WO2017112355A1 - Self-damping end effector - Google Patents
Self-damping end effector Download PDFInfo
- Publication number
- WO2017112355A1 WO2017112355A1 PCT/US2016/063843 US2016063843W WO2017112355A1 WO 2017112355 A1 WO2017112355 A1 WO 2017112355A1 US 2016063843 W US2016063843 W US 2016063843W WO 2017112355 A1 WO2017112355 A1 WO 2017112355A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- finger
- damper
- end effector
- self
- fingers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/0091—Shock absorbers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Definitions
- Silicon substrates are used in the fabrication of semiconductors and solar cells. During fabrication, substrates are subjected to various manufacturing processes involving numerous machines and process stations. Thus, the substrates need to be transported from one machine/station to another machine/station one or more times.
- An end effector may be a hand-like or claw-like structure defined by a base with a plurality of fingers or tines extending therefrom.
- the fingers may be adapted to support a substrate in a horizontal orientation.
- the end effector may be moved linearly (e.g., forward and backward) as well as rotationally, all in the same plane (e.g., x-y axis).
- the end effector may also be moved in a third direction along a z-axis to provide a full range of motion.
- the fingers of the end effector may be subjected to significant acceleration forces, causing the fingers to flex and subsequently vibrate according to natural frequencies of the fingers. Such vibration can result in unintended shifting or "walking" of substrates supported by the fingers. This may be highly detrimental to subsequent process steps, especially if a precise arrangement or orientation of the substrates is desired. Vibration can be mitigated by reducing the acceleration of an end effector during movement thereof. Such reductions result in decreased throughput of substrates through a process tool, and are thus generally undesirable.
- An exemplary embodiment of a self-damping end effector in accordance with the present disclosure may include a base, a finger extending from the base and adapted to support a substrate, and a damper associated with the finger, the damper having a natural frequency within a predetermined tolerance of a natural frequency of the finger.
- FIG. lb is a detailed perspective view illustrating a distal end of a finger of the end effector shown in FIG. la;
- FIG. lc is a perspective view illustrating the exemplary end effector shown in FIG. la with a plurality of dampers for use with the end effector;
- FIG. Id is a detailed perspective view illustrating one of the dampers shown in FIG. lc;
- FIG. le is a cross sectional perspective view illustrating a finger and a corresponding damper of the end effector shown in FIG. la;
- FIG. 2 is a perspective view illustrating another exemplary embodiment of an end effector in accordance with the present disclosure
- FIG. 3 is a perspective view illustrating another exemplary embodiment of an end effector in accordance with the present disclosure.
- a self-damping end effector in accordance with the present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, wherein certain exemplary embodiments of the self-damping end effector are presented.
- the self-damping end effector may be embodied in many different forms and is not to be construed as being limited to the embodiments set forth herein. These embodiments are provided so this disclosure will be thorough and complete, and will fully convey the scope of the self-damping end effector to those skilled in the art.
- like numbers refer to like elements throughout.
- the self-damping end effector described herein may be used in connection with substrate handling equipment such as ion implantation systems, deposition systems, etching systems, lithography systems, vacuum systems, or other systems for processing substrates.
- substrate handling equipment such as ion implantation systems, deposition systems, etching systems, lithography systems, vacuum systems, or other systems for processing substrates.
- the substrates may be solar cells, semiconductor wafers, light-emitting diodes, or other wafers known to those skilled in the art.
- the end effector 10 may include a plurality of parallel, laterally spaced- apart fingers 12a, 12b, 12c, 12d coupled to a base 14.
- the end effector 10 is shown as having four fingers 12a-12d. Alternatively, the end effector 10 may be provided with more or fewer fingers as may be appropriate to suit a particular application.
- the fingers 12a-12d may be tubular and may have any of a variety cross-sectional shapes, such as circular, rectangular, hexagonal, etc.
- the fingers 12a-12d may taper in height and width from a proximal end 16 of the fingers 12a-12d adjacent the base 14 to a distal end 18 located farther away from the base 14.
- a plurality of support pads 20 may be rigidly affixed to the fingers 12a-12d in a longitudinally spaced-apart relationship.
- the support pads 20 may be configured to support an array of substrates (not shown) in a manner familiar to those of ordinary skill in the art.
- FIG. lb a detailed view illustrating an exemplary arrangement for mounting the support pads 20.
- the support pad 20 may be removably fastened to a saddle 22, such as with mechanical fasteners.
- the saddle 22 may be affixed to the finger 12a, such as with mechanical fasteners or adhesives.
- the saddle 22 may thus provide an intermediary mounting structure for removably coupling the support pad 20 to the finger 12a.
- the end effector 10 may be provided with a plurality of vibrational dampers 24a, 24b, 24c, 24d (hereinafter “the dampers 24a-24d").
- the dampers 24a-24d may be adapted to be inserted longitudinally into, and rigidly coupled to, the fingers 12a-12d.
- the dampers 24a-24d may be provided for damping vibration of the fingers 12a-12d while avoiding significant increases in the size and weight of the fingers 12a-12d and while avoiding interference with the operation of the fingers 12a-12d as will be described in greater detail below.
- FIGS. Id and le illustrate a detailed view of the damper 24a and a cross- sectional view of the damper 24a and corresponding finger 12a of the end effector 10 (FIG. la), respectively.
- the damper 24a and finger 12a may be identical to the dampers 24b-24d and the fingers 12a-12d shown in FIG. lc.
- the following description of the damper 24a and the finger 12a shall also apply to the dampers 24b-24d and the fingers 12b-12d.
- the distal end 18 of the finger 12a is shown with the support pad 20 (FIG. la) omitted for clarity.
- the shaft 26 of the damper 24a may extend into the hollow interior of the finger 12a through the open, distal end 18 of the finger 12a, with the shaft 26 disposed in a generally coaxial relationship with the finger 12a and with the end 30 of the shaft 26 protruding from the distal end 18.
- the clamping portion 32 of the mounting bracket 28 of the damper 24a may abut the distal end 18 and the finger 12a, and the fastening tab 36b of mounting bracket 28 may extend below, and may be fastened to, the saddle 22 as described above (the fastening tab 36a, while not shown in FIG.
- the damper 24a may be securely fastened to the finger 12a while avoiding significant increases in the outer dimensions or weight of the finger 12a and with the entire damper 24a disposed below the saddle 22 so as not to interfere with substrates supported atop the finger 12a.
- a natural frequency of the damper 24a may be dependent upon the stiffness and mass distribution of the damper 24a.
- the stiffness and the mass distribution of the damper 24a may be configured to provide the damper 24a with a natural frequency equal to, or within a predefined tolerance (e.g., 10%) of, a natural frequency of the finger 12a.
- coupling the damper 24a to the finger 12a may significantly reduce the amplitude of vibration of the finger 12a during operation of the end effector 10 (FIG. la), mitigating unintended and undesirable shifting of substrates supported by the finger 12a and allowing the end effector 10 to be operated at higher speeds relative to conventional end effectors to improve throughput of a substrate handling system.
- the damper 24a (and, similarly, the dampers 24b-24d) may have configurations, shapes, sizes, and mounting arrangements different than what has been described above, wherein such configurations, shapes, sizes, and mounting arrangements may similarly provide such embodiments with a natural frequency equal to, or within a predefined tolerance of, a natural frequency of the finger 12a.
- the finger 12a (and, similarly, the fingers 12b-12d) may be provided with a plurality of dampers distributed along the length of the finger 12a. Such dampers could be coupled to the finger 12a itself, to one or more of the saddles 22 of the finger 12a, and/or to one or more of the support pads 20 of the finger 12a.
- such dampers coupled be formed as integral, contiguous features of the finger 12a, saddles 22, and/or support pads 20.
- Implementing a plurality of dampers on a finger may provide the aggregate structure (i.e., the finger and the plural dampers) with a greater number of vibrational frequencies relative to the "one- damper" embodiment described above, such vibrational frequencies having even smaller amplitudes than those of the one-damper embodiment and thus providing the finger with even greater vibrational damping relative to the one-damper embodiment.
- FIG. 2 is a top perspective view of exemplary end effector 1 10 in accordance with another embodiment of the present disclosure.
- the end effector 110 may be a generally planar structure having two fingers 1 12a, 112b extending from a base 114.
- the end effector 1 10 may be implemented with a greater or fewer number of fingers than the two fingers 112a, 112b shown in FIG. 2.
- the fingers 1 12a, 1 12b may be provided with respective cutouts 123a,
- the dampers 124a, 124b contiguous with, coplanar with, and formed from the same material as, the fingers 1 12a, 1 12b.
- the cutouts 123a, 123b may be generally U-shaped as shown in FIG. 2. In various alternative embodiments, the cutouts 123a, 123b may have virtually any other shape (e.g. a V-shape) similarly defining cantilevered portions of the fingers 1 12a, 1 12b.
- the dampers 124a, 124b may be provided for damping vibration of the fingers 1 12a, 1 12b while avoiding significant increases in the size and weight of the fingers 112a, 112b and avoiding interference with the operation of the fingers 112a, 112b. Natural frequencies of the dampers 124a, 124b may be dependent upon the stiffnesses and mass distributions of the dampers 124a, 124b.
- the stiffnesses and the mass distributions of the dampers 124a, 124b may be configured to provide the dampers 124a, 124b with respective natural frequencies equal to, or within predefined tolerances (e.g., 10%) of, the natural frequencies of their corresponding fingers 1 12a, 1 12b.
- the matched (or nearly matched) natural frequencies of the dampers 124a, 124b and their corresponding fingers 112a, 112b may interfere with one another to provide the aggregate structures (i.e., the aggregate structure of the damper 124a and finger 112a and the aggregate structure of the damper 124b and finger 1 12b) with two additional vibrational frequencies, one being below the natural frequencies of the respective individual dampers 124a, 124b and respective individual fingers 1 12a, 112b and one being above the natural frequencies of the respective individual dampers 124a and respective individual fingers 112a, 1 12b.
- the aggregate structures i.e., the aggregate structure of the damper 124a and finger 112a and the aggregate structure of the damper 124b and finger 1 12b
- the dampers 124a, 124b may have configurations, shapes, sizes, and arrangements different than what has been described above, wherein such configurations, shapes, sizes, and arrangements may similarly provide such embodiments with natural frequencies equal to, or within predefined tolerances of, the natural frequencies of the corresponding fingers 1 12a, 112b.
- the fingers 1 12a, 1 12b may be provided with respective pluralities of dampers (defined by respective cutouts) similar to the dampers 124a, 124b distributed along the lengths of the fingers 112a, 112b.
- Implementing a plurality of dampers on a finger may provide the aggregate structure (i.e., the finger and the plural dampers) with a greater number of vibrational frequencies relative to the "one-damper" embodiment described above, such vibrational frequencies having even smaller amplitudes than those of the one-damper embodiment and thus providing the finger with even greater vibrational damping relative to the one-damper embodiment.
- FIG. 3 is a top perspective view of exemplary end effector 210 in accordance with another embodiment of the present disclosure.
- the end effector 210 may be a generally planar structure having two fingers 212a, 212b extending from a base 214.
- the end effector 210 may be implemented with a greater or fewer number of fingers than the two fingers 212a, 212b shown in FIG. 3.
- the fingers 212a, 212b may be provided with respective vibrational dampers 224a, 224b (hereinafter "the dampers 224a, 224b") formed as integral, contiguous extensions of the fingers 212a, 212b.
- the dampers 224a, 224b extend from the outer edges of the fingers 212a, 212b.
- the dampers 224a, 224b may extend from the inner edges, tips, or undersides of the fingers 212a, 212b.
- the dampers 224a, 224b may be formed from the same material as the fingers 212a, 212b.
- the dampers 224a, 224b may be generally L-shaped as shown in FIG. 3.
- Natural frequencies of the dampers 224a, 224b may be dependent upon the stiffnesses and mass distributions of the dampers 224a, 224b.
- the stiffnesses and the mass distributions of the dampers 224a, 224b may be configured to provide the dampers 224a, 224b with respective natural frequencies equal to, or within predefined tolerances (e.g., 10%) of, the natural frequencies of their corresponding fingers 212a, 212b.
- the matched (or nearly matched) natural frequencies of the dampers 224a, 224b and their corresponding fingers 212a, 212b may interfere with one another to provide the aggregate structures (i.e., the coupled damper 224a and finger 212a and the coupled damper 224b and finger 212b) with two additional vibrational frequencies, one being below the natural frequencies of the respective individual dampers 224a, 224b and respective individual fingers 212a, 212b and one being above the natural frequencies of the respective individual dampers 224a and respective individual fingers 212a, 212b.
- the amplitudes of the two additional vibrational frequencies are smaller than the amplitudes of the natural frequencies of the respective individual dampers 224a, 224b and respective individual fingers 212a, 212b.
- coupling the dampers 224a, 224b to the fingers 212a, 212b may significantly reduce the amplitudes of vibration of the fingers 212a, 212b during operation of the end effector 210, mitigating unintended and undesirable shifting of substrates supported by the fingers 212a, 212b and allowing the end effector 210 to be operated at higher speeds relative to conventional end effectors to improve throughput of a substrate handling system.
- the dampers 224a, 224b may have configurations, shapes, sizes, and mounting arrangements different than what has been described above, wherein such configurations, shapes, sizes, and mounting arrangements may similarly provide such embodiments with natural frequencies equal to, or within predefined tolerances of, the natural frequencies of the corresponding fingers 212a, 212b.
- the fingers 212a, 212b may be provided with respective pluralities of dampers similar to the dampers 224a, 224b distributed along the lengths of the fingers 212a, 212b.
- Implementing a plurality of dampers on a finger may provide the aggregate structure (i.e., the finger and the plural dampers) with a greater number of vibrational frequencies relative to the "one-damper" embodiment described above, such vibrational frequencies having even smaller amplitudes than those of the one-damper embodiment and thus providing the finger with even greater vibrational damping relative to the one- damper embodiment.
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
Description
Claims
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020187020677A KR102609419B1 (en) | 2015-12-22 | 2016-11-28 | Self-damping end effector |
| CN201680075687.2A CN108431943B (en) | 2015-12-22 | 2016-11-28 | Self-damping end effector |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/978,665 | 2015-12-22 | ||
| US14/978,665 US9862101B2 (en) | 2015-12-22 | 2015-12-22 | Self-damping end effector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2017112355A1 true WO2017112355A1 (en) | 2017-06-29 |
Family
ID=59065781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2016/063843 Ceased WO2017112355A1 (en) | 2015-12-22 | 2016-11-28 | Self-damping end effector |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9862101B2 (en) |
| KR (1) | KR102609419B1 (en) |
| CN (1) | CN108431943B (en) |
| TW (1) | TWI712099B (en) |
| WO (1) | WO2017112355A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108666231B (en) * | 2017-03-28 | 2022-04-26 | 雷仲礼 | Substrate processing system, substrate transfer apparatus and transfer method |
| KR20220142444A (en) * | 2020-02-14 | 2022-10-21 | 에이에스엠엘 홀딩 엔.브이. | Reticle Gripper Damper and Isolation System for Lithographic Apparatus |
| CN118475313A (en) * | 2021-12-30 | 2024-08-09 | 奥瑞斯健康公司 | Vibration damping for surgical systems |
| TWI814679B (en) * | 2023-02-13 | 2023-09-01 | 盛詮科技股份有限公司 | Carrier suspended arm |
| USD1106977S1 (en) * | 2023-04-10 | 2025-12-23 | Asm Ip Holding B.V. | End effector |
| USD1107089S1 (en) * | 2023-12-08 | 2025-12-23 | Applied Materials, Inc. | Substrate-handling robot end effector |
| USD1106082S1 (en) * | 2025-03-06 | 2025-12-16 | Asm Ip Holding B.V. | End effector |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006041496A (en) * | 2004-06-25 | 2006-02-09 | Applied Materials Inc | Multi-select end effector assembly |
| JP2006269951A (en) * | 2005-03-25 | 2006-10-05 | Shikibo Ltd | Hand for transfer device |
| JP4000492B2 (en) * | 1997-03-14 | 2007-10-31 | 株式会社安川電機 | Wafer transfer device |
| US20130057008A1 (en) * | 2010-03-04 | 2013-03-07 | Jx Nippon Oil & Energy Corporation | Robot hand |
| US20130213169A1 (en) * | 2012-02-17 | 2013-08-22 | Mark K. Tan | Mass damper for semiconductor wafer handling end effector |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04492A (en) | 1990-04-18 | 1992-01-06 | Fuji Facom Corp | Display device |
| US6761085B1 (en) * | 2002-02-06 | 2004-07-13 | Novellus Systems Incorporated | Method and apparatus for damping vibrations in a semiconductor wafer handling arm |
| US6844929B2 (en) * | 2003-04-09 | 2005-01-18 | Phase Shift Technology | Apparatus and method for holding and transporting thin opaque plates |
| KR101023725B1 (en) * | 2004-06-29 | 2011-03-25 | 엘지디스플레이 주식회사 | Disaster Robot |
| JP2008073803A (en) * | 2006-09-21 | 2008-04-03 | Toppan Printing Co Ltd | Robot hand with vibration control function |
| US8268806B2 (en) | 2007-08-10 | 2012-09-18 | Endorecherche, Inc. | Pharmaceutical compositions |
| US8276959B2 (en) * | 2008-08-08 | 2012-10-02 | Applied Materials, Inc. | Magnetic pad for end-effectors |
| KR20140051268A (en) * | 2011-07-22 | 2014-04-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Light-emitting device |
| CN103199792B (en) * | 2012-01-05 | 2015-04-22 | 沈阳新松机器人自动化股份有限公司 | Mechanical arm braking system |
| CN102569148B (en) * | 2012-01-17 | 2014-08-27 | 南通富士通微电子股份有限公司 | Grabbing manipulator system for semiconductor packaging equipment |
| CN103258776B (en) * | 2012-02-17 | 2017-07-11 | 诺发系统公司 | The mass damper of end effector is loaded and unloaded for semiconductor wafer |
| US9004564B2 (en) * | 2013-03-13 | 2015-04-14 | Varian Semiconductor Equipment Associates, Inc. | Wafer handling apparatus |
| US9061423B2 (en) * | 2013-03-13 | 2015-06-23 | Varian Semiconductor Equipment Associates, Inc. | Wafer handling apparatus |
| CN103273494B (en) * | 2013-05-21 | 2015-09-09 | 深圳市华星光电技术有限公司 | Liquid crystal display substrate Handling device and using method thereof |
| US8863390B1 (en) * | 2014-04-16 | 2014-10-21 | American Axle & Manufacturing, Inc. | Method for fabricating damped propshaft assembly |
-
2015
- 2015-12-22 US US14/978,665 patent/US9862101B2/en active Active
-
2016
- 2016-11-18 TW TW105137730A patent/TWI712099B/en active
- 2016-11-28 KR KR1020187020677A patent/KR102609419B1/en active Active
- 2016-11-28 CN CN201680075687.2A patent/CN108431943B/en active Active
- 2016-11-28 WO PCT/US2016/063843 patent/WO2017112355A1/en not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4000492B2 (en) * | 1997-03-14 | 2007-10-31 | 株式会社安川電機 | Wafer transfer device |
| JP2006041496A (en) * | 2004-06-25 | 2006-02-09 | Applied Materials Inc | Multi-select end effector assembly |
| JP2006269951A (en) * | 2005-03-25 | 2006-10-05 | Shikibo Ltd | Hand for transfer device |
| US20130057008A1 (en) * | 2010-03-04 | 2013-03-07 | Jx Nippon Oil & Energy Corporation | Robot hand |
| US20130213169A1 (en) * | 2012-02-17 | 2013-08-22 | Mark K. Tan | Mass damper for semiconductor wafer handling end effector |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180088481A (en) | 2018-08-03 |
| CN108431943B (en) | 2022-07-26 |
| TW201724332A (en) | 2017-07-01 |
| US20170173799A1 (en) | 2017-06-22 |
| TWI712099B (en) | 2020-12-01 |
| US9862101B2 (en) | 2018-01-09 |
| CN108431943A (en) | 2018-08-21 |
| KR102609419B1 (en) | 2023-12-04 |
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