WO2017168828A1

WO2017168828A1 - Tape for electronic device package

Info

Publication number: WO2017168828A1
Application number: PCT/JP2016/084927
Authority: WO
Inventors: 真沙美青山; 二朗杉山; 邦彦石黒; 佐野　透
Original assignee: 古河電気工業株式会社
Priority date: 2016-03-31
Filing date: 2016-11-25
Publication date: 2017-10-05
Also published as: SG11201807409YA; JP6339619B2; CN109005668A; TW201739873A; MY189016A; TWI654276B; KR102593593B1; KR20180127362A; JP2017183642A

Abstract

Provided is a tape for an electronic device package, with which it is possible to suppress the occurrence of bending and marks in a metal layer, which are caused by the edge section of the rotating stage of a pickup device when picking up an adhesive layer-equipped metal layer from a pressure-sensitive adhesive tape. This tape 1 for an electronic device package is characterized by comprising: a pressure-sensitive adhesive tape 5 that has a substrate film 51 and a pressure-sensitive adhesive layer 52; and a laminate of an adhesive layer 4 and a metal layer 3 that are provided by lamination on the reverse side of the pressure-sensitive adhesive layer 52 from the substrate film 51, wherein the tack force of the pressure-sensitive adhesive layer 52 in the state in which the laminate is picked up from the pressure-sensitive adhesive tape 5 is 2-200 kPa, and the loss modulus of the adhesive layer 4 at 25°C and 50%RH does not exceed 50 MPa.

Description

Electronic device packaging tape

The present invention relates to an electronic device package tape, and more particularly to an electronic device package tape having a metal layer.

In recent years, electronic devices such as mobile phones and notebook PCs are required to be thinner and smaller. Therefore, in order to reduce the thickness and size of electronic device packages such as semiconductor packages mounted on electronic devices, the number of electrodes of electronic devices and circuit boards is increased, and the pitch is also narrowed. Such an electronic device package includes, for example, a flip chip (FC) package.

In the flip chip mounting package, as described above, since the number of electrodes is increased or the pitch is narrowed, an increase in heat generation is a problem. Thus, as a heat dissipation structure of the flip chip mounting package, it has been proposed to provide a metal layer on the back surface of the electronic device via an adhesive layer (see, for example, Patent Document 1).

Also, in the flip chip mounting package, the linear expansion coefficient of the electronic device and the linear expansion coefficient of the circuit board may be greatly different. In this case, when the intermediate product is heated and cooled in the manufacturing process of the electronic device package, there is a difference in the amount of expansion and contraction between the electronic device and the circuit board. This difference causes warpage in the electronic device package. As a structure for suppressing such warpage, it has been proposed to provide a metal layer on the back surface of an electronic device via an adhesive layer (see, for example, Patent Document 2).

Furthermore, in flip chip mounting packages, it has also been proposed to provide a metal layer on the back surface of an electronic device via an adhesive layer and use this metal layer as a protective layer for laser marking (see, for example, Patent Document 3). .

In recent years, another semiconductor chip of the same size is further stacked on the semiconductor chip to perform three-dimensional mounting. Here, in order to be able to stack another semiconductor chip of the same size on the semiconductor chip, it is necessary to stack a spacer between them. This is because another semiconductor chip is also stacked on the electrode pad portion of the semiconductor chip. It has been proposed to use a metal layer with an adhesive layer as the spacer (see, for example, Patent Document 4). In Patent Document 4, a spacer includes a step of bonding a spacer adhesive sheet having a metal layer provided with an adhesive layer on at least one surface to a dicing sheet using the adhesive layer as a bonding surface, and a spacer adhesive sheet. Forming a chip-shaped spacer having an adhesive layer, and picking up the spacer with a pin, and using the pushed spacer to peel the semiconductor chip together with the adhesive layer from the dicing sheet It describes that it is provided by a process of peeling from a dicing sheet together with an adhesive layer by an apparatus and a process of fixing a spacer to an adherend through the adhesive layer.

Japanese Patent Laid-Open No. 2007-233502 Japanese Patent No. 5487847 Japanese Patent No. 5419226 Japanese Patent No. 4954569

As described above, the metal layer with the adhesive layer is useful for various electronic device packages. However, from the viewpoint of productivity, as disclosed in Patent Document 4, a pickup layer using an existing apparatus is used. It is required to fix to the adherend.

However, since metal is easily plastically deformed due to metal bonding, there is a possibility that pin marks may remain when it is pushed up with a pin for pickup. Therefore, for example, it is conceivable to use a pickup device that peels off and picks up a semiconductor chip from a dicing sheet without using a pin as described in JP2010-114157A.

Here, a pickup device that does not use pins (needleless method) will be described with reference to FIGS. FIG. 9 is a cross-sectional view for schematically explaining a method of using a pickup device that does not use a pin. FIG. 10 is a top view schematically showing the positional relationship between the stage of the pickup device and the semiconductor chip. As shown in FIG. 9, the pickup device that does not use pins includes a stage ST that holds a dicing sheet 101 to which a semiconductor chip C is attached. Further, the stage ST has a fixed stage part ST1 and a movable stage part ST2 fitted to the fixed stage part ST1. The movable stage unit ST2 is provided such that the upper surface of the movable stage unit ST2 protrudes from the upper surface of the fixed stage unit ST1. For this reason, the clearance gap 102 is formed in the outer peripheral part of movable stage part ST2 between the dicing sheets 101. FIG. Further, as shown in FIG. 10, the stage ST is provided with a suction hole ST3 communicating with the gap 102.

Next, a method for picking up the semiconductor chip C using the pickup device will be described. First, as shown in FIG. 9A, the movable stage portion ST2 is disposed below the semiconductor chip C. At this time, the movable stage portion ST2 is arranged in a state where one end portion of the semiconductor chip C protrudes from one end surface of the movable stage portion ST2 (a state where the semiconductor chip C overhangs from one end surface of the movable stage portion ST2). Then, the dicing sheet 101 is sucked downward through the suction holes ST3 in a state where the semiconductor chip C is sucked (held) by the collet (suction collet) K from above. As a result, air in the gap 102 is sucked, the dicing sheet 101 around the movable stage portion ST2 is sucked, and the dicing sheet 101 is peeled off at the outer edge portion of the semiconductor chip C.

Thereafter, the movable stage portion ST2 is moved in the direction of arrow X as shown in FIG. As a result, the receiving area of the semiconductor chip C received by the movable stage portion ST2 is reduced, and the area where the dicing sheet 101 is sucked is increased, and finally, as shown in FIG. As described above, the semiconductor chip C can be completely separated from the dicing sheet 101.

However, when the so-called slider-type pickup device as described above is used to pick up the metal layer and the adhesive layer from an adhesive sheet such as a dicing sheet, the movable stage portion ST2 is disposed and the adhesive sheet is removed from the suction hole ST3. If the pressure-sensitive adhesive sheet does not peel well from the metal layer and the adhesive layer when sucked, the metal layer and the adhesive layer are pulled by the pressure-sensitive adhesive sheet, and the metal layer is bent or marked at the edge portion of the movable stage part ST2. There was a problem of sticking.

Therefore, the present invention is for an electronic device package that can suppress bending or a mark from being generated in a metal layer by an edge portion of a movable stage of a pickup device when a metal layer with an adhesive layer is picked up from an adhesive tape. The purpose is to provide a tape.

In order to solve the above problems, an electronic device package tape according to the present invention is provided by laminating a pressure-sensitive adhesive tape having a base film and a pressure-sensitive adhesive layer on the side opposite to the base film of the pressure-sensitive adhesive layer. The adhesive layer and the metal layer are laminated, and the tackiness of the pressure-sensitive adhesive layer in a state where the laminate is picked up from the pressure-sensitive adhesive tape is 2 to 200 kPa. The loss elastic modulus at 50 ° C. and 50% RH is 50 MPa or less.

The electronic device package tape preferably has a loss elastic modulus of 0.2 MPa or more at 25 ° C. and 50% RH of the adhesive layer.

In the electronic device package tape, the metal layer preferably contains copper or aluminum.

In the electronic device package tape, the thickness of the metal layer is preferably 5 μm or more and less than 200 μm.

In the electronic device package tape, the adhesive layer contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler. It is preferable to do.

In the electronic device package tape, the pressure-sensitive adhesive layer contains an acrylic ester represented by CH ₂ ═CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms) and a hydroxyl group-containing It is preferable to contain an acrylic polymer comprising a monomer and an isocyanate compound having a radical-reactive carbon-carbon double bond in the molecule.

According to the present invention, when a metal layer with an adhesive layer is picked up from an adhesive tape, it is possible to prevent the metal layer from being bent or marked by the edge portion of the movable stage of the pickup device.

It is sectional drawing which shows typically the structure of the tape for electronic device packages which concerns on embodiment of this invention. (A) is a top view which shows typically the structure of the tape for electronic device packages which concerns on embodiment of this invention, (b) is the same sectional drawing. It is a perspective view which shows typically the structure of the tape for electronic device packages which concerns on embodiment of this invention. It is explanatory drawing which shows typically the manufacturing method of the tape for electronic device packages which concerns on embodiment of this invention, (A) is a longitudinal cross-sectional view which shows the bonding process of a metal layer, (B) is an adhesive agent It is longitudinal direction sectional drawing which shows the bonding process of a layer, (C) is a transversal direction sectional view which shows a precut process, (D) is a perspective view which shows the removal process of an unnecessary part. It is explanatory drawing which shows typically the manufacturing method of the tape for electronic device packages which concerns on embodiment of this invention, (A) is a transversal direction sectional drawing which shows the bonding process of an adhesive tape, (B) is a pre-cut. It is a transversal direction sectional view showing a process, and (C) is a transversal direction sectional view showing an unnecessary part removal process. It is sectional drawing which illustrates typically the usage method of the tape for electronic device packages which concerns on embodiment of this invention. It is sectional drawing which illustrates typically the usage method of the tape for electronic device packages which concerns on embodiment of this invention. It is sectional drawing which shows typically the structure of the electronic device package using the tape for electronic device packages which concerns on embodiment of this invention. It is explanatory drawing which illustrates typically the usage method of a slider-type pick-up apparatus. It is a top view which shows typically the positional relationship of the stage and semiconductor chip of a slider-type pick-up apparatus.

Hereinafter, embodiments of the present invention will be described in detail.

FIG. 1 is a cross-sectional view showing an electronic device package tape 1 according to an embodiment of the present invention. The electronic device package tape 1 has a pressure-sensitive adhesive tape 5 including a base film 51 and a pressure-sensitive adhesive layer 52 provided on the base film 51, and an adhesive layer is formed on the pressure-sensitive adhesive layer 52. A laminated body of 4 and the metal layer 3 is provided. In the present embodiment, the adhesive layer 4 and the metal layer 3 provided by being laminated on the adhesive layer 4 are provided on the pressure-sensitive adhesive layer 52. The laminated body of the adhesive layer 4 and the metal layer 3 includes a mode in which they are indirectly laminated through a primer layer or the like for improving the adhesion between them.

As shown in FIGS. 2 and 3, the electronic device package tape 1 of the present invention has an adhesive tape 5 cut into a shape corresponding to the ring frame R (see FIG. 7), and a metal layer 3 and an adhesive layer. Corresponding to this, 4 is also cut into a predetermined shape (pre-cut processing), and in this embodiment, pre-cut processing is performed.

As shown in FIGS. 2 and 3, the electronic device package tape 1 of the present invention has an adhesive tape 5 (label part 5a) cut into a shape corresponding to the metal layer 3, the adhesive layer 4, and the ring frame R. The long base tape 2 in which a plurality of laminated bodies are formed is preferably wound into a roll shape, and in the present embodiment, the base tape 2 is wound into a roll shape. The laminated body provided in the tape 2 may be cut one by one.

When pre-cut and wound into a roll, as shown in FIGS. 2 and 3, the electronic device package tape 1 has a base tape 2, and the base tape 2 has a predetermined tape. A metal layer 3 having a planar shape, an adhesive layer 4 having a predetermined planar shape provided on the opposite side of the metal tape 3 to the base tape 2 side, and having a predetermined planar shape; And a label portion 5a having a predetermined planar shape provided so as to come into contact with the base tape 2 around the adhesive layer 4 and a peripheral portion 5b surrounding the outside of the label portion 5a Tape 5 is provided.

The label portion 5a has a shape corresponding to the ring frame R for dicing. The shape corresponding to the shape of the ring frame R for dicing is preferably similar in shape to the inside of the ring frame R and larger than the size inside the ring frame R. Moreover, although it does not necessarily need to be circular, the shape close | similar to circle is preferable and it is more preferable that it is circular. The peripheral part 5b includes a form that completely surrounds the outside of the label part 5a and a form that is not completely enclosed as shown. In addition, although the peripheral part 5b does not need to be provided, the tension | tensile_strength of winding concerning the label part 5a can be disperse | distributed in the form wound up in roll shape, if provided.
The adhesive layer 4 has a predetermined planar shape, and this planar shape allows the ring frame R to be bonded to the peripheral edge of the label portion 5a of the adhesive tape 5 so that it can be pushed up by the push-up member of the pickup device. The shape is smaller than the label portion 5a. The adhesive layer 4 is preferably similar in shape to the label portion 5a and smaller in size than the label portion 5a. The adhesive layer 4 is not necessarily circular, but a shape close to a circle is preferable, and a circular shape is more preferable.

The metal layer 3 has the same shape as the adhesive layer 4, and the adhesive layer 4 is laminated on the metal layer 3. In this case, it is sufficient that the main portions are laminated, and the metal layer 3 and the adhesive layer 4 do not necessarily have the same size, but they may have substantially the same shape for convenience of manufacturing. preferable. Each component will be described below.

<Base tape 2>
Although the base tape 2 can also be comprised with a well-known separator, the base tape used for the pre-cut process of the tape for electronic device packages can also be used as it is. When the base tape used for the pre-cut processing of the tape for electronic device package is used as it is, the base tape 2 needs to hold the metal layer 3 at the time of the pre-cut processing, so for example, on one side of the resin film and the resin film. The tape which has the provided adhesive layer for base tapes can be used conveniently.

As the material of the resin film constituting the base tape 2, known materials can be used. For example, polyester (PET, PBT, PEN, PBN, PTT), polyolefin (PP, PE) Examples thereof include films obtained by partially replacing these materials, copolymers (EVA, EEA, EBA), and further improving adhesion and mechanical strength. Moreover, the laminated body of these films may be sufficient. From the viewpoint of heat resistance, smoothness, and availability, it is preferably selected from polyethylene terephthalate, polypropylene, and high-density polyethylene.

The thickness of the resin film constituting the base tape 2 is not particularly limited and may be appropriately set, but is preferably 10 to 150 μm.

As the resin used for the adhesive layer for the base tape, known chlorinated polypropylene resins, acrylic resins, polyester resins, polyurethane resins, epoxy resins, etc. used for adhesives can be used. An acrylic adhesive having a polymer as a base polymer is preferred.

Examples of the acrylic polymer include (meth) acrylic acid alkyl esters (for example, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, Pentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester, A linear or branched alkyl ester of an alkyl group such as octadecyl ester or eicosyl ester having 1 to 30 carbon atoms, particularly 4 to 18 carbon atoms) and ( Data) acrylic acid cycloalkyl esters (e.g., cyclopentyl ester, acrylic polymers such as one or more was used as a monomer component of the cyclohexyl ester etc.). In addition, (meth) acrylic acid ester means acrylic acid ester and / or methacrylic acid ester, and (meth) of the present invention has the same meaning.

The acrylic polymer contains units corresponding to other monomer components copolymerizable with the (meth) acrylic acid alkyl ester or cycloalkyl ester, if necessary, for the purpose of modifying cohesive force, heat resistance and the like. May be. Examples of such monomer components include, for example, carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride Acid anhydride monomers such as itaconic anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate Hydroxyl group-containing monomers such as 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate; Styrene Contains sulfonic acid groups such as phonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, (meth) acryloyloxynaphthalene sulfonic acid Monomers; Phosphoric acid group-containing monomers such as 2-hydroxyethylacryloyl phosphate; acrylamide, acrylonitrile and the like. One or more of these copolymerizable monomer components can be used. The amount of these copolymerizable monomers used is preferably 40% by weight or less based on the total monomer components.

Furthermore, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like can be included as a monomer component for copolymerization as necessary. Examples of such polyfunctional monomers include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, Pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) An acrylate etc. are mentioned. These polyfunctional monomers can also be used alone or in combination of two or more. The amount of the polyfunctional monomer used is preferably 30% by weight or less of the total monomer components from the viewpoint of adhesive properties and the like.

The acrylic polymer can be prepared, for example, by applying an appropriate method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, or a suspension polymerization method to a mixture of one or more component monomers. The adhesive layer for the base tape preferably has a composition that suppresses the inclusion of a low molecular weight substance from the standpoint of preventing contamination of the wafer. From this point, an acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3,000,000. Since the main component is preferable, the pressure-sensitive adhesive can be of an appropriate crosslinking type by an internal crosslinking method, an external crosslinking method, or the like.

Moreover, in order to control the crosslinking density of the pressure-sensitive adhesive layer for the base tape and improve the peelability from the pressure-sensitive adhesive tape 5, for example, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a melamine compound, a metal salt compound, An energy beam obtained by mixing a low-molecular compound having two or more carbon-carbon double bonds with a method of crosslinking using an appropriate external crosslinking agent such as a metal chelate compound, an amino resin compound, or a peroxide. Appropriate methods such as a method of crosslinking by irradiation or the like can be employed. When using an external cross-linking agent, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further depending on the intended use as an adhesive. In general, it is preferable to add about 20 parts by weight or less, and further 0.1 to 20 parts by weight with respect to 100 parts by weight of the base polymer.

The thickness of the pressure-sensitive adhesive layer for the base tape is not particularly limited and can be appropriately determined, but is generally about 5 to 200 μm. Moreover, the adhesive layer for base tapes may be composed of a single layer or a plurality of layers.

<Adhesive tape 5>
There is no restriction | limiting in particular as the adhesive tape 5, A conventional adhesive tape can be used. As the adhesive tape 5, for example, a substrate film 51 provided with an adhesive layer 52 can be suitably used.

The substrate film 51 can be used without particular limitation as long as it is a conventionally known one, but has radiation transparency when a radiation curable material is used as the adhesive layer 52 described later. It is preferable to use one.

For example, the materials include polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-acrylic. Homopolymers or copolymers of α-olefins such as methyl acid copolymers, ethylene-acrylic acid copolymers, ionomers or mixtures thereof, polyurethane, styrene-ethylene-butene or pentene copolymers, polyamide-polyols Listed are thermoplastic elastomers such as copolymers, and mixtures thereof. Further, the base film may be a mixture of two or more materials selected from these groups, or may be a single layer or a multilayer.

The thickness of the base film 51 is not particularly limited and may be set as appropriate, but is preferably 50 to 200 μm.

In order to improve the adhesion between the base film 51 and the pressure-sensitive adhesive layer 52, the surface of the base film 51 is subjected to chemical or physical treatment such as chromic acid treatment, ozone exposure, flame exposure, high-voltage impact exposure, or ionizing radiation treatment. Surface treatment may be applied.

In the present embodiment, the pressure-sensitive adhesive layer 52 is provided directly on the base film 51. However, a primer layer for increasing adhesion, an anchor layer for improving machinability during dicing, stress You may provide indirectly through a relaxation layer, an antistatic layer, etc.

The resin used for the pressure-sensitive adhesive layer 52 of the pressure-sensitive adhesive tape 5 is not particularly limited, and known chlorinated polypropylene resins, acrylic resins, polyester resins, polyurethane resins, epoxy resins and the like used for pressure-sensitive adhesives can be used. Although it can be used, an acrylic adhesive having an acrylic polymer as a base polymer is preferred.

The acrylic polymer can be prepared, for example, by applying an appropriate method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, or a suspension polymerization method to a mixture of one or more component monomers. The pressure-sensitive adhesive layer 52 preferably has a composition that suppresses the inclusion of a low molecular weight substance. From this point of view, the pressure-sensitive adhesive layer 52 is preferably composed mainly of an acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3,000,000. The agent may be of an appropriate crosslinking type by an internal crosslinking method, an external crosslinking method, or the like.

Moreover, in order to control the crosslinking density of the pressure-sensitive adhesive layer 52 to improve pickup properties, for example, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a melamine compound, a metal salt compound, a metal chelate compound, an amino resin system A method of crosslinking using an appropriate external crosslinking agent such as a compound or a peroxide, or a method of mixing a low molecular compound having two or more carbon-carbon double bonds and crosslinking by irradiation with energy rays, etc. A suitable method such as the above can be adopted. When using an external cross-linking agent, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further depending on the intended use as an adhesive. In general, it is preferable to add about 20 parts by weight or less, and further 0.1 to 20 parts by weight with respect to 100 parts by weight of the base polymer. In addition, from the viewpoint of preventing deterioration and the like, additives such as various tackifiers and anti-aging agents may be used for the pressure-sensitive adhesive in addition to the above components.

As the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 52, a radiation curable pressure-sensitive adhesive is suitable. Examples of the radiation-curable pressure-sensitive adhesive include additive-type radiation-curable pressure-sensitive adhesives in which a radiation-curable monomer component or a radiation-curable oligomer component is blended with the above-mentioned pressure-sensitive adhesive.

Examples of the radiation curable monomer component to be blended include urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra ( And (meth) acrylate, dipentaerystol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butanediol di (meth) acrylate, and the like. These monomer components can be used alone or in combination of two or more.

The radiation curable oligomer component includes various oligomers such as urethane, polyether, polyester, polycarbonate, and polybutadiene, and those having a molecular weight in the range of about 100 to 30000 are suitable. The amount of the radiation curable monomer component or oligomer component can be appropriately determined in accordance with the type of the pressure-sensitive adhesive layer 52, and the amount by which the pressure-sensitive adhesive strength of the pressure-sensitive adhesive layer 52 can be reduced. Generally, the amount is, for example, about 5 to 500 parts by weight, preferably about 70 to 150 parts by weight with respect to 100 parts by weight of the base polymer such as an acrylic polymer constituting the pressure-sensitive adhesive.

As the radiation curable pressure-sensitive adhesive, in addition to the additive-type radiation curable pressure-sensitive adhesive, a base polymer having a carbon-carbon double bond in the polymer side chain or in the main chain or at the main chain terminal was used. An internal radiation-curable pressure-sensitive adhesive is also included. Intrinsic radiation curable adhesives do not need to contain oligomer components, which are low molecular components, or do not contain much, so they are stable without the oligomer components moving through the adhesive over time. This is preferable because the pressure-sensitive adhesive layer 52 having a layered structure can be formed.

As the base polymer having a carbon-carbon double bond, a polymer having a carbon-carbon double bond and having adhesiveness can be used without particular limitation. As such a base polymer, those having an acrylic polymer as a basic skeleton are preferable. Examples of the basic skeleton of the acrylic polymer include the acrylic polymers exemplified above.

The method for introducing the carbon-carbon double bond into the acrylic polymer is not particularly limited, and various methods can be adopted. However, it is easy to introduce the carbon-carbon double bond into the polymer side chain in terms of molecular design. is there. For example, after a monomer having a functional group is copolymerized in advance with an acrylic polymer, a compound having a functional group capable of reacting with the functional group and a carbon-carbon double bond is converted into a radiation-curable carbon-carbon double bond. A method of performing condensation or addition reaction while maintaining the above.

Examples of combinations of these functional groups include carboxylic acid groups and epoxy groups, carboxylic acid groups and aziridyl groups, hydroxyl groups and isocyanate groups, and the like. Among these combinations of functional groups, a combination of a hydroxyl group and an isocyanate group is preferable because of easy tracking of the reaction. In addition, the functional group may be on either side of the acrylic polymer and the compound as long as the combination of these functional groups generates an acrylic polymer having the carbon-carbon double bond. In the preferable combination, it is preferable that the acrylic polymer has a hydroxyl group and the compound has an isocyanate group. In this case, examples of the isocyanate compound having a carbon-carbon double bond include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl isocyanate, and the like. As the acrylic polymer, a copolymer obtained by copolymerizing the above-exemplified hydroxy group-containing monomer, an ether compound such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, or the like is used.

For the internal radiation curable pressure-sensitive adhesive, a base polymer having a carbon-carbon double bond (particularly an acrylic polymer) can be used alone, but the pre-radiation curable monomer component does not deteriorate the properties. And photopolymerizable compounds such as oligomer components can also be blended. The amount of the photopolymerizable compound is usually 30 parts by weight or less, preferably 0 to 10 parts by weight, based on 100 parts by weight of the base polymer.

The radiation curable pressure-sensitive adhesive preferably contains a photopolymerization initiator when cured by ultraviolet rays or the like.

Among the acrylic polymers described above, in particular, an acrylic ester represented by CH ₂ ═CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, Acrylic polymer A comprising an isocyanate compound having a radical reactive carbon-carbon double bond is preferred.

When the number of carbon atoms in the alkyl group of the acrylic acid alkyl ester is less than 4, the polarity is high and the peel force becomes too large, so that the pickup property may be lowered. On the other hand, when the number of carbon atoms of the alkyl group of the acrylic acid alkyl ester exceeds 18, the glass transition temperature of the pressure-sensitive adhesive layer 52 becomes too high, and the adhesive properties at room temperature deteriorate, resulting in dicing or expanding. Separation of the metal layer 3 and the adhesive layer 4 may occur.

The acrylic polymer A may contain units corresponding to other monomer components as necessary.

In the acrylic polymer A, an isocyanate compound having a radical reactive carbon-carbon double bond is used. That is, it is preferable that the acrylic polymer has a configuration in which a double bond-containing isocyanate compound is subjected to an addition reaction with a polymer based on a monomer composition such as an acrylic ester or a hydroxyl group-containing monomer. Accordingly, the acrylic polymer preferably has a radical reactive carbon-carbon double bond in its molecular structure. Thereby, it can be set as the active energy ray hardening-type adhesive layer (ultraviolet ray hardening-type adhesive layer etc.) hardened | cured by irradiation of an active energy ray (ultraviolet rays etc.), and the peeling force of the metal layer 3 and the adhesive layer 52 Can be reduced.

Examples of the double bond-containing isocyanate compound include methacryloyl isocyanate, acryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl isocyanate, and the like. A double bond containing isocyanate compound can be used individually or in combination of 2 or more types.

In addition, an external cross-linking agent can be appropriately used for the active energy ray-curable adhesive in order to adjust the adhesive strength before irradiation with active energy rays and the adhesive strength after irradiation with active energy rays. Specific examples of the external crosslinking method include a method of adding a so-called crosslinking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, a melamine crosslinking agent, and reacting them. When using an external cross-linking agent, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further depending on the intended use as an adhesive. The amount of the external crosslinking agent used is generally 20 parts by weight or less (preferably 0.1 to 10 parts by weight) with respect to 100 parts by weight of the base polymer. Further, the active energy ray-curable pressure-sensitive adhesive may contain various conventionally known additives such as tackifiers, anti-aging agents, and foaming agents in addition to the above components, if necessary.

The thickness of the pressure-sensitive adhesive layer 52 is not particularly limited and can be appropriately determined, but is generally about 5 to 200 μm. The pressure-sensitive adhesive layer 52 may be composed of a single layer or a plurality of layers.

The tack force of the pressure-sensitive adhesive layer 52 at 25 ° C. in a state where the laminate of the adhesive layer 4 and the metal layer 3 is picked up from the pressure-sensitive adhesive tape 5 is 2 to 200 kPa. Since it is the tack force of the adhesive layer 52 in a state where the adhesive layer 4 and the metal layer 3 are picked up from the adhesive tape 5, the adhesive layer 52 of the adhesive tape 5 is composed of a radiation-curable adhesive, and the adhesive tape When the adhesive layer 4 and the metal layer 3 are picked up after the adhesive force is lowered by irradiating 5 with radiation, it means the tack force after radiation irradiation.

The tack force of the adhesive layer 52 is a peak value in the probe tack test. The probe tack can be measured using, for example, a tacking tester TAC-II manufactured by Resuka Co., Ltd. As the measurement mode, “Constant Load” is used in which the probe is pushed down to the set pressure value and kept controlled until the set time elapses. The pressure-sensitive adhesive layer 52 of the pressure-sensitive adhesive tape 5 is faced up, a cylindrical probe is brought into contact with the upper side, and then peeled upward, and the force required for peeling is measured.

The tack force of the pressure-sensitive adhesive layer 52 can be controlled by adjusting the balance between the cohesive force of the pressure-sensitive adhesive layer and the adhesiveness of the interface. Moreover, it is possible to change also with the thickness of an adhesive layer, and the elasticity modulus and thickness of a base film.

If the tacking force of the pressure-sensitive adhesive layer 52 in a state where the laminate of the adhesive layer 4 and the metal layer 3 is picked up from the pressure-sensitive adhesive tape 5 is 200 kPa or less, it can move below the metal layer 3 and the adhesive layer 4 to be picked up. When the pressure-sensitive adhesive sheet 5 is sucked from the suction hole ST3 by arranging the stage portion ST2, the pressure-sensitive adhesive sheet 5 is peeled well from the metal layer 3 and the adhesive layer 4, so that the metal layer 3 and the adhesive layer 4 are sticky. It is possible to suppress the metal layer 3 from being bent or marked at the edge portion of the movable stage portion ST2 by being pulled by the sheet 5. Further, when the tack force is 2 kPa or more, when the pressure-sensitive adhesive sheet 5 is expanded when the metal layer 3 and the adhesive layer 4 are picked up, the outer edge of the metal layer 3 with the adhesive layer 4 is peeled off and warped. In other words, it is possible to suppress the occurrence of fold marks in the metal layer 3.

<Metal layer 3>
The metal constituting the metal layer 3 is not particularly limited. For example, the metal layer 3 has at least one selected from the group consisting of stainless steel, aluminum, iron, titanium, tin, nickel, and copper, and has a heat dissipation and electronic device package 8. It is preferable from the point of prevention of warpage. Among these, it is particularly preferable that copper is contained from the viewpoint of high thermal conductivity and a heat dissipation effect. In addition, from the viewpoint of preventing warpage of the electronic device package 8, it is particularly preferable to include aluminum.

The thickness of the metal layer 3 is not less than 5 μm and less than 200 μm. By setting the thickness to 5 μm or more, it is possible to suppress the metal layer 3 from being bent or marked by the edge of the movable stage portion ST2 (see FIG. 7C) of the pickup device. Moreover, if it is less than 200 micrometers, a process is easy, and when it is necessary to bend along a core and a bonding roll in winding and bonding, the waist of a metal layer will be too strong and a wrinkle will enter. The phenomenon can be suppressed.

As the metal layer 3, a metal foil can be used, and the metal foil may be an electrolytic foil or a rolled foil.

<Adhesive layer 4>
The adhesive layer 4 is a film obtained by previously forming an adhesive.

The adhesive layer 4 is formed of at least a thermosetting resin, and is preferably formed of at least a thermosetting resin and a thermoplastic resin.

Examples of the thermoplastic resin include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, Thermoplastic polyimide resin, polyamide resin such as 6-nylon and 6,6-nylon, phenoxy resin, acrylic resin, saturated polyester resin such as PET (polyethylene terephthalate) and PBT (polybutylene terephthalate), polyamideimide resin, or fluorine resin Etc. A thermoplastic resin can be used individually or in combination of 2 or more types. Among these thermoplastic resins, acrylic resins are less ionic impurities and have excellent stress relaxation properties, phenoxy resins are both high flexibility and strength and high toughness. This is particularly preferable because reliability can be easily secured.

The acrylic resin is not particularly limited, and one or more esters of acrylic acid or methacrylic acid having a linear or branched alkyl group having 30 or less carbon atoms (preferably 1 to 18 carbon atoms) are used. And the like. That is, in the present invention, acrylic resin has a broad meaning including methacrylic resin. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a t-butyl group, an isobutyl group, a pentyl group, an isopentyl group, a hexyl group, a heptyl group, and a 2-ethylhexyl group. Octyl group, isooctyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, dodecyl group (lauryl group), tridecyl group, tetradecyl group, stearyl group, octadecyl group and the like.

In addition, the other monomer for forming the acrylic resin (a monomer other than an alkyl ester of acrylic acid or methacrylic acid having an alkyl group with 30 or less carbon atoms) is not particularly limited. For example, acrylic acid, Carboxyl group-containing monomers such as methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid or crotonic acid, acid anhydride monomers such as maleic anhydride or itaconic anhydride, (meth) 2-hydroxyethyl acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, (meth) Acrylic acid 10-hydroxydec , Hydroxyl group-containing monomers such as 12-hydroxylauryl (meth) acrylic acid or (4-hydroxymethylcyclohexyl) -methyl acrylate, styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane Sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate or sulfonic acid group-containing monomer such as (meth) acryloyloxynaphthalene sulfonic acid, or phosphoric acid group content such as 2-hydroxyethyl acryloyl phosphate And monomers. In addition, (meth) acrylic acid means acrylic acid and / or methacrylic acid, and (meth) of the present invention has the same meaning.

In addition, examples of the thermosetting resin include an epoxy resin, a phenol resin, an amino resin, an unsaturated polyester resin, a polyurethane resin, a silicone resin, a thermosetting polyimide resin, and the like. A thermosetting resin can be used individually or in combination of 2 or more types. As the thermosetting resin, an epoxy resin containing a small amount of ionic impurities that corrode semiconductor elements is particularly suitable. Moreover, a phenol resin can be used suitably as a hardening | curing agent of an epoxy resin.

The epoxy resin is not particularly limited. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, brominated bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol AF type epoxy. Bifunctional epoxy such as resin, biphenyl type epoxy resin, naphthalene type epoxy resin, fluorene type epoxy resin, phenol novolac type epoxy resin, orthocresol novolak type epoxy resin, trishydroxyphenylmethane type epoxy resin, tetraphenylolethane type epoxy resin Epoxy such as resin, polyfunctional epoxy resin, hydantoin type epoxy resin, trisglycidyl isocyanurate type epoxy resin or glycidylamine type epoxy resin Resin can be used.

As the epoxy resin, among the examples, novolak type epoxy resin, biphenyl type epoxy resin, trishydroxyphenylmethane type epoxy resin, and tetraphenylolethane type epoxy resin are particularly preferable. This is because these epoxy resins are rich in reactivity with a phenol resin as a curing agent and are excellent in heat resistance and the like.

Furthermore, the phenol resin acts as a curing agent for the epoxy resin. For example, a novolak type phenol resin such as a phenol novolak resin, a phenol aralkyl resin, a cresol novolak resin, a tert-butylphenol novolak resin, a nonylphenol novolak resin, or a resol type. Examples thereof include phenol resins and polyoxystyrene such as polyparaoxystyrene. A phenol resin can be used individually or in combination of 2 or more types. Of these phenol resins, phenol novolac resins and phenol aralkyl resins are particularly preferred. This is because the connection reliability of the semiconductor device can be improved.

The mixing ratio of the epoxy resin and the phenol resin is preferably such that, for example, the hydroxyl group in the phenol resin is 0.5 equivalent to 2.0 equivalents per equivalent of epoxy group in the epoxy resin component. More preferred is 0.8 equivalents to 1.2 equivalents. That is, if the blending ratio of both is out of the above range, sufficient curing reaction does not proceed and the properties of the cured epoxy resin are likely to deteriorate.

In addition, an epoxy resin and a phenol resin thermosetting acceleration catalyst may be used. The thermosetting acceleration catalyst is not particularly limited, and can be appropriately selected from known thermosetting acceleration catalysts. A thermosetting acceleration | stimulation catalyst can be used individually or in combination of 2 or more types. As the thermosetting acceleration catalyst, for example, an amine-based curing accelerator, a phosphorus-based curing accelerator, an imidazole-based curing accelerator, a boron-based curing accelerator, a phosphorus-boron-based curing accelerator, or the like can be used.

As the epoxy resin curing agent, a phenol resin is preferably used as described above, but known curing agents such as imidazoles, amines, and acid anhydrides can also be used.

It is important that the adhesive layer 4 has adhesiveness (adhesiveness) to the adherend 9 such as an electronic device. Therefore, in order to crosslink the adhesive layer 4 to some extent in advance, a polyfunctional compound that reacts with the functional group at the end of the molecular chain of the polymer may be added as a crosslinking agent. Thereby, the adhesive property under high temperature can be improved and heat resistance can be improved.

The crosslinking agent is not particularly limited, and a known crosslinking agent can be used. Specifically, for example, an isocyanate crosslinking agent, an epoxy crosslinking agent, a melamine crosslinking agent, a peroxide crosslinking agent, a urea crosslinking agent, a metal alkoxide crosslinking agent, a metal chelate crosslinking agent, a metal salt Examples thereof include a system crosslinking agent, a carbodiimide crosslinking agent, an oxazoline crosslinking agent, an aziridine crosslinking agent, and an amine crosslinking agent. As the crosslinking agent, an isocyanate crosslinking agent or an epoxy crosslinking agent is suitable. Moreover, the said crosslinking agent can be used individually or in combination of 2 or more types.

In the present invention, instead of using a cross-linking agent or using a cross-linking agent, it is possible to carry out a cross-linking treatment by irradiation with an electron beam or ultraviolet rays.

Other additives can be appropriately blended in the adhesive layer 4 as necessary. Examples of other additives include fillers (fillers), flame retardants, silane coupling agents, ion trapping agents, bulking agents, antioxidants, antioxidants, and surfactants.

The soot filler may be either an inorganic filler or an organic filler, but an inorganic filler is preferred. By blending a filler such as an inorganic filler, the adhesive layer 4 can be improved in thermal conductivity, adjusted in elastic modulus, and the like. Examples of the inorganic filler include silica, clay, gypsum, calcium carbonate, barium sulfate, alumina, beryllium oxide, silicon carbide, aluminum nitride, silicon nitride and other ceramics, aluminum, copper, silver, gold, nickel, chromium, Examples include various inorganic powders made of metals such as lead, tin, zinc, palladium, solder, alloys, and other carbon. A filler can be used individually or in combination of 2 or more types. Among these, silica or alumina is particularly suitable as the filler, and fused silica is particularly suitable as the silica. The average particle size of the inorganic filler is preferably in the range of 0.001 μm to 80 μm. The average particle diameter of the inorganic filler can be measured by, for example, a laser diffraction type particle size distribution measuring apparatus.

The blending amount of the filler (particularly inorganic filler) is preferably 98% by weight or less (0% by weight to 98% by weight) with respect to the organic resin component, and particularly in the case of silica, 0% by weight to 70% by weight. In the case of a functional inorganic filler such as heat conduction or conductivity, the content is preferably 10% by weight to 98% by weight.

In addition, examples of the flame retardant include antimony trioxide, antimony pentoxide, brominated epoxy resin, and the like. A flame retardant can be used individually or in combination of 2 or more types. Examples of the silane coupling agent include β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, and the like. A silane coupling agent can be used individually or in combination of 2 or more types. Examples of the ion trapping agent include hydrotalcites and bismuth hydroxide. An ion trap agent can be used individually or in combination of 2 or more types.

The adhesive layer 4 contains, in particular, (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler from the viewpoints of adhesiveness and reliability. It is preferable to do.

(A) By using an epoxy resin, high adhesiveness, water resistance, and heat resistance can be obtained. As the epoxy resin, the above-described known epoxy resins can be used. (B) The above-mentioned well-known hardening | curing agent can be used for a hardening | curing agent.

(C) Acrylic resin has both high flexibility and strength and high toughness. A preferred acrylic resin has a Tg (glass transition temperature) of −50 ° C. to 50 ° C., and is obtained by polymerizing a monomer having an epoxy group, glycidyl group, alcoholic hydroxyl group, phenolic hydroxyl group or carboxyl group as a crosslinkable functional group. It is a crosslinkable functional group-containing (meth) acrylic copolymer. Furthermore, higher toughness can be obtained by containing acrylonitrile or the like and exhibiting rubber properties.
In addition, (C) phenoxy resin has high strength because phenoxy resin has a long molecular chain and is similar in structure to epoxy resin, acts as a flexible material in a composition with high crosslink density, and imparts high toughness. However, a tough composition can be obtained. Preferable phenoxy resins are those having a main skeleton of bisphenol A type, and other preferable examples include commercially available phenoxy resins such as bisphenol F type phenoxy resin, bisphenol A / F mixed type phenoxy resin and brominated phenoxy resin.

(D) The surface-treated inorganic filler includes inorganic filler surface-treated with a coupling agent. As the inorganic filler, the above-mentioned known inorganic fillers can be used, for example, silica and alumina. Due to the surface treatment with the coupling agent, the dispersibility of the inorganic filler is improved. For this reason, since the adhesive layer 4 excellent in fluidity | liquidity can be obtained, the adhesive force with the metal layer 3 can be improved. Further, since the inorganic filler can be highly filled, the water absorption rate can be lowered and the moisture resistance can be improved.

For example, the surface treatment of the inorganic filler with the silane coupling agent is performed by dispersing the inorganic filler in the silane coupling agent solution by a known method, so that the hydroxyl group and the silane coupling agent present on the surface of the inorganic filler are mixed. This is performed by reacting a hydrolyzable group such as an alkoxy group with a hydrolyzed silanol group to form a Si—O—Si bond on the surface of the inorganic filler.

The thickness of the adhesive layer 4 is not particularly limited, but is usually 3 μm or more, more preferably 5 μm or more from the viewpoint of easy handling, and preferably 150 μm or less in order to contribute to thinning of the semiconductor package, 100 μm or less is more preferable. The adhesive layer 4 may be composed of a single layer or a plurality of layers.

The adhesive layer 4 has a loss elastic modulus G ″ at 25 ° C. and 50% RH of 50 MPa or less. Further, the loss elastic modulus G ″ at 25 ° C. and 50% RH is preferably 0.2 MPa or more. .

The loss elastic modulus G ″ is a value when the temperature is raised from 10 ° C. at a heating rate of 5 ° C./min using a dynamic viscoelasticity measuring device, measured at a measurement frequency of 1 Hz, and reaches 25 ° C.

If the loss elastic modulus G ″ of the adhesive layer 4 at 25 ° C. and 50% RH is 50 MPa or less, the movable stage portion ST2 is disposed below the metal layer 3 and the adhesive layer 4 to be picked up and is drawn from the suction hole ST3. When the pressure-sensitive adhesive sheet 5 is sucked, the pressure-sensitive adhesive sheet 5 is satisfactorily peeled from the metal layer 3 and the adhesive layer 4, so that the metal layer 3 and the adhesive layer 4 are pulled by the pressure-sensitive adhesive sheet 5, and the movable stage portion ST2 At the edge portion, the metal layer 3 can be prevented from being bent or marked. If the loss elastic modulus G ″ is 0.2 MPa or more, when picking up the metal layer 3 and the adhesive layer 4, When the pressure-sensitive adhesive sheet 5 is expanded, peeling at the interface between the adhesive layer 4 and the metal layer 3, and the outer edge of the metal layer 3 is warped or the pickup cannot be prevented. You can.

The adhesive layer 4 has a peeling force (23 ° C., peeling angle of 180 degrees, linear speed of 300 mm / min) with the metal layer 3 in the B stage (uncured state or semi-cured state) of 0.3 N or more. Is preferred. If the peeling force is less than 0.3 N, peeling may occur between the adhesive layer 4 and the metal layer 3 during singulation (dicing).

The water absorption rate of the adhesive layer 4 is preferably 1.5 vol% or less. The method for measuring the water absorption rate is as follows. That is, using a 50 × 50 mm adhesive layer 4 (film adhesive) as a sample, the sample was dried in a vacuum dryer at 120 ° C. for 3 hours, allowed to cool in a desiccator, and then measured for dry mass. M1. The sample is immersed in distilled water at room temperature for 24 hours and then taken out. The surface of the sample is wiped off with a filter paper and quickly weighed to obtain M2. The water absorption rate is calculated by the following equation (1).

Here, d is the density of the film.
If the water absorption exceeds 1.5 vol%, package cracks may occur during solder reflow due to the absorbed water.

The saturated moisture absorption rate of the adhesive layer 4 is preferably 1.0 vol% or less. The method for measuring the saturated moisture absorption rate is as follows. That is, a circular adhesive layer 4 (film adhesive) having a diameter of 100 mm was used as a sample, the sample was dried in a vacuum dryer at 120 ° C. for 3 hours, allowed to cool in a desiccator, and then the dry mass was measured. To do. The sample is absorbed in a constant temperature and humidity chamber at 85 ° C. and 85% RH for 168 hours, then taken out, and weighed quickly to obtain M2. The saturated moisture absorption rate is calculated by the following equation (2).

Here, d is the density of the film.
When the saturated moisture absorption rate exceeds 1.0 vol%, the value of vapor pressure increases due to moisture absorption during reflow, and good reflow characteristics may not be obtained.

The residual volatile content of the adhesive layer 4 is preferably 3.0 wt% or less. The method for measuring the remaining volatile components is as follows. That is, using an adhesive layer 4 (film adhesive) having a size of 50 × 50 mm as a sample, measuring the initial mass of the sample as M1, and heating the sample at 200 ° C. for 2 hours in a hot air circulating thermostat, Weigh to M2. The remaining volatile content is calculated by the following equation (3).
Residual volatile matter (wt%) = [(M2-M1) / M1] × 100 (3)
If the residual volatile content exceeds 3.0 wt%, the solvent is volatilized by heating during packaging, and voids are generated inside the adhesive layer 4, which may cause package cracks.

Next, a method for manufacturing the electronic device package tape 1 according to the present embodiment will be described. First, a long metal layer 3 is prepared. As the metal layer 3, a commercially available metal foil may be used. Next, as shown to FIG. 4 (A), the metal layer 3 is bonded to the adhesion surface of the elongate base-material tape 2 using the bonding roller r.

Separately, a long film adhesive layer 4 is formed. The adhesive layer 4 can be formed using a conventional method of preparing a resin composition and forming it into a film-like layer. Specifically, for example, the resin composition is applied on a suitable separator (such as release paper) and dried (in the case where heat curing is necessary, heat treatment is performed as necessary to dry), Examples include a method of forming the adhesive layer 4. The resin composition may be a solution or a dispersion.

Next, as shown in FIG. 4 (B), the adhesive layer 4 peeled from the separator is bonded onto the metal layer 3 bonded to the base tape 2 using a bonding roller r or the like.

In addition, in the above, after bonding the metal layer 3 to the base tape 2, the adhesive layer 4 was bonded onto the metal layer 3, but the metal layer 3 and the adhesive layer 4 were bonded together. Then, the surface on the metal layer 3 side may be bonded to the base tape 2.

Next, as shown in FIG. 4 (C), the adhesive layer 4 and the metal layer 3 are pre-cut into a predetermined shape (here circular shape) using a press cutting blade or the like, and as shown in FIG. The unnecessary portion 6 is peeled off from the base tape 2 and removed. At this time, the adhesive layer 4 and the metal layer 3 may be separated into a predetermined size such as a size corresponding to the semiconductor chip C by using a circular cutting edge with a circular outer edge. Good.

The method for forming the metal layer 3 and the adhesive layer 4 having a predetermined shape on the base tape 2 is not limited to the above, and the long metal layer 3 is formed on the long base tape 2. After bonding and punching into a predetermined shape and removing the unnecessary portion 6, the adhesive layer 4 formed in a predetermined shape may be bonded onto the metal layer 3 having a predetermined shape, The metal layer 3 and the adhesive layer 4 formed on the substrate may be bonded to the base tape 2, but from the simplicity of the manufacturing process, the metal layer 3 and the adhesive layer 4 are manufactured by the steps shown in FIGS. It is preferable.

Separately, the adhesive tape 5 is produced. The base film can be formed by a conventionally known film forming method. Examples of the film forming method include a calendar film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, and a dry lamination method. Next, the pressure-sensitive adhesive layer composition is applied onto the base film and dried (heat-crosslinked as necessary) to form the pressure-sensitive adhesive layer 52. Examples of the coating method include roll coating, screen coating, and gravure coating. Note that the pressure-sensitive adhesive layer composition may be applied directly to the base film to form the pressure-sensitive adhesive layer 52 on the base film 51, or the surface of the pressure-sensitive adhesive layer composition is peeled off. The pressure-sensitive adhesive layer 52 may be transferred to the base film 51 after being applied to paper or the like to form the pressure-sensitive adhesive layer 52. Thereby, the adhesive tape 5 in which the adhesive layer 52 was formed on the base film 51 is produced.

Thereafter, as shown in FIG. 5A, the pressure-sensitive adhesive layer 52 of the pressure-sensitive adhesive tape 5 is formed on the surface of the metal layer 3 and the adhesive layer 4 on the side of the adhesive layer 4 on the base tape 2. The adhesive tape 5 is laminated so that the side surface contacts.

Next, as shown in FIG. 5 (B), the adhesive tape 5 is pre-cut into a predetermined shape using a press cutting blade or the like, and the surrounding unnecessary portion 7 is removed from the base tape 2 as shown in FIG. 5 (C). The tape 1 for electronic device package is made by peeling and removing. After that, the base tape 2 used for the precut processing may be peeled off and a known separator may be bonded to the adhesive layer 52 of the adhesive tape 5.

<How to use>
Next, a method for manufacturing the electronic device package 8 using the electronic device package tape 1 of the present embodiment will be described with reference to FIGS. In the present embodiment, the electronic device package 8 will be described by taking a semiconductor chip C flip-chip connected to the adherend 9 as an example.

[Mounting process of semiconductor wafer W]
First, a separate dicing tape D similar to the adhesive tape 5 of the electronic device package tape 1 of the present invention is prepared, and a semiconductor as shown in FIG. The wafer W is adhered and held and fixed by adhering (mounting process of the semiconductor wafer W), and the ring frame R is adhered to the peripheral portion of the dicing tape D. At this time, the dicing tape D is attached to the back surface of the semiconductor wafer W. The back surface of the semiconductor wafer W means a surface opposite to the circuit surface (also referred to as a non-circuit surface or a non-electrode forming surface). Although the sticking method is not specifically limited, the method by thermocompression bonding is preferable. The crimping is usually performed while pressing with a pressing means such as a crimping roll.

[Dicing process of semiconductor wafer W]
Next, as shown in FIG. 6B, the semiconductor wafer W is diced. As a result, the semiconductor wafer W is cut into a predetermined size and divided into pieces (small pieces), whereby the semiconductor chip C is manufactured. For example, the dicing is performed from the circuit surface side of the semiconductor wafer W according to a conventional method. Further, in this step, for example, a cutting method called full cut in which cutting is performed up to the dicing tape D can be employed. It does not specifically limit as a dicing apparatus used at this process, A conventionally well-known thing can be used. In addition, when expanding the dicing tape D, the expanding can be performed using a conventionally known expanding apparatus.

[Pickup process of semiconductor chip C]
As shown in FIG. 6C, the semiconductor chip C is picked up, and the semiconductor chip C is peeled off from the dicing tape D. The pickup method is not particularly limited, and various conventionally known methods can be employed. For example, a dicing tape D to which a semiconductor chip C and a ring frame R are bonded is placed on a stage S of a pickup device with the base film side down, and the ring frame R is fixed in a hollow cylindrical shape. The push-up member T is raised and the dicing tape D is expanded. In this state, a method of pushing up each semiconductor chip C from the base film side of the dicing tape D with a pin N and picking up the pushed-up semiconductor chip C with a pickup device can be used.

[Flip chip connection process]
As shown in FIG. 6D, the picked-up semiconductor chip C is fixed to an adherend 9 such as a substrate by a flip chip bonding method (flip chip mounting method). Specifically, the semiconductor chip C is always placed on the adherend 9 such that the circuit surface (also referred to as a surface, a circuit pattern formation surface, an electrode formation surface, etc.) of the semiconductor chip C faces the adherend 9. Fix according to law. For example, first, flux is attached to the bumps 10 as connection portions formed on the circuit surface side of the semiconductor chip C. Next, the bump 10 and the conductive material 11 are melted while bringing the bump 10 of the semiconductor chip C into contact with the bonding conductive material 11 (solder or the like) attached to the connection pad of the adherend 9 and pressing it. The electrical conduction between the semiconductor chip C and the adherend 9 can be ensured, and the semiconductor chip C can be fixed to the adherend 9 (flip chip bonding step). At this time, a gap is formed between the semiconductor chip C and the adherend 9, and the gap distance is generally about 30 μm to 300 μm. The flux remaining on the opposing surface or gap between the semiconductor chip C and the adherend 9 is removed by washing.

As the adherend 9, various substrates such as a lead frame and a circuit substrate (such as a wiring circuit substrate) can be used. The material of such a substrate is not particularly limited, and examples thereof include a ceramic substrate and a plastic substrate. Examples of the plastic substrate include an epoxy substrate, a bismaleimide triazine substrate, and a polyimide substrate. Also, a chip-on-chip structure can be obtained by using another semiconductor chip as the adherend 9 and flip-chip connection of the semiconductor chip C.

Next, as shown in FIG. 7A, the base tape 2 of the electronic device package tape 1 according to the present embodiment is peeled to expose the adhesive layer 52 of the metal layer 3 and the adhesive tape 5, The peripheral edge of the adhesive layer 52 is fixed to the ring frame R.

Next, as shown in FIG. 7B, the metal layer 3 and the adhesive layer 4 are cut into pieces corresponding to the semiconductor chip C and separated into pieces. The cutting can be performed in the same process as the dicing process of the semiconductor wafer W described above. In addition, this process is not performed when the pre-cut process which separates the metal layer 3 and the adhesive bond layer 4 previously is performed.

Next, the separated metal layer 3 and adhesive layer 4 are picked up and peeled off from the adhesive tape 5. The pickup is performed using a slider type pickup device as shown in FIG. As the slider type pickup device, a device for picking up a conventional semiconductor chip C as shown in FIGS. 9 and 10 can be used. That is, as shown in FIG. 7C, the suction hole ST3 (see FIG. 10) in a state where the individual pieces of the metal layer 3 and the adhesive layer 4 are adsorbed (held) by the collet (adsorption collet) K from above. Then, the adhesive tape 5 is sucked downward. As a result, the pressure-sensitive adhesive tape 5 around the movable stage portion ST2 is sucked, and the pressure-sensitive adhesive tape 5 is peeled off at the outer edge portions of the individual pieces of the metal layer 3 and the adhesive layer 4. Thereafter, the movable stage unit ST2 is moved leftward in FIG. As a result, the receiving area of the individual pieces of the metal layer 3 and the adhesive layer 4 received at the movable stage portion ST2 is reduced, and the area where the adhesive tape 5 is sucked is increased. The pieces of the metal layer 3 with the adhesive layer 4 are completely peeled off from the adhesive tape 5. At this time, the tack force of the pressure-sensitive adhesive layer 52 is 2 to 200 kPa, and the loss elastic modulus at 25 ° C. and 50% RH of the adhesive layer 4 is 50 MPa or less. When the pressure-sensitive adhesive tape 5 is sucked by being disposed below the pieces of the layer 4, the pieces of the metal layer 3 with the adhesive layer 4 are peeled off from the pressure-sensitive adhesive tape 5 satisfactorily. As a result, it is possible to suppress the metal layer 3 from being bent or marked by the edge portion of the movable stage portion ST2 of the pickup device.

Next, the picked-up metal layer 3 and the adhesive layer 4 side of the adhesive layer 4 are bonded to the back surface of the flip-chip connected semiconductor chip C as shown in FIG. Thereafter, the periphery of the semiconductor chip C with the metal layer 3 and the gap between the semiconductor chip C and the adherend 9 are filled with a sealing material (such as a sealing resin) and sealed. Sealing is performed according to a conventional method. At this time, since the metal layer 3 is provided on the back surface of the semiconductor chip C, warping caused by a difference in thermal expansion coefficient between the semiconductor chip C and the adherend 9 in the flip chip bonding process is caused. 3 is offset by the difference in coefficient of thermal expansion from 3. In addition, since the metal layer 3 is provided on the back surface of the semiconductor chip C, heat generated during use as an electronic device is dissipated by the metal layer 3.

In the above description, the package structure in which the metal layer 3 is directly provided on the back surface of the semiconductor chip C via the adhesive layer 4 and the metal layer 3 is also sealed together with the semiconductor chip C has been described. However, the semiconductor chip C is sealed. Thereafter, the metal layer 3 may be provided on the upper surface of the sealing body via the adhesive layer 4. Since the electronic device package 8 warps during sealing, the warping during sealing can be offset by providing the metal layer 3 on the upper surface of the sealing body.

In the above description, the semiconductor chip C flip-chip connected on the adherend 9 is described as an example of the electronic device package 8, but the present invention is not limited to this, and for example, the same size on the semiconductor chip. In an electronic device package structure in which other semiconductor chips are stacked, the lower semiconductor chip is interposed via an adhesive layer 4 in order to use the metal layer 3 of the electronic device package tape 1 of the present invention as a spacer between the two chips. The metal layer 3 may be provided thereon.

In this embodiment, the pressure-sensitive adhesive layer 52, the adhesive layer 4, and the metal layer 3 are provided in this order. However, the pressure-sensitive adhesive layer 52, the metal layer 3, and the adhesive layer 4 are provided in this order. Also good. In this case, a semiconductor wafer can be bonded onto the adhesive layer 4, the semiconductor wafer, the metal layer 3, and the adhesive layer 4 can be diced and picked up together. However, as described above, the semiconductor wafer, the metal layer 3 and the adhesive layer 4 are separately diced and picked up, and after the semiconductor chip is flip-chip connected, the metal layer 3 is attached to the semiconductor chip on the semiconductor chip. In this case, since the tack force of the pressure-sensitive adhesive layer 52 is 2 to 200 kPa and the loss elastic modulus at 25 ° C. and 50% RH of the adhesive layer 4 is 50 MPa or less, the adhesive layer When the metal layer 3 with 4 is picked up from the adhesive tape 5, it is possible to prevent the metal layer from being bent or marked by the edge portion of the movable stage portion ST2 of the pickup device.

<Example>
Next, in order to further clarify the effects of the present invention, examples and comparative examples will be described in detail, but the present invention is not limited to these examples.

(1) Preparation of adhesive tape <Adhesive layer composition (1)>
As the acrylic copolymer (A1) having a functional group, a copolymer comprising 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and acrylic acid, the ratio of 2-ethylhexyl acrylate being 80 mol%, and the weight average molecular weight being 700,000 Was prepared. Next, 14 mol% of 2-isocyanatoethyl methacrylate was added to prepare an acrylic copolymer (a-1) having a glass transition temperature of −70 ° C.

To 100 parts by mass of the acrylic copolymer (a-1), 10 parts by mass of Coronate L (manufactured by Tosoh Corporation, trade name) is added as a polyisocyanate, and Irgacure 184 (manufactured by BASF Corporation) as a photopolymerization initiator. A mixture obtained by adding 3 parts by mass of (trade name) was dissolved in ethyl acetate and stirred to obtain an adhesive layer composition (1).

<Adhesive layer composition (2)>
The acrylic copolymer (A1) having a functional group is composed of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, methyl acrylate and methacrylic acid. The ratio of 2-ethylhexyl acrylate is 26 mol%, and the weight average molecular weight is 500,000. A copolymer was prepared. Next, 10 mol% of 2-isocyanatoethyl methacrylate was added to prepare an acrylic copolymer (a-2) having a glass transition temperature of −20 ° C.

2 parts by mass of Coronate L (trade name, manufactured by Tosoh Corporation) as a polyisocyanate is added to 100 parts by mass of the acrylic copolymer (a-2), and Irgacure 651 (manufactured by BASF Corporation) is used as a photopolymerization initiator. A mixture obtained by adding 3 parts by mass of the product name) was dissolved in ethyl acetate and stirred to obtain an adhesive layer composition (2).

<Adhesive layer composition (3)>
The acrylic copolymer (A1) having a functional group is composed of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, methyl acrylate and methacrylic acid. The ratio of 2-ethylhexyl acrylate is 26 mol%, and the weight average molecular weight is 500,000. An acrylic copolymer (a-3) having a glass transition temperature of −11 ° C. was prepared.

To 100 parts by mass of the acrylic copolymer (a-3), 2 parts by mass of Coronate L (manufactured by Tosoh Corporation, trade name) is added as a polyisocyanate, and Irgacure 651 (manufactured by BASF Corporation) is used as a photopolymerization initiator. A mixture obtained by adding 3 parts by mass of (trade name) was dissolved in ethyl acetate and stirred to obtain an adhesive layer composition (3).

The following was produced as a base film.
<Base film (1)>
An ethylene-methacrylic acid copolymer zinc ionomer (methacrylic acid content 13%, softening point 72 ° C., melting point 90 ° C.) is melted at 140 ° C., and a long film 90 μm thick using an extruder. The base film (1) was produced by forming into a shape.

<Base film (2)>
Resin beads of low-density polyethylene (LDPE, density 0.92 g / cm ³ , melting point 110 ° C.) are melted at 200 ° C. and formed into a long film having a thickness of 150 μm using an extruder to form a base film (2 ) Was produced.

<Adhesive tape (1)>
The pressure-sensitive adhesive layer composition (1) was applied to a release liner made of a polyethylene-terephthalate film subjected to a release treatment so that the thickness after drying was 20 μm, and dried at 110 ° C. for 3 minutes. After making it into a layer, it was bonded to the base film (1) to produce an adhesive tape (1).

<Adhesive tape (2)>
An adhesive tape (2) was produced in the same manner as the adhesive tape (1) except that the thickness of the adhesive layer was changed to 35 μm.

<Adhesive tape (3)>
An adhesive tape (3) was produced in the same manner as the adhesive tape (1) except that the adhesive layer composition (2) and the base film (2) were used.

<Adhesive tape (4)>
An adhesive tape (4) was produced in the same manner as the adhesive tape (3) except that the thickness of the adhesive layer was changed to 35 μm.

<Adhesive tape (5)>
A pressure-sensitive adhesive tape (5) was produced in the same manner as the pressure-sensitive adhesive tape (2) except that the pressure-sensitive adhesive layer composition (3) was used.

<Adhesive tape (6)>
An adhesive tape (6) was produced in the same manner as the adhesive tape (1) except that the thickness of the adhesive layer was changed to 5 μm.

(2) Preparation of adhesive layer

<Adhesive layer (1)>
Acrylic resin (manufactured by Nagase ChemteX Corporation, trade name “Taisan Resin SG-P3”, Mw 850,000, Tg 12 ° C.) 80 parts by mass and naphthalene type epoxy resin (manufactured by DIC Corporation, trade name “HP-4700”) 10 An adhesive layer composition solution was prepared by dissolving 10 parts by mass of phenol resin (trade name “MEH7851”, manufactured by Meiwa Kasei Co., Ltd.) as a curing agent in methyl ethyl ketone. This adhesive layer composition solution was applied on a release film (release liner) made of a polyethylene terephthalate film having a thickness of 50 μm after the silicone release treatment, and then dried at 130 ° C. for 5 minutes. Thereby, an adhesive layer (1) having a thickness of 20 μm was produced.

<Adhesive layer (2)>
100 parts by mass of acrylic resin (manufactured by Nagase ChemteX Corporation, trade name “Taisan Resin SG-70L”, Mw 850,000, Tg 12 ° C.) and cresol novolac type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., trade name “EOCN-1020” ”Epoxy equivalent 198, softening point 64 ° C.) 353 parts by mass, liquid bisphenol A type epoxy resin (Nippon Steel Sumikin Chemical Co., Ltd., trade name“ YD-128 ”, Mw 400, epoxy equivalent 190), 46 parts by mass, as a curing agent 3 parts by mass of imidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., trade name “2PHZ-PW”), 330 parts by mass of silica filler (manufactured by Admatechs, trade name “SO-C2”, average particle size 0.5 μm) An adhesive layer composition solution was prepared by dissolving or dispersing in methyl ethyl ketone. From this adhesive layer composition solution, an adhesive layer (2) having a thickness of 20 μm was produced in the same manner as the adhesive layer (1).

<Adhesive layer (3)>
100 parts by mass of bisphenol A type phenoxy resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name “YP-50S”, Mw 60,000, Tg 84 ° C.) and cresol novolac type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., trade name “EOCN-”) 1020 ", epoxy equivalent 198, softening point 64 ° C) 40 parts by mass, liquid bisphenol A type epoxy resin (Nippon Steel & Sumikin Chemical Co., Ltd., trade name" YD-128 ", Mw400, epoxy equivalent 190) 100 parts by mass, as curing agent 1.5 parts by mass of imidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., trade name “2PHZ-PW”), 200 mass of silica filler (manufactured by Admatechs Co., Ltd., trade name “SO-C2”, average particle size 0.5 μm) The part was dissolved or dispersed in methyl ethyl ketone to prepare an adhesive layer composition solution. From this adhesive layer composition solution, an adhesive layer (3) having a thickness of 20 μm was produced in the same manner as the adhesive layer (1).

<Adhesive layer (4)>
10 parts by mass of acrylonitrile butadiene rubber (acrylonitrile content 40% by mass), 17 parts by mass of novolac type epoxy resin (DIC Corporation, trade name “N-775”, epoxy equivalent 195, softening point 78 ° C.), liquid bisphenol A type Epoxy resin (Nippon Steel & Sumikin Chemical Co., Ltd., trade name “YD-128”, Mw400, epoxy equivalent 190) 40 parts by mass, phenol resin as a curing agent (trade name “H-4” manufactured by Meiwa Kasei Co., Ltd.) 32 masses The part was dissolved in methyl ethyl ketone to prepare an adhesive layer composition solution. From this adhesive layer composition solution, an adhesive layer (4) having a thickness of 20 μm was produced in the same manner as the adhesive layer (1).

<Adhesive layer (5)>
100 parts by mass of acrylic resin (manufactured by Nagase ChemteX Corporation, trade name “Taisan Resin SG-708-6”, Tg 6 ° C.) and solid bisphenol A type epoxy resin (trade name “1004”, made by Mitsubishi Chemical Corporation), softening 280 parts by mass of a point 97 ° C), phenol resin as a curing agent (trade name “Mirex XLC-4L”, melting point 62 ° C., manufactured by Mitsui Chemicals, Inc.) 306 parts by mass, silica filler (manufactured by Admatechs Co., Ltd., trade name “ 237 parts by mass of “SO—C2” (average particle size 0.5 μm) were dissolved or dispersed in methyl ethyl ketone to prepare an adhesive layer composition solution. From this adhesive layer composition solution, an adhesive layer (5) having a thickness of 20 μm was prepared in the same manner as the adhesive layer (1).

The following metal layers were prepared.
<Metal layer (1)>
1085 (manufactured by UACJ, aluminum foil, thickness 150 μm)
<Metal layer (2)>
1085 (manufactured by UACJ, aluminum foil, thickness 20 μm)
<Metal layer (3)>
F0-WS (trade name, manufactured by Furukawa Electric Co., Ltd., copper foil, thickness 6 μm)

(5) Production of tape for electronic device package <Example 1>
A single-sided adhesive film was prepared by bonding the adhesive layer (1) formed on the release liner and the metal layer (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s. The single-sided adhesive film was pre-cut into a circular shape smaller than the pressure-sensitive adhesive tape (1) so that the pressure-sensitive adhesive tape (1) could be bonded to the ring frame. The adhesive layer (1) side exposed by peeling the release treatment film of the single-sided adhesive film and the adhesive layer of the adhesive tape (1) are exposed so that the adhesive layer is exposed around the single-sided adhesive film. Then, an electronic device package tape according to Example 1 as shown in FIG. 1 was produced.

<Examples 2 to 8, Comparative Examples 1 to 3>
For electronic device packages of Examples 2 to 8 and Comparative Examples 1 to 3 in the same manner as in Example 1, except that the combination of the adhesive tape, the adhesive layer composition, and the metal layer was changed to the combination shown in Table 1. A tape was prepared.

<Example 9>
By using the combination of the pressure-sensitive adhesive tape, adhesive layer and metal layer described in Table 1, the same method as in Example 1 except that the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape and the metal layer side of the single-sided adhesive film were bonded together. Then, an electronic device package tape of Example 9 was produced.

The following measurements and evaluations were performed on the tapes for electronic device packages according to Examples 1 to 9 and Comparative Examples 1 to 3. The results are shown in Table 1.

(Measurement of tack force)
The tack force of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape according to each example and comparative example was measured as follows using a tacking tester TAC-II manufactured by Reska Co., Ltd. For the tape for electronic device packaging that requires ultraviolet irradiation immediately before the pickup other than Comparative Example 2, before measurement, ultraviolet rays were applied to the adhesive layer from the base film side by an air-cooled high-pressure mercury lamp (80 W / cm, irradiation distance 10 cm). Irradiated with 200 mJ / cm ² . As the measurement mode, “Constant Load” was used in which the probe was pushed down to the set pressure value and kept controlled until the set time passed. The pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape according to each example and comparative example was faced up, and a probe made of SUS304 having a diameter of 3.0 mm was contacted from above. The speed at which the probe was brought into contact with the measurement sample was 0.5 mm / s, the contact load was 694 mN / mm ² , and the contact time was 10 seconds. Thereafter, the probe was peeled upward at a peeling speed of 10 mm / s, the force required for peeling was measured, and the peak value was read. The probe temperature was 25 ° C. and the plate temperature was 25 ° C. The measurement result was an average value of n = 5.

(Measurement of loss modulus)
The adhesive layers according to each of the examples and comparative examples were cut to a size of 5.0 cm × 5.0 cm, laminated, and bonded on a hot plate at a stage of 70 ° C. with a hand roller. A test piece of 0 mm was obtained. About this test piece, using a rheometer (trade name “RS6000”) manufactured by Haake, the temperature was raised in a temperature range of 10 to 150 ° C. and a heating rate of 5 ° C./min to obtain a loss elastic modulus G ″ at 25 ° C. The measurement was performed at 50% RH and a measurement frequency of 1 Hz.

(Pickup test)
The metal layer and the adhesive layer of the tape for electronic device packages according to the above examples and comparative examples were separated into pieces so that a plurality of samples having a size of 5 mm × 5 mm could be formed. Thereafter, with respect to the pressure-sensitive adhesive tape that needs to be irradiated with ultraviolet rays before pickup, the pressure-sensitive adhesive layer was irradiated with ultraviolet rays of 200 mJ / cm ² from the base film side by an air-cooled high-pressure mercury lamp (80 W / cm, irradiation distance 10 cm). Pick up the 250 sample samples in the center of the electronic device package tape using a die picker device (trade name “CAP-300II”) manufactured by Canon Machinery Co., Ltd. did. Samples with a pick-up of 98% or more were evaluated as “good”, and those with less than 98% were evaluated as “poor”. The evaluation results are shown in Table 1. In addition, the case where the phenomenon that the apparatus stopped without picking up the singulated sample did not occur was regarded as “can be picked up”.
Moreover, about the metal layer with an adhesive layer used as the object of pick-up irrespective of the above pick-up possibility, what did not have a crease | fold or a mark in a metal layer visually was considered as a success sample, and the success rate of pick-up was computed. In the calculation results, those with a success rate of 99% or more are the best products, ◎ 90% or more and less than 99% are good products, 70% or more and less than 90% are acceptable products, △, less than 70% Was evaluated as x as a defective product. The evaluation results are shown in Table 1.

<Pickup conditions>
Collet: Boy dress type Collet Size: 5mm x 5mm
Pickup method: Slider type (needleless type)
Slider (movable stage) width: 5 mm
Overhang amount (projection amount from slider end surface of one end of individual sample): 0.3 mm
Expand: 3mm
Slider speed 20mm / sec

As shown in Table 1, in the tapes for electronic device packages according to Examples 1 to 9, the tack force of the pressure-sensitive adhesive layer in the state where the laminate of the adhesive layer and the metal agent layer is picked up from the pressure-sensitive adhesive tape is 2. 2 to 162 kPa, 2 to 200 kPa as defined in the claims, and the loss elastic modulus at 25 ° C. and 50% RH of the adhesive layer is 43 MPa or less and 50 MPa or less as defined in the claims. Good results in the success rate evaluation.

On the other hand, since the loss elastic modulus of the adhesive layer at 25 ° C. and 50% RH of the tape for electronic device package according to Comparative Example 1 exceeds 50 MPa, the adhesive layer and the metal agent layer are laminated from the adhesive tape. The body could not be peeled off successfully, resulting in poor results in the evaluation of pickup availability and pickup success rate.

In the tape for electronic device packages according to Comparative Example 2, the tack force of the pressure-sensitive adhesive layer in a state where the laminate of the adhesive layer and the metal agent layer is picked up from the pressure-sensitive adhesive tape exceeds 200 kPa. The laminate of the layer and the metal agent layer could not be peeled off successfully, resulting in inferior results in the evaluation of pickup availability and pickup success rate.

In the tape for electronic device packages according to Comparative Example 3, the tack force of the pressure-sensitive adhesive layer in a state where the laminate of the adhesive layer and the metal agent layer is picked up from the pressure-sensitive adhesive tape is less than 2 kPa. It was possible to peel off the laminate of the metal layer and the metal agent layer, but when the adhesive tape was expanded, the outer edge of the metal layer with the adhesive layer was peeled and warped, and the metal layer with more than half was folded. There was a mark left.

1: Tape for electronic device package 2: Base tape 3: Metal layer 4: Adhesive layer 5: Adhesive tape 5a: Label portion 5b: Peripheral portion

Claims

An adhesive tape having a base film and an adhesive layer;
Having a laminate of an adhesive layer and a metal layer provided on the side opposite to the base film of the pressure-sensitive adhesive layer;
The tack force of the pressure-sensitive adhesive layer in a state where the laminate is picked up from the pressure-sensitive adhesive tape is 2 to 200 kPa,
The tape for electronic device packages, wherein the adhesive layer has a loss elastic modulus at 25 ° C. and 50% RH of 50 MPa or less.
The electronic device package tape according to claim 1, wherein the loss elastic modulus at 25 ° C. and 50% RH of the adhesive layer is 0.2 MPa or more.
3. The electronic device package tape according to claim 1, wherein the metal layer contains copper or aluminum.
The electronic device package tape according to any one of claims 1 to 3, wherein the metal layer has a thickness of 5 µm or more and less than 200 µm.
The adhesive layer contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler. The tape for electronic device packages as described in any one of Claims 4-5.
The pressure-sensitive adhesive layer comprises an acrylic ester represented by CH 2 = CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and radical reactivity in the molecule. The tape for electronic device packages according to any one of claims 1 to 5, comprising an acrylic polymer comprising an isocyanate compound having a carbon-carbon double bond.