WO2017115180A1

WO2017115180A1 - Synchronized sink roll

Info

Publication number: WO2017115180A1
Application number: PCT/IB2016/057376
Authority: WO
Inventors: Fayez F. AL-HARBI; Othman M. AL-MALKI
Original assignee: Sabic Global Technologies B.V.
Priority date: 2015-12-28
Filing date: 2016-12-06
Publication date: 2017-07-06

Abstract

A continuous-line apparatus and associated processing method include a cleaning station configured to remove contaminants from a metal component in transition through the continuous-line apparatus, and an annealing station configured to modify one or more properties of the metal component in transition through the continuous-line apparatus. The continuous-line apparatus also includes a galvanizing station configured to form an oxidation-resistant coating on the metal component in transition through the continuous-line apparatus, and an adjustable galvanizing roller or pulley configured to feed the metal component through the continuous-line apparatus. The adjustable galvanizing roller or pulley is also configured to synchronize via a CPU with a pre-determined dipping time for the metal component within the galvanizing station. The galvanizing roller or pulley is configured to adjust to a plurality of positions within the galvanizing station according to an associated plurality of pre-determined dipping times.

Description

SYNCHRONIZED SINK ROLL

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to and the benefit of U.S. Provisional Application No. 62/271,871, filed December 28, 2015. The contents of the referenced application are incorporated into the present application by reference.

BACKGROUND

Technical Field

[0002] Systems and methods for a continuous galvanizing line are described. In particular, an adjustable roller or pulley in a galvanizing station is described.

Discussion of the Related Art

[0003] A galvanizing process protects the surface of a finished metal or metal alloy from corrosion and oxidation. A continuous galvanizing line (CGL) is a system and process used to galvanize a metal component, such as metal strip or plate. The raw material, such as steel or steel alloy in the form of rolled coil is continuously fed through the CGL system through multiple processing stations. The stations are placed in series and connected to each other by ducts for circulating a reducing atmosphere which contains an inert gas, such as nitrogen or argon, and hydrogen. The CGL system includes a preheat furnace, an annealing furnace, a cooling station, and a station for dipping the metal component into a bath of liquid zinc or zinc alloy.

[0004] A CGL process can be varied in certain aspects, such as the temperature of a furnace, or the composition of the reducing atmosphere and/or the galvanizing bath. However, the velocity at which the raw material passes through the CGL system remains the same throughout each station of the CGL system. As a result of this limitation, the velocity (and hence the production rate) of the CGL is usually determined around a single station and/or constrained by a single processing step, such as the annealing station and cannot be different for another station, such as the galvanizing station. The properties of the coating layer of the metal component are affected by the dipping time in the galvanizing bath. However, conventionally there is no control of the dipping time in the galvanizing bath since the dipping time is controlled by the overall constant velocity of the CGL process.

SUMMARY

[0005] In one embodiment, a continuous-line apparatus includes a cleaning station configured to remove contaminants from a metal component, and an annealing station configured to modify one or more properties of the metal component. The continuous-line apparatus also includes a galvanizing station configured to form an oxidation-resistant coating on the metal component, and a central processing unit (CPU). The CPU is configured with circuitry to control functions within the galvanizing station. The galvanizing station includes a circumferential pulley or roller configured to feed the metal component through the continuous-line apparatus. The circumferential pulley or roller of the galvanizing station is adjustable in a vertical direction.

[0006] In another embodiment, a method of adjusting a treatment time in a continuous-line apparatus includes feeding a metal component through the continuous-line apparatus, and removing contaminants from the metal component via a cleaning station of the continuous- line apparatus. The method also includes modifying one or more properties of the metal component via an annealing station of the continuous-line apparatus, and adjusting a vertical height of a circumferential pulley or roller within a galvanizing station according to a predetermined dipping time for the metal component within the galvanizing station. The adjusting is controlled by a CPU. The method also includes forming an oxidation-resistant coating on the metal component via the galvanizing station.

[0007] In another embodiment, a continuous-line apparatus includes a cleaning station configured to remove contaminants from a metal component in transition through the continuous-line apparatus, and an annealing station configured to modify one or more properties of the metal component in transition through the continuous-line apparatus. The continuous-line apparatus also includes a galvanizing station configured to form an oxidation-resistant coating on the metal component in transition through the continuous-line apparatus, and an adjustable galvanizing roller or pulley configured to feed the metal component through the continuous-line apparatus. The adjustable galvanizing roller or pulley is also configured to synchronize via a CPU with a pre-determined dipping time for the metal component within the galvanizing station. The galvanizing roller or pulley is configured to adjust to a plurality of positions within the galvanizing station according to an associated plurality of pre-determined dipping times.

BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Fig. 1 illustrates a system for an automated continuous galvanizing line according to an embodiment;

[0009] Fig. 2A illustrates a system for an automated continuous galvanizing line using an adjustable synchronized sink roller according to an embodiment;

[0010] Fig. 2B illustrates a synchronized sink roller according to an embodiment;

[0011] Fig. 3 is a block diagram illustrating a hardware description of an exemplary computing device according to an embodiment;

[0012] Fig. 4 is a block diagram illustrating an exemplary data processing system according to an embodiment;

[0013] Fig. 5 is a block diagram illustrating an exemplary implementation of a CPU according to an embodiment; and

[0014] Fig. 6 is an exemplary method of adjusting a treatment time in a continuous-line apparatus according to an embodiment. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0015] A CGL includes approximately four stations for treating a metal component to be galvanized; however, more or fewer stations may be used depending on the desired performance of the CGL process. The metal component, which can be in the form of for example a strip, line, or plate is continuously fed through a reducing atmosphere, preferably a closed reducing atmosphere, system of stations. The CGL system can include a preheat station, an annealing station, a cooling station, and a galvanizing zinc or zinc alloy station among other stations and/or processing steps.

[0016] Fig. 1 illustrates a system 100 for an automated CGL. A metal component, such as strip metal or plate metal is continuously fed through system 100 from a coil of full hard material 110 (the material undergoing galvanization can take forms other than coiling). A cleaning station 115 uses a caustic and/or detergent solution to remove dirt, grease, oil, paint, or other contaminants from the surface of the metal component. The metal component can also be pickled in an acidic solution to remove mill scale, oxidation, and/or other contaminants present on the surface of the metal component. A pre-heat station 120 increases the temperature of the metal component via a direct-fired furnace (DFF) 125, although indirect heat such as electrical heat, electromagnetic and/or radiant heart may be used. The metal component is heated to a strip temperature of approximately 700° C in an air-depletion mode to provide a non-oxidizing atmosphere with respect to iron. However, other temperatures, such as 400° C to 700° C can also be used in the pre-heat station 120, based upon factors such as the composition of the metal or metal alloy, thickness, form, etc.

[0017] An annealing station 130 is configured to remove any surface oxide layer from the metal component prior to galvanizing the metal component. This may help to ensure good adhesion between a subsequent coating and the metal component. This is achieved by exposing the metal component to a reducing atmosphere via an annealing furnace. The reducing atmosphere includes approximately a 7% by volume, preferably 3-9%, 4-8% or 5- 6%), hydrogen protective atmosphere. However, other protective atmospheres containing a higher or lower percentage of hydrogen can be used in the annealing station 130, such as 15% to 40% hydrogen, based upon factors such as the composition of the metal or metal alloy, thickness, form, etc. The hydrogen protective atmosphere also includes inert components, such as nitrogen or argon.

[0018] A soaking and cooling station 135 applies a flux, such as zinc ammonium chloride to the metal component to inhibit oxidation of the cleaned surface of the metal component upon exposure to air. The flux is allowed to dry on the metal component and thereby aid in the process of the liquid zinc wetting and adhering to the metal component.

[0019] A galvanizing station 140 is configured to receive the metal component into a zinc or zinc alloy bath. A cooling station 145, such as a quenching bath reduces the temperature of the metal component to inhibit undesirable reactions of the newly-formed coating with the atmosphere. The zinc oxide coated metal component is recoiled into a finished product via a recoiler 150.

[0020] Operations of the system 100 are controlled by a computing center 160. Computing center 160 includes computing hardware and associated software configured to operate and control the CGL system 100. Multiple variations of computing hardware and associated software will depend upon the type and size of the CGL system 100. Fig. 1 illustrates a general-purpose server 165, a file server 170, a real-time communications server 175, and content management server 180, and a computer terminal 185. Computing center 160 illustrates just one of each type of server and terminal for simplicity. However, multiple servers and/or terminals, as well as other combinations of servers and terminals are contemplated by embodiments described herein. [0021] Fig. 2A illustrates a CGL system 200 having a galvanizing station 140 with a synchronized sink roller 141. Other numbers in Fig. 2A illustrate like features described with respect to Fig. 1. In an alternative embodiment, the synchronized sink roller 141 could be replaced with a synchronized sink pulley for CGL system 200 that uses pulleys throughout in lieu of rollers. The form of the metal component, such as strip, line, or plate will determine whether the CGL system 200 includes rollers or pulleys.

[0022] The synchronized sink roller 141 is mounted to a sliding rail 142 (illustrated in Fig. 2B) in which the synchronized sink roller 141 can be adjusted vertically to a position above a middle position or below the middle position. Raising or lowering the synchronized sink roller 141 results in a decrease or increase, respectively in the dipping time of the metal component in the galvanizing station 140. Raising or lowering the synchronized sink roller 141 may further result in a decrease or increase, respectively in the dipping pressure of the dipping bath on the metal component in the galvanizing station 140. A variable dipping time is thereby achieved, even though the rate at which the metal component being fed through the CGL system 200 is kept constant. Stated another way, a set length of metal component will reside within the zinc bath for a shorter period of time at the upper synchronized sink roller 141 position, and will reside within the zinc bath for a longer period of time at the lower synchronized sink roller 141 position. The length of time the metal component resides within the other stations will remain unchanged, i.e. the continuous metal component will move through the CGL system 200 at the same rate. Only the total dipping time within the zinc bath of the galvanizing station 140 is variable within the constraints of the CGL, while treatment times within the cleaning station 115, the pre-heat station 120, the annealing station 130, the soaking and cooling station 135, and the cooling station 145 will remain unchanged since the rate of feed of the continuous metal component is kept constant. [0023] Fig. 2B illustrates a close-up view of the synchronized sink roller 141 within the galvanizing station 140. The synchronized sink roller 141 can be raised to an upper position 141a on the sliding rail 142 if a shorter zinc bath time is desired. The synchronized sink roller 141 can be lowered to a lower position 141b on the sliding rail 142 if a longer zinc bath time is desired. The dipping time in the galvanizing station 140 affects the properties and thickness of the coating layer. A minimum coating thickness can be specified in relation to the metal component's section thickness. In an example, a section size thicker than 6 mm should have a minimum galvanized coating thickness of 85 μπι.

[0024] The variability of the dipping time changes according to the vertical adjustment of the roller or pulley in the galvanizing station 140, i.e. the dipping time decreases with a raising of the roller or pulley and the dipping time increases with a lowering of the roller or pulley. Therefore, the dipping time operates within an upper threshold time and a lower threshold dipping time. Embodiments described herein can increase the dipping time by lowering the roller/pulley to or near the lowest position, or decrease the dipping time by raising the roller/pulley to or near the highest position. Very short dipping times can be obtained by raising the roller/pulley to the highest position. Embodiments include adjustments of plus or minus 5%, 10%, 20%, 30%, or up to 90% from a conventional fixed position of the roller or pulley, for example.

[0025] The position of the synchronized sink roller 141 can be controlled by the computing center 160. For example, real-time communications server 175 may have received instructions to run the CGL within the zinc bath of galvanizing station 140 for a time period of ti. In response to the time designation, the content management server 180 retrieves an associated position for the synchronized sink roller 141 positioned upon the sliding rail 142 that coincides with the time period ti. Multiple combinations of time periods and synchronized sink roller 141 positions upon the sliding rail 142 are contemplated by embodiments described herein. The desired zinc bath time is synchronized with a set position of the synchronized sink roller 141 upon the sliding rail 142.

[0026] In one embodiment, the synchronized sink roller 141 is adjusted using a motorized conveyor line which moves the synchronized sink roller 141 vertically and/or at least partially vertically within a groove 143 of the sliding rail 142. The motorized conveyor line is controlled by the computing center 160. However, other mechanized and automated systems of roller or pulley adjustment are contemplated by embodiments described herein.

[0027] Embodiments described herein provide variability in the galvanizing time while all other station treatment times remain unchanged. The embodiments are realized by connecting and mounting the synchronized sink roller 141 within the groove 143 of the sliding rail 142 to provide a wide range of roller or pulley positions and an associated wide range of galvanizing times. The roller or pulley adjustment positions are synchronized with associated pre-determined bath times for the CGL, executed and controlled by the computing center 160.

[0028] In an embodiment, a first continuous-line apparatus includes a cleaning station configured to remove contaminants from a metal component, and an annealing station configured to modify one or more properties of the metal component. The first continuous- line apparatus also includes a galvanizing station configured to form an oxidation-resistant coating on the metal component, and a central processing unit (CPU). The CPU is configured with circuitry to control functions within the galvanizing station. The galvanizing station includes a circumferential pulley or roller configured to feed the metal component through the first continuous-line apparatus. The circumferential pulley or roller of the galvanizing station is adjustable in a vertical direction.

[0029] In the first continuous-line apparatus, the circumferential roller can be configured to feed continuous sheet material through the first continuous-line apparatus. The circumferential pulley or roller within the galvanizing station can be configured to adjust in the vertical direction in response to a pre-determined dipping time for the metal component within the galvanizing station while maintaining a constant feed velocity within the first continuous-line apparatus. The first continuous-line apparatus can include a continuous galvanizing line apparatus. The circumferential pulley or roller of the galvanizing station can be configured to adjust vertically and/or at least with a partial vertical vector, preferably within a groove of a sliding rail. A vertical adjustment of the circumferential pulley or roller within the groove of the sliding rail can be controlled via circuitry of the CPU. The CPU can be configured with circuitry to synchronize the vertical adjustment of the circumferential pulley or roller with an associated pre-determined dipping time within the galvanizing station.

[0030] In an embodiment, a second continuous-line apparatus includes a cleaning station configured to remove contaminants from a metal component in transition through the second continuous-line apparatus, and an annealing station configured to modify one or more properties of the metal component in transition through the second continuous-line apparatus. The second continuous-line apparatus can include a galvanizing station configured to form an oxidation-resistant coating on the metal component in transition through the second continuous-line apparatus, and an adjustable galvanizing roller or pulley configured to feed the metal component through the second continuous-line apparatus. The adjustable galvanizing roller or pulley can be configured to synchronize via a CPU with a predetermined dipping time for the metal component within the galvanizing station. The galvanizing roller or pulley is configured to adjust to a plurality of positions within the galvanizing station according to an associated plurality of pre-determined dipping times.

[0031] In the second continuous-line apparatus, the adjustable galvanizing roller can be configured to feed continuous sheet material through the second continuous-line apparatus. The adjustable galvanizing roller or pulley within the galvanizing station can be configured to adjust in a vertical direction in response to a pre-determined dipping time for the metal component within the galvanizing station while maintaining a constant feed velocity within the second continuous-line apparatus. The second continuous-line apparatus can include a continuous galvanizing line apparatus. The adjustable galvanizing roller or pulley of the galvanizing station can be configured to adjust vertically within a groove of a sliding rail. A vertical adjustment of the adjustable galvanizing roller or pulley within the groove of the sliding rail can be controlled via circuitry of the CPU. The CPU can be configured with circuitry to synchronize the vertical adjustment of the adjustable galvanizing roller or pulley with an associated pre-determined dipping time within the galvanizing station.

[0032] A hardware description of a computing device 300 according to exemplary embodiments is described with reference to Fig. 3. Computing device 300 is an exemplary description of general -purpose server 165, file server 170, real-time communications server 175, content management server 180, and computer terminal 185. The components described for computing device 300 may not all be present in general-purpose server 165, file server 170, real-time communications server 175, content management server 180, and/or computer terminal 185. In addition, general-purpose server 165, file server 170, real-time communications server 175, content management server 180, and/or computer terminal 185 may include components not described for computing device 300.

[0033] Computing device 300 includes a CPU 301 which performs the processes described above and herein after. The process data and instructions can be stored in memory 302. These processes and instructions can also be stored on a storage medium disk 304 such as a hard disk drive (HDD) or portable storage medium or can be stored remotely. Further, the claimed features are not limited by the form of the computer-readable media on which the instructions of the process are stored. For example, the instructions can be stored on CDs, DVDs, in FLASH memory, RAM, ROM, PROM, EPROM, EEPROM, hard disk or any other information processing device with which the computing device 300 communicates, such as a server or computer.

[0034] Further, the claimed features can be provided as a utility application, background daemon, or component of an operating system, or combination thereof, executing in conjunction with CPU 301 and an operating system such as Microsoft Windows 7, UNIX, Solaris, LINUX, Apple MAC-OS and other systems known to those skilled in the art.

[0035] The hardware elements in order to achieve the computing device 300 can be realized by various circuitry elements. For example, CPU 301 can be a Xenon or Core processor from Intel of America or an Opteron processor from AMD of America, or can be other processor types. Alternatively, the CPU 301 can be implemented on an FPGA, ASIC, PLD or using discrete logic circuits. Further, CPU 301 can be implemented as multiple processors cooperatively working in parallel to perform the instructions of the inventive processes described above and below.

[0036] The computing device 300 in Fig. 3 also includes a network controller 306, such as an Intel Ethernet PRO network interface card from Intel Corporation of America, for interfacing with network 333. As can be appreciated, the network 333 can be a public network, such as the Internet, or a private network such as an LAN or WAN network, or any combination thereof and can also include PSTN or ISDN sub-networks. The network 333 can also be wired, such as an Ethernet network, or can be wireless such as a cellular network including EDGE, 3G and 4G wireless cellular systems. The wireless network can also be WiFi, Bluetooth, or any other wireless form of communication that is known.

[0037] The computing device 300 further includes a display controller 308, such as a NVIDIA GeForce GTX or Quadro graphics adaptor from NVIDIA Corporation of America for interfacing with display 310, such as a Hewlett Packard HPL2445w LCD monitor. A general purpose I/O interface 312 interfaces with a keyboard and/or mouse 314 as well as a touch screen panel 316 on or separate from display 310. General purpose I/O interface 312 also connects to a variety of peripherals 318 including printers and scanners, such as an OfficeJet or DeskJet from Hewlett Packard. A sound controller 320 is also provided in the computing device 300, such as Sound Blaster X-Fi Titanium from Creative, to interface with speakers/microphone 322 thereby providing sounds and/or music.

[0038] The general purpose storage controller 324 connects the storage medium disk 304 with communication bus 326, which can be an ISA, EISA, VESA, PCI, or similar, for interconnecting all of the components of the computing device 300. A description of the general features and functionality of the display 310, keyboard and/or mouse 314, as well as the display controller 308, storage controller 324, network controller 306, sound controller 320, and general purpose I/O interface 312 is omitted herein for brevity.

[0039] The exemplary circuit elements described in the context of the present disclosure can be replaced with other elements and structured differently than the examples provided herein. Moreover, circuitry configured to perform features described herein can be implemented in multiple circuit units (e.g., chips), or the features can be combined in circuitry on a single chipset, as shown on Fig. 4. The chipset of Fig. 4 can be implemented in conjunction with computing device 300 described above with reference to Fig 3.

[0040] Fig. 4 shows a schematic diagram of a data processing system, according to certain embodiments, for performing menu navigation, as described above. The data processing system is an example of a computer in which code or instructions implementing the processes of the illustrative embodiments can be located.

[0041] In Fig. 4, data processing system 400 employs a application architecture including a north bridge and memory controller application (NB/MCH) 425 and a south bridge and input/output (I/O) controller application (SB/ICH) 420. The central processing unit (CPU) 430 is connected to B/MCH 425. The B/MCH 425 also connects to the memory 445 via a memory bus, and connects to the graphics processor 450 via an accelerated graphics port (AGP). The NB/MCH 425 also connects to the SB/ICH 420 via an internal bus (e.g., a unified media interface or a direct media interface). The CPU 430 can contain one or more processors and even can be implemented using one or more heterogeneous processor systems.

[0042] For example, Fig. 5 shows one implementation of CPU 430. In one implementation, an instruction register 538 retrieves instructions from a fast memory 540. At least part of these instructions are fetched from an instruction register 538 by a control logic 536 and interpreted according to the instruction set architecture of the CPU 430. Part of the instructions can also be directed to a register 532. In one implementation the instructions are decoded according to a hardwired method, and in another implementation the instructions are decoded according to a microprogram that translates instructions into sets of CPU configuration signals that are applied sequentially over multiple clock pulses. After fetching and decoding the instructions, the instructions are executed using an arithmetic logic unit (ALU) 534 that loads values from the register 532 and performs logical and mathematical operations on the loaded values according to the instructions. The results from these operations can be fed back into the register 532 and/or stored in a fast memory 540.

[0043] According to certain implementations, the instruction set architecture of the CPU 430 can use a reduced instruction set architecture, a complex instruction set architecture, a vector processor architecture, or a very large instruction word architecture. Furthermore, the CPU 430 can be based on the Von Neuman model or the Harvard model. The CPU 430 can be a digital signal processor, an FPGA, an ASIC, a PL A, a PLD, or a CPLD. Further, the CPU 430 can be an x86 processor by Intel or by AMD; an ARM processor; a Power architecture processor by, e.g., IBM; a SPARC architecture processor by Sun Microsystems or by Oracle; or other known CPU architectures.

[0044] Referring again to Fig. 4, the data processing system 400 can include the SB/ICH 420 being coupled through a system bus to an I/O Bus, a read only memory (ROM) 456, universal serial bus (USB) port 464, a flash binary input/output system (BIOS) 468, and a graphics controller 458. PCI/PCIe devices can also be coupled to SB/ICH 420 through a PCI bus 462.

[0045] The PCI devices can include, for example, Ethernet adapters, add-in cards, and PC cards for notebook computers. The Hard disk drive 460 and CD-ROM 466 can use, for example, an integrated drive electronics (IDE) or serial advanced technology attachment (SATA) interface. In one implementation the I/O bus can include a super I/O (SIO) device.

[0046] Further, the hard disk drive (HDD) 460 and optical drive 466 can also be coupled to the SB/ICH 420 through a system bus. In one implementation, a keyboard 470, a mouse 472, a parallel port 478, and a serial port 476 can be connected to the system bus through the I/O bus. Other peripherals and devices can be connected to the SB/ICH 420 using a mass storage controller such as SATA or PATA, an Ethernet port, an ISA bus, a LPC bridge, SMBus, a DMA controller, and an Audio Codec.

[0047] Moreover, the present disclosure is not limited to the specific circuit elements described herein, nor is the present disclosure limited to the specific sizing and classification of these elements. For example, the skilled artisan will appreciate that the circuitry described herein may be adapted based on changes on battery sizing and chemistry, or based on the requirements of the intended back-up load to be powered.

[0048] The functions and features described herein can also be executed by various distributed components of a system. For example, one or more processors can execute these system functions, wherein the processors are distributed across multiple components communicating in a network. The distributed components can include one or more client and server machines, which can share processing, such as a cloud computing system, in addition to various human interface and communication devices (e.g., display monitors, smart phones, tablets, personal digital assistants (PDAs)). The network can be a private network, such as a LAN or WAN, or can be a public network, such as the Internet. Input to the system can be received via direct user input and received remotely either in real-time or as a batch process. Additionally, some implementations can be performed on modules or hardware not identical to those described. Accordingly, other implementations are within the scope that can be claimed.

[0049] Embodiments described herein can be implemented in conjunction with one or more of the devices described above with reference to Figs. 3-5. Embodiments are a combination of hardware and software, and circuitry by which the software is implemented.

[0050] Fig. 6 illustrates an exemplary flowchart for performing a method according to aspects of the present disclosure. The hardware description above, exemplified by any one of the structural examples illustrated in Figs. 1 and 2A, constitutes or includes specialized corresponding structure that is programmed or configured to perform the method illustrated in Fig. 6. For example, the method illustrated in Fig. 6 may be completely performed by the circuitry included in the single device illustrated in Fig. 3, or the chipset as illustrated in Figs. 4-5. The method may also be completely performed in a shared manner distributed over the circuitry of a plurality of devices used in a cloud computing environment.

[0051] Fig. 6 is a flowchart for an exemplary method 600 of adjusting a treatment time in a continuous-line apparatus. Method 600 includes feeding a metal component through the continuous-line apparatus in step S610, such as the CGL system 200 illustrated in Fig. 2 A. Method 600 also includes removing contaminants from the metal component via a cleaning station of the continuous-line apparatus in step S620. The cleaning station can include a caustic solution to remove dirt, grease, oil, paint, or other contaminants from the surface of a metal component. Method 600 also includes modifying one or more properties of the metal component via an annealing station of the continuous-line apparatus in step S630. The annealing station can be configured to remove a surface oxide layer from the metal component. Method 600 also includes adjusting a vertical height of a circumferential pulley or roller within a galvanizing station according to a pre-determined dipping time for the metal component within the galvanizing station in step S640. The adjusting is controlled by a CPU. Method 600 also includes forming an oxidation-resistant coating on the metal component via the galvanizing station in step S650.

[0052] Method 600 can also include synchronizing, via circuitry of the CPU, the vertical height of the circumferential pulley or roller with a plurality of pre-determined dipping times for the metal component within the galvanizing station while maintaining a constant feed velocity of the metal component through the continuous-line apparatus. The adjusting of method 600 can include sliding the circumferential pulley or roller within a groove of a sliding rail, via circuitry of the CPU.

[0053] Method 600 can also include adjusting the pre-determined dipping time for the metal component within the galvanizing station via a synchronized adjustment of the vertical height of the circumferential pulley or roller. Method 600 can also include maintaining a constant feed velocity within the continuous-line apparatus during the adjusting. Method 600 can also include forming an oxidation-resistant coating on the metal component via a zinc or zinc alloy bath of the galvanizing station.

Claims

1. A continuous-line apparatus, comprising:

a cleaning station configured to remove contaminants from a metal component;

an annealing station configured to modify one or more properties of the metal component; a galvanizing station configured to form an oxidation-resistant coating on the metal component; and

a central processing unit (CPU) configured with circuitry to control functions within the galvanizing station, wherein the galvanizing station includes a circumferential pulley or roller configured to feed the metal component through the continuous-line apparatus, and wherein the circumferential pulley or roller of the galvanizing station is adjustable in a vertical direction.

2. The continuous-line apparatus of claim 1, wherein the circumferential roller is configured to feed continuous sheet material through the continuous-line apparatus.

3. The continuous-line apparatus of claim 1, wherein the circumferential pulley or roller within the galvanizing station is configured to adjust in the vertical direction in response to a pre-determined dipping time for the metal component within the galvanizing station while maintaining a constant feed velocity within the continuous-line apparatus.

4. The continuous-line apparatus of claim 1, wherein the continuous-line apparatus comprises a continuous galvanizing line apparatus.

5. The continuous-line apparatus of claim 1, wherein the circumferential pulley or roller of the galvanizing station is configured to adjust vertically within a groove of a sliding rail.

6. The continuous-line apparatus of claim 5, wherein a vertical adjustment of the circumferential pulley or roller within the groove of the sliding rail is controlled via circuitry of the CPU.

7. The continuous-line apparatus of claim 6, wherein the CPU is configured with circuitry to synchronize the vertical adjustment of the circumferential pulley or roller with an associated pre-determined dipping time within the galvanizing station.

8. A method of adjusting a treatment time in a continuous-line apparatus, the method comprising:

feeding a metal component through the continuous-line apparatus;

removing contaminants from the metal component via a cleaning station of the continuous- line apparatus;

modifying one or more properties of the metal component via an annealing station of the continuous-line apparatus;

adjusting a vertical height of a circumferential pulley or roller within a galvanizing station according to a pre-determined dipping time for the metal component within the galvanizing station, wherein the adjusting is controlled by a central processing unit (CPU); and forming an oxidation-resistant coating on the metal component via the galvanizing station.

9. The method of claim 8, further comprising:

synchronizing, via circuitry of the CPU, the vertical height of the circumferential pulley or roller with a plurality of pre-determined dipping times for the metal component within the galvanizing station while maintaining a constant feed velocity of the metal component through the continuous-line apparatus.

10. The method of claim 8, wherein the adjusting comprises sliding the circumferential pulley or roller within a groove of a sliding rail, via circuitry of the CPU.

11. The method of claim 8, further comprising:

adjusting the pre-determined dipping time for the metal component within the galvanizing station via a synchronized adjustment of the vertical height of the circumferential pulley or roller.

12. The method of claim 11, further comprising:

maintaining a constant feed velocity within the continuous-line apparatus during the adjusting.

13. The method of claim 8, further comprising:

forming an oxidation-resistant coating on the metal component via a zinc or zinc alloy bath of the galvanizing station.

14. A continuous-line apparatus, comprising:

a cleaning station configured to remove contaminants from a metal component in transition through the continuous-line apparatus;

an annealing station configured to modify one or more properties of the metal component in transition through the continuous-line apparatus; a galvanizing station configured to form an oxidation-resistant coating on the metal component in transition through the continuous-line apparatus; and

an adjustable galvanizing roller or pulley configured to feed the metal component through the continuous-line apparatus and configured to synchronize, via a central processing unit (CPU), with a pre-determined dipping time for the metal component within the galvanizing station, wherein the galvanizing roller or pulley is configured to adjust to a plurality of positions within the galvanizing station according to an associated plurality of pre-determined dipping times.

15. The continuous-line apparatus of claim 14, wherein the adjustable galvanizing roller is configured to feed continuous sheet material through the continuous-line apparatus.

16. The continuous-line apparatus of claim 14, wherein the adjustable galvanizing roller or pulley within the galvanizing station is configured to adjust in a vertical direction in response to a pre-determined dipping time for the metal component within the galvanizing station while maintaining a constant feed velocity within the continuous-line apparatus.

17. The continuous-line apparatus of claim 14, wherein the continuous-line apparatus comprises a continuous galvanizing line apparatus.

18. The continuous-line apparatus of claim 14, wherein the adjustable galvanizing roller or pulley of the galvanizing station is configured to adjust vertically within a groove of a sliding rail.

19. The continuous-line apparatus of claim 18, wherein a vertical adjustment of the adjustable galvanizing roller or pulley within the groove of the sliding rail is controlled via circuitry of the CPU.

20. The continuous-line apparatus of claim 19, wherein the CPU is configured with circuitry to synchronize the vertical adjustment of the adjustable galvanizing roller or pulley with an associated pre-determined dipping time within the galvanizing station.