WO2017137880A1

WO2017137880A1 - Electronic packages, housings or packages having one or more apertures

Info

Publication number: WO2017137880A1
Application number: PCT/IB2017/050635
Authority: WO
Inventors: Ger Reuvers; David Lam
Original assignee: Rjr Technologies, Inc.
Priority date: 2016-02-08
Filing date: 2017-02-06
Publication date: 2017-08-17

Abstract

The present disclosure describes a lead for semiconductor device package having at least one aperture through a portion of the lead that will be bonded to a PCB. A semiconductor device package includes a housing having a base, a side wall frame, and a lid, a die surrounded by the housing, and at least one lead extending from the die until the die is exterior to the housing, the lead having at least one aperture through a portion of the lead that will be bonded to a PCB.

Description

ELECTRONIC PACKAGES, HOUSINGS OR PACKAGES HAVING ONE OR MORE APERTURES

Inventors: GER REUVERS AND DAVID LAM, RJR TECHNOLOGIES, INC. FIELD

[0001] The present disclosure relates generally to electronic packages having at least one lead having one or more apertures therethrough, including for example, semiconductor circuit devices with one or more leads extending therefrom, the leads having one or more apertures therethrough to facilitate the escape of flux vapor and improve mechanical bonding.

BACKGROUND

[0002] Semiconductor circuit devices are ubiquitous in consumer and commercial products and devices throughout the world. Such semiconductor circuit devices are often comprised of materials such as silicon, gallium arsenide, and other similar "semi-conductor" materials, and are commonly referred to in industry as "dies." Any given die may be capable of containing a multitude of circuit elements for performing various functions.

[0003] In use, these dies are incorporated into electronic systems (packages) which access the circuitry in the dies and to which the dies contribute their specific functions. Incorporation into these systems is achieved in a variety of ways. Typically, the package is mounted to the circuitry of a printed circuit board (PCB), with "leads" joining the circuitry of the die to that of the PCB.

[0004] Often, the die and the leads that join the circuitry of the die to that of the PCB are protected by a cover, which itself may include any number components, including sides and lids of various protective materials such as metals, ceramics, glass and plastics or any other suitable materials. These components form a housing for the die, with the leads projecting beyond the housing, and together the components are collectively referred to as a "package." These packages encase and protect the dies and facilitate the electrical connections that join the die circuitry to external components such PCBs.

[0005] In this regard, the packages are often connected to PCBs by soldering the leads to the PCB. To do so, a layer of solder and flux is placed between the leads and the PCB, and with the application of heat and pressure, the solder melts and creates a conductive bond between the leads and the PCB when it hardens. However, the flux typically evaporates at a lower temperature than the solder and while the flux vapor may provide benefits such as the etching of solder surfaces resulting in better wettability and at the same time reducing or preventing oxygen from contacting and corroding the surfaces, if the vapor cannot escape, the vapor can form voids underneath the leads, reducing conductivity and weakening the bond. Attempts to eliminate these voids typically include using larger vertical forces to help force the flux vapor out from between the leads and the PCB. This may be particularly the case when the package uses large leads in its design. However, large forces present other issues including manufacturing limitations and undue stresses on the package and PCB components. Moreover, when packages are soldered at multiple levels, for example, to a PCB and to a base or heatsink, the flux vapor from the lower level (e.g., the base level) can negatively impact the higher solder level (e.g., the PCB level) irrespective of the forces used because the flux vapor cannot escape.

[0006] As such, there is a need for apparatus, systems, and methods that reduce or eliminate voids underneath the leads and increase the strength of the bonds between the components.

SUMMARY OF THE INVENTION

[0007] While the ways in which the present disclosure addresses the disadvantages of the prior art will be discussed in greater detail below, in general, the present disclosure is directed to a lead or leads for a semiconductor device package comprising at least one aperture through a PCB bonding region of the lead (i.e., the portion of the lead that will be bonded to a PCB). In accordance with various aspects of the present disclosure, the semiconductor device package may be constructed of any known or as yet unknown materials.

[0008] Non-limiting examples of semiconductor package devices contemplated herein include two-piece packages where the base is pre-attached to a ring frame and where the leads are attached to the top of the ring frame, thereby insulating the lead from the base. These are commonly known as two-piece package design. Alternatively other package designs such as those made with a lead frame, die and wire bonds with leads that go from inside an over molded body to the outside to be attached to the board, which are commonly known as an over molded package, are also contemplated. Further designs are also contemplated and include a three-piece package design comprising a housing having a base, a side wall frame (sometimes referred to as a "ring frame"), and a lid which together make a housing with an air cavity package such that one or more dies are surrounded by the resulting housing, and at least one lead extends from inside the package to the outside, with the die and the lead connected using wire bonds (or any other suitable means). In any of the foregoing semiconductor packages, the lead(s) comprise at least one aperture through a region of the lead(s) that will be bonded to a PCB.

[0009] The present disclosure includes methods of bonding a semiconductor device package to a PCB and other related components at other levels (such as at a heatsink), comprising the steps of inserting a semiconductor device package comprised of a housing having a base, a side wall frame, and a lid surrounding a die into a cavity in a PCB, initiating contact between a solderpaste pattern printed on the PCB (or other components) and a portion of a lead extending from the die that is exterior to the housing, applying heat and pressure to the lead, solderpaste and PCB so that the solder melts and fills an aperture formed in the lead, while the flux evaporates and escapes from between the lead and the PCB through the aperture in the lead.

BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The accompanying drawings are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure, and together with the description serve to explain the principles of the disclosure, wherein like numerals denote like elements and wherein:

[001 1] Figure 1 is cross-sectional side view of a semiconductor device package mounted to a printed circuit board;

[0012] Figure 2 is cross-sectional side view of a printed circuit board with a solderpaste screen printed thereon;

[0013] Figure 3 is close-up cross-sectional side view of the printed circuit board of Figure 2 with the solderpaste screen printed on it;

[0014] Figure 4 is cross-sectional side view illustrating the movement of a semiconductor device package as it is pushed down into a cavity of a printed circuit board;

[0015] Figure 5 is perspective view a side wall frame and lead frame assembly;

[0016] Figure 6 is cross-sectional side view of a semiconductor device package with an aperture in a lead proximate a side wall frame showing flux vapor from preform solder underneath the base escaping through the aperture; and

[0017] Figure 7 is perspective view of a semiconductor device package with apertures in a lead proximate a side wall frame showing flux vapor from preform solder underneath the base escaping through an aperture.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

[0018] Persons skilled in the art will readily appreciate that various aspects of the present disclosure can be realized by any number of structures, components, and systems configured to perform various functions disclosed herein. Stated differently, other such structures, components, and systems can be incorporated herein to perform the intended functions. It should also be noted that the accompanying drawing figures referred to herein are not all necessarily drawn to scale, and may be exaggerated to illustrate various aspects of the present disclosure, and in that regard, the drawing figures should not be construed as limiting.

[0019] Additionally, it is noted that the present disclosure may be at times described in connection with a laterally diffused metal oxide semiconductor (LDMOS) package of dies and leads, but other dies and packages are likewise contemplated herein. Examples of various packaging systems and methods include, for example, those disclosed in U.S. Patent No. 6,511 ,866 entitled "Use of Diverse Materials in Air- Cavity Packaging of Electronic Devices" issued January 28, 2003 which is incorporated herein by reference in its entirety.

[0020] It is noted that this disclosure is for non-limiting exemplary purposes only, and it should be appreciated that the disclosure may find application in any number of configurations with any number of components other than, for example, the package types disclosed herein. Indeed, the disclosure may have applicability in any application where one component is to be adhered to another component in the presence of a material which may be come gaseous and induce negative effects if the gas cannot escape from between the components to be adhered. Examples may include any application where a first component is to soldered to a second component in the presence of a solder and a flux, whether or not the surfaces are part of semiconductor circuit devices or similar packages, where there is a desire to facilitate the escape of flux vapor, and the same may still fall within the scope of the present disclosure.

[0021] With the above being noted and with reference to Figure 1 , a cross- sectional view illustrating an LDMOS package 100 inserted into a cavity 102 in a PCB 110 and a heat sink 116. While the package 100 may be comprised of any now known or as yet unknown components and materials, the illustrated package 100 is comprised of a base 104, a side wall frame 106, and a lid 108 surrounding a die 112. The materials of base 104, side wall frame 106, and lid 108 may vary by application and examples are described below, but in general may comprise any known or as yet unknown materials suitable forthe application, including those disclosed in U.S. Patent No. 6,511 ,866 incorporated by reference above. Similarly, the PCB 1 10 can be any conventional PCB, known or as yet unknown.

[0022] Though the order of assembly of the components disclosed herein may vary based on the application and/or use of the contemplated devices, in some embodiments, the die 1 12 is secured to the base 104 that serves as the floor of the package 100 by any suitable means such as solder, epoxies, adhesives or the like. In other embodiments, the side wall frame 106 and or lid 108 may be first molded around die 1 12, and then these components may be attached to the base 104. In still other embodiments, the die 1 12 or just the leads 114 may be molded and embedded into the side wall frame 106, and this portion may be attached to the base 104, with the die 112 and/or lid 108 attached later. In any event, one skilled in the art will appreciate that the order and assembly of these components may vary and still fall within the scope of the present disclosure.

[0023] Depending on the type of package, the base 104 may be one that dissipates heat rapidly from the die 112, or one in which heat dissipation is not critical. When high heat conductivity is needed, the base 104 can be either a metallic material, a ceramic material, a metal-coated ceramic material, or a ceramic material with a metal insert. When high heat conductivity is not needed, the base 104 can be any of these materials as well as plastic.

[0024] In an embodiment, after the die 112 is secured to the base 104, the side wall frame 106 may be placed over the base. Any suitable materials, for example, thermosetting or thermoplastic materials, can be used for the side wall frame 106. Thermosetting materials are typically molded by transfer molding, while thermoplastic materials are typically molded by injection molding, although different molding methods can be used.

[0025] As mentioned briefly above, the side wall frame 106 can be pre-formed with embedded leads 1 14, the leads 1 14 having surfaces or ends that extend into a space enclosed by the side wall frame 106 and thus can be accessible for bonding to the die 112. For non-metallic bases 104, the leads 1 14 can also be embedded in the base 104. In various aspects of the present disclosure, the base 104, side wall frame 106, and/or lid 108 may be unitarily constructed, and the leads 114 may be embedded therein.

[0026] In packages 100 in which the leads 114 are embedded in the side wall frame 106, the side wall frame 106 can be molded around the leads 1 14. Procedures for molding side wall frame 106 over leads 114 are generally known, and generally involve molding plastic over a lead frame assembly that includes a series of metal leads joined by connecting members and arranged in discrete groups, adjacent groups being connected by additional connecting members that may or may not be removed when molding is complete.

[0027] Conventional molding techniques such as injection molding, transfer molding, insert molding, FAM (film assist molding) and reaction-injection molding can be employed, depending on the materials used. Prior to the molding process, adhesive is applied to the lead frame at the locations where the leads 114 will contact the plastic. The adhesive will cure at the plastic molding temperature, forming a seal around the leads that helps prevent intrusion of moisture and other atmospheric gases. Alternatively, hermetic adhesion may also be assured by surface-treating the leads so that the plastic adheres to the leads due to mechanical/chemical forces.

[0028] The number of leads 114 may vary widely depending on the die 1 12 and the application for which it is intended. Thus, as few as two leads 1 14 or as many as 100 or more may be present, and the leads 114 may be on one side of the frame or on all sides (e.g., four). Likewise, the shape of leads 114 may vary widely depending on the die 1 12 and the application for which it is intended. For example, with reference to the various drawing Figures, the leads may have a generally rectangular, generally planar shape. However, the dimensions and shapes may take any number of elliptical or polygonal shapes, as well as various eccentric or irregular shapes.

[0029] In various embodiments, the base 104 maybe placed on and/or adhered to a heatsink 1 16 comprised of any known or unknown materials to aid in transferring the heat away from the various components described herein. The base 104 and the heatsink maybe adhered by a preform solder, which may or may not have a flux present as well.

[0030] As noted above, the components described herein may be configured from any number of conventionally known materials as well as those as yet unknown. For example, the base 104 may comprise metal or metal inserts or coatings, examples of suitable metals are listed below, together with their symbols as indicated by the Electronic Materials Handbook, Vol. 1 , Minges, M. L , et al, eds. , ASM International, Materials Park, Ohio, 1989:

• copper

• copper-tungsten alloys

• copper-iron alloys: C19400, C19500, C19700, C19210

• copper-chromium alloys: CCZ, EFTEC647

· copper-nickel-silicon alloys: C7025, KLF 125, C19010

• copper-tin alloys: C50715, C50710

• copper-zirconium alloys: C15100

• copper-magnesium alloys: C15500

• iron-nickel alloys: ASTM F30 (Alloy 42) • iron-nickel-cobalt alloys: ASTM F15 (Kovar)

• mild steel

• aluminum

• phosphorous copper

• bronze.

[0031] Preferred among these are copper, copper-containing alloys in which copper constitutes at least 95% by weight, iron-nickel alloys in which iron constitutes from about 50% to about 75% by weight, and iron-nickel-cobalt alloys in which iron constitutes from about 50% to about 75% by weight. The iron-nickel alloy Alloy 42 (58% Fe, 42% Ni) and the iron-nickel-cobalt alloy Kovar (54% Fe, 29% Ni, 17% Co), as well as the various copper alloys are of particular interest. Metal laminates can also be used, notably copper-molybdenum-copper in view of its particular high thermal conductivity. These metals and alloys can also be used as the leads 1 14 penetrating the side wall frame 106 of the package 100.

[0032] For packages 100 using a ceramic base 104, examples of suitable ceramics include AI203 (alumina), BeO (beryllia), AIN (aluminum nitride), SiN (silicon nitride), and blends of these materials, and AI203 modified by the addition of BaO (barium oxide), Si02 (silica), or CuO (cupric oxide). Preferred ceramics are alumina, optionally modified, and beryllia.

[0033] For packages 100 using a plastic base 104, suitable plastics include both thermosetting and thermoplastic materials. Examples of thermosetting materials are epoxy resins and modified epoxy resins, polyimides, modified polyimides, polyesters, and silicones. Examples of thermoplastic materials are polyurethanes, polyphenylene sulfide, polysulfone, polyether ketone, and aromatic polyesters such as liquid crystal polymer containing approximately 20-40% filler such as glass, ceramic or minerals.

[0034] When a highly heat-transmissive bond is needed between the die 1 12 and the base 104, a wide variety of solder materials are available that will form such a bond. Solder alloys may be formed from tin, lead, antimony, bismuth, cadmium, silver, copper, or gold, and various other elements in relatively small amounts. Eutectic alloys are generally preferred because of their ability to maintain the proportions of their components during melting and solidification. Examples are copper-iron alloys, copper-chromium alloys, copper-tin alloys, iron-nickel alloys, iron- nickel-cobalt alloys, tin-silver alloys, and gold-tin alloys. Exemplary embodiments as disclosed herein use tin-silver-copper alloys.

[0035] The temperature at which the die 112 is soldered or bonded to the base 104 will vary depending on the solder or bonding agent used. For high-temperature soldering as needed for high heat transmissivity, a soldering temperature above 250°C is generally used. In most cases, the soldering temperature will fall within the range of 250°C to 500°C, and preferably, within the range of 300°C to 400°C. For low- temperature soldering or bonding, the temperature will generally fall within the range of 125°C to 175°C. When epoxy is used, for example, the typical bonding temperature is about 150°C.

[0036] Application of the side wall frame 106 to the base 104 may likewise be achieved by the use of an adhesive, for example, a heat-curable polymeric adhesive. Adhesives for use in both locations include both thermosetting and thermoplastic materials, such as epoxy adhesives, polyamides, silicones, phenolic resins, polysulfones, or phenoxy adhesives. Examples of thermosetting adhesives are: • D.E.R. 332: an epoxy resin with bisphenol A (Dow Chemical Company, Midland, Mich., USA)

• ARALDITEC® ECN 1273: an epoxy cresol novolac (Ciba-Geigy Corporation, Ardsley, N.Y., USA)

• ARALDITE® MY 721 : a polyfunctional liquid epoxy resin (Ciba-Geigy Corporation)

• QUARTEX® 1410: an epoxy resin with bisphenol A (Dow Chemical Company)

• EPON® 828, 1001 F, 58005: modified bisphenol A epoxy resins (Shell Chemical Company, Houston, Tex., USA)

• Examples of Thermoplastic Adhesives are:

· Phenoxy PKHJ: a phenoxy resin (Phenoxy Associates)

• Polysulfones

[0037] The adhesive composition optionally includes one or more ingredients to provide the composition with any of a variety of desirable properties. These ingredients include curing agents, antifoaming agents, moisture getters (desiccants), and fillers to add bulk. Examples of curing agents are polyamines, polyamides, polyphenols, polymeric thiols, polycarboxylic acids, anhydrides, dicyandiamide, cyanoguanidine, imidazoles, and Lewis acids such as complexes of boron trifluoride with amines or ethers. Examples of antifoaming agents are hydrophobic silicas such as silicone resins and silanes, fluorocarbons such as polytetrafluoroethylene, fatty acid amides such as ethylene diamine stearamide, sulfonamides, hydrocarbon waxes, and solid fatty acids and esters. Examples of moisture getters are activated alumina and activated carbon. Specific products that serve as moisture getters are those identified by the supplier (Alpha Metals of Jersey City, N.J., USA) as GA2000-2, SD1000, and SD800. Examples of fillers are alumina, titanium dioxide, carbon black, calcium carbonate, kaolin clay, mica, silicas, talc, and wood flour.

[0038] In an exemplary method for bonding the base 104, side wall frame 106, and/or the lid 108, the adhesive is first applied to the surface to be bonded, then heated to a moderate temperature to bring the adhesive to a B-stage in which the adhesive is tack-free and semi-solid at room temperature. The parts to be bonded, one or both of which having thus been coated with the B-stage adhesive, are then joined and heated further to cause the B-stage adhesive to liquefy and wet the surfaces and to cure fully to form a gas-impermeable seal.

[0039] The temperature used in curing the adhesive joining the side wall frame 106 to the base will vary with the particular adhesive used, but will generally be below 200°C. In most cases, the temperature range will be from 100°C to 200°C, and preferably from 125°C to 185°C.

[0040] Once the side wall frame 106 is bonded to the base 104, the die 112 may be wire bonded to the leads 114, and a lid 108 may be affixed to the side wall frame 106 to enclose the die 112. Securement of the lid 108 to the side wall frame 106 can be accomplished by adhesives in the same manner as the securement of the side wall frame 106 to the base 104.

[0041] With reference now to Figures 2-4, an exemplary process of assembly and bonding the leads 114 to the PCB 1 10 is described. As can be seen in Figure 2, the PCB 110 has PCB solderlands screen-printed with a SAC (tin-silver-copper or Sn/Ag/Cu) solderpaste 118 onto its upper, lead 114 facing surface. Alternative solderpastes may be used instead, depending on the particular application. In the presently described embodiment, with reference now to Figure 3 showing close-ups of the PCB 110 and the solderpaste 118, the solderpaste 118 comprises SAC solderballs 120 and are carried in a flux 122. The flux 122 may be any known or as yet unknown material, but are commonly comprised of organic or glycol bases.

[0042] With reference now to Figure 4, an illustration of the package 100 being pushed down into the cavity 102 in the PCB 1 10 is illustrated. As illustrated, as the package 100 moves into the cavity 102, the leads 1 14 move towards the solderpaste 118 until they make contact with the solderpaste 118 and, with the application of heat and pressure, the solderpaste 118 melts and bonds the leads 114 to the PCB 110 as it hardens. In the illustrated embodiment, because the solderpaste 1 18 is relatively thin, soft and bendable, placement forces can easily deform the "non-flat" portions of the solderpaste 118 as the solderballs 120 in the upper layers of the solderpaste 118 shift in between the solderballs 120 in the lower layers, while also pushing the horizontal stack of solderballs 120 laterally.

[0043] Generally speaking, the flux 122 evaporates at lower temperature than the solder melting temperature. For example, depending on the type of flux 122, the flux 122 evaporates between about 120°C and about 150°C. While the resulting flux vapor may provide the benefit of etching the solder surfaces for better wettability and may prevent oxygen contact which can corrode the solder surfaces, it is important that the flux vapor escapes from between the solder surfaces because if the flux vapor does not escape, it can form voids underneath the leads 1 14. Wth conventional leads, to reduce or eliminate voids, large vertical forces are required to force the flux vapor out.

[0044] Accordingly, with reference now to Figures 5-8, leads 114 in accordance with the present disclosure are configured to more readily allow flux vapor to escape. For example, in the illustrated embodiments, one or more apertures 124 passing through one surface of the lead 1 14 to another surface of the lead 114 are provided.

[0045] In various embodiments, the apertures 124 may be formed in the leads 114 in any suitable manner. For example, the apertures may be formed in the leads 114 by laser cutting, etching, EDM, machining, punching, or other suitable means.

[0046] The apertures 124 allow the vaporized flux 122 to escape closer to the location where that particular portion of flux 122 was vaporized. For example, with reference to Figure 5, with respect to the flux 122 that evaporates in the region designated as "A" the flux vapor can escape via one of the apertures 124 proximate region A, instead of requiring the vapor to be forced to a region farther away, such as the region designated by "B" in Figure 5. If the flux vapor can escape near region A, significantly less force is required than would be required to force the flux vapor to region B, and further reduces the potential that the flux vapor does not escape, resulting in one or more voids between the lead 114 and the PCB 110.

[0047] Thus, because the apertures 124 allow the flux vapor to escape easier, lower vertical forces are needed. This also allows the elimination of any need to configure the leads 1 14 to compensate for additional vertical forces which might otherwise be necessary to force the flux vapor to escape. Likewise, the forces required to hold the leads 1 14 in place while waiting for the solder to solidify can be reduced or eliminated. Further still, the apertures 124 provide and a place the solder can fill which increases the mechanical bond between the lead 1 14 and the PCB 110. Moreover, because the solder replaces lead 114 material that has been removed to create the apertures 124, the conductivity of the leads (e.g., the internal resistance for currents) is not influenced because of the conductivity of the solder that replaces the lead 114 material removed. [0048] In the illustrated embodiments, the apertures are rectangular, but those skilled in the art will appreciate that the apertures 124 may be shaped in any matter suited for a particular application, including any number or combination of elliptical or polygonal shapes, as well as various eccentric or irregular shapes. Additionally, the number of apertures 124 may vary by application and may include as few as one or two apertures 124, to dozens, hundreds or more.

[0049] For example, with reference to Figure 5, two of the leads 114 have an array of apertures 124 in a 3 x 1 1 configuration, and two of the leads have an array of apertures 124 in a 3 x 10 configuration, with two additional apertures 124 at one end of each lead 1 14. With reference now to Figures 6 and 7, an exemplary embodiment has leads 1 14 with apertures 124 that are proximate the side wall frame 106, but which are not filled with solder or bonded to the PCB 110. By leaving these apertures 124 open, flux vapor from the flux-containing preform solder at levels below the leads 114, for example, underneath the base 104 can escape through the lead 114. In the illustrated embodiments, the apertures are about 0.450 mm wide by 0.850 mm long and the apertures 124 are spaced apart from one another about 0.300 mm, though, as noted above, dimensions and shapes may vary based on the application.

[0050] Additionally, in some embodiments, the apertures 124 closest the side wall frame 106 may be offset to provide clearances so that the side wall frame 106 does not overlap the apertures 124 in those regions. For example, in some embodiments, the offset may range from about 0.20 mm to 0.30 mm, though again, this distance may vary based on the application.

[0051] Finally, the foregoing description emphasizes particular embodiments and examples of the contemplated disclosure. However, as those skilled in the art will recognize, however, the scope of the present disclosure extends as well to variations and modifications of the above, in terms of materials, operating conditions, operating procedures, and other parameters of the construction of these packages 100 and their components and of procedures for their assembly.

[0052] Likewise, numerous characteristics and advantages have been set forth in the preceding description, including various alternatives together with details of the structure and function of the methods and systems described herein. The disclosure is intended as illustrative only and as such is not intended to be exhaustive. It will be evident to those skilled in the art that various modifications may be made, especially in matters of order, process, structure, elements, components, and arrangement including combinations of the same within the principles of the disclosure, to the full extent indicated by the broad, general meaning of the terms in which the appended claims are expressed. To the extent that these various modifications do not depart from the spirit and scope of the appended claims, they are intended to be encompassed therein.

Claims

WHAT IS CLAIMED IS: We claim:

1. A lead for a semiconductor device package, comprising at least one aperture through a PCB bonding region of the lead for improving voidless soldering without impacting conductivity of the lead.

2. The lead for a semiconductor device package of claim 1 , further comprising a plurality of apertures through the lead.

3. The lead for a semiconductor device package of claim 1 , wherein the lead is bonded to the PCB using a solderpaste comprised of solderballs and flux.

4. The lead for a semiconductor device package of claim 3, wherein as the flux evaporates it escapes between the lead and the PCB through the at least one aperture.

5. A semiconductor device package, comprising:

a housing;

a die surrounded by the housing; and

at least one lead extending from the die until the lead is exterior to the housing, the lead having at least one aperture through a PCB bonding region of the lead.

6. The semiconductor device package of claim 5, further comprising a plurality of leads.

7. The semiconductor device package of claim 5, further comprising a plurality of apertures through the at least one lead.

8. The semiconductor device package of claim 5, wherein the housing is comprised of a base, a side wall frame, and a lid.

9. The semiconductor device package of claim 8, wherein at least two of the base, the side wall frame, and the lid are unitarily constructed.

10. The semiconductor device package of claim 8, wherein the base is at least one of ceramic, metal and plastic.

1 1. The semiconductor device package of claim 5, wherein a portion of the housing is formed around the at least one lead.

12. The semiconductor device package of claim 5, wherein the semiconductor device package is an LDMOS package.

13. The semiconductor device package of claim 5, wherein the at least one lead is bonded to the PCB using a solderpaste comprised of solderballs and flux.

14. The semiconductor device package of claim 13, wherein as the flux evaporates it escapes between the at least one lead and PCB through the at least one aperture.

15. A method of bonding a semiconductor device package to a PCB, comprising the steps of:

inserting a semiconductor device package comprised of a housing having a base, a side wall frame, and a lid surrounding a die into a cavity in a PCB;

initiating contact between a solderpaste screen printed on the PCB and a portion of a lead extending from the die exterior to the housing, the solderpaste comprising a combination of solder and flux; and

applying heat and pressure to the lead, solderpaste and PCB so that the solder melts and fills an aperture formed in the lead, and the flux evaporates and escapes from between the lead and the PCB through the aperture in the lead.

16. The method of bonding a semiconductor device package to a PCB of claim 15, further comprising a plurality of leads.

17. The method of bonding a semiconductor device package to a PCB of claim 16, further comprising a plurality of apertures through the plurality of leads.

18. The method of bonding a semiconductor device package to a PCB of claim 17, wherein the flux evaporates and escapes through the apertures closest to the flux when it evaporates.

19. The method of bonding a semiconductor device package to a PCB of claim 15, wherein at least two of the base, the side wall frame, and the lid are unitarily constructed.

20. The method of bonding a semiconductor device package to a PCB of claim 15, wherein the semiconductor device package is an LDMOS package.