WO2017159661A1 - Conveying fixing jig - Google Patents
Conveying fixing jig Download PDFInfo
- Publication number
- WO2017159661A1 WO2017159661A1 PCT/JP2017/010140 JP2017010140W WO2017159661A1 WO 2017159661 A1 WO2017159661 A1 WO 2017159661A1 JP 2017010140 W JP2017010140 W JP 2017010140W WO 2017159661 A1 WO2017159661 A1 WO 2017159661A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive
- carbon nanotube
- adhesive layer
- fixing jig
- base material
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Definitions
- the present invention relates to a conveyance fixing jig.
- the workpieces When transporting materials, intermediate products, products, etc. (hereinafter also referred to as workpieces) in the manufacturing process of semiconductor elements, etc., the workpieces are transported using a transport base such as a movable arm or a movable table. (For example, refer to Patent Documents 1 and 2).
- a transport base such as a movable arm or a movable table.
- the member (conveyance fixing jig) on which the workpiece is placed is required to have a strong grip force so that the workpiece does not shift during conveyance.
- a demand is increasing year by year together with a demand for speeding up the manufacturing process.
- the conventional conveyance fixing jig has a problem that the workpiece is held by an elastic material such as a resin, and the elastic material is likely to adhere and remain on the workpiece.
- an elastic material such as a resin has a problem that heat resistance is low, and grip force is reduced under a high temperature environment.
- the conveyance fixture composed of such a material has a problem that the gripping force is essentially low and the workpiece cannot be sufficiently held even at room temperature.
- a method of holding the workpiece under a high temperature environment there are a method of suctioning under reduced pressure, a method of fixing the workpiece by the shape of the conveyance fixing jig (for example, chucking, counterboring, etc.) and the like.
- the method of adsorbing under reduced pressure is effective only under an air atmosphere and cannot be employed under vacuum in a CVD process or the like.
- the method of fixing the workpiece by the shape of the conveyance fixing jig there is a problem that the workpiece is damaged or particles are generated due to contact between the workpiece and the conveyance fixing jig.
- An object of the present invention is to provide a conveyance fixing jig which has a high grip force, hardly contaminates a workpiece (conveyed object) and is excellent in heat resistance.
- the conveyance fixture of the present invention includes a first base material, a carbon nanotube aggregate, and an adhesive layer disposed between the first base material and the carbon nanotube aggregate.
- 1 substrate and the aggregate of carbon nanotubes are bonded via the adhesive layer, and the ratio of the linear expansion coefficient of the first substrate to the linear expansion coefficient of the adhesive layer (adhesive layer / Base material) is 0.7 to 1.8.
- the aggregate of carbon nanotubes is formed on a second base material, and the first base material and the second base material are bonded via the adhesive layer.
- the adhesive constituting the adhesive layer is an inorganic adhesive or a carbon adhesive.
- the inorganic adhesive is a ceramic adhesive.
- the elastic modulus change of the adhesive layer is 50% or less when the conveyance fixture is left at 450 ° C. for 1 hour.
- the adhesive layer has a linear expansion coefficient of 5 ppm / ° C. to 12 ppm / ° C.
- the material which comprises the said 1st base material is an alumina.
- the coefficient of static friction at 23 ° C. with respect to the glass surface of the carbon nanotube aggregate surface is 1 to 50. According to another situation of this invention, the manufacturing method of the said conveyance fixing jig is provided.
- an adhesive is applied on a first substrate to form an application layer, an aggregate of carbon nanotubes is disposed on the application layer, the application layer is cured, and an adhesive layer is formed. Forming and bonding the first substrate and the aggregate of carbon nanotubes via the adhesive layer, the linear expansion coefficient of the first substrate, and the line of the adhesive layer
- the ratio of the expansion coefficient is 0.7 to 1.8.
- the conveyance fixing jig of the present invention includes a carbon nanotube aggregate disposed on the first base material, and the workpiece can be fixed by the carbon nanotube aggregate. High, difficult to contaminate work piece (conveyed object) and excellent in heat resistance.
- the first base material and the carbon nanotube aggregate are joined via an adhesive layer, and the ratio of the linear expansion coefficient of the first base material to the linear expansion coefficient of the adhesive layer (adhesive layer / By setting the base material to a specific range, the aggregate of carbon nanotubes is hardly detached even at high temperatures, and the work piece (conveyed object) can be fixed well.
- A. Overview Figure 1 of the transport fixture is a schematic cross-sectional view of the transport fixture according to one embodiment of the present invention.
- the conveyance fixture 100 includes a first base material 10, a carbon nanotube aggregate 31, and an adhesive layer 20 disposed between the first base material 10 and the carbon nanotube aggregate 31.
- the first base material 10 and the carbon nanotube aggregate 31 are bonded via the adhesive layer 20.
- the carbon nanotube aggregate 31 may be provided on the entire surface of the first base material 10 or may be provided on a part of the surface of the first base material 10.
- the carbon nanotube aggregate 31 is composed of a plurality of carbon nanotubes 32.
- the carbon nanotubes 32 are oriented in the direction of the length L, and the carbon nanotube aggregate 31 is configured as a fibrous columnar structure.
- the carbon nanotubes 32 are preferably oriented in a substantially vertical direction with respect to the first base material 10.
- the “substantially perpendicular direction” means that the angle with respect to the surface of the substrate 20 is preferably 90 ° ⁇ 20 °, more preferably 90 ° ⁇ 15 °, and further preferably 90 ° ⁇ 10 °. And particularly preferably 90 ° ⁇ 5 °.
- FIG. 2 is a schematic cross-sectional view of a conveyance fixing jig according to another embodiment of the present invention.
- the carbon nanotube aggregate 31 is formed on the second base material 33.
- the adhesive layer 20 is disposed on the side of the second base material 33 where the carbon nanotube aggregate 31 is not formed.
- the first base material 10 and the second base material 32 are joined via the adhesive layer 20.
- the conveyance fixing jig of the present invention can be suitably used in, for example, a semiconductor element manufacturing process, an optical member manufacturing process, and the like. More specifically, the conveyance fixing jig of the present invention is a material, an intermediate product, a product, etc. (specifically, a semiconductor material, a wafer) between processes in a semiconductor element manufacturing process or within a predetermined process. , Chips, films, etc.). Moreover, it can be used for transferring a glass substrate or the like between processes in manufacturing an optical member or within a predetermined process.
- materials, intermediate products, products, and the like that can be transported by the transport apparatus of the present invention may be referred to as workpieces or transported objects.
- the coefficient of static friction at 23 ° C. with respect to the glass surface of the carbon nanotube assembly side surface of the conveyance fixture is preferably 1.0 or more.
- the upper limit value of the static friction coefficient is preferably 50. If it is such a range, the conveyance fixing jig excellent in grip property can be obtained. In addition, it cannot be overemphasized that the said conveyance fixing jig with a large friction coefficient with respect to the glass surface can express strong grip property also to the mounted object (for example, semiconductor wafer) comprised from materials other than glass.
- the said 1st base material functions as a conveyance base material at the time of conveying a semiconductor material, an electronic material, etc.
- Examples of the form of the first base material include a transport arm, a transport table, a transport ring, a transport guide rail, a storage cassette, a hook, and a transport frame.
- the size and shape of the first substrate can be appropriately selected according to the purpose.
- the first substrate may be a part of a transfer arm, a transfer table, a transfer ring, a transfer guide rail, a storage cassette, a hook, a transfer frame, and the like.
- An example of the case where the first substrate is a transfer arm is shown in the schematic perspective view of FIG.
- a carbon nanotube aggregate 31 is disposed at one end of the first base material 10 as a transport arm.
- FIG. 1 described above is a cross-sectional view taken along the line II of the conveyance fixing jig 100.
- any appropriate material can be adopted as the material constituting the first base material.
- a ceramic material such as alumina or silicon nitride; a heat resistant material such as stainless steel is used as a material constituting the conveyance base material.
- alumina is used.
- the linear expansion coefficient of the first base material is preferably 2 ppm / ° C. to 12 ppm / ° C., more preferably 3 ppm / ° C. to 12 ppm / ° C., further preferably 5 ppm / ° C. to 12 ppm / ° C., More preferably, it is 6 ppm / ° C. to 9 ppm / ° C. If it is such a range, the conveyance fixing jig which can function satisfactorily also under high temperature can be obtained.
- the linear expansion coefficient can be measured by a thermomechanical analyzer (TMA).
- the volume expansion coefficient of the first base material is preferably 15 ppm / ° C. to 36 ppm / ° C., more preferably 18 ppm / ° C. to 27 ppm / ° C. If it is such a range, the conveyance fixing jig which can function satisfactorily also under high temperature can be obtained.
- the ratio of the linear expansion coefficient of the first base material to the linear expansion coefficient of the adhesive layer (adhesive layer / base material) is 0.7 to 1.8.
- the ratio of the linear expansion coefficients in such a range, the aggregate of carbon nanotubes is hardly detached even at a high temperature (for example, 450 ° C.), and the workpiece (conveyed object) is A conveyance fixing jig that can be fixed satisfactorily can be obtained.
- the carbon nanotube aggregate By using the carbon nanotube aggregate, it is possible to improve the tackiness and cleanliness at high temperature, and further, as described above, the linear expansion coefficient of the adhesive layer (ratio to the linear expansion coefficient of the first substrate) It is a great achievement of the present invention that the carbon nanotube aggregate, which is an aggregate of fibrous materials, can be satisfactorily bonded to the first base material by appropriately adjusting.
- the ratio of the linear expansion coefficient of the first base material to the linear expansion coefficient of the adhesive layer (adhesive layer / base material) is preferably 0.8 to 1.7. If it is such a range, the said effect will become more remarkable.
- the adhesive layer can be composed of any appropriate adhesive.
- an inorganic adhesive or a carbon adhesive is preferably used as the adhesive constituting the adhesive layer. These adhesives are preferable in terms of excellent heat resistance. Among these, an inorganic adhesive or a carbon adhesive is preferable.
- Examples of the inorganic adhesive include ceramic adhesive and silica adhesive.
- Ceramic adhesive is an adhesive that can exhibit adhesiveness by curing a curing component such as alkali metal silicate, phosphate, and metal alkoxide.
- a ceramic adhesive containing an alkali metal silicate or phosphate eg, aluminum phosphate is used as the curing component.
- the silica-based adhesive is an adhesive that can exhibit adhesiveness by curing silica-based curing components such as silicic acid fine particles having silanol groups on the particle surface and organopolysiloxane.
- silica-based curing component for example, fused silica, ultrafine silica (for example, particle size: 10 nm to 100 nm), silicone-based materials such as organopolysiloxane, silane compound, and organosilicon compound can be used.
- the ceramic adhesive and the silica-based adhesive may further include a curing agent (curing accelerator) and / or a filler (filler).
- the ceramic adhesive can also include any suitable dispersion medium.
- Examples of the curing agent (curing accelerator) used in combination with the alkali metal silicate in the ceramic adhesive include oxides or hydroxides such as zinc, magnesium, and calcium; And phosphates such as aluminum and zinc; borate salts such as calcium, barium and magnesium; and the like.
- Examples of the curing agent (curing accelerator) used in combination with the above phosphate include oxides or hydroxides such as magnesium, calcium, zinc, and aluminum; silicates such as magnesium and calcium; Group II boric acid Salt; and the like.
- filler examples include alumina, silica, zirconia, and magnesium oxide.
- the linear expansion coefficient of the adhesive layer is adjusted by one embodiment, the type and / or addition amount of the filler (filler).
- any appropriate solvent is used as the dispersion medium.
- an aqueous solvent or an organic solvent may be used.
- the aqueous solvent is preferable in that it can form a higher heat-resistant adhesive layer.
- an organic solvent is preferable at the point which is excellent in affinity with a carbon nanotube aggregate.
- the components in the ceramic adhesive can be appropriately selected according to the material constituting the first substrate, the material constituting the second substrate, the desired heat-resistant temperature, and the like.
- a metal alkoxide is used as a curing component
- alumina is used as a filler
- an alcohol such as methanol is used as a dispersion medium.
- the carbon-based adhesive includes a binder, a carbon-based filler, and a solvent.
- the binder include alkali metal silicate, phosphate, metal alkoxide and the like, and alkali metal silicate is preferable.
- the carbon filler include graphite powder and carbon black, and carbon black is preferable.
- the solvent include water.
- the carbon-based adhesive may include a predetermined resin and a carbon-based filler.
- a resin that becomes non-graphitizable carbon by heating can be used.
- examples of such a resin include a phenol resin and a polycarbodiimide resin.
- Examples of the carbon filler include graphite powder and carbon black.
- the carbon-based adhesive may contain any appropriate solvent. Examples of the solvent contained in the carbon-based adhesive include water, phenol, formaldehyde, ethanol, and the like.
- the linear expansion coefficient of the adhesive layer is preferably 5 ppm / ° C. to 12 ppm / ° C., more preferably 6 ppm / ° C. to 9 ppm / ° C. Within such a range, it is possible to obtain a conveyance fixing jig in which the aggregate of carbon nanotubes is not easily detached even at high temperatures.
- the linear expansion coefficient of an adhesive bond layer is a linear expansion coefficient after hardening an adhesive agent.
- the volume expansion coefficient of the adhesive layer is preferably 15 ppm / ° C. to 36 ppm / ° C., more preferably 18 ppm / ° C. to 27 ppm / ° C. Within such a range, it is possible to obtain a conveyance fixing jig in which the aggregate of carbon nanotubes is not easily detached even at high temperatures.
- the volume expansion coefficient of the adhesive layer is a volume expansion coefficient after the adhesive is cured.
- the agent layer elastic modulus is preferably 50% or less, more preferably 30% or less.
- the measurement conditions of the single indentation measurement by a nano indenter are as follows. Apparatus: Hysitron Inc. Made by Triboindenter Working indenter: Berkovich (triangular pyramid type) Measuring method: Single indentation measurement Measuring temperature: 25 ° C (room temperature) Pushing depth setting: 5 ⁇ m
- the thickness of the adhesive layer is preferably 0.1 ⁇ m to 100 ⁇ m, more preferably 0.5 ⁇ m to 50 ⁇ m, and further preferably 1.0 ⁇ m to 20 ⁇ m. If it is such a range, a carbon nanotube aggregate or a 2nd base material and a 1st base material can be firmly joined via this adhesive bond layer.
- Carbon nanotube aggregate The carbon nanotube aggregate is composed of a plurality of carbon nanotubes.
- the length of the carbon nanotube is preferably 50 ⁇ m to 3000 ⁇ m, more preferably 200 ⁇ m to 2000 ⁇ m, still more preferably 300 ⁇ m to 1500 ⁇ m, particularly preferably 400 ⁇ m to 1000 ⁇ m, and most preferably 500 ⁇ m to 1000 ⁇ m. is there. Within such a range, it is possible to form a conveyance fixing jig that has a high grip force and that hardly contaminates the object to be conveyed.
- the aggregate of carbon nanotubes can take, for example, embodiments described later (first embodiment and second embodiment).
- the first embodiment of the aggregate of carbon nanotubes includes a plurality of carbon nanotubes, the carbon nanotubes have a plurality of layers, the distribution width of the number distribution of the carbon nanotubes is 10 or more, and the number distribution of the carbon nanotubes The relative frequency of the mode value is 25% or less.
- the distribution width of the number distribution of carbon nanotubes is preferably 10 or more, more preferably 10 to 30 layers, still more preferably 10 to 25 layers, and particularly preferably. Is 10 to 20 layers.
- the “distribution width” of the number distribution of carbon nanotubes refers to the difference between the maximum number and the minimum number of carbon nanotube layers. By adjusting the distribution width of the number distribution of the carbon nanotubes within the above range, the carbon nanotubes can have excellent mechanical properties and a high specific surface area, and further, the carbon nanotubes have excellent adhesive properties. It can be the carbon nanotube aggregate shown.
- the number of carbon nanotube layers and the number distribution of the carbon nanotubes may be measured by any appropriate apparatus. Preferably, it is measured by a scanning electron microscope (SEM) or a transmission electron microscope (TEM). For example, at least 10, preferably 20 or more carbon nanotubes may be taken out from the aggregate of carbon nanotubes and measured by SEM or TEM to evaluate the number of layers and the number distribution of the layers.
- SEM scanning electron microscope
- TEM transmission electron microscope
- the maximum number of carbon nanotube layers is preferably 5 to 30 layers, more preferably 10 to 30 layers, and even more preferably 15 to 30 layers. Particularly preferred are 15 to 25 layers.
- the minimum number of carbon nanotube layers is preferably 1 to 10 layers, and more preferably 1 to 5 layers.
- the carbon nanotubes can have excellent mechanical properties and a high specific surface area.
- the carbon nanotubes can be a carbon nanotube aggregate exhibiting excellent adhesive properties.
- the relative frequency of the mode value of the number distribution of the carbon nanotubes is preferably 25% or less, more preferably 1% to 25%, and further preferably 5% to 25%. Yes, particularly preferably 10% to 25%, most preferably 15% to 25%.
- the carbon nanotubes can have excellent mechanical properties and a high specific surface area. It can be an aggregate of carbon nanotubes exhibiting excellent adhesive properties.
- the mode value of the number distribution of carbon nanotubes preferably exists in the number of layers 2 to 10 and more preferably in the number of layers 3 to 10.
- the carbon nanotubes can have excellent mechanical properties and a high specific surface area, and the carbon nanotubes have excellent adhesive properties. It can become the carbon nanotube aggregate which shows.
- the shape of the carbon nanotube it is sufficient that its cross section has any appropriate shape.
- the cross section may be substantially circular, elliptical, n-gonal (n is an integer of 3 or more), and the like.
- the length of the carbon nanotube is preferably 50 ⁇ m or more, more preferably 100 ⁇ m to 3000 ⁇ m, still more preferably 300 ⁇ m to 1500 ⁇ m, still more preferably 400 ⁇ m to 1000 ⁇ m, and particularly preferably. Is 500 ⁇ m to 1000 ⁇ m.
- the carbon nanotubes can have excellent mechanical properties and a high specific surface area, and the carbon nanotubes can exhibit excellent adhesion properties. It can be a body.
- the diameter of the carbon nanotube is preferably 0.3 nm to 2000 nm, more preferably 1 nm to 1000 nm, and further preferably 2 nm to 500 nm.
- the carbon nanotubes can have excellent mechanical properties and a high specific surface area.
- the carbon nanotube aggregates exhibit excellent adhesive properties. Can be.
- the specific surface area and density of the carbon nanotubes can be set to any appropriate values.
- the second embodiment of the aggregate of carbon nanotubes includes a plurality of carbon nanotubes, the carbon nanotubes have a plurality of layers, and the mode of the number distribution of the carbon nanotubes is present in the number of layers of 10 or less.
- the relative frequency of the mode value is 30% or more.
- the distribution width of the number distribution of carbon nanotubes is preferably 9 or less, more preferably 1 to 9 layers, still more preferably 2 to 8 layers, and particularly preferably. Is 3 to 8 layers.
- the maximum number of carbon nanotube layers is preferably 1 to 20 layers, more preferably 2 to 15 layers, and further preferably 3 to 10 layers.
- the minimum number of carbon nanotube layers is preferably 1 to 10 layers, and more preferably 1 to 5 layers.
- the carbon nanotubes can have excellent mechanical properties and a high specific surface area.
- the carbon nanotubes can be a carbon nanotube aggregate exhibiting excellent adhesive properties.
- the relative frequency of the mode value of the number distribution of the carbon nanotubes is preferably 30% or more, more preferably 30% to 100%, and further preferably 30% to 90%. Particularly preferably 30% to 80%, most preferably 30% to 70%.
- the carbon nanotubes can have excellent mechanical properties and a high specific surface area. It can be an aggregate of carbon nanotubes exhibiting excellent adhesive properties.
- the mode value of the number distribution of carbon nanotubes is preferably present in the number of layers of 10 or less, more preferably in the number of layers from 1 to 10, and more preferably in the number of layers.
- the number of layers is from 2 to 8 and particularly preferably from 2 to 6 layers.
- the cross section may have any appropriate shape.
- the cross section may be substantially circular, elliptical, n-gonal (n is an integer of 3 or more), and the like.
- the length of the carbon nanotube is preferably 50 ⁇ m or more, more preferably 550 ⁇ m to 3000 ⁇ m, still more preferably 600 ⁇ m to 2000 ⁇ m, still more preferably 650 ⁇ m to 1000 ⁇ m, and particularly preferably. Is 700 ⁇ m to 1000 ⁇ m.
- the carbon nanotubes can have excellent mechanical properties and a high specific surface area, and the carbon nanotubes can exhibit excellent adhesion properties. It can be a body.
- the diameter of the carbon nanotube is preferably 0.3 nm to 2000 nm, more preferably 1 nm to 1000 nm, and further preferably 2 nm to 500 nm.
- the carbon nanotubes can have excellent mechanical properties and a high specific surface area.
- the carbon nanotube aggregates exhibit excellent adhesive properties. Can be.
- the specific surface area and density of the carbon nanotubes can be set to any appropriate values.
- At least a portion including the tip of the carbon nanotube is coated with an inorganic material.
- the “part including at least the tip” as used herein means a portion including at least the tip of the carbon nanotube, that is, the tip of the carbon nanotube opposite to the first substrate.
- All of the above carbon nanotubes may be covered with an inorganic material at least at a portion including the tip, or a portion thereof may be covered with an inorganic material at least a portion including the tip.
- the content ratio of the carbon nanotube in which at least the portion including the tip of the carbon nanotube is coated with an inorganic material is preferably 50 wt% to 100 wt%, more preferably 60 wt% to 100 wt%. % By weight, more preferably 70% by weight to 100% by weight, further preferably 80% by weight to 100% by weight, particularly preferably 90% by weight to 100% by weight, and most preferably substantially 100% by weight. If it is such a range, the conveyance fixing jig
- the thickness of the coating layer is preferably 1 nm or more, more preferably 3 nm or more, further preferably 5 nm or more, further preferably 7 nm or more, particularly preferably 9 nm or more, and most preferably 10 nm. That's it.
- the upper limit of the thickness of the coating layer is preferably 50 nm, more preferably 40 nm, still more preferably 30 nm, particularly preferably 20 nm, and most preferably 15 nm. Within such a range, it is possible to form a conveyance fixing jig that has a high grip force and that hardly contaminates the object to be conveyed.
- the length of the coating layer is preferably 1 nm to 1000 nm, more preferably 5 nm to 700 nm, still more preferably 10 nm to 500 nm, particularly preferably 30 nm to 300 nm, and most preferably 50 nm to 100 nm. is there. If it is such a range, the conveyance fixing jig
- inorganic material arbitrary appropriate inorganic materials can be employ
- examples of such inorganic materials include SiO 2 , Al 2 O 3 , Fe 2 O 3 , TiO 2 , MgO, Cu, Ag, and Au.
- Any appropriate method can be adopted as a method for producing a carbon nanotube aggregate.
- a method for producing a carbon nanotube aggregate for example, a chemical vapor phase is formed in which a catalyst layer is formed on a flat plate, a carbon source is filled in a state where the catalyst is activated by heat, plasma, etc., and carbon nanotubes are grown.
- a method of producing an aggregate of carbon nanotubes oriented substantially vertically from a flat plate by a growth method (Chemical Vapor Deposition: CVD method).
- any appropriate flat plate can be adopted as a flat plate that can be used in the method for producing a carbon nanotube aggregate.
- the material which has smoothness and the high temperature heat resistance which can endure manufacture of a carbon nanotube is mentioned.
- examples of such materials include quartz glass, silicon (such as a silicon wafer), and a metal plate such as aluminum.
- any appropriate apparatus can be adopted as an apparatus for producing the carbon nanotube aggregate.
- a thermal CVD apparatus as shown in FIG. 4, a hot wall type configured by surrounding a cylindrical reaction vessel with a resistance heating type electric tubular furnace, and the like can be mentioned.
- a heat-resistant quartz tube is preferably used as the reaction vessel.
- Any suitable catalyst can be used as a catalyst (catalyst layer material) that can be used in the production of the carbon nanotube aggregate.
- metal catalysts such as iron, cobalt, nickel, gold, platinum, silver, copper, are mentioned.
- an alumina / hydrophilic film may be provided between the flat plate and the catalyst layer as necessary.
- any appropriate method can be adopted as a method for producing the alumina / hydrophilic film.
- it can be obtained by forming a SiO 2 film on a flat plate, depositing Al, and then oxidizing it by raising the temperature to 450 ° C.
- Al 2 O 3 interacts with the SiO 2 film hydrophilic, different Al 2 O 3 surface particle diameters than those deposited Al 2 O 3 directly formed.
- Al is heated up to 450 ° C. and oxidized without forming a hydrophilic film on a flat plate, Al 2 O 3 surfaces having different particle diameters may not be formed easily.
- Al 2 O 3 surfaces having different particle diameters may not be easily formed.
- the thickness of the catalyst layer that can be used in the production of the carbon nanotube aggregate is preferably 0.01 nm to 20 nm, more preferably 0.1 nm to 10 nm in order to form fine particles.
- the formed carbon nanotubes can have both excellent mechanical properties and a high specific surface area. It can be a carbon nanotube aggregate exhibiting excellent adhesive properties.
- Any appropriate method can be adopted as a method for forming the catalyst layer.
- a method of depositing a metal catalyst by EB (electron beam), sputtering, or the like, a method of applying a suspension of metal catalyst fine particles on a flat plate, and the like can be mentioned.
- any appropriate carbon source can be used as the carbon source that can be used for the production of the carbon nanotube aggregate.
- hydrocarbons such as methane, ethylene, acetylene, and benzene
- alcohols such as methanol and ethanol
- Arbitrary appropriate temperature can be employ
- the temperature is preferably 400 ° C to 1000 ° C, more preferably 500 ° C to 900 ° C, and further preferably 600 ° C to 800 ° C. .
- the second base material may be a flat plate used when forming the carbon nanotube aggregate. That is, the conveyance fixing jig provided with the second base material is obtained by laminating the flat plate on which the carbon nanotube aggregate is formed as it is on the first base material.
- the conveyance fixing jig can be manufactured by any appropriate method.
- the adhesive constituting the adhesive layer is applied on the first substrate, the carbon nanotube aggregate is disposed on the applied layer formed by the application, and then the applied layer is cured. Thereby, an adhesive bond layer can be formed and a conveyance fixing jig can be obtained.
- the method of arranging the carbon nanotube aggregate on the coating layer include a method of transferring the carbon nanotube aggregate to the coating layer from the flat plate with the carbon nanotube aggregate obtained by the method described in the above section D. It is done.
- a flat plate in which an adhesive constituting an adhesive layer is applied on a first substrate, and an aggregate of carbon nanotubes is formed on the coating layer formed by the application. ), And then the coating layer is cured to obtain a transport fixture.
- any appropriate method can be adopted as an adhesive application method.
- the application method include application using a comma coater or a die coater, application using a dispenser, application using a squeegee, and the like.
- a method for curing the adhesive application layer may be adopted.
- a method of curing by heating is preferably used.
- the curing temperature can be appropriately set according to the type of adhesive.
- the curing temperature is, for example, 90 ° C. to 400 ° C.
- when a carbon-based adhesive is used as the adhesive it is baked at a high temperature after curing.
- the firing temperature is preferably higher than the use temperature of the adhesive, for example, 350 ° C. to 3000 ° C.
- an Fe thin film was further formed as a catalyst layer (sputtering gas: Ar, gas pressure: 0.75 Pa, growth rate: 0) using a sputtering apparatus (trade name “CFS-4ES” manufactured by Shibaura Mechatronics). .012 nm / sec, thickness: 1.0 nm). Thereafter, this flat plate was placed in a 30 mm ⁇ quartz tube, and a mixed gas of helium / hydrogen (105/80 sccm) maintained at a moisture content of 700 ppm was allowed to flow through the quartz tube for 30 minutes to replace the inside of the tube. Thereafter, the inside of the tube was heated to 765 ° C.
- Example 1 An adhesive (manufactured by Three Bond, trade name “TB3732”, binder: metal alkoxide, filler: alumina) was applied onto the first base material (manufactured by Ceramics; linear expansion coefficient: 8 ppm / ° C.) using a squeegee. .
- the carbon nanotube aggregate obtained in Production Example 1 was collected from the flat plate and placed on the adhesive coating layer. At this time, it arrange
- a weight is placed on the opposite side of the carbon nanotube aggregate from the adhesive coating layer through a clean wafer, and a load of 50 g / cm 2 is applied for 1 minute to bring the carbon nanotube aggregate and the adhesive coating layer into close contact with each other. I let you.
- the laminate obtained as described above was placed at room temperature for 1 hour and further in an environment of 100 ° C. for 30 minutes to cure the adhesive.
- a conveyance fixing jig composed of the first base material / adhesive layer (thickness: 10 ⁇ m) / carbon nanotube aggregate was obtained.
- Example 2 instead of adhesive (trade name “TB3732” manufactured by ThreeBond Co., Ltd., binder: metal alkoxide, filler: alumina), adhesive (trade name “G7716” manufactured by EM Japan Co., Ltd., binder: silicate, filler: carbon) A laminate was obtained in the same manner as in Example 1 except that was used. The laminate is placed at room temperature for 2 hours and further in an environment of 100 ° C. for 2 hours to cure the adhesive, and from the first substrate / adhesive layer (thickness: 10 ⁇ m) / carbon nanotube aggregate A configured transport fixture was obtained.
- adhesive trade name “TB3732” manufactured by ThreeBond Co., Ltd., binder: metal alkoxide, filler: alumina
- adhesive trade name “G7716” manufactured by EM Japan Co., Ltd., binder: silicate, filler: carbon
- Example 3 instead of adhesive (trade name “TB3732”, manufactured by ThreeBond Co., Ltd., binder: metal alkoxide, filler: alumina), adhesive (trade name “RG-57-2-3”, manufactured by Ein Co., Ltd.); binder: organopolysiloxane
- a laminate was obtained in the same manner as in Example 1 except that filler: silicon dioxide (silica), titanium dioxide (titania), potassium titanate, solvent: ethylene glycol dibutyl ether was used.
- the laminate is placed in an environment at 80 ° C. for 30 minutes, further in an environment at 150 ° C. for 30 minutes, and further in an environment at 400 ° C. for 2 hours to cure and fire the adhesive.
- a conveyance fixing jig composed of a material / adhesive layer (thickness: 20 ⁇ m) / carbon nanotube aggregate was obtained.
- Example 4 The first base material (made of ceramics; linear expansion coefficient: 3 ppm / ° C.) was used instead of the first base material (made of ceramics; linear expansion coefficient: 8 ppm / ° C.), and an adhesive (Three Bond Co., Ltd.) Manufactured, trade name “TB3732”, binder: metal alkoxide, filler: alumina, adhesive (trade name “RG-12-6-2, manufactured by Ein Co., Ltd.); binder: organopolysiloxane, filler: silicon dioxide A laminate was obtained in the same manner as in Example 1 except that (silica), titanium dioxide (titania), solvent: ethylene glycol monobutyl ether) were used.
- the laminate is placed in an environment at 80 ° C. for 30 minutes, further in an environment at 150 ° C. for 30 minutes, and further in an environment at 400 ° C. for 2 hours to cure and fire the adhesive.
- a conveyance fixing jig composed of a material / adhesive layer (thickness: 20 ⁇ m) / carbon nanotube aggregate was obtained.
- thermomechanical analyzer manufactured by Shimadzu Corporation, "TMA-60"
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Carbon And Carbon Compounds (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
1つの実施形態においては、上記カーボンナノチューブ集合体が、第2の基材上に形成されており、該第1の基材と該第2の基材とが、該接着剤層を介して接合されている。
1つの実施形態においては、上記接着剤層を構成する接着剤が、無機系接着剤またはカーボン系接着剤である。
1つの実施形態においては、上記無機系接着剤が、セラミック接着剤である。
1つの実施形態においては、上記搬送固定治具を450℃下に1時間放置した際、前記接着剤層の弾性率変化が、50%以下である。
1つの実施形態においては、上記接着剤層の線膨張係数が、5ppm/℃~12ppm/℃である。
1つの実施形態においては、上記第1の基材を構成する材料が、アルミナである。
1つの実施形態においては、上記カーボンナノチューブ集合体表面のガラス表面に対する23℃における静摩擦係数が、1~50である。
本発明の別の局面によれば、上記搬送固定治具の製造方法が提供される。この製造方法は、第1の基材上に、接着剤を塗布して塗布層を形成し、該塗布層上にカーボンナノチューブ集合体を配置し、該塗布層を硬化させて、接着剤層を形成し、該接着剤層を介して、該第1の基材と該カーボンナノチューブ集合体とを、接合することを含み、該第1の基材の線膨張係数と、該接着剤層の線膨張係数の比(接着剤層/基材)が、0.7~1.8である。 The conveyance fixture of the present invention includes a first base material, a carbon nanotube aggregate, and an adhesive layer disposed between the first base material and the carbon nanotube aggregate. 1 substrate and the aggregate of carbon nanotubes are bonded via the adhesive layer, and the ratio of the linear expansion coefficient of the first substrate to the linear expansion coefficient of the adhesive layer (adhesive layer / Base material) is 0.7 to 1.8.
In one embodiment, the aggregate of carbon nanotubes is formed on a second base material, and the first base material and the second base material are bonded via the adhesive layer. Has been.
In one embodiment, the adhesive constituting the adhesive layer is an inorganic adhesive or a carbon adhesive.
In one embodiment, the inorganic adhesive is a ceramic adhesive.
In one embodiment, the elastic modulus change of the adhesive layer is 50% or less when the conveyance fixture is left at 450 ° C. for 1 hour.
In one embodiment, the adhesive layer has a linear expansion coefficient of 5 ppm / ° C. to 12 ppm / ° C.
In one embodiment, the material which comprises the said 1st base material is an alumina.
In one embodiment, the coefficient of static friction at 23 ° C. with respect to the glass surface of the carbon nanotube aggregate surface is 1 to 50.
According to another situation of this invention, the manufacturing method of the said conveyance fixing jig is provided. In this manufacturing method, an adhesive is applied on a first substrate to form an application layer, an aggregate of carbon nanotubes is disposed on the application layer, the application layer is cured, and an adhesive layer is formed. Forming and bonding the first substrate and the aggregate of carbon nanotubes via the adhesive layer, the linear expansion coefficient of the first substrate, and the line of the adhesive layer The ratio of the expansion coefficient (adhesive layer / base material) is 0.7 to 1.8.
図1は、本発明の1つの実施形態による搬送固定治具の概略断面図である。搬送固定治具100は、第1の基材10と、カーボンナノチューブ集合体31と、第1の基材10とカーボンナノチューブ集合体31との間に配置された接着剤層20とを備える。第1の基材10とカーボンナノチューブ集合体31とは、接着剤層20を介して接合されている。カーボンナノチューブ集合体31は、第1の基材10の全面に設けられていてもよく、第1の基材10の一部の面上に設けられていてもよい。 A. Overview Figure 1 of the transport fixture is a schematic cross-sectional view of the transport fixture according to one embodiment of the present invention. The
上記第1の基材は、半導体材料、電子材料等を搬送する際の搬送基材として機能する。第1の基材の形態としては、例えば、搬送アーム、搬送テーブル、搬送リング、搬送ガイドレール、収納カセット、フック、搬送フレームなどが挙げられる。第1の基材の大きさや形状は、目的に応じて、適宜選択し得る。第1の基材は、搬送アーム、搬送テーブル、搬送リング、搬送ガイドレール、収納カセット、フック、搬送フレーム等の一部であってもよい。第1の基材が搬送アームである場合の一例を、図3の概略斜視図に示す。図3の搬送固定治具100は、搬送アームとしての第1の基材10の一方端に、カーボンナノチューブ集合体31が配置されている。なお、上述の図1は、搬送固定治具100のI-I線による断面図である。 B. 1st base material The said 1st base material functions as a conveyance base material at the time of conveying a semiconductor material, an electronic material, etc. Examples of the form of the first base material include a transport arm, a transport table, a transport ring, a transport guide rail, a storage cassette, a hook, and a transport frame. The size and shape of the first substrate can be appropriately selected according to the purpose. The first substrate may be a part of a transfer arm, a transfer table, a transfer ring, a transfer guide rail, a storage cassette, a hook, a transfer frame, and the like. An example of the case where the first substrate is a transfer arm is shown in the schematic perspective view of FIG. In the
上記接着剤層は、任意の適切な接着剤により構成され得る。上記接着剤層を構成する接着剤として、好ましくは、無機系接着剤またはカーボン系接着剤が用いられる。これらの接着剤は、耐熱性に優れる点で好ましい。なかでも好ましくは、無機系接着剤またはカーボン系接着剤である。 C. Adhesive Layer The adhesive layer can be composed of any appropriate adhesive. As the adhesive constituting the adhesive layer, an inorganic adhesive or a carbon adhesive is preferably used. These adhesives are preferable in terms of excellent heat resistance. Among these, an inorganic adhesive or a carbon adhesive is preferable.
装置:Hysitron Inc.製 Triboindenter
使用圧子:Berkovich(三角錐型)
測定方法:単一押し込み測定
測定温度:25℃(室温)
押し込み深さ設定:5μm Change in elastic modulus of the adhesive layer (adhesive layer elastic modulus after 450 ° C x 1 hour-adhesive layer immediately after formation of adhesive layer (immediately after adhesive curing)) when the conveyance fixture is left at 450 ° C for 1 hour The agent layer elastic modulus) is preferably 50% or less, more preferably 30% or less. By forming an adhesive layer with little change in properties at high temperatures in this way, it is possible to obtain a conveyance fixing jig in which the aggregate of carbon nanotubes is not easily detached even at high temperatures. The elastic modulus can be determined from the slope of the load-displacement curve and the projected area of the indenter on the sample by single indentation measurement using a nanoindenter. In addition, the measurement conditions of the single indentation measurement by a nano indenter are as follows.
Apparatus: Hysitron Inc. Made by Triboindenter
Working indenter: Berkovich (triangular pyramid type)
Measuring method: Single indentation measurement Measuring temperature: 25 ° C (room temperature)
Pushing depth setting: 5μm
カーボンナノチューブ集合体は、複数のカーボンナノチューブから構成される。 D. Carbon nanotube aggregate The carbon nanotube aggregate is composed of a plurality of carbon nanotubes.
上記第2の基材は、カーボンナノチューブ集合体を形成する際に用いた平板であり得る。すなわち、第2の基材を備える搬送固定治具は、カーボンナノチューブ集合体が形成された平板をそのまま、第1の基材に積層して得られる。 E. Second Base Material The second base material may be a flat plate used when forming the carbon nanotube aggregate. That is, the conveyance fixing jig provided with the second base material is obtained by laminating the flat plate on which the carbon nanotube aggregate is formed as it is on the first base material.
搬送固定治具は、任意の適切な方法により製造され得る。1つの実施形態においては、第1の基板上に接着剤層を構成する接着剤を塗布し、該塗布により形成された塗布層上にカーボンナノチューブ集合体を配置した後、該塗布層を硬化させることにより接着剤層を形成して、搬送固定治具を得ることができる。カーボンナノチューブ集合体を塗布層上に配置する方法としては、例えば、上記D項で説明した方法により得られたカーボンナノチューブ集合体付平板から、カーボンナノチューブ集合体を上記塗布層に転写する方法が挙げられる。 F. Manufacturing method of conveyance fixing jig The conveyance fixing jig can be manufactured by any appropriate method. In one embodiment, the adhesive constituting the adhesive layer is applied on the first substrate, the carbon nanotube aggregate is disposed on the applied layer formed by the application, and then the applied layer is cured. Thereby, an adhesive bond layer can be formed and a conveyance fixing jig can be obtained. Examples of the method of arranging the carbon nanotube aggregate on the coating layer include a method of transferring the carbon nanotube aggregate to the coating layer from the flat plate with the carbon nanotube aggregate obtained by the method described in the above section D. It is done.
シリコン製の平板(バルカー・エフティ社製、厚み700μm)上に、スパッタ装置(芝浦メカトロニクス社製、商品名「CFS-4ES」)により、Al2O3薄膜(到達真空度:8.0×10-4Pa、スパッタガス:Ar、ガス圧:0.50Pa、成長レート:0.12nm/sec、厚み:20nm)を形成した。このAl2O3薄膜上に、さらにスパッタ装置(芝浦メカトロニクス社製、商品名「CFS-4ES」)にてFe薄膜を触媒層(スパッタガス:Ar、ガス圧:0.75Pa、成長レート:0.012nm/sec、厚み:1.0nm)として形成した。
その後、この平板を30mmφの石英管内に載置し、水分率700ppmに保ったヘリウム/水素(105/80sccm)混合ガスを石英管内に30分間流して、管内を置換した。その後、電気管状炉を用いて管内を765℃まで昇温させ、765℃にて安定させた。765℃にて温度を保持したまま、ヘリウム/水素/エチレン(105/80/15sccm、水分率700ppm)混合ガスを管内に充填させ、60分間放置して、平板上にカーボンナノチューブ集合体を形成させた。 [Production Example 1] Production of aggregate of carbon nanotubes Al 2 O 3 by a sputtering apparatus (trade name “CFS-4ES” manufactured by Shibaura Mechatronics Co., Ltd.) on a silicon flat plate (manufactured by VALQUA EFT Co., Ltd., thickness 700 μm) A thin film (degree of ultimate vacuum: 8.0 × 10 −4 Pa, sputtering gas: Ar, gas pressure: 0.50 Pa, growth rate: 0.12 nm / sec, thickness: 20 nm) was formed. On this Al 2 O 3 thin film, an Fe thin film was further formed as a catalyst layer (sputtering gas: Ar, gas pressure: 0.75 Pa, growth rate: 0) using a sputtering apparatus (trade name “CFS-4ES” manufactured by Shibaura Mechatronics). .012 nm / sec, thickness: 1.0 nm).
Thereafter, this flat plate was placed in a 30 mmφ quartz tube, and a mixed gas of helium / hydrogen (105/80 sccm) maintained at a moisture content of 700 ppm was allowed to flow through the quartz tube for 30 minutes to replace the inside of the tube. Thereafter, the inside of the tube was heated to 765 ° C. using an electric tubular furnace and stabilized at 765 ° C. While maintaining the temperature at 765 ° C., a mixed gas of helium / hydrogen / ethylene (105/80/15 sccm, moisture content 700 ppm) was filled into the tube and left for 60 minutes to form a carbon nanotube aggregate on the flat plate. It was.
第1の基材(セラミクス製;線膨張係数:8ppm/℃)上に、スキージを用いて、接着剤(スリーボンド社製、商品名「TB3732」、バインダ:金属アルコキシド、フィラー:アルミナ)を塗布した。
製造例1で得られたカーボンナノチューブ集合体を上記平板から採取し、接着剤塗布層上に配置した。このとき、カーボンナノチューブ集合体の平板に接していた側が、接着剤塗布層に接するように配置した。
その後、カーボンナノチューブ集合体の接着剤塗布層とは反対側に、清浄なウエハを介して重りをおき、50g/cm2の荷重を1分間かけ、カーボンナノチューブ集合体と接着剤塗布層とを密着させた。
次いで、上記のようにして得られた積層体を、常温下に1時間、さらに、100℃の環境下に30分置いて、接着剤を硬化させた。
上記のようにして、第1の基材/接着剤層(厚み:10μm)/カーボンナノチューブ集合体から構成される搬送固定治具を得た。 [Example 1]
An adhesive (manufactured by Three Bond, trade name “TB3732”, binder: metal alkoxide, filler: alumina) was applied onto the first base material (manufactured by Ceramics; linear expansion coefficient: 8 ppm / ° C.) using a squeegee. .
The carbon nanotube aggregate obtained in Production Example 1 was collected from the flat plate and placed on the adhesive coating layer. At this time, it arrange | positioned so that the side which was in contact with the flat plate of the carbon nanotube aggregate may contact the adhesive application layer.
Then, a weight is placed on the opposite side of the carbon nanotube aggregate from the adhesive coating layer through a clean wafer, and a load of 50 g / cm 2 is applied for 1 minute to bring the carbon nanotube aggregate and the adhesive coating layer into close contact with each other. I let you.
Next, the laminate obtained as described above was placed at room temperature for 1 hour and further in an environment of 100 ° C. for 30 minutes to cure the adhesive.
As described above, a conveyance fixing jig composed of the first base material / adhesive layer (thickness: 10 μm) / carbon nanotube aggregate was obtained.
接着剤(スリーボンド社製、商品名「TB3732」、バインダ:金属アルコキシド、フィラー:アルミナ)に代えて、接着剤(イーエムジャパン社製、商品名「G7716」、バインダ:ケイ酸塩、フィラー:カーボン)を用いたこと以外は、実施例1と同様にして積層体を得た。該積層体を、常温下に2時間、さらに、100℃の環境下に2時間置いて、接着剤を硬化させ、第1の基材/接着剤層(厚み:10μm)/カーボンナノチューブ集合体から構成される搬送固定治具を得た。 [Example 2]
Instead of adhesive (trade name “TB3732” manufactured by ThreeBond Co., Ltd., binder: metal alkoxide, filler: alumina), adhesive (trade name “G7716” manufactured by EM Japan Co., Ltd., binder: silicate, filler: carbon) A laminate was obtained in the same manner as in Example 1 except that was used. The laminate is placed at room temperature for 2 hours and further in an environment of 100 ° C. for 2 hours to cure the adhesive, and from the first substrate / adhesive layer (thickness: 10 μm) / carbon nanotube aggregate A configured transport fixture was obtained.
接着剤(スリーボンド社製、商品名「TB3732」、バインダ:金属アルコキシド、フィラー:アルミナ)に代えて、接着剤(アイン社製、商品名「RG-57-2-3」;バインダ:オルガノポリシロキサン、フィラー:二酸化珪素(シリカ)、二酸化チタン(チタニア)、チタン酸カリウム、溶剤:エチレングリコールジブチルエーテル)を用いたこと以外は、実施例1と同様にして積層体を得た。該積層体を、80℃の環境下に30分、さらに、150℃の環境下に30分、さらに、400℃の環境下に2時間置いて、接着剤を硬化・焼成させ、第1の基材/接着剤層(厚み:20μm)/カーボンナノチューブ集合体から構成される搬送固定治具を得た。 [Example 3]
Instead of adhesive (trade name “TB3732”, manufactured by ThreeBond Co., Ltd., binder: metal alkoxide, filler: alumina), adhesive (trade name “RG-57-2-3”, manufactured by Ein Co., Ltd.); binder: organopolysiloxane A laminate was obtained in the same manner as in Example 1 except that filler: silicon dioxide (silica), titanium dioxide (titania), potassium titanate, solvent: ethylene glycol dibutyl ether was used. The laminate is placed in an environment at 80 ° C. for 30 minutes, further in an environment at 150 ° C. for 30 minutes, and further in an environment at 400 ° C. for 2 hours to cure and fire the adhesive. A conveyance fixing jig composed of a material / adhesive layer (thickness: 20 μm) / carbon nanotube aggregate was obtained.
第1の基材(セラミクス製;線膨張係数:8ppm/℃)に代えて、第1の基材(セラミックス製;線膨張係数:3ppm/℃)を用いたこと、および、接着剤(スリーボンド社製、商品名「TB3732」、バインダ:金属アルコキシド、フィラー:アルミナ)に代えて、接着剤(アイン社製、商品名「RG-12-6-2」;バインダ:オルガノポリシロキサン、フィラー:二酸化珪素(シリカ)、二酸化チタン(チタニア)、溶剤:エチレングリコールモノブチルエーテル)を用いたこと以外は、実施例1と同様にして積層体を得た。該積層体を、80℃の環境下に30分、さらに、150℃の環境下に30分、さらに、400℃の環境下に2時間置いて、接着剤を硬化・焼成させ、第1の基材/接着剤層(厚み:20μm)/カーボンナノチューブ集合体から構成される搬送固定治具を得た。 [Example 4]
The first base material (made of ceramics; linear expansion coefficient: 3 ppm / ° C.) was used instead of the first base material (made of ceramics; linear expansion coefficient: 8 ppm / ° C.), and an adhesive (Three Bond Co., Ltd.) Manufactured, trade name “TB3732”, binder: metal alkoxide, filler: alumina, adhesive (trade name “RG-12-6-2, manufactured by Ein Co., Ltd.); binder: organopolysiloxane, filler: silicon dioxide A laminate was obtained in the same manner as in Example 1 except that (silica), titanium dioxide (titania), solvent: ethylene glycol monobutyl ether) were used. The laminate is placed in an environment at 80 ° C. for 30 minutes, further in an environment at 150 ° C. for 30 minutes, and further in an environment at 400 ° C. for 2 hours to cure and fire the adhesive. A conveyance fixing jig composed of a material / adhesive layer (thickness: 20 μm) / carbon nanotube aggregate was obtained.
接着剤(スリーボンド社製、商品名「TB3732」、バインダ:金属アルコキシド、フィラー:アルミナ)に代えて、接着剤(東亜合成社製、商品名「アロンセラミックC」、バインダ:ケイ酸塩、フィラー:シリカ)を用いたこと以外は、実施例1と同様にして積層体を得た。該積層体を、常温下に24時間、90℃の環境下に2時間、さらに、150℃の環境下に1時間置いて、接着剤を硬化させ、第1の基材/接着剤層(厚み:10μm)/カーボンナノチューブ集合体から構成される搬送固定治具を得た。 [Comparative Example 1]
Instead of the adhesive (trade name “TB3732” manufactured by Three Bond Co., Ltd., binder: metal alkoxide, filler: alumina), the adhesive (trade name “Aron Ceramic C” manufactured by Toagosei Co., Ltd.), binder: silicate, filler: A laminate was obtained in the same manner as in Example 1 except that (silica) was used. The laminate was placed at room temperature for 24 hours, at 90 ° C. for 2 hours, and further at 150 ° C. for 1 hour to cure the adhesive, and the first substrate / adhesive layer (thickness) : 10 μm) / a conveyance fixing jig composed of an aggregate of carbon nanotubes was obtained.
接着剤(スリーボンド社製、商品名「TB3732」、バインダ:金属アルコキシド、フィラー:アルミナ)に代えて、接着剤(東亜合成社製、商品名「アロンセラミックE」、バインダ:ケイ酸塩、フィラー:ジルコニア、シリカ)を用いたこと以外は、実施例1と同様にして積層体を得た。該積層体を、常温下に24時間、90℃の環境下に2時間、さらに、150℃の環境下に1時間置いて、接着剤を硬化させ、第1の基材/接着剤層(厚み:10μm)/カーボンナノチューブ集合体から構成される搬送固定治具を得た。 [Comparative Example 2]
Instead of the adhesive (trade name “TB3732” manufactured by Three Bond Co., Ltd., binder: metal alkoxide, filler: alumina), the adhesive (trade name “Aron Ceramic E” manufactured by Toa Gosei Co., Ltd.), binder: silicate, filler: A laminate was obtained in the same manner as in Example 1 except that zirconia and silica) were used. The laminate was placed at room temperature for 24 hours, at 90 ° C. for 2 hours, and further at 150 ° C. for 1 hour to cure the adhesive, and the first substrate / adhesive layer (thickness) : 10 μm) / a conveyance fixing jig composed of an aggregate of carbon nanotubes was obtained.
実施例および比較例で得られた搬送固定治具を下記の評価に供した。結果を表1に示す。 [Evaluation]
The conveyance fixtures obtained in the examples and comparative examples were subjected to the following evaluation. The results are shown in Table 1.
線膨張係数は、熱機械分析装置(TMA)(島津製作所社製、「TMA-60」)により測定した。 (1) Linear expansion coefficient The linear expansion coefficient was measured with a thermomechanical analyzer (TMA) (manufactured by Shimadzu Corporation, "TMA-60").
製造直後の搬送固定治具について、室温(23℃)下で、第1の基材とカーボンナノチューブ集合体との密着強度(引っ張りせん断強度)を測定した。密着強度は、オートグラフ(島津製作所社製、商品名「島津オートグラフAG-120kN」)を用い、引張速度を50mm/分として測定した。
また、高温処理(450℃で1時間)した後の搬送固定治具について、上記同様の方法により密着強度を測定した。 (2) Adhesion strength About the conveyance fixture immediately after manufacture, the adhesion strength (tensile shear strength) between the first substrate and the carbon nanotube aggregate was measured at room temperature (23 ° C.). The adhesion strength was measured by using an autograph (manufactured by Shimadzu Corporation, trade name “Shimadzu Autograph AG-120 kN”) at a tensile speed of 50 mm / min.
Further, the adhesion strength of the conveyance fixture after the high temperature treatment (450 ° C. for 1 hour) was measured by the same method as described above.
20 接着剤層
31 カーボンナノチューブ集合体
32 カーボンナノチューブ
33 第2の基材
100、200 搬送固定治具 DESCRIPTION OF
Claims (9)
- 第1の基材と、カーボンナノチューブ集合体と、該第1の基材と該カーボンナノチューブ集合体との間に配置された接着剤層とを備え、
該第1の基材と該カーボンナノチューブ集合体とが、該接着剤層を介して接合され、
該第1の基材の線膨張係数と、該接着剤層の線膨張係数の比(接着剤層/基材)が、0.7~1.8である、
搬送固定治具。 A first base, a carbon nanotube aggregate, and an adhesive layer disposed between the first base and the carbon nanotube aggregate,
The first substrate and the carbon nanotube aggregate are bonded via the adhesive layer,
The ratio of the linear expansion coefficient of the first base material to the linear expansion coefficient of the adhesive layer (adhesive layer / base material) is 0.7 to 1.8.
Transport fixture. - 前記カーボンナノチューブ集合体が、第2の基材上に形成されており、
該第1の基材と該第2の基材とが、該接着剤層を介して接合されている、
請求項1に記載の搬送固定治具。 The aggregate of carbon nanotubes is formed on a second substrate;
The first substrate and the second substrate are bonded via the adhesive layer,
The conveyance fixing jig according to claim 1. - 前記接着剤層を構成する接着剤が、無機系接着剤またはカーボン系接着剤である、請求項1または2に記載の搬送固定治具。 The conveyance fixing jig according to claim 1 or 2, wherein the adhesive constituting the adhesive layer is an inorganic adhesive or a carbon adhesive.
- 前記無機系接着剤が、セラミック接着剤である、請求項3に記載の搬送固定治具。 The conveyance fixing jig according to claim 3, wherein the inorganic adhesive is a ceramic adhesive.
- 前記搬送固定治具を450℃下に1時間放置した際、前記接着剤層の弾性率変化が、50%以下である、請求項1から4のいずれかに記載の搬送固定治具。 The conveyance fixing jig according to any one of claims 1 to 4, wherein the elastic modulus change of the adhesive layer is 50% or less when the conveyance fixing jig is left at 450 ° C for 1 hour.
- 前記接着剤層の線膨張係数が、5ppm/℃~12ppm/℃である、請求項1から5のいずれかに記載の搬送固定治具。 The conveyance fixing jig according to any one of claims 1 to 5, wherein the adhesive layer has a linear expansion coefficient of 5 ppm / ° C to 12 ppm / ° C.
- 前記第1の基材を構成する材料が、アルミナである、請求項1から6のいずれかに記載の搬送固定治具。 The conveyance fixing jig according to any one of claims 1 to 6, wherein a material constituting the first base material is alumina.
- 前記カーボンナノチューブ集合体表面のガラス表面に対する23℃における静摩擦係数が、1~50である、請求項1から7のいずれかに記載の搬送固定治具。 The conveyance fixture according to any one of claims 1 to 7, wherein a coefficient of static friction at 23 ° C with respect to the glass surface of the carbon nanotube aggregate surface is 1 to 50.
- 第1の基材上に、接着剤を塗布して塗布層を形成し、
該塗布層上にカーボンナノチューブ集合体を配置し、
該塗布層を硬化させて、接着剤層を形成し、
該接着剤層を介して、該第1の基材と該カーボンナノチューブ集合体とを、接合することを含み、
該第1の基材の線膨張係数と、該接着剤層の線膨張係数の比(接着剤層/基材)が、0.7~1.8である、
請求項1から8のいずれかに記載の搬送固定治具の製造方法。 On the first substrate, an adhesive is applied to form a coating layer,
Disposing a carbon nanotube aggregate on the coating layer,
The coating layer is cured to form an adhesive layer;
Bonding the first substrate and the aggregate of carbon nanotubes via the adhesive layer,
The ratio of the linear expansion coefficient of the first base material to the linear expansion coefficient of the adhesive layer (adhesive layer / base material) is 0.7 to 1.8.
The manufacturing method of the conveyance fixing jig in any one of Claim 1 to 8.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/084,628 US11420832B2 (en) | 2016-03-18 | 2017-03-14 | Transport fixing jig |
KR1020187026540A KR20180124870A (en) | 2016-03-18 | 2017-03-14 | Conveyance fixing jig |
EP17766660.9A EP3432350A4 (en) | 2016-03-18 | 2017-03-14 | Conveying fixing jig |
CN201780018295.7A CN108886011A (en) | 2016-03-18 | 2017-03-14 | Convey stationary fixture |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016055245 | 2016-03-18 | ||
JP2016-055245 | 2016-03-18 | ||
JP2017-046313 | 2017-03-10 | ||
JP2017046313A JP2017175126A (en) | 2016-03-18 | 2017-03-10 | Conveying fixing jig |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2017159661A1 true WO2017159661A1 (en) | 2017-09-21 |
Family
ID=59850290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2017/010140 WO2017159661A1 (en) | 2016-03-18 | 2017-03-14 | Conveying fixing jig |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2017159661A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11390525B2 (en) * | 2016-10-03 | 2022-07-19 | Nitto Denko Corporation | Carbon nanotube aggregate comprising a non-aligned portion |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004127737A (en) * | 2002-10-03 | 2004-04-22 | Hitachi Zosen Corp | Carbon nanotube conductive material and its manufacturing method |
JP2013208881A (en) * | 2012-03-30 | 2013-10-10 | Nippon Zeon Co Ltd | Graphene layer-containing multilayer film, method of producing the same, and adhesive graphene film/metal foil laminate |
JP2014116562A (en) * | 2012-12-12 | 2014-06-26 | Hitachi High-Technologies Corp | Semiconductor production equipment and method of eliminating static of substrate of the same |
WO2016027600A1 (en) * | 2014-08-21 | 2016-02-25 | 日東電工株式会社 | Semiconductor carrying member and semiconductor mounting member |
-
2017
- 2017-03-14 WO PCT/JP2017/010140 patent/WO2017159661A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004127737A (en) * | 2002-10-03 | 2004-04-22 | Hitachi Zosen Corp | Carbon nanotube conductive material and its manufacturing method |
JP2013208881A (en) * | 2012-03-30 | 2013-10-10 | Nippon Zeon Co Ltd | Graphene layer-containing multilayer film, method of producing the same, and adhesive graphene film/metal foil laminate |
JP2014116562A (en) * | 2012-12-12 | 2014-06-26 | Hitachi High-Technologies Corp | Semiconductor production equipment and method of eliminating static of substrate of the same |
WO2016027600A1 (en) * | 2014-08-21 | 2016-02-25 | 日東電工株式会社 | Semiconductor carrying member and semiconductor mounting member |
Non-Patent Citations (1)
Title |
---|
See also references of EP3432350A4 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11390525B2 (en) * | 2016-10-03 | 2022-07-19 | Nitto Denko Corporation | Carbon nanotube aggregate comprising a non-aligned portion |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2017175126A (en) | Conveying fixing jig | |
WO2017026336A1 (en) | Conveying device | |
KR102449288B1 (en) | adhesive structure | |
WO2017086254A1 (en) | Component gripping tool | |
WO2016027803A1 (en) | Semiconductor transport member and semiconductor carrying member | |
WO2018173456A1 (en) | Conveying and fixing jig | |
KR102477740B1 (en) | Carbon nanotube aggregate | |
WO2017159661A1 (en) | Conveying fixing jig | |
WO2016027600A1 (en) | Semiconductor carrying member and semiconductor mounting member | |
WO2016027804A1 (en) | Semiconductor transport member and semiconductor carrying member | |
JP6616194B2 (en) | Placement member | |
WO2017122622A1 (en) | Mounting member | |
WO2016027601A1 (en) | Semiconductor carrying member and semiconductor mounting member | |
JP6914386B2 (en) | Mounting member | |
WO2017122619A1 (en) | Mounting member | |
WO2017122620A1 (en) | Method for producing mounting member |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 20187026540 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2017766660 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 2017766660 Country of ref document: EP Effective date: 20181018 |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17766660 Country of ref document: EP Kind code of ref document: A1 |