WO2017158004A1 - Composant optoélectronique et procédé pour faire fonctionner un composant optoélectronique - Google Patents

Composant optoélectronique et procédé pour faire fonctionner un composant optoélectronique Download PDF

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Publication number
WO2017158004A1
WO2017158004A1 PCT/EP2017/056093 EP2017056093W WO2017158004A1 WO 2017158004 A1 WO2017158004 A1 WO 2017158004A1 EP 2017056093 W EP2017056093 W EP 2017056093W WO 2017158004 A1 WO2017158004 A1 WO 2017158004A1
Authority
WO
WIPO (PCT)
Prior art keywords
optoelectronic component
light
optoelectronic
optical element
semiconductor chip
Prior art date
Application number
PCT/EP2017/056093
Other languages
German (de)
English (en)
Inventor
Hubert Halbritter
Roland Enzmann
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2017158004A1 publication Critical patent/WO2017158004A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings

Definitions

  • the present invention relates to an optoelectronic component and a method for operating an optoelectronic ⁇ African component.
  • An object of the present invention is to provide an optoelectronic device.
  • a further object of the present invention is to specify a method for operating an optoelectronic component.
  • this optoelectronic construction ⁇ element enables automatic checking whether the optical element of the optoelectronic component is still present and intact. If the optical element is still present and intact, useful light reflected at the optical element strikes the light detector, which can be detected automatically.
  • the operational safety of the optoelectronic component is ensured, since the optical element of the opto ⁇ electronic component attenuates or divides the useful light emitted by the optoelectronic semiconductor chip in a way that a risk to persons, insbesonde ⁇ re endangering eyes is excluded , In the case of damage or removal of the optical element, the operational reliability of the optoelectronic component ⁇ construction may no longer be guaranteed, since emitted from the optoelectronic semiconductor chip Nutzlicht under certain circumstances in non-attenuated form can escape from the housing of the optoelectronic device.
  • the optical element When the optical element is damaged or removed, less or no reflected useful light reaches the light detector of the opto ⁇ electronic component, which is automatically detected. In this case appropriate measures can be taken to exclude any danger to persons.
  • the optoelectronic semiconductor chip of the optoelectronic component can be switched off in this case so that it no longer emits useful light.
  • the optical element is a diffractive optical element.
  • the optical element can divide a light beam emitted by the optoelectronic semiconductor chip into a plurality of light beams.
  • the optical element can also be provided for generating a different light pattern.
  • the optoelectronic semiconductor chip is a laser chip.
  • the optoelectronic component is suitable thereby generating useful light with high luminous intensity. At the same hazards to persons is part way legally excluded from the optoelectronic component before ⁇ .
  • the light detector is a photodiode.
  • the light detector enables therefore provides an easy and reliable detection of reflected on the optical element useful light.
  • the light detector is arranged such that a resulting due to reflection of the useful light on the optical element Beu ⁇ supply image impinges on the light detector.
  • a detection of the incident on the light detector diffraction pattern thereby enables not only detection of the EXISTING ⁇ dens one of the optical element, but also a detection of the presence of a diffractive property of the optical element, that is a proof of the function of the optical element.
  • the optoelectronic Bauele ⁇ ment advantageously a particularly high Reliable ⁇ ness.
  • the light detector is arranged such that useful light reflected at the optical element does not affect the light source
  • a reliable detection be ⁇ Sonders, this allows that the optical ele ment ⁇ of the optoelectronic component exists and its optical functionality is still obtained. On a possible ⁇ damaged damaged optical element reflected reflected light does not affect the detection security. A particularly high loading ⁇ operational safety of the optoelectronic component is advantageously possible.
  • the optical element is disposed so that light emitted from the opto-electronic semiconductor chip ⁇ useful light under egg nem applies different from 90 ° angle to a surface of op ⁇ tables element.
  • the light reflected at the optical element useful light is thereby thrown in a direction that is not precisely ent ⁇ against to the direction of striking the surface of the optical element useful light. This advantageously makes it possible to arrange the light detector at a suitable position spaced from the optical semiconductor chip in the housing of the optoelectronic component.
  • a mirror element is arranged in the housing.
  • useful light emitted by the optoelectronic semiconductor chip is deflected at the mirror element.
  • this makes it possible to arrange the optoelectronic semiconductor chip in the housing of the optoelectronic component such that useful light emitted by the optoelectronic semiconductor chip is not directed directly onto the opti ⁇ cal element of the optoelectronic component. This allows a space-saving design of the opto ⁇ electronic device.
  • this method allows a high loading ⁇ operational reliability of the optoelectronic component and may in particular minimize the risk of personal injury.
  • the optoelectronic semiconductor chip of the optoelectronic component is further operated. Lacks the optical element of the optoelectronic construction elements ⁇ , or is damaged, gets little or no reflected useful light to the light detector which is detected in the examination of the opto-electronic component ⁇ . In this case, the optoelectronic semiconductor ⁇ chip is taken out of service, whereby any risk to persons is excluded by emitted from the optoelectronic semiconductor chip of the optoelectronic device Nutzlicht.
  • Fig. 2 is a plan view of the optoelectronic component of the first embodiment; a sectional side view of an opto ⁇ electronic component according to a second embodiment; and
  • Fig. 4 is a plan view of the optoelectronic component of the second embodiment.
  • Fig. 1 shows in a highly schematic representation of a side sectional view of an optoelectronic Bauele ⁇ ment 10 according to a first embodiment.
  • 2 shows a highly schematic representation of a partially transparent view of the optoelectronic component 10 from above.
  • the optoelectronic component 10 is provided to emit light, such as visible light or light having a wavelength in the infrared areas of the spectrum ⁇ rich.
  • the optoelectronic component 10 can be beispielswei ⁇ se a laser device which is intended to emit laser light ⁇ .
  • the optoelectronic component 10 can serve, for example, for producing a structured light pattern, for example in a device for detecting depth.
  • the optoelectronic component 10 may be provided in ⁇ example, for distance measurement by the transit time method (time-of-flight method) or for another purpose.
  • the optoelectronic component 10 has a housing 100. In the housing 100, an optoelectronic semiconductor chip 110 is arranged.
  • the optoelectronic semiconductor chip ⁇ 110 is formed to emit useful light 200 emitted by the optoelectronic component 10 to the outside.
  • the useful light 200 may be, for example sichtba ⁇ res light or light having a wavelength in the infrared spectral range.
  • the optoelectronic semiconductor chip 110 is designed as an edge emitting laser chip.
  • the opto-electronic semi-conductor chip ⁇ 110 could for example also be configured as a vertically ⁇ emitting laser chip or other optoelectronic semiconductor chip.
  • the light emitted by the optoelectronic semiconductor chip 110 useful light 200 is deflected by a 100 is arrange ⁇ tes in the housing mirror element 120 by 90 ° and enters subsequent ⁇ possessedd by an optical element 130 from the housing 100 of the optoelectronic component 10 from. It is possible to arrange the optoelectronic semiconductor chip 110 in the housing 100 of the optoelectronic component 10 in a direction other than that shown, such that the useful light 200 is applied to the mirror element 120 by another than a right one
  • Angle is deflected.
  • the 110 optoelekt ⁇ tronic semiconductor chip in the housing 100 such that the useful light is emitted 200 by the optoelectronic semiconductor chip 110 directly in the direction of the optical ele- ments 130th In this case, can be dispensed with the Spie ⁇ gel 120th It is also possible to provide more than one mirror element 120 and to divert the useful light 200 several times before it exits the housing 100 of the optoelectronic component 10 through the optical element 130.
  • the useful light 200 impinges at an angle 135 to the interior of the housing 100 facing surface 131 of the op ⁇ tables element 130.
  • the semi-conductor of the optoelectronic chip 110 emitted useful light 200 may be divergent.
  • a center axis of the light cone of the useful light 200 is at the angle 135 on the surface 131 of the optical element 130.
  • the angle 135 is 90 °.
  • the optical element 130 of the optoelectronic Bauele ⁇ ments 10 can serve to split 200 in a plurality of partial rays ⁇ the useful light or to form in a different way and / or mitigate.
  • the optical ele ment ⁇ 130 is formed as a diffractive optical element.
  • the Nutzlicht 200 is radiated in the far field as transmitted diffraction image 210 in the vicinity of the optoelectronic device 10.
  • the useful light 200 emitted by the optoelectronic semiconductor chip 110 of the optoelectronic component 10 can have an intensity which represents a potential danger to persons, for example a danger to the eyes or the skin of persons.
  • the intensity of the useful light 200 is attenuated such that the light radiated into the environment of the optoelectronic component 10 transmitted diffraction image 210 does not endanger the secure ⁇ plurality of persons. Thereby, the operational safety of the optoelectronic component 10 is secured slightest ⁇ tet, as long as the optical element 130 of the optoelectronic component 10 is present and intact.
  • optical element 130 If the optical element 130 is missing, or if it is damaged, then in a further operation of the optical component
  • the optoelectronic semiconductor chip 110 has 130, the optoelectronic component taken and 10 out of operation insbesonde ⁇ re in the case of a lack or damage of the optical element turned off ⁇ the, so that the optoelectronic semiconductor chip 110 no useful light 200 more emitted.
  • the optoelectronic component 10 has a arranged in the Ge rectifu ⁇ se 100 light detector 140 which is arranged to check if the optical element 130 of the opto ⁇ electronic component 10 is present and intact.
  • the light detector 140 is designed to detect useful light 200 striking the light detector 140.
  • the Lichtde ⁇ detector 140 may be formed, for example, as a photodiode.
  • a part of the light emitted by the optoelectronic semiconductor chip 110 useful light 200 that strikes the surface 131 of the optical element 130 is reflected back as reflected light 220 ⁇ useful in the housing 100 of the optoelectronic Bauele ⁇ ments 10th
  • the light detector 140 is so in placing the housing 100 such that at least a part of the re ⁇ inflected useful light strikes the light detector 140 200, which can be detected by the light detector 140th As long as the optical element 130 is in place and intact, meets reflected useful light 220 onto the light detector 140. In the absence, the optical element 130 or is damaged, so ge ⁇ reached less or no reflected useful light 220 to light detector 140, which automatically by the light detector 140 is detectable. Thereby, the light detector 140 enables easy detection of damage or removal of the optical element 130.
  • a method for operating the optoelectronic component 10 can therefore provide for checking whether a defined amount of useful light 220 reflected at the optical element 130 reaches the light detector 140. If this is not the case, the optoelectronic semiconductor chip ⁇ 110 of the optoelectronic component 10 is such Reg ⁇ switched or otherwise out of service, that the optoelectronic semiconductor chip 110 does not emit useful light 200 more.
  • the optoelectronic component 10 may have a control unit 300, which is designed to carry out this method.
  • the control unit 300 with the
  • Light detector 140 and be coupled to the optoelectronic semiconductor chip 110.
  • the coupling can also be effected via intermediate links, for example via a driver scarf ⁇ tung, which supplies the optoelectronic semiconductor chip 110 with electric voltage and electric current.
  • the control unit 300 may comprise, for example, a microcontroller or an application-specific integrated circuit (ASIC). However, the control unit 300 of the optoelectronic component 10 may also be omitted. In this case, the method described can be performed, for example, by a separate from The control unit embodied in the optoelectronic component 10 can be carried out.
  • ASIC application-specific integrated circuit
  • the optical element 130 of the optoelectronic Bauele- ment 10 is formed as a diffractive optical element, so that is reflected toward the surface 131 of the optical element 130 impinging useful light 200 not only in an ordinary manner in accordance with the Fresnel's formula, but ⁇ additionally also on the Structures of the optical element 130 diffracted.
  • the light reflected by the optical element 130 includes useful light 220 directed so that reflected light useful ⁇ 240 and a reflected diffraction image 230.
  • the reflectors ⁇ oriented diffraction image 230 may be an image of the transmitted diffraction image 210, but may also be designed differently.
  • the reflected diffraction image 230 can reach areas within the housing 100 into which the directionally reflected useful light 240 does not reach. If the light detector so placed 140 in the housing 100 that only directed reflectors ⁇ pending useful light 240, or both directed reflected useful light 240 and light of the reflected diffraction ⁇ image 230 is incident on the light detector 140, thus allowing the light detector 140, a test whether the optical element 130 of the optoelectronic component 10 is present. Of the
  • Light detector 140 may in this case, moreover, allow to determine whether a damage to the optical element 130 is present through which, is reducing the amount of the directed re ⁇ inflected useful light 240 which is incident on the light detector 140th
  • the light detector 140 If the light detector 140 is placed in the housing 100 of the opto ⁇ electronic component 10, that only light of the reflected diffraction image 230 or both light of the reflected diffraction image 230 and directed re ⁇ reflected useful light 240 strikes the light detector 140, so the light detector 140 additionally allow an examination whether the optical element 130 still has its diffracting egg features. If the optical element 130 in ⁇ example by excessive heating, such beM interred ⁇ that it loses its diffractive properties, so ge ⁇ reached the light of the reflected diffraction image 230 no longer or only in a reduced amount to the light detector 140, which is automatically recognizable. In this case, Kings ⁇ nen turn taken appropriate measures to ensure the reliability of the optical component 10 ⁇ to. In particular, for example, the optoelectronic semiconductor chip 110 of the optoelectronic component 10 can be switched off.
  • FIG. 3 shows a highly schematic representation of a sectional side view of an optoelectronic component 20 according to a second embodiment.
  • 4 shows a highly schematic and partially transparent plan view of the optoelectronic component 20 from above.
  • the optoelectronic component 20 has great correspondence with the optoelectronic component 10 of FIGS. 1 and 2.
  • Components of the optoelectronic component 20 which correspond to the components present in the optoelectronic component 10 are provided with the same reference symbols in FIGS. 3 and 4 as in FIGS. 1 and 2. In the following, only the differences between the optoelectronic
  • the optoelekt ⁇ tronic semiconductor chip 110 At the optoelectronic component 20 the optoelekt ⁇ tronic semiconductor chip 110, the mirror element 120 and optical element 130 are oriented to each other such that the angle 135 at which the light emitted by the optoelectronic semiconductor chip 110 off hinged to the mirror element 120 useful light 200 the surface 131 of the optical
  • Elements 130 meets is different from 90 °.
  • the useful light 220 reflected at the optical element 130 is transferred to other areas in the interior of the housing 100 is thrown back than is the case with the optoelectronic component 10 of the first embodiment.
  • the light detector 140 can be arranged at a different position in the interior of the housing 100 than in the optoelectronic component 10 of the first embodiment. This can make it easier to accommodate the components of the optoelectronic component 20 in the housing 100 of the optoelectronic component 20.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Semiconductor Lasers (AREA)

Abstract

Composant optoélectronique (10, 20) qui présente un boîtier (100) dans lequel sont disposés une puce semiconductrice optoélectronique (110) conçue pour émettre de la lumière utile et un détecteur de lumière (140). La lumière utile émise par la puce semiconductrice optoélectronique peut sortir du boîtier par un élément optique (130) du composant optoélectronique. Le détecteur de lumière est conçu pour détecter la lumière utile réfléchie sur l'élément optique.
PCT/EP2017/056093 2016-03-17 2017-03-15 Composant optoélectronique et procédé pour faire fonctionner un composant optoélectronique WO2017158004A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016104947.6A DE102016104947A1 (de) 2016-03-17 2016-03-17 Optoelektronisches Bauelement und Verfahren zum Betreiben eines optoelektronischen Bauelements
DE102016104947.6 2016-03-17

Publications (1)

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WO2017158004A1 true WO2017158004A1 (fr) 2017-09-21

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WO (1) WO2017158004A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019208437A1 (fr) * 2018-04-25 2019-10-31 京セラ株式会社 Boîtier de montage d'élément optique, dispositif électronique et module électronique
WO2020020893A1 (fr) * 2018-07-24 2020-01-30 Osram Oled Gmbh Dispositif semi-conducteur optoélectronique comprenant des premiers et des deuxièmes éléments optoélectroniques
CN113196597A (zh) * 2018-12-17 2021-07-30 ams国际有限公司 包括增强的眼睛安全性特征的发光模块

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EP0805528A2 (fr) * 1996-04-29 1997-11-05 Motorola, Inc. Système de surveillance de puissance par réflection pour VCSEL
US20050084218A1 (en) * 2003-09-08 2005-04-21 Seiko Epson Corporation Optical module, and optical transmission device
DE102005016052A1 (de) * 2004-08-20 2006-03-02 Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto Selbstüberwachende Licht emittierende Vorrichtung
US20120104225A1 (en) * 2010-11-02 2012-05-03 Microsoft Corporation Detection of configuration changes in an illumination system

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KR100373801B1 (ko) * 1994-07-29 2003-05-09 산요 덴키 가부시키가이샤 반도체레이저장치및이를이용한광픽업장치
US6314223B1 (en) * 1998-08-31 2001-11-06 Digital Optics Corporation Diffractive vertical cavity surface emitting laser power monitor and system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0805528A2 (fr) * 1996-04-29 1997-11-05 Motorola, Inc. Système de surveillance de puissance par réflection pour VCSEL
US20050084218A1 (en) * 2003-09-08 2005-04-21 Seiko Epson Corporation Optical module, and optical transmission device
DE102005016052A1 (de) * 2004-08-20 2006-03-02 Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto Selbstüberwachende Licht emittierende Vorrichtung
US20120104225A1 (en) * 2010-11-02 2012-05-03 Microsoft Corporation Detection of configuration changes in an illumination system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019208437A1 (fr) * 2018-04-25 2019-10-31 京セラ株式会社 Boîtier de montage d'élément optique, dispositif électronique et module électronique
WO2020020893A1 (fr) * 2018-07-24 2020-01-30 Osram Oled Gmbh Dispositif semi-conducteur optoélectronique comprenant des premiers et des deuxièmes éléments optoélectroniques
CN112514181A (zh) * 2018-07-24 2021-03-16 欧司朗Oled股份有限公司 具有第一和第二光电元件的光电半导体装置
CN113196597A (zh) * 2018-12-17 2021-07-30 ams国际有限公司 包括增强的眼睛安全性特征的发光模块

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