WO2017111946A1 - Régulateur de tension intégré doté d'une source de courant augmentée - Google Patents

Régulateur de tension intégré doté d'une source de courant augmentée Download PDF

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Publication number
WO2017111946A1
WO2017111946A1 PCT/US2015/067401 US2015067401W WO2017111946A1 WO 2017111946 A1 WO2017111946 A1 WO 2017111946A1 US 2015067401 W US2015067401 W US 2015067401W WO 2017111946 A1 WO2017111946 A1 WO 2017111946A1
Authority
WO
WIPO (PCT)
Prior art keywords
current
pcb
voltage
ivr
current source
Prior art date
Application number
PCT/US2015/067401
Other languages
English (en)
Inventor
William J. Lambert
Mathew MANUSHAROW
Original Assignee
Intel Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corporation filed Critical Intel Corporation
Priority to DE112015007206.3T priority Critical patent/DE112015007206T5/de
Priority to US15/772,487 priority patent/US20180323708A1/en
Priority to PCT/US2015/067401 priority patent/WO2017111946A1/fr
Publication of WO2017111946A1 publication Critical patent/WO2017111946A1/fr

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]

Definitions

  • the present disclosure generally relates to integrated circuit (IC) voltage regulation.
  • IVRs integrated voltage regulators
  • MBVR Motherboard Voltage Regulator
  • Another disadvantage is that in some FIVR implementations it may be necessary to grow the CPU die to enable a large enough FIVR to support the voltage domain's maximum possible operating current (Im aX ), which adds to the financial costs to produce an IC.
  • Im aX maximum possible operating current
  • Figure 1 illustrates one embodiment of a printed circuit board (PCB).
  • PCB printed circuit board
  • Figures 2A & 2B illustrate embodiments of a FIVR voltage rail
  • Figure 3 illustrates one embodiment of a FIVR packaging configuration.
  • Figure 4 illustrates one embodiment of a current source.
  • Figure 5 illustrates one embodiment of a computer system.
  • Figure 6 illustrates a schematic side view representation of another embodiment system suitable to assemble a substrate
  • FIG. 1 illustrates one embodiment of a PCB 100.
  • PCB 100 is a motherboard that includes a voltage regulator 110, IC 150 and current source 170.
  • Voltage regulator (VR) 110 provides an appropriate supply voltage to PCB 100 by converting +5V or +12V to a lower voltage (e.g., +1.5V) required by IC 150.
  • IC 150 is electrically coupled to VR 110 via one or more pins on an electronics package (e.g., land grid arrays (LGAs)).
  • IC 150 may be implemented as a microprocessor package. In such embodiments, the IC 150 package is similar to a PCB, though with finer dimensions.
  • IC 150 is a CPU that includes IVR 152.
  • IVR 152 includes one or more phases (e.g., phase 1- phase N) that provide a voltage stepped down from (or lower than) the voltage provided by VR 110.
  • the IVR 152 phases increase the current handling capabilities by operating in parallel to provide an output voltage even when the current being consumed by the circuitry on the output is very high.
  • Figure 2A illustrates one embodiment of a conventional voltage rail implemented at IVR 152.
  • IVR 152 includes switches implemented as MOSFETs at IC 150, capacitors implemented at IC 150, and inductors implemented on the PCB 100 package.
  • a PCB current source 170 is provided to one or more voltage rails at PCB 100 to supplement current provided by IVR 152.
  • current source 170 is a PCB switching power converter that injects current into the IVR 152 output domain via additional pins (discussed in more detail below) at IC 150.
  • IC 150 may include many IVR 152 modules, one or more which may have current supplemented by be a current source 170.
  • IVR 152 continues to regulate a rail's voltage in a normal capacity to ensure typical benefits (e.g., fast transient response (particularly on parts where output decoupling is not available), the ability to quickly adjust operating voltage, etc.), while current source 170 provides a low bandwidth current supply that is injected from PCB 100 into the output of the IVR 152 voltage domain.
  • typical benefits e.g., fast transient response (particularly on parts where output decoupling is not available), the ability to quickly adjust operating voltage, etc.
  • current source 170 does not regulate the output voltage of the supply, which enables FIVR 152 to provide a low, actively regulated output impedance and to change voltages rapidly.
  • the amount of low frequency current supplied by IVR 152 is reduced by the amount of current supplied by current source 170. Since current source 170 is not on IC 150, the power it dissipates will not count against the total dissipated power of the IC 150.
  • current source 170 may be designed for high efficiency, direct conversion from an input supply (even at 12V), which may allow reduction of the total platform power.
  • FIG 3 illustrates one embodiment of IVR 152 packaging configuration for implementation of a current source 170.
  • IVR 152 includes a die 310 and conventional V CCIN pins 320.
  • pins 330 are provided to use current source 170.
  • a set of pins 330 is included at IVR 152 for each rail that uses current source 170.
  • each set of pins 330 is located near the respective IVR 152 rail for which current source 170 is augmenting (or supplementing).
  • FIG. 2B illustrates one embodiment of a IVR 152 voltage rail augmented with current source 170.
  • current source 170 supplies Ics
  • IVR 152 only needs to supply 9A. IVR 152 would then be dissipating 1.28W, resulting in total dissipated power 25.28W, versus the 28.96W when the entire current is supplied by FIVR 152. Accordingly, there is a savings of 3.68W.
  • IVR 152 + current source 170 enables the load to increase to 27A, versus 24A with IVR 152 only, which represents a substantial performance improvement in.
  • implementation of current source 170 allows for a smaller IVR 152 to meet a given 1 ⁇ requirement (where I max is the maximum value I out could ever reach). In such an embodiment, IVR 152 only needs to be rated to I max - Ics-
  • Figure 4 illustrates one embodiment of a current source 170 circuit implementation.
  • configuration represents a buck regulator that configured by control logic (discussed in more detail below) to control the switches in order to output a fixed current.
  • control logic discussed in more detail below
  • the bandwidth of IVR 152 is configured to be high enough to filter out ripple current from the current source 170.
  • Other embodiments may feature current source 170 circuit implementations using a variety of different switching or non-switching power converter topologies. Such an embodiment reduces a ripple that has to be filtered by IVR 152, or allow for current source 170 to be shut off rapidly.
  • current source 170 includes control logic 175 that controls the current provided to augment IVR 152.
  • control logic 175 is a voltage sensor that monitors the voltage of the IVR 152 plane.
  • the current supplied by current source 170 is varied as a function of the sensed voltage.
  • current source 170 may be programmed to turn off below a threshold voltage, or to increase current as a linear function of the output voltage. Such an embodiment, would obviate a need for implementation of pins 330, and could potentially operate at high speeds.
  • control logic 175 could receive signals from IC 150 power management circuitry (not shown). In such an embodiment, control logic 175 receives signals via an existing power management or system management interface. For example, an existing interface is routed to current source 170. Thus, the current supplied by the current source 170 is programmed by the IC 150 power management circuitry.
  • one or more dedicated control pins may be added to IC 150 to directly control current source 170.
  • the pins may provide simple on-off control, or more complicated functionality to dynamically adjust the current provided by current source 170.
  • Current source 170 is thus coupled to the FIVR 152 domain by a number of additional balls or pins on IC 150 selected to meet reliability requirements for handling ICS.
  • FIG. 5 illustrates one embodiment of a computer system 600.
  • the computer system 600 (also referred to as the electronic system 600) as depicted can embody a test system that includes a flip chip package mounted on a test PCB, with a peripheral chip mounted on the flip chip package and a DUT IC coupled to the flip chip package via test probes.
  • the computer system 600 may be a mobile device such as a netbook computer.
  • the computer system 600 may be a mobile device such as a wireless smart phone.
  • the computer system 600 may be a desktop computer.
  • the computer system 600 may be a hand-held reader.
  • the computer system 600 may be a server system.
  • the computer system 600 may be a supercomputer or high-performance computing system.
  • the electronic system 600 is a computer system that includes a system bus 620 to electrically couple the various components of the electronic system 600.
  • the system bus 620 is a single bus or any combination of busses according to various embodiments.
  • the electronic system 600 includes a voltage source 630 that provides power to the integrated circuit 610. In some embodiments, the voltage source 430 supplies current to the integrated circuit 610 through the system bus 620.
  • the integrated circuit 410 is electrically coupled to the system bus 620 and includes any circuit, or combination of circuits according to an embodiment.
  • the integrated circuit 610 includes a processor 612 that can be of any type.
  • the processor 612 may mean any type of circuit such as, but not limited to, a microprocessor, a micro-controller, a graphics processor, a digital signal processor, or another processor.
  • the processor 612 includes a flip chip package mounted on a test PCB, with a peripheral chip mounted on the flip chip package and a DUT IC coupled to the flip chip package via test probes.
  • SRAM embodiments are found in memory caches of the processor.
  • Other types of circuits that can be included in the integrated circuit 410 are a custom circuit or an application-specific integrated circuit (ASIC), such as a communications circuit 614 for use in wireless devices such as cellular telephones, smart phones, pagers, portable computers, two-way radios, and similar electronic systems, or a communications circuit for servers.
  • the integrated circuit 610 includes on-die memory 616 such as static random-access memory (SRAM).
  • the integrated circuit 610 includes embedded on-die memory 616 such as embedded dynamic random-access memory (eDRAM).
  • the integrated circuit 610 is complemented with a subsequent integrated circuit 611.
  • Useful embodiments include a dual processor 613 and a dual communications circuit 615 and dual on-die memory 617 such as SRAM.
  • the dual integrated circuit 610 includes embedded on-die memory 617 such as eDRAM.
  • the electronic system 600 also includes an external memory 640 that in turn may include one or more memory elements suitable to the particular application, such as a main memory 642 in the form of RAM, one or more hard drives 644, and/or one or more drives that handle removable media 646, such as diskettes, compact disks (CDs), digital variable disks (DVDs), flash memory drives, and other removable media known in the art.
  • the external memory 640 may also be embedded memory 648 such as the first die in an embedded TSV die stack, according to an embodiment.
  • the electronic system 600 also includes a display device 650, an audio output 660.
  • the electronic system 600 includes an input device such as a controller 670 that may be a keyboard, mouse, trackball, game controller, microphone, voice-recognition device, or any other input device that inputs information into the electronic system 600.
  • an input device 470 is a camera.
  • an input device 670 is a digital sound recorder.
  • an input device 670 is a camera and a digital sound recorder.
  • the integrated circuit 610 can be implemented in a number of different embodiments, including a test system that includes a flip chip package mounted on a test PCB, with a peripheral chip mounted on the flip chip package and a DUT IC coupled to the flip chip package via test probes, and their equivalents, an electronic system, a computer system, one or more methods of fabricating an integrated circuit, and one or more methods of fabricating an electronic assembly that includes a semiconductor die packaged according to any of the several disclosed embodiments as set forth herein in the various embodiments and their art-recognized equivalents.
  • the elements, materials, geometries, dimensions, and sequence of operations can all be varied to suit particular I/O coupling requirements including array contact count, array contact configuration for a microelectronic die embedded in a processor mounting substrate according to any of the several disclosed
  • a foundation substrate may be included, as represented by the dashed line of Figure 5.
  • Passive devices may also be included, as is also depicted in Figure 5.
  • references to “one embodiment”, “an embodiment”, “example embodiment”, “various embodiments”, etc., indicate that the embodiment(s) so described may include particular features, structures, or characteristics, but not every embodiment necessarily includes the particular features, structures, or characteristics. Further, some embodiments may have some, all, or none of the features described for other embodiments.
  • Coupled is used to indicate that two or more elements cooperate or interact with each other, but they may or may not have intervening physical or electrical components between them.
  • Example 1 includes a printed circuit board (PCB) comprising an integrated circuit (IC) die having one or more voltage rails and an integrated voltage regulator (IVR) electrically coupled to supply current to a voltage rail, and a PCB current source electrically coupled to supply a supplementary current to the voltage rail.
  • PCB printed circuit board
  • IVR integrated voltage regulator
  • Example 2 includes the subject matter of Example 1, wherein a magnitude of current supplied to the voltage rail by the IVR is reduced by a magnitude of supplementary current provided by the PCB current source.
  • Example 3 includes the subject matter of Examples 1 and 2, wherein the IVR comprises one or more pins to couple to the PCB current source.
  • Example 4 includes the subject matter of Examples 1-3, wherein the PCB current source provides the supplemental current to the voltage rail via the one or more pins.
  • Example 5 includes the subject matter of Examples 1-4, wherein the PCB current source comprises a switching power converter to generate the supplemental current and control logic to control delivery of the supplemental current by the switching power regulator to the voltage rail.
  • Example 6 includes the subject matter of Examples 1-5, wherein the control logic comprises a voltage sensor to monitor a voltage provided by the IVR.
  • Example 7 includes the subject matter of Examples 1-6, wherein the current supplied by the PCB current source is varied as a function of the voltage provided by the IVR that is sensed by the voltage sensor.
  • Example 8 includes the subject matter of Examples 1-7, wherein the control logic receives one or more signals to supply the supplemental current from IC die power management circuitry.
  • Example 9 includes the subject matter of Examples 1-8, wherein the control logic is coupled to IC control pins to receive one or more signals to supply the supplemental current from IC die power management circuitry.
  • Example 10 includes a printed circuit board (PCB) current source comprising a power converter to generate a supplemental current source to a voltage rail coupled to an integrated voltage regulator (IVR) and control logic to control delivery of the supplemental current by the power regulator to the voltage rail.
  • PCB printed circuit board
  • IVR integrated voltage regulator
  • Example 11 includes the subject matter of Example 10, wherein the control logic comprises a voltage sensor to monitor a voltage provided by the IVR.
  • Example 12 includes the subject matter of Examples 10 and 11, wherein the current supplied by the PCB current source is varied as a function of the voltage provided by the IVR that is sensed by the voltage sensor.
  • Example 13 includes the subject matter of Examples 10-12, wherein the control logic receives one or more signals to supply the supplemental current from IC die power management circuitry.
  • Example 14 includes the subject matter of Examples 10-13, wherein the control logic is coupled to IC control pins to receive one or more signals to supply the supplemental current from IC die power management circuitry.
  • Example 15 includes an integrated voltage regulator (IVR) electrically comprising a first set of pins electrically coupled to supply current to a voltage rail and a second set of pins coupled to receive a supplemental current from an external current source.
  • IVR integrated voltage regulator
  • Example 16 includes the subject matter of Example 15, wherein the supplemental current is supplied to the voltage rail.
  • Example 17 includes the subject matter of Examples 15 and 16, wherein a magnitude of current supplied to the voltage rail by the IVR is reduced by a magnitude of supplementary current provided by the external current source.
  • Example 18 includes the subject matter of Examples 15-17, further comprising a first phase to supply the current to the power rail and second phase to supply the current to the power rail.
  • Example 19 includes a printed circuit board (PCB) comprising a voltage regulator an integrated circuit (IC) die coupled to the voltage regulator including one or more voltage rails and an integrated voltage regulator (IVR) electrically coupled to supply current to a voltage rail and a PCB current source electrically coupled to supply a supplementary current to the voltage rail.
  • PCB printed circuit board
  • IVR integrated voltage regulator
  • Example 20 includes the subject matter of Example 19, wherein a magnitude of current supplied to the voltage rail by the IVR is reduced by a magnitude of supplementary current provided by the PCB current source.
  • Example 21 includes the subject matter of Examples 19 and 20, wherein the IVR comprises one or more pins to couple to the PCB current source.
  • Example 22 includes the subject matter of Examples 19-21, wherein the PCB current source provides the supplemental current to the voltage rail via the one or more pins.
  • Example 23 includes the subject matter of Examples 19-22, wherein the PCB current source comprises a switching power converter to generate the supplemental current and control logic to control delivery of the supplemental current by the switching power regulator to the voltage rail.
  • the PCB current source comprises a switching power converter to generate the supplemental current and control logic to control delivery of the supplemental current by the switching power regulator to the voltage rail.
  • Example 24 includes the subject matter of Examples 19-23, wherein the control logic comprises a voltage sensor to monitor a voltage provided by the IVR.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Dc-Dc Converters (AREA)

Abstract

Une carte de circuit imprimé (PCB) comprend un ou plusieurs rails de tension et un régulateur de tension intégré (IVR) électriquement couplé pour fournir du courant à un rail de tension. La carte PCB comprend également une source de courant PCB électriquement couplée pour fournir un courant supplémentaire au rail de tension.
PCT/US2015/067401 2015-12-22 2015-12-22 Régulateur de tension intégré doté d'une source de courant augmentée WO2017111946A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE112015007206.3T DE112015007206T5 (de) 2015-12-22 2015-12-22 Integrierter Spannungsregler mit vergrößerter Stromquelle
US15/772,487 US20180323708A1 (en) 2015-12-22 2015-12-22 Integrated voltage regulator with augmented current source
PCT/US2015/067401 WO2017111946A1 (fr) 2015-12-22 2015-12-22 Régulateur de tension intégré doté d'une source de courant augmentée

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2015/067401 WO2017111946A1 (fr) 2015-12-22 2015-12-22 Régulateur de tension intégré doté d'une source de courant augmentée

Publications (1)

Publication Number Publication Date
WO2017111946A1 true WO2017111946A1 (fr) 2017-06-29

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ID=59091103

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2015/067401 WO2017111946A1 (fr) 2015-12-22 2015-12-22 Régulateur de tension intégré doté d'une source de courant augmentée

Country Status (3)

Country Link
US (1) US20180323708A1 (fr)
DE (1) DE112015007206T5 (fr)
WO (1) WO2017111946A1 (fr)

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US20140062442A1 (en) * 2012-09-05 2014-03-06 Atmel Corporation Fully integrated voltage regulator using open loop digital control for optimum power stepping and slew rate
US20140082377A1 (en) * 2012-09-14 2014-03-20 James S. Dinh Providing Additional Current Capacity To A Processor For A Turbo Mode

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Publication number Priority date Publication date Assignee Title
US20040021503A1 (en) * 2002-07-31 2004-02-05 Hulfachor Ronald B. Capacitively coupled current boost circuitry for integrated voltage regulator
US20080238380A1 (en) * 2007-03-30 2008-10-02 Intel Corporation Hierarchical control for an integrated voltage regulator
WO2013048475A1 (fr) * 2011-09-30 2013-04-04 Intel Corporation Appareil et procédé pour améliorer des régulateurs de tension intégrés
US20140062442A1 (en) * 2012-09-05 2014-03-06 Atmel Corporation Fully integrated voltage regulator using open loop digital control for optimum power stepping and slew rate
US20140082377A1 (en) * 2012-09-14 2014-03-20 James S. Dinh Providing Additional Current Capacity To A Processor For A Turbo Mode

Also Published As

Publication number Publication date
DE112015007206T5 (de) 2018-09-13
US20180323708A1 (en) 2018-11-08

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