WO2017125947A4 - A thermo-laminated multilayered zircon based high temperature co-fired ceramic (htcc) tape and the process thereof - Google Patents
A thermo-laminated multilayered zircon based high temperature co-fired ceramic (htcc) tape and the process thereof Download PDFInfo
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- WO2017125947A4 WO2017125947A4 PCT/IN2017/050014 IN2017050014W WO2017125947A4 WO 2017125947 A4 WO2017125947 A4 WO 2017125947A4 IN 2017050014 W IN2017050014 W IN 2017050014W WO 2017125947 A4 WO2017125947 A4 WO 2017125947A4
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- tape
- htcc
- zircon
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
- C04B35/481—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing silicon, e.g. zircon
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Abstract
The present invention provides a low cost preparation of ultra-low CTE and low dielectric loss high temperature co-fired ceramic (HTCC) substrates for highly integrated monolithic millimeter-wave integrated circuits (MMICs) utilized in high temperature environment. This HTCC zircon substrate is advantageous over currently available HTCC substrates in terms of cost effectiveness, excellent dielectric properties, close to zero thermal expansively, high thermal conductivity and good mechanical properties.
Claims
1. A thermo-laminated mnltilayered zircon based high temperature co-fired ceramic (HTCC) tape for microelectronic applications that has been made using zircon containing slurry comprising 50-70 wt. % of a filler mineral powder having average particle size of S40 nm well dispersed in 10-30 wt % of an organic solvent; 1-10 wt % of an organic binder, and 0.5-5 wt. % of two types of plasticizers.
2. The thermo-laminated multilayered zircon based high temperature co-fired ceramic (HTCC) tape as claimed in Claim 1, wherein the organic solvent is selected from a group consisting of anhydrous xylene, ethanol, toluene, methyl ethyl ketone, and mixtures thereof.
3. The thermo-laminated multilayered zircon based high temperature co-fired ceramic (HTCC) tape as claimed in Claim 1, wherein the organic binder is selected from the group consisting of polyvinyl butyral, polyvinyl alcohol, polyvinyl acetate, polyacrylonitrile, polyethyleneimine, poly methyl methacrylate, vinyl chloride-acetate, and mixtures thereof.
4. The tbermo-laminated multilayered zircon based high temperature co-fired ceramic (HTCC) tape as' claimed in Claim 1 , wherein the two types of plasticizers are selected from a group consisting of butyl benzyl phthalate, diisooctyl phthalate, diethyl phthalate,' dimethyl adipale, monomethyl adipate, dioctji adipate, di butyl sebacate, dibutyl maleate, triethyl citrate, acetyl triethyl citrate, tributyl citrate, acetyl tributyl citrate, trioctyl citrate, acetyl trioctyl citrate, trihexyl citrate, trimethyl citrate, alkyl sulphonic acid phenyl ester, polyethylene glycol, and mixtures thereof.
5. The thermo-laminated multilayered zircon based high temperature co-fired ceramic (HTCC) tape as claimed in claim 1, wherein the HTCC tape has microwave dielectric properties at 5 and 15 GHz have relative permittivity (k) ur - 3.1-10.1 (5 GHz), Dielectric loss (tano) - 4-5x10-4 (5 GHz), Relative pamituvity (k) er = 2.9-9.9 (15 GHz), Dielectric loss (tanS) = 6-9x10-4 (15 GHz); has thermal properties as Thermal conductivity: 10-16 W/mK, coefficent of thermal expansion: ±2 ppm/oC; has mechanical properties as tensile strength: 14-20 MPa, flcxural strength: 130-150 MPa; has low thermal shrinkage and aging ^microwave dielectric properties as X shrinkage ranges 5-10 %, Y shrinkage ranges 5-10 %, Z shrinkage less than 3-8 %; has good surface topography as Average surface roughness (Sa) " 100 nm, Root mean square roughness (Sq) = 140 nm.
6. A method of preparing a low cost thermally stable thermo-laminated multilayered zircon based high temperature co-fired ceramic (HTCC) tape developed for microelectronic applications comprising:
a. obtaining mineral sand with zircon as the major component, with trace amounts (<2 vol %) of iutile, monazite, quartz, siUimanite;
b. reduction in size of the mineral sand by ball milling and tape casting of zircon mineral by developing a stable colloidal slurry; and
c. fi-bri cation of HTCC substrate using the tape casted zircon (green tape)
7. A method as claimed in claim 6, wherein the casted green tape shows good tensile strength 0.7-1.0 MPa.
8. A method as claimed in claim 6, wherein the HTCC substrate shows good densification 80-95 % when sintered in the temperature range 1400-1700 oC.
9. A method as claimed in claim 6, wherein the tape casting slurry of ZrSi04 with typical pseudoplastic behavior is prepared and casted into thin tapes of thickness in the range of 0.07-0.1 mm.
10. A method as claimed in claim 6, wherein the thermo-laminated multilayered tape (4 layer) sintered at 1400-17 OOoC/2h shows good microwave dielectric properties
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2018537797A JP6912483B2 (en) | 2016-01-19 | 2017-01-10 | Fused Deposition Modeling Zircon-based Co-fired Ceramic (HTCC) Tape and Its Manufacturing Method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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IN201611001838 | 2016-01-19 | ||
IN201611001838 | 2016-01-19 |
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WO2017125947A1 WO2017125947A1 (en) | 2017-07-27 |
WO2017125947A4 true WO2017125947A4 (en) | 2017-09-08 |
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EP3842242B1 (en) * | 2018-09-27 | 2022-10-26 | Kyocera Corporation | Thermal head and thermal printer |
CN116583012A (en) * | 2023-04-14 | 2023-08-11 | 株洲艾森达新材料科技有限公司 | Multi-layer island ceramic circuit substrate based on cofired ceramic and preparation method thereof |
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US2553265A (en) | 1947-11-06 | 1951-05-15 | Corning Glass Works | Method of making zircon refractory |
US3347687A (en) | 1966-01-07 | 1967-10-17 | Harbison Walker Refractories | Zircon refractory |
US3791834A (en) | 1972-05-31 | 1974-02-12 | Taylors Sons Co Chas | Zircon refractory compositions |
US5407734A (en) * | 1988-10-20 | 1995-04-18 | General Electric Company | Fiber-containing composite |
DE4243538C2 (en) | 1992-12-22 | 1995-05-11 | Dyko Industriekeramik Gmbh | Zirconium silicate stone and process for its manufacture |
DE102011111788A1 (en) * | 2011-09-01 | 2013-03-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Sintered flat zirconium product |
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JP2019509243A (en) | 2019-04-04 |
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