a1-2) is not particularly limited, and examples thereof include hydroxyl groups such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate.
  • alkyl (meth) acrylate Containing alkyl (meth) acrylate, pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, trimethylolpropane di (meth) acrylate, Ditrimethylolpropane di (meth) acrylate, ditrimethylolpropane tri (meth) acrylate, tris-2-hydroxyethyl isocyanurate di (meth) acrylate, glycerin di ( ) Acrylate, diglycerin di (meth) acrylate, diglycerin tri (meth) acrylate, and adducts thereof (including random oxides and block adducts) such as alkylene oxides (ethylene oxide, propylene oxide, etc.).
  • a functional (meth) acrylate etc. are mentioned, Pentaerythritol tri (meth) acrylate is preferable and Pentaerythritol triacrylate is more preferable.
  • the hydroxyl group-containing (meth) acrylate (a1-2) may be used alone or in combination of two or more.
  • the content of the hydroxyl group-containing (meth) acrylate (a1-2) component in the urethane resin (A) is preferably 0.1 to 5% by mass, more preferably 0.5 to 3% by mass, and 0.8 to 2%. Mass% is particularly preferred.
  • the content of the hydroxyl group-containing (meth) acrylate (a1-2) component is 0.1% by mass or more, the appearance of the cured product of the curable composition is improved.
  • the content of the hydroxyl group-containing (meth) acrylate (a1-2) component is 5% by mass or less, the crack resistance of the cured product of the curable composition is improved.
  • the content of the alcohol (a1) component in the urethane resin (A) is preferably 1 to 99% by mass, more preferably 20 to 95% by mass, and particularly preferably 30 to 85% by mass.
  • the alcohol (a1) component includes a polyol (a1-1) and a hydroxyl group-containing (meth) acrylate. (A1-2) is included.
  • the alcohol (a1) component may further contain other alcohol components in addition to the polyol (a1-1) and the hydroxyl group-containing (meth) acrylate (a1-2) as long as the object of the present invention is not impaired.
  • other alcohol components include polycarbonate polyol, polyester polyol, polylactone polyol, acrylic polyol, polyether polyol, and polyacetal polyol.
  • low molecular weight polyols such as ethylene glycol, diethylene glycol, 1,4-butanediol, 1,6-hexanediol, glycerin, trimethylolpropane, and pentaerythritol can be used.
  • the total content of the polyol (a1-1) and the hydroxyl group-containing (meth) acrylate (a1-2) is preferably 50% by mass or more, more preferably 60% by mass or more, and 70 More preferably, it is more preferably 80% by weight or more, particularly preferably 90% by weight or more, and most preferably 100% by weight.
  • the polyisocyanate (a2) has a plurality of isocyanate groups (—NCO) in one molecule, and further contains 2 to 6 monocyclic alicyclic structures or 3 to 7 It contains a polyisocyanate having a single aromatic ring.
  • Polyisocyanate can form an isocyanurate or biuret body with three molecules.
  • a trimer adduct is formed by the reaction of trimethylolpropane with three molecules of polyisocyanate.
  • Monocyclic means that the structure does not include a polycyclic compound structure.
  • a polycyclic compound is a compound in which two or more rings share one or more atoms, and specific examples include fused ring compounds, bridged ring compounds, and spiro ring compounds.
  • the condensed ring compound refers to a ring compound having orthocondensation such as naphthalene and phenanthrene, and orthopericondensation such as pyrene and perylene.
  • a bridged ring compound is a ring structure in which carbons are bonded in a cyclic manner, such as bicyclo [4.3.1] decane, tricyclo [2.2.1.0 2,6 ] heptane, etc.
  • one or more heteroatoms may be contained), and two or more rings having no aromaticity share one or more sides of each ring and two or more atoms.
  • Spiro ring compounds are two ring structures in which one atom is bonded to a ring of carbon (such as spiro [3.4] octane, spiro [4.5] deca-1,6-diene). It refers to a ring compound having a point bond (spiro bond) that is shared by a structure in which one or more heteroatoms may be contained in a structure in which carbon is bonded in a cyclic manner.
  • the alicyclic structure is a structure in which carbon is bonded in a cyclic manner and has no aromaticity.
  • the polyisocyanate used in the present invention may contain an isocyanurate ring in the structure, but the isocyanurate ring is not included in the alicyclic structure defined herein.
  • One or two heteroatoms may be contained in the structure in which carbons are bonded in a cyclic manner.
  • Examples of alicyclic structures include cycloalkane structures such as cyclopropane structure, cyclobutane structure, cyclopentane structure and cyclohexane structure (cycloparaffin structure), cyclobutene structure, cyclopentene structure, cyclohexene structure and cyclopropene structure.
  • a cycloalkane structure having 5 or more carbon atoms is preferable, and a cycloalkane structure having 5 to 7 carbon atoms is more preferable.
  • the number of alicyclic structures in one molecule in the polyisocyanate (a2) is 2 to 6 and preferably 2 because the electrical insulation of the cured product of the curable composition is improved.
  • polyisocyanate having 2 to 6 monocyclic alicyclic structures examples include 4,4′-dicyclohexylmethane diisocyanate (hydrogenated MDI); Biuret and isocyanurate forms of 4,4′-dicyclohexylmethane diisocyanate (hydrogenated MDI); Trimer adduct of trimethylolpropane (TMP) and hydrogenated MDI; Biuret and isocyanurate forms of polyisocyanates such as isophorone diisocyanate, methylcyclohexylene diisocyanate (hydrogenated TDI), 1,3-bis (isocyanatomethyl) cyclohexane (hydrogenated m-XDI); 3 moles of any of polyisocyanates such as isophorone diisocyanate, methylcyclohexylene diisocyanate (hydrogenated TDI), and 1,3-bis (isocyanatomethyl) cyclohexane (hydrogenated MD
  • polyisocyanate having two monocyclic alicyclic structures examples include 4,4′-dicyclohexylmethane diisocyanate (hydrogenated MDI), trimethylolpropane (TMP) and 2 moles of isophorone diisocyanate, and hexamethylene diisocyanate (HDI). ) 1 mole of adduct, and 4,4′-dicyclohexylmethane diisocyanate (hydrogenated MDI) is preferred.
  • An aromatic ring means a ring having aromaticity, that is, a ring having a (4n + 2) ⁇ electron system (n is a natural number), and includes those containing heteroatoms.
  • the aromatic ring include 5-membered rings such as a furan ring, a thiophene ring, a pyrrole ring, an imidazole ring, a thiazole ring, and an oxadiazole ring, and a 6-membered ring such as a benzene ring, a pyridine ring, and a pyrazine ring.
  • a ring is preferable, and a benzene ring is more preferable.
  • the number of aromatic rings in one molecule in the polyisocyanate (a2) is preferably 3 to 7 and more preferably 3 because the electrical insulation of the cured product of the curable composition is improved.
  • polyisocyanate having 3 to 7 monocyclic aromatic rings examples include 4,4 ′, 4 ′′ -triphenylmethane triisocyanate; 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, m-xylene diisocyanate, m-isocyanatophenylsulfonyl isocyanate, p-isocyanatophenylsulfonyl isocyanate 2,4′-diphenylmethane diisocyanate, 4,4′-diisocyanatobiphenyl, 3,3′-dimethyl-4,4′-diisocyanatobiphenyl, 3,3′-dimethyl-4,4′-diisocyanate Biuret and isocyanurate forms of polyisocyanates such as natodiphenylmethane; 1,3-phenylene diiso
  • polyisocyanate having three monocyclic aromatic rings 4,4 ′, 4 ′′ -triphenylmethane triisocyanate; 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, m-xylene diisocyanate, m-isocyanatophenylsulfonyl isocyanate, p-isocyanatophenylsulfonyl isocyanate Biuret and isocyanurate forms of polyisocyanates such as 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, m-xylene diisocyanate, m-isocyanatophenylsulfonyl isocyanate, p-isocyanatophenylsulfon
  • the polyisocyanate used in the present invention is a polyisocyanate having one monocyclic or polycyclic alicyclic structure, in addition to the above polyisocyanate, within a range not impairing the object of the present invention. And / or a polyisocyanate having a polycyclic aromatic ring, an aliphatic polyisocyanate having no ring structure, and the like.
  • polyisocyanate having one monocyclic or polycyclic alicyclic structure examples include isophorone diisocyanate, methylcyclohexylene diisocyanate (hydrogenated TDI), 2,5-norbornane diisocyanate, and 2,6-norbornane diisocyanate. .
  • polyisocyanate having 2 or less monocyclic and / or polycyclic aromatic rings examples include 4,4′-diphenylmethane diisocyanate (MDI), 2,4′-diphenylmethane diisocyanate, 4,4′-diisocyanatobiphenyl, 3,3′-dimethyl-4,4′-diisocyanatobiphenyl, 3,3′-dimethyl-4,4′-diisocyanatodiphenylmethane, 1,5-naphthylene diisocyanate, 1,3-phenylene diisocyanate, 1, Examples include 4-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, m-xylene diisocyanate, m-isocyanatophenylsulfonyl isocyanate, p-isocyanatophenylsulfonyl isocyanate.
  • MDI 4,4′-dip
  • Examples of the aliphatic polyisocyanate having no ring structure include ethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, dodecamethylene diisocyanate, 1,6,11-undecane triisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 2, Examples include 6-diisocyanatomethyl caproate, bis (2-isocyanatoethyl) fumarate, bis (2-isocyanatoethyl) carbonate, 2-isocyanatoethyl-2,6-diisocyanatohexanoate.
  • polyisocyanate (a2) may be used independently or 2 or more types may be used together.
  • any of polyisocyanates having an alicyclic structure, polyisocyanates having an aromatic ring, a combination of a polyisocyanate having an alicyclic structure and a polyisocyanate having an aromatic ring may be used.
  • a combination of a polyisocyanate having an alicyclic structure and a polyisocyanate having an aromatic ring is preferable, and 4,4′-dicyclohexylmethane diisocyanate (hydrogenated MDI), a trimer adduct of trimethylolpropane and tolylene diisocyanate It is more preferable to use in combination.
  • the polyisocyanate having an alicyclic structure and the polyisocyanate having an aromatic ring When used in combination, the polyisocyanate having an alicyclic structure and the polyisocyanate having an aromatic ring have an alicyclic structure with respect to 100 parts by mass in total.
  • the polyisocyanate is preferably 1 to 40 parts by mass, and more preferably 1.5 to 30 parts by mass.
  • the cured product of the curable composition has excellent electrical properties. It has excellent crack resistance even in portions that have insulating properties and insufficient photocuring.
  • the total content of the polyisocyanate having 2 to 6 monocyclic alicyclic structures or 3 to 7 monocyclic aromatic rings in one molecule is 50% by mass or more. 60 mass% or more is more preferable, 70 mass% or more is more preferable, 80 mass% or more is further more preferable, 90 mass% or more is particularly preferable, and 100 mass% is most preferable.
  • the cured product has excellent electrical insulation and excellent crack resistance even in a portion where photocuring is insufficient.
  • Urethane resin (A) is a polymer of a monomer containing alcohol (a1) and polyisocyanate (a2) containing polyol (a1-1) as essential components.
  • the equivalent ratio of the isocyanate group in the polyisocyanate (a2) to the hydroxyl group in the alcohol (a1) (isocyanate group / hydroxyl group) is greater than 1 and 8 or less. Yes, greater than 1 and preferably 7 or less, more preferably greater than 1 and 6 or less.
  • the equivalent ratio (isocyanate group / hydroxyl group) is 8 or less, since the urethane resin (A) has a sufficient molecular weight, the cured product of the curable composition has excellent electrical insulation and light. Excellent crack resistance even in areas where curing is insufficient.
  • the equivalent ratio (isocyanate group / hydroxyl group) needs to be larger than 1 because the urethane resin (A) has moisture curability, and the storage stability of the curable composition is improved. 2.5 or more is more preferable.
  • the equivalent ratio (isocyanate group / hydroxyl group) of the isocyanate group in the polyisocyanate (a2) to the hydroxyl group in the alcohol (a1) is the number of hydroxyl groups in the alcohol (a1) by the number of isocyanate groups in the polyisocyanate (a2). Divide and seek.
  • the number of hydroxyl groups in the alcohol (a1) is calculated based on the following formula.
  • the hydroxyl value was measured according to JIS K 1557-1: 2007 (ISO 14900: 2001) “Plastics—Polyurethane raw material polyol test method—Part 1: Determination of hydroxyl value”, method B. This is the value obtained.
  • Number of hydroxyl groups in alcohol (a1) content of alcohol (a1) in monomer as raw material ⁇ hydroxyl value / 56100
  • the number of isocyanate groups in the polyisocyanate (a2) is calculated based on the following formula.
  • the weight average molecular weight of the urethane resin (A) is preferably from 5,000 to 100,000, more preferably from 5,000 to 50,000, particularly preferably from 10,000 to 25,000.
  • the weight average molecular weight of the urethane resin (A) is 5000 or more, the electrical insulation and crack resistance of the cured product of the curable composition are improved.
  • the weight average molecular weight of the urethane resin (A) is 100,000 or less, the curable composition has a low viscosity and the handleability is improved.
  • the weight average molecular weight of the urethane resin (A) refers to a value obtained by converting the molecular weight measured by gel permeation chromatography (GPC) into polystyrene. For example, it can be measured under the following measurement conditions.
  • the content of the polyisocyanate (a2) component in the urethane resin (A) is preferably 1 to 99% by mass, more preferably 5 to 80% by mass, and particularly preferably 15 to 70% by mass.
  • the urethane resin (A) may be produced using a known polymerization method. Specifically, an alcohol (a1) and a polyisocyanate (a2) containing a polyol (a1-1) and, if necessary, a hydroxyl group-containing (meth) acrylate (a1-2) are converted into a polyisocyanate for the hydroxyl group in the alcohol (a1).
  • the urethane resin (A) can be produced by polymerizing a monomer as a raw material to be contained so that the equivalent ratio of isocyanate groups (isocyanate group / hydroxyl group) in (a2) is in the above-described range by a known polymerization method. it can.
  • the polymerization of the urethane resin (A) may be performed in a monofunctional alkyl (meth) acrylate described later.
  • the alcohol (a1) from which moisture has been removed is batched or divided into the reaction vessel.
  • the urethane resin (A) can be produced by reacting with the polyisocyanate (a2) until the hydroxyl group of the alcohol (a1) is substantially eliminated.
  • the polymerization of the urethane resin (A) is preferably performed at 10 to 120 ° C. for 0.5 to 10 hours.
  • the polymerization reaction of the urethane resin (A) may be performed in the presence of a urethanization catalyst as necessary.
  • a urethanization catalyst include organometallic compounds such as dibutyltin oxide, tin 2-ethylcaproate, tin octylate, and dibutyltin dilaurate.
  • the content of the urethane resin (A) in the curable composition is when the total amount of the urethane resin (A), the monofunctional alkyl (meth) acrylate (B) and the photopolymerization initiator (C) is 100% by mass. 15 to 60% by mass, preferably 30 to 60% by mass, more preferably 35 to 50% by mass, and particularly preferably 40 to 48% by mass.
  • the content of the urethane resin (A) is 15% by mass or more, the cured product of the curable composition has excellent electrical insulation and excellent crack resistance even in a portion where photocuring is insufficient. Have.
  • the content of the urethane resin (A) is 60% by mass or less, the curable composition has a low viscosity and the handleability is improved.
  • the curable composition contains a monofunctional (meth) acrylate (B) that does not contain a ring structure and has an alkyl group having 10 or less carbon atoms.
  • Monofunctional means having only one radical polymerizable unsaturated bond in one molecule.
  • the alkyl group is a remaining atomic group obtained by removing one hydrogen atom from an aliphatic saturated hydrocarbon, represented by —C n H 2n + 1 , and does not include heteroatoms such as nitrogen and sulfur.
  • the ring structure includes all cyclic structures formed by carbon and other atoms (nitrogen, sulfur, etc.).
  • the cured product of the curable composition Since it contains a monofunctional (meth) acrylate (B) that does not contain a ring structure and has an alkyl group having 10 or less carbon atoms, the cured product of the curable composition has excellent electrical insulation. In addition, it has excellent crack resistance even in a portion where photocuring is insufficient, and the curable composition has excellent moisture curability.
  • B monofunctional (meth) acrylate
  • Monofunctional (meth) acrylate (B) preferably does not contain a functional group that reacts with an isocyanate group.
  • the functional group that reacts with the isocyanate group include a hydroxyl group, an amino group, a thiol group, and a carboxyl group.
  • the alkyl group of the monofunctional (meth) acrylate (B) has 10 or less carbon atoms, preferably 2 to 10, more preferably 4 to 9, and particularly preferably 6 to 9.
  • the carbon number of the alkyl group is 10 or less
  • the cured product of the curable composition has excellent electrical insulation and excellent crack resistance even in a portion where photocuring is insufficient,
  • the moisture curability of the curable composition is improved.
  • the odor from a curable composition can be suppressed as carbon number of an alkyl group is 2 or more.
  • Examples of the monofunctional (meth) acrylate (B) include alkyl (meta) such as n-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-butyl (meth) acrylate, and n-octyl (meth) acrylate. ) Alkyl (meth) acrylates such as acrylate, alkyl (meth) acrylate is preferred, and alkyl acrylate is more preferred. Further, n-octyl (meth) acrylate is preferable, and n-octyl acrylate is more preferable. In addition, monofunctional (meth) acrylate may be used independently or 2 or more types may be used together.
  • alkyl (meta) such as n-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-butyl (meth) acrylate, and n
  • the content of the monofunctional (meth) acrylate (B) in the curable composition is 100 masses of the total amount of the urethane resin (A), the monofunctional alkyl (meth) acrylate (B) and the photopolymerization initiator (C).
  • the content of the monofunctional (meth) acrylate (B) is 30% by mass or more, the photocurability of the curable composition is improved and the cured product of the curable composition has excellent crack resistance.
  • the content of the monofunctional (meth) acrylate (B) is 70% by mass or less, a cured product having excellent electrical insulation and crack resistance can be obtained even in a portion where photocuring is insufficient.
  • the curable composition may contain a polyfunctional (meth) acrylate (D).
  • polyfunctional (meth) acrylate (D) By containing polyfunctional (meth) acrylate (D), the electrical insulation of the hardened
  • Polyfunctional means having two or more radically polymerizable unsaturated bonds in one molecule.
  • the polyfunctional (meth) acrylate (D) preferably does not contain a functional group that reacts with an isocyanate group.
  • the functional group that reacts with the isocyanate group include a hydroxyl group, an amino group, a thiol group, and a carboxyl group.
  • the polyfunctional (meth) acrylate (D) is not particularly limited.
  • Alkylene glycol di (meth) acrylates such as (meth) acrylate, ethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, neopentyl glycol di (meth) diacrylate, triethylene glycol di (meth) acrylate, tri Polyoxyalkylene glycol di (meth) acrylate such as propylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, bisphenol A or hydrogenated
  • Examples include diacrylates of adducts of alkylene oxide of Sphenol A, trimethylolpropane tri (meth) acrylate
  • the content of the polyfunctional (meth) acrylate (D) in the curable composition is preferably 15% by mass or less based on the total amount of the monofunctional (meth) acrylate (B) and the polyfunctional (meth) acrylate (D). 10 mass% or less is more preferable, and 6.5 mass% or less is especially preferable.
  • the content of the polyfunctional (meth) acrylate is 15% by mass or less, the cured product of the curable composition has excellent electrical insulation and excellent crack resistance even in a portion where photocuring is insufficient. Furthermore, the moisture curability of the curable composition is improved.
  • the curable composition contains a photopolymerization initiator (C).
  • the photopolymerization initiator is particularly limited as long as it can be decomposed by irradiating active energy rays such as ultraviolet rays and electron beams to generate radicals and initiate the photocuring reaction of the curable composition. Not.
  • the photopolymerization initiator (C) is not particularly limited, and examples thereof include benzoin, benzoin ethyl ether, benzophenone, acylphosphine oxide; and alkylphenones such as 2,2-dimethoxy-1,2-diphenylethane-1-one.
  • Photopolymerization initiators (C) are, for example, trade names “Irgacure 184”, “Irgacure 907”, “Irgacure 819”, “Irgacure TPO”, “Irgacure 651”, “Irgacure 369”, “Irgacure” manufactured by BASF Japan. 379 ”,“ Irgacure 379EG ”,“ Irgacure MBF ”,“ Irgacure 784 ”,“ Irgacure OXE01 ”and“ Irgacure OXE02 ”. In addition, a photoinitiator (C) may be used independently or 2 or more types may be used together.
  • the content of the photopolymerization initiator (C) in the curable composition is 100% by mass of the total amount of the urethane resin (A), the monofunctional alkyl (meth) acrylate (B) and the photopolymerization initiator (C). 1 to 15% by mass is preferable, 2 to 8% by mass is more preferable, and 3 to 7% by mass is particularly preferable.
  • the photocurability of a curable composition improves that content of a photoinitiator (C) is 1 mass% or more. When the content of the photopolymerization initiator (C) is 10% by mass or less, the cured product of the curable composition has excellent electrical insulation and crack resistance.
  • the curable composition comprises a urethane resin (A), a monofunctional (meth) acrylate (B) and a photopolymerization initiator (C) as essential components, but if necessary, a moisture curing catalyst (F), polymerization
  • A urethane resin
  • B monofunctional (meth) acrylate
  • C photopolymerization initiator
  • F moisture curing catalyst
  • An inhibitor, an antioxidant, an antifoaming agent, a leveling agent, an additive such as a silane coupling agent and a metal deactivator, and a solvent may be contained.
  • the moisture curing catalyst (F) is not particularly limited, and examples thereof include organometallic compounds and tertiary amine compounds.
  • the organic metal compound include organic tin compounds such as dibutyltin dilaurate, organic iron compounds, organic zinc compounds, organic titanium compounds, organic aluminum compounds, organic zirconium compounds, and organic bismuth compounds.
  • a moisture hardening catalyst (F) may be used independently, or 2 or more types may be used together.
  • the blending ratio of the moisture curing catalyst (F) is not particularly limited, and may be appropriately adjusted according to the purpose and application.
  • the moisture effect catalyst (F) may be used for the synthesis of the urethane resin (A) as a urethanization catalyst.
  • organic tin compound examples include tin carboxylates such as dibutyltin dilaurate, dibutyltin maleate, dibutyltin diacetate, dibutyltin diacetoacetonate, tin octylate, tin naphthenate, tin laurate and tin felzatic acid. And a reaction product of dibutyltin oxide and phthalate.
  • organic iron compound examples include tris (acetylacetonato) iron, tris (2,2,6,6-tetramethyl-3,5-heptanedionate) iron, tris (tetrafluoroacetylacetonato) iron, chloride
  • examples thereof include ferric iron, tris (2-ethylhexanoic acid) iron, iron naphthenate, triethoxy iron, and triisopropoxy iron.
  • organic zinc compound examples include bis (acetylacetonato) zinc, bis (2,2,6,6-tetramethyl-3,5-heptanedionate) zinc, bis (tetrafluoroacetylacetonato) zinc, bis (2-ethylhexanoic acid) zinc, zinc naphthenate, diethoxy zinc, diisopropoxy zinc and the like can be mentioned.
  • organic titanium compound examples include titanic acid esters such as tetrabutyl titanate and tetrapropyl titanate, and titanium chelate compounds such as titanium tetraacetylacetonate.
  • organoaluminum compound examples include aluminum trisacetylacetonate, aluminum trisethylacetoacetate, diisopropoxyaluminum ethylacetoacetate, and the like.
  • organic zirconium compound examples include zirconium chelate compounds such as zirconium tetraacetylacetonate.
  • organic bismuth compound examples include bismuth-tris (neodecanoate), bismuth-tris (2-ethylhexoate), and bismuth octylate.
  • tertiary amine compounds include trialkylamines such as triethylamine; tetraalkylalkylenediamines such as tetramethylethylenediamine and tetramethylhexanediamine; pentaalkyldialkylenetriamines such as pentamethyldiethylenetriamine; trimethylaminoethylpiperazine and dimethylpiperazine Piperazines; N-alkylimidazoles such as 1,2-dimethylimidazole; bis (dimethylaminoethyl) ether; triethylenediamine [1,4-diazabicyclo [2,2,2] octane (DABCO)]; N-methylmorpholine; Examples include 1,8-diazabicyclo [5,4,0] undecene-7 (DBU) and 2,4,6-tris (dimethylaminomethyl) phenol.
  • DBU 1,8-diazabicyclo [5,4,0] undecene-7
  • DBU
  • polymerization inhibitor examples include hydroquinone, hydroquinone monomethyl ether, benzoquinone, pt-butylcatechol and 2,6-di-t-butyl-4-methylphenol.
  • a polymerization inhibitor may be used independently or 2 or more types may be used together.
  • the blending ratio of the polymerization inhibitor is not particularly limited, and may be appropriately adjusted according to the purpose and application.
  • the antioxidant examples include a phenol-based antioxidant, a phosphorus-based antioxidant, and a sulfur-based antioxidant.
  • an antioxidant may be used independently or 2 or more types may be used together.
  • the mixing ratio of the antioxidant is not particularly limited, and may be appropriately adjusted according to the purpose and application.
  • the phenolic antioxidants are, for example, trade names “Adeka Stub AO-20”, “Adeka Stub AO-60” and “Adeka Stub AO-80” from Adeka, and trade names “Irganox 1010” and “Irganox 1076” from BASF Japan. , "Irganox 1135" and "Irganox 1520L”.
  • Phosphorous antioxidants are commercially available, for example, from Adeka under the trade names “Adekastab PEP-4C” and “Adekastab 2112”, and from BASF Japan under the trade name “Irgafos 168”.
  • Sulfur-based antioxidants are commercially available, for example, from Adeka under the trade names “Adekastab AO-412S” and “Adekastab AO-503”, and from BASF Japan under the trade names “Irganox PS 800 FL” and “Irganox PS 802 FL” Has been.
  • Antifoaming agents are, for example, trade names “BYK-054”, “BYK-057”, “BYK-065”, “BYK-066N”, “BYK-067A” and “BYK-1794” from BYK Japan Trade names “TEGO Airex 904W”, “TEGO Airex 910”, “TEGO Airex 920”, “TEGO Airex 931”, “TEGO Airex 945”, “TEGO Foamex 833” and “TEGO Foamex 833T” and “TEGO Fairex 833T” are available from Evonik. ing.
  • an antifoamer may be used independently or 2 or more types may be used together.
  • the mixing ratio of the antifoaming agent is not particularly limited, and may be appropriately adjusted according to the purpose and application.
  • leveling agents examples include silicone leveling agents, acrylic leveling agents, and fluorine leveling agents.
  • a leveling agent may be used independently or 2 or more types may be used together.
  • the mixing ratio of the leveling agent is not particularly limited, and may be appropriately adjusted according to the purpose and application.
  • silicone leveling agent examples include trade names “BYK-300”, “BYK-302”, “BYK-307”, “BYK-320”, “BYK-322”, “BYK-325” from BYK Japan.
  • Acrylic leveling agents are, for example, trade names “BYK-350”, “BYK-354”, “BYK-356” and “BYK-3441” from Big Chemie Japan, and trade names “TEGO Flow 370” and Evonik. It is commercially available from “TEGO Flow ZFS 460”.
  • Fluorine-based leveling agents include, for example, trade names “Novec FC-4430” and “Novec FC-4432” from Sumitomo 3M, and trade names “Fategent 251”, “Factent FTX-218” and “Futter” from Neos. It is commercially available at “Gent 710FL” and “Fargent 601AD”.
  • Silane coupling agents are commercially available, for example, from Shin-Etsu Silicone under the trade names “KBM-1003”, “KBE-1003”, “KBM-503”, “KBM-5103” and “KBE-9007”.
  • a silane coupling agent may be used independently or 2 or more types may be used together.
  • the blending ratio of the silane coupling agent is not particularly limited, and may be appropriately adjusted according to the purpose and application.
  • Metal deactivators are, for example, trade names “Adekastab CDA-1”, “Adekastab CDA-1M”, “Adekastab CDA-6” and “Adekastab CDA-10” from Adeka, and “Irganox MD1024” from BASF Japan. These are commercially available from Johoku Chemical Industry Co., Ltd. under the trade names “BT-120”, “BT-LX”, and “TT-LX”.
  • the solvent examples include hydrocarbons such as pentane, hexane, heptane, and cyclohexane, ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone, and esters such as ethyl acetate and butyl acetate.
  • hydrocarbons such as pentane, hexane, heptane, and cyclohexane
  • ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone
  • esters such as ethyl acetate and butyl acetate.
  • a solvent may be used independently or 2 or more types may be used together.
  • the curable composition can be produced by stirring and mixing the urethane resin (A), the monofunctional (meth) acrylate (B), the photopolymerization initiator (C), and other additives using a general-purpose stirrer. it can.
  • the curable composition can be used, for example, as a conformal coating agent, and specifically, electrically insulates the electronic circuit board after soldering in order to protect the electronic circuit board from water, moisture and dust. Used for processing.
  • the curable composition is applied onto the electronic component of the electronic circuit board formed by soldering the electronic component on the substrate, and the electronic component is covered with the curable composition.
  • the curable composition By irradiating the curable composition with active energy rays (for example, ultraviolet rays, electron beams, etc.), a monofunctional (meth) acrylate, and a polyfunctional (meth) acrylate and a urethane resin (optionally contained)
  • active energy rays for example, ultraviolet rays, electron beams, etc.
  • the hydroxyl group-containing (meth) acrylate component A) undergoes a radical polymerization reaction and is photocured.
  • the curable composition produces a cured product by moisture curing by causing the isocyanate group of the urethane resin (A) to react with moisture in the air. To do.
  • the cured product thus produced has excellent electrical insulation, and has sufficient crack resistance even in a portion where the active energy ray is not irradiated or a portion where irradiation is insufficient, Furthermore, the cured product has excellent appearance (transparency). Therefore, the cured product of the curable composition stably protects the electronic component from contaminants such as water, dust and metal powder over a long period of time while maintaining the electrical insulation state. And since the cured product of the curable composition is excellent in transparency, the state of the electronic component can be easily seen through the cured product even after coating and protection, and maintenance of the electronic circuit board can be performed. It can be done easily.
  • the compounds used for preparing the curable composition are shown below.
  • the type of solvent and the solid content of the compound are shown.
  • [Urethane acrylate] -Urethane acrylate (trade name “TEAI-1000” manufactured by Nippon Soda Co., Ltd.), a hydrogenated butadiene skeleton in the main chain, a urethane bond, and an acryloyl group at both ends, number average molecular weight: 2000
  • TMP-TDI Trimethylpropane and tolylene diisocyanate trimer adduct
  • TMP-TDI Trimethylpropane and tolylene diisocyanate trimer adduct
  • 3 aromatic rings-Trimethylolpropane and tolylene diisocyanate trimer adduct (trade name “Coronate L” manufactured by Tosoh Corporation)
  • reaction product of pentaerythritol triacrylate trade name “Aronix M-306” manufactured by Toagosei Co., Ltd.
  • DBTDL Dibutyltin dilaurate
  • the monofunctional acrylate (B) and the polyfunctional acrylate (D) are used as a reaction solvent, and a part of the monofunctional acrylate (B) and the polyfunctional acrylate (D) blended in the curable composition is a urethane resin ( It was added to the reaction system during the preparation of A).
  • the urethane resin (A) was obtained by adding a predetermined amount of dibutyltin dilaurate as a urethanization catalyst shown in Tables 1 to 4 and maintaining for 3 hours.
  • the weight average molecular weights of the obtained urethane resin (A) are shown in Tables 1 to 4.
  • Examples 1 to 10 Dibutyltin dilaurate as the above-mentioned urethane resin (A), monofunctional acrylate (B), photopolymerization initiator (C), polyfunctional acrylate (D), and moisture curing catalyst (F) as shown in Tables 5 to 8 in predetermined planets.
  • the curable composition was obtained by supplying to a stirrer and stirring and mixing uniformly.
  • the urethane resin (A) used was listed in the column of the type of urethane resin (A) in Tables 5-8.
  • the urethane resin (A) produced above contains a monofunctional acrylate (B) or a polyfunctional acrylate (D), but the values in the columns of the urethane-based resins (A) shown in Tables 5 to 8 are as follows. , The amount excluding the monofunctional acrylate (B) and the polyfunctional acrylate (D). The values in the columns of the monofunctional acrylate (B) and the polyfunctional acrylate (D) shown in Tables 5 to 8 are the monofunctional acrylate (B) and the polyfunctional acrylate (D) added when the urethane resin (A) was produced, respectively.
  • the resulting curable composition was measured for electrical insulation, crack resistance, appearance and moisture curability in the following manner, and the results are shown in Tables 5-8.
  • a curable composition was applied at a film thickness of 50 ⁇ m on a JIS 2 type comb substrate to prepare two test pieces.
  • the curable composition of one test piece is irradiated with ultraviolet rays having an emission wavelength of 365 nm to photocure the curable composition, and then the test piece is left to stand in an atmosphere of 23 ° C. and 50% relative humidity for 12 hours to be cured.
  • the cured composition was moisture cured to produce a cured product.
  • the other test piece was left to stand in an atmosphere of 23 ° C. and 50% relative humidity for 12 hours without irradiating ultraviolet rays, and the curable composition was moisture-cured to produce a cured product.
  • the applied voltage was set to 32 V, and the resistance value of the cured product after 96 hours was measured.
  • the resistance value of the cured product of the test piece that was irradiated with ultraviolet rays was written in the column “UV part”, and the resistance value of the cured product of the test piece that was not irradiated with ultraviolet rays was written in the column “dark part”.
  • the curable composition of one test piece is irradiated with ultraviolet rays having an emission wavelength of 365 nm to photocure the curable composition, and then the test piece is left to stand in an atmosphere of 23 ° C. and 50% relative humidity for 12 hours to be cured.
  • the cured composition was moisture cured to produce a cured product.
  • the other test piece was left to stand in an atmosphere of 23 ° C. and 50% relative humidity for 12 hours without irradiating ultraviolet rays, and the curable composition was moisture-cured to produce a cured product.
  • test piece After holding the test piece at 125 ° C. for 30 minutes, the test piece was held at ⁇ 40 ° C. for 30 minutes for a cycle of one cycle. The number of cycles performed was counted. Evaluation was made according to the following criteria.
  • the cycle number of the test piece irradiated with ultraviolet rays is described in the “UV part” column, and the cycle number of the test piece not irradiated with ultraviolet rays is described in the “dark part” column.
  • a ++ The number of cycles was 2000 or more.
  • a + The number of cycles was 1500 or more and less than 2000.
  • the curable composition was applied to a glass plate with a film thickness of 50 ⁇ m.
  • the curable composition was photocured by irradiating the curable composition with ultraviolet rays having an emission wavelength of 365 nm.
  • the HAZE value of the cured product of the curable composition was measured using a haze meter (trade name “NDH 5000” manufactured by Nippon Denshoku Industries Co., Ltd.).
  • the glass plate was subtracted as the background. It shows that transparency of cured
  • a + The HAZE value was 0 or more and less than 0.25.
  • the curable composition was applied to a glass epoxy substrate with a film thickness of 50 ⁇ m, and was allowed to stand in a light-shielding environment at 23 ° C. and a relative humidity of 50% with the curable composition application surface being horizontal.
  • the glass epoxy substrate is held so that the coating surface of the curable composition is vertical at 6 hours, 12 hours, and 24 hours after the application is completed, and the curable composition does not sag.
  • the following evaluation was made based on the time required for the curable composition not to sag. A: It was less than 6 hours.
  • B 6 hours or more and less than 12 hours.
  • C 12 hours or more and less than 24 hours.
  • D The curable composition sagged at the time point of 24 hours.
  • the curable composition of the present invention can be suitably used for electrical insulation treatment for protecting a soldered electronic circuit board from water, moisture, dust and the like.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Paints Or Removers (AREA)

Abstract

The present invention provides a curable composition which enables the achievement of a cured product that has excellent cracking resistance even in an insufficiently photocured portion, while exhibiting excellent electrical insulation properties. A curable composition according to the present invention contains a urethane resin (A) having a hydrogenated butadiene skeleton and/or a hydrogenated isoprene skeleton, a monofunctional (meth)acrylate (B) containing no ring structure and having an alkyl group with 10 or less carbon atoms, and a photopolymerization initiator (C). The urethane resin (A) is a polymer containing a polyol (a1-1) component and a polyisocyanate (a2) component, which is a polymer of a monomer having an equivalent ratio (isocyanate groups/hydroxyl groups) within a predetermined range; and the polyisocyanate (a2) component contains a polyisocyanate that has an alicyclic structure of non-fused 2 to 6 monocyclic rings or an aromatic ring of non-fused 3 to 7 monocyclic rings.

Description

硬化性組成物、コンフォーマルコーティング剤及び硬化物Curable composition, conformal coating agent and cured product
 本発明は、硬化性組成物、コンフォーマルコーティング剤及び硬化物に関する。 The present invention relates to a curable composition, a conformal coating agent, and a cured product.
 従来から電子材料分野において、電子回路基板を水、湿気及び埃などから保護するために、はんだ付け後の電子回路基板に対し電気絶縁処理が施される場合がある。 Conventionally, in the field of electronic materials, in order to protect an electronic circuit board from water, moisture, dust, and the like, an electrical insulation process may be performed on the electronic circuit board after soldering.
 絶縁処理を施すために用いられる硬化性組成物が種々提案されている。例えば、特許文献1には、1分子中に平均1.5個以上の(メタ)アクリロイル基を有し、且つジエン系又は水素添加されたジエン系の骨格を有する(メタ)アクリレートオリゴマー(A)、ホモポリマーのガラス転移温度が50℃以下である(メタ)アクリロイル基を1個有する化合物であって、イソシアネート反応性基を有しない化合物(B)、2個以上のイソシアネート基を有する化合物(C)及びイソシアネート反応性基を有しない光重合開始剤(D)を含有する組成物であって、(A)~(D)成分を特定割合で含む電子回路被覆のための湿気硬化併用光硬化型組成物が提案されている。 Various curable compositions used for applying insulation treatment have been proposed. For example, Patent Document 1 discloses (meth) acrylate oligomer (A) having an average of 1.5 or more (meth) acryloyl groups in one molecule and a diene-based or hydrogenated diene-based skeleton. A compound having one (meth) acryloyl group whose homopolymer has a glass transition temperature of 50 ° C. or less, a compound having no isocyanate-reactive group (B), and a compound having two or more isocyanate groups (C ) And a photopolymerization initiator (D) having no isocyanate-reactive group, which is a photocuring type combined with moisture curing for coating an electronic circuit containing components (A) to (D) in a specific ratio Compositions have been proposed.
 特許文献2には、はんだ付け部のフラックス残渣を被覆する塗膜を形成する材料として用いられる光硬化性防滴材であって、(A)水素化ポリブタジエンアクリレート、(B)1分子中にイソシアネート基を3個以上有するポリイソシアネート、(C)反応性溶媒、(D)光重合開始剤の各成分を含有してなることを特徴とする光硬化性防滴材が提案されている。 Patent Document 2 discloses a photocurable drip-proof material used as a material for forming a coating film that covers a flux residue in a soldering portion, and includes (A) hydrogenated polybutadiene acrylate and (B) isocyanate in one molecule. A photocurable drip-proof material characterized by containing each component of a polyisocyanate having 3 or more groups, (C) a reactive solvent, and (D) a photopolymerization initiator has been proposed.
 特許文献3には、(a)有機ポリイソシアネート化合物と(b)ダイマー酸、ダイマージオール及びそれらを水添したもののうち少なくとも一種以上を共重合成分として含有する数平均分子量が8000以下のポリエステルポリオールとを、(a)/(b)のNCO/OH比が1.8~2.3となるように反応させて得られるポリウレタンプレポリマーの末端NCO基数の50~90%を、光重合性の(メタ)アクリロイル基変性した一液型光硬化湿気硬化併用コーティング剤が提案されている。 Patent Document 3 includes (a) an organic polyisocyanate compound and (b) a polyester polyol having a number average molecular weight of 8000 or less and containing at least one of dimer acid, dimer diol and hydrogenated compounds as a copolymer component. Is reacted so that the NCO / OH ratio of (a) / (b) is 1.8 to 2.3, and 50 to 90% of the number of terminal NCO groups of the polyurethane prepolymer obtained is photopolymerizable ( A one-component photo-curing and moisture-curing combined coating agent modified with a (meth) acryloyl group has been proposed.
特開2014-201593号公報JP 2014-201593 A 特開2012-121935号公報JP 2012-121935 A 特開2008-159437号公報JP 2008-159437 A
 しかしながら、特許文献1の湿気硬化併用光硬化型組成物は、その硬化物の紫外線照射部及び紫外線非照射部の何れにおいても電気絶縁性及び透明性が不十分であると共に、湿気硬化性が不十分であるという問題点を有する。 However, the moisture-curing combined photo-curable composition of Patent Document 1 has insufficient electrical insulation and transparency in both the ultraviolet irradiation part and the ultraviolet non-irradiation part of the cured product, and is not moisture curable. It has the problem of being sufficient.
 特許文献2の光硬化性防滴材においても、その硬化物の紫外線照射部及び紫外線非照射部の何れにおいても電気絶縁性が不十分であるという問題点を有する。 The photocurable drip-proof material of Patent Document 2 also has a problem that electrical insulation is insufficient in both the ultraviolet irradiation part and the ultraviolet non-irradiation part of the cured product.
 特許文献3の一液型光硬化湿気硬化併用コーティング剤は、その硬化物の紫外線照射部及び紫外線非照射部の何れにおいても電気絶縁性が不十分であると共に、硬化物の紫外線照射部及び紫外線非照射部の何れにおいても気温の変化に起因した膨張及び収縮によって亀裂が生じる(耐亀裂性が低い)という問題点を有する。 The one-component photocuring / moisture-curing combined coating agent of Patent Document 3 has insufficient electrical insulation in both the ultraviolet irradiation part and the ultraviolet non-irradiation part of the cured product, and the ultraviolet irradiation part and the ultraviolet ray of the cured product. Any of the non-irradiated portions has a problem that cracks occur due to expansion and contraction due to changes in temperature (low crack resistance).
 本発明は、硬化物において、紫外線などの活性エネルギー線の照射部及び非照射部の何れにおいても優れた電気絶縁性及び耐亀裂性に優れていると共に、硬化物の透明性が高く、活性エネルギー線の照射が不十分であっても十分に硬化する(湿気硬化性に優れた)湿気硬化と光硬化を併用した硬化性組成物、並びに、この硬化性組成物を用いたコンフォーマルコーティング剤及び硬化物を提供する。 In the cured product, the cured product has excellent electrical insulation and crack resistance in both irradiated and non-irradiated portions of active energy rays such as ultraviolet rays, and the cured product has high transparency and active energy. A curable composition using both moisture curing and photocuring that is sufficiently cured (excellent in moisture curable property) even when irradiation with rays is insufficient, and a conformal coating agent using the curable composition and Provide a cured product.
 本発明の硬化性組成物は、水素添加されたブタジエン系骨格及び/又は水素添加されたイソプレン系骨格を有し、且つ水添ポリブタジエンポリオール及び/又は水添ポリイソプレンポリオールを含有するポリオール(a1-1)を含むアルコール(a1)とポリイソシアネート(a2)とをモノマー成分として含有する重合体であって、上記アルコール(a1)中の水酸基に対する上記ポリイソシアネート(a2)中のイソシアネート基の当量比(イソシアネート基/水酸基)が1より大きく且つ8以下であるモノマーの重合体であり、上記ポリイソシアネート(a2)は、一分子中に、2~6個の単環の脂環式構造、又は、3~7個の単環の芳香環を有するポリイソシアネートを含むウレタン樹脂(A)と、
 環構造を含まず且つ炭素数が10個以下のアルキル基を有する単官能(メタ)アクリレート(B)と、
 光重合開始剤(C)とを含むことを特徴とする。
The curable composition of the present invention has a hydrogenated butadiene-based skeleton and / or a hydrogenated isoprene-based skeleton, and contains a hydrogenated polybutadiene polyol and / or a hydrogenated polyisoprene polyol (a1- 1) a polymer containing an alcohol (a1) containing polyisocyanate (a2) as monomer components, the equivalent ratio of isocyanate groups in the polyisocyanate (a2) to hydroxyl groups in the alcohol (a1) ( (Isocyanate group / hydroxyl group) is a polymer of a monomer having a value greater than 1 and 8 or less, and the polyisocyanate (a2) has 2 to 6 monocyclic alicyclic structures or 3 Urethane resin (A) containing polyisocyanate having ˜7 monocyclic aromatic rings;
A monofunctional (meth) acrylate (B) having no ring structure and having an alkyl group having 10 or less carbon atoms;
And a photopolymerization initiator (C).
 即ち、本発明の硬化性組成物は、水素添加されたブタジエン系骨格及び/又は水素添加されたイソプレン系骨格を有するウレタン樹脂(A)と、
 環構造を含まず且つ炭素数が10個以下のアルキル基を有する単官能(メタ)アクリレート(B)と、
 光重合開始剤(C)とを含む硬化性組成物であって、
 上記ウレタン樹脂(A)は、水添ポリブタジエンポリオール及び/又は水添ポリイソプレンポリオールを含有するポリオール(a1-1)を含むアルコール(a1)とポリイソシアネート(a2)とをモノマー成分として含有する重合体であって、上記アルコール(a1)及び上記ポリイソシアネート(a2)を含み且つ上記アルコール(a1)中の水酸基に対する上記ポリイソシアネート(a2)中のイソシアネート基の当量比(イソシアネート基/水酸基)が1より大きく且つ8以下であるモノマーの重合体であり、上記ポリイソシアネート(a2)は、一分子中に、2~6個の単環の脂環式構造、又は、3~7個の単環の芳香環を有するポリイソシアネートを含むことを特徴とする。
That is, the curable composition of the present invention comprises a urethane resin (A) having a hydrogenated butadiene skeleton and / or a hydrogenated isoprene skeleton,
A monofunctional (meth) acrylate (B) having no ring structure and having an alkyl group having 10 or less carbon atoms;
A curable composition comprising a photopolymerization initiator (C),
The urethane resin (A) is a polymer containing, as monomer components, an alcohol (a1) containing a polyol (a1-1) containing a hydrogenated polybutadiene polyol and / or a hydrogenated polyisoprene polyol, and a polyisocyanate (a2). The equivalent ratio of the isocyanate group in the polyisocyanate (a2) to the hydroxyl group in the alcohol (a1) containing the alcohol (a1) and the polyisocyanate (a2) (isocyanate group / hydroxyl group) is 1 A polymer of a monomer having a size of 8 or less, and the polyisocyanate (a2) has 2 to 6 monocyclic alicyclic structures or 3 to 7 monocyclic aromatics in one molecule. A polyisocyanate having a ring is included.
 本発明の硬化性組成物は、上述の如き構成を有していることから、優れた電気絶縁性を有し且つ光硬化が不十分な部分においても優れた耐亀裂性を有する硬化物を得ることができる。 Since the curable composition of the present invention has the above-described configuration, a cured product having excellent electrical insulation and excellent crack resistance even in a portion where light curing is insufficient is obtained. be able to.
 本発明の硬化性組成物は、水素添加されたブタジエン系骨格及び/又は水素添加されたイソプレン系骨格を有するウレタン樹脂(A)と、環構造を含まず且つ炭素数が10個以下のアルキル基を有する単官能(メタ)アクリレート(B)と、光重合開始剤(C)とを含む。 The curable composition of the present invention includes a urethane resin (A) having a hydrogenated butadiene-based skeleton and / or a hydrogenated isoprene-based skeleton, and an alkyl group having no ring structure and having 10 or less carbon atoms. A monofunctional (meth) acrylate (B) having a photopolymerization initiator (C).
〔ウレタン樹脂(A)〕
 ウレタン樹脂(A)は、水素添加されたブタジエン系骨格(水添ブタジエン系骨格)及び/又は水素添加されたイソプレン系骨格(水添イソプレン系骨格)を有する。
[Urethane resin (A)]
The urethane resin (A) has a hydrogenated butadiene skeleton (hydrogenated butadiene skeleton) and / or a hydrogenated isoprene skeleton (hydrogenated isoprene skeleton).
 ウレタン樹脂(A)は、水添ポリブタジエンポリオール及び/又は水添ポリイソプレンポリオールを含有するポリオール(a1-1)を含むアルコール(a1)とポリイソシアネート(a2)をモノマー成分として含有する重合体である。即ち、ウレタン樹脂(A)は、水添ポリブタジエンポリオール及び/又は水添ポリイソプレンポリオールを含有するポリオール(a1-1)を含むアルコール(a1)とポリイソシアネート(a2)を含むモノマーの重合体である。 The urethane resin (A) is a polymer containing, as monomer components, an alcohol (a1) containing a polyol (a1-1) containing a hydrogenated polybutadiene polyol and / or a hydrogenated polyisoprene polyol and a polyisocyanate (a2). . That is, the urethane resin (A) is a polymer of a monomer containing an alcohol (a1) containing a polyol (a1-1) containing a hydrogenated polybutadiene polyol and / or a hydrogenated polyisoprene polyol and a polyisocyanate (a2). .
 水添ポリブタジエンポリオールとしては、例えば、ポリブタジエンジオールの水添物が挙げられる。なお、水添ポリブタジエンジオールは、例えば、日本曹達社から商品名「GI-1000」、「GI-2000」及び商品名「GI-3000」、クレイバレー社から商品名「Krasol HLBH-P2000」及び商品名「Krasol HLBH-P3000」にて市販されている。水添ポリブタジエンポリオールは、単独で用いられても二種以上が併用されてもよい。 Examples of the hydrogenated polybutadiene polyol include hydrogenated products of polybutadiene diol. Hydrogenated polybutadiene diols are, for example, trade names “GI-1000” and “GI-2000” and trade name “GI-3000” from Nippon Soda Co., Ltd., trade names “Krazol HLBH-P2000” and trade names from Clay Valley. It is commercially available under the name “Krasol HLBH-P3000”. Hydrogenated polybutadiene polyols may be used alone or in combination of two or more.
 水添ポリブタジエンポリオールは、ポリブタジエンポリオールに含まれている不飽和二重結合の一部又は全てが水添されている。水添ポリブタジエンポリオールの水添の度合いはヨウ素価によって判断することができる。水添ポリブタジエンポリオールのヨウ素価は50以下が好ましく、40以下がより好ましく、30以下が特に好ましく、25以下が最も好ましい。なお、本発明において、ヨウ素価とは、試料100gにハロゲンを反応させたとき、結合するハロゲンの量をヨウ素のg数に換算した値であり、JIS K0070で規定された方法で測定することができる。 In the hydrogenated polybutadiene polyol, part or all of the unsaturated double bonds contained in the polybutadiene polyol are hydrogenated. The degree of hydrogenation of the hydrogenated polybutadiene polyol can be determined by the iodine value. The iodine value of the hydrogenated polybutadiene polyol is preferably 50 or less, more preferably 40 or less, particularly preferably 30 or less, and most preferably 25 or less. In the present invention, the iodine value is a value obtained by converting the amount of halogen to be bonded to the number of g of iodine when halogen is reacted with 100 g of a sample, and can be measured by a method defined in JIS K0070. it can.
 水添ポリイソプレンポリオールとしては、例えば、ポリイソプレンジオールの水添物が挙げられる。なお、水添ポリイソプレンは、例えば、出光興産社から商品名「EPOL」にて市販されている。水添ポリイソプレンポリオールは、単独で用いられても二種以上が併用されてもよい。 Examples of the hydrogenated polyisoprene polyol include hydrogenated products of polyisoprene diol. Hydrogenated polyisoprene is commercially available, for example, from Idemitsu Kosan Co., Ltd. under the trade name “EPOL”. Hydrogenated polyisoprene polyols may be used alone or in combination of two or more.
 水添ポリイソプレンポリオールは、ポリイソプレンポリオールに含まれている不飽和二重結合の一部又は全てが水添されている。水添ポリイソプレンポリオールの水添の度合いはヨウ素価によって判断することができる。水添ポリイソプレンポリオールのヨウ素価は40以下が好ましく、30以下がより好ましく、20以下が特に好ましく、10以下が最も好ましい。 In the hydrogenated polyisoprene polyol, part or all of the unsaturated double bond contained in the polyisoprene polyol is hydrogenated. The degree of hydrogenation of the hydrogenated polyisoprene polyol can be determined by the iodine value. The iodine value of the hydrogenated polyisoprene polyol is preferably 40 or less, more preferably 30 or less, particularly preferably 20 or less, and most preferably 10 or less.
 硬化性組成物の硬化物が電気絶縁性に優れているので、水添ポリブタジエンポリオールが好ましい。硬化性組成物の硬化物が耐亀裂性に優れているので、水添ポリイソプレンポリオールが好ましい。 Since the cured product of the curable composition is excellent in electrical insulation, hydrogenated polybutadiene polyol is preferable. Since the cured product of the curable composition has excellent crack resistance, hydrogenated polyisoprene polyol is preferred.
 ポリオール(a1-1)の数平均分子量は、500~10000が好ましく、1000~5000がより好ましく、2100~4000が更に好ましい。数平均分子量が500以上であると、硬化性組成物の硬化物の耐亀裂性及び電気絶縁性が向上する。数平均分子量が10000以下であると、硬化性組成物の硬化直後の硬化物の粘着性が低減され、硬化物に雰囲気中の金属粉や埃が付着することに起因する硬化物の保護性能の低下を抑制することができる。 The number average molecular weight of the polyol (a1-1) is preferably 500 to 10,000, more preferably 1000 to 5000, and still more preferably 2100 to 4000. When the number average molecular weight is 500 or more, the crack resistance and electrical insulation of the cured product of the curable composition are improved. When the number average molecular weight is 10,000 or less, the adhesiveness of the cured product immediately after curing of the curable composition is reduced, and the protective performance of the cured product resulting from adhesion of metal powder and dust in the atmosphere to the cured product. The decrease can be suppressed.
 ポリオール(a1-1)の数平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC)によって測定された分子量をポリスチレン換算した値をいう。例えば、下記の測定条件にて測定することができる。
装置:東ソー社製 HLC-8220GPC
カラム:東ソー社製
    商品名「TSKgel SuperHZM-H」2本
カラム温度:40℃
溶離液:テトラヒドロフラン
検出:RI
検量線用標準ポリスチレン:東ソー社製 商品名「TSKgel 標準ポリスチレン」
The number average molecular weight of the polyol (a1-1) refers to a value obtained by converting the molecular weight measured by gel permeation chromatography (GPC) into polystyrene. For example, it can be measured under the following measurement conditions.
Equipment: HLC-8220GPC manufactured by Tosoh Corporation
Column: product name “TSKgel SuperHZM-H” manufactured by Tosoh Corporation Column temperature: 40 ° C.
Eluent: Tetrahydrofuran Detection: RI
Standard polystyrene for calibration curve: Trade name “TSKgel standard polystyrene” manufactured by Tosoh Corporation
 ウレタン樹脂(A)中におけるポリオール(a1-1)成分の含有量は、1~99質量%が好ましく、20~95質量%がより好ましく、30~85質量%が特に好ましい。 The content of the polyol (a1-1) component in the urethane resin (A) is preferably 1 to 99% by mass, more preferably 20 to 95% by mass, and particularly preferably 30 to 85% by mass.
 ウレタン樹脂(A)は、モノマー成分として水酸基含有(メタ)アクリレート(a1-2)を含有していてもよい。ウレタン樹脂(A)がモノマー成分として水酸基含有(メタ)アクリレートを含有していると、ウレタン樹脂(A)によって形成された架橋構造中に、単官能(メタ)アクリレート及び必要に応じて添加される多官能(メタ)アクリレートが形成する架橋構造を取り込むことができる。そして、硬化性組成物の硬化物の外観性(透明性)が向上する。なお、(メタ)アクリレートは、アクリレート又はメタクリレートを意味する。 The urethane resin (A) may contain a hydroxyl group-containing (meth) acrylate (a1-2) as a monomer component. When the urethane resin (A) contains a hydroxyl group-containing (meth) acrylate as a monomer component, a monofunctional (meth) acrylate and, if necessary, are added to the crosslinked structure formed by the urethane resin (A). The cross-linked structure formed by the polyfunctional (meth) acrylate can be incorporated. And the external appearance property (transparency) of the hardened | cured material of a curable composition improves. In addition, (meth) acrylate means an acrylate or a methacrylate.
 水酸基含有(メタ)アクリレート(a1-2)としては、特に限定されず、例えば、2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート、4-ヒドロキシブチル(メタ)アクリレートなどの水酸基含有アルキル(メタ)アクリレート、ペンタエリスリトールジ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、ジペンタエリスリトールテトラ(メタ)アクリレート、ジペンタエリスリトールペンタ(メタ)アクリレート、トリメチロールプロパンジ(メタ)アクリレート、ジトリメチロールプロパンジ(メタ)アクリレート、ジトリメチロールプロパントリ(メタ)アクリレート、トリス-2-ヒドロキシエチルイソシアヌレートジ(メタ)アクリレート、グリセリンジ(メタ)アクリレート、ジグリセリンジ(メタ)アクリレート、ジグリセリントリ(メタ)アクリレート、およびこれらのアルキレンオキサイド(エチレンオキサイド、プロピレンオキサイドなど)付加物(ランダム付加物、ブロック付加物を含む。)などの水酸基含有多官能(メタ)アクリレートなどが挙げられ、ペンタエリスリトールトリ(メタ)アクリレートが好ましく、ペンタエリスリトールトリアクリレートがより好ましい。なお、水酸基含有(メタ)アクリレート(a1-2)は、単独で用いられても二種以上が併用されてもよい。 The hydroxyl group-containing (meth) acrylate (a1-2) is not particularly limited, and examples thereof include hydroxyl groups such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate. Containing alkyl (meth) acrylate, pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, trimethylolpropane di (meth) acrylate, Ditrimethylolpropane di (meth) acrylate, ditrimethylolpropane tri (meth) acrylate, tris-2-hydroxyethyl isocyanurate di (meth) acrylate, glycerin di ( ) Acrylate, diglycerin di (meth) acrylate, diglycerin tri (meth) acrylate, and adducts thereof (including random oxides and block adducts) such as alkylene oxides (ethylene oxide, propylene oxide, etc.). A functional (meth) acrylate etc. are mentioned, Pentaerythritol tri (meth) acrylate is preferable and Pentaerythritol triacrylate is more preferable. The hydroxyl group-containing (meth) acrylate (a1-2) may be used alone or in combination of two or more.
 ウレタン樹脂(A)中における水酸基含有(メタ)アクリレート(a1-2)成分の含有量は、0.1~5質量%が好ましく、0.5~3質量%がより好ましく、0.8~2質量%が特に好ましい。水酸基含有(メタ)アクリレート(a1-2)成分の含有量が0.1質量%以上であると、硬化性組成物の硬化物の外観性が向上する。水酸基含有(メタ)アクリレート(a1-2)成分の含有量が5質量%以下であると、硬化性組成物の硬化物の耐亀裂性が向上する。 The content of the hydroxyl group-containing (meth) acrylate (a1-2) component in the urethane resin (A) is preferably 0.1 to 5% by mass, more preferably 0.5 to 3% by mass, and 0.8 to 2%. Mass% is particularly preferred. When the content of the hydroxyl group-containing (meth) acrylate (a1-2) component is 0.1% by mass or more, the appearance of the cured product of the curable composition is improved. When the content of the hydroxyl group-containing (meth) acrylate (a1-2) component is 5% by mass or less, the crack resistance of the cured product of the curable composition is improved.
 ウレタン樹脂(A)中におけるアルコール(a1)成分の含有量は、1~99質量%が好ましく、20~95質量%がより好ましく、30~85質量%が特に好ましい。 The content of the alcohol (a1) component in the urethane resin (A) is preferably 1 to 99% by mass, more preferably 20 to 95% by mass, and particularly preferably 30 to 85% by mass.
 なお、水酸基含有(メタ)アクリレート(a1-2)がウレタン樹脂(A)のモノマー成分として含有されている場合、アルコール(a1)成分には、ポリオール(a1-1)と水酸基含有(メタ)アクリレート(a1-2)が含まれる。 When the hydroxyl group-containing (meth) acrylate (a1-2) is contained as a monomer component of the urethane resin (A), the alcohol (a1) component includes a polyol (a1-1) and a hydroxyl group-containing (meth) acrylate. (A1-2) is included.
 アルコール(a1)成分としては、本発明の目的を損なわない範囲で、ポリオール(a1-1)及び水酸基含有(メタ)アクリレート(a1-2)以外に、その他のアルコール成分が更に含まれてもよい。その他のアルコール成分としては、例えば、ポリカーボネートポリオール、ポリエステルポリオール、ポリラクトンポリオール、アクリルポリオール、ポリエーテルポリオール、ポリアセタールポリオールなどが挙げられる。又、その他のアルコール成分として、エチレングリコール、ジエチレングリコール、1,4-ブタンジオール、1,6-ヘキサンジオール、グリセリン、トリメチロールプロパン、ペンタエリスリトールなどの低分子量のポリオールを使用することができる。 The alcohol (a1) component may further contain other alcohol components in addition to the polyol (a1-1) and the hydroxyl group-containing (meth) acrylate (a1-2) as long as the object of the present invention is not impaired. . Examples of other alcohol components include polycarbonate polyol, polyester polyol, polylactone polyol, acrylic polyol, polyether polyol, and polyacetal polyol. Further, as other alcohol components, low molecular weight polyols such as ethylene glycol, diethylene glycol, 1,4-butanediol, 1,6-hexanediol, glycerin, trimethylolpropane, and pentaerythritol can be used.
 アルコール(a1)成分中において、ポリオール(a1-1)と水酸基含有(メタ)アクリレート(a1-2)との合計の含有量は、50質量%以上が好ましく、60質量%以上がより好ましく、70質量%以上がより好ましく、80質量%以上が更に好ましく、90質量%以上が特に好ましく、100質量%が最も好ましい。 In the alcohol (a1) component, the total content of the polyol (a1-1) and the hydroxyl group-containing (meth) acrylate (a1-2) is preferably 50% by mass or more, more preferably 60% by mass or more, and 70 More preferably, it is more preferably 80% by weight or more, particularly preferably 90% by weight or more, and most preferably 100% by weight.
 ポリイソシアネート(a2)は、一分子中にイソシアネート基(-NCO)を複数個有し、更に、一分子中に、2~6個の単環の脂環式構造、又は、3~7個の単環の芳香環を有するポリイソシアネートを含有している。ポリイソシアネートは、3分子でイソシアヌレート又はビウレット体を形成することができる。トリメチロールプロパンと3分子のポリイソシアネートが反応することで三量体付加物が形成される。 The polyisocyanate (a2) has a plurality of isocyanate groups (—NCO) in one molecule, and further contains 2 to 6 monocyclic alicyclic structures or 3 to 7 It contains a polyisocyanate having a single aromatic ring. Polyisocyanate can form an isocyanurate or biuret body with three molecules. A trimer adduct is formed by the reaction of trimethylolpropane with three molecules of polyisocyanate.
 単環とは、構造中に多環化合物構造を含まないことを意味する。多環化合物とは、1個以上の原子を2個以上の環が共有している化合物であり、具体的には、縮合環化合物、橋かけ環化合物及びスピロ環化合物などが挙げられる。縮合環化合物とは、ナフタレン、フェナントレンなどのオルト縮合、ピレン、ペリレンなどのオルトペリ縮合を有する環化合物をいう。橋かけ環化合物とは、ビシクロ[4.3.1]デカン、トリシクロ[2.2.1.02,6]ヘプタンなどのように、炭素が環状に結合した環構造(炭素が環状に結合した構造中にヘテロ原子が1個以上含まれていてもよい)であって芳香族性を有しない2個以上の環が互いにそれぞれの環の辺を一辺以上且つ2個以上の原子を共有して縮合した脂環炭化水素化合物をいう。スピロ環化合物とは、スピロ[3.4]オクタン、スピロ[4.5]デカ-1,6-ジエンなどのように、1個の原子が、炭素が環状に結合した2個の環構造(炭素が環状に結合した構造中にヘテロ原子が1個以上含まれていてもよい)に共有されてできている点結合(スピロ結合)を有する環化合物をいう。 Monocyclic means that the structure does not include a polycyclic compound structure. A polycyclic compound is a compound in which two or more rings share one or more atoms, and specific examples include fused ring compounds, bridged ring compounds, and spiro ring compounds. The condensed ring compound refers to a ring compound having orthocondensation such as naphthalene and phenanthrene, and orthopericondensation such as pyrene and perylene. A bridged ring compound is a ring structure in which carbons are bonded in a cyclic manner, such as bicyclo [4.3.1] decane, tricyclo [2.2.1.0 2,6 ] heptane, etc. In the structure, one or more heteroatoms may be contained), and two or more rings having no aromaticity share one or more sides of each ring and two or more atoms. The condensed alicyclic hydrocarbon compound. Spiro ring compounds are two ring structures in which one atom is bonded to a ring of carbon (such as spiro [3.4] octane, spiro [4.5] deca-1,6-diene). It refers to a ring compound having a point bond (spiro bond) that is shared by a structure in which one or more heteroatoms may be contained in a structure in which carbon is bonded in a cyclic manner.
 脂環式構造とは、炭素が環状に結合した構造であって芳香族性を有しないものをいう。本発明で用いられるポリイソシアネートは構造中にイソシアヌレート環を含んでいてもよいが、ここで定義する脂環式構造にイソシアヌレート環は含まれない。炭素が環状に結合した構造中にヘテロ原子が1個又は2個含まれていてもよい。脂環式構造としては、シクロプロパン構造、シクロブタン構造、シクロペンタン構造、シクロヘキサン構造などシクロアルカン構造(シクロパラフィン構造)、シクロブテン構造、シクロペンテン構造、シクロヘキセン構造、シクロプロペン構造などが挙げられ、シクロアルカン構造が好ましく、炭素数が5個以上のシクロアルカン構造が好ましく、炭素数が5~7個のシクロアルカン構造がより好ましい。 The alicyclic structure is a structure in which carbon is bonded in a cyclic manner and has no aromaticity. The polyisocyanate used in the present invention may contain an isocyanurate ring in the structure, but the isocyanurate ring is not included in the alicyclic structure defined herein. One or two heteroatoms may be contained in the structure in which carbons are bonded in a cyclic manner. Examples of alicyclic structures include cycloalkane structures such as cyclopropane structure, cyclobutane structure, cyclopentane structure and cyclohexane structure (cycloparaffin structure), cyclobutene structure, cyclopentene structure, cyclohexene structure and cyclopropene structure. A cycloalkane structure having 5 or more carbon atoms is preferable, and a cycloalkane structure having 5 to 7 carbon atoms is more preferable.
 ポリイソシアネート(a2)における一分子中の脂環式構造の数は、硬化性組成物の硬化物の電気絶縁性が向上するので、2~6個であり、2個が好ましい。 The number of alicyclic structures in one molecule in the polyisocyanate (a2) is 2 to 6 and preferably 2 because the electrical insulation of the cured product of the curable composition is improved.
 2~6個の単環の脂環式構造を有するポリイソシアネートとしては、例えば、4,4’-ジシクロヘキシルメタンジイソシアネート(水素添加MDI);
4,4’-ジシクロヘキシルメタンジイソシアネート(水素添加MDI)のビウレット体及びイソシアヌレート体;
トリメチロールプロパン(TMP)と水素添加MDIとの三量体付加物;
イソホロンジイソシアネート、メチルシクロヘキシレンジイソシアネート(水素添加TDI)、1,3-ビス(イソシアナトメチル)シクロヘキサン(水素添加m-XDI)などのポリイソシアネートのビウレット体及びイソシアヌレート体;
イソホロンジイソシアネート、メチルシクロヘキシレンジイソシアネート(水素添加TDI)、および1,3-ビス(イソシアナトメチル)シクロヘキサン(水素添加m-XDI)などのポリイソシアネートのいずれか一種3モルと、トリメチロールプロパン(TMP)1モルとの三量体付加物など;
トリメチロールプロパン(TMP)とイソホロンジイソシアネート2モル及びヘキサメチレンジイソシアネート(HDI)1モルの付加物などが挙げられる。
Examples of the polyisocyanate having 2 to 6 monocyclic alicyclic structures include 4,4′-dicyclohexylmethane diisocyanate (hydrogenated MDI);
Biuret and isocyanurate forms of 4,4′-dicyclohexylmethane diisocyanate (hydrogenated MDI);
Trimer adduct of trimethylolpropane (TMP) and hydrogenated MDI;
Biuret and isocyanurate forms of polyisocyanates such as isophorone diisocyanate, methylcyclohexylene diisocyanate (hydrogenated TDI), 1,3-bis (isocyanatomethyl) cyclohexane (hydrogenated m-XDI);
3 moles of any of polyisocyanates such as isophorone diisocyanate, methylcyclohexylene diisocyanate (hydrogenated TDI), and 1,3-bis (isocyanatomethyl) cyclohexane (hydrogenated m-XDI), and trimethylolpropane (TMP) Trimer adduct with 1 mole, etc .;
Examples include adducts of trimethylolpropane (TMP) with 2 mol of isophorone diisocyanate and 1 mol of hexamethylene diisocyanate (HDI).
 2個の単環の脂環式構造を有するポリイソシアネートとしては、例えば、4,4’-ジシクロヘキシルメタンジイソシアネート(水素添加MDI)、トリメチロールプロパン(TMP)とイソホロンジイソシアネート2モル及びヘキサメチレンジイソシアネート(HDI)1モルの付加物が挙げられ、4,4’-ジシクロヘキシルメタンジイソシアネート(水素添加MDI)が好ましい。 Examples of the polyisocyanate having two monocyclic alicyclic structures include 4,4′-dicyclohexylmethane diisocyanate (hydrogenated MDI), trimethylolpropane (TMP) and 2 moles of isophorone diisocyanate, and hexamethylene diisocyanate (HDI). ) 1 mole of adduct, and 4,4′-dicyclohexylmethane diisocyanate (hydrogenated MDI) is preferred.
 芳香環とは、芳香族性を有する環、即ち、(4n+2)π電子系(nは自然数)を有する環を意味し、ヘテロ原子を含有するものも含まれる。芳香環としては、フラン環、チオフェン環、ピロール環、イミダゾール環、チアゾール環、オキサジアゾール環などの5員環、ベンゼン環、ピリジン環、ピラジン環などの6員環などが挙げられ、6員環が好ましく、ベンゼン環がより好ましい。 An aromatic ring means a ring having aromaticity, that is, a ring having a (4n + 2) π electron system (n is a natural number), and includes those containing heteroatoms. Examples of the aromatic ring include 5-membered rings such as a furan ring, a thiophene ring, a pyrrole ring, an imidazole ring, a thiazole ring, and an oxadiazole ring, and a 6-membered ring such as a benzene ring, a pyridine ring, and a pyrazine ring. A ring is preferable, and a benzene ring is more preferable.
 ポリイソシアネート(a2)における一分子中の芳香環の数は、硬化性組成物の硬化物の電気絶縁性が向上するので、3~7個が好ましく、3個がより好ましい。 The number of aromatic rings in one molecule in the polyisocyanate (a2) is preferably 3 to 7 and more preferably 3 because the electrical insulation of the cured product of the curable composition is improved.
 3~7個の単環の芳香環を有するポリイソシアネートとしては、例えば、4,4’,4’’-トリフェニルメタントリイソシアネート;
1,3-フェニレンジイソシアネート、1,4-フェニレンジイソシアネート、2,4-トリレンジイソシアネート、2,6-トリレンジイソシアネート、m-キシレンジイソシアネート、m-イソシアナトフェニルスルホニルイソシアネート、p-イソシアナトフェニルスルホニルイソシアネート、2,4’-ジフェニルメタンジイソシアネート、4,4’-ジイソシアナトビフェニル、3,3’-ジメチル-4,4’-ジイソシアナトビフェニル、3,3’-ジメチル-4,4’-ジイソシアナトジフェニルメタンなどのポリイソシアネートのビウレット体及びイソシアヌレート体;
1,3-フェニレンジイソシアネート、1,4-フェニレンジイソシアネート、2,4-トリレンジイソシアネート、2,6-トリレンジイソシアネート、m-キシレンジイソシアネート、m-イソシアナトフェニルスルホニルイソシアネート、p-イソシアナトフェニルスルホニルイソシアネート、2,4’-ジフェニルメタンジイソシアネート、4,4’-ジイソシアナトビフェニル、3,3’-ジメチル-4,4’-ジイソシアナトビフェニル、3,3’-ジメチル-4,4’-ジイソシアナトジフェニルメタンなどのポリイソシアネートのいずれか一種3モルと、トリメチロールプロパン(TMP)1モルとの三量体付加物などが挙げられる。一般にトリレンジイソシアネートは、2,4-トリレンジイソシアネートと2,6-トリレンジイソシアネートの混合物である。
Examples of the polyisocyanate having 3 to 7 monocyclic aromatic rings include 4,4 ′, 4 ″ -triphenylmethane triisocyanate;
1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, m-xylene diisocyanate, m-isocyanatophenylsulfonyl isocyanate, p-isocyanatophenylsulfonyl isocyanate 2,4′-diphenylmethane diisocyanate, 4,4′-diisocyanatobiphenyl, 3,3′-dimethyl-4,4′-diisocyanatobiphenyl, 3,3′-dimethyl-4,4′-diisocyanate Biuret and isocyanurate forms of polyisocyanates such as natodiphenylmethane;
1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, m-xylene diisocyanate, m-isocyanatophenylsulfonyl isocyanate, p-isocyanatophenylsulfonyl isocyanate 2,4′-diphenylmethane diisocyanate, 4,4′-diisocyanatobiphenyl, 3,3′-dimethyl-4,4′-diisocyanatobiphenyl, 3,3′-dimethyl-4,4′-diisocyanate Examples thereof include a trimer adduct of 3 mol of any one of polyisocyanates such as natodiphenylmethane and 1 mol of trimethylolpropane (TMP). In general, tolylene diisocyanate is a mixture of 2,4-tolylene diisocyanate and 2,6-tolylene diisocyanate.
 3個の単環の芳香環を有するポリイソシアネートとしては、
4,4’,4’’-トリフェニルメタントリイソシアネート;
1,3-フェニレンジイソシアネート、1,4-フェニレンジイソシアネート、2,4-トリレンジイソシアネート、2,6-トリレンジイソシアネート、m-キシレンジイソシアネート、m-イソシアナトフェニルスルホニルイソシアネート、p-イソシアナトフェニルスルホニルイソシアネートなどのポリイソシアネートのビウレット体及びイソシアヌレート体;
1,3-フェニレンジイソシアネート、1,4-フェニレンジイソシアネート、2,4-トリレンジイソシアネート、2,6-トリレンジイソシアネート、m-キシレンジイソシアネート、m-イソシアナトフェニルスルホニルイソシアネート、p-イソシアナトフェニルスルホニルイソシアネートなどのポリイソシアネートのいずれか一種3モルと、トリメチロールプロパン(TMP)1モルとの三量体付加物などが挙げられ、トリメチロールプロパンとトリレンジイソシアネートの三量体付加物が好ましい。
As polyisocyanate having three monocyclic aromatic rings,
4,4 ′, 4 ″ -triphenylmethane triisocyanate;
1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, m-xylene diisocyanate, m-isocyanatophenylsulfonyl isocyanate, p-isocyanatophenylsulfonyl isocyanate Biuret and isocyanurate forms of polyisocyanates such as
1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, m-xylene diisocyanate, m-isocyanatophenylsulfonyl isocyanate, p-isocyanatophenylsulfonyl isocyanate A trimer adduct of 3 mol of any one of polyisocyanates such as 1 and 1 mol of trimethylolpropane (TMP) is exemplified, and a trimer adduct of trimethylolpropane and tolylene diisocyanate is preferable.
 本発明で用いられるポリイソシアネートは、本発明の目的を損なわない範囲で、上記ポリイソシアネートの他に、1個の単環又は多環の脂環式構造を有するポリイソシアネート、2個以下の単環及び/又は多環の芳香環を有するポリイソシアネート、環構造を有しない脂肪族ポリイソシアネートなどを含んでよい。 The polyisocyanate used in the present invention is a polyisocyanate having one monocyclic or polycyclic alicyclic structure, in addition to the above polyisocyanate, within a range not impairing the object of the present invention. And / or a polyisocyanate having a polycyclic aromatic ring, an aliphatic polyisocyanate having no ring structure, and the like.
 1個の単環又は多環の脂環式構造を有するポリイソシアネートとしては、イソホロンジイソシアネート、メチルシクロヘキシレンジイソシアネート(水素添加TDI)、2,5-ノルボルナンジイソシアネート、2,6-ノルボルナンジイソシアネートなどが挙げられる。 Examples of the polyisocyanate having one monocyclic or polycyclic alicyclic structure include isophorone diisocyanate, methylcyclohexylene diisocyanate (hydrogenated TDI), 2,5-norbornane diisocyanate, and 2,6-norbornane diisocyanate. .
 2個以下の単環及び/又は多環の芳香環を有するポリイソシアネートとしては、4,4’-ジフェニルメタンジイソシアネート(MDI)、2,4’-ジフェニルメタンジイソシアネート、4,4’-ジイソシアナトビフェニル、3,3’-ジメチル-4,4’-ジイソシアナトビフェニル、3,3’-ジメチル-4,4’-ジイソシアナトジフェニルメタン、1,5ナフチレンジイソシアネート、1,3-フェニレンジイソシアネート、1,4-フェニレンジイソシアネート、2,4-トリレンジイソシアネート、2,6-トリレンジイソシアネート、m-キシレンジイソシアネート、m-イソシアナトフェニルスルホニルイソシアネート、p-イソシアナトフェニルスルホニルイソシアネートなどが挙げられる。 Examples of the polyisocyanate having 2 or less monocyclic and / or polycyclic aromatic rings include 4,4′-diphenylmethane diisocyanate (MDI), 2,4′-diphenylmethane diisocyanate, 4,4′-diisocyanatobiphenyl, 3,3′-dimethyl-4,4′-diisocyanatobiphenyl, 3,3′-dimethyl-4,4′-diisocyanatodiphenylmethane, 1,5-naphthylene diisocyanate, 1,3-phenylene diisocyanate, 1, Examples include 4-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, m-xylene diisocyanate, m-isocyanatophenylsulfonyl isocyanate, p-isocyanatophenylsulfonyl isocyanate.
 環構造を有しない脂肪族ポリイソシアネートとしては、エチレンジイソシアネート、テトラメチレンジイソシアネート、ヘキサメチレンジイソシアネート、ドデカメチレンジイソシアネート、1,6,11-ウンデカントリイソシアネート、2,2,4-トリメチルヘキサメチレンジイソシアネート、2,6-ジイソシアナトメチルカプロエート、ビス(2-イソシアナトエチル)フマレート、ビス(2-イソシアナトエチル)カーボネート、2-イソシアナトエチル-2,6-ジイソシアナトヘキサノエートなどが挙げられる。 Examples of the aliphatic polyisocyanate having no ring structure include ethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, dodecamethylene diisocyanate, 1,6,11-undecane triisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 2, Examples include 6-diisocyanatomethyl caproate, bis (2-isocyanatoethyl) fumarate, bis (2-isocyanatoethyl) carbonate, 2-isocyanatoethyl-2,6-diisocyanatohexanoate.
 なお、ポリイソシアネート(a2)は、単独で用いられても二種以上が併用されてもよい。二種以上を併用する場合は、脂環式構造を有するポリイソシアネート同士、芳香環を有するポリイソシアネート同士、脂環式構造を有するポリイソシアネートと芳香環を有するポリイソシアネートの組み合わせの何れであってもよく、脂環式構造を有するポリイソシアネートと芳香環を有するポリイソシアネートの組み合わせが好ましく、4,4’-ジシクロヘキシルメタンジイソシアネート(水素添加MDI)と、トリメチロールプロパンとトリレンジイソシアネートの三量体付加物とを組み合わせて用いることがより好ましい。 In addition, polyisocyanate (a2) may be used independently or 2 or more types may be used together. When two or more types are used in combination, any of polyisocyanates having an alicyclic structure, polyisocyanates having an aromatic ring, a combination of a polyisocyanate having an alicyclic structure and a polyisocyanate having an aromatic ring may be used. A combination of a polyisocyanate having an alicyclic structure and a polyisocyanate having an aromatic ring is preferable, and 4,4′-dicyclohexylmethane diisocyanate (hydrogenated MDI), a trimer adduct of trimethylolpropane and tolylene diisocyanate It is more preferable to use in combination.
 脂環式構造を有するポリイソシアネートと芳香環を有するポリイソシアネートを併用する場合は、脂環式構造を有するポリイソシアネートと芳香環を有するポリイソシアネートの総量100質量部に対して脂環式構造を有するポリイソシアネート1~40質量部が好ましく、1.5~30質量部がより好ましい。 When the polyisocyanate having an alicyclic structure and the polyisocyanate having an aromatic ring are used in combination, the polyisocyanate having an alicyclic structure and the polyisocyanate having an aromatic ring have an alicyclic structure with respect to 100 parts by mass in total. The polyisocyanate is preferably 1 to 40 parts by mass, and more preferably 1.5 to 30 parts by mass.
 ポリイソシアネート(a2)は、2~6個の単環の脂環式構造、又は、3~7個の単環の芳香環を含んでいるので、硬化性組成物の硬化物は、優れた電気絶縁性を有し且つ光硬化が不十分な部分においても優れた耐亀裂性を有する。 Since the polyisocyanate (a2) contains 2 to 6 monocyclic alicyclic structures or 3 to 7 monocyclic aromatic rings, the cured product of the curable composition has excellent electrical properties. It has excellent crack resistance even in portions that have insulating properties and insufficient photocuring.
 ポリイソシアネート(a2)中において、一分子中に、2~6個の単環の脂環式構造又は3~7個の単環の芳香環を有するポリイソシアネートの総含有量は、50質量%以上が好ましく、60質量%以上がより好ましく、70質量%以上がより好ましく、80質量%以上が更に好ましく、90質量%以上が特に好ましく、100質量%が最も好ましい。一分子中に、2~6個の単環の脂環式構造又は3~7個の単環の芳香環を有するポリイソシアネートの総含有量が50質量%以上であると、硬化性組成物の硬化物は、優れた電気絶縁性を有し且つ光硬化が不十分な部分においても優れた耐亀裂性を有する。 In the polyisocyanate (a2), the total content of the polyisocyanate having 2 to 6 monocyclic alicyclic structures or 3 to 7 monocyclic aromatic rings in one molecule is 50% by mass or more. 60 mass% or more is more preferable, 70 mass% or more is more preferable, 80 mass% or more is further more preferable, 90 mass% or more is particularly preferable, and 100 mass% is most preferable. When the total content of polyisocyanates having 2 to 6 monocyclic alicyclic structures or 3 to 7 monocyclic aromatic rings in one molecule is 50% by mass or more, The cured product has excellent electrical insulation and excellent crack resistance even in a portion where photocuring is insufficient.
 ウレタン樹脂(A)は、ポリオール(a1-1)を必須成分として含有するアルコール(a1)及びポリイソシアネート(a2)を含むモノマーの重合体である。ウレタン樹脂(A)の原料となるモノマー中において、上記アルコール(a1)中の水酸基に対する上記ポリイソシアネート(a2)中のイソシアネート基の当量比(イソシアネート基/水酸基)は、1より大きく且つ8以下であり、1より大きく且つ7以下が好ましく、1より大きく且つ6以下がより好ましい。当量比(イソシアネート基/水酸基)が8以下であると、ウレタン樹脂(A)が十分な大きさの分子量を有するため、硬化性組成物の硬化物は、優れた電気絶縁性を有し且つ光硬化が不十分な部分においても優れた耐亀裂性を有する。当量比(イソシアネート基/水酸基)は、ウレタン樹脂(A)が湿気硬化性を有するために1より大きいことが必要であり、硬化性組成物の保存安定性が向上するので、2以上が好ましく、2.5以上がより好ましい。 Urethane resin (A) is a polymer of a monomer containing alcohol (a1) and polyisocyanate (a2) containing polyol (a1-1) as essential components. In the monomer used as the raw material of the urethane resin (A), the equivalent ratio of the isocyanate group in the polyisocyanate (a2) to the hydroxyl group in the alcohol (a1) (isocyanate group / hydroxyl group) is greater than 1 and 8 or less. Yes, greater than 1 and preferably 7 or less, more preferably greater than 1 and 6 or less. When the equivalent ratio (isocyanate group / hydroxyl group) is 8 or less, since the urethane resin (A) has a sufficient molecular weight, the cured product of the curable composition has excellent electrical insulation and light. Excellent crack resistance even in areas where curing is insufficient. The equivalent ratio (isocyanate group / hydroxyl group) needs to be larger than 1 because the urethane resin (A) has moisture curability, and the storage stability of the curable composition is improved. 2.5 or more is more preferable.
 なお、アルコール(a1)中の水酸基に対する上記ポリイソシアネート(a2)中のイソシアネート基の当量比(イソシアネート基/水酸基)は、アルコール(a1)中の水酸基数をポリイソシアネート(a2)中のイソシアネート基数で除して求める。 In addition, the equivalent ratio (isocyanate group / hydroxyl group) of the isocyanate group in the polyisocyanate (a2) to the hydroxyl group in the alcohol (a1) is the number of hydroxyl groups in the alcohol (a1) by the number of isocyanate groups in the polyisocyanate (a2). Divide and seek.
 アルコール(a1)中の水酸基数は下記式に基づいて算出される。なお、水酸基価は、JIS K 1557-1:2007(ISO 14900:2001)「プラスチック-ポリウレタン原料ポリオール試験方法-第1部:水酸基価の求め方」の4.2 B法に準拠して測定して得られた値をいう。
 アルコール(a1)中の水酸基数
 =原料となるモノマー中におけるアルコール(a1)の含有量×水酸基価
   /56100
The number of hydroxyl groups in the alcohol (a1) is calculated based on the following formula. The hydroxyl value was measured according to JIS K 1557-1: 2007 (ISO 14900: 2001) “Plastics—Polyurethane raw material polyol test method—Part 1: Determination of hydroxyl value”, method B. This is the value obtained.
Number of hydroxyl groups in alcohol (a1) = content of alcohol (a1) in monomer as raw material × hydroxyl value / 56100
 ポリイソシアネート(a2)中のイソシアネート基数は下記式に基づいて算出される。イソシアネート当量は、ポリイソシアネートの分子量を一分子中のイソシアネート基の数で除した値をいう。具体的には、JIS K1603に準拠して測定された値をいう。
 ポリイソシアネート(a2)中のイソシアネート基数
 =原料となるモノマー中におけるポリイソシアネート(a2)の含有量
    /イソシアネート当量
The number of isocyanate groups in the polyisocyanate (a2) is calculated based on the following formula. The isocyanate equivalent refers to a value obtained by dividing the molecular weight of polyisocyanate by the number of isocyanate groups in one molecule. Specifically, it means a value measured according to JIS K1603.
Number of isocyanate groups in polyisocyanate (a2) = content of polyisocyanate (a2) in monomer as raw material / isocyanate equivalent
 ウレタン樹脂(A)の重量平均分子量は5000~100000が好ましく、5000~50000がより好ましく、10000~25000が特に好ましい。ウレタン樹脂(A)の重量平均分子量が5000以上であると、硬化性組成物の硬化物の電気絶縁性及び耐亀裂性が向上する。ウレタン樹脂(A)の重量平均分子量が100000以下であると、硬化性組成物が低粘度となり取扱性が向上する。 The weight average molecular weight of the urethane resin (A) is preferably from 5,000 to 100,000, more preferably from 5,000 to 50,000, particularly preferably from 10,000 to 25,000. When the weight average molecular weight of the urethane resin (A) is 5000 or more, the electrical insulation and crack resistance of the cured product of the curable composition are improved. When the weight average molecular weight of the urethane resin (A) is 100,000 or less, the curable composition has a low viscosity and the handleability is improved.
 ウレタン樹脂(A)の重量平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC)によって測定された分子量をポリスチレン換算した値をいう。例えば、下記の測定条件にて測定することができる。
装置:東ソー社製 HLC-8220GP
カラム:東ソー社製
    商品名「TSKgel SuperHZM-H」2本
カラム温度:40℃
溶離液:テトラヒドロフラン
検出:RI
検量線用標準ポリスチレン:東ソー社製 商品名「TSKgel 標準ポリスチレン」
The weight average molecular weight of the urethane resin (A) refers to a value obtained by converting the molecular weight measured by gel permeation chromatography (GPC) into polystyrene. For example, it can be measured under the following measurement conditions.
Equipment: HLC-8220GP manufactured by Tosoh Corporation
Column: product name “TSKgel SuperHZM-H” manufactured by Tosoh Corporation Column temperature: 40 ° C.
Eluent: Tetrahydrofuran Detection: RI
Standard polystyrene for calibration curve: Trade name “TSKgel standard polystyrene” manufactured by Tosoh Corporation
 ウレタン樹脂(A)中におけるポリイソシアネート(a2)成分の含有量は、1~99質量%が好ましく、5~80質量%がより好ましく、15~70質量%が特に好ましい。 The content of the polyisocyanate (a2) component in the urethane resin (A) is preferably 1 to 99% by mass, more preferably 5 to 80% by mass, and particularly preferably 15 to 70% by mass.
 ウレタン樹脂(A)の製造は公知の重合方法を用いればよい。具体的には、ポリオール(a1-1)及び必要に応じて水酸基含有(メタ)アクリレート(a1-2)を含むアルコール(a1)及びポリイソシアネート(a2)をアルコール(a1)中の水酸基に対するポリイソシアネート(a2)中のイソシアネート基の当量比(イソシアネート基/水酸基)が上述した範囲となるように含有する原料となるモノマーを公知の重合方法にて重合させてウレタン樹脂(A)を製造することができる。なお、ウレタン樹脂(A)の重合は、後述する単官能アルキル(メタ)アクリレート中において行われてもよい。 The urethane resin (A) may be produced using a known polymerization method. Specifically, an alcohol (a1) and a polyisocyanate (a2) containing a polyol (a1-1) and, if necessary, a hydroxyl group-containing (meth) acrylate (a1-2) are converted into a polyisocyanate for the hydroxyl group in the alcohol (a1). The urethane resin (A) can be produced by polymerizing a monomer as a raw material to be contained so that the equivalent ratio of isocyanate groups (isocyanate group / hydroxyl group) in (a2) is in the above-described range by a known polymerization method. it can. The polymerization of the urethane resin (A) may be performed in a monofunctional alkyl (meth) acrylate described later.
 より具体的には、反応容器中に単官能アルキル(メタ)アクリレートを供給した上で、ポリイソシアネート(a2)を供給した後、水分を除去したアルコール(a1)を反応容器中に一括で又は分割して供給し、アルコール(a1)の有する水酸基が実質的になくなるまでポリイソシアネート(a2)と反応させてウレタン樹脂(A)を製造することができる。 More specifically, after supplying the monofunctional alkyl (meth) acrylate into the reaction vessel and supplying the polyisocyanate (a2), the alcohol (a1) from which moisture has been removed is batched or divided into the reaction vessel. The urethane resin (A) can be produced by reacting with the polyisocyanate (a2) until the hydroxyl group of the alcohol (a1) is substantially eliminated.
 ウレタン樹脂(A)の重合は、10~120℃にて0.5~10時間行われることが好ましい。 The polymerization of the urethane resin (A) is preferably performed at 10 to 120 ° C. for 0.5 to 10 hours.
 ウレタン樹脂(A)の重合反応は、必要に応じてウレタン化触媒の存在下にて行われてもよい。ウレタン化触媒としては、例えば、ジブチル錫オキサイド、2-エチルカプロン酸錫、オクチル酸錫、ジブチル錫ジラウレートなどの有機金属化合物などが挙げられる。 The polymerization reaction of the urethane resin (A) may be performed in the presence of a urethanization catalyst as necessary. Examples of the urethanization catalyst include organometallic compounds such as dibutyltin oxide, tin 2-ethylcaproate, tin octylate, and dibutyltin dilaurate.
 硬化性組成物中におけるウレタン樹脂(A)の含有量は、ウレタン樹脂(A)、単官能アルキル(メタ)アクリレート(B)及び光重合開始剤(C)の合計量を100質量%としたとき、15~60質量%が好ましく、30~60質量%が好ましく、35~50質量%がより好ましく、40~48質量%が特に好ましい。ウレタン樹脂(A)の含有量が15質量%以上であると、硬化性組成物の硬化物は、優れた電気絶縁性を有し且つ光硬化が不十分な部分においても優れた耐亀裂性を有する。ウレタン樹脂(A)の含有量が60質量%以下であると、硬化性組成物が低粘度となり取扱性が向上する。 The content of the urethane resin (A) in the curable composition is when the total amount of the urethane resin (A), the monofunctional alkyl (meth) acrylate (B) and the photopolymerization initiator (C) is 100% by mass. 15 to 60% by mass, preferably 30 to 60% by mass, more preferably 35 to 50% by mass, and particularly preferably 40 to 48% by mass. When the content of the urethane resin (A) is 15% by mass or more, the cured product of the curable composition has excellent electrical insulation and excellent crack resistance even in a portion where photocuring is insufficient. Have. When the content of the urethane resin (A) is 60% by mass or less, the curable composition has a low viscosity and the handleability is improved.
〔単官能(メタ)アクリレート〕
 硬化性組成物は、環構造を含まず且つ炭素数が10個以下のアルキル基を有する単官能(メタ)アクリレート(B)を含有している。単官能とは、一分子中にラジカル重合性不飽和結合を1個のみ有していることをいう。アルキル基とは、脂肪族飽和炭化水素から水素原子1個を除いた残りの原子団であって-Cn2n+1で表され、窒素及び硫黄などのヘテロ原子を含まない。環構造とは、炭素及びその他の原子(窒素、硫黄など)が形成する全ての環状構造を含む。
[Monofunctional (meth) acrylate]
The curable composition contains a monofunctional (meth) acrylate (B) that does not contain a ring structure and has an alkyl group having 10 or less carbon atoms. Monofunctional means having only one radical polymerizable unsaturated bond in one molecule. The alkyl group is a remaining atomic group obtained by removing one hydrogen atom from an aliphatic saturated hydrocarbon, represented by —C n H 2n + 1 , and does not include heteroatoms such as nitrogen and sulfur. The ring structure includes all cyclic structures formed by carbon and other atoms (nitrogen, sulfur, etc.).
 環構造を含まず且つ炭素数が10個以下のアルキル基を有する単官能(メタ)アクリレート(B)を含有しているので、硬化性組成物の硬化物は、優れた電気絶縁性を有し且つ光硬化が不十分な部分においても優れた耐亀裂性を有し、更に、硬化性組成物は優れた湿気硬化性を有する。 Since it contains a monofunctional (meth) acrylate (B) that does not contain a ring structure and has an alkyl group having 10 or less carbon atoms, the cured product of the curable composition has excellent electrical insulation. In addition, it has excellent crack resistance even in a portion where photocuring is insufficient, and the curable composition has excellent moisture curability.
 単官能(メタ)アクリレート(B)はイソシアネート基と反応する官能基を含まないことが好ましい。イソシアネート基と反応する官能基としては、例えば、水酸基、アミノ基、チオール基、カルボキシル基などが挙げられる。 Monofunctional (meth) acrylate (B) preferably does not contain a functional group that reacts with an isocyanate group. Examples of the functional group that reacts with the isocyanate group include a hydroxyl group, an amino group, a thiol group, and a carboxyl group.
 単官能(メタ)アクリレート(B)が有するアルキル基の炭素数は、10個以下であり、2~10個が好ましく、4~9個がより好ましく、6~9個が特に好ましい。アルキル基の炭素数が10個以下であると、硬化性組成物の硬化物は優れた電気絶縁性を有し且つ且つ光硬化が不十分な部分においても優れた耐亀裂性を有し、更に、硬化性組成物の湿気硬化性が向上する。アルキル基の炭素数が2個以上であると、硬化性組成物からの臭気を抑制することができる。 The alkyl group of the monofunctional (meth) acrylate (B) has 10 or less carbon atoms, preferably 2 to 10, more preferably 4 to 9, and particularly preferably 6 to 9. When the carbon number of the alkyl group is 10 or less, the cured product of the curable composition has excellent electrical insulation and excellent crack resistance even in a portion where photocuring is insufficient, The moisture curability of the curable composition is improved. The odor from a curable composition can be suppressed as carbon number of an alkyl group is 2 or more.
 単官能(メタ)アクリレート(B)としては、例えば、n-ヘキシル(メタ)アクリレート、2-エチルヘキシル(メタ)アクリレート、n-ブチル(メタ)アクリレート、n-オクチル(メタ)アクリレートなどのアルキル(メタ)アクリレートなどのアルキル(メタ)アクリレートが挙げられ、アルキル(メタ)アクリレートが好ましく、アルキルアクリレートがより好ましい。又、n-オクチル(メタ)アクリレートが好ましく、n-オクチルアクリレートがより好ましい。なお、単官能(メタ)アクリレートは、単独で用いられても二種以上が併用されてもよい。 Examples of the monofunctional (meth) acrylate (B) include alkyl (meta) such as n-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-butyl (meth) acrylate, and n-octyl (meth) acrylate. ) Alkyl (meth) acrylates such as acrylate, alkyl (meth) acrylate is preferred, and alkyl acrylate is more preferred. Further, n-octyl (meth) acrylate is preferable, and n-octyl acrylate is more preferable. In addition, monofunctional (meth) acrylate may be used independently or 2 or more types may be used together.
 硬化性組成物中における単官能(メタ)アクリレート(B)の含有量は、ウレタン樹脂(A)、単官能アルキル(メタ)アクリレート(B)及び光重合開始剤(C)の合計量を100質量%としたとき、30~70質量%が好ましく、40~65質量%がより好ましく、45~60質量%が特に好ましい。単官能(メタ)アクリレート(B)の含有量が30質量%以上であると、硬化性組成物の光硬化性が向上すると共に、硬化性組成物の硬化物が優れた耐亀裂性を有する。単官能(メタ)アクリレート(B)の含有量が70質量%以下であると、光硬化が不十分な部分においても優れた電気絶縁性及び耐亀裂性を有する硬化物を得ることができる。 The content of the monofunctional (meth) acrylate (B) in the curable composition is 100 masses of the total amount of the urethane resin (A), the monofunctional alkyl (meth) acrylate (B) and the photopolymerization initiator (C). % Is preferably 30 to 70% by mass, more preferably 40 to 65% by mass, and particularly preferably 45 to 60% by mass. When the content of the monofunctional (meth) acrylate (B) is 30% by mass or more, the photocurability of the curable composition is improved and the cured product of the curable composition has excellent crack resistance. When the content of the monofunctional (meth) acrylate (B) is 70% by mass or less, a cured product having excellent electrical insulation and crack resistance can be obtained even in a portion where photocuring is insufficient.
〔多官能(メタ)アクリレート(D)〕
 硬化性組成物中には多官能(メタ)アクリレート(D)が含有されていてもよい。多官能(メタ)アクリレート(D)を含有していることによって、硬化性組成物の硬化物の電気絶縁性が向上する。多官能とは、一分子中にラジカル重合性不飽和結合を2個以上有していることをいう。
[Multifunctional (meth) acrylate (D)]
The curable composition may contain a polyfunctional (meth) acrylate (D). By containing polyfunctional (meth) acrylate (D), the electrical insulation of the hardened | cured material of a curable composition improves. Polyfunctional means having two or more radically polymerizable unsaturated bonds in one molecule.
 多官能(メタ)アクリレート(D)はイソシアネート基と反応する官能基を含まないことが好ましい。イソシアネート基と反応する官能基としては、水酸基、アミノ基、チオール基、カルボキシル基などが挙げられる。 The polyfunctional (meth) acrylate (D) preferably does not contain a functional group that reacts with an isocyanate group. Examples of the functional group that reacts with the isocyanate group include a hydroxyl group, an amino group, a thiol group, and a carboxyl group.
 多官能(メタ)アクリレート(D)としては、特に限定されず、例えば、1,3-ブチレングリコールジ(メタ)アクリレート、1,4-ブタンジオールジ(メタ)アクリレート、1、6-ヘキサンジオールジ(メタ)アクリレート、エチレングリコールジ(メタ)アクリレート、プロピレングリコールジ(メタ)アクリレート、ネオペンチルグリコールジ(メタ)ジアクリレートなどのアルキレングリコールジ(メタ)アクリレート、トリエチレングリコールジ(メタ)アクリレート、トリプロピレングリコールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、ポリプロピレングリコールジ(メタ)アクリレートなどのポリオキシアルキレングリコールジ(メタ)アクリレート、ビスフェノールA又は水素化ビスフェノールAのアルキレンオキサイド付加物のジアクリレート類、トリメチロールプロパントリ(メタ)アクリレート、ペンタエリスリトールテトラアクリレート、ジトリメチロールテトラアクリレート、ジペンタエリスリトールヘキサアクリレートなどが挙げられ、アルキレングリコールジ(メタ)アクリレートが好ましく、1,3-ブチレングリコールジ(メタ)アクリレートがより好ましく、1,3-ブチレングリコールジアクリレートが特に好ましい。多官能(メタ)アクリレートは、単独で用いられても二種以上が併用されてもよい。 The polyfunctional (meth) acrylate (D) is not particularly limited. For example, 1,3-butylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di Alkylene glycol di (meth) acrylates such as (meth) acrylate, ethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, neopentyl glycol di (meth) diacrylate, triethylene glycol di (meth) acrylate, tri Polyoxyalkylene glycol di (meth) acrylate such as propylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, bisphenol A or hydrogenated Examples include diacrylates of adducts of alkylene oxide of Sphenol A, trimethylolpropane tri (meth) acrylate, pentaerythritol tetraacrylate, ditrimethylol tetraacrylate, dipentaerythritol hexaacrylate, etc., and alkylene glycol di (meth) acrylate is 1,3-butylene glycol di (meth) acrylate is more preferable, and 1,3-butylene glycol diacrylate is particularly preferable. Polyfunctional (meth) acrylate may be used independently or 2 or more types may be used together.
 硬化性組成物中における多官能(メタ)アクリレート(D)の含有量は、単官能(メタ)アクリレート(B)及び多官能(メタ)アクリレート(D)の総量に対して15質量%以下が好ましく、10質量%以下がより好ましく、6.5質量%以下が特に好ましい。多官能(メタ)アクリレートの含有量が15質量%以下であると、硬化性組成物の硬化物は優れた電気絶縁性を有し且つ且つ光硬化が不十分な部分においても優れた耐亀裂性を有し、更に、硬化性組成物の湿気硬化性が向上する。 The content of the polyfunctional (meth) acrylate (D) in the curable composition is preferably 15% by mass or less based on the total amount of the monofunctional (meth) acrylate (B) and the polyfunctional (meth) acrylate (D). 10 mass% or less is more preferable, and 6.5 mass% or less is especially preferable. When the content of the polyfunctional (meth) acrylate is 15% by mass or less, the cured product of the curable composition has excellent electrical insulation and excellent crack resistance even in a portion where photocuring is insufficient. Furthermore, the moisture curability of the curable composition is improved.
〔光重合開始剤(C)〕
 硬化性組成物は、光重合開始剤(C)を含有している。光重合開始剤は、紫外線や電子線などの活性エネルギー線を照射することによって分解し、ラジカルを発生させて、硬化性組成物の光硬化反応を開始させることができるものであれば、特に限定されない。
[Photopolymerization initiator (C)]
The curable composition contains a photopolymerization initiator (C). The photopolymerization initiator is particularly limited as long as it can be decomposed by irradiating active energy rays such as ultraviolet rays and electron beams to generate radicals and initiate the photocuring reaction of the curable composition. Not.
 光重合開始剤(C)としては、特に限定されず、例えば、ベンゾイン、ベンゾインエチルエーテル、ベンゾフェノン、アシルフォスフィンオキサイド;2,2-ジメトキシ-1,2-ジフェニルエタン-1-オンなどのアルキルフェノン化合物;2-メチル-1[4-(メチルチオ)フェニル]-2-モルフォリノプロパン-1-オン、2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)-ブタン-1-オン及び2-ジメチルアミノ-2-(4-メチル-ベンジル)-1-(4-モルフォリン-4-イル-フェニル)-ブタン-1-オンなどのα-アミノアルキルフェノン化合物;ベンゾフェノン、2-メチルベンゾフェノン、3-メチルベンゾフェノン、4-メチルベンゾフェノン、2,4,6-トリメチルベンゾフェノン、4-フェニルベンゾフェノン、4-(メチルフェニルチオ)フェニルフェニルメタン、メチル-2-ベンゾフェノン、1-[4-(4-ベンゾイルフェニルスルファニル)フェニル]-2-メチル-2-(4-メチルフェニルスルフォニル)プロパンー1-オン、4,4‘-ビス(ジメチルアミノ)ベンゾフェノン、4,4‘-ビス(ジエチルアミノ)ベンゾフェノン、N,N′-テトラメチル-4,4′-ジアミノベンゾフェノン、N,N′-テトラエチル-4,4′-ジアミノベンゾフェノン及び4-メトキシ-4′-ジメチルアミノベンゾフェノンなどのベンゾフェノン化合物;ビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド及び2,4,6-トリメチルベンゾイル-ジフェニル-フォスフィンオキサイドなどのアシルフォスフィンオキサイド化合物;オキシフェニル酢酸;フェニルグリオキシリックアシッドメチルエステルなどのフェニルグリオキシル酸エステル化合物;ビス(η5-2,4-シクロペンタジエン-1-イル)-ビス(2,6-ジフルオロ-3-(1H-ピロール-1-イル)-フェニル)チタニウムなどのチタノセン化合物;1,2-オクタンジオン,1-[4-(フェニルチオ)-,2-(O-ベンゾイルオキシム)及びエタノン,1-[9-(エチル)-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-,1-(O-アセチルオキシム)などのオキシムエステル化合物などが挙げられる。 The photopolymerization initiator (C) is not particularly limited, and examples thereof include benzoin, benzoin ethyl ether, benzophenone, acylphosphine oxide; and alkylphenones such as 2,2-dimethoxy-1,2-diphenylethane-1-one. Compound; 2-methyl-1 [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one And α-aminoalkylphenone compounds such as 2-dimethylamino-2- (4-methyl-benzyl) -1- (4-morpholin-4-yl-phenyl) -butan-1-one; benzophenone, 2-methyl Benzophenone, 3-methylbenzophenone, 4-methylbenzophenone, 2,4,6-trimethylbenzo Phenone, 4-phenylbenzophenone, 4- (methylphenylthio) phenylphenylmethane, methyl-2-benzophenone, 1- [4- (4-benzoylphenylsulfanyl) phenyl] -2-methyl-2- (4-methylphenyl) Sulphonyl) propan-1-one, 4,4′-bis (dimethylamino) benzophenone, 4,4′-bis (diethylamino) benzophenone, N, N′-tetramethyl-4,4′-diaminobenzophenone, N, N ′ Benzophenone compounds such as tetraethyl-4,4'-diaminobenzophenone and 4-methoxy-4'-dimethylaminobenzophenone; bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide and 2,4,6-trimethyl Benzoyl-diphenyl-phosphie Acylphosphine oxide compounds such as oxides; Oxyphenylacetic acid; Phenylglyoxylic acid ester compounds such as phenylglyoxylic acid methyl ester; Bis (η5-2,4-cyclopentadien-1-yl) -bis (2,6 -Titanocene compounds such as -difluoro-3- (1H-pyrrol-1-yl) -phenyl) titanium; 1,2-octanedione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime) and ethanone Oxime ester compounds such as 1- [9- (ethyl) -6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (O-acetyloxime).
 光重合開始剤(C)は、例えば、BASFジャパン社製から商品名「Irgacure 184」、「Irgacure 907」、「Irgacure 819」、「Irgacure TPO」、「Irgacure 651」、「Irgacure 369」、「Irgacure 379」、「Irgacure 379EG」、「Irgacure MBF」、「Irgacure 784」、「Irgacure OXE01」及び「Irgacure OXE02」にて市販されている。なお、光重合開始剤(C)は、単独で用いられても二種以上が併用されてもよい。 Photopolymerization initiators (C) are, for example, trade names “Irgacure 184”, “Irgacure 907”, “Irgacure 819”, “Irgacure TPO”, “Irgacure 651”, “Irgacure 369”, “Irgacure” manufactured by BASF Japan. 379 ”,“ Irgacure 379EG ”,“ Irgacure MBF ”,“ Irgacure 784 ”,“ Irgacure OXE01 ”and“ Irgacure OXE02 ”. In addition, a photoinitiator (C) may be used independently or 2 or more types may be used together.
 硬化性組成物中における光重合開始剤(C)の含有量は、ウレタン樹脂(A)、単官能アルキル(メタ)アクリレート(B)及び光重合開始剤(C)の合計量を100質量%としたとき、1~15質量%が好ましく、2~8質量%がより好ましく、3~7質量%が特に好ましい。光重合開始剤(C)の含有量が1質量%以上であると、硬化性組成物の光硬化性が向上する。光重合開始剤(C)の含有量が10質量%以下であると、硬化性組成物の硬化物は、優れた電気絶縁性及び耐亀裂性を有している。 The content of the photopolymerization initiator (C) in the curable composition is 100% by mass of the total amount of the urethane resin (A), the monofunctional alkyl (meth) acrylate (B) and the photopolymerization initiator (C). 1 to 15% by mass is preferable, 2 to 8% by mass is more preferable, and 3 to 7% by mass is particularly preferable. The photocurability of a curable composition improves that content of a photoinitiator (C) is 1 mass% or more. When the content of the photopolymerization initiator (C) is 10% by mass or less, the cured product of the curable composition has excellent electrical insulation and crack resistance.
〔その他の成分〕
 硬化性組成物は、ウレタン樹脂(A)、単官能(メタ)アクリレート(B)及び光重合開始剤(C)を必須の成分とするが、必要に応じて、湿気硬化触媒(F)、重合禁止剤、酸化防止剤、消泡剤、レベリング剤、シランカップリング剤及び金属不活性化剤などの添加剤、並びに、溶剤が含有されていてもよい。
[Other ingredients]
The curable composition comprises a urethane resin (A), a monofunctional (meth) acrylate (B) and a photopolymerization initiator (C) as essential components, but if necessary, a moisture curing catalyst (F), polymerization An inhibitor, an antioxidant, an antifoaming agent, a leveling agent, an additive such as a silane coupling agent and a metal deactivator, and a solvent may be contained.
 湿気硬化触媒(F)としては、特に限定されず、例えば、有機金属化合物、3級アミン化合物などを挙げることができる。有機金属化合物としては、例えば、ジブチル錫ジラウレートなどの有機錫化合物、有機鉄化合物、有機亜鉛化合物、有機チタン化合物、有機アルミニウム化合物、有機ジルコニウム化合物及び有機ビスマス化合物などが挙げられる。なお、湿気硬化触媒(F)は、単独で用いられても二種以上が併用されてもよい。湿気硬化触媒(F)の配合割合は、特に限定されず、目的及び用途に応じて適宜調整されればよい。湿気効果触媒(F)は、ウレタン化触媒としてウレタン樹脂(A)の合成に用いてもよい。 The moisture curing catalyst (F) is not particularly limited, and examples thereof include organometallic compounds and tertiary amine compounds. Examples of the organic metal compound include organic tin compounds such as dibutyltin dilaurate, organic iron compounds, organic zinc compounds, organic titanium compounds, organic aluminum compounds, organic zirconium compounds, and organic bismuth compounds. In addition, a moisture hardening catalyst (F) may be used independently, or 2 or more types may be used together. The blending ratio of the moisture curing catalyst (F) is not particularly limited, and may be appropriately adjusted according to the purpose and application. The moisture effect catalyst (F) may be used for the synthesis of the urethane resin (A) as a urethanization catalyst.
 有機錫化合物としては、例えば、ジブチル錫ジラウレート、ジブチル錫マレエート、ジブチル錫ジアセテート、ジブチル錫ジアセトアセトナート、オクチル酸錫、ナフテン酸錫、ラウリン酸錫及びフェルザチック酸錫などの錫カルボン酸塩、並びにジブチル錫オキサイドとフタル酸エステルとの反応物などが挙げられる。 Examples of the organic tin compound include tin carboxylates such as dibutyltin dilaurate, dibutyltin maleate, dibutyltin diacetate, dibutyltin diacetoacetonate, tin octylate, tin naphthenate, tin laurate and tin felzatic acid. And a reaction product of dibutyltin oxide and phthalate.
 有機鉄化合物としては、例えば、トリス(アセチルアセトナート)鉄、トリス(2,2,6,6-テトラメチル-3,5-ヘプタンジオナート)鉄、トリス(テトラフルオロアセチルアセトナート)鉄、塩化第二鉄、トリス(2-エチルヘキサン酸)鉄、ナフテン酸鉄、トリエトキシ鉄、トリイソプロポキシ鉄などが挙げられる。 Examples of the organic iron compound include tris (acetylacetonato) iron, tris (2,2,6,6-tetramethyl-3,5-heptanedionate) iron, tris (tetrafluoroacetylacetonato) iron, chloride Examples thereof include ferric iron, tris (2-ethylhexanoic acid) iron, iron naphthenate, triethoxy iron, and triisopropoxy iron.
 有機亜鉛化合物としては、例えば、ビス(アセチルアセトナート)亜鉛、ビス(2,2,6,6-テトラメチル-3,5-ヘプタンジオナート)亜鉛、ビス(テトラフルオロアセチルアセトナート)亜鉛、ビス(2-エチルヘキサン酸)亜鉛、ナフテン酸亜鉛、ジエトキシ亜鉛、ジイソプロポキシ亜鉛などが挙げられる。 Examples of the organic zinc compound include bis (acetylacetonato) zinc, bis (2,2,6,6-tetramethyl-3,5-heptanedionate) zinc, bis (tetrafluoroacetylacetonato) zinc, bis (2-ethylhexanoic acid) zinc, zinc naphthenate, diethoxy zinc, diisopropoxy zinc and the like can be mentioned.
 有機チタン化合物としては、例えば、テトラブチルチタネート及びテトラプロピルチタネートなどのチタン酸エステル、並びにチタンテトラアセチルアセトナートなどのチタンキレート化合物などが挙げられる。 Examples of the organic titanium compound include titanic acid esters such as tetrabutyl titanate and tetrapropyl titanate, and titanium chelate compounds such as titanium tetraacetylacetonate.
 有機アルミニウム化合物としては、例えば、アルミニウムトリスアセチルアセトナート、アルミニウムトリスエチルアセトアセテート及びジイソプロポキシアルミニウムエチルアセトアセテートなどが挙げられる。 Examples of the organoaluminum compound include aluminum trisacetylacetonate, aluminum trisethylacetoacetate, diisopropoxyaluminum ethylacetoacetate, and the like.
 有機ジルコニウム化合物としては、例えば、ジルコニウムテトラアセチルアセトナートなどのジルコニウムキレート化合物などが挙げられる。 Examples of the organic zirconium compound include zirconium chelate compounds such as zirconium tetraacetylacetonate.
 有機ビスマス化合物としては、例えば、ビスマス-トリス(ネオデカノエート)、ビスマス-トリス(2-エチルヘキソエート)及びオクチル酸ビスマスなどが挙げられる。 Examples of the organic bismuth compound include bismuth-tris (neodecanoate), bismuth-tris (2-ethylhexoate), and bismuth octylate.
 3級アミン化合物としては、例えば、トリエチルアミンなどのトリアルキルアミン;テトラメチルエチレンジアミン及びテトラメチルヘキサンジアミンなどのテトラアルキルアルキレンジアミン;ペンタメチルジエチレントリアミンなどのペンタアルキルジアルキレントリアミン;トリメチルアミノエチルピペラジン及びジメチルピペラジンなどのピペラジン;1,2-ジメチルイミダゾールなどのN-アルキルイミダゾール;ビス(ジメチルアミノエチル)エーテル;トリエチレンジアミン〔1,4-ジアザビシクロ[2,2,2]オクタン(DABCO)〕;N-メチルモルホリン;1,8-ジアザビシクロ[5,4,0]ウンデセン-7(DBU)並びに2,4,6-トリス(ジメチルアミノメチル)フェノールなどが挙げられる。 Examples of tertiary amine compounds include trialkylamines such as triethylamine; tetraalkylalkylenediamines such as tetramethylethylenediamine and tetramethylhexanediamine; pentaalkyldialkylenetriamines such as pentamethyldiethylenetriamine; trimethylaminoethylpiperazine and dimethylpiperazine Piperazines; N-alkylimidazoles such as 1,2-dimethylimidazole; bis (dimethylaminoethyl) ether; triethylenediamine [1,4-diazabicyclo [2,2,2] octane (DABCO)]; N-methylmorpholine; Examples include 1,8-diazabicyclo [5,4,0] undecene-7 (DBU) and 2,4,6-tris (dimethylaminomethyl) phenol.
 重合禁止剤としては、例えば、ハイドロキノン、ハイドロキノンモノメチルエーテル、ベンゾキノン、p-t-ブチルカテコール及び2,6-ジ-t-ブチル-4-メチルフェノールなどが挙げられる。なお、重合禁止剤は、単独で用いられても二種以上が併用されてもよい。重合禁止剤の配合割合は、特に限定されず、目的及び用途に応じて適宜調整されればよい。 Examples of the polymerization inhibitor include hydroquinone, hydroquinone monomethyl ether, benzoquinone, pt-butylcatechol and 2,6-di-t-butyl-4-methylphenol. In addition, a polymerization inhibitor may be used independently or 2 or more types may be used together. The blending ratio of the polymerization inhibitor is not particularly limited, and may be appropriately adjusted according to the purpose and application.
 酸化防止剤としては、例えば、フェノール系酸化防止剤、リン系酸化防止剤、硫黄系酸化防止剤などが挙げられる。なお、酸化防止剤は、単独で用いられても二種以上が併用されてもよい。酸化防止剤の配合割合は、特に限定されず、目的及び用途に応じて適宜調整されればよい。フェノール系酸化防止剤は、例えば、アデカ社から商品名「アデカスタブ AO-20」、「アデカスタブ AO-60」及び「アデカスタブ AO-80」、BASFジャパン社から商品名「Irganox 1010」、「Irganox 1076」、「Irganox 1135」及び「Irganox 1520L」にて市販されている。リン系酸化防止剤は、例えば、アデカ社から商品名「アデカスタブ PEP-4C」及び「アデカスタブ 2112」、BASFジャパン社から商品名「Irgafos 168」にて市販されている。硫黄系酸化防止剤は、例えば、アデカ社から商品名「アデカスタブ AO-412S」及び「アデカスタブ AO-503」、BASFジャパン社から商品名「Irganox PS 800 FL」及び「Irganox PS 802 FL」にて市販されている。 Examples of the antioxidant include a phenol-based antioxidant, a phosphorus-based antioxidant, and a sulfur-based antioxidant. In addition, an antioxidant may be used independently or 2 or more types may be used together. The mixing ratio of the antioxidant is not particularly limited, and may be appropriately adjusted according to the purpose and application. The phenolic antioxidants are, for example, trade names “Adeka Stub AO-20”, “Adeka Stub AO-60” and “Adeka Stub AO-80” from Adeka, and trade names “Irganox 1010” and “Irganox 1076” from BASF Japan. , "Irganox 1135" and "Irganox 1520L". Phosphorous antioxidants are commercially available, for example, from Adeka under the trade names “Adekastab PEP-4C” and “Adekastab 2112”, and from BASF Japan under the trade name “Irgafos 168”. Sulfur-based antioxidants are commercially available, for example, from Adeka under the trade names “Adekastab AO-412S” and “Adekastab AO-503”, and from BASF Japan under the trade names “Irganox PS 800 FL” and “Irganox PS 802 FL” Has been.
 消泡剤は、例えば、ビックケミージャパン社から商品名「BYK-054」、「BYK-057」、「BYK-065」、「BYK-066N」、「BYK-067A」及び「BYK-1794」、エボニック社から商品名「TEGO Airex 904W」、「TEGO Airex 910」、「TEGO Airex 920」、「TEGO Airex 931」、「TEGO Airex 945」、「TEGO Foamex 833」及び「TEGO Twin 4000」にて市販されている。なお、消泡剤は、単独で用いられても二種以上が併用されてもよい。消泡剤の配合割合は、特に限定されず、目的及び用途に応じて適宜調整されればよい。 Antifoaming agents are, for example, trade names “BYK-054”, “BYK-057”, “BYK-065”, “BYK-066N”, “BYK-067A” and “BYK-1794” from BYK Japan Trade names “TEGO Airex 904W”, “TEGO Airex 910”, “TEGO Airex 920”, “TEGO Airex 931”, “TEGO Airex 945”, “TEGO Foamex 833” and “TEGO Foamex 833T” and “TEGO Fairex 833T” are available from Evonik. ing. In addition, an antifoamer may be used independently or 2 or more types may be used together. The mixing ratio of the antifoaming agent is not particularly limited, and may be appropriately adjusted according to the purpose and application.
 レベリング剤としては、例えば、シリコーン系レベリング剤、アクリル系レベリング剤、フッ素系レベリング剤などが挙げられる。なお、レベリング剤は、単独で用いられても二種以上が併用されてもよい。レベリング剤の配合割合は、特に限定されず、目的及び用途に応じて適宜調整されればよい。シリコーン系レベリング剤としては、例えば、ビックケミージャパン社から商品名「BYK-300」、「BYK-302」、「BYK-307」、「BYK-320」、「BYK-322」、「BYK-325」、「BYK-330」、「BYK-331」、「BYK-333」、「BYK-345」、「BYK-370」、「BYK-377」、「BYK-378」、「BYK-3455」、「BYK-UV3500」及び「BYK-UV3510」、エボニック社から商品名「TEGO Flow 425」、「TEGO Glide 100」、「TEGO Glide 110」及び「TEGO Glide 432」、東レ・ダウコーニング社から商品名「Dow Corning 56 Additive」及び「Dow Corning 57 Additive」にて市販されている。アクリル系レベリング剤は、例えば、ビックケミージャパン社から商品名「BYK-350」、「BYK-354」、「BYK-356」及び「BYK-3441」、エボニック社から商品名「TEGO Flow 370」及び「TEGO Flow ZFS 460」にて市販されている。フッ素系レベリング剤としては、例えば、住友スリーエム社から商品名「Novec FC-4430」及び「Novec FC-4432」、ネオス社から商品名「フタージェント 251」、「フタージェント FTX-218」、「フタージェント 710FL」及び「フタージェント 601AD」にて市販されている。 Examples of leveling agents include silicone leveling agents, acrylic leveling agents, and fluorine leveling agents. In addition, a leveling agent may be used independently or 2 or more types may be used together. The mixing ratio of the leveling agent is not particularly limited, and may be appropriately adjusted according to the purpose and application. Examples of the silicone leveling agent include trade names “BYK-300”, “BYK-302”, “BYK-307”, “BYK-320”, “BYK-322”, “BYK-325” from BYK Japan. ”,“ BYK-330 ”,“ BYK-331 ”,“ BYK-333 ”,“ BYK-345 ”,“ BYK-370 ”,“ BYK-377 ”,“ BYK-378 ”,“ BYK-3455 ”, “BYK-UV3500” and “BYK-UV3510”, trade names “TEGO Flow 425”, “TEGO Glide 100”, “TEGO Glide 110” and “TEGO Glide 432” from Evonik, and trade names “Togo Dow Corning” "Dow Corning 56 Additive" and "Dow C It is commercially available in the rning 57 Additive ". Acrylic leveling agents are, for example, trade names “BYK-350”, “BYK-354”, “BYK-356” and “BYK-3441” from Big Chemie Japan, and trade names “TEGO Flow 370” and Evonik. It is commercially available from “TEGO Flow ZFS 460”. Fluorine-based leveling agents include, for example, trade names “Novec FC-4430” and “Novec FC-4432” from Sumitomo 3M, and trade names “Fategent 251”, “Factent FTX-218” and “Futter” from Neos. It is commercially available at “Gent 710FL” and “Fargent 601AD”.
 シランカップリング剤は、例えば、信越シリコーン社から商品名「KBM-1003」、「KBE-1003」、「KBM-503」、「KBM-5103」及び「KBE-9007」にて市販されている。なお、シランカップリング剤は、単独で用いられても二種以上が併用されてもよい。シランカップリング剤の配合割合は、特に限定されず、目的及び用途に応じて適宜調整されればよい。 Silane coupling agents are commercially available, for example, from Shin-Etsu Silicone under the trade names “KBM-1003”, “KBE-1003”, “KBM-503”, “KBM-5103” and “KBE-9007”. In addition, a silane coupling agent may be used independently or 2 or more types may be used together. The blending ratio of the silane coupling agent is not particularly limited, and may be appropriately adjusted according to the purpose and application.
 金属不活性化剤は、例えば、アデカ社から商品名「アデカスタブ CDA-1」、「アデカスタブ CDA-1M」、「アデカスタブ CDA-6」及び「アデカスタブ CDA-10」、BASFジャパン社から「Irganox MD1024」、城北化学工業社から商品名「BT-120」、「BT-LX」及び「TT-LX」にて市販されている。 Metal deactivators are, for example, trade names “Adekastab CDA-1”, “Adekastab CDA-1M”, “Adekastab CDA-6” and “Adekastab CDA-10” from Adeka, and “Irganox MD1024” from BASF Japan. These are commercially available from Johoku Chemical Industry Co., Ltd. under the trade names “BT-120”, “BT-LX”, and “TT-LX”.
 溶剤としては、例えば、ペンタン、ヘキサン、ヘプタン、シクロヘキサンなどの炭化水素類、アセトン、メチルエチルケトン、メチルイソブチルケトン、シクロヘキサノンなどのケトン類、酢酸エチル、酢酸ブチルなどのエステル類などが挙げられる。なお、溶剤は、単独で用いられても二種以上が併用されてもよい。 Examples of the solvent include hydrocarbons such as pentane, hexane, heptane, and cyclohexane, ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone, and esters such as ethyl acetate and butyl acetate. In addition, a solvent may be used independently or 2 or more types may be used together.
 硬化性組成物は、ウレタン樹脂(A)、単官能(メタ)アクリレート(B)及び光重合開始剤(C)並びにその他の添加剤を汎用の攪拌機を用いて攪拌混合することによって製造することができる。 The curable composition can be produced by stirring and mixing the urethane resin (A), the monofunctional (meth) acrylate (B), the photopolymerization initiator (C), and other additives using a general-purpose stirrer. it can.
 硬化性組成物は、例えば、コンフォーマルコーティング剤として用いることができ、具体的には、電子回路基板を水、湿気及び埃などから保護するために、はんだ付け後の電子回路基板に対し電気絶縁処理を施すために用いられる。 The curable composition can be used, for example, as a conformal coating agent, and specifically, electrically insulates the electronic circuit board after soldering in order to protect the electronic circuit board from water, moisture and dust. Used for processing.
 具体的には、基板上に電子部品をはんだ付けすることによって形成された電子回路基板の電子部品上に硬化性組成物を塗布し、電子部品を硬化性組成物によって被覆した状態とする。 Specifically, the curable composition is applied onto the electronic component of the electronic circuit board formed by soldering the electronic component on the substrate, and the electronic component is covered with the curable composition.
 硬化性組成物に活性エネルギー線(例えば、紫外線、電子線など)を照射することによって、単官能(メタ)アクリレート、並びに、必要に応じて含まれている多官能(メタ)アクリレート及びウレタン樹脂(A)の水酸基含有(メタ)アクリレート成分がラジカル重合反応を生じて光硬化する。この光硬化と同時に及び活性エネルギー線の照射後、硬化性組成物は、ウレタン樹脂(A)のイソシアネート基が空気中の湿気と反応することによって架橋反応を生じて湿気硬化して硬化物を生成する。 By irradiating the curable composition with active energy rays (for example, ultraviolet rays, electron beams, etc.), a monofunctional (meth) acrylate, and a polyfunctional (meth) acrylate and a urethane resin (optionally contained) The hydroxyl group-containing (meth) acrylate component A) undergoes a radical polymerization reaction and is photocured. Simultaneously with this photocuring and after irradiation with active energy rays, the curable composition produces a cured product by moisture curing by causing the isocyanate group of the urethane resin (A) to react with moisture in the air. To do.
 このようにして生成された硬化物は、優れた電気絶縁性を有していると共に、活性エネルギー線が照射されない部分や照射が不十分な部分においても十分な耐亀裂性を有しており、更に、硬化物は、優れた外観性(透明性)を有している。従って、硬化性組成物の硬化物は、電子部品を電気絶縁状態を保持しながら、水、埃及び金属粉などの汚染物質から長期間に亘って安定的に保護する。そして、硬化性組成物の硬化物は透明性に優れているので、被覆、保護した後においても電子部品の状態を硬化物を透して容易に視認することができ、電子回路基板のメンテナンスを容易に行うことができる。 The cured product thus produced has excellent electrical insulation, and has sufficient crack resistance even in a portion where the active energy ray is not irradiated or a portion where irradiation is insufficient, Furthermore, the cured product has excellent appearance (transparency). Therefore, the cured product of the curable composition stably protects the electronic component from contaminants such as water, dust and metal powder over a long period of time while maintaining the electrical insulation state. And since the cured product of the curable composition is excellent in transparency, the state of the electronic component can be easily seen through the cured product even after coating and protection, and maintenance of the electronic circuit board can be performed. It can be done easily.
 以下に実施例を挙げて本発明を更に詳細に説明するが、本実施例に何ら限定されるものでない。 Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to the examples.
 硬化性組成物を作製するために用いた化合物を下記に示す。製品中に溶剤を含むものについては、溶剤の種類と化合物の固形分を示す。 The compounds used for preparing the curable composition are shown below. For products containing a solvent, the type of solvent and the solid content of the compound are shown.
〔ポリオール(a1-1)〕
・水添ポリブタジエンジオール1(日本曹達株式会社製 商品名「GI-3000」)、数平均分子量:3000、ヨウ素価:21以下
・水添ポリブタジエンジオール2(日本曹達株式会社製 商品名「GI-2000」)、数平均分子量:2100、ヨウ素価:21以下
・水添ポリイソプレンジオール(出光興産社製 商品名「EPOL」)、数平均分子量:2500、ヨウ素価:7.9
・ポリカーボネートジオール1(旭化成ケミカルズ社製 商品名「Duranol T5652」)
・ポリカーボネートジオール2(ダイセル社製 商品名「PLACCEL CD220PL」)
・ポリエステルポリオール(クラレ社製 商品名「Kuraray Polyol P-1010」)
・アクリルポリオール(東亞合成社製 商品名「ARUFON UH-2000」)
[Polyol (a1-1)]
・ Hydrogenated polybutadiene diol 1 (trade name “GI-3000” manufactured by Nippon Soda Co., Ltd.), number average molecular weight: 3000, iodine value: 21 or less ・ Hydrogenated polybutadiene diol 2 (trade name “GI-2000 manufactured by Nippon Soda Co., Ltd.”) ], Number average molecular weight: 2100, iodine value: 21 or less, hydrogenated polyisoprene diol (trade name “EPOL” manufactured by Idemitsu Kosan Co., Ltd.), number average molecular weight: 2500, iodine value: 7.9
・ Polycarbonatediol 1 (trade name “Duranol T5652” manufactured by Asahi Kasei Chemicals)
・ Polycarbonate diol 2 (trade name “PLACCEL CD220PL” manufactured by Daicel Corporation)
・ Polyester polyol (Kuraray Polyol P-1010)
・ Acrylic polyol (trade name “ARUFON UH-2000” manufactured by Toagosei Co., Ltd.)
〔ポリイソシアネート(a2)〕
・トリメチロールプロパンとトリレンジイソシアネートの三量体付加物(TMP-TDI)(東ソー社製 商品名「コロネートL」、酢酸エチル、固形分:75質量%)、芳香環:3個
・4,4’-ジシクロヘキシルメタンジイソシアネート(水素添加MDI)(住化コベストロウレタン社製 商品名「Desmodur W」)、脂環式構造:2個
・トリレンジイソシアネートのイソシアヌレート体(TDI/イソシアヌレート)(住化コベストロウレタン 商品名「Desmodur IL 1451」、酢酸ブチル、固形分:51質量%)、芳香環:3個
・1,3-ビス(イソシアナトメチル)シクロヘキサン(水添m-XDI)(三井化学 商品名「タケネート 600」)、脂環式構造:1個
・ヘキサメチレンジイソシアネートのイソシアヌレート体(HDI/イソシアヌレート)(旭化成ケミカルズ社製 商品名「Duranate MHG-80B」、酢酸ブチル、固形分:80質量%)、脂環式構造及び芳香環:0個
・ヘキサメチレンジイソシアネートのプレポリマー(HDI/プレポリマー)(旭化成ケミカルズ社製 商品名「Duranate D201」)、脂環式構造及び芳香環:0個
[Polyisocyanate (a2)]
Trimeryl adduct of trimethylolpropane and tolylene diisocyanate (TMP-TDI) (trade name “Coronate L”, ethyl acetate, solid content: 75% by mass, manufactured by Tosoh Corporation), aromatic ring: 3 '-Dicyclohexylmethane diisocyanate (hydrogenated MDI) (trade name “Desmodur W” manufactured by Sumika Covestrourethane Co., Ltd.), cycloaliphatic structure: 2 • isocyanurate of tolylene diisocyanate (TDI / isocyanurate) (Sumika) Covestrourethane product name “Desmodur IL 1451”, butyl acetate, solid content: 51% by mass, aromatic ring: 3, 1,3-bis (isocyanatomethyl) cyclohexane (hydrogenated m-XDI) (Mitsui Chemicals) Name “Takenate 600”), cycloaliphatic structure: 1 isocyanurate of hexamethylene diisocyanate (HDI / isocyanurate) (Asahi) Product name “Duranate MHG-80B”, butyl acetate, solid content: 80% by mass), alicyclic structure and aromatic ring: 0 pieces, hexamethylene diisocyanate prepolymer (HDI / prepolymer) (Asahi Kasei Chemicals) Product name “Duranate D201”), alicyclic structure and aromatic ring: 0
〔水酸基含有アクリレート(a1-2)〕
・ペンタエリスリトールトリアクリレート(PETA)(東亞合成社製 商品名「アロニックスM-306」)
[Hydroxyl group-containing acrylate (a1-2)]
・ Pentaerythritol triacrylate (PETA) (trade name “Aronix M-306” manufactured by Toagosei Co., Ltd.)
〔ウレタンアクリレート〕
・ウレタンアクリレート(日本曹達社製 商品名「TEAI-1000」)、主鎖に水素添加されたブタジエン骨格及びウレタン結合を有し且つ両末端にアクリロイル基を有する、数平均分子量:2000
[Urethane acrylate]
-Urethane acrylate (trade name “TEAI-1000” manufactured by Nippon Soda Co., Ltd.), a hydrogenated butadiene skeleton in the main chain, a urethane bond, and an acryloyl group at both ends, number average molecular weight: 2000
〔ポリイソシアネート(E)〕
・トリメチロールプロパンとトリレンジイソシアネートの三量体付加物(TMP-TDI)(東ソー社製 商品名「コロネートL」)、芳香環:3個
・トリメチロールプロパンとトリレンジイソシアネートの三量体付加物(TMP-TDI)(東ソー社製 商品名「コロネートL」)とペンタエリスリトールトリアクリレート(東亞合成社製 商品名「アロニックスM-306」)との反応物
[Polyisocyanate (E)]
-Trimethylolpropane and tolylene diisocyanate trimer adduct (TMP-TDI) (trade name "Coronate L" manufactured by Tosoh Corporation), 3 aromatic rings-Trimethylolpropane and tolylene diisocyanate trimer adduct (TMP-TDI) (trade name “Coronate L” manufactured by Tosoh Corporation) and reaction product of pentaerythritol triacrylate (trade name “Aronix M-306” manufactured by Toagosei Co., Ltd.)
〔単官能アクリレート(B)〕
・n-オクチルアクリレート(大阪有機化学工業社製 商品名「NOAA」)、ガラス転移温度:-65℃
・ラウリルアクリレート(大阪有機化学工業社製 商品名「LA」)、ガラス転移温度:-23℃
・イソボニルアクリレート(大阪有機化学工業社製 商品名「IBXA」)、ガラス転移温度:97℃
[Monofunctional acrylate (B)]
N-octyl acrylate (trade name “NOAA”, manufactured by Osaka Organic Chemical Industry Co., Ltd.), glass transition temperature: −65 ° C.
・ Lauryl acrylate (trade name “LA”, manufactured by Osaka Organic Chemical Industry Co., Ltd.), glass transition temperature: −23 ° C.
・ Isobonyl acrylate (trade name “IBXA” manufactured by Osaka Organic Chemical Industry Co., Ltd.), glass transition temperature: 97 ° C.
〔多官能アクリレート(D)〕
・1,3-ブチレングリコールジアクリレート(サートマー社製 商品名「SR212B」)、ガラス転移温度:101℃
[Polyfunctional acrylate (D)]
1,3-butylene glycol diacrylate (trade name “SR212B” manufactured by Sartomer), glass transition temperature: 101 ° C.
〔光重合開始剤(C)〕
・ビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド(BASF社製 商品名「Irgacure 819」)
[Photopolymerization initiator (C)]
・ Bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (trade name “Irgacure 819” manufactured by BASF)
〔湿気硬化触媒(F)、ウレタン化触媒〕
・ジブチル錫ジラウレート(DBTDL)(堺化学工業社製 商品名「TN-12」)
[Moisture curing catalyst (F), urethanization catalyst]
・ Dibutyltin dilaurate (DBTDL) (trade name “TN-12” manufactured by Sakai Chemical Industry Co., Ltd.)
(合成例1~10、比較合成例1~11)
 反応容器中に、ポリオール(a1-1)、ポリイソシアネート(a2)、水酸基含有アクリレート(a1-2)、単官能アクリレート(B)、多官能アクリレート(D)及び重合禁止剤として4-メトキシフェノール(川口化学工業社製 商品名「MQ」)を表1~4に示した所定量ずつ供給した後、反応容器内を乾燥空気でバブリング及び攪拌をしながら反応容器内を60℃に加温した。なお、アルコール(a1)中の水酸基に対するポリイソシアネート(a2)中のイソシアネート基の当量比(イソシアネート基/水酸基)を「当量比(イソシアネート基/水酸基)」の欄に記載した。なお、表1~4の数値は、何れも溶剤を除いた固形分換算の数値である。
(Synthesis Examples 1 to 10, Comparative Synthesis Examples 1 to 11)
In the reaction vessel, polyol (a1-1), polyisocyanate (a2), hydroxyl group-containing acrylate (a1-2), monofunctional acrylate (B), polyfunctional acrylate (D) and 4-methoxyphenol (polymerization inhibitor) After supplying a predetermined amount shown in Tables 1 to 4 by the trade name “MQ” manufactured by Kawaguchi Chemical Industry Co., Ltd., the inside of the reaction vessel was heated to 60 ° C. while bubbling and stirring with dry air. In addition, the equivalent ratio (isocyanate group / hydroxyl group) of the isocyanate group in the polyisocyanate (a2) to the hydroxyl group in the alcohol (a1) is described in the column of “equivalent ratio (isocyanate group / hydroxyl group)”. The numerical values in Tables 1 to 4 are numerical values in terms of solid content excluding the solvent.
 単官能アクリレート(B)及び多官能アクリレート(D)は反応溶剤として使用するものであり、硬化性組成物に配合する単官能アクリレート(B)及び多官能アクリレート(D)の一部をウレタン樹脂(A)の作製の際に反応系に添加した。 The monofunctional acrylate (B) and the polyfunctional acrylate (D) are used as a reaction solvent, and a part of the monofunctional acrylate (B) and the polyfunctional acrylate (D) blended in the curable composition is a urethane resin ( It was added to the reaction system during the preparation of A).
 しかる後、ウレタン化触媒としてジブチル錫ジラウレートを表1~4に示した所定量を加えて3時間保持することによってウレタン樹脂(A)を得た。得られたウレタン樹脂(A)の重量平均分子量を表1~4に記載した。 Thereafter, the urethane resin (A) was obtained by adding a predetermined amount of dibutyltin dilaurate as a urethanization catalyst shown in Tables 1 to 4 and maintaining for 3 hours. The weight average molecular weights of the obtained urethane resin (A) are shown in Tables 1 to 4.
(比較例13で用いたポリイソシアネート(E)の合成)
 ポリイソシアネート〔トリメチロールプロパンとトリレンジイソシアネートの三量体付加物(TMP-TDI)〕(東ソー社製 商品名「コロネートL」)59.8質量部(固形分換算)、ペンタエリスリトールトリアクリレート(PETA)(東亞合成社製 商品名「アロニックス M-306」)40.2質量部、ジブチル錫ジラウレート(DBTDL)0.01質量部、n-オクチルアクリレート(大阪有機化学工業社製 商品名「NOAA」)80.1質量部及び重合禁止剤として4-メトキシフェノール(川口化学工業製 商品名「MQ」)0.1質量部を攪拌混合して溶解し、60℃で2時間に加温してアクリロイル基含有ポリイソシアネートを得た。
(Synthesis of polyisocyanate (E) used in Comparative Example 13)
Polyisocyanate [Trimer adduct of trimethylolpropane and tolylene diisocyanate (TMP-TDI)] (trade name “Coronate L” manufactured by Tosoh Corporation) 59.8 parts by mass (in terms of solid content), pentaerythritol triacrylate (PETA ) (Trade name “Aronix M-306” manufactured by Toagosei Co., Ltd.) 40.2 parts by mass, 0.01 parts by mass of dibutyltin dilaurate (DBTDL), n-octyl acrylate (trade name “NOAA” manufactured by Osaka Organic Chemical Industry Co., Ltd.) 80.1 parts by mass and 0.1 part by mass of 4-methoxyphenol (trade name “MQ”, manufactured by Kawaguchi Chemical Industries) as a polymerization inhibitor were mixed by stirring and dissolved, and heated at 60 ° C. for 2 hours to obtain an acryloyl group. A containing polyisocyanate was obtained.
(実施例1~10、比較例1~11)
 上記ウレタン樹脂(A)、単官能アクリレート(B)、光重合開始剤(C)、多官能アクリレート(D)及び湿気硬化触媒(F)としてジブチル錫ジラウレートを表5~8に示した所定ずつ遊星式攪拌機に供給し攪拌して均一に混合し、硬化性組成物を得た。なお、使用したウレタン樹脂(A)を表5~8のウレタン樹脂(A)の種類の欄に記載した。
(Examples 1 to 10, Comparative Examples 1 to 11)
Dibutyltin dilaurate as the above-mentioned urethane resin (A), monofunctional acrylate (B), photopolymerization initiator (C), polyfunctional acrylate (D), and moisture curing catalyst (F) as shown in Tables 5 to 8 in predetermined planets. The curable composition was obtained by supplying to a stirrer and stirring and mixing uniformly. The urethane resin (A) used was listed in the column of the type of urethane resin (A) in Tables 5-8.
 上述で作製したウレタン樹脂(A)には、単官能アクリレート(B)又は多官能アクリレート(D)が含まれているが、表5~8に示したウレタン系樹脂(A)の欄の数値は、単官能アクリレート(B)及び多官能アクリレート(D)を除いた量である。表5~8に示した単官能アクリレート(B)及び多官能アクリレート(D)の欄の数値はそれぞれ、ウレタン樹脂(A)の作製時に加えた単官能アクリレート(B)及び多官能アクリレート(D)のそれぞれの量を含めた値であり、硬化性組成物に含まれている単官能アクリレート(B)及び多官能アクリレート(D)のそれぞれの総量である。表5~8の数値は何れも溶剤を除いた固形分換算の数値である。 The urethane resin (A) produced above contains a monofunctional acrylate (B) or a polyfunctional acrylate (D), but the values in the columns of the urethane-based resins (A) shown in Tables 5 to 8 are as follows. , The amount excluding the monofunctional acrylate (B) and the polyfunctional acrylate (D). The values in the columns of the monofunctional acrylate (B) and the polyfunctional acrylate (D) shown in Tables 5 to 8 are the monofunctional acrylate (B) and the polyfunctional acrylate (D) added when the urethane resin (A) was produced, respectively. It is the value including each amount of each, and is the total amount of each of the monofunctional acrylate (B) and the polyfunctional acrylate (D) contained in the curable composition. The numerical values in Tables 5 to 8 are all in terms of solid content excluding the solvent.
(比較例12、13)
 ウレタンアクリレート、ポリイソシアネート(E)、単官能アクリレート(B)、光重合開始剤(C)、多官能アクリレート(D)及び湿気硬化触媒(F)としてジブチル錫ジラウレートを表8に示した所定ずつ遊星式攪拌機に供給し攪拌して均一に混合し、硬化性組成物を得た。
(Comparative Examples 12 and 13)
Urethane acrylate, polyisocyanate (E), monofunctional acrylate (B), photopolymerization initiator (C), polyfunctional acrylate (D) and dibutyltin dilaurate as moisture-curing catalyst (F) as shown in Table 8 in predetermined planets. The curable composition was obtained by supplying to a stirrer and stirring and mixing uniformly.
 得られた硬化性組成物について、電気絶縁性、耐亀裂性、外観性及び湿気硬化性を下記の要領で測定し、その結果を表5~8に示した。 The resulting curable composition was measured for electrical insulation, crack resistance, appearance and moisture curability in the following manner, and the results are shown in Tables 5-8.
(電気絶縁性)
 JIS2型くし型基板上に硬化性組成物を膜厚50μmで塗布し、2枚の試験片を作製した。1枚の試験片の硬化性組成物に発光波長365nmの紫外線を照射して硬化性組成物を光硬化させた後、試験片を23℃、相対湿度50%の雰囲気に12時間放置して硬化性組成物を湿気硬化させて硬化物を生成した。
(Electrical insulation)
A curable composition was applied at a film thickness of 50 μm on a JIS 2 type comb substrate to prepare two test pieces. The curable composition of one test piece is irradiated with ultraviolet rays having an emission wavelength of 365 nm to photocure the curable composition, and then the test piece is left to stand in an atmosphere of 23 ° C. and 50% relative humidity for 12 hours to be cured. The cured composition was moisture cured to produce a cured product.
 もう一枚の試験片には紫外線を照射することなく、試験片を23℃、相対湿度50%の雰囲気に12時間放置して硬化性組成物を湿気硬化させて硬化物を生成した。 The other test piece was left to stand in an atmosphere of 23 ° C. and 50% relative humidity for 12 hours without irradiating ultraviolet rays, and the curable composition was moisture-cured to produce a cured product.
 2枚の試験片を85℃、相対湿度85%に保持された恒湿恒温槽内に入れた後、印加電圧を32Vに設定して96時間後における硬化物の抵抗値を測定した。 After putting two test pieces in a thermo-hygrostat kept at 85 ° C. and a relative humidity of 85%, the applied voltage was set to 32 V, and the resistance value of the cured product after 96 hours was measured.
 紫外線を照射した試験片の硬化物の抵抗値を「UV部」の欄に、紫外線を照射しなかった試験片の硬化物の抵抗値を「暗部」の欄に記載した。 The resistance value of the cured product of the test piece that was irradiated with ultraviolet rays was written in the column “UV part”, and the resistance value of the cured product of the test piece that was not irradiated with ultraviolet rays was written in the column “dark part”.
(耐亀裂性)
 ガラスエポキシ基板にリフローフラックスを塗布し、チップ抵抗をはんだ付けした。次に、チップ抵抗上に硬化性組成物を塗布し、チップ抵抗を硬化性組成物で被覆して試験片を2枚作製した。
(Crack resistance)
A reflow flux was applied to a glass epoxy substrate, and a chip resistor was soldered. Next, a curable composition was applied onto the chip resistance, and the chip resistance was coated with the curable composition to prepare two test pieces.
 1枚の試験片の硬化性組成物に発光波長365nmの紫外線を照射して硬化性組成物を光硬化させた後、試験片を23℃、相対湿度50%の雰囲気に12時間放置して硬化性組成物を湿気硬化させて硬化物を生成した。 The curable composition of one test piece is irradiated with ultraviolet rays having an emission wavelength of 365 nm to photocure the curable composition, and then the test piece is left to stand in an atmosphere of 23 ° C. and 50% relative humidity for 12 hours to be cured. The cured composition was moisture cured to produce a cured product.
 もう一枚の試験片には紫外線を照射することなく、試験片を23℃、相対湿度50%の雰囲気に12時間放置して硬化性組成物を湿気硬化させて硬化物を生成した。 The other test piece was left to stand in an atmosphere of 23 ° C. and 50% relative humidity for 12 hours without irradiating ultraviolet rays, and the curable composition was moisture-cured to produce a cured product.
 試験片を125℃にて30分間保持した後、試験片を-40℃にて30分間保持する工程を1サイクルとする冷熱サイクル試験に供し、硬化物に亀裂が初めて生じた時点において既に完全に行ったサイクル数を数えた。下記基準にしたがって評価した。 After holding the test piece at 125 ° C. for 30 minutes, the test piece was held at −40 ° C. for 30 minutes for a cycle of one cycle. The number of cycles performed was counted. Evaluation was made according to the following criteria.
 紫外線を照射した試験片のサイクル数を「UV部」の欄に、紫外線を照射しなかった試験片のサイクル数を「暗部」の欄に記載した。 The cycle number of the test piece irradiated with ultraviolet rays is described in the “UV part” column, and the cycle number of the test piece not irradiated with ultraviolet rays is described in the “dark part” column.
 A++:サイクル数が2000以上であった。
 A+ :サイクル数が1500以上で且つ2000未満であった。
 A  :サイクル数が1000以上で且つ1500未満であった。
 B  :サイクル数が720以上で且つ1000未満であった。
 C  :サイクル数が360以上で且つ720未満であった。
 D  :サイクル数が360未満であった。
A ++: The number of cycles was 2000 or more.
A +: The number of cycles was 1500 or more and less than 2000.
A: The number of cycles was 1000 or more and less than 1500.
B: The number of cycles was 720 or more and less than 1000.
C: The number of cycles was 360 or more and less than 720.
D: The number of cycles was less than 360.
(外観性)
 硬化性組成物をガラス板に膜厚50μmで塗布した。硬化性組成物に発光波長365nmの紫外線を照射して硬化性組成物を光硬化させた。硬化性組成物の硬化物のHAZE値をヘーズメーター(日本電色工業株式会社製 商品名「NDH 5000」)を用いて測定した。なお、ガラス板はバックグラウンドとして差し引いた。HAZE値が小さいほど、硬化物の透明性が高いことを示す。下記基準に基づいて評価した。
(Appearance)
The curable composition was applied to a glass plate with a film thickness of 50 μm. The curable composition was photocured by irradiating the curable composition with ultraviolet rays having an emission wavelength of 365 nm. The HAZE value of the cured product of the curable composition was measured using a haze meter (trade name “NDH 5000” manufactured by Nippon Denshoku Industries Co., Ltd.). The glass plate was subtracted as the background. It shows that transparency of cured | curing material is so high that a HAZE value is small. Evaluation was made based on the following criteria.
 A+:HAZE値が0以上で且つ0.25未満であった。
 A :HAZE値が0.25以上で且つ0.5未満であった。
 B :HAZE値が0.5以上で且つ1.0未満であった。
 C :HAZE値が1.0以上で且つ2.0未満であった。
 D :HAZE値が2.0以上であった。
A +: The HAZE value was 0 or more and less than 0.25.
A: The HAZE value was 0.25 or more and less than 0.5.
B: The HAZE value was 0.5 or more and less than 1.0.
C: The HAZE value was 1.0 or more and less than 2.0.
D: The HAZE value was 2.0 or more.
(湿気硬化性)
 硬化性組成物をガラスエポキシ基板上に膜厚50μmで塗布し、23℃、相対湿度50%、遮光の環境下において、硬化性組成物の塗布面が水平となるようにして放置した。塗布が完了してから6時間、12時間及び24時間後のそれぞれの時刻に、ガラスエポキシ基板を硬化性組成物の塗布面が垂直になるように保持し、硬化性組成物の垂れが生じなくなっているか否かを目視観察し、硬化性組成物の垂れが生じなくなるのに要した時間に基づいて下記の通り評価した。
 A:6時間未満であった。
 B:6時間以上で且つ12時間未満であった。
 C:12時間以上で且つ24時間未満であった。
 D:24時間経過時点において硬化性組成物に垂れを生じていた。
(Moisture curable)
The curable composition was applied to a glass epoxy substrate with a film thickness of 50 μm, and was allowed to stand in a light-shielding environment at 23 ° C. and a relative humidity of 50% with the curable composition application surface being horizontal. The glass epoxy substrate is held so that the coating surface of the curable composition is vertical at 6 hours, 12 hours, and 24 hours after the application is completed, and the curable composition does not sag. The following evaluation was made based on the time required for the curable composition not to sag.
A: It was less than 6 hours.
B: 6 hours or more and less than 12 hours.
C: 12 hours or more and less than 24 hours.
D: The curable composition sagged at the time point of 24 hours.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000003
Figure JPOXMLDOC01-appb-T000003
Figure JPOXMLDOC01-appb-T000004
Figure JPOXMLDOC01-appb-T000004
Figure JPOXMLDOC01-appb-T000005
Figure JPOXMLDOC01-appb-T000005
Figure JPOXMLDOC01-appb-T000006
Figure JPOXMLDOC01-appb-T000006
Figure JPOXMLDOC01-appb-T000007
Figure JPOXMLDOC01-appb-T000007
Figure JPOXMLDOC01-appb-T000008
Figure JPOXMLDOC01-appb-T000008
 本発明の硬化性組成物は、はんだ付け後の電子回路基板を水、湿気及び埃などから保護するための電気絶縁処理の用途に好適に用いることができる。 The curable composition of the present invention can be suitably used for electrical insulation treatment for protecting a soldered electronic circuit board from water, moisture, dust and the like.
(関連出願の相互参照)
 本出願は、2016年3月31日に出願された日本国特許出願第2016-69988号に基づく優先権を主張し、この出願の開示はこれらの全体を参照することにより本明細書に組み込まれる。
(Cross-reference of related applications)
This application claims priority based on Japanese Patent Application No. 2016-69988 filed on Mar. 31, 2016, the disclosure of which is incorporated herein by reference in its entirety. .

Claims (7)

  1.  水素添加されたブタジエン系骨格及び/又は水素添加されたイソプレン系骨格を有し、且つ水添ポリブタジエンポリオール及び/又は水添ポリイソプレンポリオールを含有するポリオール(a1-1)を含むアルコール(a1)とポリイソシアネート(a2)とをモノマー成分として含有する重合体であって、上記アルコール(a1)及び上記ポリイソシアネート(a2)を含み且つ上記アルコール(a1)中の水酸基に対する上記ポリイソシアネート(a2)中のイソシアネート基の当量比(イソシアネート基/水酸基)が1より大きく且つ8以下であるモノマーの重合体であり、上記ポリイソシアネート(a2)は、一分子中に、2~6個の単環の脂環式構造、又は、3~7個の単環の芳香環を有するポリイソシアネートを含むウレタン樹脂(A)と、
     環構造を含まず且つ炭素数が10個以下のアルキル基を有する単官能(メタ)アクリレート(B)と、
     光重合開始剤(C)とを含むことを特徴とする硬化性組成物。
    An alcohol (a1) containing a hydrogenated butadiene-based skeleton and / or a hydrogenated isoprene-based skeleton and containing a hydrogenated polybutadiene polyol and / or a hydrogenated polyisoprene polyol (a1-1); A polymer containing a polyisocyanate (a2) as a monomer component, the polymer containing the alcohol (a1) and the polyisocyanate (a2), and the polyisocyanate (a2) in the polyisocyanate (a2) with respect to the hydroxyl group in the alcohol (a1) A polymer of a monomer having an isocyanate group equivalent ratio (isocyanate group / hydroxyl group) of greater than 1 and 8 or less. The polyisocyanate (a2) comprises 2 to 6 monocyclic alicyclic rings in one molecule. Urethanes comprising a polyisocyanate having the formula structure or 3-7 monocyclic aromatic rings And fat (A),
    A monofunctional (meth) acrylate (B) having no ring structure and having an alkyl group having 10 or less carbon atoms;
    A curable composition comprising a photopolymerization initiator (C).
  2.  ウレタン樹脂(A)が、モノマー成分として水酸基含有(メタ)アクリレート(a1-2)を更に含むことを特徴とする請求項1に記載の硬化性組成物。 The curable composition according to claim 1, wherein the urethane resin (A) further contains a hydroxyl group-containing (meth) acrylate (a1-2) as a monomer component.
  3.  ポリイソシアネート(a2)が、4,4’-ジシクロヘキシルメタンジイソシアネート、及び/又は、トリメチロールプロパンとトリレンジイソシアネートの三量体付加物を含むことを特徴とする請求項1又は請求項2の何れか1項に記載の硬化性組成物。 The polyisocyanate (a2) contains 4,4'-dicyclohexylmethane diisocyanate and / or a trimer adduct of trimethylolpropane and tolylene diisocyanate. The curable composition according to item 1.
  4.  多官能(メタ)アクリレート(D)を更に含み、単官能アルキル(メタ)アクリレート(B)及び多官能(メタ)アクリレート(D)の総量中、多官能(メタ)アクリレート(D)の含有量が15質量%以下であることを特徴とする請求項1~3の何れか1項に記載の硬化性組成物。 The polyfunctional (meth) acrylate (D) is further included, and the content of the polyfunctional (meth) acrylate (D) in the total amount of the monofunctional alkyl (meth) acrylate (B) and the polyfunctional (meth) acrylate (D) is The curable composition according to any one of claims 1 to 3, wherein the content is 15% by mass or less.
  5.  ウレタン樹脂(A)の重量平均分子量が5000~100000であることを特徴とする請求項1~4の何れか1項に記載の硬化性組成物。 The curable composition according to any one of claims 1 to 4, wherein the urethane resin (A) has a weight average molecular weight of 5,000 to 100,000.
  6.  請求項1~5の何れか1項に記載の硬化性組成物を含むことを特徴とするコンフォーマルコーティング剤。 A conformal coating agent comprising the curable composition according to any one of claims 1 to 5.
  7.  請求項1~5の何れか1項に記載の硬化性組成物の硬化物であることを特徴とする硬化物。 A cured product, which is a cured product of the curable composition according to any one of claims 1 to 5.
PCT/JP2017/013398 2016-03-31 2017-03-30 Curable composition, conformal coating agent and cured product WO2017170932A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201780021562.6A CN109071695B (en) 2016-03-31 2017-03-30 Curable composition, shape-retaining coating agent, and cured product

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-069988 2016-03-31
JP2016069988A JP6697306B2 (en) 2016-03-31 2016-03-31 Photocurable composition with moisture curing, conformal coating agent and cured product

Publications (1)

Publication Number Publication Date
WO2017170932A1 true WO2017170932A1 (en) 2017-10-05

Family

ID=59964792

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/013398 WO2017170932A1 (en) 2016-03-31 2017-03-30 Curable composition, conformal coating agent and cured product

Country Status (3)

Country Link
JP (1) JP6697306B2 (en)
CN (1) CN109071695B (en)
WO (1) WO2017170932A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024009957A1 (en) * 2022-07-04 2024-01-11 積水化学工業株式会社 Light/moisture curable resin composition, cured product, use of light/moisture curable resin composition, and end face protection method

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6797420B2 (en) * 2018-05-23 2020-12-09 サンユレック株式会社 Light moisture curable resin composition
US11773202B2 (en) 2019-01-11 2023-10-03 Nitto Shinko Corporation Curable compound, curable composition, and method for producing curable composition
JP7449068B2 (en) * 2019-01-11 2024-03-13 日東シンコー株式会社 curable composition
JP7382214B2 (en) * 2019-01-11 2023-11-16 日東シンコー株式会社 Curable compound, curable composition, and method for producing curable composition
EP4074742A4 (en) 2019-12-13 2023-12-13 Nitto Shinko Corporation Curable composition
KR102412526B1 (en) * 2020-04-22 2022-06-23 도우성 Light/moisture curable adhesive composition and the manufacturing method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015056717A1 (en) * 2013-10-18 2015-04-23 積水化学工業株式会社 Light/moisture-curable resin composition, adhesive for electronic component, and adhesive for display device
JP2015209520A (en) * 2014-04-30 2015-11-24 荒川化学工業株式会社 Ultraviolet curable resin composition for optical use, cured layer thereof, and optical member
WO2016031952A1 (en) * 2014-08-29 2016-03-03 日本化薬株式会社 Polyurethane compound and resin composition containing same
WO2016039324A1 (en) * 2014-09-12 2016-03-17 日本化薬株式会社 Resin composition, polymerizable resin composition, photosensitive resin composition, and cured products of said resin compositions

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6031049B2 (en) * 2012-02-03 2016-11-24 昭和電工株式会社 Photocurable transparent adhesive sheet composition, optical adhesive sheet
CN102703019B (en) * 2012-06-12 2013-11-27 烟台德邦科技有限公司 Liquid optical clear adhesive with low solidification energy and preparation method thereof
JP6414479B2 (en) * 2014-02-06 2018-10-31 荒川化学工業株式会社 UV curable adhesive composition for optics, the cured layer and optical member
WO2015190558A1 (en) * 2014-06-11 2015-12-17 日本化薬株式会社 Double-sided adhesive sheet for image display devices, and article

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015056717A1 (en) * 2013-10-18 2015-04-23 積水化学工業株式会社 Light/moisture-curable resin composition, adhesive for electronic component, and adhesive for display device
JP2015209520A (en) * 2014-04-30 2015-11-24 荒川化学工業株式会社 Ultraviolet curable resin composition for optical use, cured layer thereof, and optical member
WO2016031952A1 (en) * 2014-08-29 2016-03-03 日本化薬株式会社 Polyurethane compound and resin composition containing same
WO2016039324A1 (en) * 2014-09-12 2016-03-17 日本化薬株式会社 Resin composition, polymerizable resin composition, photosensitive resin composition, and cured products of said resin compositions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024009957A1 (en) * 2022-07-04 2024-01-11 積水化学工業株式会社 Light/moisture curable resin composition, cured product, use of light/moisture curable resin composition, and end face protection method

Also Published As

Publication number Publication date
CN109071695B (en) 2021-03-26
CN109071695A (en) 2018-12-21
JP6697306B2 (en) 2020-05-20
JP2017179171A (en) 2017-10-05

Similar Documents

Publication Publication Date Title
JP6697306B2 (en) Photocurable composition with moisture curing, conformal coating agent and cured product
KR101420202B1 (en) Polymerizable compound and curable composition containing same
JP5859926B2 (en) Active energy ray curable composition for interlayer filling
KR20140107508A (en) Urethane (meth)acrylate and moisture-proof insulating coating material
JP6381474B2 (en) Curable polyurethane resin composition and cured product
TW201418303A (en) Ultraviolet curable urethane acrylate composition, thin film molded body, optical film and method for manufacturing thin film molded body
WO2016121706A1 (en) Photosensitive resin composition and cured product thereof
WO2020054582A1 (en) Urethane (meth)acrylate, active energy ray-curable composition containing same, and cured product of said composition
CN107148435B (en) Hydroxyl group-containing polyurethane resin, and urethane (meth) acrylate resin
JP6899225B2 (en) Active energy ray-curable composition
TW201446844A (en) Resin film and method for producing same
CN114621719A (en) Liquid crystal sealant for liquid crystal dropping method
JP2015221841A (en) Moisture-curable and light-curable resin composition
TWI667312B (en) Hardened resin composition for interlayer filling
WO2021117804A1 (en) Curable composition
EP3025778B1 (en) Reaction accelerator and method of producing urethane compound, thiourethane compound, amide compound or urea compound using same
JP7257815B2 (en) Urethane (meth)acrylate, active energy ray-curable composition containing the same, and cured product thereof
WO2021251404A1 (en) Curable composition
WO2020145328A1 (en) Curable composition
CN114621722A (en) Liquid crystal sealant for liquid crystal dropping method
JP2006045341A (en) Photocurable resin composition, photocurable moist-proof insulating paint for mounted circuit board, insulated electronic component and its manufacturing method
JP2013082940A (en) Method for producing urethane (meth)acrylate

Legal Events

Date Code Title Description
NENP Non-entry into the national phase

Ref country code: DE

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17775466

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 17775466

Country of ref document: EP

Kind code of ref document: A1